TWI771095B - Control chip, control circuit, and control method for sensing panels - Google Patents

Control chip, control circuit, and control method for sensing panels Download PDF

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TWI771095B
TWI771095B TW110124674A TW110124674A TWI771095B TW I771095 B TWI771095 B TW I771095B TW 110124674 A TW110124674 A TW 110124674A TW 110124674 A TW110124674 A TW 110124674A TW I771095 B TWI771095 B TW I771095B
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data
control chip
pin
clock
dat
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TW202303361A (en
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陳建盛
陳建維
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星河半導體股份有限公司
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Abstract

A control circuit of a sensing panel is provided. The control circuit includes a first, a second, and a third control chips. The first control chip includes a first clock input pin, a clock output pin, a primary data pin, and a first secondary data pin. The control circuit sends a clock through the clock output pin and sends a command through the primary data pin. The second control chip includes a second clock input pin configured to receive the clock, and a second secondary data pin configured to receive the command. The third control chip includes a third clock input pin configured to receive the clock, and a third secondary data pin configured to receive the command. After receiving the command, the second control chip sends or receives a first data according to the clock and a first target value. After receiving the command, the third control chip sends or receives a second data according to the clock and a second target value. The target value is different from the second target value.

Description

感應面板的控制晶片、控制電路及控制方法Control chip, control circuit and control method of induction panel

本發明是關於感應面板,尤其是關於感應面板的控制電路及控制方法。 The present invention relates to an induction panel, in particular to a control circuit and a control method of the induction panel.

感應面板可以感應接觸式操作或非接觸式操作。可感應接觸式操作的面板例如是電容式或電阻式的觸控面板,其藉由偵測面板上的電壓大小來得知接觸式操作的位置。可感應非接觸式操作的面板例如是電磁感應面板,其藉由偵測面板表面的電磁場大小來得知非接觸式操作的位置。 The induction panel can sense contact operation or non-contact operation. The panel that can sense the touch operation is, for example, a capacitive or resistive touch panel, which can know the position of the touch operation by detecting the magnitude of the voltage on the panel. The panel that can sense the non-contact operation is, for example, an electromagnetic induction panel, which can know the position of the non-contact operation by detecting the magnitude of the electromagnetic field on the surface of the panel.

感應面板通常需要多個偵測晶片,以及一個與該些偵測晶片連接的主控晶片。偵測晶片負責偵測選定範圍內的電壓或電磁場,並產生偵測結果,而主控晶片根據偵測結果計算接觸/非接觸式操作的位置。 A sensor panel usually requires a plurality of detection chips, and a main control chip connected to the detection chips. The detection chip is responsible for detecting the voltage or electromagnetic field in the selected range and generating the detection result, and the main control chip calculates the position of the contact/non-contact operation according to the detection result.

感應面板的尺寸愈大,所需的偵測晶片愈多,因此主控晶片需要有更多的接腳來與所有偵測晶片訊號連結。這會造成主控晶片的成本增加,以及提高面板之繞線的複雜度。 The larger the size of the sensor panel, the more detection chips are required, so the main control chip needs to have more pins to connect with all the detection chip signals. This increases the cost of the master chip and increases the complexity of the wiring of the panel.

鑑於先前技術之不足,本發明之一目的在於提供一種感應面板的控制晶片、控制電路及控制方法,以改善先前技術的不足。 In view of the deficiencies of the prior art, one object of the present invention is to provide a control chip, a control circuit and a control method for a sensing panel to improve the deficiencies of the prior art.

本發明之一實施例提供一種感應面板的控制晶片。感應面板包含一感應電路。該控制晶片包含:一時脈輸入接腳;一第一資料接腳;一偵測電路,耦接該感應電路,用來偵測該感應電路上之一特徵值;一記憶體,儲存複數個程式碼或程式指令;以及一計算電路,耦接該時脈輸入接腳、該第一資料接腳、該偵測電路及該記憶體,用來執行該些程式碼或程式指令以執行下列步驟:透過該時脈輸入接腳接收一時脈;透過該第一資料接腳接收一命令;以及根據該時脈及一目標數值透過該第一資料接腳傳送該特徵值。該目標數值決定該控制晶片傳送該特徵值之一時間點。 An embodiment of the present invention provides a control chip for an induction panel. The sensing panel includes a sensing circuit. The control chip includes: a clock input pin; a first data pin; a detection circuit coupled to the sensing circuit for detecting a characteristic value on the sensing circuit; a memory for storing a plurality of programs code or program instructions; and a computing circuit coupled to the clock input pin, the first data pin, the detection circuit and the memory for executing the code or program instructions to perform the following steps: A clock is received through the clock input pin; a command is received through the first data pin; and the characteristic value is transmitted through the first data pin according to the clock and a target value. The target value determines a point in time when the control chip transmits the characteristic value.

本發明之另一實施例提供一種感應面板的控制電路,包含一第一控制晶片、一第二控制晶片及一第三控制晶片。第一控制晶片包含一第一時脈輸入接腳、一第一時脈輸出接腳、一第一主要資料接腳及一第一次要資料接腳,用來透過該第一時脈輸出接腳傳送一時脈,以及透過該第一主要資料接腳傳送一命令。第二控制晶片包含:一第二時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈;以及一第二次要資料接腳,耦接該第一主要資料接腳,用來接收該命令。第三控制晶片包含:一第三時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈;以及一第三次要資料接腳,耦接該第一主要資料接腳,用來接收該命令。該第二控制晶片於接收該命令之後,根據該時脈及一第一目標數值傳送或接收一第一資料;該第三控制晶片於接收該命令之後,根據該時 脈及一第二目標數值傳送或接收一第二資料;該第一目標數值不等於該第二目標數值。 Another embodiment of the present invention provides a control circuit for a sensing panel, which includes a first control chip, a second control chip, and a third control chip. The first control chip includes a first clock input pin, a first clock output pin, a first main data pin and a first secondary data pin for connecting through the first clock output The pin transmits a clock, and transmits a command through the first main data pin. The second control chip includes: a second clock input pin coupled to the first clock output pin for receiving the clock; and a second secondary data pin coupled to the first primary data pin to receive the command. The third control chip includes: a third clock input pin coupled to the first clock output pin for receiving the clock; and a third secondary data pin coupled to the first primary data pin to receive the command. After receiving the command, the second control chip transmits or receives a first data according to the clock and a first target value; after receiving the command, the third control chip transmits or receives a first data according to the time The pulse and a second target value transmit or receive a second data; the first target value is not equal to the second target value.

本發明之另一實施例提供一種感應面板的控制電路,包含一第一控制晶片、一第二控制晶片及一第三控制晶片。第一控制晶片包含一第一時脈輸入接腳、一第一時脈輸出接腳、一第一主要資料接腳及一第一次要資料接腳,用來透過該第一時脈輸出接腳傳送一時脈,以及透過該第一主要資料接腳傳送一命令。第二控制晶片包含:一第二時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈;一第二時脈輸出接腳,用來傳送該時脈;一第二次要資料接腳,耦接該第一主要資料接腳,用來接收該命令;以及一第二主要資料接腳,用來傳送該命令。第三控制晶片包含:一第三時脈輸入接腳,耦接該第二時脈輸出接腳,用來接收該時脈;以及一第三次要資料接腳,耦接該第二主要資料接腳,用來接收該命令。 Another embodiment of the present invention provides a control circuit for a sensing panel, which includes a first control chip, a second control chip, and a third control chip. The first control chip includes a first clock input pin, a first clock output pin, a first main data pin and a first secondary data pin for connecting through the first clock output The pin transmits a clock, and transmits a command through the first main data pin. The second control chip includes: a second clock input pin, coupled to the first clock output pin, for receiving the clock; a second clock output pin for transmitting the clock; a The second secondary data pin is coupled to the first primary data pin for receiving the command; and a second primary data pin is used for transmitting the command. The third control chip includes: a third clock input pin coupled to the second clock output pin for receiving the clock; and a third secondary data pin coupled to the second primary data pin to receive the command.

有關本發明的特徵、實作與功效,茲配合圖式作實施例詳細說明如下。 With regard to the features, implementations and effects of the present invention, embodiments are described in detail as follows in conjunction with the drawings.

