TWI797753B - Sound device using loudspeaker to dissipate heat and control method using the same - Google Patents
Sound device using loudspeaker to dissipate heat and control method using the same Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 16
- 230000005236 sound signal Effects 0.000 claims abstract description 76
- 238000012545 processing Methods 0.000 claims abstract description 36
- 230000000737 periodic effect Effects 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 26
- 239000012528 membrane Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 18
- 239000003570 air Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000282412 Homo Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
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- 210000005069 ears Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/007—Protection circuits for transducers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/181—Low-frequency amplifiers, e.g. audio preamplifiers
- H03F3/183—Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/005—Circuits arrangements for indicating a predetermined temperature
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/03—Indexing scheme relating to amplifiers the amplifier being designed for audio applications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/181—Low-frequency amplifiers, e.g. audio preamplifiers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
- H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
- H04R29/003—Monitoring arrangements; Testing arrangements for loudspeakers of the moving-coil type
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
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- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
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Abstract
Description
本案屬於發聲裝置的領域,尤指一種利用揚聲器散熱之發聲裝置及其適用之控制方法。This case belongs to the field of sound-generating devices, especially a sound-generating device that uses loudspeakers to dissipate heat and its applicable control method.
發聲裝置(或稱可攜式電子裝置),例如手機等,因相機與無線通訊速度的進步,使得高畫質錄影、3D手遊與5G通訊在發聲裝置上盛行,也因此導致發聲裝置增加了許多負擔,故如何提升發聲裝置中的散熱便成為越來越重要的議題。Sounding devices (or portable electronic devices), such as mobile phones, etc., due to the advancement of cameras and wireless communication speeds, high-definition video, 3D mobile games and 5G communications are popular on sounding devices, which has led to an increase in the number of sounding devices There are many burdens, so how to improve the heat dissipation in the sound generating device has become an increasingly important issue.
目前的發聲裝置大部分採用被動散熱,即採用高熱傳導率的材料來將發熱源的熱能以熱傳導方式傳遞至發聲裝置的表面,再以熱對流方式傳遞至環境空氣中,以達到降低發熱源溫度的目的。然而,被動散熱能解決的發熱量受限於發聲裝置的表面積的尺寸大小,而在小型化且具備高功能的發展趨勢下,被動散熱的效果並無法大幅增加,故被動散熱往往成為發聲裝置的設計瓶頸。Most of the current sound generating devices adopt passive heat dissipation, that is, materials with high thermal conductivity are used to transfer the heat energy of the heat source to the surface of the sound generating device by heat conduction, and then transfer to the ambient air by heat convection to reduce the temperature of the heat source the goal of. However, the amount of heat that passive cooling can solve is limited by the size of the surface area of the sounding device, and under the development trend of miniaturization and high functionality, the effect of passive cooling cannot be greatly increased, so passive cooling is often the first choice for sounding devices. Design bottlenecks.
因此,如何發展一種可改善上述現有技術的利用揚聲器散熱之發聲裝置及其適用之控制方法,實為目前迫切的需求。Therefore, how to develop a sound generating device using a speaker to dissipate heat and an applicable control method thereof that can improve the above-mentioned prior art is an urgent need at present.
本案為一種利用揚聲器散熱之發聲裝置及其適用之控制方法,俾解決傳統發聲裝置因採用被動散熱,導致被動散熱的效果因受限於發聲裝置的表面積的尺寸大小而無法提升之缺失。This case is a sound generating device using speakers for heat dissipation and its applicable control method to solve the problem that the traditional sound generating device adopts passive heat dissipation, and the effect of passive heat dissipation cannot be improved due to the limitation of the surface area of the sound generating device.
