TWI793559B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

Info

Publication number
TWI793559B
TWI793559B TW110111478A TW110111478A TWI793559B TW I793559 B TWI793559 B TW I793559B TW 110111478 A TW110111478 A TW 110111478A TW 110111478 A TW110111478 A TW 110111478A TW I793559 B TWI793559 B TW I793559B
Authority
TW
Taiwan
Prior art keywords
transfer robot
transfer
substrate
robot
unit
Prior art date
Application number
TW110111478A
Other languages
Chinese (zh)
Other versions
TW202209534A (en
Inventor
古矢正明
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021031561A external-priority patent/JP7438156B2/en
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202209534A publication Critical patent/TW202209534A/en
Application granted granted Critical
Publication of TWI793559B publication Critical patent/TWI793559B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Abstract

本發明提供一種基板處理裝置以及基板處理方法,可抑制生產性的降低。實施方式的基板處理裝置包括:搬送機器人,設於搬送室內,搬送基板;移動機構,設於搬送室內,使搬送機器人移動;以及控制單元(72)。控制單元(72)包括:識別部(73),檢測搬送室內的人的位置;設定部(74),設定包含由識別部(73)所檢測到的人的位置的區域;追隨部(75),對應於所述人的移動而使由設定部(74)設定的區域移動;以及機器人控制器(72d),以搬送機器人避開區域而搬送基板的方式來控制搬送機器人及移動機構。The present invention provides a substrate processing apparatus and a substrate processing method capable of suppressing reduction in productivity. A substrate processing apparatus according to an embodiment includes: a transfer robot disposed in a transfer chamber to transfer a substrate; a moving mechanism disposed in the transfer chamber to move the transfer robot; and a control unit (72). The control unit (72) includes: a recognition unit (73), which detects the position of a person in the transfer chamber; a setting unit (74), which sets an area including the position of the person detected by the recognition unit (73); a follower unit (75) The area set by the setting unit (74) is moved according to the movement of the person; and the robot controller (72d) controls the transfer robot and the moving mechanism so that the transfer robot avoids the area and transfers the substrate.

Description

基板處理裝置以及基板處理方法Substrate processing apparatus and substrate processing method

本發明是有關於一種基板處理裝置以及基板處理方法。The invention relates to a substrate processing device and a substrate processing method.

基板處理裝置為單片式的基板處理裝置,針對半導體晶片、光掩模(photomask)用玻璃基板、液晶用玻璃基板等各種基板,例如使用多個處理室一片一片地實施各種處理(例如蝕刻處理、清洗處理、淋洗處理、乾燥處理等)。所述基板處理裝置為沿著進行基板搬送的搬送機器人移動的搬送室(機器人室)而配置著多個處理室的裝置,有時作業者從搬送室側對處理室進行維護作業。搬送室內為存在下降流(down-flow)的潔淨環境,作業者進入搬送室並步行移動至維護物件的處理室,對所述處理室進行維護作業。The substrate processing apparatus is a one-piece substrate processing apparatus that performs various processes (such as etching processing) one by one using a plurality of processing chambers for various substrates such as semiconductor wafers, glass substrates for photomasks, and glass substrates for liquid crystals. , cleaning treatment, rinse treatment, drying treatment, etc.). The substrate processing apparatus is an apparatus in which a plurality of processing chambers are arranged along a transfer chamber (robot chamber) in which a transfer robot that transfers substrates moves, and operators may perform maintenance work on the processing chambers from the transfer chamber side. The transfer chamber is a clean environment with down-flow. An operator enters the transfer chamber and moves to the processing chamber for maintenance objects on foot, and performs maintenance work on the processing chamber.

作業者從搬送室側進行對處理室的維護作業的情況下,作業者需要在進入搬送室之前切斷搬送機器人或基板處理裝置的電源等,以使搬送機器人不干擾(碰撞等)搬送室內的作業者。此時,由於將搬送機器人或基板處理裝置的電源切斷後進行維護作業,因而基板處理也停止。因此,生產性(例如生產性=生產量/時間)降低。 [現有技術文獻] [專利文獻]When the operator performs maintenance work on the processing chamber from the transfer chamber side, the operator needs to turn off the power supply of the transfer robot or substrate processing equipment before entering the transfer chamber so that the transfer robot does not interfere (collision, etc.) with the inside of the transfer chamber. Operators. At this time, since the power supply of the transfer robot or the substrate processing apparatus is cut off and maintenance work is performed, the substrate processing is also stopped. Therefore, productivity (for example, productivity=production amount/time) falls. [Prior art literature] [Patent Document]

[專利文獻1] 日本專利第4101166號公報[Patent Document 1] Japanese Patent No. 4101166

[發明所欲解決之課題][Problem to be Solved by the Invention]

本發明所要解決的問題在於提供一種基板處理裝置以及基板處理方法,可抑制生產性的降低。 [解決課題之手段]The problem to be solved by the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing a decrease in productivity. [Means to solve the problem]

本發明的實施方式的基板處理裝置包括:搬送機器人,設於搬送室內,搬送基板;移動機構,設於所述搬送室內,使所述搬送機器人移動;檢測部,檢測所述搬送室內的人的位置;設定部,設定包含由所述檢測部所檢測到的所述人的位置的區域;追隨部,對應於所述人的移動而使由所述設定部所設定的所述區域移動;以及控制部,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing apparatus according to the embodiment of the present invention includes: a transfer robot installed in the transfer chamber to transfer the substrate; a moving mechanism installed in the transfer chamber to move the transfer robot; a position; a setting unit that sets an area including the position of the person detected by the detection unit; a following unit that moves the area set by the setting unit in response to movement of the person; and The control unit controls the transfer robot and the moving mechanism so that the transfer robot avoids the area moved by the follower and transfers the substrate.

本發明的實施方式的基板處理方法包括下述工序:利用檢測部來檢測搬送室內的人的位置,所述搬送室內設有搬送基板的搬送機器人、及使所述搬送機器人移動的移動機構;利用設定部來設定包含由所述檢測部所檢測到的所述人的位置的區域;利用追隨部對應於所述人的移動而使由所述設定部所設定的所述區域移動;以及利用控制部,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。 [發明的效果]A substrate processing method according to an embodiment of the present invention includes the steps of: using a detection unit to detect the position of a person in a transfer chamber in which a transfer robot for transferring a substrate and a moving mechanism for moving the transfer robot are installed; a setting unit sets an area including the position of the person detected by the detection unit; moves the area set by the setting unit in response to movement of the person by a following unit; A part controls the transfer robot and the moving mechanism so that the transfer robot avoids the area moved by the follow-up part and transfers the substrate. [Effect of the invention]

根據本發明的實施方式,可抑制生產性的降低。According to the embodiment of the present invention, reduction in productivity can be suppressed.

<第一實施方式> 參照圖1至圖5對第一實施方式進行說明。<First Embodiment> A first embodiment will be described with reference to FIGS. 1 to 5 .

(基本結構) 如圖1所示,第一實施方式的基板處理裝置10包括多個開閉單元20、第一搬送單元30、緩衝單元40、第二搬送單元50、多個基板處理單元60及裝置附帶單元70。所述基板處理裝置10為對基板表面供給處理液(例如抗蝕劑剝離液或淋洗液、清洗液)而對基板表面進行處理的裝置,各基板處理單元60進行多種處理工序(例如抗蝕劑剝離工序或淋洗工序、清洗工序)。(basic structure) As shown in FIG. 1 , a substrate processing apparatus 10 according to the first embodiment includes a plurality of opening and closing units 20 , a first transfer unit 30 , a buffer unit 40 , a second transfer unit 50 , a plurality of substrate processing units 60 , and an attached unit 70 . The substrate processing apparatus 10 is a device that supplies a processing liquid (such as a resist stripping liquid, a rinse liquid, and a cleaning liquid) to the substrate surface to process the substrate surface, and each substrate processing unit 60 performs various processing steps (such as resist agent stripping process or rinse process, cleaning process).

各開閉單元20排列設置成一列。這些開閉單元20將作為搬送容器發揮功能的專用盒(例如前開式晶圓傳送盒(front-opening-unified-pod,FOUP))的門開閉。另外,在專用盒為FOUP的情況下,開閉單元20被稱為FOUP開啟器。在專用盒,以規定間隔層疊收納著基板W。Each switch unit 20 is arranged in a row. These opening and closing units 20 open and close doors of dedicated pods (for example, front-opening-unified-pods (FOUPs)) functioning as transfer containers. In addition, when the dedicated box is a FOUP, the opening and closing unit 20 is called a FOUP opener. In the dedicated box, the substrates W are stacked and stored at predetermined intervals.

第一搬送單元30具有第一移動機構31及第一搬送機器人32。這些第一移動機構31及第一搬送機器人32設於第一搬送室33內。第一搬送室33為與各開閉單元20排成一列的方向平行地延伸的、長方體形狀的房間。各開閉單元20排列在第一搬送室33的旁邊。The first transport unit 30 has a first moving mechanism 31 and a first transport robot 32 . The first moving mechanism 31 and the first transfer robot 32 are installed in the first transfer chamber 33 . The first transfer chamber 33 is a rectangular parallelepiped room extending parallel to the direction in which the opening and closing units 20 are aligned. The opening and closing units 20 are arranged beside the first transfer chamber 33 .

在第一搬送室33,設有兩個出入口33a。這些出入口33a分別設於第一搬送室33中延伸方向的兩端的壁面。人(例如作業者)從各出入口33a進出第一搬送室33。而且,在第一搬送室33,設置著對室內進行拍攝的多個攝像部33b。例如,在第一搬送室33的頂棚部,在延伸方向的兩端分別設有攝像部33b。作為攝像部33b,例如可使用進行拍攝的攝像機。另外,在第一搬送室33,配置著從頂棚部以下降流的形式流動潔淨空氣的空調單元(未圖示),潔淨空氣從被搬送的基板W的上方向下流動。由此,可抑制在基板周邊部等產生的灰塵或塵埃附著於基板W,而且,可抑制因第一移動機構31或第一搬送機器人32等而產生的灰塵或塵埃飄起而附著於基板W。In the first transfer chamber 33, two entrances and exits 33a are provided. These entrances and exits 33 a are respectively provided on the wall surfaces at both ends in the extending direction of the first transfer chamber 33 . Persons (for example, workers) enter and exit the first transfer chamber 33 through the respective entrances and exits 33a. And in the 1st transfer chamber 33, the some imaging part 33b which images a room is installed. For example, in the ceiling part of the 1st transfer chamber 33, the imaging part 33b is provided in both ends of the extending direction, respectively. As the imaging unit 33b, for example, a video camera that takes pictures can be used. Also, in the first transfer chamber 33 , an air conditioner (not shown) that flows clean air downflow from the ceiling is arranged, and the clean air flows downward from above the substrate W to be transferred. Thereby, it is possible to suppress the dust or dust generated in the peripheral portion of the substrate or the like from adhering to the substrate W, and it is also possible to suppress the dust or dust generated by the first moving mechanism 31, the first transfer robot 32, etc. from flying up and adhering to the substrate W. .

第一移動機構31與第一搬送室33的延伸方向平行地延伸,為使第一搬送機器人32在與第一搬送室33的延伸方向平行的直線上移動的機構。在所述第一移動機構31上設有第一搬送機器人32,第一移動機構31構成為可使第一搬送機器人32在排成一列的各開閉單元20的端部到端部往返移動。作為第一移動機構31,例如可使用具有直線導軌(linear guide)的移動機構。The first moving mechanism 31 extends parallel to the extending direction of the first transfer chamber 33 and is a mechanism for moving the first transfer robot 32 on a straight line parallel to the extending direction of the first transfer chamber 33 . A first transfer robot 32 is provided on the first moving mechanism 31 , and the first moving mechanism 31 is configured to reciprocate the first transfer robot 32 from end to end of each opening and closing unit 20 arranged in a row. As the first moving mechanism 31 , for example, a moving mechanism having a linear guide can be used.

第一搬送機器人32可沿第一移動機構31的延伸方向移動,經由迴旋台32a而設於第一移動機構31上。迴旋台32a形成為能以位於第一移動機構31的直線上的迴旋軸32b為中心而迴旋。第一搬送機器人32載置於迴旋台32a中與迴旋軸32b為相反側的端部。第一搬送機器人32藉由迴旋台32a迴旋,從而自第一移動機構31的正上方偏移。即,向各開閉單元20側或緩衝單元40側的任一個偏移。(圖1向各開閉單元側偏移)。迴旋台32a一邊支撐第一搬送機器人32,一邊與第一搬送機器人32一起藉由第一移動機構31沿著第一移動機構31的延伸方向移動。由此,第一搬送機器人32可移動至能夠與開閉單元20或緩衝單元40交接基板W的位置。而且,第一搬送機器人32可一邊移動一邊迴旋,能以最短路徑藉由各開閉單元20與緩衝單元40的通路而搬送基板W。另外,迴旋台32a可藉由迴旋機構(未圖示)而迴旋。The first transfer robot 32 is movable along the extending direction of the first moving mechanism 31 and is installed on the first moving mechanism 31 via the swivel table 32 a. The swivel table 32a is formed so as to be able to swivel around a swivel shaft 32b located on a straight line of the first moving mechanism 31 . The first transfer robot 32 is placed on the end portion of the turning table 32a on the opposite side to the turning shaft 32b. The first transfer robot 32 is shifted from directly above the first moving mechanism 31 by turning the turning table 32a. That is, it is shifted to either the side of each switch unit 20 or the side of the buffer unit 40 . (Picture 1 is shifted to each switching unit side). While supporting the first transfer robot 32 , the swivel table 32 a moves together with the first transfer robot 32 by the first moving mechanism 31 along the extending direction of the first moving mechanism 31 . Accordingly, the first transfer robot 32 can move to a position where the substrate W can be delivered to and from the opening and closing unit 20 or the buffer unit 40 . Furthermore, the first transfer robot 32 can rotate while moving, and can transfer the substrate W through the passage of each opening and closing unit 20 and the buffer unit 40 through the shortest path. In addition, the swivel table 32a can swivel by a swivel mechanism (not shown).

