TWI739007B - Dome cameras and power consuming electronics devices - Google Patents

Dome cameras and power consuming electronics devices Download PDF

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TWI739007B
TWI739007B TW107119065A TW107119065A TWI739007B TW I739007 B TWI739007 B TW I739007B TW 107119065 A TW107119065 A TW 107119065A TW 107119065 A TW107119065 A TW 107119065A TW I739007 B TWI739007 B TW I739007B
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peripheral edge
heat sink
housing part
housing
electronic device
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TW107119065A
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TW201903502A (en
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文森 詹
湯瑪斯 W 侯德布魯克
柯林 保羅 傑森
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加拿大商艾維吉隆股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47LDOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L9/00Details or accessories of suction cleaners, e.g. mechanical means for controlling the suction or for effecting pulsating action; Storing devices specially adapted to suction cleaners or parts thereof; Carrying-vehicles specially adapted for suction cleaners
    • A47L9/28Installation of the electric equipment, e.g. adaptation or attachment to the suction cleaner; Controlling suction cleaners by electric means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D1/00Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
    • G05D1/02Control of position or course in two dimensions
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/698Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Remote Sensing (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Studio Devices (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A power consuming electronics device that dissipates internal device heat via a heat sink is disclosed. The power consuming electronics device includes first and second complementary housing parts. The first housing part includes a first surface ending at a first peripheral edge, and the second housing part including a second surface ending at a second peripheral edge. The power consuming electronics device also includes a heat sink having an air exposed surface that is interposed between the first and second peripheral edges. Surface edges of the air exposed surface abut the first and second peripheral edges of the housing parts and are respectively matched therewith in shape and dimension so that an overall composite surface formed by the first and second surfaces of the housing parts and the air exposed surface of the heat sink is substantially continuous and uniform.

Description

圓頂攝影機及功率消耗電子裝置 Dome camera and power consumption electronic device

本標的物係關於經由散熱器消散熱,且特定而言係關於一種經由具有經空氣暴露表面之一散熱器消散內部裝置熱之電子裝置。 The subject matter is related to dissipating heat through a radiator, and in particular to an electronic device that dissipates the heat of the internal device through a radiator having an air-exposed surface.

熱管理係關於如何減少及控制由電子裝置及電路產生之過量熱以便改良可靠性及防止過早失效。結合熱管理,用於冷卻電子裝置及電路之一種方法係提供一或多個散熱器。一散熱器係具有特殊設計之一金屬塊以傳導及輻射來自一電組件之熱。 Thermal management is about how to reduce and control the excessive heat generated by electronic devices and circuits in order to improve reliability and prevent premature failure. In conjunction with thermal management, one method for cooling electronic devices and circuits is to provide one or more heat sinks. A heat sink is a metal block with a special design to conduct and radiate heat from an electrical component.

根據一項實例性實施例,提供一種功率消耗電子裝置,該功率消耗電子裝置包含第一互補式殼體部分及第二互補式殼體部分。該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面,且該第二殼體部分包含在一第二周邊邊緣處結束之一第二表面。該功率消耗電子裝置亦包含一散熱器,該散熱器具有為環形形狀且插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣的該經空氣暴露表面之表面邊緣在形狀及尺寸上分別與該第一周邊邊緣及該第二周邊邊緣匹配使得由該等殼體部分之該第一表面 及該第二表面以及該散熱器之該經空氣暴露表面形成之一總體複合表面係實質上連續且均勻的。該功率消耗電子裝置亦包含位於該電子裝置內且連接至該散熱器之至少一個熱產生裝置組件。在該電子裝置接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走。 According to an exemplary embodiment, a power consuming electronic device is provided. The power consuming electronic device includes a first complementary housing part and a second complementary housing part. The first housing portion includes a first surface ending at a first peripheral edge, and the second housing portion includes a second surface ending at a second peripheral edge. The power consumption electronic device also includes a heat sink having an annular shape and an air-exposed surface inserted between the first peripheral edge and the second peripheral edge. The surface edges of the air-exposed surface adjacent to the first peripheral edge and the second peripheral edge of the housing parts match the first peripheral edge and the second peripheral edge in shape and size, respectively, so that the The first surface of the housing part The second surface and the air-exposed surface of the heat sink form an overall composite surface that is substantially continuous and uniform. The power consuming electronic device also includes at least one heat generating device component located in the electronic device and connected to the heat sink. When the electronic device is turned on and the device component generates heat, the heat is sucked away from the device component via the heat sink.

根據另一實例性實施例,提供一種包含一第一半球形殼體部分之圓頂攝影機,該第一半球形殼體部分包含在一第一周邊邊緣處結束之一第一表面。該圓頂攝影機亦包含一第二半球形殼體部分,該第二半球形殼體部分包含在一第二周邊邊緣處結束之一第二表面。該第二半球形殼體部分與該第一半球形殼體部分互補。該圓頂攝影機亦包含一散熱器,該散熱器具有為環形形狀且插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣的該經空氣暴露表面之表面邊緣在形狀及尺寸上分別與該第一周邊邊緣及該第二周邊邊緣匹配使得由該等殼體部分之該第一表面及該第二表面以及該散熱器之該經空氣暴露表面形成之一總體複合表面係實質上連續且均勻的。該圓頂攝影機亦包含位於該圓頂攝影機內且連接至該散熱器之至少一個熱產生裝置組件。在該圓頂攝影機接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走。 According to another exemplary embodiment, there is provided a dome camera including a first hemispherical housing portion, the first hemispherical housing portion including a first surface that ends at a first peripheral edge. The dome camera also includes a second hemispherical housing part that includes a second surface that ends at a second peripheral edge. The second hemispherical housing part is complementary to the first hemispherical housing part. The dome camera also includes a heat sink having an air-exposed surface that is annular in shape and inserted between the first peripheral edge and the second peripheral edge. The surface edges of the air-exposed surface adjacent to the first peripheral edge and the second peripheral edge of the housing parts match the first peripheral edge and the second peripheral edge in shape and size, respectively, so that the The first surface and the second surface of the housing portion and the air exposed surface of the heat sink form an overall composite surface that is substantially continuous and uniform. The dome camera also includes at least one heat generating device component located in the dome camera and connected to the heat sink. When the dome camera is turned on and the device component generates heat, the heat is sucked away from the device component via the radiator.

