TWI800008B - System for testing non-volatile memory express backplane and method thereof - Google Patents

System for testing non-volatile memory express backplane and method thereof Download PDF

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Publication number
TWI800008B
TWI800008B TW110135540A TW110135540A TWI800008B TW I800008 B TWI800008 B TW I800008B TW 110135540 A TW110135540 A TW 110135540A TW 110135540 A TW110135540 A TW 110135540A TW I800008 B TWI800008 B TW I800008B
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TW
Taiwan
Prior art keywords
volatile memory
memory express
testing non
backplane
express backplane
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Application number
TW110135540A
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Chinese (zh)
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TW202314276A (en
Inventor
張天超
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英業達股份有限公司
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Priority to TW110135540A priority Critical patent/TWI800008B/en
Publication of TW202314276A publication Critical patent/TW202314276A/en
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TW110135540A 2021-09-24 2021-09-24 System for testing non-volatile memory express backplane and method thereof TWI800008B (en)

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TW110135540A TWI800008B (en) 2021-09-24 2021-09-24 System for testing non-volatile memory express backplane and method thereof

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TW110135540A TWI800008B (en) 2021-09-24 2021-09-24 System for testing non-volatile memory express backplane and method thereof

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TW202314276A TW202314276A (en) 2023-04-01
TWI800008B true TWI800008B (en) 2023-04-21

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050107977A1 (en) * 2004-06-23 2005-05-19 Michael Edwards Test device for signaling and waveform generation and monitoring
TW200712520A (en) * 2005-07-26 2007-04-01 Kyushu Inst Technology Semiconductor logic circuit device test vector generation method and test vector generation program
TW200712518A (en) * 2005-09-09 2007-04-01 Inapac Technology Inc Shared bond pad for testing a memory within a packaged semiconductor device
US20070257680A1 (en) * 2004-06-23 2007-11-08 Avo Multi-Amp Corporation Dba Megger Relay Testing System and Method
TW200907380A (en) * 2007-06-06 2009-02-16 Renesas Tech Corp Semiconductor device, a method of manufacturing a semiconductor device and a testing method of the same
US20150285854A1 (en) * 2010-03-16 2015-10-08 Mark A. Kassab Test Scheduling and Test Access in Test Compression Environment
US20180095127A1 (en) * 2016-09-30 2018-04-05 Intel Corporation Systems, methods, and apparatuses for implementing testing of fault repairs to a through silicon via (tsv) in two-level memory (2lm) stacked die subsystems
TW201824032A (en) * 2016-12-15 2018-07-01 台灣積體電路製造股份有限公司 Circuit testing and manufacture using multiple timing libraries
TW201837490A (en) * 2017-01-31 2018-10-16 美商奧克塔佛系統有限責任公司 Automatic test equipment method for testing system in a package devices
TW201917397A (en) * 2017-07-25 2019-05-01 加拿大商皇虎科技(加拿大)有限公司 System and method of automated burn-in testing on integrated circuit devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050107977A1 (en) * 2004-06-23 2005-05-19 Michael Edwards Test device for signaling and waveform generation and monitoring
US20070257680A1 (en) * 2004-06-23 2007-11-08 Avo Multi-Amp Corporation Dba Megger Relay Testing System and Method
TW200712520A (en) * 2005-07-26 2007-04-01 Kyushu Inst Technology Semiconductor logic circuit device test vector generation method and test vector generation program
TW200712518A (en) * 2005-09-09 2007-04-01 Inapac Technology Inc Shared bond pad for testing a memory within a packaged semiconductor device
TW200907380A (en) * 2007-06-06 2009-02-16 Renesas Tech Corp Semiconductor device, a method of manufacturing a semiconductor device and a testing method of the same
US20150285854A1 (en) * 2010-03-16 2015-10-08 Mark A. Kassab Test Scheduling and Test Access in Test Compression Environment
US20180095127A1 (en) * 2016-09-30 2018-04-05 Intel Corporation Systems, methods, and apparatuses for implementing testing of fault repairs to a through silicon via (tsv) in two-level memory (2lm) stacked die subsystems
TW201824032A (en) * 2016-12-15 2018-07-01 台灣積體電路製造股份有限公司 Circuit testing and manufacture using multiple timing libraries
TW201837490A (en) * 2017-01-31 2018-10-16 美商奧克塔佛系統有限責任公司 Automatic test equipment method for testing system in a package devices
TW201917397A (en) * 2017-07-25 2019-05-01 加拿大商皇虎科技(加拿大)有限公司 System and method of automated burn-in testing on integrated circuit devices

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