TWI740467B - Resistive memory apparatus and adjusting method for write-in voltage thereof - Google Patents
Resistive memory apparatus and adjusting method for write-in voltage thereof Download PDFInfo
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本發明是有關於一種電阻式記憶裝置,且特別是有關於一種電阻式記憶裝置的寫入電壓的調整方法。The present invention relates to a resistive memory device, and more particularly to a method for adjusting the writing voltage of the resistive memory device.
在電阻式記憶體的技術領域中,基於環境因素、製程飄移等多種可能,會造成單一積體電路間、晶粒與晶粒間的多個記憶胞的物理特性不均勻的現象。在這樣的情況下,要如何設定電阻式記憶體的寫入電壓(包括設定電壓以及重置電壓),以使記憶胞的重置時間以及設定時間可以平衡,成為一個重要的課題。In the technical field of resistive memory, environmental factors, process drift, and other possible causes may cause uneven physical characteristics of multiple memory cells between a single integrated circuit and between a die and a die. In such a situation, how to set the write voltage (including the set voltage and the reset voltage) of the resistive memory so that the reset time and the set time of the memory cell can be balanced has become an important issue.
本發明提供一種電阻式記憶體以及其寫入電壓的調整方法,可均衡其執行重置動作以及設定動作所需的時間。The invention provides a resistive memory and a method for adjusting its write voltage, which can balance the time required for the reset operation and the setting operation.
本發明的寫入電壓的調整方法適用於電阻式記憶體。寫入電壓的調整方法包括:選擇電阻式記憶體中的受測記憶胞陣列;依據一重置電壓以針對該些受測記憶胞陣列中的多個記憶胞來執行N次重置動作,以及依據設定電壓對記憶胞執行N次設定動作,其中N為大於1的整數;計算重置動作的重置時間變化率以及設定動作的設定時間變化率;以及依據重置時間變化率以及設定時間變化率來調整設定電壓以及重置電壓的其中之一電壓值。The method for adjusting the write voltage of the present invention is suitable for resistive memory. The method for adjusting the writing voltage includes: selecting the memory cell array under test in the resistive memory; performing N reset operations for the memory cells in the memory cell array under test according to a reset voltage, and Perform N setting actions on the memory cell according to the set voltage, where N is an integer greater than 1; calculate the reset time change rate of the reset action and the set time change rate of the set action; and according to the reset time change rate and the set time change Rate to adjust one of the set voltage and the reset voltage.
本發明的電阻式記憶裝置包括受測記憶胞陣列以及控制器。控制器耦接至受測記憶胞陣列。控制器用以執行上述的寫入電壓的調整方法。The resistive memory device of the present invention includes a memory cell array under test and a controller. The controller is coupled to the memory cell array under test. The controller is used to execute the above-mentioned adjustment method of the write voltage.
基於上述,本發明實施例針對電阻式記憶體中部分的受測記憶胞陣列,執行多次重置動作以及多次設定動作。並依據重置動作的重置時間變化率以及設定動作的設定時間變化率,來針對重置電壓以及設定電壓的其中之一來進行調整,可使電阻式記憶體的重置動作以及設定動作所需的寫入時間可以均衡,提升電阻式記憶體的使用效率。Based on the above, the embodiment of the present invention performs multiple reset actions and multiple setting actions for part of the memory cell array under test in the resistive memory. And according to the reset time change rate of the reset action and the set time change rate of the setting action, to adjust one of the reset voltage and the setting voltage, so that the reset action of the resistive memory and the setting action can be adjusted. The required writing time can be balanced, and the use efficiency of the resistive memory can be improved.
