TWI795971B - Detection device and detection method - Google Patents
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- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/03—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays
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Abstract
Description
本案係與偵測裝置及偵測方法有關,且特別是有關於一種應用於顯示器電路之斷路偵測裝置及斷路偵測方法。This case is related to a detection device and a detection method, and in particular to a disconnection detection device and a disconnection detection method applied to a display circuit.
軟性顯示器具有可撓性、可彎曲、重量輕、厚度薄等特性,當顯示器或手機採用超窄邊框設計、屏占比越高代表顯示器或手機螢幕將會有更大的視野與高沉浸感。然而,軟性電路可能在做撓曲(例如往後彎折)製程的過程中導致內部電路受損(crack),造成面板畫面異常,但crack可能在製程中出現,也可能於客戶端出現,無法預先透過可靠性測試檢測出來。Flexible displays have the characteristics of flexibility, bendability, light weight, and thin thickness. When a display or mobile phone adopts an ultra-narrow bezel design, a higher screen-to-body ratio means that the display or mobile phone screen will have a larger field of view and a high sense of immersion. However, the flexible circuit may cause internal circuit damage (crack) during the process of flexing (such as bending backwards), resulting in abnormal panel images. However, cracks may appear during the process or on the client side. Detected in advance through reliability testing.
發明內容旨在提供本揭示內容的簡化摘要,以使閱讀者對本揭示內容具備基本的理解。此發明內容並非本揭示內容的完整概述,且其用意並非在指出本案實施例的重要/關鍵元件或界定本案的範圍。This Summary is intended to provide a simplified summary of the disclosure in order to provide the reader with a basic understanding of the disclosure. This summary is not an extensive overview of the disclosure and it is not intended to identify key/critical elements of the embodiments or to delineate the scope of the disclosure.
本案內容之一技術態樣係關於一種偵測裝置。此偵測裝置包含處理電路及驅動電路。處理電路包含偵測器及計算器。偵測器用以提供偵測信號,且偵測器用以接收反饋信號。計算器用以根據反饋信號計算斷路的位置。驅動電路耦接於處理電路,且驅動電路包含至少一切換電路。至少一切換電路用以根據斷路的位置以切換資料信號之電路路徑。One of the technical aspects of this case relates to a detection device. The detection device includes a processing circuit and a driving circuit. The processing circuit includes a detector and a calculator. The detector is used for providing a detection signal, and the detector is used for receiving a feedback signal. The calculator is used to calculate the position of the open circuit according to the feedback signal. The driving circuit is coupled to the processing circuit, and the driving circuit includes at least one switching circuit. At least one switching circuit is used for switching the circuit path of the data signal according to the position of the disconnection.
本案內容之一技術態樣係關於一種偵測方法。此偵測方法包含:藉由偵測器以提供偵測信號,且偵測信號通過驅動電路;藉由偵測器以接收驅動電路的反饋信號;藉由計算器以根據反饋信號計算斷路的位置;以及藉由驅動電路的至少一切換電路以根據斷路的位置以切換資料信號之電路路徑。One of the technical aspects of this case relates to a detection method. This detection method includes: using a detector to provide a detection signal, and the detection signal passes through the driving circuit; using the detector to receive a feedback signal from the driving circuit; using a calculator to calculate the position of the open circuit according to the feedback signal ; and at least one switching circuit of the driving circuit is used to switch the circuit path of the data signal according to the position of the disconnection.
因此,根據本案之技術內容,本案實施例所示之偵測裝置及偵測方法得以透過提供偵測信號與接收反饋信號以計算斷路的位置,適用於顯示器電路之斷路偵測裝置。此外,本案之偵測裝置及偵測方法得以根據斷路的位置以切換資料信號之電路路徑,因此,可以改善顯示器因斷路所產生畫面異常的問題。Therefore, according to the technical content of this case, the detection device and detection method shown in the embodiment of this case can calculate the position of the disconnection by providing the detection signal and receiving the feedback signal, which is suitable for the disconnection detection device of the display circuit. In addition, the detection device and detection method of the present application can switch the circuit path of the data signal according to the position of the disconnection, so the problem of abnormal picture of the display caused by the disconnection can be improved.
