TWI739244B - Server device - Google Patents
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本發明係關於一種伺服裝置,特別是一種具導風罩的伺服裝置。The invention relates to a servo device, in particular to a servo device with a wind deflector.
目前伺服器廣為各企業所使用,其發展的範圍結合了網際網路與電信業的應用,也深入到一般人生活中,例如金融、財經、網路銀行、網路信用卡的使用、人工智慧等,這些都必需靠著伺服器強大的運算能力才能做到。以人工智慧為例,因人工智慧技術需要更大量的運算處理,故需搭配大量的高效能顯示卡。不過,高效能顯示卡亦會隨之帶來大量的廢熱,若這些廢熱無法即時排出伺服器外,則累積的廢熱恐會造成高效能顯示卡的運算效能降低,甚或導致熱當。At present, the server is widely used by various enterprises, and its scope of development combines the applications of the Internet and telecommunications, and it also penetrates into the lives of ordinary people, such as finance, finance, online banking, the use of online credit cards, artificial intelligence, etc. , These must rely on the powerful computing power of the server to do it. Take artificial intelligence as an example. Because artificial intelligence technology requires a larger amount of computing processing, it needs to be equipped with a large number of high-performance graphics cards. However, the high-performance graphics card will also bring a lot of waste heat. If the waste heat cannot be discharged from the server immediately, the accumulated waste heat may reduce the computing performance of the high-performance graphics card, or even cause heat.
現有的作法是在伺服器內部與外部皆加設風扇,以加強流經高效能顯示卡的散熱氣流。不過,由於現有伺服器外部的風扇是直接裝設於機箱上,僅能針對單一顯示卡進行散熱,故若使用者所使用的機箱並無供外部風扇組裝之結構,則使用者恐需更換機箱,或是只能讓高效能顯示卡降速使用,才能避免高效能顯示卡熱當。The existing practice is to add fans both inside and outside the server to enhance the heat dissipation airflow through the high-performance graphics card. However, since the external fan of the existing server is directly installed on the chassis and can only dissipate heat for a single graphics card, if the chassis used by the user does not have a structure for external fan assembly, the user may need to replace the chassis , Or you can only use the high-performance graphics card at a slower speed to avoid the heat of the high-performance graphics card.
本發明在於提供一種伺服裝置,藉以解決傳統伺服裝置無法安裝外部風扇,或是僅能安裝特定外部風扇的問題。The present invention is to provide a servo device to solve the problem that the traditional servo device cannot be installed with an external fan or can only be installed with a specific external fan.
本發明之一實施例所揭露之伺服裝置包含一機箱、一電子組件、一導風罩及一氣流產生器。機箱具有一容置空間。電子組件包含一主機板及至少一張擴充卡。主機板位於容置空間。至少一張擴充卡包含相固定的一卡體及一擋板。卡體裝設於主機板。擋板固定於機箱。導風罩位於容置空間之外。導風罩具有一導風通道並裝設於至少一張擴充卡之該擋板。氣流產生器裝設於導風罩。其中,擋板或機箱具有至少一開孔,且至少一開孔連通容置空間與導風通道。The servo device disclosed in an embodiment of the present invention includes a chassis, an electronic component, a wind deflector, and an airflow generator. The case has an accommodating space. The electronic component includes a motherboard and at least one expansion card. The main board is located in the accommodating space. At least one expansion card includes a fixed card body and a baffle plate. The card body is installed on the motherboard. The baffle is fixed to the chassis. The wind deflector is located outside the accommodating space. The air guiding hood has an air guiding channel and is installed on the baffle of at least one expansion card. The air flow generator is installed on the wind deflector. Wherein, the baffle or the case has at least one opening, and the at least one opening communicates with the accommodating space and the air guide channel.
