TWI797114B - Moving body device, exposure apparatus, manufacturing method of flat panel display, element manufacturing method, and driving method of moving body - Google Patents
Moving body device, exposure apparatus, manufacturing method of flat panel display, element manufacturing method, and driving method of moving body Download PDFInfo
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- TWI797114B TWI797114B TW107111169A TW107111169A TWI797114B TW I797114 B TWI797114 B TW I797114B TW 107111169 A TW107111169 A TW 107111169A TW 107111169 A TW107111169 A TW 107111169A TW I797114 B TWI797114 B TW I797114B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
移動體裝置、曝光裝置、平板顯示器的製造方法、元件製造方法以及移動體的驅動方法。基板平台裝置包括:微動平台;X粗動平台;Y粗動平台;致動器單元,包括將使X粗動平台相對於Y粗動平台相對移動的推力設為第1推力而賦予至微動平台的音圈馬達、及將所述推力設為大於第1推力的第2推力而賦予至微動平台的空氣致動器,致動器單元使微動平台及X粗動平台相對於Y粗動平台相對驅動;及控制系統,控制音圈馬達及空氣致動器,基於使微動平台及X粗動平台相對於Y粗動平台相對移動時所要求的推力,控制音圈馬達及空氣致動器中的至少任一個。 A moving body device, an exposure device, a method of manufacturing a flat panel display, a method of manufacturing an element, and a method of driving a moving body. The base plate platform device includes: a fine movement platform; an X coarse movement platform; a Y coarse movement platform; an actuator unit, including a first thrust for the X coarse movement platform relative to the Y coarse movement platform, which is given to the fine movement platform voice coil motor, and an air actuator that provides the second thrust greater than the first thrust to the fine movement stage, and the actuator unit makes the fine movement stage and the X coarse movement stage relative to the Y coarse movement stage. drive; and a control system, which controls the voice coil motor and the air actuator, and controls the voice coil motor and the air actuator based on the thrust required when the fine motion platform and the X coarse motion platform are relatively moved relative to the Y coarse motion platform. at least either one.
Description
本發明是有關於一種移動體裝置、曝光裝置、平板顯示器的製造方法、元件製造方法及移動體的驅動方法,更詳細而言,是有關於一種使第1移動體及第2移動體相對移動的移動體裝置及移動體的驅動方法、以及包含所述移動體裝置的曝光裝置、及利用所述曝光裝置的平板顯示器或元件的製造方法。 The present invention relates to a moving body device, an exposure device, a method for manufacturing a flat panel display, a method for manufacturing an element, and a method for driving a moving body. More specifically, it relates to a method for relatively moving a first moving body and a second moving body. A moving body device and a driving method of the moving body, an exposure device including the moving body device, and a method of manufacturing a flat panel display or an element using the exposure device.
先前,在製造液晶顯示零件、半導體零件(積體電路等)等電子元件(微型元件(micro device))的微影(lithography)製程中,是使用藉由經由投影光學系統(透鏡)利用照明光(能量射束(energy beam))使玻璃板或晶圓(以下統稱為「基板」)曝光,而將光罩(photo mask)或網線(reticle)(以下統稱為「遮罩」)所具有的規定的圖案轉印至所述基板的曝光裝置。 Previously, in the lithography process of manufacturing electronic components (micro devices) such as liquid crystal display parts and semiconductor parts (integrated circuits, etc.), the use of illumination light through a projection optical system (lens) (energy beam (energy beam)) exposes the glass plate or wafer (hereinafter collectively referred to as "substrate"), and the photomask (photo mask) or network cable (reticle) (hereinafter collectively referred to as "mask") has The prescribed pattern is transferred to the substrate by an exposure device.
作為此種曝光裝置,已知有包含如下的粗微動構成的平台裝置的曝光裝置,所述粗微動構成的平台裝置包括可在水平面內以長衝程(long stroke)移動的粗動平台、及保持基板的微動平台,且利用電磁馬達等微動致動器自粗動平台對微動平台賦予推 力,而進行微動平台的高精度位置控制(例如,參照專利文獻1)。 As such an exposure apparatus, there is known an exposure apparatus including a stage device having a coarse and fine movement configuration including a coarse movement stage movable in a horizontal plane with a long stroke (long stroke), and a holding stage. The micro-motion platform of the substrate, and the micro-motion actuator such as an electromagnetic motor is used to push the micro-motion platform from the coarse motion platform. force to perform high-precision position control of the micro-motion stage (for example, refer to Patent Document 1).
此處,藉由近年來的基板的大型化,微動平台有大型化的傾向。伴隨於此,為了應對驅動對象物即微動平台的大型化,所述微動致動器亦被要求高輸出化(大型化)。 Here, due to the increase in the size of the substrate in recent years, the micro-motion stage tends to increase in size. Along with this, in order to cope with the increase in the size of the micro-motion platform which is the object to be driven, the micro-motion actuator is also required to increase in output (upsizing).
[專利文獻1]美國專利申請公開第2010/0018950號說明書 [Patent Document 1] Specification of U.S. Patent Application Publication No. 2010/0018950
根據第1實施方式,提供一種移動體裝置,其包括:第1移動體,可在規定方向上移動;第2移動體,設置成所述第1移動體可相對移動,且可朝向所述規定方向移動;底座,對所述第2移動體進行支撐;致動器單元,其包括將使所述第2移動體相對於所述底座在所述規定方向上相對移動的推力設為第1推力而賦予至所述第1移動體的第1致動器、及將所述推力設為大於所述第1推力的第2推力而賦予至所述第1移動體的第2致動器,並使所述第1移動體及第2移動體關於所述規定方向相對於所述底座相對驅動;以及控制系統,對所述第1致動器及第2致動器進行控制,基於使所述第1移動體及第2移動體相對於所述底座相對移動時所要求的推力,對所述第1致動器及第2致動器中的至少任一個致動器進行控制。 According to a first embodiment, there is provided a moving body device, which includes: a first moving body capable of moving in a predetermined direction; a second moving body configured so that the first moving body can move relatively and move toward the predetermined moving in one direction; a base supporting the second moving body; an actuator unit including a first thrust that makes the second moving body relatively move in the predetermined direction with respect to the base and a first actuator applied to the first moving body, and a second actuator applied to the first moving body by setting the thrust force to a second thrust force greater than the first thrust force, and driving the first moving body and the second moving body relative to the base with respect to the predetermined direction; and a control system controlling the first actuator and the second actuator based on making the The thrust force required when the first moving body and the second moving body move relative to the base controls at least one of the first actuator and the second actuator.
根據第2實施方式,提供一種曝光裝置,其包括:第1 實施方式的移動體裝置;以及圖案形成裝置,對保持於所述移動體裝置的所述第1移動體上的物體,利用能量射束形成規定的圖案。 According to a second embodiment, there is provided an exposure apparatus including: a first A moving body device according to an embodiment; and a pattern forming device for forming a predetermined pattern with an energy beam on an object held on the first moving body of the moving body device.
