TWI797753B - Sound device using loudspeaker to dissipate heat and control method using the same - Google Patents

Sound device using loudspeaker to dissipate heat and control method using the same Download PDF

Info

Publication number
TWI797753B
TWI797753B TW110135193A TW110135193A TWI797753B TW I797753 B TWI797753 B TW I797753B TW 110135193 A TW110135193 A TW 110135193A TW 110135193 A TW110135193 A TW 110135193A TW I797753 B TWI797753 B TW I797753B
Authority
TW
Taiwan
Prior art keywords
audio signal
generating device
sound
preset audio
speaker
Prior art date
Application number
TW110135193A
Other languages
Chinese (zh)
Other versions
TW202315424A (en
Inventor
許朝貴
高慈妤
Original Assignee
仁寶電腦工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 仁寶電腦工業股份有限公司 filed Critical 仁寶電腦工業股份有限公司
Priority to TW110135193A priority Critical patent/TWI797753B/en
Priority to US17/518,881 priority patent/US11716565B2/en
Application granted granted Critical
Publication of TW202315424A publication Critical patent/TW202315424A/en
Publication of TWI797753B publication Critical patent/TWI797753B/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • H04R3/007Protection circuits for transducers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181Low-frequency amplifiers, e.g. audio preamplifiers
    • H03F3/183Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00Thermometers giving results other than momentary value of temperature
    • G01K3/005Circuits arrangements for indicating a predetermined temperature
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/03Indexing scheme relating to amplifiers the amplifier being designed for audio applications
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181Low-frequency amplifiers, e.g. audio preamplifiers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00Monitoring arrangements; Testing arrangements
    • H04R29/001Monitoring arrangements; Testing arrangements for loudspeakers
    • H04R29/003Monitoring arrangements; Testing arrangements for loudspeakers of the moving-coil type
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

A sound device is disclosed. The sound device comprises a loudspeaker box, a loudspeaker, a temperature detector, a central processing unit and a signal amplifier. The loudspeaker box comprises a sound outlet. The loudspeaker is disposed in the loudspeaker box. The temperature detector is used to detect the temperature of the sound device and generates a feedback signal. The central processing unit pre-stores a preset audio signal, wherein when the central processing unit determines that the speaker is in a standby state and the temperature of the sound device exceeds a temperature threshold by the feedback signal, the central processing unit outputs the preset audio signal, wherein the preset audio signal is a periodic signal, and every cycle of the periodic signal comprises a positive half-cycle waveform and a negative half-cycle waveform which are switched alternately. The signal amplifier is connected between the central processing unit and the loudspeaker to amplify the preset audio signal and provides it to the loudspeaker so that a diaphragm of the loudspeaker is vibrated according to the amplified preset audio signal

Description

利用揚聲器散熱之發聲裝置及其適用之控制方法Sound generating device using loudspeaker for heat dissipation and applicable control method thereof

本案屬於發聲裝置的領域,尤指一種利用揚聲器散熱之發聲裝置及其適用之控制方法。This case belongs to the field of sound-generating devices, especially a sound-generating device that uses loudspeakers to dissipate heat and its applicable control method.

發聲裝置(或稱可攜式電子裝置),例如手機等,因相機與無線通訊速度的進步,使得高畫質錄影、3D手遊與5G通訊在發聲裝置上盛行,也因此導致發聲裝置增加了許多負擔,故如何提升發聲裝置中的散熱便成為越來越重要的議題。Sounding devices (or portable electronic devices), such as mobile phones, etc., due to the advancement of cameras and wireless communication speeds, high-definition video, 3D mobile games and 5G communications are popular on sounding devices, which has led to an increase in the number of sounding devices There are many burdens, so how to improve the heat dissipation in the sound generating device has become an increasingly important issue.

目前的發聲裝置大部分採用被動散熱,即採用高熱傳導率的材料來將發熱源的熱能以熱傳導方式傳遞至發聲裝置的表面,再以熱對流方式傳遞至環境空氣中,以達到降低發熱源溫度的目的。然而,被動散熱能解決的發熱量受限於發聲裝置的表面積的尺寸大小,而在小型化且具備高功能的發展趨勢下,被動散熱的效果並無法大幅增加,故被動散熱往往成為發聲裝置的設計瓶頸。Most of the current sound generating devices adopt passive heat dissipation, that is, materials with high thermal conductivity are used to transfer the heat energy of the heat source to the surface of the sound generating device by heat conduction, and then transfer to the ambient air by heat convection to reduce the temperature of the heat source the goal of. However, the amount of heat that passive cooling can solve is limited by the size of the surface area of the sounding device, and under the development trend of miniaturization and high functionality, the effect of passive cooling cannot be greatly increased, so passive cooling is often the first choice for sounding devices. Design bottlenecks.

因此,如何發展一種可改善上述現有技術的利用揚聲器散熱之發聲裝置及其適用之控制方法,實為目前迫切的需求。Therefore, how to develop a sound generating device using a speaker to dissipate heat and an applicable control method thereof that can improve the above-mentioned prior art is an urgent need at present.

本案為一種利用揚聲器散熱之發聲裝置及其適用之控制方法,俾解決傳統發聲裝置因採用被動散熱,導致被動散熱的效果因受限於發聲裝置的表面積的尺寸大小而無法提升之缺失。This case is a sound generating device using speakers for heat dissipation and its applicable control method to solve the problem that the traditional sound generating device adopts passive heat dissipation, and the effect of passive heat dissipation cannot be improved due to the limitation of the surface area of the sound generating device.

