TWI743824B - Display panel and active component array substrate thereof - Google Patents

Display panel and active component array substrate thereof Download PDF

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TWI743824B
TWI743824B TW109119355A TW109119355A TWI743824B TW I743824 B TWI743824 B TW I743824B TW 109119355 A TW109119355 A TW 109119355A TW 109119355 A TW109119355 A TW 109119355A TW I743824 B TWI743824 B TW I743824B
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gate
active device
array substrate
bias voltage
auxiliary gate
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TW109119355A
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TW202146996A (en
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柯政宏
楊智翔
黃韋凱
熊國佑
陳奕甫
王永彬
林煒力
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友達光電股份有限公司
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Abstract

An active component array substrate includes a substrate, a pixel array, a gate driver on array (GOA), an insulation layer, an auxiliary gate, and a temperature Controller. The substrate has a display area and a peripheral area located around the display area. The pixel array is distributed in the display area. The GOA is distributed in the peripheral area and includes a plurality of drive components. Each drive component includes at least one transistor, where the drive components are electrically connected to the pixel array. The insulation layer is disposed on the substrate and covers the pixel array and the GOA. The auxiliary gate is disposed on the insulation layer, where the insulation layer is disposed between the auxiliary gate and the GOA, and the auxiliary gate covers the gate of at least one of the transistors of at least one of the drive component. The temperature controller is electrically connected to the auxiliary gate.

Description

顯示面板及其主動元件陣列基板Display panel and active element array substrate thereof

本發明是有關於一種顯示面板及其主動元件陣列基板,且特別是有關於一種具有閘極驅動陣列(Gate Driver on Array,GOA)的主動元件陣列基板以及包括此主動元件陣列基板的顯示面板。The present invention relates to a display panel and an active device array substrate thereof, and more particularly to an active device array substrate with a gate drive array (Gate Driver on Array, GOA) and a display panel including the active device array substrate.

現有的顯示面板,例如液晶顯示面板(Liquid Crystal Display Panel,LCD Panel),在一般室溫下(例如25℃至27℃),通常可以正常地顯示影像。然而,在高溫與低溫環境中,例如高緯度的寒冷地區或低緯度的炎熱地區,顯示面板可能因為受到溫度的影響而無法正常地顯示影像,從而降低影像品質。Existing display panels, such as Liquid Crystal Display Panels (LCD Panels), can normally display images at normal room temperature (for example, 25°C to 27°C). However, in high and low temperature environments, such as cold areas at high latitudes or hot areas at low latitudes, the display panel may not be able to display images normally due to the influence of temperature, thereby degrading image quality.

本發明提出一種主動元件陣列基板,其能幫助改善顯示面板在上述高溫與低溫環境中的影像品質。The present invention provides an active device array substrate, which can help improve the image quality of the display panel in the above-mentioned high temperature and low temperature environment.

本發明至少一實施例所包括的主動元件陣列基板包括基板、畫素陣列、閘極驅動陣列、絕緣層、輔助閘極以及溫度控制器。基板具有顯示區與位於顯示區周邊的周邊區。畫素陣列分布於顯示區。閘極驅動陣列分布於周邊區,並包括多個驅動元件。各個驅動元件包括至少一電晶體,其中這些驅動元件電連接畫素陣列。絕緣層設置於基板上,並覆蓋畫素陣列與閘極驅動陣列。輔助閘極設置於絕緣層上,其中絕緣層位於輔助閘極與閘極驅動陣列之間,而輔助閘極覆蓋這些驅動元件至少一者的至少一電晶體的一閘極。溫度控制器電連接輔助閘極。The active device array substrate included in at least one embodiment of the present invention includes a substrate, a pixel array, a gate drive array, an insulating layer, an auxiliary gate, and a temperature controller. The substrate has a display area and a peripheral area located at the periphery of the display area. The pixel array is distributed in the display area. The gate driving array is distributed in the peripheral area and includes a plurality of driving elements. Each driving element includes at least one transistor, and these driving elements are electrically connected to the pixel array. The insulating layer is arranged on the substrate and covers the pixel array and the gate drive array. The auxiliary gate is arranged on the insulating layer, wherein the insulating layer is located between the auxiliary gate and the gate driving array, and the auxiliary gate covers a gate of at least one transistor of at least one of these driving elements. The temperature controller is electrically connected to the auxiliary gate.

在本發明至少一實施例中,上述輔助閘極完全覆蓋閘極驅動陣列。In at least one embodiment of the present invention, the above-mentioned auxiliary gate completely covers the gate drive array.

在本發明至少一實施例中,上述輔助閘極包括多個閘極層,而各個閘極層覆蓋這些驅動元件其中一者的至少一電晶體的閘極。In at least one embodiment of the present invention, the auxiliary gate includes a plurality of gate layers, and each gate layer covers the gate of at least one transistor of one of the driving elements.

在本發明至少一實施例中,各個驅動元件包括升壓電路與升壓控制電路,而各個閘極層覆蓋升壓電路與升壓控制電路。In at least one embodiment of the present invention, each driving element includes a boost circuit and a boost control circuit, and each gate layer covers the boost circuit and the boost control circuit.

在本發明至少一實施例中,上述輔助閘極包括多個閘極層,而各個閘極層完全覆蓋這些驅動元件其中一者。In at least one embodiment of the present invention, the auxiliary gate includes a plurality of gate layers, and each gate layer completely covers one of the driving elements.

在本發明至少一實施例中,當主動元件陣列基板處於第一溫度環境時,溫度控制器提供第一偏壓給輔助閘極。當主動元件陣列基板處於第二溫度環境時,溫度控制器提供第二偏壓給輔助閘極,其中第一溫度環境的溫度大於第二溫度環境的溫度,而第一偏壓與第二偏壓彼此不同。In at least one embodiment of the present invention, when the active device array substrate is in the first temperature environment, the temperature controller provides the first bias voltage to the auxiliary gate. When the active device array substrate is in a second temperature environment, the temperature controller provides a second bias voltage to the auxiliary gate, wherein the temperature of the first temperature environment is greater than the temperature of the second temperature environment, and the first bias voltage and the second bias voltage Different from each other.

在本發明至少一實施例中,上述第一偏壓小於第二偏壓。In at least one embodiment of the present invention, the first bias voltage is smaller than the second bias voltage.

