TWI737474B - Solid-state optical phased scanning component - Google Patents

Solid-state optical phased scanning component Download PDF

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TWI737474B
TWI737474B TW109129754A TW109129754A TWI737474B TW I737474 B TWI737474 B TW I737474B TW 109129754 A TW109129754 A TW 109129754A TW 109129754 A TW109129754 A TW 109129754A TW I737474 B TWI737474 B TW I737474B
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layer
light
electrode
high dielectric
solid
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TW109129754A
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TW202210862A (en
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劉浚年
施天從
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國立中興大學
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  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

The present invention relates to a solid-state optical phase scanning array component, including: a plurality of optical units, each of the optical units includes a high dielectric constant layer, and a first electrode and a second electrode located on two sides of the high dielectric constant layer, the refractive index of each high dielectric constant layer is changeable as the power condition supplied to first and second electrodes is changed; and a lens unit, located at a light-exiting side facing the plurality of optical units, and including a light-incident surface and a light-exiting surface, being configured to guide light beam incident from the light incident surface to the plurality of optical units to change the path of the light beam, and then the light beam emits out from the light exiting surface.

Description

固態光學相位掃描構件Solid-state optical phase scanning component

本發明是有關於一種固態光學相位掃描構件,用於光達、全像術掃描及結構光掃描。The invention relates to a solid-state optical phase scanning component, which is used for lidar, holographic scanning and structured light scanning.

光達係一光偵測及測距感測器,其用光束來掃描待偵測目標並反射至光達模組所花的時間來量測待偵測目標的距離,其具有高可靠度、長使用壽命、尺寸小、重量輕、成本低等優點。Lidar is a light detection and ranging sensor, which uses a beam of light to scan the target to be detected and reflect the time it takes to measure the distance of the target to be detected. It has high reliability, Long service life, small size, light weight, low cost and other advantages.

習知光達一般是設計為包括複數個點光源矩陣,再透過機械移動掃描構件來調整各別點光源之光束角度,因此機械移動掃描構件結構複雜、製程不易、成本高,且各別機械移動掃描構件之作動可能因製造或/及控制等誤差,存在精確度不足之疑慮。The conventional LiDAR is generally designed to include a plurality of point light source matrices, and then adjust the beam angle of each point light source by mechanically moving the scanning member. Therefore, the mechanically movable scanning member has a complicated structure, difficult manufacturing process, high cost, and separate mechanically moved scanning members. The operation may be due to manufacturing or/and control errors, and there is a doubt about insufficient accuracy.

因此,有必要提供一種新穎且具有進步性之固態光學相位掃描構件,以解決上述之問題。Therefore, it is necessary to provide a novel and progressive solid-state optical phase scanning component to solve the above-mentioned problems.

本發明之主要目的在於提供一種固態光學相位掃描構件,可控制光束相位進而調製光束方向以進行掃描。The main purpose of the present invention is to provide a solid-state optical phase scanning component, which can control the phase of the beam and then modulate the direction of the beam for scanning.

為達成上述目的,本發明提供一種固態光學相位掃描構件,包括:複數光學單元,各該光學單元包括一高介電層、及位於該高介電層二側之一第一電極及一第二電極,各該高介電層可在該第一及第二電極施加不同供電條件時具有不同之折射率;及一透鏡單元,位於面對該複數光學單元之一出光側,包括一入光面及一出光面,被配置成可將自該入光面入射之光束導射至該複數光學單元而改變該光束之路徑後由該出光面射出。To achieve the above object, the present invention provides a solid-state optical phase scanning component, including: a plurality of optical units, each of the optical units includes a high dielectric layer, and a first electrode and a second electrode located on both sides of the high dielectric layer Electrodes, each of the high dielectric layers can have different refractive indexes when the first and second electrodes are applied with different power supply conditions; and a lens unit is located on the light-exit side facing the plurality of optical units and includes a light-incident surface And a light-emitting surface configured to guide the light beam incident from the light-incident surface to the plurality of optical units to change the path of the light beam and then be emitted from the light-emitting surface.

以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。The following examples are only used to illustrate the possible implementation aspects of the present invention, but they are not intended to limit the scope of protection of the present invention, and are described first.

請參考圖1至4,其顯示本發明之一較佳實施例,本發明之固態光學相位掃描構件1包括複數光學單元10及一透鏡單元20。Please refer to FIGS. 1 to 4, which show a preferred embodiment of the present invention. The solid-state optical phase scanning component 1 of the present invention includes a plurality of optical units 10 and a lens unit 20.

