TWI767875B - Memory device and operation method thereof - Google Patents

Memory device and operation method thereof Download PDF

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TWI767875B
TWI767875B TW110149343A TW110149343A TWI767875B TW I767875 B TWI767875 B TW I767875B TW 110149343 A TW110149343 A TW 110149343A TW 110149343 A TW110149343 A TW 110149343A TW I767875 B TWI767875 B TW I767875B
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reference voltage
line
word line
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stage
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TW202326735A (en
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胡瀚文
李永駿
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旺宏電子股份有限公司
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Abstract

A memory device and an operation method thereof are provided. The operation method includes: in a first phase, selecting a global signal line, selecting a first string select line, unselecting a second string select line, selecting a first word line, and unselecting a second word line; sensing during a second phase; in a third phase, keeping voltages of the global signal line, the selected first word line and the unselected second word line, unselecting the first string select line and selecting the second string select line to switch voltages of the first and the second string select lines; and sensing during a fourth phase.

Description

記憶體裝置及其操作方法Memory device and method of operating the same

本發明係有關於一種具有記憶體內運算(In-Memory-Computing (IMC))的記憶體裝置及其操作方法。The present invention relates to a memory device with In-Memory-Computing (IMC) and an operation method thereof.

人工智慧(AI)已在許多領域中成為高度有效解決方案。AI的關鍵操作在於對大量的輸入資料(如輸入特徵圖(input feature maps))與權重值進行乘積累加運算(multiply-and-accumulation (MAC))。Artificial Intelligence (AI) has become a highly effective solution in many fields. The key operation of AI is to perform multiply-and-accumulation (MAC) operations on a large amount of input data (such as input feature maps) and weight values.

然而,以目前的AI架構而言,容易遇到輸出入瓶頸(IO bottleneck)與低效率的MAC運算流程(inefficient MAC operation flow)。However, with the current AI architecture, it is easy to encounter an IO bottleneck and an inefficient MAC operation flow.

為達到高準確度,可執行具有多位元輸入及多位元權重值的MAC操作。然而,輸出入瓶頸變得更加嚴重,且效率將更低。To achieve high accuracy, MAC operations with multi-bit inputs and multi-bit weight values can be performed. However, the I/O bottleneck becomes more severe and the efficiency will be lower.

記憶體內運算(In-Memory-Computing (IMC))可用於加速MAC運算,因為IMC可減少在中央處理架構下所需要用的複雜算術邏輯單元 (Arithmetic logic unit,ALU),且提供記憶體內的MAC操作的高並行性(parallelism)。In-Memory-Computing (IMC) can be used to accelerate MAC operations, because IMC can reduce the complex Arithmetic logic unit (ALU) required under the central processing architecture, and provide an in-memory MAC High parallelism of operations.

在進行IMC時,如果能加快乘法操作的背景設定時間的話,對於IMC性能將可有所助益。When doing IMC, it would be helpful for IMC performance to speed up the background setup time of the multiply operation.

根據本案一實例,提出一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括:於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及於一第四階段內進行感應。According to an example of the present application, an operation method of a memory device is proposed, the memory device includes a plurality of memory cells, and the operation method of the memory device includes: in a first stage, selecting an integral signal line for the integral signal line The signal line is pulled up from a first reference voltage to a second reference voltage, a first string selection line is selected to be pulled up from the first reference voltage to a third reference voltage, and a first string selection line is selected A second string of select lines is maintained at the first reference voltage, a first word line is selected to be pulled up from the first reference voltage to a fourth reference voltage, and a second word line is not selected The word line is used to pull up the second word line from the first reference voltage to a fifth reference voltage; in a second stage, sensing is performed; in a third stage, the entire signal line is maintained at the The second reference voltage, the first string selection line is not selected, the first string selection line is pulled down from the third reference voltage to the first reference voltage, and the second string selection line is selected to use the second string selection line Pulling up the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and maintaining the unselected second word line at the fifth reference voltage ; and induction in a fourth stage.

根據本案另一實例,提出一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括:於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第一串選擇線於該第三參考電壓,維持不選的該第二串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及於一第四階段內進行感應。According to another example of the present application, an operation method of a memory device is proposed, the memory device includes a plurality of memory cells, and the operation method of the memory device includes: in a first stage, selecting an integral signal line to connect the The overall signal line is pulled up from a first reference voltage to a second reference voltage, and a first string selection line is selected to pull up the first string selection line from the first reference voltage to a third reference voltage. A second string of select lines is maintained at the first reference voltage, a first word line is selected to be pulled up from the first reference voltage to a fourth reference voltage, and a first word line is not selected Two word lines are used to pull up the second word line from the first reference voltage to a fifth reference voltage; in a second stage, sensing is performed; in a third stage, the entire signal line is maintained at The second reference voltage maintains the selected first string selection line at the third reference voltage, maintains the unselected second string selection line at the first reference voltage, and deselects the first word line with the the first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and the second word line is selected to be pulled down from the fifth reference voltage to the fourth reference voltage; and sensing in a fourth stage.