根據第3實施方式,提供一種平板顯示器的製造方法,其包括:利用第2實施方式的曝光裝置使所述物體曝光;以及使經曝光的所述基板顯影。 According to a third embodiment, there is provided a method of manufacturing a flat panel display, including: exposing the object using the exposure device of the second embodiment; and developing the exposed substrate.
根據第4實施方式,提供一種元件製造方法,其包括:利用第2實施方式的曝光裝置使所述物體曝光;以及使經曝光的所述物體顯影。 According to a fourth embodiment, there is provided a device manufacturing method including: exposing the object using the exposure device according to the second embodiment; and developing the exposed object.
根據第5實施方式,提供一種移動體的驅動方法,其包括:使第1移動體及第2移動體關於規定方向相對於支撐所述第2移動體的底座而相對驅動,所述第1移動體可在所述規定方向上移動,所述第2移動體設置成所述第1移動體可相對移動,且可朝向所述規定方向移動;將使所述第2移動體相對於所述底座在所述規定方向上相對移動的推力設為第1推力,利用第1致動器賦予至所述第1移動體;將使所述第2移動體相對於所述底座在所述規定方向上相對移動的推力設為大於所述第1推力的第2推力,利用第2致動器賦予至所述第1移動體;以及對所述第1致動器及第2致動器進行控制,基於使所述第1移動體及第2移動體相對於所述底座相對移動時所要求的推力,對所述第1致動器及第2致動器中的至少任一個致動器進行控制。 According to a fifth embodiment, there is provided a method of driving a moving body, including: relatively driving a first moving body and a second moving body in a predetermined direction with respect to a base supporting the second moving body, the first moving body can move in the specified direction, and the second moving body is set so that the first moving body can move relatively and move toward the specified direction; the second moving body will move relative to the base The thrust for relative movement in the predetermined direction is defined as a first thrust, which is applied to the first moving body by a first actuator; the second moving body will move in the predetermined direction relative to the base. The thrust of the relative movement is set to a second thrust greater than the first thrust, which is applied to the first moving body by a second actuator; and the first actuator and the second actuator are controlled, Controlling at least one of the first actuator and the second actuator based on the thrust force required to relatively move the first moving body and the second moving body relative to the base .
10:液晶曝光裝置 10: Liquid crystal exposure device
12:照明系統 12: Lighting system
14:遮罩平台裝置 14: Mask platform device
14a:主平台 14a: Main platform
14b:副平台 14b: Secondary platform
14c:架台 14c: Stand
14d:音圈馬達 14d: Voice coil motor
16:投影光學系統 16: Projection optical system
18:裝置本體 18: Device body
18a:上架台部 18a: Shelving platform
18b:中架台部 18b: Middle frame platform
18c:下架台部 18c: Lower shelf
19:防振裝置 19: Anti-vibration device
20:基板平台裝置 20: Substrate platform device
22:基板固持器 22: Substrate holder
24:微動平台 24:Micro-motion platform
26:粗動平台 26: Coarse movement platform
26:粗動平台 26: Coarse movement platform
28:自重支撐裝置 28: Self-weight support device
30:底架 30: Bottom frame
32:Y粗動平台 32: Y coarse motion platform
34:X粗動平台 34: X coarse motion platform
36:X射束 36: X-ray
38、50:線性導引裝置 38, 50: Linear guides
42:重量取消裝置 42: Weight cancellation device
44:Y步進導件 44: Y stepping guide
46:水準測量裝置 46: Leveling device
48:空氣軸承 48: Air Bearing
52:連結構件 52: Connecting components
54:光干涉計 54: Optical interferometer
56:條狀鏡 56: strip mirror
60:基板驅動系統 60: Substrate drive system
62:第1驅動系統 62: 1st drive system
64:第2驅動系統 64: Second drive system
66:第3驅動系統 66: 3rd drive system
68:Z傾斜驅動系統 68: Z Tilt Drive System
70:致動器單元 70: Actuator unit
70X1、70X2:X致動器單元 70X 1 , 70X 2 : X actuator unit
70Y1、70Y2:Y致動器單元 70Y 1 , 70Y 2 : Y actuator unit
72:音圈馬達 72:Voice coil motor
72X:X音圈馬達 72X:X voice coil motor
72Z:Z音圈馬達 72Z:Z voice coil motor
74:空氣致動器 74:Air actuator
74a:壓力感測器 74a: Pressure sensor
74b:加壓空氣裝置 74b: Pressurized air devices
74c:閥 74c: Valve
74X:X空氣致動器 74X:X Air Actuator
76a:定子 76a: Stator
76b:動子 76b: Movers
78:支柱 78: Pillar
80:控制器 80: Controller
82a:FF(前饋)控制器 82a: FF (feedforward) controller
82b:FB(反饋)控制器 82b: FB (feedback) controller
84a:空氣驅動器 84a:Air drive
84b:馬達驅動器 84b: Motor driver
86a:LPFmix 86a:LPF mix
86b:LPFair 86b:LPF air
88:加速度感測器 88: Acceleration sensor
90:主控制裝置 90: Master control device
92:遮罩驅動系統 92: Mask drive system
94:遮罩測量系統 94: Mask measurement system
96:基板測量系統 96:Substrate measurement system
F:地板 F: floor
G:重心位置 G: center of gravity position
IL:照明光 IL: illumination light
M:遮罩 M: mask
P:基板 P: Substrate
X、Y、Z:方向 X, Y, Z: direction
圖1是概略性地表示一實施形態的液晶曝光裝置的構成的圖。 FIG. 1 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to one embodiment.
圖2是用以說明圖1的液晶曝光裝置所含的基板驅動系統之中第1驅動系統(微動平台驅動系統)的構成的圖。 2 is a diagram for explaining the configuration of a first drive system (fine stage drive system) among substrate drive systems included in the liquid crystal exposure apparatus of FIG. 1 .
圖3是第1驅動系統的概念圖。 FIG. 3 is a conceptual diagram of a first drive system.
圖4是用以說明第1驅動系統所含的2個致動器的控制平衡的圖。 FIG. 4 is a diagram for explaining the control balance of two actuators included in the first drive system.
圖5是第1驅動系統的控制方塊圖。 Fig. 5 is a control block diagram of the first drive system.
圖6是表示液晶曝光裝置所含的主控制裝置的輸入輸出關係的方塊圖。 6 is a block diagram showing an input-output relationship of a main controller included in the liquid crystal exposure apparatus.
以下,利用圖1~圖6,對一實施形態進行說明。 Hereinafter, an embodiment will be described using FIGS. 1 to 6 .
