TWI786941B - Display apparatus - Google Patents
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- TWI786941B TWI786941B TW110142013A TW110142013A TWI786941B TW I786941 B TWI786941 B TW I786941B TW 110142013 A TW110142013 A TW 110142013A TW 110142013 A TW110142013 A TW 110142013A TW I786941 B TWI786941 B TW I786941B
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
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- H10K50/00—Organic light-emitting devices
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- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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Abstract
Description
本發明是有關於一種光電裝置,且特別是有關於一種顯示裝置。The present invention relates to an optoelectronic device, and more particularly to a display device.
依照顯示介質的特性,顯示裝置分為非自發光顯示裝置及自發光顯示裝置。非自發光顯示裝置的顯示面板需搭配背光模組方能顯示。自發光顯示裝置則不需要搭配背光模組。因此,相較於非自發光顯示裝置,自發光顯示裝置具有輕薄的優勢,而更適合應用在某些產品中,例如:智慧型手錶、智慧型手機等。According to the characteristics of the display medium, display devices are classified into non-self-luminous display devices and self-luminous display devices. The display panel of the non-self-luminous display device needs to be equipped with a backlight module to display. The self-luminous display device does not need to be equipped with a backlight module. Therefore, compared with non-self-luminous display devices, self-luminous display devices have the advantage of being thinner and lighter, and are more suitable for application in certain products, such as smart watches and smart phones.
一般而言,自發光顯示裝置的對向基板具有遮光圖案層(或稱,黑矩陣),以防止用以顯示不同顏色的多個子畫素結構發生混光。然而,在避免混光的同時,遮光圖案層的設置卻使得自發光顯示裝置的視角受限,在大視角方向上的亮度低落。Generally speaking, the opposite substrate of the self-luminous display device has a light-shielding pattern layer (or called a black matrix) to prevent light mixing between multiple sub-pixel structures for displaying different colors. However, while avoiding light mixing, the arrangement of the light-shielding pattern layer restricts the viewing angle of the self-luminous display device, and the brightness in the direction of large viewing angle is reduced.
此外,以向上發光的自發光顯示裝置為例,其畫素陣列基板的共用電極的材質需使用透光導電材料。透光導電材料的導電率偏低。當自發光顯示裝置的尺寸較大時,各子畫素結構與共用電極的訊號輸入端的距離差異增大,造成電壓壓降(IR-drop)問題嚴重,影響顯示品質。In addition, taking an upward-emitting self-luminous display device as an example, the material of the common electrode of the pixel array substrate needs to use a light-transmitting conductive material. The conductivity of light-transmitting conductive materials is relatively low. When the size of the self-luminous display device is large, the difference in distance between each sub-pixel structure and the signal input end of the common electrode increases, resulting in a serious IR-drop problem and affecting display quality.
本發明提供一種顯示裝置,顯示品質佳。The invention provides a display device with good display quality.
本發明提供另一種顯示裝置,顯示品質也佳。The invention provides another display device with good display quality.
本發明一實施例的顯示裝置,包括第一基底、至少一子畫素結構、第二基底、遮光圖案層、第一絕緣層、反射層及第二絕緣層。至少一子畫素結構設置於第一基底上。第二基底設置於第一基底的對向。遮光圖案層設置於第二基底上,且具有至少一開口。遮光圖案層的至少一開口重疊於至少一子畫素結構。第一絕緣層設置於遮光圖案層上,且具有至少一開口。第一絕緣層的至少一開口設置於遮光圖案層的至少一開口外。第一絕緣層具有定義第一絕緣層之至少一開口的至少一側壁。反射層至少設置於第一絕緣層的至少一側壁上。第二絕緣層至少設置於第一絕緣層的至少一開口中,且覆蓋反射層。A display device according to an embodiment of the present invention includes a first substrate, at least one sub-pixel structure, a second substrate, a light-shielding pattern layer, a first insulating layer, a reflective layer and a second insulating layer. At least one sub-pixel structure is disposed on the first base. The second base is disposed opposite to the first base. The light-shielding pattern layer is disposed on the second base and has at least one opening. At least one opening of the light-shielding pattern layer overlaps at least one sub-pixel structure. The first insulating layer is disposed on the light-shielding pattern layer and has at least one opening. At least one opening of the first insulating layer is disposed outside the at least one opening of the light-shielding pattern layer. The first insulating layer has at least one sidewall defining at least one opening of the first insulating layer. The reflective layer is at least disposed on at least one side wall of the first insulating layer. The second insulating layer is at least disposed in at least one opening of the first insulating layer and covers the reflective layer.
在本發明的一實施例中,上述的反射層具有相連接的至少一第一部及至少一第二部,反射層的至少一第一部設置於第一絕緣層的至少一側壁上,且反射層的至少一第二部設置於遮光圖案層與第二絕緣層之間。In an embodiment of the present invention, the reflective layer has at least one first portion and at least one second portion connected to each other, the at least one first portion of the reflective layer is disposed on at least one side wall of the first insulating layer, and At least one second portion of the reflective layer is disposed between the light-shielding pattern layer and the second insulating layer.
在本發明的一實施例中,上述的反射層的至少一第二部直接接觸於遮光圖案層。In an embodiment of the present invention, at least a second portion of the reflective layer is in direct contact with the light-shielding pattern layer.
在本發明的一實施例中,上述的反射層具有相連接的至少一第一部及至少一第二部,反射層的至少一第一部設置於第一絕緣層的至少一側壁,反射層的至少一第二部設置於至少一第一部之靠近遮光圖案層的一側,反射層之至少一第二部的邊緣與遮光圖案層的邊緣相隔一距離。In an embodiment of the present invention, the above-mentioned reflective layer has at least one first portion and at least one second portion connected, at least one first portion of the reflective layer is disposed on at least one side wall of the first insulating layer, and the reflective layer At least one second portion of the at least one first portion is disposed on a side of the at least one first portion close to the light-shielding pattern layer, and the edge of the at least one second portion of the reflective layer is spaced a distance from the edge of the light-shielding pattern layer.