請參照圖1,圖1繪示本發明一實施例的寫入電壓的調整方法的流程圖。本實施例的寫入電壓的調整方法適用於電阻式記憶體中。電阻式記憶體的寫入動作包括重置動作以及設定動作,其中的寫入電壓包括重置電壓以及設定電壓。在步驟S110中,可選擇電阻式記憶體選擇其中的一個記憶體陣列做為受測記憶胞陣列。接著,在步驟S120中,則依據一重置電壓以針對受測記憶胞陣列中的多個記憶胞來分別執行N次重置動作,並依據一設定電壓對前述多個記憶胞執行N次設定動作,其中N為大於1的整數。在此,上述的一次的重置動作中,可以針對記憶胞施加重置電壓一段時間後,並透過驗證記憶胞的電阻值以獲知重置動作是否完成,若驗證結果表示記憶胞的電阻值還不夠高,則再次對記憶胞進行重置電壓的施加動作。上述的重置電壓的施加動作可以一次或多次的進行,直至記憶胞的電阻值大於預設的閥值。相類似的,上述的一次的設定動作中,可以針對記憶胞施加設定電壓一段時間後,並透過驗證記憶胞的電阻值以獲知設定動作是否完成,若驗證結果表示記憶胞的電阻值還不夠低,則再次對記憶胞進行設定電壓的施加動作。上述的設定電壓的施加動作可以一次或多次的進行,直至記憶胞的電阻值小於預設的另一閥值。Please refer to FIG. 1. FIG. 1 is a flowchart of a method for adjusting a write voltage according to an embodiment of the present invention. The method for adjusting the write voltage of this embodiment is suitable for resistive memory. The write action of the resistive memory includes a reset action and a setting action, and the write voltage includes a reset voltage and a set voltage. In step S110, the resistive memory can be selected to select one of the memory arrays as the memory cell array to be tested. Next, in step S120, the multiple memory cells in the memory cell array under test are respectively performed N reset operations according to a reset voltage, and the multiple memory cells are set N times according to a set voltage. Action, where N is an integer greater than 1. Here, in the above-mentioned one reset operation, after a reset voltage is applied to the memory cell for a period of time, the resistance value of the memory cell can be verified to know whether the reset operation is completed. If the verification result indicates that the resistance value of the memory cell is still If it is not high enough, the reset voltage is applied to the memory cell again. The aforementioned reset voltage application action can be performed one or more times until the resistance value of the memory cell is greater than the preset threshold value. Similarly, in the one-time setting action mentioned above, after applying the setting voltage to the memory cell for a period of time, the resistance value of the memory cell can be verified to know whether the setting action is completed. If the verification result indicates that the resistance value of the memory cell is not low enough , Then apply the set voltage to the memory cell again. The above-mentioned application of the set voltage can be performed one or more times until the resistance value of the memory cell is less than another preset threshold.
接著,在步驟S130中,計算上述的多次重置動作的重置時間變化率,並計算上述的多次設定動作的設定時間變化率。在此請注意,電阻式記憶體的記憶胞,可能會因為多次的寫入動作產生物理特性的變異。因此,針對記憶胞執行第一次的重置動作所需的第一時間,可能會與針對記憶胞執行第N次的重置動作所需的第二時間不相同,通常第二時間大於第一時間。同理,針對記憶胞執行第一次的設定動作所需的第三時間,可能會與針對記憶胞執行第N次的設定動作所需的第四時間不相同,通常第四時間大於第三時間。Next, in step S130, the reset time change rate of the multiple reset operations described above is calculated, and the set time change rate of the multiple set operations described above is calculated. Please note here that the memory cell of resistive memory may change its physical characteristics due to multiple write operations. Therefore, the first time required to perform the first reset action on the memory cell may be different from the second time required to perform the Nth reset action on the memory cell. Generally, the second time is greater than the first time. time. In the same way, the third time required to perform the first setting action for the memory cell may be different from the fourth time required to perform the Nth setting action for the memory cell, usually the fourth time is greater than the third time .
而步驟S130中的重置時間變化率,可依據上述的第一時間與第二時間來計算出,在本實施例中,重置時間變化率等於第二時間與第一時間的差除以第一時間。同樣的,設定時間變化率,可依據上述的第三時間與第四時間來計算出,在本實施例中,設定時間變化率等於第四時間與第三時間的差,除以第三時間。The change rate of the reset time in step S130 can be calculated based on the first time and the second time mentioned above. In this embodiment, the change rate of the reset time is equal to the difference between the second time and the first time divided by the first time. For a time. Similarly, the set time change rate can be calculated based on the aforementioned third time and fourth time. In this embodiment, the set time change rate is equal to the difference between the fourth time and the third time, divided by the third time.
