TWI740261B - Use of ceramic composition, use of ceramic sintered body, and thermistor - Google Patents

Abstract

The invention provides a ceramic composition, a ceramic sintered body and a laminated ceramic electronic component. The ceramic composition includes a _{first main powder having a perovskite structure represented by the general formula A m} BO ₃ , wherein the A position is selected from barium, strontium or a combination thereof, the B position is titanium, and 1.02≦m≦1.05 ; By adjusting the molar ratio of the A-site and B-site of the main powder material, the resulting ceramic sintered body has an appropriate grain size and porosity, and thus has a good oxygen supplement efficiency, therefore, it contains the ceramic The laminated ceramic electronic component of the sintered body can have excellent properties of low room temperature resistance value and high temperature coefficient of resistance.

Description

Use of ceramic composition, use of ceramic sintered body and thermistor

The present invention relates to a ceramic composition containing a main powder of a perovskite structure, a ceramic sintered body formed by sintering the ceramic composition, and a laminated ceramic electronic component containing the ceramic sintered body, and is particularly applicable to positive temperature coefficient thermal Multilayer ceramic electronic components for sensitive resistors.

Thermistor (Thermistor) is a variable resistor, that is, its resistance value changes with temperature, and is divided into positive temperature coefficient thermistors, negative temperature coefficient thermistors, and critical temperature thermistors. Because thermistors have high accuracy in a specific temperature range, they have been widely used today, such as temperature sensors, inrush current limiters, or resettable fuses.

Positive temperature coefficient thermistor (PTC thermistor), referred to as PTC thermistor, its resistance value will increase as the temperature of the resistor body increases, and has a positive temperature coefficient, and reaches the Curie temperature (Curie temperature, After the Tc) or magnetic transition point, the resistance value increases rapidly, which is also called the PTC effect. Therefore, in addition to being used as a heating element, the PTC thermistor also has the function of switching over-current protection, and can realize the three functions of heating, sensing, and switching at the same time, and the latter two are the main applications.

Because electrical appliances used at room temperature such as home appliances or consumer electronics rely on thermistors, such as temperature sensors, thermistors with low room temperature resistance will have a wider range of applications. However, even if the PTC thermistor has the above-mentioned excellent functions, due to the limitation of the development of manufacturing technology, the thermistor with both low room temperature resistance and high temperature coefficient of resistance is still to be developed to meet market demand .

The present invention provides a ceramic composition which can be used in a thermistor, thereby reducing the room temperature resistance value of the thermistor and increasing the temperature coefficient of resistance of the thermistor.

To achieve the above objective, the present invention provides a ceramic composition comprising: a main powder material, which comprises a _{first main powder having a perovskite structure represented by the general formula A m} BO ₃ , wherein the A position is selected from barium ( Ba), strontium (Sr) or a combination thereof, B site is titanium (Ti), m is the molar ratio of A site to B site, and 1.02≦m≦1.05; the first rare earth material; and micro-nanosilica glass.

In some embodiments, m may be 1.020, 1.021, 1.025, 1.029, 1.030, 1.031, 1.035, 1.039, 1.040, 1.041, 1.045, 1.049, or 1.050, but is not limited thereto. Preferably, 1.02≦m≦1.04.

By adjusting the m value of the main powder material, the present invention can prevent the crystal grains formed by the ceramic composition from being inhibited or growing abnormally during the sintering process, thereby helping to improve the electrical performance of the laminated ceramic electronic component.

Preferably, the first main powder includes barium titanate, strontium titanate or a combination thereof.

Preferably, the main powder material further includes a second main powder, which can be used to increase or decrease the number of moles of the A position relative to the B position to adjust the value of m.

Preferably, the second main powder material includes barium carbonate (BaCO ₃ ) or titanium dioxide (TiO ₂ ); among them, barium carbonate contains barium, so it can be used to increase the number of moles between the A position and the B position to adjust the value of m ; Titanium dioxide does not contain barium, so it can be used to reduce the number of moles of the A position relative to the B position to adjust the m value.

Preferably, the second main powder material is barium carbonate; based on the total content of the first main powder being 1 mol, the content of barium carbonate is 0.02 mol to 0.05 mol.

