TWI757962B - Organic light emitting diode display panel - Google Patents

Abstract

An OLED display panel includes a control substrate, a first planar layer, a second planar layer, an insulation pattern layer, and a plurality of light emitting components. The control substrate has a display area and a non-display area. The first planar layer is disposed on the control substrate. The second planar layer disposed on the first planar layer includes a main part and an extension part. The extension part in the non-display area covers the sidewall of the first planar layer. The highest level of the extension part relative to the control substrate is lower than or equal to the level of the main part in the display area relative to the control substrate. The insulation pattern layer on the second planar layer has a plurality of pixel openings in the display area. The light emitting components on the second planar layer are located in the pixel openings respectively.

Description

Organic Light Emitting Diode Display Panel

The present invention relates to a display panel, and more particularly, to an organic light emitting diode (Organic Light Emitting Diode, OLED) display panel.

In the manufacturing process of the existing organic light emitting diode display panel, the film layer in the non-display area, such as the flat layer, sometimes has steep sidewalls, so that the subsequent formation on the film layer (such as the flat layer) The photoresist layer has a thicker thickness near the bottom of the above-mentioned steep sidewalls. In this way, during exposure, part of the photoresist layer near the bottom of the sidewall is not easy to be fully exposed, so that after development, part of the photoresist layer will remain near the bottom of the sidewall of the film layer to affect subsequent processes, resulting in a decrease in yield.

At least one embodiment of the present invention provides an organic light emitting diode display panel, which includes a flat layer with an extension portion, and the use of the extension portion helps to reduce or avoid the residue of the above-mentioned photoresist layer.

Another embodiment of the present invention provides an organic light emitting diode display panel. The passivation layer includes an extension portion, and the extension portion is used to help reduce or avoid the residue of the photoresist layer.

An organic light emitting diode display panel provided by at least one embodiment of the present invention includes a control substrate, a first planarization layer, a second planarization layer, an insulating pattern layer, and a plurality of light emitting elements. The control substrate has a surface, wherein the surface has a display area and a non-display area, and the non-display area surrounds the display area. The first flat layer is disposed on the surface of the control substrate, and the second flat layer is disposed on the first flat layer and includes a main body portion and an extension portion. The main body part is arranged in the display area and the non-display area, and the extension part is located in the non-display area and covers the side surface of the first flat layer. The extension part is connected to the main body part and extends from the main body part along the surface of the control substrate, wherein the maximum height of the extension part relative to the surface of the control substrate is less than or equal to the height of the main body part in the display area relative to the surface of the control substrate. The insulating pattern layer is disposed on the second flat layer and has a plurality of pixel openings, wherein the insulating pattern layer is distributed in the display area and the non-display area, and the pixel openings are located in the display area. The light-emitting elements are disposed on the second flat layer and respectively located in the pixel openings, wherein the light-emitting elements are electrically connected to the control substrate.

In at least one embodiment of the present invention, the above-mentioned organic light emitting diode display panel further includes a conductive layer. The conductive layer is disposed on the insulating pattern layer and the second flat layer and covers the light-emitting elements, wherein the insulating pattern layer further has a first sidewall located in the non-display area, and the conductive layer covers the first sidewall. The main body portion of the second flat layer has a convex portion, and the convex portion has a first top surface, wherein the first side wall is located on the first top surface, and the included angle between the first top surface and the first side wall is greater than 90 degrees. In addition, the above-mentioned included angle may be between 120 degrees and 160 degrees.

An organic light emitting diode display panel provided by another embodiment of the present invention includes a control substrate, a passivation layer, an insulating pattern layer, and a plurality of light emitting elements. The control substrate has a surface, wherein the surface has a display area and a non-display area, and the non-display area surrounds the display area. The passivation layer is disposed on the surface of the control substrate and includes a main body part and an extension part. The main body part is distributed in the display area and the non-display area, and the extension part is located in the non-display area and connected to the main body part, wherein the extension part extends from the main body part along the surface of the control substrate, and the extension part is opposite to the surface of the control substrate. The maximum height is less than or equal to the height of the main body portion within the display area relative to the surface of the control substrate. The insulating pattern layer is disposed on the passivation layer and has a plurality of pixel openings, wherein the insulating pattern layer is distributed in the display area and the non-display area, and the pixel openings are located in the display area. The light-emitting elements are disposed on the passivation layer and respectively located in the pixel openings, wherein the light-emitting elements are electrically connected to the control substrate.

