TWI784598B - Self-healing copolymerized polymer material and manufacturing method thereof as well as light-emitting material, white led backlight display, conductive electrode material, organic light-emitting diode, and flexible light-emitting electronic device containing the same - Google Patents

Self-healing copolymerized polymer material and manufacturing method thereof as well as light-emitting material, white led backlight display, conductive electrode material, organic light-emitting diode, and flexible light-emitting electronic device containing the same Download PDF

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TWI784598B
TWI784598B TW110122965A TW110122965A TWI784598B TW I784598 B TWI784598 B TW I784598B TW 110122965 A TW110122965 A TW 110122965A TW 110122965 A TW110122965 A TW 110122965A TW I784598 B TWI784598 B TW I784598B
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healing
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mdi
polymer material
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TW202300548A (en
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郭霽慶
何權倫
梁芳誠
卓家榮
曾永儒
曾嬿霖
芮祥鵬
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國立臺北科技大學
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Abstract

The instant invention provides a self-healing copolymerized polymer material and a manufacturing method thereof as well as a light-emitting material, a white led backlight display, a conductive electrode material, an organic light-emitting diode, and a flexible light-emitting electronic device containing the same. The self-healing copolymerized polymer material is PDMS-MDI x-TFB 1-x, wherein x is 0.1-0.9. By adjusting the ratio of MDI and TFB, the synthesized self-healing copolymerized polymer material has excellent performance. A higher ratio of TFB has better self-healing efficiency, and can be self-healing under various circumstances.

Description

可自我修復之共聚合高分子材料及其製造方法以及包含其之發光材料、白光LED背光顯示器、導電電極材料、有機發光二極體及柔性發光電子元件Self-healing copolymerized polymer material and its manufacturing method, as well as light-emitting material containing it, white LED backlight display, conductive electrode material, organic light-emitting diode and flexible light-emitting electronic components

本發明提供一種可自我修復之共聚合高分子材料及其製造方法以及包含其之發光材料、白光LED背光顯示器、導電電極材料、有機發光二極體及柔性發光電子元件,特別係該共聚合高分子材料為聚二甲基矽氧烷(PDMS)、二苯基甲烷二異氰酸酯(MDI)與1,3,5-苯三甲醛(TFB)之共聚合高分子。The invention provides a self-healing copolymerized polymer material and its manufacturing method, as well as a luminescent material containing the same, a white LED backlight display, a conductive electrode material, an organic light-emitting diode and a flexible light-emitting electronic component, especially the copolymerized high polymer material. The molecular material is a copolymerized polymer of polydimethylsiloxane (PDMS), diphenylmethane diisocyanate (MDI) and 1,3,5-benzenetricarbaldehyde (TFB).

材料科學領域中,高分子佔有非常重要的地位,高分子也是目前人類最廣泛使用的材料,高分子材料的使用可追溯於原始時代人類使用樹皮、稻草等天然高分子材料。二十世紀後,以人造合成的方式製作出高分子材料。1941年,英國人Whinfield 和 Dickson首先合成出聚對苯二甲酸乙二酯(PET),隨後著名的美國杜邦公司生產達克龍纖維、特麗綾(Terylene)、特麗綸(Terlenka)和特多龍(Tetoron)等人造纖維,藉此人們開始大量使用PET纖維製作成衣服,並廣泛使用合成高分子材料。In the field of material science, polymers occupy a very important position. Polymers are also the most widely used materials by humans. The use of polymer materials can be traced back to the use of natural polymer materials such as bark and straw in primitive times. After the 20th century, polymer materials were produced by artificial synthesis. In 1941, the British Whinfield and Dickson first synthesized polyethylene terephthalate (PET), and then the famous American DuPont Company produced Dacron fiber, Terylene, Terlenka and Terlenka. Man-made fibers such as Tetoron, through which people began to use a large number of PET fibers to make clothes, and widely used synthetic polymer materials.

由於許多材料經年累月的風吹日曬會逐漸產生材料老化、破損等問題,因此科學家開始思考是否可將人類受傷時,能夠自我修復的特性轉移至高分子材料上,如此就可避免時常更換材料且延長材料使用壽命。Since many materials are exposed to the wind and the sun for many years, they will gradually cause problems such as material aging and damage. Therefore, scientists began to think whether it is possible to transfer the self-healing properties of human beings to polymer materials, so as to avoid frequent replacement of materials and prolong the life of materials. service life.

在建築業最早開始使用自我修復材料,他們將可產生交聯反應的癒合劑以微胞的方式包埋入水泥中,當微胞遭到破壞時,便可釋放癒合劑產生交聯而自我修復。但由於包埋的微胞只能進行一次性的自我修復,因此開始使用可逆的動態化學鍵進行自我修復,例如: 雙烯加成反應 (Diels-Alder reaction)、硫醇反應與可逆亞胺鍵等。The construction industry first started to use self-healing materials. They embedded the healing agent that can produce cross-linking reactions into the cement in the form of microcells. When the microcells are destroyed, they can release the healing agent to generate cross-linking and self-healing. . However, since the embedded microcells can only perform one-time self-repair, reversible dynamic chemical bonds are used for self-repair, such as: Diels-Alder reaction, thiol reaction and reversible imine bond, etc. .

除了上述的共價化學鍵外,也有許多科學家利用各種不同作用力進行自我修復,例如: 氫鍵作用力、靜電作用力與疏水作用力等。自我修復高分子材料具有跟人體皮膚類似的自我修復功能,許多人開始將自我修復高分子製作成人工電子皮膚(E-skin),目前大多將此電子皮膚使用於機器手臂中,未來可將人工電子皮膚應用於機器人。In addition to the above-mentioned covalent chemical bonds, many scientists also use various forces for self-healing, such as hydrogen bond forces, electrostatic forces, and hydrophobic forces. Self-healing polymer materials have a self-healing function similar to that of human skin. Many people have begun to make self-healing polymers into artificial electronic skin (E-skin). Currently, this electronic skin is mostly used in robotic arms. In the future, artificial Electronic skin applied to robots.

然而,以往的自我修復高分子需要經由加熱觸發其自我修復機制,而須使自我修復反應啟動之反應溫度大多需超過100℃,由於此溫度過高在使用上較為不便也易造成危險,是以,為解決上述問題,本發明人開始著手於自我修復高分子之修復機制的改良。However, the self-healing polymers in the past need to be heated to trigger their self-healing mechanism, and the reaction temperature to start the self-healing reaction usually needs to exceed 100°C. Because the temperature is too high, it is inconvenient to use and easy to cause danger. Therefore, , In order to solve the above problems, the present inventors started to improve the repair mechanism of self-healing polymers.

本發明人開發出一款在室溫下即可進行自我修復的高分子材料,且本發明之可自我修復之共聚合高分子材料使用雙重自我修復機制,提高自我修復效率及在低溫(-10℃)也可進行自我修復。The inventors have developed a polymer material that can be self-repaired at room temperature, and the self-repairable copolymerized polymer material of the present invention uses a dual self-repair mechanism to improve self-repair efficiency and maintain low temperature (-10 ℃) can also perform self-healing.

本發明之可自我修復之共聚合高分子材料,其係為:聚二甲基矽氧烷(PDMS)、二苯基甲烷二異氰酸酯(MDI)與1,3,5-苯三甲醛(TFB)之共聚合高分子PDMS-MDI x-TFB 1-x,其中X為0.1~0.9 。 The self-healing copolymer polymer material of the present invention is: polydimethylsiloxane (PDMS), diphenylmethane diisocyanate (MDI) and 1,3,5-benzenetricarbaldehyde (TFB) The copolymerized polymer PDMS-MDI x -TFB 1-x , wherein X is 0.1~0.9.

進一步地,所述之共聚合高分子材料,其中該X為0.4。Further, in the copolymerized polymer material, X is 0.4.

進一步地,所述之共聚合高分子材料,其具有氫鍵與亞胺鍵之自我修復官能基。Further, the copolymerized polymer material has self-healing functional groups with hydrogen bonds and imine bonds.

進一步地,所述之共聚合高分子材料,其具有PDI (Polymer dispersity index,聚合物分散指數)為1.4~1.7。Further, the copolymerized polymer material has a PDI (Polymer dispersion index, polymer dispersion index) of 1.4-1.7.

進一步地,所述之共聚合高分子材料,其玻璃轉移溫度(T g)為-110至-130°C。 Further, the glass transition temperature (T g ) of the copolymerized polymer material is -110 to -130°C.

本發明亦提供一種可自我修復之共聚合高分子材料之方法,包含: (1) 將雙(3-氨基丙基)封端聚二甲基矽烷(bis(3-aminopropyl)-terminated poly(dimethylsiloxane),NH 2-PDMS-NH 2)與二苯基甲烷二異氰酸酯(4,4-methylenebis(phenyl isocyanate),MDI)聚合得到PDS-MDI;及 (2)將該PDS-MDI與1,3,5-苯三甲醛(1,3,5-triformylbenzene,TFB)聚合,得到PDMS-MDI-TFB。 The present invention also provides a method for self-healing copolymerized polymer materials, comprising: (1) bis(3-aminopropyl)-terminated poly(dimethylsiloxane) ), NH 2 -PDMS-NH 2 ) and diphenylmethane diisocyanate (4,4-methylenebis (phenyl isocyanate), MDI) polymerization to obtain PDS-MDI; and (2) the PDS-MDI and 1,3, 5-Benzenetriformaldehyde (1,3,5-triformylbenzene, TFB) was polymerized to obtain PDMS-MDI-TFB.

此外/或者,本發明提供一種發光材料包含所述之共聚合高分子材料混摻鈣鈦礦量子點。In addition/alternatively, the present invention provides a luminescent material comprising the copolymerized polymer material mixed with perovskite quantum dots.

本發明亦提供一種白光LED背光顯示器,包含一藍光LED芯片,及於其上分別疊加兩層之發光材料,其中該兩層發光材料分別為共聚合高分子材料混摻綠色之鈣鈦礦量子點,以及所述之共聚合高分子材料混摻紅色之鈣鈦礦量子點。The present invention also provides a white LED backlight display, which includes a blue LED chip and two layers of luminescent materials superimposed on it, wherein the two layers of luminescent materials are respectively copolymerized polymer materials mixed with green perovskite quantum dots , and the copolymerized polymer material mixed with red perovskite quantum dots.

本發明亦提供一種導電電極材料,其包含所述之共聚合高分子材料混摻奈米金屬線。The present invention also provides a conductive electrode material, which comprises the above-mentioned copolymerized polymer material mixed with nano metal wires.

進一步地,如所述之導電電極材料,其中該奈米金屬線為金屬銀線。Further, the conductive electrode material as described above, wherein the nanometer metal wires are metallic silver wires.

本發明亦提供一種有機發光二極體,其包含一發光層以及如所述之導電電極材料做為電極。The present invention also provides an organic light-emitting diode, which includes a light-emitting layer and the above-mentioned conductive electrode material as electrodes.

另一方面,本發明亦提供一種柔性發光電子元件,其包含如所述之有機發光二極體,並以一絕緣膜阻隔該發光層及該電極,且該絕緣膜未完全覆蓋該發光層,使彎折該柔性發光電子元件時,該發光層及該電極接觸。On the other hand, the present invention also provides a flexible light-emitting electronic component, which includes the above-mentioned organic light-emitting diode, and an insulating film is used to block the light-emitting layer and the electrode, and the insulating film does not completely cover the light-emitting layer, When bending the flexible light-emitting electronic element, the light-emitting layer and the electrode are in contact.

相較於習知技術,本發明之共聚合高分子材料在室溫下可自我修復,且其使用雙重自我修復機制,提高自我修復效率,甚至在低溫(-10℃)下也可進行自我修復,大幅增加此種高分子材料的商業利用度。Compared with the conventional technology, the copolymerized polymer material of the present invention can self-heal at room temperature, and it uses a dual self-healing mechanism to improve self-healing efficiency, and can also perform self-healing at low temperature (-10°C) , greatly increasing the commercial utilization of this polymer material.