In some embodiments, based on the total content of barium titanate being 1 mol, the content of barium carbonate may be 0.020 mol, 0.021 mol, 0.025 mol, 0.029 mol, 0.030 mol, 0.031 mol, 0.035 mol, 0.039 mol, 0.040 mol, 0.041 mol, 0.045 mol, 0.049 mol, or 0.050 mol, but not limited thereto.

Preferably, the A position of the first main powder contains a combination of barium and strontium; based on the total number of moles of the A position being 1 mol, the content of strontium is greater than 0 mol to 0.06 mol, that is, 0< The molar ratio of Sr occupying the A position is less than or equal to 0.06.

In some embodiments, based on the total number of moles of the A position as 1 mole, the content of strontium can be 0.005 mole, 0.010 mole, 0.015 mole, 0.020 mole, 0.025 mole, 0.030 mole, 0.035 mol, 0.040 mol, 0.045 mol, 0.050 mol, 0.055 mol, or 0.060 mol, but not limited thereto.

Preferably, the first rare earth material includes yttrium (Y), samarium (Sm), niobium (Nb), neodymium (Nd), cerium (Ce), alloys or oxides thereof.

By adding the above-mentioned first rare earth material, the perovskite structure can be semiconducted and the resistance value can be reduced.

Since the main powder material and the first rare earth material are both solid, in order to make the elements contained in it can be evenly distributed in the ceramic sintered body obtained by sintering the ceramic composition, micro-nanosilicate glass is added to the ceramic composition middle. Because the temperature required for the formation of the liquid phase of the micro-nanosilicate glass is relatively low, the barium titanate surface can be wetted quickly and uniformly during the sintering process, so that the elements in the ceramic composition can be uniformly diffused to the perovskite In the crystal lattice of the sintered structure to improve the dielectric properties of the ceramic sintered body obtained by sintering. In other words, the micro-nanosilicate glass can improve the solid solution effect of the main powder material and the first rare earth material. In addition to avoiding the precipitation of the main powder material and the first rare earth material, it also helps the laminated ceramic electronic components to exhibit the PTC effect. .

Preferably, the average particle size of the main powder material is 0.2 μm to 3 μm.

Preferably, the average particle size of the micro-nanosilicate glass is 30 nanometers to 3 micrometers.

Preferably, based on the total weight of the main powder material, the first rare earth material and the micro-nanosilicate glass, the content of the main powder material is 77 weight percent to 96.9 weight percent; more preferably, the The content of the main powder material is 79 weight percent to 92.9 weight percent.

Preferably, based on the total weight of the main powder material, the first rare earth material and the micro-nanosilicate glass, the content of the first rare earth material is 0.1% to 3% by weight; for example, The content of the first rare earth material can be 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, 1.0% by weight, 1.5% by weight, 2 Weight percentage or 2.5 weight percentage, but not limited to this.

Preferably, based on the total weight of the main powder material, the first rare earth material and the micro-nanosilicon glass, the content of the micro-nanosilicon glass is 3 wt% to 20 wt%; for example, The content of the micro-nanosilicon glass can be 3 weight percent, 4 weight percent, 5 weight percent, 6 weight percent, 7 weight percent, 8 weight percent, 9 weight percent, 10 weight percent, 11 weight percent, 12 weight percent, 13% by weight, 14% by weight, 15% by weight, 16% by weight, 17% by weight, 18% by weight, 19% by weight, or 20% by weight, but not limited thereto. Preferably, the content of the micro-nanosilicate glass is 5 wt% to 15 wt%.

The present invention also provides a ceramic sintered body, which is formed by sintering the above-mentioned ceramic composition; wherein the ceramic sintered body has a plurality of pores, and the porosity of the ceramic sintered body is 5% to 20%.

According to the present invention, the cavity of the ceramic sintered body is a space formed by the grain boundaries of at least three crystal grains.

According to the present invention, the porosity is obtained by randomly selecting a cross section of the ceramic sintered body and observing and calculating with a scanning electron microscope. The porosity is expressed by the following formula: porosity (%)=VH/VT*100; where VH is the total area of all pores in the section, and VT is the total area of the section.

Since the ceramic sintered body has a plurality of pores, it can provide an oxygen transmission path in the oxidation treatment step of the sintering process. Therefore, an appropriate increase in porosity can increase the oxygen supplement efficiency and further improve the temperature coefficient of resistance (that is, the α value) of the ceramic sintered body Performance. Therefore, the present invention also further adjusts the porosity by adjusting the m value.