100,210,220,230,240,250,710,720,730,740,750,1210,1220,1230,1240,1250,1260,1270,1280,1290,1291,1292:控制晶片 100, 210, 220, 230, 240, 250, 710, 720, 730, 740, 750, 1210, 1220, 1230, 1240, 1250, 1260, 1270, 1280, 1290, 1291, 1292: Control wafer

110:偵測電路 110: Detection circuit

120:計算電路 120: Computational Circuits

130:記憶體 130: Memory

CLK_TX,CLK_TX1,CLK_TX2,CLK_TX3,CLK_TX4:時脈輸出接腳 CLK_TX, CLK_TX1, CLK_TX2, CLK_TX3, CLK_TX4: Clock output pins

CLK_RX,CLK_RX1,CLK_RX2,CLK_RX3,CLK_RX4,CLK_RX5:時脈輸入接腳 CLK_RX, CLK_RX1, CLK_RX2, CLK_RX3, CLK_RX4, CLK_RX5: Clock input pins

DAT_TX,DAT_TX1,DAT_TX2,DAT_TX3,DAT_TX4:主要資料接腳 DAT_TX, DAT_TX1, DAT_TX2, DAT_TX3, DAT_TX4: Main data pins

DAT_RX,DAT_RX1,DAT_RX2,DAT_RX3,DAT_RX4,DAT_RX5:次要資料接腳 DAT_RX, DAT_RX1, DAT_RX2, DAT_RX3, DAT_RX4, DAT_RX5: Secondary data pins

200,700,1200:感應面板 200, 700, 1200: induction panel

201,202,203,204,205,701,702,703,704,705:感應電路 201, 202, 203, 204, 205, 701, 702, 703, 704, 705: Induction circuits

208,708,1208:控制電路 208,708,1208: Control Circuits

CLK:時脈 CLK: Clock

T:週期 T: period

t0,t1,t2,t3,t4,t5,t6,t7,t8,t9,t10,t11,t12,t13,t14,t15,t16,t17,t18,t19:時間點 t0,t1,t2,t3,t4,t5,t6,t7,t8,t9,t10,t11,t12,t13,t14,t15,t16,t17,t18,t19: time points

CMD_W:寫入命令 CMD_W: write command

DAT_210_220,DAT_210_230,DAT_210_240,DAT_210_250,DAT_220_210,DAT_230_210,DAT_240_210,DAT_250_210,DAT_710_720,DAT_710_730,DAT_710_740,DAT_710_750,DAT_720_710,DAT_730_710,DAT_740_710,DAT_750_710:資料 DAT_210_220,DAT_210_230,DAT_210_240,DAT_210_250,DAT_220_210,DAT_230_210,DAT_240_210,DAT_250_210,DAT_710_720,DAT_710_730,DAT_710_740,DAT_710_750,DAT_720_710,DAT_730_710,DAT_740_710,DAT_750_710:資料

CMD_R:讀取命令 CMD_R: read command

S410,S420,S460,S470,S480,S610,S620,S660,S670,S680,S910,S920,S960,S970,S980,S990,S1110,S1120,S1160,S1170,S1180,S1190,S1195:步驟 Steps

圖1為本發明控制晶片之一實施例的功能方塊圖;圖2顯示本發明一實施例之感應面板及其控制電路;圖3顯示控制電路之寫入操作中寫入命令及資料在時序上的安排;圖4A顯示控制晶片210的寫入操作的流程圖;圖4B顯示控制晶片220~250的寫入操作的流程圖; 圖5顯示控制電路之讀取操作中讀取命令及資料在時序上的安排;圖6A顯示控制晶片210的讀取操作的流程圖;圖6B顯示控制晶片220~250的讀取操作的流程圖;圖7顯示本發明另一實施例之感應面板及其控制電路;圖8顯示控制電路之寫入操作中寫入命令及資料在時序上的安排;圖9A顯示控制晶片710的寫入操作的流程圖;圖9B顯示控制晶片720~740的寫入操作的流程圖;圖10顯示控制電路之讀取操作中讀取命令及資料在時序上的安排;圖11A顯示控制晶片710的讀取操作的流程圖;圖11B顯示控制晶片720~740的讀取操作的流程圖;以及圖12顯示本發明另一實施例之感應面板及其控制電路。 1 is a functional block diagram of an embodiment of a control chip of the present invention; FIG. 2 shows a sensing panel and its control circuit according to an embodiment of the present invention; 4A shows the flow chart of the write operation of the control wafer 210; FIG. 4B shows the flow chart of the write operation of the control wafer 220~250; 5 shows the timing arrangement of read commands and data in the read operation of the control circuit; FIG. 6A shows the flow chart of the read operation of the control chip 210; FIG. 6B shows the flow chart of the read operation of the control chips 220 to 250 7 shows a sensor panel and its control circuit according to another embodiment of the present invention; Flow chart; FIG. 9B shows the flow chart of the write operation of the control chips 720-740; FIG. 10 shows the timing arrangement of read commands and data in the read operation of the control circuit; FIG. 11A shows the read operation of the control chip 710 11B shows a flow chart of the read operation of the control chips 720-740; and FIG. 12 shows a sensor panel and its control circuit according to another embodiment of the present invention.

以下說明內容之技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。 The technical terms used in the following description refer to the common terms in the technical field. If some terms are described or defined in this specification, the interpretation of these terms is subject to the descriptions or definitions in this specification.

本發明之揭露內容包含感應面板的控制晶片、控制電路及控制方法。由於本發明之感應面板的控制晶片及控制電路所包含之部分元件單獨而言可能為已知元件,因此在不影響該裝置發明之充分揭露及可實施性的前提下,以下說明對於已知元件的細節將予以節略。此外,本發明之感應面板的控制方法的部分或全部流程可以是軟體及/或韌體之形式,並且可藉由本發明之控制晶片或其等效裝置來執行,在不影響該方法發明之充分揭露及可實施性的前提下, 以下方法發明之說明將著重於步驟內容而非硬體。 The disclosure of the present invention includes a control chip, a control circuit and a control method of a sensing panel. Since some components included in the control chip and the control circuit of the sensing panel of the present invention may be known components individually, without affecting the full disclosure and practicability of the invention of the device, the following description describes the known components details will be omitted. In addition, part or all of the process of the control method of the sensor panel of the present invention can be in the form of software and/or firmware, and can be executed by the control chip of the present invention or its equivalent device, without affecting the sufficiency of the invention of the method. On the premise of disclosure and enforceability, The following description of the method invention will focus on the steps rather than the hardware.

圖1為本發明控制晶片之一實施例的功能方塊圖。控制晶片100用來偵測感應面板上的接觸式操作或是非接觸式操作。控制晶片100包含偵測電路110、計算電路120、記憶體130以及四個接腳:時脈輸出接腳CLK_TX、時脈輸入接腳CLK_RX、主要資料接腳DAT_TX及次要資料接腳DAT_RX。偵測電路110耦接感應電路(例如電容陣列、電阻陣列或天線陣列),用來偵測感應電路上的特徵值(例如電壓、電場及磁場的至少其中一者)。記憶體130儲存複數個程式碼或程式指令。計算電路120耦接偵測電路110、記憶體130及該四個接腳。計算電路120可以是具有程式執行能力的電路或電子元件,例如中央處理器、微處理器、微處理單元、數位訊號處理器、特殊應用積體電路(Application Specific Integrated Circuit,ASIC),或其等效電路。計算電路120藉由執行該些程式碼或程式指令來實現控制晶片100的功能(包含但不限於處理特徵值)。換言之,該些程式碼或程式指令可視為控制晶片100的韌體或軟體。 FIG. 1 is a functional block diagram of an embodiment of a control chip of the present invention. The control chip 100 is used to detect a contact operation or a non-contact operation on the sensing panel. The control chip 100 includes a detection circuit 110 , a calculation circuit 120 , a memory 130 and four pins: a clock output pin CLK_TX, a clock input pin CLK_RX, a main data pin DAT_TX and a secondary data pin DAT_RX. The detection circuit 110 is coupled to a sensing circuit (eg, a capacitor array, a resistor array or an antenna array) for detecting characteristic values (eg, at least one of voltage, electric field, and magnetic field) on the sensing circuit. The memory 130 stores a plurality of program codes or program instructions. The calculation circuit 120 is coupled to the detection circuit 110 , the memory 130 and the four pins. The computing circuit 120 may be a circuit or electronic component with program execution capability, such as a central processing unit, a microprocessor, a micro-processing unit, a digital signal processor, an application specific integrated circuit (ASIC), or the like effective circuit. The computing circuit 120 implements the functions of controlling the chip 100 (including but not limited to processing characteristic values) by executing the program codes or program instructions. In other words, the program codes or program instructions can be regarded as firmware or software for controlling the chip 100 .

時脈輸出接腳CLK_TX及時脈輸入接腳CLK_RX是單向的接腳,也就是說,計算電路120透過時脈輸入接腳CLK_RX接收時脈,以及透過時脈輸出接腳CLK_TX傳送時脈。主要資料接腳DAT_TX及次要資料接腳DAT_RX是雙向的接腳,也就是說,計算電路120可以透過主要資料接腳DAT_TX傳送及接收資料,也可以透過次要資料接腳DAT_RX傳送及接收資料。 The clock output pin CLK_TX and the clock input pin CLK_RX are unidirectional pins, that is, the computing circuit 120 receives the clock through the clock input pin CLK_RX, and transmits the clock through the clock output pin CLK_TX. The primary data pin DAT_TX and the secondary data pin DAT_RX are bidirectional pins, that is, the computing circuit 120 can transmit and receive data through the primary data pin DAT_TX, and can also transmit and receive data through the secondary data pin DAT_RX .

