TWI797517B - Antistatic Adhesive Sheet - Google Patents

Abstract

；及在室溫T溫度下，該主體聚合物之Tg溫度必須符合T-T_g>20℃。 The present invention is an antistatic adhesive sheet, the surface resistivity of which is equal to or less than 10 ¹¹ Ω, which includes: a polyimide film; and a conductive polymer layer, which is adhered to the polyimide film On the above, the conductive polymer layer must have a conjugated ring structure, an adhesive composition, which is adhered to the conductive polymer layer, and the main polymer of the adhesive composition includes a monomer that contributes to adhesion and a monomer that contributes to cohesion And modifying monomers, the monomers that contribute to cohesion must be selected as monomers derived from polystyrene, and its general structural formula is

; and at room temperature T, the Tg temperature of the host polymer must meet TT _g >20°C.

Description

Antistatic Adhesive Sheet

The present invention is an antistatic adhesive sheet, especially an antistatic adhesive sheet for attaching electronic components to the antistatic adhesive sheet. After the heating process, when the electronic components are removed from the adhesive sheet, there will be no glue residue on the electronic components. , and the removal process will not damage electronic components due to static electricity.

In the prior art, adhesive materials such as adhesive sheets have been widely used in the production process of various products (eg, semiconductor-related components, LED-related electronic components, panels, circuit boards, etc.). More specifically, it is generally used as an adhesive sheet for carrying in various high-temperature processes. In order to prevent the electronic components from detaching during the process, the adhesive force of the adhesive sheet must be sufficient to fix the electronic components and not to be in contact with the electronic components during various high-temperature processes. Electronic components are separated, i.e. no peeling occurs. In addition, after the electronic components undergo various high-temperature processes, during the pick-up step, that is, when the adhesive sheet is separated from the electronic components, the residual glue of the adhesive sheet cannot cause pollution on the electronic components. Therefore, to be used in various high-temperature processes, the required adhesive sheet must have both good adhesion and cohesion, as well as the characteristics of not being prone to adhesive residue after various high-temperature treatments.

And in response to the current more complex applications, such as the short-term fixation of electronic components with poor static resistance, such as: electronic components for high-frequency wifi, it is more required not only to be able to prevent the electronic components from being damaged after various high-temperature processes The state of the glue, and the components will not damage the electronic components due to static electricity when the components are separated from the adhesive sheet.

In the existing adhesive sheet products, after the required processing, such as various high-temperature processes, the adhesive force between the adhesive sheet and the adhered object will increase. Therefore, if the designed adhesive sheet is bonded between layers Fragile, it will cause the amount of peeling transfer pollution on the adhered object to increase and cause problems such as residual glue.

As for the suppression of static electricity generated when electronic components are detached from the adhesive sheet, general technical literature mentions that the base film on the adhesive sheet can be added with a conductive polymer layer to achieve excellent antistatic properties. The combination of the composition layer and the conductive polymer layer will easily cause adhesive residue when the adhesive sheet is peeled off from the electronic component after the electronic component has undergone various high-temperature processes, that is, the damaged surface during peeling occurs between the conductive polymer layer and the adhesive composition between layers. Therefore, in the prior art, there is still room for improvement in the adhesive sheet used for carrying electronic components through various high-temperature processes.

The technical problem to be solved by the present invention is to provide an antistatic adhesive sheet for the deficiencies of the prior art, wherein the surface resistivity of the antistatic adhesive sheet is 10 ¹¹ Ω or below, and the antistatic adhesive sheet can be used in selected At high temperature, no adhesive residue will be found on the electronic components when peeling off the adhered objects, and no static electricity will be generated to cause damage to the components. Specifically, the amount of peeling transfer pollution on the adherend is controlled to a minimum, so as to achieve the technical effect of no adhesive residue. Moreover, the antistatic adhesive sheet contains a conductive polymer layer, which can prevent the electronic components from being damaged by static electricity during the process of peeling off the adhesive sheet.

