TWI788855B - Detection system - Google Patents

Detection system Download PDF

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TWI788855B
TWI788855B TW110118894A TW110118894A TWI788855B TW I788855 B TWI788855 B TW I788855B TW 110118894 A TW110118894 A TW 110118894A TW 110118894 A TW110118894 A TW 110118894A TW I788855 B TWI788855 B TW I788855B
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feedback
detection signal
detection system
identification code
instructions
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TW110118894A
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TW202247337A (en
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陳士弘
林龍全
丁育銘
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旺宏電子股份有限公司
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Abstract

A detection system includes a first device, a second device, a third device and a server. The first device is configured to generate a first detection signal according to a first identification code and a process information, and operate in a feedback state according to one of the feedback commands. The second device establishs a connection with the first device. After receiving the first detection signal, the second device is configured to generate a second detection signal. The third device is configured to transmit a third detection signal. When the first device receives the third detection signal, the first device is driven according to one of the feedback commands. The server is connected with the second device and the third device to record a current position of the first device according to the first identification code and a second identification code in the second detection signal.

Description

偵測系統detection system

本揭示內容關於一種偵測系統,用以透過偵測訊號,控制對應之裝置運作於不同狀態。 This disclosure relates to a detection system for controlling corresponding devices to operate in different states through detection signals.

一般言,在晶圓廠的加工過程中,會透過自動化傳送系統將晶圓運送至不同的工作站,以執行顯影/黃光(Photo)、蝕刻(Etch)、薄膜(Thinfin)、擴散(Diffusion)及離子植入(CMP)等程序。 Generally speaking, in the processing process of the fab, the wafers will be transported to different workstations through the automatic conveying system to perform development/yellow light (Photo), etching (Etch), thin film (Thinfin), diffusion (Diffusion) And ion implantation (CMP) and other procedures.

一批(LOT,如:24片)晶圓會被存放於晶盒(POD)中被運送,每批晶圓會依照加工程序被輸送至對應的工作站,因此,傳送系統如何精確地管理每個晶盒的當前位置,將直接影響晶圓廠的生產產能。 A batch (LOT, such as: 24 pieces) of wafers will be stored in a pod (POD) and transported, and each batch of wafers will be transported to the corresponding workstation according to the processing procedure. Therefore, how does the transport system accurately manage each The current position of the crystal box will directly affect the production capacity of the fab.

本揭示內容係關於一種偵測系統,包含第一裝置、第二裝置、第三裝置及伺服器。第一裝置包含儲存裝置及回饋裝置。儲存裝置儲存有第一識別碼、製程狀態及複數個回饋指令。第一裝置用以根據第一識別碼及製程狀態產 生一第一偵測訊號,且回饋裝置用以根據該些回饋指令被驅動,以運作於複數個回饋狀態,對應於該些回饋指令的該些回饋狀態互不相同。第二裝置用以接收第一偵測訊號,以與第一裝置建立連線。第二裝置在接收到第一偵測訊號後,用以產生第二偵測訊號,第二偵測訊號包含第識別碼及第二識別碼。第三裝置用以發送第三偵測訊號。當第一裝置接收到第三偵測訊號時,第一裝置用以根據第三偵測訊號取得該些回饋指令之其中一者,並據以驅動回饋裝置。伺服器用以與第二裝置及第三裝置相連線。伺服器用以根據第二偵測訊號中之第一識別碼及第二識別碼,紀錄第一裝置的當前位置。 The present disclosure relates to a detection system, which includes a first device, a second device, a third device and a server. The first device includes a storage device and a feedback device. The storage device stores the first identification code, the process status and a plurality of feedback instructions. The first device is used for producing according to the first identification code and the process state A first detection signal is generated, and the feedback device is driven according to the feedback instructions to operate in a plurality of feedback states, and the feedback states corresponding to the feedback instructions are different from each other. The second device is used for receiving the first detection signal to establish a connection with the first device. The second device is used to generate a second detection signal after receiving the first detection signal, and the second detection signal includes a first identification code and a second identification code. The third device is used for sending a third detection signal. When the first device receives the third detection signal, the first device is used to obtain one of the feedback instructions according to the third detection signal, and drive the feedback device accordingly. The server is used for connecting with the second device and the third device. The server is used for recording the current location of the first device according to the first identification code and the second identification code in the second detection signal.