為達前述之目的,本案之一較廣實施態樣為提供一種發聲裝置,包含揚聲盒、揚聲器、溫度偵測器、中央處理器及訊號放大器。揚聲盒包括出音口。揚聲器設置於揚聲盒內。溫度偵測器用以檢測發聲裝置的溫度,並產生回授訊號。中央處理器預存有預設音頻訊號,並藉由回授訊號判斷發聲裝置的溫度是否超過溫度門檻值,其中當中央處理器判斷出揚聲器處於待機狀態且發聲裝置的溫度超過溫度門檻值時,中央處理器輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號且每一週期包含交互切換的正半周波形及負半周波形。訊號放大器連接於中央處理器與揚聲器之間,用以放大預設音頻訊號,並提供至揚聲器。In order to achieve the aforementioned purpose, one of the wider implementation aspects of this case is to provide a sound generating device, including a speaker box, a speaker, a temperature detector, a central processing unit and a signal amplifier. The speaker box includes a sound outlet. The speaker is arranged in the speaker box. The temperature detector is used to detect the temperature of the sound generating device and generate a feedback signal. The central processing unit pre-stores a preset audio signal, and judges whether the temperature of the sounding device exceeds the temperature threshold value through the feedback signal. When the central processing unit determines that the speaker is in a standby state and the temperature of the sounding device exceeds the temperature threshold value, the central processing unit The processor outputs a preset audio signal, wherein the preset audio signal is a periodic signal and each cycle includes alternately switched positive half-cycle waveforms and negative half-cycle waveforms. The signal amplifier is connected between the central processing unit and the loudspeaker to amplify the preset audio signal and provide it to the loudspeaker.
為達前述之目的,本案之另一較廣實施態樣為提供一種控制方法,應用於發聲裝置中,其中發聲裝置包含揚聲盒、揚聲器、溫度偵測器、中央處理器及訊號放大器,控制方法包含:利用溫度偵測器檢測發聲裝置的溫度,並產生回授訊號;中央處理器持續判斷揚聲器是否處於待機狀態,以及藉由溫度偵測器所傳來的回授訊號判斷發聲裝置的溫度是否超過溫度門檻值;當中央處理器判斷揚聲器處於待機狀態且發聲裝置的溫度超過溫度門檻值時,中央處理器輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號且每一週期包含交互切換的正半周波形及負半周波形;以及藉由訊號放大器放大預設音頻訊號,並提供至揚聲器。In order to achieve the above-mentioned purpose, another wider implementation aspect of this case is to provide a control method, which is applied to a sound-generating device, wherein the sound-generating device includes a speaker box, a speaker, a temperature detector, a central processing unit, and a signal amplifier. The method includes: using a temperature detector to detect the temperature of the sounding device, and generating a feedback signal; the central processing unit continuously determines whether the speaker is in a standby state, and judges the temperature of the sounding device through the feedback signal sent by the temperature detector Whether the temperature threshold is exceeded; when the central processing unit judges that the speaker is in standby mode and the temperature of the sounding device exceeds the temperature threshold, the central processing unit outputs a preset audio signal, wherein the default audio signal is a periodic signal and each cycle includes The positive half-cycle waveform and the negative half-cycle waveform are alternately switched; and the preset audio signal is amplified by the signal amplifier and provided to the speaker.