第一搬送機器人32例如具有升降軸及迴旋軸(均未圖示),可沿著升降軸升降,而且能以迴旋軸為中心在迴旋台32a上迴旋,進而可使兩根伸縮臂獨立地移動。在伸縮臂,安裝著握持基板W的基板手。藉由使兩根臂連續地進行握持基板W的動作、及將所握持的基板W放置於設置場所的動作(手開放),從而以短時間進行基板W的替換動作。第一搬送機器人32在以迴旋軸32b為中心由迴旋台32a迴旋至第一移動機構31中靠近開閉單元20的一側的狀態下,進行專用盒中的基板W的替換動作。而且,第一搬送機器人32在以迴旋軸32b為中心由迴旋台32a迴旋至第一移動機構31中遠離開閉單元20的一側(靠近緩衝單元40的一側)的狀態下,進行緩衝單元40中的基板W的替換動作。The first transfer robot 32 has, for example, a lifting shaft and a revolving shaft (both not shown), which can be lifted and lowered along the elevating shaft, and can revolve on the revolving platform 32a with the revolving shaft as the center, so that the two telescopic arms can move independently . A substrate hand for holding the substrate W is attached to the telescopic arm. The operation of replacing the substrate W is performed in a short time by causing the two arms to continuously perform the operation of holding the substrate W and the operation of placing the grasped substrate W on the installation place (hand opening). The first transfer robot 32 performs the replacement operation of the substrate W in the dedicated cassette while swiveling from the swivel table 32a to the side of the first moving mechanism 31 close to the opening and closing unit 20 around the swivel axis 32b. In addition, the first transfer robot 32 performs the buffer unit 40 in a state where the first transfer robot 32 is swiveled from the swivel table 32 a to the side farther from the opening and closing unit 20 (the side closer to the buffer unit 40 ) of the first moving mechanism 31 around the swivel axis 32 b. The replacement action of the substrate W in .

此處,如圖2所示,第一搬送機器人32的動作範圍(移動範圍)H1為進行與各開閉單元20或緩衝單元40的基板W的替換動作所需要的、第一搬送機器人32的三維區域的移動範圍(也包含臂或手的移動範圍)。第一搬送機器人32在第一搬送室33中位於各開閉單元20側的狀態下,可沿第一移動機構31的延伸方向在第一移動機構31的端部到端部往返移動,正對開閉單元20而進行基板W的替換動作。而且,第一搬送機器人32在第一搬送室33中位於第二搬送單元50側的狀態下,正對緩衝單元40而進行基板W的替換動作。Here, as shown in FIG. 2 , the operating range (moving range) H1 of the first transfer robot 32 is the three-dimensional range of the first transfer robot 32 required for the replacement operation of the substrate W with each opening and closing unit 20 or buffer unit 40 . The range of movement of the region (also includes the range of movement of the arm or hand). The first transfer robot 32 can move back and forth from end to end of the first moving mechanism 31 along the extension direction of the first moving mechanism 31 in the state of being positioned at each opening and closing unit 20 side in the first transferring chamber 33, facing the opening and closing The unit 20 performs the replacement operation of the substrate W. In addition, the first transfer robot 32 faces the buffer unit 40 and performs the replacement operation of the substrate W in a state located on the second transfer unit 50 side in the first transfer chamber 33 .

緩衝單元40在第一搬送室33中位於第二搬送單元50側,設置成從第一移動機構31的延伸方向的中央稍許偏離。此緩衝單元40為緩衝台,為了在第一搬送單元30與第二搬送單元50之間進行基板W的交接(更換),而暫時放置基板W。在緩衝單元40,以規定間隔層疊收納未處理或處理完畢的基板W。The buffer unit 40 is located on the side of the second conveying unit 50 in the first conveying chamber 33 , and is provided slightly deviated from the center in the extending direction of the first moving mechanism 31 . This buffer unit 40 is a buffer table, and temporarily places the substrate W in order to transfer (replace) the substrate W between the first transfer unit 30 and the second transfer unit 50 . In the buffer unit 40 , unprocessed or processed substrates W are stacked and stored at predetermined intervals.

第二搬送單元50具有第二移動機構51及第二搬送機器人52。這些第二移動機構51及第二搬送機器人52設於第二搬送室53內。第二搬送室53為與在水平面內和第一移動機構31的延伸方向正交的方向平行地延伸的、長方體形狀的房間。所述第二搬送室53與第一搬送室33中延伸方向的中央附近相連,第一搬送室33及第二搬送室53形成平面視為T字形狀的一個搬送室(基板搬送室)。以在短邊方向夾著第二搬送室53的方式,以各四個相互相向的方式設有基板處理單元60。The second transport unit 50 has a second moving mechanism 51 and a second transport robot 52 . The second moving mechanism 51 and the second transfer robot 52 are installed in the second transfer chamber 53 . The second transfer chamber 53 is a rectangular parallelepiped room extending parallel to the direction perpendicular to the extending direction of the first moving mechanism 31 in the horizontal plane. The second transfer chamber 53 is connected to the vicinity of the center in the extending direction of the first transfer chamber 33 , and the first transfer chamber 33 and the second transfer chamber 53 form a T-shaped transfer chamber (substrate transfer chamber) in plan view. Four substrate processing units 60 are provided so as to face each other so as to sandwich the second transfer chamber 53 in the short-side direction.

在第二搬送室53,設有裝置附帶單元70用的出入口53a。此出入口53a設於第二搬送室53中延伸方向的一端的壁面。人(例如作業者)從出入口53a進出裝置附帶單元70內。而且,在第二搬送室53,設置著對室內進行拍攝的多個攝像部53b。例如,在第二搬送室53的頂棚部,在延伸方向的兩端分別設有攝像部53b。作為攝像部53b,例如可使用進行拍攝的攝像機。另外,在第二搬送室53,與第一搬送室33同樣地配置著從頂棚部以下降流的形式流動潔淨空氣的空調單元(未圖示),潔淨空氣從被搬送的基板W的上方向下流動。由此,可抑制在基板周邊部等產生的灰塵或塵埃附著於基板W,而且,可抑制因第二移動機構51或第二搬送機器人52等產生的灰塵或塵埃飄起而附著於基板W。In the second transfer chamber 53, an entrance and exit 53a for the unit with equipment 70 is provided. The entrance and exit 53 a are provided on the wall surface at one end in the extending direction of the second transfer chamber 53 . A person (for example, an operator) enters and exits the apparatus-attached unit 70 through the entrance and exit 53a. And in the 2nd transfer chamber 53, the some imaging part 53b which images a room is installed. For example, on the ceiling portion of the second transfer chamber 53, imaging units 53b are respectively provided at both ends in the extending direction. As the imaging unit 53b, for example, a video camera that takes pictures can be used. In addition, in the second transfer chamber 53, an air conditioning unit (not shown) that flows clean air downflow from the ceiling portion is arranged similarly to the first transfer chamber 33, and the clean air flows from above the substrate W to be transferred to the second transfer chamber 53. flow down. This prevents dust or dust generated at the periphery of the substrate or the like from adhering to the substrate W, and also prevents dust or dust blown up by the second moving mechanism 51 or the second transfer robot 52 from adhering to the substrate W.

第二移動機構51沿在水平面內與第一移動機構31的延伸方向正交的方向延伸,為使第二搬送機器人52在直線上移動的機構,所述直線與在水平面內和第一移動機構31的延伸方向正交的方向平行。在所述第二移動機構51上設有第二搬送機器人52,第二移動機構51構成為可使第二搬送機器人52在排成一列的各基板處理單元60的端部到端部往返移動。作為第二移動機構51,例如可使用具有直線導軌的移動機構。The second moving mechanism 51 extends in a direction perpendicular to the extension direction of the first moving mechanism 31 in the horizontal plane, and is a mechanism for making the second transfer robot 52 move on a straight line, and the straight line is in line with the first moving mechanism in the horizontal plane. The direction perpendicular to the extending direction of 31 is parallel. The second transfer robot 52 is provided on the second moving mechanism 51 , and the second moving mechanism 51 is configured to reciprocate the second transfer robot 52 from end to end of each substrate processing unit 60 arranged in a row. As the second moving mechanism 51, for example, a moving mechanism having a linear guide can be used.

第二搬送機器人52可沿第二移動機構51的延伸方向移動,經由迴旋台52a設於第二移動機構51上。迴旋台52a能以位於第二移動機構51的直線上的迴旋軸52b為中心而迴旋。第二搬送機器人52載置於迴旋台52a中與迴旋軸52b為相反側的端部。藉由迴旋台52a迴旋,從而第二搬送機器人52自第二移動機構51的正上方偏移。即,向第二移動機構51的延伸方向的兩側的任一單側偏移(參照圖1)。迴旋台52a一邊支撐第二搬送機器人52,一邊與第二搬送機器人52一起藉由第二移動機構51沿第二移動機構51的延伸方向移動。由此,第二搬送機器人52可移動至能與基板處理單元60或緩衝單元40交接基板W的位置。而且,第二搬送機器人52可一邊移動一邊迴旋,能以最短路徑藉由各處理室61與緩衝單元40的通路而搬送基板W。另外,迴旋台52a可藉由迴旋機構(未圖示)而迴旋。The second transfer robot 52 can move along the extending direction of the second moving mechanism 51 and is installed on the second moving mechanism 51 via the swivel table 52a. The swivel table 52a can swivel about the swivel axis 52b located on the straight line of the second moving mechanism 51 as a center. The second transfer robot 52 is placed on the end portion of the swivel table 52a on the opposite side to the swivel shaft 52b. The second transfer robot 52 deviates from directly above the second moving mechanism 51 by the swivel table 52 a turning. That is, it deviates to either one of both sides in the extending direction of the second moving mechanism 51 (see FIG. 1 ). While supporting the second transfer robot 52 , the swivel table 52 a moves together with the second transfer robot 52 by the second moving mechanism 51 along the extending direction of the second moving mechanism 51 . Accordingly, the second transfer robot 52 can move to a position where the substrate W can be delivered to and from the substrate processing unit 60 or the buffer unit 40 . Furthermore, the second transfer robot 52 can rotate while moving, and can transfer the substrate W through the passage between each processing chamber 61 and the buffer unit 40 through the shortest path. In addition, the swivel table 52a can swivel by a swivel mechanism (not shown).

第二搬送機器人52與第一搬送機器人32同樣地,例如具有升降軸及迴旋軸(均未圖示),可沿著升降軸升降,而且能以迴旋軸為中心在迴旋台52a上迴旋,進而可使兩根伸縮臂獨立地移動。在各伸縮臂,安裝著握持基板W的基板手。藉由使兩根臂連續地進行握持基板W的動作、與將所握持的基板W放置於設置場所的動作(手開放),從而以短時間進行基板W的替換。第二搬送機器人52在以迴旋軸52b為中心由迴旋台32a迴旋至第二移動機構51中靠近基板W的替換物件的基板處理單元60的一側的狀態下,進行基板W的替換物件的基板處理單元60中的基板W的替換動作。而且,第二搬送機器人52在移動至第二移動機構51中緩衝單元40側的狀態下,進行緩衝單元40中的基板W的替換動作。The second transfer robot 52 is the same as the first transfer robot 32. For example, it has a lifting shaft and a revolving shaft (both are not shown in the figure), can be raised and lowered along the elevating shaft, and can revolve on the revolving platform 52a centering on the revolving shaft, and then The two telescopic arms can be moved independently. A substrate hand for holding the substrate W is attached to each telescopic arm. Substrate W can be exchanged in a short time by causing the two arms to successively perform the operation of holding the substrate W and the operation of placing the grasped substrate W on the installation site (hand opening). The second transfer robot 52 performs the substrate replacement of the substrate W in a state where the second transfer robot 52 is revolving from the revolving table 32a to the side of the substrate processing unit 60 close to the replacement object of the substrate W in the second moving mechanism 51. The replacement operation of the substrate W in the processing unit 60 . Furthermore, the second transfer robot 52 performs an operation of replacing the substrate W in the buffer unit 40 while moving to the buffer unit 40 side of the second moving mechanism 51 .

此處,如圖2所示,第二搬送機器人52的動作範圍(移動範圍)H2為進行與各基板處理單元60或緩衝單元40的基板W的替換動作所需要的、第二搬送機器人52的三維區域的移動範圍(也包含臂或手的移動範圍)。第二搬送機器人52在位於第二搬送室53中排成一列的各基板處理單元60側的狀態下,可沿第二移動機構51的延伸方向在第二移動機構51的端部到端部往返移動,正對基板處理單元60而進行基板W的替換動作。而且,第二搬送機器人52在位於第二搬送室53中緩衝單元40側的狀態下,正對緩衝單元40而進行基板W的替換動作。Here, as shown in FIG. 2 , the operating range (moving range) H2 of the second transfer robot 52 is the range of the second transfer robot 52 required for the replacement operation of the substrate W with each substrate processing unit 60 or buffer unit 40 . The range of movement of the three-dimensional area (also includes the range of movement of the arm or hand). The second transfer robot 52 can reciprocate from end to end of the second moving mechanism 51 along the extending direction of the second moving mechanism 51 in a state of being located on the side of the substrate processing units 60 aligned in a row in the second transferring chamber 53 . The substrate W is moved, and the substrate processing unit 60 is facing the replacement operation of the substrate W. Further, the second transfer robot 52 is positioned on the side of the buffer unit 40 in the second transfer chamber 53 , facing the buffer unit 40 and performing the replacement operation of the substrate W.

基板處理單元60在第二搬送機器人52沿著第二移動機構51的延伸方向移動的機器人移動路的兩側,例如各設有四個。基板處理單元60具有處理室61,例如為單片式的基板處理單元。處理室61例如形成為長方體形狀。在此處理室61內,設有基板保持部或處理液供給部(均未圖示)等。作為基板保持部,例如可使用以水準狀態保持基板W並旋轉的旋轉台。而且,作為處理液供給部,例如可使用從噴嘴(未圖示)對由基板保持部所保持的基板W的被處理面供給處理液(例如化學液或淋洗液、清洗液)的處理液供給部。For example, four substrate processing units 60 are provided on both sides of the robot moving path where the second transfer robot 52 moves along the extending direction of the second moving mechanism 51 . The substrate processing unit 60 has a processing chamber 61 and is, for example, a monolithic substrate processing unit. The processing chamber 61 is formed in a rectangular parallelepiped shape, for example. In this processing chamber 61 , a substrate holding unit, a processing liquid supply unit (both are not shown), and the like are provided. As the substrate holding unit, for example, a turntable that holds and rotates the substrate W in a horizontal state can be used. Furthermore, as the processing liquid supply unit, for example, a processing liquid that supplies a processing liquid (such as a chemical liquid, a rinse liquid, or a cleaning liquid) from a nozzle (not shown) to the surface to be processed of the substrate W held by the substrate holding portion can be used. supply department.