在本發明的一實施例中,上述的第二絕緣層具有設置於第一絕緣層之至少一開口中的第一部,第二絕緣層的第一部具有朝向第二基底的第一表面及朝向第一絕緣層之至少一側壁的第二表面,且第一表面與第二表面於第二絕緣層的材質內夾有一角度α,且α>90o。In an embodiment of the present invention, the above-mentioned second insulating layer has a first portion disposed in at least one opening of the first insulating layer, the first portion of the second insulating layer has a first surface facing the second substrate and The second surface facing at least one sidewall of the first insulating layer, and the first surface and the second surface form an angle α within the material of the second insulating layer, and α>90o.
在本發明的一實施例中,上述的至少一子畫素結構包括一共用電極,第二絕緣層具有設置於第一絕緣層之至少一開口中的至少一第一部,且顯示裝置更包括至少一凸起結構及第一導電層。至少一凸起結構設置於第二絕緣層的至少一第一部上。第一導電層設置於至少一凸起結構上,且電性連接至反射層及共用電極。In an embodiment of the present invention, the above-mentioned at least one sub-pixel structure includes a common electrode, the second insulating layer has at least one first portion disposed in at least one opening of the first insulating layer, and the display device further includes At least one protruding structure and the first conductive layer. At least one protruding structure is disposed on at least one first portion of the second insulating layer. The first conductive layer is disposed on at least one protruding structure, and is electrically connected to the reflective layer and the common electrode.
在本發明的一實施例中,設置於上述的至少一凸起結構上的部分第一導電層直接接觸於共用電極。In an embodiment of the present invention, a part of the first conductive layer disposed on the at least one protruding structure is directly in contact with the common electrode.
在本發明的一實施例中,上述的至少一子畫素結構更包括至少一第一電極、至少一發光圖案及一畫素定義層,畫素定義層設置於至少一第一電極上且具有重疊於至少一第一電極的至少一開口,至少一發光圖案設置於畫素定義層的至少一開口內且電性連接至第一電極,畫素定義層具有至少一凹陷,共用電極設置於畫素定義層的至少一凹陷內且電性連接到至少一發光圖案,且至少一凸起結構及至少一部分的第一導電層設置於畫素定義層的至少一凹陷中。In an embodiment of the present invention, the above-mentioned at least one sub-pixel structure further includes at least one first electrode, at least one light-emitting pattern, and a pixel definition layer. The pixel definition layer is disposed on the at least one first electrode and has Overlapping at least one opening of at least one first electrode, at least one light-emitting pattern is disposed in at least one opening of the pixel definition layer and electrically connected to the first electrode, the pixel definition layer has at least one depression, and the common electrode is disposed on the pixel definition layer The at least one recess of the pixel definition layer is electrically connected to at least one light-emitting pattern, and at least one protruding structure and at least a part of the first conductive layer are disposed in the at least one recess of the pixel definition layer.
在本發明的一實施例中,上述的顯示裝置更包括封裝層,設置於共用電極上,其中第一絕緣層與封裝層之間存在一空隙。In an embodiment of the present invention, the above display device further includes an encapsulation layer disposed on the common electrode, wherein a gap exists between the first insulating layer and the encapsulation layer.
在本發明的一實施例中,上述的顯示裝置更包括封裝層及黏著層。封裝層設置於共用電極上。黏著層設置於第一絕緣層與封裝層之間。至少一凸起結構凸出於黏著層。In an embodiment of the present invention, the above display device further includes an encapsulation layer and an adhesive layer. The encapsulation layer is disposed on the common electrode. The adhesive layer is disposed between the first insulating layer and the packaging layer. At least one protruding structure protrudes from the adhesive layer.
在本發明的一實施例中,上述的共用電極具有訊號輸入端,至少一凸起結構在遠離訊號輸入端的一處的設置密度大於靠近訊號輸入端的另一處的設置密度。In an embodiment of the present invention, the above-mentioned common electrode has a signal input end, and the arrangement density of at least one protruding structure at a place away from the signal input end is greater than that at another place close to the signal input end.
在本發明的一實施例中,上述的顯示裝置更包括第二導電層,設置於遮光圖案層上,位於遮光圖案層與第一絕緣層之間,且具有重疊於至少一子畫素結構的至少一開口。第二導電層、反射層、第一導電層及共用電極彼此電性連接。In an embodiment of the present invention, the above-mentioned display device further includes a second conductive layer disposed on the light-shielding pattern layer, between the light-shielding pattern layer and the first insulating layer, and has a structure overlapping at least one sub-pixel. At least one opening. The second conductive layer, the reflective layer, the first conductive layer and the common electrode are electrically connected to each other.
在本發明的一實施例中,上述的第二導電層在第二基底上的垂直投影的形狀與遮光圖案層在第二基底上的垂直投影的形狀實質上相同。In an embodiment of the present invention, the shape of the above-mentioned vertical projection of the second conductive layer on the second substrate is substantially the same as the shape of the vertical projection of the light-shielding pattern layer on the second substrate.
在本發明的一實施例中,上述的至少一子畫素結構包括電性連接至共用電極的多個第一發光圖案,遮光圖案層的至少一開口為遮光圖案層的多個開口,多個第一發光圖案彼此電性連接且分別重疊於遮光圖案層的多個開口。顯示裝置更包括封裝層及黏著層。封裝層設置於至少一子畫素結構上。黏著層設置於第一絕緣層與封裝層之間。一空隙存在於第一絕緣層與封裝層之間且重疊於多個第一發光圖案的一者,而黏著層重疊於多個第一發光圖案的另一者。In an embodiment of the present invention, the above-mentioned at least one sub-pixel structure includes a plurality of first light-emitting patterns electrically connected to the common electrode, at least one opening in the light-shielding pattern layer is a plurality of openings in the light-shielding pattern layer, and a plurality of The first light-emitting patterns are electrically connected to each other and respectively overlap the openings of the light-shielding pattern layer. The display device further includes an encapsulation layer and an adhesive layer. The encapsulation layer is disposed on at least one sub-pixel structure. The adhesive layer is disposed between the first insulating layer and the packaging layer. A gap exists between the first insulating layer and the encapsulation layer and overlaps one of the plurality of first light-emitting patterns, and the adhesive layer overlaps the other of the plurality of first light-emitting patterns.
在本發明的一實施例中,上述的共用電極具有訊號輸入端,空隙在遠離訊號輸入端的一處的設置密度大於靠近訊號輸入端的另一處的設置密度。In an embodiment of the present invention, the above-mentioned common electrode has a signal input end, and the arrangement density of the gaps at a place away from the signal input end is greater than that at another place close to the signal input end.
