TWI744461B - Housing assembly, electronic module and electronic device with same - Google Patents

Housing assembly, electronic module and electronic device with same Download PDF

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Publication number
TWI744461B
TWI744461B TW107101345A TW107101345A TWI744461B TW I744461 B TWI744461 B TW I744461B TW 107101345 A TW107101345 A TW 107101345A TW 107101345 A TW107101345 A TW 107101345A TW I744461 B TWI744461 B TW I744461B
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Taiwan
Prior art keywords
bracket
housing
electronic component
groove
accommodating space
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TW107101345A
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Chinese (zh)
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TW201931968A (en
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陳珏全
繆奕杰
黃盟哲
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群邁通訊股份有限公司
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Abstract

A housing assembly includes a first housing, a holder and a second housing. The holder is positioned on the first housing. A surface of the holder forms a first groove. The first groove includes a first bottom wall and a first sidewall. One side of the holder corresponding to the first sidewall includes an inclined surface. The second housing is positioned on the holder. A surface of the second housing facing the holder forms a protruding portion. A second groove is defined on the protruding portion. The second groove includes a second sidewall. The second groove receives one end of the holder defining the inclined surface. The inclined surface of the holder abuts the second sidewall of the second groove to adjust an alignment relationship of the holder and the second housing. An electronic module and an electronic device with the electronic module is also provided.

Description

殼體組件、電子組件模組及具有電子組件模組的電子裝置 Shell component, electronic component module and electronic device with electronic component module

本發明涉及一種殼體組件、電子組件模組及具有該電子組件模組的電子裝置。 The invention relates to a housing component, an electronic component module and an electronic device with the electronic component module.

目前,越來越多的電子裝置具有拍攝功能。然而,在將攝像模組安裝至電子裝置的過程中,一直存在著攝像模組與殼體的對位不良的問題,從而影響到攝像頭的拍攝視角。 Currently, more and more electronic devices have shooting functions. However, in the process of installing the camera module to the electronic device, there has always been a problem of poor alignment between the camera module and the housing, which affects the shooting angle of the camera.

有鑑於此,有必要提供一種對位良好的殼體組件。 In view of this, it is necessary to provide a housing assembly with good alignment.

另外,還提供了一種電子組件模組和具有該電子組件模組的電子裝置。 In addition, an electronic component module and an electronic device having the electronic component module are also provided.

一種殼體組件,其改良在於,所述殼體組件至少包括第一殼體、支架和第二殼體,所述支架設置於所述第一殼體上,所述支架遠離所述第一殼體的表面形成一第一凹槽,所述第一凹槽包括第一底壁和第一側壁,所述支架對應所述第一側壁的一側設置有一斜面,所述第二殼體裝設於所述支架上,所述第二殼體朝向所述支架的表面凸設形成一凸出部,所述凸出部上形成一第二凹槽,所述第二凹槽包括一第二側壁,所述第二凹槽收容所述支架設置有所述斜面的一端,所述支架的斜面抵持於所述第二凹槽的第二側壁,以調整所述支架和所述第二殼體的對位關係;所述支架上設有至少兩缺口,所述第一殼體上 設置有至少兩限位柱,所述至少兩限位柱對應設置於所述至少兩缺口內,以將所述支架裝設於所述第一殼體上,所述缺口尺寸大於所述限位柱的尺寸。 A housing assembly, which is improved in that the housing assembly at least includes a first housing, a bracket, and a second housing, the bracket is disposed on the first housing, and the bracket is away from the first housing A first groove is formed on the surface of the body. The first groove includes a first bottom wall and a first side wall. A side of the bracket corresponding to the first side wall is provided with an inclined surface. On the bracket, the second housing protrudes toward the surface of the bracket to form a protruding portion, the protruding portion is formed with a second groove, and the second groove includes a second side wall , The second groove accommodates an end of the bracket provided with the inclined surface, and the inclined surface of the bracket abuts against the second side wall of the second groove to adjust the bracket and the second housing The alignment relationship; the bracket is provided with at least two notches, the first housing At least two limiting posts are provided, and the at least two limiting posts are correspondingly disposed in the at least two notches to install the bracket on the first housing, and the size of the notches is larger than the limit The size of the column.

一種電子組件模組,所述電子組件模組包括電子組件和殼體組件,所述支架包括一第一容置空間,所述第二殼體包括一第二容置空間,所述第一容置空間用以收容所述電子組件,所述第二容置空間用以收容所述支架。 An electronic component module, the electronic component module includes an electronic component and a housing component, the bracket includes a first accommodating space, the second housing includes a second accommodating space, the first accommodating space The accommodating space is used for accommodating the electronic component, and the second accommodating space is for accommodating the bracket.

一種電子裝置,所述電子裝置包括電路板和電子組件模組,所述電路板設置於所述支架上,且與所述電子組件電連接。 An electronic device includes a circuit board and an electronic component module. The circuit board is arranged on the bracket and is electrically connected to the electronic component.

綜上所述,所述電子裝置藉由將所述支架預固定於所述第一殼體上,再將所述第二殼體裝設於所述支架上,藉由所述支架的斜面滑入所述第二凹槽,並抵持於所述第二凹槽的第二側壁,以精準調節所述支架和所述第二殼體的對位關係。另外,當所述電子組件為攝像頭組件時,由於二者對位精準,因此可有效避免影響到其拍攝視角。 In summary, the electronic device pre-fixes the bracket on the first casing, and then installs the second casing on the bracket, and slides on the inclined surface of the bracket. Into the second groove and abut against the second side wall of the second groove to precisely adjust the alignment relationship between the bracket and the second housing. In addition, when the electronic component is a camera component, due to the precise alignment of the two, it can effectively avoid affecting its shooting angle of view.

10:殼體組件 10: Shell components

101:第一殼體 101: The first shell

1011:限位柱 1011: limit column

1013:安裝孔 1013: mounting hole

102:第一容置空間 102: The first housing space

103:支架 103: bracket

1031:頂面 1031: top surface

1032:底面 1032: Bottom

1033:周壁 1033: Zhou Wall

1034:第一凹槽 1034: first groove

1035:第一底壁 1035: first bottom wall

1036:第一側壁 1036: first side wall

1037:斜面 1037: Slope

1038:配合部 1038: Cooperating Department

1039:缺口 1039: gap

104:第二容置空間 104: second housing space

105:第二殼體 105: second shell

1051:外表面 1051: Outer surface

1052:內表面 1052: inner surface

1053:穿孔 1053: Piercing

1054:凸出部 1054: Protruding part

1055:第二凹槽 1055: second groove

1056:第二底壁 1056: second bottom wall

1057:第二側壁 1057: second side wall

1058:開口 1058: opening

1059:容置槽 1059: accommodating slot

107:保護蓋 107: Protective cover

1071:蓋片 1071: cover sheet

20:電子組件模組 20: Electronic component module

30:電子組件 30: Electronic components

50:電路板 50: circuit board

501:貫穿口 501: Through mouth

503:組裝孔 503: assembly hole

100:電子裝置 100: electronic device

圖1為本發明較佳實施的電子裝置的結構示意圖。 FIG. 1 is a schematic structural diagram of an electronic device according to a preferred embodiment of the present invention.

圖2為圖1所示電子裝置的分解示意圖。 Fig. 2 is an exploded schematic diagram of the electronic device shown in Fig. 1.

圖3為圖1所示電子裝置的部分組裝示意圖。 FIG. 3 is a schematic diagram of a partial assembly of the electronic device shown in FIG. 1.

圖4為圖1所示電子裝置另一視角下的分解示意圖。 4 is an exploded schematic diagram of the electronic device shown in FIG. 1 from another perspective.

圖5為沿圖1所示電子裝置中V-V線的剖視圖。 Fig. 5 is a cross-sectional view taken along the line V-V in the electronic device shown in Fig. 1.

圖6為圖1所示電子裝置的另一部分組裝示意圖。 FIG. 6 is a schematic diagram of another part of the assembly of the electronic device shown in FIG. 1.

下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,所屬技術領域中具有通常知識 者在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。 The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, there is general knowledge in the technical field All other embodiments obtained by the author without creative work shall fall within the protection scope of the present invention.

需要說明的是,當組件被稱為“固定於”另一個組件,它可以直接在另一個組件上或者也可以存在居中的組件。當一個組件被認為是“連接”另一個組件,它可以是直接連接到另一個組件或者可能同時存在居中組件。當一個組件被認為是“設置於”另一個組件,它可以是直接設置在另一個組件上或者可能同時存在居中組件。本文所使用的術語“垂直的”、“水準的”、“左”、“右”以及類似的表述只是為了說明的目的。 It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or a centered component may also exist. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a centered component at the same time. When a component is considered to be "installed on" another component, it can be directly installed on another component or a centered component may exist at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

除非另有定義,本文所使用的所有的技術和科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施例的目的,不是旨在於限制本發明。本文所使用的術語“及/或”包括一個或多個相關的所列項目的任意的和所有的組合。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

參閱圖1及圖2,本發明較佳實施例提供了一種電子裝置100。所述電子裝置100可以為行動電話、平板、相機等。在本實施例中,以所述電子裝置100為一手機為例進行說明。 Referring to FIG. 1 and FIG. 2, a preferred embodiment of the present invention provides an electronic device 100. The electronic device 100 may be a mobile phone, a tablet, a camera, etc. In this embodiment, the electronic device 100 is a mobile phone as an example for description.

所述電子裝置100包括殼體組件10、電子組件30及電路板50。 The electronic device 100 includes a housing assembly 10, an electronic assembly 30 and a circuit board 50.

所述殼體組件10包括第一殼體101、支架103以及第二殼體105。 The housing assembly 10 includes a first housing 101, a bracket 103 and a second housing 105.

請一併參閱圖3,所述第一殼體101用於安裝所述支架103。在本實施例中,所述第一殼體101為一中框。所述第一殼體101上設置有至少兩限位柱1011。所述限位元柱1011呈柱狀結構。所述限位柱1011用於輔助將所述支架103預固定於所述第一殼體101的對應位置上。當然,在其他實施例中,所述限位柱1011還可以是長方體、圓臺等其他結構。 Please also refer to FIG. 3, the first housing 101 is used for mounting the bracket 103. In this embodiment, the first housing 101 is a middle frame. At least two limiting posts 1011 are provided on the first housing 101. The limit element column 1011 has a columnar structure. The limiting post 1011 is used to assist in pre-fixing the bracket 103 to the corresponding position of the first housing 101. Of course, in other embodiments, the limiting column 1011 may also be a rectangular parallelepiped, a truncated cone, or other structures.

所述第一殼體101的一側還設置有安裝孔1013。在本實施例中,所述安裝孔1013為螺紋孔。 A mounting hole 1013 is also provided on one side of the first housing 101. In this embodiment, the mounting hole 1013 is a threaded hole.

請一併參閱圖4,在本實施例中,所述支架103包括頂面1031、底面1032和周壁1033。所述頂面1031和所述底面1032相對設置,所述周壁1033設置並連接於所述頂面1031與所述底面1032之間。所述支架103還包括一第一容置空間102,所述第一容置空間102由所述頂面1031朝所述底面1032方向向下凹陷穿透形成。其中,所述支架103可呈圓形或四邊形結構。 Please also refer to FIG. 4. In this embodiment, the bracket 103 includes a top surface 1031, a bottom surface 1032 and a peripheral wall 1033. The top surface 1031 and the bottom surface 1032 are disposed opposite to each other, and the peripheral wall 1033 is disposed and connected between the top surface 1031 and the bottom surface 1032. The bracket 103 further includes a first accommodating space 102, and the first accommodating space 102 is formed by recessing and penetrating the top surface 1031 toward the bottom surface 1032. Wherein, the bracket 103 may have a circular or quadrangular structure.

可以理解,在本實施例中,所述支架103還開設一第一凹槽1034,所述第一凹槽1034由所述周壁1033靠近所述第一容置空間102的一側凹陷形成,大致呈環狀環繞於第一容置空間的外側。所述第一凹槽1034的橫截面大致呈臺階狀。具體地,所述第一凹槽1034包括第一底壁1035和第一側壁1036。所述周壁1033對應所述第一側壁1036的一側設置有一斜面1037。所述頂面1031和所述斜面1037之間形成一非直角的夾角A(參圖5)。 It can be understood that, in this embodiment, the bracket 103 further defines a first groove 1034, and the first groove 1034 is formed by recessing a side of the peripheral wall 1033 close to the first accommodating space 102, approximately It surrounds the outer side of the first accommodating space in a ring shape. The cross section of the first groove 1034 is generally step-shaped. Specifically, the first groove 1034 includes a first bottom wall 1035 and a first side wall 1036. A side of the peripheral wall 1033 corresponding to the first side wall 1036 is provided with an inclined surface 1037. A non-right angle A is formed between the top surface 1031 and the inclined surface 1037 (refer to FIG. 5).

進一步地,所述支架103上還設置有至少兩個配合部1038。所述配合部1038由所述周壁1033向外側延伸形成,用於輔助將所述支架103預固定於所述第一殼體101上,以避免所述支架103在安裝過程中過分偏離所述第一殼體101上的對應位置。 Furthermore, at least two matching parts 1038 are also provided on the bracket 103. The mating portion 1038 is formed by extending the peripheral wall 1033 to the outside, and is used to assist in pre-fixing the bracket 103 on the first housing 101 to prevent the bracket 103 from excessively deviating from the first housing 101 during installation. A corresponding position on the housing 101.

在本實施例中,所述配合部1038呈一片狀結構,且該配合部1038上形成一大致呈C型的缺口1039。所述缺口1039與所述限位柱1011相匹配。當將所述支架103組裝至所述第一殼體101時,所述支架103上的所述缺口1039對準相應的限位柱1011設置,並使得所述限位柱1011穿過並收容於所述缺口1039內。由於所述缺口1039大致呈C型,且其尺寸大於所述限位柱1011的尺寸。如此,當所述限位柱1011裝設於所述缺口1039內時,所述支架103可相對所述限位柱1011於第一方向(例如X軸方向)和第二方向(例如Y軸方向)上運動,從而調整所述支架103在所述第一殼體101上的位置。在本實施例中,所述第一方向與所述第二方向相互垂直。 In this embodiment, the mating portion 1038 has a one-piece structure, and a substantially C-shaped notch 1039 is formed on the mating portion 1038. The gap 1039 is matched with the limiting post 1011. When assembling the bracket 103 to the first housing 101, the notch 1039 on the bracket 103 is aligned with the corresponding limit post 1011, so that the limit post 1011 passes through and is received in Within the gap 1039. Because the notch 1039 is roughly C-shaped, and its size is larger than the size of the limiting post 1011. In this way, when the limit post 1011 is installed in the notch 1039, the bracket 103 can move relative to the limit post 1011 in a first direction (for example, the X-axis direction) and a second direction (for example, the Y-axis direction). ) Moves upward to adjust the position of the bracket 103 on the first housing 101. In this embodiment, the first direction and the second direction are perpendicular to each other.

請一併參閱圖5,在本實施例中,所述第二殼體105可為所述電子裝置100的背蓋。所述第二殼體105裝設於所述支架103上。具體地,所述第二殼體105包括外表面1051及與所述外表面1051相對設置的內表面1052。可以理解,所述第二殼體105還包括一第二容置空間104。所述第二容置空間104由所述內表面1052朝所述外表面1051的方向凹陷穿透所述內表面1052,並與所述外表面1051一起形成。所述第二容置空間104用以收容所述支架103,所述支架103的第一容置空間102用以收容所述電子組件30。進一步地,所述第二殼體105上還設有穿孔1053,所述穿孔1053貫通所述外表面1051及內表面1052,且與所述第二容置空間104連通。 Please also refer to FIG. 5. In this embodiment, the second housing 105 may be a back cover of the electronic device 100. The second housing 105 is installed on the bracket 103. Specifically, the second housing 105 includes an outer surface 1051 and an inner surface 1052 disposed opposite to the outer surface 1051. It can be understood that the second housing 105 further includes a second accommodating space 104. The second accommodating space 104 is recessed from the inner surface 1052 toward the outer surface 1051, penetrates the inner surface 1052, and is formed together with the outer surface 1051. The second accommodating space 104 is used to accommodate the bracket 103, and the first accommodating space 102 of the bracket 103 is used to accommodate the electronic component 30. Furthermore, the second housing 105 is further provided with a through hole 1053, the through hole 1053 penetrates the outer surface 1051 and the inner surface 1052 and communicates with the second accommodating space 104.

可以理解,所述內表面1052上凸設形成一呈環狀的凸出部1054。具體的,所述凸出部1054的內壁朝向所述第二容置空間104的方向凹陷形成一大致呈環狀的第二凹槽1055。所述第二凹槽1055的橫截面大致呈臺階狀。所述第二凹槽1055包括第二底壁1056和第二側壁1057。其中,所述第二底壁1056和第二側壁1057之間形成一非直角的夾角B(參圖5)。在本實施例中,所述夾角B呈倒C角。當然,在其他實施例中,所述夾角B亦可呈倒R角。 It can be understood that a ring-shaped protrusion 1054 is protrudingly formed on the inner surface 1052. Specifically, the inner wall of the protruding portion 1054 is recessed toward the second accommodating space 104 to form a substantially ring-shaped second groove 1055. The cross section of the second groove 1055 is generally stepped. The second groove 1055 includes a second bottom wall 1056 and a second side wall 1057. Wherein, a non-right angle B is formed between the second bottom wall 1056 and the second side wall 1057 (refer to FIG. 5). In this embodiment, the included angle B is a chamfered angle C. Of course, in other embodiments, the included angle B may also be a chamfered R angle.

在本實施例中,所述第二凹槽1055收容所述支架103設置有所述斜面1037的一端,並使得所述支架103的斜面1037抵持所述第二凹槽1055的第二側壁1057,以調整所述支架103和所述第二殼體105的對位關係,使得所述支架103的第一容置空間102收容的所述電子組件30能夠與所述第二殼體105上的穿孔1053準確定位,並將所述第二殼體105卡接於所述支架103上。進一步地,所述支架103的頂面1031亦可抵持所述第二凹槽1055的第二底壁1056,以加固所述支架103與所述第二殼體105之間的連接。其中,上述的對位關係為二維方向的對位關係。 In this embodiment, the second groove 1055 accommodates an end of the bracket 103 provided with the inclined surface 1037, and makes the inclined surface 1037 of the bracket 103 abut the second side wall 1057 of the second groove 1055 , In order to adjust the alignment relationship between the bracket 103 and the second housing 105, so that the electronic component 30 contained in the first accommodating space 102 of the bracket 103 can be The perforation 1053 is accurately positioned, and the second housing 105 is clamped to the bracket 103. Furthermore, the top surface 1031 of the bracket 103 can also resist the second bottom wall 1056 of the second groove 1055 to strengthen the connection between the bracket 103 and the second housing 105. Wherein, the above-mentioned alignment relationship is a two-dimensional alignment relationship.

在本實施例中,所述電子組件30為雙攝像頭組件。所述電子組件30裝設於所述第一容置空間102,並穿過所述第二容置空間104從所述穿孔1053部分露出。其中,所述電子組件30和所述殼體組件10共同構成一電子組件模組20。 In this embodiment, the electronic component 30 is a dual camera component. The electronic component 30 is installed in the first accommodating space 102 and partially exposed from the through hole 1053 through the second accommodating space 104. Wherein, the electronic component 30 and the housing component 10 together constitute an electronic component module 20.

可以理解,在其他實施例中,所述電子組件30不局限於所述雙攝像頭組件,其還可以是單攝像頭組件、接近感測器、閃光燈或其他電子組件或模組。 It can be understood that in other embodiments, the electronic component 30 is not limited to the dual camera component, and may also be a single camera component, a proximity sensor, a flashlight, or other electronic components or modules.

可以理解,當所述電子組件30為雙攝像頭組件時,所述殼體組件10還可包括保護蓋107。所述保護蓋107用於保護電子組件30。在本實施例中,所述保護蓋107屬於第二殼體105的一部分。所述保護蓋107設置於所述第二殼體105上。具體地,所述第二殼體105上設置有一開口1058。所述開口1058貫穿所述第二殼體105的外表面1051和內表面1052。所述保護蓋107藉由所述開口1058設置於所述第二殼體105上。其中,所述保護蓋107可預先處理裝設於所述第二殼體105,其中所述保護蓋107與所述第二殼體105的凸出部1054形成一體結構。 It can be understood that when the electronic assembly 30 is a dual camera assembly, the housing assembly 10 may further include a protective cover 107. The protective cover 107 is used to protect the electronic component 30. In this embodiment, the protective cover 107 is part of the second housing 105. The protective cover 107 is disposed on the second housing 105. Specifically, an opening 1058 is provided on the second housing 105. The opening 1058 penetrates the outer surface 1051 and the inner surface 1052 of the second housing 105. The protective cover 107 is disposed on the second casing 105 through the opening 1058. Wherein, the protective cover 107 can be pre-processed and installed on the second housing 105, wherein the protective cover 107 and the protruding portion 1054 of the second housing 105 form an integral structure.

進一步地,所述保護蓋107遠離所述支架103的表面向內凹陷形成一容置槽1059。所述穿孔1053貫通設置於所述容置槽1059的底面。所述容置槽1059容置一蓋片1071。在本實施例中,所述蓋片1071為玻璃等透明材質。所述蓋片1071容置於所述容置槽1059內,其與保護蓋107的表面齊平,以保證所述第二殼體105的美觀性,同時確保所述雙攝像頭組件的正常拍攝。 Further, the surface of the protective cover 107 away from the bracket 103 is recessed inward to form a receiving groove 1059. The perforation 1053 is penetrated and arranged on the bottom surface of the containing groove 1059. The accommodating groove 1059 accommodates a cover sheet 1071. In this embodiment, the cover sheet 1071 is made of transparent material such as glass. The cover sheet 1071 is accommodated in the accommodating groove 1059 and is flush with the surface of the protective cover 107 to ensure the aesthetics of the second housing 105 and at the same time ensure the normal shooting of the dual camera assembly.

請一併參閱圖6,在本實施例中,所述電路板50設置於所述支架103上,且與所述電子組件30電連接。具體的,所述電路板50上設置有貫穿口501。所述貫穿口501對應所述支架103設置。所述貫穿口501用以供裝設有所述電子組件30的支架103穿過,使得所述電路板50蓋設於所述配合部1038上,且所述電子 組件30從所述電路板50遠離所述第一殼體101的一側露出。如此,所述配合部1038夾設於所述第一殼體101和所述電路板50之間。 Please also refer to FIG. 6. In this embodiment, the circuit board 50 is disposed on the bracket 103 and is electrically connected to the electronic component 30. Specifically, a through hole 501 is provided on the circuit board 50. The through opening 501 is provided corresponding to the bracket 103. The through opening 501 is used to allow the bracket 103 provided with the electronic component 30 to pass through, so that the circuit board 50 is covered on the mating portion 1038, and the electronic The component 30 is exposed from the side of the circuit board 50 away from the first housing 101. In this way, the matching portion 1038 is sandwiched between the first housing 101 and the circuit board 50.

可以理解,在本實施例中,所述電路板50除了用以提供與電子組件30的電連接外,還用以輔助所述支架103在第三方向(例如Z軸方向)上固定於所述第一殼體101。其中,所述第三方向與所述第一方向和所述第二方向均垂直。 It can be understood that, in this embodiment, the circuit board 50 is not only used to provide electrical connection with the electronic component 30, but also used to assist the bracket 103 to be fixed on the third direction (such as the Z-axis direction). First housing 101. Wherein, the third direction is perpendicular to both the first direction and the second direction.

具體地,所述電路板50上設置有組裝孔503。所述組裝孔503與所述第一殼體101上的安裝孔1013相匹配。如此,當所述支架103裝設於所述第一殼體101的對應位置時,藉由將一安裝件(例如螺釘)分別穿過所述組裝孔503及所述安裝孔1013,從而將所述電子組件30固定於所述第一殼體101上。 Specifically, an assembly hole 503 is provided on the circuit board 50. The assembly hole 503 matches the mounting hole 1013 on the first housing 101. In this way, when the bracket 103 is installed at the corresponding position of the first housing 101, a mounting member (such as a screw) is inserted through the assembly hole 503 and the mounting hole 1013, respectively, so that the The electronic component 30 is fixed on the first housing 101.

所述電子裝置100的組裝工序包括:首先,將所述支架103藉由所述配合部1038預固定於所述第一殼體101上的限位柱1011。接著,將所述電子組件30容置於所述支架103的第一容置空間102內。然後,將所述電路板50對準所述支架103,使得裝設有電子組件30的支架103穿過所述電路板50,以使得所述電路板50的邊緣抵持所述配合部1038。再將所述第二殼體105對應卡接於所述支架103,使得所述支架103的斜面1037滑入所述第二凹槽1055,並抵持於所述第二凹槽1055的第二側壁1057,以調整所述支架103和所述第二殼體105的對位關係。當對位關係調整完後,藉由安裝件穿過所述電路板50上的組裝孔503及所述第一殼體101上的安裝孔1013,進而完成所述電子裝置100的固定及組裝。 The assembling process of the electronic device 100 includes: first, the bracket 103 is pre-fixed to the limiting post 1011 on the first housing 101 through the matching portion 1038. Then, the electronic component 30 is accommodated in the first accommodating space 102 of the bracket 103. Then, the circuit board 50 is aligned with the bracket 103 so that the bracket 103 equipped with the electronic component 30 passes through the circuit board 50 so that the edge of the circuit board 50 abuts the mating portion 1038. Then the second housing 105 is correspondingly snapped to the bracket 103, so that the inclined surface 1037 of the bracket 103 slides into the second groove 1055, and resists the second groove 1055 of the second groove 1055. The side wall 1057 is used to adjust the alignment relationship between the bracket 103 and the second housing 105. After the alignment relationship is adjusted, the mounting member passes through the assembly hole 503 on the circuit board 50 and the mounting hole 1013 on the first housing 101 to complete the fixing and assembly of the electronic device 100.

