TWI796218B - Carrier plate applied for load port - Google Patents

Abstract

A carrier plate applied for a load port is provided, which includes a main body is arranged on the load port, a first guide slot is arranged on the lower side of the main body, and the first guide slot is provided with a first switch to drive a first nozzle to move up and down to change the position, a second guide slot is arranged on the lower side of the main body opposite to the first guide slot, and the second guide slot is provided with a second switch to drive a second nozzle to move up and down to change the position, a third guide slot is arranged on the top side of the main body, and the third guide slot is provided with a third switch to drive a third nozzle to move obliquely to change the position, and a fourth guide slot is arranged on the top side of the main body opposite to the third guide slot, and the fourth guide slot is provided with a fourth nozzle to move obliquely to change the position, thereby, the first nozzle, the second nozzle, the third nozzle and the fourth nozzle move to the positions corresponding to the holes on the bottom of the wafer transfer cassette to inflate or exhaust for the wafer transfer cassette.

Description

Carrying plate applied to wafer box carrying device

The present invention relates to a carrier tray used in a wafer cassette carrier device, in particular to a carrier tray capable of switching the positions of gas nozzles according to different types of FOUPs.

In recent years, the high integration of wafers or the miniaturization of circuits has progressed rapidly, and the environmental requirements have also increased. Exposure to the air atmosphere will easily attach moisture or oxygen to the surface of the wafer, which may cause corrosion or oxidation. Therefore, it is necessary to maintain the microenvironment around the wafer at a high degree of cleanliness to avoid the occurrence of particles or moisture adhering to the surface of the wafer. The current effective method is to make the surrounding of the wafer into a nitrogen environment of inert gas, or into a vacuum state or dry air , so as to avoid changes in surface properties such as wafer surface oxidation.

In order to properly maintain such a micro-environment around the wafer, the wafer is put into the inside of a closed FOUP and managed, and the inside is filled with nitrogen or dry air.

In recent years, there is no unified standard specification among various manufacturers and different types of FOUPs, and the positions of the air inlet and outlet holes are different. Various types of FOUPs need to be equipped with different specifications of carrier trays, resulting in inconvenience and cost. Increase.

Therefore, how to design a carrier plate with high compatibility and fast switchability, which can effectively improve work efficiency and save equipment cost has become an important issue.

In order to solve the defects of the prior art, the main purpose of the present invention is to provide a carrier plate applied to the wafer cassette carrier device, only one carrier plate is needed, and the position of the gas nozzle on the carrier plate can be adjusted to correspond to various types of wafers The transfer box reduces the cost of designing different carrier trays to match various types of wafer transfer boxes, and increases the convenience of the fab in use. Thereby, the problem of space for storing multiple carrier disks is also solved.

Another object of the present invention is that the air nozzles on the susceptor can distribute corresponding moving and switching positions according to the positions of the air holes at the bottom of the FOUP, so that the gas can inflate the FOUP through the switched positions of the air nozzles Or exhaust.

According to the above purpose, the present invention discloses a carrier tray applied to a wafer cassette carrier device, comprising: a body, arranged on the wafer cassette carrier device; a first guide groove, arranged on the lower side of the body, in the first guide groove There is a first switching piece and a first air nozzle, and the first switching piece drives the first air nozzle to move up and down to switch positions; the second guide groove is arranged on the lower side of the body relative to the first guide groove, and the second guide groove is provided with There is a second switching piece and a second air nozzle, and the second switching piece drives the second air nozzle to move up and down to switch positions; the third guide groove is arranged on the upper side of the body relative to the first guide groove, and the third guide groove is provided with a second Three switching parts and the third gas nozzle, the third switching part drives the third gas nozzle to move obliquely to the switching position; and the fourth guide groove is arranged on the upper side of the body relative to the third guide groove, and the fourth guide groove is provided with the first Four switching parts and the fourth gas nozzle, the fourth switching part drives the fourth gas nozzle to move obliquely to the switching position, wherein, according to the positions of the multiple air holes at the bottom of the FOUP, the first gas nozzle, the second gas nozzle, the fourth gas nozzle The third air nozzle and the fourth air nozzle are moved to positions corresponding to a plurality of air holes to inflate or exhaust the FOUP.

