TWI743906B - Semiconductor manufacturing process control system and semiconductor manufacturing process control method - Google Patents

Abstract

A semiconductor manufacturing process control system including a base, a accommodating unit, a transfer unit, a sensing unit, and a control unit is provided. The accommodating unit is connected to the base. The accommodating unit is suitable for accommodating a semiconductor element. The transfer unit is suitable for transferring the semiconductor element to or from the accommodating unit. The sensing unit is suitable for sensing and obtaining the measurement position of the accommodating unit. The control unit is signally connected to the transfer unit and the sensing unit. The control unit includes a database. The database stores the reference position data of the accommodating unit. A semiconductor manufacturing process control method is also provided.

Description

Semiconductor manufacturing process control system and semiconductor manufacturing process control method

The present invention relates to a process control system and a process control method, and more particularly to a semiconductor process control system and a semiconductor process control method.

In the semiconductor manufacturing process, how to improve the yield or stability of the process is often a topic that R&D personnel in the semiconductor-related industries urgently want to solve.

The present invention provides a semiconductor process control system and a semiconductor process control method, which can improve the yield or stability of the corresponding semiconductor process.

The semiconductor manufacturing process control system of the present invention includes a base, a accommodating unit, a transmission unit, a sensing unit, and a control unit. The accommodating unit is connected to the base, and the accommodating unit is suitable for accommodating semiconductor elements. The transfer unit is suitable for transferring the semiconductor element to or from the accommodating unit. The sensing unit is suitable for sensing and obtaining the measurement position of the accommodating unit. The control unit signal is connected to the transmission unit and the sensing unit. The control unit includes a database. The database stores the reference position data of the accommodating unit.

In an embodiment of the present invention, the sensing unit is fixed to the base.

In an embodiment of the present invention, the sensing unit includes a distance measuring element. The distance measuring element is suitable for measuring the measuring position of the accommodating unit. The control unit is adapted to compare the measured position measured by the distance measuring element with the reference position data stored in the database.

In an embodiment of the present invention, the sensing unit includes an image capturing element. The control unit is adapted to determine the measurement position of the accommodating unit based on the image captured by the image capturing element, so as to compare with the reference position data stored in the database.

In an embodiment of the present invention, the control unit is adapted to adjust the position of the transmission unit by measuring the position and the reference position data of the database.

In an embodiment of the present invention, the reference location data of the accommodating unit stored in the database includes a conversion function.

In an embodiment of the present invention, the reference position data of the accommodating unit stored in the database includes a numerical matrix.

The semiconductor process control method of the semiconductor process control system of the present invention includes the following steps: placing a semiconductor element on the transmission unit of the semiconductor process control system of an embodiment of the present invention; The position is compared with the reference position data stored in the database; according to the comparison result between the measured position and the reference position data, one of the following steps is performed: the semiconductor device is transmitted by the transmission unit; or the transmission by the transmission unit is stopped Semiconductor components.

In an embodiment of the present invention, the step of transferring the semiconductor device includes: the control unit adjusts the position of the transfer unit according to the comparison result to transfer the semiconductor device by the transfer unit.

Based on the above, the semiconductor process control system and semiconductor process control method of the present invention can improve the yield or stability of the corresponding semiconductor process.

Hereinafter, some embodiments are listed in conjunction with the accompanying drawings for detailed description, but the provided embodiments are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn in accordance with the original dimensions. To facilitate understanding, the same elements in the following description will be described with the same symbols.

1 and 2A or 2B, the semiconductor process control system 100 includes a base 110, a accommodating unit 120, a transmission unit 130, a sensing unit 140, and a control unit 150. The accommodating unit 120 is connected to the base 110. The accommodating unit 120 is suitable for accommodating the semiconductor element 90. The transfer unit 130 is adapted to send the semiconductor element 90 to the accommodating unit 120 to accommodate the semiconductor element 90 in the accommodating unit 120; or, the transfer unit 130 is adapted to self-contain the semiconductor element 90 in the accommodating unit 120 The semiconductor element 90 inside is removed from the accommodating unit 120. The sensing unit 140 is suitable for sensing the accommodating unit 120. The control unit 150 is signally connected to the transmission unit 130 and the sensing unit 140. The control unit 150 includes a database 151. The database 151 stores reference position data of the accommodating unit 120.

In this embodiment, the semiconductor element 90 is, for example, a wafer, but the invention is not limited to this.

In this embodiment, the accommodating unit 120 is, for example, a wafer boat (such as a furnace wafer boat/furnace boat), but the present invention is not limited to this. In an embodiment, the accommodating unit 120 may be a chamber, a wafer foup, or other suitable objects for accommodating or placing the semiconductor element 90 in the semiconductor manufacturing process.

In an embodiment, the accommodating unit 120 may be directly or indirectly connected to the base 100. In addition, the present invention does not limit the form of the base 100. For example, an object on which the accommodating unit 120 can be placed or directly or indirectly connected can be generally referred to as the base 100.

2A, in an embodiment, the sensing unit 140 may include a distance measuring element 141. The distance measuring element 141 is suitable for measuring the measuring position of the accommodating unit 120. The control unit 150 is adapted to compare the measured position measured by the distance measuring element 141 with the reference position data stored in the database 151.

For example, the distance measuring element 141 may include a laser measuring instrument or other similar optical measuring instruments (Optical Measurement), for example. The distance measuring element 141 can measure the measurement position of the accommodating unit 120. The electronic signal with the measurement position can be transmitted to the control unit 150. The control unit 150 can read the reference location data including the accommodating unit 120 in the database 151. Then, the judgment component 152 of the control unit 150 can compare the aforementioned measurement position with the aforementioned reference position data to perform subsequent steps.

In an embodiment, the determining element 152 may include a logic chip or corresponding software, but the invention is not limited thereto.

2B, in an embodiment, the sensing unit 140 may include an image capturing element 142. The control unit 150 is adapted to determine the measurement position of the accommodating unit 120 by using the image captured by the image capturing element 142 to compare with the reference position data stored in the database 151.

For example, the sensing unit 140 may include a charge-coupled device (CCD) or other similar image capturing devices. The image capturing element 142 can capture an image of the accommodating unit 120. The electronic signal with the image of the capturing and containing unit 120 can be transmitted to the control unit 150. The image recognition component 153 of the control unit 150 can estimate the measurement position of the accommodating unit 120 based on the image signal of the accommodating unit 120. The control unit 150 can read the reference location data including the accommodating unit 120 in the database 151. Then, the judgment component 152 of the control unit 150 can compare the aforementioned measurement position with the aforementioned reference position data to perform subsequent steps.

In one embodiment, the image recognition component 153 may include an image processing chip or corresponding software, but the invention is not limited thereto.

In this embodiment, the sensing unit 140 can be fixed and connected to the base 110. In other words, the relative positional relationship between the sensing unit 140 and the base 110 is basically fixed. In this way, when the sensing unit 140 is used to directly or indirectly determine the measurement position of the accommodating unit 120, the reference position can be omitted. Therefore, the efficiency of the semiconductor process control system 100 when measuring the position of the containing unit 120 can be improved.

In this embodiment, the control unit 150 can be connected to the transmission unit 130 and the sensing unit 140 in a wired signal transmission manner via the signal lines 163 and 164, but the invention is not limited thereto. In an embodiment, the control unit 150 may be signal-connected to at least one of the transmitting unit 130 or the sensing unit 140 by means of wired signal transmission. In other words, the signal connection mentioned in the present invention can generally refer to the connection mode of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection modes to be the same or different.

In an embodiment, the control unit 150 may include corresponding hardware or software. For example, the control unit 150 includes software suitable for image recognition, software suitable for logical judgment, or a platform suitable for advanced process control (APC). For another example, the database 151 includes, for example, a hard disk, a disk array, or a cloud system storing relevant data.

In an embodiment, the transmission unit 130 may include a movable module (such as a horizontal movement module, a vertical movement module, a rotation movement module or a combination of the above) 131 commonly used in movable mechanism design, which may include corresponding Hardware or software, or further combined with auxiliary components. For example, the movable module 131 may have a power supply device, a motor, a belt, a gear, and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited in the present invention. The aforementioned software includes, for example, spatial position calculation software, error logging software, communication software, etc., which are not limited in the present invention. The aforementioned auxiliary components include, for example, a moving rail, a moving shaft, a shock-absorbing element, a positioning device, etc., which are not limited in the present invention.

In an embodiment, the transmission unit 130 is, for example, a robotic arm, but the invention is not limited to this.

In this embodiment, at least the reference position data of the database 151 can be used to enable the control unit 150 to adjust the orientation of the transmission unit 130 during transmission. In this way, when the semiconductor device 90 is transferred by the transfer unit 130, the contact or friction between the semiconductor device 90 and the accommodating unit 120 can be reduced, so as to reduce damage to the semiconductor device 90 (such as scratches). )) or damage (e.g. fragments).

In one embodiment, the orientation used to adjust the transmission unit 130 may include position (such as movement, height), angle (such as rotation) or other related orientation parameters, which are not limited in the present invention.

FIG. 3 is a schematic partial flowchart of a semiconductor manufacturing process control method according to an embodiment of the present invention. It is worth noting that in the process shown in FIG. 3, the semiconductor process control system used is the semiconductor process control system 100 shown in FIG. 1 as an example, but the present invention is not limited to this. In an embodiment, the semiconductor process control system used in the process of FIG. 3 may be other semiconductor process control systems similar to the semiconductor process control system 100.

Referring to FIG. 3, FIG. 1, and FIG. 2A or FIG. 2B, in step S10, a semiconductor element 90 is placed on the transfer unit 130 of the semiconductor process control system 100.

3, 1 and 2A or 2B, in step S20, the sensing unit 140 enables the control unit 150 to compare the measurement position of the accommodating unit 120 with the reference position data stored in the database 151 . The operation, signal connection, or signal transmission method of the sensing unit 140 and the control unit 150 can be the same as those described in the previous embodiment, so the description will not be repeated here.

It is worth noting that in this embodiment, step S10 may be performed first, and then step S20 may be performed, but the present invention is not limited to this. In other possible embodiments, step S20 may be performed first, and then step S10 is performed.

3, FIG. 1 and FIG. 2A or FIG. 2B, in step S30, the control unit 150 can be used to determine whether the measurement position of the containing unit 120 is within an allowable range, so as to determine whether the transmission unit 130 needs to transmit the semiconductor The device 90 (ie, step S41), or it is necessary to stop the transfer of the semiconductor device 90 by the transfer unit 130 (ie, step S42).

3 and 4A, in one embodiment, the reference position data of the accommodating unit 120 stored in the database 151 includes a conversion function F. In other words, the reference position data of the accommodating unit 120 is stored in the database 151 in the form of the conversion function F. With the conversion function F, the value of the measurement position of the containing unit 120 (may be referred to as the position value) can be converted to the value corresponding to the position of the transmission unit 130 to be adjusted (may be referred to as the adjustment value). Taking Figure 4A as an example, if the position value is X1, the corresponding adjustment value can be obtained by the conversion function F; if the position value is X2, the corresponding adjustment value can be obtained by the conversion function F as Y2; If the position value is X3, the corresponding adjustment value Y3 can be obtained by the conversion function F; if the position value is X4, the corresponding adjustment value Y4 can be obtained by the conversion function F. The relationship between the position values X1, X2, X3, and X4 can be: X1 <X2 <X3 <X4; the relationship between the adjustment values Y1, Y2, Y3, and Y4 can be: Y1 <Y2 <Y3 <Y4.

Taking FIG. 4A as an example again, if the range between the adjustment value Y2 and the adjustment value Y3 is an allowable range, the semiconductor device 90 can be transferred by the transfer unit 130. That is to say, if one adjustment value is smaller than the aforementioned allowable range (for example, adjustment value Y1), or another adjustment value is greater than the aforementioned allowable range (for example: adjustment value Y4), the transmission of the semiconductor by the transmission unit 130 can be stopped. Component 90.

In the embodiment shown in FIG. 4A, the conversion function F may include a linear function, but the present invention is not limited thereto. In other unillustrated embodiments, the conversion function F may include any suitable function.

Based on the foregoing, in the semiconductor manufacturing process control method of an embodiment, the control unit 150 can convert the value by measuring the value of the position (ie: the position value) and the reference location data in the database 151 (ie: the corresponding conversion function F) The value corresponding to the orientation of the transmitting unit 130 (ie, the adjusted value) needs to be adjusted. As mentioned, the yield or stability of the corresponding semiconductor process can be improved.

Referring to FIGS. 3 and 4B, in one embodiment, the reference position data of the accommodating unit 120 stored in the database 151 includes a numerical matrix M. That is, the pre-stored reference position data of the accommodating unit 120 may include the value of the possible measurement position of the accommodating unit 120 (may be referred to as the reference position value) and the corresponding position of the transmitting unit 130 that needs to be adjusted. The value (can be referred to as: adjustment value). Taking Figure 4B as an example, if the reference position value is X5, the corresponding adjustment value is Y5; if the reference position value is X6, the corresponding adjustment value is Y6; if the reference position value is X7, the corresponding adjustment value is Y7 ; If the reference position value is X8, the corresponding adjustment value is Y8. The relationship between the reference position values X5, X6, X7, and X8 can be: X5 ＜ X6 ＜ X7 ＜ X8; the relationship between the adjustment values Y5, Y6, Y7, and Y8 can be: Y5 ＜ Y6 ＜ Y7 ＜ Y8.