接著,在步驟S140中,則依據步驟S130中獲得的重置時間變化率以及設定時間變化率來調整設定電壓以重置電壓其中之一的電壓值。在細節上,在步驟S140中,可先針對重置時間變化率以及設定時間變化率進行比較,並在當重置時間變化率以及設定時間變化率間的差的絕對值大於預設的臨界值時,啟動設定電壓以重置電壓其中之一的電壓值的調整機制。其中,若當設定時間變化率大於重置時間變化率時,則選擇設定電壓以進行調整,若當重置時間變化率大於設定時間變化率時,則選擇重置電壓以進行調整。Next, in step S140, the set voltage is adjusted according to the reset time change rate and the set time change rate obtained in step S130 to reset the voltage value of one of the voltages. In detail, in step S140, the reset time change rate and the set time change rate can be compared first, and when the absolute value of the difference between the reset time change rate and the set time change rate is greater than the preset threshold At the time, the adjustment mechanism of setting the voltage to reset the voltage value of one of the voltages is activated. Wherein, if the set time change rate is greater than the reset time change rate, the set voltage is selected for adjustment, and if the reset time change rate is greater than the set time change rate, the reset voltage is selected for adjustment.
在此,當設定時間變化率過大時,表示在多次設定動作後,記憶胞需要更長的設定時間來執行設定動作。因此,在本實施例中,可透過提升設定電壓的電壓絕對值,來使記憶胞的設定時間可以縮短,並使記憶胞在執行設定動作所需的設定時間以及執行重置動作所需的重置時間可以相互接近,維持記憶胞的重置動作與重置動作在時間上的平衡。當然,當重置時間變化率過大時,表示在多次重置動作後,記憶胞需要更長的重置時間來執行設定動作。因此,在本實施例中,可透過提升重置電壓的電壓絕對值,來使記憶胞的重置時間可以縮短,進而維持記憶胞的設定動作與重置動作在時間上的平衡。Here, when the setting time change rate is too large, it means that after multiple setting actions, the memory cell needs a longer setting time to perform the setting action. Therefore, in this embodiment, by increasing the absolute value of the setting voltage, the setting time of the memory cell can be shortened, and the setting time required for the memory cell to perform the setting operation and the reset operation required for the reset operation can be shortened. The reset time can be close to each other, maintaining the time balance between the reset action and the reset action of the memory cell. Of course, when the reset time change rate is too large, it means that after multiple reset actions, the memory cell needs a longer reset time to perform the setting action. Therefore, in this embodiment, the reset time of the memory cell can be shortened by increasing the absolute value of the reset voltage, thereby maintaining the time balance between the setting action and the reset action of the memory cell.
請參照圖2,圖2繪示本發明一實施例的電阻式記憶體的測試動作的流程圖。其中,步驟S210中,針對電阻式記憶體中的所有記憶胞執行形成(forming)動作。在此,針對電阻式記憶胞所執行的形成動作,可針對記憶胞施加偏壓,當記憶胞上的電場超過臨界值時介電層會發生類崩潰現象,使介電層轉變為具有電阻可變的特性。形成動作用以對電阻式記憶胞進行初始化動作。Please refer to FIG. 2. FIG. 2 is a flowchart of a test operation of a resistive memory according to an embodiment of the present invention. Wherein, in step S210, a forming operation is performed for all memory cells in the resistive memory. Here, for the formation of the resistive memory cell, a bias voltage can be applied to the memory cell. When the electric field on the memory cell exceeds a critical value, the dielectric layer will collapse like a phenomenon, and the dielectric layer will be transformed into a resistive memory cell. Change characteristics. The forming action is used to initialize the resistive memory cell.