本發明以下敘述為此技術領域中通常知識者可輕易明瞭此發明之必要技術,且只要不違反其中的精神及範圍,就可以多樣的改變及修飾這個發明來適應不同的用途及狀況。如此,其他的實施例亦包含於申請專利範圍中。The present invention is described below so that those skilled in the art can easily understand the essential technology of this invention, and as long as it does not violate the spirit and scope, this invention can be changed and modified in various ways to adapt to different uses and situations. In this way, other embodiments are also included in the scope of the patent application.

有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必照實際比例繪製,該等圖式及其比例並非用以限制本發明之範圍,在此先行敘明。The detailed description and technical contents of the present invention are described as follows with respect to the accompanying drawings. Furthermore, for the convenience of explanation, the proportions of the drawings in the present invention are not necessarily drawn according to the actual scale. These drawings and their proportions are not intended to limit the scope of the present invention, and are described here first.

除非另有定義,否則本文中使用的所有技術和科學術語之含義與本發明所屬領域之一般技術人員通常理解的含義相同。在整個本申請中使用的下列術語應具有以下含義。Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The following terms used throughout this application shall have the following meanings.

本發明提供一種可自我修復之共聚合高分子材料,其係為:PDMS-MDI x-TFB 1-x,其中 X為0.1~0.9。又,本發明亦關於一種製造如前所述之可自我修復之共聚合高分子材料之方法,包含:(1) 將雙(3-氨基丙基)封端聚二甲基矽烷(bis(3-aminopropyl)-terminated poly(dimethylsiloxane),NH 2-PDMS-NH 2)與二苯基甲烷二異氰酸酯(4,4-methylenebis(phenyl isocyanate),MDI)聚合得到PDS-MDI;及(2)將該PDS-MDI與1,3,5-苯三甲醛(1,3,5-triformylbenzene,TFB)聚合,得到PDMS-MDI-TFB。 The invention provides a self-healing copolymerized polymer material, which is: PDMS-MDI x -TFB 1-x , wherein X is 0.1-0.9. Moreover, the present invention also relates to a method for manufacturing the aforementioned self-healing copolymerized polymer material, comprising: (1) bis(3-aminopropyl)-terminated polydimethylsilane (bis(3 -aminopropyl)-terminated poly(dimethylsiloxane), NH 2 -PDMS-NH 2 ) and diphenylmethane diisocyanate (4,4-methylenebis(phenyl isocyanate), MDI) are polymerized to obtain PDS-MDI; and (2) the PDS-MDI is polymerized with 1,3,5-triformylbenzene (TFB) to obtain PDMS-MDI-TFB.

前述PDMS-MDI x-TFB 1-x中之 X為0.1~0.9,例如:0.1、0.2、0.3、0.4、0.5、0.6、0.7、0.8或0.9。於一較佳實施例中,該 X為0.4。 X in the aforementioned PDMS-MDI x -TFB 1-x is 0.1-0.9, for example: 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8 or 0.9. In a preferred embodiment, the X is 0.4.

本文所述之「自我修復」機制主要分為包埋型與本質型,然而,由於包埋型自我修復有極大的缺點,當包埋的癒合劑釋放完後,無法再進行自我修復,因此本發明之自我修復機制是以本質型自我修復為主,在高分子設計上必須放入能夠被破壞後又能重新組合的鍵結,引入可逆化學反應進行自我修復。本質型自我修復為化學鍵破壞與生成的可逆現象,分為可逆共價鍵與非共價鍵,於一較佳實施例中,本發明PDMS-MDI x-TFB 1-x使用非共價鍵的氫鍵與可逆共價鍵的亞胺鍵,同時含有兩種可自我修復的官能基。 The "self-healing" mechanism described in this article is mainly divided into embedded type and essential type. However, due to the great disadvantage of embedded type self-healing, when the embedded healing agent is released, self-repairing cannot be performed any more, so this paper The self-healing mechanism of the invention is based on the essential type of self-healing. Bonds that can be destroyed and then recombined must be placed in the design of the polymer, and reversible chemical reactions must be introduced for self-healing. Essential self-healing is a reversible phenomenon of chemical bond destruction and generation, which is divided into reversible covalent bonds and non-covalent bonds. In a preferred embodiment, the PDMS-MDI x -TFB 1-x of the present invention uses non-covalent bonds Hydrogen bonds and imine bonds of reversible covalent bonds contain two self-healing functional groups at the same time.

本文所述之「自我修復官能基」係指該共聚合高分子材料使用能含氫鍵的官能基團與可逆共價鍵型利用動態化學鍵的機制作為主要產生自我修復的要素。氫鍵通常發生在兩個電負度高的原子(N、O、F)上,氫原子先以共價鍵結在一原子上,再以氫鍵作用力鍵結另一原子,由於共價鍵結之原子具有強大的陰電性,使氫原子上的電子雲被吸引,因此氫原子但有強大的正電,同時受到另一原子上負電的吸引,進而產生氫鍵作用力。在此氫鍵型自我修復高分子中,經常以縮合聚合方式產生具有氫鍵之官能基團,像是以羧酸基與胺基形成醯胺鍵結(amide)或是異氰酸酯基與胺基形成脲基團(urea)。典型的可逆共價鍵結有Diels-Alder reaction,利用共軛雙烯與烯烴形成環己烯的環加成反應,由於此反應具有可逆性,達到自我修復的效果。而二硫鍵也是一種具有可逆性的反應,當二硫鍵分解後,還原成硫醇,再重新鍵結形成二硫鍵產生自我修復。The "self-healing functional group" mentioned in this article means that the copolymerized polymer material uses a functional group capable of hydrogen bonding and a reversible covalent bond type utilizing a dynamic chemical bond mechanism as the main elements for self-healing. Hydrogen bonds usually occur on two atoms with high electronegativity (N, O, F). The hydrogen atoms are first covalently bonded to one atom, and then bonded to the other atom by hydrogen bonding force. Due to the covalent The bonded atom has a strong negative charge, which attracts the electron cloud on the hydrogen atom, so the hydrogen atom has a strong positive charge, and is attracted by the negative charge on the other atom, thereby generating a hydrogen bond force. In this hydrogen-bonded self-healing polymer, functional groups with hydrogen bonds are often generated by condensation polymerization, such as amide bonds formed by carboxylic acid groups and amine groups or amide bonds formed by isocyanate groups and amine groups. Urea group (urea). A typical reversible covalent bond is the Diels-Alder reaction, which uses the cycloaddition reaction of conjugated diene and olefin to form cyclohexene. Due to the reversibility of this reaction, it achieves the effect of self-healing. The disulfide bond is also a reversible reaction. When the disulfide bond is decomposed, it is reduced to a thiol, and then re-bonded to form a disulfide bond to generate self-repair.

氫鍵型自我修復需要利用提高溫度而破壞氫鍵,當移除溫度時,產生氫鍵的脲基團重新鍵結產生自我修復。以往可逆共價型自我修復也需加熱產生反應,但本發明PDMS-MDI x-TFB 1-x之可逆亞胺鍵在室溫下時,就可進行可逆反應,因此當未鍵結的胺基與醛基碰觸時,即可產生可逆亞胺鍵,進行自我修復。本發明之共聚合高分子材料利用多種的機制以有效提高自我修復的效率。 Hydrogen-bonded self-healing requires the use of increased temperature to break hydrogen bonds. When the temperature is removed, the urea groups that generate hydrogen bonds rebond to produce self-healing. In the past, reversible covalent self-healing also required heating to generate a reaction, but the reversible imine bond of the PDMS-MDI x -TFB 1-x of the present invention can undergo a reversible reaction at room temperature, so when the unbonded amine group When in contact with an aldehyde group, a reversible imine bond can be generated for self-healing. The copolymerized polymer material of the present invention utilizes multiple mechanisms to effectively improve the efficiency of self-healing.

於一較佳實施例中,該共聚合高分子材料具有PDI (Polymer dispersity index,聚合物分散指數)為1.4~1.7,例如:1.4、1.5、1.6或1.7。當PDI值太大時,表示分子量分佈過大,分子鏈長度不均,此現象會造成自我修復基團分離後,不易進行重組而導致自我修復效果下降,當PDI值大於2時,呈現較差的自我修復效果。In a preferred embodiment, the copolymerized polymer material has a PDI (Polymer dispersion index) of 1.4-1.7, for example: 1.4, 1.5, 1.6 or 1.7. When the PDI value is too large, it means that the molecular weight distribution is too large and the length of the molecular chain is uneven. This phenomenon will cause the self-repairing group to be separated and difficult to recombine, resulting in a decline in the self-repairing effect. When the PDI value is greater than 2, it will show poor self-repair. Repair effect.

於一較佳實施例中,該共聚合高分子材料具有玻璃轉移溫度為-110至-130℃,例如:-110至-130℃、-110至-125℃、-110至-120℃、-110至-115℃、-115至-130℃、-115至-125℃、-115至-120℃、-120至-130℃、-120至-125℃或-125至-130℃。本文所述之「玻璃轉移溫度(Tg)」為高分子材料在玻璃態(Glassy state)轉變成橡膠態(Rubber state)時的溫度範圍稱之為玻璃轉移溫度。當高分子溫度高於玻璃轉移溫度時,會由較硬脆的玻璃態轉變為較軟韌的橡膠態。將E”/E’為阻尼曲線tanδ視為高分子材料之Tg點;其中,儲存模數(Storage modulus,E’)為顯示材料中的彈性性質及外來因素的抵抗力作為依據而所測得的參數,損失模數(Loss modulus,E”)為顯示材料中的黏性性質及外來因素作用力的消耗作為依據而所測得的參數。當Tg點越低時,表示高分子鏈越容易移動,使能夠進行自我修復之官能基容易碰觸進而達到自我修復的效果。高分子之玻璃轉移溫度可以使用動態熱分析儀(DMA)進行量測。 In a preferred embodiment, the copolymerized polymer material has a glass transition temperature of -110 to -130°C, for example: -110 to -130°C, -110 to -125°C, -110 to -120°C, - 110 to -115°C, -115 to -130°C, -115 to -125°C, -115 to -120°C, -120 to -130°C, -120 to -125°C, or -125 to -130°C. The "glass transition temperature (T g )" mentioned in this article refers to the temperature range when the polymer material changes from the glassy state to the rubber state, which is called the glass transition temperature. When the polymer temperature is higher than the glass transition temperature, it will change from a hard and brittle glass state to a soft and tough rubber state. E”/E’ is the damping curve tanδ as the T g point of the polymer material; among them, the storage modulus (Storage modulus, E’) is measured based on the elastic properties of the material and the resistance of external factors The parameters obtained, the loss modulus (Loss modulus, E") is a parameter measured based on the viscous properties of the material and the consumption of external factors. When the T g point is lower, it means that the polymer chain is easier to move, making it easier for the functional groups capable of self-repair to touch and achieve the effect of self-repair. The glass transition temperature of polymers can be measured using a dynamic thermal analyzer (DMA).

本發明另一方面提供多種可自我修復之共聚合高分子材料之應用,例如包含該共聚合高分子材料之發光材料、白光LED背光顯示器、導電電極材料、有機發光二極體、柔性發光電子元件等。 Another aspect of the present invention provides a variety of applications of self-healing copolymerized polymer materials, such as luminescent materials containing the copolymerized polymer materials, white LED backlight displays, conductive electrode materials, organic light-emitting diodes, flexible light-emitting electronic components Wait.

本發明所提供之發光材料,於一較佳實施例中,包含如前所述之共聚合高分子材料混摻鈣鈦礦量子點。本發明所提供之白光LED背光顯示器,於一較佳實施例中,包含一藍光LED芯片,及於其上分別疊加兩層如前所述之發光材料,其中該兩層發光材料分別為共聚合高分子材料混摻綠色之鈣鈦礦量子點,以及共聚合高分子材料混摻紅色之鈣鈦礦量子點。 In a preferred embodiment, the luminescent material provided by the present invention comprises the aforementioned copolymerized polymer material mixed with perovskite quantum dots. In a preferred embodiment, the white light LED backlight display provided by the present invention comprises a blue light LED chip, and two layers of luminescent materials as mentioned above are stacked respectively on it, wherein the two layers of luminescent materials are respectively copolymerized The polymer material is mixed with green perovskite quantum dots, and the copolymerized polymer material is mixed with red perovskite quantum dots.

