TWI756282B - Method for producing a micromechanical component - Google Patents

Abstract

A method for producing a micromechanical component is proposed, wherein the micromechanical component comprises a substrate device and a cap device, wherein, -- in a preparation step, the substrate device and/or the cap device are structured, wherein, -- in a first substep, -- a first pressure and/or a first chemical composition are set and -- the substrate device and the cap device are connected to one another in such a way as to form a first cavity, which is closed with respect to a surrounding space of the micromechanical component, wherein the first pressure prevails and/or the first chemical composition is enclosed in the first cavity, wherein, -- in a second substep, -- a second pressure and/or a second chemical composition are set and -- the substrate device and the cap device are connected to one another in such a way as to form a second cavity, which is closed with respect to the surrounding space of the micromechanical component and with respect to the first cavity, wherein the second pressure prevails and/or the second chemical composition is enclosed in the second cavity.

Description

Methods of manufacturing micromechanical components

The invention is based on a method according to the preamble of claim 1 .

This method is generally known. If a specific internal pressure is required in the cavity of the micromechanical component, or if a gas mixture with a specific chemical composition is desired to be enclosed in the cavity, usually during capping of the micromechanical component or at the substrate wafer The internal pressure or the chemical composition is set during the bonding process with the cover wafer. During capping, for example, the lid is attached to the substrate so that the lid together with the substrate encloses the cavity. By setting the atmosphere or pressure and/or the chemical composition of the gas mixture present in the surrounding space during capping, a specific internal pressure and/or a specific chemical composition can be set in the cavity in this way.

Micromechanical components such as, for example, inertial sensors are preferably hermetically sealed by the wafer bonding process in order to protect the sensors from environmental influences (dust, moisture, gases) or intentionally enclose certain gases or vacuums. Examples of methods for hermetic sealing of micromachined inertial sensors at wafer level are: eutectic bonding, glass frit bonding, and thermocompression bonding. To date, defined pressures (e.g. vacuum of about 1 mbar, average pressures of about a few hundred mbar, or positive pressures up to 2000 mbar) or specific gases (e.g. , nitrogen or neon). In general, set a low internal pressure (high quality system) in the case of the rotation rate sensor, and in the case of the acceleration sensor A high internal pressure (high damping) is set down, either by venting during the wafer bonding process or by deliberately feeding in gas.

It is an object of the present invention to provide a method for fabricating a micromechanical component having a first cavity and a second cavity in which the first cavity can be A first pressure can be set in the second cavity, and a second pressure can be set in the second cavity.

This objective is achieved by providing, - in a second sub-step, - setting a second pressure and/or a second chemical composition, and - the substrate device and the lid device to form a second cavity are connected to each other in such a way that they are closed with respect to the surrounding space of the micromechanical component and with respect to the first cavity (in detail, hermetically closed), wherein the second pressure prevails, and/or the second chemical composition The object is enclosed in the second cavity.

by providing the substrate device and the lid device connected to each other in a first sub-step and in a second sub-step, wherein the first cavity is formed in the first sub-step and the second cavity is formed in the second sub-step In a sub-step, advantageously possibly during a phased bonding process, the first pressure can first be set in the first cavity, and the first pressure can be subsequently set in the second cavity during the same bonding process. second pressure.

Combining the first sub-step with the second sub-step in a certain phase process makes it advantageously possible to dispense with two complete joining processes, and thus significantly reduce the process time compared to the prior art. Furthermore, in particular due to the combination of the fabrication step with the first sub-step and the second sub-step, it is advantageously possible to achieve a smaller wafer size ("footprint") and thus reduce each micromechanical The material cost of the components and the number of micromechanical components per wafer are increased, whereby the micromechanical components or the wafer containing the micromechanical components can be produced at a lower cost.

In detail, it is advantageously possible with the present invention to set two pressure values at wafer level in one wafer, consisting of an acceleration sensor and a rotational rate sensor. In particular, it is here possible to set different internal pressures in the wafer at the wafer level within one process as a result of the use of deliberately set surface topography and as a result of the combination of the mechanisms of these wafer bonding methods.

Therefore, a method for fabricating a micromechanical component having a first cavity and a second cavity in which the a pressure, and a second pressure can be set in the second cavity.

In connection with the present invention, the term "micromechanical member" should be understood as a term meant to cover both micromechanical and microelectromechanical members.

The invention is preferably intended to be used for the production of a micromechanical component with two cavities or for such a micromechanical component with two cavities. However, the present invention, for example, is also intended for use with a micromechanical component having three cavities or having more than three cavities (ie, four, five, six, or more than six cavities).

