1.黏著劑組合物
本發明之黏著劑組合物之特徵在於：其係用於形成如下黏著劑層者，該黏著劑層係貼合於透明基材上具有透明導電層之透明導電性基材之上述透明導電層而使用，且其含有(甲基)丙烯酸系聚合物及含硫醇基之矽烷偶合劑。以下，對本發明之黏著劑組合物之組成進行說明。
(1)(甲基)丙烯酸系聚合物
本發明之黏著劑組合物較佳為含有(甲基)丙烯酸系聚合物及含硫醇基之矽烷偶合劑者，且含有(甲基)丙烯酸系聚合物作為主成分。此處，所謂主成分，係指黏著劑組合物中所含之全部固形物成分中含有比率最多之成分，例如在黏著劑組合物所含之全部固形物成分中占多於50重量%之成分，進而占多於70重量%之成分。
(甲基)丙烯酸系聚合物通常含有作為單體單元之(甲基)丙烯酸烷基酯作為主成分。再者，(甲基)丙烯酸酯係指丙烯酸酯及/或甲基丙烯酸酯，本發明之(甲基)係相同之意義。
作為構成(甲基)丙烯酸系聚合物之主骨架之(甲基)丙烯酸烷基酯，可例示直鏈狀或支鏈狀之烷基之碳數1～18者。例如作為上述烷基，可例示：甲基、乙基、丙基、異丙基、丁基、異丁基、戊基、己基、環己基、庚基、2-乙基己基、異辛基、壬基、癸基、異癸基、十二烷基、異肉豆蔻基、月桂基、十三烷基、十五烷基、十六烷基、十七烷基、十八烷基等。該等可單獨使用或組合使用。作為該等烷基之平均碳數，較佳為3～9。
作為構成(甲基)丙烯酸系聚合物之單體，除上述(甲基)丙烯酸烷基酯以外，亦可列舉：含羧基之單體、含羥基之單體、含醯胺基之單體、含芳香環之(甲基)丙烯酸酯等。
含羧基之單體係於其結構中含有羧基且包含(甲基)丙烯醯基、乙烯基等聚合性不飽和雙鍵之化合物。作為含羧基之單體之具體例，例如可列舉：(甲基)丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、丁烯酸等。上述含羧基之單體中，就共聚性、價格及黏著特性之觀點而言，較佳為丙烯酸。
含羥基之單體係於其結構中含有羥基且包含(甲基)丙烯醯基、乙烯基等聚合性不飽和雙鍵之化合物。作為含羥基之單體之具體例，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂基酯等(甲基)丙烯酸羥基烷基酯或甲基丙烯酸(4-羥基甲基環己基)酯等。上述含羥基之單體中，就耐久性之方面而言，較佳為(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯，尤佳為(甲基)丙烯酸4-羥基丁酯。
含醯胺基之單體係於其結構中含有醯胺基且包含(甲基)丙烯醯基、乙烯基等聚合性不飽和雙鍵之化合物。作為含醯胺基之單體之具體例，可列舉：(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-異丙基丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-己基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基-N-丙烷(甲基)丙烯醯胺、胺基甲基(甲基)丙烯醯胺、胺基乙基(甲基)丙烯醯胺、巰基甲基(甲基)丙烯醯胺、巰基乙基(甲基)丙烯醯胺等丙烯醯胺系單體；N-(甲基)丙烯醯基𠰌啉、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶等N-丙烯醯基雜環單體；N-乙烯基吡咯啶酮、N-乙烯基-ε-己內醯胺等含N-乙烯基之內醯胺系單體等。就滿足耐久性之方面而言，較佳為含醯胺基之單體，含醯胺基之單體中，就兼顧對透明導電層之耐久性及重工性方面而言，尤佳為含有N-乙烯基之內醯胺系單體。
上述含芳香環之(甲基)丙烯酸酯係於其結構中含有芳香環結構且包含(甲基)丙烯醯基之化合物。作為芳香環，可列舉：苯環、萘環或聯苯基環。含芳香環之(甲基)丙烯酸酯能夠滿足耐久性(尤其是對於透明導電層之耐久性)。
作為含芳香環之(甲基)丙烯酸酯之具體例，例如可列舉：(甲基)丙烯酸苄酯、(甲基)丙烯酸苯酯、鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯氧基丙酯、苯氧基二乙二醇(甲基)丙烯酸酯、經環氧乙烷改性之壬基苯酚(甲基)丙烯酸酯、經環氧乙烷改性之甲酚(甲基)丙烯酸酯、經苯酚環氧乙烷改性之(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸甲氧基苄酯、(甲基)丙烯酸氯苄基酯、(甲基)丙烯酸甲苯基酯、聚苯乙烯(甲基)丙烯酸酯等具有苯環者；羥基乙基化β-萘酚丙烯酸酯、(甲基)丙烯酸2-萘基乙酯、丙烯酸2-萘氧基乙酯、(甲基)丙烯酸2-(4-甲氧基-1-萘氧基)乙酯等具有萘環者；(甲基)丙烯酸聯苯酯等具有聯苯環者。
上述含羧基之單體、含羥基之單體、含醯胺基之單體、含芳香環之(甲基)丙烯酸酯於黏著劑組合物含有交聯劑之情形時成為與交聯劑之反應點。尤其是含羧基之單體、含羥基之單體由於與分子間交聯劑富有反應性，故而可較佳地用於提昇所獲得之黏著劑層之凝集性或耐熱性。
本發明所使用之(甲基)丙烯酸系聚合物較佳為於全部構成單體(100重量%)之重量比率中按照以下之量含有上述各單體作為單體單元。
上述(甲基)丙烯酸烷基酯之重量比率可設為除(甲基)丙烯酸烷基酯以外之單體之殘部，具體而言，較佳為70重量%以上。就確保接著性之方面而言，較佳為將(甲基)丙烯酸烷基酯之重量比率設為上述範圍。
上述含羧基之單體之重量比率較佳為2重量%以下，更佳為0.01～2重量%，進而較佳為0.05～1.5重量%，進而較佳為0.05～1重量%，尤佳為0.05～0.5重量%。若含羧基之單體之重量比率未達0.01重量%，則有無法兼顧耐久性及重工性之傾向。另一方面，於超過2重量%之情形時，有透明導電層會腐蝕之情況，且有無法兼顧耐久性及重工性之傾向而欠佳。
含羥基之單體之重量比率較佳為3重量%以下，更佳為0.01～3重量%，進而較佳為0.1～2重量%，尤佳為0.2～2重量%。若含羥基之單體之重量比率未達0.01重量%，則有黏著劑層之交聯不充分，而無法兼顧耐久性及重工性或不能滿足黏著特性之傾向。另一方面，於超過3重量%之情形時，有無法兼顧耐久性及重工性之傾向。
含醯胺基之單體之重量比率較佳為8重量%以下，更佳為0.1～8重量%，進而較佳為0.3～5重量%，進而較佳為0.3～4重量%，尤佳為0.7～2.5重量%。若含醯胺基之單體之重量比率未達0.1重量%，則有尤其無法兼顧對透明導電層之耐久性及重工性之傾向。另一方面，若超過8重量%，則有無法滿足耐久性及重工性之傾向。
含芳香環之(甲基)丙烯酸酯之重量比率較佳為25重量%以下，更佳為0～22重量%，進而較佳為0～18重量%。若含芳香環之(甲基)丙烯酸酯之重量比率超過25重量%，則有不能同時滿足耐久性及重工性之傾向。
於上述(甲基)丙烯酸系聚合物中，除上述單體單元以外，雖無需特別地含有其他單體單元，但為了改善接著性或兼顧耐熱性及重工性，亦可藉由共聚而導入具有(甲基)丙烯醯基或乙烯基等含不飽和雙鍵之聚合性官能基的1種以上之共聚單體。
關於(甲基)丙烯酸系聚合物中之上述共聚單體之比率，於上述(甲基)丙烯酸系聚合物之全部構成單體(100重量%)之重量比率中，較佳為0～10重量%左右，更佳為0～7重量%左右，進而較佳為0～5重量%左右。
本發明之(甲基)丙烯酸系聚合物通常使用重量平均分子量為100萬～250萬者。若考慮耐久性、尤其是耐熱性，則較佳為重量平均分子量為120萬～200萬。若重量平均分子量未達100萬，則就耐熱性之方面而言欠佳。又，若重量平均分子量大於250萬，則有黏著劑容易變硬之傾向，變得容易產生剝離。又，表示分子量分佈之重量平均分子量(Mw)/數量平均分子量(Mn)較佳為1.8以上且10以下，更佳為1.8～7，進而較佳為1.8～5。於分子量分佈(Mw/Mn)超過10之情形時，就耐久性之方面而言欠佳。再者，重量平均分子量、分子量分佈(Mw/Mn)係藉由GPC(Gel Permeation Chromatography，凝膠滲透層析法)而進行測定，根據按照聚苯乙烯換算所算出之值而求出。
此種(甲基)丙烯酸系聚合物之製造能夠適當選擇溶液聚合、塊狀聚合、乳化聚合、各種自由基聚合等公知之製造方法。又，所獲得之(甲基)丙烯酸系聚合物亦可為無規共聚物、嵌段共聚物、接枝共聚物等中之任一者。
再者，於溶液聚合中，作為聚合溶劑，例如使用乙酸乙酯、甲苯等。作為具體之溶液聚合例，反應係於氮氣等惰性氣體氣流下添加聚合起始劑，通常於50～70℃左右下實施5～30小時左右之反應條件下進行。
用於自由基聚合中之聚合起始劑、鏈轉移劑、乳化劑等並無特別限定，能夠適當選擇使用。再者，(甲基)丙烯酸系聚合物之重量平均分子量能夠根據聚合起始劑、鏈轉移劑之使用量、反應條件而進行控制，根據該等之種類而適當調整其使用量。
作為聚合起始劑，例如可列舉：2,2'-偶氮二異丁腈、2,2'-偶氮二(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮二[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮二(2-甲基丙脒)二硫酸鹽、2,2'-偶氮二(N,N'-二亞甲基異丁基脒)、2,2'-偶氮二[N-(2-羧基乙基)-2-甲基丙脒]水合物(商品名：VA-057、和光純藥工業股份有限公司製造)等偶氮系起始劑、過硫酸鉀、過硫酸銨等過硫酸鹽、過氧化二碳酸二(2-乙基己基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、過氧化二碳酸二第二丁酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三己酯、過氧化特戊酸第三丁酯、過氧化二月桂醯、過氧化二正辛醯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯、過氧化二(4-甲基苯甲醯基)、過氧化二苯甲醯、過氧化異丁酸第三丁酯、1,1-二(過氧化第三己基)環己烷、氫過氧化第三丁基、過氧化氫等過氧化物系起始劑、過硫酸鹽與亞硫酸氫鈉之組合、過氧化物與抗壞血酸鈉之組合等之組合過氧化物與還原劑之氧化還原系起始劑等，但並不限定於該等。
上述聚合起始劑可單獨使用，又，亦可混合使用2種以上，相對於單體成分之總量100重量份，整體之含量較佳為0.005～1重量份左右，更佳為0.02～0.5重量份左右。
再者，為了使用例如2,2'-偶氮二異丁腈作為聚合起始劑而製造上述重量平均分子量之(甲基)丙烯酸系聚合物，相對於單體成分之總量100重量份，聚合起始劑之使用量較佳為設為0.06～0.2重量份左右，更佳為設為0.08～0.175重量份左右。
又，鏈轉移劑、乳化劑等能夠適當使用先前公知者。該等之添加量亦能夠於無損本發明之效果之範圍內適當決定。
(2)含硫醇基之矽烷偶合劑
本發明之特徵在於：於黏著劑組合物中含有含硫醇基之矽烷偶合劑。藉由於黏著劑組合物中含有含硫醇基之矽烷偶合劑，能夠提高由該黏著劑組合物形成之黏著劑層之耐久性，尤其是在加濕環境下之耐久性優異，且可兼顧重工性。又，於含硫醇基之矽烷偶合劑中，尤佳為低聚物型含硫醇基之矽烷偶合劑。此處，所謂低聚物型係指單體之二聚物以上且未達100聚物左右之聚合物，作為低聚物型矽烷偶合劑之重量平均分子量，較佳為300～30000左右。
作為低聚物型含硫醇基之矽烷偶合劑，較佳為於分子內具有2個以上之烷氧基矽烷基之低聚物型含硫醇基之矽烷偶合劑。具體而言，例如可列舉信越化學工業股份有限公司製造之X-41-1805、X-41-1810、X-41-1818等。該等偶合劑不易揮發，具有複數個烷氧基矽烷基，因此對於耐久性及重工性之提昇較為有效，故而較佳。
作為低聚物型以外之含硫醇基之矽烷偶合劑，例如可列舉，3-巰基丙基三甲氧基矽烷、γ-巰基丙基甲基二甲氧基矽烷等。具體而言，例如可列舉信越化學工業股份有限公司製造之KBM-803等。
上述含硫醇基之矽烷偶合劑之烷氧基矽烷基之個數並無特別限定，較佳為於分子內為2個以上。又，上述含硫醇基之矽烷偶合劑之烷氧基之量於矽烷偶合劑中較佳為10～60重量%，更佳為20～50重量%，進而較佳為20～40重量%。
烷氧基之種類並無特別限定，例如可列舉：甲氧基、乙氧基、丙氧基、丁氧基、戊氧基、己氧基等碳數1～6之烷氧基。該等之中，較佳為甲氧基、乙氧基，更佳為甲氧基。又，亦較佳為一分子中含有甲氧基與乙氧基兩者。
上述含硫醇基之矽烷偶合劑之硫醇基當量(巰基當量)較佳為1000 g/mol以下，更佳為800 g/mol以下，更佳為700 g/mol以下，更佳為500 g/mol以下。又，硫醇基當量之下限值並無特別限定，於上述含硫醇基之矽烷偶合劑為低聚物型之情形時，例如較佳為200 g/mol以上。
上述含硫醇基之矽烷偶合劑(尤其是低聚物型含硫醇基之矽烷偶合劑)可單獨使用，又，亦可混合使用2種以上，相對於上述(甲基)丙烯酸系聚合物100重量份，其整體含量較佳為0.01～6重量份，更佳為0.01～3重量份，進而較佳為0.05～1重量份。藉由以上述範圍含有含硫醇基之矽烷偶合劑，能夠提高黏著劑層之耐久性，尤其是加濕環境下之耐久性優異，且可兼顧重工性。
又，於本發明之黏著劑組合物中，亦可添加上述含硫醇基之矽烷偶合劑以外之矽烷偶合劑。作為其他偶合劑，可列舉：3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基亞丁基)丙胺、N-苯基-γ-胺基丙基三甲氧基矽烷等含胺基之矽烷偶合劑、3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等含(甲基)丙烯醯基之矽烷偶合劑、3-異氰酸基丙基三乙氧基矽烷等含異氰酸基之矽烷偶合劑等。
除上述含硫醇基之矽烷偶合劑以外之矽烷偶合劑可於無損本發明效果之範圍內添加，其添加量並無特別限定。
(3)交聯劑
本發明所使用之黏著劑組合物較佳為含有交聯劑。作為交聯劑，能夠使用有機系交聯劑或多官能性金屬螯合物。作為有機系交聯劑，可列舉：異氰酸酯系交聯劑、過氧化物系交聯劑、環氧系交聯劑、亞胺系交聯劑等。多官能性金屬螯合物係多價金屬與有機化合物共價鍵結或配位鍵結者。作為多價金屬原子，可列舉：Al、Cr、Zr、Co、Cu、Fe、Ni、V、Zn、In、Ca、Mg、Mn、Y、Ce、Sr、Ba、Mo、La、Sn、Ti等。作為共價鍵結或配位鍵結之有機化合物中之原子，可列舉氧原子等，作為有機化合物，可列舉烷基酯、醇化合物、羧酸化合物、醚化合物、酮化合物等。
作為交聯劑，較佳為異氰酸酯系交聯劑及/或過氧化物系交聯劑，更佳為將異氰酸酯系交聯劑與過氧化物系交聯劑併用。
作為異氰酸酯系交聯劑，可使用具有至少2個異氰酸基之化合物。例如通常使用胺基甲酸酯化反應中所使用之公知之脂肪族多異氰酸酯、脂環族多異氰酸酯、芳香族多異氰酸酯等。
作為脂肪族多異氰酸酯，例如可列舉：三亞甲基二異氰酸酯、四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、五亞甲基二異氰酸酯、1,2-伸丙基二異氰酸酯、1,3-伸丁基二異氰酸酯、十二亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯等。
作為脂環族多異氰酸酯，例如可列舉：1,3-環戊烯二異氰酸酯、1,3-環己烷二異氰酸酯、1,4-環己烷二異氰酸酯、異佛爾酮二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化苯二甲基二異氰酸酯、氫化甲苯二異氰酸酯、氫化四甲基苯二甲基二異氰酸酯等。
作為芳香族二異氰酸酯，例如可列舉：苯二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、2,2'-二苯基甲烷二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、4,4'-甲苯胺二異氰酸酯、4,4'-二苯醚二異氰酸酯、4,4'-二苯基二異氰酸酯、1,5-萘二異氰酸酯、苯二甲基二異氰酸酯等。
又，作為異氰酸酯系交聯劑，可列舉：上述二異氰酸酯之多聚物(二聚物、三聚物、五聚物等)、與三羥甲基丙烷等多元醇反應而成之胺基甲酸酯改性體、脲改性體、縮二脲改性體、脲基甲酸酯改性體、異氰尿酸酯改性體、碳二醯亞胺改性體等。
作為異氰酸酯系交聯劑之市售品，例如可列舉：Nippon Polyurethane Industry股份有限公司製造之商品名「Millionate MT」、「Millionate MTL」、「Millionate MR-200」、「Millionate MR-400」、「Coronate L」、「Coronate HL」、「Coronate HX」、三井化學股份有限公司製造之商品名「Takenate D-110N」、「Takenate D-120N」、「Takenate D-140N」、「Takenate D-160N」、「Takenate D-165N」、「Takenate D-170HN」、「Takenate D-178N」、「Takenate 500」、「Takenate 600」等。該等化合物可單獨使用1種，又，亦可混合使用2種以上。
作為異氰酸酯系交聯劑，較佳為脂肪族多異氰酸酯及其改性體之脂肪族多異氰酸酯系化合物。與其他異氰酸酯系交聯劑相比，脂肪族多異氰酸酯系化合物其交聯結構富有柔軟性，容易緩和伴隨光學膜之膨脹/收縮而產生之應力，於耐久性試驗中難以產生剝離。作為脂肪族多異氰酸酯系化合物，尤佳為六亞甲基二異氰酸酯及其改性體。
作為過氧化物，只要為藉由加熱或光照射而產生自由基活性種，進行黏著劑組合物之基礎聚合物((甲基)丙烯酸系聚合物)之交聯者，則能夠適當使用，但考慮到作業性或穩定性，較佳為使用1分鐘半衰期溫度為80℃～160℃之過氧化物，更佳為使用為90℃～140℃之過氧化物。
作為能夠使用之過氧化物，例如可列舉：過氧化二碳酸二(2-乙基己基)酯(1分鐘半衰期溫度：90.6℃)、過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度：92.1℃)、過氧化二碳酸二第二丁酯(1分鐘半衰期溫度：92.4℃)、過氧化新癸酸第三丁酯(1分鐘半衰期溫度：103.5℃)、過氧化特戊酸第三己酯(1分鐘半衰期溫度：109.1℃)、過氧化特戊酸第三丁酯(1分鐘半衰期溫度：110.3℃)、過氧化二月桂醯(1分鐘半衰期溫度：116.4℃)、過氧化二正辛醯(1分鐘半衰期溫度：117.4℃)、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯(1分鐘半衰期溫度：124.3℃)、過氧化二(4-甲基苯甲醯基)(1分鐘半衰期溫度：128.2℃)、過氧化二苯甲醯(1分鐘半衰期溫度：130.0℃)、過氧化異丁酸第三丁酯(1分鐘半衰期溫度：136.1℃)、1,1-二(過氧化第三己基)環己烷(1分鐘半衰期溫度：149.2℃)等。其中，由於交聯反應效率特別優異，因此較佳為使用過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度：92.1℃)、過氧化二月桂醯(1分鐘半衰期溫度：116.4℃)、過氧化二苯甲醯(1分鐘半衰期溫度：130.0℃)等。
再者，過氧化物之半衰期係表示過氧化物之分解速度之指標，係指過氧化物之殘餘量成為一半為止之時間。關於用於以任意時間獲得半衰期之分解溫度、任意溫度下之半衰期時間係記載於製造商目錄等中，例如記載於日本油脂股份有限公司之「有機過氧化物目錄第9版(2003年5月)」等。
交聯劑之使用量相對於(甲基)丙烯酸系聚合物100重量份，較佳為0.01～3重量份，更佳為0.02～2重量份，進而較佳為0.03～1重量份。再者，若交聯劑未達0.01重量份，則有黏著劑層之交聯變得不充分、不能滿足耐久性或黏著特性之虞，另一方面，若多於3重量份，則可見黏著劑層變得過硬而耐久性下降之傾向。
上述異氰酸酯系交聯劑可單獨使用1種，又，亦可混合使用2種以上，相對於上述(甲基)丙烯酸系聚合物100重量份，其整體含量較佳為0.01～2重量份，更佳為0.02～2重量份，進而較佳為0.05～1.5重量份。考慮到凝集力、耐久性試驗中之剝離之阻止等而能夠適當含有。
上述過氧化物可單獨使用1種，又，亦可混合使用2種以上，相對於上述(甲基)丙烯酸系聚合物100重量份，其整體含量較佳為0.01～2重量份，更佳為0.04～1.5重量份，進而較佳為0.05～1重量份。為了調整加工性、交聯穩定性等，於該範圍內進行適當選擇。
(4)離子性化合物
本發明之黏著劑組合物可進而含有離子性化合物。作為離子性化合物，並無特別限定，可較佳地使用本領域中使用者。例如可列舉日本專利特開2015-4861號公報中記載之離子性化合物，該等之中，較佳為(全氟烷基磺醯基)醯亞胺鋰鹽，更佳為雙(三氟甲磺醯基醯亞胺)鋰。又，上述離子性化合物之比率並無特別限定，可設為無損本發明效果之範圍，例如相對於上述(甲基)丙烯酸系聚合物100重量份，較佳為10重量份以下，更佳為5重量份以下，進而較佳為3重量份以下，尤佳為1重量份以下。
(5)其他
於本發明所使用之黏著劑組合物中，能夠調配具有反應性矽烷基之聚醚化合物。聚醚化合物在就能夠提高重工性方面而言較佳。聚醚化合物例如可使用日本專利特開2010-275522號公報中所揭示者。又，作為其添加量，可於無損本發明效果之範圍適當決定。
進而，於本發明所使用之黏著劑組合物中亦可含有其他公知之添加劑，例如可根據使用用途適當添加聚丙二醇等聚伸烷基二醇之聚醚化合物、著色劑、顏料等之粉體、染料、界面活性劑、塑化劑、黏著性賦予劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、防老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、無機或有機之填充劑、金屬粉、粒子狀、箔狀物等。又，亦可於能夠控制之範圍內採用添加還原劑之氧化還原系。該等添加劑較佳為在相對於(甲基)丙烯酸系聚合物100重量份為5重量份以下、進而3重量份以下、進而1重量份以下之範圍內使用。
2.透明導電層用黏著劑層
本發明之透明導電層用黏著劑層由上述黏著劑組合物形成。於形成黏著劑層時，較佳為調整交聯劑整體之添加量，並且充分考慮交聯處理溫度或交聯處理時間之影響。
可根據使用之交聯劑來調整交聯處理溫度、交聯處理時間。交聯處理溫度較佳為170℃以下。又，該交聯處理可於黏著劑層之乾燥步驟時之溫度下進行，亦可於乾燥步驟後另外設置交聯處理步驟來進行。又，關於交聯處理時間，可以考慮生產性或作業性來設定，通常為0.2～20分鐘左右，較佳為0.5～10分鐘左右。
上述黏著劑層之形成方法並無特別限定，可為如下方法：於各種基材上塗佈上述黏著劑組合物，藉由熱烘箱等乾燥器進行乾燥而使溶劑等揮發，又，視需要實施上述交聯處理而形成黏著劑層，並將該黏著劑層轉印至下述偏光膜或透明導電性基材上；亦可於上述偏光膜或透明導電性基材上直接塗佈上述黏著劑組合物而形成黏著劑層。於本發明中，較佳為如下方法：預先製作於偏光膜上形成有黏著劑層之附黏著劑層之偏光膜，將該附黏著劑層之偏光膜貼附於液晶單元。
作為上述基材，並無特別限定，例如可列舉：脫模膜、透明樹脂膜基材、下述偏光膜等各種基材。
作為對上述基材或偏光膜塗佈黏著劑組合物之方法，可使用各種方法。具體而言，例如可列舉：噴塗、輥塗、接觸輥式塗佈、凹版塗佈、反向塗佈、輥刷、噴塗、浸漬輥塗、棒塗、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、利用模嘴塗佈機等之擠出塗佈法等方法。
乾燥條件(溫度、時間)並無特別限定，可根據黏著劑組合物之組成、濃度等適當設定，例如，為80～200℃左右、較佳為90～170℃，並且為1～60分鐘，較佳為2～30分鐘。
又，於乾燥後可視需要實施交聯處理，其條件如上所述。
黏著劑層之厚度(乾燥後)例如較佳為5～100 μm，更佳為7～70 μm，進而較佳為10～50 μm。若黏著劑層之厚度未達5 μm，則有對被黏著體之密接性欠缺、在加濕條件下之耐久性不充分之傾向。另一方面，於黏著劑層之厚度超過100 μm之情形時，有如下傾向：於形成黏著劑層時之黏著劑組合物之塗佈、乾燥時，無法充分地乾燥而殘存氣泡，或者於黏著劑層之面產生厚度不均，外觀上之問題容易變得明顯。
作為上述脫模膜之構成材料，例如可列舉：聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等樹脂膜、紙、布、不織布等多孔性材料、網狀物、發泡片、金屬箔、及該等之層壓體等適當之薄片物等，就表面平滑性優異方面而言，可較佳地使用樹脂膜。
作為樹脂膜，例如可列舉：聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。
上述脫模膜之厚度通常為5～200 μm，較佳為5～100 μm左右。對於上述脫模膜，視需要亦可進行利用聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系之脫模劑、二氧化矽粉末等之脫模及防污處理、或塗佈型、混練型、蒸鍍型等之抗靜電處理。尤其是藉由對上述脫模膜之表面適當進行聚矽氧處理、長鏈烷基處理、氟處理等剝離處理，能夠進一步提高自上述黏著劑層之剝離性。
作為上述透明樹脂膜基材，並無特別限制，可使用具有透明性之各種樹脂膜。該樹脂膜係由1層膜形成。例如作為其材料，可列舉：聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等聚酯系樹脂、乙酸酯系樹脂、聚醚碸系樹脂、聚碳酸酯系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂、聚烯烴系樹脂、(甲基)丙烯酸系樹脂、聚氯乙烯系樹脂、聚偏二氯乙烯系樹脂、聚苯乙烯系樹脂、聚乙烯醇系樹脂、聚芳酯系樹脂、聚苯硫醚系樹脂等。該等之中，尤佳為聚酯系樹脂、聚醯亞胺系樹脂及聚醚碸系樹脂。
上述膜基材之厚度較佳為15～200 μm。
3.附黏著劑層之偏光膜
本發明之附黏著劑層之偏光膜係於偏光膜之至少一面具有上述黏著劑層。本發明之附黏著劑層之偏光膜係以使該偏光膜之黏著劑層與透明基材上具有透明導電層之透明導電性基材之上述透明導電層接觸之方式進行貼合而使用。
黏著劑層之形成方法如上所述。
作為偏光膜，並無特別限定，通常使用於偏光元件之單面或兩面具有透明保護膜者。
偏光元件並無特別限定，可使用各種偏光元件。作為偏光元件，例如可列舉：使聚乙烯醇系膜、部分縮甲醛化聚乙烯醇系膜、乙烯-乙酸乙烯酯共聚物系部分皂化膜等親水性高分子膜吸附碘或二色性染料之二色性物質並進行單軸延伸而成者；聚乙烯醇之脫水處理物或聚氯乙烯之脫鹽酸處理物等多烯系配向膜等。該等之中，較佳為包含聚乙烯醇系膜與碘等二色性物質之偏光元件，更佳為含有碘及/或碘離子之碘系偏光元件。又，該等偏光元件之厚度並無特別限制，通常為5～80 μm左右。
利用碘對聚乙烯醇系膜染色並進行單軸延伸而成之偏光元件例如可藉由如下方式製作：藉由將聚乙烯醇浸漬於碘之水溶液中而進行染色，延伸至原長之3～7倍。亦可視需要浸漬於硼酸、可包含硫酸鋅、氯化鋅等之碘化鉀等之水溶液中。進而，亦可視需要於染色前將聚乙烯醇系膜浸漬於水中進行水洗。藉由對聚乙烯醇系膜進行水洗，能夠將聚乙烯醇系膜表面之污染或抗黏連劑洗淨，此外，藉由使聚乙烯醇系膜膨潤，亦有防止染色不均等不均勻之效果。延伸可於利用碘進行染色之後進行，亦可一面染色一面延伸，又，即便於硼酸或碘化鉀等之水溶液或水浴中，亦能夠進行延伸。
