TWI800224B - 冷卻液分配裝置 - Google Patents

冷卻液分配裝置 Download PDF

Info

Publication number
TWI800224B
TWI800224B TW111102221A TW111102221A TWI800224B TW I800224 B TWI800224 B TW I800224B TW 111102221 A TW111102221 A TW 111102221A TW 111102221 A TW111102221 A TW 111102221A TW I800224 B TWI800224 B TW I800224B
Authority
TW
Taiwan
Prior art keywords
distribution unit
coolant distribution
coolant
unit
distribution
Prior art date
Application number
TW111102221A
Other languages
English (en)
Other versions
TW202232283A (zh
Inventor
陳建佑
葉恬利
胡俊明
Original Assignee
雙鴻科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 雙鴻科技股份有限公司 filed Critical 雙鴻科技股份有限公司
Publication of TW202232283A publication Critical patent/TW202232283A/zh
Application granted granted Critical
Publication of TWI800224B publication Critical patent/TWI800224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW111102221A 2021-02-04 2022-01-19 冷卻液分配裝置 TWI800224B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163145685P 2021-02-04 2021-02-04
US63/145,685 2021-02-04

Publications (2)

Publication Number Publication Date
TW202232283A TW202232283A (zh) 2022-08-16
TWI800224B true TWI800224B (zh) 2023-04-21

Family

ID=81634666

Family Applications (3)

Application Number Title Priority Date Filing Date
TW111102221A TWI800224B (zh) 2021-02-04 2022-01-19 冷卻液分配裝置
TW111200791U TWM626632U (zh) 2021-02-04 2022-01-20 測漏裝置與具有測漏裝置的散熱模組
TW111200790U TWM626631U (zh) 2021-02-04 2022-01-20 冷卻液分配裝置

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW111200791U TWM626632U (zh) 2021-02-04 2022-01-20 測漏裝置與具有測漏裝置的散熱模組
TW111200790U TWM626631U (zh) 2021-02-04 2022-01-20 冷卻液分配裝置

Country Status (3)

Country Link
US (1) US20220248570A1 (zh)
CN (4) CN216930664U (zh)
TW (3) TWI800224B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240057297A1 (en) * 2022-10-17 2024-02-15 Google Llc Continuous feed liquid coolant replacement
TWI828578B (zh) * 2023-04-21 2024-01-01 光寶科技股份有限公司 液冷機櫃設備及其控制方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130312839A1 (en) * 2012-05-22 2013-11-28 Dell Products L.P. System and method for cooling information handling resources
TWI711920B (zh) * 2017-12-13 2020-12-01 雙鴻科技股份有限公司 冷卻液分佈系統
TWI714276B (zh) * 2019-09-24 2020-12-21 奇鋐科技股份有限公司 可調控水質之液冷散熱系統

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7484552B2 (en) * 2003-12-19 2009-02-03 Amphenol Corporation Modular rackmount chiller
US9854714B2 (en) * 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
TWI598561B (zh) * 2013-09-06 2017-09-11 微星科技股份有限公司 液冷模組及使用其之電子裝置
US20190178592A1 (en) * 2017-12-13 2019-06-13 Auras Technology Co., Ltd. Coolant distribution unit
GB2575679B (en) * 2018-07-20 2022-06-15 Bae Systems Plc Thermal Management System
US10609839B1 (en) * 2018-09-28 2020-03-31 Liquidcool Solutions, Inc. Liquid submersion cooled electronic systems and devices
EP4150216A4 (en) * 2020-05-11 2023-11-01 Coolit Systems, Inc. LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS
US11576283B2 (en) * 2021-04-13 2023-02-07 Dell Products L.P. Modular and highly available cooling distribution unit for information handling systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130312839A1 (en) * 2012-05-22 2013-11-28 Dell Products L.P. System and method for cooling information handling resources
TWI711920B (zh) * 2017-12-13 2020-12-01 雙鴻科技股份有限公司 冷卻液分佈系統
TWI714276B (zh) * 2019-09-24 2020-12-21 奇鋐科技股份有限公司 可調控水質之液冷散熱系統

Also Published As

Publication number Publication date
CN114867284A (zh) 2022-08-05
TWM626631U (zh) 2022-05-01
CN216930664U (zh) 2022-07-08
TWM626632U (zh) 2022-05-01
CN216594023U (zh) 2022-05-24
CN216673702U (zh) 2022-06-03
TW202232283A (zh) 2022-08-16
US20220248570A1 (en) 2022-08-04

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