In at least one embodiment of the present invention, the above-mentioned organic light emitting diode display panel further includes a conductive layer. The conductive layer is disposed on the insulating pattern layer and the passivation layer and covers the light-emitting elements, wherein the insulating pattern layer further has a first sidewall located in the non-display area, and the conductive layer covers the first sidewall. The main body portion of the passivation layer has a convex portion, and the convex portion has a first top surface, wherein the first sidewall is located on the first top surface, and the included angle between the first top surface and the first sidewall is greater than 90 degrees. In addition, the above-mentioned included angle may be between 120 degrees and 160 degrees.

In at least one embodiment of the present invention, the main body further has a plurality of annular pads and a plurality of grooves, and each annular pad surrounds one of the grooves and protrudes from the bottom of the groove. Each annular pad has a second top surface, and each pixel opening has a second sidewall, wherein the second sidewalls are respectively located on the second top surfaces, and each light-emitting element covers the second top surface of one of the annular pads.

In at least one embodiment of the present invention, the extension portion has an inclined surface, and the height of the inclined surface relative to the surface of the control substrate decreases from the main body portion toward the direction away from the display area.

In at least one embodiment of the present invention, the main body portion has an upper surface, wherein the upper surface is connected to the inclined surface, and the angle between the inclined surface and the upper surface is between 120 degrees and 160 degrees.

Based on the above, the extension can help reduce the photoresist layer near the bottom of the sidewall of the film layer (for example, near the corner between the side surface of the first planar layer and the surface of the control substrate, or near the bottom of the bevel of the extension). Thickness, so that the photoresist layer can be fully exposed to reduce or avoid the photoresist layer residue after development, which helps to improve the yield.

In the following text, the dimensions (such as length, width, thickness and depth) of elements (such as layers, films, substrates and regions, etc.) in the drawings are exaggerated in unequal proportions in order to clearly present the technical features of the present application. . Therefore, the descriptions and explanations of the following embodiments are not limited to the dimensions and shapes of the elements in the drawings, but should cover the dimensions, shapes and deviations caused by actual manufacturing processes and/or tolerances. For example, the flat surfaces shown in the figures may have rough and/or non-linear features, while the acute angles shown in the figures may be rounded. Therefore, the elements shown in the drawings in this application are mainly for illustration, and are not intended to accurately depict the actual shapes of the elements, nor are they intended to limit the scope of the patent application of this application.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated numerical value and numerical value range, but also cover the understanding of those with ordinary knowledge in the technical field to which the invention belongs. The allowable deviation range of , wherein the deviation range can be determined by the error generated during measurement, for example, the error is caused by the limitations of both the measurement system or the process conditions. Further, "about" can mean within one or more standard deviations of the above-mentioned numerical value, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text may be used to select acceptable ranges or standard deviations based on optical properties, etching properties, mechanical properties or other properties, not a single Standard deviation to apply all of the above optical, etch, mechanical and other properties.

1A is a schematic cross-sectional view of an organic light emitting diode display panel according to at least one embodiment of the present invention. Referring to FIG. 1A , the organic light emitting diode display panel 100 includes a control substrate 150 , wherein the control substrate 150 may include a support substrate 151 , a pixel array layer 152 and an insulating layer 153 . The supporting substrate 151 can be a glass plate or a transparent plastic substrate, wherein the transparent plastic substrate can be made of poly(methyl methacrylate) (PMMA, namely acrylic, Acrylic) or polyimide (Polyimide, PI) made. The support substrate 151 may be a rigid substrate or a flexible substrate. In other words, the organic light emitting diode display panel 100 may be a non-flexible display panel or a flexible display panel.

