TWI775417B - Modular communication connector - Google Patents
Modular communication connector Download PDFInfo
- Publication number
- TWI775417B TWI775417B TW110115587A TW110115587A TWI775417B TW I775417 B TWI775417 B TW I775417B TW 110115587 A TW110115587 A TW 110115587A TW 110115587 A TW110115587 A TW 110115587A TW I775417 B TWI775417 B TW I775417B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- holes
- built
- communication connector
- pairs
- Prior art date
Links
Images
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
本發明涉及一種模組化的通訊連接器,特別是涉及一種符合乙太網路供電技術的通訊連接器。 The invention relates to a modular communication connector, in particular to a communication connector conforming to the power supply technology of an Ethernet network.
乙太網路供電(Power over Ethernet,PoE)技術是指現有的乙太網佈線基礎架構不更改的情況,不僅提供IP的終端設備(例如IP電話、網路攝像機等)的數據信號的傳輸,同時還提供直流電源。PoE技術可確保現有網路的正常運行,確保現有結構化佈線的安全性,同時將成本降低。 Power over Ethernet (PoE) technology refers to the situation that the existing Ethernet cabling infrastructure is not changed. It not only provides the transmission of data signals from IP terminal devices (such as IP phones, network cameras, etc.), DC power is also provided. PoE technology can ensure the normal operation of existing networks, ensure the security of existing structured cabling, and reduce costs.
配合乙太網路供電技術,插座連接器內部的電子模組需要相關的變壓線圈。然而,該些變壓線圈與端子、電路板增加了許多組裝及焊接的組裝工序,不僅增加人力成本,也降低生產效率。 With the Ethernet power supply technology, the electronic module inside the socket connector needs a related transformer coil. However, these transformer coils, terminals, and circuit boards require many assembly and welding processes, which not only increases labor costs, but also reduces production efficiency.
故,如何通過結構設計的改良,以方便自動化組裝及焊接,減少人力成本,來提升通訊連接器的生產效率,已成為該項技術領域所欲解決的一項重要課題。 Therefore, how to improve the production efficiency of the communication connector by improving the structural design to facilitate automatic assembly and welding, reduce labor costs, and improve the production efficiency of the communication connector has become an important issue to be solved in this technical field.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種模組化的通訊連接器,可以方便自動化組裝及焊接,減少人力成本,來提升通訊連接器的生產效率。 The technical problem to be solved by the present invention is to provide a modular communication connector for the shortcomings of the prior art, which can facilitate automatic assembly and welding, reduce labor costs, and improve the production efficiency of the communication connector.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種模組化的通訊連接器,其包括一絕緣殼體、一屏蔽外殼、及一電子組件。所述絕緣殼體形成沿著一插接方向的容置腔。所述屏蔽外殼設置於所述絕緣殼體的外圍。所述電子組件收容在所述容置腔內,所述電子組件具有一端子模組、一轉接電路板、一分隔承載座、一內置電路板、及一磁性模組。其中所述轉接電路板設置於所述分隔承載座的一側,所述內置電路板設置於所述分隔承載座的另一側,其中所述轉接電路板的底端有多個電端子,所述多個電端子穿過所述分隔承載座,並延伸外露於所述通訊連接器的底面。其中所述端子模組具有一舌板及多個傳輸端子,所述舌板平行於所述插接方向並設置於所述轉接電路板及所述分隔承載座的頂端,所述多個傳輸端子設置於所述舌板上並且焊接於所述內置電路板。其中所述磁性模組與所述分隔承載座相對地連接於所述內置電路板的另一側,所述磁性模組具有一盒體、兩對電插接腳、及多個外接端子,所述盒體具有一收容空間,所述收容空間的開口面對所述內置電路板,所述多個外接端子固定於所述盒體的底部並且焊接於所述內置電路板的底部,所述兩對電插接腳分別固定於所述盒體的兩側、穿過所述內置電路板並焊接於所述轉接電路板且電連接於所述多個電端子。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a modular communication connector, which includes an insulating shell, a shielding shell, and an electronic component. The insulating housing forms an accommodating cavity along a plugging direction. The shielding shell is arranged on the periphery of the insulating housing. The electronic component is accommodated in the accommodating cavity, and the electronic component has a terminal module, a switching circuit board, a partition bearing seat, a built-in circuit board, and a magnetic module. The transfer circuit board is arranged on one side of the partition carrier, the built-in circuit board is arranged on the other side of the partition carrier, and the bottom end of the transfer circuit board has a plurality of electrical terminals , the