本揭示內容透過第三裝置主動發送訊號至第一裝置,使第一裝置能據以驅動回饋裝置,並運作於對應的回饋狀態,使偵測系統可透過第三裝置,迅速地確認第一裝置的當前位置與狀態。 This disclosure actively sends a signal to the first device through the third device, so that the first device can drive the feedback device accordingly, and operate in the corresponding feedback state, so that the detection system can quickly confirm the first device through the third device current location and status of .

100:偵測系統 100: detection system

D10:第一裝置 D10: First device

D11:處理器 D11: Processor

D12:儲存裝置 D12: storage device

D13:回饋裝置 D13: Feedback device

D14:通訊裝置 D14: Communication device

D15:顯示螢幕 D15: display screen

D20:第二裝置 D20: Second device

D30:第三裝置 D30: Third device

D40:伺服器 D40: Server

W1:工作站 W1: Workstation

W2:工作站 W2: Workstation

R1:通訊範圍 R1: communication range

R2:通訊範圍 R2: communication range

R3:通訊範圍 R3: communication range

第1圖為根據本揭示內容之部份實施例之偵測系統的示意圖。 FIG. 1 is a schematic diagram of a detection system according to some embodiments of the present disclosure.

第2圖為根據本揭示內容之部份實施例之第一裝置的示意圖。 FIG. 2 is a schematic diagram of a first device according to some embodiments of the present disclosure.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.

於本文中,當一元件被稱為「連接」或「耦接」時,可指「電性連接」或「電性耦接」。「連接」或「耦接」亦可用以表示二或多個元件間相互搭配操作或互動。此外,雖然本文中使用「第一」、「第二」、…等用語描述不同元件,該用語僅是用以區別以相同技術用語描述的元件或操作。除非上下文清楚指明,否則該用語並非特別指稱或暗示次序或順位,亦非用以限定本發明。 Herein, when an element is referred to as "connected" or "coupled", it may mean "electrically connected" or "electrically coupled". "Connected" or "coupled" may also be used to indicate that two or more elements cooperate or interact with each other. In addition, although terms such as “first”, “second”, . Unless clearly indicated by the context, the terms do not imply any particular order or sequence, nor are they intended to be limiting of the invention.

第1圖為根據本揭示內容之部份實施例之偵測系統100的示意圖。偵測系統100包含第一裝置D10、第二裝置D20、第三裝置D30及伺服器D40。在一實施例中,第一裝置D10為晶盒(圖中未示)或安裝於晶盒上,用以承裝多個晶圓加工物。晶圓加工物可為在晶圓上鍍有薄膜或塗有光阻的晶圓。在其他實施例中,第一裝置D10可以電子標籤(Tag)的形式設置於晶盒。 FIG. 1 is a schematic diagram of a detection system 100 according to some embodiments of the present disclosure. The detection system 100 includes a first device D10, a second device D20, a third device D30 and a server D40. In one embodiment, the first device D10 is a wafer box (not shown in the figure) or is installed on the wafer box for holding a plurality of wafer processing objects. The processed wafer can be a wafer coated with a thin film or coated with photoresist. In other embodiments, the first device D10 may be disposed on the crystal box in the form of an electronic tag (Tag).

在一實施例中,偵測系統100用於管理晶圓加工產線,並追蹤晶盒之位置。因此,第1圖中繪示多個第一裝置D10(如:晶盒,或晶盒上的標籤)、多個第二裝置 D20及至少一個第三裝置D30。本揭示內容不以第1圖所示為限,在其他實施例中,裝置D10~D30的數量可任意調整。 In one embodiment, the detection system 100 is used to manage the wafer processing line and track the position of the wafer box. Therefore, in the first figure, a plurality of first devices D10 (such as: a crystal box, or a label on a crystal box), a plurality of second devices D20 and at least one third device D30. The present disclosure is not limited to what is shown in FIG. 1 , and in other embodiments, the number of devices D10 - D30 can be adjusted arbitrarily.