在本發明的一實施例中,上述的至少一子畫素結構包括第一子畫素結構及第二子畫素結構,第一子畫素結構及第二子畫素結構分別包括第一發光圖案及第二發光圖案,第一絕緣層的至少一開口包括分別對應第一發光圖案及第二發光圖案的第一開口及第二開口,第一絕緣層的至少一側壁包括分別定義第一絕緣層之第一開口及第二開口的第一側壁及第二側壁,反射層包括交替堆疊的多個第一折射率子層及多個第二折射率子層,多個第一折射率子層及多個第二折射率子層設置於第一側壁及第二側壁上。In an embodiment of the present invention, the above-mentioned at least one sub-pixel structure includes a first sub-pixel structure and a second sub-pixel structure, and the first sub-pixel structure and the second sub-pixel structure respectively include a first light-emitting pattern and a second light-emitting pattern, at least one opening of the first insulating layer includes a first opening and a second opening respectively corresponding to the first light-emitting pattern and the second light-emitting pattern, at least one side wall of the first insulating layer includes respectively defining the first insulating The first opening of the layer and the first side wall and the second side wall of the second opening, the reflective layer includes a plurality of first refractive index sub-layers and a plurality of second refractive index sub-layers stacked alternately, and the plurality of first refractive index sub-layers and a plurality of second refractive index sub-layers are disposed on the first sidewall and the second sidewall.
在本發明的一實施例中,上述的至少一子畫素結構包括第一子畫素結構及第二子畫素結構,第一子畫素結構及第二子畫素結構分別包括第一發光圖案及第二發光圖案,第一絕緣層的至少一開口包括分別對應於第一子畫素結構及第二子畫素結構的第一開口及第二開口,第一絕緣層的至少一側壁包括分別定義第一絕緣層之第一開口及第二開口的第一側壁及第二側壁。反射層包括多個第一折射率子層及多個第二折射率子層,交替堆疊且設置於第一側壁上。反射層更包括多個第三折射率子層及多個第四折射率子層,交替堆疊,且設置於第二側壁上。In an embodiment of the present invention, the above-mentioned at least one sub-pixel structure includes a first sub-pixel structure and a second sub-pixel structure, and the first sub-pixel structure and the second sub-pixel structure respectively include a first light-emitting pattern and the second light-emitting pattern, at least one opening of the first insulating layer includes a first opening and a second opening respectively corresponding to the first sub-pixel structure and the second sub-pixel structure, and at least one side wall of the first insulating layer includes The first sidewall and the second sidewall of the first opening and the second opening of the first insulating layer are respectively defined. The reflective layer includes a plurality of first refractive index sub-layers and a plurality of second refractive index sub-layers, stacked alternately and arranged on the first sidewall. The reflective layer further includes a plurality of third refractive index sub-layers and a plurality of fourth refractive index sub-layers stacked alternately and disposed on the second sidewall.
在本發明的一實施例中,上述的第一發光圖案及第二發光圖案分別用以發出第一色光及第二色光,多個第一折射率子層及多個第二折射率子層對第一色光的反射率高於對第二色光的反射率。In an embodiment of the present invention, the above-mentioned first light-emitting pattern and second light-emitting pattern are used to emit the first color light and the second color light respectively, and the plurality of first refractive index sub-layers and the plurality of second refractive index sub-layers The reflectivity to the first color light is higher than the reflectivity to the second color light.
本發明一實施例的顯示裝置,包括第一基底、子畫素結構、第二基底、遮光圖案層、凸起物、反射層及第一絕緣層。子畫素結構設置於第一基底上。第二基底設置於第一基底的對向。遮光圖案層設置於第二基底上,且具有重疊於子畫素結構的開口。凸起物設置於遮光圖案層上,且由第二基底凸向第一基底,其中凸起物具有鄰接於遮光圖案層之開口的一側壁。反射層至少設置於凸起結構的側壁上。第一絕緣層覆蓋反射層,且重疊於遮光圖案層的開口。A display device according to an embodiment of the present invention includes a first substrate, a sub-pixel structure, a second substrate, a light-shielding pattern layer, protrusions, a reflective layer and a first insulating layer. The sub-pixel structure is disposed on the first base. The second base is disposed opposite to the first base. The light-shielding pattern layer is disposed on the second base and has an opening overlapping the sub-pixel structure. The protrusion is disposed on the light-shielding pattern layer and protrudes from the second base to the first base, wherein the protrusion has a side wall adjacent to the opening of the light-shielding pattern layer. The reflective layer is at least disposed on the sidewall of the protruding structure. The first insulating layer covers the reflective layer and overlaps the opening of the light-shielding pattern layer.
在本發明的一實施例中,上述的凸起物具有朝向第二基底的第一表面,凸起物的側壁朝向第一絕緣層,第一表面與側壁於凸起物的材質內夾有一角度β,且β≤90o。In an embodiment of the present invention, the above-mentioned protrusion has a first surface facing the second base, the side wall of the protrusion faces the first insulating layer, and the first surface and the side wall form an angle within the material of the protrusion. β, and β≤90o.
現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.
應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.
本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about," "approximately," or "substantially" includes stated values and averages within acceptable deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the relative A specific amount of measurement-related error (ie, the limit of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Moreover, "about", "approximately" or "substantially" used herein may select a more acceptable deviation range or standard deviation according to optical properties, etching properties or other properties, and may not use one standard deviation to apply to all properties .
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.