圖1中,概略性地表示有一實施形態的曝光裝置(此處為液晶曝光裝置10)的構成。液晶曝光裝置10是將物體(此處為玻璃基板P)設為曝光對象物的步進掃描(step and scan)方式的投影曝光裝置,即所謂掃描器(scanner)。玻璃基板P(以下簡稱為「基板P」)在俯視時形成為矩形(方形),用於液晶顯示裝置(平板顯示器)等。
In FIG. 1, the structure of the exposure apparatus (here, liquid crystal exposure apparatus 10) which concerns on one Embodiment is shown schematically. The liquid
液晶曝光裝置10包括照明系統12、保持形成有電路圖
案等的遮罩M的遮罩平台裝置14、投影光學系統16、裝置本體18、使表面(圖1中朝向+Z側的面)上塗佈有抗蝕劑(感應劑)的基板P相對於投影光學系統16相對移動的移動體裝置(此處為基板平台裝置20)、及所述構件的控制系統等。以下,將曝光時對遮罩M及基板P相對於投影光學系統16分別進行相對掃描的方向設為X軸方向,將在水平面內與X軸正交的方向設為Y軸方向,將與X軸及Y軸正交的方向設為Z軸方向,將圍繞著X軸、Y軸及Z軸的旋轉方向分別設為θx方向、θy方向及θz方向來進行說明。又,將關於X軸方向、Y軸方向及Z軸方向的位置分別設為X位置、Y位置及Z位置來進行說明。
The liquid
照明系統12是與美國專利第5,729,331號說明書等中所揭示的照明系統同樣地構成,使自未圖示的光源(汞燈或雷射二極體(laser diode)等)射出的光分別經由未圖示的反射鏡、雙色鏡(dichroic mirror)、光閘(shutter)、波長選擇濾波器、各種透鏡等,形成為多個曝光用照明光(照明光)IL而照射至遮罩M。作為照明光IL,可使用i線(波長365nm)、g線(波長436nm)、h線(波長405nm)等的光(或者,所述i線、g線、h線的合成光)。
The
作為遮罩平台裝置14所保持的遮罩M,可使用在下表面(圖1中為朝向-Z側的面)上形成有規定的電路圖案的透射型光罩。遮罩平台裝置14是與國際公開第2010/131485號所揭示的裝置同樣的所謂粗微動構成的平台裝置,包括保持遮罩M的主平
台(微動平台)14a及一對副平台(粗動平台)14b。各副平台14b在相對應的架台14c上,藉由線性馬達而在X軸方向上以長衝程受到驅動。在遮罩平台裝置14中,藉由與所述線性馬達一併構成遮罩驅動系統92(圖1中為未圖示。參照圖6)的多個音圈馬達(voice coil motor)14d,而自副平台14b對主平台14a適當地賦予推力。主控制裝置90(圖1中為未圖示。參照圖6)經由遮罩驅動系統92使主平台14a(遮罩M)相對於照明光IL,與一對副平台14b一併在X軸方向上以長衝程驅動,並且相對於一對副平台14b在XY平面內(包含Y軸方向及θz方向)適當地微小驅動。主平台14a的XY平面內的位置資訊是經由包含編碼器系統(encoder system)或干涉計(interferometer)系統等的遮罩測量系統94(圖1中未圖示。參照圖6)藉由主控制裝置90而獲得。
As the mask M held by the
投影光學系統16配置在遮罩平台裝置14的下方。投影光學系統16是與美國專利第6,552,775號說明書等所揭示的投影光學系統同樣的構成的所謂多透鏡投影光學系統,包括利用雙側遠心(telecentric)的等倍系統形成正立正像的多個透鏡模組。
The projection optical system 16 is disposed below the
在液晶曝光裝置10中,若利用來自照明系統12的多個照明光IL對遮罩M上的照明區域進行照明,則會藉由已通過(透射)遮罩M的照明光IL,經由投影光學系統16將所述照明區域內的遮罩M的電路圖案的投影像(部分正立像)形成於與基板P上的照明區域共軛的照明光的照射區域(曝光區域)內。繼而,藉由遮罩M相對於照明區域(照明光IL)沿掃描方向相對移動,
並且基板P相對於曝光區域(照明光IL)沿掃描方向相對移動,而進行基板P上的1個照射(shot)區域的掃描曝光,將形成於遮罩M上的圖案轉印至所述照射區域內。
In the liquid
裝置本體18支撐著遮罩平台裝置14及投影光學系統16,經由防振裝置19設置在無塵室(clean room)的地板F上。裝置本體18是與美國專利申請公開第2008/0030702號說明書所揭示的裝置本體同樣地構成,包括上架台部18a、一對中架台部18b及下架台部18c。所述遮罩平台裝置14的架台14c是以相對於裝置本體18振動性地呈絕緣狀態的方式,以與裝置本體18物理上分離的狀態設置在地板F上。
The
基板平台裝置20是用以對基板P相對於投影光學系統16(照明光IL)以高精度進行位置控制的裝置,具體而言,使基板P相對於照明光IL沿水平面(X軸方向及Y軸方向)以規定的長衝程驅動,並且在六個自由度方向(X軸、Y軸、Z軸、θx、θy及θz的各方向)上微量驅動。基板平台裝置20是除了後述第1驅動系統62(參照圖6)以外,與美國專利申請公開第2012/0057140號說明書等所揭示的裝置同樣地構成的所謂粗微動構成的平台裝置,包括經由基板固持器22保持基板P的微動平台24、龍門式(gantry type)的粗動平台26、自重支撐裝置28、底架(base frame)30、及用以驅動構成基板平台裝置20的各要素的基板驅動系統60(圖1中未圖示,參照圖6)、以及用以測量所述各要素的位置資訊的基板測量系統96(圖1中未圖示,參照圖6)等。
The
微動平台24形成為俯視時為矩形的板狀(或箱型),在其上表面固定有基板固持器22。基板固持器22形成為X軸方向及Y軸方向上的尺寸長於微動平台24的尺寸的俯視時為矩形的板狀(或者箱形),在其上表面(基板載置面)載置基板P。基板固持器22的上表面的X軸方向及Y軸方向上的尺寸設定為與基板P為相同程度(實際上為稍短)。基板P藉由以載置於基板固持器22的上表面的狀態真空吸附保持於基板固持器22上,而沿基板固持器22的上表面對大致整體(整個面)進行平面矯正。
The
粗動平台26包括Y粗動平台32及X粗動平台34。Y粗動平台32配置在微動平台24的下方(-Z側),即配置在底架30上。Y粗動平台32具有沿Y軸方向以規定間隔平行地配置的一對X射束36。一對X射束36經由機械性的線性導引裝置而載置在底架30上,且在底架30上沿Y軸方向移動自如。底架30以相對於所述裝置本體18振動性地呈絕緣狀態的方式,以與裝置本體18物理上分離的狀態設置在地板F上。
The
X粗動平台34配置在Y粗動平台32的上方(+Z側),即配置在微動平台24的下方(微動平台24與Y粗動平台32之間)。X粗動平台34是俯視時呈矩形的板狀的構件,經由多個機械性的線性導引裝置38載置在Y粗動平台32所具有的一對X射束36上,相對於Y粗動平台32關於X軸方向而移動自如,與此相對,關於Y軸方向,與Y粗動平台32一體地移動。
The X
自重支撐裝置28包括自下方支撐微動平台24的自重的
重量取消裝置42、以及自下方支撐所述重量取消裝置42的Y步進導件(step guide)44。重量取消裝置42(亦稱為心柱等)插入至形成於X粗動平台34上的開口部(未圖示),在其重心高度位置上,經由亦稱為撓曲(flexure)裝置的多個連結構件(未圖示)而機械連接於X粗動平台34。重量取消裝置42藉由被X粗動平台34牽引,而與所述X粗動平台34一體地在X軸方向及/或Y軸方向上移動。
Self-