圖2顯示本發明一實施例之感應面板及其控制電路。感應面板200包含感應電路201、感應電路202、感應電路203、感應電路204、感應電路205及控制電路208。控制電路208包含控制晶片210、控制晶片220、控制晶片230、 控制晶片240及控制晶片250等5個控制晶片。每個控制晶片透過感應電路偵測感應面板200的一個指定區域;更明確地說,控制晶片210、220、230、240及250(分別與感應電路201、202、203、204及205耦接或電連接)分別透過感應電路201、202、203、204及205偵測感應面板200的某個區域。控制晶片210、220、230、240及250皆可用控制晶片100實作。請注意,5個控制晶片僅用於示例,非用以限定本發明。在其他的實施例中,感應面板200上可以配置更多或更少的控制晶片。 FIG. 2 shows a sensing panel and its control circuit according to an embodiment of the present invention. The sensing panel 200 includes a sensing circuit 201 , a sensing circuit 202 , a sensing circuit 203 , a sensing circuit 204 , a sensing circuit 205 and a control circuit 208 . The control circuit 208 includes a control chip 210, a control chip 220, a control chip 230, There are five control wafers including the control wafer 240 and the control wafer 250 . Each control chip detects a designated area of the sensing panel 200 through the sensing circuit; more specifically, the control chips 210, 220, 230, 240 and 250 (coupled to or electrical connection) to detect a certain area of the sensing panel 200 through the sensing circuits 201 , 202 , 203 , 204 and 205 respectively. The control chips 210 , 220 , 230 , 240 and 250 can all be implemented by the control chip 100 . Please note that the 5 control wafers are for example only, and are not intended to limit the present invention. In other embodiments, more or less control wafers may be disposed on the sensing panel 200 .

控制晶片210的時脈輸出接腳CLK_TX1與控制晶片220的時脈輸入接腳CLK_RX2、控制晶片230的時脈輸入接腳CLK_RX3、控制晶片240的時脈輸入接腳CLK_RX4及控制晶片250的時脈輸入接腳CLK_RX5耦接或電連接。也就是說,控制晶片210可以傳送時脈CLK給控制晶片220、控制晶片230、控制晶片240及控制晶片250。在一些實施例中,時脈CLK可以由位於控制電路208上的振盪器(圖未示)產生,而控制晶片210透過時脈輸入接腳CLK_RX1接收時脈CLK。 The clock output pin CLK_TX1 of the control chip 210, the clock input pin CLK_RX2 of the control chip 220, the clock input pin CLK_RX3 of the control chip 230, the clock input pin CLK_RX4 of the control chip 240 and the clock input pin CLK_RX4 of the control chip 250 The input pin CLK_RX5 is coupled or electrically connected. That is, the control chip 210 can transmit the clock CLK to the control chip 220 , the control chip 230 , the control chip 240 and the control chip 250 . In some embodiments, the clock CLK can be generated by an oscillator (not shown) on the control circuit 208, and the control chip 210 receives the clock CLK through the clock input pin CLK_RX1.

控制晶片210的主要資料接腳DAT_TX1與控制晶片220的次要資料接腳DAT_RX2、控制晶片230的次要資料接腳DAT_RX3、控制晶片240的次要資料接腳DAT_RX4及控制晶片250的次要資料接腳DAT_RX5耦接或電連接。也就是說,控制晶片210可以透過主要資料接腳DAT_TX1傳送資料給控制晶片220、230、240及250,以及透過主要資料接腳DAT_TX1接收控制晶片220、230、240及250(分別透過次要資料接腳DAT_RX2、次要資料接腳DAT_RX3、次要資料接腳DAT_RX4及次要資料接腳DAT_RX5)所傳送的資料。在一些實施例中,控制晶片210可以透過次要資料接腳DAT_RX1將資料傳送給其他元件 (例如,電子裝置的處理器(圖未示),該電子裝置包含或整合感應面板200)。 The main data pin DAT_TX1 of the control chip 210, the secondary data pin DAT_RX2 of the control chip 220, the secondary data pin DAT_RX3 of the control chip 230, the secondary data pin DAT_RX4 of the control chip 240, and the secondary data pin of the control chip 250 The pin DAT_RX5 is coupled or electrically connected. That is, the control chip 210 can transmit data to the control chips 220, 230, 240 and 250 through the primary data pin DAT_TX1, and receive the control chips 220, 230, 240 and 250 through the primary data pin DAT_TX1 (respectively through the secondary data Data transmitted by pin DAT_RX2, secondary data pin DAT_RX3, secondary data pin DAT_RX4 and secondary data pin DAT_RX5). In some embodiments, the control chip 210 can transmit data to other devices through the secondary data pin DAT_RX1 (For example, a processor (not shown) of an electronic device that includes or integrates the sensing panel 200).

以下討論控制電路208的寫入操作(圖3、圖4A及圖4B)及讀取操作(圖5、圖6A及圖6B)。 The write operations (FIGS. 3, 4A, and 4B) and read operations (FIGS. 5, 6A, and 6B) of the control circuit 208 are discussed below.

圖3顯示控制電路208之寫入操作中寫入命令及資料在時序上的安排,圖4A顯示控制晶片210的寫入操作的流程圖,圖4B顯示控制晶片220~250的寫入操作的流程圖。 3 shows the timing arrangement of write commands and data in the write operation of the control circuit 208 , FIG. 4A shows the flow chart of the write operation of the control chip 210 , and FIG. 4B shows the flow chart of the write operation of the control chips 220 to 250 . picture.

控制晶片210的計算電路120透過時脈輸出接腳CLK_TX1傳送時脈CLK(步驟S410),以及根據時脈CLK透過主要資料接腳DAT_TX1依序傳送寫入命令CMD_W(時間點t0)、資料DAT_210_220(時間點t1)、資料DAT_210_230(時間點t2)、資料DAT_210_240(時間點t3)及資料DAT_210_250(時間點t4)(步驟S420)。「資料DAT_X_Y」代表資料的來源是控制晶片X,而資料的目的地是控制晶片Y。在一些實施例中,寫入命令與資料的長度相同;例如,在圖3的例子中,皆為3個時脈CLK的週期T(但不以此為限)。 The calculation circuit 120 of the control chip 210 transmits the clock CLK through the clock output pin CLK_TX1 (step S410 ), and sequentially transmits the write command CMD_W (time point t0 ), the data DAT_210_220 ( Time point t1), data DAT_210_230 (time point t2), data DAT_210_240 (time point t3), and data DAT_210_250 (time point t4) (step S420). "Data DAT_X_Y" means that the source of the data is the control chip X, and the destination of the data is the control chip Y. In some embodiments, the lengths of the write command and the data are the same; for example, in the example of FIG. 3 , both are three periods T of the clock CLK (but not limited thereto).

控制晶片220、230、240及250的計算電路120分別透過時脈輸入接腳CLK_RX2、CLK_RX3、CLK_RX4及CLK_RX5接收時脈CLK(步驟S460)、分別透過次要資料接腳DAT_RX2、DAT_RX3、DAT_RX4及DAT_RX5接收寫入命令CMD_W(步驟S470),以及根據時脈CLK及目標數值Px分別透過次要資料接腳DAT_RX2、DAT_RX3、DAT_RX4及DAT_RX5接收資料(步驟S480)。在一些實施例中,控制晶片220、230、240及250的計算電路120將資料儲存至記憶體130。 The calculation circuit 120 of the control chips 220, 230, 240 and 250 receives the clock CLK through the clock input pins CLK_RX2, CLK_RX3, CLK_RX4 and CLK_RX5 respectively (step S460), and respectively through the secondary data pins DAT_RX2, DAT_RX3, DAT_RX4 and DAT_RX5 Receive the write command CMD_W (step S470 ), and receive data through the secondary data pins DAT_RX2 , DAT_RX3 , DAT_RX4 and DAT_RX5 respectively according to the clock CLK and the target value Px (step S480 ). In some embodiments, the computing circuit 120 of the control chips 220 , 230 , 240 and 250 stores the data in the memory 130 .