本文中所述之「鈣鈦礦(Perovskite)」材料意指一類結晶陶瓷氧化物,結構為體心立方結構,此類晶體之分子通式一般以ABX3表示,其中A、B是陽離子,而X大部分為氧或鹵素等陰離子,其中A例如:CH3NH3 +、銫陽離子(Cs+)、CH3NH3 +或Formamidinium(HC(NH2)2+)等,但本發明不限於此等;其中B 例如:Pb2+、Ge2+、Sn2+等,但本發明不限於此等;其中X例如:氧離子、氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等,或包含其等之氧機團或鹵素基團,但本發明不限於此等。鈣鈦礦材料可從八面體結構的精細控制達到不同結構維度2D、1D、0D結構,而鈣鈦礦量子點為準零的奈米材料,三個維度尺寸皆在100奈米以下,晶格大小為2-20奈米,由於鈣鈦礦量子點具有波長可調性、高量子效率與窄半高寬,為本發明優選之發光材料。此外,可經由調控鈣鈦礦中的鹵素成分,得到不同顏色的發光材料。 The "Perovskite" material mentioned in this article refers to a class of crystalline ceramic oxides with a body-centered cubic structure. The molecular formula of this type of crystal is generally represented by ABX 3 , where A and B are cations, and Most of X are anions such as oxygen or halogen, wherein A is for example: CH 3 NH 3 + , cesium cation (Cs + ), CH 3 NH 3 + or Formamidinium (HC(NH 2 ) 2+ ), etc., but the present invention is not limited to and so on; where B is for example: Pb 2+ , Ge 2+ , Sn 2+ , etc., but the present invention is not limited thereto; where X is for example: oxygen ion, chloride ion (Cl - ), bromide ion (Br - ), iodine Ions (I - ), etc., or oxygen groups or halogen groups containing them, but the present invention is not limited thereto. Perovskite materials can achieve 2D, 1D, and 0D structures in different structural dimensions from the fine control of the octahedral structure, while the perovskite quantum dots are quasi-zero nanomaterials, and the three dimensions are all below 100 nanometers. The lattice size is 2-20 nanometers. Since the perovskite quantum dot has wavelength tunability, high quantum efficiency and narrow half-width, it is the preferred light-emitting material of the present invention. In addition, luminescent materials of different colors can be obtained by adjusting the halogen composition in the perovskite.

於本文中,使用接觸角儀用來量測物質與水滴所產生之接觸角,並以接觸角大小判斷物質親、疏水性,利用這些數據可以改善物質表面的相容性。接觸角最常見的量測方法為座滴法(Sessile Drop),在固體平面上進行液滴滴定,其原理根據接觸角計算理論Young’s equation。當物質與水滴接觸角越大時,疏水性越高;物質與水滴接觸角越小時,親水性越高。當接觸角小於10度時,稱為超親水性,接觸角介於10~90度為親水性,90~120度為疏水性,大於120度稱為超疏水性。於一較佳實施例中,本發明之發光材料所製成之薄膜具有疏水性。於一較佳實施例中,本發明之發光材料所製成之薄膜具有接觸角為90~120度,例如:90°~120°、90°~115°、90°~110°、90°~105°、90°~100°、90°~95°、95°~120°、95°~115°、95°~110°、95°~105°、95°~100°、100°~120°、100°~115°、100°~110°、100°~105°、105°~120°、105°~115°、105°~110°、110°~120°或110°~115°。 In this paper, the contact angle meter is used to measure the contact angle between the substance and water droplets, and the affinity and hydrophobicity of the substance can be judged by the contact angle. These data can be used to improve the compatibility of the surface of the substance. The most common measurement method for contact angle is the sessile drop method (Sessile Drop), which performs drop titration on a solid plane. The principle is based on the contact angle calculation theory Young’s equation. The larger the contact angle between a substance and a water droplet, the higher the hydrophobicity; the smaller the contact angle between a substance and a water droplet, the higher the hydrophilicity. When the contact angle is less than 10 degrees, it is called superhydrophilic; when the contact angle is between 10 and 90 degrees, it is hydrophilic; between 90 and 120 degrees, it is hydrophobic; and if it is greater than 120 degrees, it is called superhydrophobicity. In a preferred embodiment, the film made of the luminescent material of the present invention is hydrophobic. In a preferred embodiment, the film made of the luminescent material of the present invention has a contact angle of 90°~120°, for example: 90°~120°, 90°~115°, 90°~110°, 90°~ 105°, 90°~100°, 90°~95°, 95°~120°, 95°~115°, 95°~110°, 95°~105°, 95°~100°, 100°~120° , 100°~115°, 100°~110°, 100°~105°, 105°~120°, 105°~115°, 105°~110°, 110°~120° or 110°~115°.

本發明所提供之導電電極材料,於一較佳實施例中,包含如前所述之共聚合高分子材料混摻奈米金屬線。本發明所提供之有機發光二極體,於一較佳實施例中,包含一發光層以及如前所述之導電電極材料做為電極。此外,本發明所提供之柔性發光電子元件,其包含如前所述之有機發光二極體,並以一絕緣膜阻隔該發光層及該電極,且該絕緣膜未完全覆蓋該發光層,使彎折該柔性發光電子元件時,該發光層及該電極接觸。In a preferred embodiment, the conductive electrode material provided by the present invention comprises the aforementioned copolymerized polymer material mixed with nano metal wires. In a preferred embodiment, the organic light-emitting diode provided by the present invention includes a light-emitting layer and the above-mentioned conductive electrode material as electrodes. In addition, the flexible light-emitting electronic component provided by the present invention includes the above-mentioned organic light-emitting diode, and an insulating film is used to block the light-emitting layer and the electrode, and the insulating film does not completely cover the light-emitting layer, so that When the flexible light-emitting electronic element is bent, the light-emitting layer and the electrode are in contact.

本文所述之「奈米金屬線」,係為直徑是奈米(10 -9公尺)等級,而在長度上沒有限制的一維結構。奈米金屬線有眾多種類,其中奈米金、銀、銅等奈米線除具有優良的導電性質外,在奈米等級的尺寸效應下,還具優異的透光性、耐曲撓性。因此,被視為最具替代傳統氧化銦錫(ITO)透明電極之材料,為實現柔性、可彎折LED顯示、觸碰式螢幕等應用提供了最佳的可能性;此外,亦可用於薄膜太陽能電池。奈米銅線、奈米銀線具大的長徑比特性,使其在導電膠、導熱膠也具有相當的優勢;其他例如大長徑比的奈米金線、奈米碲線或各式奈米金屬氧化物如氧化鈦奈米線、氧化鉬奈米線、氧化鎢奈米線及氧化鋁奈米線等。於一較佳實施例中,該導電電極材料中的該奈米金屬線為金屬銀線。 The "nanometal wire" mentioned in this article refers to a one-dimensional structure with a diameter of nanometers (10 -9 meters) and no limitation in length. There are many types of metal nanowires. Among them, nanowires such as gold nanoparticles, silver nanoparticles, and copper nanoparticles not only have excellent electrical conductivity, but also have excellent light transmission and flex resistance under the nanoscale size effect. Therefore, it is considered to be the most suitable material to replace the traditional indium tin oxide (ITO) transparent electrode, providing the best possibility for the realization of flexible, bendable LED display, touch screen and other applications; in addition, it can also be used for thin films Solar battery. Nano-copper wires and nano-silver wires have large aspect ratio characteristics, so that they also have considerable advantages in conductive adhesives and thermal conductive adhesives; others such as nano-gold wires with large aspect ratios, nano-tellurium wires or various Nano metal oxides such as titanium oxide nanowires, molybdenum oxide nanowires, tungsten oxide nanowires and aluminum oxide nanowires. In a preferred embodiment, the nanometer metal wires in the conductive electrode material are metallic silver wires.

本文所述之「有機發光二極體(OLED:Organic Light Emitting Diode)」是由上下兩個電極於中間夾附有機材料所組成之極薄的疊構元件所製成。相對於無機發光二極體主要以金屬作為發光層,有機發光二極體使用有機高分子材料作為發光層。因為OLED自發光特性不需要背光模組,因此所製成之顯示器可以更輕薄,且有機材料適用製作於軟性基板上,可使面板具有可撓的特性。OLED技術之透明技術手段為採用透明導體作為電極,在合適下板設計的搭配下即可達到透明顯示之功效。前述作為發光層之有機高分子材料較佳可以係:聚噻吩類(polythiophene)、聚芴類(polyfluorene,PF)、聚對苯乙烯類(poly(p-phenylene-vinylene))、聚矽烷類、聚乙炔類、聚乙烯基咔唑類或其等之衍生物,例如聚[(9,9-雙(3’-(N,N-二甲基胺基)丙基)-2,7-芴)-alt-2,7-(9,9-二辛基芴)] (Poly[(9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt-2,7-(9,9-dioctylfluorene)], PFN)或聚[9,9-雙{6(N,N-二甲基氨基)己基}芴-共-2,5-噻吩(poly[9,9-bis{6(N,N-dimethylamino)hexyl} fluorene-co-2,5-thienylene, PFT)等,但本發明不限於此。於一較佳實施例中,使用聚芴作為有機發光層之材料,聚芴高分子因獨特的共軛結構用有優異的光電性質,為藍光發光材料。 實施例 The "OLED: Organic Light Emitting Diode" described in this article is made of an extremely thin stacked device composed of two upper and lower electrodes sandwiching organic materials in the middle. Compared with inorganic light-emitting diodes, which mainly use metal as the light-emitting layer, organic light-emitting diodes use organic polymer materials as the light-emitting layer. Because the self-luminous nature of OLED does not require a backlight module, the resulting display can be lighter and thinner, and the organic material is suitable for making on a flexible substrate, which can make the panel have flexible characteristics. The transparent technical method of OLED technology is to use transparent conductors as electrodes, and the effect of transparent display can be achieved with the matching of the lower plate design. The aforementioned organic polymer materials used as the light-emitting layer are preferably: polythiophene (polythiophene), polyfluorene (polyfluorene, PF), poly (p-phenylene-vinylene)), polysilane, Polyacetylenes, polyvinylcarbazoles or their derivatives, such as poly[(9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene )-alt-2,7-(9,9-dioctylfluorene)] (Poly[(9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt -2,7-(9,9-dioctylfluorene)], PFN) or poly[9,9-bis{6(N,N-dimethylamino)hexyl}fluorene-co-2,5-thiophene (poly[ 9,9-bis{6(N,N-dimethylamino)hexyl}fluorene-co-2,5-thienylene, PFT), etc., but the present invention is not limited thereto. In a preferred embodiment, polyfluorene is used as the material of the organic light-emitting layer. The polyfluorene polymer has excellent photoelectric properties due to its unique conjugated structure, and is a blue light-emitting material. Example

下文中,將進一步以詳細說明及實施態樣描述本發明,然而,應理解這些實施態樣僅用於幫助可更加容易理解本發明,而非用以限制本發明之範圍。 [實驗設備] Hereinafter, the present invention will be further described in detail and implementations, however, it should be understood that these implementations are only for helping to understand the present invention more easily, rather than limiting the scope of the present invention. [Laboratory equipment]