根據上述實施例之伺服裝置,因為本實施例之擴充卡之擋板增加結合孔之設計,故使用者可將擴充卡廠商販售的導風罩與氣流產生器直接裝設於擴充卡之擋板,使主機板上所有擴充卡產生的熱能能同時被導出機箱外部。如此一來,使用者不會因機箱的限制而犧牲掉導風罩與外部風扇之增設,也無需為了增設導風罩與外部風扇而更換原本的機箱。According to the servo device of the above-mentioned embodiment, because the baffle of the expansion card in this embodiment is designed with a coupling hole, the user can directly install the air deflector and airflow generator sold by the expansion card manufacturer on the expansion card's block. Board, so that the heat generated by all expansion cards on the main board can be exported to the outside of the chassis at the same time. In this way, the user will not sacrifice the addition of the air baffle and external fan due to the limitation of the case, and there is no need to replace the original case in order to add the air baffle and external fan.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.
請參閱圖1至圖2。圖1為根據本發明第一實施例所述之伺服裝置的平面示意圖。圖2為圖1之伺服裝置局部的分解示意圖。Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic plan view of the servo device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of a part of the servo device of Fig. 1.
本實施例之伺服裝置10包含一機箱100、一電子組件200、一導風罩300及一氣流產生器400。伺服裝置10還可以包含多個結合件500。The
機箱100例如包含一底板110、二側板120及一背板130。二側板120與背板130分別連接於底板110之相異側,且底板110、二側板120與背板130共同圍繞出一容置空間S1。背板130具有多個開槽131,且這些開槽131自其中一側板120朝另一側板120排列。開槽131的功用容後一併說明。The
電子組件200例如包含一主機板210及多張擴充卡220。主機板210位於容置空間S1內,並例如裝設有中央處理器、記憶體等電子元件。每一張擴充卡220例如包含相固定的一卡體221及一擋板222。卡體221例如直接插設於主機板210之擴充插槽並具有一連接埠2211。連接埠2211穿設於擋板222。擋板222例如透過螺絲固定於機箱100之背板130,且擋板222遮蓋住背板130之開槽131,以及連接埠2211透過開槽131而部分位於機箱100之外。此外,擋板222具有多個開孔2222,且這些開孔2222連通容置空間S1與機箱100之外的空間。開孔2222的功用容後一併說明。The
在本實施例中,擴充卡220以顯示卡為例,且連接埠2211例如為高畫質多媒體介面(HDMI)、DisplayPort(DP)、數位視訊介面(Digital Visual Interface,DVI)、VGA端子(Video Graphics Array connector)等影音訊號連接埠。In this embodiment, the
在本實施例中,伺服裝置10還可以包含多個前置散熱風扇60及一後置散熱風扇70。這些前置散熱風扇60位於容置空間S1,並裝設於擴充卡220遠離背板130之一側,且這些前置散熱風扇60所產生之散熱氣流用以吹向擴充卡220與主機板210上之其餘電子元件,以進一步提升伺服裝置10之解熱能力。後置散熱風扇70裝設於機箱100之背板130,且後置散熱風扇70所產生之散熱氣流用以吹向主機板210上之其餘電子元件,以對伺服裝置10之電子組件200進行解熱。不過,對於較高效能之電子組件200來說,由於較高效能之電子組件200所產生之廢熱較高,故若光靠前置散熱風扇60與後置散熱風扇70恐仍不足以解除電子組件200之廢熱時,則可更進一步藉由導風罩300及氣流產生器400來對電子組件200進行解熱。In this embodiment, the