plurality of electrical terminals pass through the separation carrier, and extend and expose on the bottom surface of the communication connector. The terminal module has a tongue plate and a plurality of transmission terminals, the tongue plate is parallel to the insertion direction and is disposed on the top of the switching circuit board and the separation carrier, and the plurality of transmission terminals A terminal is provided on the tongue plate and soldered to the built-in circuit board. Wherein, the magnetic module is connected to the other side of the built-in circuit board opposite to the separation carrier, and the magnetic module has a box body, two pairs of electrical pins, and a plurality of external terminals. The box body has an accommodating space, the opening of the accommodating space faces the built-in circuit board, the plurality of external terminals are fixed on the bottom of the box body and are welded to the bottom of the built-in circuit board, the two The pair of electrical plug pins are respectively fixed on both sides of the box body, pass through the built-in circuit board, are welded to the transfer circuit board, and are electrically connected to the plurality of electrical terminals.
本發明的其中一有益效果在於,本發明的其中一有益效果在於,本發明所提供的模組化的通訊連接器,其能通過模組化的電子組件,其中所述轉接電路板設置於所述分隔承載座的一側,所述內置電路板設置於所述分隔承載座的另一側,其中所述磁性模組與所述分隔承載座相對地連接於所述內置電路板的另一側,藉此模組化的電子組件由絕緣殼體後方組裝,方便自動化生產通訊連接器。 One of the beneficial effects of the present invention is that the modular communication connector provided by the present invention can pass through the modular electronic components, wherein the switching circuit board is disposed on the On one side of the partition carrier, the built-in circuit board is disposed on the other side of the partition carrier, wherein the magnetic module and the partition carrier are oppositely connected to the other side of the built-in circuit board On the side, the modular electronic components are assembled from the back of the insulating housing, which is convenient for automatic production of communication connectors.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有 關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following Regarding the detailed description and drawings of the present invention, the drawings provided are only for reference and illustration, and are not used to limit the present invention.
1、1b、1c:模組化的通訊連接器 1, 1b, 1c: Modular communication connectors
10、10b、10c:絕緣殼體 10, 10b, 10c: insulating shell
101:容置腔 101: accommodating cavity
102:頂壁 102: Top Wall
104:側壁 104: Sidewall
1041:導軌 1041: Rails
105:燈孔 105: light hole
106:底壁 106: Bottom Wall
107:底開口 107: Bottom opening
108:後開口 108: rear opening
11:固定柱 11: Fixed column
12:隔板 12: Partition
120:間隔 120:Interval
121:柵格 121: Grid
13:凸緣 13: Flange
20:電子組件 20: Electronic Components
21:端子模組 21: Terminal module
211:舌板 211: Tongue Plate
212:傳輸端子 212: Transmission terminal
22:轉接電路板 22: Transfer circuit board
220:子電路板 220: Daughter board
222:電端子 222: electrical terminals
223:前轉接通孔 223: Forward turn-through hole
23:分隔承載座 23: Separate bearing seat
231:底座 231: Base
232:框座 232: frame seat
2320:定位孔 2320: Positioning hole
233:定位部 233: Positioning Department
235:容置溝槽 235: accommodating groove
25:內置電路板 25: Built-in circuit board
251:焊接孔 251: Welding holes
252:後轉接通孔 252: Rear switch through hole
253:第一通孔 253: first through hole
255:第二通孔 255: second through hole
26:磁性模組 26: Magnetic module
260:收容空間 260: Containment Space
261:盒體 261: Box
2612:導槽 2612: Guide groove
262:電插接腳 262: Electric plug pins
263:上插接腳 263: upper pin
265:外接端子 265: External terminal
30、30b、30c:屏蔽外殼 30, 30b, 30c: shielded enclosure
50:發光二極體光源 50: LED light source
51:接腳 51: pin
圖1為本發明第一實施例的模組化的通訊連接器的立體分解圖。 FIG. 1 is an exploded perspective view of a modular communication connector according to a first embodiment of the present invention.