控制晶片220、230、240及250各自儲存一個目標數值Px(x=2,3,4,5)(儲存在記憶體130中)。舉例來說,P2=0T、P3=3T、P4=6T及P5=9T; 如此一來,控制晶片220、230、240及250的計算電路120於收到寫入命令CMD_W後(時間點t1)分別等待0T、3T、6T、9T才開始接收資料(即,分別於時間點t1、t2、t3及t4開始接收資料DAT_210_220、資料DAT_210_230、資料DAT_210_240及資料DAT_210_250)。在一些實施例中,目標數值Px可以是控制晶片的編號(例如,P2=2、P3=3、P4=4及P5=5),各控制晶片再根據編號及資料的長度來得知應等待的時間(例如,等待的時間=(Px-2)*3T)。 The control chips 220, 230, 240 and 250 each store a target value Px (x=2, 3, 4, 5) (stored in the memory 130). For example, P2=0T, P3=3T, P4=6T and P5=9T; In this way, the calculation circuit 120 of the control chips 220, 230, 240 and 250 waits for 0T, 3T, 6T and 9T respectively after receiving the write command CMD_W (time point t1) before starting to receive data (that is, at the time point respectively). t1, t2, t3 and t4 start to receive data DAT_210_220, data DAT_210_230, data DAT_210_240 and data DAT_210_250). In some embodiments, the target value Px can be the number of the control chip (eg, P2=2, P3=3, P4=4, and P5=5), and each control chip can know the waiting time according to the number and the length of the data. Time (eg, time to wait = (Px-2)*3T).

圖5顯示控制電路208之讀取操作中讀取命令及資料在時序上的安排,圖6A顯示控制晶片210的讀取操作的流程圖,圖6B顯示控制晶片220~250的讀取操作的流程圖。 5 shows the timing arrangement of read commands and data in the read operation of the control circuit 208 , FIG. 6A shows the flow chart of the read operation of the control chip 210 , and FIG. 6B shows the flow of the read operation of the control chips 220 to 250 . picture.

控制晶片210的計算電路120透過時脈輸出接腳CLK_TX1傳送時脈CLK(步驟S610),以及根據時脈CLK透過主要資料接腳DAT_TX1傳送讀取命令CMD_R(時間點t0)(步驟S620)。 The computing circuit 120 of the control chip 210 transmits the clock CLK through the clock output pin CLK_TX1 (step S610 ), and transmits the read command CMD_R (time point t0 ) through the main data pin DAT_TX1 according to the clock CLK (step S620 ).

控制晶片220、230、240及250的計算電路120分別透過時脈輸入接腳CLK_RX2、CLK_RX3、CLK_RX4及CLK_RX5接收時脈CLK(步驟S660)、分別透過次要資料接腳DAT_RX2、DAT_RX3、DAT_RX4及DAT_RX5接收讀取命令CMD_R(步驟S670),以及根據時脈CLK及目標數值Px分別透過次要資料接腳DAT_RX2、DAT_RX3、DAT_RX4及DAT_RX5傳送資料(步驟S680)。舉例來說,如圖5所示,控制晶片220的計算電路120於收到讀取命令CMD_R後等待P2=0T才傳送資料DAT_220_210(即,於時間點t1開始傳送)、控制晶片230的計算電路120於收到讀取命令CMD_R後等待P3=3T才傳送資料DAT_230_210(即,於時間點t2開始傳送)、控制晶片240的計算電路120於收到讀取命令CMD_R後等待P4=6T才傳送資料DAT_240_210(即, 於時間點t3開始傳送)、控制晶片250的計算電路120於收到讀取命令CMD_R後等待P5=9T才傳送資料DAT_250_210(即,於時間點t4開始傳送)。在一些實施例中,資料DAT_220_210、資料DAT_230_210、資料DAT_240_210及資料DAT_250_210是前述之感應電路上的特徵值。 The calculation circuit 120 of the control chips 220, 230, 240 and 250 receives the clock CLK through the clock input pins CLK_RX2, CLK_RX3, CLK_RX4 and CLK_RX5 respectively (step S660), and respectively through the secondary data pins DAT_RX2, DAT_RX3, DAT_RX4 and DAT_RX5 Receive the read command CMD_R (step S670 ), and transmit data through the secondary data pins DAT_RX2 , DAT_RX3 , DAT_RX4 and DAT_RX5 respectively according to the clock CLK and the target value Px (step S680 ). For example, as shown in FIG. 5 , after receiving the read command CMD_R, the computing circuit 120 of the control chip 220 waits for P2=0T before transmitting the data DAT_220_210 (ie, starts to transmit at the time point t1 ), and the computing circuit of the control chip 230 120 waits for P3=3T to transmit the data DAT_230_210 after receiving the read command CMD_R (ie, starts to transmit at time t2), and the calculation circuit 120 of the control chip 240 waits for P4=6T to transmit the data after receiving the read command CMD_R DAT_240_210 (ie, Transmission starts at time t3 ), the computing circuit 120 of the control chip 250 waits for P5 = 9T to transmit the data DAT_250_210 after receiving the read command CMD_R (ie, starts transmission at time t4 ). In some embodiments, the data DAT_220_210, the data DAT_230_210, the data DAT_240_210 and the data DAT_250_210 are the aforementioned characteristic values on the sensing circuit.

圖7顯示本發明另一實施例之感應面板及其控制電路。感應面板700包含感應電路701、感應電路702、感應電路703、感應電路704、感應電路705及控制電路708。控制電路708包含控制晶片710、控制晶片720、控制晶片730、控制晶片740及控制晶片750等5個控制晶片。每個控制晶片透過感應電路偵測感應面板的一個指定區域;舉例來說,控制晶片710、720、730、740及750(分別與感應電路701、702、703、704及705耦接或電連接)分別透過感應電路701、702、703、704及705偵測感應面板700的某個區域。控制晶片710、720、730、740及750皆可用控制晶片100實作。 FIG. 7 shows a sensing panel and its control circuit according to another embodiment of the present invention. The sensing panel 700 includes a sensing circuit 701 , a sensing circuit 702 , a sensing circuit 703 , a sensing circuit 704 , a sensing circuit 705 and a control circuit 708 . The control circuit 708 includes five control chips including a control chip 710 , a control chip 720 , a control chip 730 , a control chip 740 , and a control chip 750 . Each control chip detects a designated area of the sensing panel through the sensing circuit; for example, the control chips 710, 720, 730, 740 and 750 (coupled or electrically connected to the sensing circuits 701, 702, 703, 704 and 705, respectively) ) respectively detect a certain area of the sensing panel 700 through the sensing circuits 701 , 702 , 703 , 704 and 705 . The control chips 710 , 720 , 730 , 740 and 750 can all be implemented with the control chip 100 .

控制晶片710的時脈輸出接腳CLK_TX1耦接或電連接控制晶片720的時脈輸入接腳CLK_RX2、控制晶片720的時脈輸出接腳CLK_TX2耦接或電連接控制晶片730的時脈輸入接腳CLK_RX3、控制晶片730的時脈輸出接腳CLK_TX3耦接或電連接控制晶片740的時脈輸入接腳CLK_RX4,以及控制晶片740的時脈輸出接腳CLK_TX4耦接或電連接控制晶片750的時脈輸入接腳CLK_RX5。也就是說,控制晶片710~750以串聯的方式傳送時脈CLK。在一些實施例中,時脈CLK可以由位於控制電路708上的振盪器(圖未示)產生,而控制晶片710透過時脈輸入接腳CLK_RX1接收時脈CLK。 The clock output pin CLK_TX1 of the control chip 710 is coupled or electrically connected to the clock input pin CLK_RX2 of the control chip 720 , and the clock output pin CLK_TX2 of the control chip 720 is coupled or electrically connected to the clock input pin of the control chip 730 CLK_RX3, the clock output pin CLK_TX3 of the control chip 730 are coupled or electrically connected to the clock input pin CLK_RX4 of the control chip 740, and the clock output pin CLK_TX4 of the control chip 740 is coupled or electrically connected to the clock of the control chip 750 Input pin CLK_RX5. That is, the control chips 710 to 750 transmit the clock CLK in series. In some embodiments, the clock CLK may be generated by an oscillator (not shown) on the control circuit 708, and the control chip 710 receives the clock CLK through the clock input pin CLK_RX1.

控制晶片710的主要資料接腳DAT_TX1耦接或電連接控制晶片720的次要資料接腳DAT_RX2、控制晶片720的主要資料接腳DAT_TX2耦接 或電連接控制晶片730的次要資料接腳DAT_RX3、控制晶片730的主要資料接腳DAT_TX3耦接或電連接控制晶片740的次要資料接腳DAT_RX4,以及控制晶片740的主要資料接腳DAT_TX4耦接或電連接控制晶片750的次要資料接腳DAT_RX5。也就是說,控制晶片710~750以串聯的方式傳送及接收資料。更明確地說,控制晶片710可以傳送資料給控制晶片720,也可以從控制晶片720接收資料;控制晶片720可以傳送資料給控制晶片730,也可以從控制晶片730接收資料;以此類推。在一些實施例中,控制晶片710可以透過次要資料接腳DAT_RX1將資料傳送給其他元件。 The main data pin DAT_TX1 of the control chip 710 is coupled or electrically connected to the secondary data pin DAT_RX2 of the control chip 720 , and the main data pin DAT_TX2 of the control chip 720 is coupled to Or electrically connected to the secondary data pin DAT_RX3 of the control chip 730 , the main data pin DAT_TX3 of the control chip 730 is coupled to or electrically connected to the secondary data pin DAT_RX4 of the control chip 740 , and the main data pin DAT_TX4 of the control chip 740 is coupled It is connected or electrically connected to the secondary data pin DAT_RX5 of the control chip 750 . That is, the control chips 710-750 transmit and receive data in a serial manner. More specifically, the control chip 710 can transmit data to and receive data from the control chip 720; the control chip 720 can transmit data to and receive data from the control chip 730; and so on. In some embodiments, the control chip 710 can transmit data to other devices through the secondary data pin DAT_RX1.