根據又一實例性實施例,提供一種包含第一互補式殼體部分及第二互補式殼體部分之裝置。該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面。該第二殼體部分包含在一第二周邊邊緣處結束之一第二表面。一散熱器具有插置於該第一周邊邊緣與該第二周邊邊緣之間的一經空氣暴露表面。該經空氣暴露表面之表面邊緣分別與該等殼體部分之該第一周邊邊緣及該第二周邊邊緣匹配以用於齊平鄰接以提供由該等殼體 部分之該第一表面及該第二表面與該散熱器之該經空氣暴露表面形成之一總體複合表面之組合不顯眼性。位於該裝置內之至少一個熱產生裝置組件連接至該散熱器。在該裝置組件產生熱時,經由該散熱器將該熱自該裝置組件吸走。 According to yet another exemplary embodiment, a device including a first complementary housing part and a second complementary housing part is provided. The first housing portion includes a first surface that ends at a first peripheral edge. The second housing part includes a second surface that ends at a second peripheral edge. A heat sink has an air exposed surface interposed between the first peripheral edge and the second peripheral edge. The surface edge of the air-exposed surface is matched with the first peripheral edge and the second peripheral edge of the housing parts for flush abutment to provide the housing The combination of part of the first surface and the second surface and the air-exposed surface of the heat sink to form an overall composite surface is inconspicuous. At least one heat generating device component located in the device is connected to the heat sink. When the device component generates heat, the heat is sucked away from the device component via the heat sink.

2-2:線 2-2: line

100:圓頂攝影機裝置 100: Dome camera device

110:可移動球形總成/球形總成 110: Movable spherical assembly/spherical assembly

120:靜止邊框部分/邊框部分 120: static frame part/frame part

122:平坦表面/表面 122: flat surface/surface

123:上部圓形邊緣 123: upper rounded edge

124:第一殼體部分/第一互補式殼體部分 124: first housing part/first complementary housing part

128:散熱器 128: radiator

130:凹槽 130: Groove

132:第二殼體部分/第二互補式殼體部分 132: second housing part/second complementary housing part

136:周邊邊緣/表面邊緣 136: Peripheral edge/surface edge

137:形狀互補卡扣/卡扣 137: Complementary shape buckle/buckle

140:周邊邊緣/表面邊緣 140: Peripheral edge/surface edge

144:邊緣/表面邊緣 144: Edge/Surface Edge

148:邊緣/表面邊緣 148: Edge/Surface Edge

156:外部凹槽 156: External groove

158:光學清透窗/透明窗 158: Optical clear window/transparent window

162:IR透明窗/IR小透鏡 162: IR transparent window/IR small lens

210:透鏡與成像單元/成像單元 210: Lens and imaging unit/imaging unit

214:IR發射器 214: IR transmitter

218:感測器印刷電路板總成 218: Sensor printed circuit board assembly

222:數位印刷電路板總成 222: Digital printed circuit board assembly

226:熱界面材料 226: Thermal Interface Material

422:墊圈 422: Washer

302:孔徑 302: Aperture

304:狀態指示燈 304: Status indicator

406:內部環 406: inner ring

416:有裂縫孔/孔 416: There are crack holes/holes

432:夾具 432: Fixture

435:信號電纜 435: signal cable

433:IR發射器印刷電路板總成 433: IR transmitter printed circuit board assembly

185:孔徑 185: Aperture

186:鳩尾榫 186: Dovetail

502:臂 502: Arm

現在將以實例方式參考附圖:圖1圖解說明根據至少一項實例性實施例之一圓頂攝影機裝置之一透視圖,該圓頂攝影機包含一可移動球形總成及一靜止邊框部分;圖2圖解說明沿著線2-2截取之圖1中所展示之圓頂攝影機之球形總成之一剖面圖;圖3圖解說明圖2中所展示之球形總成之一透視圖,球形總成之一殼體部分展示為部分地拆卸以顯露出球形總成之內部組件;圖4係圖3中所展示之內部組件之一分解圖;圖5係圖2中所展示之球形總成之一後透視圖;且圖6圖解說明圖2中所展示之球形總成之一側視立面圖,球形總成之一殼體部分展示為部分地拆卸以顯露出一散熱器之細節。 Reference will now be made to the drawings by way of example: FIG. 1 illustrates a perspective view of a dome camera device according to at least one example embodiment, the dome camera including a movable spherical assembly and a stationary frame portion; FIG. 2 Illustrates a cross-sectional view of the spherical assembly of the dome camera shown in Figure 1 taken along the line 2-2; Figure 3 illustrates a perspective view of the spherical assembly shown in Figure 2 and of the spherical assembly A housing part is shown partially disassembled to reveal the internal components of the spherical assembly; Figure 4 is an exploded view of the internal components shown in Figure 3; Figure 5 is a rear view of the spherical assembly shown in Figure 2 Perspective view; and FIG. 6 illustrates a side elevation view of the spherical assembly shown in FIG. 2, with a shell part of the spherical assembly shown as being partially disassembled to reveal the details of a heat sink.

可在不同圖中使用類似或相同元件符號來表示圖式中所圖解說明之類似實例性特徵。 Similar or identical reference signs may be used in different drawings to represent similar example features illustrated in the drawings.

相關申請案資料 Related application materials

本申請案主張於2017年6月5日提出申請之臨時申請案第62/515,330號之優先權的權益,該臨時申請案之全部內容據此係以引用的 方式併入本文中。 This application claims the right of priority to the provisional application No. 62/515,330 filed on June 5, 2017, and the entire content of the provisional application is quoted accordingly The method is incorporated into this article.