處理室61具有成為基板用的出入口的基板閘門(未圖示)。基板閘門可開閉地形成於處理室61中第二搬送室53側的壁面。在所述處理室61,配置著從頂棚部以下降流的形式流動潔淨空氣的空調單元(未圖示),潔淨空氣從所搬送的基板W的上方向下流動。由此,可抑制在基板周邊部等產生的灰塵或塵埃附著於基板W,而且,可抑制因第二搬送機器人52等而產生的灰塵或塵埃飄起而附著於基板W。另外,進行維護作業的作業者打開基板閘門,從第二搬送室53側對處理室61進行維護作業。The processing chamber 61 has a substrate shutter (not shown) serving as an entrance and exit for substrates. A substrate shutter is formed on a wall surface of the processing chamber 61 on the second transfer chamber 53 side so as to be openable and closable. In the processing chamber 61 , an air conditioner (not shown) that flows clean air downflow from the ceiling portion is arranged, and the clean air flows downward from above the substrate W to be transported. Thereby, dust or dust generated in the peripheral portion of the substrate or the like can be suppressed from adhering to the substrate W, and dust generated by the second transfer robot 52 or the like can be suppressed from flying up and adhering to the substrate W. In addition, the operator performing the maintenance work opens the substrate shutter, and performs the maintenance work on the processing chamber 61 from the second transfer chamber 53 side.

裝置附帶單元70位於第二搬送室53中與第一搬送室33(第一搬送單元30)相反的一側,設於第二搬送室53的旁邊。所述裝置附帶單元70具有液供給單元71及控制單元72。液供給單元71構成為可對各基板處理單元60分別供給各種處理液。The device-attached unit 70 is located on the side opposite to the first transfer chamber 33 (first transfer unit 30 ) in the second transfer chamber 53 , and is provided beside the second transfer chamber 53 . The device-attached unit 70 has a liquid supply unit 71 and a control unit 72 . The liquid supply unit 71 is configured to supply various processing liquids to the respective substrate processing units 60 .

如圖3所示,控制單元72包括電腦72a、記憶部72b、區域控制器72c及機器人控制器(控制部)72d。這些各部例如由硬體(例如電氣電路)及軟體兩者或任一者構成。電腦72a為集中控制各部的主控制部(例如微電腦)。記憶部72b記憶各種資訊或各種程式等。As shown in FIG. 3 , the control unit 72 includes a computer 72a, a memory unit 72b, an area controller 72c, and a robot controller (control unit) 72d. Each of these units is constituted by, for example, both or any one of hardware (such as an electric circuit) and software. The computer 72a is a main control unit (such as a microcomputer) that centrally controls each unit. The memory unit 72b stores various information, various programs, and the like.

電腦72a基於記憶於記憶部72b的基板處理資訊或各種程式,控制各開閉單元20或第一搬送單元30、緩衝單元40、第二搬送單元50、各基板處理單元60等各部。而且,電腦72a可從第一移動機構31或第一搬送機器人32、第二移動機構51、第二搬送機器人52等隨時取得機械性位置資訊,例如可從這些各部分別包括的多個編碼器等隨時取得各自的位置資訊(例如平面座標或空間座標)。進而,電腦72a可從各攝像部33b、攝像部53b隨時取得各自的圖像資訊。另外,各攝像部33b、攝像部53b分別對第一搬送室33或第二搬送室53的搬送室內進行即時拍攝,將與藉由拍攝所得的圖像相關的圖像資訊送至區域控制器72c。The computer 72a controls each opening and closing unit 20 or the first transfer unit 30, the buffer unit 40, the second transfer unit 50, and each substrate processing unit 60 based on the substrate processing information or various programs stored in the memory unit 72b. Moreover, the computer 72a can obtain mechanical position information at any time from the first moving mechanism 31 or the first transport robot 32, the second mobile mechanism 51, the second transport robot 52, etc., for example, from a plurality of encoders included in these respective parts. etc. to obtain their respective location information (such as plane coordinates or spatial coordinates) at any time. Furthermore, the computer 72a can acquire respective image information from each imaging unit 33b and imaging unit 53b at any time. In addition, each imaging unit 33b and imaging unit 53b respectively take real-time images of the first transfer chamber 33 or the transfer chamber of the second transfer chamber 53, and send image information related to the images obtained by the images to the zone controller 72c. .

區域控制器72c具有識別部(檢測部)73、設定部74及追隨部75。識別部73對基於由各攝像部33b、攝像部53b所得的圖像資訊的圖像進行分析,檢測第一搬送室33或第二搬送室53內的人(人的有無)、第一搬送機器人32、第二搬送機器人52,識別這些的位置或區域(三維區域)。設定部74設定區域R1,此區域R1為包含由識別部73所檢測出的人的位置的、所需尺寸的空間區域(參照圖4及圖5),將包含區域R1的形狀或尺寸、位置等的資訊保存於記憶部72b。所謂區域R1,例如為至少包含所檢測到的人的、所需尺寸的圓柱形狀的空間區域,區域R1由空間座標設定。追隨部75對應於人的移動而使由設定部74所設定的區域R1移動。例如,追隨部75對應於人的移動而變更記憶於記憶部72b的資訊中區域R1的位置資訊。The area controller 72 c has a recognition unit (detection unit) 73 , a setting unit 74 , and a follower unit 75 . The recognition part 73 analyzes the image based on the image information obtained by each of the imaging parts 33b and 53b, and detects a person (presence or absence of a person) in the first transfer chamber 33 or the second transfer chamber 53, and the first transfer robot. 32. The second transfer robot 52 recognizes these positions or areas (three-dimensional areas). The setting unit 74 sets the region R1, which is a spatial region of a desired size including the position of the person detected by the recognition unit 73 (see FIGS. 4 and 5 ), and includes the shape, size, and position of the region R1. etc. are stored in the memory unit 72b. The region R1 is, for example, a cylindrical spatial region of a desired size including at least the detected person, and the region R1 is set by spatial coordinates. The following unit 75 moves the region R1 set by the setting unit 74 in accordance with the movement of the person. For example, the following unit 75 changes the position information of the region R1 among the information stored in the memory unit 72 b in accordance with the movement of the person.

若識別部73檢測到在第一搬送室33或第二搬送室53內的人的位置,則電腦72a將運轉模式由通常運轉模式切換為維護作業模式(作業模式的一例)。通常運轉模式是基板處理裝置10進行通常運轉而人未進入第一搬送室33或第二搬送室53的模式。維護作業模式是人為了進行維護作業而進入第一搬送室33或第二搬送室53的模式。例如,若識別部73檢測到第一搬送室33或第二搬送室53內的人的位置,則電腦72a掌握到人進入了第一搬送室33或第二搬送室53,將運轉模式由通常運轉模式切換為維護作業模式。而且,若識別部73未檢測到第一搬送室33及第二搬送室53內的人的位置,則電腦72a掌握到人不在第一搬送室33或第二搬送室53,將運轉模式由維護作業模式切換為通常運轉模式。這樣,電腦72a作為切換部發揮功能。When the recognition unit 73 detects the position of a person in the first transfer chamber 33 or the second transfer chamber 53 , the computer 72 a switches the operation mode from the normal operation mode to the maintenance work mode (an example of the work mode). The normal operation mode is a mode in which the substrate processing apparatus 10 performs normal operation and no person enters the first transfer chamber 33 or the second transfer chamber 53 . The maintenance work mode is a mode in which a person enters the first transfer chamber 33 or the second transfer chamber 53 for maintenance work. For example, if the recognition unit 73 detects the position of a person in the first transfer chamber 33 or the second transfer chamber 53, then the computer 72a grasps that the person has entered the first transfer chamber 33 or the second transfer chamber 53, and changes the operation mode from normal to normal. The operation mode is switched to the maintenance work mode. And if the identification part 73 does not detect the position of the person in the first transfer chamber 33 and the second transfer chamber 53, then the computer 72a grasps that the person is not in the first transfer chamber 33 or the second transfer chamber 53, and changes the operation mode from maintenance to maintenance. The work mode is switched to the normal operation mode. In this way, the computer 72a functions as a switching unit.

機器人控制器72d僅在運轉模式為維護作業模式的情況下,以第一搬送機器人32或第二搬送機器人52避開區域R1而移動的方式來控制第一移動機構31、第一搬送機器人32(也包含迴旋台32a,以下相同)、第二移動機構51、第二搬送機器人52(也包含迴旋台52a,以下相同)等。即,機器人控制器72d基於與第一搬送機器人32的動作範圍H1或第二搬送機器人52的動作範圍H2相關的動作範圍資訊,來識別第一搬送機器人32的動作範圍H1或第二搬送機器人52的動作範圍H2,使所識別的動作範圍H1、動作範圍H2以不接觸區域R1的方式根據區域R1的移動而變化,將變化的動作範圍H1、動作範圍H2隨時保存於記憶部72b。另外,機器人控制器72d以第一搬送機器人32及第二搬送機器人52僅在保存於記憶部72b的動作範圍H1、動作範圍H2內搬送基板W的方式,來控制第一移動機構31、第一搬送機器人32、第二移動機構51、第二搬送機器人52等。另外,上文所述的動作範圍資訊例如為由空間座標指定動作範圍H1、動作範圍H2的資訊,且預先記憶於記憶部72b。The robot controller 72d controls the first moving mechanism 31 and the first transport robot 32 ( Also includes the swivel table 32a, hereinafter the same), the second moving mechanism 51, the second transfer robot 52 (also includes the swivel table 52a, hereinafter the same), and the like. That is, the robot controller 72d recognizes the operation range H1 of the first transfer robot 32 or the operation range H2 of the second transfer robot 52 based on the operation range information related to the operation range H1 of the first transfer robot 32 or the operation range H2 of the second transfer robot 52 The recognized operating range H1 and H2 are changed according to the movement of the area R1 without touching the area R1, and the changed operating range H1 and H2 are stored in the memory unit 72b at any time. In addition, the robot controller 72d controls the first moving mechanism 31, the first moving mechanism 31, the first moving mechanism 52 so that the first moving robot 32 and the second moving robot 52 move the substrate W only within the operating range H1 and operating range H2 stored in the memory unit 72b. The transfer robot 32, the second moving mechanism 51, the second transfer robot 52, and the like. In addition, the motion range information mentioned above is, for example, information specifying the motion range H1 and the motion range H2 by spatial coordinates, and is stored in the memory unit 72b in advance.

(維護作業) 接下來,對所述基板處理裝置10中作業者進行的維護作業進行說明。作為一例,針對作業者對圖4及圖5中的A1的處理室61進行維護作業的情況進行說明。(maintenance work) Next, maintenance work performed by an operator in the substrate processing apparatus 10 will be described. As an example, a case where an operator performs maintenance work on the processing chamber 61 of A1 in FIG. 4 and FIG. 5 will be described.

如圖4所示,作業者從第一搬送室33的出入口33a進入第一搬送室33,移動至緩衝單元40的附近,如圖5所示,從緩衝單元40的附近進入第二搬送室53,移動至正對圖5中的A1的處理室61的位置。接下來,作業者對A1的處理室61內的各部進行維護作業,若維護作業完成,則在方才從第一搬送室33的出入口33a移動至正對A1的處理室61的位置的路徑中反向移動,從第一搬送室33的出入口33a退出。As shown in Figure 4, the operator enters the first transfer chamber 33 from the entrance 33a of the first transfer chamber 33, moves to the vicinity of the buffer unit 40, and as shown in Figure 5, enters the second transfer chamber 53 from the vicinity of the buffer unit 40 , move to the position facing the processing chamber 61 of A1 in FIG. 5 . Next, the operator performs maintenance work on each part in the processing chamber 61 of A1, and if the maintenance work is completed, the operator moves back to the position facing the processing chamber 61 of A1 from the entrance and exit 33a of the first transfer chamber 33 just now. to move to and exit from the entrance/exit 33a of the first transfer chamber 33 .

這樣,作業者移動而進行維護作業,第一搬送室33及第二搬送室53中,由各攝像部33b、攝像部53b對室內即時進行拍攝。若作業者進入第一搬送室33,則基於由各攝像部33b所得的圖像資訊而由識別部73檢測到作業者,由電腦72a將通常運轉模式切換為維護作業模式。另一方面,若作業者完成維護作業而從第一搬送室33及第二搬送室53退出,則根據由各攝像部33b、攝像部53b所得的圖像資訊而識別部73未檢測到作業者,由電腦72a將維護作業模式切換為通常運轉模式。通常運轉模式中,識別部73的識別動作、設定部74的設定動作、追隨部75的追隨動作及機器人控制器72d的避開控制動作(使第二搬送機器人52避開區域R1的控制動作)被禁止,在維護作業模式下允許所述各動作。In this way, the operator moves to perform maintenance work, and in the first transfer chamber 33 and the second transfer chamber 53 , the imaging units 33b and 53b capture images of the interior in real time. When an operator enters the first transfer chamber 33, the operator is detected by the recognition unit 73 based on the image information obtained by each imaging unit 33b, and the computer 72a switches the normal operation mode to the maintenance operation mode. On the other hand, if the operator finishes the maintenance work and exits from the first transfer chamber 33 and the second transfer chamber 53, the recognition unit 73 does not detect the operator based on the image information obtained by the respective imaging units 33b and 53b. , the maintenance work mode is switched to the normal operation mode by the computer 72a. In the normal operation mode, the identification operation of the identification part 73, the setting operation of the setting part 74, the following operation of the following part 75, and the avoidance control operation of the robot controller 72d (control operation for avoiding the second transfer robot 52 from the region R1) prohibited, the above-mentioned actions are allowed in the maintenance work mode.