根據本案又一實例,提出一種記憶體裝置,包括:數個記憶體單元;複數個整體信號線;複數個位元線;複數個串選擇線;複數個字元線,耦接至該些記憶體單元,該些記憶體單元更耦接至該些位元線;複數個第一開關,耦接至該些串選擇線與該些位元線;以及複數個第二開關,耦接至該些整體信號線與該些位元線;其中,於一第一階段內,選擇該些整體信號線之一第一整體信號線以將該第一整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇該些串選擇線之一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選該些串選擇線之一第二串選擇線以維持於該第一參考電壓,選擇該些字元線之一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選該些字元線之一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該第一整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及於一第四階段內進行感應。According to another example of the present application, a memory device is proposed, comprising: a plurality of memory cells; a plurality of integral signal lines; a plurality of bit lines; a plurality of string select lines; and a plurality of word lines, coupled to the memories a body unit, the memory units are further coupled to the bit lines; a plurality of first switches are coupled to the string selection lines and the bit lines; and a plurality of second switches are coupled to the some integral signal lines and the bit lines; wherein, in a first stage, a first integral signal line of the integral signal lines is selected to pull up the first integral signal line from a first reference voltage to a second reference voltage, selects a first string selection line of the string selection lines to pull the first string selection line from the first reference voltage to a third reference voltage, and deselects one of the string selection lines A second string of select lines is maintained at the first reference voltage, and a first word line of the word lines is selected to pull up the first word line from the first reference voltage to a fourth reference voltage , and deselect a second word line of the word lines to pull up the second word line from the first reference voltage to a fifth reference voltage; sense in a second stage; in a In the third stage, the first overall signal line is maintained at the second reference voltage, the first string selection line is not selected, and the first string selection line is pulled down from the third reference voltage to the first reference voltage, selecting the second string select line to pull the second string select line from the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and maintaining The unselected second word line is at the fifth reference voltage; and sensed in a fourth stage.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given and described in detail in conjunction with the accompanying drawings as follows:

本說明書的技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。本揭露之各個實施例分別具有一或多個技術特徵。在可能實施的前提下,本技術領域具有通常知識者可選擇性地實施任一實施例中部分或全部的技術特徵,或者選擇性地將這些實施例中部分或全部的技術特徵加以組合。The technical terms in this specification refer to the common terms in the technical field. If some terms are described or defined in this description, the interpretations of these terms are subject to the descriptions or definitions in this description. Each embodiment of the present disclosure has one or more technical features. Under the premise of possible implementation, those skilled in the art can selectively implement some or all of the technical features in any embodiment, or selectively combine some or all of the technical features in these embodiments.

第1圖顯示根據本案一實施例之記憶體裝置100之電路示意圖。記憶體裝置100例如但不受限於,為三維(3D)記憶體裝置。如第1圖所示,記憶體裝置100包括複數個記憶體區塊(memory block)B0~BQ(Q為正整數)、頁緩衝器電路120、共同源極線(common source line)CSL、複數條整體源極線(global source lines,亦可稱為整體信號線)GSL0~GSLQ、複數條串選擇線(string select line)SSL0~SSLN(N為正整數)、複數條字元線WL0~WLM(M為正整數)、複數條位元線BL0~BLP(P為正整數)。FIG. 1 shows a schematic circuit diagram of a memory device 100 according to an embodiment of the present invention. The memory device 100 is, for example and without limitation, a three-dimensional (3D) memory device. As shown in FIG. 1, the memory device 100 includes a plurality of memory blocks B0-BQ (Q is a positive integer), a page buffer circuit 120, a common source line CSL, a plurality of A global source line (also called a global signal line) GSL0~GSLQ, a plurality of string select lines (string select lines) SSL0~SSLN (N is a positive integer), a plurality of word lines WL0~WLM (M is a positive integer), a plurality of bit lines BL0~BLP (P is a positive integer).

各該些記憶體區塊B0~BQ包括複數個開關SW1、複數個開關SW2與複數個記憶體串SS。各記憶體串SS包括複數個記憶體單元MC。該些記憶體單元MC位於該些字元線WL0~WLM與該些位元線BL0~BLP之交叉處。在同一記憶體區塊內,耦接至同一位元線的該些記憶體單元MC組成一記憶體串SS。Each of the memory blocks B0 ˜ BQ includes a plurality of switches SW1 , a plurality of switches SW2 and a plurality of memory strings SS. Each memory string SS includes a plurality of memory cells MC. The memory cells MC are located at the intersections of the word lines WL0 ˜WLM and the bit lines BL0 ˜BLP. In the same memory block, the memory cells MC coupled to the same bit line form a memory string SS.

該些開關SW1位於該些串選擇線SSL0~SSLN與該些位元線BL0~BLP之交叉處。當選擇一相關記憶體串SS時,相關的開關SW1將被導通。The switches SW1 are located at the intersections of the string select lines SSL0 ˜SSLN and the bit lines BL0 ˜BLP. When an associated memory string SS is selected, the associated switch SW1 will be turned on.

該些開關SW2位於該些整體源極線GSL0~GSLQ與該些位元線BL0~BLP之交叉處。當選擇一相關記憶體區塊時,相關的開關SW2將被導通。The switches SW2 are located at the intersections of the global source lines GSL0 ˜GSLQ and the bit lines BL0 ˜BLP. When an associated memory block is selected, the associated switch SW2 will be turned on.

流經該些記憶體串SS的複數個晶胞電流Id將透過共同源極線CSL而流至後端的相關電路(例如但不受限於,為累積電路),以進行相關操作(例如但不受限於,乘積累加運算(Multiply Accumulate,MAC)、資料讀取、資料寫入等)。A plurality of cell currents Id flowing through the memory strings SS will flow through the common source line CSL to the related circuits (such as, but not limited to, accumulation circuits) at the back end to perform related operations (such as but not limited to). Limited by, multiply and accumulate operation (Multiply Accumulate, MAC), data read, data write, etc.).

頁緩衝器電路120包括複數個頁緩衝器121_0~121_P。各頁緩衝器121_0~121_P耦接至各位元線BL0~BLP。The page buffer circuit 120 includes a plurality of page buffers 121_0 to 121_P. The page buffers 121_0 ˜ 121_P are coupled to the bit lines BL0 ˜BLP.