圖1為本發明一實施例之顯示裝置10的剖面示意圖。FIG. 1 is a schematic cross-sectional view of a
圖2為本發明一實施例之顯示裝置10的上視示意圖。FIG. 2 is a schematic top view of a
圖1對應圖2的剖線I-I’。圖2繪示顯示裝置10的遮光圖案層220、多個發光圖案150及黏著層270,而省略顯示裝置10的其它構件。Fig. 1 corresponds to the section line I-I' of Fig. 2 . FIG. 2 shows the light-
請參照圖1,顯示裝置10包括相對設置的畫素陣列基板100及對向基板200。畫素陣列基板100包括第一基底110。舉例而言,在本實施例中,第一基底110的材質可以是玻璃、石英、有機聚合物、或是不透光/反射材料(例如:晶圓、陶瓷、或其它可適用的材料)、或是其它可適用的材料。Referring to FIG. 1 , the
畫素陣列基板100更包括設置於第一基底110上的多個子畫素結構SPX。每一子畫素結構SPX包括至少一第一電極130、一共用電極160及至少一發光圖案150,其中至少一第一電極130及共用電極160各自電性連接到至少一發光圖案150,且至少一發光圖案150用以發出光束L。The
在本實施例中,每一子畫素結構SPX更包括一子畫素電路120,電性連接到至少一第一電極130。舉例而言,在本實施例中,子畫素電路120可包括資料線(未繪示)、掃描線(未繪示)、電源線(未繪示)、第一電晶體(未繪示)、第二電晶體(未繪示)及電容(未繪示),其中第一電晶體的第一端電性連接至資料線,第一電晶體的控制端電性連接至掃描線,第一電晶體的第二端電性連接至第二電晶體的控制端,第二電晶體的第一端電性連接至電源線,電容電性連接於第一電晶體的第二端及第二電晶體的第一端,且第二電晶體的第二端電性連接到至少一第一電極130。然而,本發明不以此為限,在其它實施例中,子畫素電路120也可以是其它種電路。In this embodiment, each sub-pixel structure SPX further includes a
此外,在本實施例中,每一子畫素結構SPX更可選擇性地包括畫素定義層140。畫素定義層140具有至少一開口140a,重疊於至少一第一電極130。至少一發光圖案150可設置於畫素定義層140的至少一開口140a中。舉例而言,在本實施例中,發光圖案150的材質例如是有機發光材料,而顯示裝置10可以是有機電致發光顯示器。然而,本發明不限於此,在其它實施例中,發光圖案150的材質也可以是無機發光材料,而顯示裝置10也可以是無機電致發光顯示器,例如但不限於:微型發光二極體(μLED)顯示器。In addition, in this embodiment, each sub-pixel structure SPX further optionally includes a
在本實施例中,共用電極160是透光電極,其包括金屬氧化物,例如:銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、或其它合適的氧化物、或者是上述至少二者的堆疊層,但本發明不以此為限。In this embodiment, the
請參照圖1及圖2,在本實施例中,多個子畫素結構SPX可包括分別用以發出第一色光L1、第二色光L2及第三色光L3的第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3。彼此相鄰的第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3可組成一畫素結構PX。舉例而言,在本實施例中,第一色光L1、第二色光L2及第三色光L3例如分別是紅色光束、綠色光束及藍色光束,但本發明不以此為限。Please refer to FIG. 1 and FIG. 2. In this embodiment, the plurality of sub-pixel structures SPX may include first sub-pixel structures SPX1, SPX1, The second sub-pixel structure SPX2 and the third sub-pixel structure SPX3. The adjacent first sub-pixel structure SPX1, second sub-pixel structure SPX2 and third sub-pixel structure SPX3 can form a pixel structure PX. For example, in this embodiment, the first color light L1 , the second color light L2 and the third color light L3 are red light beams, green light beams and blue light beams respectively, but the invention is not limited thereto.
請參照圖1,在本實施例中,畫素陣列基板100更包括封裝層170,設置於子畫素結構SPX的共用電極160上。舉例而言,在本實施例中,封裝層170可以是具封裝薄膜(Thin Film Encapsulation, TFE)的高分子聚合物,但本發明不以此為限。Please refer to FIG. 1 , in this embodiment, the
對向基板200包括第二基底210,設置於第一基底110的對向。舉例而言,在本實施例中,第二基底210的材質可以是玻璃、石英、有機聚合物、或是其它可適用的材料。The
對向基板200更包括遮光圖案層220。遮光圖案層220又可稱為黑矩陣(black matrix,BM)。遮光圖案層220設置於第二基底210上,且具有開口220a。遮光圖案層220的開口220a重疊於子畫素結構SPX。詳細而言,遮光圖案層220的開口220a重疊於子畫素結構SPX的發光圖案150。The
在本實施例中,對向基板200更可選擇性地包括多個彩
色濾光圖案230,設置於第二基底210上,且重疊於遮光圖案層220的開口220a。在本實施例中,多個彩色濾光圖案230可包括分別設置於第一子畫素結構SPX1之第一發光圖案150R、第二子畫素結構SPX2之第二發光圖案150G及第三子畫素結構SPX3之第三發光圖案150B上方的第一彩色濾光圖案230R、第二彩色濾光圖案230G及第三彩色濾光圖案230B。舉例而言,在本實施例中,第一彩色濾光圖案230R、第二彩色濾光圖案230G及第三彩色濾光圖案230B可分別是紅色濾光圖案、綠色濾光圖案及藍色濾光圖案,但本發明不以此為限。
In this embodiment, the
對向基板200更包括第一絕緣層240,設置於遮光圖案層220上,且具有開口240a。第一絕緣層240的開口240a設置於遮光圖案層220的開口220a外。第一絕緣層240的開口240a重疊於遮光圖案層220的實體。第一絕緣層240具有定義開口240a的側壁242。The
對向基板200更包括反射層250,至少設置於定義第一絕緣層240之開口240a的側壁242上。詳細而言,在本實施例中,反射層250具有相連接的第一部251及第二部252。反射層250的第一部251設置於第一絕緣層240的側壁242上。反射層250的第二部252設置於遮光圖案層220與第二絕緣層260(的第一部261)之間。簡言之,反射層250是共形地設置於第一絕緣層240的開口240a中。此外,在本實施例中,反射層250的第二部252可直接接觸於遮光圖案層220,但本發明不以此為限。The
在本實施例中,反射層250的第二部252的邊緣252e與遮光圖案層220的邊緣220e相隔一距離D。反射層250於第二基底210上的垂直投影未超出遮光圖案層220於第二基底210上的垂直投影。換言之,反射層250設置於遮光圖案層220下,且未外露於遮光圖案層220。在本實施例中,反射層250的材質例如是金屬,但本發明不以此為限。In this embodiment, the
在本實施例中,對向基板200更包括第二絕緣層260,至少設置於第一絕緣層240的開口240a中,且覆蓋反射層250。在本實施例中,第二絕緣層260具有設置於第一絕緣層240之開口240a中的第一部261,第二絕緣層260的第一部261具有朝向第二基底210的第一表面261a及朝向第一絕緣層240之側壁242的第二表面261b,第一表面261a與第二表面261b於第二絕緣層260的材質內夾有角度α,且α>90o。在本實施例中,第二絕緣層260更可選擇性地具有第二部262,第二部262設置於第一絕緣層240上且重疊於遮光圖案層220的開口220a。In this embodiment, the
在本實施例中,對向基板200更包括黏著層(filler)270,設置於第一絕緣層240與封裝層170之間。對向基板200與畫素陣列基板100透過黏著層270彼此連接。反射層250位於第一絕緣層240與第二絕緣層260之間。第二絕緣層260位於反射層250與黏著層270之間。黏著層270位於第二絕緣層260與封裝層170之間。In this embodiment, the
值得一提的是,具有大發散角φ且向遮光圖案層220傳遞的光束L原本無法從顯示裝置10的內部出射,但透過反射層250的反射作用,光束L可被反射層250引導至遮光圖案層220的開口220a,並以大角度θ出射。藉此,顯示裝置10在大視角方向上的亮度可增加。It is worth mentioning that the light beam L having a large divergence angle φ and passing to the light-
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the aforementioned embodiments, and the following embodiments will not be repeated.