Advantageous refinements and developments of the invention can be derived from the description of the appendices and referenced figures.

According to a preferred development, it is known that the first pressure is higher than the second pressure, wherein the first sensor unit for measuring the acceleration is arranged in the first cavity, and the first sensor unit for measuring the rotation rate is Two sensor units are arranged in the second cavity. According to a preferred development, knowing that the first pressure is lower than the second pressure, a first sensor unit for measuring the rotation rate is disposed in the first cavity and a second sensor unit for measuring the acceleration The detector unit is arranged in the second cavity. Thus, advantageously, a mechanically robust micromechanical component for rotational rate measurement and acceleration measurement is provided, which has optimal operating conditions for both the first sensor unit and the second sensor unit.

According to a preferred development, it is known that the substrate device includes a first substrate frame and a second substrate frame, wherein the first substrate frame and the second substrate frame are formed in a manner such that before the first sub-step, they are perpendicular to the The extent of the first substrate frame of the main plane of the substrate area of the substrate device is larger than the extent of the second substrate frame perpendicular to the main plane of the substrate area. In this way, it is advantageously made possible that, by means of the formation of the first substrate frame and the second substrate frame, the first sub-step of the closure (in detail, the hermetic closure) can be formed in the first sub-step A cavity, and the closed (specifically, hermetically closed) second cavity can be formed in the second sub-step.

According to a preferred development, it is known that the cover device includes a first cover frame and a second cover frame, wherein the first cover frame and the second cover frame are formed in such a way that before the first sub-step, perpendicular to the The extent of the first cover frame of the main plane of the cover area of the cover device is larger than the area of the second cover frame perpendicular to the main plane of the cover area. In this way, by means of the formation of the first cover frame and the second cover frame, the closed (in detail, hermetically closed) first cavity can be formed in the first sub-step, and It becomes possible to form the closed (in detail, hermetically closed) second cavity in this second sub-step.

According to a preferred development, it is known that the substrate device comprises a first substrate frame and a second substrate frame, wherein prior to the first sub-step, the second substrate frame is constructed in a manner such that during the first sub-step An access opening is formed between the second cavity and the surrounding space. In this way, it is advantageously made possible that, by virtue of the construction of the second substrate frame, even in the case where the same extent of the first substrate frame and the second substrate frame is perpendicular to the main plane of the substrate extent, The second cavity is not yet closed (in detail, not yet hermetically closed) in the first sub-step, and the second cavity may be closed (in detail, hermetically closed) in the second sub-step.

According to a preferred development, it is known that the cover device comprises a first cover frame and a second cover frame, wherein prior to the first sub-step, the second cover frame is constructed in a manner such that during the first sub-step An access opening is formed between the second cavity and the surrounding space. In this way, it is advantageously made possible that, by virtue of this construction of the second cover frame, even in the case where the same extent of the first cover frame and the second cover frame is perpendicular to the main plane of the cover extent, The second cavity is not yet closed (in detail, not yet hermetically closed) in the first sub-step, and the second cavity may be closed (in detail, hermetically closed) in the second sub-step.

According to a preferred development, it is known that the first sub-step and the second sub-step are performed in one bonding process. In particular, in this way it is advantageously possible to dispense with two complete joining processes.

According to a preferred development, it is known that the substrate device and the cover device are connected to each other in the first sub-step in such a way that the first substrate frame and/or the first cover frame enclose the closure (in detail , hermetically closed) first cavity, wherein the substrate device and the cover device are connected to each other in the second sub-step in such a way that the second substrate frame and/or the second cover frame enclose the closure (in detail, hermetically closed) second cavity. In this way, it is advantageously made possible that, by means of the first substrate frame and/or the first cover frame, the first pressure can be set in the first cavity, and by means of the second substrate frame And/or the second cover frame, the second pressure can be set in the second cavity.

According to a preferred development, it is known that in the first substep, the substrate component and the cover component are connected to each other by means of thermocompression bonding. According to a preferred development, it is known that in this first substep, the substrate component and the cover component are connected to each other by means of sealing glass bonding. According to a preferred development, it is known that in the first sub-step, the substrate device and the lid device are connected to each other by means of eutectic bonding. According to a preferred development, it is known that in the second sub-step, the substrate device and the lid device are connected to each other by means of eutectic bonding. According to a preferred development, it is known that in the second sub-step, the substrate component and the cover component are connected to each other by means of sealing glass bonding. In this way, advantageous possibilities for integrating different joining mechanisms into one joining process are provided.