第2圖顯示根據本案一實施例之記憶體操作方法之示意圖及波形圖。於第2圖中,為方便解釋,將耦接至同一字元線(如WL0)的該些記憶體單元MC畫出,以清楚顯示切換串選擇線時的操作。此外,在進行串選擇線切換時,雖然第2圖是以依序切換(SSL0→SSL1…),但當知本案並不受限於此,串選擇線的切換順序可以有其他順序,此亦在本案精神範圍內。FIG. 2 shows a schematic diagram and a waveform diagram of a memory operation method according to an embodiment of the present application. In FIG. 2, for the convenience of explanation, the memory cells MC coupled to the same word line (eg, WL0) are drawn to clearly show the operation when the string selection line is switched. In addition, when switching the string selection lines, although Figure 2 shows sequential switching (SSL0→SSL1...), it should be understood that the present case is not limited to this, and the switching sequence of the string selection lines may have other sequences, which also within the spirit of the case.

在底下,以記憶體區塊B0(整體源極線GSL0)、串選擇線SSL0、SSL1與字元線WL0、WL1為例做說明,但當知本案並不受限於此。為方便解釋,原本是存取其他記憶體區塊的資料,但在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL0為受選串選擇線,而字元線WL0為受選字元線)。Below, the memory block B0 (the overall source line GSL0 ), the string selection lines SSL0 , SSL1 and the word lines WL0 , WL1 are taken as examples for description, but it should be understood that the present case is not limited to this. For the convenience of explanation, the data of other memory blocks was originally accessed, but after the address is decoded, for example, it is found that the next data is stored in the intersection of the string selection line SSL0 and the word line WL0 in the memory block B0 (ie, string select line SSL0 is the selected string select line, and word line WL0 is the selected word line).

則於階段P21內,選擇整體源極線GSL0由第一參考電壓拉高至第二參考電壓;選擇串選擇線SSL0由第一參考電壓拉高至第三參考電壓;不選(unselect)其他串選擇線SSL1~SSLN以維持於第一參考電壓;選擇字元線WL0由第一參考電壓拉高至第四參考電壓;不選其他字元線WL1~WLM以由第一參考電壓拉高至第五參考電壓(高於第四參考電壓)。藉此,可以選擇區域150內的該些記憶體單元MC(如第1圖與第2圖所示)。Then in stage P21, select the overall source line GSL0 to be pulled up from the first reference voltage to the second reference voltage; select the string selection line SSL0 to be pulled up from the first reference voltage to the third reference voltage; unselect other strings Select the lines SSL1~SSLN to maintain the first reference voltage; select the word line WL0 to be pulled up from the first reference voltage to the fourth reference voltage; do not select other word lines WL1~WLM to be pulled up from the first reference voltage to the fourth reference voltage Five reference voltages (higher than the fourth reference voltage). Thereby, the memory cells MC in the area 150 can be selected (as shown in FIG. 1 and FIG. 2 ).

之後,於階段P22內進行感應。After that, induction is performed in stage P22.

之後,在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL1與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL1為受選串選擇線,而字元線WL0為受選字元線)。亦即,受選串選擇線改變(由串選擇線SSL0變為串選擇線SSL1),但受選字元線未改變(仍為字元線WL0)。Then, after the address is decoded, for example, it is found that the next data is stored in the memory cell MC at the intersection of the string selection line SSL1 and the word line WL0 in the memory block B0 (that is, the string selection line SSL1 is The selected string select line, and the word line WL0 is the selected word line). That is, the selected string select line is changed (from string select line SSL0 to string select line SSL1 ), but the selected word line is not changed (still word line WL0 ).

則於階段P23內,將受選整體源極線GSL0維持於第二參考電壓;不選該串選擇線SSL0由第三參考電壓拉低至第一參考電壓;其他的不選串選擇線SSL2~SSLN維持於第一參考電壓;選擇串選擇線SSL1由第一參考電壓拉高至第三參考電壓;將受選字元線WL0維持於第四參考電壓;將不選字元線WL1~WLM維持於第五參考電壓。藉此,可以選擇區域151內的該些記憶體單元MC(如第1圖與第2圖所示)。Then in stage P23, the selected global source line GSL0 is maintained at the second reference voltage; the string selection line SSL0 is not selected and pulled down from the third reference voltage to the first reference voltage; the other string selection lines SSL2~ are not selected. SSLN is maintained at the first reference voltage; the selection string selection line SSL1 is pulled up from the first reference voltage to the third reference voltage; the selected word line WL0 is maintained at the fourth reference voltage; the unselected word lines WL1~WLM are maintained at the fifth reference voltage. Thereby, the memory cells MC in the area 151 can be selected (as shown in FIG. 1 and FIG. 2 ).

之後,於階段P24內進行感應。After that, induction is performed in stage P24.

同理,在位址解碼後,為存取下一筆資料,要將受選串選擇線改變(例如,由串選擇線SSL1變為串選擇線SSL2),但受選字元線未改變。則於下一階段內,將受選整體源極線GSL0維持於第二參考電壓;不選串選擇線SSL1由第三參考電壓拉低至第一參考電壓;將其他的不選串選擇線SSL0與SSL3~SSLN維持於第一參考電壓;選擇串選擇線SSL2由第一參考電壓拉高至第三參考電壓;將受選字元線WL0維持於第四參考電壓;將其他的不選字元線WL1~WLM維持於第五參考電壓。Similarly, after the address is decoded, to access the next data, the selected string selection line needs to be changed (for example, from the string selection line SSL1 to the string selection line SSL2), but the selected word line is not changed. In the next stage, the selected overall source line GSL0 is maintained at the second reference voltage; the unselected string selection line SSL1 is pulled down from the third reference voltage to the first reference voltage; the other unselected string selection lines SSL0 and SSL3~SSLN are maintained at the first reference voltage; the selection string selection line SSL2 is pulled up from the first reference voltage to the third reference voltage; the selected word line WL0 is maintained at the fourth reference voltage; other unselected words are maintained Lines WL1 ˜WLM are maintained at the fifth reference voltage.

