TWI733540B - Communication device and model building system for adaptively modifying communication frequency - Google Patents

Abstract

A communication device for adaptively modifying communication frequency includes a wireless module, a storage module, a temperature module, and a processor. The wireless module operates at a working frequency in response to a frequency setting parameter. The storage module stores a temperature-frequency relationship. The temperature-frequency relationship is the correspondence between an actual frequency of the wireless module and a frequency calibration value at different temperatures. The temperature module detects the temperature of the communication device to obtain a temperature signal. The processor is coupled to the wireless module, the storage module, and the temperature module. The processor obtains a device temperature according to the temperature signal, obtains a frequency correction parameter corresponding to a target frequency at the device temperature according to the temperature-frequency relationship, generates the frequency setting parameter according to the frequency correction parameter, and sends the frequency setting parameter to the wireless module, so that the working frequency of the wireless module accord with the target frequency.

Description

Communication device for adaptively correcting communication frequency and its model building system

The present invention relates to a communication technology, in particular to a communication device for adaptively correcting the communication frequency and its model building system.

Now the world has entered the era of the Internet, and communication transmission plays an extremely important role in this. Therefore, a large number of various wireless communication devices have appeared, and in the wireless communication technology, the wireless frequency is the basis of the technology. However, the wireless frequency is very prone to signal distortion due to some factors (such as temperature changes, interference caused by device components, etc.), resulting in unsatisfactory communication transmission results (such as inability to correctly transmit signals and messages, and the stability of the transmission process Low).

In view of the above, this project provides a communication device that adaptively corrects the communication frequency and its model building system, so that the communication device can adaptively correct the communication frequency to avoid distortion of the communication frequency caused by temperature changes or interference caused by device components.

In some embodiments, the communication device for adaptively correcting the communication frequency includes a wireless module, a storage module, a temperature module, and a processor. The wireless module responds to the frequency setting parameter to operate at the operating frequency. The relationship between the storage temperature and frequency of the storage module. The temperature-frequency relationship is the corresponding relationship between the actual frequency of the wireless module and the frequency calibration value at different temperatures. The temperature module detects the temperature of the communication device to obtain a temperature signal. The processor is coupled to the wireless module, the storage module, and the temperature module. The processor obtains the device temperature according to the temperature signal, and obtains the frequency correction parameter corresponding to the target frequency at the device temperature according to the temperature-frequency relationship, and generates the frequency setting parameter according to the frequency correction parameter, and sends the frequency setting parameter to the wireless module, To make the working frequency of the wireless module match the target frequency.

In some embodiments, the storage module also stores the device error correction value. The processor further combines the frequency correction parameter and the device error correction value to obtain the frequency setting parameter.

In some embodiments, the processor performs temperature calibration on the measured value corresponding to the temperature signal to obtain the device temperature.

In some embodiments, the storage module also stores a temperature correction relationship for the processor to correct the measured value to the device temperature according to the temperature correction relationship. The temperature correction relationship is the corresponding relationship between the measured value and the device temperature.

In some embodiments, the temperature-frequency relationship is a linear calculation formula. The linear calculation formula presents the linear relationship between the device temperature and the frequency correction parameters.

In some embodiments, the temperature-frequency relationship is a compensation comparison table. The compensation comparison table presents the non-linear relationship between the device temperature and the frequency correction parameters.

In some embodiments, within a temperature interval, the temperature-frequency relationship is a linear calculation formula; outside the temperature interval, the temperature-frequency relationship is a compensation comparison table.

In some embodiments, the model building system for adaptively correcting the communication frequency includes a temperature control device, a communication device, and a communication frequency analysis device. The temperature control device provides a temperature control environment. The communication device is located in a temperature-controlled environment. The communication device includes a storage module, a wireless module, a temperature module, and a processor. The wireless module responds to the frequency setting parameter to operate at the operating frequency. The temperature module detects the temperature of the communication device to obtain a temperature signal. The processor is coupled to the wireless module, the storage module, and the temperature module. The processor obtains the device temperature according to the temperature signal, generates frequency setting parameters according to the frequency calibration value, and sends the frequency setting parameters to the wireless module. The communication frequency analysis device measures the actual frequency operated by the wireless module when the temperature control environment is at different temperatures. The communication device is coupled to the temperature control device and the communication frequency analysis device, so that the processor of the communication device establishes the temperature-frequency relationship based on the device temperature obtained by the temperature control environment corresponding to different temperatures and the corresponding actual frequency and frequency calibration value, and Store the temperature-frequency relationship in the storage module.