在本發明至少一實施例中,上述中第一偏壓大於第二偏壓。In at least one embodiment of the present invention, the above-mentioned first bias voltage is greater than the second bias voltage.

本發明至少一實施例所包括的顯示面板包括上述主動元件陣列基板以及對向基板,其中對向基板配置於主動元件陣列基板的對面,並連接主動元件陣列基板。At least one embodiment of the present invention includes a display panel including the above-mentioned active device array substrate and a counter substrate, wherein the counter substrate is disposed on the opposite side of the active device array substrate and connected to the active device array substrate.

在本發明至少一實施例中,上述顯示面板還包括液晶層,其中液晶層夾置於主動元件陣列基板與對向基板之間。In at least one embodiment of the present invention, the above-mentioned display panel further includes a liquid crystal layer, wherein the liquid crystal layer is sandwiched between the active device array substrate and the counter substrate.

上述溫度控制器能利用雙閘極效應,提供適當電壓給處於不同溫度環境下的主動元件陣列基板,降低溫度對顯示面板的影響,幫助顯示面板在高溫或低溫環境下能正常地顯示影像,進而維持或提升顯示面板的影像品質。The above-mentioned temperature controller can use the double gate effect to provide appropriate voltages to the active element array substrates in different temperature environments, reduce the temperature impact on the display panel, and help the display panel to display images normally under high or low temperature environments, and then Maintain or improve the image quality of the display panel.

在以下的內文中,為了清楚呈現本案的技術特徵,圖式中的元件(例如層、膜、基板以及區域等)的尺寸(例如長度、寬度、厚度與深度)會以不等比例的方式放大。因此,下文實施例的說明與解釋不受限於圖式中的元件所呈現的尺寸與形狀,而應涵蓋如實際製程及/或公差所導致的尺寸、形狀以及兩者的偏差。例如,圖式所示的平坦表面可以具有粗糙及/或非線性的特徵,而圖式所示的銳角可以是圓的。所以,本案圖式所呈示的元件主要是用於示意,並非旨在精準地描繪出元件的實際形狀,也非用於限制本案的申請專利範圍。In the following text, in order to clearly present the technical features of the case, the dimensions (such as length, width, thickness, and depth) of the elements (such as layers, films, substrates, and regions) in the drawings will be enlarged in unequal proportions. . Therefore, the description and explanation of the following embodiments are not limited to the size and shape presented by the elements in the drawings, but should cover the size, shape, and deviation of the two caused by actual manufacturing processes and/or tolerances. For example, the flat surface shown in the drawing may have rough and/or non-linear characteristics, and the acute angle shown in the drawing may be round. Therefore, the elements shown in the drawings of this case are mainly used for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they used to limit the scope of the patent application in this case.

其次,本案內容中所出現的「約」、「近似」或「實質上」等這類用字不僅涵蓋明確記載的數值與數值範圍,而且也涵蓋發明所屬技術領域中具有通常知識者所能理解的可允許偏差範圍,其中此偏差範圍可由測量時所產生的誤差來決定,而此誤差例如是起因於測量系統或製程條件兩者的限制。此外,「約」可表示在上述數值的一個或多個標準偏差內,例如±30%、±20%、±10%或±5%內。本案文中所出現的「約」、「近似」或「實質上」等這類用字可依光學性質、蝕刻性質、機械性質或其他性質來選擇可以接受的偏差範圍或標準偏差,並非單以一個標準偏差來套用以上光學性質、蝕刻性質、機械性質以及其他性質等所有性質。Secondly, the words "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated value and range of values, but also cover the understanding of those with ordinary knowledge in the technical field of the invention. The allowable deviation range of, wherein the deviation range can be determined by the error generated during the measurement, and this error is caused by the limitation of the measurement system or the process conditions, for example. In addition, "about" may mean within one or more standard deviations of the above-mentioned value, for example, within ±30%, ±20%, ±10%, or ±5%. The terms "about", "approximately" or "substantially" appearing in this text can be used to select acceptable deviation ranges or standard deviations based on optical properties, etching properties, mechanical properties, or other properties. The standard deviation applies all the above optical properties, etching properties, mechanical properties, and other properties.

圖1A是本發明至少一實施例的剖面示意圖。請參閱圖1A,本實施例中的顯示面板100的種類有多種,例如液晶顯示面板、微型發光二極體顯示面板(Micro-LED display panel)或有機發光二極體顯示面板(Organic Light Emitting Diode Display Panel,OLED Display Panel),其中圖1A所示的顯示面板100是以液晶顯示面板為例。不過,在此強調,顯示面板100不限制只能是液晶顯示面板。FIG. 1A is a schematic cross-sectional view of at least one embodiment of the present invention. 1A, there are many types of display panel 100 in this embodiment, such as a liquid crystal display panel, a micro-LED display panel, or an organic light emitting diode display panel (Organic Light Emitting Diode). Display Panel, OLED Display Panel), where the display panel 100 shown in FIG. 1A is an example of a liquid crystal display panel. However, it is emphasized here that the display panel 100 is not limited to being a liquid crystal display panel.

顯示面板100包括對向基板110與主動元件陣列基板200,其中對向基板110配置於主動元件陣列基板200的對面,並連接主動元件陣列基板200。以圖1A為例,對向基板110可為彩色濾光基板,其可包括多種濾光層或多種光致發光量子點材料(Photo-emissive quantum dot material)。顯示面板100還可包括液晶層120與框膠130。液晶層120夾置於主動元件陣列基板200與對向基板110之間,而框膠130圍繞整個液晶層120,並連接主動元件陣列基板200與對向基板110。The display panel 100 includes a counter substrate 110 and an active device array substrate 200, wherein the counter substrate 110 is disposed on the opposite side of the active device array substrate 200 and is connected to the active device array substrate 200. Taking FIG. 1A as an example, the counter substrate 110 may be a color filter substrate, which may include multiple filter layers or multiple photo-emissive quantum dot materials. The display panel 100 may further include a liquid crystal layer 120 and a sealant 130. The liquid crystal layer 120 is sandwiched between the active device array substrate 200 and the opposite substrate 110, and the sealant 130 surrounds the entire liquid crystal layer 120 and connects the active device array substrate 200 and the opposite substrate 110.