In a preferred embodiment of the present invention, the carrying plate applied to the wafer cassette carrying device further includes a fifth air nozzle and a sixth air nozzle, which are respectively arranged on the upper side of the body, between the fifth air nozzle and the sixth air nozzle The distance is less than the distance between the third air nozzle and the fourth air nozzle.

In a preferred embodiment of the present invention, when the first air nozzle is switched to the upper side of the first guide groove, and the second air nozzle is switched to the upper side of the second guide groove, the third air nozzle is located at the outermost side of the third guide groove position, and the fourth air nozzle is located at the outermost position of the fourth guide groove, wherein there is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and the third There is a second distance between the center of the third gas nozzle hole of the gas nozzle and the center of the fourth gas nozzle hole of the fourth gas nozzle, and the second distance is greater than the first distance.

In a preferred embodiment of the present invention, when the first air nozzle is switched to the upper side of the first guide groove, and the second air nozzle is switched to the upper side of the second guide groove, the third air nozzle is located at the uppermost side of the third guide groove position, and the fourth air nozzle is located at the uppermost position of the fourth guide groove, wherein there is a third distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle, and the third distance less than the second distance and greater than the first distance.

In a preferred embodiment of the present invention, when the first air nozzle is switched to the lower side of the first guide groove, and the second air nozzle is switched to the lower side of the second guide groove, the third air nozzle is located in the third guide groove The innermost position, and the fourth air nozzle is located at the innermost position of the fourth guide groove, wherein there is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle , there is a fourth distance between the center of the third nozzle hole of the third nozzle and the center of the fourth nozzle hole of the fourth nozzle, and the fourth distance is smaller than the third distance and equal to the first distance.

In a preferred embodiment of the present invention, when the first air nozzle is switched to the position on the lower side of the first guide groove, and the second air nozzle is switched to the position on the lower side of the second guide groove, the first air nozzle of the first air nozzle There is a first distance between the center of the hole and the center of the second nozzle hole of the second nozzle, and between the center of the fifth nozzle hole of the fifth nozzle and the center of the sixth nozzle hole of the sixth nozzle. There is a fifth distance, which is equal to the first distance.

Please refer to Figure 1. FIG. 1 is a schematic diagram showing a first embodiment of a carrier tray applied to a wafer cassette carrier device. In FIG. 1 , a susceptor 1 a has a body 10 a and is disposed on a wafer carrier (not shown in the figure). In addition, in FIG. 1, the upper side and the lower side of the main body 10a are shown by the Y direction of the Cartesian coordinate system, and the left side and the right side of the main body 10a are shown by the X direction. The main body 10a of the carrier plate 1a has a first guide slot 12, a second guide slot 14, a third guide slot 16, and a fourth guide slot 18, and their structures and positions are described in detail below.

