TWI739007B - Dome cameras and power consuming electronics devices - Google Patents
Dome cameras and power consuming electronics devices Download PDFInfo
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- TWI739007B TWI739007B TW107119065A TW107119065A TWI739007B TW I739007 B TWI739007 B TW I739007B TW 107119065 A TW107119065 A TW 107119065A TW 107119065 A TW107119065 A TW 107119065A TW I739007 B TWI739007 B TW I739007B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L9/00—Details or accessories of suction cleaners, e.g. mechanical means for controlling the suction or for effecting pulsating action; Storing devices specially adapted to suction cleaners or parts thereof; Carrying-vehicles specially adapted for suction cleaners
- A47L9/28—Installation of the electric equipment, e.g. adaptation or attachment to the suction cleaner; Controlling suction cleaners by electric means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
- G05D1/02—Control of position or course in two dimensions
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/698—Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Remote Sensing (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Radar, Positioning & Navigation (AREA)
- Studio Devices (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本標的物係關於經由散熱器消散熱,且特定而言係關於一種經由具有經空氣暴露表面之一散熱器消散內部裝置熱之電子裝置。 The subject matter is related to dissipating heat through a radiator, and in particular to an electronic device that dissipates the heat of the internal device through a radiator having an air-exposed surface.
熱管理係關於如何減少及控制由電子裝置及電路產生之過量熱以便改良可靠性及防止過早失效。結合熱管理,用於冷卻電子裝置及電路之一種方法係提供一或多個散熱器。一散熱器係具有特殊設計之一金屬塊以傳導及輻射來自一電組件之熱。 Thermal management is about how to reduce and control the excessive heat generated by electronic devices and circuits in order to improve reliability and prevent premature failure. In conjunction with thermal management, one method for cooling electronic devices and circuits is to provide one or more heat sinks. A heat sink is a metal block with a special design to conduct and radiate heat from an electrical component.
根據一項實例性實施例,提供一種功率消耗電子裝置,該功率消耗電子裝置包含第一互補式殼體部分及第二互補式殼體部分。該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面,且該第二殼體部分包含在一第二周邊邊緣處結束之一第二表面。該功率消耗電子裝置亦包含一散熱器,該散熱器具有為環形形狀且插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣的該經空氣暴露表面之表面邊緣在形狀及尺寸上分別與該第一周邊邊緣及該第二周邊邊緣匹配使得由該等殼體部分之該第一表面 及該第二表面以及該散熱器之該經空氣暴露表面形成之一總體複合表面係實質上連續且均勻的。該功率消耗電子裝置亦包含位於該電子裝置內且連接至該散熱器之至少一個熱產生裝置組件。在該電子裝置接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走。 According to an exemplary embodiment, a power consuming electronic device is provided. The power consuming electronic device includes a first complementary housing part and a second complementary housing part. The first housing portion includes a first surface ending at a first peripheral edge, and the second housing portion includes a second surface ending at a second peripheral edge. The power consumption electronic device also includes a heat sink having an annular shape and an air-exposed surface inserted between the first peripheral edge and the second peripheral edge. The surface edges of the air-exposed surface adjacent to the first peripheral edge and the second peripheral edge of the housing parts match the first peripheral edge and the second peripheral edge in shape and size, respectively, so that the The first surface of the housing part The second surface and the air-exposed surface of the heat sink form an overall composite surface that is substantially continuous and uniform. The power consuming electronic device also includes at least one heat generating device component located in the electronic device and connected to the heat sink. When the electronic device is turned on and the device component generates heat, the heat is sucked away from the device component via the heat sink.