1: Micromechanical components

3: Substrate device

5: Cover device

7: Surrounding space

11: The first cavity

12: Second cavity

30: substrate wafer

31: The first substrate frame

32: Second substrate frame

40: First access opening/gap or void

41: Gap or void

42: Gap or void

43: Gap or void

50: Cover wafer

51: The first cover frame

52: Second cover frame

53: Sealing lip

54: Cutting Road

55: Structure

100: The main plane of the substrate range

101: Main plane of cover range

131: The first aluminum frame

151: oxide frame/silicon oxide narrow frame

151': Silicon oxide narrow frame

200: Preparation steps

201: First substep

202: Second substep

231: Second aluminum frame

251: germanium/germanium frame/germanium bonding frame

300: Flat

FIG. 1 shows a schematic representation of a method of manufacturing a micromechanical component according to an embodiment of the invention, given by way of example.

2 to 7 show, in schematic representations, the micromechanical components given by way of example during a method according to an embodiment of the invention.

In the various figures, the same parts are always provided with the same designations and are therefore generally referenced or mentioned only once in each case.

In FIG. 1 a schematic representation of a method for producing a micromechanical component 1 according to a specific example of the invention is shown, given by way of example. Furthermore, in FIGS. 2 to 7 there are schematic representations of the micromechanical component 1 during a method according to a specific example of the invention, given by way of example.

According to the invention, it is proposed that the micromechanical component 1 comprises a substrate device 3 and a cover device 5 . Preferably, the substrate device 3 extends along the main plane 100 of the substrate area, and the cover device 5 extends along the main plane 101 of the cover area. Furthermore, the substrate device 3 preferably includes at least a portion of the substrate wafer 30 , and the lid device 5 preferably includes at least a portion of the lid wafer 50 . Preferably, the substrate wafer 30 includes a functional wafer. Moreover, the substrate device 3 preferably includes a first substrate frame 31 and a second substrate frame 32 , and the cover device 5 preferably includes a first cover frame 51 and a second cover frame 52 . In addition, the first substrate frame 31 includes at least a portion of the structural layer disposed on the substrate wafer 30 , and the second substrate frame 32 includes at least another portion of the structural layer disposed on the substrate wafer 30 . In addition, the first cover frame 51 includes at least a portion of the structure layer disposed on the cover wafer 50 , and the second cover frame 52 includes at least another portion of the structure layer disposed on the cover wafer 50 .

Preferably, the first substrate frame 31 includes aluminum. In addition, the second substrate frame 32 preferably includes aluminum. Moreover, the first cover frame 51 preferably contains germanium. In addition, the second cover frame 52 preferably includes germanium. Particularly preferably, the first cover frame 51 includes germanium and silicon oxide. In addition, the base wafer 30 preferably includes a silicon wafer and/or the lid wafer 50 preferably includes another silicon wafer.

Furthermore, according to the present invention, it is known that: -- in the preparation step 200, the substrate device 3 and/or the cover device 5 are constructed. It is preferably provided here, by means of over portions of the substrate wafer 30, and/or over portions of the cover wafer 50, and/or over the first substrate frame 31 and/or the second substrate frame 32 and/or the first substrate frame 31 and/or the second substrate frame 32 and/or the A cover frame 51 and/or a second cover frame 52 are deposited and/or grown on layers not yet constructed and other layers are constructed to construct portions of the base wafer 30 and/or portions of the cover wafer 50 and/or the first The respective layers of the substrate frame 31 and/or the second substrate frame 32 and/or the first cover frame 51 and/or the second cover frame 52 are preferably during the fabrication step 200 . Furthermore, it is preferably provided that the substrate device 3 is constructed by means of surface micromachining.

Furthermore, the cover device 5 is preferably constructed by means of body micromachining.

Preferably, before the first sub-step 201, in detail in the preparation step 200, the first substrate frame 31 and the second substrate frame 32 are formed in a manner, so that before the first sub-step 201, it is particularly preferable Also before the second sub-step 202, the extent of the first substrate frame 31 perpendicular to the main plane 100 of the substrate area of the substrate device 3 is larger than the extent of the second substrate frame 32 perpendicular to the main plane 100 of the substrate area. In addition, before the first sub-step 201 , in detail in the preparation step 200 , preferably the first cover frame 51 and the second cover frame 52 are formed in a manner, so that before the first sub-step 201 , it is particularly preferred Also before the second sub-step 202, the extent of the first cover frame 51 perpendicular to the main plane 101 of the cover area of the cover device 5 is larger than the extent of the second cover frame 52 perpendicular to the main plane 101 of the cover area.

