TWI779183B - Systems, methods, and media for artificial intelligence feedback control in additive manufacturing - Google Patents

Systems, methods, and media for artificial intelligence feedback control in additive manufacturing Download PDF

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TWI779183B
TWI779183B TW108110747A TW108110747A TWI779183B TW I779183 B TWI779183 B TW I779183B TW 108110747 A TW108110747 A TW 108110747A TW 108110747 A TW108110747 A TW 108110747A TW I779183 B TWI779183 B TW I779183B
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target
printed
property
algorithm
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TW201945162A (en
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馬修 普特曼
法登 賓斯基
詹姆士 威廉斯三世
達瑪斯 里摩居
亞司文 拉加芙 尼爾馬雷斯瓦讓
馬利歐 克里斯
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美商奈米創尼克影像公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80Data acquisition or data processing
    • B22F10/85Data acquisition or data processing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90Means for process control, e.g. cameras or sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/209Heads; Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/24Classification techniques
    • G06F18/241Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2411Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/29Graphical models, e.g. Bayesian networks
    • G06F18/295Markov models or related models, e.g. semi-Markov models; Markov random fields; Networks embedding Markov models
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • G06N20/10Machine learning using kernel methods, e.g. support vector machines [SVM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00Scenes; Scene-specific elements
    • G06V20/60Type of objects
    • G06V20/64Three-dimensional objects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2203/00Controlling
    • B22F2203/03Controlling for feed-back
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/8422Investigating thin films, e.g. matrix isolation method
    • G01N2021/8438Mutilayers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/044Recurrent networks, e.g. Hopfield networks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/045Combinations of networks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/047Probabilistic or stochastic networks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • G06N3/088Non-supervised learning, e.g. competitive learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N7/00Computing arrangements based on specific mathematical models
    • G06N7/01Probabilistic graphical models, e.g. probabilistic networks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06Recognition of objects for industrial automation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
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Abstract

Additive manufacturing systems using artificial intelligence can identify an anomaly in a printed layer of an object from a generated topographical image of the printed layer. The additive manufacturing systems can also use artificial intelligence to determine a correlation between the identified anomaly and one or more print parameters, and adaptively adjust one or more print parameters. The additive manufacturing systems can also use artificial intelligence to optimize one or more printing parameters to achieve desired mechanical, optical and/or electrical properties.

Description

加成製造中人工智慧反饋控制系統、方法及媒介Artificial intelligence feedback control system, method and medium in additive manufacturing

本文有關於在加成(積層)製造中用於提供人工智慧回饋控制的機制。This article is about mechanisms used to provide artificial intelligence feedback control in additive (additive) manufacturing.

積層製造系統,例如3D印表機及單元印表機,被廣泛用於沉積多層天然的、合成的或生物材料,以經由擠出、燒結、光聚合、機械合成或電流體力量的過程來製造物體。積層製造的過程經由層沉積流程來製造物體,其中積層製造印表機不斷添加連續層,直到完成列印物體。Additive manufacturing systems, such as 3D printers and cell printers, are widely used to deposit multiple layers of natural, synthetic or biological materials for fabrication through processes of extrusion, sintering, photopolymerization, mechanosynthesis or electrohydrodynamic forces object. The process of additive manufacturing creates objects through a layer deposition process, where an additive manufacturing printer keeps adding successive layers until the printed object is complete.

通常,由積層製造印表機列印的物體是基於生產設計。可以使用三維建模軟體(例如,CAD程式)來為物體建立期望規格的生產設計。然後,切層程式可以將生產設計轉換為數字控制碼(例如,G碼),其將該設計劃分為多個層,然後可以用於指示積層製造印表機列印生產設計的每個個別層的實體表示。積層製造的目標是列印一個與生產設計的規格密切相關的物體。Typically, objects printed by additive manufacturing printers are based on production designs. Three-dimensional modeling software (eg, a CAD program) can be used to create a production design of desired specifications for the object. A layer-slicing program can then convert the production design into a numerical control code (e.g., G-code) that divides the design into layers, which can then be used to instruct an additive manufacturing printer to print each individual layer of the production design entity representation. The goal of additive manufacturing is to print an object that closely matches the specifications of the production design.

根據生產設計的規模和複雜程度,所列印物體可能需要幾個小時到幾天才能完成。目前的積層製造系統受限於它們可以提供的回饋類型以及它們在列印物體的每一層之後可以採取的校正動作。通常在整個物體被列印完之前不提供回饋。當在物體的列印過程期間提供回饋時,通常用於確定是停止還是繼續列印物體的目的。Depending on the size and complexity of the production design, printed objects can take hours to days to complete. Current additive manufacturing systems are limited in the type of feedback they can provide and the corrective actions they can take after printing each layer of an object. Usually no feedback is provided until the entire object has been printed. When providing feedback during the printing process of an object, it is typically used for the purpose of determining whether to stop or continue printing the object.

在一些積層製造系統中,當光照在物體上時,由所列印物體產生的陰影提供反饋。這種方法是有限的,因為陰影會阻礙所列印物體的多個區域並妨礙精確的反饋。積層製造中的精確回饋對於維持品質及可再現的列印物體是有用的。In some additive manufacturing systems, feedback is provided by shadows produced by printed objects when light falls on them. This approach is limited because shadows can obstruct many areas of the printed object and prevent accurate feedback. Accurate feedback in additive manufacturing is useful to maintain quality and reproducible printed objects.

因此,期望為物體的每個列印層提供人工智慧回饋控制(AIFC),以便在物體的列印過程期間可以採取及時的校正動作。還希望提供AIFC以實現列印物體的所需機械、光學及/或電性質,以及實現與其生產設計非常相似的列印物體,或改進生產設計。Therefore, it is desirable to provide artificial intelligence feedback control (AIFC) for each printing layer of an object so that timely corrective actions can be taken during the printing process of the object. It is also desirable to provide AIFCs to achieve desired mechanical, optical and/or electrical properties of printed objects, and to achieve printed objects that closely resemble their production designs, or to improve production designs.

根據一些實施方式,提供了在積層製造中用於人工智慧回饋控制的系統、方法、及媒體。更特別的是,在一些實施例中,提供了積層製造系統,該系統包括:被配置為以逐層方式列印一物體的列印頭;用於向該物體的一列印層的一表面提供照明的照明源;被配置為擷取該列印層的一影像的影像感測器;以及至少一硬體處理器,被配置為:接收經擷取影像;產生該列印層的三維形貌影像;使用第一人工智慧算法,從所產生的形貌影像識別出該列印層中的異常;使用第二人工智慧算法,確定所識別的異常與一或多個列印參數之間的關聯;以及分配數值給一或多個列印參數。According to some embodiments, systems, methods, and media for artificial intelligence feedback control in additive manufacturing are provided. More particularly, in some embodiments, an additive manufacturing system is provided, the system comprising: a printing head configured to print an object in a layer-by-layer manner; for providing a surface of a printed layer of the object with an illumination source for illumination; an image sensor configured to capture an image of the printed layer; and at least one hardware processor configured to: receive the captured image; generate a three-dimensional topography of the printed layer image; using a first artificial intelligence algorithm, identifying an anomaly in the print layer from the generated topography image; using a second artificial intelligence algorithm, determining a correlation between the identified anomaly and one or more printing parameters ; and assign values to one or more print parameters.

在一些實施例中,提供了用於積層製造的方法,該方法包括:接收經擷取影像,該經擷取影像是由影像感測器產生,該影像感測器被配置以擷取以逐層方式列印的物體的列印層的影像;使用硬體處理器產生該列印層的三維形貌影像;使用第一人工智慧算法,從所產生的形貌影像識別出該列印層中的異常;使用第二人工智慧算法,確定所識別的異常與一或多個列印參數之間的關聯;以及分配數值給一或多個列印參數。In some embodiments, a method for additive manufacturing is provided, the method comprising: receiving a captured image generated by an image sensor configured to capture to sequentially The image of the printing layer of the object printed in layer mode; using a hardware processor to generate a three-dimensional topography image of the printing layer; using the first artificial intelligence algorithm to identify the printing layer from the generated topography anomalies; using a second artificial intelligence algorithm, determining a correlation between the identified anomalies and the one or more printing parameters; and assigning values to the one or more printing parameters.

在一些實施例中,提供了一種包含多個電腦可執行指令的非暫態電腦可讀取媒體,當由處理器執行該多個電腦可執行指令時,導致該處理器執行一種用於積層製造的方法,該方法包括:接收經擷取影像,該經擷取影像是由影像感測器產生,該影像感測器被配置以擷取以逐層方式列印的物體的列印層的影像;產生該列印層的三維形貌影像;使用第一人工智慧算法,從所產生的形貌影像識別出該列印層中的異常;使用第二人工智慧算法,確定所識別的異常與一或多個列印參數之間的關聯;以及分配數值給一或多個列印參數。In some embodiments, there is provided a non-transitory computer-readable medium containing a plurality of computer-executable instructions that, when executed by a processor, cause the processor to execute a method for additive manufacturing A method comprising: receiving a captured image generated by an image sensor configured to capture an image of a printed layer of an object printed in a layer-by-layer manner ; generating a three-dimensional topography image of the printing layer; using a first artificial intelligence algorithm to identify anomalies in the printing layer from the generated topography image; using a second artificial intelligence algorithm to determine whether the identified anomalies are consistent with a or associations between printing parameters; and assigning values to one or more printing parameters.

根據所揭露主題的一些實施方式,提供了用於積層製造人工智慧回饋控制(AIFC)的多種機制(其可以包括系統、方法、裝置、設備等)。例如,與生產設計相比,AIFC可有用於最佳化積層製造系統的列印參數,以實現期望的機械、光學及/或電性質及/或列印物體的期望準確度。AIFC還可用於識別列印層中的異常並在列印過程中採取校正動作。According to some implementations of the disclosed subject matter, various mechanisms (which may include systems, methods, apparatuses, devices, etc.) for additive manufacturing artificial intelligence feedback control (AIFC) are provided. For example, AIFC may be useful for optimizing printing parameters of an additive manufacturing system to achieve desired mechanical, optical and/or electrical properties and/or a desired accuracy of printed objects as compared to production design. AIFC can also be used to identify anomalies in the print layer and take corrective action during the printing process.

如本文所揭露的,在一些實施例中,人工智慧可用於從本文所述的積層製造中學習及改進,並輸出回饋、資訊、資料及/或指令(“AIFC”)。人工智慧算法可以單獨或組合的方式包括以下中的一個或多個:機器學習、隱藏馬可夫模型(hidden Markov models)、遞迴類神經網路(recurrent neural networks)、卷積類神經網路(convolutional neural networks)、貝氏符號法(Bayesian symbolic methods)、通用對抗網路(general adversarial networks)、支援向量機(support vector machines)及/或任何其他合適的人工智慧算法。雖然AIFC基於AI算法,但AIFC還可以使用不是基於人工智慧算法、在積層製造期間收集的資料。As disclosed herein, in some embodiments, artificial intelligence can be used to learn and improve from additive manufacturing as described herein and output feedback, information, data, and/or instructions (“AIFC”). Artificial intelligence algorithms may include one or more of the following alone or in combination: machine learning, hidden Markov models, recurrent neural networks, convolutional neural networks neural networks), Bayesian symbolic methods, general adversarial networks, support vector machines, and/or any other suitable artificial intelligence algorithm. Although AIFC is based on AI algorithms, AIFC can also use data collected during additive manufacturing that is not based on AI algorithms.

第1圖顯示了根據所揭露主題的一些實施方式的可以實現AIFC的示例性積層製造系統100。在高階,根據一些實施方式,積層製造系統100的基本元件包括數字控制碼產生器110、積層製造印表機115、影像產生器170及影像分析器180。積層製造印表機115可包括影像感測器120、光源130、列印頭140,線材供應系統145、底板150及控制模組160。用於積層製造系統100的元件的功能可以結合在單個元件中或分佈在幾個元件中。在一些實施例中,一些元件(例如,數字控制碼產生器110、影像產生器170及/或影像分析器180)的功能可以從積層製造印表機115遠端執行。FIG. 1 shows an exemplary additive manufacturing system 100 that can implement AIFC, according to some implementations of the disclosed subject matter. At a high level, the basic elements of the additive manufacturing system 100 include a digital control code generator 110, an additive manufacturing printer 115, an image generator 170, and an image analyzer 180, according to some embodiments. The additive manufacturing printer 115 may include an image sensor 120 , a light source 130 , a printing head 140 , a wire supply system 145 , a bottom plate 150 and a control module 160 . The functions of the elements used in the additive manufacturing system 100 may be combined in a single element or distributed among several elements. In some embodiments, the functions of some components (eg, digital control code generator 110 , image generator 170 , and/or image analyzer 180 ) may be performed remotely from additive manufacturing printer 115 .

注意,積層製造系統100可包括未顯示的其他合適的元件。附加地或替代地,可以省略積層製造系統100中包括的一些元件。Note that additive manufacturing system 100 may include other suitable elements not shown. Additionally or alternatively, some elements included in the additive manufacturing system 100 may be omitted.

儘管以下描述涉及伴隨熔融沈積成型積層製造印表機使用AIFC,但在一些實施例中,本文所述的AIFC可與任何合適的3D列印技術一起使用,包括立體光固化成型技術(SLA)、電子束熔化、直接金屬沉積(電動流體動力學印刷)及選擇性雷射燒結。Although the following description refers to the use of AIFCs with fused deposition modeling additive manufacturing printers, in some embodiments, the AIFCs described herein may be used with any suitable 3D printing technology, including stereolithography (SLA), Electron beam melting, direct metal deposition (electrohydrodynamic printing) and selective laser sintering.

