TWI754287B - carrier device - Google Patents

Abstract

A carrying device is suitable for carrying a wafer. The carrying device includes a carrying frame and three holding mechanisms. The carrier is used for carrying the bottom surface of the wafer. The carrier is formed with an air inlet channel and three distribution channels. The air inlet channel can be filled with gas so that the air can be distributed out through the distribution channels. Each of the holding mechanisms includes a bracket, a pressing piece, and a pneumatic actuating component. The bracket is arranged on the carrier. The pressing piece can be movably connected to the bracket for holding the outer periphery of the wafer. The pneumatic actuating component is disposed on the bracket and connected to the pressing piece, the pneumatic actuating component communicates with the corresponding shunt channel and can be driven by the gas discharged from it to actuate the pressing piece to move to a holding the The holding position of the outer periphery of the wafer.

Description

carrier device

The present invention relates to a carrier device, in particular to a carrier device for carrying wafers.

In the lithography process, a wafer is usually rotated by a carrier device to perform wet processes such as photoresist coating, development, photoresist removal, and etching. The conventional carrier device uses a vacuum chuck to absorb the wafer and drives the wafer to rotate, and is driven by a plurality of pressing parts to rotate to a position for pressing the wafer by centrifugal force generated when the vacuum chuck rotates.

Since the rotation speed of the vacuum chuck directly affects the centrifugal force driving the pressing parts to rotate, the pressing parts are easily affected by the rotation speed of the vacuum chuck, resulting in changes in the force and position of pressing the wafer. The stability of pressing the wafer is affected.

Therefore, an object of the present invention is to provide a At least one disadvantage of the technology is the carrier device.

Therefore, the carrying device of the present invention is suitable for carrying a wafer, the wafer has a bottom surface and an outer periphery, and the carrying device includes a carrying frame and at least three holding mechanisms.

The carrier is used for carrying the bottom surface of the wafer, the carrier is formed with an air inlet channel, and at least three branch channels communicated with the air inlet channel, and the air inlet channel can be filled with gas to make it pass through the air inlet channel. The equal distribution channel is shunted out. The holding mechanisms are disposed adjacent to the outer periphery of the carrier frame and are spaced apart from each other and arranged in a ring shape. Each of the holding mechanisms includes a bracket, a pressing piece, and a pneumatic actuating component. The bracket is arranged on the carrier. The pressing piece can be movably connected to the bracket for holding the outer periphery of the wafer. The pneumatic actuating component is disposed on the bracket and connected to the pressing piece, the pneumatic actuating component communicates with the corresponding shunt channel and can be driven by the gas discharged from it to actuate the pressing piece to move to a holding the The holding position of the outer periphery of the wafer.

In the carrying device of the present invention, the pneumatic actuating assembly includes a cylinder, and a transmission unit connected between the cylinder and the pressing piece, the cylinder can be driven by the gas to exert a thrust to push the transmission unit to make it Push the pressing piece to move to the holding position.

In the bearing device of the present invention, the air cylinder is a spring-returned air cylinder, and the air cylinder constantly exerts a pulling force opposite to the pushing force to the transmission unit.

In the bearing device of the present invention, the pressed part comprises a fulcrum part pivotally connected to the bracket, a force applying part located below the fulcrum part and rotatably pivoted to the transmission unit, and a fulcrum part located at the fulcrum part The upper part is used to hold the resistance part of the outer periphery.

In the bearing device of the present invention, the transmission unit is formed with a screw hole, the cylinder includes a piston rod, and the piston rod has a screw connection section screwed into the screw hole, and the pneumatic actuating assembly further includes a screw connection with the screw hole. The adjusting nut of the screwing section, the adjusting nut can be operated and rotated to screw the screwing section into or out of the screw hole.

In the bearing device of the present invention, the force-applying portion includes two spaced side baffles, the transmission unit includes a transmission rod, and a pivot group, the transmission rod has a rod body, and a pivot formed at the outer end of the rod body. A connecting block, the rod body has the screw hole, the pivoting block is located between and blocked by the side baffles, and the pivot shaft group is pivotally connected to the side baffles and the pivoting block.

In the carrying device of the present invention, the carrying frame includes a carrying frame for carrying the bottom surface of the wafer and defining the shunt channels, the pneumatic actuating component is located at the bottom end of the carrying frame and includes a carrying frame connected to the carrying frame an adapter unit between the bottom end of the frame and the cylinder, the adapter unit is used for guiding the gas in the corresponding branch channel to the cylinder.