圖2為本發明第一實施例的模組化的通訊連接器的另一立體分解圖。 2 is another perspective exploded view of the modular communication connector according to the first embodiment of the present invention.
圖3A為本發明第一實施例的模組化的通訊連接器的部分分解圖。 3A is a partial exploded view of the modular communication connector according to the first embodiment of the present invention.
圖3B為圖3A的另一角度。 FIG. 3B is another angle of FIG. 3A.
圖4為本發明第一實施例的模組化的通訊連接器的立體組合圖。 FIG. 4 is a perspective combined view of the modular communication connector according to the first embodiment of the present invention.
圖5為本發明第一實施例的模組化的通訊連接器的立體剖視圖。 5 is a perspective cross-sectional view of the modular communication connector according to the first embodiment of the present invention.
圖6為本發明第一實施例的模組化的通訊連接器的平面剖視圖。 6 is a plan cross-sectional view of the modular communication connector according to the first embodiment of the present invention.
圖7為本發明第二實施例的模組化的通訊連接器的立體分解圖。 7 is an exploded perspective view of a modular communication connector according to a second embodiment of the present invention.
圖8為本發明第二實施例的模組化的通訊連接器的立體組合圖。 FIG. 8 is a perspective combined view of a modular communication connector according to a second embodiment of the present invention.
圖9為本發明第三實施例的模組化的通訊連接器的立體分解圖。 9 is an exploded perspective view of a modular communication connector according to a third embodiment of the present invention.
圖10為本發明第三實施例的模組化的通訊連接器的立體組合 圖。 10 is a three-dimensional assembly of a modular communication connector according to a third embodiment of the present invention picture.
以下是通過特定的具體實施例來說明本發明所公開的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.
[第一實施例] [First Embodiment]
參閱圖1至圖6所示,本發明第一實施例提供一種模組化的通訊連接器1,其包括一絕緣殼體10、一電子組件20以及一屏蔽外殼30。所述絕緣殼體10形成沿著一插接方向(如圖3A所示的X軸方向)的容置腔101(參圖3A),可供一RJ45連接器插頭插接於內。
Referring to FIGS. 1 to 6 , a first embodiment of the present invention provides a
如圖3B所示,本實施例的絕緣殼體10具有一頂壁102、一底壁106及一對側壁104,所述頂壁102及所述一對側壁104延伸超過所述底壁106。底壁106向下突出一對固定柱11。絕緣殼體10還具有一位於容置腔101內的隔板12。所述隔板12連接於所述底壁106的後緣,所述隔板12的後方形成一底開
口107以及一後開口108,以供組裝所述電子組件20。如圖3B、圖5及圖6所示,具體的說,隔板12將容置腔101分隔成前、後兩部分。前半的容置腔101對應於RJ45連接器插頭的外形,後半的容置腔101對應於電子組件20。本實施例的電子組件20的結構節省空間,體積小,其中後半的容置腔101小於前半的容置腔101。隔板12的底緣向後突出一凸緣13。