The pixel array layer 152 and the insulating layer 153 are both disposed on the support substrate 151, wherein the pixel array layer 152 is located between the insulating layer 153 and the support substrate 151, and the insulating layer 153 is, for example, an inorganic barrier passivation layer (Inorganic Barrier Passivation Layer, IOBP Layer). The pixel array layer 152 has a plurality of control elements T15 (only one is shown in FIG. 1A ). Specifically, the pixel array layer 152 is a multi-layer film, and includes multi-layer metal layers, multi-layer insulating layers and semiconductor pattern layers (all not shown). The metal layers, the insulating layers and the semiconductor pattern layers are stacked on each other to form the control elements T15, wherein the control elements T15 may be transistors, such as thin film transistors (Thin Film Transistor, TFT).

The organic light emitting diode display panel 100 further includes a first planarization layer 110 and a second planarization layer 120 . The first planarization layer 110 and the second planarization layer 120 are both insulating layers and may be patterned photoresist layers, wherein the constituent materials of the first planarization layer 110 and the second planarization layer 120 may be the same or different from each other. The first flat layer 110 and the second flat layer 120 are both disposed on the control substrate 150 . The control substrate 150 has a surface 153s. Taking FIG. 1A as an example, the surface 153s may be the upper surface of the insulating layer 153 , wherein the first flat layer 110 is disposed on the surface 153s of the control substrate 150 , and the second flat layer 120 is disposed on the first flat layer 110 .

The surface 153s of the control substrate 150 has a display area A15 and a non-display area N15. The non-display area N15 is located around the display area A15 and surrounds the display area A15. The first flat layer 110 and the second flat layer 120 are not only distributed in the display area A15, but also distributed in the non-display area N15. The second flat layer 120 includes an extension portion 121 and a main body portion 122, wherein the extension portion 121 is connected to the main body portion 122 and extends from the main body portion 122 along the surface 153s. The main body portion 122 is distributed in the display area A15 and the non-display area N15, and the extension portion 121 is located in the non-display area N15, and is distributed only in the non-display area N15, not in the display area A15.

The extension portion 121 covers the side surface 111 of the first flat layer 110 , so the extension portion 121 protrudes from the edge of the first flat layer 110 . In addition, the maximum height H12a of the extension portion 121 relative to the surface 153s of the control substrate 150 is less than or equal to the height H12b of the main body portion 122 in the display area A15 relative to the surface 153s, and the average height of the extension portion 121 relative to the surface 153s is smaller than the display area. Average height of body portion 122 in A15 relative to surface 153s.

The extension portion 121 has an inclined surface 121s. From FIG. 1A , the height of the inclined surface 121s relative to the surface 153s decreases from the main body 122 toward the direction away from the display area A15 , wherein the inclined surface 121s may be a curved surface (as shown in FIG. 1A ) or a flat surface. The main body portion 122 has an upper surface 122u connected to the inclined surface 121s, and the angle A12 between the inclined surface 121s and the upper surface 122u may be between 120 degrees and 160 degrees. However, the angle A12 is not limited to this aforementioned range. In addition, the extension part 121 and the main body part 122 can be formed by exposing and developing the same layer of photoresist, wherein the extension part 121 can be formed by using a photomask with a semi-transparent area, and the light The mask is, for example, a half-tone mask or a gray tone mask.

The organic light emitting diode display panel 100 further includes an insulating pattern layer 130, wherein the insulating pattern layer 130 is disposed on the second flat layer 120 and distributed in the display area A15 and the non-display area N15. The insulating pattern layer 130 has a plurality of pixel openings 131 (only one is shown in FIG. 1A ), wherein the pixel openings 131 are located in the display area A15 , but may not be located in the non-display area N15 . The pixel openings 131 are formed through the insulating pattern layer 130 , so the second flat layer 120 under each pixel opening 131 is not covered by the insulating pattern layer 130 .

The insulating pattern layer 130 further has a first sidewall 133 located in the non-display area N15, and the main body portion 122 of the second flat layer 120 has a convex portion 122p, wherein the convex portion 122p has a first top surface U1, and the first sidewall 133 is located on the first sidewall 122p. on the top U1. The first top surface U1 and the first side wall 133 are not substantially perpendicular, and the included angle A23 between the first top surface U1 and the first side wall 133 is greater than 90 degrees, eg, between 120 degrees and 160 degrees. Since the included angle A23 can be between 120 degrees and 160 degrees, the first side wall 133 can be a gentle slope.