接著,步驟S220執行測試初始化動作,步驟S230則針對電阻式記憶體執行使用者功能測試。步驟S240中,則在電阻式記憶體中選擇受測記憶胞陣列,並針對受測記憶胞陣列進行寫入時間的蒐集動作。並在步驟S250執行步驟S240所獲得的寫入資料的分析動作。在此注意,步驟S240的寫入時間的蒐集動作,可以透過針對受測記憶胞陣列的多個記憶胞執行N次的設定動作以及N次的重置動作,並計算出重置動作的重置時間變化率以及設定動作的設定時間變化率。上述的N為大於1的任意整數。Then, step S220 executes a test initialization action, and step S230 executes a user function test for the resistive memory. In step S240, the memory cell array under test is selected from the resistive memory, and the writing time collection action is performed for the memory cell array under test. And in step S250, the analysis operation of the written data obtained in step S240 is executed. Note here that the writing time collection action of step S240 can be performed by performing N setting actions and N reset actions on multiple memory cells of the memory cell array under test, and the reset action of the reset action can be calculated. Time change rate and set time change rate of setting action. The aforementioned N is any integer greater than one.
在此請注意,上述的N可以由設計者自行設定,沒有固定的限制。Please note that the above N can be set by the designer without a fixed limit.
步驟S260中,執行設定時間變化率Tset與重置時間變化率Treset的差值的絕對值(|Tset – Treset|)的計算。當設定時間變化率Tset與重置時間變化率Treset的差值的絕對值大於預設的臨界值X時,啟動重置電壓或設定電壓的調整機制,並執行步驟S270。若當設定時間變化率Tset與重置時間變化率Treset的差值的絕對值不大於預設的臨界值X時,則結束此測試流程。接著,在步驟S270中,判斷設定時間變化率Tset是否大於重置時間變化率Treset。當設定時間變化率Tset大於重置時間變化率Treset時,執行步驟S271,相對的,當設定時間變化率Tset小於重置時間變化率Treset時,執行步驟S281。In step S260, the calculation of the absolute value (|Tset-Treset|) of the difference between the set time change rate Tset and the reset time change rate Treset is performed. When the absolute value of the difference between the set time change rate Tset and the reset time change rate Treset is greater than the preset threshold X, the reset voltage or the adjustment mechanism of the set voltage is activated, and step S270 is executed. If the absolute value of the difference between the set time change rate Tset and the reset time change rate Treset is not greater than the preset critical value X, the test procedure is ended. Next, in step S270, it is determined whether the set time change rate Tset is greater than the reset time change rate Treset. When the set time change rate Tset is greater than the reset time change rate Treset, step S271 is executed. On the other hand, when the set time change rate Tset is less than the reset time change rate Treset, step S281 is executed.
在步驟S271中,則使設定時間變化率Tset減去重置時間變化率Treset,並判斷設定時間變化率Tset與重置時間變化率Treset的變化率差值是否大於預設的一參考值Y。當上述的變化率差值大於參考值Y,表示設定電壓需要相對大幅度的調整,故在步驟S272中使設定電壓V_SET加上第一電壓AV,以調高設定電壓的電壓值。而當上述的變化率差值小於參考值Y,表示設定電壓只需要相對低幅度的調整,故在步驟S273中使設定電壓V_SET加上第二電壓BV,以調高設定電壓的電壓值。其中第一電壓AV大於第二電壓BV。In step S271, the reset time change rate Treset is subtracted from the set time change rate Tset, and it is determined whether the change rate difference between the set time change rate Tset and the reset time change rate Treset is greater than a preset reference value Y. When the above-mentioned change rate difference is greater than the reference value Y, it indicates that the set voltage needs to be adjusted relatively greatly. Therefore, in step S272, the set voltage V_SET is added to the first voltage AV to increase the voltage value of the set voltage. When the above-mentioned change rate difference is less than the reference value Y, it means that the setting voltage only needs a relatively low amplitude adjustment. Therefore, in step S273, the setting voltage V_SET is added to the second voltage BV to increase the voltage value of the setting voltage. The first voltage AV is greater than the second voltage BV.