在一些實施例中,積層製造印表機115可包括一個或多個影像感測器120,用於在列印過程中擷取影像及/或視訊。影像感測器120可以被配置為在列印物體的每一層的同時及/或之後擷取物體的影像(或視訊)。影像感測器120可以是例如電荷耦合裝置(CCD)或互補式金屬氧化物半導體(CMOS)感測器,如可用於數位相機及/或攝影機中的感測器。影像感測器120還可以包括用於擷取物體的熱影像及/或視訊並執行溫度計算的紅外線(IR)攝影機。影像感測器120可以相對於底板150及/或列印頭140位於不同的位置和角度。In some embodiments, the additive manufacturing printer 115 may include one or more image sensors 120 for capturing images and/or video during the printing process. The image sensor 120 may be configured to capture an image (or video) of the object while and/or after printing each layer of the object. The image sensor 120 may be, for example, a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) sensor, such as may be used in a digital camera and/or a video camera. The image sensor 120 may also include an infrared (IR) camera for capturing thermal images and/or video of objects and performing temperature calculations. The image sensor 120 can be located at different positions and angles relative to the bottom plate 150 and/or the print head 140 .

在一些實施例中,積層製造印表機115可包括單一光源130或多個光源(例如,多光向量),其位於相對於底板150及/或相對於影像感測器120的不同位置及角度(例如,光源可以圍繞影像感測器120周圍被放置)。照明可以根據尺寸、所使用的光源的數量及/或照明的位置及角度而變化。照明可以用於照亮物體的列印層,使得影像感測器120可以擷取物體的影像及/或視訊。In some embodiments, additive manufacturing printer 115 may include a single light source 130 or multiple light sources (e.g., multiple light vectors) positioned at different positions and angles relative to chassis 150 and/or relative to image sensor 120 (eg, light sources may be placed around the periphery of the image sensor 120). Illumination may vary according to size, number of light sources used and/or position and angle of illumination. Illumination can be used to illuminate the printed layer of the object so that the image sensor 120 can capture an image and/or video of the object.

擷取的影像及/或視訊可以儲存在記憶體中,並且可以用於建立列印層的三維形貌影像及/或其他合適的影像,如本文結合影像產生器170所討論的。Captured images and/or videos may be stored in memory and may be used to create a three-dimensional topographical image of the printed layer and/or other suitable images, as discussed herein in connection with image generator 170 .

第2圖顯示了可與積層製造印表機115一起使用的相機120及光源130的示例。第2圖包括被放置在LED支架230中的發光二極體(LED)環210圍繞的相機120。在一些實施例中,控制模組160控制LED環210內的各個LED,確定應該照亮哪些LED。LED環210內的各個LED的控制可以藉由用於產生列印層影像的形貌成像技術的要求來確定。FIG. 2 shows an example of a camera 120 and light source 130 that may be used with an additive manufacturing printer 115 . FIG. 2 includes the camera 120 surrounded by a light emitting diode (LED) ring 210 placed in an LED holder 230 . In some embodiments, the control module 160 controls the individual LEDs within the LED ring 210 to determine which LEDs should be illuminated. The control of the individual LEDs within LED ring 210 may be determined by the requirements of the topographical imaging technique used to generate the printed layer image.

如上所述,積層製造印表機115還可包括一或多個列印頭140及一或多個底板150。列印頭140及/或底板150可相對於另一個以X(寬度)、Y(長度)及Z(高度)維度移動。列印頭140可以固定由線材供應系統145供應的線材,該線材經由一或多個列印頭140的一或多個噴嘴以逐層方式擠出。在一些實施例中,列印頭噴嘴的溫度可以被控制來加熱儲存在列印頭140中的線材,以使線材保持可以被沉積的可流動形式(例如,當列印頭140及/或底板150相對於另一個移動,及/或當列印頭140及/或底板150靜止時)。擠出的材料可以熔合至底板150(如第一擠出層的情況)或先前沉積的擠出層。可以控制的列印頭140及/或底板150的其他方面包括,例如列印頭140及/或底板150在移動期間遵循的路徑、當在生產設計的各層之間轉換時列印頭及/或底板150沿Z軸維度相對於另一個移動的量、列印頭140及/或底板150相對於另一個的方向、列印頭140及/或底板150的移動速度、以及列印頭140沉積線材的量及速率。在一些實施例中,列印路徑可以由至少兩組X-Y-Z坐標定義。在操作期間,可以控制列印頭及/或底板相對於另一個移動,並且列印頭可以以期望的填充圖案釋放線材。在一些實施例中,列印頭140及/或底板150可以由來自數字控制碼產生器110的碼及/或控制模組160控制。As noted above, the additive manufacturing printer 115 may also include one or more print heads 140 and one or more chassis 150 . Print head 140 and/or chassis 150 are movable relative to each other in X (width), Y (length) and Z (height) dimensions. The print head 140 can hold the filament supplied by the filament supply system 145 , and the filament is extruded layer by layer through one or more nozzles of the one or more print heads 140 . In some embodiments, the temperature of the printhead nozzles can be controlled to heat the filament stored in the printhead 140 so that the filament remains in a flowable form where it can be deposited (e.g., when the printhead 140 and/or the chassis 150 relative to one another, and/or when print head 140 and/or base plate 150 are stationary). The extruded material may be fused to the base plate 150 (as in the case of the first extruded layer) or to a previously deposited extruded layer. Other aspects of print head 140 and/or chassis 150 that may be controlled include, for example, the path that print head 140 and/or chassis 150 follows during movement, the print head and/or The amount of movement of the base plate 150 relative to the other along the Z-axis dimension, the orientation of the print head 140 and/or the base plate 150 relative to the other, the speed of movement of the print head 140 and/or the base plate 150, and the deposition of the filament by the print head 140 amount and rate. In some embodiments, the printing path can be defined by at least two sets of X-Y-Z coordinates. During operation, the print head and/or the chassis can be controlled to move relative to the other, and the print head can release the filaments in a desired fill pattern. In some embodiments, the print head 140 and/or the chassis 150 may be controlled by codes from the digital control code generator 110 and/or the control module 160 .

在一些實施例中,底板150可以被加熱到預定溫度並且可以在不同方向上定向。In some embodiments, the bottom plate 150 can be heated to a predetermined temperature and can be oriented in different directions.

在一些實施例中,控制模組160(在一些實施例中可包括控制器及控制者介面),可控制積層製造系統100的元件(例如,數字控制碼產生器110、影像感測器120、光源130、列印頭140、底板150、影像產生器170及影像分析器180)的任何合適的一或多個設定(例如,溫度、速度、方向等)、以及通訊、操作(例如,擷取列印物體的影像、啟用光源130等)、以及由積層製造系統的元件執行的計算及積層製造系統的元件之間的計算。控制系統108可以包括任何合適的硬體(在一些實施例中可以執行軟體),例如電腦、微處理器、微控制器、專用積體電路(ASIC)、現場可程式閘陣列(FGPA)、以及數位信號處理器(DSP)(其中任何一個可稱為硬體處理器)、編碼器、讀取編碼器的電路、記憶體裝置(包括一或多個EPROMS、一或多個EEPROM、動態隨機存取記憶體(“DRAM”)、靜態隨機存取記憶體(“SRAM”)及/或快閃記憶體)、及/或任何其他合適的硬體元件。在一些實施例中,積層製造系統100內的各個元件可包括其自己的軟體、韌體及/或硬體,以控制各個元件並與積層製造系統100中的其他元件通訊。In some embodiments, the control module 160 (which may include a controller and a controller interface in some embodiments) can control the components of the additive manufacturing system 100 (for example, the digital control code generator 110, the image sensor 120, any suitable one or more settings (e.g. temperature, speed, direction, etc.) printing an image of the object, enabling the light source 130, etc.), and calculations performed by and between components of the AM system. Control system 108 may include any suitable hardware (and in some embodiments may execute software), such as computers, microprocessors, microcontrollers, application specific integrated circuits (ASICs), field programmable gate arrays (FGPAs), and Digital signal processors (DSP) (any of which may be referred to as a hardware processor), encoders, circuits for reading encoders, memory devices (including one or more EPROMS, one or more EEPROMs, dynamic random memory memory (“DRAM”), static random access memory (“SRAM”) and/or flash memory), and/or any other suitable hardware components. In some embodiments, each component within the additive manufacturing system 100 may include its own software, firmware, and/or hardware to control each component and communicate with other components in the additive manufacturing system 100 .

在一些實施例中,控制模組160與積層製造系統100的其他元件之間的通訊、及/或控制模組160與積層製造印表機115內的其他元件之間的通訊可以使用任何合適的通訊技術,例如類比技術(例如,中繼邏輯)、數位技術(例如,RS232、乙太網路或無線)、網路技術(例如,區域網路(LAN)、廣域網路(WAN)、網際網路)、藍芽技術、近場通訊技術、安全RF技術及/或任何其他合適的通訊技術。In some embodiments, communication between the control module 160 and other components of the additive manufacturing system 100, and/or communication between the control module 160 and other components within the additive manufacturing printer 115 may use any suitable Communication technologies such as analog technologies (e.g., relay logic), digital technologies (e.g., RS232, Ethernet or wireless), network technologies (e.g., local area network (LAN), wide area network (WAN), Internet road), Bluetooth technology, near field communication technology, secure RF technology and/or any other suitable communication technology.

在一些實施例中,可以使用任何合適的輸入裝置(例如,鍵盤、滑鼠或搖桿)將操作者輸入傳送到控制模組160。In some embodiments, operator input may be communicated to control module 160 using any suitable input device (eg, keyboard, mouse, or joystick).

除了第1圖中所示的元件之外,積層製造印表機115還可以包括其他元件,例如溫度感測器、濕度感測器、用於測量加速度以及列印頭140的任何非預期運動(例如搖晃、顫抖等)的加速度計,以及用於顯示影像的顯示監視器。積層製造印表機115還可包括一或多個致動器,用於定向及/或移動影像感測器120、照明源130、列印頭140及/或底板150。In addition to the elements shown in Figure 1, the additive manufacturing printer 115 may include other elements such as temperature sensors, humidity sensors, sensors for measuring acceleration and any unintended movement of the print head 140 ( such as shaking, trembling, etc.), and a display monitor for displaying images. Additive manufacturing printer 115 may also include one or more actuators for orienting and/or moving image sensor 120 , illumination source 130 , print head 140 and/or chassis 150 .

第1圖還顯示了數字控制碼產生器110。在一些實施例中,數字控制碼產生器110可以被配置為接收要被列印的物體的三維設計(例如,電腦輔助設計(CAD)模型)(這裡稱為“生產設計”)。可以能夠以數字控制碼產生器110處理的任何合適格式(例如,標準曲面細分語言(.stl)、繪圖標準(DWS)或繪圖(DWG)文件格式)接收生產設計。Figure 1 also shows a digital control code generator 110 . In some embodiments, digital control code generator 110 may be configured to receive a three-dimensional design (eg, a computer-aided design (CAD) model) of an object to be printed (referred to herein as a "production design"). The production design may be received in any suitable format capable of being processed by the digital control code generator 110 (eg, standard tessellation language (.stl), drafting standard (DWS), or drafting (DWG) file format).

數字控制碼產生器110可以被配置為將生產設計轉換為用於積層製造印表機115的指令以列印生產設計的實體表示。在一些實施例中,如結合第3圖所述,數字控制碼產生器110可以包括用於讓操作者輸入某些列印參數的介面。列印參數還可以包括但不限於以下的一個或多個:積層製造機115的列印特徵(例如,列印頭尺寸、擠出的線材類型、3D列印技術等);列印路徑;線材供給率;生產設計的規格(例如,經列印設計看起來應該是什麼樣的、期望的機械、光學及/或電性質等)。Digital control code generator 110 may be configured to convert the production design into instructions for additive manufacturing printer 115 to print a physical representation of the production design. In some embodiments, as described in conjunction with FIG. 3 , the digital control code generator 110 may include an interface for the operator to input certain printing parameters. The printing parameters may also include, but are not limited to, one or more of the following: printing characteristics of the additive manufacturing machine 115 (eg, print head size, extruded filament type, 3D printing technology, etc.); printing path; filament Supply rates; specifications for production designs (eg, what the design should look like when printed, desired mechanical, optical and/or electrical properties, etc.).

基於一或多個列印參數,數字控制碼產生器110可以應用切層演算法以使生產設計與在Z方向上以預定距離間隔開的平行平面相交以產生二維或三維層。例如,如果要列印的物體在Z方向上為5mm並且所期望的層厚度在Z方向上為0.2mm,那麼可以將物體的生產設計切成25層,它們在Z方向上厚度為0.2mm。除了切割生產設計之外,數字控制碼產生器110還可以被配置為基於以下一個或多個產生要列印的每個層的數字控制碼:列印參數;來自當前列印的列印物體的一個或多個先前列印層的AIFC;來自其他列印物體的AIFC(其中一些可能被納入生產設計);以及積層製造印表機115的列印特徵。Based on one or more printing parameters, the digital control code generator 110 may apply a slice algorithm to intersect the production design with parallel planes spaced a predetermined distance apart in the Z direction to generate two-dimensional or three-dimensional layers. For example, if an object to be printed is 5mm in the Z direction and the desired layer thickness is 0.2mm in the Z direction, then the production design of the object can be sliced into 25 layers that are 0.2mm thick in the Z direction. In addition to cutting the production design, the digital control code generator 110 can also be configured to generate a digital control code for each layer to be printed based on one or more of: printing parameters; AIFC of one or more previously printed layers; AIFC from other printed objects (some of which may be incorporated into the production design); and the printing characteristics of the additive manufacturing printer 115.

