TWI739244B - Server device - Google Patents

Server device Download PDF

Info

Publication number
TWI739244B
TWI739244B TW108146839A TW108146839A TWI739244B TW I739244 B TWI739244 B TW I739244B TW 108146839 A TW108146839 A TW 108146839A TW 108146839 A TW108146839 A TW 108146839A TW I739244 B TWI739244 B TW I739244B
Authority
TW
Taiwan
Prior art keywords
cover
air
slide rail
servo device
wind deflector
Prior art date
Application number
TW108146839A
Other languages
Chinese (zh)
Other versions
TW202126153A (en
Inventor
劉俊宏
林家鴻
陳貴閔
Original Assignee
技嘉科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 技嘉科技股份有限公司 filed Critical 技嘉科技股份有限公司
Priority to TW108146839A priority Critical patent/TWI739244B/en
Publication of TW202126153A publication Critical patent/TW202126153A/en
Application granted granted Critical
Publication of TWI739244B publication Critical patent/TWI739244B/en

Links

Images

Abstract

A server device includes a case, an electronic assembly, a deflector and an airflow product. The case has a space. The electronic assembly includes a mother board and at least one expansion card. The mother board is in the space. The at least one expansion card includes a card body and a baffle mounting on the card body. The card body disposes on the mother board. The baffle fixes on the case. The deflector is out of the space. The deflector has wind guide channel and mounts on the baffle of the at least one expansion card. The airflow product mounts on the deflector. Wherein the baffle or the case has at least one opening and the at least one opening connects with the space and the wind guide channel.

Description

伺服裝置Servo device

本發明係關於一種伺服裝置,特別是一種具導風罩的伺服裝置。The invention relates to a servo device, in particular to a servo device with a wind deflector.

目前伺服器廣為各企業所使用,其發展的範圍結合了網際網路與電信業的應用,也深入到一般人生活中,例如金融、財經、網路銀行、網路信用卡的使用、人工智慧等,這些都必需靠著伺服器強大的運算能力才能做到。以人工智慧為例,因人工智慧技術需要更大量的運算處理,故需搭配大量的高效能顯示卡。不過,高效能顯示卡亦會隨之帶來大量的廢熱,若這些廢熱無法即時排出伺服器外,則累積的廢熱恐會造成高效能顯示卡的運算效能降低,甚或導致熱當。At present, the server is widely used by various enterprises, and its scope of development combines the applications of the Internet and telecommunications, and it also penetrates into the lives of ordinary people, such as finance, finance, online banking, the use of online credit cards, artificial intelligence, etc. , These must rely on the powerful computing power of the server to do it. Take artificial intelligence as an example. Because artificial intelligence technology requires a larger amount of computing processing, it needs to be equipped with a large number of high-performance graphics cards. However, the high-performance graphics card will also bring a lot of waste heat. If the waste heat cannot be discharged from the server immediately, the accumulated waste heat may reduce the computing performance of the high-performance graphics card, or even cause heat.

現有的作法是在伺服器內部與外部皆加設風扇,以加強流經高效能顯示卡的散熱氣流。不過,由於現有伺服器外部的風扇是直接裝設於機箱上,僅能針對單一顯示卡進行散熱,故若使用者所使用的機箱並無供外部風扇組裝之結構,則使用者恐需更換機箱,或是只能讓高效能顯示卡降速使用,才能避免高效能顯示卡熱當。The existing practice is to add fans both inside and outside the server to enhance the heat dissipation airflow through the high-performance graphics card. However, since the external fan of the existing server is directly installed on the chassis and can only dissipate heat for a single graphics card, if the chassis used by the user does not have a structure for external fan assembly, the user may need to replace the chassis , Or you can only use the high-performance graphics card at a slower speed to avoid the heat of the high-performance graphics card.

本發明在於提供一種伺服裝置,藉以解決傳統伺服裝置無法安裝外部風扇,或是僅能安裝特定外部風扇的問題。The present invention is to provide a servo device to solve the problem that the traditional servo device cannot be installed with an external fan or can only be installed with a specific external fan.

本發明之一實施例所揭露之伺服裝置包含一機箱、一電子組件、一導風罩及一氣流產生器。機箱具有一容置空間。電子組件包含一主機板及至少一張擴充卡。主機板位於容置空間。至少一張擴充卡包含相固定的一卡體及一擋板。卡體裝設於主機板。擋板固定於機箱。導風罩位於容置空間之外。導風罩具有一導風通道並裝設於至少一張擴充卡之該擋板。氣流產生器裝設於導風罩。其中,擋板或機箱具有至少一開孔,且至少一開孔連通容置空間與導風通道。The servo device disclosed in an embodiment of the present invention includes a chassis, an electronic component, a wind deflector, and an airflow generator. The case has an accommodating space. The electronic component includes a motherboard and at least one expansion card. The main board is located in the accommodating space. At least one expansion card includes a fixed card body and a baffle plate. The card body is installed on the motherboard. The baffle is fixed to the chassis. The wind deflector is located outside the accommodating space. The air guiding hood has an air guiding channel and is installed on the baffle of at least one expansion card. The air flow generator is installed on the wind deflector. Wherein, the baffle or the case has at least one opening, and the at least one opening communicates with the accommodating space and the air guide channel.

根據上述實施例之伺服裝置,因為本實施例之擴充卡之擋板增加結合孔之設計,故使用者可將擴充卡廠商販售的導風罩與氣流產生器直接裝設於擴充卡之擋板,使主機板上所有擴充卡產生的熱能能同時被導出機箱外部。如此一來,使用者不會因機箱的限制而犧牲掉導風罩與外部風扇之增設,也無需為了增設導風罩與外部風扇而更換原本的機箱。According to the servo device of the above-mentioned embodiment, because the baffle of the expansion card in this embodiment is designed with a coupling hole, the user can directly install the air deflector and airflow generator sold by the expansion card manufacturer on the expansion card's block. Board, so that the heat generated by all expansion cards on the main board can be exported to the outside of the chassis at the same time. In this way, the user will not sacrifice the addition of the air baffle and external fan due to the limitation of the case, and there is no need to replace the original case in order to add the air baffle and external fan.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

請參閱圖1至圖2。圖1為根據本發明第一實施例所述之伺服裝置的平面示意圖。圖2為圖1之伺服裝置局部的分解示意圖。Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic plan view of the servo device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of a part of the servo device of Fig. 1.

本實施例之伺服裝置10包含一機箱100、一電子組件200、一導風罩300及一氣流產生器400。伺服裝置10還可以包含多個結合件500。The servo device 10 of this embodiment includes a chassis 100, an electronic component 200, a wind deflector 300, and an airflow generator 400. The servo device 10 may also include a plurality of coupling members 500.

機箱100例如包含一底板110、二側板120及一背板130。二側板120與背板130分別連接於底板110之相異側,且底板110、二側板120與背板130共同圍繞出一容置空間S1。背板130具有多個開槽131,且這些開槽131自其中一側板120朝另一側板120排列。開槽131的功用容後一併說明。The chassis 100 includes, for example, a bottom plate 110, two side plates 120, and a back plate 130. The two side plates 120 and the back plate 130 are respectively connected to different sides of the bottom plate 110, and the bottom plate 110, the two side plates 120 and the back plate 130 jointly surround an accommodating space S1. The back plate 130 has a plurality of slots 131, and the slots 131 are arranged from one side plate 120 to the other side plate 120. The function of the slot 131 will be described later.