Taking FIG. 4B as an example again, if the measurement position of the accommodating unit 120 is within the range between the reference position values (eg, greater than or equal to the reference position value X5, and less than or equal to the reference position value X8; it can be called: allowable Range), the semiconductor device 90 can be transferred by the transfer unit 130. In other words, if the measurement position of the accommodating unit 120 is smaller than the aforementioned allowable range, or another measurement position of the accommodating unit 120 is greater than the aforementioned allowable range, the transmission of the semiconductor device 90 by the transmission unit 130 can be stopped. In addition, if the measurement position of the accommodating unit 120 is within the range between the reference position values, but does not directly correspond to the numerical matrix M, the adjustment value can be adjusted by a corresponding numerical calculation method (such as: interpolation or polynomial regression). Forecast method, but not limited) to estimate.

Based on the foregoing, in another embodiment of the semiconductor manufacturing process control method, the control unit 150 can obtain the position corresponding to the transmission unit 130 to be adjusted by using the pre-stored reference position data of the accommodating unit 120 (ie, the corresponding numerical matrix M) The value of (ie: adjustment value). In this way, the yield or stability of the corresponding semiconductor manufacturing process can be improved.

In summary, the semiconductor process control system and semiconductor process control method of the present invention can improve the yield or stability of the corresponding semiconductor process.

100: Semiconductor process control system 90: Semiconductor components 110: Pedestal 120: containment unit 130: transfer unit 131: Movable module 140: sensing unit 141: Ranging element 142: Image capture component 150: control unit 151: Database 152: Judgment component 153: Image recognition component 163, 164: signal line F: Conversion function M: Numerical matrix S10, S20, S30, S41, S42: steps

FIG. 1 is a partial perspective view of a semiconductor process control system according to an embodiment of the invention. 2A is a schematic diagram of partial signal connections of a semiconductor process control system according to an embodiment of the present invention. 2B is a schematic diagram of partial signal connections of a semiconductor process control system according to another embodiment of the present invention. FIG. 3 is a schematic partial flowchart of a semiconductor manufacturing process control method according to an embodiment of the present invention. 4A is a schematic diagram of a partial database of a semiconductor process control system according to an embodiment of the present invention. 4B is a schematic diagram of a part of a database of a semiconductor process control system according to an embodiment of the present invention.

S10, S20, S30, S41, S42: steps

Claims (9)

A semiconductor manufacturing process control system, comprising: a base; an accommodating unit connected to the pedestal and suitable for accommodating a semiconductor element; a transfer unit adapted to send or remove the semiconductor element to or from the accommodating unit A sensing unit, adapted to sense and obtain the measurement position of the accommodating unit; and a control unit, a signal connected to the transmission unit and the sensing unit, and the control unit includes: a database, a storage The reference position data of the accommodating unit, wherein the control unit is adapted to compare the measurement position measured by the sensing unit with the reference position data stored in the database. The semiconductor process control system according to claim 1, wherein the sensing unit is fixedly connected to the base. The semiconductor process control system according to claim 1, wherein the sensing unit includes a distance measuring element adapted to measure the measurement position of the accommodating unit, wherein the control unit is adapted to measure the distance The measurement position measured by the component is compared with the reference position data stored in the database. The semiconductor process control system according to claim 1, wherein the sensing unit includes: an image capturing element, and the control unit is adapted to use the image capturing element The image captured by the software determines the measurement position of the accommodating unit to compare with the reference position data stored in the database. The semiconductor manufacturing process control system according to claim 1, wherein the control unit is adapted to adjust the position of the transmission unit based on the measurement position and the reference position data of the database. The semiconductor process control system according to claim 1, wherein the reference position data of the accommodating unit stored in the database includes a conversion function. The semiconductor process control system according to claim 1, wherein the reference position data of the accommodating unit stored in the database includes a numerical matrix. A semiconductor manufacturing process control method includes: placing the semiconductor element on the transfer unit of the semiconductor manufacturing process control system according to claim 1; The measurement location is compared with the reference location data stored in the database; based on the comparison result between the measurement location and the reference location data, one of the following steps is performed: by the transmission unit Transferring the semiconductor element; or stopping the transfer of the semiconductor element by the transfer unit. The semiconductor manufacturing process control method according to claim 8, wherein the step of transmitting the semiconductor element includes: the control unit adjusts the position of the transmitting unit according to the comparison result to The semiconductor device is transferred by the transfer unit.

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