TWI753262B - thermal sensor - Google Patents

Abstract

The thermal sensor (1) of the present invention comprises: a cylindrical casing (10) having a bottom (11), and a thermal detection part (30) for detecting the thermal energy of the gas. The casing (10) has a first hole (21) and a second hole (22), so that the gas flowing in from one of the holes flows out from the other hole. When the thermal sensor (1) is viewed from the direction of the central axis (J1) of the casing (10), the thermal detection part (30) is arranged in a peripheral area ( 10b).

Description

thermal sensor

The present invention relates to a thermal sensor for sensing thermal energy generated by fire or the like.

In the prior art, there are known thermal sensors that sense thermal energy generated by a fire or the like. As an example of such a thermal sensor, Patent Document 1 describes a thermal sensor including a housing body, a thermistor arranged outside the housing body, and a protection provided to cover the outside of the thermistor frame. In this thermal sensor, the thermal energy of the gas flowing toward the thermal sensor during a fire is detected by using a thermistor disposed outside the main body of the casing. [Previously known technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 10-334360

[Problems to be Solved by Invention]

In recent years, in order to improve the appearance of the building in which the thermal sensor is installed, thinning of the thermal sensor has been sought. However, in the thermal sensor described in Patent Document 1, there is a problem that the thickness of the thermal sensor becomes thick.

In view of this, the present invention aims at reducing the thickness of the thermal sensor. [Technical means to solve problems]

In order to achieve the above object, a thermal sensor according to an aspect of the present invention includes: a cylindrical casing with a bottom, and a thermal detection part for detecting thermal energy of gas; the casing has a first hole and a second hole , so that the gas flowing in from one side flows out from the other side; when the thermal sensor is observed from the direction of the central axis of the casing, the thermal detection part is arranged in the peripheral area of the casing that is different from the center. [Effect of invention]

According to the present invention, the thermal sensor can be thinned.

(The reason behind the completion of the present invention) First, the reason for accomplishing the present invention will be described with reference to the comparative example of FIG. 1 . FIG. 1 is a diagram illustrating a thermal sensor 101 of a comparative example.

The thermal sensor 101 of the comparative example includes a cylindrical casing 110 having a bottom portion 111, and a thermal detection portion 130 for detecting gas thermal energy. The thermal detection unit 130 is, for example, a thermistor with a lead wire, which is disposed vertically below the bottom 111 and is disposed in the center of the casing 110 when viewed from the vertical below. Furthermore, the casing 110 is provided with a protection frame 116 covering the thermal detection portion 130 .

As shown in FIG. 1 , when there is a heat source such as a flame vertically below the thermal sensor 101 , a vertical airflow (updraft) flowing toward the thermal sensor 101 is generated. In the vicinity of the thermal sensor 101 , the vertical airflow changes the direction of the flow due to the external shape of the thermal sensor 101 , and changes to an oblique flow including components flowing from the center of the casing 110 to the outer periphery. Therefore, in the thermal sensor 101 of the comparative example, in order for the thermal detection portion 130 to contact the vertical airflow, it is necessary to arrange the thermal detection portion 130 to protrude substantially vertically downward. Therefore, there is a problem that the protruding size of the protective frame 116 covering the thermal detection portion 130 is increased, and the thickness of the thermal sensor 101 is increased.

On the other hand, in the thermal sensor of the present embodiment, when the thermal sensor is viewed from vertically below, the thermal detection portion is disposed in a peripheral region of the housing that is different from the center. Since the vertical airflow will flow close to the casing in this peripheral area, the protruding size of the thermal detection portion required for contacting the vertical airflow can be reduced. Thereby, the thermal sensor can be reduced in thickness.

Hereinafter, the thermal sensor according to the embodiment of the present invention will be described in detail with reference to the drawings. In addition, the embodiments described below are all illustrative of a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement of constituent elements, connection forms, etc. shown in the following embodiments are all examples, and the gist thereof is not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, the constituent elements that are not described in the independent claims that disclose the highest-level concept of the present invention will be described as arbitrary constituent elements.

In addition, each figure is a schematic diagram and is not necessarily a precise illustration. Therefore, for example, the scales and the like in each drawing do not necessarily match. In addition, in each figure, the same code|symbol is attached|subjected about the substantially same structure, and the repeated description is abbreviate|omitted or simplified.

Furthermore, in this specification and the drawings, the x-axis, the y-axis, and the z-axis system represent three axes of a three-dimensional orthogonal coordinate system. In this embodiment, the z-axis direction is defined as the vertical direction, and the direction perpendicular to the z-axis (direction parallel to the xy plane) is defined as the horizontal direction. Also, the negative direction of the z-axis is assumed to be vertically downward.

(Embodiment) [1-1. Configuration of thermal sensor] The configuration of the thermal sensor according to the embodiment will be described with reference to FIGS. 2 to 9 . The thermal sensor of the present embodiment is a fire alarm that detects a fire in a building or the like and notifies the outside of the occurrence of a fire.

FIG. 2 is a perspective view of the thermal sensor 1 according to the embodiment. FIG. 3 is a perspective view of the thermal sensor 1 viewed from a direction different from that of FIG. 2 . FIG. 4 is a diagram showing a schematic configuration of the thermal sensor 1 . Moreover, in FIG. 3, it is the figure which removed the cover 18 (refer FIG. 8) from the case 10, and is shown.

As shown in FIGS. 2 and 3 , the thermal sensor 1 includes a cylindrical casing 10 that constitutes the outer contour of the thermal sensor 1 , and a component mounting board 40 provided in the casing 10 . As shown in FIG. 4 , the component mounting board 40 includes a thermal detection unit 30 that detects thermal energy of gas, and a control unit 50 that determines whether there is a fire based on a result measured by the thermal detection unit 30 .