As shown in FIG. 3B , the insulating
其中所述絕緣殼體10的底部前端設有兩個燈孔105,以容納兩個發光二極體光源50,發光二極體光源50具有一對接腳51向下彎折並外露於絕緣殼體10的底面。
The bottom front end of the insulating
所述屏蔽外殼30設置於所述絕緣殼體10的外圍。屏蔽外殼30以金屬片沖壓並彎折而成,本實施例的屏蔽外殼30具有頂壁、後壁及一對側壁,底部呈開口狀,可方便絕緣殼體10與電子組件20組合後,直接組裝於屏蔽外殼30的內部。
The shielding
本發明的其中一項特徵在於,電子組件20為一模組化結構,方便自動化生產,並且方便自動化組裝於絕緣殼體10內。以下具體的說明。所述電子組件20收容在所述容置腔101內。所述電子組件20具有一端子模組21、一轉接電路板22、一分隔承載座23、一內置電路板25、及一磁性模組26。轉接電路板22、分隔承載座23、與內置電路板25均垂直於插接方向,也就是說大致沿著圖3A的YZ平面延伸。
One of the features of the present invention is that the
所述端子模組21具有一舌板211及多個傳輸端子212,所述舌板211平行於所述插接方向並設置於所述轉接電路板22及所述分隔承載座23的頂端,所述多個傳輸端子212設置於所述舌板211上並且焊接於所述內置電路板25。
The
本實施例的電子組件20能自動化生產的一項關鍵在於分隔承載座23,其中轉接電路板22設置於分隔承載座23的一側,內置電路板25設置於
分隔承載座23的另一側。轉接電路板22具有一大約呈U字形的子電路板220,轉接電路板22的底端有多個電端子222,多個電端子222穿過分隔承載座23,並延伸外露於通訊連接器1的底面。
One of the keys to the automated production of the
其中所述磁性模組26與所述分隔承載座23相對地連接於所述內置電路板25的另一側。所述磁性模組26具有一盒體261、兩對電插接腳262、及多個外接端子265。所述盒體261由絕緣材料制成,其具有一收容空間260可收容多個磁性線圈(圖略),所述收容空間260的開口面對所述內置電路板25。所述多個外接端子265固定於所述盒體261的底部並且焊接於所述內置電路板25的底部,具體的說,外接端子265大致呈L形,一端突出於盒體261且朝向內置電路板25,另一端突出於盒體261的底面以焊接於一電路板。所述兩對電插接腳262分別固定於所述盒體261的兩側、穿過所述內置電路板25並焊接於所述轉接電路板22且電連接於所述多個電端子222。
The
轉接電路板22具有兩對前轉接通孔223,其中所述內置電路板25具有多個焊接孔251、及兩對後轉接通孔252,所述焊接孔251沿水平方向排列成一直線且鄰近於所述內置電路板25的頂緣,所述兩對後轉接通孔252分開位於所述多個焊接孔251的兩側,其中所述磁性模組26的所述兩對電插接腳262分別穿過並焊接於所述兩對後轉接通孔252、及所述兩對前轉接通孔223,所述端子模組21的所述多個傳輸端子212分別焊接於所述多個焊接孔251。
The switching
所述內置電路板25還具有多個第一通孔253、及多個第二通孔255,所述多個第一通孔253沿水平方向排列成一直線且靠近所述內置電路板25的頂緣,所述多個第二通孔255沿水平方向排列成一直線且靠近所述內置電路板25的底緣;所述磁性模組26還具有多個上插接腳263,所述多個上插接腳263位於所述兩對電插接腳262之間並且分別焊接於所述多個第一通孔253,所述多個外接端子265分別焊接於所述多個第二通孔255。
The built-in
如圖1所示,所述分隔承載座23具有一底座231及一框座232,所述框座232設於所述底座231上面,所述框座232的兩側各設有一定位孔2320,所述兩對電插接腳262的其中兩個分別穿過兩個所述定位孔2320。框座232的中間形成一定位部233。
As shown in FIG. 1 , the
其中所述底座231與所述框座232之間形成一容置溝槽235,所述轉接電路板22置於所述容置溝槽235內,所述內置電路板25的底緣抵接於所述底座231,所述框座232容納所述內置電路板25的多個電子元件。
An
本實施例上述安排的另一項優點在於,轉接電路板22的多個電端子222與磁性模組26的多個外接端子265分隔較遠,有利於避免意外的電弧。
Another advantage of the above arrangement in this embodiment is that the plurality of
請參閱圖3B,本實施例在組裝時,將組合完成的電子組件20由絕緣殼體10的後方組裝於絕緣殼體10內的後半的容置腔101內。其中所述隔板12形成多個柵格121,所述隔板12與所述頂壁102之間形成一間隔120,該些柵格121貫穿隔板12的前面與後面,並連通所述間隔120。柵格121的數量等於傳輸端子212的數量,所述端子模組21的所述舌板211穿過所述間隔120,所述多個傳輸端子212分別穿過所述多個柵格121。