各該光學單元10包括一高介電層11、及位於該高介電層11二側之一第一電極12及一第二電極13,各該高介電層11可在該第一及第二電極12, 13施加不同供電條件時具有不同之折射率,該供電條件可為電壓、或其他能影響該高介電層11之折射率的供電條件,各該光學單元10可為反射式或穿透式;該透鏡單元20位於面對該複數光學單元10之一出光側14,該透鏡單元20包括一入光面21及一出光面22,該透鏡單元20被配置成可將自該入光面21入射之光束100導射至該複數光學單元10而改變該光束100之路徑後由該出光面22射出,該光束100可為紅外線光束或具有其他波長之光束。其中,該複數光學單元10之高介電層11可建構成可被單獨、分群、或全部一起控制其折射率之變化。藉此,可將單一光源透過不同供電條件簡單地改變該高介電層11之折射率,使光束之間產生相位差,以實現控制光束相位進而調製光束方向,以進行掃描。此外,該複數光學單元10之間的間距可造成各光束之間的光程差,因此再加上改變該高介電層11之折射率所造成之相位差,可達雙重的調校效果。Each of the optical units 10 includes a high dielectric layer 11, and a first electrode 12 and a second electrode 13 located on two sides of the high dielectric layer 11. The two electrodes 12, 13 have different refractive indices when different power supply conditions are applied. The power supply conditions can be voltage or other power supply conditions that can affect the refractive index of the high dielectric layer 11. Each of the optical units 10 can be reflective or Transmissive; the lens unit 20 is located facing the light-exit side 14 of the plurality of optical units 10, the lens unit 20 includes a light-incident surface 21 and a light-exit surface 22, the lens unit 20 is configured to The light beam 100 incident on the light surface 21 is guided to the plurality of optical units 10 to change the path of the light beam 100 and then emitted from the light exit surface 22. The light beam 100 may be an infrared light beam or a light beam with other wavelengths. Wherein, the high dielectric layer 11 of the plurality of optical units 10 can be constructed to be individually, grouped, or all together to control the change of its refractive index. Thereby, a single light source can be transmitted through different power supply conditions to simply change the refractive index of the high-dielectric layer 11 to generate a phase difference between the beams, so as to control the beam phase and then modulate the beam direction for scanning. In addition, the distance between the plurality of optical units 10 can cause the optical path difference between the light beams. Therefore, in addition to the phase difference caused by changing the refractive index of the high dielectric layer 11, a double adjustment effect can be achieved.

該複數光學單元10較佳呈矩陣排列,亦可依據需求成不同排列、組合。該高介電層11為碳化鈦層、氮化矽層、氮化鋁層、鈦酸鋇層、二氧化矽層或壓電陶瓷層,各該高介電層11可為單一層一體成型之高介電薄膜之一部分。該高介電層11之製程上,可使用單晶矽材料,其結構體積小、熱光係數大、調節相位較為容易;而使用氮化矽材料,其損耗小、加工誤差容忍度較大,有利相位的精確控制。該第一電極12位於該透鏡單元20與該高介電層11之間且為接地,該第一電極12為可透光之銀(Ag)、銅(Cu)、金(Au)或透明導電薄膜,該第一電極12之厚度較佳不大於100奈米而允許透光。各該第一電極12為單一層一體成型之金屬薄膜之一部分。各該光學單元10之第二電極13相互獨立地位於該高介電層11之遠離該透鏡單元20之一側,該第二電極13為不透光且包括設於一基層(較佳為不允許透光)上之銀(Ag)、銅(Cu)金(Au)或導電薄膜(其厚度較佳為不小於10奈米),該第二電極13之總厚度較佳不大於100奈米而不允許透光。選擇性地,該透鏡單元可直接結合於該高介電層11之一側或直接結合於該第一電極12之一側而成一體結構,無需另外配置獨立之透鏡單元。The plurality of optical units 10 are preferably arranged in a matrix, and can also be arranged and combined according to requirements. The high dielectric layer 11 is a titanium carbide layer, a silicon nitride layer, an aluminum nitride layer, a barium titanate layer, a silicon dioxide layer or a piezoelectric ceramic layer, and each of the high dielectric layers 11 can be a single layer integrally formed Part of high dielectric film. In the manufacturing process of the high dielectric layer 11, single crystal silicon material can be used, which has a small structure, large thermo-optical coefficient, and easy phase adjustment; while using silicon nitride material, its loss is small and processing error tolerance is large. Accurate control of favorable phase. The first electrode 12 is located between the lens unit 20 and the high dielectric layer 11 and is grounded. The first electrode 12 is light-transmissive silver (Ag), copper (Cu), gold (Au) or transparent conductive Thin film, the thickness of the first electrode 12 is preferably not more than 100 nanometers to allow light transmission. Each of the first electrodes 12 is a part of a single-layer integrally formed metal film. The second electrode 13 of each optical unit 10 is independently located on the side of the high dielectric layer 11 away from the lens unit 20. The second electrode 13 is opaque and includes a base layer (preferably not Allow light transmission) on silver (Ag), copper (Cu), gold (Au) or conductive film (its thickness is preferably not less than 10 nm), the total thickness of the second electrode 13 is preferably not more than 100 nm It does not allow light transmission. Optionally, the lens unit can be directly coupled to one side of the high dielectric layer 11 or directly coupled to one side of the first electrode 12 to form an integrated structure, without the need for a separate lens unit.

