TWI800008B - System for testing non-volatile memory express backplane and method thereof - Google Patents
System for testing non-volatile memory express backplane and method thereof Download PDFInfo
- Publication number
- TWI800008B TWI800008B TW110135540A TW110135540A TWI800008B TW I800008 B TWI800008 B TW I800008B TW 110135540 A TW110135540 A TW 110135540A TW 110135540 A TW110135540 A TW 110135540A TW I800008 B TWI800008 B TW I800008B
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- volatile memory
- memory express
- testing non
- backplane
- express backplane
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TW110135540A TWI800008B (en) | 2021-09-24 | 2021-09-24 | System for testing non-volatile memory express backplane and method thereof |
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TW110135540A TWI800008B (en) | 2021-09-24 | 2021-09-24 | System for testing non-volatile memory express backplane and method thereof |
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TW202314276A TW202314276A (en) | 2023-04-01 |
TWI800008B true TWI800008B (en) | 2023-04-21 |
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TW110135540A TWI800008B (en) | 2021-09-24 | 2021-09-24 | System for testing non-volatile memory express backplane and method thereof |
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Citations (10)
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US20050107977A1 (en) * | 2004-06-23 | 2005-05-19 | Michael Edwards | Test device for signaling and waveform generation and monitoring |
TW200712520A (en) * | 2005-07-26 | 2007-04-01 | Kyushu Inst Technology | Semiconductor logic circuit device test vector generation method and test vector generation program |
TW200712518A (en) * | 2005-09-09 | 2007-04-01 | Inapac Technology Inc | Shared bond pad for testing a memory within a packaged semiconductor device |
US20070257680A1 (en) * | 2004-06-23 | 2007-11-08 | Avo Multi-Amp Corporation Dba Megger | Relay Testing System and Method |
TW200907380A (en) * | 2007-06-06 | 2009-02-16 | Renesas Tech Corp | Semiconductor device, a method of manufacturing a semiconductor device and a testing method of the same |
US20150285854A1 (en) * | 2010-03-16 | 2015-10-08 | Mark A. Kassab | Test Scheduling and Test Access in Test Compression Environment |
US20180095127A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Systems, methods, and apparatuses for implementing testing of fault repairs to a through silicon via (tsv) in two-level memory (2lm) stacked die subsystems |
TW201824032A (en) * | 2016-12-15 | 2018-07-01 | 台灣積體電路製造股份有限公司 | Circuit testing and manufacture using multiple timing libraries |
TW201837490A (en) * | 2017-01-31 | 2018-10-16 | 美商奧克塔佛系統有限責任公司 | Automatic test equipment method for testing system in a package devices |
TW201917397A (en) * | 2017-07-25 | 2019-05-01 | 加拿大商皇虎科技(加拿大)有限公司 | System and method of automated burn-in testing on integrated circuit devices |
-
2021
- 2021-09-24 TW TW110135540A patent/TWI800008B/en active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050107977A1 (en) * | 2004-06-23 | 2005-05-19 | Michael Edwards | Test device for signaling and waveform generation and monitoring |
US20070257680A1 (en) * | 2004-06-23 | 2007-11-08 | Avo Multi-Amp Corporation Dba Megger | Relay Testing System and Method |
TW200712520A (en) * | 2005-07-26 | 2007-04-01 | Kyushu Inst Technology | Semiconductor logic circuit device test vector generation method and test vector generation program |
TW200712518A (en) * | 2005-09-09 | 2007-04-01 | Inapac Technology Inc | Shared bond pad for testing a memory within a packaged semiconductor device |
TW200907380A (en) * | 2007-06-06 | 2009-02-16 | Renesas Tech Corp | Semiconductor device, a method of manufacturing a semiconductor device and a testing method of the same |
US20150285854A1 (en) * | 2010-03-16 | 2015-10-08 | Mark A. Kassab | Test Scheduling and Test Access in Test Compression Environment |
US20180095127A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Systems, methods, and apparatuses for implementing testing of fault repairs to a through silicon via (tsv) in two-level memory (2lm) stacked die subsystems |
TW201824032A (en) * | 2016-12-15 | 2018-07-01 | 台灣積體電路製造股份有限公司 | Circuit testing and manufacture using multiple timing libraries |
TW201837490A (en) * | 2017-01-31 | 2018-10-16 | 美商奧克塔佛系統有限責任公司 | Automatic test equipment method for testing system in a package devices |
TW201917397A (en) * | 2017-07-25 | 2019-05-01 | 加拿大商皇虎科技(加拿大)有限公司 | System and method of automated burn-in testing on integrated circuit devices |
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Publication number | Publication date |
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TW202314276A (en) | 2023-04-01 |
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