詳細來說,導風罩300位於機箱100之外側。導風罩300具有一導風通道S2並裝設於位於相對兩側之兩張擴充卡220之二擋板222,使得導風通道S2透過擋板222上的這些開孔2222連通容置空間S1。具體來說,每一擋板222具有至少一個結合孔2221。在本實施例中,每一個擋板222以四個結合孔2221為例,以兩個為一組,共分成兩組,且兩組結合孔2221分別鄰近於擋板222之相對兩側。導風罩300包含多個遮蓋板310、二組裝板320及一固定框330。任二相鄰的遮蓋板310彼此相連,以令這些遮蓋板310共同圍繞出導風通道S2。固定框330連接這些遮蓋板310,且這些遮蓋板310遠離固定框330之一端共同圍繞形成入風口O1,而固定框330圍繞出出風口O2。容置空間S1依序連通入風口O1、導風通道S2及出風口O2。In detail, the
二組裝板320例如分別與位於相對兩側之二遮蓋板310相連接,並位於此二遮蓋板310相對遠離固定框330之一端。二組裝板320各具有至少一個穿孔321,本實施例是以二個穿孔321為例。這些結合件500例如為螺絲,且這些結合件500分別穿過二組裝板320之穿孔321,並分別結合於這些擴充卡220之這些擋板222中位於相對最外側的兩組結合孔2221,以令導風罩300組裝於位於相對兩側之兩張擴充卡220之二擋板222。For example, the two
氣流產生器400例如為風扇,並裝設於導風罩300之固定框330中。也就是說,氣流產生器400裝設於導風罩300之出風口O2。當氣流產生器400運轉時,氣流產生器400所產生之散熱氣流F會流經容置空間S1中的擴充卡220。接著,在散熱氣流F流經擴充卡220後,再流經開孔2222與導風通道S2,以將所有擴充卡220所產生之廢熱排出機箱100之外。The
由於上述擴充卡220之擋板222增加結合孔2221之設計,故若機箱100無供導風罩300組裝之結構,則導風罩300亦可組裝於擴充卡220之擋板222,以提升伺服裝置10的解熱能力。更進一步以實際狀況來進行說明。傳統伺服裝置10之機箱100並未設置有可供導風罩300連接的結構,因此無法設置導風罩300,除非更換機箱100,否則使用者並無法透過加裝導風罩300與外部風扇來提升伺服裝置10的散熱效能。反之,因為本實施例之擴充卡220之擋板222增加結合孔2221之設計,故使用者可將對應於擴充卡220尺寸的導風罩300與氣流產生器400直接裝設於擴充卡220之擋板222。如此一來,使用者不會因機箱100的限制而犧牲掉導風罩300與外部風扇之增設,也無需為了增設導風罩300與外部風扇而更換原本的機箱100。Since the
此外,當導風罩300組裝於擴充卡220之擋板222時,導風罩300之入風口O1較出風口O2靠近機箱100,且如圖1所示,每一遮蓋板310與入風口O1所處之平面E夾一銳角θ,使得導風通道S2之截面積隨遠離機箱100之方向漸縮,以令導風罩300之入風口O1的面積大於導風罩300之出風口O2的面積,且導風罩300之入風口O1對應多張擴充卡220。如此一來,伺服裝置10僅需單一個氣流產生器400,即可對多張擴充卡220進行解熱,進而減少伺服裝置10中風扇的設置成本。In addition, when the
在本實施例中,這些結合件500係以螺絲為例,但並不以此為限。在其他實施例中,這些結合件500亦可為鉚釘或扣具。此外,若機箱100內有裝設易受震動干擾的電子元件,則這些結合件500亦可具有減震功能,以進一步避免氣流產生器400運轉所產生之震動透過導風罩300傳遞至機箱100內部的電子元件。In this embodiment, these
在本實施例中,擋板222之結合孔2221分成兩組並分別鄰近於擋板222之相對兩側,但並不以此為限。在其他實施例中,擋板222之結合孔2221亦可僅為單組,並置中地位於擋板222,或是位於上方。In this embodiment, the coupling holes 2221 of the
在本實施例中,因擴充卡220的數量為多張,故導風罩300係裝設於位於最外面兩側之兩張擴充卡220之二擋板222,但並不以此為限,風罩300也可以僅裝設於特定未連接訊號連接線的擴充卡220。在其他實施例中,若擴充卡220的數量僅為單張,則導風罩300也可以僅裝設於單張擴充卡220。In this embodiment, because the number of