The first guide groove 12 is arranged on the lower side of the main body 10a, and the first switch member 122 and the first air nozzle 124 are arranged in the first guide groove 12, and the first switch member 122 drives the first air nozzle 124 in the first guide groove. Move up and down within 12. The second guide groove 14 is arranged on the lower side of the main body 10 relative to the first guide groove 12, and the second guide groove 14 is provided with a second switching member 142 and a second air nozzle 144, and the second switching member 142 drives the second air nozzle. 144 moves the switching position up and down in the second guide groove 14 . It should be noted that, the first guide groove 12 and the second guide groove 14 are respectively disposed opposite to each other on the left and right sides of the lower side of the main body 10a. Wherein, the included angle between the direction in which the first air nozzle 124 moves up and down and the X direction is 90 degrees, and the included angle between the direction in which the second air nozzle 144 moves up and down and the X direction is 90 degrees. The third guide groove 16 is arranged on the upper side of the body 10 relative to the first guide groove 12, and the third guide groove 16 is provided with a third switching member 162 and a third air nozzle 164, and the third switching member 162 drives the third air nozzle 164 Diagonal movement to switch positions. The fourth guide groove 18 is arranged on the upper side of the main body 10 relative to the third guide groove 16, and the fourth guide groove 18 is provided with a fourth switching member 182 and a fourth air nozzle 184, and the fourth switching member 182 drives the fourth air nozzle 184 Move diagonally to toggle the position. Wherein, the angle between the obliquely moving direction of the third air nozzle 164 and the X direction is between 10° and 35°, and the angle between the obliquely moving direction of the fourth air nozzle 184 and the X direction is also between 10° and X direction. 35 degrees. It should be further explained here that the third guiding groove 16 and the fourth guiding groove 18 are respectively disposed above the first guiding groove 12 and the second guiding groove 14 . In addition, at least three positioning points 20a, 20b, 20c are respectively defined on the outside of the third guiding groove 16 and the fourth guiding groove 18, and each positioning point 20a, 20b, 20c corresponds to a different type of FOUP ( not shown in the figure), therefore, the third switching member 162 can drive the third air nozzle 164 to switch to one of the positioning points 20a, 20b or 20c in the third guide groove 16; the fourth switching member 182 can drive the fourth air nozzle 184 to switch to one of the positioning points 20a, 20b or 20c in the fourth guide groove 18 . According to the above, according to the positions (not shown) of the air holes (not shown in the figure) of the bottom (not shown in the figure) of the FOUP (not shown in the figure), the first switching member 122 drives the first air nozzle 124, the second The second switching part 142 drives the second gas nozzle 144, the third switching part 162 drives the third gas nozzle 164, and the fourth switching part 182 drives the fourth gas nozzle 184 to move the switching position, so that the switched position can correspond to different types of crystals. Multiple air hole positions (not shown in the figure) of the FOUP (not shown in the figure) are used to inflate or exhaust the FOUP (not shown in the figure). That is to say, the position distribution of air holes at the bottom of different types of FOUPs will also be different. The susceptor according to the embodiment of the present invention can correspond to at least three FOUPs with different air hole distributions by switching the positions of the air nozzles. An example will be described below.

In FIG. 1, when the carrier tray 1a carries the first FOUP (not shown in the figure), at this time, in order to correspond to the position distribution of the air holes at the bottom of the first FOUP, the first FOUP of the carrier tray 1a The air nozzle 124 is switched to the upper side of the first guide groove 12, the second air nozzle 144 is switched to the upper side of the second guide groove 14, and the third air nozzle 164 is located at the outermost position of the third guide groove 16 (locating point 20a) , the fourth air nozzle 184 is located at the outermost position (locating point 20a) of the fourth guide groove 18, wherein the center of the first air nozzle hole 1242 of the first air nozzle 124 is aligned with the second air nozzle hole 1442 of the second air nozzle 14 There is a first distance L1 between the centers of the third valve hole 1642 of the third valve 164 and the center of the center of the fourth valve hole 1842 of the fourth valve 184 has a second distance L2, and the second The distance L2 is greater than the first distance L1.

Please refer to FIG. 2 . FIG. 2 is a schematic diagram showing a second embodiment of a carrier tray applied to a wafer cassette carrier device. The structures and positions of the first guide groove 12, the second guide groove 14, the third guide groove 16, and the fourth guide groove 18 of the main body 10a of the carrier plate 1a shown in FIG. As shown in FIG. 2, when the carrier tray 1a carries the second FOUP (not shown in the figure), at this time, the carrier tray 1a corresponds to the position of the air hole at the bottom of the second FOUP (not shown in the figure). Distribution, when the first air nozzle 124 of the carrier tray 1a is switched to the upper side position of the first guide groove 12, and the second air nozzle 144 is switched to the upper side position of the second guide groove 14, the third air nozzle 164 is located in the third guide groove 16 at the uppermost position (positioning point 20b), and the fourth air nozzle 184 is located at the uppermost position (positioning point 20b) of the fourth guide groove 18, wherein the center of the third air nozzle hole 1642 of the third air nozzle 164 is in line with the first There is a third distance L3 between centers of the fourth air nozzle holes 1842 of the four air nozzles 184, and the third distance L3 is smaller than the second distance L2 (as shown in FIG. 1 ) and larger than the first distance L1.