在其他實施例中,該第二電極13可配置成面向該透鏡單元20,該第一電極12配置成位於該高介電層11之遠離該透鏡單元20之一側;該透鏡單元可直接結合於該高介電層之一側而成一體結構。In other embodiments, the second electrode 13 may be configured to face the lens unit 20, and the first electrode 12 may be configured to be located on a side of the high dielectric layer 11 away from the lens unit 20; the lens unit may be directly combined An integrated structure is formed on one side of the high dielectric layer.

在本實施利中,各該光學單元10另包括一背層30,該背層30位於該高介電層11之遠離該透鏡單元20之一側。該背層30為藍寶石層,具有良好散熱、支撐及保護作用。各該背層30為單一層一體成型之藍寶石薄膜之一部分,該第二電極13位於與該高介電層11與該背層30之間。In this embodiment, each of the optical units 10 further includes a back layer 30, and the back layer 30 is located on a side of the high dielectric layer 11 away from the lens unit 20. The back layer 30 is a sapphire layer, which has good heat dissipation, support and protection effects. Each of the back layers 30 is a part of a single-layer integrally formed sapphire film, and the second electrode 13 is located between the high dielectric layer 11 and the back layer 30.

該透鏡單元20包括矽(Si)稜鏡或二氧化矽(SiO 2)透鏡,該透鏡亦可為球面或非球面鏡,依據不同需求,該透鏡單元20可包括單一或多數透鏡。在本實施利中,該透鏡單元20包括一個三稜鏡,該金屬薄膜設於該三稜鏡之其中一面,該入光面21及該出光面22分別設於該三稜鏡之其他二面。 The lens unit 20 includes a silicon (Si) lens or a silicon dioxide (SiO 2 ) lens. The lens can also be a spherical or aspherical lens. According to different requirements, the lens unit 20 can include a single lens or a plurality of lenses. In the present embodiment, the lens unit 20 includes a three-dimensional ring, the metal film is disposed on one side of the three-dimensional ring, and the light-incident surface 21 and the light-emitting surface 22 are respectively disposed on the other two surfaces of the three-dimensional ring .

機制上,當光束100入射時,可透過一控制單元40調控輸入不同的供電條件至該複數光學單元10之第一及第二電極12, 13,以使該複數光學單元10之高介電層11具有不同折射率,自該入光面21進入該透鏡單元20之光束100穿過該第一電極12後,射入該高介電層11並經該第二電極13反射並於該高介電層11折射後穿過該第一電極12而由該出光面22射出。具不同折射率之高介電層11使得自部分或全部光學單元10射出之光束100轉向且產生相位差,透過調控光束100之間的相位關係,可對指定方向產生相長干涉從而實現高強度具指向性光束(其它方向產生相消干涉而無光束輸出),因此可以將一束或多束高強度光束的照射方向使用供電條件控制實現空間中一維/二維/三維之掃描。該光束100較佳係於一光纖50內傳輸,且經過一準直器60後,射入該固態光學相位掃描構件1並投射至待掃描物,掃描後之反射光束例如可使用紅外光相機或其他光接收器接收,再經後端處理裝置取得掃描結果。In mechanism, when the light beam 100 is incident, a control unit 40 can be used to control and input different power supply conditions to the first and second electrodes 12, 13 of the complex optical unit 10, so that the high dielectric layer of the complex optical unit 10 11 has different refractive indexes. The light beam 100 entering the lens unit 20 from the light-incident surface 21 passes through the first electrode 12, enters the high dielectric layer 11 and is reflected by the second electrode 13 and passes through the high dielectric layer. The electrical layer 11 passes through the first electrode 12 after being refracted and is emitted from the light-emitting surface 22. The high dielectric layer 11 with different refractive indexes makes the light beam 100 emitted from part or all of the optical unit 10 turn and produce a phase difference. By adjusting the phase relationship between the light beams 100, constructive interference can be generated in the specified direction to achieve high intensity With directional beam (destructive interference in other directions without beam output), the irradiation direction of one or more high-intensity beams can be controlled by power supply conditions to realize 1D/2D/3D scanning in space. The light beam 100 is preferably transmitted in an optical fiber 50, and after passing through a collimator 60, it enters the solid-state optical phase scanning member 1 and is projected to the object to be scanned. The reflected light beam after scanning can be, for example, an infrared camera or The other optical receivers receive it, and then obtain the scanning result through the back-end processing device.