將理解,當在本文中一元件稱為「正被連接至另一元件」、「與另一元件進行通信」或「經耦合至另一元件」時,其可係直接連接至其他元件、直接與其他元件進行通信,或直接耦合至其他元件,或者可存在介入元件。相比而言,當在本文中一元件稱為「經直接連接至另一元件、「直接與另一元件進行通信」或「經直接耦合至另一元件」時,不存在介入元件。用於闡述元件之間之關係的其他詞語應以一相似方式解釋(亦即,「在......之間」對「直接在......之間」,「毗鄰」對「直接毗鄰」等)。 It will be understood that when an element is referred to herein as "being connected to another element", "communicating with another element" or "coupled to another element", it can be directly connected to the other element, directly It communicates with other elements, or is directly coupled to other elements, or intervening elements may be present. In contrast, when an element is referred to herein as being "directly connected to another element, "directly communicating with another element", or "directly coupled to another element", there is no intervening element. Other words used to describe the relationship between elements should be interpreted in a similar way (that is, "between" and "directly between" and "adjacent" to "Directly adjacent" etc.).

如本文中所使用,術語「環形」關於二維係指一圓形形狀,且關於三維係指由相對之邊界至少部分地界定之一球體之一區段,該等相對之邊界係由在球體之表面上描繪的兩個圓所構成。 As used herein, the term "circular" refers to a circular shape with respect to two dimensions, and refers to a section of a sphere at least partially defined by opposite boundaries, which are defined by the sphere It is composed of two circles drawn on its surface.

特定實例性實施例係關於攝影機(舉例而言,圓頂攝影機及其他類型之安全攝影機);然而某些實例性實施例係針對電子裝置而非攝影機。舉例而言,實例性實施例可被應用於智慧電話、手持式計算裝置、智慧廚房裝置、無人飛機等。 Certain exemplary embodiments are related to cameras (for example, dome cameras and other types of security cameras); however, certain exemplary embodiments are related to electronic devices rather than cameras. For example, the example embodiments may be applied to smart phones, handheld computing devices, smart kitchen devices, unmanned aircraft, and so on.

現參考圖1,其圖解說明根據至少一項實例性實施例之一圓頂攝影機裝置100之一透視圖。圓頂攝影機裝置100包含一可移動球形總成110,及一靜止邊框部分120。相對於球形總成110之移動,球形總成110傾斜大約自0°至90°,且全景旋轉多於360°,以便確保可將圓頂攝影機裝置100設定為一所要視域。並且,球形總成110之一部分經定大小以裝配於邊框部分120內。邊框部分120之平坦表面122覆蓋邊框部分120之內部。 Reference is now made to FIG. 1, which illustrates a perspective view of a dome camera apparatus 100 according to at least one example embodiment. The dome camera device 100 includes a movable spherical assembly 110 and a stationary frame portion 120. Relative to the movement of the spherical assembly 110, the spherical assembly 110 is tilted approximately from 0° to 90°, and the panoramic rotation is more than 360° to ensure that the dome camera device 100 can be set to a desired field of view. In addition, a part of the spherical assembly 110 is sized to fit in the frame portion 120. The flat surface 122 of the frame portion 120 covers the inside of the frame portion 120.

邊框部分120之上部圓形邊緣123經構形為與一適合平坦表面(諸如(舉例而言),一天花板瓷磚)齊平安裝。此外,圓頂攝影機裝置100可被安裝於一天花板上,該天花板具有平行於表面122亦平行於天花板之一表面。圓頂攝影機裝置100亦可被安裝於一吊架上,該吊架具有平行於表面122此外亦平行於天花板之表面,吊架可自天花板向下延伸。圓頂攝影機裝置100亦可被安裝於一壁上,該壁具有平行於表面122亦平行於壁之表面。 The upper circular edge 123 of the frame portion 120 is configured to be mounted flush with a suitable flat surface, such as, for example, a ceiling tile. In addition, the dome camera device 100 can be installed on a ceiling that has a surface parallel to the surface 122 and also parallel to the ceiling. The dome camera device 100 can also be mounted on a hanger which has a surface parallel to the surface 122 and also parallel to the ceiling, and the hanger can extend downward from the ceiling. The dome camera device 100 can also be mounted on a wall having a surface parallel to the surface 122 and also parallel to the wall.

球形總成110包含一第一殼體部分124、一散熱器128及一第二殼體部分132。根據至少某些實例,第一殼體部分124、第二殼體部分132及邊框部分120可全部皆由聚碳酸酯(PC)與丙烯腈-丁二烯-苯乙烯(ABS)之一組合製成。 The spherical assembly 110 includes a first housing part 124, a heat sink 128 and a second housing part 132. According to at least some examples, the first housing portion 124, the second housing portion 132, and the frame portion 120 may all be made of a combination of polycarbonate (PC) and acrylonitrile-butadiene-styrene (ABS) become.

關於散熱器128,根據某些實例此可完全或部分地由鋁製成。散熱器128具有插置於第一殼體部分124與第二殼體部分132之間的一經空氣暴露表面。由於經空氣暴露表面之邊緣144及148係圍繞一球形表面構成完整跡線之表面曲線,因此散熱器128之經空氣暴露表面係環形的。在替代實例性實施例中,經暴露表面具有某些其他類型之形狀。舉例而言,在具有具一總體矩形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之四個矩形之尺寸。亦預期其他適合形狀。舉例而言,在具有具一總體三角形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之三個矩形之尺寸。作為又一實例,在具有具一總體五邊形棱柱形狀之一殼體之一電子裝置之情形中,經暴露表面可採用經配置以匹配殼體之總體形狀之五個矩形之尺寸。因此,可能有且預期眾多不同形狀。 Regarding the heat sink 128, this may be made entirely or partially of aluminum according to some examples. The heat sink 128 has an air-exposed surface interposed between the first housing part 124 and the second housing part 132. Since the edges 144 and 148 of the air-exposed surface surround a spherical surface to form a surface curve of a complete trace, the air-exposed surface of the heat sink 128 is annular. In alternative exemplary embodiments, the exposed surface has some other type of shape. For example, in the case of an electronic device having a housing having an overall rectangular prism shape, the exposed surface may adopt the size of four rectangles configured to match the overall shape of the housing. Other suitable shapes are also expected. For example, in the case of an electronic device having a housing having an overall triangular prism shape, the exposed surface may adopt the size of three rectangles configured to match the overall shape of the housing. As yet another example, in the case of an electronic device having a housing having an overall pentagonal prism shape, the exposed surface may adopt the size of five rectangles configured to match the overall shape of the housing. Therefore, many different shapes are possible and expected.