而且,基於由各攝像部33b、攝像部53b所得的圖像資訊,而由識別部73檢測作業者、第一搬送機器人32、第二搬送機器人52,識別作業者的有無及位置、第一搬送機器人32的位置、第二搬送機器人52的位置。由設定部74設定包含由識別部73所檢測到的作業者的位置的區域R1,將包含區域R1的形狀或尺寸、位置等的資訊保存於記憶部72b。根據由各攝像部33b、攝像部53b所得的圖像資訊,而即時識別作業者的有無及位置、第一搬送機器人32的位置、第二搬送機器人52的位置。因此,記憶於記憶部72b的資訊中區域R1的位置資訊根據作業者的移動而隨時變更。And based on the image information obtained by each imaging unit 33b and imaging unit 53b, the recognition unit 73 detects the operator, the first transfer robot 32, and the second transfer robot 52, and recognizes the presence and position of the operator, the first transfer robot The position of the robot 32 and the position of the second transfer robot 52 . The area R1 including the position of the worker detected by the recognition unit 73 is set by the setting unit 74, and information including the shape, size, position, etc. of the area R1 is stored in the memory unit 72b. Based on the image information obtained by each of the imaging units 33b and 53b, the presence and location of the operator, the position of the first transfer robot 32, and the position of the second transfer robot 52 are recognized in real time. Therefore, among the information memorized in the memory unit 72b, the positional information of the region R1 is constantly changed according to the movement of the operator.

機器人控制器72d基於記憶於記憶部72b的動作範圍資訊而識別第一搬送機器人32的動作範圍H1或第二搬送機器人52的動作範圍H2,基於記憶於記憶部72b的資訊,使所識別的動作範圍H1、動作範圍H2以不接觸區域R1的方式根據區域R1的移動而變化。圖5中,機器人控制器72d使所識別的動作範圍H2以不接觸區域R1的方式根據區域R1的移動而變化,基於變化的動作範圍H2,以第二搬送機器人52避開區域R1而搬送基板W的方式,也就是以第二搬送機器人52僅在變化的動作範圍H2內搬送基板W的方式,來控制第二移動機構51及第二搬送機器人52。The robot controller 72d recognizes the motion range H1 of the first transfer robot 32 or the motion range H2 of the second transfer robot 52 based on the motion range information stored in the memory unit 72b, and makes the recognized motion range based on the information stored in the memory portion 72b. The range H1 and the operating range H2 change according to the movement of the region R1 so as not to touch the region R1. In FIG. 5, the robot controller 72d changes the recognized operation range H2 according to the movement of the region R1 so as not to touch the region R1, and based on the changed operation range H2, the second transfer robot 52 avoids the region R1 to transfer the substrate. In the W mode, that is, the second moving mechanism 51 and the second transport robot 52 are controlled in such a manner that the second transport robot 52 transports the substrate W only within the variable operating range H2.

此處,基本上第一搬送機器人32在各開閉單元20與緩衝單元40之間進行基板搬送,但以在第一搬送機器人32的動作範圍H1內基板W的搬送路徑成為最短距離的方式搬送基板W。而且,第二搬送機器人52在處理室61與緩衝單元40之間進行基板搬送,進而在各處理室61之間進行基板搬送,但以在第二搬送機器人52的動作範圍H2內基板W的搬送路徑成為最短距離的方式搬送基板W。因此,基板W的搬送路徑是以在第一搬送機器人32的動作範圍H1或第二搬送機器人52的動作範圍H2內成為最短距離的方式,由機器人控制器72d設定。即,以基板W的搬送路徑成為最短距離(最短路徑)為基準,實現第一搬送機器人32的動作範圍H1或第二搬送機器人52的動作範圍H2內的基板搬送動作。Here, the first transfer robot 32 basically transfers the substrate between the switching units 20 and the buffer unit 40, but transfers the substrate so that the transfer path of the substrate W becomes the shortest distance within the operating range H1 of the first transfer robot 32. W. Furthermore, the second transfer robot 52 transfers the substrate between the processing chamber 61 and the buffer unit 40, and further transfers the substrate between the respective processing chambers 61, but the substrate W is transferred within the operating range H2 of the second transfer robot 52. The substrate W is conveyed so that the path becomes the shortest distance. Therefore, the transport path of the substrate W is set by the robot controller 72d so as to be the shortest distance within the operating range H1 of the first transport robot 32 or the operating range H2 of the second transport robot 52 . That is, the substrate transfer operation within the operating range H1 of the first transfer robot 32 or the operating range H2 of the second transfer robot 52 is realized based on the shortest distance (shortest path) of the transfer route of the substrate W.

例如,在第二搬送機器人52的迴旋方向為第二搬送機器人52因迴旋動作而旋向動作範圍H2外的迴旋方向(例如逆時針)的情況下,設為與所述迴旋方向相反的迴旋方向(例如順時針),也就是因迴旋動作而旋向動作範圍H2內的迴旋方向。而且,在僅變更迴旋方向時第二搬送機器人52因迴旋動作而旋向動作範圍H2外的情況下,第二搬送機器人52藉由第二移動機構51而一邊向自作業者遠離的方向(向與作業者進行作業的處理室為相反側的處理室側偏移的狀態)移動一邊迴旋,或者一邊縮回兩根伸縮臂一邊迴旋。作為迴旋動作,有第二搬送機器人52藉由迴旋台32a而迴旋的動作、或第二搬送機器人52單體在迴旋台32a上迴旋的動作(參照圖2)。由機器人控制器72d適當選擇包含所述那樣的動作的各種動作而執行控制,但以各處理室61與緩衝單元40之間的基板W的搬送路徑成為最短距離的方式選擇。For example, when the turning direction of the second transport robot 52 is the turning direction (for example, counterclockwise) in which the second transport robot 52 turns out of the operating range H2 due to the turning action, it is set to be the turning direction opposite to the turning direction. (for example, clockwise), that is, the direction of turning to the movement range H2 due to the turning action. Moreover, when only the turning direction is changed, when the second transport robot 52 turns out of the operating range H2 due to the turning action, the second transport robot 52 moves away from the operator by the second moving mechanism 51 (towards the same direction as the operator). The processing chamber where the operator works is in a state where the processing chamber side on the opposite side is shifted) and turns while moving, or turns while retracting the two telescopic arms. As the swiveling operation, there is an operation in which the second transfer robot 52 swivels on the swivel table 32 a, or an operation in which the second transfer robot 52 alone swivels on the swivel table 32 a (see FIG. 2 ). Various operations including those described above are appropriately selected and controlled by the robot controller 72d, but are selected so that the conveyance path of the substrate W between each processing chamber 61 and the buffer unit 40 becomes the shortest distance.

另外,上文所述的說明中,設想作業者對圖4及圖5中的A1的處理室61進行維護作業的情況,但不限於此,例如設想從第一搬送室33的出入口33a進入第一搬送室33並對最近的開閉單元20進行維護作業的情況。此時,機器人控制器72d使第一搬送機器人32的動作範圍H1以不接觸區域R1的方式根據區域R1的移動而變化。即,機器人控制器72d使所識別的動作範圍H1以不接觸區域R1的方式根據區域R1的移動而變化,基於變化的動作範圍H1,以第一搬送機器人32避開區域R1搬送基板W的方式,也就是以第一搬送機器人32僅在變化的動作範圍H1內搬送基板W的方式,來控制第一移動機構31及第一搬送機器人32。In addition, in the description above, it is assumed that the operator performs maintenance work on the processing chamber 61 of A1 in FIG. 4 and FIG. 5 , but it is not limited thereto. A transport room 33 and the situation of performing maintenance work on the nearest switch unit 20 . At this time, the robot controller 72d changes the operating range H1 of the first transfer robot 32 according to the movement of the region R1 so as not to touch the region R1. That is, the robot controller 72d changes the recognized operation range H1 according to the movement of the region R1 so as not to touch the region R1, and based on the changed operation range H1, the first transfer robot 32 transfers the substrate W so that the first transfer robot 32 avoids the region R1. , that is, the first moving mechanism 31 and the first transfer robot 32 are controlled so that the first transfer robot 32 transfers the substrate W only within the changing motion range H1.

而且,機器人控制器72d基於由識別部73所識別的第一搬送機器人32的位置及區域R1的位置,判斷第一搬送機器人32與區域R1的間隔距離是否為規定距離以下。所述規定距離為第一搬送機器人32低速移動的距離。若機器人控制器72d判斷為第一搬送機器人32與區域R1的間隔距離為規定距離以下,則降低第一搬送機器人32的移動速度,使第一搬送機器人32的移動動作過渡到低速動作。例如,在第一搬送機器人32向作業者靠近的情況下,使第一搬送機器人32的移動速度從規定速度下降。另外,在第一搬送機器人32自作業者遠離的情況下,也可不降低第一搬送機器人32的移動速度而保持規定速度。而且,機器人控制器72d基於由識別部73所識別的第二搬送機器人52的位置及區域R1的位置,判斷第二搬送機器人52與區域R1的間隔距離是否為規定距離以下,並根據其判斷結果對第二搬送機器人52進行與所述相同的處理。所述規定距離為第二搬送機器人52低速移動的距離。Then, the robot controller 72d determines whether the distance between the first transfer robot 32 and the region R1 is equal to or less than a predetermined distance based on the position of the first transfer robot 32 and the position of the region R1 recognized by the recognition unit 73 . The predetermined distance is the distance that the first transfer robot 32 moves at a low speed. If the robot controller 72d determines that the distance between the first transfer robot 32 and the region R1 is less than a predetermined distance, it reduces the moving speed of the first transfer robot 32 and transitions the movement of the first transfer robot 32 to a low-speed operation. For example, when the first transfer robot 32 approaches the operator, the moving speed of the first transfer robot 32 is decreased from a predetermined speed. In addition, when the first transfer robot 32 is separated from the operator, the movement speed of the first transfer robot 32 may be maintained at a predetermined speed without reducing it. Furthermore, the robot controller 72d judges whether or not the separation distance between the second transfer robot 52 and the region R1 is less than or equal to a predetermined distance based on the position of the second transfer robot 52 recognized by the recognition unit 73 and the position of the region R1, and based on the judgment result The same processing as described above is performed on the second transfer robot 52 . The predetermined distance is the distance that the second transfer robot 52 moves at a low speed.

圖4中,作業者從第一搬送室33的出入口33a進入第一搬送室33,移動至緩衝單元40的附近。第一搬送機器人32自第一移動機構31的正上方向各開閉單元20側偏移,第一搬送機器人32與區域R1的間隔距離並未成為規定距離以下,因而第一搬送機器人32的移動動作未設為低速動作。另一方面,若在作業者位於緩衝單元40的附近的狀態下,第一搬送機器人32對緩衝單元40進行用於搬送基板的動作,則第一搬送機器人32與區域R1的間隔距離成為規定距離以下,因而第一搬送機器人32的移動動作設為低速動作。而且,圖5中,在維護作業中,作業者位於正對A1的處理室61的位置。因此,在第二搬送機器人52對緩衝單元40進行用於搬送基板的動作的情況下,第二搬送機器人52與區域R1的間隔距離成為規定距離以下,因而第二搬送機器人52的移動動作設為低速動作。In FIG. 4 , the worker enters the first transfer chamber 33 from the entrance/exit 33 a of the first transfer chamber 33 and moves to the vicinity of the buffer unit 40 . The first transfer robot 32 deviates from directly above the first moving mechanism 31 to the side of each opening and closing unit 20, and the distance between the first transfer robot 32 and the region R1 does not become less than a predetermined distance, so the moving operation of the first transfer robot 32 Low-speed operation is not set. On the other hand, when the first transfer robot 32 operates to transfer the substrate to the buffer unit 40 while the operator is in the vicinity of the buffer unit 40, the distance between the first transfer robot 32 and the region R1 becomes a predetermined distance. Hereinafter, therefore, the movement operation of the first transfer robot 32 is set to a low-speed operation. In addition, in FIG. 5 , during the maintenance work, the operator is located at a position facing the processing chamber 61 of A1. Therefore, when the second transfer robot 52 performs an operation for transferring the substrate to the buffer unit 40, the distance between the second transfer robot 52 and the region R1 is equal to or less than a predetermined distance, and thus the moving operation of the second transfer robot 52 is as follows: Slow motion.

而且,機器人控制器72d基於由識別部73所識別的第一搬送機器人32的位置及區域R1的位置,判斷第一搬送機器人32與區域R1的間隔距離是否為規定停止距離(<規定間隔距離)以下。所述規定停止距離預先設定為下述距離,即:第一搬送機器人32與區域R1的間隔距離較上文所述的規定間隔距離更短,且第一搬送機器人32不與區域R1接觸。若作業者過於靠近第一搬送機器人32,機器人控制器72d判斷為第一搬送機器人32與區域R1的間隔距離為規定停止距離以下,則禁止第一搬送機器人32的移動直到彼此的間隔距離較規定停止距離更長為止。例如,若作業者在緩衝單元40的周邊經過,或在緩衝單元40的周邊停下,機器人控制器72d判斷為第一搬送機器人32與區域R1的間隔距離為規定停止距離以下,則禁止第一搬送機器人32移動,中斷第一搬送機器人32到達緩衝單元40。而且,機器人控制器72d基於由識別部73所識別的第二搬送機器人52的位置及區域R1的位置,判斷第二搬送機器人52與區域R1的間隔距離是否為規定停止距離以下,並根據其判斷結果,對第二搬送機器人52進行與上文所述相同的處理。所述規定停止距離預先設定為下述距離,即:第二搬送機器人52與區域R1的間隔距離較上文所述的規定間隔距離更短,且第一搬送機器人32不與區域R1接觸。Furthermore, the robot controller 72d determines whether or not the separation distance between the first transfer robot 32 and the region R1 is a predetermined stop distance (<predetermined separation distance) based on the position of the first transfer robot 32 recognized by the recognition unit 73 and the position of the region R1. the following. The predetermined stop distance is preset as a distance, that is, the distance between the first transfer robot 32 and the region R1 is shorter than the predetermined distance described above, and the first transfer robot 32 does not contact the region R1. If the operator is too close to the first transfer robot 32, the robot controller 72d determines that the distance between the first transfer robot 32 and the region R1 is below the predetermined stop distance, and prohibits the movement of the first transfer robot 32 until the distance between the first transfer robot 32 is less than the predetermined distance. until the stopping distance is longer. For example, if the operator passes by or stops around the buffer unit 40, and the robot controller 72d determines that the distance between the first transfer robot 32 and the region R1 is less than or equal to a predetermined stop distance, the first transport robot 32 is prohibited. The transfer robot 32 moves, interrupting the arrival of the first transfer robot 32 to the buffer unit 40 . Furthermore, the robot controller 72d judges whether the separation distance between the second transfer robot 52 and the region R1 is equal to or less than a predetermined stop distance based on the position of the second transfer robot 52 recognized by the recognition unit 73 and the position of the region R1, and judges accordingly. As a result, the same processing as described above is performed on the second transfer robot 52 . The predetermined stop distance is preset as a distance between the second transfer robot 52 and the region R1 is shorter than the above-mentioned predetermined distance, and the first transfer robot 32 does not come into contact with the region R1.