重量取消裝置42經由被稱為水準測量(leveling)裝置46的偽球面軸承裝置而自下方以非接觸方式支撐著微動平台24的自重。水準測量裝置46相對於XY平面擺動(傾斜(tilt)動作)自如地支撐著微動平台24。水準測量裝置46經由未圖示的空氣軸承(air bearing)自下方以非接觸狀態支撐著重量取消裝置42。由此,容許微動平台24相對於重量取消裝置42(及X粗動平台34)朝向X軸方向、Y軸方向及θz方向的相對移動及相對於水平面的擺動(朝向θx方向、θy方向的相對移動)。關於重量取消裝置42、水準測量裝置46、撓曲裝置的構成及功能,已揭示於美國專利申請公開第2010/0018950號說明書等中,因此省略說明。
The
Y步進導件44包括與X軸平行地延伸的構件,配置在Y粗動平台32所具有的一對X射束36之間。Y步進導件44經由空氣軸承48以非接觸狀態支撐著重量取消裝置42,作為重量取消裝置42朝向X軸方向移動時的壓盤而發揮作用。Y步進導件44經由機械性的線性導引裝置50而載置在下架台部18c上,相對於
下架台部18c在Y軸方向上移動自如。Y步進導件44經由多個連結構件52(撓曲裝置)機械連接於一對X射束36,且藉由被Y粗動平台32牽引,而與Y粗動平台32一體地沿Y軸方向移動。
The
基板驅動系統60(圖1中未圖示。參照圖6)包括用以使微動平台24相對於投影光學系統16(照明光IL)在六個自由度方向上驅動的第1驅動系統62(參照圖6)、用以使Y粗動平台32在底架30上沿Y軸方向以長衝程驅動的第2驅動系統64(參照圖6)、及用以使X粗動平台34在Y粗動平台32上沿X軸方向以長衝程驅動的第3驅動系統66(參照圖6)。構成第2驅動系統64及第3驅動系統66的致動器的種類並無特別限定,作為一例,可使用線性馬達或滾珠螺桿驅動裝置等(圖1中圖示有線性馬達)。關於第2驅動系統64及第3驅動系統66的詳細構成,作為一例而揭示於美國專利申請公開第2010/0018950號說明書等中,因此省略說明。
The substrate drive system 60 (not shown in FIG. 1 ; see FIG. 6 ) includes a first drive system 62 (see Fig. 6), the second drive system 64 (referring to Fig. 6) for making the Y
圖2中,表示已去除基板固持器22(參照圖1)的狀態的基板平台裝置20的平面圖(Y粗動平台32、底架30(分別參照圖1)等亦未圖示)。如圖2所示,第1驅動系統62包括用以對微動平台24賦予X軸方向上的推力的一對X致動器單元70X1、X致動器單元70X2,及用以對微動平台24賦予Y軸方向上的推力的一對Y致動器單元70Y1、Y致動器單元70Y2。一對X致動器單元70X1、X致動器單元70X2是在微動平台24的+X側,在Y軸方向上隔開地配置。一對X致動器單元70X1、X致動器單元70X2
是相對於包含微動平台24的系統(質量系統)的重心位置G而對稱(圖2中為上下對稱)地配置。此處,所謂「包含微動平台24的系統」,是指包含微動平台24及其一體物(基板固持器22等。參照圖1)的系統。
FIG. 2 shows a plan view of the
一對Y致動器單元70Y1、Y致動器單元70Y2是在微動平台24的+Y側,在X軸方向上隔開地配置。一對Y致動器單元70Y1、Y致動器單元70Y2是相對於包含微動平台24的系統的重心位置G而對稱(圖2中為左右對稱)地配置。各Y致動器單元70Y1、Y致動器單元70Y2的構成除了配置不同的方面以外,與X致動器單元70X1相同,因此以下,代表4個致動器單元對X致動器單元70X1的構成進行說明。再者,圖1中,為了說明粗動平台26及自重支撐裝置28等的構成,為方便起見,並未圖示一對X致動器單元70X1、X致動器單元70X2。
The pair of Y actuator units 70Y 1 and Y actuator unit 70Y 2 are arranged at a distance from each other in the X-axis direction on the +Y side of the
X致動器單元70X1包括包含動磁(moving magnet)型的X音圈馬達72X、及X空氣致動器(氣動致動器(pneumatic actuator))74X的一組致動器。X音圈馬達72X主要用於對微動平台24的投影光學系統16(參照圖1)的以亞微米級(submicron order)的位置控制(微量驅動),X空氣致動器74X主要於使微動平台24加速至規定的曝光速度為止時使用。作為X致動器單元70X1所具有的X音圈馬達72X及X空氣致動器74X,分別使用衝程(最大發送量)為±數mm(例如2mm~3mm)程度的裝置,X空氣致動器74X是使用較X音圈馬達72X更高輸出的(可產生大
推力的)裝置。與此相對,作為X音圈馬達72X,則使用相較於X空氣致動器74X,能夠以亞微米級對驅動對象物(此處為微動平台24)進行位置控制(微量驅動)的裝置。
The X actuator unit 70X1 includes a set of actuators including a moving magnet type X
X音圈馬達72X的定子(stator)76a經由支柱78安裝在X粗動平台34上,動子76b安裝在微動平台24的側面。X空氣致動器74X包含合成橡膠製的風箱(bellows),所述風箱的伸縮方向(此處為X軸方向)上的一端與所述支柱78(X粗動平台34)機械連接,另一端與微動平台24的側面機械連接。如上所述,X音圈馬達72X及X空氣致動器74X是並列地配置,當利用致動器72X、致動器74X任一個對微動平台24賦予推力時,其驅動反作用力均僅作用至X粗動平台34(可視為自X粗動平台34對微動平台24賦予推力,或者將推力自X粗動平台34傳遞至微動平台24)。X音圈馬達72X及X空氣致動器74X、以及其控制系統的詳細情況將在後文描述。
A stator (stator) 76 a of the X
主控制裝置90(參照圖6)為了在掃描曝光動作中,將微動平台24自靜止狀態(速度及加速度為零的狀態)設為規定的等速移動狀態,經由第3驅動系統66(參照圖6)對X粗動平台34賦予X軸方向上的推力(加速度)而使所述X粗動平台34在掃描方向上以長衝程移動,並且經由第1驅動系統62自X粗動平台34對微動平台24賦予X軸方向上的推力(加速度)。又,在X粗動平台34及微動平台24達到所期望的曝光速度後(或即將達到曝光速度之前),藉由包含規定的安定時間(settling time),自
等速移動的X粗動平台34經由第1驅動系統62將小於所述加速驅動控制時的推力賦予至微動平台24,而對微動平台24進行等速驅動控制。又,在掃描曝光時,與所述等速移動控制同時,基於對準測量結果等,經由第1驅動系統62使微動平台24相對於投影光學系統16(參照圖1)在水平面內三個自由度方向(X軸方向、Y軸方向、θz方向中的至少一個方向)上微量驅動。又,主控制裝置90在關於Y軸方向的基板P的照射區域間移動動作(Y步進動作)時,經由第2驅動系統64(參照圖6)對Y粗動平台32及X粗動平台34賦予Y軸方向上的推力,並且經由第1驅動系統62自X粗動平台34對微動平台24賦予Y軸方向上的推力。
The main controller 90 (refer to FIG. 6 ) in order to set the