又，於本發明中，亦可使用厚度為10 μm以下之薄型偏光元件。就薄型化之觀點而言，該厚度較佳為1～7 μm。此種薄型偏光元件就厚度不均較少、視認性優異，又，因尺寸變化較少而耐久性優異，進而偏光膜之厚度亦能夠實現薄型化之方面而言較佳。
作為薄型偏光元件，代表性而言，可列舉：日本專利特開昭51-069644號公報、日本專利特開2000-338329號公報、國際公開第2010/100917號說明書、或日本專利4751481號說明書、日本專利特開2012-073563號公報中記載之薄型偏光膜。該等薄型偏光膜可以藉由如下製作方法而獲得，該製作方法包括：以積層體之狀態將該聚乙烯醇系樹脂(以下，亦稱為PVA系樹脂)層及延伸用樹脂基材進行延伸之步驟、及進行染色之步驟。若為該製作方法，則即便PVA系樹脂層較薄，亦可藉由經延伸用樹脂基材支持而於不存在因延伸所引起之斷裂等缺陷之情況下進行延伸。
作為上述薄型偏光膜，就於包括以積層體之狀態進行延伸之步驟及染色之步驟的製作方法中，亦可以高倍率進行延伸而提高偏光性能之方面而言，較佳為如國際公開第2010/100917號說明書、或日本專利4751481號說明書、日本專利特開2012-073563號公報中所記載之藉由包括在硼酸水溶液中進行延伸之步驟之製法而獲得者，尤佳為日本專利4751481號說明書或日本專利特開2012-073563號公報中所記載之藉由包括在硼酸水溶液中進行延伸前輔助性地進行空中延伸之步驟之製法而獲得者。
作為形成設置於上述偏光元件之單面或兩面之透明保護膜之材料，例如可使用透明性、機械強度、熱穩定性、水分阻隔性、各向同性等優異之熱塑性樹脂。作為此種熱塑性樹脂之具體例，可列舉：三乙醯纖維素等纖維素樹脂、聚酯樹脂、聚醚碸樹脂、聚碸樹脂、聚碳酸酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚烯烴樹脂、(甲基)丙烯酸系樹脂、環狀聚烯烴樹脂(降𦯉烯系樹脂)、聚芳酯樹脂、聚苯乙烯樹脂、聚乙烯醇樹脂、及該等之混合物。再者，於偏光元件之單側，藉由接著劑層而貼合透明保護膜，於另一單側，作為透明保護膜，能夠使用(甲基)丙烯酸系、胺基甲酸酯系、丙烯酸胺基甲酸酯系、環氧系、聚矽氧系等熱硬化性樹脂或紫外線硬化型樹脂。於透明保護膜中亦可含有1種以上之任意適當之添加劑。作為添加劑，例如可列舉：紫外線吸收劑、防氧化劑、潤滑劑、塑化劑、脫模劑、防著色劑、阻燃劑、成核劑、抗靜電劑、顏料、著色劑等。透明保護膜中之上述熱塑性樹脂之含量較佳為50～100重量%，更佳為50～99重量%，進而較佳為60～98重量%，尤佳為70～97重量%。於透明保護膜中之上述熱塑性樹脂之含量為50重量%以下之情形時，有無法充分表現熱塑性樹脂原本所具有之高透明性等之虞。
透明保護膜之厚度可適當決定，就強度或處理性等作業性、薄膜性等方面而言，通常為1～500 μm左右。
上述偏光元件與透明保護膜通常經由水系接著劑等而密接。作為水系接著劑，可例示異氰酸酯系接著劑、聚乙烯醇系接著劑、明膠系接著劑、乙烯系乳膠系、水系聚胺基甲酸酯、水系聚酯等。除上述以外，作為偏光元件與透明保護膜之接著劑，可列舉紫外硬化型接著劑、電子束硬化型接著劑等。電子束硬化型偏光膜用接著劑對於上述各種透明保護膜顯示出較佳之接著性。又，於本發明所使用之接著劑中可含有金屬化合物填料。
又，於本發明中，亦可於偏光元件上形成相位差膜等代替偏光膜之透明保護膜。又，亦可於透明保護膜上進而設置另一透明保護膜、或設置相位差膜等。
亦可於上述透明保護膜之未接著偏光元件之面實施硬塗層或抗反射處理、抗沾黏處理、以擴散或防眩為目的之處理。
又，於偏光膜與黏著劑層之間，亦可具有增黏層。形成增黏層之材料並無特別限定，例如可列舉：各種聚合物類、金屬氧化物之溶膠、矽溶膠等。該等之中，尤佳為使用聚合物類。上述聚合物類之使用形態可為溶劑可溶型、水分散型、水溶解型中之任意形態。
作為上述聚合物類，例如可列舉：聚胺基甲酸酯系樹脂、聚酯系樹脂、丙烯酸系樹脂、聚醚系樹脂、纖維素系樹脂、聚乙烯醇系樹脂、聚乙烯基吡咯啶酮、聚苯乙烯系樹脂等。又，於上述聚合物類中，可使用能夠作為下述有機導電層之形成材料使用之聚噻吩等導電性聚合物。
又，於上述附黏著劑層之偏光膜之黏著劑層露出之情形時，亦可於供於使用之前利用脫模膜(隔離膜)保護黏著劑層。作為脫模膜，可列舉如上所述者。於製作上述黏著劑層時使用脫模膜作為基材之情形時，藉由將脫模膜上之黏著劑層與偏光膜貼合，該脫模膜可作為附黏著劑層之偏光膜之黏著劑層之脫模膜使用，於步驟方面可實現簡化。
本發明之附黏著劑層之偏光膜係貼合於透明基材上具有透明導電層之透明導電性基材之上述透明導電層而使用。
作為透明導電性基材之透明導電層之構成材料，並無特別限定，可使用選自由銦、錫、鋅、鎵、銻、鈦、矽、鋯、鎂、鋁、金、銀、銅、鈀、鎢所組成之群中之至少一種金屬之金屬氧化物。該金屬氧化物中亦可以視需要進而含有上述群所示之金屬原子。例如，較佳為使用含有氧化錫之氧化銦(ITO)、含有銻之氧化錫等，尤佳為使用ITO。作為ITO，較佳為含有氧化銦80～99重量%及氧化錫1～20重量%。
又，作為上述ITO，可列舉結晶性之ITO、非晶性(無定形)ITO，均適合使用。
透明導電性基材之透明導電層可列舉將金屬細線形成為格子狀之圖案而成之金屬網或塗佈金屬微粒子而形成者。作為構成之金屬材料，只要為導電性較高之金屬，則可使用任意適當之金屬(包括合金物質)。具體而言，較佳為例如選自由金、鉑、銀、鋁、及銅所組成之群中之1種以上之金屬，就導電性之觀點而言，較佳為鋁、銀、銅或金。
透明導電性基材之透明導電層可由有機導電膜形成。作為有機導電膜之形成材料，並無特別限定，可列舉導電性聚合物、包含電解質鹽與有機聚矽氧烷之離子導電性組合物、離子性化合物、各種界面活性劑(陽離子型、陰離子型及兩性界面活性劑)等。該等之中，就光學特性、外觀、抗靜電效果及抗靜電效果在熱時、加濕時之穩定性之觀點而言，較佳為使用導電聚合物。尤佳為使用聚苯胺、聚噻吩等導電性聚合物。該等導電性聚合物可使用水溶性、水分散性、有機溶劑可溶性、有機溶劑分散性均可，對於水溶性導電性聚合物或水分散性導電性聚合物而言，可將形成抗靜電層時之塗佈液製備成水溶液或水分散液，該塗佈液無需使用非水系有機溶劑，可抑制因該有機溶劑導致之透明基材之變質。再者，水溶液或水分散液除含有水以外，還可以含有水系溶劑。例如可列舉：甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇、正戊醇、異戊醇、第二戊醇、第三戊醇、1-乙基-1-丙醇、2-甲基-1-丁醇、正己醇、環己醇等醇類。
又，上述聚苯胺、聚噻吩等水溶性導電性聚合物或水分散性導電性聚合物較佳為在分子中具有親水性官能基。作為親水性官能基，例如可列舉：磺基、胺基、醯胺基、亞胺基、四級銨鹽基、羥基、巰基、肼基、羧基、硫酸酯基、磷酸酯基、或該等之鹽等。藉由於分子內具有親水性官能基，而容易於水中溶解，在水中容易以微粒子狀進行分散，可容易地製備上述水溶性導電性聚合物或水分散性導電性聚合物。
作為水溶性導電聚合物之市售品之例，可列舉聚苯胺磺酸(三菱麗陽股份有限公司製造，藉由聚苯乙烯換算求出之重量平均分子量為150000)等。作為水分散性導電聚合物之市售品之例，可列舉聚噻吩系導電性聚合物(Nagase Chemtex公司製造，商品名Denatron系列)等。
又，為了提高導電性聚合物之皮膜形成性、與透明基材之密接性等，上述導電性聚合物亦可添加黏合劑成分。於導電性聚合物為水溶性導電性聚合物或水分散性導電性聚合物之水系材料之情形時，使用水溶性或水分散性之黏合劑成分。作為黏合劑之例，可列舉：含㗁唑啉基之聚合物、聚胺基甲酸酯系樹脂、聚酯系樹脂、丙烯酸系樹脂、聚醚系樹脂、纖維素系樹脂、聚乙烯醇系樹脂、環氧樹脂、聚乙烯吡咯啶酮、聚苯乙烯系樹脂、聚乙二醇、季戊四醇等。尤佳為聚胺基甲酸酯系樹脂、聚酯系樹脂、丙烯酸系樹脂。該等黏合劑可根據其用途適當地使用1種或2種以上。
導電性聚合物、黏合劑之使用量雖亦取決於其等之種類，但較佳為以使所獲得之透明導電膜之表面電阻值成為1×108
～1×1012
Ω/□之方式進行控制。
進而，於本發明中使用之有機導電層中亦可含有其他公知之添加劑，例如可根據使用用途適當添加著色劑、顏料等之粉體、染料、界面活性劑、塑化劑、黏著性賦予劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、防老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、無機或有機之填充劑、金屬粉、粒狀、箔狀物等。
此外，有機導電膜亦可於透明基材上藉由形成導電性聚合物之單體之電解聚合而形成。
上述透明導電層之厚度並無特別限定，較佳為設為10 nm～1000 nm，更佳為50～400 nm。
作為上述透明導電層之形成方法，並無特別限定，可採用先前公知之方法。具體而言，例如可例示真空蒸鍍法、濺鍍法、離子鍍覆法。又，於塗佈塗敷液之情形時，例如可列舉：微凹版印刷塗佈法、輥塗法、浸塗法、流塗法、旋塗法、模塗法、澆鑄轉印法、噴塗法等。又，於金屬網之情形時，例如可藉由如下方式獲得：將含有銀鹽之感光性組合物(透明導電層形成用組合物)塗佈於脫模膜等被黏著體上，然後進行曝光處理及顯影處理，將金屬細線形成為特定之圖案。又，該透明導電層亦可將含有金屬微粒子之糊(透明導電層形成用組合物)按特定之圖案進行印刷而獲得。又，亦可根據所需之膜厚採用適當之方法。
又，亦可於上述透明導電層上具有外覆(OC)層(未圖示)。作為外覆層，可無特別限制地使用本領域中通常使用之外覆層，例如可列舉由醇酸樹脂、丙烯酸系樹脂、環氧樹脂、聚胺基甲酸酯樹脂、異氰酸酯樹脂等形成之層。作為外覆層之厚度，並無特別限定，例如較佳為0.1～10 μm。
作為透明基材，只要為透明之基板即可，對其素材並無特別限定，例如可列舉玻璃、透明樹脂膜基材。作為透明樹脂膜基材，可列舉上述者。
又，於透明導電層與透明基板之間亦可視需要設置底塗層、低聚物防止層等。
4.圖像顯示面板、圖像顯示裝置
本發明之圖像顯示面板之特徵在於具備上述附黏著劑層之偏光膜、及透明基材上具有透明導電層之透明導電性基材，且
上述附黏著劑層之偏光膜之黏著劑層貼合於上述圖像顯示面板之上述透明導電層。
又，本發明之圖像顯示裝置之特徵在於具有上述圖像顯示面板。
附黏著劑層之偏光膜、透明導電性基材如上所述。圖像顯示面板具有上述透明導電性基材，且與上述附黏著劑之偏光膜一起形成圖像顯示裝置之一部分。
對作為應用本發明之附黏著劑層之偏光膜之圖像顯示面板之代表性實施形態的液晶面板進行說明。液晶面板中使用之液晶單元具備透明基材上具有透明導電層之透明導電性基材，通常在液晶單元之視認側之表面具備該透明導電性基材。使用圖1對可於本發明中使用之包含液晶單元之液晶面板進行說明。但本發明不受圖1之限制。
作為可包含於本發明之圖像顯示面板中之液晶面板1之一實施形態，可列舉從視認側起包含視認側透明保護膜2/偏光元件3/液晶單元側透明保護膜4/黏著劑層5/透明導電層6/透明基材7/液晶層8/透明基材9/黏著劑層10/液晶單元側透明保護膜11/偏光元件12/光源側透明保護膜13之構成。圖1中，本發明之附黏著劑層之偏光膜相當於視認側透明保護膜2/偏光元件3/液晶單元側透明保護膜4/黏著劑層5。又，圖1中，本發明所使用之透明導電性基材係由透明導電層6/透明基材7所構成。又，圖1中，具備本發明所使用之透明導電性基材之液晶單元係由透明導電層6/透明基材7/液晶層8/透明基材9所構成。
進而，除上述構成以外，亦可於液晶面板1適當設置相位差膜、視角補償膜、亮度提高膜等光學膜。
作為液晶層8，並無特別限定，例如可使用：TN型、STN型、π型、VA型、IPS型等任意類型者。透明基板9(光源側)只要為透明之基板即可，其素材並無特別限定，例如可列舉玻璃、透明樹脂膜基材。作為透明樹脂膜基材，可列舉如上所述者。
又，光源側之黏著劑層10、液晶單元側透明保護膜11、偏光元件12、光源側透明保護膜13可使用先前本領域中所使用者，又，亦可較佳地使用本說明書中記載者。
上述液晶面板1之特徵在於：以液晶單元之透明導電層6與附黏著劑層之偏光膜之黏著劑層5接觸之方式，將本發明之附黏著劑層之偏光膜積層於形成於液晶單元之視認側之最外層的透明導電層6上。
本發明之圖像顯示裝置只要為包含具備本發明之附黏著劑層之偏光膜、及透明基材上具有透明導電層之透明導電性基材的圖像顯示面板者即可，較佳為包含上述液晶面板。以下，作為一例，對液晶顯示裝置進行說明，但本發明不受其所限定。
作為能夠應用上述圖像顯示面板之圖像顯示裝置之具體例，可列舉：液晶顯示裝置、電致發光(EL)顯示器、電漿顯示器(PD)、場發射顯示器(FED：Field Emission Display)等。
本發明之圖像顯示裝置只要為包含具備本發明之附黏著劑層之偏光膜、及透明基材上具有透明導電層之透明導電性基材之圖像顯示面板者即可，其他構成與先前之圖像顯示裝置相同。
[實施例]
以下，藉由實施例而具體地說明本發明，但本發明不受該等實施例之限定。再者，無特別規定之室溫放置條件全部為23℃、65%R.H.。
＜(甲基)丙烯酸系聚合物之重量平均分子量之測定＞
(甲基)丙烯酸系聚合物之重量平均分子量(Mw)係藉由GPC(凝膠滲透層析法)而進行測定。Mw/Mn亦以相同之方式進行測定。
・分析裝置：HLC-8120GPC，東曹股份有限公司製造
・管柱：G7000HXL＋GMHXL＋GMHXL，東曹股份有限公司製造
・管柱尺寸：各7.8 mm×30 cm 共計90 cm
・管柱溫度：40℃
・流量：0.8 mL/min
・注入量：100 μL
・溶離液：四氫呋喃
・檢測器：差示折射計(RI)
・標準試樣：聚苯乙烯
製造例1(偏光膜之製作)
將厚度80 μm之聚乙烯醇膜一面於30℃、0.3重量%濃度之碘溶液中染色1分鐘一面於速度比不同之輥間延伸至3倍。然後，於60℃、包含4重量%濃度之硼酸、10重量%濃度之碘化鉀之水溶液中，一面浸漬0.5分鐘一面延伸至總延伸倍率為6倍。其次，藉由於30℃、含有1.5重量%濃度之碘化鉀之水溶液中浸漬10秒鐘而進行洗淨後，於50℃下進行4分鐘之乾燥而獲得厚度30 μm之偏光元件。利用聚乙烯醇系接著劑將經皂化處理之厚度80 μm之三乙醯纖維素膜貼合於該偏光元件之兩面而製作偏光膜。
製造例2(丙烯酸系聚合物(a-1)之溶液之調整)
於具備攪拌翼、溫度計、氮氣導入管、冷卻器之四口燒瓶中添加含有丙烯酸丁酯99重量份、丙烯酸4-羥基丁酯1重量份之單體混合物。進而，相對於上述單體混合物(固形物成分)100重量份，與乙酸乙酯100重量份一起添加作為聚合起始劑之2,2'-偶氮二異丁腈0.1重量份，一面緩緩地攪拌一面導入氮氣而進行氮氣置換後，使燒瓶內之液體溫度保持於55℃附近，進行8小時聚合反應而製備重量平均分子量(Mw)156萬、Mw/Mn 3.2之丙烯酸系聚合物(a-1)之溶液。
製造例3～5
製造例2中，如表1所示般改變用於製備丙烯酸系聚合物之單體之種類、其使用比率，除此以外，藉由與製造例2相同之方法製備丙烯酸系聚合物(a-2)～(a-4)之溶液。
[表1] 丙烯酸系聚合物 調配比率(重量份) Mw Mw/Mn
BA NVP AA HBA
製造例2 (a-1) 99 - - 1 156 3.2
製造例3 (a-2) 99.3 - 0.3 0.4 162 3.4
製造例4 (a-3) 99.3 1.5 - 0.4 161 3.5
製造例5 (a-4) 97.8 1.5 0.3 0.4 155 3.7
表1中之簡稱分別如下所述。
BA：丙烯酸丁酯
NVP：N-乙烯基-2-吡咯啶酮
AA：丙烯酸
HBA：丙烯酸4-羥基丁酯
實施例1
(丙烯酸系黏著劑組合物之製備)
相對於製造例2中所獲得之丙烯酸系聚合物(a-1)之溶液之固形物成分100重量份，調配異氰酸酯交聯劑(商品名：Takenate D160N，三羥甲基丙烷六亞甲基二異氰酸酯，三井化學股份有限公司製造)0.1份、過氧化苯甲醯(Nyper BMT 40SV，日本油脂股份有限公司製造)0.3份、及3-巰基丙基三甲氧基矽烷(商品名：KBM-803，烷氧基量：47重量%，硫醇基當量：196g/mol，信越化學工業股份有限公司製造)0.3份，而製備丙烯酸系黏著劑組合物之溶液。
(附黏著劑層之偏光膜之製作)
以乾燥後之黏著劑層之厚度成為23 μm之方式將丙烯酸系黏著劑組合物之溶液塗佈於經聚矽氧系剝離劑處理之聚對苯二甲酸乙二酯膜(隔離膜，商品名：MRF38，三菱化學聚酯膜股份有限公司製造)之單面，於155℃下乾燥1分鐘而於隔離膜之表面形成黏著劑層。其次，將形成於隔離膜上之黏著劑層轉印至製造例1中所製作之偏光膜而製作附黏著劑層之偏光膜。
實施例2～13、比較例1～5
於實施例1中，如表2所示般改變丙烯酸系聚合物之種類、矽烷偶合劑之種類、其添加量，除此以外，藉由與實施例1相同之方法而製備丙烯酸系黏著劑組合物之溶液。再者，實施例12中，以表2所示之比率調配離子性化合物。使用所獲得之丙烯酸系黏著劑組合物之溶液，藉由與實施例1相同之方法製作附黏著劑層之偏光膜。
對上述實施例及比較例中獲得之附黏著劑層之偏光膜進行以下之評價。將評價結果示於表2。
＜評價樣品之製備＞
將實施例及比較例中所獲得之附黏著劑層之偏光膜裁切成15英吋，將所獲得者設為樣品。將該樣品貼合於附透明導電層之玻璃。作為附透明導電層之玻璃，使用於厚度0.7 mm之無鹼玻璃(商品名：EG-XG，康寧公司製造)上具有非晶性ITO層之附ITO層之玻璃、及於與上述相同之無鹼玻璃上具有有機導電膜之附有機導電膜之玻璃。使用貼合機將上述樣品分別黏貼於上述附ITO層之玻璃之ITO層、附有機導電膜之玻璃之有機導電膜。其次，以50℃、0.5 MPa進行15分鐘高壓釜處理，而使上述樣品分別完全密接於附ITO層之玻璃及附有機導電膜之玻璃。
再者，ITO層藉由濺鍍形成。ITO之組成中，Sn比率為3重量%，樣品之貼合前實施140℃×60分鐘之加熱步驟。再者，ITO之Sn比率由Sn原子之重量/(Sn原子之重量＋In原子之重量)算出。有機導電膜使用含聚乙二氧基噻吩·聚乙烯磺酸鹽之塗敷液並藉由旋塗法而形成。
＜剛塗敷後之耐久性試驗＞
對實施過該處理之樣品於60℃/95%RH之各氛圍下實施500小時處理後(加濕試驗)，按照下述基準利用目視分別評價偏光膜與附ITO層之玻璃之間、及偏光膜與附有機導電膜之玻璃之間之外觀。
(評價基準)
◎：完全不存在剝離等外觀上之變化。
○：端部稍有剝離，但實用上無問題。
△：端部有剝離，但只要不為特殊用途，則實用上無問題。
×：端部有顯著之剝離，且實用上有問題。
＜接著力＞
將實施例及比較例中獲得之附黏著劑層之偏光膜裁切成寬25 mm，將所獲得者設為評價樣品，除此以外，藉由與上述＜評價樣品之製備＞同樣之操作，貼合於附透明導電層之玻璃(附ITO層之玻璃與附有機導電膜之玻璃)，進行同樣之處理，使附黏著劑層之偏光膜完全密接於附透明導電層之玻璃(初期)。
然後，於60℃之乾燥條件下實施48小時加熱處理(加熱後)。測定上述樣品之接著力。接著力係藉由對利用拉伸試驗機(Autograph SHIMAZU AG-1 1OKN)以剝離角度90°、剝離速度300 mm/分鐘將該樣品剝離時之接著力(N/25mm)進行測定而求出。測定時，以1次/0.5秒之間隔取樣，將其平均值作為測定值。
＜重工性＞
將實施例及比較例中獲得之附黏著劑層之偏光膜裁切成長350 mm×寬250 mm，將所獲得者設為評價樣品，除此以外，實施與上述接著力之測定對象相同之處理。用人手將該樣品從附透明導電層之玻璃剝離，基於下述基準評價重工性。重工性之評價按照上述順序製作3片，並重複實施3次。
◎：3片均無糊劑殘留、膜斷裂，能良好地剝離。
○：3片中之一部分發生膜斷裂，但藉由再次剝離而剝離。
△：3片均發生膜斷裂，但藉由再次之剝離而剝離。
×：3片均有糊劑殘留、或幾次剝離膜均發生斷裂而不能剝離。
[表2] 黏著劑組合物 相對於附ITO層之玻璃 相對於附有機導電膜之玻璃
(甲基)丙烯酸系聚合物 交聯劑 矽烷偶合劑 離子性化合物
(重量份) 耐久性 接著力
(N/25 mm) 重工試驗 耐久性 接著力
(N/25 mm) 重工試驗
異氰酸酯系
(重量份) 過氧化物系
(重量份) 種類 硫醇基當量
(g/mol) 烷氧基量
(重量%) 添加量
(重量份) 60℃
/95%RH 初期 60℃
48 h後 60℃
/95%RH 初期 65℃48 h後
實施例1 (a-1) 0.1 0.3 KBM-803 196 47 0.3 - △ 4 7 ◎ ◎ 4.2 10.8 ◎
實施例2 (a-1) 0.1 0.3 X-41-1805 800 50 0.3 - △ 4.4 7 ◎ ◎ 3.2 10.2 ◎
實施例3 (a-1) 0.1 0.3 X-41-1818 850 60 0.3 - △ 4.5 6.9 ◎ ◎ 3 9.5 ◎
實施例4 (a-1) 0.1 0.3 X-41-1810 450 30 0.3 - 〇 4.8 7.2 ◎ ◎ 3.6 11 ◎
實施例5 (a-1) 0.1 0.3 X-41-1810 450 30 0.05 - 〇 5.4 6.8 ◎ ◎ 4.8 8.7 ◎
實施例6 (a-1) 0.1 0.3 X-41-1810 450 30 1 - 〇 4.3 7.3 ◎ ◎ 3.3 12.2 〇
實施例7 (a-1) 0.1 0.3 X-41-1810 450 30 6 - 〇 3 6.1 ◎ 〇 2.9 10.2 △
實施例8 (a-2) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6 7.9 ◎ ◎ 4 9.8 ◎
實施例9 (a-3) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6.2 8.3 ◎ ◎ 4.3 10.8 ◎
實施例10 (a-4) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6 8.2 ◎ ◎ 4.8 10.4 ◎
實施例11 (a-4) 0.1 0.3 X-41-1805 800 50 0.3 - 〇 5.3 6.9 ◎ ◎ 4.5 10.1 ◎
實施例12 (a-4) 0.1 0.3 X-41-18l8 850 60 0.3 - 〇 5.8 7.1 ◎ ◎ 4.2 11.1 ◎
實施例13 (a-4) 0.1 0.3 X-41-1810 450 30 0.3 1 ◎ 6 7.5 ◎ ◎ 3.9 9.9 ◎
比較例1 (a-1) 0.1 0.3 - - - - - × 5.8 6.3 ◎ × 5.9 11.8 ◎
比較例2 (a-1) 0.1 0.3 KBM-403 - 39 0.3 - × 4 6.9 ◎ 〇 6.6 12.7 〇
比較例3 (a-1) 0.1 0.3 X-41-1056 - 17 0.3 - 〇 4.9 9.2 ◎ ◎ 17.1 19.9 ×
比較例4 (a-2) 0.1 0.3 X-41-1056 - 17 0.3 - ◎ 6.9 12.4 〇 ◎ 16.6 21.6 ×
比較例5 (a-3) 0.1 0.3 X-41-1056 - 17 0.3 - ◎ 6.3 12.9 〇 ◎ 17.9 20.7 ×
表2中之簡稱分別如下所述。
異氰酸酯系：商品名：Takenate D160N，三羥甲基丙烷六亞甲基二異氰酸酯，三井化學股份有限公司製造；
過氧化物系：商品名：Nyper BMT 40SV，過氧化苯甲醯，日本油脂股份有限公司製造；
KBM-803：3-巰基丙基三甲氧基矽烷，烷氧基量：47重量%，硫醇基當量：196g/mol，信越化學工業股份有限公司製造；
X-41-1805：低聚物型含硫醇基之矽烷偶合劑，烷氧基量：50重量%，硫醇基當量：800 g/mol，信越化學工業股份有限公司製造；
X-41-1818：低聚物型含硫醇基之矽烷偶合劑，烷氧基量：60重量%，硫醇基當量：850 g/mol，信越化學工業股份有限公司製造；
X-41-1810：低聚物型含硫醇基之矽烷偶合劑，烷氧基量：30重量%，硫醇基當量：450 g/mol，信越化學工業股份有限公司製造；
KBM-403：γ-縮水甘油氧基丙基甲氧基矽烷，烷氧基量：39重量%，信越化學工業股份有限公司製造；
X-41-1056：低聚物型含環氧基之矽烷偶合劑，烷氧基量：17重量%，環氧當量：280 g/mol，信越化學工業股份有限公司製造；