為達前述之目的,本案之一較廣實施態樣為提供一種發聲裝置,包含揚聲盒、揚聲器、溫度偵測器、中央處理器及訊號放大器。揚聲盒包括出音口。揚聲器設置於揚聲盒內。溫度偵測器用以檢測發聲裝置的溫度,並產生回授訊號。中央處理器預存有預設音頻訊號,並藉由回授訊號判斷發聲裝置的溫度是否超過溫度門檻值,其中當中央處理器判斷出揚聲器處於待機狀態且發聲裝置的溫度超過溫度門檻值時,中央處理器輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號且每一週期包含交互切換的正半周波形及負半周波形。訊號放大器連接於中央處理器與揚聲器之間,用以放大預設音頻訊號,並提供至揚聲器。In order to achieve the aforementioned purpose, one of the wider implementation aspects of this case is to provide a sound generating device, including a speaker box, a speaker, a temperature detector, a central processing unit and a signal amplifier. The speaker box includes a sound outlet. The speaker is arranged in the speaker box. The temperature detector is used to detect the temperature of the sound generating device and generate a feedback signal. The central processing unit pre-stores a preset audio signal, and judges whether the temperature of the sounding device exceeds the temperature threshold value through the feedback signal. When the central processing unit determines that the speaker is in a standby state and the temperature of the sounding device exceeds the temperature threshold value, the central processing unit The processor outputs a preset audio signal, wherein the preset audio signal is a periodic signal and each cycle includes alternately switched positive half-cycle waveforms and negative half-cycle waveforms. The signal amplifier is connected between the central processing unit and the loudspeaker to amplify the preset audio signal and provide it to the loudspeaker.

為達前述之目的,本案之另一較廣實施態樣為提供一種控制方法,應用於發聲裝置中,其中發聲裝置包含揚聲盒、揚聲器、溫度偵測器、中央處理器及訊號放大器,控制方法包含:利用溫度偵測器檢測發聲裝置的溫度,並產生回授訊號;中央處理器持續判斷揚聲器是否處於待機狀態,以及藉由溫度偵測器所傳來的回授訊號判斷發聲裝置的溫度是否超過溫度門檻值;當中央處理器判斷揚聲器處於待機狀態且發聲裝置的溫度超過溫度門檻值時,中央處理器輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號且每一週期包含交互切換的正半周波形及負半周波形;以及藉由訊號放大器放大預設音頻訊號,並提供至揚聲器。In order to achieve the above-mentioned purpose, another wider implementation aspect of this case is to provide a control method, which is applied to a sound-generating device, wherein the sound-generating device includes a speaker box, a speaker, a temperature detector, a central processing unit, and a signal amplifier. The method includes: using a temperature detector to detect the temperature of the sounding device, and generating a feedback signal; the central processing unit continuously determines whether the speaker is in a standby state, and judges the temperature of the sounding device through the feedback signal sent by the temperature detector Whether the temperature threshold is exceeded; when the central processing unit judges that the speaker is in standby mode and the temperature of the sounding device exceeds the temperature threshold, the central processing unit outputs a preset audio signal, wherein the default audio signal is a periodic signal and each cycle includes The positive half-cycle waveform and the negative half-cycle waveform are alternately switched; and the preset audio signal is amplified by the signal amplifier and provided to the speaker.

體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非架構於限制本案。Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used for illustration in nature, rather than to limit this case.

請參閱第1圖、第2圖、第3圖及第4圖,其中第1圖為本案較佳實施例之發聲裝置的系統方塊示意圖,第2圖為發聲裝置的部分結構在第一較佳實施例下的剖面示意圖,第3圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在時域上的波形示意圖,第4圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在各頻率對應的最大擺盪距離的關係圖。如第1圖至第4圖所示,本案之發聲裝置1可為但不限於手機或筆記型電腦等可攜式電子裝置,發聲裝置1包含揚聲器2、溫度偵測器3、中央處理器4、訊號放大器5及揚聲盒6。揚聲器2位於揚聲盒6內,其中揚聲盒6包含出音口60,發聲裝置1可透過揚聲器2播放人耳可聽到的一主要音頻。Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, wherein Fig. 1 is a system block diagram of a sound generating device in a preferred embodiment of the case, and Fig. 2 is a partial structure of the sound generating device in the first preferred embodiment. The sectional schematic diagram under the embodiment, the 3rd figure is the waveform schematic diagram of the amplified preset audio signal received by the speaker shown in the 1st figure from the preset audio signal amplifier in the time domain, and the 4th figure is the schematic diagram of the waveform shown in the 1st figure The relationship diagram of the maximum swing distance corresponding to each frequency of the amplified preset audio signal received by the loudspeaker from the preset audio signal amplifier shown in FIG. As shown in Figures 1 to 4, the sound generating device 1 in this case can be, but not limited to, portable electronic devices such as mobile phones or notebook computers. The sound generating device 1 includes a speaker 2, a temperature detector 3, and a central processing unit 4 , signal amplifier 5 and speaker box 6. The speaker 2 is located in the speaker box 6 , wherein the speaker box 6 includes a sound outlet 60 , and the sound generating device 1 can play a main audio that can be heard by the human ear through the speaker 2 .

溫度偵測器3用以檢測發聲裝置1的溫度,並對應產生回授訊號。於一些實施例中,溫度偵測器3可內建於發聲裝置1的主機(host),該主機更可包含揚聲器2、中央處理器4、訊號放大器5及揚聲盒6等,然溫度偵測器3亦可由外部電路構成而與該主機分別獨立地設置於發聲裝置1內。The temperature detector 3 is used to detect the temperature of the sound generating device 1 and generate a feedback signal correspondingly. In some embodiments, the temperature detector 3 can be built into the host (host) of the sound generating device 1, and the host can further include a speaker 2, a central processing unit 4, a signal amplifier 5 and a speaker box 6, etc., but the temperature detector The tester 3 can also be constituted by an external circuit and be installed in the sound generating device 1 independently of the host.