In the carrying device of the present invention, the pneumatic actuating component can be driven by the gas to apply a thrust to push the pressing piece to move to the holding position, and the pneumatic actuating component constantly exerts a force opposite to the pressing piece. The pull of the push force resets it to a The initial position of the outer perimeter separation.

In the carrying device of the present invention, the bracket includes an upper frame for connecting the pressing piece, the upper frame has a guiding inclined surface, and the guiding inclined surface is used for contacting the outer peripheral edge to guide it to slide downward.

The carrying device of the present invention further comprises a plurality of guide blocks disposed adjacent to the outer periphery of the carrying frame and arranged in a ring shape at an interval from each other, each of the guide blocks has a guide slope, and the guide slope is used for the The outer perimeter contacts to guide it to slide down.

In the carrier device of the present invention, the carrier frame includes a center column, and a carrier frame disposed on the top of the center column for supporting the bottom surface of the wafer, the center column defines the air intake channel, and the support frame defines the The split channels and a plurality of hollow spaces are spaced apart from each other and arranged in a ring shape.

In the carrying device of the present invention, the carrying frame includes a plurality of supporting columns, each of which has an elastic head cover for supporting the bottom surface of the wafer.

The effect of the present invention lies in: the pneumatic actuating components of the holding mechanisms can be driven by the gas to actuate the pressing parts to rotate to the holding position, so that the pressing parts press the outer periphery of the wafer The pressure of the edge can be maintained at a constant value without being affected by the change of the rotational speed of the carrier, thereby improving the stability of pressing the wafer.

1: Wafer

1': Wafer

11: Bottom surface

12: Top surface

13: Outer perimeter

200: carrying device

2: Carrier

20: Gas

21: center column

211: Intake channel

22: Bearing frame

221: Frame Parts

222: Support column

223: Inner board

224: Outer Ring

225: The first connecting rod

226: Second connecting rod

227: shunt channel

228: hollow space

229: Cylinder

230: Elastic headgear

3: Guide block

31: Guide slope

32: Block Facade

4: Retaining mechanism

41: Bracket

411: Lower shell

412: Upper frame

413: Shell

414: Cover

415: accommodating space

416: Upper through hole

417: upper opening

418: Pivot

419: Guide Bevel

420: Block Facade

42: Pressed parts

421: Pivot Department

422: Force Department

423: Ministry of Resistance

424: Side Baffle

425:Pivot slot

43: Pneumatic actuation assembly

44: Cylinder

441: Cylinder block

442: Piston

443: Piston Rod

444: Spring

445: Chamber

446: Perforation

447: Stomata

448: Threaded section

45: transfer unit

451: Adapter

452: Connection tube

46: Transmission unit

461: Transmission rod

462: Pivot Group

463: Rod

464:Pivot block

465: screw hole

466:Pivot hole

467: Pivot

468: Buckle

469: Head

47: Adjustment nut

F1: Rally

F2: thrust

R1: The first rotation direction

R2: Second rotation direction

Other features and effects of the present invention will be described with reference to the embodiments of the drawings 1 is an exploded perspective view of an embodiment of the carrier device of the present invention and a wafer, illustrating the configuration relationship between a carrier, a plurality of guide blocks, and a plurality of holding mechanisms; 2 is a cross-sectional view of the embodiment and the wafer, illustrating a pressing part of each of the holding mechanisms in an initial position; FIG. 3 is an incomplete perspective exploded view of the embodiment, illustrating the overall structure of each of the holding mechanisms , and the detailed structure of a plurality of supporting columns; Fig. 4 is an incomplete perspective exploded view of this embodiment, illustrating the detailed structure of each of the holding mechanisms; Fig. 5 is an incomplete bottom view of each of the holding mechanisms of this embodiment, A cover is omitted in the figure; FIG. 6 is a partial enlarged view of FIG. 2; FIG. 7 is a cross-sectional view of the embodiment and the wafer, illustrating that the pressing part of each of the holding mechanisms is in a holding position; 7 is a partial enlarged view; FIG. 9 is an incomplete cross-sectional view of the embodiment and the wafer, illustrating the rotation of an adjusting nut to shorten the length between a piston rod and a transmission rod; and FIG. 10 is the implementation Example with an incomplete cross-sectional view of the wafer.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated by the same reference numerals.