Furthermore, after the preparation step 200 and before the first sub-step 201 , the substrate device 3 and the lid device 5 are preferably arranged with respect to each other in such a way that the substrate-scope main plane 100 and the lid-scope main plane 101 are arranged parallel to each other. Here it is preferably provided that the substrate device 3 and the cover device 5 are arranged with respect to each other in such a way that the first substrate frame 31 and the second substrate frame 32 face the cover device 5 . Furthermore, the substrate device 3 and the cover device 5 are preferably arranged with respect to each other in such a way that the first cover frame 51 and the second cover frame 52 face the substrate device 3 .

Furthermore, according to the present invention, -- in the first sub-step 201, preferably performed after the preparation step 200, -- setting the first pressure and/or the first chemical composition, and -- the substrate device 3 and the lid device 5 are connected to each other in such a way as to form a first cavity 11, which is closed with respect to the surrounding space 7 of the micromechanical component 1 (in particular, hermetic closure), wherein the first pressure prevails and/or the first chemical composition is enclosed in in the first cavity 11 . Preferably, the first chemical composition contains nitrogen. Furthermore, the first chemical composition preferably contains nitrogen in a proportion of at least 90% by volume (especially preferably at least 99%, most preferably at least 99.9%). In addition, the first chemical composition preferably includes neon. Furthermore, the first chemical composition preferably contains neon in a proportion of at least 90% by volume (especially preferably at least 99%, most preferably at least 99.9%).

It is preferably provided, especially preferably before the setting of the first pressure and/or the first chemical composition, that the substrate device 3 and the cover device 5 are arranged at a distance from each other. Furthermore, the substrate device 3 and the cover device 5 are preferably arranged with respect to each other in such a way that the protrusions in the first substrate frame 31 on the substrate-wide main plane 100 and the protrusions in the first cover frame 51 on the substrate-wide main plane 100 The protrusions overlap. Furthermore, the substrate device 3 and the cover device 5 are preferably arranged with respect to each other in such a way that the protrusions in the second substrate frame 32 on the substrate-wide main plane 100 and the protrusions in the second cover frame 52 on the substrate-wide main plane 100 The protrusions overlap. The substrate device 3 and the lid device 5 configured in the manner of an illustrative embodiment shown by way of example are shown in FIGS. 3 to 6 .

Once the substrate device 3 and the lid device 5 have been configured, eg as shown in FIGS. 3-6 , the first pressure and/or the first chemical composition is set. Preferably, the first pressure and/or the first chemical composition is set in the surrounding space 7, and thus also spatially dominates between the substrate device 3 and the lid device 5, in particular not yet closed (details). In other words, the first cavity 11 which is not yet hermetically closed) and in the second cavity 12 which is not yet closed (in detail, not yet hermetically closed).

Preferably according to the invention, it is especially preferred to reduce the distance between the main plane 100 of the substrate area and the main plane 101 of the cover area during and/or after setting the first pressure and/or the first chemical composition during the moving step or the distance between the substrate device 3 and the cover device 5 . In other words, the substrate device 3 moves vertically relative to the substrate extent main plane 100 and in the direction of the cover device 5 , and/or the cover device 5 moves vertically relative to the cover extent main plane 101 and in the direction of the substrate device 3 .

In the illustrative embodiment shown by means of the example in FIGS. 3 , 4 and 6 , preferably, the first substrate frame 31 and the first cover frame 51 first come into contact with each other by the moving steps performed.

Preferably, in the illustrative embodiment shown by means of the example in FIG. 7, not only the first substrate frame 31 and the first cover frame 51, but also the second substrate frame 32 and the second cover frame 52 are preferably The moving steps performed are in contact with each other.

Furthermore, before the first sub-step 201 , in detail in the preparation step 200 , the second substrate frame 32 is structured and formed in such a way that during the first sub-step 201 , in the second, not yet hermetically closed, in detail A first access opening 40 is formed between the cavity 12 and the surrounding space 7 . Furthermore, prior to the first sub-step 201 , in detail in the fabrication step 200 , the second cover frame 52 is constructed and formed in such a way that during the first sub-step 201 , in detail, it is not yet closed (detailed in In other words, an access opening or another access opening is formed between the second cavity 12 that has not been hermetically closed) and the surrounding space 7 . In other words, the micromechanical component 1 comprises, after the first sub-step 201 and before the second sub-step 202: a first cavity 11, which is closed (in detail, hermetically closed) with respect to the surrounding space 7; and a second cavity The body 12 , which is not closed (in detail, not hermetically closed) with respect to the surrounding space 7 .