以下討論控制電路708的寫入操作(圖8、圖9A及圖9B)及讀取操作(圖10、圖11A及圖11B)。 The write operations (FIGS. 8, 9A, and 9B) and read operations (FIGS. 10, 11A, and 11B) of the control circuit 708 are discussed below.

圖8顯示控制電路708之寫入操作中寫入命令及資料在時序上的安排,圖9A顯示控制晶片710的寫入操作的流程圖,圖9B顯示控制晶片720~740的寫入操作的流程圖。 8 shows the timing arrangement of write commands and data in the write operation of the control circuit 708 , FIG. 9A shows the flow chart of the write operation of the control chip 710 , and FIG. 9B shows the flow chart of the write operation of the control chips 720 to 740 . picture.

控制晶片710的計算電路120透過時脈輸出接腳CLK_TX1傳送時脈CLK(步驟S910),以及根據時脈CLK透過主要資料接腳DAT_TX1依序傳送寫入命令CMD_W(時間點t0)、資料DAT_710_750(時間點t3)、資料DAT_710_740(時間點t6)、資料DAT_710_730(時間點t9)及資料DAT_710_720(時間點t12)(步驟S920)。 The computing circuit 120 of the control chip 710 transmits the clock CLK through the clock output pin CLK_TX1 (step S910 ), and sequentially transmits the write command CMD_W (time point t0 ), the data DAT_710_750 ( Time point t3), data DAT_710_740 (time point t6), data DAT_710_730 (time point t9), and data DAT_710_720 (time point t12) (step S920).

控制晶片720的計算電路120從時間點t0開始透過次要資料接腳DAT_RX2接收寫入命令CMD_W,並於下一個週期(從時間點t1開始)開始透過主要資料接腳DAT_TX2傳送寫入命令CMD_W。在控制晶片720接收及處理寫入命令CMD_W之後(即得知該命令為寫入命令之後,時間點t3),控制晶 片720的計算電路120根據時脈CLK及目標數值P2=9T來接收資料DAT_710_720。更明確地說,控制晶片720的計算電路120從時間點t3開始計時9T的時間後開始取得資料DAT_710_720,並且將中間的資料(即,資料DAT_710_750、資料DAT_710_740及資料DAT_710_730)透過主要資料接腳DAT_TX2往下一級的控制晶片(即,控制晶片730)傳送。 The computing circuit 120 of the control chip 720 receives the write command CMD_W through the secondary data pin DAT_RX2 from the time point t0, and starts to transmit the write command CMD_W through the main data pin DAT_TX2 in the next cycle (starting from the time point t1). After the control chip 720 receives and processes the write command CMD_W (that is, after knowing that the command is a write command, time point t3), the control chip 720 The calculation circuit 120 of the slice 720 receives the data DAT_710_720 according to the clock CLK and the target value P2=9T. More specifically, the calculation circuit 120 of the control chip 720 starts to obtain the data DAT_710_720 after counting the time of 9T from the time point t3, and transmits the intermediate data (ie, the data DAT_710_750, the data DAT_710_740 and the data DAT_710_730) through the main data pin DAT_TX2 Transfer to the next stage of the control wafer (ie, control wafer 730).

類似地,控制晶片730的計算電路120於時間點t2開始透過主要資料接腳DAT_TX3傳送寫入命令CMD_W。在控制晶片730接收及處理寫入命令CMD_W之後(即於時間點t4得知該命令為寫入命令之後),控制晶片730的計算電路120將中間的資料(即,資料DAT_710_750及資料DAT_710_740)透過主要資料接腳DAT_TX3往下一級的控制晶片(即,控制晶片740)傳送,並且在時間點t10(即t4+6T(6T為控制晶片730的目標數值P3))開始取得資料DAT_710_730。 Similarly, the computing circuit 120 of the control chip 730 starts to transmit the write command CMD_W through the main data pin DAT_TX3 at the time point t2. After the control chip 730 receives and processes the write command CMD_W (ie, after learning that the command is a write command at the time point t4 ), the calculation circuit 120 of the control chip 730 transmits the intermediate data (ie, the data DAT_710_750 and the data DAT_710_740 ) through the The main data pin DAT_TX3 is transmitted to the next-level control chip (ie, the control chip 740 ), and starts to obtain the data DAT_710_730 at the time point t10 (ie, t4+6T (6T is the target value P3 of the control chip 730 )).

類似地,控制晶片740的計算電路120於時間點t3開始透過主要資料接腳DAT_TX4傳送寫入命令CMD_W。在控制晶片740接收及處理寫入命令CMD_W之後(即於時間點t5得知該命令為寫入命令之後),控制晶片740的計算電路120將中間的資料(即,資料DAT_710_750)透過主要資料接腳DAT_TX4往下一級的控制晶片(即,控制晶片750)傳送,並且在時間點t8(即t5+3T(3T為控制晶片740的目標數值P4))開始取得資料DAT_710_740。 Similarly, the computing circuit 120 of the control chip 740 starts to transmit the write command CMD_W through the main data pin DAT_TX4 at the time point t3. After the control chip 740 receives and processes the write command CMD_W (ie, after learning that the command is a write command at the time point t5), the calculation circuit 120 of the control chip 740 transfers the intermediate data (ie, the data DAT_710_750) through the main data connection The pin DAT_TX4 is transmitted to the next-level control chip (ie, the control chip 750 ), and starts to obtain the data DAT_710_740 at the time point t8 (ie, t5+3T (3T is the target value P4 of the control chip 740 )).

因為控制晶片750是最後一個控制晶片,所以控制晶片750不需要傳送寫入命令CMD_W。在控制晶片750接收及處理寫入命令CMD_W之後(即於時間點t6得知該命令為寫入命令之後),控制晶片750的計算電路120在時間點t6(即t6+0T(0T為控制晶片750的目標數值P5))開始取得資料 DAT_710_740。 Because the control wafer 750 is the last control wafer, the control wafer 750 does not need to transmit the write command CMD_W. After the control chip 750 receives and processes the write command CMD_W (ie, after learning that the command is a write command at the time point t6 ), the calculation circuit 120 of the control chip 750 at the time point t6 (ie, t6 + OT ( OT is the control chip The target value of 750 P5)) began to obtain data DAT_710_740.

根據上述的討論,控制晶片720、730及740的操作可以以圖9B的流程圖表示,包含以下的步驟。 Based on the above discussion, the operation of the control wafers 720, 730, and 740 can be represented by the flowchart of FIG. 9B, including the following steps.

步驟S960:控制晶片720、730及740的計算電路120分別透過時脈輸入接腳CLK_RX2、CLK_RX3、CLK_RX4及CLK_RX5接收時脈CLK。 Step S960: The calculation circuit 120 of the control chips 720, 730 and 740 receives the clock CLK through the clock input pins CLK_RX2, CLK_RX3, CLK_RX4 and CLK_RX5, respectively.

步驟S970:控制晶片720、730及740的計算電路120分別透過次要資料接腳DAT_RX2、DAT_RX3及DAT_RX4接收寫入命令CMD_W、第一資料及第二資料。對控制晶片720而言,第一資料包含資料DAT_710_750、資料DAT_710_740及資料DAT_710_730,而第二資料包含資料DAT_710_720。對控制晶片730而言,第一資料包含資料DAT_710_750及資料DAT_710_740,而第二資料包含資料DAT_710_730。對控制晶片740而言,第一資料包含資料DAT_710_750,而第二資料包含資料DAT_710_740。 Step S970: The computing circuit 120 of the control chips 720, 730 and 740 receives the write command CMD_W, the first data and the second data through the secondary data pins DAT_RX2, DAT_RX3 and DAT_RX4, respectively. For the control chip 720, the first data includes data DAT_710_750, data DAT_710_740 and data DAT_710_730, and the second data includes data DAT_710_720. For the control chip 730, the first data includes data DAT_710_750 and DAT_710_740, and the second data includes data DAT_710_730. For the control chip 740, the first data includes data DAT_710_750, and the second data includes data DAT_710_740.

步驟S980:控制晶片720、730及740的計算電路120分別透過主要資料接腳DAT_TX2、DAT_TX3及DAT_TX4傳送寫入命令CMD_W及第一資料。 Step S980: The computing circuit 120 of the control chips 720, 730 and 740 transmits the write command CMD_W and the first data through the main data pins DAT_TX2, DAT_TX3 and DAT_TX4, respectively.