在本實施例中,連接埠2211的數量為單個,但並不以此為限。在其他實施例中,連接埠2211的數量也可以為多個。In this embodiment, the number of the
在本實施例中,卡體221例如直接插設於主機板210之擴充插槽,但並不以此為限。在其他實施例中,卡體221亦可透過軟排間接插設於主機板210之擴充插槽。In this embodiment, the
在本實施例中,僅擋板222具有開孔2222,但並不以此為限。在其他實施例中,亦可擋板222與機箱100皆具有開孔2222,或是僅機箱100具有開孔2222。In this embodiment, only the
上述之導風罩300為一體式結構,使得導風罩300之入風口O1的尺寸係呈固定,但並不以此為限。請參閱圖3至圖5。圖3為根據本發明第二實施例所述之導風罩與氣流產生器的分解示意圖。圖4為圖3之導風罩呈收合狀態的立體示意圖。圖5為圖3之導風罩呈展開狀態的立體示意圖。The
在本實施例中,導風罩300a包含一主罩體310a及二副罩體320a。主罩體310a包含一第一側板311a及二第二側板312a。二第二側板312a分別連接於第一側板311a之相對兩側,且氣流產生器400裝設於第一側板311a。每一副罩體320a包含一第三側板321a及二第四側板322a。二第四側板322a分別連接於第三側板321a之相對兩側,且第三側板321a遮蓋部分第一側板311a,以及二第四側板322a分別遮蓋部分二第二側板312a。此外,每一副罩體320a還可以包含一第五側板323a及一組裝板324a。第五側板323a銜接二第四側板322a,且組裝板324a連接於第五側板323a,並例如透過結合件結合於擴充卡之擋板。In this embodiment, the
由於二副罩體320a與主罩體310a間之組接關係皆相同,故先以其中一副罩體320a與主罩體310a間之組接關係來進行說明。本實施例之導風罩300a更包含二第一滑軌結構350a及二第二滑軌結構360a。二第一滑軌結構350a分別位於二第二側板312a遠離第一側板311a之一側。二第二滑軌結構360a分別位於其中一副罩體320a之二第四側板322a遠離第三側板321a之一側。第一滑軌結構350a與第二滑軌結構360a例如為相匹配之滑塊與滑槽,且二第二滑軌結構360a分別可滑動地設置於二第一滑軌結構350a,以令其中一副罩體320a可活動地設置於主罩體310a。同理,導風罩300a更包含另外的二第二滑軌結構360a。另外的二第二滑軌結構360a分別位於另一副罩體320a之二第四側板322a遠離第三側板321a之一側,且另外的二第二滑軌結構360a分別可滑動地設置於二第一滑軌結構350a,以令另一副罩體320a可活動地設置於主罩體310a。Since the assembling relationship between the two sub-covers 320a and the
從上述說明可知,二副罩體320a可活動地位於主罩體310a之相對兩側,且主罩體310a與二副罩體320a共同圍繞出入風口O1。二副罩體320a可相對主罩體310a活動以調整入風口O1的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向A調整副罩體320a與主罩體310a的相對位置關係,以令原本之入風口O1(如圖4所示)調大成入風口O1’(如圖5所示),使得入風口O1’的範圍涵蓋擴充卡的分佈區域。也就是說,當機箱內之擴充卡數量增加時,使用者可沿方向A將導風罩300a從收合狀態(如圖4所示)變更成展開狀態(如圖5所示)。It can be seen from the above description that the two
請參閱圖6至圖8。圖6為根據本發明第三實施例所述之導風罩與氣流產生器的分解示意圖。圖7為圖6之導風罩呈收合狀態的立體示意圖。圖8為圖6之導風罩呈展開狀態的立體示意圖。Please refer to Figure 6 to Figure 8. Fig. 6 is an exploded schematic diagram of the wind deflector and the air flow generator according to the third embodiment of the present invention. Fig. 7 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in a folded state. Fig. 8 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in an unfolded state.