The organic light emitting diode display panel 100 further includes a plurality of light emitting elements 140 , wherein the light emitting elements 140 are disposed on the main body portion 122 of the second flat layer 120 and are respectively located in the pixel openings 131 . In this embodiment, each light-emitting element 140 is an organic light-emitting diode element (OLED Component), and includes a conductive layer 141 and a light-emitting layer 142, wherein the conductive layer 141 may be a metal layer or a transparent conductive layer, and the light-emitting layer 142 includes Multiple organic semiconductor layers. The material of the transparent conductive layer is, for example, a transparent metal oxide such as indium tin oxide (Indium Tin Oxide, ITO) or indium zinc oxide (Indium Zinc Oxide, IZO).

The light-emitting elements 140 are electrically connected to the control substrate 150 . Taking FIG. 1A as an example, the control elements T15 of the control substrate 150 can use a plurality of contact windows C11 to connect the conductive layers 141 of the light-emitting elements 140, so that the light-emitting elements 140 are electrically connected to the control substrate 150, wherein the contact windows C11 can be The material of the contact window C11 can be the same as the material of the conductive layer 141 . The control elements T15 can control the power input to the light-emitting elements 140 to control the light-emitting elements 140 to emit light.

In addition, the organic light emitting diode display panel 100 may further include a conductive layer 160 . The conductive layer 160 is disposed on the insulating pattern layer 130 and the second flat layer 120 and covers the light-emitting elements 140 , the main body 122 of the second flat layer 120 and the insulating pattern layer 130 , wherein the conductive layer 160 is distributed on the display area A15 and the non-contact layer 130 . The display area N15 covers the first sidewall 133 of the insulating pattern layer 130 .

The conductive layer 160 may be a metal layer or the above-mentioned transparent conductive layer, and may be formed by physical vapor deposition (PVD), wherein the physical vapor deposition is, for example, sputtering or evaporation. Since the first sidewall 133 is a gentle slope, the conductive layer 160 formed on the first sidewall 133 is not on a steep slope, so that the conductive layer located at the corner between the first sidewall 133 and the first top surface U1 The 160 is not easy to be broken, thereby helping to improve the yield of the organic light emitting diode display panel 100 .

The conductive layer 160 is electrically connected to the light-emitting elements 140 , and the light-emitting layer 142 is located between the conductive layers 141 and 160 . When the light-emitting element 140 is an organic light-emitting diode, the conductive layers 141 and 160 can be used as the anode and the cathode of the light-emitting element 140, respectively. The pixel array layer 152 can have a common pad 152p, and the conductive layer 160 can be connected to the common pad 152p through at least one contact hole H10, so that the conductive layer 160 is electrically connected to the common pad 152p, wherein the common pad 152p can be grounded. In addition, the organic light emitting diode display panel 100 may further include a capping layer 170 , wherein the capping layer 170 may cover the conductive layer 160 , as shown in FIG. 1A .

In this embodiment, the organic light emitting diode display panel 100 may further include a conductive layer 141a, wherein a portion of the conductive layer 141a is formed on the main body portion 122, and another portion of the conductive layer 141a is formed in the contact hole H10. The conductive layer 141a may cover the convex portion 122p and extend from the convex portion 122p along the upper surface 122u of the main body portion 122 to the sidewall and bottom of the contact hole H10, as shown in FIG. 1A .

The conductive layers 141 and 141a may be formed by lithography and etching from the same conductive layer, wherein the lithography includes exposure and development. In other words, these conductive layers 141 and 141a can be formed by etching the patterned photoresist layer as a mask. In this embodiment, the extension portion 121 covers the side surface 111 of the first flat layer 110 and extends from the main body portion 122 along the surface 153s of the control substrate 150 , so that the extension portion 121 can fill in the side surface 111 and the surface of the control substrate 150 . Corner between 153s.