具有經空氣暴露表面而非無此表面(亦即散熱器完全含納於球形總成110內部)之散熱器128之一影響係透過散熱器傳輸之熱能夠向外輻射至周圍空氣。根據某些實例,散熱器128之經空氣暴露表面係一精加工表面,其中精加工係可增加至周圍環境之輻射熱轉移之效率之電塗佈(e-塗佈)或一粉末塗佈。因此,散熱器128允許在圓頂攝影機裝置100之球形總成110內產生比原本可能的情況大的量的經准許熱。以此方式,可將通常在球形總成110外部發現之熱產生組件(舉例而言,在一分離攝影機尾部總成內,諸如在共同擁有之標題為「Security Camera Having a Cable Assembly with an Integrated Processing Module」之美國專利第9,167,137中展示及闡述之一者)帶入球形總成110內。舉例而言,關於其中攝影機裝置附接至攝影機尾部總成之實例,將熱產生組件內部化於球形總成110內可導致一經減小大小或甚至消除攝影機尾部總成。根據至少某些實例,關於操作攝影機之時間,散熱器128促進將球形總成110之內部組件之一周圍溫度維持在不在國際或其他公認安全標準之外之任何適合範圍內;且使其外部經暴露表面具有在不在國際或其他公認安全標準之外之任何適合範圍內之一觸控溫度。 One of the effects of the heat sink 128 with an air-exposed surface instead of no such surface (that is, the heat sink is completely contained inside the spherical assembly 110) is that the heat transmitted through the heat sink can be radiated outward to the surrounding air. According to some examples, the air-exposed surface of the heat sink 128 is a finishing surface, wherein the finishing is an electric coating (e-coating) or a powder coating that can increase the efficiency of radiant heat transfer to the surrounding environment. Therefore, the heat sink 128 allows a larger amount of permitted heat to be generated in the spherical assembly 110 of the dome camera device 100 than originally possible. In this way, heat generating components that are usually found outside the spherical assembly 110 (for example, in a separate camera tail assembly, such as in the jointly owned title "Security Camera Having a Cable Assembly with an Integrated Processing Module "US Patent No. 9,167,137 showed and explained one of them) was brought into the spherical assembly 110. For example, regarding an example in which the camera device is attached to the camera tail assembly, internalizing the heat generating component within the spherical assembly 110 can result in a reduction in size or even the elimination of the camera tail assembly. According to at least some examples, the heat sink 128 facilitates maintaining the ambient temperature of one of the internal components of the spherical assembly 110 within any suitable range that is not outside the international or other recognized safety standards with respect to the time of operating the camera; The exposed surface has a touch temperature that is not within any suitable range outside the international or other recognized safety standards.

就散熱器128之幾何形狀而言,散熱器128之經空氣暴露表面之表面邊緣144鄰接第一殼體部分124之一周邊邊緣136。類似地,散熱器128之經空氣暴露表面之表面邊緣148鄰接第二殼體部分132之一周邊邊緣140。並且,應注意,如本文中所使用之術語「周邊邊緣」有時被熟習模製(用於製造)技術者稱為一「分離線」或一「分割線」。 As far as the geometry of the heat sink 128 is concerned, the surface edge 144 of the air-exposed surface of the heat sink 128 adjoins a peripheral edge 136 of the first housing portion 124. Similarly, the surface edge 148 of the air-exposed surface of the heat sink 128 abuts a peripheral edge 140 of the second housing portion 132. Also, it should be noted that the term "peripheral edge" as used herein is sometimes referred to as a "separation line" or a "division line" by those familiar with molding (for manufacturing) technology.

如圖1中所展示,表面邊緣144及148在形狀及尺寸上分別與周邊邊緣136及140匹配使得由散熱器128之經空氣暴露表面以及第一互 補式殼體部分124及第二互補式殼體部分132之表面形成之一總體複合表面係實質上連續且均勻的。並且,可認為上述邊緣之間具有齊平鄰接以提供總體複合表面之組合不顯眼性。 As shown in FIG. 1, the surface edges 144 and 148 match the peripheral edges 136 and 140 in shape and size, respectively, so that the air-exposed surface of the heat sink 128 and the first mutual The surfaces of the complementary housing portion 124 and the second complementary housing portion 132 form an overall composite surface that is substantially continuous and uniform. In addition, it can be considered that there is flush abutment between the above-mentioned edges to provide the overall composite surface with unobtrusive combination.

將注意,由於表面邊緣136圍繞總成之總體球體形狀描繪比表面邊緣140大之一圓形,因此由表面邊緣144描繪出之圓形亦比由表面邊緣148描繪出之圓形大。因此所圖解說明之散熱器128在經暴露表面之區域中朝向後漸縮。並且,在所圖解說明之實例性實施例中,周邊邊緣136係處於球形總成110之一中點處,此之影響可為在使用傳統模製程序時限制球形形狀構造所需之部件的數目。在替代實例性實施例中,預期此散熱器區域之不同漸縮及/或擴張。 It will be noted that since the overall spherical shape of the surface edge 136 surrounding the assembly is depicted as a circle larger than the surface edge 140, the circle depicted by the surface edge 144 is also larger than the circle depicted by the surface edge 148. The illustrated heat sink 128 therefore tapers towards the rear in the area of the exposed surface. Also, in the illustrated exemplary embodiment, the peripheral edge 136 is located at one of the midpoints of the spherical assembly 110. This effect can be used to limit the number of parts required for spherical shape construction when using traditional molding procedures. . In alternative exemplary embodiments, a different tapering and/or expansion of this heat sink area is expected.