綜上所述,所述電子裝置100藉由將所述支架103預固定於所述第一殼體101上,再將所述第二殼體105裝設於所述支架103上,藉由所述支架103的斜面1037滑入所述第二凹槽1055,並抵持於所述第二凹槽1055的第二側壁1057,以精準調節所述支架103和所述第二殼體105的對位關係,使得所述支架103的第一容置空間102收容的所述電子組件30能夠與所述第二殼體105上的穿 孔1053準確定位。另外,當所述電子組件30為雙攝像頭組件時,由於雙攝像頭組件與所述第二殼體105上的穿孔1053二者對位精準,因此可有效避免影響到其拍攝視角。 In summary, the electronic device 100 pre-fixes the bracket 103 on the first casing 101, and then installs the second casing 105 on the bracket 103, The inclined surface 1037 of the bracket 103 slides into the second groove 1055 and abuts against the second side wall 1057 of the second groove 1055 to precisely adjust the alignment of the bracket 103 and the second housing 105 Position relationship, so that the electronic component 30 accommodated in the first accommodating space 102 of the bracket 103 can be inserted into the second housing 105 The hole 1053 is accurately positioned. In addition, when the electronic assembly 30 is a dual-camera assembly, the dual-camera assembly and the perforation 1053 on the second housing 105 are precisely aligned, which can effectively avoid affecting its shooting angle of view.

以上實施例僅用以說明本發明的技術方案而非限制,儘管參照較佳實施例對本發明進行了詳細的說明,所屬技術領域中具有通常知識者應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神和實質。 The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those with ordinary knowledge in the technical field should understand that the technical solutions of the present invention can be modified or modified. Equivalent replacement without departing from the spirit and essence of the technical solution of the present invention.

10:殼體組件 10: Shell components

101:第一殼體 101: The first shell

1011:限位柱 1011: limit column

1013:安裝孔 1013: mounting hole

102:第一容置空間 102: The first housing space

103:支架 103: bracket

1031:頂面 1031: top surface

1033:周壁 1033: Zhou Wall

1034:第一凹槽 1034: first groove

1035:第一底壁 1035: first bottom wall

1036:第一側壁 1036: first side wall

1037:斜面 1037: Slope

1038:配合部 1038: Cooperating Department

1039:缺口 1039: gap

105:第二殼體 105: second shell

1051:外表面 1051: Outer surface

1053:穿孔 1053: Piercing

1058:開口 1058: opening

1059:容置槽 1059: accommodating slot

107:保護蓋 107: Protective cover

1071:蓋片 1071: cover sheet

20:電子組件模組 20: Electronic component module

30:電子組件 30: Electronic components

50:電路板 50: circuit board

501:貫穿口 501: Through mouth

503:組裝孔 503: assembly hole

100:電子裝置 100: electronic device

Claims (10)