Therefore, in the process of forming the conductive layers 141 and 141a, the extension portion 121 can reduce the unexposed photoresist layer near the bottom of the side surface 111 (ie, near the corner between the side surface 111 and the surface 153s, or the extension portion 121). (near the bottom of the slope 121s), so that the photoresist layer near the bottom of the side surface 111 can be fully exposed during exposure, so as to reduce or avoid the patterned photoresist layer remaining on the extension 121 after development. In this way, part of the conductive layer on the original extension portion 121 is not covered by the patterned photoresist layer but can be removed by etching, so that the conductive layer 141a does not cover the extension portion 121, thereby reducing or preventing short circuit of the conductive layer 141a.

1B is a partial top view of the organic light emitting diode display panel in FIG. 1A at one of the pixel openings, wherein the organic light emitting diode display panel 100 shown in FIG. 1B omits the conductive layer 160 and the cover layer 170 is shown in the case of the light-emitting layer 142, and FIG. 1A is drawn in cross-section along the line 1A-1A in FIG. 1B. Please refer to FIGS. 1A and 1B , the main body portion 122 further has a plurality of annular pad portions 122r and a plurality of grooves R12 . Each annular pad portion 122r surrounds one of the grooves R12 and protrudes from the bottom of the grooves R12. Each annular pad portion 122r has a second top surface U2, and each pixel opening 131 has a second sidewall 134, wherein the second sidewalls 134 are respectively located on the second top surfaces U2, and each light-emitting element 140 covers one of the annular pads The second top surface U2 of the portion 122r.

The light-emitting layers 142 of the light-emitting elements 140 can be formed by inkjet, so the light-emitting layers 142 can be formed by liquid ink. In the process of forming the light emitting layer 142, the light emitting layer 142 is attached to the second sidewall 134 of the insulating pattern layer 130, so the light emitting layer 142 has a concave top surface 142u, as shown in FIG. 1A. In other words, in the same light-emitting layer 142, the height of the area around the upper surface 142u is higher than the height of the central area of the upper surface 142u.

Since the annular pad portion 122r protrudes from the bottom of the groove R12, and the second sidewall 134 of the pixel opening 131 is located on the second top surface U2, the light emitting layer 142 located at the edge portion will cover the second top surface with a higher height U2, and the light-emitting layer 142 located in the central portion covers the conductive layer 141 located at the bottom of the groove R12 with a lower height. Therefore, even if the height of the area around the upper surface 142u of the light-emitting layer 142 is higher than the height of the central area of the upper surface 142u, the thickness of the light-emitting layer 142 at the edge portion and the thickness at the center portion will not be much different, thereby facilitating the light-emitting element 140. uniform brightness.

In addition, it should be noted that, in this embodiment, the light-emitting layer 142 may be formed by using an inkjet method, but in other embodiments, the light-emitting layer 142 may also be formed by physical vapor deposition (PVD), such as vapor deposition. form. Therefore, the light-emitting layer 142 is not limited to be formed only by the inkjet method.

2 is a schematic cross-sectional view of an organic light emitting diode display panel according to another embodiment of the present invention. Please refer to FIG. 2 , the organic light emitting diode display panel 200 of the embodiment of FIG. 2 is similar to the organic light emitting diode display panel 100 of the embodiment of FIG. 1A . For example, both the organic light emitting diode display panels 100 and 200 have the same function, and also include some same elements, such as the control substrate 150, the insulating pattern layer 130, the light emitting element 140, the conductive layers 160, 141a and the cover layer 170.

The only difference between the organic light emitting diode display panels 100 and 200 is that the organic light emitting diode display panel 200 includes the passivation layer 210 , but does not include the first planarization layer 110 and the second planarization layer 120 , wherein the passivation layer 210 can be formed by exposing and developing a single photoresist layer, and this exposure can be performed using a photomask with semi-transmissive regions, such as a half-tone mask or a grayscale mask. Therefore, the organic light emitting diode display panel 200 shown in FIG. 2 is basically realized by replacing the first planarization layer 110 and the second planarization layer 120 in FIG. 1A with the passivation layer 210 , and the passivation layer 210 is similar to the first planarization layer. layer 110 and the second planarization layer 120 .