中央處理器4預存有預設音頻訊號,此外,中央處理器4更接收溫度偵測器3所輸出的回授訊號,以藉由回授訊號判斷發聲裝置1的溫度是否超過溫度門檻值,並判斷揚聲器2是否處於一待機狀態。於本實施例中,前述待機狀態係指揚聲器2無須播放主要音頻。當揚聲器2處於待機狀態(即無須播放主要音頻)且中央處理器4判斷發聲裝置1的溫度超過溫度門檻值時,中央處理器4便輸出預設音頻訊號,其中預設音頻訊號為一週期性訊號,且每一週期包含交互切換的正半周波形(如第3圖所示的時域中角度0度到180度)及負半周波形(如第3圖所示的時域中180度到360度),且預設音頻訊號為人類無法聽見之音頻訊號(即預設音頻訊號的頻率低於人耳可聽到的門檻頻率,例如20Hz)。另外,當中央處理器4判斷揚聲器2非處於待機狀態(即需播放主要音頻)或發聲裝置1的溫度未超過溫度門檻值時,中央處理器4便停止輸出預設音頻訊號。The central processing unit 4 is pre-stored with a preset audio signal. In addition, the central processing unit 4 further receives the feedback signal output by the temperature detector 3, so as to determine whether the temperature of the sounding device 1 exceeds the temperature threshold by the feedback signal, and It is judged whether the speaker 2 is in a standby state. In this embodiment, the aforementioned standby state means that the speaker 2 does not need to play main audio. When the loudspeaker 2 is in the standby state (i.e. no main audio needs to be played) and the central processing unit 4 judges that the temperature of the sounding device 1 exceeds the temperature threshold, the central processing unit 4 outputs a preset audio signal, wherein the default audio signal is a periodic signal, and each cycle includes alternately switched positive half-cycle waveforms (0 degrees to 180 degrees in the time domain as shown in Figure 3) and negative half-cycle waveforms (180 degrees to 360 degrees in the time domain as shown in Figure 3 degree), and the default audio signal is an audio signal that cannot be heard by humans (that is, the frequency of the default audio signal is lower than the threshold frequency that can be heard by human ears, such as 20 Hz). In addition, when the central processing unit 4 judges that the speaker 2 is not in the standby state (that is, the main audio needs to be played) or the temperature of the sound generating device 1 does not exceed the temperature threshold, the central processing unit 4 stops outputting the preset audio signal.

於一些實施例中,中央處理器4預存的預設音頻訊號可由微處控制單元(microcontroller unit, MCU)或數位訊號處理器(digital signal processor, DSP)(皆未圖示)計算而產生,並預存於中央處理器4內,但不以此為限。於其它實施例中,預設音頻訊號可由音樂編輯軟體產生而預存於中央處理器4內。另外,預設音頻訊號可為弦波,而以下皆以預設音頻訊號為弦波來示範性說明,其中弦波的表示式為Y=Asinθ,Y為弦波的電壓值,A為揚聲器2所接收之額定電壓,θ為角度,且其範圍在0度至360度。In some embodiments, the preset audio signal pre-stored by the central processing unit 4 can be calculated and generated by a microcontroller unit (microcontroller unit, MCU) or a digital signal processor (digital signal processor, DSP) (both not shown), and Prestored in the central processing unit 4, but not limited thereto. In other embodiments, the preset audio signal can be generated by music editing software and pre-stored in the central processing unit 4 . In addition, the default audio signal can be a sinusoidal wave, and the following are examples of the default audio signal as a sinusoidal wave, where the expression of the sinusoidal wave is Y=Asinθ, Y is the voltage value of the sinusoidal wave, and A is the speaker 2 The rated voltage received, θ is an angle, and its range is from 0° to 360°.

訊號放大器5連接於中央處理器4與揚聲器2之間,用以放大中央處理器4所輸出之預設音頻訊號,並提供至揚聲器2,使揚聲器2之振動膜(未圖示)依據放大後之預設音頻訊號而對應振動,其中訊號放大器5所輸出之放大後之預設音頻訊號與中央處理器4所輸出的預設音頻訊號的波形及特性一致,只差在振幅加大,而第3圖及第4圖則分別以時域及頻域顯示了放大後之預設音頻訊號的波形,而由第3圖及第4圖所示可知,放大後之預設音頻訊號為一週期性訊號,且每一週期包含交互切換的正半周波形及負半周波形(中央處理器4所輸出的預設音頻訊號亦相同,不再贅述),其中在放大後之預設音頻訊號之正半周波形時,藉由揚聲器2之振動膜的振動將發聲裝置1內由熱源7導致的熱空氣由出音口60排出發聲裝置1外,並在預設音頻訊號之負半周波形時藉由揚聲器2之振動膜的振動將發聲裝置1外的冷空氣由出音口60吸入於發聲裝置1內,藉此在揚聲器2處於待機狀態且發聲裝置1有散熱需求時,本案之發聲裝置1可驅動揚聲器2依據預設音頻訊號之正半周波形及負半周波形來運作,使得發聲裝置1在使用者無法聽到的情況下進行主動散熱,因此本案之發聲裝置1的散熱量並不受限於表面積的尺寸大小而可增加散熱效果。The signal amplifier 5 is connected between the central processing unit 4 and the loudspeaker 2, and is used to amplify the preset audio signal output by the central processing unit 4, and provide it to the loudspeaker 2, so that the diaphragm (not shown) of the loudspeaker 2 is amplified according to the The preset audio signal corresponding to the vibration, wherein the amplified preset audio signal output by the signal amplifier 5 is consistent with the waveform and characteristics of the preset audio signal output by the central processing unit 4, except that the amplitude is increased, and the second Figure 3 and Figure 4 show the waveform of the amplified preset audio signal in the time domain and frequency domain respectively, and it can be seen from Figure 3 and Figure 4 that the amplified preset audio signal is a periodicity signal, and each cycle includes a positive half-cycle waveform and a negative half-cycle waveform that are switched alternately (the default audio signal output by the central processing unit 4 is also the same, and will not be described in detail), wherein the positive half-cycle waveform of the preset audio signal after the amplification When the vibration of the vibrating membrane of the speaker 2 causes the heat source 7 in the sound generating device 1 to be discharged out of the sound generating device 1 through the sound outlet 60, and is passed through the speaker 2 when the negative half cycle waveform of the audio signal is preset. The vibration of the vibrating membrane draws cold air outside the sound generating device 1 into the sound generating device 1 through the sound outlet 60, so that the sound generating device 1 of this case can drive the speaker 2 when the speaker 2 is in a standby state and the sound generating device 1 has heat dissipation requirements It operates according to the positive half-cycle waveform and negative half-cycle waveform of the preset audio signal, so that the sound generating device 1 actively dissipates heat when the user cannot hear it, so the heat dissipation of the sound generating device 1 in this case is not limited by the size of the surface area And can increase the cooling effect.