在步驟S281中,則使重置時間變化率Treset減去設定時間變化率Tset,並判斷重置時間變化率Treset與設定時間變化率Tset的變化率差值是否大於預設的參考值Y。當上述的變化率差值大於參考值Y,表示重置電壓需要相對大幅度的調整,故在步驟S282中使重置電壓V_RESET加上第三電壓aV,以調高重置電壓的電壓值。而當上述的變化率差值小於參考值Y,表示重置電壓只需要相對低幅度的調整,故在步驟S283中使重置電壓V_RESET加上第四電壓bV,以調高重置電壓的電壓值。其中第三電壓aV大於第四電壓bV。In step S281, the reset time change rate Treset is subtracted from the set time change rate Tset, and it is determined whether the change rate difference between the reset time change rate Treset and the set time change rate Tset is greater than the preset reference value Y. When the aforementioned change rate difference is greater than the reference value Y, it indicates that the reset voltage needs to be adjusted by a relatively large amount. Therefore, in step S282, the reset voltage V_RESET is added to the third voltage aV to increase the voltage value of the reset voltage. When the above-mentioned change rate difference is less than the reference value Y, it means that the reset voltage only needs a relatively low amplitude adjustment. Therefore, in step S283, the reset voltage V_RESET is added to the fourth voltage bV to increase the reset voltage. value. The third voltage aV is greater than the fourth voltage bV.
最後,在步驟S290中,則將上述的重置電壓以及設定電壓的調整資訊,寫入至儲存裝置中,之後結束此測試流程。在此請注意,重置電壓以及設定電壓的調整資訊可以透過數位資料的形式寫入至儲存裝置中。儲存裝置可以是揮發式或非揮發式的任意記憶元件,沒有固定的限制。Finally, in step S290, the above-mentioned reset voltage and setting voltage adjustment information are written into the storage device, and then the test process is ended. Please note here that the adjustment information of the reset voltage and the set voltage can be written into the storage device in the form of digital data. The storage device can be any volatile or non-volatile memory element, and there is no fixed limit.
在本實施例中,圖2的流程可以在電阻式記憶體執行測試動作時執行。並且,當測試動作完成後,電阻式記憶體會根據重置電壓以及設定電壓的調整資訊調整初始化的重置電壓以及設定電壓,以操作受測記憶體陣列外的所有記憶體陣列。In this embodiment, the process of FIG. 2 can be executed when the resistive memory is performing a test action. Moreover, when the test operation is completed, the resistive memory adjusts the reset voltage and the set voltage of the initialization according to the adjustment information of the reset voltage and the set voltage to operate all the memory arrays except the tested memory array.
值得一提的,受測記憶胞陣列可以為電阻式記憶體中的一部分。也就是說,圖2中步驟S240至S290的步驟可僅針對電阻式記憶體中的一小部份來執行,可加速寫入電壓的調整動作。It is worth mentioning that the memory cell array under test can be a part of resistive memory. In other words, the steps S240 to S290 in FIG. 2 can be performed only for a small part of the resistive memory, which can speed up the adjustment of the write voltage.
圖3A、圖3B、圖4A以及圖4B分別繪示在經過多次操作後,寫入時間發生偏移的例子。圖中示例是針對受測記憶胞陣列的多個記憶胞執行多次的重置動作,並針對受測記憶胞陣列的多個記憶胞執行多次的設定動作後,分別記錄多次重置動作的重置時間以獲得曲線CV1,並分別記錄多次設定動作的設定時間以獲得曲線CV2。3A, FIG. 3B, FIG. 4A, and FIG. 4B respectively show examples in which the writing time shifts after multiple operations. The example in the figure is to perform multiple reset actions on multiple memory cells of the tested memory cell array, and after multiple setting actions are performed on multiple memory cells of the tested memory cell array, multiple reset actions are recorded respectively To obtain the curve CV1, and record the setting time of multiple setting actions to obtain the curve CV2.