為了使本揭示內容的敘述更加詳盡與完備,下文針對了本案的實施態樣與具體實施例提出了說明性的描述;但這並非實施或運用本案具體實施例的唯一形式。實施方式中涵蓋了多個具體實施例的特徵以及用以建構與操作這些具體實施例的方法步驟與其順序。然而,亦可利用其他具體實施例來達成相同或均等的功能與步驟順序。In order to make the description of the disclosure more detailed and complete, the following provides an illustrative description of the implementation and specific embodiments of the present case; but this is not the only form of implementing or using the specific embodiments of the present case. The description covers features of various embodiments as well as method steps and their sequences for constructing and operating those embodiments. However, other embodiments can also be used to achieve the same or equivalent functions and step sequences.
除非本說明書另有定義,此處所用的科學與技術詞彙之含義與本案所屬技術領域中具有通常知識者所理解與慣用的意義相同。此外,在不和上下文衝突的情形下,本說明書所用的單數名詞涵蓋該名詞的複數型;而所用的複數名詞時亦涵蓋該名詞的單數型。Unless otherwise defined in this specification, the meanings of scientific and technical terms used herein are the same as those understood and commonly used by those with ordinary knowledge in the technical field to which this case belongs. In addition, the singular nouns used in this specification include the plural forms of the nouns, and the plural nouns used also include the singular forms of the nouns, unless the context conflicts with the context.
另外,關於本文中所使用之「耦接」或「連接」,可指二或多個元件相互直接作實體或電性接觸,或是相互間接作實體或電性接觸,亦可指二或多個元件相互操作或動作。In addition, regarding the "coupling" or "connection" used herein, it may refer to two or more elements being in direct physical or electrical contact with each other, or indirect physical or electrical contact with each other, or it may refer to two or more components. elements interact or act on each other.
在本文中,用語『電路』泛指由一或多個電晶體與/或一或多個主被動元件按一定方式連接以處理訊號的物件。In this article, the term "circuit" generally refers to an object that is connected in a certain way by one or more transistors and/or one or more active and passive components to process signals.
在說明書及申請專利範圍中使用了某些詞彙來指稱特定的元件。然而,所屬技術領域中具有通常知識者應可理解,同樣的元件可能會用不同的名詞來稱呼。說明書及申請專利範圍並不以名稱的差異做為區分元件的方式,而是以元件在功能上的差異來做為區分的基準。在說明書及申請專利範圍所提及的「包含」為開放式的用語,故應解釋成「包含但不限定於」。Certain terms are used in the specification and claims to refer to particular elements. However, those skilled in the art should understand that the same element may be called by different terms. The description and the scope of the patent application do not use the difference in the name as the way to distinguish the components, but the difference in the function of the components as the basis for the distinction. The term "comprising" mentioned in the specification and scope of patent application is an open term, so it should be interpreted as "including but not limited to".