Referring to FIG. 1 , which is an embodiment of a carrier device 200 of the present invention, the carrier device 200 is suitable for carrying a wafer 1 , and the wafer 1 has a bottom surface 11 , a top surface 12 , and a connection between the bottom surface 11 and the wafer 1 . Outer perimeter 13 between top surfaces 12 .

Referring to FIGS. 1 and 2 , the carrying device 200 includes a carrying frame 2 , a plurality of guide blocks 3 , and a plurality of holding mechanisms 4 . The carrying frame 2 includes a central column 21 and a carrying frame 22 . The center column 21 defines an air intake passage 211 extending in the up-down direction and capable of being filled with the gas 20 (as shown in FIG. 7 ). The bottom end of the central column 21 is used for connecting with a gas supply source (not shown), and the gas supply source is used for filling the gas 20 into the air inlet channel 211 . In this embodiment, the gas 20 is dry compressed air (Clean Dry Air, CDA) as an example, and the pressure value thereof ranges from, for example, 1 to 5 kg. Of course, the pressure value of the gas 20 can be adjusted as required.

The carrier frame 22 is used for carrying the bottom surface 11 of the wafer 1 and includes a frame member 221 and a plurality of support columns 222 . The frame member 221 has an inner plate 223 , an outer ring 224 , a plurality of first connecting rods 225 , and a plurality of second connecting rods 226 . The inner plate 223 is fixedly disposed on the top of the center column 21 . The outer ring 224 is circular and surrounds the outer circumference of the inner plate 223 . The first connecting rods 225 are connected between the outer periphery of the inner plate 223 and the inner periphery of the outer ring 224 . The first connecting rods 225 are equiangularly spaced from each other and arranged in a ring shape. The second connecting rods 226 are connected to the outer periphery of the inner plate 223 and the inner periphery of the outer ring 224 Between the edges, the second connecting rods 226 are equidistantly spaced from each other and arranged in a ring shape, and each second connecting rod 226 is located between two adjacent first connecting rods 225 . In this embodiment, the number of the first connecting rods 225 and the number of the second connecting rods 226 are respectively four as an example. The inner plate 223 and the second connecting rods 226 together define four shunt channels 227 (only two of which are shown in FIG. 2 ) which are communicated with the intake channel 211 and are used to split the gas 20 out. The channel 227 is elongated and extends from the center of the inner plate 223 to the corresponding middle position of the second connecting rod 226 . In addition, the inner plate 223 , the outer ring 224 , the first connecting rods 225 and the second connecting rods 226 of the frame member 221 together define a plurality of hollow spaces that are equidistantly spaced from each other and arranged in a ring shape 228. The upper and lower ends of each hollow space 228 are open to allow the circulation of cleaning fluid (not shown). The supporting columns 222 are disposed on the top surface of the outer ring 224 , the top surface of the first connecting rods 225 and the top surface of the second connecting rods 226 . Each of the supporting columns 222 has a column body 229 and an elastic head cover 230 . . The column 229 is disposed on the top surface of the aforementioned corresponding structure. The elastic head cover 230 is sleeved on the top of the column 229 for supporting the bottom surface 11 of the wafer 1 . The elastic headgear 230 of this embodiment is made of, for example, an antistatic silicone material. Therefore, the bottom surface 11 will not be scratched when each of the support posts 222 contacts the wafer 1 .

The guide blocks 3 are disposed on the top surface of the outer ring 224 of the carrier frame 2 and adjacent to the outer periphery thereof. In this embodiment, the number of the guide blocks 3 is four as an example. Each of the guide blocks 3 is located outside the corresponding first connecting rod 225 , and each of the guide blocks 3 has A guide slope 31 extending obliquely inward from top to bottom, and a blocking vertical surface 32 connected to the bottom end of the guide slope 31 . The guiding slope 31 is used for contacting the outer peripheral edge 13 of the wafer 1 to guide it to slide downward, and the blocking vertical surface 32 is used for blocking the outer peripheral edge 13 of the wafer 1 .