圖3為本發明一實施例之顯示裝置10A的剖面示意圖。FIG. 3 is a schematic cross-sectional view of a
圖4為本發明一實施例之顯示裝置10A的剖面示意圖。FIG. 4 is a schematic cross-sectional view of a
圖5為本發明一實施例之顯示裝置10A的上視示意圖。FIG. 5 is a schematic top view of a
圖3對應圖5的剖線II-II’。圖4對應圖5的剖線III-III’。圖5繪示顯示裝置10A的遮光圖案層220、第二導電層280、凸起結構290、多個發光圖案150及黏著層270,而省略顯示裝置10A的其它構件。Fig. 3 corresponds to the section line II-II' of Fig. 5 . Fig. 4 corresponds to section line III-III' of Fig. 5 . FIG. 5 shows the light-
圖3、圖4及圖5的顯示裝置10A與圖1及圖2的顯示裝置10類似,兩者主要的差異在於:圖3、圖4及圖5的顯示裝置10A更包括:第二導電層280、凸起結構290及第一導電層292。The
請參照圖3、圖4及圖5,對向基板200更包括凸起結構290及第一導電層292。凸起結構290設置於第二絕緣層260的第一部261上,且凸向畫素陣列基板100。第一導電層292設置於凸起結構290上,且電性連接至反射層250及共用電極160。換言之,凸起結構290上的部分第一導電層292是做為對向基板200的反射層250與畫素陣列基板100的共用電極160之間的橋接元件來使用。在本實施例中,設置於凸起結構290上之部分第一導電層292可直接接觸於共用電極160,但本發明不以此為限。Referring to FIG. 3 , FIG. 4 and FIG. 5 , the
請參照圖3及圖4,在本實施例中,畫素定義層140可具有凹陷142a,共用電極160設置於畫素定義層140的凹陷142a內且電性連接至發光圖案150,對向基板200的凸起結構290及設置於凸起結構290上的部分第一導電層292設置於凹陷142a中。畫素定義層140的凹陷142a有助於對向基板200的凸起結構290及設置於凸起結構290上的部分第一導電層292穩定地設置於畫素陣列基板100上,以良好地電性連接對向基板200的反射層250與畫素陣列基板100的共用電極160。3 and 4, in this embodiment, the
舉例而言,在本實施例中,畫素定義層140可包括第一子畫素定義層141及設置於第一子畫素定義層141上的第二子畫素定義層142,第一子畫素定義層141及第二子畫素定義層142共同定義重疊於第一電極130的開口140a,而第二子畫素定義層142具有重疊於凸起結構290的凹陷142a,但本發明不以此為限。For example, in this embodiment, the
值得一提的是,在本實施例中,共用電極160係透光,透光之共用電極160能選用的材質的電阻率偏高,但透過設置於凸起結構290上的部分第一導電層292,電阻率偏高的共用電極160可與電阻率低的反射層250電性連接。藉此,包括共用電極160及反射層250的複合式共用電極C的電阻值可降低,有助於改善因共用電極160的電阻值過高而導致的電壓壓降(IR-drop)問題,進而提升顯示品質。It is worth mentioning that, in this embodiment, the
請參照圖3及圖5,在本實施例中,對向基板200更包括第二導電層280,設置於遮光圖案層220上,位於遮光圖案層220與第一絕緣層240之間,且具有重疊於子畫素結構SPX的開口280a。在本實施例中,第二導電層280在第二基底210上的垂直投影的形狀與遮光圖案層220在第二基底210上的垂直投影的形狀可選擇性地實質上相同。舉例而言,在本實施例中,第二導電層280在第二基底210上的垂直投影與遮光圖案層220在第二基底210上的垂直投影可皆為網狀圖形,但本發明不以此為限。3 and 5, in this embodiment, the
請參照圖3,在本實施例中,反射層250可透過第一絕緣層240的開口240a電性連接至第二導電層280。在本實施例中,第二導電層280、反射層250、第一導電層292及共用電極160彼此電性連接,而形成一複合式共用電極C。在本實施例中,除了反射層250外,第二導電層280的電阻率也小於共用電極160的電阻率。透過與共用電極160電性連接的第二導電層280,複合式共用電極C的電阻值可進一步降低,而更顯著地改善電壓壓降(IR-drop)問題。Referring to FIG. 3 , in this embodiment, the
請參照圖3、圖4及圖5,在本實施例中,為使對向基板200之凸起結構290上的部分第一導電層292更良好地與畫素陣列基板100的共用電極160電性連接,顯示裝置10的部分區域中可不設置黏著層270。也就是說,在部分區域中,對向基板200的第一絕緣層240與畫素陣列基板100的封裝層170之間可存在空隙(air gap)AG。此外,在另一部分區域中,對向基板200的第一絕緣層240與畫素陣列基板100的封裝層170之間仍可設有黏著層270,以維持畫素陣列基板100與對向基板200的連接。Please refer to FIG. 3 , FIG. 4 and FIG. 5 . In order to connect, the
舉例而言,在本實施例中,同一子畫素結構SPX可包括多個發光圖案150,同一子畫素結構SPX的多個發光圖案150分別重疊於遮光圖案層220的多個開口220a,同一子畫素結構SPX的多個發光圖案150彼此電性連接,同一子畫素結構SPX的多個發光圖案150電性連接至同一子畫素電路120,其中一個發光圖案150重疊於黏著層270,而另一個發光圖案150則重疊於空隙AG。For example, in this embodiment, the same sub-pixel structure SPX may include multiple light-emitting
黏著層270的設置可減少發光圖案150發出的光束L(請參考圖1)在顯示裝置10A內部的界面反射,增加子畫素結構SPX的出光效率。空隙AG可使對向基板200之凸起結構290上的部分第一導電層292與畫素陣列基板100的共用電極160良好地電性連接,而不被黏著層270阻礙。在同一子畫素結構SPX的多個發光圖案150上分別設置黏著層270及空隙AG,可使多個子畫素結構SPX具有相同或相近的出光效果,並兼顧反射層250(及/或第二導電層280)與共用電極160的電性連接。然而,本發明不限於此,在其它實施例中,也可採用其它方式配置空隙AG及黏著層270。此外,本發明也不限制同一子畫素結構SPX之重疊於空隙AG的面積與重疊於黏著層270的面積的比例,同一子畫素結構SPX之重疊於空隙AG的面積與重疊於黏著層270的面積的比例可視實際需求調整。The setting of the
請參照圖3、圖4及圖5,舉例而言,共用電極160具有一訊號輸入端OVSS。在本實施例中,凸起結構290在遠離訊號輸入端OVSS的一處的設置密度可選擇性地大於靠近訊號輸入端OVSS的另一處的設置密度。在本實施例中,空隙AG在遠離訊號輸入端OVSS的一處的設置密度可選擇性地大於靠近訊號輸入端OVSS的另一處的設置密度。也就是說,在越遠離訊號輸入端OVSS處(即,電壓壓降較嚴重處),對向基板200之第一導電層292與畫素陣列基板100之共用電極160的電連接處的密度可越高,以更進一步地優化改善電壓壓降(IR-drop)的效果。Please refer to FIG. 3 , FIG. 4 and FIG. 5 , for example, the