於上述實施例中,揚聲器2之振動膜的振動,能帶動揚聲盒6內的空氣朝出音口60流通,因此在放大後之預設音頻訊號為正半周波形時,揚聲器2之振動膜的振動方向是朝向接近出音口60的方向,以排出發聲裝置1內的熱空氣,而在放大後之預設音頻訊號為負半周波形時,揚聲器2之振動膜的振動方向是遠離出音口60的方向,以吸入冷空氣至發聲裝置1內。In the above-mentioned embodiment, the vibration of the vibrating membrane of the speaker 2 can drive the air in the speaker box 6 to circulate toward the sound outlet 60, so when the amplified preset audio signal is a positive half-cycle waveform, the vibrating membrane of the speaker 2 The vibration direction of the loudspeaker 2 is toward the direction close to the sound outlet 60 to discharge the hot air in the sound generating device 1, and when the amplified preset audio signal is a negative half-cycle waveform, the vibration direction of the vibrating membrane of the speaker 2 is away from the sound output. The direction of the opening 60 is used to draw cold air into the sound generating device 1 .

為了提升發聲裝置1的散熱效果,於一些實施例中,如第3圖及第4圖所示,在預設音頻訊號中由一個正半周波形及一個負半周波形所構成的一個週期下,正半周波形的頻率快於負半周波形的頻率,換言之,即正半周波形的時間長度短於負半周波形的時間長度,如此一來,揚聲器2之振動膜的振動方式為快推慢拉,即在快推形式下是讓發聲裝置1內的熱空氣盡快排出,在慢拉形式下則是將發聲裝置1外的冷空氣以最大的量吸入於發聲裝置1內。而對應第3圖及第4圖可知,在第3圖所示的時域中的角度90度與270度時,可以對應到揚聲器2之振動膜在不同頻率下正電壓及負電壓分別的最大擺盪距離(Excursion)。而從第4圖可知,依照振動膜材料的特性,在不同頻率下的最大擺盪距離也有所不同。當預設音頻訊號的負半周波形在F1 Hz時,相較於F2 Hz的操作的擺振距離較小,但由於振動膜擺動較慢,仍可提高由出音口60吸入的冷空氣量。換言之,預設音頻訊號的正半周波形在F2 Hz時,相較於在F1 Hz時的操作,振動膜擺動較快,使得由揚聲盒6內的熱空氣可以快速排除(第4圖中標示的E為振動膜在預設音頻訊號為F2Hz下的最大擺盪距離)。In order to improve the heat dissipation effect of the sounding device 1, in some embodiments, as shown in Fig. 3 and Fig. 4, under a cycle formed by a positive half-cycle waveform and a negative half-cycle waveform in the preset audio signal, the positive The frequency of the half-cycle waveform is faster than the frequency of the negative half-cycle waveform. In other words, the time length of the positive half-cycle waveform is shorter than the time length of the negative half-cycle waveform. In this way, the vibration mode of the vibrating membrane of the loudspeaker 2 is fast push and slow pull, that is, in In the fast push mode, the hot air in the sound generating device 1 is discharged as soon as possible, and in the slow pulling mode, the cold air outside the sound generating device 1 is sucked into the sound generating device 1 with the maximum amount. Corresponding to Figure 3 and Figure 4, it can be seen that when the angles in the time domain shown in Figure 3 are 90 degrees and 270 degrees, they can correspond to the maximum positive and negative voltages of the vibrating membrane of the speaker 2 at different frequencies. Swing distance (Excursion). As can be seen from Figure 4, according to the characteristics of the diaphragm material, the maximum swing distance at different frequencies is also different. When the negative half-period waveform of the preset audio signal is at F1 Hz, the shimmy distance is smaller compared to the F2 Hz operation, but the amount of cold air sucked by the sound outlet 60 can still be increased due to the slower vibration of the diaphragm. In other words, when the positive half cycle waveform of the preset audio signal is at F2 Hz, compared with the operation at F1 Hz, the vibrating membrane swings faster, so that the hot air in the speaker box 6 can be quickly removed (marked in Figure 4 E is the maximum swinging distance of the vibrating membrane when the preset audio signal is F2Hz).

請再參閱第2圖,於本實施例中,發聲裝置1更包含第一殼體61、第二殼體62及第一熱傳導介質63。第一殼體61由金屬導熱材質所構成,例如銅或鋁等,第二殼體62由塑料所構成,且第一殼體61及第二殼體62更相組接而共同定義出具有腔體64之揚聲盒6,此外,第一殼體61及第二殼體62兩者間至少有部分彼此相隔,以形成揚聲盒6之出音口60。再者,第一殼體61更包含有延伸部610,延伸部610突出於揚聲盒6的外部。又揚聲器2位於腔體64內並設置於第二殼體62上。更甚者,第一熱傳導介質63位於熱源7與第一殼體61之延伸部610之間,且與熱源7與延伸部610相接觸,更可為但不限於散熱膏、導熱膠片或焊錫。而由第2圖所示可知,熱源7產生的熱能可經由第一熱傳導介質63及第一殼體61傳導至揚聲盒6,使得揚聲盒6內的冷空氣變為熱空氣,後續再藉由揚聲器2之振動膜的振動運作將揚聲盒6內的熱空氣排出,並將冷空氣吸入揚聲盒6內,以達成散熱之目的。Please refer to FIG. 2 again. In this embodiment, the sound generating device 1 further includes a first housing 61 , a second housing 62 and a first heat transfer medium 63 . The first housing 61 is made of a metal heat-conducting material, such as copper or aluminum, and the second housing 62 is made of plastic, and the first housing 61 and the second housing 62 are further assembled to jointly define a cavity. The speaker box 6 of the body 64 , in addition, at least part of the first casing 61 and the second casing 62 are separated from each other to form the sound outlet 60 of the speaker box 6 . Furthermore, the first casing 61 further includes an extension portion 610 protruding from the outside of the speaker box 6 . In addition, the speaker 2 is located in the cavity 64 and disposed on the second casing 62 . What’s more, the first heat transfer medium 63 is located between the heat source 7 and the extension portion 610 of the first housing 61 , and is in contact with the heat source 7 and the extension portion 610 , which can be but not limited to heat dissipation paste, heat conduction film or solder. As can be seen from Figure 2, the heat energy generated by the heat source 7 can be conducted to the speaker box 6 through the first heat transfer medium 63 and the first housing 61, so that the cold air in the speaker box 6 becomes hot air, and then The hot air in the speaker box 6 is discharged by the vibrating operation of the vibrating membrane of the speaker 2, and the cold air is sucked into the speaker box 6 to achieve the purpose of heat dissipation.