If the ceramic sintered body is too dense, the oxygen transmission path will be reduced and the oxygen supplement ability will be reduced, making the α value poor; on the contrary, if the porosity of the ceramic sintered body is too high, although there are more oxygen supplement paths Increase the value of α, but the problem of insufficient structural strength of the ceramic sintered body is prone to occur, and the failure of the subsequent dielectric performance test may occur due to the insufficient density of the ceramic sintered body structure. Therefore, preferably, the porosity of the ceramic sintered body is 5% to 20%. For example: the porosity can be 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19 % Or 20%.

According to the present invention, after the sintering of the ceramic composition is completed, the silicon dioxide component in the micro-nanosilicate glass will mainly gather in the pores of the ceramic sintered body to form solid particles, which is the glass phase. The glass phase can also be called a solid glass phase or a glass body, which helps to further reduce the resistance value and improve the α value performance of the ceramic sintered body.

Preferably, when the content of the micro-nanosilicate glass in the ceramic composition is more than 3% by weight, the resulting ceramic sintered body can obviously form a glass phase due to the sufficient silicon content.

The present invention also provides a laminated ceramic electronic component, which includes: a ceramic body including a plurality of the above-mentioned ceramic sintered bodies and a plurality of internal electrodes; wherein the ceramic sintered bodies and the internal electrodes are formed by overlapping each other. The ceramic body; and two external electrodes, which are respectively arranged on two opposite sides of the ceramic body and are electrically connected to the internal electrodes.

According to the present invention, two adjacent inner electrodes are electrically connected to opposite outer electrodes, respectively.

In the above-mentioned laminated ceramic electronic component, a plurality of internal electrodes are alternately laminated inside the ceramic body in a parallel manner, thereby achieving the function of reducing room temperature resistance.

Preferably, the internal electrodes include nickel (Ni).

Preferably, each of the external electrodes includes any one or a combination of silver (Ag), nickel, and tin (Sn). In some embodiments, each of the external electrodes is an electrode with a multilayer structure. For example, the external electrodes may be external electrodes with a three-layer structure, and the materials of the first to third external electrodes are silver, nickel, and tin in order.

Preferably, each of the inner electrodes is approximately perpendicular to the outer electrodes (90 degrees included).

Preferably, the above-mentioned laminated ceramic electronic component may further include two protective layers, and the protective layers are disposed on two opposite surfaces of the ceramic body, and the surfaces and the internal electrodes are parallel to each other. The protective layer can avoid the problem of over-plating when the laminated ceramic electronic components are electroplated to form external electrodes.

Preferably, the room temperature resistance value of the above-mentioned laminated ceramic electronic component is 1 ohm to 15 ohm, wherein the room temperature refers to 25°C.

Preferably, the temperature coefficient of resistance of the above-mentioned laminated ceramic electronic component is 4 ppm/°C to 10 ppm/°C.

Preferably, the Curie temperature of the laminated ceramic electronic component is 80°C to 110°C. For example, the Curie temperature of the laminated ceramic electronic component can be 80°C, 81°C, 82°C, 83°C, 84°C, 85°C, 86°C, 87°C, 88°C, 89°C, 90°C, 91℃、92℃、93℃、94℃、95℃、96℃、97℃、98℃、99℃、100℃、101℃、102℃、103℃、104℃、105℃、106℃、107℃ , 108℃, 109℃ or 110℃.

The present invention further provides an electrical appliance including the above-mentioned laminated ceramic electronic component.

10: Laminated ceramic electronic components

100: ceramic body

110: Ceramic sintered body

120: inner electrode

130, 140: side

150, 160: surface

170: Hole

180: glass phase

200, 300: external electrode

400: protective layer

S: thickness

FIG. 1 is a schematic diagram of a cross-section of a laminated ceramic electronic component of the present invention.

2A to 2L are electron micrographs of cross-sections of ceramic sintered bodies in the laminated ceramic electronic components of Examples 1 to 6 and Comparative Examples 1 to 6, respectively.

Several operation methods are provided below to illustrate the implementation of the present invention; those familiar with the art can easily understand the advantages and effects of the present invention through the content of this specification, and perform various operations without departing from the spirit of the present invention. Modifications and changes to implement or apply the content of the present invention.