在其他實施方式中,切層演算法可以被配置為僅確定第一層並且為該第一層產生數字控制碼。可以基於以下的一個或多個來產生用於列印物體的每個後續層的數字控制碼:來自當前列印的列印物體的一個或多個先前列印層的AIFC;來自其他列印物體的AIFC(其中一些可能被納入生產設計);用於列印物體的生產設計的所期望機械、光學及/或電性質和規格;由操作者輸入的輸入參數及/或積層製造印表機115的列印特徵。在一些實施例中,可以完全省略切層演算法,並且可以基於以下中的一個或多個產生數字控制碼:來自其他列印物體的AIFC(其中一些可能被納入生產設計);用於列印物體的生產設計的所期望機械、光學及/或電性質和規格;操作者輸入的輸入參數;及/或積層製造印表機115的列印特徵。在一些實施例中,數字控制碼產生器還可以考慮不可控變量(即,無需人為干預的不可控變量),例如,包括但不限於,積層製造印表機115的環境濕度、溫度和光照、電壓變化、磨損以及可用於列印頭140的總線材供應。In other embodiments, the layer-slicing algorithm may be configured to only determine the first layer and generate the digital control code for that first layer. The numerical control codes for each subsequent layer of the printed object may be generated based on one or more of: AIFC from one or more previously printed layers of the currently printed printed object; AIFC (some of which may be incorporated into the production design); desired mechanical, optical and/or electrical properties and specifications of the production design for the printed object; input parameters entered by the operator and/or additive manufacturing printer 115 printing characteristics. In some embodiments, the slice algorithm may be omitted entirely, and the numerical control code may be generated based on one or more of: AIFC from other printed objects (some of which may be incorporated into the production design); Desired mechanical, optical, and/or electrical properties and specifications of the production design of the object; input parameters entered by the operator; and/or printing characteristics of the additive manufacturing printer 115 . In some embodiments, the digital control code generator may also take into account uncontrollable variables (i.e., uncontrollable variables that do not require human intervention), including, but not limited to, environmental humidity, temperature, and lighting of the additive manufacturing printer 115, Voltage variations, wear, and bus supply available to printhead 140 .

第3圖顯示了根據所揭露主題的一些實施方式的用於讓操作者將列印參數輸入至數字控制碼產生器110中的示例介面300。FIG. 3 shows an example interface 300 for an operator to enter printing parameters into the digital control code generator 110 according to some implementations of the disclosed subject matter.

注意,介面300可以包括用於控制未顯示的其他合適列印參數的欄位。附加地或替代地,在一些實施例中可以省略介面300中包括的一些列印參數。此外,介面300中包括的任何及所有列印參數可替代地由數字控制碼產生器自動產生,而不是由操作者輸入。在一些實施例中,操作者可以輸入用於生產設計的第一層的列印參數,且數字控制碼產生器110可以使用人工智慧算法及本文揭露的其他方法來產生用於列印設計的後續層的列印參數。Note that interface 300 may include fields for controlling other suitable printing parameters not shown. Additionally or alternatively, some printing parameters included in interface 300 may be omitted in some embodiments. Furthermore, any and all printing parameters included in interface 300 may alternatively be automatically generated by a digital control code generator rather than input by an operator. In some embodiments, an operator may input printing parameters for producing the first layer of the design, and the digital control code generator 110 may use artificial intelligence algorithms and other methods disclosed herein to generate subsequent layers for printing the design. The printing parameters for the layer.

如圖所示,介面300可以包括控制列印品質參數(例如層高度、殼厚度及縮回)的欄位。As shown, interface 300 may include fields to control print quality parameters such as layer height, shell thickness, and retraction.

層高度是指列印物體的層的高度。層的高度會影響列印解析度。例如,與較高層相比,短層可以產生更詳細的列印及更光滑的表面。但是,具有較短層的物體可能需要更長時間來列印。相反地,較高的層可以對應於較低解析度的列印及較粗糙的表面。包括高層的物體可以比具有較短層的相同物體更快地被列印。在一些實施例中可以使用任何合適的層高度。The layer height refers to the height of the layer of the printed object. Layer height affects print resolution. For example, short layers can produce more detailed prints and smoother surfaces than higher layers. However, objects with shorter layers may take longer to print. Conversely, higher layers may correspond to lower resolution printing and rougher surfaces. Objects that include high layers can be printed faster than the same object with shorter layers. Any suitable layer heights may be used in some embodiments.

殼厚度是指列印物體的外壁的厚度。在一些實施例中可以使用任何合適的殼厚度。Shell thickness refers to the thickness of the outer wall of the printed object. Any suitable shell thickness may be used in some embodiments.

縮回是指當列印頭移動到沒有指定列印的區域時,確保沒有線材從列印頭擠出。在一些實施例中,可以啟用或停用縮回。Retraction refers to ensuring that no filament is extruded from the print head when the print head moves to an area that is not designated for printing. In some embodiments, retraction can be enabled or disabled.

介面300還可以包括控制列印速度設定的欄位,用於控制列印頭速度及/或底板速度。列印速度是指列印頭列印時列印頭及/或底板移動的速度。在一些實施例中可以使用任何合適的列印速度。基於列印速度,可以計算需要擠出的材料量(即供給率)。在一些實施例中可以使用任何合適的供給率。Interface 300 may also include fields to control print speed settings for controlling print head speed and/or platen speed. Printing speed refers to the speed at which the print head and/or the platen move while the print head is printing. Any suitable printing speed may be used in some embodiments. Based on the printing speed, the amount of material that needs to be extruded (ie, the feed rate) can be calculated. Any suitable feed rate may be used in some embodiments.

介面300還可以包括控制溫度設定的欄位,用於控制列印頭溫度及/或底板溫度。當列印速度改變時,可能需要改變列印頭的溫度,以確保擠出的線材被充分加熱以進行沉積。在一些實施例中可以使用任何合適的列印頭溫度。Interface 300 may also include fields to control temperature settings for controlling print head temperature and/or chassis temperature. As the printing speed is changed, it may be necessary to change the temperature of the print head to ensure that the extruded filament is heated sufficiently for deposition. Any suitable print head temperature may be used in some embodiments.

介面300還可以包括控制填充密度及填充圖案設定的欄位。Interface 300 may also include fields to control fill density and fill pattern settings.

填充密度是指在物體內列印的結構,並且可以例如由百分比來指定。在一些實施例中可以使用任何合適的填充密度。100%填充密度是指沒有預期間隙的固體填充密度。Fill density refers to the structure printed within an object and can be specified, for example, by a percentage. Any suitable packing density may be used in some embodiments. 100% packing density refers to a solid packing density with no expected interstices.

填充圖案是指填充的圖案。在一些實施例中可以使用任何合適的填充圖案。例如,在一些實施例中,填充圖案可包括蜂窩、三角形、網格及矩形。填充密度及填充圖案會影響列印重量、列印物體強度、總列印時間及外部性質。填充圖案還可以影響機械、光學及/或電性質。在一些實施例中,可以為特定層或為整個物體設定填充密度及填充圖案。Fill pattern refers to the pattern of filling. Any suitable fill pattern may be used in some embodiments. For example, in some embodiments, fill patterns may include honeycombs, triangles, grids, and rectangles. Fill density and fill pattern affect print weight, print object strength, total print time, and exterior properties. Fill patterns can also affect mechanical, optical and/or electrical properties. In some embodiments, the fill density and fill pattern can be set for specific layers or for the entire object.

此外,介面300可以包括用於控制支撐設定的欄位,包括支撐類型及平台黏合型態。Additionally, interface 300 may include fields for controlling support settings, including support type and platform binding type.

一些列印物體可能具有懸垂部分,因此可能需要支撐以防止擠出的線材在列印過程中掉落。支撐設定可用於指定支撐放置的位置。在一些實施例中可以使用任何合適的支撐設定。Some printed objects may have overhangs, so supports may be required to prevent the extruded filament from falling during printing. Support settings can be used to specify where supports are placed. Any suitable support settings may be used in some embodiments.

平台黏合設定可用於改善列印層與底板150的黏附力。可指定的不同類型的平台黏合設定包括:筏設定,其在列印物體的底層及底板之間添加粗網格形式的額外線材;邊緣設定,在列印物體的第一層周圍添加額外的線材線;以及裙邊設定,在第一列印層上的物體周圍添加一排線材。使用某些平台黏合設定可以幫助減少列印物體中的翹曲量。在一些實施例中可以使用任何合適的平台黏合設定。The platform adhesion setting can be used to improve the adhesion of the printing layer to the bottom plate 150 . The different types of platform bonding settings that can be specified include: Raft settings, which add extra wires in the form of a coarse grid between the bottom layer of the printed object and the base plate; Edge settings, which add extra wires around the first layer of the printed object Lines; and the Skirt setting, which adds a row of wires around objects on the first print layer. Using certain platform binding settings can help reduce the amount of warping in printed objects. Any suitable platform binding settings may be used in some embodiments.

介面300還可以包括與物體放置及方向相關的欄位設定。這些設定包括列印物體在底板150上的位置,以及列印物體在底板150上的方向。在一些實施例中可以使用任何合適的物體放置及/或方向設定。Interface 300 may also include field settings related to object placement and orientation. These settings include the position of the printed object on the bottom plate 150 and the direction of the printed object on the bottom plate 150 . Any suitable object placement and/or orientation may be used in some embodiments.

在一些實施例中,產生的數字控制碼可以描述用於列印頭140及/或底板150的相對移動的列印路徑。列印路徑可以由X-Y-Z維度(設定點)中的兩組坐標、以及指定在設定點之間移動的方式的指令來定義。所產生的數字控制碼可以指定列印頭140及/底板150相對於另一個的移動(同時在沿著列印路徑的一對連續點之間移動)的速度、在一對連續點之間線材的溫度(或列印頭噴嘴的溫度)、及/或在一對連續點之間的線材的供給率。產生的數字控制碼可以指定列印頭140應該擠出線材的位置,及/或它應該避免釋放線材的位置。產生的數字控制碼中包括的所有參數也被認為是“列印參數”。In some embodiments, the generated digital control code may describe a print path for relative movement of the print head 140 and/or the chassis 150 . A print path can be defined by two sets of coordinates in the X-Y-Z dimension (setpoints), and instructions specifying how to move between the setpoints. The resulting digital control code can specify the speed at which print head 140 and/or chassis 150 move relative to one another (while moving between a pair of consecutive points along the print path), the speed at which the wire will move between a pair of consecutive points. temperature (or print head nozzle temperature), and/or the feed rate of the filament between a pair of consecutive points. The resulting digital control code may specify where the print head 140 should extrude the filament, and/or where it should avoid releasing the filament. All parameters included in the resulting numeric control code are also considered "printing parameters".

上述一或多個列印參數以及不可控變量可以影響列印物體的性質,例如層異常、表面粗糙度、列印解析度、總構建時間、用於列印物體所使用的擠出材料的量、以及列印物體的機械、光學及/或電性質。機械性質可包括最大抗拉強度(Rm )、屈服強度(Rp2% )、斷裂伸長度(A% )、楊氏模數(E)、疲勞(σd )、柏松比(Poisson's ratio)、質量、及比重。光學性質可包括吸收、反射、透射、及折射。電性質可包括電阻率及傳導率。所揭露的機械、光學及電性質僅是示例,而非旨在限制。One or more of the above printing parameters as well as uncontrollable variables can affect the properties of the printed object, such as layer anomalies, surface roughness, printing resolution, total build time, amount of extruded material used to print the object , and the mechanical, optical and/or electrical properties of the printed object. Mechanical properties may include maximum tensile strength (R m ), yield strength (Rp 2% ), elongation at break (A % ), Young's modulus (E), fatigue (σ d ), Poisson's ratio , mass, and specific gravity. Optical properties may include absorption, reflection, transmission, and refraction. Electrical properties may include resistivity and conductivity. The disclosed mechanical, optical and electrical properties are examples only and are not intended to be limiting.

AIFC可用於將被列印物體所期望的機械性質、光學性質、電性質及/或任何合適的性質最佳化。列印物體時,AIFC也可用於採取校正動作。校正動作可以包括改變目前正在列印的物體的下一層或目標未來層的列印參數。在一些實施例中,AIFC可用於改進生產設計。AIFC can be used to optimize desired mechanical properties, optical properties, electrical properties, and/or any suitable properties of a printed object. AIFC can also be used to take corrective action when printing objects. Corrective actions may include changing the printing parameters of the next or targeted future layers of the object currently being printed. In some embodiments, AIFC can be used to improve production design.

如第1圖中所示,積層製造系統100可包括影像產生器170,其可處理物體的列印層的擷取影像及/或視訊。在一些實施例中,影像產生器170可包括配置用於儲存擷取影像及/或視訊以及用於從擷取的影像及/或視訊產生列印層的三維形貌影像、及/或其他合適影像的硬體或軟體。As shown in FIG. 1 , the additive manufacturing system 100 can include an image generator 170 that can process captured images and/or videos of printed layers of an object. In some embodiments, the image generator 170 may include a three-dimensional topographical image configured to store captured images and/or videos and to generate printed layers from the captured images and/or videos, and/or other suitable Image hardware or software.

可以使用具有預定義大小、數量及位置的照射光的不同形貌成像技術(包括但不限於,聚焦成形算法、光影重建算法、光學立體算法及傅立葉疊層衍射調變算法),以產生每個列印層的一或多個三維形貌影像。產生的形貌影像可以提供與列印物體及/或部分列印物體的完成層相關的容量資訊、列印物體及/或部分列印物體的每層的總尺寸、列印物體及/或部分列印物體的每層的特徵、以及在列印物體及/或部分列印物體的一或多層上發現的有關異常(諸如量、分佈、異常類型等)的資訊。Different topographical imaging techniques (including, but not limited to, focus shaping algorithms, light shadow reconstruction algorithms, optical stereo algorithms, and Fourier stack diffraction modulation algorithms) with illumination lights of predefined sizes, quantities, and positions can be used to generate each One or more 3D topography images of the print layer. The resulting topographical image may provide volume information related to the finished layers of the printed object and/or partially printed object, the overall dimensions of each layer of the printed object and/or partially printed object, the printed object and/or the partial The characteristics of each layer of the printed object, and information about anomalies (such as amount, distribution, type of anomaly, etc.) found on one or more layers of the printed object and/or part of the printed object.