。另貢獻黏著力單體歸類為W_A、W_B…W_Z；貢獻內聚力單體歸類為W_a、W_b…W_c；改性單體歸類為W₁、W₂…W₃，定義室溫為T，主體聚合物之玻璃轉移溫度為T_g，符合習知The FOX Equation： In order to solve the above technical problems, the present invention provides an antistatic adhesive sheet, which includes a polyimide film, a conductive polymer layer and an adhesive composition layer. The conductive polymer layer is disposed on the polyimide film, and the adhesive composition layer is disposed on the conductive polymer layer. The conductive polymer must have a conjugated ring structure, such as polystyrene, polypyrrole, polythiophene, polyaniline, polyphenylene sulfide. The main polymer of the adhesive composition includes monomers contributing to adhesion, monomers contributing to cohesion and modified monomers, wherein the monomers contributing to cohesion must be selected as monomers derived from polystyrene, and its general structural formula is

. In addition, monomers contributing adhesion are classified as W _A , W _B ... W _Z ; monomers contributing cohesion are classified as W _a , W _b ... W _c ; monomers contributing modification are classified as W ₁ , W ₂ ... W ₃ , Define the room temperature as T, and the glass transition temperature of the host polymer as T _g , which conforms to the conventional The FOX Equation:

1/T _g =WA/T _g,A +WB/T _g,B +WC/T _g,C +...+Wa/T _g,a +Wb/T _g,b +Wc/T _g,c +... +W1/T _{g, 1} +W2/T _{g, 2} +W3/T _{g, 3} +..., and the electronic components can only be attached to the adhesive sheet under the condition of TT _g >20°C.

The beneficial effect of the present invention is that the provided antistatic adhesive sheet can find the matching relationship between the adhesive composition layer and the conductive polymer layer, and the object (electronic component) can be attached to the antistatic adhesive sheet before going through various high-temperature processes. Closely bonded, after various high-temperature processes, there is no adhesive residue during the peeling process of the electronic components and the antistatic adhesive sheet, and the surface resistance of the adhesive sheet is effectively reduced, and then the adhesive sheet is peeled off from the electronic components. Suppresses static electricity generation.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

10: Polyimide film

12: Conductive polymer layer

14: Adhesive composition layer

Figure 1 is an embodiment of the antistatic adhesive sheet of the present invention.

Please refer to the first drawing, the antistatic adhesive sheet of the present invention includes a polyimide film 10, a conductive polymer layer 12 and an adhesive composition layer 14, the conductive polymer layer 12 is arranged on the polyimide film 10 and has a conjugated ring structure, and the adhesive composition layer 14 is disposed on the conductive polymer layer 12 . The main polymer of the adhesive composition layer 14 includes a monomer contributing to adhesion, a monomer contributing to cohesion, and a modifying monomer. The following will describe in detail the monomers that contribute to adhesion, the monomers that contribute to cohesion, and the modified monomers.

The host polymer includes at least one structural unit derived from at least one monomer containing a polymerizable carbon-carbon double bond. Hereinafter, it will be referred to as "a monomer having a polymerizable carbon-carbon double bond group".

The cohesion-contributing monomer must be a styrene monomer or a styrene derivative monomer, which conforms to the following structural formula:

X諸如Cl、COOH、NH₂…等習知之苯乙烯衍生物之單體。具體來說，當主體聚合物包括衍生自上述單體的結構單元時，主體聚合物的物理性質，例如內聚力與耐熱性會被提升。且事實上，通過使用上述單體，可以親合導電高分子層，意指在抗靜電黏著片過完各種高溫製程後，電子元件與該黏著片剝離時無殘膠現象發生，且更可以承受不同的高溫環境。

X is a monomer such as Cl, COOH, NH ₂ ... and other known styrene derivatives. Specifically, when the host polymer includes structural units derived from the above-mentioned monomers, the physical properties of the host polymer, such as cohesion and heat resistance, can be improved. And in fact, by using the above-mentioned monomers, the conductive polymer layer can be attached, which means that after the antistatic adhesive sheet has undergone various high-temperature processes, there will be no adhesive residue when the electronic component is peeled off from the adhesive sheet, and it is more tolerable. different high temperature environments.

The above-mentioned copolymerizable monomers may be used alone to form the structural unit of the host polymer, or two or more kinds of copolymerizable monomers may be used simultaneously to form the structural unit of the host polymer.

The modified monomers are highly cross-linked during polymerization. For example, the modifying monomer may be methacrylic acid, acrylic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, diaminoethyl methacrylate.

The above-mentioned modifying monomers may be used alone, or two or more kinds of modifying monomers may be used in combination. Alternatively, as described above for the copolymerizable monomer, among the monomers used to form the structural unit of the host polymer, an acrylic monomer or a methacrylic monomer may be used alone. By using the modified monomer, the derived host polymer can have improved cohesion and heat resistance.