第1圖係依照本案一實施例繪示一種偵測裝置與顯示面板的示意圖。如圖所示,偵測裝置100包含處理電路110及驅動電路120,處理電路110包含偵測器111及計算器113,且驅動電路120包含至少一切換電路121。於連接關係上,處理電路110耦接於驅動電路120,計算器113耦接於偵測器111,偵測器111耦接於至少一切換電路121。FIG. 1 is a schematic diagram illustrating a detection device and a display panel according to an embodiment of the present application. As shown in the figure, the
為提供根據斷路的位置以切換資料信號之電路路徑的技術,本案提供如第1圖所示之偵測裝置100,其相關操作詳細說明如下所述。In order to provide the technique of switching the circuit path of the data signal according to the position of the disconnection, the present application provides a
在一實施例中,偵測器111用以提供偵測信號,且偵測器111用以接收反饋信號。In one embodiment, the
隨後,計算器113用以根據反饋信號計算斷路的位置。舉例而言,若量測用線材的長度為0.3 m,計算器113接收到的反饋信號時間為1.494x10
-9s,計算器113接收到的反饋信號速度為3x10
8m/s,則斷路的位置為(1.494x10
-9x3x10
8)-0.3 =0.1182m。此外,斷路的位置為軟性電路板的接頭(pin)端為起始點。
Subsequently, the
接著,至少一切換電路121用以根據斷路的位置以切換資料信號之電路路徑。舉例而言,根據斷路的位置以開啟斷路的位置鄰近的至少一切換電路121,並透過至少一切換電路121將資料信號傳遞至面板900。Next, at least one
為使偵測裝置100之上述操作易於理解,請一併參閱第2圖至第5圖,第2圖係依照本案一實施例繪示一種偵測裝置的詳細電路圖,第3圖至第5圖係依照本案一實施例繪示如第2圖中所示之偵測裝置的操作示意圖。In order to make the above-mentioned operation of the
請一併參閱第2圖與第3圖,在一實施例中,在第一階段時,驅動電路120傳遞資料信號至面板900。Please refer to FIG. 2 and FIG. 3 together. In one embodiment, in the first stage, the
請參閱第4圖,在一實施例中,在第二階段時,驅動電路120之電路路徑發生斷路,偵測信號於斷路的位置回傳反饋信號至處理電路110及至少一切換電路121。Please refer to FIG. 4 , in one embodiment, in the second stage, the circuit path of the
請參閱第5圖,在一實施例中,在第三階段時,至少一切換電路121接收反饋信號以開啟,且至少一切換電路121將資料信號傳遞至面板900。Please refer to FIG. 5 , in one embodiment, in the third stage, at least one
在一實施例中,處理電路110更包含時序控制器115及資料信號源117。於連接關係上,資料信號源117耦接於時序控制器115。In one embodiment, the
時序控制器115用以提供複數時序信號。接著,資料信號源117根據複數時序信號以提供資料信號。The
在一實施例中,驅動電路120更包含至少一放大電路123。至少一放大電路123用以接收並放大反饋信號。In one embodiment, the
第6圖係依照本案一實施例繪示一種偵測裝置與顯示面板的示意圖。第7圖係依照本案一實施例繪示一種偵測裝置的詳細電路圖。請一併參閱第6圖及第7圖,相較於第1圖所示之偵測裝置100,第6圖及第7圖之偵測裝置100A的電源電路130A更包含修復電源133A,且偵測裝置100A的至少一切換電路121A更包含修復元件125A。於連接關係上,修復電源133A耦接於至少一切換電路121A。FIG. 6 is a schematic diagram illustrating a detection device and a display panel according to an embodiment of the present application. FIG. 7 is a detailed circuit diagram of a detection device according to an embodiment of the present application. Please refer to FIG. 6 and FIG. 7 together. Compared with the
在一實施例中,修復電源133A用以提供修復信號。隨後,修復元件125A用以接收修復信號以修復驅動電路120A。舉例而言,修復元件125A可以由高阻抗材料構成,高阻抗材料可以是鈦合金(例如Ti/Al/Ti)或鉬合金(例如Mo/Al/Mo),但本案不以此為限。In one embodiment, the
為使偵測裝置100A之上述操作易於理解,請一併參閱第7圖至第10圖,第8圖至第10圖係依照本案一實施例繪示如第7圖中所示之偵測裝置的操作示意圖。In order to make the above-mentioned operation of the
請一併參閱第7圖與第8圖,在一實施例中,在第一階段時,驅動電路120A傳遞資料信號至面板900A。Please refer to FIG. 7 and FIG. 8 together. In one embodiment, in the first stage, the driving
請參閱第9圖,在一實施例中,在第二階段時,驅動電路120A之電路路徑發生斷路,偵測信號於斷路的位置回傳反饋信號至處理電路110A及至少一切換電路121A。Please refer to FIG. 9 , in one embodiment, in the second stage, the circuit path of the driving
請參閱第10圖,在一實施例中,在第三階段時,至少一切換電路121A接收反饋信號以開啟,且至少一切換電路121A將修復信號傳遞至斷路以予修復,致使驅動電路120A可透過其電路路徑傳遞資料信號至面板900A。Please refer to FIG. 10. In one embodiment, in the third stage, at least one
在一實施例中,處理電路110A更包含伽瑪信號源119A。於連接關係上,伽瑪信號源119A耦接於時序控制器115A。伽瑪信號源119A用以提供伽瑪信號。In one embodiment, the
第11圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的剖面圖。第12圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的剖面圖。FIG. 11 is a cross-sectional view illustrating a driving circuit structure of a detection device according to an embodiment of the present application. FIG. 12 is a cross-sectional view illustrating a driving circuit structure of a detection device according to an embodiment of the present application.