第一裝置D10儲存有第一識別碼、製程狀態及多個回饋指令。其中第一識別碼用以辨識第一裝置D10,製程狀態則用以紀錄第一裝置D10中晶圓加工物的加工過程(如:經過第幾道加工程序),或者紀錄第一裝置D10中晶圓加工物的優先層級(如:第一級優先、第二級優先)。 The first device D10 stores a first identification code, a process state and a plurality of feedback instructions. The first identification code is used to identify the first device D10, and the process status is used to record the processing process of the wafer processed object in the first device D10 (such as: which processing procedure has been passed), or to record the wafer processing process in the first device D10. The priority level of the circular workpiece (eg: first level priority, second level priority).

第2圖為根據本揭示內容之部份實施例之第一裝置D10的示意圖。在部份實施例中,第一裝置D10包含處理器D11、儲存裝置D12、回饋裝置D13及通訊裝置D14。處理器D11係電性連接於儲存裝置D12、回饋裝置D13及通訊裝置D14。儲存裝置D12則用以儲存第一識別碼、製程狀態及回饋指令。回饋裝置D13係根據該些回饋指令被驅動,以運作於複數個回饋狀態,且對應於該些回饋指令的該些回饋狀態互不相同。回饋指令之內容與操作方式將於後續段落中說明。此外,在一實施例中,第一裝置D10透過內部之電池進行運轉。 FIG. 2 is a schematic diagram of a first device D10 according to some embodiments of the present disclosure. In some embodiments, the first device D10 includes a processor D11, a storage device D12, a feedback device D13, and a communication device D14. The processor D11 is electrically connected to the storage device D12, the feedback device D13 and the communication device D14. The storage device D12 is used for storing the first identification code, process status and feedback instruction. The feedback device D13 is driven according to the feedback instructions to operate in a plurality of feedback states, and the feedback states corresponding to the feedback instructions are different from each other. The content and operation method of the feedback command will be explained in the following paragraphs. In addition, in one embodiment, the first device D10 operates through an internal battery.

第一裝置D10根據第一識別碼及製程狀態產生第一偵測訊號,且透過通訊裝置D14定時地朝外發送第一偵測訊號。第一裝置D10使用之通訊協定可為藍芽或WiFi,但本揭示內容並不以此為限。每個第一裝置D10具有通訊範圍R1、R2,在通訊範圍內,其他具有相同之通訊協定的電子裝置可接收第一偵測訊號。 The first device D10 generates a first detection signal according to the first identification code and the process state, and regularly sends the first detection signal outward through the communication device D14. The communication protocol used by the first device D10 may be Bluetooth or WiFi, but the present disclosure is not limited thereto. Each first device D10 has a communication range R1, R2, within the communication range, other electronic devices with the same communication protocol can receive the first detection signal.

第二裝置D20內亦設有通訊裝置。在第一裝置D10被輸送、加工的過程中,若第一裝置D10的通訊範圍內有第二裝置D20,則第二裝置D20可接收第一偵測訊號,與第一裝置D10建立連線。由於第二裝置D20用以代表晶圓加工產線的某個區域,因此任意兩個第二裝置D20之間會有一段間隔。在一實施例中兩個第二裝置D20間的距離大於或等於第一裝置D10之通訊範圍R1(如:大於其範圍直徑)。 A communication device is also provided in the second device D20. When the first device D10 is transported and processed, if there is a second device D20 within the communication range of the first device D10, the second device D20 can receive the first detection signal and establish a connection with the first device D10. Since the second device D20 is used to represent a certain area of the wafer processing line, there is a gap between any two second devices D20. In one embodiment, the distance between the two second devices D20 is greater than or equal to the communication range R1 of the first device D10 (eg, greater than its range diameter).

舉例而言,第一裝置D10透過藍芽技術朝外發送第一偵測訊號,在通訊範圍R1、R2內具有藍芽模組的電子裝置(如:第二裝置D20)皆可接收到第一偵測訊號,並取得第一偵測訊號內的第一識別碼,且在建立連線之後,取得第一偵測訊號內所攜帶的資訊(即,製程狀態)。 For example, the first device D10 sends out the first detection signal through the bluetooth technology, and all electronic devices with bluetooth modules (such as: the second device D20) within the communication range R1 and R2 can receive the first detection signal. Detecting the signal, obtaining the first identification code in the first detecting signal, and obtaining the information carried in the first detecting signal (ie, the process status) after the connection is established.