此處,若對基板搬送的流程進行說明,則對基板W進行兩種處理,因而基板W被依次搬送至開閉單元20、緩衝單元40、第一處理室61、第二處理室61、緩衝單元40、開閉單元20。第一處理室61及第二處理室61中,利用互不相同的處理液進行對基板W的處理。詳細來說,如圖4及圖5所示,在隔著第二移動機構51排列的八個處理室61中,存在於單側排成一列的四個處理室(第一處理室)61、及於另一單側排成一列的四個處理室(第二處理室)61。在對基板W進行兩種處理的情況下,於在單側排成一列的四個第一處理室61、與在另一單側排成一列的四個第二處理室61中,執行互不相同的處理。此時,隔著第二移動機構51正對的第一處理室61與第二處理室61成為一組,若第一處理室61中的處理結束,則由第二搬送機器人52從第一處理室將基板W搬送至第二處理室61。另外,圖5中,基於第二搬送機器人52的動作範圍H2,而禁止到達成為維護對象的A1的處理室61,因而對A1的處理室61的基板搬送、以及從A1的處理室(第一處理室)61向作為組的第二處理室61的基板搬送也被禁止。Here, if the flow of substrate transfer is described, two types of processing are performed on the substrate W, so the substrate W is sequentially transferred to the opening and closing unit 20, the buffer unit 40, the first processing chamber 61, the second processing chamber 61, and the buffer unit. 40. The opening and closing unit 20. In the first processing chamber 61 and the second processing chamber 61 , the substrate W is processed using different processing liquids. Specifically, as shown in FIGS. 4 and 5 , among the eight processing chambers 61 arranged across the second moving mechanism 51 , there are four processing chambers (first processing chambers) 61 arranged in a row on one side, And four processing chambers (second processing chambers) 61 arranged in a row on the other side. In the case of performing two kinds of processing on the substrate W, in the four first processing chambers 61 lined up on one side and the four second processing chambers 61 lined up on the other side, different processes are performed. Same deal. At this time, the first processing chamber 61 and the second processing chamber 61 facing each other through the second moving mechanism 51 form a group. The chamber transports the substrate W to the second processing chamber 61 . In addition, in FIG. 5 , based on the operating range H2 of the second transfer robot 52, it is prohibited to reach the processing chamber 61 of A1 which is the maintenance target, so the substrate transfer to the processing chamber 61 of A1 and the transfer of the substrate from the processing chamber of A1 (first The transfer of the substrate from the processing chamber 61 to the second processing chamber 61 as a group is also prohibited.

第一搬送機器人32從開閉單元20內的專用盒中取出未處理的基板W,迴旋(或移動並迴旋)而將未處理的基板W設置於緩衝單元40內。第二搬送機器人52從緩衝單元40內取出未處理的基板W,迴旋(或迴旋並移動)而將未處理的基板W設置於所需的第一處理室61內。然後,在第一處理室61中對基板W進行處理。若第一處理室61中的處理結束,則第二搬送機器人52從第一處理室61內取出基板W,迴旋180度而將基板W設置於第二處理室61內。然後,在第二處理室61中對基板W進行處理。若第二處理室61中的處理結束,則第二搬送機器人52從第二處理室61內取出基板W,迴旋(或迴旋並移動)而將基板W放置於緩衝單元40內。第一搬送機器人32從緩衝單元40內取出處理完畢的基板W,迴旋(或迴旋並移動)而將處理完畢的基板W設置於所需的專用盒內。The first transfer robot 32 takes out the unprocessed substrate W from the dedicated cassette in the opening and closing unit 20 , and turns (or moves and turns) to set the unprocessed substrate W in the buffer unit 40 . The second transfer robot 52 takes out the unprocessed substrate W from the buffer unit 40 and turns (or turns and moves) to place the unprocessed substrate W in the desired first processing chamber 61 . Then, the substrate W is processed in the first processing chamber 61 . When the processing in the first processing chamber 61 is completed, the second transfer robot 52 takes out the substrate W from the first processing chamber 61 , turns around 180 degrees, and sets the substrate W in the second processing chamber 61 . Then, the substrate W is processed in the second processing chamber 61 . When the processing in the second processing chamber 61 is completed, the second transfer robot 52 takes out the substrate W from the second processing chamber 61 , rotates (or rotates and moves), and places the substrate W in the buffer unit 40 . The first transfer robot 32 takes out the processed substrate W from the buffer unit 40 , turns (or turns and moves) and sets the processed substrate W in a desired dedicated cassette.

但是,第二搬送機器人52進行的基板搬送流程是以第一處理室61與和其正對的第二處理室61的每個組來執行,但第一處理室61及第二處理室61中,處理內容不同,因而處理時間也不同。為了提高生產性,第二搬送機器人52在緩衝單元40、第一處理室61、第二處理室61的各場所中利用其中一個臂將處理完畢的基板W取出,利用另一個臂設置未處理的基板W。即,第二搬送機器人52在緩衝單元40、第一處理室61、第二處理室61的各場所中,進行處理完畢的基板W的取出動作與未處理的基板W的交接動作(基板的替換動作)作為一組動作。而且,第一搬送機器人32也在緩衝單元40中進行處理完畢的基板W的取出動作與未處理的基板W的交接動作(基板的替換動作)作為一組動作。進而,為了提高生產性,在各第一處理室61中分別設置未處理的基板W而在各第一處理室61中同時進行處理,從處理結束的第一處理室61中取出處理完畢的基板W,設置於對應的第二處理室61並在各第二處理室61中同時進行處理。因此,實際的基板搬送流程較上文所述的基板搬送流程更複雜。However, the substrate transfer process performed by the second transfer robot 52 is performed for each group of the first processing chamber 61 and the second processing chamber 61 facing it, but in the first processing chamber 61 and the second processing chamber 61 , the processing content is different, so the processing time is also different. In order to improve productivity, the second transfer robot 52 uses one of the arms to take out the processed substrate W in each of the buffer unit 40, the first processing chamber 61, and the second processing chamber 61, and uses the other arm to place the unprocessed substrate W. Substrate W. That is, the second transfer robot 52 performs the taking-out operation of the processed substrate W and the transfer operation of the unprocessed substrate W (substrate replacement) in each of the buffer unit 40, the first processing chamber 61, and the second processing chamber 61. actions) as a set of actions. Furthermore, the first transfer robot 32 also performs an operation of taking out processed substrates W and a delivery operation of unprocessed substrates W (substrate replacement operation) in the buffer unit 40 as a set of operations. Further, in order to improve productivity, unprocessed substrates W are respectively set in the first processing chambers 61 and processed simultaneously in the first processing chambers 61, and the processed substrates are taken out from the first processing chambers 61 where the processing is completed. W, is set in the corresponding second processing chamber 61 and is processed in each second processing chamber 61 simultaneously. Therefore, the actual substrate transfer process is more complicated than the substrate transfer process described above.

這種基板搬送中,作業者可不干擾第一搬送機器人32及第二搬送機器人52,而移動至圖4及圖5中的A1的處理室61的前面,可到達圖4及圖5中的A1的處理室61並進行對所述A1的處理室61的維護作業。即,即便作業者進入搬送室(第一搬送室33、第二搬送室53),搬送機器人(第一搬送機器人32、第二搬送機器人52)也可繼續進行搬送動作。若識別出作業者在搬送室內,則識別搬送機器人的動作範圍H1、動作範圍H2與作業者的區域R1,以搬送機器人避開作業者而移動的方式進行控制。搬送機器人一邊避開與進行維護作業的作業者的接觸,一邊繼續進行搬送基板W的搬送作業。即便不藉由搬送機器人的電源停止或基板處理裝置10的電源停止等來停止搬送作業,作業者與搬送機器人也可共用搬送室而進行各自的作業(協作作業的實現)。因此,即便在作業者進入搬送室內的情況下,搬送機器人也可不停止基板搬送而繼續進行搬送作業,基板處理裝置10可繼續進行基板處理。由此,可抑制基板處理因維護作業而停止,抑制生產性的降低。而且,即便維護作業延長,搬送機器人也繼續進行搬送作業,因而基板處理裝置10可繼續進行基板處理,可抑制生產性的降低。In this substrate transfer, the operator can move to the front of the processing chamber 61 of A1 in FIG. 4 and FIG. and perform maintenance work on the processing chamber 61 of A1. That is, even if an operator enters the transfer chamber (the first transfer chamber 33 , the second transfer chamber 53 ), the transfer robot (the first transfer robot 32 , the second transfer robot 52 ) can continue the transfer operation. When it is recognized that the operator is in the transport chamber, the operating range H1 and H2 of the transport robot and the area R1 of the operator are identified, and the transport robot is controlled so as to avoid the operator and move. The transfer robot continues the transfer operation of the substrate W while avoiding contact with the operator performing the maintenance work. Even without stopping the transfer operation by stopping the power supply of the transfer robot or the substrate processing apparatus 10 , the operator and the transfer robot can share the transfer room and perform their respective operations (implementation of collaborative work). Therefore, even when an operator enters the transfer chamber, the transfer robot can continue the transfer operation without stopping the substrate transfer, and the substrate processing apparatus 10 can continue the substrate processing. Thereby, it is possible to suppress the substrate processing from being stopped due to maintenance work, and to suppress a decrease in productivity. Furthermore, since the transfer robot continues the transfer operation even if the maintenance operation is prolonged, the substrate processing apparatus 10 can continue processing the substrate, thereby suppressing a decrease in productivity.

而且,第一搬送機器人32藉由迴旋台32a自第一移動機構31的正上方偏移,第一搬送室33的大致一半的區域(第一搬送室33中第二搬送室53側的區域)成為第一搬送機器人32的動作範圍外。因此,人可在第一搬送機器人32的動作範圍外步行移動,與第一搬送機器人32位於第一移動機構31的正上方的情況(人進入第一搬送機器人32的動作範圍內而移動的情況)相比,可抑制與第一搬送機器人32接觸。因此,藉由在第一搬送機器人32與第一移動機構31之間追加迴旋台32a,從而第一搬送機器人32自第一移動機構31的正上方偏移,可設置不與人干擾的空間,即便人因維護作業等而進入第一搬送室33內,第一搬送機器人32也可繼續進行基板搬送。Furthermore, since the first transfer robot 32 is shifted from directly above the first moving mechanism 31 by the swivel table 32a, approximately half of the first transfer chamber 33 (the area on the second transfer chamber 53 side of the first transfer chamber 33 ) It becomes out of the movement range of the 1st transfer robot 32. Therefore, a person can move on foot outside the operating range of the first transfer robot 32, which is different from the case where the first transfer robot 32 is located directly above the first moving mechanism 31 (the situation in which the person enters the operating range of the first transfer robot 32 and moves) ), contact with the first transfer robot 32 can be suppressed. Therefore, by adding a swivel table 32a between the first transfer robot 32 and the first moving mechanism 31, the first transfer robot 32 is offset from directly above the first moving mechanism 31, and a space that does not interfere with people can be provided. Even if a person enters the first transfer chamber 33 due to maintenance work, etc., the first transfer robot 32 can continue to transfer the substrate.

進而,在作業者需要對多個處理室61中的特定的處理室61長時間進行維護作業的情況下,也可不停止基板處理裝置10而繼續進行基板處理或基板搬送,同時作業者在第二搬送室53內進行維護作業。而且,作業者可在第二搬送室53內進行維護作業,因而可省略有時設於與第二搬送室53側相反的一側、也就是搬送室外的維護空間(用於作業者從基板處理裝置10的裝置外到達處理室61內的空間)。由此,可削減裝置外的維護區域,因而可提高維持費用昂貴的潔淨室的空間利用效率。即,也無需擴大採取基板處理裝置10的裝置外的區域作為維護空間,因而即便在潔淨室設置多台基板處理裝置10的情況下,也可使這些基板處理裝置10的裝置間隔變窄,可有效利用潔淨室。而且,只要可在維持了基板搬送所需要的潔淨度的搬送室內進行維護作業,則也有可能可使裝置外的空間的潔淨度較現狀更低,可減輕維持潔淨室的潔淨度的維持品。而且,從灰塵的影響少的搬送室側進行維護作業,因而也可縮短處理室解放後的潔淨度恢復所耗的時間,可抑制生產性的降低。Furthermore, when the operator needs to perform maintenance work on a specific processing chamber 61 among the plurality of processing chambers 61 for a long time, the substrate processing or substrate transfer can be continued without stopping the substrate processing apparatus 10. Maintenance work is performed in the transfer chamber 53 . Moreover, the operator can perform maintenance work in the second transfer chamber 53, so it is possible to omit the maintenance space sometimes provided on the side opposite to the second transfer chamber 53, that is, outside the transfer chamber (for the operator to process the substrate from the substrate). The outside of the device 10 reaches the space inside the processing chamber 61). Thereby, the maintenance area outside the apparatus can be reduced, and thus the space utilization efficiency of the clean room, which is expensive to maintain, can be improved. That is, there is no need to expand the area outside the substrate processing apparatus 10 as a maintenance space. Therefore, even when a plurality of substrate processing apparatuses 10 are installed in a clean room, the interval between these substrate processing apparatuses 10 can be narrowed, enabling Effective use of cleanrooms. Furthermore, as long as the maintenance work can be performed in the transfer room where the cleanliness required for substrate transfer can be maintained, the cleanliness of the space outside the device may be lower than the current situation, and the maintenance materials for maintaining the cleanliness of the clean room can be reduced. In addition, since the maintenance work is performed from the side of the transfer chamber where the influence of dust is less, the time taken to restore the cleanliness of the processing chamber after release can also be shortened, and a decrease in productivity can be suppressed.