請參閱第5圖,其係為發聲裝置的部分結構在第二較佳實施例下的剖面示意圖。本實施例的發聲裝置1a的結構相似於第1圖及第2圖所示之發聲裝置1,故以相同符號進行標示來代表元件結構及特性相似而不再贅述,惟本實施例之發聲裝置1a除了包含如第2圖所示之第一殼體61、第二殼體62及第一熱傳導介質63外,更包含第二熱傳導介質65,且第一殼體61不具有如第2圖所示之延伸部610,另外,第一熱傳導介質63僅與熱源7接觸而未與第一殼體61接觸,第二熱傳導介質65則位於第一熱傳導介質63及部分第一殼體61之間,且與第一熱傳導介質63及第一殼體61相接觸。更甚者,第一熱傳導介質63與第二熱傳導介質65可為但不限於由散熱膏、導熱膠片或焊錫等中不同的熱傳導介質所構成。而由第5圖所示可知,熱源7產生的熱能可經由第一熱傳導介質63、第二熱傳導介質65及第一殼體61傳導至揚聲盒6,使得揚聲盒6的冷空氣變為熱空氣,後續再藉由揚聲器2之振動膜的振動運作而將揚聲盒6內的熱空氣排出,並將冷空氣吸入揚聲盒6內,以達成散熱之目的。Please refer to FIG. 5 , which is a schematic cross-sectional view of a part of the structure of the sound generating device under the second preferred embodiment. The structure of the sound generating device 1a of this embodiment is similar to the sound generating device 1 shown in Fig. 1 and Fig. 2, so the same symbols are used to mark to represent that the structure and characteristics of the components are similar and will not be described again, but the sound generating device of this embodiment In addition to the first housing 61, the second housing 62 and the first heat transfer medium 63 as shown in Figure 2, 1a further includes a second heat transfer medium 65, and the first housing 61 does not have In addition, the first heat transfer medium 63 is only in contact with the heat source 7 and not in contact with the first casing 61, and the second heat transfer medium 65 is located between the first heat transfer medium 63 and part of the first casing 61, And it is in contact with the first heat transfer medium 63 and the first casing 61 . What's more, the first heat conduction medium 63 and the second heat conduction medium 65 may be, but not limited to, constituted by different heat conduction mediums such as heat dissipation paste, heat conduction film, or solder. As can be seen from Fig. 5, the heat energy generated by the heat source 7 can be conducted to the speaker box 6 through the first heat transfer medium 63, the second heat transfer medium 65 and the first housing 61, so that the cold air in the speaker box 6 becomes The hot air is then discharged from the speaker box 6 through the vibrating operation of the vibrating membrane of the speaker 2, and the cold air is sucked into the speaker box 6 to achieve the purpose of heat dissipation.

於一些實施例中,第一殼體61可利用金屬的可塑性而形成至少一散熱鰭片(未圖示),以增加散熱面積而提升發聲裝置1a的散熱效率。In some embodiments, the first housing 61 can utilize the plasticity of metal to form at least one heat dissipation fin (not shown), so as to increase the heat dissipation area and improve the heat dissipation efficiency of the sound generating device 1a.

請參閱第6圖,並配合第1圖至第4圖,其中第6圖為本案較佳實施例之適用於第1圖所示之發聲裝置的控制方法流程示意圖。如第6圖所示,本案之發聲裝置的控制方法包含步驟如下。Please refer to Figure 6, and cooperate with Figures 1 to 4, wherein Figure 6 is a schematic flowchart of a control method applicable to the sounding device shown in Figure 1 in a preferred embodiment of the present case. As shown in Fig. 6, the control method of the sound generating device in this case includes the following steps.

步驟S1,利用溫度偵測器3檢測發聲裝置1的溫度,並產生回授訊號。Step S1, using the temperature detector 3 to detect the temperature of the sound generating device 1, and generating a feedback signal.

步驟S2,中央處理器4持續判斷揚聲器2是否處於待機狀態(即是否不需要播放主要音頻),以及藉由溫度偵測器3所傳來的回授訊號判斷發聲裝置1的溫度是否超過溫度門檻值。In step S2, the central processing unit 4 continues to judge whether the speaker 2 is in a standby state (that is, whether it is not necessary to play the main audio), and judges whether the temperature of the sound generating device 1 exceeds the temperature threshold based on the feedback signal from the temperature detector 3 value.

步驟S3,當中央處理器4判斷揚聲器2處於待機狀態且發聲裝置1的溫度超過溫度門檻值時,中央處理器4輸出預設音頻訊號。Step S3 , when the CPU 4 judges that the speaker 2 is in a standby state and the temperature of the sound generating device 1 exceeds a temperature threshold, the CPU 4 outputs a preset audio signal.

步驟S4,藉由訊號放大器5放大預設音頻訊號,並提供至揚聲器2。Step S4 , amplifying the preset audio signal by the signal amplifier 5 and providing it to the speaker 2 .