離子性化合物：雙(三氟甲磺醯亞胺)鋰，Mitsubishi Materials股份有限公司製造。1. Adhesive composition The adhesive composition of the present invention is characterized in that it is used to form the following adhesive layer, and the adhesive layer is attached to a transparent conductive substrate with a transparent conductive layer on a transparent substrate The above-mentioned transparent conductive layer is used, and it contains a (meth)acrylic polymer and a thiol group-containing silane coupling agent. Hereinafter, the composition of the adhesive composition of the present invention will be described. (1) (Meth)acrylic polymer The adhesive composition of the present invention preferably contains a (meth)acrylic polymer and a thiol group-containing silane coupling agent, and contains a (meth)acrylic polymer as the main component. Here, the so-called main component refers to the component with the largest proportion among the total solid content contained in the adhesive composition, for example, the component that accounts for more than 50% by weight of the total solid content contained in the adhesive composition. , and then account for more than 70% by weight of the composition. A (meth)acrylic-type polymer normally contains the (meth)acrylic-acid alkylester as a monomer unit as a main component. In addition, (meth)acrylate means acrylate and/or methacrylate, and (meth) of this invention is the same meaning. As the alkyl (meth)acrylate constituting the main skeleton of the (meth)acrylic polymer, a linear or branched alkyl group having 1 to 18 carbon atoms can be exemplified. For example, as the above-mentioned alkyl group, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, hexyl, cyclohexyl, heptyl, 2-ethylhexyl, isooctyl, Nonyl, decyl, isodecyl, dodecyl, isomyristyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, and the like. These can be used alone or in combination. As an average carbon number of these alkyl groups, 3-9 are preferable. As the monomer constituting the (meth)acrylic polymer, in addition to the above-mentioned alkyl (meth)acrylate, a carboxyl group-containing monomer, a hydroxyl group-containing monomer, an amide group-containing monomer, (meth)acrylates containing aromatic rings, etc. The carboxyl group-containing monomer system is a compound containing a carboxyl group and a polymerizable unsaturated double bond such as a (meth)acryloyl group and a vinyl group in its structure. Specific examples of the carboxyl group-containing monomer include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, Butenoic acid, etc. Among the above-mentioned carboxyl group-containing monomers, acrylic acid is preferred from the viewpoints of copolymerizability, price, and adhesive properties. The hydroxyl group-containing monomer system is a compound containing a hydroxyl group in its structure and a polymerizable unsaturated double bond such as a (meth)acryloyl group and a vinyl group. Specific examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth)acrylate ) Hydroxyalkyl (meth)acrylates such as 6-hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, etc. ester or (4-hydroxymethylcyclohexyl) methacrylate, etc. Among the above-mentioned hydroxyl-containing monomers, 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are preferred in terms of durability, and 4-(meth)acrylate is particularly preferred. -Hydroxybutyl ester. The amide group-containing monomer system contains an amide group in its structure and a compound containing a polymerizable unsaturated double bond such as a (meth)acryloyl group and a vinyl group. Specific examples of the amide group-containing monomer include (meth)acrylamide, N,N-dimethyl(meth)acrylamide, and N,N-diethyl(meth)propylene Acrylamide, N-isopropylacrylamide, N-methyl(meth)acrylamide, N-butyl(meth)acrylamide, N-hexyl(meth)acrylamide, N-hydroxyl Methyl (meth) acrylamide, N-methylol-N-propane (meth) acrylamide, aminomethyl (meth) acrylamide, aminoethyl (meth) acrylamide , mercaptomethyl (meth) acrylamide, mercaptoethyl (meth) acrylamide and other acrylamide monomers; N-(meth) acrylamide, N-(meth) acrylamide N-acryloyl heterocyclic monomers such as piperidine, N-(meth)acryloyl pyrrolidine, etc.; N-vinyl pyrrolidone, N-vinyl-ε-caprolactamide, etc. Base lactam-based monomers, etc. In terms of satisfying durability, an amide group-containing monomer is preferred, and among the amide group-containing monomers, in terms of both durability and reworkability of the transparent conductive layer, N is particularly preferred. - Vinyl lactamide-based monomer. The above-mentioned aromatic ring-containing (meth)acrylate is a compound containing an aromatic ring structure and a (meth)acryloyl group in its structure. As an aromatic ring, a benzene ring, a naphthalene ring, or a biphenyl ring is mentioned. The aromatic ring-containing (meth)acrylate can satisfy durability (especially for the transparent conductive layer). Specific examples of the aromatic ring-containing (meth)acrylate include benzyl (meth)acrylate, phenyl (meth)acrylate, o-phenylphenol (meth)acrylate, (meth)acrylate Phenoxy acrylate, phenoxyethyl (meth)acrylate, phenoxypropyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, modified with ethylene oxide Nonylphenol (meth)acrylate, ethylene oxide modified cresol (meth)acrylate, phenol ethylene oxide modified (meth)acrylate, (meth)acrylic acid 2- Hydroxy-3-phenoxypropyl ester, methoxybenzyl (meth)acrylate, chlorobenzyl (meth)acrylate, cresyl (meth)acrylate, polystyrene (meth)acrylate, etc. Those with a benzene ring; hydroxyethylated β-naphthol acrylate, 2-naphthylethyl (meth)acrylate, 2-naphthyloxyethyl acrylate, 2-(4-methoxy) (meth)acrylate Those having a naphthalene ring, such as 1-naphthyloxy) ethyl ester; those having a biphenyl ring, such as biphenyl (meth)acrylate. The above carboxyl group-containing monomers, hydroxyl group-containing monomers, amide group-containing monomers, and aromatic ring-containing (meth)acrylates react with the crosslinking agent when the adhesive composition contains a crosslinking agent point. In particular, the carboxyl group-containing monomer and the hydroxyl group-containing monomer have high reactivity with the intermolecular crosslinking agent, so they can be preferably used to improve the cohesiveness or heat resistance of the obtained adhesive layer. The (meth)acrylic polymer used in the present invention preferably contains each of the above-mentioned monomers as monomer units in the following amounts in the weight ratio of all the constituent monomers (100% by weight). The weight ratio of the said alkyl (meth)acrylate can be made into the residual part of the monomer other than the alkyl (meth)acrylate, specifically, it is preferable that it is 70 weight% or more. It is preferable to make the weight ratio of the alkyl (meth)acrylate into the said range from the point of ensuring adhesiveness. The weight ratio of the above-mentioned carboxyl group-containing monomer is preferably 2 wt % or less, more preferably 0.01 to 2 wt %, further preferably 0.05 to 1.5 wt %, further preferably 0.05 to 1 wt %, particularly preferably 0.05 ~0.5 wt%. If the weight ratio of the carboxyl group-containing monomer is less than 0.01% by weight, there is a tendency that both durability and heavy-duty cannot be achieved. On the other hand, when it exceeds 2 weight%, the transparent conductive layer may corrode, and there exists a tendency for the durability and reworkability to become unsatisfactory, and it is unfavorable. The weight ratio of the hydroxyl group-containing monomer is preferably 3% by weight or less, more preferably 0.01 to 3% by weight, still more preferably 0.1 to 2% by weight, particularly preferably 0.2 to 2% by weight. If the weight ratio of the hydroxyl group-containing monomer is less than 0.01% by weight, the crosslinking of the adhesive layer will be insufficient, and the durability and reworkability may not be achieved, or the adhesive properties may not be satisfied. On the other hand, when it exceeds 3 weight%, there exists a tendency for it to become impossible to satisfy both durability and heavy duty. The weight ratio of the amide group-containing monomer is preferably 8% by weight or less, more preferably 0.1 to 8% by weight, still more preferably 0.3 to 5% by weight, still more preferably 0.3 to 4% by weight, particularly preferably 0.7 to 2.5% by weight. If the weight ratio of the amide group-containing monomer is less than 0.1 wt %, there is a tendency that the durability and reworkability of the transparent conductive layer cannot be achieved in particular. On the other hand, when it exceeds 8 weight%, there exists a tendency for the durability and heavy workability not to be satisfied. The weight ratio of the aromatic ring-containing (meth)acrylate is preferably 25% by weight or less, more preferably 0 to 22% by weight, and still more preferably 0 to 18% by weight. If the weight ratio of the aromatic ring-containing (meth)acrylate exceeds 25% by weight, there is a tendency that both durability and heavy-duty properties cannot be satisfied. In the above-mentioned (meth)acrylic polymer, in addition to the above-mentioned monomeric unit, there is no need to particularly contain other monomeric units, but in order to improve adhesiveness or to achieve both heat resistance and reworkability, it may be introduced by copolymerization. One or more comonomers containing a polymerizable functional group containing an unsaturated double bond such as a (meth)acryloyl group or a vinyl group. The ratio of the above-mentioned comonomer in the (meth)acrylic polymer is preferably 0 to 10 weight percent in the weight ratio of the total constituent monomers (100% by weight) of the (meth)acrylic polymer. %, more preferably about 0 to 7% by weight, still more preferably about 0 to 5% by weight. The (meth)acrylic polymer of the present invention is usually used with a weight average molecular weight of 1,000,000 to 2,500,000. In consideration of durability, especially heat resistance, the weight average molecular weight is preferably 1,200,000 to 2,000,000. If the weight average molecular weight is less than 1 million, it is unfavorable in terms of heat resistance. Moreover, when a weight average molecular weight exceeds 2,500,000, there exists a tendency for an adhesive to become hard easily, and it becomes easy to generate|occur|produce peeling. In addition, the weight average molecular weight (Mw)/number average molecular weight (Mn) representing the molecular weight distribution is preferably 1.8 or more and 10 or less, more preferably 1.8 to 7, and still more preferably 1.8 to 5. When the molecular weight distribution (Mw/Mn) exceeds 10, it is unfavorable in terms of durability. In addition, the weight average molecular weight and molecular weight distribution (Mw/Mn) were measured by GPC (Gel Permeation Chromatography, gel permeation chromatography), and were calculated|required from the value calculated by polystyrene conversion. For the production of such a (meth)acrylic polymer, known production methods such as solution polymerization, block polymerization, emulsion polymerization, and various radical polymerizations can be appropriately selected. In addition, the obtained (meth)acrylic polymer may be any of a random copolymer, a block copolymer, a graft copolymer, and the like. In addition, in solution polymerization, as a polymerization solvent, ethyl acetate, toluene, etc. are used, for example. As a specific example of solution polymerization, the reaction is carried out by adding a polymerization initiator under an inert gas flow such as nitrogen, usually at about 50 to 70° C. under the reaction conditions for about 5 to 30 hours. The polymerization initiator, chain transfer agent, emulsifier and the like used in the radical polymerization are not particularly limited, and can be appropriately selected and used. In addition, the weight average molecular weight of a (meth)acrylic-type polymer can be controlled by the usage-amount of a polymerization initiator, a chain transfer agent, and reaction conditions, and the usage-amount can be adjusted suitably according to these kinds. As a polymerization initiator, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-amidinopropane) dihydrochloride, 2,2'-azobis [2-(5-Methyl-2-imidazolin-2-yl)propane]dihydrochloride, 2,2'-azobis(2-methylpropionamidine)disulfate, 2,2'- Azobis(N,N'-dimethyleneisobutylamidine), 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine]hydrate (trade name : Azo-based initiators such as VA-057, Wako Pure Chemical Industries, Ltd.), potassium persulfate, ammonium persulfate and other persulfates, bis(2-ethylhexyl)peroxydicarbonate, peroxide