1.   真空合成系統:型號為玻璃真空合成組,供應商為科霖企業社。 2.   電子分析儀和精密天秤:型號為ATX224,供應商為 SHIMADZU公司。 3.   旋轉減壓濃縮機:型號為R-100,供應商為BUCHI公司。 4.   超音波震盪水槽:型號為DC200H,供應商為DELTA公司。 5.   真空烘箱:型號為DOV40,供應商為DENG YNG公司。 6.   核磁共振光譜儀( 1H-NMR):型號為Fourier300,供應商為BRUKER公司。 7.   熱分析-紅外線光譜儀(TG/FT-IR):型號為FT/IR-4600,供應商為JASCO公司。 8.   凝膠滲透層析儀(GPC):型號為RI-2031,plus,供應商為JASCO公司。 9.   熱重分析儀(TGA):型號為TG-209,供應商為NETZSCH公司。 10.  動態熱機械分析儀(DMA):型號為DMS 6100,供應商為Tech Max公司。 11.  萬能拉力試驗機:型號為QC508,供應商為Cometech公司。 12.  接觸角儀(Contact angle):型號為Phoenix300,供應商為SEO公司。 13.  光學顯微鏡(OM):型號為QC508,供應商為Cometech公司。 14.  場發式電子顯微鏡(FE-SEM):型號為S4800,供應商為HITACHI公司。 15.  紫外光-可見光光譜儀(UV-Vis):型號為V-730,供應商為JASCO公司。 16.  螢光光譜儀(PL):型號為Fluoromax,供應商為HORIBA公司。 17.  分光式輝度色度計(PR-670):型號為PR-670,供應商為SPECTRASCAN公司。 實施例 1- 可自我修復之共聚合高分子材料 PDMS-MDI x-TFB 1-x [合成方法] 1. Vacuum synthesis system: the model is a glass vacuum synthesis unit, and the supplier is Kelin Enterprise Co., Ltd. 2. Electronic analyzer and precision balance: the model is ATX224, and the supplier is SHIMADZU. 3. Rotary decompression concentrator: the model is R-100, and the supplier is BUCHI. 4. Ultrasonic oscillating water tank: the model is DC200H, and the supplier is DELTA Company. 5. Vacuum oven: the model is DOV40, and the supplier is DENG YNG Company. 6. Nuclear magnetic resonance spectrometer ( 1 H-NMR): the model is Fourier300, and the supplier is BRUKER. 7. Thermal analysis-infrared spectrometer (TG/FT-IR): the model is FT/IR-4600, and the supplier is JASCO. 8. Gel permeation chromatography (GPC): the model is RI-2031, plus, and the supplier is JASCO. 9. Thermogravimetric Analyzer (TGA): The model is TG-209, and the supplier is NETZSCH. 10. Dynamic Thermomechanical Analyzer (DMA): the model is DMS 6100, and the supplier is Tech Max. 11. Universal tensile testing machine: the model is QC508, and the supplier is Cometech. 12. Contact angle meter (Contact angle): the model is Phoenix300, and the supplier is SEO Company. 13. Optical microscope (OM): the model is QC508, and the supplier is Cometech. 14. Field-emission electron microscope (FE-SEM): the model is S4800, and the supplier is HITACHI. 15. Ultraviolet-visible spectrometer (UV-Vis): the model is V-730, and the supplier is JASCO. 16. Fluorescence spectrometer (PL): the model is Fluoromax, and the supplier is HORIBA. 17. Spectrophotometric luminance colorimeter (PR-670): the model is PR-670, and the supplier is SPECTRASCAN. Example 1 - self-healing copolymerized polymer material PDMS-MDI x -TFB 1-x [synthesis method]

如圖1所示,本發明之可自我修復之共聚合高分子材料,其以兩步法方式將雙(3-氨基丙基)封端聚二甲基矽氧烷(bis(3‐aminopropyl)‐terminated poly(dimethylsiloxane))、二苯基甲烷二異氰酸酯(4,4‐methylenebis(phenyl isocyanate))與1,3,5-苯三甲醛(1,3,5-triformylbenzene),利用縮合聚合並調控不同比例製備出具自我修復效果的聚二甲基矽氧烷高分子。以下進行兩步法之步驟說明。As shown in Figure 1, the self-healing copolymerized polymer material of the present invention uses bis(3-aminopropyl)-terminated polydimethylsiloxane (bis(3‐aminopropyl) ‐terminated poly(dimethylsiloxane)), diphenylmethane diisocyanate (4,4‐methylenebis(phenyl isocyanate)) and 1,3,5-benzene triformaldehyde (1,3,5-triformylbenzene), using condensation polymerization and regulation Polydimethylsiloxane polymers with self-healing effect were prepared in different proportions. The steps of the two-step method are described below.

第一步-合成聚二甲基矽氧烷高分子預聚物(PDMS-MDI):將雙(3-氨基丙基)封端聚二甲基矽氧烷(NH 2-PDMS-NH 2)溶解在氯仿溶劑中,加入三乙胺當作催化劑,攪拌30分鐘至完全溶解。將二苯基甲烷二異氰酸酯(MDI)溶解於氯仿溶劑中,攪拌10分鐘至完全溶解。將兩反應物分別放入液態氮中,以冷凍真空乾燥法重複三次除去溶劑中的水氣與氧氣後,使用氣密針抽取MDI溶液,緩慢滴入NH 2-PDMS-NH 2溶液,並在冰浴中反應1小時後移除冰浴,使溫度逐漸恢復室溫並反應5小時。等待反應結束後,將產物緩慢加入甲醇中,持續攪拌12小時,倒出甲醇並以氯仿溶解沉澱物,利用旋轉減壓濃縮機去除氯仿溶劑,放置真空烘箱12小時,即可獲得聚二甲基矽氧烷高分子預聚物。 The first step-synthesis of polydimethylsiloxane polymer prepolymer (PDMS-MDI): bis(3-aminopropyl) end-capped polydimethylsiloxane (NH 2 -PDMS-NH 2 ) Dissolve in chloroform solvent, add triethylamine as a catalyst, and stir for 30 minutes until completely dissolved. Dissolve diphenylmethane diisocyanate (MDI) in chloroform solvent and stir for 10 minutes until completely dissolved. Put the two reactants into liquid nitrogen respectively, and remove the moisture and oxygen in the solvent by freeze-vacuum drying three times, then extract the MDI solution with an airtight needle, slowly drop into the NH 2 -PDMS-NH 2 solution, and After reacting in the ice bath for 1 hour, the ice bath was removed, and the temperature was gradually returned to room temperature and reacted for 5 hours. After the reaction is over, slowly add the product to methanol, continue to stir for 12 hours, pour out the methanol and dissolve the precipitate with chloroform, remove the chloroform solvent by using a rotary decompression concentrator, and place it in a vacuum oven for 12 hours to obtain polydimethyl Silicone polymer prepolymer.

第二步-合成聚二甲基矽氧烷可自我修復之共聚合高分子材料(PDMS-MDI x-TFB 1-x) :將第一步產物PDMS-MDI溶解於氯仿溶劑中,攪拌30分鐘至完全溶解。將1,3,5-苯三甲醛(TFB)溶解於氯仿溶劑中,攪拌10分鐘至完全溶解。將兩反應物分別放入液態氮中,以冷凍真空乾燥法重複三次除去溶劑中的水氣與氧氣後,使用氣密針抽取TFB溶液,緩慢滴入PDMS-MDI溶液,在室溫下反應6小時,等待反應結束後,即可獲得可自我修復之共聚合高分子材料PDMS-MDI x-TFB 1-x溶液。 The second step - synthesis of polydimethylsiloxane self-healing copolymerized polymer material (PDMS-MDI x -TFB 1-x ): Dissolve the first step product PDMS-MDI in chloroform solvent and stir for 30 minutes until completely dissolved. Dissolve 1,3,5-benzenetricarbaldehyde (TFB) in chloroform solvent and stir for 10 minutes until completely dissolved. Put the two reactants into liquid nitrogen respectively, and remove the water vapor and oxygen in the solvent by freeze-vacuum drying three times, then extract the TFB solution with an airtight needle, slowly drop into the PDMS-MDI solution, and react at room temperature for 6 After waiting for the reaction to finish, the self-healing copolymerized polymer material PDMS-MDI x -TFB 1-x solution can be obtained.

可自我修復高分子彈性體薄膜之製備:將合成好的PDMS-MDI x-TFB 1-x溶液倒入鐵氟龍模具中,移至超音波震盪水槽震盪30分鐘,使溶液均勻分散在鐵氟龍模具,並放置在抽風櫃中室溫下12小時等待溶劑揮發後,移至真空烘箱乾燥6小時,即可取下得到可自我修復高分子彈性體薄膜。 [結構分析] 1. 1H-NMR分析 Preparation of self-healing polymer elastomer film: Pour the synthesized PDMS-MDI x -TFB 1-x solution into a Teflon mold, move it to an ultrasonic vibration tank for 30 minutes, and disperse the solution evenly in the Teflon mold. Dragon mold, and placed in a fume hood at room temperature for 12 hours to wait for the solvent to volatilize, then move to a vacuum oven to dry for 6 hours, and then it can be removed to obtain a self-healing polymer elastomer film. [Structural analysis] 1. 1 H-NMR analysis

1H-NMR鑑定高分子結構上不同環境下質子之化學位移,進而判斷高分子是否成功合成。 1 H-NMR is used to identify the chemical shift of protons in different environments on the polymer structure, and then judge whether the polymer is successfully synthesized.

使用氯仿為d-solvent溶解可自我修復之共聚合高分子材料,利用官能基上特殊的 1H訊號鑑定結構,並計算積分面積判斷MDI與TFB成功反應之莫耳比。 Using chloroform to dissolve the self-healing copolymer polymer material for d-solvent, using the special 1 H signal on the functional group to identify the structure, and calculating the integral area to determine the molar ratio of the successful reaction between MDI and TFB.

以PDMS-MDI 0.4-TFB 0.6為例,圖2所示為PDMS-MDI 0.4-TFB 0.61H-NMR圖譜 (CDCl 3;δppm),化學位移7.24 ppm為CDCl 3之溶劑訊號,化學位移3.2、3.6 ppm為PDMS末端胺基分別與MDI、TFB單體反應之CH 2訊號。如圖3所示,化學位移6.92、7.62 ppm為PDMS末端胺基(-NH 2)與MDI之異氰酸酯基(-NCO)反應,形成新的脲基團(-NH-C=O-NH-)之NH訊號。化學位移8.15 ppm為PDMS末端胺基(-NH 2)與TFB之醛基(-CHO)反應,形成新的亞胺基團(-C=NH)之NH訊號,經由以上之 1H-NMR圖譜訊號可表示此可自我修復之共聚合高分子材料已成功合成。 2. FT-IR光譜分析 Taking PDMS-MDI 0.4 -TFB 0.6 as an example, Figure 2 shows the 1 H-NMR spectrum (CDCl 3 ; δppm) of PDMS-MDI 0.4 -TFB 0.6 , the chemical shift is 7.24 ppm, which is the solvent signal of CDCl 3 , and the chemical shift is 3.2 , 3.6 ppm are the CH 2 signals of the reaction of PDMS terminal amine groups with MDI and TFB monomers respectively. As shown in Figure 3, the chemical shifts of 6.92 and 7.62 ppm are the reaction between the terminal amine group (-NH 2 ) of PDMS and the isocyanate group (-NCO) of MDI to form a new urea group (-NH-C=O-NH-) The NH signal. The chemical shift of 8.15 ppm is the NH signal of the reaction of PDMS terminal amine group (-NH 2 ) and TFB aldehyde group (-CHO) to form a new imine group (-C=NH), through the above 1 H-NMR spectrum The signal can indicate that the self-healing copolymer polymer material has been successfully synthesized. 2. FT-IR spectral analysis

FT-IR光譜最常使用於官能基鑑定,利用不同官能基產生不同的振動頻率,分析特定吸收峰的位置,鑑定官能基的結構與種類。FT-IR spectroscopy is most commonly used in the identification of functional groups, using different functional groups to produce different vibration frequencies, analyzing the position of specific absorption peaks, and identifying the structure and type of functional groups.

將樣品裁切成1 x 2 cm的長條狀,使用傅立葉轉換紅外線光譜儀掃描範圍400 ~ 4000 cm -1觀察可自我修復之共聚合高分子材料官能基之特徵吸收峰。TG/FT-IR 觀察可自我修復之共聚合高分子材料官能基之氫鍵吸收峰。 Cut the sample into strips of 1 x 2 cm, and use a Fourier transform infrared spectrometer to scan from 400 to 4000 cm -1 to observe the characteristic absorption peaks of functional groups of self-healing copolymerized polymer materials. TG/FT-IR observation of hydrogen bond absorption peaks of functional groups of self-healing copolymerized polymer materials.