根據另一實例性實施例,提供一種包含一第一半球形殼體部分之圓頂攝影機,該第一半球形殼體部分包含在一第一周邊邊緣處結束之一第一表面。該圓頂攝影機亦包含一第二半球形殼體部分,該第二半球形殼體部分包含在一第二周邊邊緣處結束之一第二表面。該第二半球形殼體部分與該第一半球形殼體部分互補。該圓頂攝影機亦包含一散熱器,該散熱器具有為環形形狀且插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣的該經空氣暴露表面之表面邊緣在形狀及尺寸上分別與該第一周邊邊緣及該第二周邊邊緣匹配使得由該等殼體部分之該第一表面及該第二表面以及該散熱器之該經空氣暴露表面形成之一總體複合表面係實質上連續且均勻的。該圓頂攝影機亦包含位於該圓頂攝影機內且連接至該散熱器之至少一個熱產生裝置組件。在該圓頂攝影機接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走。 According to another exemplary embodiment, there is provided a dome camera including a first hemispherical housing portion, the first hemispherical housing portion including a first surface that ends at a first peripheral edge. The dome camera also includes a second hemispherical housing part that includes a second surface that ends at a second peripheral edge. The second hemispherical housing part is complementary to the first hemispherical housing part. The dome camera also includes a heat sink having an air-exposed surface that is annular in shape and inserted between the first peripheral edge and the second peripheral edge. The surface edges of the air-exposed surface adjacent to the first peripheral edge and the second peripheral edge of the housing parts match the first peripheral edge and the second peripheral edge in shape and size, respectively, so that the The first surface and the second surface of the housing portion and the air exposed surface of the heat sink form an overall composite surface that is substantially continuous and uniform. The dome camera also includes at least one heat generating device component located in the dome camera and connected to the heat sink. When the dome camera is turned on and the device component generates heat, the heat is sucked away from the device component via the radiator.
根據又一實例性實施例,提供一種包含第一互補式殼體部分及第二互補式殼體部分之裝置。該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面。該第二殼體部分包含在一第二周邊邊緣處結束之一第二表面。一散熱器具有插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。該經空氣暴露表面之表面邊緣分別與該等殼體部分之該第一周邊邊緣及該第二周邊邊緣匹配以用於齊平鄰接以提供由該等殼體 部分之該第一表面及該第二表面與該散熱器之該經空氣暴露表面形成之一總體複合表面之組合不顯眼性。位於該裝置內之至少一個熱產生裝置組件連接至該散熱器。在該裝置組件產生熱時,經由該散熱器將該熱自該裝置組件吸走。 According to yet another exemplary embodiment, a device including a first complementary housing part and a second complementary housing part is provided. The first housing portion includes a first surface that ends at a first peripheral edge. The second housing part includes a second surface that ends at a second peripheral edge. A heat sink has an air exposed surface interposed between the first peripheral edge and the second peripheral edge. The surface edge of the air-exposed surface is matched with the first peripheral edge and the second peripheral edge of the housing parts for flush abutment to provide the housing The combination of part of the first surface and the second surface and the air-exposed surface of the heat sink to form an overall composite surface is inconspicuous. At least one heat generating device component located in the device is connected to the heat sink. When the device component generates heat, the heat is sucked away from the device component via the heat sink.