Specifically, the insulating pattern layer 130 , the plurality of light-emitting elements 140 and the conductive layer 160 are all disposed on the passivation layer 210 , and the passivation layer 210 is disposed on the surface 153s of the control substrate 150 and includes the main body portion 212 and the connection main body portion 212 extension 211. The main body portion 212 is distributed in the display area A15 and the non-display area N15, and the extension portion 211 is located in the non-display area N15 but not in the display area A15. The extension portion 211 extends from the main body portion 212 along the surface 153s. Secondly, similar to the previous embodiment, the extension portion 211 also has a maximum height H12a, and the main body portion 212 also has a height H12b, wherein the maximum height H12a is less than or equal to the height H12b.

In addition, the extending portion 211 of the passivation layer 210 also has a slope 211s, and the height of the slope 211s relative to the surface 153s decreases from the main body 212 to the direction away from the display area A15, as shown in FIG. 2 . The upper surface 212u of the main body portion 212 is connected to the inclined surface 211s, and the range of the angle A22 between the inclined surface 211s and the upper surface 212u may be the same as the range of the angle A12 in FIG. 1A . In addition, the main body portion 212 of the passivation layer 210 also has a convex portion 122p , a plurality of annular pad portions 122r and a plurality of grooves R12 , so there is a gap between the first top surface U1 of the convex portion 122p and the first sidewall 133 of the insulating pattern layer 130 . An included angle A23 is also formed.

Therefore, the topography of the passivation layer 210 is similar to the topography of the second planarization layer 120 , and the passivation layer 210 shown in FIG. 2 is substantially equivalent to be integrally formed into one in FIG. 1A . The first flat layer 110 and the second flat layer 120 . For example, when the first flat layer 110 and the second flat layer 120 in FIG. 1A are formed by exposing and developing a single photoresist layer, the first flat layer 110 and the second flat layer 120 are integrally formed, that is, the first flat layer 110 and the second flat layer 120 are integrally formed. There is no clearly distinguishable seam or boundary between a flat layer 110 and the second flat layer 120 , and the first flat layer 110 and the second flat layer 120 formed in one piece are substantially as shown in FIG. 2 . the passivation layer 210.

To sum up, by using the above extension, the photoresist layer can be reduced at corners (for example, near the corner between the side surface of the first flat layer and the surface of the control substrate, or near the bottom of the inclined plane of the extension). Thickness, so that the photoresist layer can be fully exposed, reducing or avoiding the residue of the photoresist layer after development, which helps to improve the yield.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the appended patent application.

100, 200: organic light emitting diode display panel 110: First flat layer 111: side surface 120: Second flat layer 121, 211: Extensions 121s, 211s: Bevel 122, 212: main body 122p: convex part 122u, 142u, 212u: upper surface 122r: Ring pad 130: insulating pattern layer 131: Pixel opening 133: First side wall 134: Second side wall 140: Light-emitting element 141, 141a, 160: Conductive layer 142: Light-emitting layer 150: Control substrate 151: Support substrate 152: Pixel Array Layer 152p: common pad 153: Insulation layer 153s: Surface 170: Overlay 210: Passivation layer A12, A22: Angle A15: Display area A23: Angle C11: Contact window H10: Contact hole H12a: Maximum height H12b: height N15: Non-display area R12: groove T15: Control element U1: First top surface U2: Second top surface

1A is a schematic cross-sectional view of an organic light emitting diode display panel according to at least one embodiment of the present invention. FIG. 1B is a partial top view of the organic light emitting diode display panel in FIG. 1A at one of the pixel openings. 2 is a schematic cross-sectional view of an organic light emitting diode display panel according to another embodiment of the present invention.

100: Organic Light Emitting Diode Display Panel

110: First flat layer

111: side surface

120: Second flat layer

121: Extensions

121s: Bevel

122: main body

122p: convex part

122u, 142u: upper surface

122r: Ring pad

130: insulating pattern layer

131: Pixel opening

133: First side wall

134: Second side wall

140: Light-emitting element

141, 141a, 160: Conductive layer

142: Light-emitting layer

150: Control substrate

151: Support substrate

152: Pixel Array Layer

152p: common pad

153: Insulation layer

153s: Surface

170: Overlay

A12: Angle

A15: Display area

A23: Angle

C11: Contact window

H10: Contact hole

H12a: Maximum height

H12b: height

N15: Non-display area

R12: groove

T15: Control element

U1: First top surface

U2: Second top surface

Claims (10)