以下內容請參見圖4,以PDMS-MDI 0.4-TFB 0.6為例,MDI單體中含有異氰酸酯基(-NCO)在2260 cm -1具有特徵峰,而TFB單體中含有醛基(-CHO)在1680 cm -1具有其特徵峰,當反應完成後,PDMS-MDI 0.4-TFB 0.6圖譜中無明顯的-NCO與-CHO特徵峰,表示此可自我修復之共聚合高分子材料已成功合成。 Please refer to Figure 4 for the following content. Taking PDMS-MDI 0.4 -TFB 0.6 as an example, the isocyanate group (-NCO) in the MDI monomer has a characteristic peak at 2260 cm -1 , and the aldehyde group (-CHO) in the TFB monomer It has its characteristic peak at 1680 cm -1 , and when the reaction is completed, there are no obvious characteristic peaks of -NCO and -CHO in the spectrum of PDMS-MDI 0.4 -TFB 0.6 , indicating that this self-healing copolymeric polymer material has been successfully synthesized.

請參見圖5,係為不同比例之可自我修復之共聚合高分子材料FT-IR圖譜,在1635-1645 cm -1、3300-3350 cm -1分別為脲基團之-C=O與-NH特徵峰,1650-1665 cm -1為亞胺基團之-C=N特徵峰。 Please refer to Figure 5, which are the FT-IR spectra of different proportions of self-healing copolymerized polymer materials, at 1635-1645 cm -1 and 3300-3350 cm -1 are the -C=O and - of the urea group, respectively The NH characteristic peak, 1650-1665 cm -1 is the -C=N characteristic peak of the imine group.

請參見圖6,可由3300-3350 cm -1特徵峰訊號觀察到,當MDI比例增加時,脲基團之-NH訊號逐漸增強表示可產生氫鍵之官能基增加,當TFB比例增加而MDI比例減少時,1635-1645 cm -1脲基團之-C=O訊號逐漸減弱,1650-1665 cm -1亞胺基團之-C=N訊號逐漸增強,表示具有自我修復之可逆共價鍵增加。 3. WAXD分析 Please refer to Figure 6. It can be observed from the characteristic peak signal at 3300-3350 cm -1 that when the proportion of MDI increases, the -NH signal of the urea group gradually increases, indicating that the functional groups that can generate hydrogen bonds increase. When the proportion of TFB increases and the proportion of MDI When it decreases, the -C=O signal of 1635-1645 cm -1 urea group gradually weakens, and the -C=N signal of 1650-1665 cm -1 imine group gradually increases, indicating that the reversible covalent bond with self-repair increases . 3. WAXD analysis

將樣品製備成薄膜狀,以掃描角度範圍10º至40º,觀察出此可自我修復之共聚合高分子材料彈性體無明顯的衍射峰,判斷為非結晶高分子。 [凝膠滲透層析法(GPC)分子量鑑定] The sample is prepared into a thin film, and the scanning angle ranges from 10º to 40º. It is observed that the self-healing copolymerized polymer elastomer has no obvious diffraction peaks, and it is judged as an amorphous polymer. [Gel Permeation Chromatography (GPC) Molecular Weight Identification]

凝膠滲透層析法(GPC)為常見用來測量高分子分子量的方式,將不同比例之可自我修復之共聚合高分子材料PDMS-MDI x-TFB 1-x溶解於GPC移動相溶劑THF中,配製濃度為10mg/ml,完全溶解後注入GPC,將管柱溫度設定為40℃,分析時間30分鐘,流速1 ml/min。等待30分鐘可得到分子量數據。 Gel Permeation Chromatography (GPC) is a common method used to measure the molecular weight of polymers. Different proportions of self-healing copolymerized polymer materials PDMS-MDI x -TFB 1-x are dissolved in THF as the GPC mobile phase solvent , the preparation concentration was 10mg/ml, and injected into GPC after completely dissolved, the column temperature was set to 40°C, the analysis time was 30 minutes, and the flow rate was 1 ml/min. Wait 30 minutes for molecular weight data.

請參見表1,當MDI比例增加時,分子量逐漸上升,表示PDMS與MDI具有較好的反應性,與TFB的反應性較差,PDI範圍在1.4-1.7之間。當PDI值太大時,表示分子量分佈過大,分子鏈長度不均,此現象會造成自我修復基團分離後,不易進行重組而導致自我修復效果下降,當PDI值大於2時,呈現較差的自我修復效果,PDI值約1.5具有較好的自我修復效果。Please refer to Table 1. When the proportion of MDI increases, the molecular weight increases gradually, indicating that PDMS has better reactivity with MDI, and poor reactivity with TFB, and the PDI range is between 1.4-1.7. When the PDI value is too large, it means that the molecular weight distribution is too large and the length of the molecular chain is uneven. This phenomenon will cause the self-repairing group to be separated and difficult to recombine, resulting in a decline in the self-repairing effect. When the PDI value is greater than 2, it will show poor self-repair. Repair effect, PDI value of about 1.5 has a good self-repair effect.

Figure 02_image001
表1 [熱穩定性分析]
Figure 02_image001
Table 1 [Thermal Stability Analysis]

使用熱重分析儀TGA量測熱裂解溫度(T d),一般以熱裂解溫度表示此高分子的熱穩定性。觀察熱重分析曲線,當質量損失5%時,為熱裂解溫度(degradation temperature,T d5%)。 Thermal cracking temperature (T d ) is measured by thermogravimetric analyzer TGA, and thermal cracking temperature is generally used to represent the thermal stability of the polymer. Observe the thermogravimetric analysis curve, when the mass loss is 5%, it is the thermal cracking temperature (degradation temperature, T d5% ).

取5至10 mg樣品放置陶瓷盤中,在氬氣環境下以每分鐘10度升溫速率從25至900 ºC,並觀察溫度對重量的損失變化、殘餘重量、最快損失重量之溫度範圍和重量損失5%熱裂解溫度。Take 5 to 10 mg of sample and place it in a ceramic dish, in an argon atmosphere at a heating rate of 10 degrees per minute from 25 to 900 ºC, and observe the change in temperature to weight loss, residual weight, the temperature range of the fastest weight loss and weight Loss of 5% pyrolysis temperature.

如圖7所示,為不同比例之TGA曲線圖,測試溫度範圍25-900℃。下表2為不同比例之可自我修復之共聚合高分子材料的熱烈解溫度。根據表2,當MDI比例減少而TFB比例增加時,熱裂解溫度會隨著TFB比例增加而上升,其原因有兩點:(1) TFB具有三個可反應的官能基,當三個官能基反應完全時,導致化學交聯產生網狀結構而使T d上升;(2)當TFB比例增加時,表示MDI比例減少,此時可逆共價鍵數量會多於氫鍵數量,由於共價鍵屬於一級鍵,具有較高的鍵能,而導致T d上升,因此加入TFB可提高高分子熱穩定性。 As shown in Figure 7, it is a TGA curve of different proportions, and the test temperature range is 25-900°C. Table 2 below shows the thermal solution temperatures of different ratios of self-healing copolymerized polymer materials. According to Table 2, when the proportion of MDI decreases and the proportion of TFB increases, the thermal cracking temperature will increase with the proportion of TFB. There are two reasons: (1) TFB has three reactive functional groups, when the three functional groups When the reaction is complete, the chemical cross-linking will produce a network structure and the T d will increase; (2) when the proportion of TFB increases, it means that the proportion of MDI decreases, and the number of reversible covalent bonds will be more than the number of hydrogen bonds. It belongs to the first-order bond and has higher bond energy, which leads to an increase in T d . Therefore, adding TFB can improve the thermal stability of polymers.

表2

Figure 02_image003
[玻璃轉移溫度分析] Table 2
Figure 02_image003
[Glass transition temperature analysis]

以機械動態熱分析儀DMA量測儲存模數、損失模數及阻尼(Tanδ)訊號表示玻璃轉移溫度(T g)。 The glass transition temperature (T g ) is expressed by measuring the storage modulus, loss modulus and damping (Tanδ) signal with a mechanical dynamic thermal analyzer DMA.

將製備好的樣品薄膜裁切成長4 cm、寬1 cm、厚度0.5 mm的樣品試片,使用tensile模式測量,量測溫度範圍-150 ºC至30 ºC,升溫速率5 ºC/ min,其靜力:動力為1:0.9、1Hz。Cut the prepared sample film into 4 cm long, 1 cm wide, and 0.5 mm thick sample specimens, and use the tensile mode to measure, the measurement temperature range is -150 ºC to 30 ºC, the heating rate is 5 ºC/min, the static force : The power is 1: 0.9, 1Hz.

圖8為不同比例之可自我修復之共聚合高分子材料DMA曲線。表3為不同比例之可自我修復之共聚合高分子材料T g點。如圖8與表3所示,TFB比例上升時,可自我修復之共聚合高分子材料的T g點逐漸下降,當T g點越低時,表示高分子鏈越容易移動,使能夠進行自我修復之官能基容易碰觸進而達到自我修復的效果。 Figure 8 is the DMA curves of self-healing copolymerized polymer materials with different proportions. Table 3 shows the T g points of different ratios of self-healing copolymer polymer materials. As shown in Figure 8 and Table 3, when the TFB ratio increases, the T g point of the self-healing copolymerized polymer material gradually decreases. When the T g point is lower, it means that the polymer chain is easier to move, enabling self-healing. The repairing functional group is easy to touch to achieve the effect of self-repairing.

Figure 02_image005
表3 [機械性質分析]
Figure 02_image005
Table 3 [Mechanical Property Analysis]

當高分子材料進行拉伸試驗時,賦予高分子材料外力進行拉伸產生外型及尺寸變化,外觀型態改變稱為應變,此時高分子材料內部產生抵抗之作用力稱為應力,楊氏模數用以描述高分子材料抵抗形變的能力,依據虎克定律,在物體之彈性限度內,應力與應變成正比,其中兩者之比值為楊氏模數。When the polymer material is subjected to a tensile test, the polymer material is given an external force to stretch to produce a change in appearance and size. The change in appearance is called strain. At this time, the force that produces resistance inside the polymer material is called stress. Young’s The modulus is used to describe the ability of polymer materials to resist deformation. According to Hooke's law, within the elastic limit of the object, the stress and strain become proportional, and the ratio of the two is Young's modulus.

在自我修復材料中,通常利用拉伸試驗測得之應力與應變來描述自我修復材料之特性,並以高分子尚未破壞前的拉伸應力與高分子修復後的拉伸應力之比值稱為修復效率(Healing efficiency)。In self-healing materials, the stress and strain measured by the tensile test are usually used to describe the characteristics of the self-healing material, and the ratio of the tensile stress before the polymer has not been damaged to the tensile stress after the polymer is repaired is called repair. Efficiency (Healing efficiency).

本發明使用萬能拉力試驗機測試降伏點、延伸率、楊氏係數、最大斷裂應力等機械性質。將樣品薄膜裁切成長3 cm、寬1 cm、厚度0.5 mm 的樣品,以拉伸速率50 mN/min進行量測。The invention uses a universal tensile testing machine to test mechanical properties such as yield point, elongation, Young's modulus, and maximum breaking stress. The sample film was cut into a sample with a length of 3 cm, a width of 1 cm, and a thickness of 0.5 mm, and was measured at a tensile rate of 50 mN/min.

如圖9所示,當MDI比例增加時,由於MDI結構中具有雙苯環相對於TFB單苯環結構較剛硬,因此具有較高的拉伸應力與較低的拉伸率。反之,當TFB比例增加,具有較高的拉伸率與較低的拉伸應力。As shown in Figure 9, when the ratio of MDI increases, the MDI structure has a higher tensile stress and lower elongation rate because the double benzene ring in the MDI structure is more rigid than the TFB single benzene ring structure. On the contrary, when the ratio of TFB increases, it has higher elongation rate and lower tensile stress.