如上所述,在微動平台24的驅動控制時,主控制裝置90(參照圖6)適當使用第1驅動系統62所包含的共計4個致動器單元(70X1、70X2、70Y1、70Y2),對微動平台24適當地賦予X軸方向、Y軸方向及θz方向上的推力。此時,1個致動器單元所具有的一組(2個)致動器(若為X致動器單元70X1,則為X音圈馬達72X及X空氣致動器74X)中的一者或兩者是以基於對微動平台24進行驅動時的條件而預先設定的規定的控制平衡(按照控制演算法(control algorithm)來使用。關於所述規定的控制平衡,將在後文描述。
As described above, the main control device 90 (refer to FIG. 6 ) appropriately uses a total of four actuator units (70X 1 , 70X 2 , 70Y 1 , 70Y 2 ) Appropriately impart thrusts in the X-axis direction, the Y-axis direction and the θz direction to the
又,第1驅動系統62(參照圖6)包括用以使微動平台24相對於X粗動平台34在Z傾斜方向(Z軸方向及相對於XY平面進行擺動的方向)上驅動的Z傾斜驅動系統68(參照圖6)。Z
傾斜驅動系統68如圖1所示,包括配置在微動平台24與X粗動平台34之間的多個Z音圈馬達72Z。多個Z音圈馬達72Z配置於不在同一直線上的至少3個部位。關於包含Z音圈馬達72Z在內的Z傾斜驅動系統68的構成,已揭示於美國專利申請公開第2010/0018950號說明書等中,故而省略說明。
In addition, the first drive system 62 (see FIG. 6 ) includes a Z tilt drive for driving the
微動平台24(基板P)的六個自由度方向上的位置資訊是經由基板測量系統96藉由主控制裝置90(分別參照圖6)而求出。基板測量系統96包括包含固定在裝置本體18上的光干涉計54的光干涉計系統。再者,圖1中,僅圖示有用以求出微動平台24的Y軸方向上的位置資訊的Y干涉計,但實際上,Y干涉計及用以求出微動平台24的X軸方向上的位置資訊的X干涉計分別配置有多個。又,在微動平台24上,固定有與光干涉計54相對應的條狀鏡(bar mirror)56(圖1中僅圖示有與Y干涉計相對應的Y條狀鏡)。又,圖1中雖未圖示,但基板測量系統96亦包含用以求出微動平台24的Z傾斜方向上的位置資訊的Z傾斜測量系統(構成並無特別限定)。光干涉計系統及Z傾斜測量系統的一例已揭示於美國專利申請公開第2010/0018950號說明書等中,因此省略說明。再者,用以求出微動平台24的水平面內的位置資訊的測量系統的構成可適當變更,而並不限於所述光干涉計系統,亦可使用如國際公開第2015/147319號所揭示的編碼器系統、或者光干涉計系統及編碼器系統的混合(hybrid)型的測量系統。
The position information of the micro-movement stage 24 (substrate P) in six degrees of freedom directions is obtained by the main control device 90 (refer to FIG. 6 respectively) via the
其次,對構成所述第1驅動系統62的各致動器的構成
及其控制系統進行說明。此處,第1驅動系統62所具有的4個致動器單元70X1、致動器單元70X2、致動器單元70Y1、致動器單元70Y2的構成除了配置(推力的產生方向)不同的方面以外,實質上相同,因而此處,為了便於說明,將4個致動器單元70X1、致動器單元70X2、致動器單元70Y1、致動器單元70Y2稱為致動器單元70而不特別加以區分,並且將致動器單元70設為包含音圈馬達72及空氣致動器74的單元來進行說明。
Next, the configuration of each actuator constituting the
如圖3所示,致動器單元70包含控制器80。控制器80是針對4個致動器單元70X1、致動器單元70X2、致動器單元70Y1、致動器單元70Y2(參照圖2)分別單獨地配置。1個致動器單元70所具有的一組致動器(音圈馬達72及空氣致動器74)藉由共同的控制器80來控制。再者,在圖3中,是圖示為控制器80構成致動器單元70的一部分,但控制器80亦可為統一控制液晶曝光裝置10(參照圖1)的主控制裝置90(參照圖6)的一部分。
As shown in FIG. 3 , the
控制器80藉由對音圈馬達72的定子所具有的線圈的電流的供給控制,而進行音圈馬達72的驅動控制(推力的大小及方向的控制)。又,控制器80藉由一面時常監視測量空氣致動器74所具有的風箱內的壓力的壓力感測器74a的輸出,一面進行配置在空氣致動器74與包含壓縮機(compressor)等的加壓空氣裝置74b之間的閥74c的開閉控制,來進行空氣致動器74的驅動控制(推力的大小及方向的控制)。
The
此處,在對空氣致動器74已供給空氣(已產生推力)
的狀態下,藉由空氣致動器74自身的剛性,而使X粗動平台34與微動平台24成為機械連結的狀態。當在所述連結狀態下X粗動平台34在X軸方向及/或Y軸方向上以長衝程移動時,可使與所述X粗動平台34機械連結的微動平台24與X粗動平台34一同以長衝程移動。如上所述,空氣致動器74自身的衝程為數毫米程度,在對空氣致動器74已供給空氣的狀態下,X粗動平台34會經由空氣致動器74而按壓或牽引微動平台24,因此可不對音圈馬達72進行電流供給,而使微動平台24以長衝程移動。
Here, after the
與此相對,在對空氣致動器74未供給空氣(未產生推力)的狀態下,成為可實質上忽視空氣致動器74自身的剛性的狀態,微動平台24成為對X粗動平台34關於沿XY平面的方向無機械約束(移動自如)的狀態。當在所述非約束狀態下X粗動平台34在X軸方向及/或Y軸方向上以長衝程移動時,藉由利用音圈馬達72對微動平台24賦予推力,可使微動平台24與X粗動平台34一同以長衝程移動。又,亦可與所述以長衝程的移動同時,藉由音圈馬達72而使微動平台24相對於X粗動平台34在水平面內微量驅動。再者,所述「可實質上忽視空氣致動器74的剛性的狀態」,是指當利用音圈馬達72驅動微動平台24時,空氣致動器74(風箱)的剛性不會成為音圈馬達74的阻力(負載)之類的程度。再者,所謂「不產生藉由空氣致動器74的推力的狀態」,亦可對空氣致動器74供給空氣,只要是微動平台24對X粗動平台34關於沿XY平面的方向無機械約束(移動自如)的狀態即可。
On the other hand, in the state where air is not supplied to the air actuator 74 (thrust is not generated), the rigidity of the
再者,在本實施形態的致動器單元70中,是空氣致動器74與微動平台24及X粗動平台34分別機械連接的構造,因此在微動平台24與X粗動平台34之間,包含未對空氣致動器74供給空氣的狀態,經常介在有可使振動相互傳遞的物體。與此相對,空氣致動器74所含的風箱具有與公知的防振(除震)裝置(本實施形態的防振裝置19(參照圖1)等)中所使用的合成橡膠製的風箱型空氣彈簧同樣的除震功能,可使微動平台24與X粗動平台34之間的振動衰減(阻礙振動的傳遞)。如上所述,在空氣致動器74中,風箱作為衰減部而發揮作用,微動平台24與X粗動平台34成為振動性的偽分離狀態。因此,能夠以高精度進行使用音圈馬達72的微動平台24的位置控制。