在本實施例中,導風罩300b包含一主罩體310b及二副罩體320b。主罩體310b包含一第一側板311b及二第二側板312b。二第二側板312b分別連接於第一側板311b之相對兩側,且氣流產生器400裝設於第一側板311b。每一副罩體320b包含一第三側板321b及二第四側板322b。二第四側板322b分別連接於第三側板321b之相對兩側,且第三側板321b遮蓋部分第一側板311b,以及二第四側板322b分別遮蓋部分二第二側板312b。In this embodiment, the
由於二副罩體320b與主罩體310b間之組接關係皆相同,故先以其中一副罩體320b與主罩體310b間之組接關係來進行說明。本實施例之導風罩300b更包含一第一滑軌結構350b及一第二滑軌結構360b。第一滑軌結構350b位於第一側板311b。第二滑軌結構360b位於其中一副罩體320b之第三側板321b。第一滑軌結構350b與第二滑軌結構360b例如為相匹配之T形滑塊與T形滑槽,且第二滑軌結構360b可滑動地設置於第一滑軌結構350b,以令其中一副罩體320b可活動地設置於主罩體310b。同理,導風罩300b更包含另外的一第二滑軌結構360b。另外的第二滑軌結構360b位於另一副罩體320b之第三側板321b,且另外的第二滑軌結構360b可滑動地設置於第一滑軌結構350b,以令另一副罩體320b可活動地設置於主罩體310b。Since the assembly relationship between the two sub-covers 320b and the
從上述說明可知,二副罩體320b可活動地位於主罩體310b之相對兩側,且主罩體310b與二副罩體320b共同圍繞出入風口O1。二副罩體320b可相對主罩體310b活動以調整入風口O1的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向B調整副罩體320b與主罩體310b的相對位置關係,以令原本之入風口O1(如圖7所示)調大成入風口O1’(如圖8所示),使得入風口O1’的範圍涵蓋擴充卡的分佈區域。也就是說,當機箱內之擴充卡數量增加時,使用者可沿方向B將導風罩300b從收合狀態(如圖7所示)變更成展開狀態(如圖8所示)。It can be seen from the above description that the two sub-covers 320b are movably located on opposite sides of the
請參閱圖9至圖10。圖9為根據本發明第四實施例所述之導風罩搭配氣流產生器,且導風罩呈收合狀態的平面示意圖。圖10為圖9之導風罩呈展開狀態的平面示意圖。Please refer to Figure 9 to Figure 10. 9 is a schematic plan view of the air deflector according to the fourth embodiment of the present invention with an airflow generator, and the air deflector is in a folded state. Fig. 10 is a schematic plan view of the air duct of Fig. 9 in an unfolded state.
在本實施例中,導風罩300c包含一主罩體310c及二副罩體320c。由於二副罩體320c與主罩體310c間之組接關係皆相同,故先以其中一副罩體320c與主罩體310c間之組接關係來進行說明。本實施例之導風罩300c更包含一第一滑軌結構350c及一第二滑軌結構360c。第一滑軌結構350c設置於主罩體310c。第二滑軌結構360c設置於其中一副罩體320c。第一滑軌結構350c與第二滑軌結構360c例如為相匹配之滾輪與軌道,且第二滑軌結構360c可滑動地設置於第一滑軌結構350c,以令其中一副罩體320c可活動地設置於主罩體310c。同理,導風罩300更包含另外的一第一滑軌結構350c及一第二滑軌結構360c。另外的第一滑軌結構350c與第二滑軌結構360c分別設置於主罩體310c與另一副罩體320c,且另外的第二滑軌結構360c可滑動地設置於另外的第一滑軌結構350c,以令另一副罩體320c可活動地設置於主罩體310c。In this embodiment, the
從上述說明可知,二副罩體320c可活動地位於主罩體310c之相對兩側,且主罩體310c與二副罩體320c共同圍繞出入風口。二副罩體320c可相對主罩體310c活動以調整入風口的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向C調整副罩體320c與主罩體310c的相對位置關係,以將導風罩300c從收合狀態(如圖9所示)變更成展開狀態(如圖10所示)。It can be seen from the above description that the two sub-covers 320c are movably located on opposite sides of the
上述本實施例中,副罩體的數量為二,且二副罩體分別位於主罩體的相對兩側,但並不以此為限。在其他實施例中,副罩體的數量也可以為單個,僅位於主罩體之其中一側。In the foregoing embodiment, the number of sub-covers is two, and the two sub-covers are respectively located on opposite sides of the main cover, but it is not limited to this. In other embodiments, the number of sub-covers can also be single, which is located only on one side of the main cover.