Di(4-tert-butylcyclohexyl) dicarbonate, di-2-butyl peroxydicarbonate, 3-butyl peroxyneodecanoate, 3-hexyl peroxypivalate, peroxypivalic acid Tertiary butyl ester, dilaurin peroxide, di-n-octyl peroxide, 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate, bis(4-methylbenzene peroxide) carboxyl), dibenzoyl peroxide, tert-butyl peroxyisobutyrate, 1,1-bis(tert-hexyl peroxide) cyclohexane, tert-butyl hydroperoxide, hydrogen peroxide, etc. Peroxide-based initiators, combinations of persulfate and sodium bisulfite, combinations of peroxides and sodium ascorbate, etc. Redox-based initiators of peroxides and reducing agents, etc., but not limited to such. The above-mentioned polymerization initiators may be used alone or in combination of two or more, and the overall content is preferably about 0.005 to 1 part by weight, more preferably 0.02 to 0.5 parts by weight relative to 100 parts by weight of the total amount of the monomer components. About parts by weight. In addition, in order to use, for example, 2,2'-azobisisobutyronitrile as a polymerization initiator to produce a (meth)acrylic polymer of the above-mentioned weight-average molecular weight, with respect to 100 parts by weight of the total amount of the monomer components, The amount of the polymerization initiator to be used is preferably about 0.06 to 0.2 parts by weight, more preferably about 0.08 to 0.175 parts by weight. Moreover, a chain transfer agent, an emulsifier, etc. can use previously well-known suitably. These addition amounts can also be suitably determined in the range which does not impair the effect of this invention. (2) Thiol group-containing silane coupling agent The present invention is characterized in that a thiol group-containing silane coupling agent is contained in the adhesive composition. By containing a thiol group-containing silane coupling agent in the adhesive composition, the durability of the adhesive layer formed from the adhesive composition can be improved, especially in a humidified environment, the durability is excellent, and heavy work can be taken into account. sex. Furthermore, among the thiol group-containing silane coupling agents, an oligomer-type thiol group-containing silane coupling agent is particularly preferable. Here, the term "oligomer type" refers to a polymer having more than a dimer of monomers and less than about 100 polymers, and the weight average molecular weight of the oligomer type silane coupling agent is preferably about 300 to 30,000. The oligomer-type thiol group-containing silane coupling agent is preferably an oligomer-type thiol group-containing silane coupling agent having two or more alkoxysilyl groups in the molecule. Specifically, X-41-1805, X-41-1810, X-41-1818 etc. by Shin-Etsu Chemical Co., Ltd. are mentioned, for example. These coupling agents are not easily volatile and have a plurality of alkoxysilyl groups, and are therefore more effective in improving durability and reworkability, and are therefore preferred. Examples of the thiol group-containing silane coupling agent other than the oligomer type include 3-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, and the like. Specifically, KBM-803 etc. by Shin-Etsu Chemical Industry Co., Ltd. are mentioned, for example. The number of the alkoxysilyl groups of the thiol group-containing silane coupling agent is not particularly limited, but is preferably two or more in the molecule. In addition, the amount of the alkoxy group in the thiol group-containing silane coupling agent is preferably 10 to 60% by weight, more preferably 20 to 50% by weight, and still more preferably 20 to 40% by weight in the silane coupling agent. The type of the alkoxy group is not particularly limited, and examples thereof include alkoxy groups having 1 to 6 carbon atoms, such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. Among these, a methoxy group and an ethoxy group are preferable, and a methoxy group is more preferable. Moreover, it is also preferable that both a methoxy group and an ethoxy group are contained in one molecule. The thiol group equivalent (mercapto equivalent) of the above-mentioned thiol group-containing silane coupling agent is preferably 1000 g/mol or less, more preferably 800 g/mol or less, more preferably 700 g/mol or less, more preferably 500 g /mol or less. In addition, the lower limit of the thiol group equivalent is not particularly limited, but when the above-mentioned thiol group-containing silane coupling agent is an oligomer type, it is preferably 200 g/mol or more, for example. The above-mentioned thiol group-containing silane coupling agents (especially oligomer type thiol group-containing silane coupling agents) may be used alone or in combination of two or more kinds. 100 parts by weight, the overall content is preferably 0.01-6 parts by weight, more preferably 0.01-3 parts by weight, and still more preferably 0.05-1 part by weight. By containing the thiol group-containing silane coupling agent in the above-mentioned range, the durability of the adhesive layer can be improved, and especially the durability in a humidified environment can be excellent, and the reworkability can be taken into consideration. In addition, silane coupling agents other than the above-mentioned thiol group-containing silane coupling agents may be added to the adhesive composition of the present invention. As other coupling agents, 3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, 3-triethoxy Silyl-N-(1,3-dimethylbutylene)propylamine, N-phenyl-γ-aminopropyltrimethoxysilane and other amine-containing silane coupling agents, 3-propenyloxypropyl (Meth)acryloyl group-containing silane coupling agents such as trimethoxysilane, 3-methacryloyloxypropyltriethoxysilane, isocyanatopropyltriethoxysilane, etc. Silane coupling agent of cyano group, etc. Silane coupling agents other than the above-mentioned thiol group-containing silane coupling agents may be added within a range that does not impair the effect of the present invention, and the amount of addition thereof is not particularly limited. (3) Cross-linking agent The adhesive composition used in the present invention preferably contains a cross-linking agent. As the crosslinking agent, an organic crosslinking agent or a polyfunctional metal chelate compound can be used. As an organic type crosslinking agent, an isocyanate type crosslinking agent, a peroxide type crosslinking agent, an epoxy type crosslinking agent, an imine type crosslinking agent, etc. are mentioned. The polyfunctional metal chelate is a covalent bond or a coordinate bond between a polyvalent metal and an organic compound. Examples of polyvalent metal atoms include Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn, In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, Ti Wait. Examples of atoms in the covalently or coordinately bonded organic compound include oxygen atoms and the like, and examples of the organic compound include alkyl esters, alcohol compounds, carboxylic acid compounds, ether compounds, ketone compounds, and the like. As the crosslinking agent, an isocyanate-based crosslinking agent and/or a peroxide-based crosslinking agent is preferred, and it is more preferred to use an isocyanate-based crosslinking agent and a peroxide-based crosslinking agent in combination. As the isocyanate-based crosslinking agent, a compound having at least two isocyanate groups can be used. For example, well-known aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanates, etc., which are generally used in the urethanization reaction, are used. Examples of aliphatic polyisocyanates include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3 -butylene diisocyanate, dodecylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc. Examples of alicyclic polyisocyanates include 1,3-cyclopentene diisocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexanediisocyanate, isophorone diisocyanate, hydrogenated diisocyanate Phenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated tetramethyl xylylene diisocyanate and the like. Examples of aromatic diisocyanates include benzene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenylene Methane diisocyanate, 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, xylylene diisocyanate Wait. In addition, as the isocyanate-based crosslinking agent, the above-mentioned diisocyanate polymers (dimers, trimers, pentamers, etc.), and aminomethyl esters obtained by reacting with polyols such as trimethylolpropane are exemplified. Ester modified product, urea modified product, biuret modified product, allophanate modified product, isocyanurate modified product, carbodiimide modified product, etc. Examples of commercially available isocyanate-based crosslinking agents include trade names "Millionate MT", "Millionate MTL", "Millionate MR-200", "Millionate MR-400", "Millionate MR-400", "Millionate Coronate L", "Coronate HL", "Coronate HX", "Takenate D-110N", "Takenate D-120N", "Takenate D-140N", "Takenate D-160N" manufactured by Mitsui Chemicals Co., Ltd. , "Takenate D-165N", "Takenate D-170HN", "Takenate D-178N", "Takenate 500", "Takenate 600", etc. These compounds may be used alone or in combination of two or more. The isocyanate-based crosslinking agent is preferably an aliphatic polyisocyanate and an aliphatic polyisocyanate-based compound of its modified form. Compared with other isocyanate-based cross-linking agents, the aliphatic polyisocyanate-based compound has a more flexible cross-linked structure, easily relieves the stress caused by the expansion/contraction of the optical film, and is difficult to peel off in the durability test. As the aliphatic polyisocyanate-based compound, hexamethylene diisocyanate and modified products thereof are particularly preferred. The peroxide can be appropriately used as long as it generates radically active species by heating or light irradiation to perform crosslinking of the base polymer ((meth)acrylic polymer) of the adhesive composition. In consideration of workability and stability, it is preferable to use a peroxide having a half-life temperature of 80°C to 160°C for 1 minute, and more preferably a peroxide having a half-life temperature of 90°C to 140°C. Examples of peroxides that can be used include bis(2-ethylhexyl)peroxydicarbonate (1-minute half-life temperature: 90.6°C), bis(4-tert-butylcyclohexyl)peroxydicarbonate Esters (1-minute half-life temperature: 92.1°C), di-2-butyl peroxydicarbonate (1-minute half-life temperature: 92.4°C), 3-butyl peroxyneodecanoate (1-minute half-life temperature: 103.5°C), 3-hexyl pivalate oxide (1-minute half-life temperature: 109.1°C), 3-butyl peroxypivalate (1-minute half-life temperature: 110.3°C), dilaurin peroxide (1-minute half-life temperature: 116.4°C) ), di-n-octyl peroxide (1-minute half-life temperature: 117.4°C), 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate (1-minute half-life temperature: 124.3°C), Dibenzyl peroxide (1-minute half-life temperature: 128.2°C), Dibenzyl peroxide (1-minute half-life temperature: 130.0°C), tert-butyl peroxyisobutyrate (1 1-minute half-life temperature: 136.1°C), 1,1-bis(3-hexyl peroxide) cyclohexane (1-minute half-life temperature: 149.2°C), and the like. Among them, since the crosslinking reaction efficiency is particularly excellent, it is preferable to use bis(4-tert-butylcyclohexyl)peroxydicarbonate (1-minute half-life temperature: 92.1°C), dilaurin peroxide (1-minute half-life) temperature: 116.4°C), dibenzoyl peroxide (1 minute half-life temperature: 130.0°C), and the like. In addition, the