步驟S990:控制晶片720、730及740的計算電路120分別根據時脈CLK及目標數值P2、P3及P4取得第二資料。在一些實施例中,控制晶片720、730及740的計算電路120將第二資料儲存至記憶體130。 Step S990: The calculation circuit 120 of the control chips 720, 730 and 740 obtains the second data according to the clock CLK and the target values P2, P3 and P4, respectively. In some embodiments, the computing circuit 120 of the control chips 720 , 730 and 740 stores the second data in the memory 130 .

圖10顯示控制電路708之讀取操作中讀取命令及資料在時序上的安排,圖11A顯示控制晶片710的讀取操作的流程圖,圖11B顯示控制晶片720~740的讀取操作的流程圖。 10 shows the timing arrangement of read commands and data in the read operation of the control circuit 708 , FIG. 11A shows the flow chart of the read operation of the control chip 710 , and FIG. 11B shows the flow of the read operation of the control chips 720 to 740 . picture.

控制晶片710的計算電路120透過時脈輸出接腳CLK_TX1傳送 時脈CLK(步驟S1110),以及根據時脈CLK透過主要資料接腳DAT_TX1傳送讀取命令CMD_R(時間點t0)(步驟S1120)。 The calculation circuit 120 of the control chip 710 transmits through the clock output pin CLK_TX1 The clock CLK (step S1110 ), and the read command CMD_R (time point t0 ) is transmitted through the main data pin DAT_TX1 according to the clock CLK (step S1120 ).

控制晶片720的計算電路120於時間點t0開始透過次要資料接腳DAT_RX2接收讀取命令CMD_R,並且於時間點t1開始透過主要資料接腳DAT_TX2傳送讀取命令CMD_R。控制晶片730的計算電路120於時間點t1開始透過次要資料接腳DAT_RX3接收讀取命令CMD_R,並且於時間點t2開始透過主要資料接腳DAT_TX3傳送讀取命令CMD_R。控制晶片740的計算電路120於時間點t2開始透過次要資料接腳DAT_RX4接收讀取命令CMD_R,並且於時間點t3開始透過主要資料接腳DAT_TX4傳送讀取命令CMD_R。控制晶片750的計算電路120於時間點t3開始透過次要資料接腳DAT_RX5接收讀取命令CMD_R。因為控制晶片750是最後一個控制晶片,所以控制晶片750不需要傳送讀取命令CMD_R。 The computing circuit 120 of the control chip 720 starts to receive the read command CMD_R through the secondary data pin DAT_RX2 at the time point t0, and starts to transmit the read command CMD_R through the main data pin DAT_TX2 at the time point t1. The computing circuit 120 of the control chip 730 starts to receive the read command CMD_R through the secondary data pin DAT_RX3 at the time point t1, and starts to transmit the read command CMD_R through the main data pin DAT_TX3 at the time point t2. The computing circuit 120 of the control chip 740 starts to receive the read command CMD_R through the secondary data pin DAT_RX4 at the time point t2, and starts to transmit the read command CMD_R through the main data pin DAT_TX4 at the time point t3. The computing circuit 120 of the control chip 750 starts to receive the read command CMD_R through the secondary data pin DAT_RX5 at the time point t3. Since the control wafer 750 is the last control wafer, the control wafer 750 does not need to transmit the read command CMD_R.

控制晶片750於接收及處理讀取命令CMD_R之後(即於時間點t6得知該命令為讀取命令之後),控制晶片750的計算電路120在時間點t6(即t6+0T(0T為控制晶片750的目標數值P5))開始透過次要資料接腳DAT_RX5傳送資料DAT_750_710。 After the control chip 750 receives and processes the read command CMD_R (ie, after learning that the command is a read command at the time point t6 ), the calculation circuit 120 of the control chip 750 at the time point t6 (ie, t6 + 0T (0T is the control chip The target value of 750 P5)) starts to transmit data DAT_750_710 through the secondary data pin DAT_RX5.

控制晶片740的計算電路120於時間點t6開始透過主要資料接腳DAT_TX4接收資料DAT_750_710、於時間點t7開始透過次要資料接腳DAT_RX4傳送資料DAT_750_710,以及於時間點t10(即t7+3T(3T為控制晶片740的目標數值P4))開始透過次要資料接腳DAT_RX4傳送資料DAT_740_710。 The computing circuit 120 of the control chip 740 starts to receive the data DAT_750_710 through the primary data pin DAT_TX4 at the time point t6, starts to transmit the data DAT_750_710 through the secondary data pin DAT_RX4 at the time point t7, and starts at the time point t10 (ie t7+3T(3T For the target value P4)) of the control chip 740, the data DAT_740_710 starts to be transmitted through the secondary data pin DAT_RX4.

控制晶片730的計算電路120於時間點t7開始透過主要資料接腳 DAT_TX3依序接收資料DAT_750_710及資料DAT_740_710、於時間點t8開始透過次要資料接腳DAT_RX3依序傳送資料DAT_750_710及資料DAT_740_710,以及於時間點t14(即t8+6T(6T為控制晶片730的目標數值P3))開始透過次要資料接腳DAT_RX3傳送資料DAT_730_710。 The computing circuit 120 of the control chip 730 starts to pass through the main data pins at time t7 DAT_TX3 receives data DAT_750_710 and data DAT_740_710 in sequence, starts to transmit data DAT_750_710 and data DAT_740_710 sequentially through secondary data pin DAT_RX3 at time point t8, and at time point t14 (ie t8+6T (6T is the target value of control chip 730) P3)) starts to transmit data DAT_730_710 through the secondary data pin DAT_RX3.

控制晶片720的計算電路120於時間點t8開始透過主要資料接腳DAT_TX2依序接收資料DAT_750_710、資料DAT_740_710及資料DAT_730_710、於時間點t9開始透過次要資料接腳DAT_RX2依序傳送資料DAT_750_710、資料DAT_740_710及資料DAT_730_710,以及於時間點t18(即t9+9T(9T為控制晶片720的目標數值P2))開始透過次要資料接腳DAT_RX2傳送資料DAT_720_710。 The computing circuit 120 of the control chip 720 starts to receive the data DAT_750_710, the data DAT_740_710 and the data DAT_730_710 through the main data pin DAT_TX2 at the time point t8, and sequentially transmits the data DAT_750_710 and the data DAT_740_710 through the secondary data pin DAT_RX2 at the time point t9. and the data DAT_730_710, and the data DAT_720_710 is transmitted through the secondary data pin DAT_RX2 at the time point t18 (ie, t9+9T (9T is the target value P2 of the control chip 720 )).

根據上述的討論,控制晶片720、730及740的操作可以以圖11B的流程圖表示,包含以下的步驟。 Based on the above discussion, the operation of the control wafers 720, 730, and 740 can be represented by the flowchart of FIG. 11B, including the following steps.

步驟S1160:控制晶片720(730或740)的計算電路120透過時脈輸入接腳CLK_RX2(CLK_RX3或CLK_RX4)接收時脈CLK。 Step S1160: The calculation circuit 120 of the control chip 720 (730 or 740) receives the clock CLK through the clock input pin CLK_RX2 (CLK_RX3 or CLK_RX4).

步驟S1170:控制晶片720(730或740)的計算電路120透過次要資料接腳DAT_RX2(DAT_RX3或DAT_RX4)接收讀取命令CMD_R。 Step S1170: The computing circuit 120 of the control chip 720 (730 or 740) receives the read command CMD_R through the secondary data pin DAT_RX2 (DAT_RX3 or DAT_RX4).

步驟S1180:控制晶片720(730或740)的計算電路120透過主要資料接腳DAT_TX2(DAT_TX3或DAT_TX4)傳送讀取命令CMD_R。 Step S1180: The computing circuit 120 of the control chip 720 (730 or 740) transmits the read command CMD_R through the main data pin DAT_TX2 (DAT_TX3 or DAT_TX4).

步驟S1190:控制晶片720(730或740)的計算電路120透過主要資料接腳DAT_TX2(DAT_TX3或DAT_TX4)接收第一資料。對控制晶片740而言,第一資料包含資料DAT_750_710。對控制晶片730而言,第一資料包含資料DAT_750_710及資料DAT_740_710。對控制晶片720而言,第一資料 包含資料DAT_750_710、資料DAT_740_710及資料DAT_730_710。 Step S1190: The computing circuit 120 of the control chip 720 (730 or 740) receives the first data through the main data pin DAT_TX2 (DAT_TX3 or DAT_TX4). For the control chip 740, the first data includes data DAT_750_710. For the control chip 730, the first data includes data DAT_750_710 and data DAT_740_710. For the control chip 720, the first data Contains data DAT_750_710, data DAT_740_710 and data DAT_730_710.