Referring to FIG. 3B , during assembly in this embodiment, the assembled
請參閱圖3B、圖5及圖6,本實施例的電子組件20組裝於絕緣殼體10時,可以良好的固定於絕緣殼體10內。分隔承載座23的前端卡接於隔板12底部的凸緣13,所述分隔承載座23的後端卡接於磁性模組26的盒體261。換句話說,電子組件20的底部前緣可以卡接於絕緣殼體10的底壁106。此外,所述絕緣殼體10的所述一對側壁104的內側底部各形成一導軌1041,所述盒體261的兩側底部各形成一導槽2612,所述導軌1041卡合於所述導槽2612。最後,屏蔽外殼30由上而下蓋覆絕緣殼體10,屏蔽外殼30的後壁擋住電子組件20。
Please refer to FIG. 3B , FIG. 5 and FIG. 6 , when the
[第二實施例] [Second Embodiment]
請參閱圖7及圖8,本實施例的模組化的通訊連接器1b可供兩個RJ45連接器插頭插接於內,通訊連接器1b具有兩個電子組件20,每一電子組件20相容於上述的實施例,因此容不贅述。絕緣殼體10b隔成兩個容置腔101,以分別容置兩個電子組件20,組裝的過程,類似於上述實施例,每一電子組件20組合完成後,可以由絕緣殼體10b的後方組裝,最後,屏蔽外殼30b由上而下蓋覆絕緣殼體10b。此實施例說明本發明的模組化的電子組件20,可以適用於自動化組裝。
Please refer to FIG. 7 and FIG. 8 , the
[第三實施例] [Third Embodiment]
請參閱圖9及圖10,本實施例的模組化的通訊連接器1c可供四個RJ45連接器插頭插接於內,通訊連接器1c具有四個電子組件20,每一電子組件20相容於上述的實施例,因此容不贅述。絕緣殼體10c隔成兩個容置腔101,以分別容置四個電子組件20,組裝的過程,類似於上述實施例,每一電子組件20組合完成後,可以由絕緣殼體10c的後方組裝,最後,屏蔽外殼30c由上而下蓋覆絕緣殼體10c。此實施例說明本發明的模組化的電子組件20,可以適用於自動化組裝。
Please refer to FIG. 9 and FIG. 10. The
[實施例的有益效果] [Advantageous effects of the embodiment]
本發明的其中一有益效果在於,本發明所提供的模組化的通訊連接器,其能通過模組化的電子組件,其中所述轉接電路板設置於所述分隔承載座的一側,所述內置電路板設置於所述分隔承載座的另一側,其中所述磁性模組與所述分隔承載座相對地連接於所述內置電路板的另一側,藉此模組化的電子組件由絕緣殼體後方組裝,方便自動化生產通訊連接器。 One of the beneficial effects of the present invention is that the modular communication connector provided by the present invention can pass through a modular electronic component, wherein the switching circuit board is disposed on one side of the partition carrier, The built-in circuit board is arranged on the other side of the separation carrier, wherein the magnetic module is connected to the other side of the built-in circuit board opposite to the separation carrier, whereby the modular electronic The components are assembled from the back of the insulating shell, which facilitates the automatic production of communication connectors.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等 效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the scope of the present invention. Effective technical changes are all included in the scope of the patent application of the present invention.
