TWI795078B - Film removing liquid, preparation method thereof, and application method thereof - Google Patents

Abstract

A film removing fluid, a preparation method thereof, and application method thereof are provided. The film removal fluid includes sodium hydroxide in a concentration of 35% to 45% by weight, polyethylene glycol in a concentration of 2% by weight, and water in a concentration of 53% to 63% by weight. The preparation method of the film removing fluid includes a weighing step and a mixing step. In the weighing step, sodium hydroxide, polyethylene glycol and water are weighed. In the mixing step, sodium hydroxide and polyethylene glycol are poured into water and mixed sequentially. The application method of the film removing fluid includes a dilution step and a film removing step. In the dilution step, the film removing fluid is diluted with water to 5% to 25% of its original weight percentage concentration. In the de-filming step, the diluted de-filming fluid is used to de-film a circuit board.

Description

Film removal solution, its preparation method and its use method

The invention relates to a film-removing liquid, its configuration method and its use method, in particular to a film-removing liquid used for circuit boards, its configuration method and its use method.

The circuit design of existing circuit boards has become denser and more complex, and to improve the circuit fineness of circuit boards made of high-density interconnect technology (High Density Interconnect, HDI), it is usually chosen to reduce the number of wires on the circuit board. width. However, when the line width/space (L/S) of the traditional inorganic film removal solution is below 80 mm/80 mm, its film removal effect on the circuit board is poor and the rate is low. In addition, the traditional inorganic film removal solution also produces a lot of waste liquid after the film removal is completed.

Therefore, how to overcome the above-mentioned defects by improving the formula of the film-removing solution has become one of the important issues to be solved by this business.

The embodiment of the present invention provides a film-removing solution for the deficiencies of the prior art, which can effectively improve the possible defects of the traditional inorganic film-removing solution.

The embodiment of the present invention discloses a film removal solution, which includes sodium hydroxide with a concentration of 35% to 45% by weight, polyethylene glycol with a concentration of 2% by weight, and a concentration of 53% to 63% by weight. % of water between.

The embodiment of the present invention discloses a method for configuring a film removal solution, which includes: weighing step: weighing sodium hydroxide with a concentration of 35% to 45% by weight, polyethylene glycol with a concentration of 2% by weight and water with a concentration of 53% to 63% by weight; and a mixing step: pouring the sodium hydroxide and the polyethylene glycol into the water in sequence and stirring.

The embodiment of the present invention discloses a method for using a film-removing liquid, which includes: a dilution step: diluting a film-removing liquid with water to 5% to 25% of its original weight percent concentration; wherein, the film-removing liquid includes a weight percent concentration Sodium hydroxide between 35%～45%, polyethylene glycol with a concentration of 2% by weight and water between 53%～63% by weight; The film-removing solution removes the film of a circuit board.

One of the beneficial effects of the present invention is that the film removal liquid, its configuration method and its use method provided by the present invention can pass through "the film removal liquid includes a weight percentage concentration between 35% and 45% The sodium hydroxide, the polyethylene glycol with a concentration of 2% by weight and the water with a concentration of 53% to 63% by weight” are used to improve the fine line dryness of the circuit board. Improve the removal efficiency of the membrane and reduce the waste liquid generated after the membrane removal is completed.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

S100: Configuration method of film removal solution

S101: weighing step

S103: mixing step

S200: How to use the film removal solution

S201: Dilution step

S203: film removal step

FIG. 1 is a flow chart of the steps of the method for configuring the film removal solution according to the second embodiment of the present invention.

FIG. 2 is a flow chart of the steps of the method for using the film removal solution according to the third embodiment of the present invention.

The following is to illustrate the relevant "removing film" disclosed by the present invention through specific specific examples. Liquid, its configuration method and its use method”, those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. This specification Various details in the present invention can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the accompanying drawings of the present invention are only simple schematic illustrations, not drawn according to actual dimensions, and are stated in advance. In addition, if it is pointed out below that please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize the follow-up description. Most of the relevant content mentioned appears in the specific drawing, but not Only the specific drawings can be referred to in the subsequent description. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

The first embodiment of the present invention provides a film removal solution, which includes sodium hydroxide with a concentration of 35% to 45% by weight, polyethylene glycol with a concentration of 2% by weight, and a concentration of 53% by weight. ~63% water. Wherein, the weight percentage concentration of described sodium hydroxide is preferably between 38%～42%, and described water is selected from the group that tap water, distilled water, deionized water and demineralized water form, and described water The weight percent concentration is preferably between 56% and 60%.

As mentioned above, by the proportion configuration of the above-mentioned sodium hydroxide, the above-mentioned polyethylene glycol and the above-mentioned water, the film-removing liquid can be used to remove the fine circuit dry film on the circuit board, and the film-removing liquid can effectively Remove the plating film from the circuit board. In addition, the dry film separated from the circuit board through the film removal operation by the film removal liquid has a fine and uniform particle shape, and the film residue is moderate in size and easy to remove. Filtration is not easy to clog the nozzle.