The above-mentioned main polymer of the adhesive composition includes a monomer contributing to adhesion, a monomer contributing to cohesion and a modifying monomer. Among them, monomers contributing adhesion are classified as W _A , W _B ... W _Z ; monomers contributing cohesion are classified as W _a , W _b ... W _c ; monomers contributing modification are classified as W ₁ , W ₂ ... W ₃ , Available from The FOX Equation:

1/T _g =WA/T _g,A +WB/T _g,B +WC/T _g,C +...+Wa/T _g,a +Wb/T _g,b +Wc/T _g,c +... +W1/T _g,1 +W2/T _g,2 +W3/T _g,3 +…

Deduce the glass transition temperature (T _g ) of the host polymer, and through literature and experimental observations, if the room temperature T is 23°C, the T _g of the host polymer obtained through the possibility of arranging and combining various monomers needs to be low The effect of adhesive force at room temperature is obvious only at 3°C, that is, under the condition of TT _g >20°C, the formed adhesive sheet can be bonded to electronic components without peeling off before going through various high-temperature processes.

In other conventional techniques, in order to increase the cohesive force of the adhesive composition layer, a polyisocyanate-based cross-linking agent is also added, and the cross-linking agent reacts with the functional group of the modified monomer in the host polymer, thereby increasing the cohesive force. And the polyisocyanate crosslinking agent is not limited in the present invention, for example, the polyisocyanate crosslinking agent can be toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), diphenylmethane diisocyanate (MDI), dicyclohexylmethane diisocyanate Lysine diisocyanate (HMDI), lysine diisocyanate (LDI) or related derivatives thereof, which have the general formula R-N=C=O.

As described above, the host polymer of the present invention may be obtained by performing polymerization using the above-mentioned monomers alone, or using a mixture of two or more monomers for polymerization. The type of polymerization reaction may be solution polymerization, emulsion polymerization, mass polymerization or suspension polymerization.

After the host polymer is formed through a polymerization reaction, the host polymer may have a weight average molecular weight greater than 200,000. Preferably, the host polymer of the embodiment of the present invention has a weight average molecular weight between 800,000 and 3.5 million. For the weight average molecular weight of the host polymer, it can be measured and calculated by gel permeation chromatography (the weight average molecular weight is converted by gel permeation chromatography (GPC) with polystyrene as a standard product) have to).

A host polymer having a weight average molecular weight within the above range may have a lower oligomer content. In this way, after the thermosetting adhesive composition including the host polymer is peeled off from the surface of the adherend through a thermosetting process, the pollutants remaining on the surface of the adherend can be greatly reduced. Specifically, based on the above selection of monomers related to the host polymer, the host polymer can have a higher molecular weight. Accordingly, the host polymer will have better physical properties, such as not easy to residue and degumming, and excellent heat resistance. In this way, the low molecular weight substance will not move in the adhesive over time, thereby ensuring the stability of the thermosetting adhesive composition. In contrast, if the molecular weight of the host polymer is low, the low molecular weight substances in the adhesive product will have adverse effects on the thermosetting adhesive composition.

The adhesive composition layer 14 provided by the embodiment of the present invention may further include a thermal polymerization initiator for initiating the polymerization reaction of the host polymer. The thermal polymerization initiator may be benzoyl peroxide, azobisisobutyronitrile (AIBN) or a mixture thereof.

Based on 100 parts of the main polymer, the content of the thermal polymerization initiator in the thermosetting adhesive composition layer 14 is between 0.1 and 20 parts by weight, preferably the content of the thermal polymerization initiator is between In 0.5 to 10 parts by weight.

The conductive polymer layer 12 included in the antistatic adhesive sheet can be formed on the polyimide film 10 in various ways, and the method of formation is not limited here, and can be formed on the polyimide film 10 by coating On, or evaporation, sputtering, spraying... and other effects that can be achieved by various conventional technologies. In addition, the thickness of the conductive polymer layer of the adhesive sheet is not limited, and may be between 0.3 and 100 micrometers (μm). Preferably, the thickness of the conductive polymer layer is between 0.5 and 25 μm.

The conductive polymer layer 12 must have a conjugated ring structure, such as polystyrene, polypyrrole, polythiophene, polyaniline, polyphenylene sulfide, and the like.

The temperature suitable for various high-temperature processes in the present invention can be in the range of 100-300°C. According to the temperature required by different processes, for example, the LED molding temperature can be 130-180°C. For example, the circuit board reflow temperature can be It is 260~288°C...etc.