電子組件200例如包含一主機板210及多張擴充卡220。主機板210位於容置空間S1內,並例如裝設有中央處理器、記憶體等電子元件。每一張擴充卡220例如包含相固定的一卡體221及一擋板222。卡體221例如直接插設於主機板210之擴充插槽並具有一連接埠2211。連接埠2211穿設於擋板222。擋板222例如透過螺絲固定於機箱100之背板130,且擋板222遮蓋住背板130之開槽131,以及連接埠2211透過開槽131而部分位於機箱100之外。此外,擋板222具有多個開孔2222,且這些開孔2222連通容置空間S1與機箱100之外的空間。開孔2222的功用容後一併說明。The electronic component 200 includes, for example, a motherboard 210 and a plurality of expansion cards 220. The motherboard 210 is located in the accommodating space S1, and is equipped with electronic components such as a central processing unit and a memory, for example. Each expansion card 220 includes, for example, a card body 221 and a baffle 222 that are fixed to each other. The card body 221 is, for example, directly inserted into the expansion slot of the motherboard 210 and has a connection port 2211. The connecting port 2211 passes through the baffle 222. The baffle 222 is fixed to the back plate 130 of the chassis 100 by screws, for example, and the baffle 222 covers the slot 131 of the back plate 130, and the connection port 2211 is partially located outside the chassis 100 through the slot 131. In addition, the baffle 222 has a plurality of openings 2222, and these openings 2222 communicate with the accommodating space S1 and the space outside the chassis 100. The function of the opening 2222 will be described later.

在本實施例中,擴充卡220以顯示卡為例,且連接埠2211例如為高畫質多媒體介面(HDMI)、DisplayPort(DP)、數位視訊介面(Digital Visual Interface,DVI)、VGA端子(Video Graphics Array connector)等影音訊號連接埠。In this embodiment, the expansion card 220 takes a display card as an example, and the port 2211 is, for example, a high-definition multimedia interface (HDMI), a DisplayPort (DP), a digital visual interface (DVI), a VGA terminal (Video Graphics Array connector) and other video and audio signal ports.

在本實施例中,伺服裝置10還可以包含多個前置散熱風扇60及一後置散熱風扇70。這些前置散熱風扇60位於容置空間S1,並裝設於擴充卡220遠離背板130之一側,且這些前置散熱風扇60所產生之散熱氣流用以吹向擴充卡220與主機板210上之其餘電子元件,以進一步提升伺服裝置10之解熱能力。後置散熱風扇70裝設於機箱100之背板130,且後置散熱風扇70所產生之散熱氣流用以吹向主機板210上之其餘電子元件,以對伺服裝置10之電子組件200進行解熱。不過,對於較高效能之電子組件200來說,由於較高效能之電子組件200所產生之廢熱較高,故若光靠前置散熱風扇60與後置散熱風扇70恐仍不足以解除電子組件200之廢熱時,則可更進一步藉由導風罩300及氣流產生器400來對電子組件200進行解熱。In this embodiment, the servo device 10 may further include a plurality of front cooling fans 60 and a rear cooling fan 70. The front cooling fans 60 are located in the accommodating space S1 and are installed on the expansion card 220 on a side away from the backplane 130, and the heat dissipation airflow generated by the front cooling fans 60 is used to blow the expansion card 220 and the motherboard 210 The rest of the electronic components above can further enhance the anti-heat capability of the servo device 10. The rear cooling fan 70 is installed on the back plate 130 of the chassis 100, and the heat dissipation airflow generated by the rear cooling fan 70 is used to blow the remaining electronic components on the motherboard 210 to de-heat the electronic components 200 of the servo device 10 . However, for a higher-performance electronic component 200, since the higher-performance electronic component 200 generates higher waste heat, the front cooling fan 60 and the rear cooling fan 70 may not be enough to remove the electronic components. When the waste heat is 200, the air guide 300 and the air flow generator 400 can be used to further deheat the electronic component 200.

詳細來說,導風罩300位於機箱100之外側。導風罩300具有一導風通道S2並裝設於位於相對兩側之兩張擴充卡220之二擋板222,使得導風通道S2透過擋板222上的這些開孔2222連通容置空間S1。具體來說,每一擋板222具有至少一個結合孔2221。在本實施例中,每一個擋板222以四個結合孔2221為例,以兩個為一組,共分成兩組,且兩組結合孔2221分別鄰近於擋板222之相對兩側。導風罩300包含多個遮蓋板310、二組裝板320及一固定框330。任二相鄰的遮蓋板310彼此相連,以令這些遮蓋板310共同圍繞出導風通道S2。固定框330連接這些遮蓋板310,且這些遮蓋板310遠離固定框330之一端共同圍繞形成入風口O1,而固定框330圍繞出出風口O2。容置空間S1依序連通入風口O1、導風通道S2及出風口O2。In detail, the wind deflector 300 is located on the outer side of the chassis 100. The air guiding hood 300 has an air guiding channel S2 and is installed on the two baffles 222 of the two expansion cards 220 located on opposite sides, so that the air guiding channel S2 communicates with the accommodating space S1 through the openings 2222 on the baffle 222 . Specifically, each baffle 222 has at least one coupling hole 2221. In this embodiment, each baffle 222 takes four coupling holes 2221 as an example, and two groups are taken as a group, divided into two groups, and the two sets of coupling holes 2221 are respectively adjacent to opposite sides of the baffle 222. The wind deflector 300 includes a plurality of cover plates 310, two assembly plates 320 and a fixing frame 330. Any two adjacent cover plates 310 are connected to each other, so that these cover plates 310 collectively surround the air guiding channel S2. The fixing frame 330 is connected to the covering plates 310, and one end of the covering plates 310 away from the fixing frame 330 collectively surrounds the air inlet O1, and the fixing frame 330 surrounds the air outlet O2. The accommodating space S1 is connected to the air inlet O1, the air guide channel S2 and the air outlet O2 in sequence.

二組裝板320例如分別與位於相對兩側之二遮蓋板310相連接,並位於此二遮蓋板310相對遠離固定框330之一端。二組裝板320各具有至少一個穿孔321,本實施例是以二個穿孔321為例。這些結合件500例如為螺絲,且這些結合件500分別穿過二組裝板320之穿孔321,並分別結合於這些擴充卡220之這些擋板222中位於相對最外側的兩組結合孔2221,以令導風罩300組裝於位於相對兩側之兩張擴充卡220之二擋板222。For example, the two assembly plates 320 are respectively connected to two cover plates 310 located on opposite sides, and are located at one end of the two cover plates 310 relatively far away from the fixed frame 330. Each of the two assembly plates 320 has at least one perforation 321, and this embodiment takes two perforations 321 as an example. The coupling members 500 are, for example, screws, and the coupling members 500 respectively pass through the through holes 321 of the two assembling boards 320, and are respectively coupled to the two sets of coupling holes 2221 located at the relatively outermost sides of the baffles 222 of the expansion cards 220. The wind deflector 300 is assembled to the second baffle 222 of the two expansion cards 220 located on opposite sides.

