TWI799401B - Methods of etching conductive features, and related devices and systems - Google Patents
Methods of etching conductive features, and related devices and systems Download PDFInfo
- Publication number
- TWI799401B TWI799401B TW106143295A TW106143295A TWI799401B TW I799401 B TWI799401 B TW I799401B TW 106143295 A TW106143295 A TW 106143295A TW 106143295 A TW106143295 A TW 106143295A TW I799401 B TWI799401 B TW I799401B
- Authority
- TW
- Taiwan
- Prior art keywords
- systems
- methods
- conductive features
- related devices
- etching conductive
- Prior art date
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662432710P | 2016-12-12 | 2016-12-12 | |
US62/432,710 | 2016-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201828358A TW201828358A (en) | 2018-08-01 |
TWI799401B true TWI799401B (en) | 2023-04-21 |
Family
ID=63960176
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112135058A TW202401560A (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features |
TW111105647A TWI819494B (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features, and related devices and systems |
TW106143295A TWI799401B (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features, and related devices and systems |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112135058A TW202401560A (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features |
TW111105647A TWI819494B (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features, and related devices and systems |
Country Status (1)
Country | Link |
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TW (3) | TW202401560A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040079729A1 (en) * | 2002-10-25 | 2004-04-29 | Nanya Technology Corporation | Process for etching metal layer |
US20040245213A1 (en) * | 2003-06-09 | 2004-12-09 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
US20140252571A1 (en) * | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
TW201534756A (en) * | 2014-03-10 | 2015-09-16 | Nat Univ Tsing Hua | Method for manufacturing silicon carbide thin film |
WO2016193978A2 (en) * | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
-
2017
- 2017-12-07 TW TW112135058A patent/TW202401560A/en unknown
- 2017-12-07 TW TW111105647A patent/TWI819494B/en active
- 2017-12-07 TW TW106143295A patent/TWI799401B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040079729A1 (en) * | 2002-10-25 | 2004-04-29 | Nanya Technology Corporation | Process for etching metal layer |
US20040245213A1 (en) * | 2003-06-09 | 2004-12-09 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
US20140252571A1 (en) * | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
TW201534756A (en) * | 2014-03-10 | 2015-09-16 | Nat Univ Tsing Hua | Method for manufacturing silicon carbide thin film |
WO2016193978A2 (en) * | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
Also Published As
Publication number | Publication date |
---|---|
TWI819494B (en) | 2023-10-21 |
TW202224013A (en) | 2022-06-16 |
TW202401560A (en) | 2024-01-01 |
TW201828358A (en) | 2018-08-01 |
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