The adhesive sheet provided by the present invention can have different shapes. Specifically, the adhesive sheet may be a sheet-shaped adhesive material, or an adhesive material rolled into a roll. In addition, the shape of the adhesive sheet can be adjusted according to the field of application, the type of product to be adhered, or other parameters of the manufacturing process, and the present invention is not limited here.

The polyimide film 10 of the adhesive sheet is used to support the conductive polymer layer 12 and the adhesive composition layer 14 . The thickness of the polyimide film 10 may be between 10 to 300 microns (μm), preferably, the thickness is between 12.5 to 200 microns.

The adhesive composition layer 14 in the adhesive sheet provided by the embodiment of the present invention can be formed on the surface of the conductive polymer layer 12 through a coating step or a transfer printing step. For example, the adhesive composition layer 14 can be directly coated on the surface of the conductive polymer layer 12 . Alternatively, the adhesive composition layer can be coated on the surface of a temporary carrier first, the surface of the temporary carrier is pre-set with a release agent, after the adhesive composition coated on the release agent of the temporary carrier is dried and formed, then The dried and shaped adhesive composition is transferred to the surface of the conductive polymer layer 12 .

In the present invention, the thickness of the adhesive composition layer 14 made of host polymer may be in the range of 1 to 100 microns (μm). In practice, in order to ensure the adhesive force including the adhesive composition layer 14, the adhesive composition layer 14 must have a thickness greater than 1 micron.

In addition to the polyimide film 10 , the conductive polymer layer 12 and the adhesive composition layer 14 , the adhesive sheet provided by the embodiment of the present invention may further include a release layer. The release layer can be disposed on the surface of the adhesive composition layer 14 such that the adhesive composition layer 14 is disposed between the conductive polymer layer 12 and the release layer. The release layer may have a thickness between 10 and 200 microns (μm), and may be formed of paper, polyethylene, polypropylene, polyethylene terephthalate. The release layer can provide protection and isolation for the adhesive composition layer 14, so that the adhesive sheet will not be affected by external environmental factors during storage and reduce the adhesive force and other characteristics.

In practice, in order to increase the functionality of the release layer, the release layer can also be endowed with an anti-ultraviolet function, thereby effectively preventing the adhesive composition layer 14 of the adhesive sheet from reacting under the influence of ultraviolet light in the storage environment. In addition, it is easy to separate the release layer from the adhesive composition layer for 12 minutes during use. Release, the surface of the release layer can undergo specific surface treatment steps, for example, the surface of the release layer is modified, such as polysiloxane treatment, long-chain alkyl treatment, or fluorine treatment.

The antistatic adhesive sheet provided by the embodiment of the present invention can be used in various high-temperature processes, but the object (electronic component) is not limited to the application of any industry, such as semiconductors, semiconductor packaging, LED-related processes, circuit board-related processes, panels ……wait. And the material of the object to which the adhesive sheet is attached is not limited, for example, it can be electronic materials such as metal, ceramics, glass, semiconductor components, flexible boards, hard boards, soft-rigid boards, LEDs, etc., in the production process of related electronics industries Adhesive sheets for medium protection or passenger loading.

The technical solution adopted by the present invention is to provide an antistatic adhesive sheet, which includes a polyimide film 10 , a conductive polymer layer 12 and an adhesive composition layer 14 . The conductive polymer layer 12 is disposed on the polyimide film 10 , and the adhesive composition layer 14 is disposed on the conductive polymer layer 12 . The conductive polymer layer 12 must have a conjugated ring structure, and the main polymer of the adhesive composition layer 14 includes a monomer contributing to adhesion, a monomer contributing to cohesion, and a modified monomer, wherein the monomer contributing to cohesion must be selected as polyphenylene Monomers of ethylene derivatives, the general structure of which is

。另貢獻黏著力單體歸類為W_A、W_B…W_Z；貢獻內聚力單體歸類為W_a、W_b…W_c；改性單體歸類為W₁、W₂…W₃，定義室溫為T，主體聚合物之玻璃轉移溫度為T_g，符合習知The FOX Equation：

. In addition, monomers contributing adhesion are classified as W _A , W _B ... W _Z ; monomers contributing cohesion are classified as W _a , W _b ... W _c ; monomers contributing modification are classified as W ₁ , W ₂ ... W ₃ , Define the room temperature as T, and the glass transition temperature of the host polymer as T _g , which conforms to the conventional The FOX Equation:

1/T _g =WA/T _g,A +WB/T _g,B +WC/T _g,C +...+Wa/T _g,a +Wb/T _g,b +Wc/T _g,c +... +W1/T _{g, 1} +W2/T _{g, 2} +W3/T _{g, 3} +...and the electronic components can be attached to the adhesive sheet only under the condition of TT _g >20°C. In detail, the beneficial effect of the present invention is that the provided antistatic adhesive sheet finds the matching relationship between the adhesive composition and the conductive polymer, and the object to be attached (electronic component) can be bonded to the The antistatic adhesive sheet is tightly bonded. After various high-temperature processes, there is no adhesive residue during the peeling process of the electronic component and the antistatic adhesive sheet, and the surface resistance of the adhesive sheet is effectively reduced. Suppresses static electricity generation during stripping of electronic components. Next, the content and effect of the antistatic adhesive sheet provided by the present invention will be shown by examples and comparative examples.

In a one-liter (1L) round-bottomed flask equipped with a separatory funnel, thermometer, nitrogen inlet tube, condenser tube, vacuum seal, stirring rod, and stirring blades, add the main polymer monomer.

As a thermal polymerization initiator, 0.3% by weight of AIBN was used based on the total amount of monomers.

Next, blow nitrogen gas into the above-mentioned experimental device for polymerization, control the temperature of the solution in the experimental device to 65°C±2°C by means of water-proof heating under stirring, and react for 12 hours to obtain the main polymer.

Mix the polyisocyanate-based crosslinking agent and ethyl acetate into the host polymer obtained above, and stir evenly to obtain an adhesive composition.

With respect to the total amount of monomers in the main polymer, 2% polyisocyanate crosslinking agent (toluene diisocyanate, CAS number: 584-84-9, purchased from Sigma-Aldrich) was added.

Use a coater to apply the obtained adhesive composition on the peeled surface of the PET film that has been peeled with a polysiloxane compound, and dry it in a dryer at 100°C for 30 minutes to obtain an adhesive with a thickness of 20 μm. composition layer.

Use a coating machine to control the coating thickness, and coat the obtained conductive polymer on the base film that has been treated with corona in advance. 2μm conductive polymer layer.

Lay the adhesive composition layer on the conductive polymer layer on the base film with a hand roller, and perform an adhesive treatment at 50°C for 72 hours to make an antistatic adhesive sheet. Fix the antistatic adhesive sheet on the iron frame. The exposed adhesive sheet in the middle of the iron frame can fix the electronic components in it, and then place it in an oven to simulate a high-temperature process, and control the temperature of the oven at 200°C for 10 minutes.

data measurement

A. Surface resistance measurement (Ω):

Surface resistance measuring instrument model: PRS-801; operating specification: refer to ASTM D257; operating method: cut the adhesive sheet into a sample with a length of 10 cm x a width of 10 cm. Place the sample on an insulating plane, press the test pen (PRF-922B) vertically on the test surface, press RESET, and then press the TEST button to measure the surface resistance value.

B. Contamination of the component by the adhesive sheet after the peeling process: When the component is carried by the adhesive sheet, after setting the oven at 200°C/10min to simulate the high-temperature process, the component is peeled off the adhesive sheet, and the surface of the component is observed using a microscope Whether there is residual glue (magnification: 400X).

C. Adhesive state of the adhesive sheet and the object to be pasted before the high-temperature process: When the component is carried by the adhesive sheet, use visual observation to observe the state of the adhesive sheet and the object to be pasted.

D. Adhesive state of the adhesive sheet and the attached object after the high-temperature process: When the component is carried by the adhesive sheet, after simulating the high-temperature process conditions at 200°C/30min, use visual observation to observe the adhesive sheet and the attached object situation.

The following content (%) is calculated based on the total weight of the adhesive composition, and the room temperature is controlled at 25°C.

Example 1

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~73%), cohesion-contributing monomer: styrene (~11%), modifying monomer: acrylic acid (~16%); Calculated by The Fox Equation, it is known that TT _g >20°C; conductive polymer formula: polystyrene; base film: PI film.

Example 2

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~68%), cohesion-contributing monomer: p-chlorostyrene (~9%), modifying monomer: acrylic acid (~23% ); Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polystyrene; base film: PI film.

Example 3

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~68%), cohesion-contributing monomer: 4-vinylaniline (~8%), modifying monomer: acrylic acid (~24% ); Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polystyrene; base film: PI film.