圖1B是圖1A中的主動元件陣列基板的俯視示意圖。主動元件陣列基板200包括基板210,其中基板210具有顯示區211與位於顯示區211周邊的周邊區212,且顯示區211與周邊區212彼此不重疊。主動元件陣列基板200還包括畫素陣列220與閘極驅動陣列230。畫素陣列220與閘極驅動陣列230皆設置於基板210上,並分別分布於顯示區211與周邊區212,其中閘極驅動陣列230設置在周邊區212內,未分布於顯示區211。FIG. 1B is a schematic top view of the active device array substrate in FIG. 1A. The active device array substrate 200 includes a substrate 210, wherein the substrate 210 has a display area 211 and a peripheral area 212 located at the periphery of the display area 211, and the display area 211 and the peripheral area 212 do not overlap with each other. The active device array substrate 200 further includes a pixel array 220 and a gate driving array 230. The pixel array 220 and the gate driving array 230 are both disposed on the substrate 210 and distributed in the display area 211 and the peripheral area 212 respectively. The gate driving array 230 is disposed in the peripheral area 212 and not distributed in the display area 211.

畫素陣列220可包括多條掃描線221,其中這些掃描線221電連接閘極驅動陣列230。主動元件陣列基板200還可包括源極電路240,而畫素陣列220還可包括多條資料線222,其中源極電路240也設置於顯示區211以外的周邊區212,而這些資料線222電連接源極電路240。因此,利用掃描線221與資料線222,畫素陣列220電連接閘極驅動陣列230與源極電路240。The pixel array 220 may include a plurality of scan lines 221, and the scan lines 221 are electrically connected to the gate driving array 230. The active device array substrate 200 may further include a source circuit 240, and the pixel array 220 may further include a plurality of data lines 222. The source circuit 240 is also disposed in the peripheral area 212 outside the display area 211, and the data lines 222 are electrically connected to each other. Connect the source circuit 240. Therefore, by using the scan line 221 and the data line 222, the pixel array 220 is electrically connected to the gate driving array 230 and the source circuit 240.

另外,畫素陣列220還包括多個畫素單元(未繪示),而各個畫素單元具有畫素電極與電晶體元件。電晶體元件例如是薄膜電晶體,並電連接畫素電極。這些電晶體元件電連接這些掃描線221與這些資料線222,其中掃描線221連接電晶體元件的閘極,而資料線222連接電晶體元件的源極。如此,源極電路240與閘極驅動陣列230能分別經由資料線222與掃描線221控制畫素單元,而源極電路240能經由資料線222輸入灰階電壓至畫素單元的畫素電極,以使位於畫素電極上方的液晶層120內的液晶分子偏轉,促使顯示面板100顯示影像。In addition, the pixel array 220 also includes a plurality of pixel units (not shown), and each pixel unit has a pixel electrode and a transistor element. The transistor element is, for example, a thin film transistor, and is electrically connected to the pixel electrode. The transistor elements are electrically connected to the scan lines 221 and the data lines 222, wherein the scan line 221 is connected to the gate electrode of the transistor element, and the data line 222 is connected to the source electrode of the transistor element. In this way, the source circuit 240 and the gate drive array 230 can control the pixel unit via the data line 222 and the scan line 221, respectively, and the source circuit 240 can input the gray-scale voltage to the pixel electrode of the pixel unit via the data line 222. In order to deflect the liquid crystal molecules in the liquid crystal layer 120 above the pixel electrode, the display panel 100 is prompted to display an image.

畫素陣列220還包括輔助閘極250與溫度控制器260,其中溫度控制器260電連接輔助閘極250。輔助閘極250可為導電層,其構成材料例如是金屬材料或透明導電材料。輔助閘極250設置於周邊區212內,並且位在閘極驅動陣列230的上方,其中輔助閘極250可完全覆蓋閘極驅動陣列230,如圖1B所示。須說明的是,本文所述的覆蓋可包括接觸與沒有接觸的情況,即輔助閘極250可完全覆蓋閘極驅動陣列230,且也可以不接觸閘極驅動陣列230。 The pixel array 220 further includes an auxiliary gate 250 and a temperature controller 260, wherein the temperature controller 260 is electrically connected to the auxiliary gate 250. The auxiliary gate 250 may be a conductive layer, and its constituent material is, for example, a metal material or a transparent conductive material. The auxiliary gate 250 is disposed in the peripheral area 212 and above the gate driving array 230, wherein the auxiliary gate 250 can completely cover the gate driving array 230, as shown in FIG. 1B. It should be noted that the coverage described herein may include contact and no contact, that is, the auxiliary gate 250 may completely cover the gate driving array 230, and may also not touch the gate driving array 230.

圖1C是圖1B中的主動元件陣列基板在其閘極驅動陣列處的俯視示意圖。請參閱圖1C,閘極驅動陣列230包括多個驅動元件231,而這些驅動元件231電連接這些掃描線221。利用這些掃描線221,這些驅動元件231得以電連接畫素陣列220。此外,由於輔助閘極250完全覆蓋閘極驅動陣列230,因此輔助閘極250覆蓋這些驅動元件231,如圖1C所示。 FIG. 1C is a schematic top view of the active device array substrate in FIG. 1B at its gate drive array. Referring to FIG. 1C, the gate driving array 230 includes a plurality of driving elements 231, and the driving elements 231 are electrically connected to the scan lines 221. Using the scan lines 221, the driving elements 231 are electrically connected to the pixel array 220. In addition, since the auxiliary gate 250 completely covers the gate driving array 230, the auxiliary gate 250 covers these driving elements 231, as shown in FIG. 1C.

圖1D是圖1C中的主動元件陣列基板在其驅動元件處的俯視示意圖。請參閱圖1C與圖1D,在本實施例中,各個驅動元件231可包括升壓電路(pull-up circuit)U23a、升壓控制電路U23c、降壓電路(pull-down circuit)D23a與降壓控制電路D23c。在同一個驅動元件231中,升壓電路U23a、升壓控制電路U23c、降壓電路D23a與降壓控制電路D23c彼此電連接。由於輔助閘極250覆蓋這些驅動元件231,所以輔助閘極250也完全覆蓋各個驅動元件231的升壓電路U23a、升壓控制電路U23c、降壓電路D23a與降壓控制電路D23c。 FIG. 1D is a schematic top view of the active device array substrate in FIG. 1C at its driving devices. Please refer to FIG. 1C and FIG. 1D. In this embodiment, each driving element 231 may include a pull-up circuit U23a, a boost control circuit U23c, a pull-down circuit D23a, and a step-down circuit U23a. Control circuit D23c. In the same driving element 231, the step-up circuit U23a, the step-up control circuit U23c, the step-down circuit D23a, and the step-down control circuit D23c are electrically connected to each other. Since the auxiliary gate 250 covers these driving elements 231, the auxiliary gate 250 also completely covers the boost circuit U23a, boost control circuit U23c, buck circuit D23a, and buck control circuit D23c of each driving element 231.