承上,當第二裝置D20接收到第一偵測訊號後,第二裝置D20根據第一偵測訊號產生第二偵測訊號。第二偵測訊號中包含第一識別碼及第二識別碼。第二識別碼可為第二裝置D20的機碼。換言之,第一識別碼係對應於第一裝置D10、第二識別碼則對應於第二裝置D20。在部份實施例中,第二偵測訊號還可包含第一裝置D10的製程狀態。 As above, after the second device D20 receives the first detection signal, the second device D20 generates the second detection signal according to the first detection signal. The second detection signal includes a first identification code and a second identification code. The second identification code may be a machine code of the second device D20. In other words, the first identification code corresponds to the first device D10, and the second identification code corresponds to the second device D20. In some embodiments, the second detection signal may further include the process status of the first device D10.

在部份實施例中,每一個第二裝置D20係設於天線裝置上,且其位置可鄰近於工作站W1、W2。每一個工作站W1、W2係用以對晶圓執行不同的加工程序。 In some embodiments, each second device D20 is disposed on the antenna device, and its location may be adjacent to the workstations W1, W2. Each workstation W1, W2 is used to execute different processing procedures on the wafer.

工作站W1、W2可透過有線或無線(如:NFC、 藍芽)的方式與第一裝置D10相連線,以修改或更新第一裝置D10內儲存的製程資訊。舉例而言,當第一裝置D10運送至工作站W1附近之後,工作站W1將第一裝置D10之製程資訊設定為「完成第一道顯影」。接著,當第一裝置D10中的晶圓加工物在工作站W1上完成加工、且第一裝置D10運送至工作站W2後,工作站W2將第一裝置D10之製程資訊設定為「完成第一道蝕刻」。 Workstations W1 and W2 can be wired or wireless (such as: NFC, Bluetooth) to connect with the first device D10 to modify or update the process information stored in the first device D10. For example, after the first device D10 is transported to the vicinity of the workstation W1, the workstation W1 sets the process information of the first device D10 as "completed the first development". Next, when the wafer processing in the first device D10 is processed on the workstation W1 and the first device D10 is transported to the workstation W2, the workstation W2 sets the process information of the first device D10 as "completed the first etching". .

伺服器D40係與第二裝置D20相連線,以能接收第二裝置D20傳送的第二偵測訊號,且取得第二偵測訊號中的第一識別碼及第二識別碼,以辨識第一裝置D10及第二裝置D20。由於第二裝置D20設置於鄰近工作站W1、W2之位置,或者用以代表晶圓加工產線的某個區域,因此,伺服器D40可根據第一識別碼及第二識別碼,確認第一裝置D10當前靠近於哪一個第二裝置D20,從而紀錄第一裝置D10的當前位置(例如:位於工作站W1旁)。 The server D40 is connected to the second device D20 to receive the second detection signal sent by the second device D20, and obtain the first identification code and the second identification code in the second detection signal to identify the second detection signal. A device D10 and a second device D20. Since the second device D20 is installed adjacent to the workstations W1 and W2, or used to represent a certain area of the wafer processing line, the server D40 can identify the first device according to the first identification code and the second identification code Which second device D20 D10 is currently close to, so as to record the current location of the first device D10 (for example: located next to the workstation W1).

第三裝置D30可為一種可攜式電子裝置(如:手機、平板等),且內部同樣具有通訊裝置,用以接收或發送無線訊號。第三裝置D30可發送第三偵測訊號。當第一裝置D10位於第三裝置D30的通訊範圍R3內時,第一裝置D10將根據接收到的第三偵測訊號,取得其內儲存的一個回饋指令,並據以驅動回饋裝置D13,使其運作於對應的「回饋狀態」。在部份實施例中,回饋裝置D13可於不同回饋狀態下呈現出不同的外顯特徵,外顯特徵可為聲音、影像、震動或發光的任一者或其中多種之結合。 The third device D30 can be a portable electronic device (such as a mobile phone, a tablet, etc.), and also has a communication device inside for receiving or sending wireless signals. The third device D30 can send a third detection signal. When the first device D10 is within the communication range R3 of the third device D30, the first device D10 will obtain a feedback command stored therein according to the received third detection signal, and drive the feedback device D13 accordingly, so that It operates in the corresponding "feedback state". In some embodiments, the feedback device D13 can exhibit different appearance features in different feedback states, and the appearance features can be any one of sound, image, vibration, or light, or a combination of several of them.