可以適用於積層製造系統100中的影像產生器170的聚焦成形算法的示例由Said Pertuz等人(“Analysis of Focus Measure Operators for Shape-from-Focus,” Pattern Recognition, vol. 45, issue 5, pp. 1415-1432)描述,其全部內容在此引入作為參考。所揭露的方法僅是示例,並非旨在進行限制。An example of a focus shaping algorithm that may be adapted for use in image generator 170 in additive manufacturing system 100 is described by Said Pertuz et al. ("Analysis of Focus Measure Operators for Shape-from-Focus," Pattern Recognition, vol. 45, issue 5, pp. 1415-1432), the entire contents of which are hereby incorporated by reference. The disclosed methods are examples only and are not intended to be limiting.

可以適用於積層製造系統100中的影像產生器170的光影重建算法的示例由Byungil Kim等人(“Depth and Shape from Shading using the Photometric Stereo method,” CVGIP: Image Understanding, vol. 54, no. 3, pp 416-427, 1991)描述,其全部內容在此引入作為參考。所揭露的方法僅是示例,並非旨在進行限制。An example of a light and shadow reconstruction algorithm that can be applied to the image generator 170 in the additive manufacturing system 100 is given by Byungil Kim et al. (“Depth and Shape from Shading using the Photometric Stereo method,” CVGIP: Image Understanding, vol. 54, no. 3 , pp 416-427, 1991), the entire contents of which are hereby incorporated by reference. The disclosed methods are examples only and are not intended to be limiting.

可適用於積層製造系統100中的影像產生器170的光學立體算法的示例由Jose R.A. Torreao(“Estimating 3-D Shape from the Optical Flow of Photometric Stereo Images,” Proceedings of the 6th Ibero-American Conference on AI: Progress in Artificial Intelligence (IBERAMIA 1998), Helder Coelho (Ed.), Springer-Verlag, London, UK, UK, 253-261)於“從光學立體影像的光流估計三維形狀”描述,其全部內容在此引入作為參考。所揭露的方法僅是示例,並非旨在進行限制。An example of an optical stereo algorithm applicable to image generator 170 in additive manufacturing system 100 is given by Jose R.A. Torreao (“Estimating 3-D Shape from the Optical Flow of Photometric Stereo Images,” Proceedings of the 6th Ibero-American Conference on AI : Progress in Artificial Intelligence (IBERAMIA 1998), Helder Coelho (Ed.), Springer-Verlag, London, UK, UK, 253-261) described in "Estimating 3D shape from optical flow in optical stereo images", the entirety of which can be found at This is incorporated by reference. The disclosed methods are examples only and are not intended to be limiting.

可以適用於積層製造系統100中的影像產生器170的傅立葉疊層衍射調變算法的示例由Guoan Zeng等人(“Wide-field High-resolution Fourier Ptychographic Microscopy,” Nature Photonics, vol. 7, pp. 739-745, 2013),其全部內容在此引入作為參考。所揭露的方法僅是示例,並非旨在進行限制。An example of a Fourier stack diffraction modulation algorithm that may be adapted for the image generator 170 in the additive manufacturing system 100 is given by Guoan Zeng et al. ("Wide-field High-resolution Fourier Ptychographic Microscopy," Nature Photonics, vol. 7, pp. 739-745, 2013), the entire contents of which are hereby incorporated by reference. The disclosed methods are examples only and are not intended to be limiting.

在一些實施例中,由影像產生器170產生的形貌影像及/或其他合適的影像可以提供諸如異常速率及分佈、異常類型、沿著列印路徑的各點處的沉積線材等資訊。例如,如第4圖所示,列印層的擷取影像400顯示沉積線材中的非預期間隙。在另一組示例中,如第5A圖、第5B圖及第5C圖中所示,各列印層的擷取影像在列印層中顯示出非預期的螺紋狀人造物及其他破裂。In some embodiments, topographical images and/or other suitable images generated by image generator 170 may provide information such as anomaly rates and distributions, anomaly types, deposited wires at various points along the print path, and the like. For example, as shown in FIG. 4, a captured image 400 of a printed layer shows an unexpected gap in the deposited wire. In another set of examples, as shown in Figures 5A, 5B, and 5C, captured images of printed layers showed unexpected thread-like artifacts and other breakages in the printed layer.

在一些實施例中,影像分析器180可以被配置為從影像產生器170接收產生的形貌影像及/或其他合適的影像,並且在視覺上認知及識別列印層上的一或多個異常。在一些實施例中,這可以藉由比較以下來識別差異而完成:如從二維或三維形貌影像獲得的列印層的實際特徵、偵測到的列印層的列印路徑圖、及/或層影像;以及如產生的數字碼及/或層的生產設計中所指定的列印層的特徵。在一些實施例中,可以使用一或多個人工智慧算法以基於差異識別異常。這些異常可以包括例如實際列印層及生產設計之間的差異,及/或列印層相關於:層的周邊尺寸;設定點之間沉積線材的尺寸;填充密度;填充圖案;表面粗糙度;列印路徑;及/或任何其他變化的產生數字碼。異常的識別可以包括對異常進行分類,以及識別其大小、形狀、X-Y-Z位置及/或任何其他合適的特徵。在一些實施例中,可以使用任何合適的人工智慧算法。例如,在一些實施例中,人工智慧算法可以單獨或組合的包括以下中的一或多個:機器學習;隱藏馬可夫模型;遞迴類神經網路;卷積類神經網路;貝氏符號法;通用對抗網路;支援向量機;及/或任何其他合適的人工智慧算法。In some embodiments, image analyzer 180 may be configured to receive generated topographical images and/or other suitable images from image generator 170 and to visually recognize and identify one or more anomalies on the printed layer . In some embodiments, this can be accomplished by comparing, for example, the actual characteristics of the printed layer obtained from the 2D or 3D topographical image, the printed path map of the detected printed layer, and and/or the layer image; and the characteristics of the printed layer as specified in the generated digital code and/or the layer's production design. In some embodiments, one or more artificial intelligence algorithms may be used to identify anomalies based on differences. These anomalies can include, for example, differences between the actual printed layer and the production design, and/or printed layers related to: perimeter dimensions of layers; dimensions of deposited wire between setpoints; fill density; fill pattern; surface roughness; print path; and/or any other variation of the resulting numeric code. Identification of the anomaly may include classifying the anomaly, as well as identifying its size, shape, X-Y-Z location, and/or any other suitable characteristics. In some embodiments, any suitable artificial intelligence algorithm may be used. For example, in some embodiments, the artificial intelligence algorithm may include one or more of the following alone or in combination: machine learning; hidden Markov model; recurrent neural network; convolutional neural network; Bayesian notation ; general adversarial networks; support vector machines; and/or any other suitable artificial intelligence algorithm.

在一些實施例中,不基於人工智慧的算法可用於識別異常。In some embodiments, algorithms that are not based on artificial intelligence may be used to identify anomalies.

在一些實施例中,影像分析器180可以被預程式化以識別列印層的接收影像中某些異常(例如,列印層中非預期的間隙或捲曲的邊緣、翹曲或不均勻的圖案、過度擠壓的點、螺紋狀或其他外來人造物及/或任何其他破裂)。基於預程式化的異常,影像分析器180可以處理完成的列印層的產生影像,以確定處理的影像是否包括與預程式化的異常類似的任何異常,並識別列印層上的任何這種異常的一或多個位置。In some embodiments, the image analyzer 180 may be preprogrammed to identify certain anomalies in the received image of the printed layer (e.g., unexpected gaps or curled edges, warping, or uneven patterns in the printed layer). , over-extruded points, corrugations or other foreign artefacts and/or any other ruptures). Based on the preprogrammed anomalies, the image analyzer 180 can process the resulting image of the completed printed layer to determine whether the processed image includes any anomalies similar to the preprogrammed anomalies, and to identify any such anomalies on the printed layer. One or more locations of the exception.

在一些實施例中,影像分析器180還可以被配置為確定並記錄偵測到的異常與一或多個列印參數之間的相關性。例如,藉由使用合適的人工智慧算法,影像分析器可以確定可能與偵測到的異常相關的一或多個列印參數。例如,影像分析器180可以發現以下示例相關性:當列印頭處於特定溫度而不是其他溫度時發生的中斷;某些列印速度而非其他列印速度會導致大量意外間隙;以及某些填充圖案、在物體的某些位置、會引起某種類型的異常。In some embodiments, image analyzer 180 may also be configured to determine and record a correlation between detected anomalies and one or more printing parameters. For example, by using suitable artificial intelligence algorithms, the image analyzer can determine one or more printing parameters that may be related to the detected anomaly. For example, the image analyzer 180 may find the following example dependencies: interruptions that occur when the print head is at certain temperatures but not others; certain print speeds but not others cause a large number of unexpected gaps; Patterns, at certain locations on objects, cause certain types of anomalies.

在一些實施例中,回應於偵測到被偵測異常與一或多個列印圖案之間的相關性,影像分析器180可以提供改變物體的一或多層、或是將來要列印的一或多個物體被列印的方式的資訊、資料及/或指令。例如,在一些實施例中,影像分析器可以將所發現的相關及/或用於適應地調整列印參數設定的指令傳送到數字控制碼產生器110、控制模組160及/或任何其他裝置。然後,針對目前正在列印的物體的任何後續層,數字控制碼產生器110及/或控制模組160可以使用該資訊來對數字控制碼中的列印參數作出調整。在一些實施例中,可以調整列印參數,使得下一層或任何未來層補償在先前層中發現的異常。例如,如果在列印層中偵測到非預期的間隙,則下一層的數字控制碼可以包括在沉積位於間隙上方的線材時填充間隙的指令。在另一示例中,當在物體的下部發現非預期間隙時,物體的上部中的對稱層的數字控制碼可包括補償間隙的指令。In some embodiments, in response to detecting a correlation between the detected anomaly and one or more printed patterns, the image analyzer 180 may provide for changing one or more layers of an object, or a pattern to be printed in the future. Information, data and/or instructions on the manner in which one or more objects are printed. For example, in some embodiments, the image analyzer may communicate the found correlations and/or instructions for adaptively adjusting printing parameter settings to the digital control code generator 110, the control module 160, and/or any other device . This information can then be used by the digital control code generator 110 and/or the control module 160 to make adjustments to the printing parameters in the digital control code for any subsequent layers of the object currently being printed. In some embodiments, printing parameters can be adjusted so that the next layer or any future layer compensates for anomalies found in previous layers. For example, if an unexpected gap is detected in a printed layer, the next layer's digital control code may include instructions to fill the gap when depositing wire over the gap. In another example, when an unexpected gap is found in the lower part of the object, the digital control code of the symmetric layer in the upper part of the object may include instructions to compensate for the gap.

在一些實施例中,影像分析器180可以被配置為測量完成的列印物體的機械、光學及/或電性質。In some embodiments, image analyzer 180 may be configured to measure mechanical, optical, and/or electrical properties of the completed printed object.

在一些實施例中,影像分析器180可以被配置為偵測一或多個列印參數與列印層及/或完成的列印物體中的少數異常之間的相關性。在進一步的實施例中,影像分析器180可以被配置為偵測一或多個列印參數與完成的列印物體所測得的機械、光學及/或電性質之間的相關性。響應於偵測到一或多個這樣的相關性,影像分析可以提供資訊、資料及/或指令,這些資訊、資料及/或指令改變了物體的一或多層或將來要列印的一或多個物體被列印的方式。在一些實施例中,影像分析器180可以將資訊、資料及/或指令提供給例如三維建模軟體,以改進生產設計。In some embodiments, image analyzer 180 may be configured to detect correlations between one or more printing parameters and minor anomalies in the printed layer and/or the finished printed object. In a further embodiment, the image analyzer 180 may be configured to detect a correlation between one or more printing parameters and measured mechanical, optical and/or electrical properties of the finished printed object. In response to detecting one or more such correlations, image analysis may provide information, data and/or instructions that alter one or more layers of an object or one or more layers to be printed in the future. The way an object is printed. In some embodiments, image analyzer 180 may provide information, data and/or instructions to, for example, 3D modeling software to improve production design.

在一些實施例中,影像分析器180可以使用用於列印層的產生的形貌影像及/或其他產生的影像、以及用於列印層的所產生數字控制碼,以學習不可控變量(即,沒有人為干預的不可控變量)及產生的列印頭運動之間的關係,以及學習沉積層中的異常(例如,列印層中的非預期的間隙或捲曲的邊緣、翹曲或不均勻的圖案、過度擠出的點,與數字控制碼中指定的列印路徑的偏差、非預期的螺紋狀或其他外來人造物及/或任何其他破裂)。響應於偵測到不可控變量與所得到的列印頭運動之間的相關性以及異常,影像分析器180可以提供改變物體的一或多層或將來要列印的一或多個物體被列印的方式的資訊、資料及/或指令。In some embodiments, image analyzer 180 may use generated topographical images and/or other generated images for printed layers, and generated numerical control codes for printed layers, to learn uncontrollable variables ( That is, the relationship between uncontrollable variables without human intervention) and the resulting print head motion, as well as learning anomalies in the deposited layer (e.g., unexpected gaps or curled edges in the printed layer, warping or not Uniform patterns, over-extruded dots, deviations from the print path specified in the NC code, unintended threading or other foreign artifacts and/or any other breakage). In response to detecting correlations and anomalies between uncontrollable variables and resulting print head motion, image analyzer 180 may provide changes to one or more layers of an object or one or more objects to be printed in the future to be printed. information, data and/or instructions in the form of

在一些實施例中,關於相關性的資訊可用於訓練如本文所述的一或多個AI機制。In some embodiments, information about correlations may be used to train one or more AI mechanisms as described herein.