The holding mechanisms 4 are disposed near the outer periphery of the frame member 221 of the carrier frame 2 and are equiangularly spaced from each other and arranged in a ring shape. In this embodiment, the number of the holding mechanisms 4 is four For example, each of the holding mechanisms 4 is disposed on the bottom surface of the outer ring 224 and the corresponding second connecting rod 226 , and each of the holding mechanisms 4 is located between two adjacent guide blocks 3 . It should be noted that, the number of the holding mechanisms 4 can also be three or more than four, which can be adjusted according to requirements, and is not limited to the number disclosed above.

Referring to FIGS. 3 , 4 , 5 and 6 , each of the holding mechanisms 4 includes a bracket 41 , a pressing piece 42 , and a pneumatic actuating component 43 . The bracket 41 includes a lower casing 411 and an upper frame 412 . The lower shell 411 is in the shape of a long shell and has a casing 413 and a cover 414 . The casing 413 is locked to the bottom surface of the corresponding second connecting rod 226 , and a part of the casing 413 protrudes from the outer periphery of the outer ring 224 . The casing 413 defines an accommodating space 415 , an upper through hole 416 , and an upper opening 417 . The accommodating space 415 accommodates the pneumatic actuating assembly 43 . The upper through hole 416 communicates with the top end of the accommodating space 415 and is adjacent to the inner end of the housing 413 . The upper opening 417 communicates with the top of the accommodating space 415 and is adjacent to the outer end of the housing 413 . The cover body 414 is locked at the bottom end of the casing 413 . The upper frame 412 The upper frame 412 has a pivot shaft 418 , a guiding inclined surface 419 , and a blocking vertical surface 420 locked on the top surface of the portion of the casing 413 protruding from the outer periphery of the outer ring 224 . The pivot 418 is located above the upper opening 417 . The guiding inclined surface 419 is located inside the pivot shaft 418 and extends from top to bottom and inclined inwardly for contacting the outer peripheral edge 13 of the wafer 1 to guide it to slide downward. The blocking vertical surface 420 is connected to the bottom end of the guiding inclined surface 419 for blocking the outer peripheral edge 13 of the wafer 1 .

The pressing piece 42 can be movably connected to the bracket 41 for holding the outer periphery 13 of the wafer 1 . In this embodiment, the pressing piece 42 is a lever structure passing through the upper opening 417 and the upper frame 412 , and the pressing piece 42 includes a fulcrum portion 421 , and an application force located below the fulcrum portion 421 . part 422 , and a resistance part 423 located above the fulcrum part 421 . The fulcrum portion 421 is a pivot hole rotatably pivoted to the pivot shaft 418 of the upper frame 412 . The force-applying portion 422 includes two spaced-apart side baffles 424 , and each of the side baffles 424 is formed with a pivot slot 425 . The resisting portion 423 is used to hold the outer peripheral edge 13 of the wafer 1 .

The pneumatic actuating assembly 43 is disposed in the accommodating space 415 of the bracket 41 and is connected to the pressing piece 42 and communicates with the corresponding shunt channel 227 . The pneumatic actuating assembly 43 includes a cylinder 44 , an adapter unit 45 , a transmission unit 46 , and an adjusting nut 47 . In this embodiment, the cylinder 44 is a spring-return type cylinder and includes a cylinder block 441 , a piston 442 , a piston rod 443 , and a spring 444 . The cylinder 441 is formed with a cavity 445 and a through hole 446 connected to the outer end of the cavity 445 , and an air hole 447 connected to the inner end of the chamber 446 . The piston 442 is disposed in the chamber 445 . The piston rod 443 passes through the cavity 445 and the through hole 446 , and the inner end of the piston rod 443 is connected to the piston 442 . The piston rod 443 has a threaded section 448 protruding from the outer end of the cylinder 441 . The spring 444 is a compression spring set on the piston rod 443 and located in the chamber 445 . The inner and outer ends of the spring 444 abut on the piston 442 and the cylinder 441 respectively. Apply an inward stretch.