圖2圖解說明圖1中所展示之圓頂攝影機裝置100之球形總成110之一剖面圖。如所展示,多個組件被裝納於球形總成110內,包含一透鏡與成像單元210、IR發射器214、一感測器印刷電路板總成(PCBA)218、一數位PCBA 222,及經定位於數位PCBA 222與散熱器128之間的熱界面材料226(在所圖解說明之實例性實施例中,更具體而言,熱界面材料226係一適合大小之間隙墊)。關於透鏡與成像單元210,其擷取圓頂攝影機裝置100之視域中之一場景之影像及視訊。所擷取影像及視訊在經耦合至透鏡與成像單元210之PCBA中經處理。此處理可包含將所輸出影像資料格式化為各種影像標準,諸如(舉例而言)H.264或H.265。另外,此處理可進一步包含:使用視訊分析來分析所擷取影像及視訊,以偵測目標且對目標進行分類;及壓縮、編碼及解碼所擷取影像及視訊。 FIG. 2 illustrates a cross-sectional view of the spherical assembly 110 of the dome camera device 100 shown in FIG. 1. As shown, multiple components are housed in the spherical assembly 110, including a lens and imaging unit 210, an IR emitter 214, a sensor printed circuit board assembly (PCBA) 218, a digital PCBA 222, and The thermal interface material 226 positioned between the digital PCBA 222 and the heat sink 128 (in the illustrated example embodiment, more specifically, the thermal interface material 226 is a gap pad of a suitable size). Regarding the lens and imaging unit 210, it captures images and videos of a scene in the field of view of the dome camera device 100. The captured images and videos are processed in the PCBA coupled to the lens and imaging unit 210. This processing may include formatting the output image data into various image standards, such as, for example, H.264 or H.265. In addition, this processing may further include: analyzing the captured images and videos using video analysis to detect and classify the targets; and compressing, encoding, and decoding the captured images and videos.

參考圖1及圖2兩者,球形總成110包含光學清透窗158及IR透明窗或小透鏡162。IR發射器214係定位於IR透明窗162後面。關於透明窗158,其允許圓頂攝影機裝置100外部之光通過進入至球形總成110中,該光然後被成像單元210擷取以形成影像及視訊。影像感測器可係熟習此項技術者認為適合之任何感測器部分,包含(舉例而言)CMOS、NMOS或CCD。 Referring to both FIGS. 1 and 2, the spherical assembly 110 includes an optical clear window 158 and an IR transparent window or small lens 162. The IR emitter 214 is positioned behind the IR transparent window 162. Regarding the transparent window 158, it allows light outside the dome camera device 100 to pass into the spherical assembly 110, and the light is then captured by the imaging unit 210 to form images and videos. The image sensor can be any part of the sensor deemed suitable by those familiar with the technology, including, for example, CMOS, NMOS, or CCD.

關於IR小透鏡162,其可係由允許IR光通過之一黑色材料製成,藉此幫助IR發射器214融入球形總成110之外觀中。併入有IR小透鏡162及透明窗158之一光滑球形表面的使用使得更難以辨別成像單元210面向哪一方向,且允許圓頂攝影機裝置100之一較小架構。並且,應注意,在某些實例中,圓頂攝影機裝置100可既不包含IR發射器214亦不包含IR小透鏡162。換言之,圓頂攝影機裝置100之IR區段係一選用區段。不存在圓頂攝影機裝置100之IR區段之一影像可係對熱消散之一經減少的需求。 Regarding the IR small lens 162, it can be made of a black material that allows IR light to pass through, thereby helping the IR emitter 214 to blend into the appearance of the spherical assembly 110. The use of a smooth spherical surface incorporating the IR lenslet 162 and the transparent window 158 makes it more difficult to discern which direction the imaging unit 210 faces, and allows a smaller architecture of the dome camera device 100. Also, it should be noted that in some examples, the dome camera device 100 may include neither the IR emitter 214 nor the IR lenslet 162. In other words, the IR section of the dome camera device 100 is an optional section. The absence of an image of the IR section of the dome camera device 100 may result in a reduced demand for heat dissipation.

參考圖2,所圖解說明散熱器128界定圍繞散熱器128延伸完整圓形之一凹槽130。凹槽130經定大小及經塑形以與第二殼體部分132之一形狀互補卡扣137對準。此配置保持第二殼體部分132固定至散熱器128同時允許散熱器128及第一殼體部分124相對於第二殼體部分132之方位角旋轉。 Referring to FIG. 2, the illustrated heat sink 128 defines a groove 130 that extends around the heat sink 128 in a complete circle. The groove 130 is sized and shaped to align with a complementary buckle 137 of the second housing portion 132. This configuration keeps the second housing part 132 fixed to the heat sink 128 while allowing the azimuth rotation of the heat sink 128 and the first housing part 124 relative to the second housing part 132.

圖3圖解說明球形總成110之一透視圖,其中第一殼體部分124以一部分拆卸狀態展示以顯露出球形總成110之內部組件。第一殼體部分124上之外部凹槽156(其經提供以緩解模製問題)平行於球形總成110之旋轉方向而定位。圖3中亦展示界定於散熱器128之環形壁中之一孔徑 302。孔徑302暴露經提供以達成圓頂攝影機裝置100之一重設之一重設成出廠默認值開關。一狀態指示燈304毗鄰孔徑302以促進提供表示狀態資訊之可見光。 FIG. 3 illustrates a perspective view of the spherical assembly 110 in which the first housing part 124 is shown in a partially disassembled state to reveal the internal components of the spherical assembly 110. The outer groove 156 on the first housing part 124 (which is provided to alleviate molding problems) is positioned parallel to the rotation direction of the spherical assembly 110. Figure 3 also shows an aperture defined in the annular wall of the radiator 128 302. The aperture 302 is exposed to a switch provided to achieve a reset of one of the dome camera apparatus 100 to a factory default value. A status indicator light 304 is adjacent to the aperture 302 to facilitate the provision of visible light indicating status information.