換言之,第一裝置D10用以根據第三偵測訊號取得該些回饋指令之其中一者,使回饋裝置D13運作於對應之回饋狀態。在其他實施例中,每一個回饋狀態的回饋強度、回饋頻率或回饋時間互不相同。 In other words, the first device D10 is used to obtain one of the feedback commands according to the third detection signal, so as to make the feedback device D13 operate in the corresponding feedback state. In other embodiments, the feedback intensity, feedback frequency or feedback time of each feedback state are different from each other.

在一實施例中,第三裝置D30係由晶圓加工產線的檢查人員所攜帶。透過第三裝置D30主動發送第三偵測訊號至第一裝置D10,使第一裝置D10之回饋裝置D13呈現聲音、影像、震動或發光等外顯特徵。檢查人員將能快速地找到第一裝置D10,並將其運送至對應的其他工作站進行加工。 In one embodiment, the third device D30 is carried by inspectors of the wafer processing line. The third detection signal is actively sent to the first device D10 through the third device D30, so that the feedback device D13 of the first device D10 presents external features such as sound, video, vibration or light. The inspectors will be able to quickly find the first device D10 and transport it to other corresponding workstations for processing.

此外,檢查人員還能透過第三裝置D30,連線至伺服器D40,以透過伺服器D40所接收到的第二偵測訊號,得知第一裝置D10的當前位置(如:位於哪一個工作站或區域)。即便第一裝置D10被其他物件所遮蔽,或者位於訊號死角,而未曾與第二裝置D20相連線,第三裝置D30仍舊能透過伺服器D40,得知第一裝置D10最後連線的第二裝置D20為何,並判斷出第一裝置D10可能的所在區域,再根據第三裝置D30的第三偵測訊號,主動激發第一裝置D10,使回饋裝置D13產生外顯特徵。 In addition, the inspector can also connect to the server D40 through the third device D30, so as to know the current location of the first device D10 (such as which workstation it is located in) through the second detection signal received by the server D40. or region). Even if the first device D10 is covered by other objects, or is located in a signal dead spot, and has never been connected to the second device D20, the third device D30 can still know the second device that the first device D10 was last connected to through the server D40. The device D20 determines the possible area where the first device D10 is located, and then actively activates the first device D10 according to the third detection signal of the third device D30, so that the feedback device D13 produces an external feature.

具體而言,在一實施例中,回饋裝置D13包含指示燈。回饋裝置D13根據第三偵測訊號取得回饋指令後,將根據回饋指令驅動指示燈。每一個回饋指令係使指示燈產生不同顏色。舉例而言,若第三偵測訊號為「標示為第一優先級」,則第一裝置D10之回饋裝置D13會找到對 應於「第一優先級」的回饋指令(如:發出紅燈),驅動回饋裝置D13上對應的紅色發光元件。同理,若第三偵測訊號為「標示為一般優先級」,則第一裝置D10之回饋裝置D13會找到對應於「一般優先級」的回饋指令(如:發出綠燈),驅動回饋裝置D13上對應的綠色發光元件。 Specifically, in one embodiment, the feedback device D13 includes an indicator light. After the feedback device D13 obtains the feedback instruction according to the third detection signal, it will drive the indicator light according to the feedback instruction. Each feedback command makes the indicator light produce a different color. For example, if the third detection signal is "marked as the first priority", the feedback device D13 of the first device D10 will find the corresponding In response to the "first priority" feedback command (for example: to emit a red light), the corresponding red light-emitting element on the feedback device D13 is driven. Similarly, if the third detection signal is "marked as general priority", the feedback device D13 of the first device D10 will find a feedback command corresponding to "general priority" (for example: send out a green light), and drive the feedback device D13 The corresponding green light-emitting element on.