請參閱圖11至圖12。圖11為根據本發明第五實施例之伺服裝置局部的平面示意圖。圖12為圖11之蓋體遮蓋開口的平面示意圖。本實施例之伺服裝置10d除了原本之機箱100d、導風罩300d及氣流產生器400d,還可以包含至少一外部連接器380d。導風罩300d具有一開口370d及一蓋體390d。外部連接器380d固定於導風罩300d之開口370d,並電性連接於擴充卡222d之連接埠2211d。蓋體390d可活動地設置於導風罩300d之開口370d,以遮蓋或顯露外部連接器380d。如圖11所示,在有螢幕或電視等外部電子裝置搭接需求時,蓋體390d可沿方向D移動而令外部連接器380d曝露於外,使得外部電子裝置的訊號連接線得以插接於外部連接器380d。反之,如圖12所示,在無外部電子裝置搭接需求時,蓋體390d可沿方向D之反向移動而令外部連接器380d被蓋體390d遮蓋。Please refer to Figure 11 to Figure 12. FIG. 11 is a schematic plan view of a part of a servo device according to a fifth embodiment of the present invention. Fig. 12 is a schematic plan view of the cover of Fig. 11 covering the opening. The
當然,上述實施例之導風罩300d可以僅具有一開口370d及一蓋體390d,在有外部電子裝置搭接需求時,可打開蓋體390d,使訊號連接線能夠穿過開口370d,直接與擴充卡之連接埠連接。Of course, the
根據上述實施例之伺服裝置,因為本實施例之擴充卡之擋板增加結合孔之設計,故使用者可將擴充卡廠商販售的導風罩與氣流產生器直接裝設於擴充卡之擋板。如此一來,使用者不會因機箱的限制而犧牲掉導風罩與外部風扇之增設,也無需為了增設導風罩與外部風扇而更換原本的機箱。According to the servo device of the above-mentioned embodiment, because the baffle of the expansion card in this embodiment is designed with a coupling hole, the user can directly install the air deflector and airflow generator sold by the expansion card manufacturer on the expansion card's block. plate. In this way, the user will not sacrifice the addition of the air baffle and external fan due to the limitation of the case, and there is no need to replace the original case in order to add the air baffle and external fan.
在至少部分實施例中,由於導風罩之入風口的面積大於導風罩之出風口的面積,且導風罩之入風口對應多張擴充卡。如此一來,伺服裝置僅需單一個氣流產生器,即可對多張擴充卡進行解熱,進而減少伺服裝置中風扇的設置成本。In at least some embodiments, the area of the air inlet of the air guide is larger than the area of the air outlet of the air guide, and the air inlet of the air guide corresponds to multiple expansion cards. In this way, the servo device only needs a single airflow generator to deheat multiple expansion cards, thereby reducing the installation cost of the fan in the servo device.
在至少部分實施例中,由於副罩體可活動地位於主罩體,且主罩體與二副罩體共同圍繞出入風口,故若機箱內裝設之擴充卡的數量增加或減少時,則使用者可調整副罩體與主罩體的相對位置關係,以令入風口的範圍涵蓋擴充卡的分佈區域。In at least some embodiments, since the sub-cover is movably located in the main cover, and the main cover and the two sub-covers surround the air inlet and outlet together, if the number of expansion cards installed in the chassis increases or decreases, then The user can adjust the relative positional relationship between the secondary cover and the main cover, so that the range of the air inlet covers the distribution area of the expansion card.
在至少部分實施例中,由於外部連接器固定於導風罩之開口,以便於外部電子裝置電性連接於擴充卡。In at least some embodiments, the external connector is fixed to the opening of the wind deflector so that the external electronic device is electrically connected to the expansion card.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.