於一些實施例中,本案之發聲裝置的控制方法更可包含步驟S5,揚聲器2之振動膜依據放大後之預設音頻訊號對應振動,以在預設音頻訊號之正半周波形時藉由振動膜將發聲裝置1內的熱空氣由揚聲盒6之出音口60排出發聲裝置1外,並在預設音頻訊號之負半周波形時藉由振動膜將發聲裝置1外的冷空氣由出音口60吸入發聲裝置1內。當然,於一些實施例中,在步驟S5執行完後,可重新執行步驟S1。In some embodiments, the control method of the sound generating device of this case may further include step S5, the vibrating membrane of the speaker 2 vibrates correspondingly according to the amplified preset audio signal, so that when the preset audio signal has a positive half cycle waveform, the vibrating membrane The hot air in the sound generating device 1 is discharged out of the sound generating device 1 through the sound outlet 60 of the speaker box 6, and the cold air outside the sound generating device 1 is discharged through the vibrating membrane when the negative half-cycle waveform of the preset audio signal The mouth 60 sucks into the sound generating device 1 . Certainly, in some embodiments, step S1 may be re-executed after step S5 is executed.

綜上所述,本案提供一種利用揚聲器散熱之發聲裝置及其適用之控制方法,發聲裝置在揚聲器處於待機狀態且有散熱需求時,驅動揚聲器依據預設音頻訊號之正半周波形及負半周波形來運作,使得發聲裝置在使用者無法聽到的情況下進行主動散熱,因此本案之發聲裝置的散熱量並不受限於表面積的尺寸大小而可增加散熱效果。To sum up, this project provides a sound generating device that utilizes the speaker to dissipate heat and its applicable control method. When the speaker is in a standby state and there is a need for heat dissipation, the sound generating device drives the speaker according to the positive half-cycle waveform and the negative half-cycle waveform of the preset audio signal. The operation enables the sound generating device to actively dissipate heat when the user cannot hear it. Therefore, the heat dissipation of the sound generating device in this case is not limited to the size of the surface area, and the heat dissipation effect can be increased.

1、1a: 發聲裝置 2: 揚聲器 3: 溫度偵測器 4: 中央處理器 5: 訊號放大器 6: 揚聲盒 7: 熱源 60: 出音口 Y: 弦波的電壓值 F1: 預設音頻訊號的負半周波形具有正電壓的最大擺盪距離時的頻率 F2: 預設音頻訊號的正半周波形具有正電壓的最大擺盪距離時的頻率 61: 第一殼體 62: 第二殼體 63: 第一熱傳導介質 64: 腔體 610:延伸部 65: 第二熱傳導介質 E: 最大擺盪距離 1, 1a: sound generating device 2: Speaker 3: Temperature detector 4: CPU 5: Signal Amplifier 6: Speaker box 7: heat source 60: Sound outlet Y: Voltage value of the sine wave F1: The frequency at which the negative half-cycle waveform of the preset audio signal has the maximum swing distance of the positive voltage F2: The frequency at which the positive half-cycle waveform of the preset audio signal has the maximum swing distance of positive voltage 61: First shell 62: Second housing 63: First heat transfer medium 64: Cavity 610: Extension 65: Second heat transfer medium E: Maximum swing distance

第1圖為本案較佳實施例之發聲裝置的系統方塊示意圖; 第2圖為發聲裝置的部分結構在第一較佳實施例下的剖面示意圖; 第3圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在時域上的波形示意圖; 第4圖為第1圖所示之揚聲器從預設音頻訊號放大器所接收之放大後之預設音頻訊號在各頻率對應的最大擺盪距離的關係圖; 第5圖為發聲裝置的部分結構在第二較佳實施例下的剖面示意圖; 第6圖為本案較佳實施例之適用於第1圖所示之發聲裝置的控制方法流程示意圖。 Fig. 1 is the system block diagram of the sound generating device of the preferred embodiment of the present case; Fig. 2 is a schematic cross-sectional view of part of the structure of the sounding device under the first preferred embodiment; Fig. 3 is a waveform schematic diagram in the time domain of the amplified preset audio signal received by the speaker shown in Fig. 1 from the preset audio signal amplifier; Figure 4 is a relationship diagram of the maximum swing distance corresponding to each frequency of the amplified preset audio signal received by the speaker shown in Figure 1 from the preset audio signal amplifier; Fig. 5 is a schematic cross-sectional view of part of the structure of the sounding device under the second preferred embodiment; Fig. 6 is a schematic flowchart of a control method applicable to the sound generating device shown in Fig. 1 according to a preferred embodiment of the present application.

1: 發聲裝置 2: 揚聲器 3: 溫度偵測器 4: 中央處理器 5: 訊號放大器 1: sound generating device 2: Speaker 3: Temperature detector 4: CPU 5: Signal Amplifier

Claims (12)