The adapter unit 45 includes an adapter 451 and a connecting pipe 452 . The adapter 451 passes through the upper through hole 416 and is screwed to the bottom end of the corresponding second connecting rod 226 . The adapter 451 communicates with the corresponding distribution channel 227 for receiving the gas 20 discharged therefrom. (as shown in Figure 7). The connecting pipe 452 is connected between the adapter 451 and the inner end of the cylinder 441 of the cylinder 44 to receive the gas 20 discharged from the adapter 451 and guide it into the air hole 447 , The gas 20 can flow into the chamber 445 and push the piston 442 . The flow direction of the gas 20 can be changed by the adapter unit 45 , so that the pneumatic actuating element 43 can be arranged below the corresponding second connecting rod 226 to avoid occupying the space above it. Thereby, the top surface of each of the second connecting rods 226 can be provided with a part of the supporting columns 222 to improve the stability of carrying the wafer 1 .

The transmission unit 46 is connected between the piston rod 443 of the air cylinder 44 and the force applying portion 422 of the pressing piece 42 . The transmission unit 46 includes a transmission rod 461 and a pivot shaft group 462 . The transmission rod 461 has a rod body 463 and a pivot block 464 formed on the outer end of the rod body 463 . The inner end of the rod body 463 is concave outward to form a threaded section for the 448 screw holes 465. The pivoting block 464 is located between the side baffles 424 of the force applying portion 422 , and two opposite sides of the pivoting block 464 are blocked by the side baffles 424 and cannot rotate. The pivot block 464 is formed with a pivot hole 466 that communicates between the pivot slots 425 . The pivot assembly 462 has a pivot 467 and a retaining ring 468 . The pivot shaft 467 passes through the pivot connection grooves 425 and the pivot connection hole 466 , and a head 469 of the pivot shaft 467 blocks the outer side of a corresponding one of the side baffles 424 . The retaining ring 468 is fastened to the pivot shaft 467 and stops at the outside of the other corresponding side baffle 424 . Thereby, the pivot shaft group 462 can pivot the side baffles 424 and the pivot block 464 together, and the force applying portion 422 can be pivoted to the pivot shaft 467 through the side baffles 424 . .

When the piston 442 of the air cylinder 44 of the pneumatic actuating assembly 43 is not driven by the gas 20, the spring 444 constantly exerts an inward elastic force on the piston 442, so that the piston rod 443 of the air cylinder 44 is constantly An inward pulling force F1 is applied to the transmission unit 46 , whereby the pressing piece 42 can be positioned at an initial position (as shown in FIG. 6 ). When the piston 442 of the cylinder 44 of the pneumatic actuating assembly 43 is driven by the gas 20 , the piston rod 443 exerts a pushing force F2 (as shown in FIG. 8 ) opposite to the pulling force F1 to push the transmission unit 46 , so that the transmission unit 46 can push the pressing piece 42 to rotate from the initial position to a holding position for holding the outer periphery 13 of the wafer 1 (as shown in FIG. 8 ).

The adjusting nut 47 is screwed to the threaded section 448 of the piston rod 443, and the adjusting nut 47 can be operated and rotated to screw the threaded section 448 into or out of the screw hole 465, whereby the length between the piston rod 443 and the transmission rod 461 can be adjusted, so that the angle of the pressing piece 42 in the initial position and the holding position can be adjusted.

Referring to FIGS. 1 , 2 and 6 , when the pressing part 42 of each holding mechanism 4 is at the initial position, the pressing part 42 will not block a transfer arm (not shown) from placing the wafer 1 On the carrier frame 22 or on a pick-and-place path for clamping the wafer 1 from the carrier frame 22 . At this time, the transfer arm can place the wafer 1 on the carrier frame 22 via the pick-and-place path. When the transfer arm releases the wafer 1 to move down, if the position of the wafer 1 is deviated, the outer peripheral edge 13 contacts the corresponding guiding slope 31 of the guiding block 3 or the corresponding upper The guide slope 419 of the frame 412, the guide slope 31 or the guide slope 419 can smoothly guide the outer periphery 13 to slide down and at the same time guide the position of the wafer 1, so that the wafer 1 can be accurately placed on the support columns 222 of the carrying frame 22 .