請參見圖10,於一較佳實施態樣中,因後續之應用而選用軟硬適中的PDMS-MDI 0.4-TFB 0.6作為以下探討之材料,由於此可自我修復之共聚合高分子材料具有室溫下修復的效果,因此對於室溫下不同修復時間進行測試,發現當室溫下修復3小時,修復效率就可達到80%,但隨著修復時間的增加,應力並不會有大幅的提升,只會些微提升拉伸率,此現象說明在室溫下修復3小時後,材料可產生自我修復基團大部分已完成大部分鍵結重組,導致高分子鏈移動較差,而無法提高應力及修復效率。 Please refer to Figure 10. In a preferred implementation, PDMS-MDI 0.4 -TFB 0.6 with moderate hardness and softness is selected as the material discussed below for subsequent applications, because this self-healing copolymer polymer material has Therefore, we tested different repair times at room temperature and found that when repaired at room temperature for 3 hours, the repair efficiency can reach 80%, but as the repair time increases, the stress will not increase significantly , will only slightly increase the elongation rate. This phenomenon shows that after 3 hours of repairing at room temperature, the material can produce self-repairing groups. Repair efficiency.

請參見圖11,於一較佳實施態樣中,使用光學顯微鏡觀察自我修復,當放置於室溫下3小時進行修復後,被切割的傷痕已完全消失,表示已完成修復。除了在室溫下進行自我修復外,也將此可自我修復之共聚合高分子材料於不同環境下進行自我修復測試,分別測試-10℃、25℃水中、60℃水中及NaCl水溶液中進行自我修復的情形,圖12為不同環境條件之自我修復應力-應變曲線圖,可觀察到在各種外界環境下都可達到一定程度的修復效果。如圖13及表4所示,於一較佳實施態樣PDMS-MDI 0.4-TFB 0.6材料進行自我修復測試,在不同環境條件下,自我修復效率皆達到75%以上。 Please refer to FIG. 11 . In a preferred embodiment, the self-healing is observed with an optical microscope. After being placed at room temperature for 3 hours for repairing, the cut scars have completely disappeared, indicating that the repairing has been completed. In addition to self-healing at room temperature, self-healing tests of this self-healing copolymerized polymer material were also carried out in different environments, and the self-healing tests were performed in -10°C, 25°C water, 60°C water and NaCl aqueous solution. In the case of restoration, Figure 12 is a self-healing stress-strain curve under different environmental conditions. It can be observed that a certain degree of restoration effect can be achieved under various external environments. As shown in Figure 13 and Table 4, self-healing tests were performed on PDMS-MDI 0.4 -TFB 0.6 materials in a preferred embodiment, and the self-healing efficiency reached over 75% under different environmental conditions.

Figure 02_image007
表4
Figure 02_image007
Table 4

以下實施例介紹本發明之可自我修復之共聚合高分子材料較佳之示例性應用。 實施例 2- 發光材料 The following examples describe preferred exemplary applications of the self-healing copolymerized polymer material of the present invention. Example 2 - Luminescent material

本實施例之發光材料係將前述可自我修復之共聚合高分子材料混摻鈣鈦礦量子點。於一較佳實施態樣中,將可自我修復之共聚合高分子材料溶於甲苯中,配製成15 wt%溶液,加入10 mg/ml之鈣鈦礦量子點溶液,均勻混合後,製備成自我修復鈣鈦礦量子點薄膜。The luminescent material of this embodiment is the aforementioned self-repairable copolymerized polymer material mixed with perovskite quantum dots. In a preferred embodiment, the self-healing copolymerized polymer material is dissolved in toluene to prepare a 15 wt% solution, and a 10 mg/ml perovskite quantum dot solution is added and mixed uniformly to prepare into a self-healing perovskite quantum dot film.

請參見圖14,對薄膜進行拉伸試驗,可自我修復之共聚合高分子材料薄膜之機械性質並不會因混摻鈣鈦礦量子點減弱,混摻鈣鈦礦量子點的可自我修復之共聚合高分子材料薄膜修復後效率可達到80%,且可進行拉伸、彎曲、扭轉等動作,如圖15。Please refer to Figure 14. The tensile test of the film shows that the mechanical properties of the self-healing copolymerized polymer film will not be weakened by the mixing of perovskite quantum dots, and the self-healing properties of the mixing of perovskite quantum dots The efficiency of the copolymerized polymer film can reach 80% after repair, and it can be stretched, bent, twisted, etc., as shown in Figure 15.

將自我修復鈣鈦礦量子點薄膜量測紫外光-可見光光譜儀與螢光光譜儀,請參見圖16,當薄膜受到破壞與修復完成後,並不會影響鈣鈦礦量子點的紫外-可見分光光度法(UV-Vis)吸收峰訊號與光激螢光(PL)訊號導致減弱或位移現象。Measure the self-healing perovskite quantum dot film with a UV-visible spectrometer and a fluorescence spectrometer, see Figure 16. When the film is damaged and repaired, the UV-visible spectrophotometry of the perovskite quantum dot will not be affected UV-Vis absorption peak signal and photoluminescence (PL) signal lead to weakening or shifting phenomenon.

一般而言,鈣鈦礦材料容易受到水氣而潮解導致失去光學性質,但本發明之可自我修復之共聚合高分子材料以PDMS為主體結構具疏水性。將本實施例之自我修復鈣鈦礦量子點薄膜泡入水中,由肉眼觀察亮度無明顯減弱。此外,以螢光光譜儀量測,PL強度隨著泡入水中的時間而減弱,但依然維持一定強度,如圖17所示。為證明可自我修復之共聚合高分子材料具疏水性,利用接觸角儀進行量測,如圖18所示,量得之接觸角為103°,顯示本發明之可自我修復之共聚合高分子材料確實為疏水性材料。因此本發明之可自我修復之共聚合高分子材料具疏水性,可保護鈣鈦礦量子點不會因泡入水中而失去原有的光學性質。 實施例 3- LED 背光顯示器 Generally speaking, perovskite materials are easily deliquified by moisture and lose optical properties, but the self-healing copolymerized polymer material of the present invention has PDMS as the main structure and is hydrophobic. The self-healing perovskite quantum dot film of this embodiment was soaked in water, and the brightness was not significantly weakened by naked eyes. In addition, measured by a fluorescence spectrometer, the PL intensity weakens with the time soaked in water, but still maintains a certain intensity, as shown in Figure 17. In order to prove that the self-healing copolymer polymer material is hydrophobic, a contact angle meter was used to measure it. As shown in Figure 18, the measured contact angle is 103°, which shows that the self-healing copolymer polymer material of the present invention The material is indeed a hydrophobic material. Therefore, the self-healing copolymer polymer material of the present invention is hydrophobic, which can protect the perovskite quantum dots from losing their original optical properties due to soaking in water. Example 3 - LED backlit display

本實施例將實施例2之自我修復鈣鈦礦量子點薄膜應用於背光顯示器。In this embodiment, the self-healing perovskite quantum dot thin film of Embodiment 2 is applied to a backlight display.

以製作白光LED芯片為例,首先將可自我修復之共聚合高分子材料分別混摻綠色與紅色鈣鈦礦量子點,並製備成綠色與紅色自我修復鈣鈦礦量子點薄膜。接者,以下請參照圖19,以藍光LED芯片22為基底,將前述綠色自我修復鈣鈦礦量子點薄膜21作為第一層,再疊上前述紅色自我修復鈣鈦礦量子點薄膜20作為第二層,並調控薄膜厚薄度,即可製作出白光LED芯片24。Taking the production of white LED chips as an example, first, self-healing copolymerized polymer materials are mixed with green and red perovskite quantum dots, and green and red self-healing perovskite quantum dot films are prepared. Next, please refer to FIG. 19 below. With the blue LED chip 22 as the base, the aforementioned green self-healing perovskite quantum dot film 21 is used as the first layer, and the aforementioned red self-healing perovskite quantum dot film 20 is stacked as the second layer. two layers, and adjusting the thickness of the film, the white LED chip 24 can be produced.

使用PR-670分光式輝度色度計進行量測,如圖20所示,可觀察到產生白光的發射光譜,並參見圖21,CIE顏色座標圖顯示發色光位於白光區,顯示已成功製備出白光LED背光顯示器。 實施例 4- 導電電極材料 Use the PR-670 spectroscopic luminance colorimeter to measure, as shown in Figure 20, the emission spectrum that produces white light can be observed, and see Figure 21, the CIE color coordinate diagram shows that the chromatic light is located in the white light area, indicating that it has been successfully prepared White LED backlit display. Example 4 - Conductive Electrode Material

本實施例將實施例1之可自我修復之共聚合高分子材料製成的薄膜混摻奈米金屬線製成導電電極材料。於一實施態樣中,將PDMS-MDI 0.4-TFB 0.6薄膜塗佈上奈米銀線溶液,放置於室溫下等待乾燥後,再塗佈上液態金屬鎵,完成自我修復導電電極製作。 In this embodiment, the thin film made of the self-healing copolymer polymer material in Embodiment 1 is mixed with nanometer metal wires to make a conductive electrode material. In one embodiment, the PDMS-MDI 0.4 -TFB 0.6 film is coated with silver nano wire solution, placed at room temperature for drying, and then coated with liquid metal gallium to complete the fabrication of self-healing conductive electrodes.

由於柔性電子元件需時常彎折,本實施例將自我修復導電電極進行100次的彎曲測試,並同時量測電阻值變化。經由測試後可觀察到,經100次彎曲後,片電阻值均未高於20 ohm/cm 2,此現象說明自我修復導電電極不會因多次的彎曲導致失去電性。由於可自我修復之共聚合高分子移動時,奈米銀線會部分嵌入高分子中,使電極不易脫落而依然具有導電性。 實施例 5- 有機發光二極體 Since flexible electronic components need to be bent frequently, in this embodiment, the self-healing conductive electrode is subjected to 100 bending tests, and the resistance value change is measured at the same time. After testing, it can be observed that after 100 times of bending, the sheet resistance value is not higher than 20 ohm/cm 2 , which shows that the self-healing conductive electrode will not lose its electrical properties due to repeated bending. When the self-healing copolymer polymer moves, the silver nanowires will be partially embedded in the polymer, so that the electrode is not easy to fall off and still has conductivity. Example 5 - Organic Light Emitting Diodes

本實施例將一有機發光層以及實施例4之導電電極材料製成有機發光二極體(OLED)。本實施例使用聚芴(PF)作為有機發光材料,其為藍光發光材料。 [製造方法] In this embodiment, an organic light-emitting layer and the conductive electrode material in Embodiment 4 are made into an organic light-emitting diode (OLED). In this embodiment, polyfluorene (PF) is used as the organic light emitting material, which is a blue light emitting material. [Production method]

配製1 wt% 聚乙二醇(PEO)溶液於DMF中,以1:20比例加入聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(PEDOT:PSS)中,充分攪拌,為電子傳輸層溶液;配製1 wt% PF溶液作為發光層溶液。Prepare 1 wt% polyethylene glycol (PEO) solution in DMF, add poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid (PEDOT:PSS) at a ratio of 1:20, and stir well to obtain Electron transport layer solution; prepare 1 wt% PF solution as the emissive layer solution.

將如實施例1之PDMS-MDI 0.4-TFB 0.6薄膜放置於氧電漿機中2分鐘後,PEDOT:PSS/PEO以旋轉塗佈500 rpm/10s後1000 rpm/20s塗佈於前述PDMS-MDI 0.4-TFB 0.6薄膜,並加熱70℃/10min。再以旋轉塗佈1000 rpm/30塗佈PF溶液,加熱80℃/10min。 After placing the PDMS-MDI 0.4 -TFB 0.6 film as in Example 1 in an oxygen plasma machine for 2 minutes, PEDOT:PSS/PEO was coated on the aforementioned PDMS-MDI by spin coating at 500 rpm/10s and then at 1000 rpm/20s 0.4 - TFB 0.6 film, and heated at 70°C/10min. Then apply the PF solution by spin coating at 1000 rpm/30, and heat at 80°C/10min.

