TWI738574B - Polishing equipment for a spherical body - Google Patents
Polishing equipment for a spherical body Download PDFInfo
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- TWI738574B TWI738574B TW109141253A TW109141253A TWI738574B TW I738574 B TWI738574 B TW I738574B TW 109141253 A TW109141253 A TW 109141253A TW 109141253 A TW109141253 A TW 109141253A TW I738574 B TWI738574 B TW I738574B
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Abstract
Description
本發明是有關於一種用於球體之拋光設備。The present invention relates to a polishing equipment for spheres.
在許多球狀產品上,為求表面光滑、球體真圓等條件,通常需要在球狀產品表面進行研磨拋光。為了能有效穩定球狀產品、以及對於球面全方位地進行完整研磨拋光,習知研磨拋光裝置包括至少三研磨單元及至少一撥動單元,該至少三研磨單元分別位於球狀產品之其中一角位,對於球面之不同區域分別研磨,該至少一撥動單元則供致使該球狀產品偏轉,以期該至少三研磨單元能確實研磨到球面之所有區域,TW201436935所揭示者極為此類。In many spherical products, in order to obtain conditions such as smooth surface and true roundness of the sphere, it is usually necessary to polish and polish the surface of the spherical product. In order to effectively stabilize the spherical product and perform complete grinding and polishing on the spherical surface in all directions, the conventional grinding and polishing device includes at least three grinding units and at least one toggle unit, the at least three grinding units are respectively located at one of the corners of the spherical product For the different areas of the spherical surface to be ground separately, the at least one toggle unit is used to cause the spherical product to deflect, so that the at least three grinding units can indeed grind to all areas of the spherical surface. TW201436935 reveals this kind of thing.
然而,此類習知研磨拋光裝置之構造極為複雜、製造成本較高,此外,多個研磨單元與撥動單元之間的配合不易精準配合控制,容易產生誤差,致使拋光效率、拋光穩定性及拋光光滑不佳等問題,且球狀產品亦無法獲得較佳之真圓度。However, such conventional grinding and polishing devices have extremely complex structures and high manufacturing costs. In addition, the coordination between multiple grinding units and toggle units is not easy to precisely coordinate and control, and errors are likely to occur, resulting in polishing efficiency, polishing stability, and Poor polishing and other problems, and spherical products cannot obtain better roundness.
因此,有必要提供一種新穎且具有進步性之用於球體之拋光設備,以解決上述之問題。Therefore, it is necessary to provide a novel and progressive polishing equipment for spheres to solve the above-mentioned problems.
本發明之主要目的在於提供一種用於球體之拋光設備,結構簡單,且具良好拋光效率、拋光穩定性及拋光效果。The main purpose of the present invention is to provide a polishing equipment for spheres, which has a simple structure and good polishing efficiency, polishing stability and polishing effect.
為達成上述目的,本發明提供一種用於球體之拋光設備,包括:一基座,包括一筒件,該筒件供支承一待拋光之球體;一流體增壓單元,連通至該筒件之內部,供將流體供入該筒件內而推撐該球體;一研磨件,與該筒件呈可相對運動之配置,供研磨該球體之表面且同時摩擦帶動該球體轉動。In order to achieve the above object, the present invention provides a polishing device for a ball, including: a base, including a cylinder for supporting a ball to be polished; a fluid pressurizing unit connected to the cylinder The inside is used for supplying fluid into the cylinder to push and support the sphere; a grinding piece is arranged in a relatively movable configuration with the cylinder for grinding the surface of the sphere and at the same time friction driving the sphere to rotate.
以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。The following examples are only used to illustrate the possible implementation aspects of the present invention, but they are not intended to limit the scope of protection of the present invention, and are described first.
請參考圖1至6,其顯示本發明之一較佳實施例,本發明之用於球體之拋光設備1包括一基座10、一流體增壓單元20及一研磨件30。Please refer to FIGS. 1 to 6, which show a preferred embodiment of the present invention. The
該基座10包括一筒件11,該筒件11供支承一待拋光之球體60;該流體增壓單元20連通至該筒件11之內部,供將流體(氣體或液體)供入該筒件11內而推撐該球體60,減少該球體60之摩擦阻力或可使該球體60直接相對該筒件11懸浮;該研磨件30與該筒件11呈可相對運動之配置,供研磨該球體60之表面且同時摩擦帶動該球體60轉動。藉此,該用於球體之拋光設備1結構簡單、成本低,且利用流體均勻且全方向性地推撐該球體60,在研磨過程中該研磨件30與該球體60之接觸極為穩定,故該球體60之拋光效率、拋光穩定性及拋光效果(例如光滑程度、真圓度等)極佳。The
該基座10另包括一移動軌道12及一可移動地設於該移動軌道12上之承載件13,該筒件11設置於該承載件13上,較佳地,該筒件11及該承載件13至少其中一者具有較佳之吸震效果(剛性較低者),有助研磨穩定性。該基座10另包括一連接該承載件13之驅動裝置14,該驅動裝置14供驅動該承載件13相對該研磨件30移動,使該球體60可快速位移至待研磨位置、或完成研磨後快速退回。該筒件11較佳係可更換地安裝於該承載件13上,可依據不同尺寸之球體選用適當尺寸的筒件11。在本實施例中,該驅動裝置14為(氣壓、油壓等)伸縮壓缸裝置,然亦可使用例如螺桿、鍊或帶等傳動機構進行驅動。The
較佳地,該筒件11可沿一第一方向D1移動,該研磨件30可沿一第二方向D2移動,該第二方向D2不平行於該第一方向D1,在本實施例中,該第二方向D2垂直於該第一方向D1,舉例而言,相對上,該筒件11可前後(第一方向D1)移動,該研磨件30可左右(第二方向D2)或/及上下移動,據此,可依據該球體60之尺寸調整最佳之相對研磨位置及角度。較佳地,該研磨件30可建構為可相對於該第一方向D1擺動(沿第三方向D3),透過改變該研磨件30與該球體60之接觸位置及角度,可得到不同之拋光效率、拋光穩定性及拋光光滑程度。
Preferably, the
在本實施例中,該筒件11具有單一開口111,該開口111供接納該球體60之一部分,當該流體通入該筒件11之內部時較快具有較佳之推撐效果,且易於控制該流體對於該球體60之推撐程度(接觸摩擦大小、或懸浮)。該筒件11之一端罩設有一供承放該球體60之多通道層40,該多通道層40可為纖維布層,編織或非編織結構、一體或非一體成型構件。該多通道層40允許該流體通過,使氣流更加穩定,該多通道層40進一步均勻化該流體對於該球體60之支承力的分佈,更加優化、穩定了研磨之條件。此外,該多通道層40在該球體60拋光、轉動過程中,亦可有效刮除研磨產生之粉屑,可提升拋光表面光滑度。該多通道層40透過一束件50定位地安裝於該筒件11上,該束件50較佳為周長可調整之環件,可方便快速安裝、更換該多通道層40。
In this embodiment, the
該流體增壓單元20包括一泵浦21及一連通該泵浦21與該筒件11之內部的管件22,該管件22為可撓,藉此可適用於不同工作環境之配置需求,具有較佳之適用性及調整性。該流體由該泵浦21增壓後通入該筒件11之內部,藉由增壓後之該流體向上推頂該球體60,降低該球體60之摩擦阻力,方便有效且平順地進行研磨作業。
The fluid pressurizing
該研磨件30包括一研磨面31,在該研磨面31面向該筒件11之方向上,該研磨面31之中心線C1與該筒件11之中心線C2相互錯位,藉此,在研磨過程中,該球體60會自動被該研磨件30帶動進行左或右之角度偏轉,因此能自動研磨到該球體60之表面的所有方位區域。較佳地,該研磨面31與該球體60之接觸位置位於該球體60之上半球區域,如此可兼顧研磨程度、該球體60之穩定性、該球體60能被確實帶轉。The grinding
1:用於球體之拋光設備 10:基座 11:筒件 111:開口 12:移動軌道 13:承載件 14:驅動裝置 20:流體增壓單元 21:泵浦 22:管件 30:研磨件 31:研磨面 40:多通道層 50:束件 60:球體 C1, C2:中心線 D1:第一方向 D2:第二方向 D3:第三方向 1: Polishing equipment for spheres 10: Pedestal 11: Tube 111: open 12: moving track 13: Carrier 14: drive device 20: Fluid booster unit 21: Pump 22: pipe fittings 30: Grinding parts 31: Grinding surface 40: Multi-channel layer 50: Bundle 60: Sphere C1, C2: Centerline D1: First direction D2: second direction D3: Third party