half-life of a peroxide is an index which shows the decomposition rate of a peroxide, and means the time until the residual amount of a peroxide becomes half. The decomposition temperature for obtaining the half-life at an arbitrary time and the half-life time at an arbitrary temperature are described in the manufacturer's catalogue, etc., for example, in "Organic Peroxide Catalogue 9th Edition (May 2003) of NOF Corporation. )"Wait. The use amount of the crosslinking agent is preferably 0.01 to 3 parts by weight, more preferably 0.02 to 2 parts by weight, and still more preferably 0.03 to 1 part by weight relative to 100 parts by weight of the (meth)acrylic polymer. Furthermore, if the amount of the crosslinking agent is less than 0.01 parts by weight, the crosslinking of the adhesive layer may become insufficient, and the durability and adhesion properties may not be satisfied. On the other hand, if it exceeds 3 parts by weight, adhesion may be observed. The tendency of the agent layer to become too hard and the durability to decrease. The above-mentioned isocyanate-based crosslinking agent may be used alone or in combination of two or more kinds. The total content of the above-mentioned isocyanate-based crosslinking agent is preferably 0.01 to 2 parts by weight relative to 100 parts by weight of the (meth)acrylic polymer. It is preferably 0.02 to 2 parts by weight, more preferably 0.05 to 1.5 parts by weight. It can be appropriately contained in consideration of cohesive strength, prevention of peeling in a durability test, and the like. The above-mentioned peroxides may be used alone or in combination of two or more kinds, and the total content is preferably 0.01 to 2 parts by weight, more preferably 100 parts by weight of the above-mentioned (meth)acrylic polymer. 0.04 to 1.5 parts by weight, more preferably 0.05 to 1 part by weight. In order to adjust processability, crosslinking stability, etc., it selects suitably within this range. (4) Ionic compound The adhesive composition of this invention may further contain an ionic compound. It does not specifically limit as an ionic compound, It can use suitably by the user in this field. For example, the ionic compounds described in Japanese Patent Laid-Open No. 2015-4861 can be cited, among them, lithium (perfluoroalkylsulfonyl)imide is preferred, and bis(trifluoromethane) is more preferred. Sulfonyl imide) lithium. Moreover, the ratio of the said ionic compound is not specifically limited, It can be set as the range which does not impair the effect of this invention, For example, with respect to 100 weight part of the said (meth)acrylic type polymer, it is preferably 10 parts by weight or less, more preferably 5 parts by weight or less, more preferably 3 parts by weight or less, particularly preferably 1 part by weight or less. (5) Others In the adhesive composition used in the present invention, a polyether compound having a reactive silane group can be formulated. The polyether compound is preferable in that the reworkability can be improved. As a polyether compound, the thing disclosed in Unexamined-Japanese-Patent No. 2010-275522 can be used, for example. In addition, the addition amount can be suitably determined in the range which does not impair the effect of this invention. Furthermore, other known additives may be contained in the adhesive composition used in the present invention, for example, powders such as polyether compounds of polyalkylene glycols such as polypropylene glycol, colorants, and pigments may be appropriately added according to the application. , dyes, surfactants, plasticizers, adhesion imparting agents, surface lubricants, leveling agents, softeners, antioxidants, antiaging agents, light stabilizers, UV absorbers, polymerization inhibitors, inorganic or organic Fillers, metal powders, particles, foils, etc. In addition, a redox system in which a reducing agent is added may be used within a controllable range. These additives are preferably used within a range of 5 parts by weight or less, further 3 parts by weight or less, and further 1 part by weight or less with respect to 100 parts by weight of the (meth)acrylic polymer. 2. Adhesive layer for transparent conductive layers The adhesive layer for transparent conductive layers of the present invention is formed from the above-mentioned adhesive composition. When forming the adhesive layer, it is preferable to adjust the addition amount of the entire cross-linking agent, and fully consider the influence of the cross-linking treatment temperature or the cross-linking treatment time. The cross-linking treatment temperature and the cross-linking treatment time can be adjusted according to the cross-linking agent used. The crosslinking treatment temperature is preferably 170°C or lower. In addition, this crosslinking process may be performed at the temperature of the drying step of the adhesive layer, or may be performed by providing a separate crosslinking treatment step after the drying step. In addition, the crosslinking treatment time can be set in consideration of productivity and workability, but is usually about 0.2 to 20 minutes, preferably about 0.5 to 10 minutes. The method of forming the above-mentioned adhesive layer is not particularly limited, and may be a method of applying the above-mentioned adhesive composition to various substrates, drying with a drier such as a hot oven to volatilize a solvent, etc., and implementing as necessary The above-mentioned cross-linking treatment is performed to form an adhesive layer, and the adhesive layer is transferred to the following polarizing film or transparent conductive substrate; the above-mentioned adhesive can also be directly coated on the above-mentioned polarizing film or transparent conductive substrate composition to form an adhesive layer. In the present invention, the method is preferably as follows: forming a polarizing film with an adhesive layer on the polarizing film in advance, and attaching the polarizing film with an adhesive layer on a liquid crystal cell. Although it does not specifically limit as said base material, For example, various base materials, such as a mold release film, a transparent resin film base material, and the following polarizing film, are mentioned. Various methods can be used as a method of applying the adhesive composition to the above-mentioned base material or polarizing film. Specifically, for example, spray coating, roll coating, touch roll coating, gravure coating, reverse coating, roll brushing, spray coating, dip roll coating, bar coating, blade coating, air knife coating, curtain coating can be mentioned. methods such as die coating, die lip coating, and extrusion coating using a die nozzle coater. The drying conditions (temperature, time) are not particularly limited, and can be appropriately set according to the composition and concentration of the adhesive composition, for example, about 80 to 200°C, preferably 90 to 170°C, and for 1 to 60 minutes, Preferably it is 2 to 30 minutes. Moreover, after drying, a crosslinking process may be performed as needed, and the conditions are as described above. The thickness of the adhesive layer (after drying) is, for example, preferably 5 to 100 μm, more preferably 7 to 70 μm, and still more preferably 10 to 50 μm. If the thickness of the adhesive layer is less than 5 μm, the adhesion to the adherend tends to be insufficient, and the durability under humidified conditions tends to be insufficient. On the other hand, when the thickness of the adhesive layer exceeds 100 μm, there is a tendency that during application and drying of the adhesive composition for forming the adhesive layer, the adhesive composition cannot be dried sufficiently and air bubbles remain, or the adhesive Uneven thickness occurs on the surface of the agent layer, and problems in appearance tend to become apparent. Examples of the constituent material of the mold release film include resin films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films, porous materials such as paper, cloth, and non-woven fabrics, meshes, woven fabrics, and the like. A resin film can be preferably used in terms of excellent surface smoothness as appropriate thin objects such as foam sheets, metal foils, and laminates thereof. As a resin film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyterephthalic acid film can be mentioned, for example. Ethylene glycol film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, etc. The thickness of the said release film is 5-200 micrometers normally, Preferably it is about 5-100 micrometers. For the above-mentioned mold release film, mold release and antifouling treatment using polysiloxane-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based mold release agents, silica powder, etc. Antistatic treatment for cloth type, kneading type, vapor deposition type, etc. In particular, the peelability from the adhesive layer can be further improved by appropriately performing peeling treatments such as polysiloxane treatment, long-chain alkyl treatment, and fluorine treatment on the surface of the mold release film. It does not specifically limit as said transparent resin film base material, Various resin films which have transparency can be used. The resin film is formed of a single-layer film. For example, examples of the material include polyester-based resins such as polyethylene terephthalate and polyethylene naphthalate, acetate-based resins, polyether-based resins, polycarbonate-based resins, and polyamides. Amine resins, polyimide resins, polyolefin resins, (meth)acrylic resins, polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, Polyarylate resin, polyphenylene sulfide resin, etc. Among them, polyester-based resins, polyimide-based resins, and polyether-based resins are particularly preferred. The thickness of the above-mentioned film substrate is preferably 15 to 200 μm. 3. The polarizing film with an adhesive layer The polarizing film with an adhesive layer of the present invention has the above-mentioned adhesive layer on at least one side of the polarizing film. The polarizing film with the adhesive layer of the present invention is used by bonding the adhesive layer of the polarizing film and the transparent conductive layer of the transparent conductive substrate having the transparent conductive layer on the transparent substrate in contact with each other. The method of forming the adhesive layer is as described above. It does not specifically limit as a polarizing film, Usually, it is used for the thing which has a transparent protective film on one side or both sides of a polarizing element. The polarizing element is not particularly limited, and various polarizing elements can be used. Examples of polarizers include those obtained by adsorbing iodine or dichroic dyes to hydrophilic polymer films such as polyvinyl alcohol-based films, partially formalized polyvinyl alcohol-based films, and ethylene-vinyl acetate copolymer-based partially saponified films. Dichroic substances and uniaxially stretched; polyene-based alignment films such as dehydration-treated products of polyvinyl alcohol or dehydrochloric acid-treated products of polyvinyl chloride. Among these, a polarizing element containing a polyvinyl alcohol-based film and a dichroic substance such as iodine is preferable, and an iodine-based polarizing element containing iodine and/or iodine ions is more preferable. In addition, the thickness of these polarizing elements is not particularly limited, but is usually about 5 to 80 μm. A polarizing element in which a polyvinyl alcohol-based film is dyed with iodine and uniaxially stretched can be produced, for example, by immersing polyvinyl alcohol in an aqueous solution of iodine for dyeing and extending to 3 to 3 of the original length. 