步驟S1195:控制晶片720(730或740)的計算電路120透過次要資料接腳DAT_RX2(DAT_RX3或DAT_RX4)傳送第一資料及第二資料。對控制晶片740而言,第二資料包含資料DAT_740_710。對控制晶片730而言,第二資料包含資料DAT_730_710。對控制晶片720而言,第二資料包含資料DAT_720_710。 Step S1195: The computing circuit 120 of the control chip 720 (730 or 740) transmits the first data and the second data through the secondary data pin DAT_RX2 (DAT_RX3 or DAT_RX4). For the control chip 740, the second data includes data DAT_740_710. For the control chip 730, the second data includes data DAT_730_710. For the control chip 720, the second data includes data DAT_720_710.

在一些實施例中,控制晶片210及控制晶片710所接收的資料可以包含接觸/非接觸式操作的位置的座標,而該座標是由其他的控制晶片(例如220、230、240、250、720、730、740或750)根據所測得的特徵值計算得到。 In some embodiments, the data received by the control wafer 210 and the control wafer 710 may include the coordinates of the position of the contact/non-contact operation, which coordinates are obtained by other control wafers (eg, 220, 230, 240, 250, 720). , 730, 740 or 750) are calculated from the measured eigenvalues.

在圖2的實施例中,控制晶片是以並聯的方式連接,而在圖7的實施例中,控制晶片是以串聯的方式連接。其他的實施例可以結合圖2及圖7的實施例。圖12顯示本發明另一實施例之感應面板及其控制電路。感應面板1200的控制電路1208包含控制晶片1210、控制晶片1220、控制晶片1230、控制晶片1240、控制晶片1250、控制晶片1260、控制晶片1270、控制晶片1280、控制晶片1290、控制晶片1291及控制晶片1292等11個控制晶片。為了簡潔起見,圖12中省略控制晶片的接腳並且只繪示資料連線(即,省略時脈連線)。控制晶片1210、1220、1230、1240及1250為並聯連接;控制晶片1220、1260、1270及1280為串聯連接;控制晶片1250、1290、1291及1292為串聯連接。只要為每個控制晶片預先指定目標數值Px,則各控制晶片便可依據圖4A~4B、圖6A~6B、圖9A~9B以及圖11A~11B的流程操作。因為結合串聯及並聯,所以控制電路1208在佈局上更有彈性,更容易應用於各種尺寸的感應面板。 In the embodiment of FIG. 2, the control chips are connected in parallel, while in the embodiment of FIG. 7, the control chips are connected in series. Other embodiments may be combined with the embodiments of FIG. 2 and FIG. 7 . FIG. 12 shows a sensing panel and its control circuit according to another embodiment of the present invention. The control circuit 1208 of the sensing panel 1200 includes a control chip 1210, a control chip 1220, a control chip 1230, a control chip 1240, a control chip 1250, a control chip 1260, a control chip 1270, a control chip 1280, a control chip 1290, a control chip 1291 and a control chip 11 control wafers such as 1292. For the sake of brevity, the pins of the control chip are omitted in FIG. 12 and only data connections (ie, clock connections are omitted) are shown. The control chips 1210, 1220, 1230, 1240 and 1250 are connected in parallel; the control chips 1220, 1260, 1270 and 1280 are connected in series; the control chips 1250, 1290, 1291 and 1292 are connected in series. As long as the target value Px is pre-specified for each control chip, each control chip can operate according to the flowcharts of FIGS. 4A-4B, 6A-6B, 9A-9B, and 11A-11B. Because of the combination of series and parallel, the control circuit 1208 is more flexible in layout and can be more easily applied to sensing panels of various sizes.

綜上所述,基於自定義的通訊規範(參考圖3、圖5、圖8及圖10之時序圖,以及圖4A、圖4B、圖6A、圖6B、圖9A、圖9B、圖11A及圖11B之流程圖)本發明之控制晶片可以根據軟體或韌體動態設置為主控(master)模式(透過主要資料接腳DAT_TX傳送資料及接收資料,例如前述之控制晶片210、710、720、730及740)或被控(slave)模式(透過次要資料接腳DAT_RX傳送資料及接收資料,例如前述之控制晶片220、230、240、250、720、730、740及750)。請注意,控制晶片720、730及740於主控模式及被控模式之間切換。再者,因為每個感應晶片皆可執行感應演算法,所以即使感應面板的尺寸變大也不會增加某一個控制晶片的運算需求。也就是說,本發明所提出之控制電路是一種分散式及/或去中心化的架構,不但有助於簡化繞線的複雜度、使電路佈局更有彈性,而且不會造成單一晶片的運算負擔過大。 To sum up, based on the customized communication specification (refer to the timing diagrams of FIG. 3, FIG. 5, FIG. 8 and FIG. 10, and FIG. 4A, FIG. 4B, FIG. 11B is the flow chart) The control chip of the present invention can be dynamically set to master mode according to software or firmware (transmitting and receiving data through the main data pin DAT_TX, such as the aforementioned control chips 210, 710, 720, 730 and 740) or slave mode (transmitting and receiving data through the secondary data pin DAT_RX, such as the aforementioned control chips 220, 230, 240, 250, 720, 730, 740 and 750). Note that the control chips 720, 730 and 740 switch between master mode and slave mode. Furthermore, since each sensing chip can execute a sensing algorithm, even if the size of the sensing panel increases, the computing requirement of a certain control chip will not be increased. That is to say, the control circuit proposed by the present invention is a distributed and/or decentralized structure, which not only helps to simplify the complexity of the wiring and makes the circuit layout more flexible, but also does not cause the operation of a single chip. Overburdened.

由於本技術領域具有通常知識者可藉由本案之裝置發明的揭露內容來瞭解本案之方法發明的實施細節與變化,因此,為避免贅文,在不影響該方法發明之揭露要求及可實施性的前提下,重複之說明在此予以節略。請注意,前揭圖示中,元件之形狀、尺寸及比例僅為示意,係供本技術領域具有通常知識者瞭解本發明之用,非用以限制本發明。此外,在一些實施例中,前揭的流程圖中所提及的步驟可依實際操作調整其前後順序,甚至可同時或部分同時執行。 Since a person with ordinary knowledge in the technical field can understand the implementation details and changes of the method invention in this application through the disclosure content of the device invention in this application, in order to avoid redundant repetition, the disclosure requirements and practicability of the method invention are not affected. On the premise, repeated explanations are omitted here. Please note that the shapes, sizes and ratios of the components in the preceding figures are only schematic representations, which are for those skilled in the art to understand the present invention, and are not intended to limit the present invention. In addition, in some embodiments, the steps mentioned in the aforementioned flowcharts can be adjusted in their sequence according to the actual operation, and can even be executed simultaneously or partially simultaneously.

雖然本發明之實施例如上所述,然而該些實施例並非用來限定本發明,本技術領域具有通常知識者可依據本發明之明示或隱含之內容對本發明之技術特徵施以變化,凡此種種變化均可能屬於本發明所尋求之專利保護範疇,換言之,本發明之專利保護範圍須視本說明書之申請專利範圍所界定者為準。 Although the embodiments of the present invention are described above, these embodiments are not intended to limit the present invention. Those skilled in the art can change the technical features of the present invention according to the explicit or implicit contents of the present invention. All such changes may belong to the scope of patent protection sought by the present invention. In other words, the scope of patent protection of the present invention shall be determined by the scope of the patent application in this specification.

200:感應面板 200: Induction panel

201,202,203,204,205:感應電路 201, 202, 203, 204, 205: Induction circuits

208:控制電路 208: Control circuit

210,220,230,240,250:控制晶片 210, 220, 230, 240, 250: Control chip

CLK_TX,CLK_TX1,CLK_TX2,CLK_TX3,CLK_TX4:時脈輸出接腳 CLK_TX, CLK_TX1, CLK_TX2, CLK_TX3, CLK_TX4: Clock output pins

CLK_RX,CLK_RX1,CLK_RX2,CLK_RX3,CLK_RX4,CLK_RX5:時脈輸入接腳 CLK_RX, CLK_RX1, CLK_RX2, CLK_RX3, CLK_RX4, CLK_RX5: Clock input pins

DAT_TX,DAT_TX1,DAT_TX2,DAT_TX3,DAT_TX4:主要資料接腳 DAT_TX, DAT_TX1, DAT_TX2, DAT_TX3, DAT_TX4: Main data pins

DAT_RX,DAT_RX1,DAT_RX2,DAT_RX3,DAT_RX4,DAT_RX5:次要資料接腳 DAT_RX, DAT_RX1, DAT_RX2, DAT_RX3, DAT_RX4, DAT_RX5: Secondary data pins

Claims (13)