氣流產生器400例如為風扇,並裝設於導風罩300之固定框330中。也就是說,氣流產生器400裝設於導風罩300之出風口O2。當氣流產生器400運轉時,氣流產生器400所產生之散熱氣流F會流經容置空間S1中的擴充卡220。接著,在散熱氣流F流經擴充卡220後,再流經開孔2222與導風通道S2,以將所有擴充卡220所產生之廢熱排出機箱100之外。The air flow generator 400 is, for example, a fan, and is installed in the fixed frame 330 of the wind deflector 300. In other words, the airflow generator 400 is installed at the air outlet O2 of the wind deflector 300. When the airflow generator 400 operates, the heat dissipation airflow F generated by the airflow generator 400 flows through the expansion card 220 in the accommodating space S1. Then, after the heat dissipation airflow F flows through the expansion card 220, it then flows through the opening 2222 and the air guiding channel S2, so as to discharge all the waste heat generated by the expansion card 220 out of the chassis 100.

由於上述擴充卡220之擋板222增加結合孔2221之設計,故若機箱100無供導風罩300組裝之結構,則導風罩300亦可組裝於擴充卡220之擋板222,以提升伺服裝置10的解熱能力。更進一步以實際狀況來進行說明。傳統伺服裝置10之機箱100並未設置有可供導風罩300連接的結構,因此無法設置導風罩300,除非更換機箱100,否則使用者並無法透過加裝導風罩300與外部風扇來提升伺服裝置10的散熱效能。反之,因為本實施例之擴充卡220之擋板222增加結合孔2221之設計,故使用者可將對應於擴充卡220尺寸的導風罩300與氣流產生器400直接裝設於擴充卡220之擋板222。如此一來,使用者不會因機箱100的限制而犧牲掉導風罩300與外部風扇之增設,也無需為了增設導風罩300與外部風扇而更換原本的機箱100。Since the baffle 222 of the expansion card 220 is designed with a coupling hole 2221, if the chassis 100 does not have a structure for the air baffle 300 to be assembled, the air baffle 300 can also be assembled on the baffle 222 of the expansion card 220 to enhance the servo The anti-heat capability of the device 10. Furthermore, the actual situation will be explained. The chassis 100 of the conventional servo device 10 is not provided with a structure for connecting the wind deflector 300, so the wind deflector 300 cannot be installed. Unless the chassis 100 is replaced, the user cannot install the wind deflector 300 and an external fan. The heat dissipation performance of the servo device 10 is improved. On the contrary, because the baffle 222 of the expansion card 220 of this embodiment is designed with a coupling hole 2221, the user can directly install the air deflector 300 and the air flow generator 400 corresponding to the size of the expansion card 220 on the expansion card 220 Baffle 222. In this way, the user will not sacrifice the addition of the air deflector 300 and the external fan due to the limitation of the case 100, and there is no need to replace the original case 100 in order to add the air deflector 300 and the external fan.

此外,當導風罩300組裝於擴充卡220之擋板222時,導風罩300之入風口O1較出風口O2靠近機箱100,且如圖1所示,每一遮蓋板310與入風口O1所處之平面E夾一銳角θ,使得導風通道S2之截面積隨遠離機箱100之方向漸縮,以令導風罩300之入風口O1的面積大於導風罩300之出風口O2的面積,且導風罩300之入風口O1對應多張擴充卡220。如此一來,伺服裝置10僅需單一個氣流產生器400,即可對多張擴充卡220進行解熱,進而減少伺服裝置10中風扇的設置成本。In addition, when the air deflector 300 is assembled to the baffle 222 of the expansion card 220, the air inlet O1 of the air deflector 300 is closer to the chassis 100 than the air outlet O2, and as shown in FIG. 1, each cover plate 310 and the air inlet O1 An acute angle θ is included in the plane E, so that the cross-sectional area of the air guide channel S2 is gradually reduced in the direction away from the chassis 100, so that the area of the air inlet O1 of the air guide 300 is larger than the area of the air outlet O2 of the air guide 300 , And the air inlet O1 of the wind deflector 300 corresponds to multiple expansion cards 220. In this way, the servo device 10 only needs a single airflow generator 400 to deheat multiple expansion cards 220, thereby reducing the installation cost of the fan in the servo device 10.

在本實施例中,這些結合件500係以螺絲為例,但並不以此為限。在其他實施例中,這些結合件500亦可為鉚釘或扣具。此外,若機箱100內有裝設易受震動干擾的電子元件,則這些結合件500亦可具有減震功能,以進一步避免氣流產生器400運轉所產生之震動透過導風罩300傳遞至機箱100內部的電子元件。In this embodiment, these coupling members 500 are screws as an example, but are not limited to this. In other embodiments, these coupling members 500 may also be rivets or fasteners. In addition, if electronic components that are susceptible to vibration are installed in the chassis 100, these coupling members 500 can also have a shock absorption function to further prevent the vibration generated by the operation of the airflow generator 400 from being transmitted to the chassis 100 through the air deflector 300 Internal electronic components.

在本實施例中,擋板222之結合孔2221分成兩組並分別鄰近於擋板222之相對兩側,但並不以此為限。在其他實施例中,擋板222之結合孔2221亦可僅為單組,並置中地位於擋板222,或是位於上方。In this embodiment, the coupling holes 2221 of the baffle 222 are divided into two groups and are respectively adjacent to opposite sides of the baffle 222, but it is not limited thereto. In other embodiments, the coupling holes 2221 of the baffle 222 may be only a single group, and are located in the middle of the baffle 222 or on the upper side.

在本實施例中,因擴充卡220的數量為多張,故導風罩300係裝設於位於最外面兩側之兩張擴充卡220之二擋板222,但並不以此為限,風罩300也可以僅裝設於特定未連接訊號連接線的擴充卡220。在其他實施例中,若擴充卡220的數量僅為單張,則導風罩300也可以僅裝設於單張擴充卡220。In this embodiment, because the number of expansion cards 220 is multiple, the wind deflector 300 is installed on the two baffles 222 of the two expansion cards 220 located on the outermost sides, but it is not limited to this. The windshield 300 can also be installed only on the specific expansion card 220 that is not connected to the signal cable. In other embodiments, if the number of expansion cards 220 is only a single, the wind deflector 300 can also be installed on only a single expansion card 220.

在本實施例中,連接埠2211的數量為單個,但並不以此為限。在其他實施例中,連接埠2211的數量也可以為多個。In this embodiment, the number of the connection port 2211 is single, but it is not limited thereto. In other embodiments, the number of the connection ports 2211 can also be multiple.

在本實施例中,卡體221例如直接插設於主機板210之擴充插槽,但並不以此為限。在其他實施例中,卡體221亦可透過軟排間接插設於主機板210之擴充插槽。In this embodiment, the card body 221 is directly inserted into the expansion slot of the motherboard 210, but it is not limited to this. In other embodiments, the card body 221 can also be inserted into the expansion slot of the motherboard 210 indirectly through a flexible strip.