An organic light emitting diode display panel, comprising: a control substrate having a surface, wherein the surface has a display area and a non-display area, and the non-display area surrounds the display area; a first flat layer disposed on the On the surface of the control substrate: a second flat layer, disposed on the first flat layer, and comprising: a main body part, distributed in the display area and the non-display area, and has a plurality of annular pads and a plurality of recesses a groove, wherein each of the annular pads surrounds one of the grooves and protrudes from the bottom of the groove, each of the annular pads has a second top surface; an extension is located in the non-display area and covers the a side surface of the first flat layer, wherein the extension part is connected to the main body part and extends along the surface from the main body part, wherein the maximum height of the extension part relative to the surface is less than or equal to the the height of the main body relative to the surface; an insulating pattern layer disposed on the second flat layer and having a plurality of pixel openings, wherein the insulating pattern layer is distributed in the display area and the non-display area, and the picture A pixel opening is located in the display area; and a plurality of light-emitting elements are disposed on the second flat layer and are respectively located in the pixel openings, wherein the light-emitting elements are electrically connected to the control substrate, and each light-emitting element covers it a second top surface of the annular pad. The organic light emitting diode display panel according to claim 1, It also includes: a conductive layer disposed on the insulating pattern layer and the second flat layer and covering the light-emitting elements, wherein the insulating pattern layer further has a first sidewall located in the non-display area, and the conductive layer covers the first side wall; the main body portion of the second flat layer has a convex portion, and the convex portion has a first top surface, wherein the first side wall is located on the first top surface, and the first top surface and An included angle between the first side walls is greater than 90 degrees. The organic light emitting diode display panel of claim 2, wherein the included angle is between 120 degrees and 160 degrees. The organic light emitting diode display panel of claim 1, wherein the extension portion has an inclined surface, and a height of the inclined surface relative to the surface decreases from the main body portion toward a direction away from the display area. The organic light emitting diode display panel of claim 4, wherein the main body has an upper surface, the upper surface is connected to the inclined surface, and an angle between the inclined surface and the upper surface is between 120 degrees and 160 degrees between. An organic light emitting diode display panel, comprising: a control substrate having a surface, wherein the surface has a display area and a non-display area, and the non-display area surrounds the display area; a passivation layer disposed on the control substrate on that surface, and includes: a main body, distributed in the display area and the non-display area, and has a plurality of annular pads and a plurality of grooves, and each of the annular pads surrounds one of the grooves and protrudes from the bottom of the groove, Each of the annular pad parts has a second top surface; an extension part is located in the non-display area and connected to the main body part, wherein the extension part extends from the main body part along the surface, and the extension part is opposite to the main body part The maximum height of the surface is less than or equal to the height of the main body in the display area relative to the surface; an insulating pattern layer is disposed on the passivation layer and has a plurality of pixel openings, wherein the insulating pattern layer is distributed in the The display area and the non-display area, the pixel openings are located in the display area, each pixel opening has a second sidewall, wherein the second sidewalls are respectively located on the second top surfaces; and a plurality of light-emitting elements are disposed on the passivation layer and respectively located in the pixel openings, wherein the light-emitting elements are electrically connected to the control substrate, and each of the light-emitting elements covers the second top surface of one of the annular pads. The organic light emitting diode display panel according to claim 6, further comprising: a conductive layer disposed on the insulating pattern layer and the passivation layer and covering the light emitting elements, wherein the insulating pattern layer further has a The first sidewall of the non-display area, and the conductive layer covers the first sidewall; the main body portion of the passivation layer has a convex portion, and the convex portion has a first top surface, wherein the first sidewall is located on the first sidewall On the top surface, and an included angle between the first top surface and the first side wall is greater than 90 degrees. The organic light emitting diode display panel of claim 7, wherein the included angle is between 120 degrees and 160 degrees. The organic light emitting diode display panel of claim 6, wherein the extending portion has an inclined surface, and the height of the inclined surface relative to the surface decreases from the main portion toward the direction away from the display area. The organic light emitting diode display panel of claim 9, wherein the main body has an upper surface, the upper surface is connected to the inclined surface, and an angle between the inclined surface and the upper surface is between 120 degrees and 160 degrees between.

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