1:固態光學相位掃描構件1: Solid-state optical phase scanning component

10:光學單元10: Optical unit

11:高介電層11: High dielectric layer

12:第一電極12: The first electrode

13:第二電極13: second electrode

14: 出光側14: Light emitting side

20:透鏡單元20: lens unit

21:入光面21: Glossy surface

22:出光面22: Glossy surface

30:背層30: back layer

40:控制單元40: control unit

50:光纖50: Optical fiber

60:準直器60: collimator

100:光束100: beam

圖1為本發明一較佳實施例之固態光學相位掃描構件示意圖。 圖2為本發明一較佳實施例之固態光學相位掃描構件立體圖。 圖3為本發明一較佳實施例之固態光學相位掃描構件分解圖。 圖4為本發明一較佳實施例之作用示意圖。 FIG. 1 is a schematic diagram of a solid-state optical phase scanning component according to a preferred embodiment of the present invention. Fig. 2 is a perspective view of a solid-state optical phase scanning component according to a preferred embodiment of the present invention. Fig. 3 is an exploded view of a solid-state optical phase scanning component according to a preferred embodiment of the present invention. Fig. 4 is a schematic diagram of the function of a preferred embodiment of the present invention.

1:固態光學相位掃描構件 1: Solid-state optical phase scanning component

11:高介電層 11: High dielectric layer

12:第一電極 12: The first electrode

30:背層 30: back layer

100:光束 100: beam

Claims (9)