Moreover, according to the present invention, it is known that - in the second sub-step 202, preferably performed after the first sub-step 201, - setting the second pressure and/or the second chemical composition, and - the substrate device 3 and the cover device 5 are connected to each other in a manner to form a second cavity 12, which is closed with respect to the surrounding space 7 of the micromechanical component 1 and with respect to the first cavity 11 (in detail, hermetically closed), wherein the The two pressures dominate, and/or the second chemical composition is enclosed in the second cavity 12 .

Preferably, the second pressure and/or the second chemical composition is set in the surrounding space 7, and thus also spatially dominates between the substrate device 3 and the lid device 5, in particular not yet closed (details). In other words, in the second cavity 12 that has not been hermetically closed).

Preferably according to the present invention, especially preferably during and/or after setting the second pressure and/or the second chemical composition, the difference between the substrate area main plane 100 and the cover area main plane 101 is further reduced in another moving step. distance between. In other words, the substrate device 3 moves vertically relative to the substrate-wide main plane 100 and in the direction of the cover device 5 , and/or the cover device 5 moves vertically relative to the substrate-wide main plane 100 and in the direction of the substrate device 3 . The substrate device 3 and the cover device 5 are here preferably moved in such a way that the substrate-scope main plane 100 and the lid-scope main plane 101 are preferably arranged parallel to each other at each point in time. Preferably, in the illustrative embodiments shown by means of the examples in FIGS. 3 , 4 , 6 and 7 , the first substrate frame 31 and/or the first cover frame 51 are preferably plastically deformed, and /or by means of mechanical pressure and/or temperature into a polymerized liquid state. Preferably, not only the first substrate frame 31 and/or the first cover frame 51 but also the second substrate frame 32 and/or the second cover frame 52 are relatively small in the illustrative embodiment shown by means of the example in FIG. 7 . It is preferably plastically deformed and/or converted to a polymeric liquid state by means of mechanical pressure and/or temperature.

In the illustrative embodiment shown by means of the example in FIGS. 3 , 4 and 6 , the second substrate frame 32 and the second cover frame 52 are preferably in contact with each other by another movement step performed.

Preferably, according to the invention, it is known that during another moving step, the first cavity 11 remains closed (in detail, hermetically closed) with respect to the surrounding space 7 of the micromechanical component 1 . Furthermore, the volume of the first cavity 11 is preferably reduced by a maximum of 10%, particularly preferably by a maximum of 1%, and most preferably by a maximum of 0.1% during the second sub-step 202 . Furthermore, the first pressure after the second sub-step 202 is preferably a maximum of 10% higher than the first pressure before the second sub-step 202, particularly preferably a maximum of 1%, and most preferably a maximum of 0.1%. Furthermore, the first chemical composition preferably remains substantially constant during the second sub-step 202 .

Furthermore, the substrate device 3 and the cover device 5 are preferably connected to each other in the first sub-step 201 in such a way that the first substrate frame 31 and/or the first cover frame 51 are enclosed (in detail, hermetically closed) The first cavity 11 in which the substrate device 3 and the lid device 5 are connected to each other in the second sub-step 202 in such a way that the second substrate frame 32 and/or the second lid frame 52 are enclosed (in detail, hermetically sealed) Sexually closed) second cavity 12.

According to the present invention, it is preferably provided that, in the first sub-step 201 and the second sub-step 202, the substrate device 3 and the lid device 5 are connected to each other by bonding. Furthermore, in a first sub-step 201, the substrate device 3 and the lid device 5 are connected to each other, preferably by means of thermocompression bonding. Furthermore, in the first sub-step 201, the substrate device 3 and the cover device 5 are preferably connected to each other by means of sealing glass bonding. Furthermore, in a first sub-step 201, the substrate device 3 and the lid device 5 are preferably connected to each other by means of eutectic bonding. Furthermore, in the second sub-step 202, the substrate device 3 and the lid device 5 are connected to each other, preferably by means of eutectic bonding. Furthermore, in the second sub-step 202, the substrate device 3 and the cover device 5 are preferably connected to each other by means of sealing glass bonding.