以下請參照圖3A、圖3B、圖4A以及圖4B說明本發明的寫入電壓的調整方法。在圖3A中,執行第一次重置動作所需的第一重置時間tWT1_1例如為0.6毫秒;執行第N次重置動作所需的第二重置時間tWT1_N例如為0.69毫秒;執行第一次設定動作所需的第一設定時間tWT0_1例如為0.7毫秒;執行第N次設定動作所需的第二設定時間tWT0_N例如為1.0毫秒。據此,可計算出重置時間變化率 = (tWT1_N - tWT1_1) / tWT1_1 = 0.15,以及計算出設定時間變化率 = (tWT0_N – tWT0_1) / tWT0_1 = 0.43。進而,可計算出設定時間變化率以及重置時間變化率的差 = 0.28。Hereinafter, referring to FIG. 3A, FIG. 3B, FIG. 4A, and FIG. 4B, the method for adjusting the write voltage of the present invention will be described. In FIG. 3A, the first reset time tWT1_1 required to perform the first reset action is, for example, 0.6 milliseconds; the second reset time tWT1_N required to perform the Nth reset action is, for example, 0.69 milliseconds; The first setting time tWT0_1 required for the second setting action is, for example, 0.7 milliseconds; the second setting time tWT0_N required to perform the Nth setting action is, for example, 1.0 milliseconds. Based on this, the reset time change rate = (tWT1_N-tWT1_1) / tWT1_1 = 0.15 can be calculated, and the set time change rate = (tWT0_N – tWT0_1) / tWT0_1 = 0.43. Furthermore, the difference between the set time change rate and the reset time change rate = 0.28 can be calculated.
在設定時間變化率大於重置時間變化率的前提下,透過判斷設定時間變化率以及重置時間變化率的差有無大於預設的參考值Y,可以執行圖2的步驟S272或S273以調整設定電壓的電壓值,並增加設定動作的能量。Under the premise that the set time change rate is greater than the reset time change rate, by judging whether the difference between the set time change rate and the reset time change rate is greater than the preset reference value Y, step S272 or S273 of Figure 2 can be executed to adjust the setting The voltage value of the voltage, and increase the energy of the set action.
在圖3B中,執行第一次重置動作所需的第一重置時間tWT1_1例如為1.0毫秒;執行第N次重置動作所需的第二重置時間tWT1_N例如為1.15毫秒;執行第一次設定動作所需的第一設定時間tWT0_1例如為0.7毫秒;執行第N次設定動作所需的第二設定時間tWT0_N例如為1.1毫秒。據此,可計算出重置時間變化率 = (tWT1_N - tWT1_1) / tWT1_1 = 0.15,以及計算出設定時間變化率 = (tWT0_N – tWT0_1) / tWT0_1 = 0.57。進一步的,可計算出設定時間變化率以及重置時間變化率的差 = 0.42。同樣在設定時間變化率大於重置時間變化率的前提下,再透過判斷設定時間變化率以及重置時間變化率的差有無大於預設的參考值Y,可以執行圖2的步驟S272或S273以調整設定電壓的電壓值,並增加設定動作的能量。In FIG. 3B, the first reset time tWT1_1 required to perform the first reset action is, for example, 1.0 millisecond; the second reset time tWT1_N required to perform the Nth reset action is, for example, 1.15 milliseconds; The first setting time tWT0_1 required for the second setting action is, for example, 0.7 milliseconds; the second setting time tWT0_N required for performing the Nth setting action is, for example, 1.1 milliseconds. Based on this, the reset time change rate = (tWT1_N-tWT1_1) / tWT1_1 = 0.15 can be calculated, and the set time change rate = (tWT0_N – tWT0_1) / tWT0_1 = 0.57. Furthermore, the difference between the set time change rate and the reset time change rate = 0.42 can be calculated. Similarly, on the premise that the set time change rate is greater than the reset time change rate, by determining whether the difference between the set time change rate and the reset time change rate is greater than the preset reference value Y, step S272 or S273 of FIG. 2 can be executed. Adjust the voltage value of the set voltage and increase the energy of the set action.