具體而言,在一實施例中,回饋裝置D13包含音訊播放器。回饋裝置D13根據第三偵測訊號取得回饋指令後,將根據回饋指令驅動音訊播放器。每一個回饋指令係使音訊播放器產生不同長度、不同頻率或不同強度的聲音。舉例而言,若第三偵測訊號為「尋找位置」,則第一裝置D10之回饋裝置D13會找到對應於「尋找位置」的回饋指令(如:發出2Hz短聲),驅動音訊播放器播放對應的音訊。同理,若第三偵測訊號為「停止尋找」,則第一裝置D10之回饋裝置D13會找到對應於「一般優先級」的回饋指令(如:停止播放),關閉音訊播放器。 Specifically, in one embodiment, the feedback device D13 includes an audio player. After the feedback device D13 obtains the feedback instruction according to the third detection signal, it will drive the audio player according to the feedback instruction. Each feedback command causes the audio player to generate sounds of different lengths, frequencies or intensities. For example, if the third detection signal is "finding location", the feedback device D13 of the first device D10 will find the feedback command corresponding to "finding location" (for example: send out a 2Hz short sound), and drive the audio player to play corresponding audio. Similarly, if the third detection signal is "stop searching", the feedback device D13 of the first device D10 will find a feedback command corresponding to the "general priority" (such as: stop playing), and turn off the audio player.

具體而言,在一實施例中,回饋裝置D13包含震動器。回饋裝置D13根據第三偵測訊號取得回饋指令後,將根據回饋指令驅動震動器。每一個回饋指令係使震動器產生不同時間長度或不同強度的震動。舉例而言,若第三偵測訊號為「尋找位置且設為第一優先級」,則第一裝置D10之回饋裝置D13會找到對應於「尋找位置且設為第一優先級」的回饋指令(如:發出10秒震動),驅動震動器產生震盪。同理,若第三偵測訊號為「尋找位置且設為第二優先級」,則第一裝置D10之回饋裝置D13會找到對 應於「尋找位置且設為第二」的回饋指令(如:發出5秒震動),驅動震動器產生震盪。 Specifically, in one embodiment, the feedback device D13 includes a vibrator. After the feedback device D13 obtains the feedback instruction according to the third detection signal, it will drive the vibrator according to the feedback instruction. Each feedback command causes the vibrator to generate vibrations of different durations or different intensities. For example, if the third detection signal is "find a location and set it as the first priority", the feedback device D13 of the first device D10 will find the feedback command corresponding to "find the location and set it as the first priority" (For example: 10 seconds of vibration), drive the vibrator to generate vibration. Similarly, if the third detection signal is "Looking for a location and setting it as the second priority", the feedback device D13 of the first device D10 will find the corresponding In response to the feedback command of "find the position and set it to the second" (for example: send out vibration for 5 seconds), drive the vibrator to vibrate.

換言之,在部份實施例中,第一裝置D10內儲存有多個相互對應的第三偵測訊號與回饋指令,因此當第一裝置D10接收到第三偵測訊號後,能根據第三裝置D30發送的第三偵測訊號(如:「尋找位置」),找到內部儲存的對應第三偵測訊(如:「尋找位置」)號,再據以找到對應之回饋指令(如:發出2Hz短聲),以執行對應動作。 In other words, in some embodiments, the first device D10 stores a plurality of corresponding third detection signals and feedback instructions, so when the first device D10 receives the third detection signal, it can The third detection signal sent by D30 (such as: "find the location"), find the corresponding number of the third detection signal (such as: "find the location") stored in the internal storage, and then find the corresponding feedback command (such as: send 2Hz Short sound) to perform the corresponding action.

在一實施例中,第一裝置D10還包含顯示螢幕D15(如:彩色螢幕或電子紙)。顯示螢幕D15電性連接於處理器D11,用以顯示製程狀態。在部份實施例中,當第一裝置D10接收到第三偵測訊號後「設為第一優先級」,第一裝置D10可據以找出對應的回饋指令,控制顯示螢幕D15,例如:在顯示螢幕D15上顯示出「第一優先級」的字體。在其他實施例中,顯示螢幕D15亦可為一種回饋裝置D13,以運作於不同的回饋狀態(如:螢幕上的字體以固定頻率閃爍)。 In one embodiment, the first device D10 further includes a display screen D15 (such as a color screen or electronic paper). The display screen D15 is electrically connected to the processor D11 for displaying process status. In some embodiments, when the first device D10 receives the third detection signal and "sets as the first priority", the first device D10 can find out the corresponding feedback command and control the display screen D15, for example: On the display screen D15, the font of "first priority" is displayed. In other embodiments, the display screen D15 can also be a feedback device D13 to operate in different feedback states (for example, characters on the screen blink at a fixed frequency).

