TWI799916B - 使用cip封裝體架構的電子裝置及其cip封裝體架構 - Google Patents

使用cip封裝體架構的電子裝置及其cip封裝體架構 Download PDF

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Publication number
TWI799916B
TWI799916B TW110126313A TW110126313A TWI799916B TW I799916 B TWI799916 B TW I799916B TW 110126313 A TW110126313 A TW 110126313A TW 110126313 A TW110126313 A TW 110126313A TW I799916 B TWI799916 B TW I799916B
Authority
TW
Taiwan
Prior art keywords
cip
architecture
package
electronic device
electronic
Prior art date
Application number
TW110126313A
Other languages
English (en)
Other versions
TW202306084A (zh
Inventor
楊成發
許容賓
龔錦川
Original Assignee
大陸商春源科技（深圳）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商春源科技（深圳）有限公司 filed Critical 大陸商春源科技（深圳）有限公司
Priority to TW110126313A priority Critical patent/TWI799916B/zh
Priority to CN202210542022.5A priority patent/CN115621245A/zh
Priority to CN202221195172.5U priority patent/CN217468421U/zh
Priority to US17/866,062 priority patent/US20230018396A1/en
Publication of TW202306084A publication Critical patent/TW202306084A/zh
Application granted granted Critical
Publication of TWI799916B publication Critical patent/TWI799916B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/02—Connectors or connections adapted for particular applications for antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/24—Connectors or connections adapted for particular applications for radio transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Transceivers (AREA)
  • Dram (AREA)
TW110126313A 2021-07-16 2021-07-16 使用cip封裝體架構的電子裝置及其cip封裝體架構 TWI799916B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW110126313A TWI799916B (zh) 2021-07-16 2021-07-16 使用cip封裝體架構的電子裝置及其cip封裝體架構
CN202210542022.5A CN115621245A (zh) 2021-07-16 2022-05-17 使用cip封装体架构的电子装置及其cip封装体架构
CN202221195172.5U CN217468421U (zh) 2021-07-16 2022-05-17 使用cip封装体架构的电子装置及其cip封装体架构
US17/866,062 US20230018396A1 (en) 2021-07-16 2022-07-15 Cip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110126313A TWI799916B (zh) 2021-07-16 2021-07-16 使用cip封裝體架構的電子裝置及其cip封裝體架構

Publications (2)

Publication Number Publication Date
TW202306084A TW202306084A (zh) 2023-02-01
TWI799916B true TWI799916B (zh) 2023-04-21

Family

ID=83275625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110126313A TWI799916B (zh) 2021-07-16 2021-07-16 使用cip封裝體架構的電子裝置及其cip封裝體架構

Country Status (3)

Country Link
US (1) US20230018396A1 (zh)
CN (2) CN115621245A (zh)
TW (1) TWI799916B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200076046A1 (en) * 2018-09-05 2020-03-05 Intel Corporation 5g mmwave antenna architecture with thermal management
US20210134734A1 (en) * 2017-06-30 2021-05-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Device with Shield for Electromagnetic Interference
TWM626215U (zh) * 2021-07-16 2022-05-01 大陸商春源科技（深圳）有限公司 使用cip封裝體架構的電子裝置及其cip封裝體架構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210134734A1 (en) * 2017-06-30 2021-05-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Device with Shield for Electromagnetic Interference
US20200076046A1 (en) * 2018-09-05 2020-03-05 Intel Corporation 5g mmwave antenna architecture with thermal management
TWM626215U (zh) * 2021-07-16 2022-05-01 大陸商春源科技（深圳）有限公司 使用cip封裝體架構的電子裝置及其cip封裝體架構

Also Published As

Publication number Publication date
CN217468421U (zh) 2022-09-20
US20230018396A1 (en) 2023-01-19
CN115621245A (zh) 2023-01-17
TW202306084A (zh) 2023-02-01

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