圖1E是圖1D中的主動元件陣列基板的剖面示意圖。請參閱圖1D與圖1E,其中圖1E所示的驅動元件231可從升壓電路U23a或升壓控制電路U23c處剖面而繪製。主動元件陣列基板200還包括絕緣層270,其中絕緣層270設置於基板210上,並覆蓋畫素陣列220(請參閱圖1B與圖1C)以及閘極驅動陣列230。輔助閘極250設置於絕緣層270上,而絕緣層270位於輔助閘極250與閘極驅動陣列230之間。FIG. 1E is a schematic cross-sectional view of the active device array substrate in FIG. 1D. Please refer to FIGS. 1D and 1E, where the driving element 231 shown in FIG. 1E can be drawn from the cross section of the boost circuit U23a or the boost control circuit U23c. The active device array substrate 200 further includes an insulating layer 270, wherein the insulating layer 270 is disposed on the substrate 210 and covers the pixel array 220 (see FIGS. 1B and 1C) and the gate driving array 230. The auxiliary gate 250 is disposed on the insulating layer 270, and the insulating layer 270 is located between the auxiliary gate 250 and the gate driving array 230.

各個驅動元件231包括至少一個電晶體232,而在圖1E所示的實施例中,電晶體232可以是薄膜電晶體,而且也可以是場效電晶體(Field-Effect Transistor,FET),例如是金屬氧化物半導體場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOSFET)。閘極驅動陣列230包括金屬層232g、絕緣層232i、通道層232c與金屬圖案層,其中金屬層232g形成於基板210上,而絕緣層232i形成於金屬層232g上,並覆蓋金屬層232g。Each driving element 231 includes at least one transistor 232. In the embodiment shown in FIG. 1E, the transistor 232 may be a thin film transistor or a field-effect transistor (Field-Effect Transistor, FET), for example, Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The gate driving array 230 includes a metal layer 232g, an insulating layer 232i, a channel layer 232c, and a metal pattern layer. The metal layer 232g is formed on the substrate 210, and the insulating layer 232i is formed on the metal layer 232g and covers the metal layer 232g.

通道層232c形成於絕緣層232i上,以使絕緣層232i能被夾置在通道層232c與金屬層232g之間,其中通道層232c為半導體層。金屬圖案形成於通道層232c上,並包括金屬層232s與金屬層232d,其中金屬層232s與232d彼此分離。金屬層232s與232d可用微影蝕刻來形成,而為了確保金屬層232s與232d彼此分離,可進行背通道蝕刻,蝕除下方一小部分的通道層232c,從而在通道層232c上形成凹槽(圖未標示)。The channel layer 232c is formed on the insulating layer 232i, so that the insulating layer 232i can be sandwiched between the channel layer 232c and the metal layer 232g, wherein the channel layer 232c is a semiconductor layer. The metal pattern is formed on the channel layer 232c and includes a metal layer 232s and a metal layer 232d, wherein the metal layers 232s and 232d are separated from each other. The metal layers 232s and 232d can be formed by lithography etching. In order to ensure that the metal layers 232s and 232d are separated from each other, back channel etching can be performed to etch away a small part of the channel layer 232c below, thereby forming a groove on the channel layer 232c ( The picture is not marked).

利用這些金屬層232g、232s、232d、絕緣層232i以及通道層232c的堆疊,電晶體232得以形成,其中金屬層232g為電晶體232的閘極,而金屬層232s與232d分別為電晶體232的源極與汲極。此外,輔助閘極250覆蓋金屬層232g,即輔助閘極250覆蓋驅動元件231的電晶體232的閘極,其中輔助閘極250不接觸金屬層232g。 Using the stack of these metal layers 232g, 232s, 232d, insulating layer 232i and channel layer 232c, the transistor 232 is formed, wherein the metal layer 232g is the gate electrode of the transistor 232, and the metal layers 232s and 232d are respectively the gate of the transistor 232 Source and drain. In addition, the auxiliary gate 250 covers the metal layer 232g, that is, the auxiliary gate 250 covers the gate of the transistor 232 of the driving element 231, wherein the auxiliary gate 250 does not contact the metal layer 232g.

須說明的是,雖然圖1E僅繪示一個電晶體232,但升壓電路U23a、升壓控制電路U23c、降壓電路D23a與降壓控制電路D23c個別可包括至少一個電晶體232,所以單一個驅動元件231可包括多個電晶體232。此外,在其他實施例中,各個驅動元件231可以僅包括一個電晶體232,所以圖1E所示的電晶體232數量僅供舉例說明,並非限制各個驅動元件231所包括的電晶體232的數量。 It should be noted that although FIG. 1E only shows one transistor 232, the boost circuit U23a, the boost control circuit U23c, the buck circuit D23a, and the buck control circuit D23c may each include at least one transistor 232, so a single transistor 232 The driving element 231 may include a plurality of transistors 232. In addition, in other embodiments, each driving element 231 may include only one transistor 232, so the number of transistors 232 shown in FIG. 1E is for illustration only, and the number of transistors 232 included in each driving element 231 is not limited.

在電晶體232中,通道層232c被夾置在兩層絕緣層270與232i之間,而這兩層絕緣層270與232i也被夾置在輔助閘極250與金屬層232g之間。因此,在金屬層232g與通道層232c之間會形成一個電容,而在輔助閘極250與通道層232c之間會形成另一個電容。 In the transistor 232, the channel layer 232c is sandwiched between two insulating layers 270 and 232i, and the two insulating layers 270 and 232i are also sandwiched between the auxiliary gate 250 and the metal layer 232g. Therefore, a capacitor is formed between the metal layer 232g and the channel layer 232c, and another capacitor is formed between the auxiliary gate 250 and the channel layer 232c.