圖4係球形總成110之內部組件(圖3中所展示)之一分解圖。如先前本文中所闡述,所圖解說明球形總成110內包含兩個PCBA:感測器PCBA 218及數位PCBA 222。感測器PCBA 218包含呈板下面上之觸點形式之經暴露銅。在球形總成110之裝配期間,此經暴露銅與散熱器128之內部環406接觸。內部環406與經暴露銅之間的此直接接觸促進熱自感測器PCBA 218至散熱器128之傳輸。與感測器PCBA 218相比而言,數位PCBA 222經由熱界面材料226熱連接至散熱器128。在至少一項實例中,熱界面材料226直接附接至產生大部分熱之數位PCBA 222之半導體晶片,該半導體晶片可係一晶片上系統(SoC),舉例而言。 FIG. 4 is an exploded view of the internal components of the spherical assembly 110 (shown in FIG. 3). As previously described in this article, the illustrated spherical assembly 110 includes two PCBAs: the sensor PCBA 218 and the digital PCBA 222. The sensor PCBA 218 contains exposed copper in the form of contacts on the underside of the board. During the assembly of the spherical assembly 110, this exposed copper is in contact with the inner ring 406 of the heat sink 128. This direct contact between the inner ring 406 and the exposed copper facilitates the transfer of heat from the sensor PCBA 218 to the heat sink 128. In contrast to the sensor PCBA 218, the digital PCBA 222 is thermally connected to the heat sink 128 via the thermal interface material 226. In at least one example, the thermal interface material 226 is directly attached to the semiconductor chip of the digital PCBA 222 that generates most of the heat. The semiconductor chip may be a system on chip (SoC), for example.

散熱器128之一後壁內界定複數個有裂縫孔416。孔416可藉由給熱空氣提供逸出至球形總成110之後區域中之一路徑來促進降低熱產生內部組件之區域內之溫度。在球形總成110經完全裝配時孔416將由第二殼體部分132覆蓋;然而,參考展示球形總成110之一後透視圖之圖5,第二殼體部分132中界定一孔徑185,該孔徑允許熱空氣逸出球形總成110。在所圖解說明之實例性實施例中,孔徑185位於鳩尾榫186之端之間。在至少某些實例中,孔徑185另外充當一電纜通道,電纜穿過該電纜通道來將電力攜載至裝置組件。 A plurality of cracked holes 416 are defined in a rear wall of the heat sink 128. The holes 416 can facilitate the reduction of the temperature in the area of the heat generating internal components by providing a path for the hot air to escape to the area behind the spherical assembly 110. When the spherical assembly 110 is fully assembled, the hole 416 will be covered by the second housing portion 132; however, referring to Figure 5 showing a rear perspective view of the spherical assembly 110, the second housing portion 132 defines an aperture 185, which The aperture allows hot air to escape the spherical assembly 110. In the illustrated example embodiment, the aperture 185 is located between the ends of the dovetail 186. In at least some instances, the aperture 185 additionally serves as a cable channel through which the cable passes to carry power to the device components.

再次參考圖4,透鏡與成像單元210包含一夾具432。夾具432用於在使用一固定焦點透鏡聚焦之後將透鏡與成像單元210固持在適當位置中。亦展示固持IR發射器214之一IR發射器PCBA 433。信號電纜 435將IR發射器PCBA 433耦合至數位PCBA 222。 Referring again to FIG. 4, the lens and imaging unit 210 includes a clamp 432. The clamp 432 is used to hold the lens and the imaging unit 210 in a proper position after focusing with a fixed focus lens. The IR transmitter PCBA 433, one of the fixed IR transmitters 214, is also shown. signal cable 435 couples the IR transmitter PCBA 433 to the digital PCBA 222.

接下來,圖4中亦展示一墊圈422。墊圈422經定位以鄰接球形總成110之內部側且藉此提供一不透明障壁以將IR發射器214自透鏡與成像單元210分離。 Next, a washer 422 is also shown in FIG. 4. The gasket 422 is positioned to abut the inner side of the spherical assembly 110 and thereby provide an opaque barrier to separate the IR emitter 214 from the lens and the imaging unit 210.

圖6圖解說明球形總成110之一側視立面圖,其中第二殼體部分132展示為自球形總成110之其餘部分拆卸以顯露出散熱器128之細節。凹槽130係清晰可見的。並且,卡扣137展示為位於臂502上。可在第二殼體部分132上提供任何適合數目個類似於臂502之臂。作為所圖解說明臂502之一替代方案,類似於所圖解說明卡扣137之一卡扣可併入至第二殼體部分132之內部表面中且與第二殼體部分132之內部表面成整體。 6 illustrates a side elevational view of the spherical assembly 110, in which the second housing portion 132 is shown as being disassembled from the rest of the spherical assembly 110 to reveal the details of the heat sink 128. The groove 130 is clearly visible. Also, the buckle 137 is shown as being located on the arm 502. Any suitable number of arms similar to the arms 502 may be provided on the second housing part 132. As an alternative to the illustrated arm 502, a buckle similar to the illustrated buckle 137 may be incorporated into and integral with the inner surface of the second housing portion 132 .

可做出所闡述實施例之特定變更及修改。舉例而言,儘管本發明之特定實施例經設計以包含於一攝影機(舉例而言,一圓頂攝影機)中,但本發明之其他替代實施例適合於其中一經暴露散熱器係適當的之其他類型之電子裝置。此等其他類型之電子裝置可包含(舉例而言)無人飛機、行動電子裝置、智慧廚房裝置等。可在無過度困難或發明性努力之情況下由熟習此項技術者做出如攝影機實施例與此等替代實施例之間的所需設計修改。因此,上文所論述之實施例視為係圖解說明的而非限制性的,且本發明應解釋為僅受隨附申請專利範圍限制。 Specific changes and modifications to the described embodiments can be made. For example, although certain embodiments of the present invention are designed to be included in a camera (for example, a dome camera), other alternative embodiments of the present invention are suitable for other types where an exposed heat sink is appropriate的电子装置。 The electronic device. These other types of electronic devices may include, for example, drones, mobile electronic devices, smart kitchen devices, and so on. Those skilled in the art can make necessary design modifications between the camera embodiment and these alternative embodiments without undue difficulty or inventive effort. Therefore, the above-discussed embodiments are considered to be illustrative rather than restrictive, and the present invention should be construed as being limited only by the scope of the attached patent application.