請參照圖3,在本實施例中,設置於黏著層270旁的凸起結構290上的部分第一導電層292仍然可與共用電極160電性連接。在本實施例中,凸起結構290可凸出於黏著層270,而使凸起結構290上的部分第一導電層292電性連接至共用電極160。然而,本發明不限於此,在其它實施例中,黏著層270也可蓋過凸起結構290。Referring to FIG. 3 , in this embodiment, a portion of the first
圖6為本發明一實施例之顯示裝置10B的上視示意圖。FIG. 6 is a schematic top view of a
圖6繪示顯示裝置10B的遮光圖案層220、第二導電層280、凸起結構290、多個發光圖案150及黏著層270,而省略顯示裝置10B的其它構件。6 shows the light-
圖6的顯示裝置10B與圖5的顯示裝置10A類似,兩者的差異在於:黏著層270的形成位置略有差異。請參照圖5及圖6,黏著層270可包括多個黏著圖案272。在圖5的實施例中,噴塗黏著圖案272的間距P約等於一個畫素結構PX的寬度W。在圖6的實施例中,噴塗黏著圖案272的間距P約等於n個畫素結構PX的寬度W,其中n為大於或等於2的正整數。圖6是以n=2(即,黏著圖案272的間距P約等於2個畫素結構PX的寬度W)為示例,但本發明不以此為限。The
圖7為本發明一實施例之顯示裝置10C的剖面示意圖。FIG. 7 is a schematic cross-sectional view of a
圖8為本發明一實施例之顯示裝置10C的剖面示意圖。FIG. 8 is a schematic cross-sectional view of a
圖9為本發明一實施例之顯示裝置10C的上視示意圖。FIG. 9 is a schematic top view of a
圖7對應圖9的剖線IV-IV’。圖8對應圖9的剖線V-V’。圖9繪示圖7及圖8之顯示裝置10C的遮光圖案層220、第二導電層280、凸起結構290、多個發光圖案150及黏著層270,而省略圖7及圖8之顯示裝置10C的其它構件。Fig. 7 corresponds to section line IV-IV' of Fig. 9 . Fig. 8 corresponds to the section line V-V' of Fig. 9 . FIG. 9 shows the light-
圖7、圖8及圖9的顯示裝置10C與圖3、圖4及圖5的顯示裝置10A類似,兩者的差異在於:顯示裝置10C的反射層250C與顯示裝置10A的反射層250不同。The
請參照圖7、圖8及圖9,在本實施例中,多個子畫素結構SPX包括第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3,第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3分別包括第一發光圖案150R、第二發光圖案150G及第三發光圖案150B,第一絕緣層240的開口220a包括分別對應於第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3的第一開口220a-1、第二開口220a-2及第三開口220a-3,第一絕緣層240的側壁242包括分別定義第一開口220a-1、第二開口220a-2及第三開口220a-3的第一側壁242-1、第二側壁242-2及第三側壁242-3。Please refer to FIG. 7, FIG. 8 and FIG. 9. In this embodiment, the multiple sub-pixel structures SPX include a first sub-pixel structure SPX1, a second sub-pixel structure SPX2, and a third sub-pixel structure SPX3. The sub-pixel structure SPX1, the second sub-pixel structure SPX2, and the third sub-pixel structure SPX3 respectively include a first
在本實施例中,反射層250C包括多個第一折射率子層250a及多個第二折射率子層250b,交替堆疊且設置在第一側壁242-1上。多個第一折射率子層250a的折射率與多個第二折射率子層250b的折射率不同。交替堆疊的多個第一折射率子層250a及多個第二折射率子層250b可形成第一分散式布拉格反射器DBR1。第一分散式布拉格反射器DBR1用以反射第一子畫素結構SPX1發出的第一色光L1。In this embodiment, the
在本實施例中,反射層250C更包括多個第三折射率子層250c及多個第四折射率子層250d,交替堆疊且設置在第二側壁242-2上。多個第三折射率子層250c的折射率與多個第四折射率子層250d的折射率不同。交替堆疊的多個第三折射率子層250c及多個第四折射率子層250d可形成第二分散式布拉格反射器DBR2。第二分散式布拉格反射器DBR2用以反射第二子畫素結構SPX2發出的第二色光L2。In this embodiment, the
在本實施例中,反射層250C更包括多個第五折射率子層250e及多個第六折射率子層250f,交替堆疊且設置在第三側壁242-3上。多個第五折射率子層250e的折射率與多個第六折射率子層250f的折射率不同。交替堆疊的多個第五折射率子層250e及多個第六折射率子層250f可形成第三分散式布拉格反射器DBR3。第三分散式布拉格反射器DBR3用以反射第三子畫素結構SPX3發出的第三色光L3。In this embodiment, the
在本實施例中,第一折射率子層250a及多個第二折射率子層250b(即,第一分散式布拉格反射器DBR1)對第一色光L1的反射率高於對第二色光L2的反射率。在本實施例中,多個第三折射率子層250c及多個第四折射率子層250d(即,第二分散式布拉格反射器DBR2)對第二色光L2的反射率高於對第一色光L1的反射率。在本實施例中,多個第五折射率子層250e及多個第六折射率子層250f(即,第三分散式布拉格反射器DBR3)對第三色光L3的反射率高於對第二色光L2的反射率。In this embodiment, the first
在本實施例中,透過調整第一折射率子層250a、第二折射率子層250b、第三折射率子層250c、第四折射率子層250d、第五折射率子層250e及/或第六折射率子層250f的折射率及/或厚度,能使反射層250C針對不同波長的第一色光L1、第二色光L2及第三色光L3提高其反射率。In this embodiment, by adjusting the first
在本實施例中,第一折射率子層250a、第二折射率子層250b、第三折射率子層250c、第四折射率子層250d、第五折射率子層250e及第六折射率子層250f的材質具有導電性。舉例而言,第一折射率子層250a、第二折射率子層250b、第三折射率子層250c、第四折射率子層250d、第五折射率子層250e及第六折射率子層250f的材質可包括金屬氧化物,但本發明不以此為限。In this embodiment, the first
圖10為本發明一實施例之顯示裝置10D的剖面示意圖。圖10的顯示裝置10D與圖7的顯示裝置10C類似,兩者的差異在於:在圖10的實施例中,多個第一折射率子層250a及多個第二折射率子層250b設置於分別對應於第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3的第一側壁242-1、第二側壁242-2及第三側壁242-3上。換言之,在本實施例中,第一子畫素結構SPX1、第二子畫素結構SPX2及第三子畫素結構SPX3是共用同一種第一分散式布拉格反射器DBR1,而顯示裝置10D的對向基板200的製程較顯示裝置10C的對向基板200的製程簡單。FIG. 10 is a schematic cross-sectional view of a