"Ceramic Composition"

The following examples and comparative examples use the main powder material, the first rare earth material and micro-nanosilicate glass as starting materials, and the total weight of the starting materials of each embodiment and comparative example is fixed: the main powder material is 89.5 weight The percentage and the first rare earth material are both 0.5% by weight, and the micro-nanosilicate glass is both 10% by weight; the group with m value of 1 means that the main powder material uses only barium titanate, and the group with m value greater than 1 means that the main powder material is only barium titanate. In addition to barium titanate, the powder material also contains barium carbonate. The group with m value less than 1 means that the main powder material contains barium titanate and titanium dioxide; the main powder material in each embodiment and comparative example contains the first The types and content differences of the main powder are shown in Table 1.

Among them, Examples 2 to 6 and Comparative Examples 1 to 6 added strontium titanate to replace part of the barium titanate; Comparative Example 5 further added calcium titanate to replace part of the barium titanate.

The above-mentioned main powder materials are all commercially available products. Among them, the purity of barium titanate is 99.5%, the purity of barium carbonate is 99.9%, the purity of titanium dioxide is 99.5%, the purity of strontium titanate is 99.9%, and the purity of calcium titanate is 99.9%.

The above-mentioned first rare earth material is also a commercially available product, which is niobium oxide with a purity of 99.9%.

The aforementioned micro-nanosilica glass is also a commercially available product, and contains 98.6 weight percent of silicon dioxide, 0.4 weight percent of rare earth elements, and 1 weight percent of at least one of barium, strontium, calcium, and titanium.

The average particle size of the main powder material is 0.2 micron to 3 microns, and the average particle size of the micro-nanosilica glass is 30 nanometers to 3 microns.

"Ceramic sintered body and laminated ceramic electronic components containing the same"

After the above ceramic composition is prepared, toluene and alcohol are used as solvents. The amount of solvent added can be adjusted according to the required degree of dispersion. In addition, about 0.5 wt% to 0.75 wt% of the total weight of the starting materials is added. Dispersant (commodity model BYK-110, 111 and/or 115), and add about 25% to 30% by weight of the total weight of the starting materials as a polyvinyl butyral resin binder; combine all the above materials Put it into the ball mill together with the zirconium ball, and fully perform wet grinding. Mix to obtain ceramic slurry. Then use the doctor blade method to form the ceramic slurry into a sheet and then dry it at a drying temperature of about 50°C to 60°C; the drying time is adjusted according to the actual situation to obtain a roll of thin ribbon.

The nickel metal powder and the organic binder are dispersed together in an organic solvent to prepare internal electrode paste, and then the internal electrodes are printed on the thin strip by screen printing to form a thin strip with internal electrodes. Use thin strips without printed internal electrodes as the upper and lower covers, and sandwich the laminated structure formed by multiple thin strips with internal electrodes between the upper and lower covers; then, after the heat equalization step, use it again The cutting machine cuts out the ceramic green embryo. The green ceramic embryo with laminated structure is subjected to degreasing treatment at about 300°C for 24 hours in a protective atmosphere. The degreased ceramic green body is calcined in a nitrogen/hydrogen reducing atmosphere at 1250°C to 1380°C for about 1 hour to prepare a sintered ceramic body. The sintered ceramic body includes a plurality of sintered ribbons. The ceramic sintered body and the plurality of internal electrodes overlap each other, and the number of ceramic sintered body layers and the number of internal electrodes can be adjusted according to the thickness of the ribbon. The sintered ceramic body is subjected to piping and corner grinding, and then subjected to an oxidation treatment at 700°C to 900°C in an atmospheric environment to form a ceramic body. Coating the upper and lower surfaces of the ceramic body with a protective layer to form a protective layer parallel to the internal electrodes, and depositing silver on the left and right sides of the ceramic body to form external electrodes to form the laminated ceramic electronics Element, wherein the external electrodes are electrically connected to the internal electrodes.