在一些實施例中,在列印一層之後,影像分析器180可以被配置為將完成的列印層與一或多個先前層進行比較以偵測及記錄異常、比較及記錄異常率及模式、並提供指令至數字控制碼產生器110及/或控制模組160,以調整列印參數而使物體的整體設計最佳化(例如,獲得期望的機械、光學及/或電性質或實現非常類似於生產設計的列印設計)或最佳化列印工作的操作(例如,加速沉積速率、或最小化所需材料的量)。完成的層和先前的層之間用以識別異常的比較還可以用於更好地將因果關係分配給積層製造系統100的列印參數,並且對部分列印物體的下一層或任何後續層進行適當的調整,以及最佳化類似或不同物體的未來列印工作。In some embodiments, after printing a layer, the image analyzer 180 can be configured to compare the completed printed layer with one or more previous layers to detect and record anomalies, compare and record anomaly rates and patterns, And provide instructions to the digital control code generator 110 and/or the control module 160 to adjust the printing parameters to optimize the overall design of the object (for example, to obtain desired mechanical, optical and/or electrical properties or to achieve very similar print design for production design) or operations to optimize the print job (for example, to speed up the deposition rate, or minimize the amount of material required). Comparisons between completed layers and previous layers to identify anomalies can also be used to better assign causal relationships to the printing parameters of the additive manufacturing system 100, and to perform the next or any subsequent layers of a partially printed object. Appropriate adjustments and optimization for future print jobs of similar or different objects.

在一些實施例中,影像分析器180可以被配置為分析部分列印物體的目前及/或先前層的總異常率,並且基於來自類似列印工作的AIFC,向數字控制碼產生器110及/或控制模組160提供指令,以調整部分列印物體的下一層及/或任何未來層的列印參數,以獲得期望的機械、光學及/或電性質。In some embodiments, image analyzer 180 may be configured to analyze the total anomaly rate of the current and/or previous layers of a partially printed object and, based on the AIFC from a similar print job, provide information to digital control code generator 110 and/or Or the control module 160 provides instructions to adjust the printing parameters of the next layer and/or any future layers of the partially printed object to obtain desired mechanical, optical and/or electrical properties.

在一些實施例中,在列印一層之後,可以使用不基於人工智慧的算法來識別與正在使用的特定積層製造印表機的特定校準相關的異常。可以對後續層及未來列印工作的數字控制碼進行適當調整,以說明特定積層製造印表機的校準。In some embodiments, after printing a layer, non-artificial intelligence based algorithms may be used to identify anomalies related to the specific calibration of the specific additive manufacturing printer being used. Appropriate adjustments can be made to the digital control codes for subsequent layers and future print jobs to account for the calibration of a particular additive manufacturing printer.

在一些實施例中,如果列印層或多個層中的異常超過某些預定容許量,則可以在完成之前停止列印物體的列印工作。為失敗的列印工作收集的資料可以向數字控制碼產生器110、控制模組160及/或收集與由積層製造印表機115執行的列印處理有關的訓練資料的任何電腦系統提供資訊、資料及/或指令。In some embodiments, if anomalies in the print layer or layers exceed some predetermined tolerance, the print job of the printed object may be stopped before completion. The data collected for failed print jobs may provide information to digital control code generator 110, control module 160, and/or any computer system that collects training data related to the printing process performed by additive manufacturing printer 115, Information and/or Instructions.

在一些實施例中,影像分析器180還可以被配置為傳送列印物體的異常資料(例如,異常的分佈、模式及速率),以及對三維建模軟體的自動推薦的列印調整,以消除或修改與異常相對應的設計中的結構。In some embodiments, image analyzer 180 may also be configured to communicate anomaly data of printed objects (e.g., distribution, pattern, and velocity of anomalies), as well as automatically recommended printing adjustments to 3D modeling software to eliminate Or modify the structure in the design corresponding to the exception.

進一步參考第1圖至第3圖,第6圖顯示了根據所揭露主題的一些實施例的高階、使用AIFC的積層製造列印操作的示例。在一些實施例中,積層製造流程600可以使用積層製造系統100。With further reference to Figures 1-3, Figure 6 shows an example of a high-level, additive manufacturing printing operation using an AIFC, according to some embodiments of the disclosed subject matter. In some embodiments, the additive manufacturing process 600 may use the additive manufacturing system 100 .

在610,向數字控制碼產生器110提供指定列印物體看起來應該是什麼樣的生產設計、以及列印物體的期望的機械、光學及/或電性質。在一些實施例中,由操作者輸入一些初始列印參數。在一些實施例中,生產設計被提供給數字控制碼產生器110以及使用AIFC的影像分析器180,確定生產設計的期望的機械、光學及/或電性質。At 610 , the digital control code generator 110 is provided with a production design specifying what the printed object should look like, as well as desired mechanical, optical, and/or electrical properties of the printed object. In some embodiments, some initial printing parameters are input by the operator. In some embodiments, the production design is provided to the digital control code generator 110 and the image analyzer 180 using AIFC to determine the desired mechanical, optical and/or electrical properties of the production design.

在一些實施例中,操作者可以輸入用於影像分析器180的一組規則,以在積層製造列印過程中解決衝突的目標。例如,使用者可以指定實現列印物體的最佳機械性質應該優先於:列印速度;生產設計的完整性;以及減少使用的線材量。操作者還可以指定對於列印物體最重要的機械、光學及/或電性質,使得影像分析器180可以提供用於調整使那些機械、光學及/或電性質最佳化的列印參數的指令。In some embodiments, an operator may input a set of rules for the image analyzer 180 to resolve conflicting goals during the additive manufacturing printing process. For example, users can specify that achieving the best mechanical properties for printed objects should take precedence over: printing speed; integrity of design for production; and reducing the amount of filament used. The operator can also specify the most important mechanical, optical, and/or electrical properties of the printed object so that the image analyzer 180 can provide instructions for adjusting printing parameters that optimize those mechanical, optical, and/or electrical properties .

在620處,數字控制碼產生器110可以基於以下中的一個或多個產生用於列印物體層的數字控制碼:由操作者輸入的輸入參數、積層製造印表機115的列印特徵;生產設計的規格(包括機械、光學及/或電性質);來自部分列印物體的一或多個先前列印層的AIFC及/或來自其他列印物體的AIFC。產生的數字控制碼可以包括供列印頭140及/或底板150要行經的一組設定點(例如,多個X-Y-Z坐標)。第7A圖顯示了可能包括在數字控制碼中的列印層的一組設定點的示例模擬。產生的數字控制碼還可以包括定義列印頭及/或底板應如何行經各個設定點的指令。例如,在第7B圖中顯示了基於所包括的指令,行進的列印路徑可能看起來如何的示例模擬。At 620, the numerical control code generator 110 may generate a numerical control code for printing the object layer based on one or more of: input parameters entered by the operator, printing characteristics of the additive manufacturing printer 115; Specifications of the production design (including mechanical, optical and/or electrical properties); AIFC from one or more previously printed layers of a partially printed object and/or AIFC from other printed objects. The generated digital control code may include a set of set points (eg, a plurality of X-Y-Z coordinates) for print head 140 and/or chassis 150 to travel through. Figure 7A shows an example simulation of a set of set points for a print layer that might be included in a digital control code. The generated digital control code may also include instructions defining how the print head and/or the plate should travel past various setpoints. For example, an example simulation of how the print path traveled might look based on the instructions included is shown in Figure 7B.

在一些實施例中,所產生的數字控制碼還可以指定某些列印參數,包括但不限於設定點之間列印頭140及/或底板150的速度、在設定點之間列印頭140的噴嘴及/或底板150的溫度、在設定點之間沉積的線材量、設定點之間的填充密度及設定點之間的填充圖案。In some embodiments, the generated digital control code may also specify certain printing parameters, including but not limited to, the speed of the print head 140 and/or the chassis 150 between set points, the speed of the print head 140 between set points, The temperature of the nozzle and/or the base plate 150, the amount of wire deposited between the set points, the fill density between the set points, and the fill pattern between the set points.

在630處,列印頭140可以根據由數字控制碼產生器110及/或控制模組160提供的指令來沉積用於生產設計的層的線材。At 630 , the printhead 140 may deposit wires for producing the designed layers according to the instructions provided by the digital control code generator 110 and/or the control module 160 .

在640處,光源130可以基於指定的形貌成像技術及/或(如上所述的)其他成像技術照射列印層。At 640, the light source 130 may illuminate the print layer based on the specified topographical imaging technique and/or (as described above) other imaging techniques.

在650處,影像感測器120可以擷取被照射的列印層的影像。At 650, the image sensor 120 may capture an image of the illuminated print layer.

在660處,影像產生器170可以基於由影像感測器120擷取的影像產生列印層的一或多個形貌影像及/或任何其他合適的影像。在一些實施例中,列印層的產生影像可包括一系列平鋪或聯結在一起的擷取影像。At 660 , image generator 170 may generate one or more topographical images of the print layer and/or any other suitable images based on the images captured by image sensor 120 . In some embodiments, the generated image of the printed layer may include a series of captured images tiled or concatenated together.

在進一步的實施例中,可以從由影像產生器170產生的一或多個形貌影像及/或其他合適的影像確定列印層的實際列印路徑。In a further embodiment, the actual print path of the print layer may be determined from one or more topographical images generated by image generator 170 and/or other suitable images.

在670處,影像分析器180可以使用列印層的所產生的形貌影像及/或其他產生的影像,以及列印層的所產生的數字控制碼,以確定及記錄擠壓層中的異常(例如,非預期的間隙或捲曲邊緣、翹曲或不均勻的圖案、過度擠壓的點,與數字控制碼中指定的列印路徑的偏差、非預期的螺紋狀或其他外來人造物及/或列印層中的任何其他破裂)。At 670, the image analyzer 180 may use the generated topographical image and/or other generated images of the printed layer, and the generated digital control code of the printed layer to determine and record anomalies in the extruded layer (e.g., unintended gaps or curled edges, warped or uneven patterns, over-extruded dots, deviations from the print path specified in the NC code, unintended corkscrews or other extraneous artifacts and/or or any other break in the print layer).

在一些實施例中,影像分析器180可以從包含在產生的數字控制碼中的設定點及指令中擷取及繪製列印層的列印路徑。影像分析器可以將繪製的列印路徑轉換為像素,並且將像素覆蓋在從列印層的產生影像獲得的列印路徑上,並確定像素與列印路徑之間的差異。在一些實施例中,影像分析器180可以將從列印層的產生影像獲得的列印路徑轉換為坐標系統中的列印點,並將這些列印點與沿著從產生的數字控制碼擷取的繪製路徑的列印點進行比較。In some embodiments, the image analyzer 180 may extract and map the print path of the print layer from the setpoints and instructions included in the generated digital control code. The image analyzer may convert the drawn print path to pixels and overlay the pixels on the print path obtained from the generated image of the print layer and determine differences between the pixels and the print path. In some embodiments, the image analyzer 180 may convert the print path obtained from the generated image of the print layer into print points in a coordinate system, and compare these print points along the lines extracted from the generated digital control code. Take the printed points of the drawn path for comparison.

如果從產生的影像獲得的列印層的列印路徑與從產生的數字控制碼中擷取的列印路徑相同,則它們之間的差異將為零或接近零。大於零的數字描述了在實際列印路徑及產生的數字控制碼中指定的列印路徑之間偵測到的錯誤量。列印路徑的比較還可以指出沿列印路徑發生錯誤的位置。If the print path of the print layer obtained from the generated image is the same as the print path extracted from the generated NC code, the difference between them will be zero or close to zero. A number greater than zero describes the amount of errors detected between the actual print path and the print path specified in the generated NCC. The comparison of print paths can also point out where errors occur along the print path.

在680處,影像分析器180可以分析影像分析器從列印層及/或先前層偵測到的異常的數量及異常的類型(包括實際路徑與在所產生的數字控制碼中的列印路徑之間的偏差)。基於來自其他列印工作的AIFC,影像分析器180可以確定是否應該對部分列印物體的下一層或後續層的列印參數進行任何調整,以實現關於偵測到的異常的所期望的機械、光學及/或電性質。例如,如果基於偵測到的異常,針對部分列印物體的目前及/或先前層,影像分析器180確定完成列印物體的機械性質將弱於期望的,則影像分析器180可以指示數字控制碼產生器110及/或控制模組160調整下一層或任何後續層上的某些列印參數(例如,增加填充密度及/或改變填充圖案),以便可以實現所期望的機械性質。At 680, the image analyzer 180 can analyze the number and type of anomalies detected by the image analyzer from the print layer and/or the previous layer (both the actual path and the print path in the generated digital control code deviation between). Based on the AIFC from other print jobs, the image analyzer 180 can determine whether any adjustments should be made to the printing parameters of the next or subsequent layer of the partially printed object to achieve the desired mechanical, optical and/or electrical properties. For example, if image analyzer 180 determines that the mechanical properties of the completed printed object will be weaker than expected for the current and/or previous layers of the partially printed object based on detected anomalies, image analyzer 180 may instruct digital control Code generator 110 and/or control module 160 adjust certain printing parameters (eg, increasing fill density and/or changing fill pattern) on the next or any subsequent layer so that desired mechanical properties can be achieved.

在一些實施例中,對於為列印物體沉積的每一層或任何數量的層重複操作610-680。影像分析器180可以使用在每一層獲得的資料以及來自其他列印工作的AIFC來修改下一層及/或後續層的列印參數,以實現列印物體的期望的機械、光學及/或電性質及/或期望的設計。在進一步的實施例中,可以測量完成的列印物體的機械、光學及/或電性質。In some embodiments, operations 610-680 are repeated for each layer or any number of layers deposited for the printed object. The image analyzer 180 can use the data obtained at each layer and the AIFC from other print jobs to modify the printing parameters of the next and/or subsequent layers to achieve desired mechanical, optical, and/or electrical properties of the printed object and/or desired design. In a further embodiment, mechanical, optical and/or electrical properties of the finished printed object may be measured.