2-2:線 2-2: line
100:圓頂攝影機裝置 100: Dome camera device
110:可移動球形總成/球形總成 110: Movable spherical assembly/spherical assembly
120:靜止邊框部分/邊框部分 120: static frame part/frame part
122:平坦表面/表面 122: flat surface/surface
123:上部圓形邊緣 123: upper rounded edge
124:第一殼體部分/第一互補式殼體部分 124: first housing part/first complementary housing part
128:散熱器 128: radiator
130:凹槽 130: Groove
132:第二殼體部分/第二互補式殼體部分 132: second housing part/second complementary housing part
136:周邊邊緣/表面邊緣 136: Peripheral edge/surface edge
137:形狀互補卡扣/卡扣 137: Complementary shape buckle/buckle
140:周邊邊緣/表面邊緣 140: Peripheral edge/surface edge
144:邊緣/表面邊緣 144: Edge/Surface Edge
148:邊緣/表面邊緣 148: Edge/Surface Edge
156:外部凹槽 156: External groove
158:光學清透窗/透明窗 158: Optical clear window/transparent window
162:IR透明窗/IR小透鏡 162: IR transparent window/IR small lens
210:透鏡與成像單元/成像單元 210: Lens and imaging unit/imaging unit
214:IR發射器 214: IR transmitter
218:感測器印刷電路板總成 218: Sensor printed circuit board assembly
222:數位印刷電路板總成 222: Digital printed circuit board assembly
226:熱界面材料 226: Thermal Interface Material
422:墊圈 422: Washer
302:孔徑 302: Aperture
304:狀態指示燈 304: Status indicator
406:內部環 406: inner ring
416:有裂縫孔/孔 416: There are crack holes/holes
432:夾具 432: Fixture
435:信號電纜 435: signal cable
433:IR發射器印刷電路板總成 433: IR transmitter printed circuit board assembly
185:孔徑 185: Aperture
186:鳩尾榫 186: Dovetail
502:臂 502: Arm
現在將以實例方式參考附圖:圖1圖解說明根據至少一項實例性實施例之一圓頂攝影機裝置之一透視圖,該圓頂攝影機包含一可移動球形總成及一靜止邊框部分;圖2圖解說明沿著線2-2截取之圖1中所展示之圓頂攝影機之球形總成之一剖面圖;圖3圖解說明圖2中所展示之球形總成之一透視圖,球形總成之一殼體部分展示為部分地拆卸以顯露出球形總成之內部組件;圖4係圖3中所展示之內部組件之一分解圖;圖5係圖2中所展示之球形總成之一後透視圖;且圖6圖解說明圖2中所展示之球形總成之一側視立面圖,球形總成之一殼體部分展示為部分地拆卸以顯露出一散熱器之細節。 Reference will now be made to the drawings by way of example: FIG. 1 illustrates a perspective view of a dome camera device according to at least one example embodiment, the dome camera including a movable spherical assembly and a stationary frame portion; FIG. 2 Illustrates a cross-sectional view of the spherical assembly of the dome camera shown in Figure 1 taken along the line 2-2; Figure 3 illustrates a perspective view of the spherical assembly shown in Figure 2 and of the spherical assembly A housing part is shown partially disassembled to reveal the internal components of the spherical assembly; Figure 4 is an exploded view of the internal components shown in Figure 3; Figure 5 is a rear view of the spherical assembly shown in Figure 2 Perspective view; and FIG. 6 illustrates a side elevation view of the spherical assembly shown in FIG. 2, with a shell part of the spherical assembly shown as being partially disassembled to reveal the details of a heat sink.
可在不同圖中使用類似或相同元件符號來表示圖式中所圖解說明之類似實例性特徵。 Similar or identical reference signs may be used in different drawings to represent similar example features illustrated in the drawings.
本申請案主張於2017年6月5日提出申請之臨時申請案第62/515,330號之優先權的權益,該臨時申請案之全部內容據此係以引用的 方式併入本文中。 This application claims the right of priority to the provisional application No. 62/515,330 filed on June 5, 2017, and the entire content of the provisional application is quoted accordingly The method is incorporated into this article.
將理解,當在本文中一元件稱為「正被連接至另一元件」、「與另一元件進行通信」或「經耦合至另一元件」時,其可係直接連接至其他元件、直接與其他元件進行通信,或直接耦合至其他元件,或者可存在介入元件。相比而言,當在本文中一元件稱為「經直接連接至另一元件、「直接與另一元件進行通信」或「經直接耦合至另一元件」時,不存在介入元件。用於闡述元件之間之關係的其他詞語應以一相似方式解釋(亦即,「在......之間」對「直接在......之間」,「毗鄰」對「直接毗鄰」等)。 It will be understood that when an element is referred to herein as "being connected to another element", "communicating with another element" or "coupled to another element", it can be directly connected to the other element, directly It communicates with other elements, or is directly coupled to other elements, or intervening elements may be present. In contrast, when an element is referred to herein as being "directly connected to another element, "directly communicating with another element", or "directly coupled to another element", there is no intervening element. Other words used to describe the relationship between elements should be interpreted in a similar way (that is, "between" and "directly between" and "adjacent" to "Directly adjacent" etc.).