[Second embodiment]

Please refer to Fig. 1, which is the second embodiment of the present invention. It should be noted that the drawings corresponding to this embodiment and the relevant numbers and shapes mentioned are only used to specifically illustrate this embodiment. The embodiments of the invention are used to facilitate the understanding of the content of the present invention, but not to limit the protection scope of the present invention.

As shown in FIG. 1 , the second embodiment of the present invention provides a configuration method S100 of a film-removing solution, which includes a weighing step S101 and a mixing step S103, and in the weighing step S101, the weight percentage concentration is between Sodium hydroxide between 35%~45%, polyethylene glycol with a concentration of 2% by weight and water with a concentration of 53%~63% by weight are weighed, and in the mixing step S103 , the above-mentioned sodium hydroxide and the above-mentioned polyethylene glycol were sequentially poured into the water and stirred.

It should be noted that, in the weighing step S101, the weight percent concentration of the sodium hydroxide is preferably between 38% and 42%, and the water is selected from tap water, distilled water, deionized water and demineralized water. A group formed by water, and the weight percent concentration of the water is preferably between 56% and 60%.

[Third embodiment]

Please refer to Figure 2, which is the third embodiment of the present invention. It should be noted that the drawings corresponding to this embodiment and the relevant numbers and shapes mentioned are only used to specifically illustrate this embodiment. The embodiments of the invention are used to facilitate the understanding of the content of the present invention, but not to limit the protection scope of the present invention.

As shown in Figure 2, the third embodiment of the present invention provides a method for using a film removal solution S200, which includes a dilution step S201 and a film removal step S203, and in the dilution step S201, a film removal solution is added with water Dilute to 5%~25% of its original weight percentage concentration. Wherein, the film-removing solution includes sodium hydroxide with a weight percent concentration between 35% and 45%, and a weight percent concentration of 2% polyethylene glycol and water with a concentration of 53% to 63% by weight.

It should be noted that, in this embodiment, the weight percent concentration of the above-mentioned sodium hydroxide is preferably between 38% and 42%, and the above-mentioned water is selected from the group consisting of tap water, distilled water, deionized water and demineralized water Group, and the weight percentage concentration of above-mentioned water is between 56%～60%.

It should be noted that, in the film removal step S203, the diluted film removal solution is used to remove the film from a circuit board (not shown in the figure), and when the diluted film removal solution is removed When filming, its temperature is kept between 50°C and 60°C.

It should be noted that, as shown in Table 1 and Table 2 below, Table 1 shows the experimental results of the beaker test of the film remover of the present invention combined with a black oil circuit board. Wherein, the film-removing liquid after dilution is the experimental group 1, and the liquid caustic soda (sodium hydroxide) is the control group 1; Table 2 shows the experimental results of the beaker test of the film-removing liquid of the present invention with the green oil circuit board. Wherein, the diluted film-removing liquid is the experimental group 2, and the caustic soda is the control group 2.

As shown in Table 1 and Table 2 above, in the beaker test of Table 1, compared with the time for the black oil circuit board to be soaked in the liquid alkali, the time for the black oil circuit board to be soaked in the film-removing solution Shorten about 11%; In the beaker test of table 2, compared with the time that described green oil circuit board is soaked in described liquid caustic soda, the time that described green oil circuit board is soaked in described film-removing liquid has shortened about 20%. It is obvious that the present invention goes The film liquid can effectively improve the film removal efficiency of the circuit board.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the film removal liquid, its configuration method S100 and its use method S200 provided by the present invention can pass "the film removal liquid includes a concentration of 35% to 45% by weight." The sodium hydroxide between, the polyethylene glycol with a concentration of 2% by weight and the water with a concentration of 53% to 63% by weight” are technical solutions to improve the fineness of the circuit board. Improve the removal efficiency of the line dry film and reduce the waste liquid generated after the film removal is completed.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

S100: Configuration method of film removal solution

S101: weighing steps

S103: mixing step

Claims (4)

A film-removing liquid, which includes sodium hydroxide with a concentration of 38% to 42% by weight, polyethylene glycol with a concentration of 2% by weight and water with a concentration of 56% to 60% by weight , and the water is selected from the group consisting of tap water, distilled water, deionized water and demineralized water. A method for configuring a film-removing solution, which includes: weighing step: weighing sodium hydroxide with a weight percentage concentration of 38% to 42%, polyethylene glycol with a weight percentage concentration of 2%, and weight percentage concentration between Water between 56%~60%, and the water is selected from the group consisting of tap water, distilled water, deionized water and demineralized water; and a mixing step: mixing the sodium hydroxide and the polyethylene glycol Alcohol is sequentially poured into the water and stirred. A method for using a film-removing solution, which includes: a dilution step: diluting a film-removing solution with water to 10% to 20% of its original weight percent concentration; Sodium hydroxide between 42%, the weight percent concentration is the water between the polyethylene glycol of 2% and the weight percent concentration between 56%～60%, and described water is selected from tap water, distilled water, deionized water and a group composed of demineralized water; and a film removal step: removing the film from a circuit board with the diluted film removal solution. The method for using the film-removing liquid according to claim 3, wherein, in the film-removing step, the temperature of the film-removing liquid after dilution is kept between 50°C and 60°C.

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