In some embodiments, the communication frequency analysis device measures the actual frequency operated by the wireless module when the temperature control environment is at a fixed temperature, and the processor of the communication device obtains the actual frequency according to the temperature control environment corresponding to the fixed temperature. And the frequency calibration value to generate the device error correction value, and store the device error correction value in the storage module.

In some embodiments, the processor establishes a temperature correction relationship according to a temperature control environment of different temperatures and a measurement value of the corresponding temperature signal, and stores the temperature correction relationship in the storage module. The device temperature corresponds to the different temperature of the temperature control environment.

Therefore, according to some embodiments, the communication device determines the frequency setting parameters that should be given to the wireless module at this time by detecting its own temperature, so that the operating frequency of the wireless module will not be distorted. Therefore, it is ensured that the operating frequency of the wireless module of the communication device can meet the target frequency without being affected by temperature changes. In some embodiments, the frequency setting parameters are obtained by combining the device error correction value (the influence of the device component on the operating frequency of the wireless module), which greatly reduces the possibility of frequency distortion and avoids the device component’s influence on the frequency. Interference. In some embodiments, the temperature correction relationship is used to improve the accuracy of the communication device to detect the temperature, thereby reducing the chance of frequency distortion.

Please refer to FIG. 1. FIG. 1 is a block diagram of a communication device 100 for adaptively correcting a communication frequency according to an embodiment of the present invention. The communication device 100 includes a wireless module 110, a storage module 120, a temperature module 130 and a processor 140. The storage module 120 is used to store various data related to the operation of the processor 140, the wireless module 110, and the temperature module 130, such as the temperature-frequency relationship. In some embodiments, the processor 140 may be a central processing unit, a microprocessor, an application-specific integrated circuit (ASIC, Application-specific Integrated Circuit), or a system on a chip (SOC, System on a Chip), etc. Circuit. In some embodiments, the storage module 120 can be a volatile memory, a non-volatile memory, or a combination thereof. In some examples, the volatile memory may be random access memory or the like. In some examples, the non-volatile memory can be flash memory, read-only memory, hard disk, or solid-state drive.

In some embodiments, the temperature-frequency relationship may be the corresponding relationship between the actual frequency of the wireless module 110 and the frequency calibration value under different temperatures. The actual frequency is the actual operating frequency of the wireless module 110 that has not been adaptively corrected. The frequency calibration value is the frequency at which the calibration should be performed. In some embodiments, the temperature-frequency relationship is a corresponding relationship between different temperatures and frequency offset values. The frequency offset value may be the difference between the actual frequency of the wireless module 110 and the frequency calibration value under the corresponding temperature.

The temperature module 130 is used to detect the temperature of the communication device 100 to obtain a temperature signal. In some exemplary embodiments, the temperature module 130 may be a resistance thermometer, an infrared thermometer, a liquid crystal thermometer, a thermal thermometer, a thermocouple thermometer, etc.

The wireless module 110 operates at a frequency (hereinafter referred to as "operating frequency") in response to the frequency setting parameter. In some embodiments, the frequency setting parameter may be a parameter setting of internal components of the wireless module 110. Among them, the parameter setting, such as the setting of the crystal oscillator load capacitance tuning (The Crystal Oscillator Load Capacitor Tuning, CTNUE) value, the tuning capacitor value to change the operating frequency, or the setting of the value of the high frequency crystal oscillator (High Frequency Crystal Oscillator) Oscillator, HFXO) to change the operating frequency and so on. In some embodiments, the wireless module 110 is used to provide the communication device 100 for network communication or short-range communication with other devices (for example: the communication frequency analysis device 220 shown in FIG. 2 and FIG. 3), that is, through the network or near Distance communication technology is used for data communication and transmission with other devices. In some exemplary embodiments, the wireless module 110 such as but not limited to wireless compatible authentication (Wi-Fi), wireless wide area network (WWAN), long-term evolution technology (LTE), mobile communication technology (eg, 3G, 4G, 4.5G , 5G, etc.), Wireless Broadband (Wibro), Global Interoperability Microwave Access (Wimax), Near Field Communication (NFC), Radio Frequency Identification (RFID), Infrared Communication Technology (IrDA), Ultra Wideband (UWB), ZigBee, Bluetooth sensor, Bluetooth transceiver, Internet of Things radio frequency technology (Sub-1GHz) and other wireless communication interface circuits. In some embodiments, the communication device 100 may include one or more wireless modules 110. The wireless modules 110 may support the same or different communication protocols, or the wireless modules 110 may operate at different operating frequencies. In some embodiments, multiple wireless modules 110 may be integrated together. For example, two wireless modules 110 supporting the Bluetooth protocol and the wireless compatible authentication protocol can be integrated into the same communication chip.