7 times. It can also be immersed in an aqueous solution of boric acid, potassium iodide, etc., which may contain zinc sulfate, zinc chloride, and the like. Furthermore, the polyvinyl alcohol-type film may be immersed in water and washed with water before dyeing as needed. By washing the polyvinyl alcohol-based film with water, contamination on the surface of the polyvinyl alcohol-based film and anti-blocking agents can be removed, and by swelling the polyvinyl alcohol-based film, uneven dyeing and other unevenness can also be prevented. Effect. The stretching may be carried out after dyeing with iodine, or it may be stretched while dyeing, and the stretching can be carried out even in an aqueous solution such as boric acid or potassium iodide or in a water bath. In addition, in the present invention, a thin polarizer having a thickness of 10 μm or less can also be used. From the viewpoint of thinning, the thickness is preferably 1 to 7 μm. Such a thin polarizing element is preferable in that the thickness variation is small and the visibility is excellent, and the dimensional change is small and the durability is excellent, and the thickness of the polarizing film can also be reduced in thickness. Typical examples of thin polarizers include: Japanese Patent Laid-Open No. 51-069644, Japanese Patent Laid-Open No. 2000-338329, International Publication No. 2010/100917, or Japanese Patent No. 4751481, The thin polarizing film described in Japanese Patent Laid-Open No. 2012-073563. These thin polarizing films can be obtained by a production method comprising: extending the polyvinyl alcohol-based resin (hereinafter, also referred to as PVA-based resin) layer and the resin substrate for stretching in the state of a laminate steps, and the steps for dyeing. According to this production method, even if the PVA-based resin layer is thin, it can be extended without defects such as breakage due to the stretching by being supported by the resin substrate for stretching. As the above-mentioned thin polarizing film, in the production method including the step of stretching and the step of dyeing in the state of a laminate, it is also preferable to stretch at a high magnification to improve the polarizing performance, as described in International Publication No. 2010 The specification of /100917, or the specification of Japanese Patent No. 4751481, or the specification of Japanese Patent Laid-Open No. 2012-073563 is obtained by the production method including the step of extending in a boric acid aqueous solution, especially the specification of Japanese Patent No. 4751481 Or obtained by the production method described in Japanese Patent Laid-Open No. 2012-073563 including the step of auxiliary in-air stretching before stretching in a boric acid aqueous solution. As a material for forming the transparent protective film provided on one side or both sides of the polarizing element, for example, thermoplastic resins excellent in transparency, mechanical strength, thermal stability, moisture barrier properties, and isotropy can be used. Specific examples of such thermoplastic resins include cellulose resins such as triacetyl cellulose, polyester resins, polyether resins, polysiloxanes, polycarbonate resins, polyamide resins, and polyimide resins. , polyolefin resins, (meth)acrylic resins, cyclic polyolefin resins (nor-alkene resins), polyarylate resins, polystyrene resins, polyvinyl alcohol resins, and mixtures thereof. Furthermore, on one side of the polarizing element, a transparent protective film is attached through an adhesive layer, and on the other side, as a transparent protective film, (meth)acrylic, urethane, acrylic can be used. Urethane-based, epoxy-based, polysiloxane-based and other thermosetting resins or UV-curable resins. One or more arbitrary appropriate additives may be contained in the transparent protective film. Examples of additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, anti-coloring agents, flame retardants, nucleating agents, antistatic agents, pigments, colorants, and the like. The content of the thermoplastic resin in the transparent protective film is preferably 50 to 100% by weight, more preferably 50 to 99% by weight, still more preferably 60 to 98% by weight, and particularly preferably 70 to 97% by weight. When content of the said thermoplastic resin in a transparent protective film is 50 weight% or less, there exists a possibility that the high transparency etc. which a thermoplastic resin originally has cannot be fully expressed. The thickness of the transparent protective film can be appropriately determined, but is usually about 1 to 500 μm in terms of strength, workability such as handling properties, and film properties. The polarizing element and the transparent protective film are usually adhered to each other via a water-based adhesive or the like. Examples of the water-based adhesive include isocyanate-based adhesives, polyvinyl alcohol-based adhesives, gelatin-based adhesives, vinyl-based latex-based adhesives, water-based polyurethanes, and water-based polyesters. In addition to the above, as the adhesive between the polarizing element and the transparent protective film, an ultraviolet curing adhesive, an electron beam curing adhesive, and the like are exemplified. The adhesive for electron beam curable polarizing films shows preferable adhesiveness to the above-mentioned various transparent protective films. Moreover, a metal compound filler may be contained in the adhesive agent used for this invention. Furthermore, in the present invention, a transparent protective film such as a retardation film may be formed on the polarizing element instead of the polarizing film. Moreover, another transparent protective film, a retardation film, etc. may be further provided on the transparent protective film. The surface of the above-mentioned transparent protective film that is not attached to the polarizing element can also be subjected to a hard coating or anti-reflection treatment, anti-sticking treatment, and treatment for the purpose of diffusion or anti-glare. Moreover, between the polarizing film and the adhesive layer, an adhesion promoting layer may be provided. The material for forming the adhesion promoting layer is not particularly limited, and examples thereof include various polymers, sols of metal oxides, and silica sols. Among these, it is particularly preferable to use polymers. The use form of the above-mentioned polymers may be any form among solvent-soluble type, water-dispersed type, and water-soluble type. Examples of the above-mentioned polymers include polyurethane-based resins, polyester-based resins, acrylic resins, polyether-based resins, cellulose-based resins, polyvinyl alcohol-based resins, and polyvinylpyrrolidone. , polystyrene resin, etc. Moreover, among the said polymers, conductive polymers, such as polythiophene, which can be used as a formation material of the following organic conductive layer can be used. Moreover, when the adhesive layer of the polarizing film with the adhesive layer is exposed, the adhesive layer may be protected by a release film (separator film) before being used. As a release film, those mentioned above are mentioned. In the case where a release film is used as a base material in the production of the above-mentioned adhesive layer, the release film can be used as an adhesion of the polarizing film with the adhesive layer by laminating the adhesive layer on the release film with the polarizing film. The use of the release film of the agent layer can simplify the steps. The polarizing film with the adhesive layer of the present invention is used by bonding the above-mentioned transparent conductive layer of the transparent conductive substrate having the transparent conductive layer on the transparent substrate. The constituent material of the transparent conductive layer of the transparent conductive substrate is not particularly limited, and can be selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, and palladium. , a metal oxide of at least one metal in the group consisting of tungsten. This metal oxide may further contain metal atoms shown in the above-mentioned groups as needed. For example, indium oxide (ITO) containing tin oxide, tin oxide containing antimony, etc. are preferably used, and ITO is particularly preferably used. As ITO, it is preferable to contain 80 to 99 weight% of indium oxide and 1 to 20 weight% of tin oxide. Moreover, as said ITO, crystalline ITO and non-crystalline (amorphous) ITO are mentioned, and both are used suitably. The transparent conductive layer of the transparent conductive base material includes a metal mesh formed by forming thin metal wires in a lattice-like pattern, or one formed by coating metal fine particles. As the constituent metal material, any appropriate metal (including alloy substances) can be used as long as it is a metal with high conductivity. Specifically, for example, at least one metal selected from the group consisting of gold, platinum, silver, aluminum, and copper is preferred, and from the viewpoint of electrical conductivity, aluminum, silver, copper, or gold is preferred. . The transparent conductive layer of the transparent conductive substrate may be formed of an organic conductive film. The material for forming the organic conductive film is not particularly limited, and examples include conductive polymers, ionic conductive compositions containing electrolyte salts and organopolysiloxanes, ionic compounds, and various surfactants (cationic, anionic, etc.) and amphoteric surfactants). Among these, it is preferable to use a conductive polymer from the viewpoint of optical properties, appearance, antistatic effect, and stability of antistatic effect under heat and humidification. In particular, conductive polymers such as polyaniline and polythiophene are preferably used. These conductive polymers can be water-soluble, water-dispersible, organic solvent-soluble, or organic-solvent-dispersible. For water-soluble conductive polymers or water-dispersible conductive polymers, an antistatic layer can be formed. When the coating liquid is prepared into an aqueous solution or a water dispersion liquid, the coating liquid does not need to use a non-aqueous organic solvent, and the deterioration of the transparent substrate caused by the organic solvent can be suppressed. In addition, the aqueous solution or the aqueous dispersion may contain an aqueous solvent in addition to water. For example, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol, third butanol, n-amyl alcohol, isoamyl alcohol, second amyl alcohol, third amyl alcohol Alcohols, 1-ethyl-1-propanol, 2-methyl-1-butanol, n-hexanol, cyclohexanol and other alcohols. Moreover, it is preferable that the said water-soluble conductive polymer, such as polyaniline and polythiophene, or a water-dispersible conductive polymer has a hydrophilic functional group in a molecule|numerator. Examples of the hydrophilic functional group include a sulfo group, an amino group, an amide group, an imino group, a quaternary ammonium salt group, a hydroxyl group, a mercapto group, a hydrazine group, a carboxyl group, a sulfate group, a phosphate group, or the like. salt, etc. Since it has a hydrophilic functional group in a