在本實施例中,僅擋板222具有開孔2222,但並不以此為限。在其他實施例中,亦可擋板222與機箱100皆具有開孔2222,或是僅機箱100具有開孔2222。In this embodiment, only the baffle 222 has an opening 2222, but it is not limited to this. In other embodiments, both the baffle 222 and the chassis 100 may have the opening 2222, or only the chassis 100 may have the opening 2222.

上述之導風罩300為一體式結構,使得導風罩300之入風口O1的尺寸係呈固定,但並不以此為限。請參閱圖3至圖5。圖3為根據本發明第二實施例所述之導風罩與氣流產生器的分解示意圖。圖4為圖3之導風罩呈收合狀態的立體示意圖。圖5為圖3之導風罩呈展開狀態的立體示意圖。The aforementioned wind deflector 300 is an integrated structure, so that the size of the air inlet O1 of the wind deflector 300 is fixed, but it is not limited to this. Please refer to Figure 3 to Figure 5. Fig. 3 is an exploded schematic view of the wind deflector and the air flow generator according to the second embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in a folded state. Fig. 5 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in an unfolded state.

在本實施例中,導風罩300a包含一主罩體310a及二副罩體320a。主罩體310a包含一第一側板311a及二第二側板312a。二第二側板312a分別連接於第一側板311a之相對兩側,且氣流產生器400裝設於第一側板311a。每一副罩體320a包含一第三側板321a及二第四側板322a。二第四側板322a分別連接於第三側板321a之相對兩側,且第三側板321a遮蓋部分第一側板311a,以及二第四側板322a分別遮蓋部分二第二側板312a。此外,每一副罩體320a還可以包含一第五側板323a及一組裝板324a。第五側板323a銜接二第四側板322a,且組裝板324a連接於第五側板323a,並例如透過結合件結合於擴充卡之擋板。In this embodiment, the air guide cover 300a includes a main cover 310a and two sub-covers 320a. The main cover 310a includes a first side plate 311a and two second side plates 312a. The two second side plates 312a are respectively connected to opposite sides of the first side plate 311a, and the airflow generator 400 is installed on the first side plate 311a. Each secondary cover 320a includes a third side plate 321a and two fourth side plates 322a. The two fourth side plates 322a are respectively connected to opposite sides of the third side plate 321a, and the third side plate 321a covers a part of the first side plate 311a, and the two fourth side plates 322a respectively cover a part of the second side plate 312a. In addition, each secondary cover 320a may further include a fifth side plate 323a and an assembly plate 324a. The fifth side plate 323a is connected to the two fourth side plates 322a, and the assembly plate 324a is connected to the fifth side plate 323a, and is coupled to the baffle plate of the expansion card, for example, through a coupling member.

由於二副罩體320a與主罩體310a間之組接關係皆相同,故先以其中一副罩體320a與主罩體310a間之組接關係來進行說明。本實施例之導風罩300a更包含二第一滑軌結構350a及二第二滑軌結構360a。二第一滑軌結構350a分別位於二第二側板312a遠離第一側板311a之一側。二第二滑軌結構360a分別位於其中一副罩體320a之二第四側板322a遠離第三側板321a之一側。第一滑軌結構350a與第二滑軌結構360a例如為相匹配之滑塊與滑槽,且二第二滑軌結構360a分別可滑動地設置於二第一滑軌結構350a,以令其中一副罩體320a可活動地設置於主罩體310a。同理,導風罩300a更包含另外的二第二滑軌結構360a。另外的二第二滑軌結構360a分別位於另一副罩體320a之二第四側板322a遠離第三側板321a之一側,且另外的二第二滑軌結構360a分別可滑動地設置於二第一滑軌結構350a,以令另一副罩體320a可活動地設置於主罩體310a。Since the assembling relationship between the two sub-covers 320a and the main cover 310a is the same, the assembling relationship between one of the sub-covers 320a and the main cover 310a will be described first. The wind deflector 300a of this embodiment further includes two first slide rail structures 350a and two second slide rail structures 360a. The two first sliding rail structures 350a are respectively located on one side of the two second side plates 312a away from the first side plate 311a. The two second slide rail structures 360a are respectively located on one side of the second side plate 322a of the second cover 320a away from the third side plate 321a. The first slide rail structure 350a and the second slide rail structure 360a are, for example, matching sliders and slide grooves, and the two second slide rail structures 360a are respectively slidably disposed on the two first slide rail structures 350a, so that one of them The auxiliary cover 320a is movably disposed on the main cover 310a. Similarly, the wind deflector 300a further includes two other second slide rail structures 360a. The other two second slide rail structures 360a are respectively located on one side of the second fourth side plate 322a of the other sub-cover 320a away from the third side plate 321a, and the other two second slide rail structures 360a are respectively slidably disposed on the second side plate 321a. A sliding rail structure 350a enables the other auxiliary cover 320a to be movably disposed on the main cover 310a.

從上述說明可知,二副罩體320a可活動地位於主罩體310a之相對兩側,且主罩體310a與二副罩體320a共同圍繞出入風口O1。二副罩體320a可相對主罩體310a活動以調整入風口O1的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向A調整副罩體320a與主罩體310a的相對位置關係,以令原本之入風口O1(如圖4所示)調大成入風口O1’(如圖5所示),使得入風口O1’的範圍涵蓋擴充卡的分佈區域。也就是說,當機箱內之擴充卡數量增加時,使用者可沿方向A將導風罩300a從收合狀態(如圖4所示)變更成展開狀態(如圖5所示)。It can be seen from the above description that the two sub-covers 320a are movably located on opposite sides of the main cover 310a, and the main cover 310a and the two sub-covers 320a jointly surround the air inlet and outlet O1. The second cover 320a can move relative to the main cover 310a to adjust the area of the air inlet O1. For example, if the number of expansion cards installed in the chassis increases, the user can adjust the relative positional relationship between the secondary cover 320a and the main cover 310a along the direction A to make the original air inlet O1 (as shown in Figure 4 As shown), adjust the air inlet O1' (as shown in FIG. 5) so that the range of the air inlet O1' covers the distribution area of the expansion card. That is, when the number of expansion cards in the chassis increases, the user can change the wind deflector 300a from the folded state (as shown in FIG. 4) to the unfolded state (as shown in FIG. 5) along the direction A.

請參閱圖6至圖8。圖6為根據本發明第三實施例所述之導風罩與氣流產生器的分解示意圖。圖7為圖6之導風罩呈收合狀態的立體示意圖。圖8為圖6之導風罩呈展開狀態的立體示意圖。Please refer to Figure 6 to Figure 8. Fig. 6 is an exploded schematic diagram of the wind deflector and the air flow generator according to the third embodiment of the present invention. Fig. 7 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in a folded state. Fig. 8 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in an unfolded state.