請參閱第11圖及第12圖,驅動電路200更包含第一絕緣層(例如210、210A)、第二絕緣層(例如220、220A)、第三絕緣層(例如230、230A)、第一金屬層(例如240、240A)、修補材(例如250、250A)、修補電路走線(例如260、260A)及第四絕緣層(例如270、270A)。於連接關係上,第二絕緣層(例如220、220A)堆疊於第一絕緣層(例如210、210A)的上方,第三絕緣層(例如230、230A)堆疊於第一絕緣層(例如210、210A)的上方且相鄰於第二絕緣層(例如220、220A),第一金屬層(例如240、240A)堆疊於第二絕緣層(例如220、220A)的上方,修補材(例如250、250A)堆疊於第一金屬層(例如240、240A)的兩側及/或上方,修補電路走線(例如260、260A)相鄰於修補材(例如250、250A)或堆疊於修補材(例如250、250A)上方,第四絕緣層(例如270、270A)堆疊於修補電路走線(例如260、260A)的上方且堆疊於驅動電路200內部的最上層。Please refer to FIG. 11 and FIG. 12, the
在一實施例中,第一金屬層(例如240、240A)用以傳遞資料信號。舉例而言,第一絕緣層(例如210、210A)可以是聚醯亞胺(Polyimide, PI),第二絕緣層(例如220、220A)可以是有機緩衝鈍化層(Organic buffer passivation, OBP),有機緩衝鈍化層的材料可以是光阻材料,第三絕緣層(例如230、230A)可以是緩衝層(Buffer layer, BL),緩衝層的材料可以是氮化矽(SiNx)或氧化矽(SiOx),第一金屬層(例如240、240A)可以是金屬層(Metal layer 2, M2),金屬層材料可以是鈦合金(Ti/Al/Ti),第四絕緣層(例如270、270A)可以是有機緩衝鈍化層(Organic buffer passivation, OBP),有機緩衝鈍化層的材料可以是光阻材料。In one embodiment, the first metal layer (
請一併參閱第10圖~第12圖,在一實施例中,修復元件125A用以接收修復信號以修復驅動電路120A。舉例而言,修復元件125A用以接收修復信號以產生熱能融化修補材(例如250、250A),融化的修補材(例如250、250A)用以修復驅動電路120A上的斷路或瑕疵。Please refer to FIGS. 10 to 12 together. In one embodiment, the repairing
第13圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的俯視圖。如圖所示,驅動電路200結構外型呈現蛇型。FIG. 13 is a top view illustrating a driving circuit structure of a detection device according to an embodiment of the present application. As shown in the figure, the structural appearance of the driving
請一併參照第11圖及第13圖,在一實施例中,第13圖為第11圖之驅動電路200的俯視圖,驅動電路200的俯視圖結構外型呈現蛇型,且驅動電路200包含第一絕緣層210、第二絕緣層220、第三絕緣層230、第一金屬層240、修補材250、修補電路走線260及第四絕緣層270。舉例而言,驅動電路200結構外型可以為蛇型或直線型,然而蛇行的外型設計可以承受較多的應力,避免過多的斷路產生,並於應力較大的彎折處配置修補材250,以利彎折處斷路時能即時修復。Please refer to FIG. 11 and FIG. 13 together. In one embodiment, FIG. 13 is a top view of the driving
請一併參照第12圖及第13圖,在一實施例中,第13圖為第12圖之驅動電路200A的俯視圖,驅動電路200A的俯視圖結構外型呈現蛇型,且驅動電路200A包含第一絕緣層210A、第二絕緣層220A、第三絕緣層230A、第一金屬層240A、修補材250A、修補電路走線260A及第四絕緣層270A。Please refer to FIG. 12 and FIG. 13 together. In one embodiment, FIG. 13 is a top view of the driving