而且,除了基於機械性位置資訊(例如來自編碼器的位置資訊)來控制第一搬送機器人32及第二搬送機器人52以外,還基於識別部73根據由各攝像部33b、攝像部53b所得的圖像資訊而生成的位置資訊來進行控制,由此可進行更準確的位置控制,能可靠地監測第一搬送機器人32及第二搬送機器人52。而且,可掌握實際的第一搬送機器人32及第二搬送機器人52的位置,與僅利用機械性位置資訊來進行控制相比,可提高安全性。而且,除了基於機械性位置資訊(例如來自編碼器的位置資訊)來控制第一搬送機器人32及第二搬送機器人52以外,還基於識別部73根據由各攝像部33b、攝像部53b所得的圖像資訊而生成的位置資訊來進行控制,由此可進行更準確的位置控制,能可靠地監測第一搬送機器人32及第二搬送機器人52。而且,可掌握實際的第一搬送機器人32及第二搬送機器人52的位置,與僅利用機械性位置資訊來進行控制相比,可提高安全性。In addition, in addition to controlling the first transfer robot 32 and the second transfer robot 52 based on mechanical position information (for example, position information from an encoder), the recognition unit 73 also uses images obtained by the respective imaging units 33b and 53b. By controlling the position information generated from the information, more accurate position control can be performed, and the first transfer robot 32 and the second transfer robot 52 can be reliably monitored. Furthermore, the actual positions of the first transfer robot 32 and the second transfer robot 52 can be grasped, and safety can be improved compared to control using only mechanical position information. In addition, in addition to controlling the first transfer robot 32 and the second transfer robot 52 based on mechanical position information (for example, position information from an encoder), the recognition unit 73 also uses images obtained by the respective imaging units 33b and 53b. By controlling the position information generated from the information, more accurate position control can be performed, and the first transfer robot 32 and the second transfer robot 52 can be reliably monitored. Furthermore, the actual positions of the first transfer robot 32 and the second transfer robot 52 can be grasped, and safety can be improved compared to control using only mechanical position information.

如以上所說明,根據第一實施方式,檢測搬送室(第一搬送室33、第二搬送室53)內的人的位置並進行識別,設定包含所識別的人的位置的區域R1,對應於人的移動而使所設定的區域R1移動,以搬送機器人(第一搬送機器人32、第二搬送機器人52)避開移動的區域R1而搬送基板W的方式,來控制搬送機器人及移動機構(第一移動機構31、第二移動機構51)的動作。由此,即便在作業者進入搬送室內的情況下,搬送機器人也可不停止基板搬送而繼續進行搬送作業,基板處理裝置10可繼續進行基板處理。由此,可抑制基板處理因維護作業而停止,抑制生產性的降低。而且,即便維護作業延長,搬送機器人也繼續進行搬送作業,因而基板處理裝置10可繼續進行基板處理,可抑制生產性的降低。As described above, according to the first embodiment, the position of a person in the transfer chamber (the first transfer chamber 33 and the second transfer chamber 53 ) is detected and recognized, and the region R1 including the recognized position of the person is set to correspond to The movement of the person moves the set region R1, and the transfer robot (the first transfer robot 32, the second transfer robot 52) avoids the moving region R1 and transfers the substrate W, so that the transfer robot and the moving mechanism (the first transfer robot 32 and the second transfer robot 52) are controlled. a moving mechanism 31 and a second moving mechanism 51). Accordingly, even when an operator enters the transfer chamber, the transfer robot can continue the transfer operation without stopping the substrate transfer, and the substrate processing apparatus 10 can continue the substrate processing. Thereby, it is possible to suppress the substrate processing from being stopped due to maintenance work, and to suppress a decrease in productivity. Furthermore, since the transfer robot continues the transfer operation even if the maintenance operation is prolonged, the substrate processing apparatus 10 can continue processing the substrate, thereby suppressing a decrease in productivity.

<第二實施方式> 參照圖6及圖7對第二實施方式進行說明。另外,第二實施方式中,對與第一實施方式的不同點(輸入部及設定部)進行說明,省略其他說明。<Second Embodiment> A second embodiment will be described with reference to FIGS. 6 and 7 . In addition, in the second embodiment, differences from the first embodiment (input unit and setting unit) will be described, and other descriptions will be omitted.

如圖6所示,在第二實施方式的第一搬送室33,設有輸入部33c。輸入部33c配置於第一搬送室33的出入口33a的附近,受理來自人(例如作業者)的輸入操作。作為輸入部33c,例如可使用開關或按鈕、觸控式螢幕等。輸入部33c電連接於網域控制器72c,若受理來自人的輸入操作,則將輸入信號送至區域控制器72c(參照圖3)。例如,若作業者操作輸入部33c而指示維護物件的處理室61,則表示維護物件的處理室61的輸入資訊作為輸入信號輸入至區域控制器72c。As shown in FIG. 6, in the 1st transfer chamber 33 of 2nd Embodiment, the input part 33c is provided. The input unit 33c is arranged near the entrance/exit 33a of the first transfer chamber 33, and accepts an input operation from a person (for example, an operator). As the input part 33c, a switch, a button, a touch panel, etc. can be used, for example. The input unit 33c is electrically connected to the domain controller 72c, and upon receiving an input operation from a human, sends an input signal to the domain controller 72c (see FIG. 3 ). For example, when the operator operates the input unit 33c and instructs to maintain the processing chamber 61 of the object, input information representing the processing chamber 61 of the maintenance object is input to the zone controller 72c as an input signal.

區域控制器72c的設定部74基於從輸入部33c輸入的輸入資訊,在由所述輸入資訊所示的處理室61的前面,設定用於人進行作業的作業區域R2,將與所設定的作業區域R2相關的作業區域資訊記憶於記憶部72b。例如,若人操作輸入部33c將圖6中的A2的處理室61指定為維護物件的處理室,則在所指定的維護物件的處理室61的前面設定作業區域R2。所謂作業區域R2,例如為所檢測到的人可在處理室61的前面對維護物件的處理室61安全地進行維護作業的、所需尺寸的長方體形狀的空間區域。作業區域R2是在維護物件的處理室61的前面由空間座標設定。另外,作業者為了設定作業區域R2而輸入的資訊只要為可確定作業者進行作業的區域的資訊即可,不限定於指定維護物件的處理室61的資訊。例如,若為表示作業者可進入的裝置內的任一場所的資訊,則可設為輸入資訊。因此,可將指定作業區域R2本身的資訊設為輸入資訊,也可將表示搬送區域內的任一場所的資訊設為輸入資訊。而且,作業區域R2是與區域R1分別設定。The setting unit 74 of the area controller 72c sets a work area R2 for people to work on in front of the processing chamber 61 indicated by the input information based on the input information input from the input unit 33c, and compares the set work area R2 with the set work area. The work area information related to the area R2 is stored in the storage unit 72b. For example, when the human operation input unit 33c designates the processing chamber 61 at A2 in FIG. 6 as the processing chamber for the maintenance object, the working area R2 is set in front of the designated processing chamber 61 for the maintenance object. The work area R2 is, for example, a cuboid-shaped spatial area of a desired size in which a detected person can safely perform maintenance work on the maintenance object in front of the treatment chamber 61 . The work area R2 is set by spatial coordinates in front of the processing chamber 61 for maintaining objects. In addition, the information input by the operator to set the work area R2 is not limited to information specifying the processing chamber 61 of the maintenance object as long as the area where the operator works can be specified. For example, if it is information indicating any place in the device that an operator can enter, it can be set as input information. Therefore, information specifying the work area R2 itself may be used as input information, or information indicating any place in the transfer area may be used as input information. Furthermore, the work area R2 is set separately from the area R1.

維護作業中,在作業者對圖6中的A2的處理室61進行維護作業的情況下,作業者從第一搬送室33的出入口33a進入第一搬送室33,操作輸入部33c,將圖6中的A2的處理室61指定為維護物件。接下來,作業者從第一搬送室33的出入口33a的附近移動至緩衝單元40的附近,從緩衝單元40的附近進入第二搬送室53,移動至正對A2的處理室61的位置。接下來,作業者對A2的處理室61內的各部進行維護作業,若維護作業完成,則在方才從第一搬送室33的出入口33a移動至正對A2的處理室61的位置的路徑中反向移動,從第一搬送室33的出入口33a退出。In the maintenance work, when the operator performs maintenance work on the processing chamber 61 of A2 in FIG. The processing chamber 61 of A2 in is designated as a maintenance object. Next, the operator moves from the vicinity of the entrance 33a of the first transfer chamber 33 to the vicinity of the buffer unit 40, enters the second transfer chamber 53 from the vicinity of the buffer unit 40, and moves to a position facing the processing chamber 61 of A2. Next, the operator performs maintenance work on each part in the processing chamber 61 of A2. If the maintenance work is completed, the operator will reverse the process in the path that has just moved from the entrance and exit 33a of the first transfer chamber 33 to the position facing the processing chamber 61 of A2. to move to and exit from the entrance/exit 33a of the first transfer chamber 33 .

若由作業者操作輸入部33c而指定圖6中的A2的處理室61為維護物件,則表示維護物件為A2的處理室61的輸入資訊發送至區域控制器72c。基於所發送的輸入資訊,而由設定部74在A2的處理室61的前面設定作業區域R2。其他處理與第一實施方式相同,但機器人控制器72d基於與所設定的作業區域R2相關的作業區域資訊,以第二搬送機器人52避開區域R1及作業區域R2搬送基板W的方式,來控制第二搬送機器人52及第二移動機構51。If the processing chamber 61 of A2 in FIG. 6 is designated as a maintenance object by the operator operating the input unit 33c, input information indicating that the maintenance object is the processing chamber 61 of A2 is sent to the zone controller 72c. Based on the transmitted input information, the setting unit 74 sets the work area R2 in front of the processing chamber 61 of A2. Other processes are the same as those in the first embodiment, but the robot controller 72d controls the second transfer robot 52 to transfer the substrate W avoiding the regions R1 and R2 based on the work region information related to the set work region R2. The second transfer robot 52 and the second moving mechanism 51 .

基板搬送中,作業者可不干擾第一搬送機器人32及第二搬送機器人52而移動至圖6中的A2的處理室61的前面,可到達A2的處理室61並進行對所述A2的處理室61的維護作業。即,與第一實施方式同樣地,即便作業者進入搬送室(第一搬送室33、第二搬送室53),搬送機器人(第一搬送機器人32、第二搬送機器人52)也可繼續進行搬送動作。因此,可抑制基板處理因維護作業而停止,抑制生產性的降低。而且,即便維護作業延長,搬送機器人也繼續進行搬送作業,因而基板處理裝置10可繼續進行基板處理,可抑制生產性的降低。而且,在成為維護對象的處理室61的前面設定作業區域R2。由此,第二搬送機器人52避開作業區域R2而移動,因而能可靠地抑制在維護作業中第二搬送機器人52接觸作業者,作業者可更安全地進行維護作業。During the substrate transfer, the operator can move to the front of the processing chamber 61 of A2 in FIG. 61 maintenance operations. That is, similarly to the first embodiment, even if an operator enters the transfer chamber (the first transfer chamber 33, the second transfer chamber 53), the transfer robot (the first transfer robot 32, the second transfer robot 52) can continue the transfer. action. Therefore, it is possible to suppress the substrate processing from being stopped due to maintenance work, and to suppress a decrease in productivity. Furthermore, since the transfer robot continues the transfer operation even if the maintenance operation is prolonged, the substrate processing apparatus 10 can continue processing the substrate, thereby suppressing a decrease in productivity. Further, a work area R2 is set in front of the processing chamber 61 to be maintained. As a result, the second transfer robot 52 moves away from the work area R2, so that the second transfer robot 52 can be reliably prevented from contacting the operator during the maintenance work, and the operator can perform the maintenance work more safely.

另外,也可如圖7所示,由分隔構件R2a包圍作業區域R2。作為分隔構件R2a,例如可使用簾幕。在使用此簾幕的情況下,針對每個處理室61在位於其前面的作業區域R2的頂棚部分設置簾幕軌道。作業者移動至作業區域R2後,在作業區域R2設置分隔構件R2a(例如將簾幕安裝於簾幕軌道),由分隔構件R2a包圍作業區域R2。而且,若設為閘門等,則可成為防護壁。由此,可將處理室61內及作業區域R2內與第二搬送室53(搬送區域)內區分,抑制污染從處理室61內及作業區域R2內向第二搬送室53內擴展,因而可抑制作業員的維護作業導致灰塵向周圍擴散。In addition, as shown in FIG. 7, the working area R2 may be surrounded by the partition member R2a. As the partition member R2a, for example, a curtain can be used. In the case of using this curtain, a curtain rail is provided on the ceiling portion of the work area R2 located in front of each processing chamber 61 . After the worker moves to the work area R2, the partition member R2a is installed in the work area R2 (for example, a curtain is attached to a curtain rail), and the work area R2 is surrounded by the partition member R2a. Moreover, if it is set as a gate etc., it can become a protective wall. Thus, the inside of the processing chamber 61 and the operation area R2 can be distinguished from the second transfer chamber 53 (transfer area), and the spread of contamination from the processing chamber 61 and the operation area R2 to the second transfer chamber 53 can be suppressed. The operator's maintenance work causes dust to spread around.

如以上所說明,根據第二實施方式,可獲得與第一實施方式相同的效果。而且,藉由在成為維護對象的處理室61的前面設定作業區域R2,從而第二搬送機器人52避開作業區域R2而移動。由此,能可靠地抑制第二搬送機器人52在維護作業中接觸作業者,因而作業者可更安全地進行維護作業。As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained. And by setting the work area R2 in front of the processing chamber 61 used as maintenance object, the 2nd transfer robot 52 avoids the work area R2 and moves. This can reliably prevent the second transfer robot 52 from coming into contact with the operator during the maintenance work, so that the operator can perform the maintenance work more safely.

<其他實施方式> 上文所述的說明中,例示了關於第一搬送機器人32的移動而使用一軸的第一移動機構31及迴旋台32a,而且,關於第二搬送機器人52的移動而使用一軸的第二移動機構51及迴旋台52a,但不限於此,例如,也可設置支撐第一搬送機器人32或第二搬送機器人52的移動台及二軸的移動機構,利用二軸的移動機構使所述移動台沿在平面內正交的兩個方向(例如X方向及Y方向)移動。第一搬送機器人32或第二搬送機器人52可藉由二軸的移動機構沿兩個方向同時移動,能以最短路徑搬送基板W。<Other Embodiments> In the above description, it was exemplified that the first moving mechanism 31 and the swivel table 32a with one axis are used for the movement of the first transport robot 32, and the second moving mechanism with one axis is used for the movement of the second transport robot 52. 51 and the swivel table 52a, but not limited thereto, for example, a moving table and a two-axis moving mechanism supporting the first transfer robot 32 or the second transfer robot 52 may also be provided, and the two-axis moving mechanism is used to make the moving table move along the Move in two orthogonal directions (such as X direction and Y direction) in the plane. The first transfer robot 32 or the second transfer robot 52 can simultaneously move in two directions through a two-axis moving mechanism, and can transfer the substrate W by the shortest path.