1:模組化的通訊連接器 1: Modular communication connector
10:絕緣殼體 10: Insulating shell
101:容置腔 101: accommodating cavity
105:燈孔 105: light hole
11:固定柱 11: Fixed column
20:電子組件 20: Electronic Components
21:端子模組 21: Terminal module
211:舌板 211: Tongue Plate
212:傳輸端子 212: Transmission terminal
22:轉接電路板 22: Transfer circuit board
222:電端子 222: electrical terminals
23:分隔承載座 23: Separate bearing seat
233:定位部 233: Positioning Department
25:內置電路板 25: Built-in circuit board
26:磁性模組 26: Magnetic module
262:電插接腳 262: Electric plug pins
265:外接端子 265: External terminal
30:屏蔽外殼 30: Shielded shell
50:發光二極體光源 50: LED light source
51:接腳 51: pin
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110115587A TWI775417B (en) | 2021-04-29 | 2021-04-29 | Modular communication connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110115587A TWI775417B (en) | 2021-04-29 | 2021-04-29 | Modular communication connector |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI775417B true TWI775417B (en) | 2022-08-21 |
TW202243347A TW202243347A (en) | 2022-11-01 |
Family
ID=83807132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110115587A TWI775417B (en) | 2021-04-29 | 2021-04-29 | Modular communication connector |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI775417B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101662108A (en) * | 2008-08-27 | 2010-03-03 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
TWM412505U (en) * | 2010-10-14 | 2011-09-21 | Speedtech Corp | A module jack with a built-in PCB |
US20150171564A1 (en) * | 2013-12-13 | 2015-06-18 | Foxconn Interconnect Technology Limited | Method and apparatus for terminating wire wound magnetic core |
US20160359284A1 (en) * | 2015-06-08 | 2016-12-08 | Foxconn Interconnect Technology Limited | Stacked receptacle connector integrated with rj-45 connector and usb type-c connector |
TWM553886U (en) * | 2017-07-27 | 2018-01-01 | Singatron Technology Hong Kong Co Ltd | Network connector |
-
2021
- 2021-04-29 TW TW110115587A patent/TWI775417B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101662108A (en) * | 2008-08-27 | 2010-03-03 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
TWM412505U (en) * | 2010-10-14 | 2011-09-21 | Speedtech Corp | A module jack with a built-in PCB |
US20150171564A1 (en) * | 2013-12-13 | 2015-06-18 | Foxconn Interconnect Technology Limited | Method and apparatus for terminating wire wound magnetic core |
US20160359284A1 (en) * | 2015-06-08 | 2016-12-08 | Foxconn Interconnect Technology Limited | Stacked receptacle connector integrated with rj-45 connector and usb type-c connector |
TWM553886U (en) * | 2017-07-27 | 2018-01-01 | Singatron Technology Hong Kong Co Ltd | Network connector |
Also Published As
Publication number | Publication date |
---|---|
TW202243347A (en) | 2022-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7517254B2 (en) | Modular jack assembly having improved base element | |
US9912086B2 (en) | Electrical connector assembly having a small-sized electrical connector | |
US6773298B2 (en) | Connector assembly with light source sub-assemblies and method of manufacturing | |
US7775829B2 (en) | Electrical connector | |
US9172189B2 (en) | High speed modular jack having central shield | |
TWI279944B (en) | Stacked electrical connector assembly | |
US8579661B2 (en) | High speed modular jack | |
US9246276B2 (en) | Electrical connector having a shielding member disposed between two magnetic modules | |
US7736176B2 (en) | Modular jack assembly having improved connecting terminal | |
JP2007520036A (en) | Modular jack connector system | |
US8439705B2 (en) | Modular jack with sheilding plate between magnetic components | |
US20120115364A1 (en) | Electrical connector having improved grounding members | |
US20150056825A1 (en) | High speed modular jack having wrapping transformers | |
TW201830789A (en) | Receptacle cage member having locating features | |
US20150056827A1 (en) | High speed modular jack having two stacked printed circuit boards | |
CN104536102A (en) | Opto-electronic device assembly | |
US20150037986A1 (en) | Cable connector assembly | |
TWM629001U (en) | Electric connector | |
TW201712976A (en) | Electrical connector | |
CN215771678U (en) | Modular communication connector | |
US6682365B1 (en) | Stacked connector with plastic part assembled thereto | |
TWI775417B (en) | Modular communication connector | |
TW201620208A (en) | Electrical connector | |
CN215266773U (en) | Communication connector | |
TWM616021U (en) | Communication connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |