TWI744461B - Housing assembly, electronic module and electronic device with same - Google Patents
Housing assembly, electronic module and electronic device with same Download PDFInfo
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- TWI744461B TWI744461B TW107101345A TW107101345A TWI744461B TW I744461 B TWI744461 B TW I744461B TW 107101345 A TW107101345 A TW 107101345A TW 107101345 A TW107101345 A TW 107101345A TW I744461 B TWI744461 B TW I744461B
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Abstract
Description
本發明涉及一種殼體組件、電子組件模組及具有該電子組件模組的電子裝置。 The invention relates to a housing component, an electronic component module and an electronic device with the electronic component module.
目前,越來越多的電子裝置具有拍攝功能。然而,在將攝像模組安裝至電子裝置的過程中,一直存在著攝像模組與殼體的對位不良的問題,從而影響到攝像頭的拍攝視角。 Currently, more and more electronic devices have shooting functions. However, in the process of installing the camera module to the electronic device, there has always been a problem of poor alignment between the camera module and the housing, which affects the shooting angle of the camera.
有鑑於此,有必要提供一種對位良好的殼體組件。 In view of this, it is necessary to provide a housing assembly with good alignment.
另外,還提供了一種電子組件模組和具有該電子組件模組的電子裝置。 In addition, an electronic component module and an electronic device having the electronic component module are also provided.
一種殼體組件,其改良在於,所述殼體組件至少包括第一殼體、支架和第二殼體,所述支架設置於所述第一殼體上,所述支架遠離所述第一殼體的表面形成一第一凹槽,所述第一凹槽包括第一底壁和第一側壁,所述支架對應所述第一側壁的一側設置有一斜面,所述第二殼體裝設於所述支架上,所述第二殼體朝向所述支架的表面凸設形成一凸出部,所述凸出部上形成一第二凹槽,所述第二凹槽包括一第二側壁,所述第二凹槽收容所述支架設置有所述斜面的一端,所述支架的斜面抵持於所述第二凹槽的第二側壁,以調整所述支架和所述第二殼體的對位關係;所述支架上設有至少兩缺口,所述第一殼體上 設置有至少兩限位柱,所述至少兩限位柱對應設置於所述至少兩缺口內,以將所述支架裝設於所述第一殼體上,所述缺口尺寸大於所述限位柱的尺寸。 A housing assembly, which is improved in that the housing assembly at least includes a first housing, a bracket, and a second housing, the bracket is disposed on the first housing, and the bracket is away from the first housing A first groove is formed on the surface of the body. The first groove includes a first bottom wall and a first side wall. A side of the bracket corresponding to the first side wall is provided with an inclined surface. On the bracket, the second housing protrudes toward the surface of the bracket to form a protruding portion, the protruding portion is formed with a second groove, and the second groove includes a second side wall , The second groove accommodates an end of the bracket provided with the inclined surface, and the inclined surface of the bracket abuts against the second side wall of the second groove to adjust the bracket and the second housing The alignment relationship; the bracket is provided with at least two notches, the first housing At least two limiting posts are provided, and the at least two limiting posts are correspondingly disposed in the at least two notches to install the bracket on the first housing, and the size of the notches is larger than the limit The size of the column.
一種電子組件模組,所述電子組件模組包括電子組件和殼體組件,所述支架包括一第一容置空間,所述第二殼體包括一第二容置空間,所述第一容置空間用以收容所述電子組件,所述第二容置空間用以收容所述支架。 An electronic component module, the electronic component module includes an electronic component and a housing component, the bracket includes a first accommodating space, the second housing includes a second accommodating space, the first accommodating space The accommodating space is used for accommodating the electronic component, and the second accommodating space is for accommodating the bracket.
一種電子裝置,所述電子裝置包括電路板和電子組件模組,所述電路板設置於所述支架上,且與所述電子組件電連接。 An electronic device includes a circuit board and an electronic component module. The circuit board is arranged on the bracket and is electrically connected to the electronic component.
綜上所述,所述電子裝置藉由將所述支架預固定於所述第一殼體上,再將所述第二殼體裝設於所述支架上,藉由所述支架的斜面滑入所述第二凹槽,並抵持於所述第二凹槽的第二側壁,以精準調節所述支架和所述第二殼體的對位關係。另外,當所述電子組件為攝像頭組件時,由於二者對位精準,因此可有效避免影響到其拍攝視角。 In summary, the electronic device pre-fixes the bracket on the first casing, and then installs the second casing on the bracket, and slides on the inclined surface of the bracket. Into the second groove and abut against the second side wall of the second groove to precisely adjust the alignment relationship between the bracket and the second housing. In addition, when the electronic component is a camera component, due to the precise alignment of the two, it can effectively avoid affecting its shooting angle of view.
10:殼體組件 10: Shell components
101:第一殼體 101: The first shell
1011:限位柱 1011: limit column
1013:安裝孔 1013: mounting hole
102:第一容置空間 102: The first housing space
103:支架 103: bracket
1031:頂面 1031: top surface
1032:底面 1032: Bottom
1033:周壁 1033: Zhou Wall
1034:第一凹槽 1034: first groove
1035:第一底壁 1035: first bottom wall
1036:第一側壁 1036: first side wall
1037:斜面 1037: Slope
1038:配合部 1038: Cooperating Department
1039:缺口 1039: gap
104:第二容置空間 104: second housing space
105:第二殼體 105: second shell
1051:外表面 1051: Outer surface
1052:內表面 1052: inner surface
1053:穿孔 1053: Piercing
1054:凸出部 1054: Protruding part
1055:第二凹槽 1055: second groove
1056:第二底壁 1056: second bottom wall
1057:第二側壁 1057: second side wall
1058:開口 1058: opening
1059:容置槽 1059: accommodating slot
107:保護蓋 107: Protective cover
1071:蓋片 1071: cover sheet
20:電子組件模組 20: Electronic component module
30:電子組件 30: Electronic components
50:電路板 50: circuit board
501:貫穿口 501: Through mouth
503:組裝孔 503: assembly hole
100:電子裝置 100: electronic device
圖1為本發明較佳實施的電子裝置的結構示意圖。 FIG. 1 is a schematic structural diagram of an electronic device according to a preferred embodiment of the present invention.
圖2為圖1所示電子裝置的分解示意圖。 Fig. 2 is an exploded schematic diagram of the electronic device shown in Fig. 1.
圖3為圖1所示電子裝置的部分組裝示意圖。 FIG. 3 is a schematic diagram of a partial assembly of the electronic device shown in FIG. 1.
圖4為圖1所示電子裝置另一視角下的分解示意圖。 4 is an exploded schematic diagram of the electronic device shown in FIG. 1 from another perspective.
圖5為沿圖1所示電子裝置中V-V線的剖視圖。 Fig. 5 is a cross-sectional view taken along the line V-V in the electronic device shown in Fig. 1.
圖6為圖1所示電子裝置的另一部分組裝示意圖。 FIG. 6 is a schematic diagram of another part of the assembly of the electronic device shown in FIG. 1.
下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,所屬技術領域中具有通常知識 者在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。 The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, there is general knowledge in the technical field All other embodiments obtained by the author without creative work shall fall within the protection scope of the present invention.
需要說明的是,當組件被稱為“固定於”另一個組件,它可以直接在另一個組件上或者也可以存在居中的組件。當一個組件被認為是“連接”另一個組件,它可以是直接連接到另一個組件或者可能同時存在居中組件。當一個組件被認為是“設置於”另一個組件,它可以是直接設置在另一個組件上或者可能同時存在居中組件。本文所使用的術語“垂直的”、“水準的”、“左”、“右”以及類似的表述只是為了說明的目的。 It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or a centered component may also exist. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a centered component at the same time. When a component is considered to be "installed on" another component, it can be directly installed on another component or a centered component may exist at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
除非另有定義,本文所使用的所有的技術和科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施例的目的,不是旨在於限制本發明。本文所使用的術語“及/或”包括一個或多個相關的所列項目的任意的和所有的組合。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.
參閱圖1及圖2,本發明較佳實施例提供了一種電子裝置100。所述電子裝置100可以為行動電話、平板、相機等。在本實施例中,以所述電子裝置100為一手機為例進行說明。
Referring to FIG. 1 and FIG. 2, a preferred embodiment of the present invention provides an
所述電子裝置100包括殼體組件10、電子組件30及電路板50。
The
所述殼體組件10包括第一殼體101、支架103以及第二殼體105。
The
請一併參閱圖3,所述第一殼體101用於安裝所述支架103。在本實施例中,所述第一殼體101為一中框。所述第一殼體101上設置有至少兩限位柱1011。所述限位元柱1011呈柱狀結構。所述限位柱1011用於輔助將所述支架103預固定於所述第一殼體101的對應位置上。當然,在其他實施例中,所述限位柱1011還可以是長方體、圓臺等其他結構。
Please also refer to FIG. 3, the
所述第一殼體101的一側還設置有安裝孔1013。在本實施例中,所述安裝孔1013為螺紋孔。
A mounting
請一併參閱圖4,在本實施例中,所述支架103包括頂面1031、底面1032和周壁1033。所述頂面1031和所述底面1032相對設置,所述周壁1033設置並連接於所述頂面1031與所述底面1032之間。所述支架103還包括一第一容置空間102,所述第一容置空間102由所述頂面1031朝所述底面1032方向向下凹陷穿透形成。其中,所述支架103可呈圓形或四邊形結構。
Please also refer to FIG. 4. In this embodiment, the
可以理解,在本實施例中,所述支架103還開設一第一凹槽1034,所述第一凹槽1034由所述周壁1033靠近所述第一容置空間102的一側凹陷形成,大致呈環狀環繞於第一容置空間的外側。所述第一凹槽1034的橫截面大致呈臺階狀。具體地,所述第一凹槽1034包括第一底壁1035和第一側壁1036。所述周壁1033對應所述第一側壁1036的一側設置有一斜面1037。所述頂面1031和所述斜面1037之間形成一非直角的夾角A(參圖5)。
It can be understood that, in this embodiment, the
進一步地,所述支架103上還設置有至少兩個配合部1038。所述配合部1038由所述周壁1033向外側延伸形成,用於輔助將所述支架103預固定於所述第一殼體101上,以避免所述支架103在安裝過程中過分偏離所述第一殼體101上的對應位置。
Furthermore, at least two matching
在本實施例中,所述配合部1038呈一片狀結構,且該配合部1038上形成一大致呈C型的缺口1039。所述缺口1039與所述限位柱1011相匹配。當將所述支架103組裝至所述第一殼體101時,所述支架103上的所述缺口1039對準相應的限位柱1011設置,並使得所述限位柱1011穿過並收容於所述缺口1039內。由於所述缺口1039大致呈C型,且其尺寸大於所述限位柱1011的尺寸。如此,當所述限位柱1011裝設於所述缺口1039內時,所述支架103可相對所述限位柱1011於第一方向(例如X軸方向)和第二方向(例如Y軸方向)上運動,從而調整所述支架103在所述第一殼體101上的位置。在本實施例中,所述第一方向與所述第二方向相互垂直。
In this embodiment, the
請一併參閱圖5,在本實施例中,所述第二殼體105可為所述電子裝置100的背蓋。所述第二殼體105裝設於所述支架103上。具體地,所述第二殼體105包括外表面1051及與所述外表面1051相對設置的內表面1052。可以理解,所述第二殼體105還包括一第二容置空間104。所述第二容置空間104由所述內表面1052朝所述外表面1051的方向凹陷穿透所述內表面1052,並與所述外表面1051一起形成。所述第二容置空間104用以收容所述支架103,所述支架103的第一容置空間102用以收容所述電子組件30。進一步地,所述第二殼體105上還設有穿孔1053,所述穿孔1053貫通所述外表面1051及內表面1052,且與所述第二容置空間104連通。
Please also refer to FIG. 5. In this embodiment, the
可以理解,所述內表面1052上凸設形成一呈環狀的凸出部1054。具體的,所述凸出部1054的內壁朝向所述第二容置空間104的方向凹陷形成一大致呈環狀的第二凹槽1055。所述第二凹槽1055的橫截面大致呈臺階狀。所述第二凹槽1055包括第二底壁1056和第二側壁1057。其中,所述第二底壁1056和第二側壁1057之間形成一非直角的夾角B(參圖5)。在本實施例中,所述夾角B呈倒C角。當然,在其他實施例中,所述夾角B亦可呈倒R角。
It can be understood that a ring-shaped
在本實施例中,所述第二凹槽1055收容所述支架103設置有所述斜面1037的一端,並使得所述支架103的斜面1037抵持所述第二凹槽1055的第二側壁1057,以調整所述支架103和所述第二殼體105的對位關係,使得所述支架103的第一容置空間102收容的所述電子組件30能夠與所述第二殼體105上的穿孔1053準確定位,並將所述第二殼體105卡接於所述支架103上。進一步地,所述支架103的頂面1031亦可抵持所述第二凹槽1055的第二底壁1056,以加固所述支架103與所述第二殼體105之間的連接。其中,上述的對位關係為二維方向的對位關係。
In this embodiment, the
在本實施例中,所述電子組件30為雙攝像頭組件。所述電子組件30裝設於所述第一容置空間102,並穿過所述第二容置空間104從所述穿孔1053部分露出。其中,所述電子組件30和所述殼體組件10共同構成一電子組件模組20。
In this embodiment, the
可以理解,在其他實施例中,所述電子組件30不局限於所述雙攝像頭組件,其還可以是單攝像頭組件、接近感測器、閃光燈或其他電子組件或模組。
It can be understood that in other embodiments, the
可以理解,當所述電子組件30為雙攝像頭組件時,所述殼體組件10還可包括保護蓋107。所述保護蓋107用於保護電子組件30。在本實施例中,所述保護蓋107屬於第二殼體105的一部分。所述保護蓋107設置於所述第二殼體105上。具體地,所述第二殼體105上設置有一開口1058。所述開口1058貫穿所述第二殼體105的外表面1051和內表面1052。所述保護蓋107藉由所述開口1058設置於所述第二殼體105上。其中,所述保護蓋107可預先處理裝設於所述第二殼體105,其中所述保護蓋107與所述第二殼體105的凸出部1054形成一體結構。
It can be understood that when the
進一步地,所述保護蓋107遠離所述支架103的表面向內凹陷形成一容置槽1059。所述穿孔1053貫通設置於所述容置槽1059的底面。所述容置槽1059容置一蓋片1071。在本實施例中,所述蓋片1071為玻璃等透明材質。所述蓋片1071容置於所述容置槽1059內,其與保護蓋107的表面齊平,以保證所述第二殼體105的美觀性,同時確保所述雙攝像頭組件的正常拍攝。
Further, the surface of the
請一併參閱圖6,在本實施例中,所述電路板50設置於所述支架103上,且與所述電子組件30電連接。具體的,所述電路板50上設置有貫穿口501。所述貫穿口501對應所述支架103設置。所述貫穿口501用以供裝設有所述電子組件30的支架103穿過,使得所述電路板50蓋設於所述配合部1038上,且所述電子
組件30從所述電路板50遠離所述第一殼體101的一側露出。如此,所述配合部1038夾設於所述第一殼體101和所述電路板50之間。
Please also refer to FIG. 6. In this embodiment, the
可以理解,在本實施例中,所述電路板50除了用以提供與電子組件30的電連接外,還用以輔助所述支架103在第三方向(例如Z軸方向)上固定於所述第一殼體101。其中,所述第三方向與所述第一方向和所述第二方向均垂直。
It can be understood that, in this embodiment, the
具體地,所述電路板50上設置有組裝孔503。所述組裝孔503與所述第一殼體101上的安裝孔1013相匹配。如此,當所述支架103裝設於所述第一殼體101的對應位置時,藉由將一安裝件(例如螺釘)分別穿過所述組裝孔503及所述安裝孔1013,從而將所述電子組件30固定於所述第一殼體101上。
Specifically, an
所述電子裝置100的組裝工序包括:首先,將所述支架103藉由所述配合部1038預固定於所述第一殼體101上的限位柱1011。接著,將所述電子組件30容置於所述支架103的第一容置空間102內。然後,將所述電路板50對準所述支架103,使得裝設有電子組件30的支架103穿過所述電路板50,以使得所述電路板50的邊緣抵持所述配合部1038。再將所述第二殼體105對應卡接於所述支架103,使得所述支架103的斜面1037滑入所述第二凹槽1055,並抵持於所述第二凹槽1055的第二側壁1057,以調整所述支架103和所述第二殼體105的對位關係。當對位關係調整完後,藉由安裝件穿過所述電路板50上的組裝孔503及所述第一殼體101上的安裝孔1013,進而完成所述電子裝置100的固定及組裝。
The assembling process of the
綜上所述,所述電子裝置100藉由將所述支架103預固定於所述第一殼體101上,再將所述第二殼體105裝設於所述支架103上,藉由所述支架103的斜面1037滑入所述第二凹槽1055,並抵持於所述第二凹槽1055的第二側壁1057,以精準調節所述支架103和所述第二殼體105的對位關係,使得所述支架103的第一容置空間102收容的所述電子組件30能夠與所述第二殼體105上的穿
孔1053準確定位。另外,當所述電子組件30為雙攝像頭組件時,由於雙攝像頭組件與所述第二殼體105上的穿孔1053二者對位精準,因此可有效避免影響到其拍攝視角。
In summary, the
以上實施例僅用以說明本發明的技術方案而非限制,儘管參照較佳實施例對本發明進行了詳細的說明,所屬技術領域中具有通常知識者應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神和實質。 The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those with ordinary knowledge in the technical field should understand that the technical solutions of the present invention can be modified or modified. Equivalent replacement without departing from the spirit and essence of the technical solution of the present invention.
10:殼體組件 10: Shell components
101:第一殼體 101: The first shell
1011:限位柱 1011: limit column
1013:安裝孔 1013: mounting hole
102:第一容置空間 102: The first housing space
103:支架 103: bracket
1031:頂面 1031: top surface
1033:周壁 1033: Zhou Wall
1034:第一凹槽 1034: first groove
1035:第一底壁 1035: first bottom wall
1036:第一側壁 1036: first side wall
1037:斜面 1037: Slope
1038:配合部 1038: Cooperating Department
1039:缺口 1039: gap
105:第二殼體 105: second shell
1051:外表面 1051: Outer surface
1053:穿孔 1053: Piercing
1058:開口 1058: opening
1059:容置槽 1059: accommodating slot
107:保護蓋 107: Protective cover
1071:蓋片 1071: cover sheet
20:電子組件模組 20: Electronic component module
30:電子組件 30: Electronic components
50:電路板 50: circuit board
501:貫穿口 501: Through mouth
503:組裝孔 503: assembly hole
100:電子裝置 100: electronic device
Claims (10)
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TW107101345A TWI744461B (en) | 2018-01-12 | 2018-01-12 | Housing assembly, electronic module and electronic device with same |
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TW107101345A TWI744461B (en) | 2018-01-12 | 2018-01-12 | Housing assembly, electronic module and electronic device with same |
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TW201931968A TW201931968A (en) | 2019-08-01 |
TWI744461B true TWI744461B (en) | 2021-11-01 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206294254U (en) * | 2016-12-20 | 2017-06-30 | 广东欧珀移动通信有限公司 | Housing unit, dual camera module and mobile terminal |
TW201728985A (en) * | 2015-11-16 | 2017-08-16 | 三美電機股份有限公司 | Lens driving device, camera module and camera-mounted device |
US20170310861A1 (en) * | 2016-04-21 | 2017-10-26 | Ningbo Sunny Opotech Co., Ltd. | Camera Module and Array Camera Module Based on Integral Packaging Technology |
-
2018
- 2018-01-12 TW TW107101345A patent/TWI744461B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201728985A (en) * | 2015-11-16 | 2017-08-16 | 三美電機股份有限公司 | Lens driving device, camera module and camera-mounted device |
US20170310861A1 (en) * | 2016-04-21 | 2017-10-26 | Ningbo Sunny Opotech Co., Ltd. | Camera Module and Array Camera Module Based on Integral Packaging Technology |
CN206294254U (en) * | 2016-12-20 | 2017-06-30 | 广东欧珀移动通信有限公司 | Housing unit, dual camera module and mobile terminal |
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