The thermal detection part 30 is arranged inside the casing 10 . The thermal detection unit 30 has thermal detection elements such as a chip thermistor. For example, in the case where the thermal detection element is a chip thermistor, the height of the thermal detection portion 30 can be reduced compared to the case where the thermal detection element is a thermistor with wires. In addition, the thermal detection element is not limited to a chip thermistor.

The thermal detection element is connected to the control unit 50 through wirings formed on the component mounting substrate 40 . In addition, in FIG. 4 , one thermal detection unit 30 is shown as an example, but in reality, a plurality of thermal detection units 30 are connected to the control unit 50 . The configuration of the thermal detection unit 30 will be described in detail later.

The control unit 50 is composed of, for example, an IC chip such as a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The control unit 50 determines whether there is a fire by, for example, whether the average value of the voltages output by the plurality of thermal detection elements is higher than a predetermined threshold value. In addition, the control unit 50 may compare the maximum value or the minimum value of the voltages output by the plurality of thermal detection elements with a predetermined threshold value to determine whether there is a fire.

Furthermore, the control part 50 is provided with the notification circuit (illustration omitted) for notifying the determination result of the presence or absence of a fire. The notification circuit is, for example, wired to a server as an external management device. The control unit 50 notifies the server of the presence or absence of fire through the notification circuit. In the notification circuit, a loudspeaker or LED (Light Emitting Diode) for notifying the surrounding about a fire can also be connected.

The thermal sensor 1 having the above-mentioned configuration is arranged on the ceiling or the wall of a building, a factory, or a house, for example. Hereinafter, a case where the thermal sensor 1 is arranged on the ceiling of a building will be described as an example.

FIG. 5A is a diagram showing the vertical airflow to the thermal sensor 1 . FIG. 5B is a diagram showing the horizontal airflow to the thermal sensor 1 .

As shown in FIG. 5A , when the heat source is vertically below the thermal sensor 1 , the vertical airflow generated by the heat source flows toward the thermal sensor 1 . Furthermore, as shown in FIG. 5B , when the heat source is at a position different from the position vertically below the thermal sensor 1 , the horizontal airflow flowing along the ceiling flows toward the thermal sensor 1 .

The thermal sensor 1 of the present embodiment has a thinner structure than the prior art, and has a structure capable of sensing thermal energy of gas flowing by at least one of the vertical airflow and the horizontal airflow. Hereinafter, the structure of the thermal sensor 1 will be described in detail.

6 is a diagram showing the thermal sensor 1, (a) is a front view, (b) is a bottom view. FIG. 7 is a top view of the thermal sensor 1 . FIG. 8 is an enlarged cross-sectional view of a part of the thermal sensor 1 shown in (a) of FIG. 6 . FIG. 9 is a diagram showing a region of the thermal sensor 1 where the thermal detection portion 30 is disposed. Moreover, in FIG. 7, the figure in the case where the cover 18 is removed from the casing 10 is shown. In addition, in FIG. 8, only the cut surface is shown, and the structure which exists in the depth direction is not shown.

As shown in FIGS. 6 to 8 , the thermal sensor 1 includes a housing 10 and a component mounting board 40 . 6( b ), the entire external shape of the component mounting board 40 is shown with a dotted line, including the external shape of the component mounting board 40 visible through the first hole 21 (the same applies to FIG. 9 ).

The case 10 has a case body 15 and a protrusion 16 to which the case body 15 is connected. The casing main body 15 is cylindrical and has a bottom portion 11 and a side portion 12 . The protruding portion 16 is cylindrical, and protrudes outward from the bottom portion 11 of the case body 15 . The protruding size of the protruding portion 16 protruding from the bottom portion 11 is, for example, larger than 0 mm and smaller than 9 mm. The diameter of the protruding portion 16 is less than half the diameter of the casing main body 15 .

Furthermore, the case 10 has an opening 13 located on the opposite side of the bottom 11 . When the thermal sensor 1 is installed on the ceiling of a building, the opening 13 is a portion that is in contact with the ceiling. The case 10 is formed of, for example, a heat-resistant resin.

The casing 10 has a first hole 21 and a second hole 22 for allowing the gas flowing in from one of them to flow out from the other. The second hole 22 is connected to the first hole 21 via an internal path 25 to be described later.

When the thermal sensor 1 is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided in the center 10a of the casing 10, but is formed in a peripheral area different from the center 10a (Area shown by dots in FIG. 9) 10b. In the present embodiment, the diameter of the protruding portion 16 is less than half the diameter of the housing body 15, so the peripheral region 10b is located closer to the center 10a than the outer periphery. Specifically, the first hole 21 and the second hole 22 are provided in a range of 0.2 times or more and 0.5 times or less the diameter of the casing body.

As shown in FIG.6(b), the 1st hole 21 is connected to the bottom surface part 16a of the protrusion part 16, and is provided in plural. Each of the first holes 21 is formed along the outer periphery of the bottom surface portion 16a, and each of the first holes 21 has a circular arc shape when the thermal sensor 1 is viewed from the direction of the central axis J1. In addition, the shape of the first hole 21 is not limited to an arcuate shape, and may have a polygonal, circular, elliptical, or crescent shape. Furthermore, when the thermal sensor 1 is viewed from the direction of the central axis J1, each of the first hole 21 and the second hole 22 is rotationally symmetrically arranged with the central axis J1 as the center and at equal angular intervals. In addition, each of the first holes 21 may not be arranged at intervals of an equal angle with the center axis J1 as the center. As shown in FIG.6(a), the 1st hole 21 is provided in the bottom surface part 16a, and the hole axis of the 1st hole 21 is made parallel to the center axis|shaft J1.