2-2:線 2-2: line

100:圓頂攝影機裝置 100: Dome camera device

110:可移動球形總成/球形總成 110: Movable spherical assembly/spherical assembly

120:靜止邊框部分/邊框部分 120: static frame part/frame part

122:平坦表面/表面 122: flat surface/surface

123:上部圓形邊緣 123: upper rounded edge

124:第一殼體部分/第一互補式殼體部分 124: first housing part/first complementary housing part

128:散熱器 128: radiator

132:第二殼體部分/第二互補式殼體部分 132: second housing part/second complementary housing part

136:周邊邊緣/表面邊緣 136: Peripheral edge/surface edge

140:周邊邊緣/表面邊緣 140: Peripheral edge/surface edge

144:邊緣/表面邊緣 144: Edge/Surface Edge

148:邊緣/表面邊緣 148: Edge/Surface Edge

156:外部凹槽 156: External groove

158:光學清透窗/透明窗 158: Optical clear window/transparent window

162:IR透明窗/IR小透鏡 162: IR transparent window/IR small lens

Claims (18)

一種圓頂攝影機,其包括:一第一半球形殼體部分,其包含在一第一周邊邊緣處結束之一第一表面;一第二半球形殼體部分,其包含一卡扣(snap)及在一第二周邊邊緣處結束之一第二表面,該第二半球形殼體部分係與該第一半球形殼體部分互補;一散熱器,其定義一凹槽(groove)且具有為環形形狀且經插置於該第一周邊邊緣與該第二周邊邊緣之間之一經空氣暴露表面,且鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣之該經空氣暴露表面的表面邊緣在形狀及尺寸上係分別與該第一周邊邊緣及該第二周邊邊緣匹配,使得由該等殼體部分之該第一表面及該第二表面以及該散熱器之該經空氣暴露表面所形成之一總體複合表面係實質上連續且均勻的;及至少一個熱產生裝置組件,其位於該圓頂攝影機內且經連接至該散熱器,其中在該圓頂攝影機經接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走,及其中該卡扣係與該凹槽形狀互補,該凹槽為經定大小及經塑形以與該卡扣對準。 A dome camera, comprising: a first hemispherical housing part, which includes a first surface ending at a first peripheral edge; a second hemispherical housing part, which includes a snap And a second surface ending at a second peripheral edge, the second hemispherical shell part is complementary to the first hemispherical shell part; a heat sink, which defines a groove and has An air-exposed surface of a ring shape and inserted between the first peripheral edge and the second peripheral edge, and adjacent to the first peripheral edge and the second peripheral edge of the housing parts, the air-exposed The surface edge of the surface is matched with the first peripheral edge and the second peripheral edge in shape and size, respectively, so that the first surface and the second surface of the housing parts and the air passing through the radiator An overall composite surface formed by the exposed surface is substantially continuous and uniform; and at least one heat generating device component located in the dome camera and connected to the heat sink, wherein the dome camera is connected and When the device component generates heat, the heat is sucked away from the device component through the radiator, and the shape of the buckle is complementary to the groove, and the groove is sized and shaped to align with the buckle allow. 如請求項1之圓頂攝影機,其中該第一半球形殼體部分界定一第一殼體空間,該散熱器界定在該等表面邊緣之間延伸之一第二殼體空間,且該 第二半球形殼體部分界定一第三殼體空間,並且該圓頂攝影機之一總體殼體空間係由該第一殼體空間、該第二殼體空間及該第三殼體空間構成。 Such as the dome camera of claim 1, wherein the first hemispherical housing portion defines a first housing space, the heat sink defines a second housing space extending between the surface edges, and the The second hemispherical shell part defines a third shell space, and an overall shell space of the dome camera is constituted by the first shell space, the second shell space and the third shell space. 如請求項2之圓頂攝影機,其中該至少一個熱產生裝置組件包含位於該第二殼體空間內之一感測器印刷電路板總成及一數位印刷電路板總成。 Such as the dome camera of claim 2, wherein the at least one heat generating device component includes a sensor printed circuit board assembly and a digital printed circuit board assembly located in the second housing space. 如請求項1之圓頂攝影機,其中該散熱器之該經空氣暴露表面係經電塗佈或經粉末塗佈之一精加工表面。 The dome camera of claim 1, wherein the air-exposed surface of the heat sink is a finishing surface that is electro-coated or powder-coated. 如請求項1之圓頂攝影機,其中該第一半球形殼體部分及該第二半球形殼體部分兩者皆係由聚碳酸酯與丙烯腈-丁二烯-苯乙烯之一組合製成。 Such as the dome camera of claim 1, wherein both the first hemispherical housing part and the second hemispherical housing part are made of a combination of polycarbonate and acrylonitrile-butadiene-styrene . 一種功率消耗電子裝置,其包括:一第一互補式殼體部分及一第二互補式殼體部分,該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面,且該第二殼體部分包含一卡扣及在一第二周邊邊緣處結束之一第二表面;一散熱器,其定義一凹槽且具有為閉合曲線形且經插置於該第一周邊邊緣與該第二周邊邊緣之間之一經空氣暴露表面,且鄰接該等殼體部分之該第一周邊邊緣及該第二周邊邊緣之該經空氣暴露表面的表面邊緣在形狀及尺寸上係分別與該第一周邊邊緣及該第二周邊邊緣匹配,使得由該等殼體部分之該第一表面及該第二表面以及該散熱器之該經空氣暴露表面所形成之一總體複合表面係實質上連續且均勻的;及至少一個熱產生裝置組件,其位於該電子裝置內且經連接至該散熱 器,其中該電子裝置係一圓頂攝影機,且該第一殼體部分及該第二殼體部分在與該散熱器裝配在一起時形成該圓頂攝影機之一球形形狀殼體,其中在該電子裝置經接通且該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走,及其中該卡扣係與該凹槽形狀互補,該凹槽為經定大小及經塑形以與該卡扣對準。 A power consuming electronic device, comprising: a first complementary housing part and a second complementary housing part, the first housing part includes a first surface that ends at a first peripheral edge, and the The second housing part includes a buckle and a second surface ending at a second peripheral edge; a heat sink defines a groove and has a closed curve shape and is inserted into the first peripheral edge and One of the second peripheral edges has an air-exposed surface, and the surface edges of the air-exposed surface adjacent to the first peripheral edge and the second peripheral edge of the housing parts are respectively the same in shape and size as the The first peripheral edge and the second peripheral edge match such that an overall composite surface formed by the first surface and the second surface of the housing parts and the air-exposed surface of the heat sink is substantially continuous And uniform; and at least one heat generating device component located in the electronic device and connected to the heat sink The electronic device is a dome camera, and the first housing part and the second housing part form a spherical-shaped housing of the dome camera when assembled with the heat sink. When the device is switched on and the device component generates heat, the heat is sucked away from the device component through the radiator, and the shape of the buckle is complementary to the groove, and the groove is sized and shaped to Align with the buckle. 