TWI799752B - Electronic device and manufacturing method thereof - Google Patents

Electronic device and manufacturing method thereof Download PDF

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Publication number
TWI799752B
TWI799752B TW109137536A TW109137536A TWI799752B TW I799752 B TWI799752 B TW I799752B TW 109137536 A TW109137536 A TW 109137536A TW 109137536 A TW109137536 A TW 109137536A TW I799752 B TWI799752 B TW I799752B
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TW
Taiwan
Prior art keywords
manufacturing
electronic device
electronic
Prior art date
Application number
TW109137536A
Other languages
Chinese (zh)
Other versions
TW202218213A (en
Inventor
林俊賢
Original Assignee
群創光電股份有限公司
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Publication date
Application filed by 群創光電股份有限公司 filed Critical 群創光電股份有限公司
Priority to TW109137536A priority Critical patent/TWI799752B/en
Publication of TW202218213A publication Critical patent/TW202218213A/en
Application granted granted Critical
Publication of TWI799752B publication Critical patent/TWI799752B/en

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TW109137536A 2020-10-29 2020-10-29 Electronic device and manufacturing method thereof TWI799752B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109137536A TWI799752B (en) 2020-10-29 2020-10-29 Electronic device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109137536A TWI799752B (en) 2020-10-29 2020-10-29 Electronic device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW202218213A TW202218213A (en) 2022-05-01
TWI799752B true TWI799752B (en) 2023-04-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137536A TWI799752B (en) 2020-10-29 2020-10-29 Electronic device and manufacturing method thereof

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TW (1) TWI799752B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022846A (en) * 2002-06-18 2004-01-22 Nagoya Industrial Science Research Inst Method of arranging fine component and substrate device
CN107431106A (en) * 2015-04-07 2017-12-01 夏普株式会社 Fluid assembles top contact LED disks
TW201826490A (en) * 2016-09-15 2018-07-16 美商伊樂視有限公司 System and method for the fluidic assembly of emissive displays
US10170664B2 (en) * 2014-10-31 2019-01-01 eLux, Inc. Surface mount emissive elements
US20190319015A1 (en) * 2014-10-31 2019-10-17 eLux Inc. Emissive Display Substrate for Surface Mount Micro-LED Fluidic Assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022846A (en) * 2002-06-18 2004-01-22 Nagoya Industrial Science Research Inst Method of arranging fine component and substrate device
US10170664B2 (en) * 2014-10-31 2019-01-01 eLux, Inc. Surface mount emissive elements
US20190319015A1 (en) * 2014-10-31 2019-10-17 eLux Inc. Emissive Display Substrate for Surface Mount Micro-LED Fluidic Assembly
CN107431106A (en) * 2015-04-07 2017-12-01 夏普株式会社 Fluid assembles top contact LED disks
TW201826490A (en) * 2016-09-15 2018-07-16 美商伊樂視有限公司 System and method for the fluidic assembly of emissive displays

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Publication number Publication date
TW202218213A (en) 2022-05-01

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