在本實施例中,導風罩300b包含一主罩體310b及二副罩體320b。主罩體310b包含一第一側板311b及二第二側板312b。二第二側板312b分別連接於第一側板311b之相對兩側,且氣流產生器400裝設於第一側板311b。每一副罩體320b包含一第三側板321b及二第四側板322b。二第四側板322b分別連接於第三側板321b之相對兩側,且第三側板321b遮蓋部分第一側板311b,以及二第四側板322b分別遮蓋部分二第二側板312b。In this embodiment, the wind deflector 300b includes a main cover 310b and two auxiliary covers 320b. The main cover 310b includes a first side plate 311b and two second side plates 312b. The two second side plates 312b are respectively connected to opposite sides of the first side plate 311b, and the airflow generator 400 is installed on the first side plate 311b. Each secondary cover 320b includes a third side plate 321b and two fourth side plates 322b. The two fourth side plates 322b are respectively connected to opposite sides of the third side plate 321b, and the third side plate 321b covers a part of the first side plate 311b, and the two fourth side plates 322b respectively cover a part of the second side plate 312b.

由於二副罩體320b與主罩體310b間之組接關係皆相同,故先以其中一副罩體320b與主罩體310b間之組接關係來進行說明。本實施例之導風罩300b更包含一第一滑軌結構350b及一第二滑軌結構360b。第一滑軌結構350b位於第一側板311b。第二滑軌結構360b位於其中一副罩體320b之第三側板321b。第一滑軌結構350b與第二滑軌結構360b例如為相匹配之T形滑塊與T形滑槽,且第二滑軌結構360b可滑動地設置於第一滑軌結構350b,以令其中一副罩體320b可活動地設置於主罩體310b。同理,導風罩300b更包含另外的一第二滑軌結構360b。另外的第二滑軌結構360b位於另一副罩體320b之第三側板321b,且另外的第二滑軌結構360b可滑動地設置於第一滑軌結構350b,以令另一副罩體320b可活動地設置於主罩體310b。Since the assembly relationship between the two sub-covers 320b and the main cover 310b is the same, the assembly relationship between one of the sub-covers 320b and the main cover 310b will be described first. The wind deflector 300b of this embodiment further includes a first slide rail structure 350b and a second slide rail structure 360b. The first slide rail structure 350b is located on the first side plate 311b. The second slide rail structure 360b is located on the third side plate 321b of one of the secondary covers 320b. The first slide rail structure 350b and the second slide rail structure 360b are, for example, matching T-shaped sliders and T-shaped slide grooves, and the second slide rail structure 360b is slidably disposed on the first slide rail structure 350b to make the A secondary cover 320b is movably disposed on the main cover 310b. Similarly, the wind deflector 300b further includes another second slide rail structure 360b. The other second slide rail structure 360b is located on the third side plate 321b of the other secondary cover 320b, and the other second slide rail structure 360b is slidably disposed on the first slide rail structure 350b, so that the other secondary cover 320b It is movably arranged on the main cover 310b.

從上述說明可知,二副罩體320b可活動地位於主罩體310b之相對兩側,且主罩體310b與二副罩體320b共同圍繞出入風口O1。二副罩體320b可相對主罩體310b活動以調整入風口O1的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向B調整副罩體320b與主罩體310b的相對位置關係,以令原本之入風口O1(如圖7所示)調大成入風口O1’(如圖8所示),使得入風口O1’的範圍涵蓋擴充卡的分佈區域。也就是說,當機箱內之擴充卡數量增加時,使用者可沿方向B將導風罩300b從收合狀態(如圖7所示)變更成展開狀態(如圖8所示)。It can be seen from the above description that the two sub-covers 320b are movably located on opposite sides of the main cover 310b, and the main cover 310b and the two sub-covers 320b jointly surround the air inlet and outlet O1. The second cover 320b can move relative to the main cover 310b to adjust the area of the air inlet O1. For example, if the number of expansion cards installed in the chassis increases, the user can adjust the relative positional relationship between the secondary cover 320b and the main cover 310b in the direction B to make the original air inlet O1 (as shown in FIG. 7 As shown), the air inlet O1' is enlarged (as shown in FIG. 8), so that the range of the air inlet O1' covers the distribution area of the expansion card. That is, when the number of expansion cards in the chassis increases, the user can change the wind deflector 300b from the folded state (as shown in FIG. 7) to the unfolded state (as shown in FIG. 8) along the direction B.

請參閱圖9至圖10。圖9為根據本發明第四實施例所述之導風罩搭配氣流產生器,且導風罩呈收合狀態的平面示意圖。圖10為圖9之導風罩呈展開狀態的平面示意圖。Please refer to Figure 9 to Figure 10. 9 is a schematic plan view of the air deflector according to the fourth embodiment of the present invention with an airflow generator, and the air deflector is in a folded state. Fig. 10 is a schematic plan view of the air duct of Fig. 9 in an unfolded state.

在本實施例中,導風罩300c包含一主罩體310c及二副罩體320c。由於二副罩體320c與主罩體310c間之組接關係皆相同,故先以其中一副罩體320c與主罩體310c間之組接關係來進行說明。本實施例之導風罩300c更包含一第一滑軌結構350c及一第二滑軌結構360c。第一滑軌結構350c設置於主罩體310c。第二滑軌結構360c設置於其中一副罩體320c。第一滑軌結構350c與第二滑軌結構360c例如為相匹配之滾輪與軌道,且第二滑軌結構360c可滑動地設置於第一滑軌結構350c,以令其中一副罩體320c可活動地設置於主罩體310c。同理,導風罩300更包含另外的一第一滑軌結構350c及一第二滑軌結構360c。另外的第一滑軌結構350c與第二滑軌結構360c分別設置於主罩體310c與另一副罩體320c,且另外的第二滑軌結構360c可滑動地設置於另外的第一滑軌結構350c,以令另一副罩體320c可活動地設置於主罩體310c。In this embodiment, the wind deflector 300c includes a main cover 310c and two auxiliary covers 320c. Since the assembly relationship between the two sub-covers 320c and the main cover 310c is the same, the assembly relationship between one of the sub-covers 320c and the main cover 310c will be described first. The wind deflector 300c of this embodiment further includes a first slide rail structure 350c and a second slide rail structure 360c. The first slide rail structure 350c is disposed on the main cover 310c. The second slide rail structure 360c is disposed in one of the sub-covers 320c. The first slide rail structure 350c and the second slide rail structure 360c are, for example, matching rollers and rails, and the second slide rail structure 360c is slidably disposed on the first slide rail structure 350c, so that one of the secondary covers 320c can be It is movably provided on the main cover 310c. Similarly, the wind deflector 300 further includes another first slide rail structure 350c and a second slide rail structure 360c. The other first slide rail structure 350c and the second slide rail structure 360c are respectively disposed on the main cover 310c and the other secondary cover 320c, and the other second slide rail structure 360c is slidably disposed on the other first slide rail The structure 350c allows another auxiliary cover 320c to be movably disposed on the main cover 310c.