同理,在位址解碼後,為存取下一筆資料,如果要切換至不同的記憶體區塊,則需要再度執行類似於階段P21的操作。Similarly, after the address is decoded, in order to access the next piece of data, if it is necessary to switch to a different memory block, the operation similar to the stage P21 needs to be performed again.

如第2圖所示,該記憶體裝置100更包括累積電路130,耦接至頁緩衝器電路120。As shown in FIG. 2 , the memory device 100 further includes an accumulation circuit 130 coupled to the page buffer circuit 120 .

由該些被選記憶體單元MC所讀出的資料係先輸入至頁緩衝器電路120內,再傳送給累積電路130(本案並不受限於此)進行MAC運算後,得到輸出資料。The data read from the selected memory cells MC are first input into the page buffer circuit 120, and then sent to the accumulation circuit 130 (this case is not limited to this) for MAC operation to obtain output data.

亦即,於第2圖的操作方法中,於初始化階段(P21)後,讀取同一記憶體區塊內的資料下,當需要進行串選擇線之切換時,讓整體源極線的位準維持,讓受選字元線與不選字元線的位準維持,將下一受選串選擇線與目前受選串選擇線之位準進行切換(如階段P23)。如此做法可以縮短記憶體裝置操作之背景設定時間(階段P21~P24可視為是MAC操作中的乘法位元線設定時間與字元線設定時間)。That is, in the operation method of FIG. 2, after the initialization stage (P21), when the data in the same memory block is read, when the string selection line needs to be switched, let the level of the entire source line be Maintain, maintain the level of the selected word line and the unselected word line, and switch the level of the next selected string selection line and the current selected string selection line (eg, stage P23). In this way, the background setting time of the memory device operation can be shortened (the stages P21 to P24 can be regarded as the multiplication bit line setting time and the word line setting time in the MAC operation).

此外,於本案第2圖實施例中,透過切換記憶體區塊與串選擇線,相比於習知技術,可以減少字元線設定時間,進而加速操作。In addition, in the embodiment of FIG. 2 of the present application, by switching the memory block and the string selection line, compared with the prior art, the word line setting time can be reduced, thereby speeding up the operation.

更甚者,於本案第2圖實施例中,如果記憶體裝置具有多個記憶平面(memory plane)且各記憶平面有各自的累積電路的話,則MAC操作的累積與輸出可利用管線化方式來進行。What’s more, in the embodiment of FIG. 2 of this application, if the memory device has multiple memory planes and each memory plane has its own accumulation circuit, the accumulation and output of the MAC operation can be pipelined. conduct.

第3圖顯示根據本案另一實施例之記憶體操作方法之示意圖及波形圖。於第3圖中,為方便解釋,將耦接至同一串選擇線(如SSL0)的該些記憶體單元MC畫出,以清楚顯示切換字元線時的操作。此外,在進行字元線切換時,雖然第3圖是以依序切換(WL0→WL1…),但當知本案並不受限於此,字元線的切換順序可以有其他順序,此亦在本案精神範圍內。FIG. 3 shows a schematic diagram and a waveform diagram of a memory operation method according to another embodiment of the present application. In FIG. 3, for the convenience of explanation, the memory cells MC coupled to the same string of select lines (eg, SSL0) are drawn to clearly show the operation of switching word lines. In addition, when switching word lines, although Figure 3 shows sequential switching (WL0→WL1...), it should be understood that this case is not limited to this, and the switching order of word lines can be in other sequences, which is also within the spirit of the case.

在底下,以記憶體區塊B0(整體源極線GSL0)、串選擇線SSL0、SSL1與字元線WL0、WL1為例做說明,但當知本案並不受限於此。為方便解釋,原本是存取其他記憶體區塊的資料,但在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL0為受選串選擇線,而字元線WL0為受選字元線)。Below, the memory block B0 (the overall source line GSL0 ), the string selection lines SSL0 , SSL1 and the word lines WL0 , WL1 are taken as examples for description, but it should be understood that the present case is not limited to this. For the convenience of explanation, the data of other memory blocks was originally accessed, but after the address is decoded, for example, it is found that the next data is stored in the intersection of the string selection line SSL0 and the word line WL0 in the memory block B0 (ie, string select line SSL0 is the selected string select line, and word line WL0 is the selected word line).

則於階段P31內,選擇該整體源極線GSL0由第一參考電壓拉高至第二參考電壓;選擇該串選擇線SSL0由第一參考電壓拉高至第三參考電壓;不選其他的串選擇線SSL1~SSLN以維持於第一參考電壓;選擇該字元線WL0由第一參考電壓拉高至第四參考電壓;不選其餘字元線WL1~WLM由第一參考電壓拉高至第五參考電壓(高於第四參考電壓)。藉此,可以選擇區域150內的該些記憶體單元MC(如第1圖與第3圖所示)。Then in stage P31, select the overall source line GSL0 to be pulled up from the first reference voltage to the second reference voltage; select the string selection line SSL0 to be pulled up from the first reference voltage to the third reference voltage; do not select other strings The lines SSL1-SSLN are selected to be maintained at the first reference voltage; the word line WL0 is selected to be pulled up from the first reference voltage to the fourth reference voltage; the remaining word lines WL1-WLM are not selected to be pulled up from the first reference voltage to the fourth reference voltage Five reference voltages (higher than the fourth reference voltage). Thereby, the memory cells MC in the area 150 can be selected (as shown in FIG. 1 and FIG. 3 ).