一種發聲裝置,包含:一揚聲盒,包含一出音口;一揚聲器,設置於該揚聲盒內;一溫度偵測器,用以檢測該發聲裝置的溫度,並產生一回授訊號;一中央處理器,預存有一預設音頻訊號,並藉由該回授訊號判斷該發聲裝置的溫度是否超過一溫度門檻值,其中當該揚聲器處於一待機狀態且該發聲裝置的溫度超過該溫度門檻值時,該中央處理器輸出該預設音頻訊號,其中該預設音頻訊號為一週期性訊號且每一週期包含交互切換的一正半周波形及一負半周波形;以及一訊號放大器,連接於該中央處理器與該揚聲器之間,用以放大該預設音頻訊號,並提供至該揚聲器;其中該正半周波形的時間長度短於該負半周波形的時間長度。 A sounding device, comprising: a speaker box, including a sound outlet; a speaker, arranged in the speaker box; a temperature detector, used to detect the temperature of the sounding device, and generate a feedback signal; A central processing unit pre-stores a preset audio signal, and judges whether the temperature of the sound-generating device exceeds a temperature threshold based on the feedback signal, wherein when the speaker is in a standby state and the temperature of the sound-generating device exceeds the temperature threshold value, the central processing unit outputs the preset audio signal, wherein the preset audio signal is a periodic signal and each cycle includes a positive half-cycle waveform and a negative half-cycle waveform alternately switched; and a signal amplifier connected to Between the CPU and the loudspeaker, the preset audio signal is amplified and provided to the loudspeaker; wherein the duration of the positive half-cycle waveform is shorter than the duration of the negative half-cycle waveform. 如請求項1所述之發聲裝置,其中該揚聲器之一振動膜依據放大後之該預設音頻訊號對應振動,以在該預設音頻訊號之該正半周波形時藉由該振動膜將該發聲裝置內的熱空氣由該出音口排出該發聲裝置外,並在該預設音頻訊號之該負半周波形時藉由該振動膜將該發聲裝置外的冷空氣由該出音口吸入該發聲裝置內。 The sound generating device as described in claim 1, wherein a vibrating membrane of the speaker vibrates correspondingly according to the amplified preset audio signal, so that the vibrating membrane will emit a sound when the preset audio signal has a positive half cycle waveform The hot air in the device is discharged out of the sound-generating device through the sound outlet, and the cold air outside the sound-generating device is sucked into the sound-generating device through the vibrating membrane during the negative half-cycle waveform of the preset audio signal. inside the device. 如請求項1所述之發聲裝置,其中該預設音頻訊號為人類無法聽見之音頻訊號。 The sound generating device as described in claim 1, wherein the preset audio signal is an audio signal that humans cannot hear. 如請求項1所述之發聲裝置,其中該預設音頻訊號為一弦波。 The sound generating device as claimed in claim 1, wherein the preset audio signal is a sine wave. 如請求項2所述之發聲裝置,其中在放大後之該預設音頻訊號為該正半周波形時,該振動膜的振動方向朝向接近該出音口的方向,在放大後之該預設音頻訊號為該負半周波形時,該振動膜的振動方向遠離該出音口的方向。 The sounding device as described in claim 2, wherein when the amplified preset audio signal is the positive half-cycle waveform, the vibration direction of the vibrating membrane faces the direction close to the sound outlet, and the amplified preset audio signal When the signal is the negative half cycle waveform, the vibration direction of the vibrating membrane is away from the direction of the sound outlet. 如請求項1所述之發聲裝置,其中該發聲裝置更包含一第一殼體、一第二殼體及一第一熱傳導介質,該第一殼體由一金屬導熱材質所構成,該第二殼體由一塑料所構成,且該第一殼體及該第二殼體相組接而共同定義出該揚聲盒,又該第一殼體更包含一延伸部,該延伸部突出於該揚聲盒的外部,該第一熱傳導介質位於一熱源與該第一殼體之該延伸部之間,且與該熱源與該延伸部相接觸。 The sounding device as described in Claim 1, wherein the sounding device further comprises a first casing, a second casing and a first heat transfer medium, the first casing is made of a metal heat conducting material, and the second The casing is made of a plastic, and the first casing and the second casing are assembled together to define the speaker box, and the first casing further includes an extension part protruding from the Outside the speaker box, the first heat transfer medium is located between a heat source and the extension of the first casing, and is in contact with the heat source and the extension. 如請求項1所述之發聲裝置,其中該發聲裝置更包含一第一殼體、一第二殼體、一第一熱傳導介質及一第二熱傳導介質,該第一殼體由一金屬導熱材質所構成,該第二殼體由一塑料所構成,且該第一殼體及該第二殼體相組接而共同定義出該揚聲盒,該第一熱傳導介質與一熱源接觸,該第二熱傳導介質位於該第一熱傳導介質及部分該第一殼體之間,且與該第一熱傳導介質及該第一殼體相接觸。 The sound generating device as described in claim 1, wherein the sound generating device further comprises a first casing, a second casing, a first heat transfer medium and a second heat transfer medium, and the first casing is made of a metal heat conduction material constituted, the second housing is made of a plastic, and the first housing and the second housing are combined to jointly define the speaker box, the first heat transfer medium is in contact with a heat source, the first The second heat transfer medium is located between the first heat transfer medium and part of the first casing, and is in contact with the first heat transfer medium and the first casing. 如請求項7所述之發聲裝置,其中該第一熱傳導介質與該第二熱傳導介質分別由不同的熱傳導介質所構成。 The sound generating device according to claim 7, wherein the first heat transfer medium and the second heat transfer medium are respectively composed of different heat transfer media. 一種控制方法,應用於一發聲裝置中,其中該發聲裝置包含一揚聲盒、一揚聲器、一溫度偵測器、一中央處理器及一訊號放大器,該控制方法包含:利用該溫度偵測器檢測該發聲裝置的溫度,並產生一回授訊號; 該中央處理器持續判斷該揚聲器是否處於一待機狀態,以及藉由該溫度偵測器所傳來的該回授訊號判斷該發聲裝置的溫度是否超過一溫度門檻值;當該中央處理器判斷該揚聲器處於該待機狀態且該發聲裝置的溫度超過該溫度門檻值時,該中央處理器輸出一預設音頻訊號,其中該預設音頻訊號為一週期性訊號且每一週期包含交互切換的一正半周波形及一負半周波形;以及藉由該訊號放大器放大該預設音頻訊號,並提供至該揚聲器;其中該正半周波形的時間長度短於該負半周波形的時間長度。 A control method, applied to a sound generating device, wherein the sound generating device includes a speaker box, a speaker, a temperature detector, a central processing unit and a signal amplifier, the control method includes: using the temperature detector Detect the temperature of the sound generating device and generate a feedback signal; The central processing unit continues to judge whether the speaker is in a standby state, and judges whether the temperature of the sound generating device exceeds a temperature threshold value through the feedback signal sent by the temperature detector; when the central processing unit judges that the When the speaker is in the standby state and the temperature of the sound generating device exceeds the temperature threshold, the central processing unit outputs a preset audio signal, wherein the preset audio signal is a periodic signal and each cycle includes a positive A half-cycle waveform and a negative half-cycle waveform; and the preset audio signal is amplified by the signal amplifier and provided to the speaker; wherein the time length of the positive half-cycle waveform is shorter than the time length of the negative half-cycle waveform. 如請求項9所述之控制方法,其中該揚聲器之一振動膜依據放大後之該預設音頻訊號對應振動,以在該預設音頻訊號之該正半周波形時藉由該振動膜將該發聲裝置內的熱空氣由該揚聲盒之一出音口排出該發聲裝置外,並在該預設音頻訊號之該負半周波形時藉由該振動膜將該發聲裝置外的冷空氣由該出音口吸入該發聲裝置內。 The control method as described in claim 9, wherein a vibrating membrane of the speaker vibrates correspondingly according to the amplified preset audio signal, so that the vibrating membrane will emit sound when the preset audio signal has a positive half cycle waveform The hot air in the device is discharged out of the sound-generating device through a sound outlet of the speaker box, and the cold air outside the sound-generating device is discharged out of the sound-generating device through the vibrating membrane when the preset audio signal is in the negative half cycle waveform. The sound port is sucked into the sound generating device. 如請求項9所述之控制方法,其中該預設音頻訊號為人類所無法聽見之音頻訊號。 The control method as described in Claim 9, wherein the preset audio signal is an audio signal that humans cannot hear. 如請求項9所述之控制方法,其中該預設音頻訊號為一弦波。 The control method as described in Claim 9, wherein the preset audio signal is a sine wave.
TW110135193A 2021-09-22 2021-09-22 Sound device using loudspeaker to dissipate heat and control method using the same TWI797753B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW110135193A TWI797753B (en) 2021-09-22 2021-09-22 Sound device using loudspeaker to dissipate heat and control method using the same
US17/518,881 US11716565B2 (en) 2021-09-22 2021-11-04 Sound emitting device using loudspeaker to dissipate heat and control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110135193A TWI797753B (en) 2021-09-22 2021-09-22 Sound device using loudspeaker to dissipate heat and control method using the same