執行流程600的特定部分的時間的劃分可以變化,而且沒有劃分或不同的劃分也在本文揭露主題的範圍內。注意,在一些實施例中,可以在任何合適的時間執行流程600的方塊。應當理解,在一些實施例中,本文描述的流程600的至少一些部分可以以任何次序或順序執行,不限於在第6圖中顯示及描述的次序及順序。此外,在一些實施例中,在適當時或並行地,可以基本上同時執行本文描述的流程600的一些部分。附加地或替代地,在一些實施例中可以省略流程600的一些部分。The division of time for performing particular portions of process 600 may vary, and no division or different divisions are within the scope of the subject matter disclosed herein. Note that in some embodiments, the blocks of process 600 may be performed at any suitable time. It should be understood that in some embodiments, at least some portions of the process 600 described herein may be performed in any order or sequence, not limited to the order and sequence shown and described in FIG. 6 . Furthermore, in some embodiments, some portions of process 600 described herein may be performed substantially simultaneously, as appropriate or in parallel. Additionally or alternatively, some portions of process 600 may be omitted in some embodiments.

流程600可以任何合適的硬體及/或軟體實現。例如,在一些實施例中,流程600可以在影像分析器180或數字控制碼產生器110中實現。The process 600 can be implemented by any suitable hardware and/or software. For example, in some embodiments, the process 600 may be implemented in the image analyzer 180 or the digital control code generator 110 .

在一些實施例中,對於相似或不同的物體,影像分析器180可以學習列印物體的每一層的異常圖案,以使得影像分析器180能夠在(例如,如結合第6圖所描述的)列印流程期間在層等級自適應地調整列印參數,以實現期望的機械、光學及/或電性質。In some embodiments, for similar or dissimilar objects, image analyzer 180 may learn anomalous patterns for each layer of the printed object, such that image analyzer 180 can identify (eg, as described in connection with FIG. Printing parameters are adaptively adjusted at the layer level during the printing process to achieve desired mechanical, optical and/or electrical properties.

某些列印參數影響列印物體的機械、光學及/或電性質。例如,填充密度及填充圖案可以影響機械性質,如最大抗拉強度(Rm )、屈服強度(Rp2% )、斷裂伸長度(A% )、楊氏模數(E)、疲勞(σd )、柏松比(Poisson's ratio)、質量及比重。Certain printing parameters affect the mechanical, optical and/or electrical properties of the printed object. For example, packing density and packing pattern can affect mechanical properties such as maximum tensile strength (R m ), yield strength (Rp 2% ), elongation at break (A % ), Young's modulus (E), fatigue (σ d ), Poisson's ratio, mass and specific gravity.

為了理解異常圖案及某些列印參數如何實際影響列印物體的機械、光學及/或電性質,可以多次列印物體,同時改變對列印物體的機械、光學及/或電性質有影響的列印參數。每個列印物體的異常圖案可以在例如結合第6圖所述的層等級(例如,在670處)確定及記錄。另外,可以測量及記錄每個列印物體的機械、光學及/或電性質。In order to understand how anomalous patterns and certain printing parameters actually affect the mechanical, optical and/or electrical properties of the printed object, it is possible to print the object multiple times while changing the mechanical, optical and/or electrical properties of the printed object print parameters for . Anomalous patterns for each printed object may be determined and recorded at the layer level (eg, at 670 ), such as described in connection with FIG. 6 . Additionally, mechanical, optical and/or electrical properties of each printed object can be measured and recorded.

第8圖顯示了根據一些實施例的用於基於不同的填充密度及填充圖案來學習異常圖案及異常率以及這些異常圖案及異常率如何影響列印物體的機械性質的訓練流程的示例800。FIG. 8 shows an example 800 of a training process for learning outlier patterns and outlier rates based on different infill densities and infill patterns, and how those anomaly patterns and outlier rates affect the mechanical properties of printed objects, according to some embodiments.

在810處,可以識別影響物體的機械性質的一或多個列印參數。例如,當填充密度及填充圖案影響物體的機械性質時可以被識別。在一些實施例中,人工智慧算法可用於識別影響物體的機械性質的其他列印參數。At 810, one or more printing parameters that affect mechanical properties of the object can be identified. For example, it can be recognized when the infill density and infill pattern affect the mechanical properties of the object. In some embodiments, artificial intelligence algorithms can be used to identify other printing parameters that affect the mechanical properties of the object.

在820處,可以列印預定數量(“一組”)的目標物體,並且已經識別出影響目標物體的機械性質的一或多個列印參數可以對於整個組保持相同。例如,可以列印組中的每個物體,指定相同的填充圖案及填充密度列印參數。At 820, a predetermined number ("group") of target objects may be printed, and one or more printing parameters that have been identified to affect mechanical properties of the target objects may remain the same for the entire group. For example, you can print each object in a group, specifying the same hatch pattern and fill density print parameters.

在830處,如結合第6圖的670所描述的,可以針對組中的每個列印物體在層等級偵測並記錄異常。例如,可以為每個層確定實際列印路徑與從產生的控制碼中擷取的列印路徑之間的差異。在列印組中的每個目標物體之後,可以測量及記錄該目標物體的機械性質。At 830, as described in connection with 670 of FIG. 6, anomalies may be detected and logged at the layer level for each printed object in the group. For example, the difference between the actual print path and the print path extracted from the generated control code can be determined for each layer. After printing each target object in the set, the mechanical properties of the target object can be measured and recorded.

在830之後,流程800可以循環回到820,並且可以不同的填充密度及/或填充圖案列印另一預定數量的目標物體。After 830, process 800 may loop back to 820 and another predetermined number of target objects may be printed with a different fill density and/or fill pattern.

可以根據需要多次重複820和830,以訓練影像分析器180學習異常圖案及不同的識別的列印參數(例如,填充密度及填充圖案)如何影響物體的機械性質。每次列印預定數量的目標物體(“一組”)時,可以改變所識別的參數(例如,填充密度及/或填充圖案)。下表反映了目標物體的示例組及其指定的填充密度及填充圖案列印參數:

Figure 108110747-A0304-0001
820 and 830 may be repeated as many times as necessary to train image analyzer 180 to learn how anomalous patterns and different identified printing parameters (eg, infill density and infill pattern) affect the mechanical properties of the object. The identified parameters (eg, infill density and/or infill pattern) may be changed each time a predetermined number of target objects ("set") are printed. The table below reflects an example set of target objects and their specified infill density and infill pattern print parameters:
Figure 108110747-A0304-0001

在一些實施例中,對於列印物體的每一層保持恆定的填充密度及填充圖案列印參數。在其他實施例中,針對物體的不同層而變化填充密度及/或填充圖案,這取決於層的位置或隨機。In some embodiments, the fill density and fill pattern printing parameters are maintained constant for each layer of the printed object. In other embodiments, the fill density and/or fill pattern is varied for different layers of the object, depending on the position of the layer or randomly.

一旦影像分析器180已經了解了不同的異常率及圖案以及所識別的列印參數(例如,不同的填充密度及填充圖案)如何影響物體的機械性質,在列印工作期間(例如,在層等級)影像分析器可以自適應地調整所識別的列印參數的值,以達到所期望的機械性質。例如,影像分析器180可以偵測到部分列印物體的列印層具有某種異常率及圖案,如果未調整填充密度及填充圖案,則該圖案一旦完成就可能導致列印物體的低於平均的機械性質。然後,影像分析器180可以調整下一層及/或任何後續層的填充率及填充圖案列印參數,以實現期望的機械性質,同時還試圖減少異常的發生。Once the image analyzer 180 has learned how different outlier rates and patterns and identified print parameters (e.g., different infill densities and infill patterns) affect the mechanical properties of the object, during a print job (e.g., at the layer level ) image analyzer can adaptively adjust the values of the identified printing parameters to achieve the desired mechanical properties. For example, the image analyzer 180 may detect that the printed layer of a partially printed object has certain anomalies and patterns that, if the fill density and fill pattern are not adjusted, may result in a lower-than-average printed object once completed. mechanical properties. The image analyzer 180 can then adjust the fill rate and fill pattern printing parameters of the next layer and/or any subsequent layers to achieve the desired mechanical properties while also attempting to reduce the occurrence of anomalies.

可以執行類似的流程以學習異常圖案如何影響物體的光學及/或電性質。例如,可以識別影響物體的光學及/或電性質的列印參數。如上所述控制多組目標物體的識別的列印參數,可以列印多組目標物體。一旦影像分析器180已經學習到不同的異常率及圖案以及所識別的列印參數如何影響物體的電及/或光學性質,影像分析器可以在列印工作期間,在層等級自適應地調整所識別的列印參數的值,以實現期望的電及/或光學性質。Similar procedures can be performed to learn how anomalous patterns affect the optical and/or electrical properties of an object. For example, printing parameters that affect the optical and/or electrical properties of the object can be identified. Multiple sets of target objects can be printed by controlling the printing parameters for identifying multiple sets of target objects as described above. Once the image analyzer 180 has learned how the different anomaly rates and patterns and the identified printing parameters affect the electrical and/or optical properties of the object, the image analyzer can adaptively adjust all the anomalies at the layer level during the printing job. Values of the identified printing parameters to achieve desired electrical and/or optical properties.

可以執行類似的流程以用於學習不可控變量(即,無人為干預的不可控變量)如何影響物體的機械、光學及/或電性質。例如,可以識別影響物體的機械、光學及/或電性質的不可控變量。如上所述控制多組目標物體的所識別的不可控變量,可以列印多組目標物體。一旦影像分析器180已經學習到不同的異常率及圖案以及所識別的列印不可控變量如何影響物體的機械、電及/或光學性質,影像分析器可以在列印工作期間,在層等級自適應地調整列印參數的值,以補償不可控的變量並實現所期望的電及/或光學性質。Similar procedures can be performed for learning how uncontrollable variables (ie, uncontrollable variables without human intervention) affect mechanical, optical and/or electrical properties of objects. For example, uncontrollable variables affecting mechanical, optical and/or electrical properties of an object may be identified. By controlling the identified uncontrollable variables of multiple sets of target objects as described above, multiple sets of target objects can be printed. Once the image analyzer 180 has learned how the different anomaly rates and patterns and identified printing uncontrollable variables affect the mechanical, electrical, and/or optical properties of the object, the image analyzer can automatically, at the layer level, during a printing job. The values of printing parameters are adaptively adjusted to compensate for uncontrollable variables and achieve desired electrical and/or optical properties.

執行流程800的特定部分的時間的劃分可以變化,而且沒有劃分或不同的劃分也在本文揭露主題的範圍內。注意,在一些實施例中,可以在任何合適的時間執行流程800的方塊。應當理解,在一些實施例中,本文描述的流程800的至少一些部分可以以任何次序或順序執行,不限於在第8圖中顯示及描述的次序及順序。此外,在一些實施例中,在適當時或並行地,可以基本上同時執行本文描述的流程800的一些部分。附加地或替代地,在一些實施例中可以省略流程800的一些部分。The division of time for performing particular portions of process 800 may vary, and no division or different divisions are within the scope of the subject matter disclosed herein. Note that in some embodiments, the blocks of process 800 may be performed at any suitable time. It should be understood that in some embodiments, at least some portions of the process 800 described herein may be performed in any order or sequence, not limited to the order and sequence shown and described in FIG. 8 . Furthermore, in some embodiments, some portions of process 800 described herein may be performed substantially simultaneously, as appropriate or in parallel. Additionally or alternatively, some portions of process 800 may be omitted in some embodiments.

流程800可以任何合適的硬體及/或軟體實現。例如,在一些實施例中,流程800可以在影像分析器180或數字控制碼產生器110中實現。The process 800 can be implemented by any suitable hardware and/or software. For example, in some embodiments, the process 800 may be implemented in the image analyzer 180 or the digital control code generator 110 .

在一些實施例中,影像分析器180可以使用列印層的產生的形貌影像及/或其他產生的影像(如第6圖660中所述)、以及列印層的產生的數字控制碼,以學習列印參數與產生的列印頭運動之間的關係、以及學習擠出層中的異常(例如,列印層中的非預期的間隙或捲曲邊緣、翹曲或不均勻的圖案、過度擠出的點、捲曲的邊緣、與數字控制碼中指定的列印路徑的偏差、非預期的螺紋狀或其他外來人造物及/或任何其他破裂)。影像分析器180還可以反轉習得的關係以計算最佳數字控制碼輸入參數,該參數將導致期望的列印頭運動並最小化擠出層中的異常。更具體地,人工智慧算法的輸入變量可以包括:列印頭的先前測量位置(以

Figure 02_image001
i -1 表示);造成列印頭的先前位置的控制碼列印參數(以θi -1 表示);以及列印頭的目前測量位置(以
Figure 02_image001
i 表示)。輸出變量可以是造成列印頭目前位置的數字控制碼參數(以θ 表示)。輸入變量及輸出變量可以一起作為人工智慧算法的單一訓練樣本。單一列印層可以產生數百個這樣的訓練樣本。這些訓練樣本,以及先前層中的異常知識、生產設計的期望規格、積層製造印表機的列印特徵及/或環境條件可用於計算最佳列印參數以產生期望的列印頭運動。在一些實施例中,訓練樣本、以及先前層中的異常知識、生產設計的期望規格、積層製造印表機的特徵及/或環境條件可用於計算最佳列印參數、以及在後續層中用於列印路徑的X-Y-Z設定點的最佳位置及指令。In some embodiments, image analyzer 180 may use generated topographical images of printed layers and/or other generated images (as described in Figure 6 660), and generated digital control codes of printed layers, to study the relationship between printing parameters and the resulting print head motion, and to study anomalies in extruded layers (e.g., unexpected gaps or curled edges in the printed layer, warped or uneven patterns, excessive extruded dots, curled edges, deviations from the print path specified in the NC code, unintended threading or other foreign artifacts, and/or any other breakage). Image analyzer 180 can also invert the learned relationship to calculate optimal digital control code input parameters that will result in desired print head motion and minimize anomalies in the extruded layer. More specifically, the input variables for the AI algorithm may include: the previously measured position of the print head (in
Figure 02_image001
i -1 ); the control code printing parameters that caused the previous position of the print head (denoted by θ i -1 ); and the current measured position of the print head (denoted by
Figure 02_image001
i means). The output variable may be a numerical control code parameter (denoted by θ ) that results in the current position of the print head. The input variables and the output variables can be used together as a single training sample for the artificial intelligence algorithm. A single print layer can generate hundreds of such training samples. These training samples, along with knowledge of anomalies in previous layers, desired specifications of production designs, printing characteristics of additive manufacturing printers, and/or environmental conditions can be used to calculate optimal printing parameters to produce desired print head motions. In some embodiments, training samples, as well as knowledge of anomalies in previous layers, desired specifications for production designs, additive manufacturing printer characteristics, and/or environmental conditions, can be used to calculate optimal printing parameters and use them in subsequent layers. Optimal location and command of the XYZ setpoints on the print path.