The processor 140 is coupled to the wireless module 110, the storage module 120 and the temperature module 130. The processor 140 is used to control the operation of the wireless module 110, the storage module 120, and the temperature module 130, and perform data and signal processing. The processor 140 receives the temperature signal from the temperature module 130, and analyzes the temperature signal to obtain the internal temperature of the communication device 100 (hereinafter referred to as “device temperature”). Since the wireless module 110 and the temperature module 130 are both disposed inside the communication device 100, the temperature of the environment where the wireless module 110 is located can be known by the device temperature. In some embodiments, the wireless module 110 and the temperature module 130 may be integrated together. In some embodiments, the wireless module 110 and the temperature module 130 are separated and independently arranged in adjacent positions.

In some embodiments, the processor 140 parses the temperature signal to obtain a measurement value, and performs temperature correction on the measurement value to obtain the device temperature. The measured value is the original data obtained by the temperature module 130 measuring the internal temperature of the communication device 100. In some embodiments, the storage module 120 stores a temperature correction relationship, and the processor 140 performs temperature correction according to the temperature correction relationship, and corrects the measured value to the device temperature. In some embodiments, the temperature correction relationship is a corresponding relationship between the measured value and the device temperature. Specifically, in some embodiments, the temperature correction relationship may be realized by a comparison table, for example, by a temperature correction comparison table. In some embodiments, the temperature correction relationship can be realized by a linear calculation formula, and the device temperature corresponding to the measured value is calculated through the linear relationship between the measured value and the actual temperature. Wherein, the actual temperature is the temperature of the actual environment where the wireless module 110 is located. In some embodiments, if the temperature module 130 is sufficiently accurate, there is almost no error between the measured value of the temperature module 130 and the device temperature, that is, the device temperature can be regarded as the actual temperature.

According to the current device temperature, the processor 140 can obtain the frequency correction parameter corresponding to the frequency to be operated (hereinafter referred to as the “target frequency”) through the temperature-frequency relationship. In some embodiments, the frequency correction parameter may be a frequency offset value corresponding to the current device temperature obtained according to the temperature-frequency relationship (that is, the frequency offset value caused by temperature changes).

In some embodiments, the temperature-frequency relationship may be realized in the form of a comparison table, for example, the temperature-frequency relationship is a compensation comparison table. The processor 140 obtains the frequency correction parameters corresponding to the target frequency and the current device temperature through the compensation comparison table stored in the storage module 120.

In some embodiments, the temperature-frequency relationship can be realized by a linear calculation formula. The frequency correction parameters corresponding to the target frequency and the current device temperature are calculated through the linear relationship between temperature and frequency changes. For example, the linear calculation formula presents the device temperature and frequency. Correct the linear relationship between the parameters.

In some embodiments, if there is a non-linear relationship between temperature and frequency change, the temperature-frequency relationship is realized in the form of a comparison table (for example, a compensation comparison table) (that is, the compensation comparison table presents the relationship between the device temperature and the frequency correction parameter). Non-linear relationship); if there is a linear relationship between temperature and frequency change, the linear calculation formula is used to realize the temperature-frequency relationship.