在圖4A中,執行第一次重置動作所需的第一重置時間tWT1_1例如為1.0毫秒;執行第N次重置動作所需的第二重置時間tWT1_N例如為1.5毫秒;執行第一次設定動作所需的第一設定時間tWT0_1例如為0.8毫秒;執行第N次設定動作所需的第二設定時間tWT0_N例如為0.92毫秒。據此,可計算出重置時間變化率 = (tWT1_N - tWT1_1) / tWT1_1 = 0.50,以及計算出設定時間變化率 = (tWT0_N – tWT0_1) / tWT0_1 = 0.15。進一步的,可計算出重置時間變化率以及設定時間變化率的差 = 0.35。In FIG. 4A, the first reset time tWT1_1 required to perform the first reset action is, for example, 1.0 millisecond; the second reset time tWT1_N required to perform the Nth reset action is, for example, 1.5 milliseconds; The first setting time tWT0_1 required for the second setting action is, for example, 0.8 milliseconds; the second setting time tWT0_N required for performing the Nth setting action is, for example, 0.92 milliseconds. Based on this, the reset time change rate = (tWT1_N-tWT1_1) / tWT1_1 = 0.50, and the set time change rate = (tWT0_N – tWT0_1) / tWT0_1 = 0.15 can be calculated. Furthermore, the difference between the reset time change rate and the set time change rate = 0.35 can be calculated.
基於重置時間變化率大於設定時間變化率,再透過判斷重置時間變化率以及設定時間變化率的差有無大於預設的參考值Y,可以執行圖2的步驟S282或S283以調整重置電壓的電壓值,並增加重置動作的能量。Based on the reset time change rate being greater than the set time change rate, and then by judging whether the difference between the reset time change rate and the set time change rate is greater than the preset reference value Y, step S282 or S283 of Figure 2 can be executed to adjust the reset voltage And increase the energy of the reset action.
在圖4B中,執行第一次重置動作所需的第一重置時間tWT1_1例如為0.7毫秒;執行第N次重置動作所需的第二重置時間tWT1_N例如為1.05毫秒;執行第一次設定動作所需的第一設定時間tWT0_1例如為1.0毫秒;執行第N次設定動作所需的第二設定時間tWT0_N例如為1.15毫秒。據此,可計算出重置時間變化率 = (tWT1_N - tWT1_1) / tWT1_1 = 0.50,以及計算出設定時間變化率 = (tWT0_N – tWT0_1) / tWT0_1 = 0.15。進一步的,可計算出重置時間變化率以及設定時間變化率的差 = 0.35。In FIG. 4B, the first reset time tWT1_1 required to perform the first reset action is, for example, 0.7 milliseconds; the second reset time tWT1_N required to perform the Nth reset action is, for example, 1.05 milliseconds; The first setting time tWT0_1 required for the second setting action is, for example, 1.0 millisecond; the second setting time tWT0_N required for performing the Nth setting action is, for example, 1.15 milliseconds. Based on this, the reset time change rate = (tWT1_N-tWT1_1) / tWT1_1 = 0.50, and the set time change rate = (tWT0_N – tWT0_1) / tWT0_1 = 0.15 can be calculated. Furthermore, the difference between the reset time change rate and the set time change rate = 0.35 can be calculated.
同樣基於重置時間變化率大於設定時間變化率,再透過判斷重置時間變化率以及設定時間變化率的差有無大於預設的參考值Y,可以執行圖2的步驟S282或S283以調整重置電壓的電壓值,並增加重置動作的能量。Also based on the reset time change rate being greater than the set time change rate, and then by judging whether the difference between the reset time change rate and the set time change rate is greater than the preset reference value Y, step S282 or S283 of Figure 2 can be executed to adjust the reset The voltage value of the voltage, and increase the energy of the reset action.