如本文中所使用,術語「環形」關於二維係指一圓形形狀,且關於三維係指由相對之邊界至少部分地界定之一球體之一區段,該等相對之邊界係由在球體之表面上描繪的兩個圓所構成。 As used herein, the term "circular" refers to a circular shape with respect to two dimensions, and refers to a section of a sphere at least partially defined by opposite boundaries, which are defined by the sphere It is composed of two circles drawn on its surface.
特定實例性實施例係關於攝影機(舉例而言,圓頂攝影機及其他類型之安全攝影機);然而某些實例性實施例係針對電子裝置而非攝影機。舉例而言,實例性實施例可被應用於智慧電話、手持式計算裝置、智慧廚房裝置、無人飛機等。 Certain exemplary embodiments are related to cameras (for example, dome cameras and other types of security cameras); however, certain exemplary embodiments are related to electronic devices rather than cameras. For example, the example embodiments may be applied to smart phones, handheld computing devices, smart kitchen devices, unmanned aircraft, and so on.
現參考圖1,其圖解說明根據至少一項實例性實施例之一圓頂攝影機裝置100之一透視圖。圓頂攝影機裝置100包含一可移動球形總成110,及一靜止邊框部分120。相對於球形總成110之移動,球形總成110傾斜大約自0°至90°,且全景旋轉多於360°,以便確保可將圓頂攝影機裝置100設定為一所要視域。並且,球形總成110之一部分經定大小以裝配於邊框部分120內。邊框部分120之平坦表面122覆蓋邊框部分120之內部。
Reference is now made to FIG. 1, which illustrates a perspective view of a
邊框部分120之上部圓形邊緣123經構形為與一適合平坦表面(諸如(舉例而言),一天花板瓷磚)齊平安裝。此外,圓頂攝影機裝置100可被安裝於一天花板上,該天花板具有平行於表面122亦平行於天花板之一表面。圓頂攝影機裝置100亦可被安裝於一吊架上,該吊架具有平行於表面122此外亦平行於天花板之表面,吊架可自天花板向下延伸。圓頂攝影機裝置100亦可被安裝於一壁上,該壁具有平行於表面122亦平行於壁之表面。
The upper
球形總成110包含一第一殼體部分124、一散熱器128及一第二殼體部分132。根據至少某些實例,第一殼體部分124、第二殼體部分132及邊框部分120可全部皆由聚碳酸酯(PC)與丙烯腈-丁二烯-苯乙烯(ABS)之一組合製成。
The
關於散熱器128,根據某些實例此可完全或部分地由鋁製成。散熱器128具有插置於第一殼體部分124與第二殼體部分132之間的一經空氣暴露表面。由於經空氣暴露表面之邊緣144及148係圍繞一球形表面構成完整跡線之表面曲線,因此散熱器128之經空氣暴露表面係環形的。在替代實例性實施例中,經暴露表面具有某些其他類型之形狀。舉例而言,在具有具一總體矩形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之四個矩形之尺寸。亦預期其他適合形狀。舉例而言,在具有具一總體三角形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之三個矩形之尺寸。作為又一實例,在具有具一總體五邊形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之五個矩形之尺寸。因此,可能有且預期眾多不同形狀。
Regarding the
具有經空氣暴露表面而非無此表面(亦即散熱器完全含納於球形總成110內部)之散熱器128之一影響係透過散熱器傳輸之熱能夠向外輻射至周圍空氣。根據某些實例,散熱器128之經空氣暴露表面係一精加工表面,其中精加工係可增加至周圍環境之輻射熱轉移之效率之電塗佈(e-塗佈)或一粉末塗佈。因此,散熱器128允許在圓頂攝影機裝置100之球形總成110內產生比原本可能的情況大的量的經准許熱。以此方式,可將通常在球形總成110外部發現之熱產生組件(舉例而言,在一分離攝影機尾部總成內,諸如在共同擁有之標題為「Security Camera Having a Cable Assembly with an Integrated Processing Module」之美國專利第9,167,137中展示及闡述之一者)帶入球形總成110內。舉例而言,關於其中攝影機裝置附接至攝影機尾部總成之實例,將熱產生組件內部化於球形總成110內可導致一經減小大小或甚至消除攝影機尾部總成。根據至少某些實例,關於操作攝影機之時間,散熱器128促進將球形總成110之內部組件之一周圍溫度維持在不在國際或其他公認安全標準之外之任何適合範圍內;且使其外部經暴露表面具有在不在國際或其他公認安全標準之外之任何適合範圍內之一觸控溫度。
One of the effects of the
就散熱器128之幾何形狀而言,散熱器128之經空氣暴露表面之表面邊緣144鄰接第一殼體部分124之一周邊邊緣136。類似地,散熱器128之經空氣暴露表面之表面邊緣148鄰接第二殼體部分132之一周邊邊緣140。並且,應注意,如本文中所使用之術語「周邊邊緣」有時被熟習模製(用於製造)技術者稱為一「分離線」或一「分割線」。
As far as the geometry of the
如圖1中所展示,表面邊緣144及148在形狀及尺寸上分別與周邊邊緣136及140匹配使得由散熱器128之經空氣暴露表面以及第一互
補式殼體部分124及第二互補式殼體部分132之表面形成之一總體複合表面係實質上連續且均勻的。並且,可認為上述邊緣之間具有齊平鄰接以提供總體複合表面之組合不顯眼性。
As shown in FIG. 1, the surface edges 144 and 148 match the
將注意,由於表面邊緣136圍繞總成之總體球體形狀描繪比表面邊緣140大之一圓形,因此由表面邊緣144描繪出之圓形亦比由表面邊緣148描繪出之圓形大。因此所圖解說明之散熱器128在經暴露表面之區域中朝向後漸縮。並且,在所圖解說明之實例性實施例中,周邊邊緣136係處於球形總成110之一中點處,此之影響可為在使用傳統模製程序時限制球形形狀構造所需之部件的數目。在替代實例性實施例中,預期此散熱器區域之不同漸縮及/或擴張。
It will be noted that since the overall spherical shape of the
圖2圖解說明圖1中所展示之圓頂攝影機裝置100之球形總成110之一剖面圖。如所展示,多個組件被裝納於球形總成110內,包含一透鏡與成像單元210、IR發射器214、一感測器印刷電路板總成(PCBA)218、一數位PCBA 222,及經定位於數位PCBA 222與散熱器128之間的熱界面材料226(在所圖解說明之實例性實施例中,更具體而言,熱界面材料226係一適合大小之間隙墊)。關於透鏡與成像單元210,其擷取圓頂攝影機裝置100之視域中之一場景之影像及視訊。所擷取影像及視訊在經耦合至透鏡與成像單元210之PCBA中經處理。此處理可包含將所輸出影像資料格式化為各種影像標準,諸如(舉例而言)H.264或H.265。另外,此處理可進一步包含:使用視訊分析來分析所擷取影像及視訊,以偵測目標且對目標進行分類;及壓縮、編碼及解碼所擷取影像及視訊。
FIG. 2 illustrates a cross-sectional view of the
參考圖1及圖2兩者,球形總成110包含光學清透窗158及IR透明窗或小透鏡162。IR發射器214係定位於IR透明窗162後面。關於透明窗158,其允許圓頂攝影機裝置100外部之光通過進入至球形總成110中,該光然後被成像單元210擷取以形成影像及視訊。影像感測器可係熟習此項技術者認為適合之任何感測器部分,包含(舉例而言)CMOS、NMOS或CCD。
Referring to both FIGS. 1 and 2, the
關於IR小透鏡162,其可係由允許IR光通過之一黑色材料製成,藉此幫助IR發射器214融入球形總成110之外觀中。併入有IR小透鏡162及透明窗158之一光滑球形表面的使用使得更難以辨別成像單元210面向哪一方向,且允許圓頂攝影機裝置100之一較小架構。並且,應注意,在某些實例中,圓頂攝影機裝置100可既不包含IR發射器214亦不包含IR小透鏡162。換言之,圓頂攝影機裝置100之IR區段係一選用區段。不存在圓頂攝影機裝置100之IR區段之一影像可係對熱消散之一經減少的需求。
Regarding the IR
參考圖2,所圖解說明散熱器128界定圍繞散熱器128延伸完整圓形之一凹槽130。凹槽130經定大小及經塑形以與第二殼體部分132之一形狀互補卡扣137對準。此配置保持第二殼體部分132固定至散熱器128同時允許散熱器128及第一殼體部分124相對於第二殼體部分132之方位角旋轉。
Referring to FIG. 2, the illustrated
圖3圖解說明球形總成110之一透視圖,其中第一殼體部分124以一部分拆卸狀態展示以顯露出球形總成110之內部組件。第一殼體部分124上之外部凹槽156(其經提供以緩解模製問題)平行於球形總成110之旋轉方向而定位。圖3中亦展示界定於散熱器128之環形壁中之一孔徑
302。孔徑302暴露經提供以達成圓頂攝影機裝置100之一重設之一重設成出廠默認值開關。一狀態指示燈304毗鄰孔徑302以促進提供表示狀態資訊之可見光。
FIG. 3 illustrates a perspective view of the
圖4係球形總成110之內部組件(圖3中所展示)之一分解圖。如先前本文中所闡述,所圖解說明球形總成110內包含兩個PCBA:感測器PCBA 218及數位PCBA 222。感測器PCBA 218包含呈板下面上之觸點形式之經暴露銅。在球形總成110之裝配期間,此經暴露銅與散熱器128之內部環406接觸。內部環406與經暴露銅之間的此直接接觸促進熱自感測器PCBA 218至散熱器128之傳輸。與感測器PCBA 218相比而言,數位PCBA 222經由熱界面材料226熱連接至散熱器128。在至少一項實例中,熱界面材料226直接附接至產生大部分熱之數位PCBA 222之半導體晶片,該半導體晶片可係一晶片上系統(SoC),舉例而言。
FIG. 4 is an exploded view of the internal components of the spherical assembly 110 (shown in FIG. 3). As previously described in this article, the illustrated
散熱器128之一後壁內界定複數個有裂縫孔416。孔416可藉由給熱空氣提供逸出至球形總成110之後區域中之一路徑來促進降低熱產生內部組件之區域內之溫度。在球形總成110經完全裝配時孔416將由第二殼體部分132覆蓋;然而,參考展示球形總成110之一後透視圖之圖5,第二殼體部分132中界定一孔徑185,該孔徑允許熱空氣逸出球形總成110。在所圖解說明之實例性實施例中,孔徑185位於鳩尾榫186之端之間。在至少某些實例中,孔徑185另外充當一電纜通道,電纜穿過該電纜通道來將電力攜載至裝置組件。
A plurality of cracked
再次參考圖4,透鏡與成像單元210包含一夾具432。夾具432用於在使用一固定焦點透鏡聚焦之後將透鏡與成像單元210固持在適當位置中。亦展示固持IR發射器214之一IR發射器PCBA 433。信號電纜
435將IR發射器PCBA 433耦合至數位PCBA 222。
Referring again to FIG. 4, the lens and
接下來,圖4中亦展示一墊圈422。墊圈422經定位以鄰接球形總成110之內部側且藉此提供一不透明障壁以將IR發射器214自透鏡與成像單元210分離。
Next, a
圖6圖解說明球形總成110之一側視立面圖,其中第二殼體部分132展示為自球形總成110之其餘部分拆卸以顯露出散熱器128之細節。凹槽130係清晰可見的。並且,卡扣137展示為位於臂502上。可在第二殼體部分132上提供任何適合數目個類似於臂502之臂。作為所圖解說明臂502之一替代方案,類似於所圖解說明卡扣137之一卡扣可併入至第二殼體部分132之內部表面中且與第二殼體部分132之內部表面成整體。
6 illustrates a side elevational view of the
可做出所闡述實施例之特定變更及修改。舉例而言,儘管本發明之特定實施例經設計以包含於一攝影機(舉例而言,一圓頂攝影機)中,但本發明之其他替代實施例適合於其中一經暴露散熱器係適當的之其他類型之電子裝置。此等其他類型之電子裝置可包含(舉例而言)無人飛機、行動電子裝置、智慧廚房裝置等。可在無過度困難或發明性努力之情況下由熟習此項技術者做出如攝影機實施例與此等替代實施例之間的所需設計修改。因此,上文所論述之實施例視為係圖解說明的而非限制性的,且本發明應解釋為僅受隨附申請專利範圍限制。 Specific changes and modifications to the described embodiments can be made. For example, although certain embodiments of the present invention are designed to be included in a camera (for example, a dome camera), other alternative embodiments of the present invention are suitable for other types where an exposed heat sink is appropriate的电子装置。 