Please refer to FIG. 3 . FIG. 3 is a schematic diagram showing a third embodiment of a carrier tray applied to a wafer cassette carrier device. Similarly, the structures and positions of the first guide groove 12, the second guide groove 14, the third guide groove 16, and the fourth guide groove 18 of the body 10a of the carrying tray 1a shown in FIG. Make more statements. As shown in FIG. 3, when the carrier tray 1a carries the third FOUP (not shown in the figure), at this time, the carrier tray 1a corresponds to the position of the air hole at the bottom of the third FOUP (not shown in the figure). Distribution, when the first air nozzle 124 of the carrier tray 1 is switched to the lower side of the first guide groove 12, and the second air nozzle 144 is switched to the lower side of the second guide groove 14, the third air nozzle 164 is located in the third The innermost position (positioning point 20c) of the guide groove 16, and the fourth air nozzle 184 is located at the innermost position (positioning point 20c) of the fourth guide groove 18, wherein the center of the third air nozzle hole 1642 of the third air nozzle 164 There is a fourth distance L4 between the center of the fourth nozzle hole 1842 of the fourth nozzle 184, and the fourth distance L4 is smaller than the third distance L3 (as shown in FIG. 2 ) and equal to the first distance L1.

Please refer to FIG. 4 . FIG. 4 is a schematic view showing a fourth embodiment of a carrier tray applied to a wafer cassette carrier device. In FIG. 4 , the susceptor 1 b has a body 10 b and is disposed on a wafer support device (not shown in the figure). In addition, in FIG. 4, the upper side and the lower side of the main body 10b are shown by the Y direction of the Cartesian coordinate system, and the left side and the right side of the main body 10b are shown by the X direction. The main body 10b of the carrier plate 1b has a first guide groove 12, a second guide groove 14, a third guide groove 30, and a fourth guide groove 32, and their structures and positional relationships are described in detail below.

The first guide groove 12 is arranged on the lower side of the main body 10b, and the first switch member 122 and the first air nozzle 124 are arranged in the first guide groove 12, and the first switch member 122 drives the first air nozzle 124 in the first guide groove. Move up and down within 12. The second guide groove 14 is arranged on the lower side of the main body 10b relative to the first guide groove 12. The second guide groove 14 is provided with a second switching member 142 and a second air nozzle 144, and the second switching member 142 drives the second air nozzle. 144 moves the switching position up and down in the second guide groove 14 . It should be noted that, the first guide groove 12 and the second guide groove 14 are respectively disposed opposite to each other on the left and right sides of the lower side of the main body 10b. The third guide groove 30 is arranged on the upper side of the main body 10b relative to the first guide groove 12, and the third guide groove 30 is provided with a third switching member 302 and a third air nozzle 304, and the third switching member 302 drives the third air nozzle 304 Move diagonally to toggle the position. The fourth guide groove 32 is arranged on the upper side of the main body 10b relative to the third guide groove 30, and the fourth guide groove 32 is provided with a fourth switching member 322 and a fourth air nozzle 324, and the fourth switching member 322 drives the fourth air nozzle 324 Move diagonally to toggle the position. In addition, at least two positioning points 22a, 22b are defined outside the third guiding groove 30 and the fourth guiding groove 32, and each positioning point 22a, 22b corresponds to a different type of FOUP (not shown in the figure). ) at the bottom of the air hole position, therefore, the third switching member 302 can drive the third air nozzle 304 to switch to one of the positioning points 22a or 22b in the third guide groove 30; the fourth switching member 322 can drive the fourth air nozzle 324 switches to one of the positioning points 22a or 22b in the fourth guide groove 32 . In this embodiment, the fifth air nozzle 40 and the sixth air nozzle 42 are respectively arranged on the upper side of the main body 10b, and the distance L5 between the fifth air nozzle 40 and the sixth air nozzle 42 is smaller than the distance L5 between the third air nozzle 304 and the sixth air nozzle 42. The second distance L6 between the fourth air nozzles 324 is equal to the first distance L1.