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非架構於限制本案。Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used for illustration in nature, rather than to limit this case.
請參閱第1圖、第2圖、第3圖及第4圖,其中第1圖為本案較佳實施例之發聲裝置的系統方塊示意圖,第2圖為發聲裝置的部分結構在第一較佳實施例下的剖面示意圖,第3圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在時域上的波形示意圖,第4圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在各頻率對應的最大擺盪距離的關係圖。如第1圖至第4圖所示,本案之發聲裝置1可為但不限於手機或筆記型電腦等可攜式電子裝置,發聲裝置1包含揚聲器2、溫度偵測器3、中央處理器4、訊號放大器5及揚聲盒6。揚聲器2位於揚聲盒6內,其中揚聲盒6包含出音口60,發聲裝置1可透過揚聲器2播放人耳可聽到的一主要音頻。Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, wherein Fig. 1 is a system block diagram of a sound generating device in a preferred embodiment of the case, and Fig. 2 is a partial structure of the sound generating device in the first preferred embodiment. The sectional schematic diagram under the embodiment, the 3rd figure is the waveform schematic diagram of the amplified preset audio signal received by the speaker shown in the 1st figure from the preset audio signal amplifier in the time domain, and the 4th figure is the schematic diagram of the waveform shown in the 1st figure The relationship diagram of the maximum swing distance corresponding to each frequency of the amplified preset audio signal received by the loudspeaker from the preset audio signal amplifier shown in FIG. As shown in Figures 1 to 4, the
溫度偵測器3用以檢測發聲裝置1的溫度,並對應產生回授訊號。於一些實施例中,溫度偵測器3可內建於發聲裝置1的主機(host),該主機更可包含揚聲器2、中央處理器4、訊號放大器5及揚聲盒6等,然溫度偵測器3亦可由外部電路構成而與該主機分別獨立地設置於發聲裝置1內。The
中央處理器4預存有預設音頻訊號,此外,中央處理器4更接收溫度偵測器3所輸出的回授訊號,以藉由回授訊號判斷發聲裝置1的溫度是否超過溫度門檻值,並判斷揚聲器2是否處於一待機狀態。於本實施例中,前述待機狀態係指揚聲器2無須播放主要音頻。當揚聲器2處於待機狀態(即無須播放主要音頻)且中央處理器4判斷發聲裝置1的溫度超過溫度門檻值時,中央處理器4便輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號,且每一週期包含交互切換的正半周波形(如第3圖所示的時域中角度0度到180度)及負半周波形(如第3圖所示的時域中180度到360度),且預設音頻訊號為人類無法聽見之音頻訊號(即預設音頻訊號的頻率低於人耳可聽到的門檻頻率,例如20Hz)。另外,當中央處理器4判斷揚聲器2非處於待機狀態(即需播放主要音頻)或發聲裝置1的溫度未超過溫度門檻值時,中央處理器4便停止輸出預設音頻訊號。The
於一些實施例中,中央處理器4預存的預設音頻訊號可由微處控制單元(microcontroller unit, MCU)或數位訊號處理器(digital signal processor, DSP)(皆未圖示)計算而產生,並預存於中央處理器4內,但不以此為限。於其它實施例中,預設音頻訊號可由音樂編輯軟體產生而預存於中央處理器4內。另外,預設音頻訊號可為弦波,而以下皆以預設音頻訊號為弦波來示範性說明,其中弦波的表示式為Y=Asinθ,Y為弦波的電壓值,A為揚聲器2所接收之額定電壓,θ為角度,且其範圍在0度至360度。In some embodiments, the preset audio signal pre-stored by the