之後,於階段P32內進行感應。After that, induction is performed in stage P32.

之後,在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL1之交叉處的記憶體單元MC內(亦即,串選擇線SSL0仍為受選串選擇線,而字元線WL1為受選字元線)。亦即,受選串選擇線不改變(仍為串選擇線SSL0),但受選字元線改變(由字元線WL0變為WL1)。After that, after the address is decoded, for example, it is found that the next data is stored in the memory cell MC at the intersection of the string selection line SSL0 and the word line WL1 in the memory block B0 (that is, the string selection line SSL0 is still in the memory cell MC). line is selected for the selected string, and word line WL1 is the selected word line). That is, the selected string select line does not change (still the string select line SSL0), but the selected word line changes (from word line WL0 to WL1).

則於階段P33內,將受選整體源極線GSL0維持於第二參考電壓;將受選串選擇線SSL0維持於第三參考電壓;將不選串選擇線SSL1~SSLN維持於第一參考電壓;不選該字元線WL0由第四參考電壓拉高至第五參考電壓;將其他的不選字元線WL2~WLM維持於第四參考電壓;以及,選擇該字元線WL1由第五參考電壓拉低至第四參考電壓。藉此,可以選擇區域160內的該些記憶體單元MC(如第1圖與第3圖所示)。Then in phase P33, the selected global source line GSL0 is maintained at the second reference voltage; the selected string selection line SSL0 is maintained at the third reference voltage; the unselected string selection lines SSL1-SSLN are maintained at the first reference voltage ; unselect the word line WL0 is pulled up from the fourth reference voltage to the fifth reference voltage; maintain the other unselected word lines WL2~WLM at the fourth reference voltage; and select the word line WL1 from the fifth reference voltage The reference voltage is pulled down to the fourth reference voltage. Thereby, the memory cells MC in the area 160 can be selected (as shown in FIG. 1 and FIG. 3 ).

之後,於階段P34內進行感應。After that, induction is performed in stage P34.

同理,在位址解碼後,為存取下一筆資料,要將受選字元線改變(例如,由字元線WL1變為字元線WL2),但受選串選擇線未改變。則於下一階段內,將受選整體源極線GSL0維持於第二參考電壓;將受選串選擇線SSL0維持於第三參考電壓;將不選串選擇線SSL1~SSLN維持於第一參考電壓;未擇該字元線WL1由第四參考電壓拉高至第五參考電壓;其他的不選字元線WL0與WL3~WLM係維持於第五參考電壓;以及,選擇該字元線WL2由第五參考電壓拉低至第四參考電壓。Similarly, after address decoding, in order to access the next data, the selected word line needs to be changed (eg, from word line WL1 to word line WL2), but the selected string selection line is not changed. In the next stage, the selected overall source line GSL0 is maintained at the second reference voltage; the selected string selection line SSL0 is maintained at the third reference voltage; the unselected string selection lines SSL1 ˜SSLN are maintained at the first reference voltage; the unselected word line WL1 is pulled up from the fourth reference voltage to the fifth reference voltage; the other unselected word lines WL0 and WL3~WLM are maintained at the fifth reference voltage; and the word line WL2 is selected Pulled down from the fifth reference voltage to the fourth reference voltage.

由該些被選記憶體單元MC所讀出的資料係先輸入至頁緩衝器電路120內,再傳送給累積電路130(本案並不受限於此)進行MAC運算後,得到輸出資料。The data read from the selected memory cells MC are first input into the page buffer circuit 120, and then sent to the accumulation circuit 130 (this case is not limited to this) for MAC operation to obtain output data.

亦即,於第3圖的操作方法中,於初始化階段(P31)後,讀取同一記憶體區塊內的資料下,當需要進行字元線之切換時,讓整體源極線的位準維持,讓受選串選擇線與不選串選擇線的位準維持,將下一受選字元線與目前受選字元線之位準進行切換(如階段P33)。如此做法可以縮短記憶體裝置操作之背景設定時間(階段P31~P34可視為是MAC操作中的乘法位元線設定時間與字元線設定時間)。That is, in the operation method of FIG. 3, after the initialization stage (P31), when reading the data in the same memory block, when the switching of the word line is required, the level of the entire source line is set. Maintain, maintain the level of the selected string selection line and the unselected string selection line, and switch the level of the next selected word line and the current selected word line (eg, stage P33). In this way, the background setting time of the memory device operation can be shortened (the stages P31 to P34 can be regarded as the multiplication bit line setting time and the word line setting time in the MAC operation).

此外,於本案第3圖實施例中,透過切換記憶體區塊、串選擇線與字元線,相比於習知技術,可以減少字元線設定時間,進而加速操作。In addition, in the embodiment shown in FIG. 3 of the present application, by switching the memory block, the string selection line and the word line, compared with the prior art, the time for setting the word line can be reduced, thereby speeding up the operation.

更甚者,於本案第3圖實施例中,如果記憶體裝置具有多個記憶平面且各記憶平面有各自的累積電路的話,則MAC操作的累積與輸出可利用管線化方式來進行。What's more, in the embodiment of Fig. 3 of this application, if the memory device has multiple memory planes and each memory plane has its own accumulation circuit, the accumulation and output of MAC operations can be performed in a pipelined manner.