當輸入電壓至金屬層232g時,金屬層232g與通道層232c之間的電容內部會產生電場,而此電場會改變通道層232c內的空乏區,以使金屬層232s與232d在電性上彼此導通或不導通。同樣地,當輸入電壓至輔助閘極250時,輔助閘極250與通道層232c之間的電容內部也會產生電場,而此電場也會改變通道層232c內的空乏區,以使金屬層232s與232d在電性上彼此導通或不導通。When the input voltage is applied to the metal layer 232g, an electric field will be generated in the capacitor between the metal layer 232g and the channel layer 232c, and this electric field will change the depletion region in the channel layer 232c, so that the metal layers 232s and 232d are electrically connected to each other. Conduction or non-conduction. Similarly, when the input voltage is applied to the auxiliary gate 250, an electric field will also be generated in the capacitor between the auxiliary gate 250 and the channel layer 232c, and this electric field will also change the depletion region in the channel layer 232c, so that the metal layer 232s And 232d are electrically conductive or non-conductive to each other.

由此可知,金屬層232g與輔助閘極250兩者任一者所輸出的電壓能影響通道層232c內的載子分布,以控制金屬層232s與232d之間的電性導通。當同時輸入電壓至金屬層232g與輔助閘極250時,通道層232c會同時被金屬層232g與輔助閘極250兩者所產生的電場影響,進而產生雙閘極效應。It can be seen that the voltage output by either the metal layer 232g and the auxiliary gate 250 can affect the carrier distribution in the channel layer 232c to control the electrical conduction between the metal layers 232s and 232d. When a voltage is input to the metal layer 232g and the auxiliary gate 250 at the same time, the channel layer 232c will be simultaneously affected by the electric field generated by both the metal layer 232g and the auxiliary gate 250, thereby generating a double gate effect.

請參閱圖1C與圖1E,由於溫度控制器260電連接輔助閘極250,因此溫度控制器260能提供電壓給輔助閘極250,其中溫度控制器260能感測溫度,並可具有溫度補償電壓的功能。也就是說,溫度控制器260能根據所感測到的溫度來輸出適當的電壓至輔助閘極250,以控制電晶體232的運作。1C and 1E, since the temperature controller 260 is electrically connected to the auxiliary gate 250, the temperature controller 260 can provide voltage to the auxiliary gate 250, where the temperature controller 260 can sense temperature and can have a temperature compensation voltage Function. In other words, the temperature controller 260 can output an appropriate voltage to the auxiliary gate 250 according to the sensed temperature to control the operation of the transistor 232.

舉例而言,在電晶體232為N型金屬氧化物半導體場效電晶體(NMOSFET)的條件下,當主動元件陣列基板200處於高溫環境時,溫度控制器260會偵測到高溫,其可介於40℃至90℃之間,但本發明不以此為限。此時,在高溫環境下的電晶體232的閥值電壓通常會下降,以至於金屬層232s(源極)與金屬層232d(汲極)之間容易產生漏電流。這時候,溫度控制器260可以提供偏低的電壓,例如負偏壓,給輔助閘極250,以減少上述漏電流的產生。For example, under the condition that the transistor 232 is an N-type metal oxide semiconductor field effect transistor (NMOSFET), when the active device array substrate 200 is in a high temperature environment, the temperature controller 260 will detect the high temperature, which can be adjusted It is between 40°C and 90°C, but the present invention is not limited to this. At this time, the threshold voltage of the transistor 232 in a high temperature environment usually drops, so that leakage current is likely to occur between the metal layer 232s (source) and the metal layer 232d (drain). At this time, the temperature controller 260 can provide a low voltage, such as a negative bias voltage, to the auxiliary gate 250 to reduce the leakage current.

承上述,當主動元件陣列基板200處於低溫環境時,溫度控制器260會偵測到低溫,其可介於0℃至-40℃之間,但本發明不以此為限。此時,處於低溫環境下的電晶體232的閥值電壓通常會上升,以至於電晶體232需要比原來更高的電壓才能開啟。此時,溫度控制器260可提供偏高的電壓,例如正偏壓,給輔助閘極250,以幫助開啟電晶體232,從而維持或提升處於低溫環境下的電晶體232的驅動能力。In view of the above, when the active device array substrate 200 is in a low temperature environment, the temperature controller 260 will detect the low temperature, which may be between 0° C. and -40° C., but the present invention is not limited to this. At this time, the threshold voltage of the transistor 232 in a low-temperature environment usually rises, so that the transistor 232 needs a higher voltage to be turned on. At this time, the temperature controller 260 can provide a relatively high voltage, such as a positive bias voltage, to the auxiliary gate 250 to help turn on the transistor 232, thereby maintaining or improving the driving capability of the transistor 232 in a low temperature environment.

由此可知,在電晶體232為N型金屬氧化物半導體場效電晶體的條件下,當主動元件陣列基板200處於第一溫度環境(例如高溫環境)時,溫度控制器260可提供第一偏壓(例如負偏壓)給輔助閘極250,以減少漏電流的產生。當主動元件陣列基板200處於第二溫度環境(例如低溫環境)時,溫度控制器260可提供第二偏壓(例如正偏壓)給輔助閘極250,以維持或提升處於低溫環境下的電晶體232的驅動能力,其中第一偏壓小於第二偏壓。It can be seen that, under the condition that the transistor 232 is an N-type metal oxide semiconductor field effect transistor, when the active device array substrate 200 is in a first temperature environment (for example, a high temperature environment), the temperature controller 260 can provide a first bias A voltage (for example, a negative bias) is applied to the auxiliary gate 250 to reduce leakage current. When the active device array substrate 200 is in a second temperature environment (for example, a low temperature environment), the temperature controller 260 can provide a second bias voltage (for example, a positive bias voltage) to the auxiliary gate 250 to maintain or increase the electric power in the low temperature environment. The driving capability of the crystal 232, wherein the first bias voltage is smaller than the second bias voltage.

另外,電晶體232也可以是P型金屬氧化物半導體場效電晶體(PMOSFET)。在電晶體232為P型金屬氧化物半導體場效電晶體的條件下,當主動元件陣列基板200處於第一溫度環境(例如高溫環境)時,溫度控制器260可提供較高的第一偏壓(例如正偏壓)給輔助閘極250,以減少漏電流的產生。當主動元件陣列基板200處於第二溫度環境(例如低溫環境)時,溫度控制器260可提供較低的第二偏壓(例如負偏壓)給輔助閘極250,以維持或提升處於低溫環境下的電晶體232的驅動能力,其中第一偏壓大於第二偏壓。In addition, the transistor 232 may also be a P-type metal oxide semiconductor field effect transistor (PMOSFET). Under the condition that the transistor 232 is a P-type metal oxide semiconductor field effect transistor, when the active device array substrate 200 is in a first temperature environment (for example, a high temperature environment), the temperature controller 260 can provide a higher first bias voltage (For example, a positive bias) is applied to the auxiliary gate 250 to reduce leakage current. When the active device array substrate 200 is in a second temperature environment (such as a low temperature environment), the temperature controller 260 can provide a lower second bias voltage (such as a negative bias voltage) to the auxiliary gate 250 to maintain or improve the low temperature environment Under the driving capability of the transistor 232, the first bias voltage is greater than the second bias voltage.

基於上述,溫度控制器260能根據其所量測的溫度提供適當的電壓給輔助閘極250,以減少在高溫環境下的電晶體232所產生的漏電流,以及維持或提升在低溫環境下的電晶體232的驅動能力。如此,利用雙閘極效應,可以降低溫度對顯示面板100的影響,幫助顯示面板100在高溫或低溫環境下可以正常地顯示影像,從而維持或提升顯示面板100的影像品質。Based on the above, the temperature controller 260 can provide an appropriate voltage to the auxiliary gate 250 according to the temperature measured by it, so as to reduce the leakage current generated by the transistor 232 in a high temperature environment, and to maintain or improve the temperature in a low temperature environment. The driving capability of the transistor 232. In this way, the use of the double gate effect can reduce the influence of temperature on the display panel 100 and help the display panel 100 to display images normally in a high temperature or low temperature environment, thereby maintaining or improving the image quality of the display panel 100.

圖2是本發明另一實施例的主動元件陣列基板的局部俯視示意圖。請參閱圖2,本實施例的主動元件陣列基板300與前述實施例的主動元件陣列基板200相似,兩者包括相同的元件與相同或相似的剖面結構(如圖1E所示),而且也具有實質上相同的功效。以下主要敘述主動元件陣列基板300與200之間的差異,兩者相同技術特徵原則上不再重複贅述。2 is a schematic partial top view of an active device array substrate according to another embodiment of the invention. Please refer to FIG. 2. The active device array substrate 300 of this embodiment is similar to the active device array substrate 200 of the previous embodiment. Both include the same elements and the same or similar cross-sectional structure (as shown in FIG. 1E), and also have Substantially the same effect. The following mainly describes the differences between the active device array substrates 300 and 200, and the technical features of the two are not repeated in principle.

有別於前述實施例中的主動元件陣列基板200,主動元件陣列基板300所包括的輔助閘極350不同於前述輔助閘極250,其中輔助閘極350沒有完全覆蓋閘極驅動陣列230,並且包括多個閘極層351。這些閘極層351彼此電連接,並且電連接於溫度控制器260。因此,溫度控制器260也能根據其所量測的溫度來提供適當的電壓給這些閘極層351。Different from the active device array substrate 200 in the foregoing embodiment, the auxiliary gate 350 included in the active device array substrate 300 is different from the foregoing auxiliary gate 250, wherein the auxiliary gate 350 does not completely cover the gate drive array 230 and includes A plurality of gate layers 351. These gate layers 351 are electrically connected to each other and are electrically connected to the temperature controller 260. Therefore, the temperature controller 260 can also provide appropriate voltages to the gate layers 351 according to the measured temperature.

這些閘極層351覆蓋這些驅動元件231。以圖2為例,這些閘極層351分別覆蓋這些驅動元件231,而且各個閘極層351完全覆蓋這些驅動元件231其中一者。換句話說,各個閘極層351完全覆蓋單一個驅動元件231的升壓電路U23a、升壓控制電路U23c、降壓電路D23a與降壓控制電路D23c。此外,各個閘極層351下方的驅動元件231剖面結構可與圖1E所示的驅動元件231剖面結構相同,因此各個閘極層351也覆蓋這些驅動元件231其中一者的至少一電晶體232的閘極(如圖1E所示的金屬層232g)。 The gate layers 351 cover the driving elements 231. Taking FIG. 2 as an example, the gate layers 351 respectively cover the driving elements 231, and each gate layer 351 completely covers one of the driving elements 231. In other words, each gate layer 351 completely covers the step-up circuit U23a, the step-up control circuit U23c, the step-down circuit D23a, and the step-down control circuit D23c of a single driving element 231. In addition, the cross-sectional structure of the driving element 231 under each gate layer 351 can be the same as the cross-sectional structure of the driving element 231 shown in FIG. Gate (the metal layer 232g as shown in Figure 1E).

圖3是本發明另一實施例的主動元件陣列基板的局部俯視示意圖。請參閱圖3,本實施例的主動元件陣列基板400與前述實施例的主動元件陣列基板300相似,兩者包括相同的元件與相同或相似的剖面結構(如圖1E所示),並且也具有實質上相同的功效。惟主動元件陣列基板400不同於主動元件陣列基板300的地方在於:在主動元件陣列基板400中,輔助閘極450的多個閘極層451沒有完全覆蓋驅動元件231。 3 is a schematic partial top view of an active device array substrate according to another embodiment of the invention. Please refer to FIG. 3, the active device array substrate 400 of this embodiment is similar to the active device array substrate 300 of the previous embodiment, and both include the same elements and the same or similar cross-sectional structure (as shown in FIG. 1E), and also have Substantially the same effect. The only difference between the active device array substrate 400 and the active device array substrate 300 is that in the active device array substrate 400, the multiple gate layers 451 of the auxiliary gate 450 do not completely cover the driving element 231.

具體而言,各個閘極層451局部覆蓋其中一個驅動元件231,未完全覆蓋驅動元件231。以圖3為例,各個閘極層451完全覆蓋驅動元件231的升壓電路U23a與升壓控制電路U23c,但沒有完全覆蓋降壓電路D23a與降壓控制電路D23c,如圖3所示。由此可知,根據以上圖1C、圖1D、圖2與圖3所示的實施例,輔助閘極(例如輔助閘極250、350或450)可以完全或局部覆蓋驅動元件231。此外,輔助閘極可以僅覆蓋單一個驅動元件231的其中一個電晶體232的閘極。或是,輔助閘極可以覆蓋所有驅動元件231的電晶體232。因此,輔助閘極覆蓋驅動元件231的方式有多種,而本發明不以上述實施例為限。Specifically, each gate layer 451 partially covers one of the driving elements 231, but does not completely cover the driving elements 231. Taking FIG. 3 as an example, each gate layer 451 completely covers the boost circuit U23a and the boost control circuit U23c of the driving element 231, but does not completely cover the buck circuit D23a and the buck control circuit D23c, as shown in FIG. It can be seen that, according to the embodiments shown in FIG. 1C, FIG. 1D, FIG. 2 and FIG. In addition, the auxiliary gate may only cover the gate of one of the transistors 232 of a single driving element 231. Or, the auxiliary gate may cover all the transistors 232 of the driving element 231. Therefore, there are many ways for the auxiliary gate to cover the driving element 231, and the present invention is not limited to the above-mentioned embodiment.

綜上所述,在本發明至少一實施例的顯示面板中,根據雙閘極效應,溫度控制器提供給輔助閘極的適當電壓能降低溫度對顯示面板的影響,幫助顯示面板在高溫或低溫環境下能正常地顯示影像,進而維持或提升顯示面板的影像品質。To sum up, in the display panel of at least one embodiment of the present invention, according to the double gate effect, the appropriate voltage provided by the temperature controller to the auxiliary gate can reduce the effect of temperature on the display panel, and help the display panel to operate at high or low temperatures. The image can be displayed normally under the environment, thereby maintaining or improving the image quality of the display panel.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明精神和範圍內,當可作些許更動與潤飾,因此本發明保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of invention protection shall be subject to the scope of the attached patent application.

100:顯示面板 110:對向基板 120:液晶層 130:框膠 200、300、400:主動元件陣列基板 210:基板 211:顯示區 212:周邊區 220:畫素陣列 221:掃描線 222:資料線 230:閘極驅動陣列 231:驅動元件 232:電晶體 232c:通道層 232d、232g、232s:金屬層 232i、270:絕緣層 240:源極電路 250、350、450:輔助閘極 260:溫度控制器 351、451:閘極層 D23a:降壓電路 D23c:降壓控制電路 U23a:升壓電路 U23c:升壓控制電路 100: display panel 110: Opposite substrate 120: liquid crystal layer 130: frame glue 200, 300, 400: Active component array substrate 210: substrate 211: display area 212: Surrounding Area 220: pixel array 221: scan line 222: Data Line 230: gate drive array 231: drive element 232: Transistor 232c: channel layer 232d, 232g, 232s: metal layer 232i, 270: insulating layer 240: source circuit 250, 350, 450: auxiliary gate 260: temperature controller 351, 451: Gate layer D23a: Step-down circuit D23c: Step-down control circuit U23a: Boost circuit U23c: Boost control circuit

圖1A是本發明至少一實施例的剖面示意圖。 圖1B是圖1A中的主動元件陣列基板的俯視示意圖。 圖1C是圖1B中的主動元件陣列基板在其閘極驅動陣列處的俯視示意圖。 圖1D是圖1C中的主動元件陣列基板在其驅動元件處的俯視示意圖。 圖1E是圖1D中的主動元件陣列基板的剖面示意圖。 圖2是本發明另一實施例的主動元件陣列基板的局部俯視示意圖。 圖3是本發明另一實施例的主動元件陣列基板的局部俯視示意圖。 FIG. 1A is a schematic cross-sectional view of at least one embodiment of the present invention. FIG. 1B is a schematic top view of the active device array substrate in FIG. 1A. FIG. 1C is a schematic top view of the active device array substrate in FIG. 1B at its gate drive array. FIG. 1D is a schematic top view of the active device array substrate in FIG. 1C at its driving devices. FIG. 1E is a schematic cross-sectional view of the active device array substrate in FIG. 1D. 2 is a schematic partial top view of an active device array substrate according to another embodiment of the invention. 3 is a schematic partial top view of an active device array substrate according to another embodiment of the invention.

200:主動元件陣列基板 200: Active component array substrate

220:畫素陣列 220: pixel array

221:掃描線 221: scan line

230:閘極驅動陣列 230: gate drive array

231:驅動元件 231: drive element

250:輔助閘極 250: auxiliary gate

260:溫度控制器 260: temperature controller

Claims (17)