As shown in FIGS. 3 and 6( a ), a plurality of second holes 22 are provided on the side surface portion 16 b of the protruding portion 16 . Each of the second holes 22 is provided in the side surface portion 16b such that the hole axis of the second hole 22 is perpendicular to the central axis J1. Each second hole 22 is formed along the outer periphery of the side surface portion 16b. A plurality of struts 23 are provided between the second holes 22 adjacent in the circumferential direction. The plurality of pillars 23 are connected to the case main body 15 and the bottom surface portion 16a.

As shown in FIG. 8 , the housing 10 has an inner path 25 connecting the first hole 21 and the second hole 22 . The gas directed toward the thermal sensor 1 by the vertical airflow flows in through the first hole 21 , passes through the internal path 25 , and flows out from the second hole 22 . On the other hand, the gas directed toward the thermal sensor 1 by the horizontal airflow flows in through the second hole 22 , passes through the internal path 25 , and flows out from the first hole 21 . Alternatively, the gas directed toward the thermal sensor 1 by the horizontal airflow flows in through the second hole 22 and then flows out from the other second hole 22 located on the opposite side of the second hole 22 into which it flows. The aforementioned heat detection portion 30 is arranged at a position in contact with the gas flowing in the internal path 25 . The thermal detection portion 30 is formed as a part of the component mounting substrate 40 .

The component mounting board 40 is arranged inside the casing 10 and is fixed to the inner bottom of the bottom portion 11 of the casing 10 by means of fastening members or the like. The component mounting board 40 is arranged so that the main surface of the component mounting board 40 is orthogonal to the central axis J1, that is, it is arranged in the horizontal direction. Inside the housing 10 , a cover 18 is provided to cover the component mounting substrate 40 .

The component mounting substrate 40 includes a substrate main body 41 , a control unit 50 mounted on the substrate main body 41 , and a plurality of thermal detection elements 32 mounted on the substrate main body 41 .

As shown in FIG. 7, the board|substrate main body 41 has the plate-shaped center part 41c, and the rod-shaped support part 31 extended in four directions from the outer periphery of the center part 41c. The control portion 50 is mounted on the central portion 41 c of the substrate main body 41 , and each of the plurality of thermal detection elements 32 is mounted on the end portion of each support portion 31 . That is, when the thermal sensor 1 is viewed from the direction of the central axis J1 , the control unit 50 is arranged in the center of the casing 10 , and the thermal detection element 32 is arranged on the outer periphery of the control unit 50 . In addition, when the thermal sensor 1 is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the position of the first hole 21 . Specifically, when the thermal sensor 1 is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged at a position overlapping the first hole 21 .

The thermal detection portion 30 includes thermal detection elements 32 and a support portion 31 for supporting each thermal detection element 32 . Moreover, the support part 31 is comprised by a part of the board|substrate main body 41. The thermal detection element 32 and the support portion 31 are disposed inside the casing 10 . Specifically, the end portion of the support portion 31 is arranged so as to be in contact with the gas passing through the internal path 25 (see FIG. 8 ). Thereby, the thermal detection part 30 can detect the thermal energy of the gas passing through the internal path 25 .

Furthermore, as shown in FIG. 9 , when the thermal sensor 1 is viewed from the direction of the central axis J1 , the thermal detection portion 30 is disposed in the peripheral region 10 b that is different from the center 10 a of the housing 10 . In this embodiment, the peripheral region 10b is located closer to the center 10a than the outer periphery.

Since the vertical airflow will flow close to the casing 10 in the peripheral region 10b, the protruding size of the thermal detection portion 30 required for contacting the vertical airflow can be reduced. That is, by arranging the thermal detecting portion 30 in the peripheral region 10b as in the present embodiment, the size of the thermal detecting portion 30 in the direction of the central axis J1 can be reduced compared to, for example, arranging the thermal detecting portion 30 in the center 10a of the housing 10. The protruding dimension of the thermal detection part 30 on the upper part. Thereby, the thermal sensor 1 can be reduced in thickness. Furthermore, since the component mounting board 40 is arranged so that the main surface of the component mounting board 40 is orthogonal to the central axis J1, the thermal sensor 1 can be reduced in thickness.

[1-2. Effects, etc.] The thermal sensor 1 of the present embodiment includes a cylindrical casing 10 having a bottom portion 11, and a thermal detection portion 30 that detects thermal energy of gas. The casing 10 has a first hole 21 and a second hole 22 so that the gas flowing in from one of them flows out from the other. When the thermal sensor 1 is viewed from the direction of the central axis J1 of the casing 10 , the thermal detection portion 30 is arranged in the peripheral region 10 b that is different from the center 10 a of the casing 10 .

As described above, by arranging the thermal detection portion 30 in the peripheral region 10b, the protruding size of the thermal detection portion 30 in the direction of the central axis J1 can be reduced. Thereby, the thermal sensor 1 can be reduced in thickness.

Furthermore, when the thermal sensor 1 is viewed from the direction of the central axis J1, the first hole 21 and the second hole 22 may be provided not in the center 10a of the casing 10, but in the peripheral region 10b.

In this way, by making the thermal sensor 1 not form a hole in the center 10a of the housing 10, the vertical airflow can be directed to the peripheral region 10b of the housing 10. Thereby, the protruding size of the thermal detection portion 30 in the direction of the central axis J1 can be reduced, and the thermal sensor 1 can be reduced in thickness.