而且,上文所述的說明中,例示了使用攝像部33b、攝像部53b作為把握人的有無或位置的部件,但不限於此,例如也可使用利用超聲波或光的距離感測器、確認地面的腳位置的踩墊開關(接觸感測器、重量感測器、應變感測器等)、熱攝像機、聲響(引起注意的聲音)等。Moreover, in the above-mentioned description, the use of the imaging unit 33b and the imaging unit 53b was exemplified as a component for grasping the presence or position of a person, but it is not limited thereto. Foot pad switches on the ground (contact sensor, weight sensor, strain sensor, etc.), thermal camera, sound (sound for attention), etc.

進而,作為這種部件,也可使用發射電波的發射器。人持有此發射器或將此發射器佩戴在身上,識別部(檢測部)73基於發射的電波來識別(檢測)人的位置。由此,設定以發射器為中心的規定區域、也就是包含人的位置的區域R1。例如,預先設置於基板處理裝置10內且註冊了位置資訊的接收器接收從發射器發射的電波。由此,識別部73可將來自發射器的電波強度最強的接收器的位置設為人的位置,基於多個接收器所接收的電波強度藉由運算求出人的位置。更具體而言,可將行動電話、智慧型電話、可穿戴設備、平板終端、身份證明(identification,ID)卡等資訊通信終端作為發射器,將接收從發射器發射的信標(beacon)的接入點(access point)、路由器等終端作為接收器。Furthermore, as such a member, a transmitter that emits radio waves can also be used. A person holds or wears this transmitter, and the recognition unit (detection unit) 73 recognizes (detects) the position of the person based on the emitted radio waves. Thus, a predetermined area centered on the transmitter, that is, an area R1 including the position of the person is set. For example, a receiver installed in advance in the substrate processing apparatus 10 and registered with location information receives radio waves transmitted from the transmitter. Thus, the recognition unit 73 can set the position of the receiver with the strongest radio wave intensity from the transmitter as the person's position, and calculate the person's position based on the radio wave intensities received by the plurality of receivers. More specifically, an information communication terminal such as a mobile phone, a smart phone, a wearable device, a tablet terminal, and an identification (ID) card can be used as a transmitter, and the signal of a beacon (beacon) transmitted from the transmitter can be received. Terminals such as access points and routers serve as receivers.

而且,上文所述的說明中,例示了使用圓柱形狀的空間區域作為區域R1,但不限於此,例如也可使用作為可至少包含所檢測到的人的所需尺寸的、長方體形狀的空間區域或紡錘體形狀的空間區域、人型的空間區域。而且,例示了使用長方體形狀的空間區域作為作業區域R2,但不限於此,例如也可使用作為可在作業中也包含所檢測到的人的所需尺寸的、圓柱形狀的空間區域或紡錘體形狀的空間區域。當區域R1與作業區域R2重疊時,可使任一者具有優先順序。例如,可使區域R1與作業區域R2中任一較大區域優先。而且,在人走出作業區域R2的情況下,也可由攝像部33b、攝像部53b識別作業者並立即設定為區域R1,以第一搬送機器人32、第二搬送機器人52避開所述設定的區域R1的方式控制。Moreover, in the above-mentioned description, it was exemplified that a cylindrical space region is used as the region R1, but it is not limited thereto. For example, a rectangular parallelepiped space of a required size that can contain at least a detected person may also be used. Area or spindle-shaped space area, human-shaped space area. In addition, the use of a cuboid-shaped space area as the work area R2 was exemplified, but it is not limited thereto. For example, a cylindrical-shaped space area or a spindle of a required size that can also include detected people during work may also be used. The spatial region of the shape. When the area R1 overlaps with the work area R2, either one may be prioritized. For example, a larger one of the area R1 and the work area R2 may be prioritized. Moreover, when a person walks out of the operation area R2, the operator can be recognized by the imaging unit 33b and the imaging unit 53b and immediately set as the area R1, and the first transport robot 32 and the second transport robot 52 avoid the set area. R1 way control.

而且,上文所述的說明中,例示了由一人進行維護作業,但不限於此,例如也可由多人進行維護作業。在由多人進行維護作業的情況下,針對每個人設定區域R1,第一搬送機器人32或第二搬送機器人52避開針對每個人設定的區域R1(多個區域R1)而搬送基板W。Moreover, in the above-mentioned description, it was exemplified that one person performs the maintenance work, but the present invention is not limited thereto, and for example, a plurality of persons may perform the maintenance work. When maintenance work is performed by multiple persons, a region R1 is set for each person, and the first transfer robot 32 or the second transfer robot 52 transfers the substrate W avoiding the region R1 (regions R1 ) set for each person.

而且,上文所述的說明中,例示了基於第一搬送機器人32或第二搬送機器人52與區域R1的間隔距離而降低第一搬送機器人32或第二搬送機器人52的移動速度,但不限於此,例如在作業者移動的情況下,也可降低第一搬送機器人32或第二搬送機器人52的移動速度。而且,也可根據作業者的移動速度來變更第一搬送機器人32或第二搬送機器人52的移動速度。例如,機器人控制器72d若作業者的移動速度提高,則降低第一搬送機器人32或第二搬送機器人52的移動速度,反之若作業者的移動速度降低,則提高第一搬送機器人32或第二搬送機器人52的移動速度。另外,追隨部75對應於人的移動而變更記憶於記憶部72b的資訊中區域R1的位置資訊,但也可根據所述區域R1的位置資訊的變化而求出作業者的移動速度。Moreover, in the above description, it was exemplified that the moving speed of the first transfer robot 32 or the second transfer robot 52 is reduced based on the distance between the first transfer robot 32 or the second transfer robot 52 and the region R1, but it is not limited to Here, for example, when the operator moves, the moving speed of the first transfer robot 32 or the second transfer robot 52 can also be reduced. Furthermore, the moving speed of the first transfer robot 32 or the second transfer robot 52 may be changed according to the moving speed of the worker. For example, if the moving speed of the operator increases, the robot controller 72d decreases the moving speed of the first transfer robot 32 or the second transfer robot 52, and vice versa if the moving speed of the operator decreases, then increases the speed of the first transfer robot 32 or the second transfer robot. The moving speed of the transfer robot 52. In addition, the tracking unit 75 changes the position information of the area R1 among the information stored in the memory unit 72b in accordance with the movement of the person, but may also obtain the moving speed of the operator based on the change of the position information of the area R1.

而且,上文所述的說明中,例示了在第一搬送機器人32或第二搬送機器人52向作業者靠近的情況下降低移動速度,但不限於此,例如也可設為即便在第一搬送機器人32或第二搬送機器人52向作業者靠近的情況下,也不降低移動速度,而且,也可設為在第一搬送機器人32或第二搬送機器人52自作業者遠離的情況下降低移動速度。而且,上文所述的說明中,以第一搬送機器人32及第二搬送機器人52搬送基板W的搬送路徑成為最短距離的方式來選擇搬送路徑,但也可根據與區域R1的間隔距離而優先選擇低速移動的距離短的搬送路徑。由此,縮短基板搬送時間。Moreover, in the above-mentioned description, it was exemplified that the moving speed is reduced when the first transport robot 32 or the second transport robot 52 approaches the operator, but it is not limited thereto. When the robot 32 or the second transfer robot 52 approaches the operator, the moving speed is not reduced, and the moving speed may be reduced when the first transfer robot 32 or the second transfer robot 52 moves away from the operator. In addition, in the above description, the transport route is selected so that the transport route for the first transport robot 32 and the second transport robot 52 transports the substrate W becomes the shortest distance, but it may be prioritized according to the distance from the region R1. Select a conveyance path with low speed and short distance. Thereby, the board|substrate transfer time is shortened.

而且,上文所述的說明中,例示了在維護物件的處理室61的前面設定作業區域R2(參照圖6或圖7),但不限於此,也可除了作業區域R2以外,還由設定部74設定用於由識別部73所檢測的作業者(從第一搬送室33的出入口33a進入第一搬送室33的作業者)從第一搬送室33的出入口33a移動至作業區域R2的移動區域(未圖示)。所謂移動區域,為作業者可進入搬送室且不與第一搬送機器人32及第二搬送機器人52接觸而移動至作業區域R2的、所需尺寸的空間區域。機器人控制器72d以第一搬送機器人32或第二搬送機器人52避開作業區域R2及移動區域而搬送基板W的方式,來控制第一移動機構31、第一搬送機器人32、第二移動機構51、第二搬送機器人52等的動作。所述處理中,也可不執行區域R1的設定或追隨等處理。然後,在由識別部73檢測到作業者移動並在作業區域R2內的情況下,設定部74刪除移動區域。在作業者在作業區域R2內進行作業的情況下,機器人控制器72d以第一搬送機器人32或第二搬送機器人52僅避開作業區域R2而搬送基板W的方式,來控制第一移動機構31、第一搬送機器人32、第二移動機構51、第二搬送機器人52等的動作。Moreover, in the description above, it was exemplified that the working area R2 was set in front of the processing chamber 61 of the maintenance object (refer to FIG. 6 or FIG. 7 ), but it is not limited to this, and it may also be set by setting The part 74 is set for the movement of the worker detected by the recognition part 73 (the worker entering the first transfer chamber 33 from the entrance 33 a of the first transfer chamber 33 ) from the entrance 33 a of the first transfer chamber 33 to the work area R2 . area (not shown). The movement area is a space area of a desired size in which an operator can enter the transfer room and move to the work area R2 without contacting the first transfer robot 32 and the second transfer robot 52 . The robot controller 72d controls the first moving mechanism 31, the first transferring robot 32, and the second moving mechanism 51 so that the first transferring robot 32 or the second transferring robot 52 transfers the substrate W while avoiding the work area R2 and the moving area. , the actions of the second transfer robot 52 and the like. In the processing described above, processing such as setting and tracking of the region R1 may not be performed. Then, when the recognition unit 73 detects that the operator has moved and is within the work area R2, the setting unit 74 deletes the movement area. When the operator performs work in the work area R2, the robot controller 72d controls the first moving mechanism 31 so that the first transport robot 32 or the second transport robot 52 transports the substrate W while avoiding the work area R2. , the actions of the first transfer robot 32, the second moving mechanism 51, the second transfer robot 52, and the like.

而且,上文所述的說明中,例示了對基板W進行兩種處理,但不限於此,例如也可進行一種處理,而且也可進行三種處理。在對基板W進行一種處理的情況下,第二搬送機器人52以緩衝單元40、處理室61、緩衝單元40的順序搬送基板W。在對基板W進行三種處理的情況下,第二搬送機器人52以緩衝單元40、第一處理室61、第二處理室61、第三處理室61、緩衝單元40的順序搬送基板W。即,成為以處理1→處理2→處理3的順序進行處理後,使處理完畢的基板返回緩衝單元40的作業。例如,將進行處理1的第一處理室61的個數設為兩個,將進行處理2的第二處理室61的個數設為四個,將進行處理3的第三處理室61設為兩個,其原因在於,設想處理2與處理1或處理3相比需要兩倍的時間,而成倍地設定台數。In addition, in the above description, two kinds of treatments were performed on the substrate W as examples, but the present invention is not limited thereto. For example, one kind of treatment may be performed, and three kinds of treatments may be performed. When one type of processing is performed on the substrate W, the second transfer robot 52 transfers the substrate W in the order of the buffer unit 40 , the processing chamber 61 , and the buffer unit 40 . When three types of processing are performed on the substrate W, the second transfer robot 52 transfers the substrate W in the order of the buffer unit 40 , the first processing chamber 61 , the second processing chamber 61 , the third processing chamber 61 , and the buffer unit 40 . That is, it becomes an operation of returning the processed substrate to the buffer unit 40 after processing in the order of processing 1 → processing 2 → processing 3 . For example, the number of the first processing chamber 61 for processing 1 is two, the number of second processing chamber 61 for processing 2 is four, and the third processing chamber 61 for processing 3 is Two, the reason is that the number of sets is doubled assuming that processing 2 takes twice as long as processing 1 or 3 .

另外,藉由利用攝像部33b、攝像部53b的感測器檢測到作業者在機器人的動作範圍H1、動作範圍H2內從而限制機器人動作,但將作業者從出入口33a、出入口53a的門進入、退出設為基本動作。因此,在發生了作業者並未出入門而出現在機器人的動作範圍、或從動作範圍消失的事情的情況下,也可視為作業者的異常動作、或感測器的異常,藉由警告(warning)或警報(alarm)來確認作業者的動作。In addition, by using the sensors of the imaging unit 33b and the imaging unit 53b to detect that the operator is within the operating range H1 and H2 of the robot, the movement of the robot is restricted. Exit is set as the basic action. Therefore, even when an operator appears in or disappears from the operating range of the robot without entering or exiting the door, it can be regarded as an abnormal operation of the operator or an abnormality of the sensor, and the warning ( warning) or alarm (alarm) to confirm the operator's action.

而且,在兩處利用攝像機進行拍攝,且兩處的攝像機均未識別出作業者的情況下,也可視為攝像機異常,暫且停止也就是暫時停止搬送機器人的動作。Moreover, if two cameras are used to take pictures, and neither of the two cameras recognizes the operator, it can also be considered that the cameras are abnormal, and temporarily stopping means temporarily stopping the movement of the transfer robot.

而且,在使用多個感測器且任一感測器識別出作業者的情況下,也可暫且停止搬送機器人的動作,或不使維護作業模式回到通常作業模式。Furthermore, when a plurality of sensors are used and an operator is recognized by any one of the sensors, the operation of the transfer robot may be temporarily stopped, or the maintenance work mode may not be returned to the normal work mode.

而且,也可將搬送機器人的動作暫時停止顯示於作業者持有的終端等的操作畫面。而且,攝像機的異常等停止的原因也可顯示於終端。這種情況下,若作業者可離開裝置而確保安全,則也可藉由從終端輸入解除暫時停止的指示,而使搬送機器人開始動作。而且,在作業者在裝置內移動的情況等下,也可藉由不從終端輸入解除暫時停止的指示,從而繼續停止以確保安全。Furthermore, the operation of the transfer robot may be temporarily stopped and displayed on an operation screen such as a terminal held by the operator. In addition, the cause of stop such as abnormality of the camera can also be displayed on the terminal. In this case, if the operator can leave the device and ensure safety, the transfer robot can be started to operate by inputting an instruction to cancel the temporary stop from the terminal. Furthermore, in the case where an operator moves within the device, it is also possible to ensure safety by continuing to stop without inputting an instruction to cancel the temporary stop from the terminal.