此外,於本案其他可能實施例中,第2圖與第3圖之操作方法可以任意組合,其皆在本案精神範圍內。第4圖與第5圖顯示根據本案又一實施例之記憶體裝置之操作方法。In addition, in other possible embodiments of the present application, the operation methods of Fig. 2 and Fig. 3 can be combined arbitrarily, which are all within the scope of the present application. FIG. 4 and FIG. 5 show the operation method of the memory device according to still another embodiment of the present application.

於第4圖中,階段P41~P44相同或相似於第2圖的階段P21~P24,階段P45~P46相同或相似於第3圖的階段P33~P34,故其細節在此省略。In Fig. 4, stages P41-P44 are the same or similar to stages P21-P24 in Fig. 2, and stages P45-P46 are the same or similar to stages P33-P34 in Fig. 3, so their details are omitted here.

亦即,於第4圖中,先進行串選擇線的切換(受選串選擇線由串選擇線SSL0切換成串選擇線SSL1,如階段P43),之後進行字元線的切換(受選字元線由字元線WL0切換成字元線WL1,如階段P45)。That is, in Figure 4, the string selection line is switched first (the selected string selection line is switched from the string selection line SSL0 to the string selection line SSL1, as in stage P43), and then the word line is switched (the selected word The word line is switched from word line WL0 to word line WL1, as in stage P45).

於第5圖中,階段P51~P54相同或相似於第3圖的階段P31~P34,階段P55~P56相同或相似於第2圖的階段P23~P24,故其細節在此省略。In Fig. 5, stages P51-P54 are the same or similar to stages P31-P34 in Fig. 3, and stages P55-P56 are the same or similar to stages P23-P24 in Fig. 2, so their details are omitted here.

亦即,於第5圖中,先進行字元線的切換(受選字元線由字元線WL0切換成字元線WL1,如階段P53),之後進行串選擇線的切換(受選串選擇線由串選擇線SSL0切換成串選擇線SSL1,如階段P55)。That is, in FIG. 5, the switching of the word line is performed first (the selected word line is switched from the word line WL0 to the word line WL1, as in stage P53), and then the string selection line is switched (the selected string The selection line is switched from the string selection line SSL0 to the string selection line SSL1, as in stage P55).

第6圖顯示根據本案又一實施例之記憶體裝置之操作方法。記憶體裝置之操作方法包括:(610)於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;(620)於一第二階段內進行感應;(630)於一第三階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及(640)於一第四階段內進行感應。FIG. 6 shows an operation method of a memory device according to yet another embodiment of the present application. The operation method of the memory device includes: (610) in a first stage, selecting an overall signal line to pull up the overall signal line from a first reference voltage to a second reference voltage, selecting a first string selection line to pull up the first string select line from the first reference voltage to a third reference voltage, deselect a second string select line to maintain the first reference voltage, select a first word line to The first word line is pulled up from the first reference voltage to a fourth reference voltage, and a second word line is not selected to be pulled up from the first reference voltage to a fifth reference voltage; (620) inducting in a second stage; (630) in a third stage, maintaining the overall signal line at the second reference voltage, not selecting the first string selection line The string selection line is pulled down from the third reference voltage to the first reference voltage, the second string selection line is selected to pull the second string selection line up from the first reference voltage to the third reference voltage, and maintained to be The selected first word line is at the fourth reference voltage, and the unselected second word line is maintained at the fifth reference voltage; and (640) sensing in a fourth stage.

第7圖顯示根據本案又一實施例之記憶體裝置之操作方法。該記憶體裝置之操作方法包括:(710)於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;(720)於一第二階段內進行感應;(730)於一第三階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第一串選擇線於該第三參考電壓,維持不選的該第二串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及(740)於一第四階段內進行感應。FIG. 7 shows an operation method of a memory device according to yet another embodiment of the present invention. The operating method of the memory device includes: (710) in a first stage, selecting an overall signal line to pull up the overall signal line from a first reference voltage to a second reference voltage, selecting a first string select lines to pull up the first string of select lines from the first reference voltage to a third reference voltage, deselect a second string of select lines to maintain the first reference voltage, select a first word line to pulling up the first word line from the first reference voltage to a fourth reference voltage, and deselecting a second word line to pull up the second word line from the first reference voltage to a first five reference voltages; (720) inducting in a second stage; (730) in a third stage, maintaining the entire signal line at the second reference voltage, and maintaining the selected first string of select lines at The third reference voltage maintains the unselected second string of select lines at the first reference voltage, and the first word line is unselected and the first word line is pulled up from the fourth reference voltage to the fifth a reference voltage, and selecting the second word line to pull the second word line down from the fifth reference voltage to the fourth reference voltage; and (740) sensing in a fourth stage.

由上述可知,在本案上述實施例中,可以提供較快操作速度(例如但不受限於,較快的MAC操作速度,較快的資料讀取/寫入速度等),因為在進行感應前可以減少背景設定時間(例如可減少MAC操作中的乘法位元線設定時間與字元線設定時間)。It can be seen from the above that in the above-mentioned embodiments of the present application, a faster operation speed (such as, but not limited to, faster MAC operation speed, faster data read/write speed, etc.) can be provided, because before induction is performed Background setup time can be reduced (eg, multiplication bit line setup time and word line setup time in MAC operations can be reduced).

本案上述實施例可應用於三維NAND型快閃記憶體,或者敏感於保持與熱變化的記憶體裝置,例如但不受限於,三維NOR型快閃記憶體,相變(PCM)型快閃記憶體,磁式隨機存取記憶體(magnetic RAM)或電阻式RAM等。The above embodiments of the present case can be applied to three-dimensional NAND-type flash memory, or memory devices sensitive to retention and thermal changes, such as, but not limited to, three-dimensional NOR-type flash memory, phase-change (PCM)-type flash memory Memory, magnetic random access memory (magnetic RAM) or resistive RAM, etc.