一種殼體組件,其改良在於,所述殼體組件至少包括第一殼體、支架和第二殼體,所述支架設置於所述第一殼體上,所述支架遠離所述第一殼體的表面形成一第一凹槽,所述第一凹槽包括第一底壁和第一側壁,所述支架對應所述第一側壁的一側設置有一斜面,所述第二殼體裝設於所述支架上,所述第二殼體朝向所述支架的表面凸設形成一凸出部,所述凸出部上形成一第二凹槽,所述第二凹槽包括一第二側壁,所述第二凹槽收容所述支架設置有所述斜面的一端,所述支架的斜面抵持於所述第二凹槽的第二側壁,以調整所述支架和所述第二殼體的對位關係;所述支架上設有至少兩缺口,所述第一殼體上設置有至少兩限位柱,所述至少兩限位柱對應設置於所述至少兩缺口內,以將所述支架裝設於所述第一殼體上,所述缺口尺寸大於所述限位柱的尺寸。 A housing assembly, which is improved in that the housing assembly at least includes a first housing, a bracket, and a second housing, the bracket is disposed on the first housing, and the bracket is away from the first housing A first groove is formed on the surface of the body. The first groove includes a first bottom wall and a first side wall. A side of the bracket corresponding to the first side wall is provided with an inclined surface. On the bracket, the second housing protrudes toward the surface of the bracket to form a protruding portion, the protruding portion is formed with a second groove, and the second groove includes a second side wall , The second groove accommodates an end of the bracket provided with the inclined surface, and the inclined surface of the bracket abuts against the second side wall of the second groove to adjust the bracket and the second housing Alignment relationship; the bracket is provided with at least two notches, the first housing is provided with at least two limit posts, the at least two limit posts are correspondingly provided in the at least two notches, so as to The bracket is installed on the first housing, and the size of the notch is larger than the size of the limiting column. 如請求項1所述之殼體組件,其中,所述支架和所述第二殼體的對位關係為二維的對位關係。 The housing assembly according to claim 1, wherein the alignment relationship between the bracket and the second housing is a two-dimensional alignment relationship. 如請求項1所述之殼體組件,其中,所述第二殼體為背蓋。 The housing assembly according to claim 1, wherein the second housing is a back cover. 如請求項1所述之殼體組件,其中,所述支架上設置有至少兩配合部,所述缺口形成與所述配合部上。 The housing assembly according to claim 1, wherein the bracket is provided with at least two mating parts, and the notch is formed on the mating part. 一種電子組件模組,其改良在於,所述電子組件模組包括電子組件和如請求項1-4中任一項所述的殼體組件,所述支架包括一第一容置空間,所述第二殼體包括一第二容置空間,所述第一容置空間用以收容所述電子組件,所述第二容置空間用以收容所述支架。 An electronic component module, which is improved in that the electronic component module includes an electronic component and the housing component according to any one of claims 1-4, the bracket includes a first accommodating space, and the The second housing includes a second accommodating space, the first accommodating space is used for accommodating the electronic component, and the second accommodating space is used for accommodating the bracket. 如請求項5所述之電子組件模組,其中,所述電子組件為攝像頭組件、閃光燈或者接近感測器。 The electronic component module according to claim 5, wherein the electronic component is a camera component, a flashlight, or a proximity sensor. 如請求項5所述之電子組件模組,其中,所述支架包括頂面、底面和周壁,所述頂面和所述底面相對設置,所述周壁設置於所述頂面和所述底面之間,所述頂面朝所述底面方向向下凹陷形成所述第一容置空間,所述第二殼體包括外表面及與所述外表面相對設置的內表面,所述內表面朝所述外表面的方向凹陷形成第二容置空間。 The electronic component module according to claim 5, wherein the bracket includes a top surface, a bottom surface and a peripheral wall, the top surface and the bottom surface are disposed oppositely, and the peripheral wall is disposed between the top surface and the bottom surface. In between, the top surface is recessed downward in the direction of the bottom surface to form the first accommodating space, the second housing includes an outer surface and an inner surface opposite to the outer surface, and the inner surface faces the The direction of the outer surface is recessed to form a second accommodating space. 如請求項7所述之電子組件模組,其中,所述頂面和所述第一側壁之間形成一非直角的夾角。 The electronic component module according to claim 7, wherein a non-right angle is formed between the top surface and the first side wall. 一種電子裝置,其改良在於,所述電子裝置包括電路板和如請求項7所述的電子組件模組,所述電路板設置於所述支架上,且與所述電子組件電連接。 An electronic device, which is improved in that the electronic device includes a circuit board and the electronic component module according to claim 7, the circuit board is arranged on the bracket and is electrically connected to the electronic component. 如請求項9所述之電子裝置,其中,所述電路板設置於所述支架,並與所述第一殼體配合,以將所述支架設置於所述第一殼體。 The electronic device according to claim 9, wherein the circuit board is disposed on the bracket and cooperates with the first casing to install the bracket on the first casing.
TW107101345A 2018-01-12 2018-01-12 Housing assembly, electronic module and electronic device with same TWI744461B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206294254U (en) * 2016-12-20 2017-06-30 广东欧珀移动通信有限公司 Housing unit, dual camera module and mobile terminal
TW201728985A (en) * 2015-11-16 2017-08-16 三美電機股份有限公司 Lens driving device, camera module and camera-mounted device
US20170310861A1 (en) * 2016-04-21 2017-10-26 Ningbo Sunny Opotech Co., Ltd. Camera Module and Array Camera Module Based on Integral Packaging Technology

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201728985A (en) * 2015-11-16 2017-08-16 三美電機股份有限公司 Lens driving device, camera module and camera-mounted device
US20170310861A1 (en) * 2016-04-21 2017-10-26 Ningbo Sunny Opotech Co., Ltd. Camera Module and Array Camera Module Based on Integral Packaging Technology
CN206294254U (en) * 2016-12-20 2017-06-30 广东欧珀移动通信有限公司 Housing unit, dual camera module and mobile terminal

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