Furthermore, the casing 10 may have a cylindrical protrusion 16 protruding outward from the bottom portion 11 , the first hole 21 may be provided in the bottom surface portion 16 a of the protrusion portion 16 , and the second hole 22 may be provided in the side surface portion 16 b of the protrusion 16 . .

As described above, by providing the first hole 21 on the bottom surface portion 16a and the second hole 22 on the side surface portion 16b, the thermal sensor 1 can be provided which can cope with both vertical airflow and horizontal airflow.

Furthermore, the housing 10 may have an inner path 25 connecting the first hole 21 and the second hole 22 , and the thermal detection part 30 may be arranged at a position in contact with the gas flowing in the inner path 25 .

Thereby, the thermal detection part 30 can be used to detect the thermal energy of the gas flowing in the inner path 25 .

In addition, when the thermal sensor 1 is viewed from the direction of the central axis J1 , the thermal detection portion 30 may be arranged to correspond to the first hole 21 .

Thereby, the thermal detection part 30 can be used to detect the thermal energy of the gas flowing in from the first hole 21 or the gas flowing out from the first hole 21 .

Furthermore, the thermal detection part 30 can also have a thermal detection element 32 and a support part 31 supporting the thermal detection element 32 , and the thermal detection element 32 and the support part 31 are arranged inside the casing 10 .

Thereby, the thermal detection part 30 can be used to detect the thermal energy inside the casing 10 .

Furthermore, the thermal sensor 1 can also be further provided with a control unit 50, and the control unit 50 is based on the detection result measured by the thermal detection unit 30 to determine whether there is a fire; in the direction from the central axis J1 When looking at the thermal sensor 1 , the control unit 50 is arranged in the center of the casing 10 , and the thermal detection element 32 is arranged on the outer periphery more than the control unit 50 .

In this way, the thermal detection element 32 can be used to detect the thermal energy of the outer peripheral region of the casing 10 .

Furthermore, a component mounting substrate 40 can also be fixed on the bottom 11 of the housing 10 , and the component mounting substrate 40 includes a substrate main body 41 , a control part 50 and a thermal detection element 32 mounted on the substrate main body 41 , and the supporting part 31 is It is constituted by a part of the substrate main body 41 .

In this way, by mounting the thermal detection element 32 on the substrate main body 41 , the height of the thermal detection portion 30 can be reduced. Thereby, the thermal sensor 1 can be reduced in thickness.

[1-3. Modification 1 of the embodiment] Next, the thermal sensor 1A of Modification 1 of the embodiment will be described. In Modification 1, an example will be described in which the support portion 31 constituting the thermal detection portion 30 of the component mounting substrate 40 is formed along the shape of the first hole 21 .

FIG. 10 is a plan view of the thermal sensor 1A of Modification 1. FIG. Moreover, in FIG. 10, the figure in the case where the cover 18 is removed from the casing 10 is shown.

The component mounting board 40 is arranged inside the casing 10 and is fixed to the inner bottom of the bottom portion 11 of the casing 10 by means of fastening members or the like. The component mounting substrate 40 includes a substrate main body 41 , a control unit 50 , and a plurality of thermal detection elements 32 .

The substrate main body 41 has a central portion 41c and a pair of support portions 31 provided on both sides of the central portion 41c. The control portion 50 is mounted on the central portion 41 c of the substrate main body 41 ; each of the plurality of thermal detection elements 32 is mounted on the end portion of each support portion 31 .

When the thermal sensor 1A is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the first hole 21 . Specifically, the end portion of the support portion 31 has an arcuate shape, and is arranged to correspond to the arcuate first hole 21 . As described above, in the heat detection part 30 of the modification 1, by arranging the end of the support part 31 to correspond to the first hole 21, compared with the above-mentioned embodiment, the heat receiving area is increased, and it is easy to flow from the inside to the inside. The configuration of the gas in path 25 to receive thermal energy.

The same is true for the thermal sensor 1A of the modified example. When the thermal sensor 1A is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged in the peripheral region 10 b that is different from the center 10 a of the housing 10 . As described above, by arranging the thermal detection portion 30 in the peripheral region 10b, the protruding size of the thermal detection portion 30 in the direction of the central axis J1 can be reduced. Thereby, the thermal sensor 1A can be reduced in thickness.

[1-4. Modification 2 of the embodiment] Next, the thermal sensor 1B of Modification 2 of the embodiment will be described. In Modification 2, an example will be described in which the thermal detection portion 30 is disposed closer to the outer periphery than the center of the housing 10 when the thermal sensor 1B is viewed from the direction of the central axis J1 .

11 is a diagram showing a thermal sensor 1B of Modification 2, (a) is a front view, and (b) is a bottom view. FIG. 12 is a diagram showing a region in which the thermal detection unit 30 is arranged in the thermal sensor 1B of the modification 2. As shown in FIG.

As shown in FIG. 11 , the thermal sensor 1B includes a housing 10 and a component mounting board 40 . 11( b ), the entire external shape of the component mounting board 40 is shown with a broken line, including the external shape of the component mounting board 40 visible through the first hole 21 (the same applies to FIG. 12 ).

The case 10 has a case body 15 and a protrusion 16 to which the case body 15 is connected. The casing main body 15 is cylindrical and has a bottom portion 11 and a side portion 12 . The protruding portion 16 is cylindrical, and protrudes outward from the bottom portion 11 of the case body 15 . The diameter of the protruding portion 16 in this modification is larger than 0.5 times the diameter of the housing main body 15 and smaller than 1 time.

When the thermal sensor 1B is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided in the center 10a of the casing 10, but is formed in a peripheral area different from the center 10a (Area shown by dots in FIG. 12) 10b. Since the diameter of the protruding portion 16 is larger than 0.5 times the diameter of the housing main body 15 in this modification, the peripheral region 10b is located closer to the outer periphery than the center 10a. Specifically, the first hole 21 and the second hole 22 are provided in a range larger than 0.5 times the diameter of the casing body and smaller than 1 time.