在一些實施例中,還可以應用影像分析器180來學習列印參數與層的整體特徵之間的關係。例如,可應用影像分析器180來學習擠出層中的異常總數、列印頭及/或底板的運動與產生的數字控制碼中的列印路徑指令的接近程度、以及指定的填充密度。在一些實施例中,影像分析器180可以反轉習得的關係來計算列印參數,該列印參數將導致最接近生產設計的規格的一層,包括期望的機械、光學及/或電性質。In some embodiments, the image analyzer 180 can also be used to learn the relationship between printing parameters and the overall characteristics of the layer. For example, image analyzer 180 may be employed to learn the total number of anomalies in extruded layers, the proximity of print head and/or platen motion to the print path instructions in the generated digital control code, and specified fill densities. In some embodiments, image analyzer 180 may invert the learned relationship to calculate printing parameters that will result in a layer that most closely matches the specifications of the production design, including desired mechanical, optical, and/or electrical properties.

在一些實施例中,影圖像分析器180可以使用列印層產生的形貌影像及/或其他產生的影像、以及列印層的產生的數字控制碼,以學習不可控變量(即,沒有人為干預的不可控的變量)及產生的列印頭運動之間的關係,以及學習沉積層中的異常(例如,列印層中的非預期的間隙或捲曲的邊緣、翹曲或不均勻的圖案、過度擠出的點、與數字控制碼中指定的列印路徑的偏差、非預期的螺紋狀或其他外來人造物及/或任何其他破裂)。如果影像分析器180發現不可控變量對產生的列印頭運動及/或沉積層中的異常產生不利影響(超出閾值容差),則影像分析器180可以向控制模組160發送警報。一旦接收到警報,控制模組160可以在積層製造系統100的顯示器上顯示警告及/或經由電子郵件、文本或任何其他合適的電子機制警告操作者。在一些實施例中,影像分析器180可以被配置為經由電子郵件、文本或任何其他合適的電子機制直接警告操作者。例如,在一些實施例中,如果影像分析器180確定環境濕度、溫度及/或光負面地影響所得到的列印頭運動或者層中的異常數量超出預定容差,則影像分析器180可以向控制模組160及/或操作者發送警告。在一些實施例中,如果影像分析器180確定積層製造印表機115的磨損及/或列印頭140可用的總線材量(例如,少量線材)對產生的列印頭運動產生負面影響或者層中的異常數量超出預定容差,則影像分析器180可以向控制模組160及/或操作者發送警報,以替換積層製造印表機及/或重新填充線材。在一些實施例中,如果影像分析器180確定電壓變化負面地影響所得到的列印頭運動或者層中的異常數量超過預定容差,則影像分析器180可以向控制模組160及/或操作者發送警報以檢查電壓源。In some embodiments, image analyzer 180 may use topographical images and/or other generated images of printed layers, as well as digital control codes generated by printed layers, to learn uncontrollable variables (i.e., no uncontrollable variables of human intervention) and the resulting print head motion, and learning anomalies in the deposited layer (e.g., unexpected gaps or curled edges in the printed layer, warped or uneven patterns, over-extruded points, deviations from the print path specified in the NC code, unintended threading or other foreign artifacts, and/or any other breakage). If the image analyzer 180 finds that uncontrollable variables adversely affect the resulting print head motion and/or anomalies in the deposited layer (beyond a threshold tolerance), the image analyzer 180 may send an alert to the control module 160 . Once an alert is received, the control module 160 may display an alert on a display of the additive manufacturing system 100 and/or alert an operator via email, text, or any other suitable electronic mechanism. In some embodiments, imagery analyzer 180 may be configured to alert the operator directly via email, text, or any other suitable electronic mechanism. For example, in some embodiments, if image analyzer 180 determines that ambient humidity, temperature, and/or light are negatively affecting the resulting print head motion or that the number of anomalies in a layer exceeds a predetermined tolerance, image analyzer 180 may send a message to The control module 160 and/or the operator sends an alert. In some embodiments, if image analyzer 180 determines that wear of additive manufacturing printer 115 and/or the amount of bus material (eg, a small amount of wire) available to print head 140 negatively affects the resulting print head movement or layer The image analyzer 180 may send an alert to the control module 160 and/or an operator to replace the AM printer and/or refill the wire if the number of anomalies in the image exceeds a predetermined tolerance. In some embodiments, if image analyzer 180 determines that voltage variations are negatively affecting the resulting print head motion or that the number of anomalies in a layer exceeds a predetermined tolerance, image analyzer 180 may report to control module 160 and/or operate or send an alert to check the voltage source.

在一些實施例中,任何合適的電腦可讀媒體可用於儲存用於執行本文描述的功能及/或流程的指令。例如,在一些實施例中,電腦可讀媒體可以是暫態的或非暫態的。例如,非暫態電腦可讀媒體可以包括諸如非暫態磁性媒體(諸如硬碟、軟磁碟等)、非暫態光學媒體(諸如光碟、數位影音光碟、藍光光碟等)、非暫態半導體媒體(如快閃記憶體、電性可程式化唯讀記憶體(EPROM)、電性可抹除可程式化唯讀記憶體(EEPROM)等)、在傳輸過程中不會短暫或缺乏任何持久性的表象的任何合適的媒體、及/或任何合適的有形媒體。作為另一個例子,暫態電腦可讀媒體可以包括網路上、導線、導體、光纖、電路、以及在傳輸過程中短暫或缺乏任何持久性的表象的任何合適的媒體中的信號、及/或任何合適的無形媒體中的信號。In some embodiments, any suitable computer-readable medium may be used to store instructions for performing the functions and/or processes described herein. For example, in some embodiments computer readable media may be transitory or non-transitory. For example, non-transitory computer-readable media may include media such as non-transitory magnetic media (such as hard disks, floppy disks, etc.), non-transitory optical media (such as compact discs, DVDs, Blu-ray discs, etc.), non-transitory semiconductor media (such as flash memory, electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), etc.), will not be short or lack any persistence during transmission any suitable medium of representation, and/or any suitable tangible medium. As another example, transitory computer-readable media may include signals on a network, wires, conductors, optical fibers, circuits, and any suitable medium that is transitory or lacks any appearance of permanence during transmission, and/or any Signals in suitable intangible media.

本文描述的示例(以及表述為“諸如”、“例如”、“包括”等的子句)的提供不應被解釋為將所請求的主題限制於特定示例;相反地,這些例子僅用於說明許多可能方面中的一些。還應注意,如本文所使用的,術語機制可以包含硬體、軟體、韌體或其任何合適的組合。The provision of examples described herein (and clauses expressing "such as", "for example", "including", etc.) should not be construed as limiting the claimed subject matter to the particular examples; rather, these examples are for illustration only Some of the many possible aspects. It should also be noted that, as used herein, the term mechanism can encompass hardware, software, firmware, or any suitable combination thereof.

已經具體參考這些示出的實施例詳細描述了積層製造系統及方法。然而,很明顯的是,可以在如前述說明書中描述的本揭露內容的精神及範圍內進行各種修改及改變,並且這些修改及改變被認為是本揭露內容的等同物及本揭露內容的一部分。本發明的範圍僅受以下申請專利範圍的限制。The additive manufacturing system and method have been described in detail with specific reference to these illustrated embodiments. However, it is obvious that various modifications and changes can be made within the spirit and scope of the present disclosure as described in the foregoing specification, and these modifications and changes are considered to be equivalents of the present disclosure and a part of the present disclosure. The scope of the present invention is limited only by the claims of the following claims.

110‧‧‧數字控制碼產生器 120‧‧‧影像感測器 130‧‧‧光源 140‧‧‧列印頭 145‧‧‧線材供應系統 150‧‧‧底板 160‧‧‧控制模組 170‧‧‧影像產生器 180‧‧‧影像分析器 210‧‧‧發光二極體(LED)環 230‧‧‧LED支架 300‧‧‧介面 400‧‧‧擷取影像 600、800‧‧‧流程 610、620、630、640、650、660、670、680、810、820、830‧‧‧步驟110‧‧‧Digital control code generator 120‧‧‧image sensor 130‧‧‧Light source 140‧‧‧print head 145‧‧‧Wire supply system 150‧‧‧bottom plate 160‧‧‧control module 170‧‧‧Image generator 180‧‧‧Image Analyzer 210‧‧‧Light-emitting diode (LED) ring 230‧‧‧LED bracket 300‧‧‧interface 400‧‧‧capturing images 600, 800‧‧‧Process Steps 610, 620, 630, 640, 650, 660, 670, 680, 810, 820, 830‧‧‧

第1圖是根據一些實施方式的積層製造系統的範例。 第2圖是可與根據一些實施方式的積層製造印表機一起使用的相機及光源的範例。 第3圖是根據一些實施方式供操作者輸入列印參數至數字控制碼產生器的介面的範例。 第4圖是根據一些實施方式可被擷取的列印層影像的範例,其顯示在沉積線材中的非預期間隙。 第5A圖、第5B圖及第5C圖是根據一些實施方式可被擷取的各種列印層影像的範例,其顯示列印層中的非預期螺紋狀人造物及其它破裂。 第6圖是根據一些實施方式的(高階)積層製造列印操作的範例。 第7A圖是根據一些實施方式用於列印層的一組設定點的模擬的範例,該模擬可被包含在數字控制碼中。 第7B圖是根據一些實施方式行進的列印路徑可能看起來如何的模擬的範例。 第8圖是根據一些實施方式的用於基於不同的填充密度和填充圖案來學習異常模式及異常率的訓練過程、以及這些異常模式及異常率如何影響列印物體的機械性質的範例。Figure 1 is an example of an additive manufacturing system according to some embodiments. Figure 2 is an example of a camera and light source that may be used with an additive manufacturing printer according to some embodiments. FIG. 3 is an example of an interface for an operator to input printing parameters into a digital control code generator according to some embodiments. FIG. 4 is an example of an image of a printed layer that may be captured according to some embodiments, showing unexpected gaps in the deposited wire. Figures 5A, 5B, and 5C are examples of various print layer images that may be captured according to some embodiments, showing unexpected thread-like artifacts and other breakages in the print layer. Figure 6 is an example of a (higher order) additive manufacturing printing operation according to some embodiments. Figure 7A is an example of a simulation of a set of set points for a print layer that may be included in a digital control code according to some embodiments. Figure 7B is an example of a simulation of how a traveled print path might look according to some implementations. Figure 8 is an example of a training process for learning outlier patterns and outlier rates based on different infill densities and infill patterns, and how these outlier patterns and outlier rates affect the mechanical properties of printed objects, according to some embodiments.

110‧‧‧數字控制碼產生器 110‧‧‧Digital control code generator

120‧‧‧影像感測器 120‧‧‧image sensor

130‧‧‧光源 130‧‧‧Light source

140‧‧‧列印頭 140‧‧‧print head

145‧‧‧線材供應系統 145‧‧‧Wire supply system

150‧‧‧底板 150‧‧‧bottom plate

160‧‧‧控制模組 160‧‧‧control module

170‧‧‧影像產生器 170‧‧‧Image generator

180‧‧‧影像分析器 180‧‧‧Image Analyzer

Claims (21)