As shown in FIG. 1, the laminated semiconductor ceramic electronic component 10 has a ceramic body 100, which includes a plurality of ceramic sintered bodies 110 and a plurality of internal electrodes 120, and the ceramic sintered bodies 110 and the internal electrodes 120 are formed by overlapping each other In the ceramic body 100; two external electrodes 200, 300, which are respectively disposed on two opposite sides 130, 140 of the ceramic body 100, and are electrically connected to the internal electrodes 120, and the two external electrodes 200, 300 and the internal The included angle of the electrode 120 is approximately 90 degrees; and two protective layers 400, which are respectively disposed on the upper and lower surfaces 150, 160 of the ceramic body, and are approximately parallel to the inner electrodes 120. In addition, two adjacent internal electrodes 120 are separated by the ceramic sintered body 110, and there is a thickness S between the two adjacent internal electrodes 120, which thickness S is less than 40 microns.

Characteristic analysis : Observe the microstructure of the cross-section of the ceramic sintered body formed by the ceramic compositions of the above-mentioned Examples 1 to 6 and Comparative Examples 1 to 6 with an electron microscope and calculate the porosity, and the results are listed in Table 2. Taking FIG. 2B as an example, the cross-section of the ceramic sintered body formed from the ceramic composition of Example 2 clearly shows that the ceramic sintered body not only has pores 170, but also a glass phase 180 is formed in some of the pores.

The room temperature resistance and α values of laminated ceramic electronic components including ceramic sintered bodies formed from the ceramic compositions of Examples 1 to 6 and Comparative Examples 1 to 6 were measured. The results are listed in Table 2; The length of the tested sample is 0.933 millimeters (mm), and the cross-sectional area is 2.396 square millimeters (mm ² ). The measurement is performed after the multilayer ceramic electronic component is deposited with silver as the external electrode according to the above steps.

The room temperature resistance measurement method is to apply voltage to the above-mentioned tested sample at room temperature (ie 25°C), and use a multimeter (brand: HIOKI, model: RM3545) to measure its current value to calculate the resistance value.

The method for measuring the value of α is to place the above-mentioned sample under test in a constant temperature bath, and while gradually increasing the temperature from 20°C to 250°C, convert the resistance value corresponding to each temperature according to the above method to obtain the resistance value -Temperature curve, based on which the temperature at which the resistance value is twice the room temperature resistance value, that is, the double point. Since the double point is the phase transition temperature at which the tested sample begins to exhibit PTC characteristics, and roughly approaches the Curie temperature (Tc), the room temperature and double point are respectively T1 and T2, and their respective resistance values Are R1 and R2, and calculate the value of α according to the formula α={In10×(LogR2-LogR1)/(T2-T1)×100).

In addition, the temperature corresponding to the resistance value of 2 times the room temperature (25°C) is the Curie temperature.

First, comparing the measurement results of room temperature resistance and α values of Examples 1 to 6 and Comparative Examples 1 to 6, it can be seen that by adjusting the composition of the main powder material and the m value range in its perovskite structure Multilayer ceramic electronic components have a lower room temperature resistance value and a higher α value. For example: From the comparison of Example 2, Examples 4 to 6, and Comparative Examples 1 to 4, and Comparative Example 6, it can be found that when the m value is between 1.02 and 1.05, the room temperature resistance value is lower than 15 ohms, and α Values are higher than 4ppm/℃, with excellent electrical performance. When the m value is in the range of 1.02 to 1.04, the room temperature resistance value of the laminated ceramic electronic component is lower than 8.5 ohms, and the α value is also higher than 4.3 ppm/°C. In addition, from the data of Examples 2 and 4 to 6, it can be seen that a porosity of 9% to 16% can provide sufficient oxygen supplementation efficiency, thus exhibiting excellent electrical performance.

In addition, it can be seen from the experimental results of Example 1 and Examples 2 and 3 that when the A site is all barium or a combination of barium and strontium, the room temperature resistance values are all lower than 6 ohms, and the α values are all higher than 4 ppm/ ℃, with excellent electrical performance.

Furthermore, from the comparison between Example 2 and Example 3, it can be found that when the total number of moles at the A position is 1 mole, regardless of the amount of strontium titanate added is 0.03 or 0.06 mole, its room temperature resistance Value is all It is lower than 6 ohms, and the alpha value is higher than 5ppm/℃. Based on this, it can be seen that when a small amount of strontium is substituted for barium at the A site, although the room temperature resistance value is slightly increased, the α value is also increased, and it still has excellent electrical performance.