As shown in FIG. 12 , when the thermal sensor 1B is viewed from the direction of the central axis J1 , the thermal detection portion 30 is disposed in the peripheral region 10 b that is different from the center 10 a of the housing 10 . In addition, the peripheral region 10b of the present modification is located closer to the outer periphery than the center 10a.

Since the vertical airflow will flow close to the casing 10 in the peripheral region 10b, the protruding size of the thermal detection portion 30 required for contacting the vertical airflow can be reduced. Therefore, by arranging the thermal detecting portion 30 in the peripheral region 10b as in this modification, the size of the thermal detecting portion 30 in the direction of the central axis J1 can be reduced compared to, for example, arranging the thermal detecting portion 30 in the center 10a of the housing 10 . the protruding size of the thermal detection part 30 . Thereby, the thermal sensor 1B can be reduced in thickness.

Furthermore, in the thermal sensor 1B of Modification 2, when the thermal sensor 1B is viewed from the direction of the central axis J1 , the peripheral region 10 b is located closer to the outer periphery than the center of the housing 10 .

Thereby, when the vertical airflow flows near the outer periphery of the housing 10 and close to the housing 10 , the protruding size of the thermal detection portion 30 required for contacting the vertical airflow can be reduced. Thereby, the protruding size of the thermal detection portion 30 in the direction of the central axis J1 can be reduced, and the thermal sensor 1B can be reduced in thickness.

[1-5. Modification 3 to Modification 9 of the embodiment] Next, Modifications 3 to 9 of the embodiment will be described with reference to FIGS. 13 to 19 .

First, the thermal sensor 1C of Modification 3 of the embodiment will be described. In Modification 3, an example will be described in which the thermal sensor 1C has two thermal detection parts 30 and two first holes 21 .

13 is a diagram showing a thermal sensor 1C of Modification 3, (a) is a front view, and (b) is a bottom view. Furthermore, in FIG. 13 , the entire outer shape of the component mounting board 40 is shown with dotted lines, including the outer shape of the component mounting board 40 visible through the first hole 21 (also shown in FIGS. 14 to 17 and 19 ). same).

As shown in FIG. 13( a ), the case 10 of the thermal sensor 1C includes a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

As shown in (b) of FIG. 13 , when the thermal sensor 1C is viewed from the direction of the central axis J1 of the casing 10 , each of the first hole 21 and the second hole 22 is not provided at the center 10 a of the casing 10 , but It is provided in the peripheral area 10b (refer FIG. 12) different from the center 10a.

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and two are provided. Each of the first holes 21 is formed in the vicinity of the outer periphery of the bottom surface portion 16a, and each of the first holes 21 has an arcuate shape when the thermal sensor 1C is viewed from the direction of the central axis J1. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may be a polygon such as a rectangle, a circle, an ellipse, a crescent shape, or a combination of these shapes. Furthermore, when the thermal sensor 1C is viewed from the direction of the central axis J1, each of the first holes 21 is rotationally symmetrically arranged at intervals of 180° around the central axis J1. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center, and may not be arranged rotationally symmetrically.

The thermal detection part 30 is arranged at a position in contact with the gas flowing in the internal path 25 . When the thermal sensor 1C is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the position of the first hole 21 . Specifically, when the thermal sensor 1C is viewed from the direction of the central axis J1 , the thermal detection portion 30 is disposed at a position overlapping the first hole 21 .

Next, the thermal sensor 1D of Modification 4 of the embodiment will be described. In Modification 4, an example will be described in which the first hole 21 of the thermal sensor 1D has an elliptical shape.

14 is a diagram showing a thermal sensor 1D of Modification 4, (a) is a front view, and (b) is a bottom view.

As shown in FIG. 14( a ), the case 10 of the thermal sensor 1D includes a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

As shown in FIG. 14( b ), when the thermal sensor 1D is viewed from the direction of the central axis J1 of the casing 10 , the first hole 21 and the second hole 22 are not provided at the center 10 a of the casing 10 , but It is provided in the peripheral area 10b (refer FIG. 12) different from the center 10a.

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and two are provided. Each of the first holes 21 is formed in the vicinity of the outer periphery of the bottom surface portion 16a, and each of the first holes 21 has an elliptical shape when the thermal sensor 1D is viewed from the direction of the central axis J1. In addition, the shape of the first hole 21 is not limited to the elliptical shape, and may have a shape other than the elliptical shape. For example, the shape of the first hole 21 may have a polygonal shape such as a rectangle, a circular shape, a crescent shape, or a shape combining these shapes. Furthermore, when the thermal sensor 1D is viewed from the direction of the central axis J1, each of the first holes 21 is rotationally symmetrically arranged at intervals of 180° around the central axis J1. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center, and may not be arranged rotationally symmetrically.

The thermal detection part 30 is arranged at a position in contact with the gas flowing in the internal path 25 . When the thermal sensor 1D is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the position of the first hole 21 . Specifically, when the thermal sensor 1D is viewed from the direction of the central axis J1 , the thermal detection portion 30 is disposed at a position overlapping the first hole 21 .

Next, the thermal sensor 1E of Modification 5 of the embodiment will be described. In Modification 5, the following example will be described: the thermal sensor 1E has three thermal detection parts 30 and three first holes 21 .

FIG. 15 is a bottom view of the thermal sensor 1E of Modification 5. FIG.