Referring to FIGS. 7 and 8 , after the wafer 1 is placed on the support columns 222 of the carrier frame 22 , the gas supply source is controlled to operate so as to fill the gas 20 into the air inlet channel 211 , and the gas 20 is subsequently Diverted into the diverting channels 227 . The gas 20 discharged from each branch channel 227 will flow into the chamber 445 through the adapter 451 , the connecting pipe 452 and the air hole 447 in sequence, and the gas 20 applies the thrust F2 to the piston 442 to make it move within the chamber 445 . During the movement of the piston 442 , the thrust force F2 is applied to the piston rod 443 and the spring 444 is compressed to deform and accumulate restoring elastic force. The piston rod 443 will apply the thrust F2 to the transmission unit 46 and push it, so that The transmission unit 46 pushes the pressing piece 42 to rotate around the pivot 418 along a first rotation direction R1. When the pressing part 42 rotates to the holding position where the resisting part 423 presses and holds the outer periphery 13 of the wafer 1 , the pressing part 42 cannot continue to rotate. At this time, the carrier device 200 can drive the wafer 1 to rotate to perform related processes. Since the pressure of the gas 20 is kept at a constant value during the process, the pressure of the pressing parts 42 to press the outer periphery 13 of the wafer 1 can also be kept at a constant value without being affected by changes in the rotational speed of the carrier 2 , whereby the stability of pressing the wafer 1 can be improved.

Referring to FIG. 1 and FIG. 7 , after the process is completed, the chemical organic solvent remaining on the wafer 1 needs to be cleaned. The chemical organic solvent remaining on the top surface 12 of the wafer 1 is washed away by the cleaning liquid sprayed by a cleaning mechanism (not shown in the figure). At the same time, the cleaning liquid can also pass through the hollows of the carrier frame 22 . The space 228 rinses away the chemical organic solvent remaining on the bottom surface 11 of the wafer 1 . In this way, the bottom surface 11 and the top surface 12 can be cleaned at the same time without turning the wafer 1 over, which can greatly improve the convenience and efficiency of cleaning.

Referring to FIG. 2 and FIG. 6 , after the cleaning of the wafer 1 is completed, the gas supply source is controlled to stop running so that the gas 20 is no longer filled into the air inlet channel 211 . At this time, each of the cylinders 44 drives the piston 442 to reset by the reset elastic force accumulated by the spring 444. During the reset movement of the piston 442, the piston rod 443 applies the pulling force F1 to the transmission unit 46, so that the transmission unit 46 Pull the pressing piece 42 to rotate around the pivot 418 along a second rotational direction R2 opposite to the first rotational direction R1 (as shown in FIG. 8 ) move. When the piston 442 abuts against the end surface of the cylinder 441 , it cannot continue to move and complete the reset. At this time, the pressing piece 42 automatically resets to the initial position where the resisting portion 423 is separated from the outer periphery 13 . Afterwards, the transfer arm can hold the wafer 1 and move it away from the carrier frame 22 .

Referring to FIGS. 9 and 10 , when the angle of the pressing piece 42 in the holding position is to be adjusted to be less inclined, the adjusting nut 47 is rotated to screw the threaded section 448 into the threaded hole 465 so that the The length between the piston rod 443 and the transmission rod 461 is shortened, so that the angle of the pressing piece 42 in the holding position shown in FIG. 10 can be adjusted to be less inclined. Thereby, the pressing parts 42 of the holding mechanisms 4 can be applied to hold the wafer 1' with a larger size.

Referring to FIGS. 6 and 8 , on the contrary, when the angle of the pressing piece 42 in the holding position is to be adjusted to be more inclined, the adjusting nut 47 is rotated to unscrew the threaded section 448 out of the threaded hole 465 so that the The length between the piston rod 443 and the transmission rod 461 becomes longer, and the angle of the pressing piece 42 at the holding position can be adjusted to be relatively inclined. Thereby, the pressed parts 42 of the holding mechanisms 4 can be applied to hold the wafer 1 with a smaller size.

It should be noted that, the pressing parts 42 in this embodiment can also be designed to slide laterally on the upper frame 412 through the pivot shaft 418 , so that the pressing parts 42 can be driven by the transmission unit 46 . while sliding between the initial position and the holding position. Therefore, the manner in which each of the pressing parts 42 can be movably connected to the upper frame 412 of the bracket 41 is not limited to a pivotable manner.

To sum up, the pneumatic actuating components 43 of the holding mechanisms 4 can be driven by the gas 20 to actuate the pressing pieces 42 to rotate to the holding position, so that the pressing pieces 42 press the crystal The pressure of the outer peripheral edge 13 of the circle 1 can be kept at a constant value without being affected by the change of the rotational speed of the carrier 2 , thereby improving the stability of pressing the wafer 1 , so the object of the present invention can indeed be achieved .