圖1為本發明一較佳實施例之立體圖。 圖2為本發明一較佳實施例之分解圖。 圖3為本發明一較佳實施例之拋光作業之立體圖。 圖4為本發明一較佳實施例之拋光作業之側視圖。 圖5為本發明一較佳實施例之拋光作業之俯視圖。 圖6為圖5之局部放大圖。 Figure 1 is a perspective view of a preferred embodiment of the present invention. Figure 2 is an exploded view of a preferred embodiment of the present invention. Fig. 3 is a perspective view of a polishing operation of a preferred embodiment of the present invention. Fig. 4 is a side view of the polishing operation of a preferred embodiment of the present invention. Fig. 5 is a top view of the polishing operation of a preferred embodiment of the present invention. Fig. 6 is a partial enlarged view of Fig. 5.
1:用於球體之拋光設備 1: Polishing equipment for spheres
10:基座 10: Pedestal
11:筒件 11: Tube
12:移動軌道 12: moving track
13:承載件 13: Carrier
14:驅動裝置 14: drive device
22:管件 22: pipe fittings
30:研磨件 30: Grinding parts
31:研磨面 31: Grinding surface
40:多通道層 40: Multi-channel layer
Claims (9)
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TW109141253A TWI738574B (en) | 2020-11-25 | 2020-11-25 | Polishing equipment for a spherical body |
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TW109141253A TWI738574B (en) | 2020-11-25 | 2020-11-25 | Polishing equipment for a spherical body |
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TW202220792A TW202220792A (en) | 2022-06-01 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5116545Y2 (en) * | 1972-01-21 | 1976-05-01 | ||
JP2001150323A (en) * | 1999-11-24 | 2001-06-05 | Olympus Optical Co Ltd | Spherical surface generating device and spherical surface generating method |
US6439982B1 (en) * | 1999-12-06 | 2002-08-27 | Edward O. Klukos | Ball spinner and polish apparatus |
TW201231215A (en) * | 2010-12-14 | 2012-08-01 | Nike International Ltd | Method of deburring a ball |
JP5116545B2 (en) | 2007-05-25 | 2013-01-09 | キヤノン株式会社 | Liquid ejection method |
TW201503930A (en) * | 2012-12-14 | 2015-02-01 | Kwh Mirka Ab Oy | Support cradle for bowling balls |
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2020
- 2020-11-25 TW TW109141253A patent/TWI738574B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5116545Y2 (en) * | 1972-01-21 | 1976-05-01 | ||
JP2001150323A (en) * | 1999-11-24 | 2001-06-05 | Olympus Optical Co Ltd | Spherical surface generating device and spherical surface generating method |
US6439982B1 (en) * | 1999-12-06 | 2002-08-27 | Edward O. Klukos | Ball spinner and polish apparatus |
JP5116545B2 (en) | 2007-05-25 | 2013-01-09 | キヤノン株式会社 | Liquid ejection method |
TW201231215A (en) * | 2010-12-14 | 2012-08-01 | Nike International Ltd | Method of deburring a ball |
TW201503930A (en) * | 2012-12-14 | 2015-02-01 | Kwh Mirka Ab Oy | Support cradle for bowling balls |
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