如圖22,將另一PDMS-MDI 0.4-TFB 0.6薄膜塗佈上奈米銀線溶液形成導電電極材料311,放置於室溫下等待乾燥後,再塗佈上液態金屬鎵312,完成自我修復導電電極31製作(即實施例4)。 As shown in Figure 22, another PDMS-MDI 0.4 -TFB 0.6 film is coated with silver nanowire solution to form a conductive electrode material 311, placed at room temperature and waited to dry, and then coated with liquid metal gallium 312 to complete self-healing Fabrication of the conductive electrode 31 (i.e. embodiment 4).

將前述自我修復導電電極與前述發光層組合成自我修復有機發光二極體。如圖22,於一較佳實施態樣中,該有機發光二極體30具有導電電極層31//發光層32/電子傳輸層33/可自我修復之共聚合高分子材料層34之結構。Combining the aforementioned self-healing conductive electrode and the aforementioned light-emitting layer into a self-healing organic light-emitting diode. As shown in FIG. 22 , in a preferred embodiment, the organic light emitting diode 30 has a structure of conductive electrode layer 31//light emitting layer 32/electron transport layer 33/self-healing copolymerized polymer material layer 34.

如圖23,施予電流後,使自我修復有機發光二極體成功發出藍光,並使用PR-670進行量測,可觀察到在10V開始發光。接著,測試自我修復有機發光二極體經由修復後是否能繼續發光。將自我修復導電電極切割後,原發光位置瞬間熄滅,係為奈米銀線因切割後,導致奈米銀線間無法碰觸,使電極繼續無法導電。等待3小時使電極修復後,由於進行修復時,可自我修復之共聚合高分子鏈遷移進而帶動奈米銀線隨之移動,使奈米銀線再次碰觸而恢復導電性,並再次發光,如圖24。在自我修復後,再以PR-670進行量測,發現癒合後之亮度接近於未切割前自我修復有機發光二極體之亮度。 As shown in Figure 23, after the current is applied, the self-healing organic light-emitting diode successfully emits blue light, and it is measured with PR-670, and it can be observed that it starts to emit light at 10V. Next, test whether the self-healing organic light-emitting diode can continue to emit light after being repaired. After the self-healing conductive electrode is cut, the original light-emitting position is instantly extinguished, which is due to the nano-silver wires being unable to touch each other after cutting, making the electrode continue to be unable to conduct electricity. After waiting for 3 hours for the electrode to be repaired, the self-repairing copolymerized polymer chain migrates and drives the nano silver wire to move along with it during the repair, so that the nano silver wire touches again to restore conductivity and emit light again. Figure 24. After self-healing, it was measured with PR-670, and it was found that the brightness after healing was close to the brightness of self-healing organic light-emitting diodes before cutting.

此外,為測試自我修復有機發光二極體的點與面是否皆可發亮,因此分別利用鑷子尖端與板手進行按壓,均可使自我修復有機發光二極體成功發亮。 In addition, in order to test whether the points and surfaces of the self-healing organic light emitting diode can be illuminated, the self-healing organic light emitting diode can be successfully illuminated by pressing with the tip of the tweezers and the wrench respectively.

實施例6-柔性發光電子元件Example 6 - Flexible Light Emitting Electronic Components

由於本發明之可自我修復之共聚合高分子材料具有拉伸性與彎折性,藉由此特性將實施例5之有機發光二極體應用製備出柔性的發光電子元件。 Since the self-healing copolymerized polymer material of the present invention has stretchability and bendability, flexible light-emitting electronic components can be prepared by applying the organic light-emitting diode in Example 5 through this characteristic.

請參見圖25,為自我修復柔性發光電子元件10示意圖,其具有導電電極層13/絕緣膜14/發光層15/電子傳輸層16/可自我修復之共聚合高分子材料層17/絕緣膜14之結構。亦即,如同實施例5,惟在發光層(例如:PF層)15兩側黏貼不具導電性的絕緣膜(例如:PET膜)14後,再覆蓋上實施例4之自我修復導電電極13,製備出自我修復柔性發光電子元件10。 Please refer to FIG. 25 , which is a schematic diagram of a self-healing flexible light-emitting electronic component 10, which has a conductive electrode layer 13/insulating film 14/light-emitting layer 15/electron transport layer 16/self-healing copolymerized polymer material layer 17/insulating film 14 The structure. That is, as in Embodiment 5, only after a non-conductive insulating film (for example: PET film) 14 is pasted on both sides of the light-emitting layer (for example: PF layer) 15, and then covered with the self-healing conductive electrode 13 of Embodiment 4, A self-healing flexible light-emitting electronic component 10 is prepared.

將此自我修復柔性發光電子元件黏貼於手指上,並施予電流後,自我修復柔性發光電子元件並未發光。然當手指進行彎曲時,自我修復柔性發光電子元件因發光層與電極成功碰觸而通電後發光,因此,成功製備出自我修復柔性發光電子元件。 The self-healing flexible light-emitting electronic component was pasted on the finger, and after the current was applied, the self-healing flexible light-emitting electronic component did not emit light. However, when the finger is bent, the self-healing flexible light-emitting electronic component emits light after being energized due to the successful contact between the light-emitting layer and the electrode. Therefore, the self-healing flexible light-emitting electronic component is successfully prepared.

綜上所述,本發明成功製備出新穎之可自我修復之共聚合高分子材料PDMS-MDIx-TFB1-x,並提供多種應用,本發明具有下列優勢: To sum up, the present invention has successfully prepared a novel self-healing copolymerized polymer material PDMS-MDI x -TFB 1-x , and provides various applications. The present invention has the following advantages:

1.當PDMS-MDIx-TFB1-x中MDI比例增加時,-NH訊號增強可表示產生氫鍵之官能基增加,當TFB比例增加時,-C=N訊號增強表示產生可逆共價鍵之官能基增加。使本發明之PDMS-MDIx-TFB1-x具有非共價鍵的氫鍵與可逆共價鍵的亞胺鍵,同時含有兩種可自我修復的官能基。氫鍵型自我修復需要利用提高溫度而破壞氫鍵,當移除溫度時,產生氫鍵的脲基團重新鍵結產生自我修復。以往可逆共價型自我修復也需加熱產生反應,但本發明具有之可逆亞胺鍵在室溫下時,就可進行可逆反應,因此當未鍵結的胺基與醛基碰觸時,即可產生可逆亞胺鍵,進行自我修復。 1. When the proportion of MDI in PDMS-MDI x -TFB 1-x increases, the increase of -NH signal can indicate the increase of functional groups that generate hydrogen bonds. When the proportion of TFB increases, the increase of -C=N signal indicates the generation of reversible covalent bonds The functional group increases. The PDMS-MDI x -TFB 1-x of the present invention has non-covalent hydrogen bonds and reversible covalent imine bonds, and contains two kinds of self-healing functional groups. Hydrogen-bonded self-healing requires the use of increased temperature to break hydrogen bonds. When the temperature is removed, the urea groups that generate hydrogen bonds rebond to produce self-healing. In the past, reversible covalent self-healing also required heating to generate a reaction, but the reversible imine bond of the present invention can undergo a reversible reaction at room temperature, so when the unbonded amine group touches the aldehyde group, that is Can generate reversible imine bonds for self-healing.

2.本發明之PDMS-MDIx-TFB1-x具有優異的熱穩定性,並在TFB比例增加時,熱裂解溫度逐漸上升。 2. The PDMS-MDI x -TFB 1-x of the present invention has excellent thermal stability, and when the proportion of TFB increases, the thermal cracking temperature rises gradually.

3.當PDMS-MDIx-TFB1-x中TFB比例增加時,Tg逐漸下降,此現象表示高分子鏈越容易移動,使能夠進行自我修復之官能基容易碰觸進而達到自我修復的效果,因此較高比例的TFB有較好的自我修復效率。 3. When the proportion of TFB in PDMS-MDI x -TFB 1-x increases, T g gradually decreases. This phenomenon indicates that the polymer chain is easier to move, so that the functional groups capable of self-repair can be easily touched to achieve the effect of self-repair , so a higher proportion of TFB has a better self-healing efficiency.

4.由於MDI結構較剛硬,因此PDMS-MDIx-TFB1-x具有高比例MDI時,具有較高的拉伸應力與較低的拉伸率,而具有高比例TFB時則反之。 4. Due to the rigidity of the MDI structure, PDMS-MDI x -TFB 1-x has higher tensile stress and lower elongation when it has a high proportion of MDI, and vice versa when it has a high proportion of TFB.

5.本發明經試驗證實在室溫下不同時間進行自我修復,發現3小時修復效率就可達到80%,在各種不同環境下也可進行自我修復。 5. The present invention has been tested to perform self-repair at different times at room temperature, and found that the repair efficiency can reach 80% within 3 hours, and it can also perform self-repair in various environments.

6.將PDMS-MDIx-TFB1-x混摻鈣鈦礦量子點,由於以PDMS為主體結構具疏水性可保護鈣鈦礦量子點不會受到水氣侵襲而失去光學性質。 6. The PDMS-MDI x -TFB 1-x is mixed with perovskite quantum dots, because the hydrophobicity of PDMS as the main structure can protect the perovskite quantum dots from loss of optical properties due to water vapor attack.

7. 本發明將PDMS-MDI x-TFB 1-x混摻鈣鈦礦量子點並放入藍光LED芯片中,成功製作出自我修復白光LED背光顯示器。 7. The present invention mixes PDMS-MDI x -TFB 1-x with perovskite quantum dots and puts them into blue LED chips, successfully producing a self-healing white LED backlight display.

8. 本發明利用在PDMS-MDI x-TFB 1-x中加入奈米金屬線製作出自我修復導電電極,使用有機高分子為發光材料,成功製作出有機發光二極體。經試驗,對自我修復導電電極進行切割,等待修復後,還可使有機發光二極體重新發亮,成功製作出自我修復有機發光二極體。 8. The present invention utilizes the addition of nanometer metal wires into PDMS-MDI x -TFB 1-x to produce self-healing conductive electrodes, and uses organic polymers as light-emitting materials to successfully produce organic light-emitting diodes. After testing, the self-healing conductive electrode is cut, and after waiting for repair, the organic light-emitting diode can be made to shine again, and the self-healing organic light-emitting diode is successfully produced.

9. 將前述自我修復有機發光二極體進行改良以絕緣材料在兩端阻隔電極與發光層,貼於手指後彎曲,使電極與發光層接觸而通電後發亮,製作出自我修復柔性電子元件。9. Improve the aforementioned self-healing organic light-emitting diode with insulating materials at both ends to block the electrode and the light-emitting layer, stick it to the finger and then bend it, so that the electrode and the light-emitting layer will be in contact with the light-emitting layer and glow after being energized to produce a self-healing flexible electronic component .

本文中,所提供的所有範圍旨在包括在給定之範圍內的每個特定範圍以及在該給定範圍之間的子範圍的組合。此外,除非另有說明,否則本文提供的所有範圍皆包括所述範圍的端點。從而,範圍1-5具體包括1、2、3、4和5,以及諸如2-5、3-5、2-3、2-4、1-4等子範圍。Herein, all ranges provided are intended to include each specific range within the given range as well as combinations of subranges between the given ranges. Additionally, unless otherwise stated, all ranges provided herein include the endpoints of the stated range. Thus, the range 1-5 specifically includes 1, 2, 3, 4, and 5, and sub-ranges such as 2-5, 3-5, 2-3, 2-4, 1-4, and so on.

本文中所稱之「包含或包括」意指不排除一或多個其他組件、步驟、操作和/或元素的存在或添加至所述之組件、步驟、操作和/或元素。本文所述之「包含」、「包括」、「含有」、「囊括」、「具有」是可互換的,而非限制性的。「約或接近」或「基本上」意指具有接近於允許指定誤差的數值或範圍,以避免被任何不合理之第三方違法或不公平地使用為理解本發明揭示之精確或絕對數值。「一」意指該物的語法對象之一個或一個以上(即,至少為一)。The term "comprising or comprising" referred to herein means not excluding the existence or addition of one or more other components, steps, operations and/or elements to the described components, steps, operations and/or elements. The terms "comprising", "comprising", "containing", "comprising", and "having" described herein are interchangeable and not limiting. "About or close to" or "substantially" means a value or range that is close to the specified error to avoid illegal or unfair use by any unreasonable third party to understand the precise or absolute value disclosed in the present invention. "A" means one or more than one (ie, at least one) of the grammatical object of the thing.