第14圖係依照本案一實施例繪示一種偵測方法的流程圖。偵測方法300包含以下步驟:FIG. 14 is a flowchart illustrating a detection method according to an embodiment of the present invention. The
步驟310:藉由偵測器111以提供偵測信號,且偵測信號通過驅動電路120;Step 310: using the
步驟320:藉由偵測器111以接收驅動電路120的反饋信號;Step 320: Receive a feedback signal from the driving
步驟330:藉由計算器113以根據反饋信號計算斷路的位置;Step 330: use the
步驟340:藉由驅動電路120的至少一切換電路121以根據斷路的位置以切換資料信號之電路路徑。Step 340 : Use at least one
為使偵測方法300易於理解,請一併參閱第1圖及第14圖。於步驟310中,可藉由偵測器111以提供偵測信號,且偵測信號通過驅動電路120。To make the
隨後,於步驟320中,可藉由偵測器111以接收驅動電路120的反饋信號。Then, in
接著,於步驟330中,可藉由計算器113以根據反饋信號計算斷路的位置。Next, in
然後,於步驟340中,可藉由驅動電路120的至少一切換電路121以根據斷路的位置以切換資料信號之電路路徑。Then, in
第15圖係依照本案一實施例繪示一種偵測方法的流程圖。為使第15圖之偵測方法300A易於理解,請一併參閱第2圖及第15圖。第15圖之偵測方法300A包含以下步驟:FIG. 15 is a flowchart illustrating a detection method according to an embodiment of the present case. In order to make the
步驟310A:藉由偵測器111以提供偵測信號,且偵測信號通過驅動電路120;
步驟320A:偵測是否有反饋信號;
步驟330A:藉由計算器113以根據反饋信號計算斷路的位置;
步驟340A:藉由驅動電路的至少一切換電路121以根據斷路的位置以切換資料信號之電路路徑;
步驟350A:判斷亮暗線是否明顯;
步驟360A:面板900不佳;
步驟370A:面板900許可。
在一實施例中,第15圖之偵測方法300A與第14圖之偵測方法300的差異在於偵測方法300A之步驟320A的判斷流程。於步驟320中,可藉由偵測器111偵測是否有反饋信號。當藉由偵測器111偵測有反饋信號時,則執行步驟330A以藉由計算器113根據反饋信號計算斷路的位置。In one embodiment, the difference between the
在一實施例中,當藉由偵測器111偵測無反饋信號時,則執行步驟370A以判定面板900許可。舉例而言,當藉由偵測器111偵測無反饋信號時,即驅動電路120無斷路產生,故判定面板900許可。In one embodiment, when no feedback signal is detected by the
在一實施例中,請參閱步驟350A,可進一步判斷面板900的複數亮暗線是否明顯,上述亮暗線是由驅動電路120內部的斷路所造成。舉例而言,可以透過人眼或感應器判斷由驅動電路120內部的斷路所造成面板900的複數亮暗線是否明顯。In one embodiment, please refer to step 350A to further determine whether the plurality of bright and dark lines on the
在一實施例中,請一併參閱步驟350A及步驟360A,當驅動電路120有斷路時,則判定面板900的複數亮暗線明顯,且當面板900的複數亮暗線明顯時,則判定面板900不佳。In one embodiment, please refer to step 350A and step 360A together. When the driving
在一實施例中,請一併參閱步驟350A及步驟370A,當驅動電路120修復斷路或藉由至少一切換電路121切換資料信號之電路路徑時,則判定面板900的複數亮暗線不明顯,且當面板900的複數亮暗線不明顯時,則判定面板900許可。In one embodiment, please refer to step 350A and step 370A together. When the driving