圖11為本發明一實施例之顯示裝置10E的剖面示意圖。圖11的顯示裝置10E與圖1的顯示裝置10類似,兩者的差異在於:圖11的顯示裝置10E的對向基板200E與圖1的顯示裝置10的對向基板200不同。FIG. 11 is a schematic cross-sectional view of a
請參照圖11,具體而言,在本實施例中,對向基板200E包括第二基底210、遮光圖案層220、凸起物294、反射層250E及第一絕緣層240E。遮光圖案層220設置於第二基底210上,且具有重疊於子畫素結構SPX的開口220a。凸起物294設置於遮光圖案層220上,且由第二基底210凸向第一基底110。凸起物294具有鄰接於遮光圖案層220之開口220a的側壁294a。反射層250E至少設置凸起物294的側壁294a上。第一絕緣層240E覆蓋反射層250E,且重疊於遮光圖案層220的開口220a。在本實施例中,凸起物294具有朝向第二基底210的第一表面294b,凸起物294的側壁294a朝向第一絕緣層240E,第一表面294b與側壁294a於凸起物294的材質內夾有一角度β,且β<90o。Referring to FIG. 11 , specifically, in this embodiment, the
圖12為本發明一實施例之顯示裝置10F的剖面示意圖。圖12的顯示裝置10F與圖11的顯示裝置10E類似,兩者的差異在於:在圖12的實施例中,第一表面294b與側壁294a於凸起物294的材質內夾有一角度β,且β實質上等於90o。FIG. 12 is a schematic cross-sectional view of a
類似地,圖11的顯示裝置10E及圖12的顯示裝置10F透過凸起物294上的反射層250E,能將具有大發散角φ且向遮光圖案層220傳遞的光束L引導至遮光圖案層220的開口220a,並以大角度θ出射。藉此,顯示裝置10E、10F在大視角方向上的亮度能增加。Similarly, the
10、10A、10B、10C、10D、10E、10F:顯示裝置 100:畫素陣列基板 110:第一基底 120:子畫素電路 130:第一電極 140:畫素定義層 140a、220a、240a、280a:開口 141:第一子畫素定義層 142:第二子畫素定義層 142a:凹陷 150:發光圖案 150R:第一彩色濾光圖案 150G:第二彩色濾光圖案 150B:第三彩色濾光圖案 160:共用電極 170:封裝層 200:對向基板 210:第二基底 220:遮光圖案層 220e:邊緣 220a-1:第一開口 220a-2:第二開口 220a-3:第三開口 230:彩色濾光圖案 230R:第一彩色濾光圖案 230G:第二彩色濾光圖案 230B:第三彩色濾光圖案 240、240E:第一絕緣層 242、294a:側壁 242-1:第一側壁 242-2:第二側壁 242-3:第三側壁 250、250C、250E:反射層 250a:第一折射率子層 250b:第二折射率子層 250c:第三折射率子層 250d:第四折射率子層 250e:第五折射率子層 250f:第六折射率子層 251、261:第一部 252、262:第二部 252e:邊緣 260:第二絕緣層 261a:第一表面 261b:第二表面 270:黏著層 272:黏著圖案 280:第二導電層 290:凸起結構 292:第一導電層 294:凸起物 294b:第一表面 AG:空隙 C:複合式共用電極 D:距離 DBR1:第一分散式布拉格反射器 DBR2:第二分散式布拉格反射器 DBR3:第三分散式布拉格反射器 L:光束 L1:第一色光 L2:第二色光 L3:第三色光 OVSS:訊號輸入端 PX:畫素結構 P:間距 SPX:子畫素結構 SPX1:第一子畫素結構 SPX2:第二子畫素結構 SPX3:第三子畫素結構 W:寬度 α、β、θ:角度 φ:發散角 I-I’、II-II’、III-III’、IV-IV’、V-V’:剖線 10, 10A, 10B, 10C, 10D, 10E, 10F: display device 100:Pixel array substrate 110: First base 120: Sub-pixel circuit 130: first electrode 140:Pixel definition layer 140a, 220a, 240a, 280a: openings 141: The first sub-pixel definition layer 142: The second sub-pixel definition layer 142a: Depression 150: Luminous pattern 150R: The first color filter pattern 150G: Second color filter pattern 150B: the third color filter pattern 160: common electrode 170: encapsulation layer 200: opposite substrate 210:Second Base 220: shading pattern layer 220e: edge 220a-1: first opening 220a-2: second opening 220a-3: the third opening 230: Color filter pattern 230R: The first color filter pattern 230G: Second color filter pattern 230B: the third color filter pattern 240, 240E: the first insulating layer 242, 294a: side wall 242-1: first side wall 242-2: second side wall 242-3: third side wall 250, 250C, 250E: reflective layer 250a: the first refractive index sublayer 250b: second refractive index sublayer 250c: the third refractive index sublayer 250d: the fourth refractive index sublayer 250e: the fifth refractive index sublayer 250f: sixth refractive index sublayer 251, 261: Part 1 252, 262: Part Two 252e: edge 260: second insulating layer 261a: first surface 261b: second surface 270: Adhesive layer 272: Adhesive pattern 280: second conductive layer 290: Convex structure 292: The first conductive layer 294: bumps 294b: first surface AG: Gap C: Composite common electrode D: distance DBR1: First Distributed Bragg Reflector DBR2: Second Distributed Bragg Reflector DBR3: Third Distributed Bragg Reflector L: light beam L1: first color light L2: second color light L3: third color light OVSS: signal input terminal PX: pixel structure P: Pitch SPX: sub-pixel structure SPX1: The first sub-pixel structure SPX2: Second sub-pixel structure SPX3: The third sub-pixel structure W: width α, β, θ: angle φ: divergence angle I-I', II-II', III-III', IV-IV', V-V': broken line