本案上述實施例可應用於需要執行多個MAC操作的不同人工智慧(AI)模型,例如但不受限於,全連接層(fully connection layer)、卷積層(convolution layer)、多層感知器 (Multilayer perceptron)、支援向量機器(support vector machine)等。The above embodiments of this case can be applied to different artificial intelligence (AI) models that need to perform multiple MAC operations, such as, but not limited to, a fully connected layer, a convolution layer, a multi-layer perceptron perceptron), support vector machine, etc.

本案上述實施例可應用於加速MAC操作、讀取操作、寫入操作等。The above-mentioned embodiments of this case can be applied to accelerate MAC operations, read operations, write operations, and the like.

本案上述實施例可應用於計算用途(computing usage),亦可應用於資料搜尋、分析用途、聚類分析(Clustering analysis)等。The above-mentioned embodiments of the present application can be applied to computing usage, and can also be applied to data search, analysis usage, clustering analysis, and the like.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

100:記憶體裝置 B0~BQ:記憶體區塊 120:頁緩衝器電路 CSL:共同源極線 GSL0~GSLQ:整體源極線 SSL0~SSLN:串選擇線 WL0~WLM:字元線 BL0~BLP:位元線 SW1、SW2:開關 SS:記憶體串 121_0~121_P:頁緩衝器 Id:電流 150、151、160:區域 130:累積電路 P21~P24、P31~P34、P41~P46、P51~P56:階段 610-640、710-740:步驟100: Memory device B0~BQ: memory block 120: Page Buffer Circuit CSL: Common Source Line GSL0~GSLQ: Overall source line SSL0~SSLN: String selection line WL0~WLM: word line BL0~BLP: bit lines SW1, SW2: switch SS: memory string 121_0~121_P: page buffer Id: current 150, 151, 160: Area 130: Cumulative circuit P21~P24, P31~P34, P41~P46, P51~P56: Stage 610-640, 710-740: Steps

第1圖顯示根據本案一實施例之記憶體裝置之電路示意圖。 第2圖顯示根據本案一實施例之記憶體操作方法之示意圖及波形圖。 第3圖顯示根據本案另一實施例之記憶體操作方法之示意圖及波形圖。 第4圖與第5圖顯示根據本案又一實施例之記憶體裝置之操作方法。 第6圖顯示根據本案又一實施例之記憶體裝置之操作方法。 第7圖顯示根據本案又一實施例之記憶體裝置之操作方法。 FIG. 1 shows a schematic circuit diagram of a memory device according to an embodiment of the present invention. FIG. 2 shows a schematic diagram and a waveform diagram of a memory operation method according to an embodiment of the present application. FIG. 3 shows a schematic diagram and a waveform diagram of a memory operation method according to another embodiment of the present application. FIG. 4 and FIG. 5 show the operation method of the memory device according to still another embodiment of the present application. FIG. 6 shows an operation method of a memory device according to yet another embodiment of the present application. FIG. 7 shows an operation method of a memory device according to yet another embodiment of the present invention.

610-640:步驟 610-640: Procedure

Claims (10)