Furthermore, in the
又,在本實施形態的基板平台裝置20中,如上所述,在微動平台24的位置控制時,致動器單元70所具有的2個(一組)致動器,即音圈馬達72及空氣致動器74是以規定的控制平衡來使用。以下,對2個致動器的控制平衡進行說明。
Also, in the
圖4是用以說明本實施形態的致動器單元70所具有的2個致動器的控制平衡的概念圖。如圖4所示,在本實施形態中,在微動平台24的位置控制時,根據頻率,分別使用將需要的(所要求的)推力施加至微動平台24的致動器。具體而言,2個致動器之中,作為微動致動器的音圈馬達72與空氣致動器74相比,可在更高頻寬(bandwidth)內進行控制驅動,因此在高頻寬內進行微動平台24的位置控制時,使用音圈馬達72。又,在低頻寬內
的微動平台24的位置控制時,使用可產生大於音圈馬達72的推力的空氣致動器74。又,在高頻寬與低頻寬之間的中頻寬內,使用空氣致動器74。再者,在本實施形態中,作為一例,假設未達3Hz的頻寬作為低頻寬,大於或等於3Hz且未達10Hz~20Hz的頻寬作為中頻寬,大於或等於10Hz~20Hz的頻寬作為高頻寬,但各頻寬的頻率並不限定於此,可適當變更。
FIG. 4 is a conceptual diagram illustrating the control balance of two actuators included in the
又,如由圖4所知,在利用空氣致動器74的低頻寬內的微動平台24的位置控制中,藉由前饋(feedforward,FF)控制而對微動平台24賦予推力(空氣前饋力(Air FF Force))。在利用空氣致動器74的中頻寬內的微動平台24的位置控制中,藉由反饋(feedback,FB)控制而對微動平台24賦予推力(空氣反饋力(Air FB Force))。又,在利用音圈馬達72的高頻寬內的微動平台24的位置控制中,將音圈馬達72的推力(馬達力(Motor Force))賦予至微動平台24。再者,在中頻寬內的微動平台的24的位置控制中,亦可設為將藉由使用空氣致動器74的反饋(FB)控制而獲得的推力及音圈馬達72的推力賦予至微動平台24。
Also, as known from FIG. 4 , in the position control of the
圖5是表示用以進行所述前饋控制及反饋控制的致動器單元70的控制電路的一例的方塊圖。如圖5所示,將基於自控制器80(參照圖3)供給的基板P的目標驅動位置的指令值輸入至FF(前饋)控制器82a及FB(反饋)控制器82b,分成低頻及低頻以外的頻率的2個信號。FF控制器82a將基於低頻的信號而運算出的輸出值,輸出至用以控制空氣致動器74(實際上為閥74c)
的空氣驅動器84a。空氣致動器74基於所述輸出值對微動平台24賦予推力。所述前饋控制是在將靜止狀態的微動平台24加速至達到掃描速度為止時、或微動平台24的Y步進動作時、微動平台24的減速時(賦予負加速度的情況)等無需對微動平台24以高精度進行位置控制的情況下進行。
FIG. 5 is a block diagram showing an example of a control circuit of the
又,在微動平台24(參照圖3)的位置控制系統中,每隔規定的控制取樣間隔基於基板測量系統96(參照圖3)的輸出對微動平台24的當前位置資訊進行更新,且反饋所述微動平台24的位置的實測值與指令值的差分即位置誤差信號,以更高精度進行微動平台24的位置控制。如圖5所示,將反饋信號(位置誤差信號)輸入至反饋控制器82b。來自反饋控制器82b的輸出(指令值)在低通濾波器(low pass filter)(LPFmix 86a及LPFair 86b)中基於頻率而被劃分。即,如上所述,將基於中頻(位置誤差信號的低頻寬)的信號而運算出的輸出值輸入至空氣驅動器84a,將基於高頻的信號而運算出的輸出值輸入至用以控制音圈馬達72的馬達驅動器84b。空氣致動器74及音圈馬達72(當位置誤差為微量(高頻寬)時,僅音圈馬達72)基於所述輸出值對微動平台24賦予推力。所述反饋控制是在微動平台24的安定動作時及掃描曝光動作時等對微動平台24以高精度進行位置控制時進行。
Also, in the position control system of the micro-motion platform 24 (refer to FIG. 3 ), the current position information of the
又,在本實施形態的基板平台裝置20(參照圖1)中,與基於所述位置誤差信號而進行的反饋控制一併,利用加速度感測器88(參照圖3)來監視微動平台24的加速度,進行加速度反
饋控制,即對基於微動平台24的振動而產生的微動平台24的位置誤差進行修正。所述加速度反饋控制與公知的主動防振(除震)裝置等中所進行的控制相同,因而此處省略詳細的說明。
In addition, in the substrate stage device 20 (see FIG. 1 ) of this embodiment, the acceleration sensor 88 (see FIG. 3 ) is used to monitor the motion of the
如以上說明,在本實施形態的基板平台裝置20中,在用以進行微動平台24(基板P)的高精度位置控制的反饋控制中,藉由頻率的頻寬來劃分施加需要的推力的致動器(分別使用2個致動器),因此與假設利用所有音圈馬達72進行反饋控制(微小定位控制)的情況相比,音圈馬達72的負載更輕,因此可使用更低輸出(更小型且更低消耗電力)的致動器作為音圈馬達72。
As described above, in the
又,在本實施形態中,作為前饋控制,僅使用可產生大推力的空氣致動器74對微動平台24賦予推力,因此可不對音圈馬達72通電,而使微動平台24加減速度,從而效率良好。
Also, in this embodiment, as feed-forward control, only the
又,致動器單元70是利用1個控制器80(利用1個信號輸入)來統一控制2個致動器(音圈馬達72、空氣致動器74),因此控制系統的構成簡單。
In addition, the
再者,構成以上說明的實施形態的液晶曝光裝置10的各要素的構成並不限定於所述說明的構成,可進行適當變更。作為一例,所述實施形態的第1驅動系統62包括共計4個致動器單元(70X1、70X2、70Y1、70Y2),但致動器單元的數量並不限定於此。又,產生X軸方向上的推力的X致動器單元及在Y軸方向上產生推力的Y致動器單元中,數量亦可不同。
In addition, the structure of each element which comprises the liquid
又,在所述實施形態的致動器單元70中,是將2個致
動器(音圈馬達72及空氣致動器74)鄰接地(隔開地)配置(使推力作用至微動平台24的不同位置)的構成,但各致動器的配置並不限於此,亦可將音圈馬達72與空氣致動器74配置在同軸上。具體而言,藉由在空氣致動器74中使用筒狀的風箱,並且將音圈馬達72插入至所述風箱的內徑側,可將2個致動器配置在大致同軸上。
Also, in the
又,構成1個致動器單元的致動器的種類亦可適當變更。即,在所述實施形態中,使用電磁力(勞侖茲力(Lorentz force))驅動方式的音圈馬達72作為微量驅動用的致動器,但亦可使用其他種類的致動器(利用壓電零件等的微動致動器)。同樣地,作為用以對微動平台24賦予大推力的致動器是使用空氣致動器74,但亦可使用其他種類的致動器(電磁馬達等)。又,在多個致動器單元中,各致動器單元所具有的致動器的構成亦可未必共同,例如在X軸用致動器單元及Y軸用致動器單元中,構成亦可為不同。