請參照圖5,圖5繪示本發明實施例的電阻式記憶體裝置的示意圖。電阻式記憶體裝置500包括記憶區塊510、控制器520、儲存裝置530以及電壓產生器540。在執行寫入電壓調整動作時,控制器520可由記憶區塊510中選擇一受測記憶胞陣列511,並針對受測記憶胞陣列511執行如圖1繪示的寫入電壓調整流程。控制器520所執行的動作細節,在前述的實施例以及實施方式都有詳細的說明,在此不多贅述。Please refer to FIG. 5. FIG. 5 is a schematic diagram of a resistive memory device according to an embodiment of the present invention. The
控制器520另可將重置電壓VRESET以及設定電壓VSET的調整資訊IFO寫入至儲存裝置530中。儲存裝置530可以是任意形式的記憶體,沒有特定的限制。電壓產生器540則用以提供重置電壓VRESET以及設定電壓VSET至記憶區塊510。其中,控制器530可以依據儲存裝置530記錄的重置電壓VRESET以及設定電壓VSET的調整資訊IFO,來使電壓產生器540針對所產生的重置電壓VRESET以及設定電壓VSET的電壓值進行調整。The
在硬體架構上,控制器520可以為具運算能力的處理器。或者,控制器520可透過硬體描述語言或是其他熟知的數位電路的設計方式來進行設計,並透過現場可程式邏輯門陣列、複雜可程式邏輯裝置或是特殊應用積體電路的方式來實現的硬體電路。In terms of hardware architecture, the
綜上所述,本發明針對電阻式記憶體中部分的受測記憶胞陣列執行多次的重置動作以及設定動作。透過記錄重置動作的重置時間變化率以及設定動作的重置時間變化率,來判斷出設定動作的設定能量以及重置動作的重置能量有無發生不足,並據以調整設定電壓或重置電壓的電壓值。如此一來,電阻式記憶體的重置動作以及設定動作可以得到平衡,提升使用效率。In summary, the present invention performs multiple reset actions and setting actions on part of the memory cell array under test in the resistive memory. By recording the reset time change rate of the reset action and the reset time change rate of the setting action, determine whether the set energy of the set action and the reset energy of the reset action are insufficient, and adjust the set voltage or reset accordingly The voltage value of the voltage. In this way, the reset action and setting action of the resistive memory can be balanced, and the use efficiency can be improved.
S110~S140:寫入電壓調整步驟 S210~S290:測試動作的步驟 CV1、CV2:曲線 tWT1_1、tWT1_N:重置時間 tWT0_1、tWT0_N:設定時間 500:電阻式記憶體裝置 510:記憶區塊 520:控制器 530:儲存裝置 540:電壓產生器 511:受測記憶胞陣列 VRESET:重置電壓 VSET:設定電壓 IFO:調整資訊 S110~S140: Steps to adjust the write voltage S210~S290: Steps to test actions CV1, CV2: Curve tWT1_1, tWT1_N: reset time tWT0_1, tWT0_N: set time 500: Resistive memory device 510: memory block 520: Controller 530: storage device 540: Voltage Generator 511: Tested memory cell array VRESET: reset voltage VSET: set voltage IFO: adjustment information
圖1繪示本發明一實施例的寫入電壓的調整方法的流程圖。 圖2繪示本發明一實施例的電阻式記憶體的測試動作的流程圖。 圖3A、圖3B、圖4A以及圖4B分別繪示本發明不同實施方式的寫入電壓的調整方法的動作示意圖。 圖5繪示本發明實施例的電阻式記憶體裝置的示意圖。 FIG. 1 shows a flowchart of a method for adjusting a write voltage according to an embodiment of the present invention. FIG. 2 is a flowchart of a test operation of a resistive memory according to an embodiment of the present invention. 3A, FIG. 3B, FIG. 4A, and FIG. 4B respectively show schematic diagrams of operations of the write voltage adjustment method according to different embodiments of the present invention. FIG. 5 is a schematic diagram of a resistive memory device according to an embodiment of the invention.
S110~S140:寫入電壓調整步驟 S110~S140: Steps to adjust the write voltage
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