在部份實施例中,第一裝置D10係透過第一通訊協定(如:藍芽)與第二裝置D20及/或第三裝置D30相連線。伺服器D40則透過第二通訊協定與第二裝置D20及/或第三裝置D30相連線。第一通訊協定之通訊傳輸距離係小於第二通訊協定之通訊傳輸距離,「通訊傳輸距離」可為無線訊號可傳播的最遠距離,或者為無線訊號所能傳 輸的最大範圍面積。例如:第一通訊協定可為藍芽、第二通訊協定可為WiFi,但本揭示內容並不以此為限。 In some embodiments, the first device D10 is connected to the second device D20 and/or the third device D30 through a first communication protocol (eg, Bluetooth). The server D40 is connected to the second device D20 and/or the third device D30 through the second communication protocol. The communication transmission distance of the first communication protocol is smaller than the communication transmission distance of the second communication protocol. The maximum area of the output. For example: the first communication protocol may be Bluetooth, and the second communication protocol may be WiFi, but the disclosure is not limited thereto.

據此,檢查人員於晶圓加工產線中,能透過第三裝置D30連上伺服器D40,得知每個第一裝置D10的製程資訊與當前位置。而當檢查人員靠近第一裝置D10時,則可透過第三裝置D30發送第三偵測訊號,以驅動第一裝置D10上的回饋裝置D13,以精確且快速地找到特定的第一裝置D10。如前所述,第三裝置D30尚能應用於第一裝置D10位於通訊死角,導致沒有與任何第二裝置D20相連線時的偵測。 Accordingly, in the wafer processing production line, inspectors can connect to the server D40 through the third device D30 to know the process information and current position of each first device D10. When the inspector approaches the first device D10, the third detection signal can be sent through the third device D30 to drive the feedback device D13 on the first device D10, so as to accurately and quickly find the specific first device D10. As mentioned above, the third device D30 can still be applied to detect when the first device D10 is located in a communication dead zone, resulting in no connection with any second device D20.

前述各實施例中的各項元件、方法步驟或技術特徵,係可相互結合,而不以本揭示內容中的文字描述順序或圖式呈現順序為限。 Various components, method steps or technical features in the above-mentioned embodiments can be combined with each other, and are not limited by the order of description in words or presentation in drawings in the present disclosure.

雖然本揭示內容已以實施方式揭露如上,然其並非用以限定本揭示內容,任何熟習此技藝者,在不脫離本揭示內容之精神和範圍內,當可作各種更動與潤飾,因此本揭示內容之保護範圍當視後附之申請專利範圍所界定者為準。 Although the content of this disclosure has been disclosed above in terms of implementation, it is not intended to limit the content of this disclosure. Anyone who is skilled in this art can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure The scope of protection of the content shall be defined by the scope of the attached patent application.

100:偵測系統 D10:第一裝置 D20:第二裝置 D30:第三裝置 D40:伺服器 W1:工作站 W2:工作站 R1:通訊範圍 R2:通訊範圍 R3:通訊範圍 100: detection system D10: First device D20: Second device D30: Third device D40: Server W1: Workstation W2: Workstation R1: communication range R2: communication range R3: communication range

Claims (10)