Example 4

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (72%), cohesion-contributing monomer: 4-vinylbenzoic acid (10%), modifying monomer: acrylic acid (18%) ; Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polystyrene; base film: PI film.

Example 5

500 grams (g) of ethyl acetate, adhesion contributing monomer: butyl acrylate (73%), cohesion contributing monomer: styrene (11%), modifying monomer: acrylic acid (16%); via The Fox Equation calculation shows that TT _g >20℃; conductive polymer formula: polypyrrole; base film: PI film.

Example 6

500 grams (g) of ethyl acetate, adhesion contributing monomer: butyl acrylate (73%), cohesion contributing monomer: styrene (11%), modifying monomer: acrylic acid (16%); via The Fox Equation calculation shows that TT _g >20℃; conductive polymer formula: polythiophene; base film: PI film.

Example 7

500 grams (g) of ethyl acetate, adhesion contributing monomer: butyl acrylate (73%), cohesion contributing monomer: styrene (11%), modifying monomer: acrylic acid (16%); via The Fox Equation calculation shows that TT _g >20℃; conductive polymer formula: polyaniline; base film: PI film.

Example 8

500 grams (g) of ethyl acetate, adhesion contributing monomer: butyl acrylate (73%), cohesion contributing monomer: styrene (11%), modifying monomer: acrylic acid (16%); via The Fox Equation calculation shows that TT _g >20℃; conductive polymer formula: polyphenylene sulfide; base film: PI film.

Comparative example 1

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~33%), cohesion-contributing monomer: styrene (~5%), modifying monomer: acrylic acid (~62%); Calculated by The Fox Equation, TT _g <20°C; conductive polymer formula: polystyrene; base film: PI film.

Comparative example 2

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~32%), cohesion-contributing monomer: p-chlorostyrene (~4.6%), modifying monomer: acrylic acid (~63.4% ); calculated by The Fox Equation, TT _g <20℃; conductive polymer formula: polystyrene; base film: PI film.

Comparative example 3

500 grams (g) of ethyl acetate, monomer contributing adhesion: butyl acrylate (~71%), monomer contributing cohesion: acrylic acid (~11%), monomer modifying: acrylic acid (~18%); The Fox Equation calculates that TT _g >20°C; conductive polymer formula: polystyrene; base film: PI film.

Comparative example 4

500 grams (g) of ethyl acetate, adhesion contributing monomer: butyl acrylate (~67%), cohesion contributing monomer: methacrylic acid (~10%), modifying monomer: acrylic acid (~23%) ; Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polystyrene; base film: PI film.

Comparative Example 5

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~73%), cohesion-contributing monomer: styrene (~11%), modifying monomer: acrylic acid (~16%); Calculated by The Fox Equation, TT _g >20°C; conductive polymer formula: none; base film: PI film.

Comparative Example 6

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~73%), cohesion-contributing monomer: styrene (~11%), modifying monomer: acrylic acid (~16%); Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polyacetylene; base film: PI film.

Comparative Example 7

500 grams (g) of ethyl acetate, adhesion-contributing monomer: butyl acrylate (~73%), cohesion-contributing monomer: styrene (~11%), modifying monomer: acrylic acid (~16%); Calculated by The Fox Equation, TT _g >20℃; conductive polymer formula: polystyrene; base film: PET film.

The form description is as follows:

The content of the specific embodiments above is for explaining the present invention in detail, however, these embodiments are only for illustration and are not intended to limit the present invention. Those skilled in the art can understand that various changes or modifications made to the present invention are part of the present invention without departing from the scope defined by the appended claims.

Claims (2)

An antistatic adhesive sheet, the surface resistivity of which is equal to or less than 10 ¹¹ Ω, which includes: a polyimide film; and a conductive polymer layer, which is coated on the polyimide film, The conductive polymer layer has a conjugated ring structure, which is polyphenylene sulfide; an adhesive composition layer, which is coated on the conductive polymer layer, and the main polymer of the adhesive composition layer includes a contribution to the adhesion. Monomers, cohesion-contributing monomers and modified monomers, wherein the cohesion-contributing monomers must be selected as derivatives of polystyrene, such as p-chlorostyrene, 4-vinylaniline or 4-vinylbenzoic acid; and At room temperature T, the Tg temperature of the host polymer must meet TT _g >20°C. The antistatic adhesive sheet as claimed in claim 1, wherein at least one monomer precursor of the host polymer includes an acryl group with a polymerizable carbon-carbon double bond or an acryl group containing a polymerizable carbon-carbon Double-bonded methacryl.

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