In addition, the types of actuators constituting one actuator unit can also be appropriately changed. That is, in the above-described embodiment, the
又,所述實施形態的各致動器單元包含2個1組的致動器(1個音圈馬達72及1個空氣致動器74),但構成各致動器單元的致動器的數量亦可為3個或3個以上。此時,亦可與所述實施形態同樣地將致動器設為兩種種類,將其中一種或兩種致動器配置多個,3個或3個以上的致動器的種類亦可互不相同。
Moreover, each actuator unit of the above-mentioned embodiment includes two actuators (one
又,在所述實施形態中,配置有在二維平面內的正交二軸方向(X軸及Y軸)上產生推力的致動器單元,但致動器單元所產生的推力的方向並不限於此,亦可僅在單軸方向上,亦可為
三個自由度方向以上。又,在所述實施形態中,將致動器單元配置在微動平台24的+X側及+Y側,但亦可設為亦配置在-X側及-Y側。
In addition, in the above-described embodiment, the actuator unit is arranged to generate thrust in the orthogonal two-axis directions (X-axis and Y-axis) in the two-dimensional plane, but the direction of the thrust generated by the actuator unit is not the same. Not limited to this, it can also be only in the uniaxial direction, or it can be
more than three degrees of freedom. In addition, in the above-mentioned embodiment, the actuator unit is arranged on the +X side and the +Y side of the
又,在所述實施形態中,是根據3個頻寬(低頻寬、中頻寬及高頻寬)選擇性地分別使用將前饋控制時及反饋控制時所需的推力施加至微動平台24的致動器的構成,但並不限於此,亦可根據2個頻寬(低頻寬及高頻寬)選擇性地分別使用致動器。具體而言,亦可在前饋控制中僅使用低頻寬用的空氣致動器74使微動平台24加速,在反饋控制中僅使用高頻寬用的音圈馬達72進行微動平台24的位置控制。
Also, in the above-mentioned embodiment, according to the three bandwidths (low bandwidth, middle bandwidth, and high bandwidth), the actuators for applying the thrust required for feedforward control and feedback control to the
又,在所述實施形態中,已對用以對保持基板P的微動平台24進行高精度位置控制的第1驅動系統62具備多個致動器單元的情況進行說明,但並不限於此,亦可在用以驅動遮罩M(參照圖1)的遮罩驅動系統92(參照圖6)中,配置同樣的構成的致動器單元。在所述實施形態的遮罩平台裝置14中,遮罩M僅在X軸方向上以長衝程進行移動,因此作為致動器單元,僅配置沿X軸方向產生推力的致動器單元即可。
In addition, in the above-mentioned embodiment, the case where the
又,所述實施形態的基板平台裝置20的構成亦不限於所述實施形態中所說明的構成,而可適當變更,在該些變形例中,亦可應用與本實施形態同樣的基板驅動系統60。即,作為基板平台裝置,亦可為如美國專利申請公開第2010/0018950號說明書所揭示的在X粗動平台上配置Y粗動平台的類型的粗動平台(此
時,微動平台24是自Y粗動平台藉由各致動器單元而被賦予推力)。又,作為基板平台裝置,亦可未必包含自重支撐裝置28。又,基板平台裝置亦可為使基板P僅在掃描方向上長衝程驅動的裝置。
In addition, the structure of the
又,控制系統80是說明針對4個致動器單元70X1、致動器單元70X2、致動器單元70Y1、致動器單元70Y2(參照圖2)分別單獨地配置的情況,但亦可設為針對一對X致動器單元70X1、X致動器單元70X2配置1個控制系統80,針對一對Y致動器單元70Y1、Y致動器單元70Y2配置1個控制系統80。即,亦可設為在每個驅動方向上配置控制系統80的構成。又,亦可設為針對4個全部的致動器單元70X1、致動器單元70X2、致動器單元70Y1、致動器單元70Y2配置1個控制系統80。
Also, the
又,照明光亦可為ArF準分子雷射光(波長193nm)、KrF準分子雷射光(波長248nm)等紫外光、F2雷射光(波長157nm)等真空紫外光。又,作為照明光,亦可使用藉由摻雜有鉺(或鉺及鐿兩者)的光纖放大器(fiber amplifier),將自分佈回饋(distributed feedback,DFB)半導體雷射或光纖雷射(fiber laser)振盪的紅外區域、或可見區域的單一波長雷射光加以放大,且使用非線性光學結晶而波長轉換成紫外光的高諧波。又,亦可使用固體雷射(波長:355nm,266nm)等。 In addition, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm), vacuum ultraviolet light such as F2 laser light (wavelength 157nm). In addition, as the illumination light, it is also possible to use a fiber amplifier (fiber amplifier) doped with erbium (or both erbium and ytterbium), which is self-distributed feedback (distributed feedback, DFB) semiconductor laser or fiber laser (fiber laser). Laser) oscillating infrared region, or single-wavelength laser light in the visible region is amplified, and the wavelength is converted into high harmonics of ultraviolet light using nonlinear optical crystals. Moreover, solid-state laser (wavelength: 355 nm, 266 nm) etc. can also be used.