The electronic device. These other types of electronic devices may include, for example, drones, mobile electronic devices, smart kitchen devices, and so on. Those skilled in the art can make necessary design modifications between the camera embodiment and these alternative embodiments without undue difficulty or inventive effort. Therefore, the above-discussed embodiments are considered to be illustrative rather than restrictive, and the present invention should be construed as being limited only by the scope of the attached patent application.
2-2:線 2-2: line
100:圓頂攝影機裝置 100: Dome camera device
110:可移動球形總成/球形總成 110: Movable spherical assembly/spherical assembly
120:靜止邊框部分/邊框部分 120: static frame part/frame part
122:平坦表面/表面 122: flat surface/surface
123:上部圓形邊緣 123: upper rounded edge
124:第一殼體部分/第一互補式殼體部分 124: first housing part/first complementary housing part
128:散熱器 128: radiator
132:第二殼體部分/第二互補式殼體部分 132: second housing part/second complementary housing part
136:周邊邊緣/表面邊緣 136: Peripheral edge/surface edge
140:周邊邊緣/表面邊緣 140: Peripheral edge/surface edge
144:邊緣/表面邊緣 144: Edge/Surface Edge
148:邊緣/表面邊緣 148: Edge/Surface Edge
156:外部凹槽 156: External groove
158:光學清透窗/透明窗 158: Optical clear window/transparent window
162:IR透明窗/IR小透鏡 162: IR transparent window/IR small lens
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- 2018-06-01 GB GB1917159.4A patent/GB2576665A/en not_active Withdrawn
- 2018-06-01 CA CA3065590A patent/CA3065590C/en active Active
- 2018-06-01 WO PCT/CA2018/050660 patent/WO2018223224A1/en active Application Filing
- 2018-06-01 TW TW107119065A patent/TWI739007B/en active
- 2018-06-01 US US15/996,137 patent/US10795242B2/en active Active
- 2018-06-01 DE DE112018002840.2T patent/DE112018002840T5/en active Pending
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CA3065590C (en) | 2022-05-10 |
TW201903502A (en) | 2019-01-16 |
CA3065590A1 (en) | 2018-12-13 |
WO2018223224A1 (en) | 2018-12-13 |
DE112018002840T5 (en) | 2020-02-20 |
US20180348600A1 (en) | 2018-12-06 |
US10795242B2 (en) | 2020-10-06 |
GB2576665A (en) | 2020-02-26 |
GB201917159D0 (en) | 2020-01-08 |
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