TWI800129B - 導體線路載板模組 - Google Patents
導體線路載板模組 Download PDFInfo
- Publication number
- TWI800129B TWI800129B TW110144829A TW110144829A TWI800129B TW I800129 B TWI800129 B TW I800129B TW 110144829 A TW110144829 A TW 110144829A TW 110144829 A TW110144829 A TW 110144829A TW I800129 B TWI800129 B TW I800129B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive circuit
- circuit carrier
- carrier module
- module
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110144829A TWI800129B (zh) | 2021-12-01 | 2021-12-01 | 導體線路載板模組 |
| US17/694,445 US12021018B2 (en) | 2021-12-01 | 2022-03-14 | Conductive circuit carrier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110144829A TWI800129B (zh) | 2021-12-01 | 2021-12-01 | 導體線路載板模組 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI800129B true TWI800129B (zh) | 2023-04-21 |
| TW202324653A TW202324653A (zh) | 2023-06-16 |
Family
ID=86499313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110144829A TWI800129B (zh) | 2021-12-01 | 2021-12-01 | 導體線路載板模組 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US12021018B2 (zh) |
| TW (1) | TWI800129B (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202129855A (zh) * | 2020-01-17 | 2021-08-01 | 台灣積體電路製造股份有限公司 | 積體電路封裝 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60234281D1 (de) * | 2001-03-14 | 2009-12-17 | Ibiden Co Ltd | Mehrschichtige Leiterplatte |
| US9263373B2 (en) | 2014-06-18 | 2016-02-16 | Dyi-chung Hu | Thin film RDL for nanochip package |
| US9543249B1 (en) | 2015-09-21 | 2017-01-10 | Dyi-chung Hu | Package substrate with lateral communication circuitry |
| JP6628544B2 (ja) * | 2015-10-07 | 2020-01-08 | 富士通株式会社 | 配線基板の製造方法 |
| US9799616B2 (en) | 2016-03-08 | 2017-10-24 | Dyi-chung Hu | Package substrate with double sided fine line RDL |
| US10163802B2 (en) | 2016-11-29 | 2018-12-25 | Taiwan Semicondcutor Manufacturing Company, Ltd. | Fan-out package having a main die and a dummy die, and method of forming |
| KR102055593B1 (ko) | 2017-02-03 | 2019-12-13 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
| US10510633B1 (en) | 2018-07-16 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package and printed circuit board attachment |
| TWI739027B (zh) | 2018-08-30 | 2021-09-11 | 恆勁科技股份有限公司 | 覆晶封裝基板之核心結構及其製法 |
| CN112913142A (zh) * | 2018-08-31 | 2021-06-04 | 天工方案公司 | 与嵌入滤波器有关的装置和方法 |
-
2021
- 2021-12-01 TW TW110144829A patent/TWI800129B/zh active
-
2022
- 2022-03-14 US US17/694,445 patent/US12021018B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202129855A (zh) * | 2020-01-17 | 2021-08-01 | 台灣積體電路製造股份有限公司 | 積體電路封裝 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202324653A (zh) | 2023-06-16 |
| US20230170288A1 (en) | 2023-06-01 |
| US12021018B2 (en) | 2024-06-25 |
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