一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括: 於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓; 於一第二階段內進行感應; 於一第三階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及 於一第四階段內進行感應。 An operating method of a memory device, the memory device comprising a plurality of memory units, the operating method of the memory device comprising: In a first stage, an overall signal line is selected to be pulled up from a first reference voltage to a second reference voltage, and a first string of select lines is selected to be driven from the The first reference voltage is pulled up to a third reference voltage, a second string of select lines is not selected to maintain the first reference voltage, and a first word line is selected to pass the first word line from the first reference pulling up the voltage to a fourth reference voltage, and deselecting a second word line to pull up the second word line from the first reference voltage to a fifth reference voltage; induction in a second stage; In a third stage, the entire signal line is maintained at the second reference voltage, the first string selection line is not selected, and the first string selection line is pulled down from the third reference voltage to the first reference voltage, selecting the second string select line to pull the second string select line from the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and maintaining deselecting the second word line at the fifth reference voltage; and Induction is performed in a fourth stage. 如請求項1所述之記憶體裝置之操作方法,其中,該記憶體裝置更包括一頁緩衝器電路與一累積電路, 該些記憶體單元之至少一受選記憶體單元所讀出的資料係輸入至該頁緩衝器電路內,傳送給該累積電路進行乘積累加運算,得到輸出資料。 The operation method of a memory device according to claim 1, wherein the memory device further comprises a page buffer circuit and an accumulation circuit, The data read from at least one selected memory cell of the memory cells is input into the page buffer circuit, and sent to the accumulating circuit for multiplying and accumulating to obtain output data. 如請求項1所述之記憶體裝置之操作方法,其中,該記憶體裝置包括複數個記憶平面且各該些記憶平面包括一累積電路,則一乘積累加運算的累積與輸出為管線化進行。The operation method of a memory device as claimed in claim 1, wherein the memory device includes a plurality of memory planes and each of the memory planes includes an accumulation circuit, and the accumulation and output of a multiply-accumulate-add operation are pipelined. 如請求項1所述之記憶體裝置之操作方法,更包括: 於一第五階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第二串選擇線於該第三參考電壓,維持不選的該第一串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及 於一第六階段內進行感應。 The operating method of the memory device as claimed in claim 1, further comprising: In a fifth stage, the entire signal line is maintained at the second reference voltage, the selected second string selection line is maintained at the third reference voltage, and the unselected first string selection line is maintained at the first selection line. a reference voltage, the first word line is not selected, the first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and the second word line is selected for the second word line line is pulled down from the fifth reference voltage to the fourth reference voltage; and Induction is performed in a sixth stage. 一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括: 於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓; 於一第二階段內進行感應; 於一第三階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第一串選擇線於該第三參考電壓,維持不選的該第二串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及 於一第四階段內進行感應。 An operating method of a memory device, the memory device comprising a plurality of memory units, the operating method of the memory device comprising: In a first stage, an overall signal line is selected to be pulled up from a first reference voltage to a second reference voltage, and a first string of select lines is selected to be driven from the The first reference voltage is pulled up to a third reference voltage, a second string of select lines is not selected to maintain the first reference voltage, and a first word line is selected to pass the first word line from the first reference pulling up the voltage to a fourth reference voltage, and deselecting a second word line to pull up the second word line from the first reference voltage to a fifth reference voltage; induction in a second stage; In a third stage, the entire signal line is maintained at the second reference voltage, the selected first string of select lines is maintained at the third reference voltage, and the unselected second string of select lines is maintained at the first a reference voltage, the first word line is not selected, the first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and the second word line is selected for the second word line line is pulled down from the fifth reference voltage to the fourth reference voltage; and Induction is performed in a fourth stage. 如請求項5所述之記憶體裝置之操作方法,其中,該記憶體裝置更包括一頁緩衝器電路與一累積電路, 該些記憶體單元之至少一受選記憶體單元所讀出的資料係輸入至該頁緩衝器電路內,傳送給該累積電路進行乘積累加運算,得到輸出資料。 The operating method of a memory device according to claim 5, wherein the memory device further comprises a page buffer circuit and an accumulation circuit, The data read from at least one selected memory cell of the memory cells is input into the page buffer circuit, and sent to the accumulating circuit for multiplying and accumulating to obtain output data. 如請求項5所述之記憶體裝置之操作方法,其中,該記憶體裝置包括複數個記憶平面且各該些記憶平面包括一累積電路,則一乘積累加運算的累積與輸出為管線化進行。The operation method of a memory device as claimed in claim 5, wherein the memory device includes a plurality of memory planes and each of the memory planes includes an accumulation circuit, and the accumulation and output of a multiply-accumulate-add operation are pipelined. 如請求項5所述之記憶體裝置之操作方法,更包括: 於一第五階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第二字元線於該第四參考電壓,以及,維持不選的該第一字元線於該第五參考電壓;以及 於一第六階段內進行感應。 The operating method of the memory device as claimed in claim 5, further comprising: In a fifth stage, the entire signal line is maintained at the second reference voltage, the first string selection line is not selected, and the first string selection line is pulled down from the third reference voltage to the first reference voltage, selecting the second string select line to pull the second string select line from the first reference voltage to the third reference voltage, maintaining the selected second word line at the fourth reference voltage, and maintaining deselecting the first word line at the fifth reference voltage; and Induction is performed in a sixth stage. 一種記憶體裝置,包括: 複數個記憶體單元; 複數個整體信號線; 複數個位元線; 複數個串選擇線; 複數個字元線,耦接至該些記憶體單元,該些記憶體單元更耦接至該些位元線; 複數個第一開關,耦接至該些串選擇線與該些位元線;以及 複數個第二開關,耦接至該些整體信號線與該些位元線; 其中, 於一第一階段內,選擇該些整體信號線之一第一整體信號線以將該第一整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇該些串選擇線之一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選該些串選擇線之一第二串選擇線以維持於該第一參考電壓,選擇該些字元線之一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選該些字元線之一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓; 於一第二階段內進行感應; 於一第三階段內,將該第一整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及 於一第四階段內進行感應。 A memory device comprising: a plurality of memory cells; a plurality of integral signal lines; a plurality of bit lines; a plurality of string selection lines; a plurality of word lines coupled to the memory cells, the memory cells further coupled to the bit lines; a plurality of first switches coupled to the string select lines and the bit lines; and a plurality of second switches, coupled to the overall signal lines and the bit lines; in, In a first stage, a first overall signal line of the overall signal lines is selected to be pulled up from a first reference voltage to a second reference voltage, and one of the string selection lines is selected. A first string selection line to pull up the first string selection line from the first reference voltage to a third reference voltage, and a second string selection line of the string selection lines is deselected to maintain the first reference voltage, selecting a first word line of the word lines to pull up the first word line from the first reference voltage to a fourth reference voltage, and deselecting a second word line of the word lines word line to pull up the second word line from the first reference voltage to a fifth reference voltage; induction in a second stage; In a third stage, the first overall signal line is maintained at the second reference voltage, the first string selection line is not selected, and the first string selection line is pulled down from the third reference voltage to the first reference voltage, selecting the second string select line to pull the second string select line from the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and , maintaining the unselected second word line at the fifth reference voltage; and Induction is performed in a fourth stage. 如請求項9所述之記憶體裝置,其中, 於一第五階段內,將該第一整體信號線維持於該第二參考電壓,維持被選的該第二串選擇線於該第三參考電壓,維持不選的該第一串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及 於一第六階段內進行感應。 The memory device of claim 9, wherein, In a fifth stage, the first overall signal line is maintained at the second reference voltage, the selected second string selection line is maintained at the third reference voltage, and the unselected first string selection line is maintained at For the first reference voltage, the first word line is not selected so that the first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and the second word line is selected for the second the word line is pulled down from the fifth reference voltage to the fourth reference voltage; and Induction is performed in a sixth stage.
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