10、10d:伺服裝置
60:前置散熱風扇
70:後置散熱風扇
100、100d:機箱
110:底板
120:側板
130:背板
131:開槽
200:電子組件
210:主機板
220:擴充卡
221:卡體
2211、2211d:連接埠
222、222d:擋板
2221:結合孔
2222:開孔
300、300a、300b、300c、300d:導風罩
310:遮蓋板
320:組裝板
321:穿孔
330:固定框
310a、310b、310c:主罩體
311a、311b:第一側板
312a、312b:第二側板
320a、320b、320c:副罩體
321a、321b:第三側板
322a、322b:第四側板
323a:第五側板
324a:組裝板
350a、350b、350c:第一滑軌結構
360a、360b、360c:第二滑軌結構
370d:開口
380d:外部連接器
390d:蓋體
400、400d:氣流產生器
500:結合件
θ:銳角
O1、O1’:入風口
O2:出風口
S1:容置空間
S2:導風通道
A~D:方向
E:平面
F:散熱氣流10.10d: Servo device
60: Front cooling fan
70:
圖1為根據本發明第一實施例所述之伺服裝置的平面示意圖。 圖2為圖1之伺服裝置局部的分解示意圖。 圖3為根據本發明第二實施例所述之導風罩與氣流產生器的分解示意圖。 圖4為圖3之導風罩呈收合狀態的立體示意圖。 圖5為圖3之導風罩呈展開狀態的立體示意圖。 圖6為根據本發明第三實施例所述之導風罩與氣流產生器的分解示意圖。 圖7為圖6之導風罩呈收合狀態的立體示意圖。 圖8為圖6之導風罩呈展開狀態的立體示意圖。 圖9為根據本發明第四實施例所述之導風罩搭配氣流產生器,且導風罩呈收合狀態的平面示意圖。 圖10為圖9之導風罩呈展開狀態的平面示意圖。 圖11為根據本發明第五實施例之伺服裝置局部的平面示意圖。 圖12為圖11之蓋體遮蓋開口的平面示意圖。FIG. 1 is a schematic plan view of the servo device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of a part of the servo device of Fig. 1. Fig. 3 is an exploded schematic view of the wind deflector and the air flow generator according to the second embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in a folded state. Fig. 5 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in an unfolded state. Fig. 6 is an exploded schematic diagram of the wind deflector and the air flow generator according to the third embodiment of the present invention. Fig. 7 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in a folded state. Fig. 8 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in an unfolded state. 9 is a schematic plan view of the air deflector according to the fourth embodiment of the present invention with an airflow generator, and the air deflector is in a folded state. Fig. 10 is a schematic plan view of the air duct of Fig. 9 in an unfolded state. FIG. 11 is a schematic plan view of a part of a servo device according to a fifth embodiment of the present invention. Fig. 12 is a schematic plan view of the cover of Fig. 11 covering the opening.
10:伺服裝置10: Servo device
60:前置散熱風扇60: Front cooling fan
70:後置散熱風扇70: Rear cooling fan
100:機箱100: Chassis
110:底板110: bottom plate
120:側板120: side panel
130:背板130: backplane
200:電子組件200: Electronic components
210:主機板210: Motherboard
220:擴充卡220: Expansion card
300:導風罩300: Wind hood
310:遮蓋板310: Cover plate
400:氣流產生器400: Airflow generator
θ:銳角θ: acute angle
O1:入風口O1: Air inlet
E:平面E: plane
F:散熱氣流F: Cooling airflow
Claims (13)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM303613U (en) * | 2006-06-07 | 2006-12-21 | Compucase Entpr Co Ltd | Airflow guiding conduit device for computer host |
TWM353406U (en) * | 2008-11-04 | 2009-03-21 | Chenbro Micom Co Ltd | Adjustable airflow guiding cover |
TW201427541A (en) * | 2012-12-29 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Computer enclosure and cooling module |
TW201443383A (en) * | 2013-05-08 | 2014-11-16 | Hon Hai Prec Ind Co Ltd | Air duct |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM303613U (en) * | 2006-06-07 | 2006-12-21 | Compucase Entpr Co Ltd | Airflow guiding conduit device for computer host |
TWM353406U (en) * | 2008-11-04 | 2009-03-21 | Chenbro Micom Co Ltd | Adjustable airflow guiding cover |
TW201427541A (en) * | 2012-12-29 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Computer enclosure and cooling module |
TW201443383A (en) * | 2013-05-08 | 2014-11-16 | Hon Hai Prec Ind Co Ltd | Air duct |
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