訊號放大器5連接於中央處理器4與揚聲器2之間,用以放大中央處理器4所輸出之預設音頻訊號,並提供至揚聲器2,使揚聲器2之振動膜(未圖示)依據放大後之預設音頻訊號而對應振動,其中訊號放大器5所輸出之放大後之預設音頻訊號與中央處理器4所輸出的預設音頻訊號的波形及特性一致,只差在振幅加大,而第3圖及第4圖則分別以時域及頻域顯示了放大後之預設音頻訊號的波形,而由第3圖及第4圖所示可知,放大後之預設音頻訊號為一週期性訊號,且每一週期包含交互切換的正半周波形及負半周波形(中央處理器4所輸出的預設音頻訊號亦相同,不再贅述),其中在放大後之預設音頻訊號之正半周波形時,藉由揚聲器2之振動膜的振動將發聲裝置1內由熱源7導致的熱空氣由出音口60排出發聲裝置1外,並在預設音頻訊號之負半周波形時藉由揚聲器2之振動膜的振動將發聲裝置1外的冷空氣由出音口60吸入於發聲裝置1內,藉此在揚聲器2處於待機狀態且發聲裝置1有散熱需求時,本案之發聲裝置1可驅動揚聲器2依據預設音頻訊號之正半周波形及負半周波形來運作,使得發聲裝置1在使用者無法聽到的情況下進行主動散熱,因此本案之發聲裝置1的散熱量並不受限於表面積的尺寸大小而可增加散熱效果。The
於上述實施例中,揚聲器2之振動膜的振動,能帶動揚聲盒6內的空氣朝出音口60流通,因此在放大後之預設音頻訊號為正半周波形時,揚聲器2之振動膜的振動方向是朝向接近出音口60的方向,以排出發聲裝置1內的熱空氣,而在放大後之預設音頻訊號為負半周波形時,揚聲器2之振動膜的振動方向是遠離出音口60的方向,以吸入冷空氣至發聲裝置1內。In the above-mentioned embodiment, the vibration of the vibrating membrane of the
為了提升發聲裝置1的散熱效果,於一些實施例中,如第3圖及第4圖所示,在預設音頻訊號中由一個正半周波形及一個負半周波形所構成的一個週期下,正半周波形的頻率快於負半周波形的頻率,換言之,即正半周波形的時間長度短於負半周波形的時間長度,如此一來,揚聲器2之振動膜的振動方式為快推慢拉,即在快推形式下是讓發聲裝置1內的熱空氣盡快排出,在慢拉形式下則是將發聲裝置1外的冷空氣以最大的量吸入於發聲裝置1內。而對應第3圖及第4圖可知,在第3圖所示的時域中的角度90度與270度時,可以對應到揚聲器2之振動膜在不同頻率下正電壓及負電壓分別的最大擺盪距離(Excursion)。而從第4圖可知,依照振動膜材料的特性,在不同頻率下的最大擺盪距離也有所不同。當預設音頻訊號的負半周波形在F1 Hz時,相較於F2 Hz的操作的擺振距離較小,但由於振動膜擺動較慢,仍可提高由出音口60吸入的冷空氣量。換言之,預設音頻訊號的正半周波形在F2 Hz時,相較於在F1 Hz時的操作,振動膜擺動較快,使得由揚聲盒6內的熱空氣可以快速排除(第4圖中標示的E為振動膜在預設音頻訊號為F2Hz下的最大擺盪距離)。In order to improve the heat dissipation effect of the
請再參閱第2圖,於本實施例中,發聲裝置1更包含第一殼體61、第二殼體62及第一熱傳導介質63。第一殼體61由金屬導熱材質所構成,例如銅或鋁等,第二殼體62由塑料所構成,且第一殼體61及第二殼體62更相組接而共同定義出具有腔體64之揚聲盒6,此外,第一殼體61及第二殼體62兩者間至少有部分彼此相隔,以形成揚聲盒6之出音口60。再者,第一殼體61更包含有延伸部610,延伸部610突出於揚聲盒6的外部。又揚聲器2位於腔體64內並設置於第二殼體62上。更甚者,第一熱傳導介質63位於熱源7與第一殼體61之延伸部610之間,且與熱源7與延伸部610相接觸,更可為但不限於散熱膏、導熱膠片或焊錫。而由第2圖所示可知,熱源7產生的熱能可經由第一熱傳導介質63及第一殼體61傳導至揚聲盒6,使得揚聲盒6內的冷空氣變為熱空氣,後續再藉由揚聲器2之振動膜的振動運作將揚聲盒6內的熱空氣排出,並將冷空氣吸入揚聲盒6內,以達成散熱之目的。Please refer to FIG. 2 again. In this embodiment, the
請參閱第5圖,其係為發聲裝置的部分結構在第二較佳實施例下的剖面示意圖。本實施例的發聲裝置1a的結構相似於第1圖及第2圖所示之發聲裝置1,故以相同符號進行標示來代表元件結構及特性相似而不再贅述,惟本實施例之發聲裝置1a除了包含如第2圖所示之第一殼體61、第二殼體62及第一熱傳導介質63外,更包含第二熱傳導介質65,且第一殼體61不具有如第2圖所示之延伸部610,另外,第一熱傳導介質63僅與熱源7接觸而未與第一殼體61接觸,第二熱傳導介質65則位於第一熱傳導介質63及部分第一殼體61之間,且與第一熱傳導介質63及第一殼體61相接觸。更甚者,第一熱傳導介質63與第二熱傳導介質65可為但不限於由散熱膏、導熱膠片或焊錫等中不同的熱傳導介質所構成。而由第5圖所示可知,熱源7產生的熱能可經由第一熱傳導介質63、第二熱傳導介質65及第一殼體61傳導至揚聲盒6,使得揚聲盒6的冷空氣變為熱空氣,後續再藉由揚聲器2之振動膜的振動運作而將揚聲盒6內的熱空氣排出,並將冷空氣吸入揚聲盒6內,以達成散熱之目的。Please refer to FIG. 5 , which is a schematic cross-sectional view of a part of the structure of the sound generating device under the second preferred embodiment. The structure of the
於一些實施例中,第一殼體61可利用金屬的可塑性而形成至少一散熱鰭片(未圖示),以增加散熱面積而提升發聲裝置1a的散熱效率。In some embodiments, the
請參閱第6圖,並配合第1圖至第4圖,其中第6圖為本案較佳實施例之適用於第1圖所示之發聲裝置的控制方法流程示意圖。如第6圖所示,本案之發聲裝置的控制方法包含步驟如下。Please refer to Figure 6, and cooperate with Figures 1 to 4, wherein Figure 6 is a schematic flowchart of a control method applicable to the sounding device shown in Figure 1 in a preferred embodiment of the present case. As shown in Fig. 6, the control method of the sound generating device in this case includes the following steps.