molecule|numerator, it is easy to dissolve in water, and it is easy to disperse|distribute in the form of microparticles|fine-particles in water, and the said water-soluble conductive polymer or a water-dispersible conductive polymer can be easily prepared. Examples of commercially available water-soluble conductive polymers include polyaniline sulfonic acid (manufactured by Mitsubishi Rayon Co., Ltd., and the weight-average molecular weight calculated in terms of polystyrene is 150,000). Examples of commercial products of the water-dispersible conductive polymer include polythiophene-based conductive polymers (manufactured by Nagase Chemtex, trade name Denatron series). Moreover, in order to improve the film formability of a conductive polymer, the adhesiveness with a transparent base material, etc., you may add a binder component to the said conductive polymer. When the conductive polymer is a water-soluble conductive polymer or a water-based material of a water-dispersible conductive polymer, a water-soluble or water-dispersible binder component is used. Examples of the binder include oxazoline group-containing polymers, polyurethane-based resins, polyester-based resins, acrylic resins, polyether-based resins, cellulose-based resins, and polyvinyl alcohol-based resins. Resin, epoxy resin, polyvinylpyrrolidone, polystyrene resin, polyethylene glycol, pentaerythritol, etc. Particularly preferred are polyurethane-based resins, polyester-based resins, and acrylic-based resins. One or more of these binders can be appropriately used according to the application. Although the usage-amount of the conductive polymer and the binder also depends on the type of them, it is preferable that the surface resistance value of the obtained transparent conductive film becomes 1×10 8 to 1×10 12 Ω/□ Take control. Furthermore, the organic conductive layer used in the present invention may also contain other known additives, for example, powders such as colorants, pigments, dyes, surfactants, plasticizers, and tackifiers may be appropriately added according to the application. , Surface lubricant, leveling agent, softener, antioxidant, anti-aging agent, light stabilizer, ultraviolet absorber, polymerization inhibitor, inorganic or organic filler, metal powder, granular, foil, etc. In addition, the organic conductive film can also be formed on the transparent substrate by electrolytic polymerization of the monomer forming the conductive polymer. The thickness of the above-mentioned transparent conductive layer is not particularly limited, but is preferably 10 to 1000 nm, more preferably 50 to 400 nm. It does not specifically limit as a formation method of the said transparent conductive layer, A conventionally well-known method can be employ|adopted. Specifically, for example, a vacuum deposition method, a sputtering method, and an ion plating method can be exemplified. Moreover, in the case of applying a coating liquid, for example, a microgravure coating method, a roll coating method, a dip coating method, a flow coating method, a spin coating method, a die coating method, a casting transfer method, a spray coating method can be mentioned. Wait. Moreover, in the case of a metal mesh, it can be obtained, for example, by applying a photosensitive composition (composition for forming a transparent conductive layer) containing a silver salt on a to-be-adhered body such as a release film, and then exposing it to light. Processing and development processing, the thin metal wire is formed into a specific pattern. Moreover, this transparent conductive layer can also be obtained by printing the paste (composition for transparent conductive layer forming) containing metal fine particles in a specific pattern. In addition, an appropriate method may be adopted according to the required film thickness. Moreover, you may have an overcoat (OC) layer (not shown) on the said transparent conductive layer. As the overcoat layer, those commonly used in this field can be used without particular limitation, and examples thereof include those formed of alkyd resins, acrylic resins, epoxy resins, polyurethane resins, isocyanate resins, and the like. Floor. Although it does not specifically limit as thickness of an overcoat layer, For example, 0.1-10 micrometers is preferable. The transparent base material is not particularly limited as long as it is a transparent substrate, and examples thereof include glass and transparent resin film base materials. As a transparent resin film base material, the above-mentioned ones are mentioned. Moreover, an undercoat layer, an oligomer prevention layer, etc. may be provided between the transparent conductive layer and the transparent substrate as needed. 4. Image Display Panel, Image Display Device The image display panel of the present invention is characterized by having the polarizing film with the above-mentioned adhesive layer, and the transparent conductive base material having the transparent conductive layer on the transparent base material, and the above-mentioned adhering film is characterized in that: The adhesive layer of the polarizing film of the adhesive layer is attached to the above-mentioned transparent conductive layer of the above-mentioned image display panel. Moreover, the image display apparatus of this invention has the said image display panel, It is characterized by the above-mentioned. The polarizing film and the transparent conductive substrate to which the adhesive layer is attached are as described above. The image display panel has the above-mentioned transparent conductive substrate, and forms a part of the image display device together with the above-mentioned polarizing film with the adhesive. The liquid crystal panel which is a typical embodiment of the image display panel to which the polarizing film of the adhesive layer of this invention is applied is demonstrated. The liquid crystal cell used in the liquid crystal panel has a transparent conductive substrate having a transparent conductive layer on the transparent substrate, and the transparent conductive substrate is usually provided on the surface of the liquid crystal cell on the visible side. A liquid crystal panel including a liquid crystal cell that can be used in the present invention will be described using FIG. 1 . However, the present invention is not limited by FIG. 1 . As one embodiment of the liquid crystal panel 1 that can be included in the image display panel of the present invention, there can be mentioned a transparent protective film 2 on the viewing side/polarizer 3/transparent protective film 4 on the liquid crystal cell side/adhesive layer from the viewing side 5/Transparent conductive layer 6/Transparent substrate 7/Liquid crystal layer 8/Transparent substrate 9/Adhesive layer 10/Transparent protective film 11 on the liquid crystal cell side/Polarizing element 12/Transparent protective film 13 on the light source side. In FIG. 1 , the polarizing film with the adhesive layer of the present invention corresponds to the transparent protective film 2 on the viewing side/polarizing element 3/transparent protective film 4 on the liquid crystal cell side/adhesive layer 5. In addition, in FIG. 1, the transparent electroconductive base material used for this invention is comprised by the transparent electroconductive layer 6/transparent base material 7. In addition, in FIG. 1, the liquid crystal cell provided with the transparent electroconductive base material used by this invention is comprised from the transparent electroconductive layer 6/transparent base material 7/liquid crystal layer 8/transparent base material 9. Furthermore, in addition to the said structure, optical films, such as a retardation film, a viewing angle compensation film, a brightness improvement film, may be suitably provided in the liquid crystal panel 1. The liquid crystal layer 8 is not particularly limited, and for example, any type such as a TN type, an STN type, a π type, a VA type, and an IPS type can be used. The material of the transparent substrate 9 (light source side) is not particularly limited as long as it is a transparent substrate, and examples thereof include glass and a transparent resin film substrate. As a transparent resin film base material, the thing mentioned above is mentioned. In addition, the adhesive layer 10 on the light source side, the transparent protective film 11 on the liquid crystal cell side, the polarizing element 12, and the transparent protective film 13 on the light source side can be used by those previously used in the field, and can also be preferably used as described in this specification. By. The above-mentioned liquid crystal panel 1 is characterized in that the polarizing film with the adhesive layer of the present invention is laminated on the liquid crystal cell in such a way that the transparent conductive layer 6 of the liquid crystal cell is in contact with the adhesive layer 5 of the polarizing film with the adhesive layer. on the outermost transparent conductive layer 6 on the visible side. The image display device of the present invention may be an image display panel including a polarizing film having the adhesive layer of the present invention and a transparent conductive substrate having a transparent conductive layer on the transparent substrate, and preferably includes The above liquid crystal panel. Hereinafter, a liquid crystal display device will be described as an example, but the present invention is not limited thereto. Specific examples of the image display device to which the above-mentioned image display panel can be applied include a liquid crystal display device, an electroluminescence (EL) display, a plasma display (PD), a field emission display (FED: Field Emission Display), and the like. . The image display device of the present invention only needs to be an image display panel including a polarizing film having the adhesive layer of the present invention, and a transparent conductive substrate having a transparent conductive layer on the transparent substrate, and other configurations are the same as the previous ones. The image display device is the same. [Examples] Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. In addition, the room temperature storage conditions without special provisions were all 23 degreeC, 65%RH. <Measurement of the weight average molecular weight of the (meth)acrylic polymer> The weight average molecular weight (Mw) of the (meth)acrylic polymer was measured by GPC (gel permeation chromatography). Mw/Mn is also determined in the same manner.・Analysis device: HLC-8120GPC, manufactured by Tosoh Corporation ・Column: G7000HXL+GMHXL+GMHXL, manufactured by Tosoh Corporation ・Column size: 7.8 mm each ×30 cm, total 90 cm ・Column temperature: 40℃ ・Flow rate: 0.8 mL/min ・Injection volume: 100 μL ・Eluent: THF ・Detector: Differential refractometer (RI) ・Standard sample: Polystyrene Production Example 1 (Production of Polarizing Film) A polyvinyl alcohol film with a thickness of 80 μm was dyed in an iodine solution of 0.3 wt % concentration at 30° C. for 1 minute and stretched to 3 times between rollers with different speed ratios. Then, in an aqueous solution containing boric acid at a concentration of 4 wt % and potassium iodide at a concentration of 10 wt % at 60° C., it was stretched to a total stretching ratio of 6 times while being immersed for 0.5 minutes. Next, after washing by immersion in an aqueous solution containing potassium iodide having a concentration of 1.5 wt % at 30° C. for 10 seconds, drying was performed at 50° C. for 4 minutes to obtain a polarizer with a thickness of 30 μm. A polarizing film was produced by bonding a saponified triacetoxycellulose film with a thickness of 80 μm to both sides of the polarizing element using a polyvinyl alcohol-based adhesive. Production Example 2 (Adjustment of Solution of Acrylic Polymer (a-1)) To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction pipe, and a cooler, 99 parts by weight of butyl acrylate and 4-hydroxybutyl acrylate were added 1 part by weight of ester monomer mixture. Further, 0.1 part by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator was added with 100 parts by weight of ethyl acetate with respect to 100 parts by weight of the above-mentioned monomer mixture (solid content), gradually After nitrogen substitution was carried out by introducing nitrogen gas while stirring, the liquid temperature in the flask was maintained at around 55°C, and a polymerization reaction was carried out for 8 hours to prepare an acrylic polymer (a) having a weight average molecular weight (Mw) of 1.56 million and Mw/Mn of 3.2. -1) solution. Production Examples 3 to 5 In Production Example 2, except that the types of the monomers used to prepare the acrylic polymer and their usage ratios were changed as shown in Table 1, acrylics were prepared by the same method as in Production Example 2. Solutions of polymers (a-2) to (a-4). [Table 1] Acrylic polymer Blending ratio (parts by weight) Mw Mw/Mn