一種偵測系統,包含: 一第一裝置,包含一儲存裝置及一回饋裝置,其中該儲存裝置儲存有一第一識別碼、一製程狀態及複數個回饋指令,該第一裝置用以根據該第一識別碼及該製程狀態產生一第一偵測訊號,且該回饋裝置用以根據該些回饋指令被驅動,以運作於複數個回饋狀態,對應於該些回饋指令的該些回饋狀態互不相同; 一第二裝置,用以接收該第一偵測訊號,以與該第一裝置建立連線,其中該第二裝置在接收到該第一偵測訊號後,用以產生一第二偵測訊號,該第二偵測訊號包含該第一識別碼及一第二識別碼; 一第三裝置,用以發送一第三偵測訊號,其中當該第一裝置接收到該第三偵測訊號時,該第一裝置用以根據該第三偵測訊號取得該些回饋指令之其中一者,並據以驅動該回饋裝置;以及 一伺服器,用以與該第二裝置及該第三裝置相連線,其中該伺服器用以根據該第二偵測訊號中之該第一識別碼及該第二識別碼,紀錄該第一裝置的一當前位置。 A detection system comprising: A first device, including a storage device and a feedback device, wherein the storage device stores a first identification code, a process state and a plurality of feedback instructions, and the first device is used to generating a first detection signal, and the feedback device is driven according to the feedback instructions to operate in a plurality of feedback states, and the feedback states corresponding to the feedback instructions are different from each other; A second device for receiving the first detection signal to establish a connection with the first device, wherein the second device is used for generating a second detection signal after receiving the first detection signal , the second detection signal includes the first identification code and a second identification code; A third device for sending a third detection signal, wherein when the first device receives the third detection signal, the first device is used for obtaining the feedback instructions according to the third detection signal one of them, according to which the feedback device is driven; and a server for connecting with the second device and the third device, wherein the server is used for recording the first identification code and the second identification code in the second detection signal A current location of a device. 如請求項1所述之偵測系統,其中該第一裝置用以根據該第三偵測訊號取得該些回饋指令之其中一者,使該回饋裝置運作於該些回饋狀態的其中一者,且該些回饋狀態的回饋強度、回饋頻率或回饋時間互不相同。The detection system as described in claim 1, wherein the first device is used to obtain one of the feedback instructions according to the third detection signal, so that the feedback device operates in one of the feedback states, And the feedback intensity, feedback frequency or feedback time of these feedback states are different from each other. 如請求項2所述之偵測系統,其中該回饋裝置包含一指示燈,該回饋裝置用以根據該些回饋指令,驅動該指示燈產生不同的光色。The detection system as described in claim 2, wherein the feedback device includes an indicator light, and the feedback device is used to drive the indicator light to generate different light colors according to the feedback instructions. 如請求項2所述之偵測系統,其中該回饋裝置包含一音訊播放器,該回饋裝置用以根據該些回饋指令,驅動該音訊播放器產生不同長度、頻率或強度的聲音。The detection system as described in claim 2, wherein the feedback device includes an audio player, and the feedback device is used to drive the audio player to generate sounds of different lengths, frequencies or intensities according to the feedback instructions. 如請求項2所述之偵測系統,其中該回饋裝置包含一震動器,該回饋裝置用以根據該些回饋指令,驅動該震動器產生不同強度或時間長度的震動。The detection system according to claim 2, wherein the feedback device includes a vibrator, and the feedback device is used to drive the vibrator to generate vibrations of different intensities or durations according to the feedback instructions. 如請求項1所述之偵測系統,其中該第一裝置還包含一顯示螢幕,該顯示螢幕用以顯示該製程狀態。The detection system according to claim 1, wherein the first device further includes a display screen for displaying the process status. 如請求項1所述之偵測系統,其中該第三裝置用以連線至該伺服器,用以取得該當前位置。The detection system as described in claim 1, wherein the third device is used to connect to the server to obtain the current location. 如請求項1所述之偵測系統,其中該第一裝置係透過一第一通訊協定與該第二裝置或該第三裝置相連線,且該伺服器係透過一第二通訊協定與該第二裝置或該第三裝置相連線,該第一通訊協定之通訊傳輸距離係小於該第二通訊協定之通訊傳輸距離。The detection system as described in claim 1, wherein the first device is connected to the second device or the third device through a first communication protocol, and the server is connected to the second device through a second communication protocol The second device or the third device is connected by wire, and the communication transmission distance of the first communication protocol is smaller than the communication transmission distance of the second communication protocol. 如請求項8所述之偵測系統,其中該第一通訊協定為藍芽。The detection system according to claim 8, wherein the first communication protocol is Bluetooth. 如請求項1所述之偵測系統,其中該第一裝置用以承裝複數個晶圓加工物。The detection system as claimed in claim 1, wherein the first device is used to hold a plurality of wafer processing objects.
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