The case 10 of the thermal sensor 1E has a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

When the thermal sensor 1E is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided in the center 10a of the casing 10, but is formed in a peripheral area different from the center 10a 10b (see Fig. 12).

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and three are provided. Each of the first holes 21 is formed in the vicinity of the outer periphery of the bottom surface portion 16a, and when the thermal sensor 1E is viewed from the direction of the central axis J1, each of the first holes 21 has an arcuate shape. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may be a polygon such as a rectangle, a circle, an ellipse, a crescent shape, or a combination of these shapes. Furthermore, when the thermal sensor 1E is viewed from the direction of the central axis J1, each of the first holes 21 is rotationally symmetrically arranged at intervals of 120° around the central axis J1. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center, and may not be arranged rotationally symmetrically.

The thermal detection part 30 is arranged at a position in contact with the gas flowing in the internal path 25 . When the thermal sensor 1E is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the position of the first hole 21 . Specifically, when the thermal sensor 1E is viewed from the direction of the central axis J1 , the thermal detection portion 30 is disposed at a position overlapping the first hole 21 .

Next, the thermal sensor 1F of Modification 6 of the embodiment will be described. In Modification 6, an example will be described in which the first holes 21 are arranged at intervals of different angles when the thermal sensor 1F is viewed from the direction of the central axis J1.

FIG. 16 is a diagram showing the thermal sensor 1F of Modification 6, (a) is a front view, and (b) is a bottom view.

The case 10 of the thermal sensor 1F has a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

When the thermal sensor 1F is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided in the center 10a of the casing 10, but is formed in a peripheral area different from the center 10a 10b (see Fig. 12).

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and three are provided. Each of the first holes 21 is formed in the vicinity of the outer periphery of the bottom surface portion 16a, and when the thermal sensor 1F is viewed from the direction of the central axis J1, each of the first holes 21 has an arcuate shape. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may have a polygonal shape such as a rectangle, a circle, an ellipse, or a crescent shape. Furthermore, when the thermal sensor 1F is viewed from the direction of the central axis J1, each of the three first holes 21 is centered on the central axis J1 at 90° intervals and 180° intervals. Configured at intervals of different angles. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center.

The thermal detection part 30 is arranged at a position in contact with the gas flowing in the internal path 25 . When the thermal sensor 1F is viewed from the direction of the central axis J1 , the thermal detection portion 30 is arranged corresponding to the position of the first hole 21 . That is, each of the three thermal detection portions 30 is also arranged at intervals of different angles with the center axis J1 as the center, at intervals of 90° and at intervals of 180°. In addition, each of the thermal detection parts 30 may not be arranged at intervals with the above-mentioned angle not centering on the central axis J1.

Next, the thermal sensor 1G of Modification 7 of the embodiment will be described. In Modification 7, the following example will be described: when the thermal sensor 1G is viewed from the direction of the central axis J1, the positions of the plurality of thermal detection portions 30 and the positions of the plurality of first holes 21 are partially coincident with each other. , while other parts are not consistent.

FIG. 17 is a diagram showing the thermal sensor 1G of Modification 7, (a) is a front view, and (b) is a bottom view.

As shown in FIG. 17( a ), the case 10 of the thermal sensor 1G includes a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

As shown in FIG. 17( b ), when the thermal sensor 1G is viewed from the direction of the central axis J1 of the casing 10 , each of the first hole 21 and the second hole 22 is not provided at the center 10 a of the casing 10 , but It is provided in the peripheral area 10b (refer FIG. 12) different from the center 10a.

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and two are provided. Each of the first holes 21 is formed in the vicinity of the outer periphery of the bottom surface portion 16a, and when the thermal sensor 1G is viewed from the direction of the central axis J1, each of the first holes 21 has an arcuate shape. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may be a polygon such as a rectangle, a circle, an ellipse, a crescent shape, or a combination of these shapes. Furthermore, when the thermal sensor 1G is viewed from the direction of the central axis J1, each of the first holes 21 is rotationally symmetrically arranged at intervals of 180° around the central axis J1. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center, and may not be arranged rotationally symmetrically.

Four thermal detection units 30 are installed in the casing 10 . When the thermal sensor 1G is viewed from the direction of the central axis J1, two thermal detection parts 30 among the four thermal detection parts 30 are arranged at positions corresponding to the first hole 21; the other two thermal detection parts 30 The measuring portion 30 is provided at a position that does not correspond to the first hole 21 . Specifically, the two thermal detection portions 30 are arranged at positions overlapping the first holes 21 , and the other two thermal detection portions 30 are arranged at positions not overlapping the first holes 21 . When viewed from the direction of the central axis J1, the other two heat detection portions 30 are covered by the bottom surface portion 16a. Like the thermal sensor 1G of Modification 7, when viewed from the direction of the central axis J1, the first hole 21 and the thermal detection portion 30 do not necessarily need to be provided at the same position, and may be provided at different positions.

Next, the thermal sensor 1H of Modification 8 of the embodiment will be described. In Modification 8, an example will be described in which, when the thermal sensor 1H is viewed from the direction of the central axis J1, the positions of the plurality of thermal detection portions 30 and the positions of the plurality of first holes 21 do not all coincide.

FIG. 18 is a bottom view showing the thermal sensor 1H of Modification 8. As shown in FIG.

The case 10 of the thermal sensor 1H has a case body 15 and a protrusion 16 to which the case body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

When the thermal sensor 1H is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided in the center 10a of the casing 10, but is formed in a peripheral area different from the center 10a 10b (see Fig. 12).