一種積層製造系統,包含:一列印頭,被配置為以一逐層方式列印一物體;一照明源,用於向該物體的一列印層的一表面提供照明;一影像感測器,被配置為擷取該列印層的一影像;以及至少一硬體處理器,被配置為:接收一擷取影像;得到該物體的一目標機械性質、一目標光學性質、或一目標電性質的至少其中之一;產生該列印層的一三維形貌影像;使用經訓練以偵測列印層中的異常的一第一人工智慧算法,從所產生的形貌影像識別出該列印層中的一異常;使用一第二人工智慧算法,確定所識別的異常、一或多個人不可控變量與一或多個列印參數之間的一關聯;基於該關聯確定不再能夠達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;調整該一或多個列印參數的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;促使一操作人員調整該一或多個人不可控變量的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;以及使該列印頭使用經調整的值列印該物體的一後續層,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一。 An additive manufacturing system comprising: a printing head configured to print an object in a layer-by-layer manner; an illumination source for providing illumination to a surface of a printed layer of the object; configured to capture an image of the printing layer; and at least one hardware processor configured to: receive a captured image; obtain a target mechanical property, a target optical property, or a target electrical property of the object at least one of; generating a three-dimensional topographical image of the printed layer; identifying the printed layer from the generated topographical image using a first artificial intelligence algorithm trained to detect anomalies in the printed layer an anomaly in; using a second artificial intelligence algorithm, determining a correlation between the identified anomaly, one or more human uncontrollable variables, and one or more printing parameters; determining that the object is no longer reachable based on the correlation at least one of the target mechanical property, the target optical property, or the target electrical property; adjusting a value of the one or more printing parameters to achieve the target mechanical property, the target optical property, or at least one of the target electrical properties; prompting an operator to adjust a value of the one or more personal uncontrollable variables to achieve at least one of the target mechanical properties, the target optical properties, or the target electrical properties of the object one of; and causing the print head to print a subsequent layer of the object using adjusted values to achieve at least one of the target mechanical property, the target optical property, or the target electrical property of the object. 如申請專利範圍第1項所述之積層製造系統,其中該列印層的該三維形貌影像是使用以下算法其中之一而產生:一聚焦成形算法(shape-from-focus algorithm)、一光影重建算法(shape-from-shading focus algorithm)、一光學立體算法(photometric stereo algorithm)、以及一傅立葉疊層衍射調變算法(Fourier ptychography modulation algorithm)。 The additive manufacturing system described in item 1 of the scope of patent application, wherein the three-dimensional shape image of the printing layer is generated using one of the following algorithms: a shape-from-focus algorithm algorithm), a shape-from-shading focus algorithm, a photometric stereo algorithm, and a Fourier ptychography modulation algorithm. 如申請專利範圍第1項所述之積層製造系統,其中該第一人工智慧算法及該第二人工智慧算法中的至少其中之一包括機器學習、隱藏馬可夫模型(hidden Markov models)、遞迴類神經網路(recurrent neural networks)、卷積類神經網路(convolutional neural networks)、貝氏符號法(Bayesian symbolic methods)、支援向量機(support vector machines)以及通用對抗網路(general adversarial network)中的至少其中之一。 The additive manufacturing system described in claim 1, wherein at least one of the first artificial intelligence algorithm and the second artificial intelligence algorithm includes machine learning, hidden Markov models, recursive class In recurrent neural networks, convolutional neural networks, Bayesian symbolic methods, support vector machines, and general adversarial networks at least one of the . 如申請專利範圍第1項所述之積層製造系統,其中識別該異常是藉由將所產生的三維形貌影像與下列至少其中之一比較而執行:用於該列印層的所產生的數字控制碼、該經列印物體的一或多個前層、以及該經列印物體的一生產設計。 The additive manufacturing system of claim 1, wherein identifying the anomaly is performed by comparing the generated three-dimensional topography image with at least one of: the generated number for the printed layer The control code, one or more front layers of the printed object, and a production design of the printed object. 如申請專利範圍第1項所述之積層製造系統,其中該至少一硬體處理器更被配置為:在該物體被列印後,測量該機械性質、該光學性質以及該電性質的至少其中之一;確定該物體的一異常率及一異常圖案中至少其中之一;以及確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該物體的該機械性質、該光學性質以及該電性質的至少其中之一。 The additive manufacturing system described in claim 1, wherein the at least one hardware processor is further configured to measure at least one of the mechanical properties, the optical properties, and the electrical properties after the object is printed determining at least one of an anomalous rate and an anomalous pattern of the object; and determining how the anomalous rate and the anomalous pattern and at least one of the printing parameters affect the mechanical property, the optical properties and at least one of the electrical properties. 如申請專利範圍第1項所述之積層製造系統,其中識別一列印參數是使用一人工智慧算法。 In the additive manufacturing system described in claim 1 of the patent application, an artificial intelligence algorithm is used to identify a printing parameter. 如申請專利範圍第1項所述之積層製造系統,其中確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該機械性質、該光學性質以及該電性質的至少其中之一是使用一人工智慧算法。 The additive manufacturing system described in claim 1, wherein determining how the abnormality rate and the abnormal pattern and at least one of the printing parameters affect at least one of the mechanical properties, the optical properties, and the electrical properties One is to use an artificial intelligence algorithm. 一種用於積層製造的方法,包括:接收一經擷取影像,該經擷取影像是由一影像感測器產生,該影像感測器被配置以擷取以一逐層方式列印的一物體的一列印層的一影像;得到該物體的一目標機械性質、一目標光學性質、或一目標電性質的至少其中之一;使用一硬體處理器產生該列印層的一三維形貌影像;使用經訓練以偵測列印層中的異常的一第一人工智慧算法,從所產生的形貌影像識別出該列印層中的一異常;使用一第二人工智慧算法,確定所識別的異常、一或多個人不可控變量與一或多個列印參數之間的一關聯;基於該關聯確定不再能夠達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;調整該一或多個列印參數的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;促使一操作人員調整該一或多個人不可控變量的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;以及使該列印頭使用經調整的值列印該物體的一後續層,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一。 A method for additive manufacturing comprising: receiving a captured image produced by an image sensor configured to capture an object printed in a layer-by-layer manner obtaining an image of a printed layer of the object; obtaining at least one of a target mechanical property, a target optical property, or a target electrical property of the object; generating a three-dimensional topographical image of the printed layer using a hardware processor ; using a first artificial intelligence algorithm trained to detect anomalies in the printing layer, identifying an anomaly in the printing layer from the generated topography image; using a second artificial intelligence algorithm, determining the identified anomaly, a correlation between one or more human uncontrollable variables and one or more printing parameters; determining based on the correlation that the target mechanical property, the target optical property, or the target electrical property of the object can no longer be achieved adjusting a value of the one or more printing parameters to achieve at least one of the target mechanical property, the target optical property, or the target electrical property of the object; prompting an operator to adjust a value of the one or more uncontrollable variables to achieve at least one of the target mechanical property, the target optical property, or the target electrical property of the object; and causing the print head to use the adjusted value series A subsequent layer of the object is printed to achieve at least one of the target mechanical property, the target optical property, or the target electrical property of the object. 如申請專利範圍第8項所述之方法,其中該列印層的該三維形貌影像是使用以下算法其中之一而產生:一聚焦成形算法(shape-from-focus algorithm)、一光影重建算法(shape-from-shading focus algorithm)、一光學立體算法 (photometric stereo algorithm)、以及一傅立葉疊層衍射調變算法(Fourier ptychography modulation algorithm)。 The method described in claim 8 of the patent application, wherein the 3D topography image of the printing layer is generated using one of the following algorithms: a shape-from-focus algorithm, a light and shadow reconstruction algorithm (shape-from-shading focus algorithm), an optical stereo algorithm (photometric stereo algorithm), and a Fourier ptychography modulation algorithm (Fourier ptychography modulation algorithm). 如申請專利範圍第8項所述之方法,其中該第一人工智慧算法及該第二人工智慧算法中的至少其中之一包括機器學習、隱藏馬可夫模型(hidden Markov models)、遞迴類神經網路(recurrent neural networks)、卷積類神經網路(convolutional neural networks)、貝氏符號法(Bayesian symbolic methods)、支援向量機(support vector machines)以及通用對抗網路(general adversarial network)中的至少其中之一。 The method described in claim 8 of the patent application, wherein at least one of the first artificial intelligence algorithm and the second artificial intelligence algorithm includes machine learning, hidden Markov models, and recurrent neural networks At least one of recurrent neural networks, convolutional neural networks, Bayesian symbolic methods, support vector machines, and general adversarial network one of them. 如申請專利範圍第8項所述之方法,其中識別該異常是藉由將所產生的三維形貌影像與下列至少其中之一比較而執行:用於該列印層的所產生的數字控制碼、該經列印物體的一或多個前層、以及該經列印物體的一生產設計。 The method of claim 8, wherein identifying the anomaly is performed by comparing the generated 3D topography image with at least one of: a generated digital control code for the print layer , one or more front layers of the printed object, and a production design of the printed object. 如申請專利範圍第8項所述之方法,更包括:在該物體被列印後,測量該機械性質、該光學性質以及該電性質的至少其中之一;確定該物體的一異常率及一異常圖案中至少其中之一;以及確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該物體的該機械性質、該光學性質以及該電性質的至少其中之一。 The method described in item 8 of the scope of the patent application further includes: after the object is printed, measuring at least one of the mechanical property, the optical property and the electrical property; determining an abnormality rate and an abnormality rate of the object at least one of the abnormal pattern; and determining how the abnormal rate and at least one of the abnormal pattern and the printing parameter affect at least one of the mechanical property, the optical property, and the electrical property of the object. 如申請專利範圍第8項所述之方法,其中識別一列印參數是使用一人工智慧算法。 The method described in claim 8, wherein identifying a printing parameter uses an artificial intelligence algorithm. 如申請專利範圍第8項所述之方法,其中確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該機械性質、該光學性質以及該電性質的至少其中之一是使用一人工智慧算法。 The method of claim 8, wherein determining how at least one of the abnormality rate and the abnormal pattern and the printing parameters affect at least one of the mechanical property, the optical property and the electrical property is Use an artificial intelligence algorithm. 一種包含多個電腦可執行指令的非暫態電腦可讀取媒體,當由一處理器執行該多個電腦可執行指令時,導致該處理器執行一種用於積層製造的方法,該方法包括:接收一經擷取影像,該經擷取影像是由一影像感測器產生,該影像感測器被配置以擷取以一逐層方式列印的一物體的一列印層的一影像;得到該物體的一目標機械性質、一目標光學性質、或一目標電性質的至少其中之一;產生該列印層的一三維形貌影像;使用經訓練以偵測列印層中的異常的一第一人工智慧算法,從所產生的形貌影像識別出該列印層中的一異常;使用一第二人工智慧算法,確定所識別的異常、一或多個人不可控變量與一或多個列印參數之間的一關聯;基於該關聯確定不再能夠達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;調整該一或多個列印參數的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;促使一操作人員調整該一或多個人不可控變量的一值,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一;以及使該列印頭使用經調整的值列印該物體的一後續層,以達到該物體的該目標機械性質、該目標光學性質、或該目標電性質的至少其中之一。 A non-transitory computer-readable medium containing computer-executable instructions that, when executed by a processor, cause the processor to perform a method for additive manufacturing, the method comprising: receiving a captured image generated by an image sensor configured to capture an image of a printed layer of an object printed in a layer-by-layer manner; obtaining the at least one of a target mechanical property, a target optical property, or a target electrical property of an object; generating a three-dimensional topographical image of the printed layer; using a first an artificial intelligence algorithm identifying an anomaly in the print layer from the generated topography image; using a second artificial intelligence algorithm to determine the identified anomaly, one or more human uncontrollable variables and one or more column a correlation between printing parameters; determining based on the correlation that at least one of the target mechanical property, the target optical property, or the target electrical property of the object is no longer achievable; adjusting the one or more printing parameters a value to achieve at least one of the target mechanical property, the target optical property, or the target electrical property of the object; prompting an operator to adjust a value of the one or more human uncontrollable variables to achieve the object at least one of the target mechanical property, the target optical property, or the target electrical property; and causing the print head to print a subsequent layer of the object using adjusted values to achieve the target mechanical property of the object property, the target optical property, or at least one of the target electrical property. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中該列印層的該三維形貌影像是使用以下算法其中之一而產生:一聚焦成形算法(shape-from-focus algorithm)、一光影重建算法(shape-from-shading focus algorithm)、一光學立體算法(photometric stereo algorithm)、以及一傅立葉疊層衍射調變算法(Fourier ptychography modulation algorithm)。 The non-transitory computer-readable medium described in claim 15, wherein the three-dimensional shape image of the printing layer is generated using one of the following algorithms: a shape-from-focus algorithm algorithm), a light and shadow reconstruction algorithm (shape-from-shading focus algorithm), a photometric stereo algorithm, and a Fourier ptychography modulation algorithm. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中該第一人工智慧算法及該第二人工智慧算法中的至少其中之一包括機器學習、隱藏馬可夫模型(hidden Markov models)、遞迴類神經網路(recurrent neural networks)、卷積類神經網路(convolutional neural networks)、貝氏符號法(Bayesian symbolic methods)、支援向量機(support vector machines)以及通用對抗網路(general adversarial network)中的至少其中之一。 The non-transitory computer-readable medium described in claim 15, wherein at least one of the first artificial intelligence algorithm and the second artificial intelligence algorithm includes machine learning, hidden Markov models (hidden Markov models ), recurrent neural networks, convolutional neural networks, Bayesian symbolic methods, support vector machines, and general adversarial networks ( general adversarial network) at least one of them. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中識別該異常是藉由將所產生的三維形貌影像與下列至少其中之一比較而執行:用於該列印層的所產生的數字控制碼、該經列印物體的一或多個前層、以及該經列印物體的一生產設計。 The non-transitory computer readable medium of claim 15, wherein identifying the anomaly is performed by comparing the generated 3D topography image with at least one of: for the printed layer The generated digital control code, one or more front layers of the printed object, and a production design of the printed object. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中該方法更包括:在該物體被列印後,測量該機械性質、該光學性質以及該電性質的至少其中之一;確定該物體的一異常率及一異常圖案中至少其中之一;以及確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該物體的該機械性質、該光學性質以及該電性質的至少其中之一。 The non-transitory computer-readable medium described in claim 15, wherein the method further includes: measuring at least one of the mechanical property, the optical property, and the electrical property after the object is printed ; determining at least one of an anomalous rate and an anomalous pattern of the object; and determining how the anomalous rate and the anomalous pattern and at least one of the printing parameters affect the mechanical property, the optical property, and at least one of the electrical properties. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中識別一列印參數是使用一人工智慧算法。 The non-transitory computer-readable medium as described in claim 15, wherein identifying a printing parameter uses an artificial intelligence algorithm. 如申請專利範圍第15項所述之非暫態電腦可讀取媒體,其中確定該異常率及該異常圖案及該列印參數的至少其中之一如何影響該機械性質、該光學性質以及該電性質的至少其中之一是使用一人工智慧算法。 The non-transitory computer readable medium of claim 15, wherein determining how at least one of the anomaly rate and the anomalous pattern and the printing parameters affect the mechanical property, the optical property, and the electrical property At least one of the properties is using an artificial intelligence algorithm.
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