步驟S1,利用溫度偵測器3檢測發聲裝置1的溫度,並產生回授訊號。Step S1, using the
步驟S2,中央處理器4持續判斷揚聲器2是否處於待機狀態(即是否不需要播放主要音頻),以及藉由溫度偵測器3所傳來的回授訊號判斷發聲裝置1的溫度是否超過溫度門檻值。In step S2, the
步驟S3,當中央處理器4判斷揚聲器2處於待機狀態且發聲裝置1的溫度超過溫度門檻值時,中央處理器4輸出預設音頻訊號。Step S3 , when the
步驟S4,藉由訊號放大器5放大預設音頻訊號,並提供至揚聲器2。Step S4 , amplifying the preset audio signal by the
於一些實施例中,本案之發聲裝置的控制方法更可包含步驟S5,揚聲器2之振動膜依據放大後之預設音頻訊號對應振動,以在預設音頻訊號之正半周波形時藉由振動膜將發聲裝置1內的熱空氣由揚聲盒6之出音口60排出發聲裝置1外,並在預設音頻訊號之負半周波形時藉由振動膜將發聲裝置1外的冷空氣由出音口60吸入發聲裝置1內。當然,於一些實施例中,在步驟S5執行完後,可重新執行步驟S1。In some embodiments, the control method of the sound generating device of this case may further include step S5, the vibrating membrane of the
綜上所述,本案提供一種利用揚聲器散熱之發聲裝置及其適用之控制方法,發聲裝置在揚聲器處於待機狀態且有散熱需求時,驅動揚聲器依據預設音頻訊號之正半周波形及負半周波形來運作,使得發聲裝置在使用者無法聽到的情況下進行主動散熱,因此本案之發聲裝置的散熱量並不受限於表面積的尺寸大小而可增加散熱效果。To sum up, this project provides a sound generating device that utilizes the speaker to dissipate heat and its applicable control method. When the speaker is in a standby state and there is a need for heat dissipation, the sound generating device drives the speaker according to the positive half-cycle waveform and the negative half-cycle waveform of the preset audio signal. The operation enables the sound generating device to actively dissipate heat when the user cannot hear it. Therefore, the heat dissipation of the sound generating device in this case is not limited to the size of the surface area, and the heat dissipation effect can be increased.
1、1a: 發聲裝置 2: 揚聲器 3: 溫度偵測器 4: 中央處理器 5: 訊號放大器 6: 揚聲盒 7: 熱源 60: 出音口 Y: 弦波的電壓值 F1: 預設音頻訊號的負半周波形具有正電壓的最大擺盪距離時的頻率 F2: 預設音頻訊號的正半周波形具有正電壓的最大擺盪距離時的頻率 61: 第一殼體 62: 第二殼體 63: 第一熱傳導介質 64: 腔體 610:延伸部 65: 第二熱傳導介質 E: 最大擺盪距離 1, 1a: sound generating device 2: Speaker 3: Temperature detector 4: CPU 5: Signal Amplifier 6: Speaker box 7: heat source 60: Sound outlet Y: Voltage value of the sine wave F1: The frequency at which the negative half-cycle waveform of the preset audio signal has the maximum swing distance of the positive voltage F2: The frequency at which the positive half-cycle waveform of the preset audio signal has the maximum swing distance of positive voltage 61: First shell 62: Second housing 63: First heat transfer medium 64: Cavity 610: Extension 65: Second heat transfer medium E: Maximum swing distance
第1圖為本案較佳實施例之發聲裝置的系統方塊示意圖; 第2圖為發聲裝置的部分結構在第一較佳實施例下的剖面示意圖; 第3圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在時域上的波形示意圖; 第4圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在各頻率對應的最大擺盪距離的關係圖; 第5圖為發聲裝置的部分結構在第二較佳實施例下的剖面示意圖; 第6圖為本案較佳實施例之適用於第1圖所示之發聲裝置的控制方法流程示意圖。 Fig. 1 is the system block diagram of the sound generating device of the preferred embodiment of the present case; Fig. 2 is a schematic cross-sectional view of part of the structure of the sounding device under the first preferred embodiment; Fig. 3 is a waveform schematic diagram in the time domain of the amplified preset audio signal received by the speaker shown in Fig. 1 from the preset audio signal amplifier; Figure 4 is a relationship diagram of the maximum swing distance corresponding to each frequency of the amplified preset audio signal received by the speaker shown in Figure 1 from the preset audio signal amplifier; Fig. 5 is a schematic cross-sectional view of part of the structure of the sounding device under the second preferred embodiment; Fig. 6 is a schematic flowchart of a control method applicable to the sound generating device shown in Fig. 1 according to a preferred embodiment of the present application.
1: 發聲裝置 2: 揚聲器 3: 溫度偵測器 4: 中央處理器 5: 訊號放大器 1: sound generating device 2: Speaker 3: Temperature detector 4: CPU 5: Signal Amplifier
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