一種主動元件陣列基板,包括 一基板,具有一顯示區與位於該顯示區周邊的一周邊區; 一畫素陣列,分布於該顯示區; 一閘極驅動陣列,分布於該周邊區,並包括多個驅動元件,而各該驅動元件包括至少一電晶體,其中該些驅動元件電連接該畫素陣列; 一絕緣層,設置於該基板上,並覆蓋該畫素陣列與該閘極驅動陣列; 一輔助閘極,設置於該絕緣層上,其中該絕緣層位於該輔助閘極與該閘極驅動陣列之間,而該輔助閘極覆蓋該些驅動元件至少一者的該至少一電晶體的一閘極;以及 一溫度控制器,電連接該輔助閘極。 An active element array substrate, including A substrate having a display area and a peripheral area located at the periphery of the display area; A pixel array distributed in the display area; A gate driving array distributed in the peripheral area and including a plurality of driving elements, and each of the driving elements includes at least one transistor, wherein the driving elements are electrically connected to the pixel array; An insulating layer disposed on the substrate and covering the pixel array and the gate drive array; An auxiliary gate is disposed on the insulating layer, wherein the insulating layer is located between the auxiliary gate and the gate drive array, and the auxiliary gate covers the at least one transistor of at least one of the drive elements A gate; and A temperature controller is electrically connected to the auxiliary gate. 如請求項1所述的主動元件陣列基板,其中該輔助閘極完全覆蓋該閘極驅動陣列。The active device array substrate according to claim 1, wherein the auxiliary gate completely covers the gate driving array. 如請求項1所述的主動元件陣列基板,其中該輔助閘極包括多個閘極層,而各該閘極層覆蓋該些驅動元件其中一者的該至少一電晶體的該閘極。The active device array substrate according to claim 1, wherein the auxiliary gate includes a plurality of gate layers, and each of the gate layers covers the gate of the at least one transistor of one of the driving elements. 如請求項3所述的主動元件陣列基板,其中各該驅動元件包括一升壓電路與一升壓控制電路,而各該閘極層覆蓋該升壓電路與該升壓控制電路。The active device array substrate according to claim 3, wherein each of the driving elements includes a boost circuit and a boost control circuit, and each of the gate layers covers the boost circuit and the boost control circuit. 如請求項1所述的主動元件陣列基板,其中該輔助閘極包括多個閘極層,而各該閘極層完全覆蓋該些驅動元件其中一者。The active device array substrate according to claim 1, wherein the auxiliary gate includes a plurality of gate layers, and each of the gate layers completely covers one of the driving elements. 如請求項1所述的主動元件陣列基板,其中當該主動元件陣列基板處於一第一溫度環境時,該溫度控制器提供一第一偏壓給該輔助閘極; 當該主動元件陣列基板處於一第二溫度環境時,該溫度控制器提供一第二偏壓給該輔助閘極,其中該第一溫度環境的溫度大於該第二溫度環境的溫度,而該第一偏壓與該第二偏壓彼此不同。 The active device array substrate according to claim 1, wherein when the active device array substrate is in a first temperature environment, the temperature controller provides a first bias voltage to the auxiliary gate; When the active device array substrate is in a second temperature environment, the temperature controller provides a second bias voltage to the auxiliary gate, wherein the temperature of the first temperature environment is greater than the temperature of the second temperature environment, and the first temperature environment A bias voltage and the second bias voltage are different from each other. 如請求項6所述的主動元件陣列基板,其中該第一偏壓小於該第二偏壓。The active device array substrate according to claim 6, wherein the first bias voltage is less than the second bias voltage. 如請求項6所述的主動元件陣列基板,其中該第一偏壓大於該第二偏壓。The active device array substrate according to claim 6, wherein the first bias voltage is greater than the second bias voltage. 一種顯示面板,包括: 一主動元件陣列基板,包括: 一基板,具有一顯示區與位於該顯示區周邊的一周邊區; 一畫素陣列,分布於該顯示區; 一閘極驅動陣列,分布於該周邊區,並包括多個驅動元件,而各該驅動元件包括至少一電晶體,其中該些驅動元件電連接該畫素陣列; 一絕緣層,設置於該基板上,並覆蓋該畫素陣列與該閘極驅動陣列; 一輔助閘極,設置於該絕緣層上,其中該絕緣層位於該輔助閘極與該閘極驅動陣列之間,而該輔助閘極覆蓋該些驅動元件至少一者的該至少一電晶體的一閘極; 一溫度控制器,電連接該輔助閘極;以及 一對向基板,配置於該主動元件陣列基板的對面,並連接該主動元件陣列基板。 A display panel including: An active device array substrate, including: A substrate having a display area and a peripheral area located at the periphery of the display area; A pixel array distributed in the display area; A gate driving array distributed in the peripheral area and including a plurality of driving elements, and each of the driving elements includes at least one transistor, wherein the driving elements are electrically connected to the pixel array; An insulating layer disposed on the substrate and covering the pixel array and the gate drive array; An auxiliary gate is disposed on the insulating layer, wherein the insulating layer is located between the auxiliary gate and the gate drive array, and the auxiliary gate covers the at least one transistor of at least one of the drive elements A gate A temperature controller electrically connected to the auxiliary gate; and The pair of facing substrates are arranged on the opposite side of the active device array substrate and connected to the active device array substrate. 如請求項9所述的顯示面板,還包括一液晶層,其中該液晶層夾置於該主動元件陣列基板與該對向基板之間。The display panel according to claim 9, further comprising a liquid crystal layer, wherein the liquid crystal layer is sandwiched between the active device array substrate and the counter substrate. 如請求項9所述的顯示面板,其中該輔助閘極完全覆蓋該閘極驅動陣列。The display panel according to claim 9, wherein the auxiliary gate completely covers the gate driving array. 如請求項9所述的顯示面板,其中該輔助閘極包括多個閘極層,而各該閘極層覆蓋該些驅動元件其中一者的該至少一電晶體的該閘極。The display panel according to claim 9, wherein the auxiliary gate includes a plurality of gate layers, and each of the gate layers covers the gate of the at least one transistor of one of the driving elements. 如請求項12所述的顯示面板,其中各該驅動元件包括一升壓電路與一升壓控制電路,而各該閘極層覆蓋該升壓電路與該升壓控制電路。The display panel according to claim 12, wherein each of the driving elements includes a boost circuit and a boost control circuit, and each of the gate layers covers the boost circuit and the boost control circuit. 如請求項9所述的顯示面板,其中該輔助閘極包括多個閘極層,而各該閘極層完全覆蓋該些驅動元件其中一者。The display panel according to claim 9, wherein the auxiliary gate includes a plurality of gate layers, and each of the gate layers completely covers one of the driving elements. 如請求項9所述的顯示面板,其中當該主動元件陣列基板處於一第一溫度環境時,該溫度控制器提供一第一偏壓給該輔助閘極; 當該主動元件陣列基板處於一第二溫度環境時,該溫度控制器提供一第二偏壓給該輔助閘極,其中該第一溫度環境的溫度大於該第二溫度環境的溫度,而該第一偏壓與該第二偏壓彼此不同。 The display panel according to claim 9, wherein when the active device array substrate is in a first temperature environment, the temperature controller provides a first bias voltage to the auxiliary gate; When the active device array substrate is in a second temperature environment, the temperature controller provides a second bias voltage to the auxiliary gate, wherein the temperature of the first temperature environment is greater than the temperature of the second temperature environment, and the first temperature environment A bias voltage and the second bias voltage are different from each other. 如請求項15所述的顯示面板,其中該第一偏壓小於該第二偏壓。The display panel according to claim 15, wherein the first bias voltage is less than the second bias voltage. 如請求項15所述的顯示面板,其中該第一偏壓大於該第二偏壓。The display panel according to claim 15, wherein the first bias voltage is greater than the second bias voltage.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080048994A1 (en) * 2006-08-25 2008-02-28 Samsung Electronics Co., Ltd. Liquid crystal display device having touch panel function and method for detecting a touch position
TW201213933A (en) * 2007-06-20 2012-04-01 Au Optronics Corp Liquid crystal display and method for making the same
TW201341891A (en) * 2012-04-10 2013-10-16 E Ink Holdings Inc Electric apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080048994A1 (en) * 2006-08-25 2008-02-28 Samsung Electronics Co., Ltd. Liquid crystal display device having touch panel function and method for detecting a touch position
TW201213933A (en) * 2007-06-20 2012-04-01 Au Optronics Corp Liquid crystal display and method for making the same
TW201341891A (en) * 2012-04-10 2013-10-16 E Ink Holdings Inc Electric apparatus

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