從上述說明可知,二副罩體320c可活動地位於主罩體310c之相對兩側,且主罩體310c與二副罩體320c共同圍繞出入風口。二副罩體320c可相對主罩體310c活動以調整入風口的面積。舉例是說,若機箱內裝設之擴充卡的數量增加時,則使用者可沿方向C調整副罩體320c與主罩體310c的相對位置關係,以將導風罩300c從收合狀態(如圖9所示)變更成展開狀態(如圖10所示)。It can be seen from the above description that the two sub-covers 320c are movably located on opposite sides of the main cover 310c, and the main cover 310c and the two sub-covers 320c jointly surround the air inlet and outlet. The second cover 320c can move relative to the main cover 310c to adjust the area of the air inlet. For example, if the number of expansion cards installed in the chassis increases, the user can adjust the relative positional relationship between the sub-cover 320c and the main cover 310c along the direction C, so as to remove the wind deflector 300c from the folded state ( As shown in Figure 9) change to the unfolded state (as shown in Figure 10).

上述本實施例中,副罩體的數量為二,且二副罩體分別位於主罩體的相對兩側,但並不以此為限。在其他實施例中,副罩體的數量也可以為單個,僅位於主罩體之其中一側。In the foregoing embodiment, the number of sub-covers is two, and the two sub-covers are respectively located on opposite sides of the main cover, but it is not limited to this. In other embodiments, the number of sub-covers can also be single, which is located only on one side of the main cover.

請參閱圖11至圖12。圖11為根據本發明第五實施例之伺服裝置局部的平面示意圖。圖12為圖11之蓋體遮蓋開口的平面示意圖。本實施例之伺服裝置10d除了原本之機箱100d、導風罩300d及氣流產生器400d,還可以包含至少一外部連接器380d。導風罩300d具有一開口370d及一蓋體390d。外部連接器380d固定於導風罩300d之開口370d,並電性連接於擴充卡222d之連接埠2211d。蓋體390d可活動地設置於導風罩300d之開口370d,以遮蓋或顯露外部連接器380d。如圖11所示,在有螢幕或電視等外部電子裝置搭接需求時,蓋體390d可沿方向D移動而令外部連接器380d曝露於外,使得外部電子裝置的訊號連接線得以插接於外部連接器380d。反之,如圖12所示,在無外部電子裝置搭接需求時,蓋體390d可沿方向D之反向移動而令外部連接器380d被蓋體390d遮蓋。Please refer to Figure 11 to Figure 12. FIG. 11 is a schematic plan view of a part of a servo device according to a fifth embodiment of the present invention. Fig. 12 is a schematic plan view of the cover of Fig. 11 covering the opening. The servo device 10d of this embodiment may include at least one external connector 380d in addition to the original chassis 100d, the wind deflector 300d, and the air flow generator 400d. The wind deflector 300d has an opening 370d and a cover 390d. The external connector 380d is fixed to the opening 370d of the wind deflector 300d, and is electrically connected to the connection port 2211d of the expansion card 222d. The cover 390d can be movably disposed in the opening 370d of the wind deflector 300d to cover or expose the external connector 380d. As shown in FIG. 11, when there is a need to connect an external electronic device such as a screen or a TV, the cover 390d can move along the direction D to expose the external connector 380d, so that the signal connection line of the external electronic device can be plugged in External connector 380d. On the contrary, as shown in FIG. 12, when there is no need to connect the external electronic device, the cover 390d can move in the opposite direction of the direction D so that the external connector 380d is covered by the cover 390d.

當然,上述實施例之導風罩300d可以僅具有一開口370d及一蓋體390d,在有外部電子裝置搭接需求時,可打開蓋體390d,使訊號連接線能夠穿過開口370d,直接與擴充卡之連接埠連接。Of course, the wind deflector 300d of the above embodiment may only have an opening 370d and a cover 390d. When an external electronic device is required to overlap, the cover 390d can be opened so that the signal connection line can pass through the opening 370d and directly connect with The port connection of the expansion card.

根據上述實施例之伺服裝置,因為本實施例之擴充卡之擋板增加結合孔之設計,故使用者可將擴充卡廠商販售的導風罩與氣流產生器直接裝設於擴充卡之擋板。如此一來,使用者不會因機箱的限制而犧牲掉導風罩與外部風扇之增設,也無需為了增設導風罩與外部風扇而更換原本的機箱。According to the servo device of the above-mentioned embodiment, because the baffle of the expansion card in this embodiment is designed with a coupling hole, the user can directly install the air deflector and airflow generator sold by the expansion card manufacturer on the expansion card's block. plate. In this way, the user will not sacrifice the addition of the air baffle and external fan due to the limitation of the case, and there is no need to replace the original case in order to add the air baffle and external fan.

在至少部分實施例中,由於導風罩之入風口的面積大於導風罩之出風口的面積,且導風罩之入風口對應多張擴充卡。如此一來,伺服裝置僅需單一個氣流產生器,即可對多張擴充卡進行解熱,進而減少伺服裝置中風扇的設置成本。In at least some embodiments, the area of the air inlet of the air guide is larger than the area of the air outlet of the air guide, and the air inlet of the air guide corresponds to multiple expansion cards. In this way, the servo device only needs a single airflow generator to deheat multiple expansion cards, thereby reducing the installation cost of the fan in the servo device.

在至少部分實施例中,由於副罩體可活動地位於主罩體,且主罩體與二副罩體共同圍繞出入風口,故若機箱內裝設之擴充卡的數量增加或減少時,則使用者可調整副罩體與主罩體的相對位置關係,以令入風口的範圍涵蓋擴充卡的分佈區域。In at least some embodiments, since the sub-cover is movably located in the main cover, and the main cover and the two sub-covers surround the air inlet and outlet together, if the number of expansion cards installed in the chassis increases or decreases, then The user can adjust the relative positional relationship between the secondary cover and the main cover, so that the range of the air inlet covers the distribution area of the expansion card.

在至少部分實施例中,由於外部連接器固定於導風罩之開口,以便於外部電子裝置電性連接於擴充卡。In at least some embodiments, the external connector is fixed to the opening of the wind deflector so that the external electronic device is electrically connected to the expansion card.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10、10d:伺服裝置 60:前置散熱風扇 70:後置散熱風扇 100、100d:機箱 110:底板 120:側板 130:背板 131:開槽 200:電子組件 210:主機板 220:擴充卡 221:卡體 2211、2211d:連接埠 222、222d:擋板 2221:結合孔 2222:開孔 300、300a、300b、300c、300d:導風罩 310:遮蓋板 320:組裝板 321:穿孔 330:固定框 310a、310b、310c:主罩體 311a、311b:第一側板 312a、312b:第二側板 320a、320b、320c:副罩體 321a、321b:第三側板 322a、322b:第四側板 323a:第五側板 324a:組裝板 350a、350b、350c:第一滑軌結構 360a、360b、360c:第二滑軌結構 370d:開口 380d:外部連接器 390d:蓋體 400、400d:氣流產生器 500:結合件 θ:銳角 O1、O1’:入風口 O2:出風口 S1:容置空間 S2:導風通道 A~D:方向 E:平面 F:散熱氣流10.10d: Servo device 60: Front cooling fan 70: Rear cooling fan 100, 100d: chassis 110: bottom plate 120: side panel 130: backplane 131: Slotting 200: Electronic components 210: Motherboard 220: Expansion card 221: Card Body 2211, 2211d: port 222, 222d: baffle 2221: Combination hole 2222: Hole 300, 300a, 300b, 300c, 300d: wind deflector 310: Cover plate 320: assembly board 321: Piercing 330: fixed frame 310a, 310b, 310c: main cover 311a, 311b: first side panel 312a, 312b: second side panel 320a, 320b, 320c: sub-cover 321a, 321b: third side panel 322a, 322b: fourth side panel 323a: Fifth side panel 324a: assembly board 350a, 350b, 350c: the first slide rail structure 360a, 360b, 360c: second slide rail structure 370d: opening 380d: External connector 390d: cover 400, 400d: airflow generator 500: Combination θ: acute angle O1, O1’: Air inlet O2: Air outlet S1: Housing space S2: Air duct A~D: Direction E: plane F: Cooling airflow