第16圖係依照本案一實施例繪示一種偵測方法的流程圖。相較於第15圖所示之偵測方法300A,第16圖之偵測方法300B具有修復驅動電路120的步驟。為使第16圖之偵測方法300B易於理解,請一併參閱第7圖及第16圖。第16圖之偵測方法300B包含以下步驟:FIG. 16 is a flowchart illustrating a detection method according to an embodiment of the present invention. Compared with the
步驟310B:藉由偵測器111A以提供偵測信號,且偵測信號通過驅動電路120A;
步驟320B:偵測是否有反饋信號;
步驟330B:藉由計算器113A以根據反饋信號計算斷路的位置;
步驟340B:藉由驅動電路120A的至少一切換電路121A以根據斷路的位置以切換修復信號之修復電路路徑,並藉由修復元件125A用以接收修復信號以修復驅動電路120A;
步驟350B:判斷藉由修復元件125A修復驅動電路120A的次數是否小於3次;
步驟360B:面板900A不佳;
步驟370B:面板900A許可。
在一實施例中,請參閱步驟350B,可進一步判斷藉由修復元件修復驅動電路120A的次數是否小於3次。舉例而言,可以透過人或電腦判斷藉由修復元件125A修復驅動電路120A的次數是否小於3次。In one embodiment, referring to step 350B, it may be further determined whether the number of times of repairing the driving
在一實施例中,請參閱步驟360B,當修復元件125A修復驅動電路120A的次數大於3次時,則判定面板900A不佳。In one embodiment, please refer to step 360B, when the number of times the repairing
在一實施例中,當修復元件125A修復驅動電路120的次數小於3次時,會再度執行步驟320B以偵測是否有反饋信號,若無反饋信號,則可執行步驟370B以判定面板900A許可。In one embodiment, when the repairing
由上述本案實施方式可知,應用本案具有下列優點。本案實施例所示之偵測裝置及偵測方法得以根據斷路的位置以切換資料信號之電路路徑,因此,可以改善顯示器因斷路所產生畫面異常的問題。As can be seen from the implementation manner of the present case described above, the application of the present case has the following advantages. The detection device and detection method shown in the embodiment of this case can switch the circuit path of the data signal according to the position of the disconnection, so the problem of abnormal picture of the display caused by the disconnection can be improved.
雖然上文實施方式中揭露了本案的具體實施例,然其並非用以限定本案,本案所屬技術領域中具有通常知識者,在不悖離本案之原理與精神的情形下,當可對其進行各種更動與修飾,因此本案之保護範圍當以附隨申請專利範圍所界定者為準。Although the specific examples of this case are disclosed in the above implementation mode, they are not used to limit this case. Those who have ordinary knowledge in the technical field of this case can carry out this case without departing from the principle and spirit of this case. Various changes and modifications, so the protection scope of this case should be defined by the scope of the accompanying patent application.