以上已將本發明做一詳細說明,惟以上所述者,僅惟本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡一本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention with this, that is, all the equivalents of the scope of the patent application for the present invention Changes and modifications should still fall within the scope of the patent coverage of the present invention.

10:柔性發光電子元件10: Flexible light-emitting electronic components

13:導電電極層13: Conductive electrode layer

14:絕緣膜14: insulating film

15:發光層15: Luminous layer

16:電子傳輸層16: Electron transport layer

17:可自我修復之共聚合高分子材料層17: Self-healing copolymerized polymer material layer

20:紅色自我修復鈣鈦礦量子點薄膜20: Red self-healing perovskite quantum dot film

21:綠色自我修復鈣鈦礦量子點薄膜21: Green self-healing perovskite quantum dot film

22:藍光LED芯片22:Blue LED chip

24:白光LED芯片24:White LED chip

30:有機發光二極體30: Organic Light Emitting Diodes

31:導電電極層31: Conductive electrode layer

311:導電電極材料311: Conductive electrode material

312:鎵312: Gallium

32:發光層32: luminescent layer

33:電子傳輸層33: Electron transport layer

34:可自我修復之共聚合高分子材料層34: Self-healing copolymerized polymer material layer

圖1為根據本發明較佳實施例的PDMS-MDI 0.4-TFB 0.6合成方法示意圖。 Fig. 1 is a schematic diagram of a synthesis method of PDMS-MDI 0.4 -TFB 0.6 according to a preferred embodiment of the present invention.

圖2為根據本發明較佳實施例的PDMS-MDI 0.4-TFB 0.6之NMR圖譜。 Fig. 2 is an NMR spectrum of PDMS-MDI 0.4 -TFB 0.6 according to a preferred embodiment of the present invention.

圖3為根據本發明較佳實施例的PDMS-MDI 0.4-TFB 0.6之局部NMR圖譜。 Fig. 3 is a partial NMR spectrum of PDMS-MDI 0.4 -TFB 0.6 according to a preferred embodiment of the present invention.

圖4為根據本發明較佳實施例的PDMS-MDI 0.4-TFB 0.6之FT-IR官能基鑑定。 Fig. 4 is the FT-IR functional group identification of PDMS-MDI 0.4 -TFB 0.6 according to a preferred embodiment of the present invention.

圖5為根據本發明較佳實施例的不同比例之可自我修復之共聚合高分子材料FT-IR圖譜。FIG. 5 is an FT-IR spectrum of a self-healing copolymerized polymer material with different ratios according to a preferred embodiment of the present invention.

圖6為根據本發明較佳實施例的不同比例之可自我修復之共聚合高分子材料-NH、-C=N、-C=O的FT-IR圖譜。Fig. 6 is the FT-IR spectra of self-healing copolymeric polymer materials -NH, -C=N, -C=O with different proportions according to a preferred embodiment of the present invention.

圖7為根據本發明較佳實施例的不同比例之可自我修復之共聚合高分子材料TGA曲線。FIG. 7 is a TGA curve of different ratios of self-healing copolymerized polymer materials according to a preferred embodiment of the present invention.

圖8為根據本發明較佳實施例的不同比例之可自我修復之共聚合高分子材料DMA曲線。FIG. 8 is a DMA curve of a self-healing copolymerized polymer material with different ratios according to a preferred embodiment of the present invention.

圖9為根據本發明較佳實施例的不同比例之可自我修復之共聚合高分子材料應力-應變曲線。FIG. 9 is a stress-strain curve of self-healing copolymer polymer materials with different proportions according to a preferred embodiment of the present invention.

圖10為根據本發明較佳實施例的可自我修復之共聚合高分子材料室溫下自我修復之應力-應變曲線圖。FIG. 10 is a stress-strain graph of self-healing at room temperature of a self-healing copolymer polymer material according to a preferred embodiment of the present invention.

圖11為根據本發明較佳實施例的可自我修復之共聚合高分子材料室溫下自我修復之光學顯微鏡影像圖。FIG. 11 is an optical microscope image of self-healing of a self-healing copolymerized polymer material at room temperature according to a preferred embodiment of the present invention.

圖12為根據本發明較佳實施例的可自我修復之共聚合高分子材料不同環境條件之自我修復應力-應變曲線圖。Fig. 12 is a self-healing stress-strain curve of the self-healing copolymerized polymer material in different environmental conditions according to a preferred embodiment of the present invention.

圖13為根據本發明較佳實施例的可自我修復之共聚合高分子材料不同環境條件之自我修復效率圖。FIG. 13 is a graph of self-healing efficiency of a self-healing copolymerized polymer material under different environmental conditions according to a preferred embodiment of the present invention.

圖14為根據本發明較佳實施例的自我修復鈣鈦礦量子點薄膜應力-應變曲線圖。Fig. 14 is a stress-strain graph of a self-healing perovskite quantum dot film according to a preferred embodiment of the present invention.

圖15為根據本發明較佳實施例的自我修復鈣鈦礦量子點薄膜修復後彎曲、扭轉圖。Fig. 15 is a bending and torsion diagram of a self-healing perovskite quantum dot film after repairing according to a preferred embodiment of the present invention.

圖16為根據本發明較佳實施例的自我修復鈣鈦礦量子點薄膜UV-Vis與PL圖。Fig. 16 is a UV-Vis and PL diagram of a self-healing perovskite quantum dot thin film according to a preferred embodiment of the present invention.

圖17為根據本發明較佳實施例的自我修復鈣鈦礦量子點薄膜泡水後PL圖。Fig. 17 is a PL diagram of a self-healing perovskite quantum dot film soaked in water according to a preferred embodiment of the present invention.

圖18為根據本發明較佳實施例的自我修復鈣鈦礦量子點薄膜之接觸角。Fig. 18 is the contact angle of the self-healing perovskite quantum dot film according to a preferred embodiment of the present invention.

圖19為根據本發明較佳實施例的白光LED背光顯示器結構示意圖。FIG. 19 is a schematic structural diagram of a white LED backlight display according to a preferred embodiment of the present invention.

圖20為根據本發明較佳實施例的白光LED背光顯示器電致發光光譜圖。Fig. 20 is an electroluminescence spectrum diagram of a white LED backlight display according to a preferred embodiment of the present invention.

圖21為根據本發明較佳實施例的白光LED背光顯示器CIE座標圖。FIG. 21 is a CIE coordinate diagram of a white LED backlight display according to a preferred embodiment of the present invention.

圖22為根據本發明較佳實施例的自我修復有機發光二極體結構示意圖。Fig. 22 is a schematic diagram of the structure of a self-healing organic light emitting diode according to a preferred embodiment of the present invention.

圖23為根據本發明較佳實施例的自我修復有機發光二極體EL圖。Fig. 23 is an EL diagram of a self-healing organic light emitting diode according to a preferred embodiment of the present invention.

圖24為根據本發明較佳實施例的自我修復有機發光二極體修復後EL圖。FIG. 24 is an EL diagram of a self-healing organic light-emitting diode after repairing according to a preferred embodiment of the present invention.

圖25為根據本發明較佳實施例的自我修復柔性發光電子元件剖面示意圖。Fig. 25 is a schematic cross-sectional view of a self-healing flexible light-emitting electronic component according to a preferred embodiment of the present invention.

無。none.

Claims (11)

一種可自我修復之共聚合高分子材料,其係為:聚二甲基矽氧烷(PDMS)、二苯基甲烷二異氰酸酯(MDI)與1,3,5-苯三甲醛(TFB)之共聚合高分子PDMS-MDIx-TFB1-x,其中x為0.1~0.9,且其具有PDI(Polymer dispersity index,聚合物分散指數)為1.4~1.7。 A self-healing copolymerized polymer material, which is a copolymer of polydimethylsiloxane (PDMS), diphenylmethane diisocyanate (MDI) and 1,3,5-benzenetricarbaldehyde (TFB) The polymeric polymer PDMS-MDI x -TFB 1-x , wherein x is 0.1-0.9, and it has a PDI (Polymer dispersion index, polymer dispersion index) of 1.4-1.7. 如請求項1所述之共聚合高分子材料,其中該x為0.4。 The copolymerized polymer material according to claim 1, wherein the x is 0.4. 如請求項1所述之共聚合高分子材料,其具有氫鍵與亞胺鍵之自我修復官能基。 The copolymerized polymer material according to claim 1, which has self-healing functional groups of hydrogen bonds and imine bonds. 如請求項1至3任一項所述之共聚合高分子材料,其玻璃轉移溫度(Tg)為-110至-130℃。 The copolymerized polymer material according to any one of Claims 1 to 3 has a glass transition temperature (T g ) of -110 to -130°C. 一種製造如請求項1至4任一項之可自我修復之共聚合高分子材料之方法,包含:(1)將雙(3-氨基丙基)封端聚二甲基矽烷(bis(3-aminopropyl)-terminated poly(dimethylsiloxane),NH2-PDMS-NH2)與二苯基甲烷二異氰酸酯(4,4-methylenebis(phenyl isocyanate),MDI)聚合得到PDS-MDI;及(2)將該PDS-MDI與1,3,5-苯三甲醛(1,3,5-triformylbenzene,TFB)聚合,得到PDMS-MDI-TFB。 A method for manufacturing a self-healing copolymerized polymer material according to any one of claims 1 to 4, comprising: (1) bis(3-aminopropyl)-terminated polydimethylsilane (bis(3- aminopropyl)-terminated poly(dimethylsiloxane), NH 2 -PDMS-NH 2 ) and diphenylmethane diisocyanate (4,4-methylenebis(phenyl isocyanate), MDI) are polymerized to obtain PDS-MDI; and (2) the PDS -MDI is polymerized with 1,3,5-benzenetriformaldehyde (1,3,5-triformylbenzene, TFB) to obtain PDMS-MDI-TFB. 一種發光材料,包含如請求項1至4任一項之共聚合高分子材料混摻鈣鈦礦量子點。 A luminescent material, comprising the copolymerized polymer material mixed with perovskite quantum dots according to any one of claims 1 to 4. 一種白光LED背光顯示器,包含一藍光LED芯片,及於其上分別疊加兩層如請求項6之發光材料,其中該兩層發光材料分別為共聚合高分子 材料混摻綠色之鈣鈦礦量子點,以及共聚合高分子材料混摻紅色之鈣鈦礦量子點。 A white LED backlight display, comprising a blue LED chip, and two layers of the luminescent material according to claim 6 respectively superimposed on it, wherein the two layers of luminescent material are respectively copolymerized polymers The material is mixed with green perovskite quantum dots, and the copolymerized polymer material is mixed with red perovskite quantum dots. 一種導電電極材料,其包含如請求項1至4任一項之共聚合高分子材料混摻奈米金屬線。 A conductive electrode material comprising the copolymerized polymer material mixed with nano metal wires according to any one of claims 1 to 4. 如請求項8之導電電極材料,其中該奈米金屬線為金屬銀線。 The conductive electrode material according to claim 8, wherein the nanometer metal wires are metallic silver wires. 一種有機發光二極體,其包含一發光層以及如請求項8或9之導電電極材料做為電極。 An organic light-emitting diode, which comprises a light-emitting layer and the conductive electrode material according to claim 8 or 9 as an electrode. 一種柔性發光電子元件,其包含如請求項10所述之有機發光二極體,並以一絕緣膜阻隔該發光層及該電極,且該絕緣膜未完全覆蓋該發光層,使彎折該柔性發光電子元件時,該發光層及該電極接觸。A flexible light-emitting electronic component, which includes the organic light-emitting diode as described in claim 10, and an insulating film is used to block the light-emitting layer and the electrode, and the insulating film does not completely cover the light-emitting layer, so that the flexible In light-emitting electronic components, the light-emitting layer is in contact with the electrode.
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CN110951023A (en) * 2019-12-16 2020-04-03 吉林大学 High-molecular damping material capable of being repaired at room temperature and preparation method and application thereof

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