圖1為根據本發明第一實施例所述之伺服裝置的平面示意圖。 圖2為圖1之伺服裝置局部的分解示意圖。 圖3為根據本發明第二實施例所述之導風罩與氣流產生器的分解示意圖。 圖4為圖3之導風罩呈收合狀態的立體示意圖。 圖5為圖3之導風罩呈展開狀態的立體示意圖。 圖6為根據本發明第三實施例所述之導風罩與氣流產生器的分解示意圖。 圖7為圖6之導風罩呈收合狀態的立體示意圖。 圖8為圖6之導風罩呈展開狀態的立體示意圖。 圖9為根據本發明第四實施例所述之導風罩搭配氣流產生器,且導風罩呈收合狀態的平面示意圖。 圖10為圖9之導風罩呈展開狀態的平面示意圖。 圖11為根據本發明第五實施例之伺服裝置局部的平面示意圖。 圖12為圖11之蓋體遮蓋開口的平面示意圖。FIG. 1 is a schematic plan view of the servo device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of a part of the servo device of Fig. 1. Fig. 3 is an exploded schematic view of the wind deflector and the air flow generator according to the second embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in a folded state. Fig. 5 is a three-dimensional schematic diagram of the wind deflector of Fig. 3 in an unfolded state. Fig. 6 is an exploded schematic diagram of the wind deflector and the air flow generator according to the third embodiment of the present invention. Fig. 7 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in a folded state. Fig. 8 is a three-dimensional schematic diagram of the wind deflector of Fig. 6 in an unfolded state. 9 is a schematic plan view of the air deflector according to the fourth embodiment of the present invention with an airflow generator, and the air deflector is in a folded state. Fig. 10 is a schematic plan view of the air duct of Fig. 9 in an unfolded state. FIG. 11 is a schematic plan view of a part of a servo device according to a fifth embodiment of the present invention. Fig. 12 is a schematic plan view of the cover of Fig. 11 covering the opening.

10:伺服裝置10: Servo device

60:前置散熱風扇60: Front cooling fan

70:後置散熱風扇70: Rear cooling fan

100:機箱100: Chassis

110:底板110: bottom plate

120:側板120: side panel

130:背板130: backplane

200:電子組件200: Electronic components

210:主機板210: Motherboard

220:擴充卡220: Expansion card

300:導風罩300: Wind hood

310:遮蓋板310: Cover plate

400:氣流產生器400: Airflow generator

θ:銳角θ: acute angle

O1:入風口O1: Air inlet

E:平面E: plane

F:散熱氣流F: Cooling airflow

Claims (13)