一種固態光學相位掃描構件,包括:複數光學單元,各該光學單元包括一高介電層、及位於該高介電層二側之一第一電極及一第二電極,各該高介電層可在該第一及第二電極施加不同供電條件時具有不同之折射率;及一透鏡單元,位於面對該複數光學單元之一出光側,包括一入光面及一出光面,被配置成可將自該入光面入射之光束導射至該複數光學單元而改變該光束之路徑後由該出光面射出;其中各該光學單元另包括一背層,該背層位於該高介電層之遠離該透鏡單元之一側,該第二電極位於與該高介電層與該背層之間,該第二電極為不透光。 A solid-state optical phase scanning component includes: a plurality of optical units, each of the optical units includes a high-dielectric layer, and a first electrode and a second electrode located on two sides of the high-dielectric layer, each of the high-dielectric layers The first and second electrodes can have different refractive indexes when different power supply conditions are applied; and a lens unit, which is located on the light-exit side facing the plurality of optical units, includes a light-incident surface and a light-emitting surface, and is configured to The light beams incident from the light incident surface can be directed to the plurality of optical units to change the path of the light beams and then emitted from the light exit surface; wherein each of the optical units further includes a back layer located on the high dielectric layer On a side far away from the lens unit, the second electrode is located between the high dielectric layer and the back layer, and the second electrode is opaque. 如請求項1所述的固態光學相位掃描構件,其中該複數光學單元呈矩陣排列。 The solid-state optical phase scanning member according to claim 1, wherein the plurality of optical units are arranged in a matrix. 如請求項1所述的固態光學相位掃描構件,其中該高介電層為碳化鈦層、氮化矽層、鈦酸鋇層或二氧化矽層。 The solid-state optical phase scanning member according to claim 1, wherein the high dielectric layer is a titanium carbide layer, a silicon nitride layer, a barium titanate layer, or a silicon dioxide layer. 如請求項1所述的固態光學相位掃描構件,其中該第一電極位於該透鏡單元與該高介電層之間,該第一電極為銀(Ag)、銅(Cu)或金(Au)薄膜。 The solid-state optical phase scanning member according to claim 1, wherein the first electrode is located between the lens unit and the high dielectric layer, and the first electrode is silver (Ag), copper (Cu) or gold (Au) film. 如請求項4所述的固態光學相位掃描構件,其中各該第一電極為單一層一體成型之金屬薄膜之一部分。 The solid-state optical phase scanning member according to claim 4, wherein each of the first electrodes is a part of a single-layer integrally formed metal film. 如請求項1所述的固態光學相位掃描構件,其中該背層為藍寶石層。 The solid-state optical phase scanning member according to claim 1, wherein the back layer is a sapphire layer. 如請求項1所述的固態光學相位掃描構件,其中該透鏡單元包括矽(Si)稜鏡或二氧化矽(SiO2)透鏡。 The solid-state optical phase scanning component according to claim 1, wherein the lens unit includes a silicon (Si) 鏡 or a silicon dioxide (SiO 2 ) lens. 如請求項6所述的固態光學相位掃描構件,另包括一光纖及一連接於該光纖一端之準直器,該光束於該光纖內傳輸並自該準直器射出至該入光面;其中該供電條件為電壓;該複數光學單元呈矩陣排列;該高介電層為碳化鈦層、氮化矽層、鈦酸鋇層或二氧化矽層;各該高介電層為單一層一體成型之高介電薄膜之一部分;該第一電極位於該透鏡單元與該高介電層之間且為接地,該第一電極為可透光之銀(Ag)、銅(Cu)或金(Au)薄膜;各該第一電極為單一層一體成型之金屬薄膜之一部分;該第二電極包括設於一基層上之銀(Ag)、銅(Cu)或金(Au)薄膜;各該背層為單一層一體成型之藍寶石薄膜之一部分;該透鏡單元包括矽(Si)稜鏡或二氧化矽(SiO2)透鏡;及該透鏡單元包括一個三稜鏡,該金屬薄膜設於該三稜鏡之其中一面,該入光面及該出光面分別設於該三稜鏡之其他二面。 The solid-state optical phase scanning member according to claim 6, further comprising an optical fiber and a collimator connected to one end of the optical fiber, the light beam is transmitted in the optical fiber and emitted from the collimator to the light incident surface; wherein The power supply condition is voltage; the plurality of optical units are arranged in a matrix; the high dielectric layer is a titanium carbide layer, a silicon nitride layer, a barium titanate layer or a silicon dioxide layer; each of the high dielectric layers is a single layer integrally formed Part of the high dielectric film; the first electrode is located between the lens unit and the high dielectric layer and is grounded; the first electrode is light-transmissive silver (Ag), copper (Cu) or gold (Au) ) Thin film; each of the first electrodes is a part of a single-layer integrally formed metal thin film; the second electrode includes a silver (Ag), copper (Cu) or gold (Au) thin film arranged on a base layer; each of the back layers It is a part of a single-layer integrally formed sapphire film; the lens unit includes a silicon (Si) lens or a silicon dioxide (SiO 2 ) lens; and the lens unit includes a triple lens on which the metal film is disposed One of the sides, the light-incident surface and the light-exit surface are respectively set on the other two sides of the three ridges. 如請求項1至8任一項所述的固態光學相位掃描構件,其中各該光學單元之第二電極相互獨立地位於該高介電層之遠離該透鏡單元之一側。The solid-state optical phase scanning member according to any one of claims 1 to 8, wherein the second electrode of each optical unit is independently located on a side of the high dielectric layer away from the lens unit.
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TW200717389A (en) * 2005-10-21 2007-05-01 Hewlett Packard Development Co Luminance adjustment
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WO2019202761A1 (en) * 2018-04-20 2019-10-24 株式会社村田製作所 Spectrometer, imaging device, scanning device, and position measuring device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1276521A (en) * 2000-06-29 2000-12-13 上海交通大学 Attenuater of laser intensity
TW200717389A (en) * 2005-10-21 2007-05-01 Hewlett Packard Development Co Luminance adjustment
TW201100879A (en) * 2009-06-22 2011-01-01 Hon Hai Prec Ind Co Ltd Image sensor module and image obtainning module
EP3418780A2 (en) * 2017-06-20 2018-12-26 Samsung Electronics Co., Ltd. Beam-steering device and optical apparatus including the same
WO2019202761A1 (en) * 2018-04-20 2019-10-24 株式会社村田製作所 Spectrometer, imaging device, scanning device, and position measuring device

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