Four of the first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16 . Each of the first holes 21 is formed along the outer periphery of the bottom surface portion 16a, and when the thermal sensor 1H is viewed from the direction of the central axis J1, each of the first holes 21 has a circular arc shape. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may have a polygonal shape, an ellipse shape, a crescent shape, or a combination of these shapes. Furthermore, when the thermal sensor 1H is viewed from the direction of the central axis J1, each of the first holes 21 is rotationally symmetrically arranged at intervals of 90° around the central axis J1. In addition, each of the first holes 21 may not be arranged at intervals of the above-mentioned angle with the center axis J1 as the center, and may not be arranged rotationally symmetrically.

Four thermal detection units 30 are installed in the casing 10 . When the thermal sensor 1H is viewed from the direction of the central axis J1 , all the thermal detection portions 30 among the four thermal detection portions 30 are provided at positions that do not correspond to the first holes 21 . Specifically, the four thermal detection portions 30 are arranged at positions that do not overlap with the first holes 21 . When viewed from the direction of the central axis J1, the four heat detection portions 30 are covered by the bottom surface portion 16a.

Next, the thermal sensor 1i of Modification 9 of the embodiment will be described. In Modification 9, the following example will be described: when the thermal sensor 1i is viewed from the direction of the central axis J1, the positions of the plurality of thermal detection portions 30 and the positions of the plurality of first holes 21 are partially coincident with each other. , while other parts are not consistent.

FIG. 19 is a diagram showing a thermal sensor 1i according to Modification 9, (a) is a front view, and (b) is a bottom view.

As shown in FIG. 19( a ), the housing 10 of the thermal sensor 1 i has a housing main body 15 and a protruding portion 16 to which the housing main body 15 is connected. The housing 10 has a first hole 21 and a second hole 22 . The second hole 22 is connected to the first hole 21 through the inner path of the housing 10 .

As shown in (b) of FIG. 19 , when the thermal sensor 1i is viewed from the direction of the central axis J1 of the casing 10, each of the first hole 21 and the second hole 22 is not provided at the center 10a of the casing 10, but It is provided in the peripheral area 10b (refer FIG. 12) different from the center 10a.

The first holes 21 are fastened to the bottom surface portion 16a of the protruding portion 16, and two are provided. Each of the first holes 21 is formed along the outer periphery of the bottom surface portion 16a, and each of the first holes 21 has a circular arc shape when the thermal sensor 1i is viewed from the direction of the central axis J1. In addition, the shape of the first hole 21 is not limited to the arc shape, and may have a shape other than the arc shape. For example, the shape of the first hole 21 may have a polygonal shape, an ellipse shape, a crescent shape, or a combination of these shapes. Furthermore, when the thermal sensor 1i is viewed from the direction of the central axis J1, each of the first holes 21 is arranged to be rotationally symmetrical about the central axis J1. In addition, each of the first holes 21 may not be arranged to be rotationally symmetrical about the central axis J1.

Four thermal detection units 30 are installed in the casing 10 . When the thermal sensor 1i is viewed from the direction of the central axis J1, two thermal detectors 30 among the four thermal detectors 30 are disposed at positions corresponding to the first hole 21; the other two thermal detectors The measuring portion 30 is provided at a position that does not correspond to the first hole 21 . Specifically, the two thermal detection portions 30 are arranged at positions overlapping the first holes 21 , and the other two thermal detection portions 30 are arranged at positions not overlapping the first holes 21 . When viewed from the direction of the central axis J1, the other two heat detection portions 30 are covered by the bottom surface portion 16a. Like the thermal sensor 1i of Modification 9, when viewed from the direction of the central axis J1, the first hole 21 and the thermal detection portion 30 do not necessarily need to be provided at the same positions, and may be provided at different positions.

As shown in the thermal sensors 1C to 1i of Modifications 3 to 9, when the thermal sensors 1C to 1i are viewed from the direction of the central axis J1, the thermal detection portion 30 is arranged at a position different from the center 10a of the casing 10 Peripheral area 10b. In addition, the peripheral region 10b of Modifications 3 to 9 is positioned closer to the outer periphery than the center 10a.

Since the vertical airflow will flow close to the casing 10 in the peripheral region 10b, the protruding size of the thermal detection portion 30 required for contacting the vertical airflow can be reduced. Therefore, by arranging the thermal detection portion 30 in the peripheral region 10b as in the modified examples 3 to 9, the size of the thermal detection portion 30 can be reduced on the central axis J1, compared to the case where the thermal detection portion 30 is arranged in the center 10a of the housing 10, for example. The protruding size of the thermal detection portion 30 in the direction. Thereby, the thermal sensors 1C to 1i can be thinned.

(Other Embodiments) As mentioned above, although the thermal sensors 1-1i of this invention were demonstrated based on the said embodiment, this invention is not limited to the said embodiment.

For example, the thermal sensors 1 to 1i may also include a smoke detection portion for detecting smoke. Furthermore, the thermal sensors 1 to 1i are not limited to being arranged on the ceiling, but may also be arranged on a wall. The thermal sensors 1 to 1i may be supplied with electric power by a public power source, or may be supplied with electric power by a battery provided inside the casing 10 .

For example, the shape of the housing 10 of the thermal sensors 1 to 1i is not limited to a cylindrical shape, and may be a rectangular cylindrical shape. Furthermore, the number of the thermal detection parts 30 provided in the casing 10 is not limited to a plurality, and may be one.

Other forms that can be obtained by applying various modifications that can be conceived by those of ordinary skill in the technical field to which the present invention pertains to the embodiments, or forms realized by arbitrarily combining the constituent elements and functions of the embodiments without departing from the gist of the present invention, All belong to the present invention.