BA NVP AA HBA
Manufacturing example 2 (a-1) 99 - - 1 156 3.2
Manufacturing Example 3 (a-2) 99.3 - 0.3 0.4 162 3.4
Manufacturing Example 4 (a-3) 99.3 1.5 - 0.4 161 3.5
Manufacturing Example 5 (a-4) 97.8 1.5 0.3 0.4 155 3.7
The abbreviations in Table 1 are as follows. BA: butyl acrylate NVP: N-vinyl-2-pyrrolidone AA: acrylic acid HBA: 4-hydroxybutyl acrylate Example 1 (Preparation of acrylic adhesive composition) Relative to that obtained in Production Example 2 The solid content of the solution of the acrylic polymer (a-1) was 100 parts by weight, and an isocyanate crosslinking agent (trade name: Takenate D160N, trimethylolpropane hexamethylene diisocyanate, manufactured by Mitsui Chemicals Co., Ltd.) was prepared. 0.1 part, 0.3 part of benzyl peroxide (Nyper BMT 40SV, manufactured by NOF Corporation), and 3-mercaptopropyltrimethoxysilane (trade name: KBM-803, alkoxy group content: 47% by weight, Thiol group equivalent: 196 g/mol, manufactured by Shin-Etsu Chemical Co., Ltd.) 0.3 part, and a solution of the acrylic adhesive composition was prepared. (Production of polarizing film with adhesive layer) The solution of the acrylic adhesive composition was coated on the polysiloxane-based release agent-treated polyterephthalene so that the thickness of the adhesive layer after drying was 23 μm. One side of an ethylene formate film (release film, trade name: MRF38, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd.) was dried at 155° C. for 1 minute to form an adhesive layer on the surface of the release film. Next, the adhesive layer formed on the separator was transferred to the polarizing film produced in Production Example 1 to produce a polarizing film to which the adhesive layer was attached. Examples 2 to 13 and Comparative Examples 1 to 5 In Example 1, the type of acrylic polymer, the type of silane coupling agent, and the amount of addition thereof were changed as shown in Table 2. 1 The solution of the acrylic adhesive composition was prepared by the same method. In addition, in Example 12, the ionic compound was mix|blended by the ratio shown in Table 2. Using the obtained solution of the acrylic adhesive composition, a polarizing film with an adhesive layer was produced by the same method as in Example 1. The following evaluation was performed about the polarizing film with the adhesive bond layer obtained by the said Example and the comparative example. The evaluation results are shown in Table 2. <Preparation of evaluation samples> The polarizing film with the adhesive layer obtained in the Example and the comparative example was cut into 15 inches, and the obtained thing was set as a sample. The sample was attached to the glass with the transparent conductive layer. As the glass with a transparent conductive layer, an alkali-free glass with a thickness of 0.7 mm (trade name: EG-XG, manufactured by Corning Incorporated) was used, which had an amorphous ITO layer on the glass with an ITO layer, and the same glass without an ITO layer as above. A glass with an organic conductive film with an organic conductive film on the alkali glass. The above-mentioned samples were respectively pasted on the ITO layer of the glass with an ITO layer and the organic conductive film of the glass with an organic conductive film using a laminating machine. Next, autoclave treatment was performed at 50° C. and 0.5 MPa for 15 minutes, so that the above samples were completely adhered to the glass with an ITO layer and the glass with an organic conductive film, respectively. Furthermore, the ITO layer is formed by sputtering. In the composition of ITO, the Sn ratio was 3 wt %, and a heating step of 140° C.×60 minutes was performed before lamination of the samples. In addition, the Sn ratio of ITO was calculated from the weight of Sn atoms/(weight of Sn atoms+weight of In atoms). The organic conductive film was formed by a spin coating method using a coating liquid containing polyethylenedioxythiophene·polyvinylsulfonate. <Durability Test Immediately After Coating> After the treated sample was treated for 500 hours in each atmosphere of 60°C/95%RH (humidification test), the polarizing film and the polarizing film were visually evaluated according to the following criteria. Appearance between glass with ITO layer and between polarizing film and glass with organic conductive film. (Evaluation Criteria) ⊚: There is no change in appearance such as peeling at all. ○: The edge is slightly peeled, but there is no practical problem. △: There is peeling at the edge, but there is no practical problem unless it is used for a special purpose. ×: There is significant peeling at the edge, and there is a practical problem. <Adhesion force> The polarizing film with the adhesive layer obtained in the Examples and Comparative Examples was cut into a width of 25 mm, and the obtained product was used as an evaluation sample, except that the above-mentioned <Preparation of evaluation sample> was used. In the same operation, stick to the glass with transparent conductive layer (glass with ITO layer and glass with organic conductive film), and carry out the same treatment, so that the polarizing film with adhesive layer is completely adhered to the glass with transparent conductive layer (Initial). Then, a heat treatment (after heating) was performed under dry conditions at 60°C for 48 hours. The adhesion of the above samples was measured. The adhesive force was determined by measuring the adhesive force (N/25mm) when the sample was peeled off with a tensile tester (Autograph SHIMAZU AG-1 1OKN) at a peel angle of 90° and a peel speed of 300 mm/min. During the measurement, the samples were sampled at once/0.5 second intervals, and the average value was taken as the measurement value. <Reworkability> The measurement of the adhesive force described above was carried out except that the polarizing film with the adhesive layer obtained in the examples and the comparative examples was cut out to a length of 350 mm × a width of 250 mm, and the obtained one was used as an evaluation sample. Objects are treated the same. This sample was peeled from the glass with the transparent conductive layer by hand, and the reworkability was evaluated based on the following criteria. The evaluation of reproducibility was carried out in the above-mentioned procedure, and three sheets were produced and repeated three times. ⊚: No paste residue or film breakage was observed in any of the 3 sheets, and the peeling was good. (circle) : The film|membrane rupture occurred in one part of 3 sheets, but it peeled by peeling again. Δ: Film breakage occurred in all 3 sheets, but was peeled off by peeling again. ×: The paste remained on all 3 sheets, or the peeling film was broken several times and could not be peeled off. [Table 2] adhesive composition Relative to glass with ITO layer Compared with glass with organic conductive film
(Meth)acrylic polymer cross-linking agent Silane coupling agent Ionic compound (parts by weight) Durability Adhesion force (N/25 mm) Heavy industry test Durability Adhesion force (N/25 mm) Heavy industry test
Isocyanate series (parts by weight) Peroxide series (parts by weight) type Thiol equivalent (g/mol) Amount of alkoxy group (wt%) Addition amount (parts by weight) 60℃/95%RH Early stage After 48 hours at 60°C 60℃/95%RH Early stage After 48 h at 65°C
Example 1 (a-1) 0.1 0.3 KBM-803 196 47 0.3 - △ 4 7 ◎ ◎ 4.2 10.8 ◎
Example 2 (a-1) 0.1 0.3 X-41-1805 800 50 0.3 - △ 4.4 7 ◎ ◎ 3.2 10.2 ◎
Example 3 (a-1) 0.1 0.3 X-41-1818 850 60 0.3 - △ 4.5 6.9 ◎ ◎ 3 9.5 ◎
Example 4 (a-1) 0.1 0.3 X-41-1810 450 30 0.3 - 〇 4.8 7.2 ◎ ◎ 3.6 11 ◎
Example 5 (a-1) 0.1 0.3 X-41-1810 450 30 0.05 - 〇 5.4 6.8 ◎ ◎ 4.8 8.7 ◎
Example 6 (a-1) 0.1 0.3 X-41-1810 450 30 1 - 〇 4.3 7.3 ◎ ◎ 3.3 12.2 〇
Example 7 (a-1) 0.1 0.3 X-41-1810 450 30 6 - 〇 3 6.1 ◎ 〇 2.9 10.2 △
Example 8 (a-2) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6 7.9 ◎ ◎ 4 9.8 ◎
Example 9 (a-3) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6.2 8.3 ◎ ◎ 4.3 10.8 ◎
Example 10 (a-4) 0.1 0.3 X-41-1810 450 30 0.3 - ◎ 6 8.2 ◎ ◎ 4.8 10.4 ◎
Example 11 (a-4) 0.1 0.3 X-41-1805 800 50 0.3 - 〇 5.3 6.9 ◎ ◎ 4.5 10.1 ◎
Example 12 (a-4) 0.1 0.3 X-41-18l8 850 60 0.3 - 〇 5.8 7.1 ◎ ◎ 4.2 11.1 ◎
Example 13 (a-4) 0.1 0.3 X-41-1810 450 30 0.3 1 ◎ 6 7.5 ◎ ◎ 3.9 9.9 ◎
Comparative Example 1 (a-1) 0.1 0.3 - - - - - × 5.8 6.3 ◎ × 5.9 11.8 ◎
Comparative Example 2 (a-1) 0.1 0.3 KBM-403 - 39 0.3 - × 4 6.9 ◎ 〇 6.6 12.7 〇
Comparative Example 3 (a-1) 0.1 0.3 X-41-1056 - 17 0.3 - 〇 4.9 9.2 ◎ ◎ 17.1 19.9 ×
Comparative Example 4 (a-2) 0.1 0.3 X-41-1056 - 17 0.3 - ◎ 6.9 12.4 〇 ◎ 16.6 21.6 ×
Comparative Example 5 (a-3) 0.1 0.3 X-41-1056 - 17 0.3 - ◎ 6.3 12.9 〇 ◎ 17.9 20.7 ×
The abbreviations in Table 2 are as follows. Isocyanate series: Trade name: Takenate D160N, trimethylolpropane hexamethylene diisocyanate, manufactured by Mitsui Chemicals Co., Ltd. Peroxide series: Trade name: Nyper BMT 40SV, benzyl peroxide, NOF Corporation manufactured by the company; KBM-803: 3-mercaptopropyltrimethoxysilane, alkoxy group amount: 47% by weight, thiol group equivalent: 196 g/mol, manufactured by Shin-Etsu Chemical Co., Ltd.; X-41-1805: low Polymer type thiol group-containing silane coupling agent, alkoxy group content: 50% by weight, thiol group equivalent: 800 g/mol, manufactured by Shin-Etsu Chemical Co., Ltd.; X-41-1818: Oligomer type containing Thiol-based silane coupling agent, alkoxy group content: 60% by weight, thiol group equivalent: 850 g/mol, manufactured by Shin-Etsu Chemical Co., Ltd.; X-41-1810: Oligomer type thiol group-containing Silane coupling agent, alkoxy group amount: 30% by weight, thiol group equivalent: 450 g/mol, manufactured by Shin-Etsu Chemical Co., Ltd.; KBM-403: γ-glycidoxypropylmethoxysilane, alkoxy Base amount: 39% by weight, manufactured by Shin-Etsu Chemical Co., Ltd.; X-41-1056: Oligomer type epoxy group-containing silane coupling agent, alkoxy group amount: 17% by weight, epoxy equivalent: 280 g/ mol, manufactured by Shin-Etsu Chemical Co., Ltd.; Ionic compound: lithium bis(trifluoromethanesulfonimide), manufactured by Mitsubishi Materials Co., Ltd.