而且,視作業者的活動不同,有時產生搬送機器人無法避開作業者而無法繼續進行機器人的動作的狀態。也可藉由預先設定這樣無法繼續進行動作的狀態的圖案,從而在機器人暫且停止動作後,只要相當於預先設定的圖案的狀態不消除,則機器人不開始動作。Furthermore, depending on the activities of the operator, there may be a state where the transfer robot cannot avoid the operator and cannot continue the operation of the robot. It is also possible to pre-set the pattern of such a state that cannot continue to move, so that after the robot temporarily stops moving, as long as the state corresponding to the preset pattern is not eliminated, the robot will not start to move.

以上,對本發明的若干實施方式進行了說明,但這些實施方式是作為示例而提示,並非意指限定發明的範圍。這些新穎的實施方式能以其他各種實施方式實施,可在不偏離發明的主旨的範圍內進行各種省略、替換、變更。這些實施方式或其變形包含於發明的範圍或主旨,並且包含於權利要求書所記載的發明及其均等範圍。Some embodiments of the present invention have been described above, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various embodiments, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope or gist of the invention, and are included in the invention described in the claims and their equivalents.

10:基板處理裝置 20:開閉單元 30:第一搬送單元 31:第一移動機構 32:第一搬送機器人 32a:迴旋台 32b:迴旋軸 33:第一搬送室 33a:出入口 33b:攝像部 33c:輸入部 40:緩衝單元 50:第二搬送單元 51:第二移動機構 52:第二搬送機器人 52a:迴旋台 52b:迴旋軸 53:第二搬送室 53a:出入口 53b:攝像部 60:基板處理單元 61:處理室 70:裝置附帶單元 71:液供給單元 72:控制單元 72a:電腦 72b:記憶部 72c:區域控制器 72d:機器人控制器(控制部) 73:識別部(檢測部) 74:設定部 75:追隨部 H1:動作範圍(移動範圍) H2:動作範圍 R1:區域 R2:作業區域 R2a:分隔構件 W:基板10: Substrate processing device 20:Switching unit 30: The first transfer unit 31: The first mobile mechanism 32: The first transfer robot 32a: Turntable 32b: rotary axis 33: The first transfer room 33a: entrance and exit 33b: Camera department 33c: input part 40: buffer unit 50: The second transfer unit 51: Second mobile mechanism 52: Second transfer robot 52a: Turntable 52b: rotary axis 53: The second transfer room 53a: entrance and exit 53b: Camera Department 60: Substrate processing unit 61: Processing room 70: Unit attached to the device 71: Liquid supply unit 72: Control unit 72a: Computer 72b: memory department 72c: Zone Controller 72d: Robot controller (control department) 73: Recognition Department (Detection Department) 74: Setting department 75: Follow Ministry H1: Action range (moving range) H2: Action range R1: Region R2: operating area R2a: Separation member W: Substrate

圖1為表示第一實施方式的基板處理裝置的概略結構的圖。 圖2為用於說明第一實施方式的搬送機器人的動作範圍的圖。 圖3為表示第一實施方式的控制單元的概略結構的圖。 圖4為用於說明第一實施方式的搬送機器人的動作範圍調整的第一圖。 圖5為用於說明第一實施方式的搬送機器人的動作範圍調整的第二圖。 圖6為用於說明第二實施方式的搬送機器人的動作範圍調整的圖。 圖7為用於說明第二實施方式的分隔構件的圖。FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to a first embodiment. FIG. 2 is a diagram for explaining the operating range of the transfer robot according to the first embodiment. Fig. 3 is a diagram showing a schematic configuration of a control unit according to the first embodiment. Fig. 4 is a first diagram for explaining the adjustment of the operating range of the transfer robot according to the first embodiment. FIG. 5 is a second diagram for explaining the adjustment of the operating range of the transfer robot according to the first embodiment. FIG. 6 is a diagram for explaining the adjustment of the motion range of the transfer robot according to the second embodiment. FIG. 7 is a diagram for explaining a partition member of the second embodiment.

72:控制單元72: Control unit

72a:電腦72a: Computer

72b:記憶部72b: memory department

72c:區網控制器72c: Area network controller

72d:機器人控制器72d: Robot controller

73:識別部73: Identification Department

74:設定部74: Setting department

75:追隨部75: Follow Ministry

Claims (10)

一種基板處理裝置,包括: 搬送機器人,設於搬送室內,搬送基板; 移動機構,設於所述搬送室內,使所述搬送機器人移動; 檢測部,檢測所述搬送室內的人的位置; 設定部,設定包含由所述檢測部所檢測到的所述人的位置的區域; 追隨部,對應於所述人的移動而使由所述設定部所設定的所述區域移動;以及 控制部,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。A substrate processing device, comprising: The transfer robot is installed in the transfer room to transfer the substrate; A moving mechanism is installed in the transfer chamber to move the transfer robot; a detection unit that detects the position of a person in the transfer chamber; a setting unit that sets an area including the position of the person detected by the detection unit; a following unit that moves the area set by the setting unit in response to movement of the person; and The control unit controls the transfer robot and the moving mechanism so that the transfer robot avoids the area moved by the follower and transfers the substrate. 如請求項1所述的基板處理裝置,其中 所述控制部識別所述搬送機器人的動作範圍,使所識別的所述搬送機器人的動作範圍以不接觸由所述追隨部所移動的所述區域的方式變化,以所述搬送機器人在變化後的所述搬送機器人的動作範圍內搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing apparatus as claimed in claim 1, wherein The control unit recognizes the motion range of the transfer robot, and changes the recognized motion range of the transfer robot so as not to touch the area moved by the follower, so that the transfer robot changes The transfer robot and the moving mechanism are controlled in such a manner that the substrate is transferred within the operating range of the transfer robot. 如請求項1或請求項2所述的基板處理裝置,其中 所述設定部設定用於所述搬送室內的人進行作業的作業區域, 所述控制部以所述搬送機器人避開由所述設定部所設定的所述作業區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing apparatus as claimed in claim 1 or claim 2, wherein The setting unit sets a work area for people in the transfer chamber to work, The control unit controls the transfer robot and the moving mechanism so that the transfer robot transfers the substrate while avoiding the work area set by the setting unit. 如請求項1或請求項2所述的基板處理裝置,其中 所述檢測部檢測所述搬送室內的所述搬送機器人, 所述控制部求出由所述檢測部所檢測到的所述搬送機器人與由所述檢測部所檢測到的所述人的間隔距離,基於所求出的所述間隔距離而改變所述搬送機器人的移動速度。The substrate processing apparatus as claimed in claim 1 or claim 2, wherein the detection unit detects the transfer robot in the transfer chamber, The control unit obtains a separation distance between the transfer robot detected by the detection unit and the person detected by the detection unit, and changes the transfer robot based on the obtained separation distance. The speed at which the robot moves. 如請求項1或請求項2所述的基板處理裝置,還包括: 切換部,在由所述檢測部檢測到所述人的情況下,將運轉模式由通常運轉模式切換為作業模式, 所述控制部僅在所述運轉模式為所述作業模式的情況下,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing device as described in claim 1 or claim 2, further comprising: a switching unit that switches the operation mode from the normal operation mode to the work mode when the person is detected by the detection unit, The control unit controls the transfer robot so that the transfer robot avoids the area moved by the follower and transfers the substrate only when the operation mode is the work mode. A robot and the moving mechanism. 一種基板處理方法,包括下述工序: 利用檢測部來檢測搬送室內的人的位置,所述搬送室內設有搬送基板的搬送機器人、及使所述搬送機器人移動的移動機構; 利用設定部來設定包含由所述檢測部所檢測到的所述人的位置的區域; 利用追隨部對應於所述人的移動而使由所述設定部所設定的所述區域移動;以及 利用控制部,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。A substrate processing method, comprising the following steps: detecting a position of a person in a transfer chamber in which a transfer robot for transferring the substrate and a movement mechanism for moving the transfer robot are installed by using the detection unit; setting an area including the position of the person detected by the detection unit by the setting unit; moving the area set by the setting unit corresponding to the movement of the person by a following unit; and The transfer robot and the moving mechanism are controlled by the control unit so that the transfer robot avoids the area moved by the follower and transfers the substrate. 如請求項6所述的基板處理方法,其中 所述控制部識別所述搬送機器人的動作範圍,使所識別的所述搬送機器人的動作範圍以不接觸由所述追隨部所移動的所述區域的方式變化,以所述搬送機器人在變化後的所述搬送機器人的動作範圍內搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing method as described in claim 6, wherein The control unit recognizes the motion range of the transfer robot, and changes the recognized motion range of the transfer robot so as not to touch the area moved by the follower, so that the transfer robot changes The transfer robot and the moving mechanism are controlled in such a manner that the substrate is transferred within the operating range of the transfer robot. 如請求項6或請求項7所述的基板處理方法,其中 所述設定部設定用於所述搬送室內的人進行作業的作業區域, 所述控制部以所述搬送機器人避開由所述設定部所設定的所述作業區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing method as described in claim 6 or claim 7, wherein The setting unit sets a work area for people in the transfer chamber to work, The control unit controls the transfer robot and the moving mechanism so that the transfer robot transfers the substrate while avoiding the work area set by the setting unit. 如請求項6或請求項7所述的基板處理方法,其中 所述檢測部檢測所述搬送室內的所述搬送機器人, 所述控制部求出由所述檢測部所檢測的所述搬送機器人與由所述檢測部所檢測的所述人的間隔距離,基於所求出的所述間隔距離而改變所述搬送機器人的移動速度。The substrate processing method as described in claim 6 or claim 7, wherein the detection unit detects the transfer robot in the transfer chamber, The control unit obtains a separation distance between the transfer robot detected by the detection unit and the person detected by the detection unit, and changes the distance of the transfer robot based on the obtained separation distance. Moving speed. 如請求項6或請求項7所述的基板處理方法,還包括下述工序: 在由所述檢測部檢測到所述人的情況下,將運轉模式由通常運轉模式切換為作業模式,且 所述控制部僅在所述運轉模式為所述作業模式的情況下,以所述搬送機器人避開由所述追隨部所移動的所述區域而搬送所述基板的方式,來控制所述搬送機器人及所述移動機構。The substrate processing method as described in claim 6 or claim 7, further comprising the following steps: When the person is detected by the detection unit, the operation mode is switched from the normal operation mode to the work mode, and The control unit controls the transfer robot so that the transfer robot avoids the area moved by the follower and transfers the substrate only when the operation mode is the work mode. A robot and the moving mechanism.
TW110111478A 2020-03-31 2021-03-30 Substrate processing apparatus and substrate processing method TWI793559B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020064586 2020-03-31
JP2020-064586 2020-03-31
JP2021-031561 2021-03-01
JP2021031561A JP7438156B2 (en) 2020-03-31 2021-03-01 Substrate processing equipment and substrate processing method

Publications (2)

Publication Number Publication Date
TW202209534A TW202209534A (en) 2022-03-01
TWI793559B true TWI793559B (en) 2023-02-21

Family

ID=77868397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110111478A TWI793559B (en) 2020-03-31 2021-03-30 Substrate processing apparatus and substrate processing method

Country Status (2)

Country Link
CN (1) CN113471119A (en)
TW (1) TWI793559B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248338A (en) * 2011-05-20 2012-12-01 Hitachi High Tech Corp Exposure apparatus, exposure method, inspecting method of exposure apparatus and manufacturing method of display panel substrate
TW201939649A (en) * 2018-03-15 2019-10-01 日商昕芙旎雅股份有限公司 Efem

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5835254B2 (en) * 2013-03-15 2015-12-24 株式会社安川電機 Robot system and control method of robot system
JP6659231B2 (en) * 2015-04-08 2020-03-04 富士電機株式会社 Production line monitoring system
JP6866673B2 (en) * 2017-02-15 2021-04-28 オムロン株式会社 Monitoring system, monitoring device, and monitoring method
JP6710321B2 (en) * 2017-03-29 2020-06-17 株式会社Kokusai Electric Substrate transfer unit, substrate processing apparatus, and semiconductor device manufacturing method
EP3437804A1 (en) * 2017-08-02 2019-02-06 ABB Schweiz AG Robot control method
JP7246147B2 (en) * 2017-09-29 2023-03-27 芝浦メカトロニクス株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
JP6650988B1 (en) * 2018-11-14 2020-02-19 株式会社東芝 Control system, control method, program, and storage medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248338A (en) * 2011-05-20 2012-12-01 Hitachi High Tech Corp Exposure apparatus, exposure method, inspecting method of exposure apparatus and manufacturing method of display panel substrate
TW201939649A (en) * 2018-03-15 2019-10-01 日商昕芙旎雅股份有限公司 Efem

Also Published As

Publication number Publication date
CN113471119A (en) 2021-10-01
TW202209534A (en) 2022-03-01

Similar Documents

Publication Publication Date Title
JP6686062B2 (en) Access allocation system and operating method for semiconductor manufacturing equipment
US6092678A (en) Overhead hoist transfer
US9815624B2 (en) Inter-floor transport facility
US11417555B2 (en) Ceiling conveyance vehicle and ceiling conveyance vehicle system
KR102110290B1 (en) Teaching apparatus and teaching method
US10923370B2 (en) Transport system and transport method
US20160059411A1 (en) Mobile device for manipulating objects
TW201347937A (en) Transfer system
KR101427514B1 (en) Transfer system
JP6126248B2 (en) Substrate processing method and substrate processing apparatus
CN103227132A (en) Conveying system
TWI793559B (en) Substrate processing apparatus and substrate processing method
JP7438156B2 (en) Substrate processing equipment and substrate processing method
US11059673B2 (en) Conveyance system
JP2004087839A (en) Maintenance system, substrate processor and remote controller
JP2019216152A (en) Teaching apparatus and teaching method for substrate transfer system
KR100380646B1 (en) Interlock apparatus and processing system of substrate transfer apparatus
TW202208216A (en) Overhead carrier and overhead carrying system
JP4705757B2 (en) Manufacturing method of semiconductor integrated circuit device
JP2021136258A (en) Substrate processing apparatus and substrate processing method
JP2014021666A (en) Management method for processing device
CN113474121A (en) Substrate processing apparatus
US11334080B2 (en) Systems and methods for raised floor automated sensor vehicles
JP5772800B2 (en) Transport system
TW202347580A (en) Transport system