一種感應面板的控制晶片,該感應面板包含一感應電路,該控制晶片包含: 一時脈輸入接腳; 一第一資料接腳; 一偵測電路,耦接該感應電路,用來偵測該感應電路上之一特徵值; 一記憶體,儲存複數個程式碼或程式指令;以及 一計算電路,耦接該時脈輸入接腳、該第一資料接腳、該偵測電路及該記憶體,用來執行該些程式碼或程式指令以執行下列步驟: 透過該時脈輸入接腳接收一時脈; 透過該第一資料接腳接收一命令;以及 根據該時脈及一目標數值透過該第一資料接腳傳送該特徵值; 其中該目標數值決定該控制晶片傳送該特徵值之一時間點。 A control chip of an induction panel, the induction panel includes an induction circuit, and the control chip includes: A clock input pin; a first data pin; a detection circuit, coupled to the induction circuit, for detecting a characteristic value on the induction circuit; a memory that stores a plurality of code or program instructions; and A computing circuit, coupled to the clock input pin, the first data pin, the detection circuit and the memory, is used for executing the program codes or program instructions to perform the following steps: Receive a clock through the clock input pin; receiving a command through the first data pin; and transmit the characteristic value through the first data pin according to the clock and a target value; The target value determines a time point when the control chip transmits the characteristic value. 如請求項1之控制晶片,更包含一第二資料接腳,耦接該計算電路,該計算電路更執行下列步驟: 透過該第二資料接腳傳送該命令。 As claimed in claim 1, the control chip further comprises a second data pin, which is coupled to the computing circuit, and the computing circuit further performs the following steps: The command is sent through the second data pin. 如請求項2之控制晶片,其中該特徵值係一第一特徵值,該計算電路更執行下列步驟: 透過該第二資料接腳接收一第二特徵值;以及 透過該第一資料接腳傳送該第二特徵值。 The control chip of claim 2, wherein the characteristic value is a first characteristic value, and the calculation circuit further performs the following steps: receiving a second characteristic value through the second data pin; and The second characteristic value is transmitted through the first data pin. 一種感應面板的控制電路,包含: 一第一控制晶片,包含一第一時脈輸入接腳、一第一時脈輸出接腳、一第一主要資料接腳及一第一次要資料接腳,用來透過該第一時脈輸出接腳傳送一時脈,以及透過該第一主要資料接腳傳送一命令; 一第二控制晶片,包含: 一第二時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈;以及 一第二次要資料接腳,耦接該第一主要資料接腳,用來接收該命令;以及 一第三控制晶片,包含: 一第三時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈;以及 一第三次要資料接腳,耦接該第一主要資料接腳,用來接收該命令; 其中,該第二控制晶片於接收該命令之後,根據該時脈及一第一目標數值傳送或接收一第一資料,該第三控制晶片於接收該命令之後,根據該時脈及一第二目標數值傳送或接收一第二資料,以及該第一目標數值不等於該第二目標數值。 A control circuit of an induction panel, comprising: a first control chip, comprising a first clock input pin, a first clock output pin, a first main data pin and a first secondary data pin for transmitting the first clock The output pin transmits a clock, and transmits a command through the first main data pin; a second control chip, comprising: a second clock input pin coupled to the first clock output pin for receiving the clock; and a second secondary data pin coupled to the first primary data pin for receiving the command; and a third control chip, comprising: a third clock input pin coupled to the first clock output pin for receiving the clock; and a third secondary data pin coupled to the first primary data pin for receiving the command; The second control chip transmits or receives a first data according to the clock and a first target value after receiving the command, and the third control chip sends or receives a first data according to the clock and a second after receiving the command The target value transmits or receives a second data, and the first target value is not equal to the second target value. 如請求項4之控制電路,其中該命令係一寫入命令、該第一控制晶片透過該第一主要資料接腳傳送該第一資料及該第二資料,以及該第二控制晶片於接收該寫入命令之後等待N個該時脈的週期再透過該第二次要資料接腳接收該第一資料,N為大於等於零的整數。The control circuit of claim 4, wherein the command is a write command, the first control chip transmits the first data and the second data through the first main data pin, and the second control chip receives the After the write command, wait for N cycles of the clock and then receive the first data through the second secondary data pin, where N is an integer greater than or equal to zero. 如請求項5之控制電路,其中該第二目標數值大於該第一目標數值,該第一控制晶片係先傳送該第一資料再傳送該第二資料。The control circuit of claim 5, wherein the second target value is greater than the first target value, and the first control chip transmits the first data first and then transmits the second data. 如請求項4之控制電路,其中該命令係一讀取命令、該第二控制晶片於接收該讀取命令之後等待N個該時脈的週期再透過該第二次要資料接腳傳送該第一資料,以及該第一控制晶片透過該第一主要資料接腳接收該第一資料,N為大於等於零的整數。The control circuit of claim 4, wherein the command is a read command, the second control chip waits for N cycles of the clock after receiving the read command, and then transmits the first through the second secondary data pin a data, and the first control chip receives the first data through the first main data pin, and N is an integer greater than or equal to zero. 如請求項7之控制電路,其中該第二目標數值大於該第一目標數值,該第一控制晶片係透過該第一主要資料接腳先接收該第一資料再接收該第二資料。The control circuit of claim 7, wherein the second target value is greater than the first target value, and the first control chip receives the first data first and then the second data through the first main data pin. 一種感應面板的控制電路,包含: 一第一控制晶片,包含一第一時脈輸入接腳、一第一時脈輸出接腳、一第一主要資料接腳及一第一次要資料接腳,用來透過該第一時脈輸出接腳傳送一時脈,以及透過該第一主要資料接腳傳送一命令; 一第二控制晶片,包含: 一第二時脈輸入接腳,耦接該第一時脈輸出接腳,用來接收該時脈; 一第二時脈輸出接腳,用來傳送該時脈; 一第二次要資料接腳,耦接該第一主要資料接腳,用來接收該命令;以及 一第二主要資料接腳,用來傳送該命令;以及 一第三控制晶片,包含: 一第三時脈輸入接腳,耦接該第二時脈輸出接腳,用來接收該時脈;以及 一第三次要資料接腳,耦接該第二主要資料接腳,用來接收該命令。 A control circuit of an induction panel, comprising: a first control chip, comprising a first clock input pin, a first clock output pin, a first main data pin and a first secondary data pin for transmitting the first clock The output pin transmits a clock, and transmits a command through the first main data pin; a second control chip, comprising: a second clock input pin coupled to the first clock output pin for receiving the clock; a second clock output pin for transmitting the clock; a second secondary data pin coupled to the first primary data pin for receiving the command; and a second main data pin for transmitting the command; and a third control chip, comprising: a third clock input pin coupled to the second clock output pin for receiving the clock; and A third secondary data pin is coupled to the second primary data pin for receiving the command. 如請求項9之控制電路,其中該命令係一寫入命令、該第一控制晶片透過該第一主要資料接腳輸出一第一資料及一第二資料、該第二控制晶片透過該第二次要資料接腳接收該第一資料及該第二資料,並根據該時脈取得該第一資料、該第二控制晶片透過該第二主要資料接腳傳送該第二資料,以及該第三控制晶片透過該第三次要資料接腳接收該第二資料。The control circuit of claim 9, wherein the command is a write command, the first control chip outputs a first data and a second data through the first main data pin, the second control chip outputs a first data and a second data through the second control chip The secondary data pin receives the first data and the second data, and obtains the first data according to the clock, the second control chip transmits the second data through the second main data pin, and the third data The control chip receives the second data through the third secondary data pin. 如請求項10之控制電路,其中該第一控制晶片係先傳送該第二資料再傳送該第一資料。The control circuit of claim 10, wherein the first control chip transmits the second data first and then transmits the first data. 如請求項9之控制電路,其中該命令係一讀取命令、該第三控制晶片根據該讀取命令產生一第一資料、該第三控制晶片透過該第三次要資料接腳將該第一資料傳送至該第二控制晶片、該第二控制晶片根據該讀取命令產生一第二資料,以及該第二控制晶片透過該第二主要資料接腳接收該第一資料,並且透過該第二次要資料接腳傳送該第一資料及該第二資料至該第一控制晶片。The control circuit of claim 9, wherein the command is a read command, the third control chip generates a first data according to the read command, and the third control chip generates the first data through the third secondary data pin A data is sent to the second control chip, the second control chip generates a second data according to the read command, and the second control chip receives the first data through the second main data pin, and through the second control chip The secondary data pin transmits the first data and the second data to the first control chip. 如請求項12之控制電路,其中該第二控制晶片係先傳送該第一資料再傳送該第二資料。The control circuit of claim 12, wherein the second control chip transmits the first data first and then transmits the second data.
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TW201523413A (en) * 2013-12-11 2015-06-16 Touchplus Information Corp Control-point sensing panel and design method of control-point sensing panel
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201523413A (en) * 2013-12-11 2015-06-16 Touchplus Information Corp Control-point sensing panel and design method of control-point sensing panel
TW201629737A (en) * 2015-02-13 2016-08-16 新益先創科技股份有限公司 Capacitance image sensing system
US20200052044A1 (en) * 2017-08-14 2020-02-13 Samsung Display Co., Ltd. Display device having an input sensing unit

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