1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1i‧‧‧thermal sensor 10‧‧‧Enclosure 10a‧‧‧Center 10b‧‧‧ Surrounding area 11, 111‧‧‧Bottom 12‧‧‧Side 13‧‧‧Opening 15‧‧‧Enclosure body 16‧‧‧Projection 16a‧‧‧Bottom face 16b‧‧‧Side 18‧‧‧Cover 21‧‧‧1st hole 22‧‧‧2nd hole 23‧‧‧Pillars 25‧‧‧Internal Path 30‧‧‧Thermal Detection Department 31‧‧‧Support Department 32‧‧‧Thermal detection element 40‧‧‧Parts mounting board 41‧‧‧Substrate body 41c‧‧‧Central 50‧‧‧Control Department 101‧‧‧Thermal sensor 110‧‧‧Enclosure 116‧‧‧Protective frame 130‧‧‧Thermal Detection Department J1‧‧‧Central axis

[FIG. 1] FIG. 1 is a diagram illustrating a thermal sensor of a comparative example. [Fig. 2] Fig. 2 is a perspective view of the thermal sensor of the embodiment. [Fig. 3] Fig. 3 is a perspective view of the thermal sensor of the embodiment viewed from a direction different from that of Fig. 2. [Fig. [FIG. 4] FIG. 4 is a diagram showing a schematic configuration of the thermal sensor of the embodiment. [FIG. 5A] FIG. 5A is a diagram showing the vertical airflow to the thermal sensor of the embodiment. [FIG. 5B] FIG. 5B is a diagram showing the horizontal airflow to the thermal sensor of the embodiment. [FIG. 6] FIG. 6 is a diagram showing the thermal sensor of the embodiment, (a) is a front view, and (b) is a bottom view. [Fig. 7] Fig. 7 is a plan view of the thermal sensor according to the embodiment. [Fig. 8] Fig. 8 is an enlarged cross-sectional view of a part of the thermal sensor shown in (a) of Fig. 6. [Fig. [FIG. 9] FIG. 9 is a diagram showing a region where a thermal detection portion is arranged in the thermal sensor of the embodiment. [ Fig. 10] Fig. 10 is a plan view of a thermal sensor according to Modification 1 of the embodiment. [Fig. 11] Fig. 11 is a diagram showing a thermal sensor according to Modification 2 of the embodiment, (a) is a front view, and (b) is a bottom view. [FIG. 12] FIG. 12 is a diagram showing a region in which a thermal detection portion is arranged in the thermal sensor according to Modification 2 of the embodiment. [Fig. 13] Fig. 13 is a diagram showing a thermal sensor according to Modification 3 of the embodiment, wherein (a) is a front view, and (b) is a bottom view. [Fig. 14] Fig. 14 is a diagram showing a thermal sensor according to Modification 4 of the embodiment, wherein (a) is a front view, and (b) is a bottom view. [ Fig. 15] Fig. 15 is a bottom view showing a thermal sensor according to Modification 5 of the embodiment. [Fig. 16] Fig. 16 is a diagram showing a thermal sensor according to Modification 6 of the embodiment, (a) is a front view, and (b) is a bottom view. [Fig. 17] Fig. 17 is a diagram showing a thermal sensor according to Modification 7 of the embodiment, wherein (a) is a front view, and (b) is a bottom view. [ Fig. 18] Fig. 18 is a bottom view showing a thermal sensor according to Modification 8 of the embodiment. [Fig. 19] Fig. 19 is a diagram showing a thermal sensor according to Modification 9 of the embodiment, (a) is a front view, and (b) is a bottom view.

1‧‧‧thermal sensor

10‧‧‧Enclosure

10a‧‧‧Center

10b‧‧‧ Surrounding area

11‧‧‧Bottom

12‧‧‧Side

15‧‧‧Enclosure body

16‧‧‧Projection

21‧‧‧1st hole

30‧‧‧Thermal Detection Department

40‧‧‧Parts mounting board

J1‧‧‧Central axis

Claims (6)

A thermal sensor, comprising: a casing having: a cylindrical casing main body having a side portion; and a protruding portion connected to the casing main body, protruding vertically downward toward the outside and disposed; and a thermal detecting portion for detecting gas The thermal energy of the shell; the shell has a first hole and a second hole, so that the gas flowing in from one hole directly contacts the thermal detection part, and then flows out from the other hole; when viewing the shell from the direction of the central axis of the shell In the case of a thermal sensor, the thermal detection portion is circumferentially arranged in plural numbers in a peripheral region of the casing that is different from the center; the thermal detection portion has: a thermal detection element composed of a chip thermistor , and a support portion for supporting the thermal detection element; at the bottom of the casing, a component mounting substrate is fixed; the component mounting substrate includes a substrate main body and the thermal detection element mounted on the substrate main body; the supporting portion, It is formed by a part of the main body of the base plate; the first hole is set on the bottom surface of the protruding part; the second hole is set on the side surface of the protruding part. According to the thermal sensor of claim 1, when the thermal sensor is viewed from the central axis direction, the first hole and the second hole are not respectively provided in the center of the housing, but are located in the surrounding area. The thermal sensor of claim 1, wherein, when the thermal sensor is viewed from the center axis direction, The thermal detection part is arranged corresponding to the first hole. According to the thermal sensor of claim 1, wherein the thermal detection element and the support portion are disposed inside the casing. The thermal sensor of claim 1, further comprising: a control unit, based on the detection result measured by the thermal detection unit, to determine whether there is a fire; observing the thermal sensor from the direction of the central axis In the case of a device, the control part is arranged in the center of the casing, and the thermal detection element is arranged at an outer periphery more than the control part. The thermal sensor of claim 1, wherein, when the thermal sensor is viewed from the central axis direction, the peripheral region is located closer to the outer periphery than the center of the housing.

Images