一種伺服裝置,包含:一機箱,具有一容置空間;一電子組件,包含一主機板及至少一張擴充卡,該主機板位於該容置空間,該至少一張擴充卡包含相固定的一卡體及一擋板,該卡體裝設於該主機板,該擋板固定於該機箱;一導風罩,位於該容置空間之外,該導風罩具有一導風通道並裝設於該至少一張擴充卡之該擋板,該導風罩具有相對的一入風口及一出風口,該入風口的範圍涵蓋該至少一張擴充卡的分佈區域;以及一氣流產生器,裝設於該導風罩;其中,該擋板或該機箱具有至少一開孔,且該至少一開孔連通該容置空間與該導風通道,該氣流產生器所產生之散熱氣流會流經該容置空間中的該至少一張擴充卡。 A servo device includes: a chassis with an accommodating space; an electronic component, including a motherboard and at least one expansion card, the motherboard is located in the accommodating space, and the at least one expansion card includes a fixed one A card body and a baffle, the card body is installed on the main board, the baffle is fixed to the chassis; a wind deflector is located outside the accommodating space, the wind deflector has an air duct and is installed In the baffle of the at least one expansion card, the air duct has an air inlet and an air outlet opposite to each other, and the range of the air inlet covers the distribution area of the at least one expansion card; and an airflow generator is installed Set in the air guide; wherein, the baffle or the chassis has at least one opening, and the at least one opening communicates with the accommodating space and the air guide channel, and the heat dissipation airflow generated by the airflow generator will flow through The at least one expansion card in the accommodating space. 如申請專利範圍第1項所述之伺服裝置,其中該入風口較該出風口靠近該機箱,且該氣流產生器裝設於該出風口。 In the servo device described in item 1 of the scope of patent application, the air inlet is closer to the chassis than the air outlet, and the airflow generator is installed at the air outlet. 如申請專利範圍第2項所述之伺服裝置,其中該導風罩包含多個遮蓋板及一固定框,該這些遮蓋板共同圍繞出該導風通道,該固定框連接於該這些遮蓋板之一端,且該這些遮蓋板遠離該固定框之一端共同圍繞出該入風口,以及該固定框圍繞出該出風口。 As for the servo device described in item 2 of the scope of patent application, the air deflector includes a plurality of cover plates and a fixed frame, the cover plates collectively surround the air guiding channel, and the fixed frame is connected to the cover plates One end and one end of the cover plates away from the fixed frame jointly surround the air inlet and outlet, and the fixed frame surrounds the air outlet. 如申請專利範圍第3項所述之伺服裝置,其中,且每一該遮蓋板與該入風口所處之平面夾一銳角,以令該導風罩之該入風口的面積大於該導風罩之該出風口的面積。 The servo device described in item 3 of the scope of patent application, wherein each of the cover plates and the plane where the air inlet is located at an acute angle, so that the area of the air inlet of the air hood is larger than the air hood The area of the air outlet. 如申請專利範圍第2項所述之伺服裝置,其中該導風罩包含一主罩體及至少一副罩體,該至少一副罩體可活動地設置於該主罩體之一側,且該主罩體與該至少一副罩體共同圍繞出該入風口,該至少一副罩體可相對該主罩體活動以調整該入風口的面積。 The servo device described in item 2 of the scope of patent application, wherein the wind deflector includes a main cover and at least one auxiliary cover, the at least one auxiliary cover is movably arranged on one side of the main cover, and The main cover and the at least one auxiliary cover jointly surround the air inlet, and the at least one auxiliary cover can move relative to the main cover to adjust the area of the air inlet. 如申請專利範圍第5項所述之伺服裝置,其中該至少一副罩體的數量為二,該二副罩體分別可活動地設置於該主罩體的相對兩側。 For the servo device described in item 5 of the scope of patent application, wherein the number of the at least one sub-cover is two, and the two sub-covers are respectively movably arranged on opposite sides of the main cover. 如申請專利範圍第5項所述之伺服裝置,其中該主罩體包含一第一側板及二第二側板,該氣流產生器裝設於該第一側板,該二第二側板分別連接於該第一側板之相對兩側,該至少一副罩體包含一第三側板及二第四側板,該二第四側板分別連接於該第三側板之相對兩側,且該第三側板遮蓋部分該第一側板,該二第四側板分別遮蓋部分該二第二側板。 For the servo device described in item 5 of the scope of patent application, the main cover includes a first side plate and two second side plates, the airflow generator is installed on the first side plate, and the two second side plates are respectively connected to the On opposite sides of the first side panel, the at least one auxiliary cover includes a third side panel and two fourth side panels. The two fourth side panels are respectively connected to opposite sides of the third side panel, and the third side panel covers part of the The first side plate, and the two fourth side plates respectively cover part of the two second side plates. 如申請專利範圍第7項所述之伺服裝置,其中該導風罩更包含二第一滑軌結構及二第二滑軌結構,該二第一滑軌結構分別位於該二第二側板遠離該第一側板之一側,該二第二滑軌結構分別位於該二第四側板遠離該第三側板之一側,且該二第二滑軌結構分別可滑動地設置於該二第一滑軌結構。 For the servo device described in item 7 of the scope of patent application, the wind deflector further includes two first slide rail structures and two second slide rail structures, and the two first slide rail structures are respectively located on the two second side plates away from the One side of the first side plate, the two second slide rail structures are respectively located on a side of the two fourth side plates away from the third side plate, and the two second slide rail structures are respectively slidably disposed on the two first slide rails structure. 如申請專利範圍第7項所述之伺服裝置,其中該導風罩更包含一第一滑軌結構及一第二滑軌結構,該第一滑軌結構位於該第一側板,該第二滑軌結構位於該第三側板,且該第二滑軌結構可滑動地設置於該第一滑軌結構。 For the servo device described in claim 7, wherein the wind deflector further includes a first slide rail structure and a second slide rail structure, the first slide rail structure is located on the first side plate, and the second slide rail structure The rail structure is located on the third side plate, and the second slide rail structure is slidably disposed on the first slide rail structure. 如申請專利範圍第1項所述之伺服裝置,更包含至少一外部連接器,該卡體具有至少一連接埠,該卡體之該至少一連接埠穿設該擋 板,該導風罩具有一開口,該外部連接器固定於該導風罩之該開口,並電性連接於該連接埠。 For example, the servo device described in item 1 of the scope of patent application further includes at least one external connector, the card body has at least one connection port, and the at least one connection port of the card body penetrates the block Board, the air guide has an opening, the external connector is fixed to the opening of the air guide, and is electrically connected to the connection port. 如申請專利範圍第10項所述之伺服裝置,更包含一蓋體,該蓋體可活動地設置於該導風罩之該開口,以遮蓋或顯露該外部連接器。 For example, the servo device described in item 10 of the scope of patent application further includes a cover that can be movably arranged on the opening of the wind deflector to cover or expose the external connector. 如申請專利範圍第1項所述之伺服裝置,更包含多個結合件,該導風罩具有多個穿孔,該至少一張擴充卡具有多個結合孔,該這些結合件分別穿設該這些穿孔,並分別結合於該至少一張擴充卡之該這些結合孔。 For example, the servo device described in item 1 of the scope of the patent application further includes a plurality of coupling members, the wind deflector has a plurality of perforations, the at least one expansion card has a plurality of coupling holes, and the coupling members respectively pass through the Perforations are respectively combined with the combining holes of the at least one expansion card. 如申請專利範圍第12項所述之伺服裝置,其中每一該這些結合件為螺絲、鉚釘或扣具。 For the servo device described in item 12 of the scope of patent application, each of these coupling parts is a screw, a rivet or a fastener.
TW108146839A 2019-12-20 2019-12-20 Server device TWI739244B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108146839A TWI739244B (en) 2019-12-20 2019-12-20 Server device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108146839A TWI739244B (en) 2019-12-20 2019-12-20 Server device

Publications (2)

Publication Number Publication Date
TW202126153A TW202126153A (en) 2021-07-01
TWI739244B true TWI739244B (en) 2021-09-11

Family

ID=77908564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108146839A TWI739244B (en) 2019-12-20 2019-12-20 Server device

Country Status (1)

Country Link
TW (1) TWI739244B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM303613U (en) * 2006-06-07 2006-12-21 Compucase Entpr Co Ltd Airflow guiding conduit device for computer host
TWM353406U (en) * 2008-11-04 2009-03-21 Chenbro Micom Co Ltd Adjustable airflow guiding cover
TW201427541A (en) * 2012-12-29 2014-07-01 Hon Hai Prec Ind Co Ltd Computer enclosure and cooling module
TW201443383A (en) * 2013-05-08 2014-11-16 Hon Hai Prec Ind Co Ltd Air duct

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM303613U (en) * 2006-06-07 2006-12-21 Compucase Entpr Co Ltd Airflow guiding conduit device for computer host
TWM353406U (en) * 2008-11-04 2009-03-21 Chenbro Micom Co Ltd Adjustable airflow guiding cover
TW201427541A (en) * 2012-12-29 2014-07-01 Hon Hai Prec Ind Co Ltd Computer enclosure and cooling module
TW201443383A (en) * 2013-05-08 2014-11-16 Hon Hai Prec Ind Co Ltd Air duct

Also Published As

Publication number Publication date
TW202126153A (en) 2021-07-01

Similar Documents

Publication Publication Date Title
US7760498B2 (en) Electronic apparatus with air guiding element
US7289323B2 (en) Wind-guiding cover
US7835149B2 (en) Computer enclosure with airflow guide
JP4360859B2 (en) Electronics
US7522413B2 (en) Heat dissipating system
US7742296B2 (en) Computer having apparatuses for cooling elements
US6034870A (en) Computer system having a highly efficient forced air cooling subsystem
US20110267777A1 (en) Cooling unit, electronic device, and heat sink
US20090168330A1 (en) Electronic device with airflow guiding duct
US20110090643A1 (en) Computer system
TWI693749B (en) Fan expansion card and motherboard module
US20050018388A1 (en) Redundant power supply wirelessly connected to motherboard
US20100258283A1 (en) Electronic device
US20060067048A1 (en) Inlet airflow guiding structure for computers
US9690338B2 (en) Electronic device with cooling facility
TWI739244B (en) Server device
KR100934630B1 (en) Electronics
US7106586B2 (en) Computer heat dissipating system
TWM562995U (en) Portable electronic apparatus
US20230328930A1 (en) Graphics card and computer host
CN113009990B (en) Servo device
CN113009990A (en) Servo device
US20060049728A1 (en) Computer bezel with inlet airflow guiding device
KR20080095185A (en) Heat radiator and electronic apparatus
US20060012964A1 (en) Circuit board group for electrically coupling electronic devices