In FIG. 4, when the carrier tray 1b carries the first FOUP (not shown in the figure), at this time, in order to correspond to the air hole position distribution at the bottom of the first FOUP, the carrier tray 1b The first air nozzle 124 switches to the upper side position of the first guide groove 12, the second air nozzle 144 switches to the upper side position of the second guide groove 14, the third air nozzle 304 of the third guide groove 30 and the fourth guide groove 32 When the fourth air nozzle 324 is at the position of the anchor point 22a, the third air nozzle 304 is located at the outermost position of the third guide groove 30 (the anchor point 22a), and the fourth air nozzle 32 is located at the outermost position of the fourth guide groove 30 (the anchor point 22a), wherein there is a first distance L1 between the center of the first gas nozzle hole 1242 of the first gas nozzle 124 and the center of the second gas nozzle hole 1442 of the second gas nozzle 14, the fifth gas nozzle 40 and the sixth gas nozzle There is a fifth distance L5 between the nozzles 42, and the first distance L1 is equal to the fifth distance L5; between the center of the third nozzle hole 3042 of the third nozzle 304 and the center of the fourth nozzle hole 3242 of the fourth nozzle 324 There is a second distance L2 between them, and the second distance L2 is greater than the first distance L1 and greater than the fifth distance L5.

According to the above, according to the positions (not shown) of the air holes (not shown in the figure) of the bottom (not shown in the figure) of the first FOUP (not shown in the figure), the first switching member 122 drives the first air nozzle 124 , the second switching member 142 drives the second air nozzle 144, the third switching member 302 drives the third air nozzle 304 located at the outermost position of the third guide groove 30 (locating point 22a), and the fourth switching member 322 drives the fourth air nozzle 324 The mobile switch is located at the outermost position (locating point 22a) of the fourth guide groove 18, so that the switched position can correspond to a plurality of air hole positions (not shown in the figure) of the FOUP (not shown in the figure) and to The first FOUP (not shown) is inflated or deflated.

Please refer to Figure 5 next. FIG. 5 is a schematic diagram showing a fifth embodiment of a carrier tray applied to a wafer cassette carrier device. The structures and positions of the first guide groove 12, the second guide groove 14, the third guide groove 30, and the fourth guide groove 32 of the main body 10b of the carrier plate 1b shown in FIG. 5 are the same as those in FIG. In FIG. 5, when the carrier tray 1b carries the second FOUP (not shown in the figure), at this time, in order to correspond to the air hole position distribution at the bottom of the second FOUP, the carrier tray 1b The first air nozzle 124 is switched to the upper side of the first guide groove 12, the second air nozzle 144 is switched to the upper side of the second guide groove 14, and the third air nozzle 304 is located at the uppermost position of the third guide groove 30 (locating point 22b) , the fourth air nozzle 32 is located at the uppermost position of the fourth guide groove 30 (locating point 22b), wherein the center of the first air nozzle hole 1242 of the first air nozzle 124 and the center of the second air nozzle hole 1442 of the second air nozzle 144 There is a first distance L1 between the centers, there is a fifth distance L5 between the center of the fifth nozzle hole 402 of the fifth nozzle 40 and the center of the sixth nozzle hole 422 of the sixth nozzle 42, and the first distance L1 Equal to the fifth distance L5; there is a third distance L3 between the center of the third nozzle hole 3042 of the third nozzle 304 and the center of the fourth nozzle hole 3242 of the fourth nozzle 324, wherein the third distance L3 is less than the first The second distance L2 is greater than the first distance L1 and greater than the fifth distance L5.

