TWI799384B - 熱傳導片材 - Google Patents

熱傳導片材 Download PDF

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Publication number
TWI799384B
TWI799384B TW106124997A TW106124997A TWI799384B TW I799384 B TWI799384 B TW I799384B TW 106124997 A TW106124997 A TW 106124997A TW 106124997 A TW106124997 A TW 106124997A TW I799384 B TWI799384 B TW I799384B
Authority
TW
Taiwan
Prior art keywords
heat conduction
conduction sheet
sheet
heat
conduction
Prior art date
Application number
TW106124997A
Other languages
English (en)
Chinese (zh)
Other versions
TW201835182A (zh
Inventor
內海大介
村上康之
Original Assignee
日商日本瑞翁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本瑞翁股份有限公司 filed Critical 日商日本瑞翁股份有限公司
Publication of TW201835182A publication Critical patent/TW201835182A/zh
Application granted granted Critical
Publication of TWI799384B publication Critical patent/TWI799384B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW106124997A 2016-08-03 2017-07-26 熱傳導片材 TWI799384B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016152991 2016-08-03
JP2016-152991 2016-08-03

Publications (2)

Publication Number Publication Date
TW201835182A TW201835182A (zh) 2018-10-01
TWI799384B true TWI799384B (zh) 2023-04-21

Family

ID=61072805

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106124997A TWI799384B (zh) 2016-08-03 2017-07-26 熱傳導片材

Country Status (3)

Country Link
JP (1) JPWO2018025587A1 (fr)
TW (1) TWI799384B (fr)
WO (1) WO2018025587A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019171987A1 (fr) * 2018-03-07 2019-09-12 日本ゼオン株式会社 Structure conductrice, corps composite, procédé de production de structure conductrice, et procédé de production de corps composite
JP7234560B2 (ja) * 2018-09-28 2023-03-08 日本ゼオン株式会社 熱伝導シートおよびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591068B (en) * 2001-08-06 2004-06-11 Showa Denko Kk Conductive curable resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10125237B2 (en) * 2008-05-23 2018-11-13 Hitachi Chemical Company, Ltd. Heat radiation sheet and heat radiation device
MY164019A (en) * 2010-06-17 2017-11-15 Hitachi Chemical Co Ltd Thermal conductive sheet, method of producing thermal conductive sheet and heat releasing device
JP6152030B2 (ja) * 2013-03-29 2017-06-21 積水化学工業株式会社 電子機器用熱伝導性発泡体シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591068B (en) * 2001-08-06 2004-06-11 Showa Denko Kk Conductive curable resin composition

Also Published As

Publication number Publication date
JPWO2018025587A1 (ja) 2019-05-30
WO2018025587A1 (fr) 2018-02-08
TW201835182A (zh) 2018-10-01

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