However, the above are only examples of the present invention, and should not limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the content of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

1: Wafer

200: carrying device

2: Carrier

21: center column

211: Intake channel

22: Bearing frame

221: Frame Parts

222: Support column

223: Inner board

226: Second connecting rod

227: shunt channel

4: Retaining mechanism

41: Bracket

42: Pressed parts

43: Pneumatic actuation assembly

44: Cylinder

45: transfer unit

46: Transmission unit

Claims (12)

A carrying device is suitable for carrying a wafer, the wafer has a bottom surface and an outer periphery, the carrying device comprises: a carrying frame for carrying the bottom surface of the wafer, the carrying frame is formed with an air inlet channel, and at least three shunt channels communicated with the intake channel, the intake channel can be filled with gas with a constant pressure to make it flow out through these shunt channels; at least three holding mechanisms are provided on the carrier frame Adjacent to the outer periphery and spaced apart from each other in a ring shape, each of the holding mechanisms includes: a bracket, disposed on the carrier; a pressing piece, movably connected to the bracket for holding the outer periphery of the wafer ; And a pneumatic actuating component, disposed on the bracket and connected to the pressing piece, the pneumatic actuating component communicates with the corresponding shunt channel and can be driven by the gas discharged to actuate the pressing piece to move to a holding position for holding the outer periphery of the wafer. The carrying device of claim 1, wherein the pneumatic actuating assembly comprises a cylinder and a transmission unit connected between the cylinder and the pressing piece, the cylinder can be driven by the gas to exert a thrust force Push the transmission unit to push the pressing piece to move to the holding position. The carrying device according to claim 2, wherein the cylinder is a spring-returned cylinder, and the cylinder constantly exerts a pulling force opposite to the pushing force to the transmission unit. The carrier device of claim 3, wherein the pressed part contains a A fulcrum part pivotally connected to the bracket, a force applying part located below the fulcrum part and rotatably pivoted to the transmission unit, and a resisting part located above the fulcrum part for holding the outer periphery. The carrying device according to claim 4, wherein the transmission unit is formed with a screw hole, the cylinder includes a piston rod, the piston rod has a screw connection section screwed into the screw hole, and the pneumatic actuating assembly further It comprises an adjusting nut screwed on the screwing section, and the adjusting nut can be operated and rotated to screw the screwing section into or out of the screw hole. The carrying device of claim 5, wherein the force applying portion comprises two spaced side baffles, the transmission unit comprises a transmission rod, and a pivot set, the transmission rod has a rod body, and a formed A pivot block at the outer end of the rod body, the rod body has the screw hole, the pivot block is located between and blocked by the side baffles, and the pivot group is pivotally connected to the side baffles and the pivot block. The carrying device of claim 2, wherein the carrying frame includes a carrying frame for carrying the bottom surface of the wafer and defining the shunt channels, the pneumatic actuating component is located at the bottom end of the carrying frame and It includes an adapter unit connected between the bottom end of the carrier frame and the cylinder, and the adapter unit is used for guiding the gas in the corresponding distribution channel to the cylinder. The carrying device as claimed in claim 1, wherein the pneumatic actuating component can be driven by the gas to apply a thrust to push the pressing piece to move to the holding position, and the pneumatic actuating component constantly presses the pressing component The element exerts a pulling force opposite to the pushing force to restore it to an initial position separated from the outer periphery. The carrying device as claimed in claim 1, wherein the bracket comprises an upper frame for connecting the pressed part, the upper frame has a guiding slope, and the guiding slope is used for the outer peripheral edge to contact to guide it toward the Swipe down. The carrying device according to claim 9, further comprising a plurality of guide blocks disposed adjacent to the outer periphery of the carrying frame and spaced apart from each other in a ring shape, each of the guide blocks has a guide slope, the guide slope It is used for contacting the outer peripheral edge to guide it to slide downward. The carrier device of claim 1, wherein the carrier comprises a center pillar and a carrier frame disposed on the top of the center pillar for supporting the bottom surface of the wafer, and the center pillar defines the air inlet channel , the carrying frame defines the shunt channels and a plurality of hollow spaces which are spaced apart from each other and arranged in a ring shape. The carrier device of claim 1, wherein the carrier comprises a plurality of support columns, and each of the support columns has an elastic head cover for supporting the bottom surface of the wafer.

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