如請求項6之功率消耗電子裝置,其中該至少一個熱產生裝置組件包含含納於該球形形狀殼體內之一感測器印刷電路板總成及一數位印刷電路板總成。 The power consumption electronic device of claim 6, wherein the at least one heat generating device component includes a sensor printed circuit board assembly and a digital printed circuit board assembly contained in the spherical shell. 如請求項7之功率消耗電子裝置,進一步包括在該球形形狀殼體內且經定位於該數位印刷電路板總成與該散熱器之間之一熱界面材料。 For example, the power consumption electronic device of claim 7, further comprising a thermal interface material in the spherical shape housing and positioned between the digital printed circuit board assembly and the heat sink. 如請求項7之功率消耗電子裝置,其中該感測器印刷電路板總成具有與該散熱器直接接觸之經暴露銅。 The power consumption electronic device of claim 7, wherein the sensor printed circuit board assembly has exposed copper in direct contact with the heat sink. 如請求項6之功率消耗電子裝置,其中該散熱器之該經空氣暴露表面係經電塗佈或經粉末塗佈之一精加工表面。 The power consumption electronic device of claim 6, wherein the air-exposed surface of the heat sink is a finishing surface that is electro-coated or powder-coated. 如請求項6之功率消耗電子裝置,其中該第一周邊邊緣及該第二周邊邊緣中之每一者係至少部分地圓錐曲線形狀。 The power consumption electronic device of claim 6, wherein each of the first peripheral edge and the second peripheral edge is at least partially in a conic shape. 一種功率消耗電子裝置,其包括:一第一互補式殼體部分及一第二互補式殼體部分,該第一殼體部分包含在一第一周邊邊緣處結束之一第一表面,且該第二殼體部分包含一卡扣及在一第二周邊邊緣處結束之一第二表面;一散熱器,其定義一凹槽且具有經插置於該第一周邊邊緣與該第二周邊邊緣之間之一經空氣暴露表面,且該經空氣暴露表面之表面邊緣係分別與該等殼體部分之該第一周邊邊緣及該第二周邊邊緣匹配以實現齊平鄰接,以提供由該等殼體部分之該第一表面及該第二表面以及該散熱器之該經空氣暴露表面所形成之一總體複合表面的組合不顯眼性;及至少一個熱產生裝置組件,其位於該裝置內且經連接至該散熱器,其中該裝置係一圓頂攝影機,且該第一殼體部分及該第二殼體部分在與該散熱器裝配在一起時形成該圓頂攝影機之一球形形狀殼體,其中在該裝置組件產生熱時,經由該散熱器將熱自該裝置組件吸走,及其中該卡扣係與該凹槽形狀互補,該凹槽為經定大小及經塑形以與該卡扣對準。 A power consuming electronic device, comprising: a first complementary housing part and a second complementary housing part, the first housing part includes a first surface that ends at a first peripheral edge, and the The second housing part includes a buckle and a second surface that ends at a second peripheral edge; a heat sink that defines a groove and is inserted into the first peripheral edge and the second peripheral edge One of the air-exposed surfaces, and the surface edge of the air-exposed surface is matched with the first peripheral edge and the second peripheral edge of the shell parts to achieve flush abutment, so as to provide the shell The combination of the first surface and the second surface of the body portion and the air-exposed surface of the heat sink forming an overall composite surface is inconspicuous; and at least one heat generating device component located in the device and passing through Connected to the heat sink, wherein the device is a dome camera, and the first housing part and the second housing part form a spherical-shaped housing of the dome camera when assembled with the heat sink, wherein When the device component generates heat, the heat is sucked away from the device component through the radiator, and the shape of the buckle is complementary to the groove, and the groove is sized and shaped to match the buckle alignment. 如請求項12之功率消耗電子裝置,其中該至少一個熱產生裝置組件包含含納於該球形形狀殼體內之一感測器印刷電路板總成及一數位印刷電路板總成。 The power consumption electronic device of claim 12, wherein the at least one heat generating device component includes a sensor printed circuit board assembly and a digital printed circuit board assembly contained in the spherical shell. 如請求項13之功率消耗電子裝置,進一步包括在該球形形狀殼體內 且經定位於該數位印刷電路板總成與該散熱器之間之一熱界面材料。 For example, the power consumption electronic device of claim 13, further included in the spherical shape housing And it is positioned as a thermal interface material between the digital printed circuit board assembly and the heat sink. 如請求項13之功率消耗電子裝置,其中該感測器印刷電路板總成具有與該散熱器直接接觸之經暴露銅。 The power consumption electronic device of claim 13, wherein the sensor printed circuit board assembly has exposed copper in direct contact with the heat sink. 如請求項12之功率消耗電子裝置,其中該散熱器之該經空氣暴露表面係經電塗佈或經粉末塗佈之一精加工表面。 The power consuming electronic device of claim 12, wherein the air-exposed surface of the heat sink is a finishing surface that is electro-coated or powder-coated. 如請求項12之功率消耗電子裝置,其中該第一周邊邊緣及該第二周邊邊緣中之每一者係至少部分地圓錐曲線形狀。 Such as the power consumption electronic device of claim 12, wherein each of the first peripheral edge and the second peripheral edge is at least partially in a conic shape. 如請求項12之功率消耗電子裝置,其中該第一互補式殼體部分及該第二互補式殼體部分兩者皆係由聚碳酸酯(PC)與丙烯腈-丁二烯-苯乙烯之一組合所製成。 For example, the power consumption electronic device of claim 12, wherein the first complementary housing part and the second complementary housing part are both made of polycarbonate (PC) and acrylonitrile-butadiene-styrene Made by a combination.
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