圖1為本發明一實施例之顯示裝置10的剖面示意圖。
圖2為本發明一實施例之顯示裝置10的上視示意圖。
圖3為本發明一實施例之顯示裝置10A的剖面示意圖。
圖4為本發明一實施例之顯示裝置10A的剖面示意圖。
圖5為本發明一實施例之顯示裝置10A的上視示意圖。
圖6為本發明一實施例之顯示裝置10B的上視示意圖。
圖7為本發明一實施例之顯示裝置10C的剖面示意圖。
圖8為本發明一實施例之顯示裝置10C的剖面示意圖。
圖9為本發明一實施例之顯示裝置10C的上視示意圖。
圖10為本發明一實施例之顯示裝置10D的剖面示意圖。
圖11為本發明一實施例之顯示裝置10E的剖面示意圖。
圖12為本發明一實施例之顯示裝置10F的剖面示意圖。
FIG. 1 is a schematic cross-sectional view of a
10:顯示裝置 10: Display device
100:畫素陣列基板 100:Pixel array substrate
110:第一基底 110: First base
120:子畫素電路 120: Sub-pixel circuit
130:第一電極 130: first electrode
140:畫素定義層 140:Pixel definition layer
140a、220a、240a:開口 140a, 220a, 240a: openings
150:發光圖案 150: Luminous pattern
150R:第一彩色濾光圖案 150R: The first color filter pattern
150G:第二彩色濾光圖案 150G: Second color filter pattern
150B:第三彩色濾光圖案 150B: the third color filter pattern
160:共用電極 160: common electrode
170:封裝層 170: encapsulation layer
200:對向基板 200: opposite substrate
210:第二基底 210:Second Base
220:遮光圖案層 220: shading pattern layer
220e、252e:邊緣 220e, 252e: edge
230:彩色濾光圖案 230: Color filter pattern
230R:第一彩色濾光圖案 230R: The first color filter pattern
230G:第二彩色濾光圖案 230G: Second color filter pattern
230B:第三彩色濾光圖案 230B: the third color filter pattern
240:第一絕緣層 240: first insulating layer
242:側壁 242: side wall
250:反射層 250: reflective layer
251、261:第一部
251, 261:
252、262:第二部 252, 262: Part Two
260:第二絕緣層 260: second insulating layer
261a:第一表面 261a: first surface
261b:第二表面 261b: second surface
270:黏著層 270: Adhesive layer
D:距離 D: distance
L:光束 L: light beam
L1:第一色光 L1: first color light
L2:第二色光 L2: second color light
L3:第三色光 L3: third color light
SPX:子畫素結構 SPX: sub-pixel structure
SPX1:第一子畫素結構 SPX1: The first sub-pixel structure
SPX2:第二子畫素結構 SPX2: Second sub-pixel structure
SPX3:第三子畫素結構 SPX3: The third sub-pixel structure
α、θ:角度 α, θ: angle
φ:發散角 φ: divergence angle
I-I’:剖線 I-I': section line
Claims (17)
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TW110142013A TWI786941B (en) | 2021-11-11 | 2021-11-11 | Display apparatus |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100090595A1 (en) * | 2008-10-15 | 2010-04-15 | Sony Corporation | Reflection plate, light-emitting device and method of manufacturing reflection plate |
TW201349482A (en) * | 2012-03-30 | 2013-12-01 | Dainippon Printing Co Ltd | Color-filter substrate used in organic electroluminescence display, color filter for organic electroluminescence display, and organic electroluminescence display |
CN113078180A (en) * | 2021-06-07 | 2021-07-06 | 苏州华星光电技术有限公司 | Display panel and display device |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100090595A1 (en) * | 2008-10-15 | 2010-04-15 | Sony Corporation | Reflection plate, light-emitting device and method of manufacturing reflection plate |
TW201349482A (en) * | 2012-03-30 | 2013-12-01 | Dainippon Printing Co Ltd | Color-filter substrate used in organic electroluminescence display, color filter for organic electroluminescence display, and organic electroluminescence display |
CN113078180A (en) * | 2021-06-07 | 2021-07-06 | 苏州华星光电技术有限公司 | Display panel and display device |
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TW202319818A (en) | 2023-05-16 |
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