Furthermore, the second sub-step 202 is preferably performed in such a way that, after the second sub-step 202, the extent of the first substrate frame 31 perpendicular to the main plane 100 of the substrate extent of the substrate device 3 is substantially equal to the extent perpendicular to the extent of the substrate The extent of the second substrate frame 32 of the main plane 100 . Furthermore, the second sub-step 202 is preferably performed in such a way that the extent of the first cover frame 51 perpendicular to the main plane 101 of the cover area of the cover device 5 is equal to the extent of the second cover frame 52 perpendicular to the main plane 101 of the cover area Scope. Furthermore, the second sub-step 202 is preferably performed in such a way that after the second sub-step 202, the extent of the first substrate frame 31 and the first cover frame 51 perpendicular to the main plane 100 of the extent of the substrate is substantially equal to the extent perpendicular to the The area of the second substrate frame 32 and the second cover frame 52 of the main plane 100 of the substrate area.

Preferably, in the case of the illustrative embodiment shown in FIGS. 3 to 5 , the substrate device 3 and the lid device 5 are connected to each other by means of thermocompression in a first sub-step 201 , and in a second sub-step 202 are connected to each other by means of eutectic bonding.

In the case of the illustrative embodiment shown in Figure 3, prior to the first sub-step 201, preferably in the fabrication step 200, the bonding frame surface morphology is produced under germanium 251 with the oxide frame 151, preferably The ground is produced with a silicon oxide frame. In other words, the first cover frame 51 includes the oxide frame 151 , wherein the oxide frame 151 preferably includes silicon oxide, and the germanium frame 251 or the germanium bonding frame 251 . Preferably, in the preparation step 200, first, an oxide frame 151 is deposited or grown and structured (especially preferably pre-structured) on a portion of the cover wafer 50, and then a germanium frame 251 is deposited on the oxide frame 151 superior. As shown by means of the example in FIG. 3 , the wafer intended to enclose the first pressure or enclose the first cavity 11 after the first sub-step 201 and after the second sub-step 202 is preferably in the extent parallel to the substrate The main plane 100 is surrounded by one (or more) silicon oxide narrow frames 151, 151' on the lid edge, wherein the one (or more) silicon oxide narrow frames 151, 151' is located on the germanium or Below the germanium bonding frame 251, and the height of the bonding frame or the germanium bonding frame 251 is increased. In the first part of the bonding process or in the first sub-step 201, the wafers are sealed by thermocompression bonding at a first pressure and a temperature below the eutectic temperature. On the other hand, the bonding frame intended to enclose the second pressure or the wafers enclosing the second cavity 12 does not increase in bonding frame height so that it is after the first wafer is sealed or at the first sub-surface. Still open after step 201. After the pressure in the surrounding space 7 or the bonding chamber has changed, it is only sealed with the second pressure in the second part of the bonding process or in the second sub-step 202 . The second seal is performed above the eutectic temperature, resulting in eutectic bonding of all wafers including those that were first sealed. It is especially preferred that nitrogen at higher pressures is initially enclosed by thermocompression bonding (preferably in the first sub-step 201), and then when the bonding process continues under vacuum (preferably in the second sub-step 202), the rotation rate sensor is eutectic bonded, wherein the acceleration sensor also undergoes eutectic bonding reaction.

Furthermore, in the case of the illustrative embodiment shown by means of the example in FIG. 4 , prior to the first sub-step 201 , preferably in a preparation step 200 , a joint frame topology is produced in which the aluminium is thickened. Preferably, the principle of the illustrative embodiment shown by means of the example in FIG. 4 corresponds substantially to the principle of the illustrative embodiment shown by means of the example in FIG. In the case of the illustrative embodiment, a sensor-side aluminum bonding frame is formed, the height of which is increased by a narrow frame, which is also composed of aluminum and is located below the bonding frame or below the aluminum bonding frame. In other words, preferably before the first sub-step 201 , the first aluminum layer is deposited and constructed on the substrate wafer 30 in a manner to form the first aluminum frame 131 on the substrate wafer 30 , and then the second aluminum layer is deposited on the substrate wafer 30 . The method of forming the second aluminum frame 231 on the substrate wafer 30 and the first aluminum frame 131 is deposited and constructed on the substrate wafer 30 and the constructed first aluminum layer or on the first aluminum frame 131 . In other words, the first substrate frame 31 shown by means of the example in FIG. 4 includes a first aluminum frame 131 and a second aluminum frame 231 . The wafer with increased height of the bonding frame or the first cavity 11 is sealed with a first pressure before a pressure change (preferably from a first pressure to a second pressure) is performed in the bonding chamber or surrounding space 7, and the first cavity 11 is sealed with a first pressure. The second pressure seals the other wafers whose height of the frame is not increased or seals the second cavity 12 with the second pressure.