From the experimental results of Comparative Examples 1 to 3 and Comparative Example 5, it can be found that when a small amount of calcium is substituted for barium, the room temperature resistance value of the multilayer ceramic electronic component is greatly increased, such as the room temperature resistance of Comparative Example 5. The value is as high as 5834 ohm, and the alpha value is only 2.4ppm/℃, less than 4ppm/℃, the electrical performance is extremely poor.

Finally, from the comparison of Examples 1 to 3, it can be found that when the A site contains strontium, the Curie temperature of the laminated ceramic electronic component can be further reduced from about 110°C to about 95°C or about 80°C.

In summary, the ceramic composition of the present invention, by adjusting the types of main powder materials, such as the types of barium and strontium, and setting the m value of the first main powder within a specific content range, does help to include The laminated ceramic electronic component of the sintered ceramic sintered body reduces its room temperature resistance value and increases its temperature coefficient of resistance, thereby obtaining a laminated ceramic electronic component with better electrical performance.

The above-mentioned embodiments are merely examples for the convenience of description, but this embodiment is not intended to limit the scope of patent application of the present invention; all other changes, modifications and other changes completed without departing from the disclosure of the present invention should be included in The invention covers the scope of patents.

10: Laminated ceramic electronic components

100: ceramic body

110: Ceramic sintered body

120: inner electrode

130, 140: side

150, 160: surface

200, 300: external electrode

400: protective layer

S: thickness

Claims (10)

A ceramic composition used for thermistor use, comprising: a main powder material, which contains a _{first main powder having a perovskite structure represented by the general formula A m} BO ₃ , wherein the A position is selected from barium, Strontium or a combination thereof, B-site is titanium, m is the molar ratio of A-site and B-site, and 1.02≦m≦1.05; the first rare earth material; and micro-nanosilicon glass. The use according to claim 1, wherein the main powder material further contains barium carbonate; based on the total content of the first main powder being 1 mol, the content of barium carbonate is 0.02 mol to 0.05 mol. The use according to claim 1 or 2, wherein the A site contains a combination of barium and strontium; based on the total number of moles of the A site being 1 mol, the content of strontium is greater than 0 mol to 0.06 mol. The use according to claim 1 or 2, wherein, based on the total weight of the main powder material, the first rare earth material and the micro-nanosilicate glass, the content of the main powder material is 77% by weight to 96.9 weight percent, the content of the first rare earth material is 0.1 weight percent to 3 weight percent, and the content of the micro-nanosilicate glass is 3 weight percent to 20 weight percent. The use according to claim 4, wherein the content of the micro-nanosilicate glass is 5 wt% to 15 wt%. A ceramic sintered body is used for thermistor, which is formed by sintering a ceramic composition; wherein, the ceramic composition includes: a main powder material, which contains a perovskite represented _{by the general formula A m} BO ₃ The first main powder of the mineral structure, wherein the A site is selected from barium, strontium or a combination thereof, the B site is titanium, and m is the molar ratio of the A site to the B site, and 1.02≦m≦1.05; the first rare earth material; And micro-nano silica glass; and the ceramic sintered body has a plurality of pores, and the porosity of the ceramic sintered body is 5% to 20%. The use as described in claim 6, wherein a glass phase is formed in some of the pores. A thermistor, comprising: a ceramic body comprising a ceramic sintered body and a plurality of internal electrodes; wherein the ceramic sintered body is sintered from a ceramic composition; wherein the ceramic composition contains: main powder material , Which contains a first main powder with a perovskite structure represented by the general formula A _m BO ₃ , wherein the A position is selected from barium, strontium or a combination thereof, the B position is titanium, and m is the combination of the A and B positions Mol ratio and 1.02≦m≦1.05; the first rare earth material; and micro-nanosilicate glass; and the ceramic sintered body has a plurality of pores, and the porosity of the ceramic sintered body is 5% to 20%; the ceramics The sintered body and the internal electrodes are overlapped and formed in the ceramic body; and two external electrodes are respectively arranged on two opposite sides of the ceramic body and are electrically connected to the internal electrodes. The thermistor described in claim 8 has a room temperature resistance value of 1 ohm to 15 ohms, and a temperature coefficient of resistance of 4 to 10 ppm/°C. The thermistor described in claim 9 has a Curie temperature of 80°C to 110°C.

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