Publications (2)

Publication Number Publication Date
TW202315424A TW202315424A (en) 2023-04-01
TWI797753B true TWI797753B (en) 2023-04-01

Family

ID=85572995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135193A TWI797753B (en) 2021-09-22 2021-09-22 Sound device using loudspeaker to dissipate heat and control method using the same

Country Status (2)

Country Link
US (1) US11716565B2 (en)
TW (1) TWI797753B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735949A (en) * 2013-12-19 2015-06-24 中兴通讯股份有限公司 Drive device and heat dissipation device and method of vibrating diaphragm coil of horn and mobile terminal
CN105430124A (en) * 2015-10-28 2016-03-23 努比亚技术有限公司 Terminal and heat dissipation method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM369635U (en) * 2009-05-14 2009-11-21 Hannstar Display Corp Electronic equipment having heat-dissipating device
TWI469651B (en) 2010-03-08 2015-01-11 Ind Tech Res Inst Flat speaker apparatus with heat dissipating structure and method for heat dissipation of flat speaker
US8798308B2 (en) 2012-02-21 2014-08-05 Bose Corporation Convective airflow using a passive radiator
DE102012210127B4 (en) * 2012-06-15 2014-02-06 Siemens Aktiengesellschaft Device for generating an air flow and arrangement
US9354677B2 (en) * 2013-09-26 2016-05-31 Sonos, Inc. Speaker cooling
US9867312B2 (en) * 2013-12-17 2018-01-09 Htc Corporation Electronic module and heat dissipation module
US10045461B1 (en) 2014-09-30 2018-08-07 Apple Inc. Electronic device with diaphragm cooling
CN104902358B (en) 2015-06-08 2019-01-18 歌尔股份有限公司 A kind of loudspeaker mould group
CN106812728B (en) 2015-11-27 2019-04-16 英业达科技有限公司 Radiator fan device
US10419855B2 (en) 2017-11-30 2019-09-17 Apple Inc. Cooling for audio appliances
CN108391188B (en) 2018-02-11 2020-02-21 维沃移动通信有限公司 Loudspeaker assembly and electronic equipment
CN108616795B (en) 2018-05-10 2023-12-22 惠州迪芬尼声学科技股份有限公司 Loudspeaker box comprising active refrigeration loudspeaker
US11375301B2 (en) * 2019-07-22 2022-06-28 AAC Technologies Pte. Ltd. Speaker box device and mobile terminal using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735949A (en) * 2013-12-19 2015-06-24 中兴通讯股份有限公司 Drive device and heat dissipation device and method of vibrating diaphragm coil of horn and mobile terminal
CN105430124A (en) * 2015-10-28 2016-03-23 努比亚技术有限公司 Terminal and heat dissipation method

Also Published As

Publication number Publication date
US11716565B2 (en) 2023-08-01
TW202315424A (en) 2023-04-01
US20230086258A1 (en) 2023-03-23

Similar Documents

Publication Publication Date Title
JP6246371B2 (en) Speaker vibration membrane coil drive device, heat dissipation device, method, and mobile terminal
WO2017190454A1 (en) Mobile terminal
WO2021072813A1 (en) Loudspeaker device and mobile terminal
WO2022001870A1 (en) Electronic equipment, and heat dissipation control method and apparatus for camera module
WO2021012294A1 (en) Sound production device and mobile terminal
WO2022002054A1 (en) Speaker assembly and electronic device
TW202102011A (en) Speaker
US11445302B2 (en) Dual loudspeaker enabled cooling
CN204157038U (en) A kind of high efficiency and heat radiation anti-interference sound equipment loudspeaker
TWI308053B (en) Dissipation device
TWI797753B (en) Sound device using loudspeaker to dissipate heat and control method using the same
WO2021012239A1 (en) Loudspeaker apparatus and mobile terminal
WO2021012240A1 (en) Loudspeaker apparatus and mobile terminal
US20210029460A1 (en) Speaker box and mobile terminal
JP2014120853A (en) Terminal device and mobile terminal
WO2021114144A1 (en) Heat pipe and loudspeaker apparatus
CN203149475U (en) Loudspeaker box and heat dissipation type air pipe thereof
WO2024037183A1 (en) Audio output method, electronic device and computer-readable storage medium
GB2322500A (en) Heat dissipator using acoustically generated airflow
KR100881341B1 (en) Heat radiation structure for electronic device
CN115942164A (en) Sound production device utilizing loudspeaker to dissipate heat and applicable control method thereof
CN113079679B (en) Heat radiation structure and electronic equipment with same
CN211089957U (en) Sound production device and electronic equipment
CN211429463U (en) Active audio amplifier convenient to carry
WO2022116684A1 (en) Exciter, screen assembly, and terminal