又,已說明投影光學系統16是具備多條光學系統的多透鏡方式的投影光學系統的情況,但投影光學系統的條數並不限於此,只要有1條或1條以上即可。又,並不限於多透鏡方式的 投影光學系統,亦可為使用奧夫納(Offner)型的大型鏡的投影光學系統等。又,作為投影光學系統16,亦可為放大系統或縮小系統。 Also, the case where the projection optical system 16 is a multi-lens type projection optical system including a plurality of optical systems has been described, but the number of projection optical systems is not limited to this, and may be one or more. Also, not limited to the multi-lens method The projection optical system may be a projection optical system using an Offner-type large mirror, or the like. In addition, as the projection optical system 16, an enlargement system or a reduction system may be used.
又,作為曝光裝置的用途,並不限定於將液晶顯示零件圖案轉印至方形的玻璃板的液晶用的曝光裝置,亦可廣泛應用於有機電致發光(Electro-Luminescence,EL)面板製造用的曝光裝置,半導體製造用的曝光裝置,用以製造薄膜磁頭、微機械(micro machine)及去氧核糖核酸(deoxyribonucleic acid,DNA)晶片等的曝光裝置。又,不僅可應用於為了製造半導體零件等微型元件的曝光裝置,而且亦可應用於為了製造光曝光裝置、極紫外線(extreme ultraviolet,EUV)曝光裝置、X線曝光裝置及電子束曝光裝置等中所使用的遮罩或網線,將電路圖案轉印至玻璃基板或矽晶圓等的曝光裝置。 In addition, the use of the exposure device is not limited to the exposure device for liquid crystals for transferring the pattern of liquid crystal display components to a square glass plate, but can also be widely used in the manufacture of organic electro-luminescence (EL) panels. Exposure devices for semiconductor manufacturing, exposure devices for manufacturing thin-film magnetic heads, micro machines (micro machines) and deoxyribonucleic acid (DNA) wafers. In addition, it can be applied not only to exposure devices for manufacturing micro-elements such as semiconductor parts, but also to light exposure devices, extreme ultraviolet (extreme ultraviolet, EUV) exposure devices, X-ray exposure devices, and electron beam exposure devices. Masks or reticles are used to transfer circuit patterns to exposure devices such as glass substrates or silicon wafers.
又,成為曝光對象的物體並不限於玻璃板,亦可為晶圓、陶瓷基板、薄膜構件或遮罩坯料(mask blanks)等其他物體。又,當曝光對象物為平板顯示器用的基板時,所述基板的厚度並無特別限定,亦包含薄膜狀(具有可撓性的片材(sheet)狀的構件)的物體。再者,本實施形態的曝光裝置在一邊的長度或對角長度為大於或等於500mm的基板為曝光對象物的情況下特別有效。 In addition, the objects to be exposed are not limited to glass plates, and may be other objects such as wafers, ceramic substrates, film members, or mask blanks. Moreover, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and a film-like (sheet-like member having flexibility) is also included. In addition, the exposure apparatus of this embodiment is especially effective when the board|substrate whose one side length or diagonal length is 500 mm or more is an exposure object.
液晶顯示零件(或者半導體零件)等電子元件是經由如下步驟而製造:進行元件的功能及性能設計;製作基於所述設計 步驟的遮罩(或者網線);製作玻璃基板(或者晶圓);微影步驟,利用所述各實施形態的曝光裝置及所述曝光方法,將遮罩(網線)的圖案轉印至玻璃基板;顯影步驟,使經曝光的玻璃基板顯影;蝕刻步驟,藉由蝕刻而去除殘留有抗蝕劑的部分以外的部分的露出構件;抗蝕劑去除步驟,去除蝕刻完畢而不需要的抗蝕劑;元件組裝步驟;檢查步驟等。此時,在微影步驟中,利用所述實施形態的曝光裝置來執行所述曝光方法,在玻璃基板上形成元件圖案,因此能夠以高生產率製造高積體度的元件。 Electronic components such as liquid crystal display parts (or semiconductor parts) are manufactured through the following steps: designing the functions and performance of the components; The mask (or network cable) of step; Make glass substrate (or wafer); Photolithography step, utilize the exposure device of each embodiment described and described exposure method, transfer the pattern of mask (network cable) to A glass substrate; a developing step of developing the exposed glass substrate; an etching step of removing exposed members other than the portion where the resist remains; a resist removing step of removing unnecessary resist after etching etchant; component assembly steps; inspection steps, etc. In this case, in the lithography step, the exposure method is performed using the exposure apparatus of the above-mentioned embodiment to form a device pattern on the glass substrate, so that a high-density device can be manufactured with high productivity.
如以上說明,本發明的移動體裝置及移動體的驅動方法適用於對移動體進行驅動。又,本發明的曝光裝置適用於在物體上形成圖案。又,本發明的元件製造方法適用於微型元件的生產。又,本發明的平板顯示器的製造方法適用於平板顯示器的製造。 As described above, the moving body device and the driving method of the moving body according to the present invention are suitable for driving the moving body. Also, the exposure apparatus of the present invention is suitable for forming a pattern on an object. Also, the component manufacturing method of the present invention is suitable for the production of micro components. Moreover, the manufacturing method of the flat-panel display of this invention is suitable for manufacture of a flat-panel display.
20:基板平台裝置 20: Substrate platform device
24:微動平台 24:Micro-motion platform
26:粗動平台 26: Coarse movement platform
34:X粗動平台 34: X coarse motion platform
62:第1驅動系統 62: 1st drive system
70X1、70X2:X致動器單元 70X 1 , 70X 2 : X actuator unit
70Y1、70Y2:Y致動器單元 70Y 1 , 70Y 2 : Y actuator unit
72X:X音圈馬達 72X:X voice coil motor
74X:X空氣致動器 74X:X Air Actuator
76a:定子 76a: Stator
76b:動子 76b: Movers
78:支柱 78: Pillar
G:重心位置 G: center of gravity position
X、Y、Z:方向 X, Y, Z: direction
Claims (23)
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