Furthermore, in the case of the illustrative embodiment shown by means of the example in FIG. 5 , before the first sub-step 201 , preferably in the preparation step 200 , a sealing lip is formed in the scribe line. Here, it is preferably provided that the substrate means 3 and/or the lid means 5 are constructed in such a way that the wafer which first seals or encloses the first cavity 11 is surrounded by a sealing lip 53 which is in the dicing lane 54 middle. In other words, the substrate device 3 and/or the lid device 5 are preferably constructed in such a way that the substrate device 3 and/or the lid device 5 comprise a sealing lip 53 , wherein the sealing lip 53 is preferably arranged in the first cavity 11 and the second cavity 12 . Furthermore, on the sensor side, the scribe lines 54 around the bonding frame are filled with aluminum on the lid side with the silicon oxide structure. Preferably, the sealing lip 53 comprises silicon oxide or silicon oxide structures or scribe line oxide. Furthermore, the substrate device 3 is preferably constructed in such a way that the substrate device 3 includes structures 55 in the scribe lines 54, wherein the structures 55 preferably comprise aluminum or scribe lines aluminum. During bonding or in the first sub-step 201, the wafer or the first cavity is sealed with the sealing lip by pressing the sealing lip 53 into the structure 55 and enclosing the first pressure in the first cavity 11 11. After the pressure is changed or after the second pressure and/or the second chemical composition has been set, the other wafers are sealed with the second pressure or the second cavity 12 is sealed with the second pressure, and all the wafers or the first cavity 11 and The second cavity 12 is tightly sealed by eutectic bonding (in detail, hermetically sealed), preferably in the second sub-step 202 .

In the case of the illustrative embodiment shown by means of the example in FIG. 6 , prior to the first sub-step 201 , preferably in a preparation step 200 , the surface morphology is produced in the aluminum bonding frame. In other words, preferably before the first sub-step 201 , the first aluminum layer is deposited and constructed on the substrate wafer 30 in a manner to form the first aluminum frame 131 on the substrate wafer 30 , and then the second aluminum layer is deposited on the substrate wafer 30 . The method of forming the second aluminum frame 231 on the substrate wafer 30 and the first aluminum frame 131 is deposited and constructed on the substrate wafer 30 and the constructed first aluminum layer or on the first aluminum frame 131 . Preferably, before the first sub-step 201, an aluminum frame is applied on the sensor edge or on the substrate wafer, the aluminum frame preferably enclosing the configuration in a plane preferably parallel to the main plane 100 of the substrate area The micromechanical structure on the substrate wafer 30 and in the first cavity 11 is opposite to the cover edge sealing glass bonding frame or opposite to the first cover frame 51 and the second cover frame 52 , wherein the first cover frame 51 and the second cover frame 51 are opposite to each other. The two cover frames 52 preferably respectively comprise sealing glass joint frames. In the case where the wafer is first sealed or enclosed with the first cavity 11 by the first pressure, the height of the first substrate frame 31 (which preferably includes an aluminum frame) is increased compared to the second substrate frame 32 . This variant is joined with sealing glass in a two-stage process. In other words, the substrate device 3 and the cover device 5 are connected to each other by sealing glass bonding in sub-step 201 and in a second sub-step 202 . Here, the first cover frame 51 (which includes the sealing glass) and the second cover frame 52 (which includes the sealing glass) are preferably softened first. Subsequently, the first cover frame 51 abuts against the first substrate frame 31, preferably during or at the end of the moving step. Here, the wafer or first cavity 11 encloses the first pressure. After the pressure is changed or after the second pressure and/or the second chemical composition has been set, the pressing force between the substrate device 3 and the lid device 5 is increased, so that the other wafers without the aluminum frame with increased height are placed in the first The two are joined under pressure, or so that the second cavity 12 is closed with respect to the surrounding space 7 and with respect to the first cavity 11 (in detail, hermetically closed).