100、100A:偵測裝置100, 100A: detection device
110、110A:處理電路110, 110A: processing circuit
111、111A:偵測器111, 111A: detector
113、113A:計算器113, 113A: Calculator
115、115A:時序控制器115, 115A: timing controller
117、117A:資料信號源117, 117A: data signal source
119、119A:伽瑪信號源119, 119A: Gamma signal source
120、120A、200、200A:驅動電路120, 120A, 200, 200A: drive circuit
121、121A:至少一切換電路121, 121A: at least one switching circuit
123、123A:至少一放大電路123, 123A: at least one amplifier circuit
125A:修復元件125A: Restoration Components
130、130A:電源電路130, 130A: power circuit
131、131A:驅動電源131, 131A: drive power supply
133A:修復電源133A: Repair power supply
210、210A:第一絕緣層210, 210A: first insulating layer
220、220A:第二絕緣層220, 220A: second insulating layer
230、230A:第三絕緣層230, 230A: the third insulating layer
240、240A:第一金屬層240, 240A: first metal layer
250、250A:修補材250, 250A: repair material
260、260A:修補電路走線260, 260A: repair circuit wiring
270、270A:第四絕緣層270, 270A: the fourth insulating layer
400、400A:偵測方法400, 400A: detection method
900、900A:面板900, 900A: panel
為讓本案之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖係依照本案一實施例繪示一種偵測裝置與顯示面板的示意圖。 第2圖係依照本案一實施例繪示一種偵測裝置的詳細電路圖。 第3圖至第5圖係依照本案一實施例繪示如第2圖中所示之偵測裝置的操作示意圖。 第6圖係依照本案一實施例繪示一種偵測裝置與顯示面板的示意圖。 第7圖係依照本案一實施例繪示一種偵測裝置的詳細電路圖。 第8圖至第10圖係依照本案一實施例繪示如第7圖中所示之偵測裝置的操作示意圖。 第11圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的剖面圖。 第12圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的剖面圖。 第13圖係依照本案一實施例繪示一種偵測裝置的驅動電路結構的俯視圖。 第14圖係依照本案一實施例繪示一種偵測方法的流程圖。 第15圖係依照本案一實施例繪示一種偵測方法的流程圖。 第16圖係依照本案一實施例繪示一種偵測方法的流程圖。 In order to make the above and other purposes, features, advantages and embodiments of this case more obvious and understandable, the accompanying drawings are explained as follows: FIG. 1 is a schematic diagram illustrating a detection device and a display panel according to an embodiment of the present application. FIG. 2 is a detailed circuit diagram of a detection device according to an embodiment of the present application. Figures 3 to 5 are schematic diagrams illustrating the operation of the detection device shown in Figure 2 according to an embodiment of the present application. FIG. 6 is a schematic diagram illustrating a detection device and a display panel according to an embodiment of the present application. FIG. 7 is a detailed circuit diagram of a detection device according to an embodiment of the present application. Figures 8 to 10 are schematic diagrams illustrating the operation of the detection device shown in Figure 7 according to an embodiment of the present case. FIG. 11 is a cross-sectional view illustrating a driving circuit structure of a detection device according to an embodiment of the present application. FIG. 12 is a cross-sectional view illustrating a driving circuit structure of a detection device according to an embodiment of the present application. FIG. 13 is a top view illustrating a driving circuit structure of a detection device according to an embodiment of the present application. FIG. 14 is a flowchart illustrating a detection method according to an embodiment of the present invention. FIG. 15 is a flowchart illustrating a detection method according to an embodiment of the present case. FIG. 16 is a flowchart illustrating a detection method according to an embodiment of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
100:偵測裝置 100: detection device
110:處理電路 110: processing circuit
111:偵測器 111: Detector
113:計算器 113: Calculator
115:時序控制器 115: Timing controller
117:資料信號源 117: Data signal source
119:伽瑪信號源 119: Gamma signal source
120:驅動電路 120: drive circuit
121:至少一切換電路 121: at least one switching circuit
123:至少一放大電路 123: At least one amplifier circuit
130:電源電路 130: Power circuit
131:驅動電源 131: Drive power
900:面板 900: panel
Claims (19)
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