Please refer to Figure 6 next. FIG. 6 is a schematic diagram showing a sixth embodiment of a carrier tray applied to a wafer cassette carrier device. Similarly, the structures and positions of the first guide groove 12, the second guide groove 14, the third guide groove 16, and the fourth guide groove 18 of the body 10b of the carrying tray 1b shown in FIG. Make more statements. In FIG. 6, when the carrier tray 1b carries the third FOUP (not shown in the figure), at this time, in order to correspond to the air hole position distribution at the bottom of the third FOUP, the carrier tray 1b The first air nozzle 124 is switched to the position on the lower side of the first guide groove 12, the second air nozzle 144 is switched to the position on the lower side of the second guide groove 14, and the third air nozzle 304 can be located at any position in the third guide groove 30, for example The outermost position (locating point 22a), the fourth air nozzle 32 can be located at any position in the fourth guide groove 30, such as the outermost position (locating point 22a), wherein the first air nozzle hole 1242 of the first air nozzle 124 There is a first distance L1 between the center and the center of the second nozzle hole 1442 of the second nozzle 14, the center of the fifth nozzle hole 402 of the fifth nozzle 40 and the sixth nozzle hole of the sixth nozzle 42 There is a fifth distance L5 between the centers of 422, and the first distance L1 is equal to the fifth distance L5; the center of the third valve hole 3042 of the third valve 304 and the center of the fourth valve hole 3242 of the fourth valve 324 There is a second distance L2 between them, and the second distance L2 is greater than the first distance L1 and greater than the fifth distance L5.

In the foregoing embodiments, the first air nozzle 124 and the second air nozzle 144 are generally used to inflate the FOUP (not shown in the figure), the third air nozzle 164, the fourth air nozzle The nozzle 184 , the fifth nozzle 40 and the sixth nozzle hole 422 are generally nozzles used for exhausting the FOUP (not shown in the figure). But, in another embodiment, it may be that the third gas nozzle 164 is used to inflate the FOUP (not shown in the figure), and the fourth gas nozzle 184 is used to transfer the wafers. Air nozzle used for exhausting the cartridge (not shown in the figure). In the present invention, the inflation or exhaust function of each air nozzle is not limited, as long as the positions of the air nozzles can correspond to various types of FOUPs.

According to the above, the user only needs to connect the first air nozzle 124, the second air nozzle 144, the third air nozzle 164, and the fourth air nozzle 184 of the tray 1a, the first air nozzle 124, and the second air nozzle of the tray 1b. 144. The third air nozzle 304 and the fourth air nozzle 324 can be adjusted according to the position of multiple air holes (not shown in the figure) at the bottom (not shown in the figure) of the FOUP (not shown in the figure) Use, increase the convenience of use and reduce the air hole position (not shown in the figure) of the bottom (not shown in the figure) of different wafer transfer boxes (not shown in the figure) need to use different carrier trays cost and space utilization.

1a, 1b: carrying plate 10a, 10b: Ontology 12: The first guide groove 122: The first switch 124: The first valve 1242: The first valve hole 14: Second guide groove 142: The second switch 144:Second valve 1442: The second valve hole 16, 30: The third guide groove 162, 302: the third switch 164, 304: the third valve 1642, 3042: the third valve hole 18, 32: The fourth guide groove 182, 322: the fourth switch 184, 324: The fourth valve 1842, 3242: the fourth valve hole 20a, 20b, 20c, 22a, 22b: anchor points L1: first distance L2: second distance L3: third distance L4: fourth distance L5: fifth distance

FIG. 1 is a schematic diagram showing a first embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention. FIG. 2 is a schematic diagram showing a second embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention. FIG. 3 is a schematic diagram showing a third embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention. FIG. 4 is a schematic diagram showing a fourth embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention. FIG. 5 is a schematic diagram showing a fifth embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention. FIG. 6 is a schematic diagram showing a sixth embodiment of a carrier tray applied to a wafer cassette carrier device according to the technology disclosed in the present invention.