Also, in the case of the illustrative embodiment shown by means of the example in FIG. 7 , the eutectic bonding is performed with or without open regions in the Al bonding frame or the first substrate frame 31 and the second substrate frame 32 . Preferably, prior to the first sub-step 201, particularly preferably in the preparation step 200, a first substrate frame 31 is formed here, which completely encloses the first cavity in a plane 300 parallel to the main plane 100 of the substrate area body 11. Furthermore, preferably before the first sub-step 201, especially preferably in the preparation step 200, a second substrate frame 32 is formed, which only partially encloses the second cavity in a plane 300 parallel to the main plane 100 of the substrate area body 12. The wafer intended to enclose the first pressure or enclose the first cavity 11 is preferably provided here with a bonding frame configured in a standard manner. Only those wafers that seal or enclose the second cavity 12 with the second pressure in the second step of the bonding process have a gap in the sensor-side aluminum bonding frame. In other words, the second substrate frame 32 includes gaps or voids 40 , 41 , 42 , 43 . The gaps or voids 40, 41, 42, 43 are not closed immediately during bonding or in the first sub-step 201, so that pressure changes can be performed during the bonding process or in the second sub-step 202, or once the wafer has been in the first sub-step 201. Sealed with a standard bonding frame under pressure, or has formed a first cavity 11 that is closed (in detail, hermetically closed) with respect to the surrounding space 7 of the micromechanical component 1, but has been formed between other wafers or the second substrate frame 32 A second pressure and/or a second chemical composition may be set before the gaps or voids 40, 41, 42, 43 are filled with the flow eutectic. Thus, the wafer or substrate device 3 and the lid device 5, whose gap encloses the second pressure, are connected to each other in such a way as to form a surrounding space 7 with respect to the micromechanical component 1 and closed with respect to the first cavity 11 (in detail, The second cavity 12 is hermetically closed), wherein the second pressure is dominant and/or the second chemical composition is enclosed in the second cavity 12 .

200‧‧‧Preparation steps

201‧‧‧First sub-step

202‧‧‧Second sub-step

Claims (8)

A method for manufacturing a micromechanical component (1), wherein the micromechanical component (1) comprises a substrate device (3) and a cover device (5), wherein, in a preparation step (200), the substrate device (3) is constructed ) and/or the cover device (5), wherein, in a first sub-step (201), a first pressure and/or a first chemical composition are set, and the substrate device (3) and the cover device (5) connected to each other in such a way as to form a first cavity (11) closed with respect to the surrounding space (7) of the micromechanical component (1), wherein the first pressure prevails and/or the first chemical The composition is enclosed in the first cavity (11), characterized in that, in the second sub-step (202), a second pressure and/or a second chemical composition are set, and the substrate device (3) and The cover devices (5) are connected to each other in such a way as to form a second cavity (12) with respect to the surrounding space (7) of the micromechanical component (1) and with respect to the first cavity ( 11) Closure, wherein the second pressure prevails and/or the second chemical composition is enclosed in the second cavity (12), wherein the first sub-step (201) and the second sub-step (202) ) is performed in a bonding process, wherein the substrate device (3) comprises a first substrate frame (31) and a second substrate frame (32), wherein the first substrate frame (31) and the second substrate frame (32) Formed in such a way that, prior to the first sub-step (201), the extent of the first substrate frame (31) perpendicular to the substrate extent principal plane (100) of the substrate device (3) is greater than the extent perpendicular to the substrate extent The main plane (100) The range of the second substrate frame (32). The method of claim 1, wherein the cover device (5) comprises a first cover frame (51) and a second cover frame (52), wherein the first cover frame (51) and the second cover frame ( 52) Formed in such a way that, before the first sub-step (201), the extent of the first cover frame (51) perpendicular to the main plane (101) of the cover extent of the cover device (5) is greater than perpendicular to the extent of the cover frame (51) Covering the area of the second cover frame (52) on the main plane (101) of the area. The method of claim 1, wherein the substrate device (3) comprises a first substrate frame (31) and a second substrate frame (32), wherein before the first sub-step (201), the second substrate The frame (32) is constructed in such a way that an access opening is formed between the second cavity (12) and the surrounding space (7) during the first sub-step (201). The method of claim 2, wherein the cover device (5) comprises a first cover frame (51) and a second cover frame (52), wherein before the first sub-step (201), the second cover The frame (52) is constructed in such a way that an access opening is formed between the second cavity (12) and the surrounding space (7) during the first sub-step (201). The method of any one of claims 1 to 4, wherein in the first sub-step (201) the substrate device (3) and the lid device (5) are connected to each other by means of thermocompression bonding. The method of any one of claims 1 to 4, wherein in the first sub-step (201) the substrate device (3) and the cover device (5) are connected to each other by means of sealing glass bonding. The method of any one of claims 1 to 4, wherein in the first sub-step (201) the substrate device (3) and the lid device (5) are connected to each other by means of eutectic bonding. The method of any one of claims 1 to 4, wherein in the second sub-step (202) the substrate device (3) and the lid device (5) are bonded and/or sealed by means of eutectic glass bonding this connection.

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