1a: carrier plate

10a: Ontology

12: The first guide groove

122: The first switch

124: The first valve

1242: The first valve hole

14: Second guide groove

142: The second switch

144:Second valve

1442: The second valve hole

16: The third guide groove

162: The third switch

164: The third valve

1642: The third valve hole

18: The fourth guide groove

18: The fourth switching piece

184: The fourth valve

1842: Fourth valve hole

20a, 20b, 20c, 22a, 22b: anchor points

L1: first distance

L2: second distance

Claims (6)

A carrier plate applied to a wafer box carrier device, comprising: a body, set on a wafer cassette carrying device; A first guide groove is arranged on the lower side of the body, and a first switching member and a first gas nozzle are arranged in the first guide groove, and the first switching member drives the first gas nozzle to move up and down to switch positions; A second guide groove is arranged on the lower side of the body relative to the first guide groove, and a second switch piece and a second air nozzle are arranged in the second guide groove, and the second switch piece drives the second air nozzle Move the mouth up and down to switch positions; A third guide slot is arranged on the upper side of the body relative to the first guide slot, and a third switching member and a third air nozzle are arranged in the third guide slot, and the third switching member drives the third air nozzle Move the toggle position diagonally; and A fourth guide groove is arranged on the upper side of the body relative to the third guide groove, and a fourth switching member and a fourth air nozzle are arranged in the fourth guide groove, and the fourth switching member drives the fourth air nozzle Move diagonally to switch positions; Wherein, according to the position of a plurality of air holes at the bottom of a FOUP, the first air nozzle, the second air nozzle, the third air nozzle and the fourth air nozzle move to the positions corresponding to the air holes to The FOUP is inflated or deflated. The carrier plate applied to the wafer carrier device as described in claim 1 further includes a fifth air nozzle and a sixth air nozzle, which are respectively arranged on the upper side of the body, the fifth air nozzle and the sixth air nozzle The distance between them is smaller than the distance between the third air nozzle and the fourth air nozzle. The carrier plate applied to the wafer carrier device as described in claim 1 or 2, wherein when the first air nozzle is switched to the upper side of the first guide groove, and the second air nozzle is switched to the upper side of the second guide groove position, the third air nozzle is located at the outermost position of the third guide groove, and the fourth air nozzle is located at the outermost position of the fourth guide groove, wherein the center of a first air nozzle hole of the first air nozzle and There is a first distance between the center of a second gas nozzle hole of the second gas nozzle, the center of a third gas nozzle hole of the third gas nozzle and the center of a fourth gas nozzle hole of the fourth gas nozzle There is a second distance between them, and the second distance is greater than the first distance. The carrier plate applied to the wafer carrier device as described in claim 1 or 2, wherein when the first air nozzle is switched to the upper side of the first guide groove, and the second air nozzle is switched to the upper side of the second guide groove position, the third air nozzle is located at the uppermost position of the third guide groove, and the fourth air nozzle is located at the uppermost position of the fourth guide groove, wherein the center of a third air nozzle hole of the third air nozzle and There is a third distance between centers of a fourth air nozzle hole of the fourth air nozzle, and the third distance is greater than the first distance. The carrier tray applied to the wafer carrier device as described in claim 1, wherein when the first air nozzle is switched to the lower side of the first guide groove, and the second air nozzle is switched to the lower side of the second guide groove position, the third air nozzle is located at the innermost position of the third guide groove, and the fourth air nozzle is located at the innermost position of the fourth guide groove, wherein the center of a first air nozzle hole of the first air nozzle and There is a first distance between the center of a second gas nozzle hole of the second gas nozzle, the center of a third gas nozzle hole of the third gas nozzle and the center of a fourth gas nozzle hole of the fourth gas nozzle There is a fourth distance between them, and the fourth distance is equal to the first distance. The carrier tray applied to the wafer carrier device as described in claim 2, wherein when the first air nozzle is switched to the lower side of the first guide groove, and the second air nozzle is switched to the lower side of the second guide groove Position, there is a first distance between the center of a first nozzle hole of the first nozzle and the center of a second nozzle hole of the second nozzle, a fifth nozzle hole of the fifth nozzle There is a fifth distance between the center of the sixth air nozzle and the center of a sixth air nozzle hole, and the fifth distance is equal to the first distance.

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