In some embodiments, within a temperature interval (that is, within a first temperature interval), there is a linear relationship between temperature and frequency changes, and the temperature-frequency relationship is realized by a linear calculation formula; outside the temperature interval (for example, and In a second temperature interval where the first temperature interval does not overlap), the temperature and frequency change have a non-linear relationship, and the temperature-frequency relationship is realized in the form of a comparison table (for example, a compensation comparison table). In some embodiments, the temperature range may be a range that complies with the frequency tolerance specification of the communication protocol. For example, the temperature range can be from -20°C to 50°C, but is not limited to this.

The processor 140 generates a frequency setting parameter according to the frequency correction parameter. For example, the storage module 120 stores the corresponding relationship between the frequency calibration parameters and the frequency setting parameters (for example, realized by a comparison table (such as a parameter comparison table)), and the processor 140 obtains the current frequency calibration parameters according to the parameter comparison table. The corresponding frequency setting parameter. In some embodiments, the frequency setting parameter is the same as the frequency correction parameter (ie, the frequency offset value corresponding to the current device temperature). In some embodiments, the frequency setting parameter may be a parameter that has a corresponding relationship with the frequency correction parameter, but has different functions. For example, the frequency correction parameter is the frequency offset value, and the frequency setting parameter is the tuning value of the load capacitance of the crystal oscillator corresponding to the generated frequency offset value.

In some embodiments, the storage module 120 stores a device error correction value. In addition to considering the frequency correction parameter, the processor 140 further considers the device error correction value to obtain the frequency setting parameter. In some embodiments, the device error correction value is a frequency offset value caused by individual component differences. For example, when the wireless module 110 is at a fixed temperature, the frequency offset value caused by individual component differences (such as wireless module When 110 is at a fixed temperature, the corresponding relationship between the actual frequency and the frequency calibration value, or the difference between the actual frequency and the frequency calibration value). In some embodiments, the processor 140 queries the current frequency correction parameter and the frequency setting parameter corresponding to the device error correction value according to the parameter comparison table. The frequency setting parameters obtained by considering the frequency correction parameters and the device error correction values together can eliminate the frequency distortion caused by temperature changes and individual component differences, thereby improving the accuracy and stability of the communication device 100 and making the operating frequency Meet the target frequency more accurately.

The processor 140 sends the frequency setting parameter to the wireless module 110 so that the operating frequency of the wireless module 110 in response to the frequency setting parameter can meet the target frequency. In other words, through the frequency setting parameters, the frequency distortion caused by temperature changes or individual component differences can be corrected (for example, by tuning the value of the load capacitance of the crystal oscillator to make the operating frequency match the target frequency; or applying a frequency compensation value to To offset the frequency distortion caused by temperature changes or individual components). The frequency compensation value is the inverse difference between the actual frequency and the target frequency. The reverse difference value is to apply a reverse frequency offset value to the actual frequency to offset the frequency difference between the actual frequency and the target frequency. For example, if the target frequency is greater than the actual frequency, the frequency compensation value is an enhanced actual frequency If the target frequency is less than the actual frequency, the frequency compensation value is a frequency offset value that weakens the actual frequency.

Please refer to Figure 1, Figure 2 and Figure 3 at the same time. FIG. 2 is a schematic structural diagram of a model building system 200 for adaptively correcting communication frequencies according to an embodiment of the present invention. FIG. 3 is a block diagram of a model building system 200 for adaptively correcting communication frequencies according to an embodiment of the present invention. The model building system 200 for adaptively correcting the communication frequency includes a temperature control device 210, a communication device 100, and a communication frequency analysis device 220. The communication device 100 is coupled to the temperature control device 210 and the communication frequency analysis device 220. The temperature control device 210 is used to provide a temperature control environment. The communication device 100 is located in a temperature-controlled environment. The model building system 200 for adaptively correcting the communication frequency is used to implement the method of establishing the temperature-frequency relationship of the adaptive model and the frequency setting parameter corresponding to the frequency correction parameter, and the device error value of the adaptive model and the frequency corresponding to the device error value Method of setting parameters.

Referring to FIG. 4, it is a flow diagram of establishing the temperature-frequency relationship of the adaptive model for correcting the communication frequency and the frequency setting parameters corresponding to the frequency correction parameters according to an embodiment of the present invention. First, the communication device 100 sends a control signal to the temperature control device 210, so that the temperature control device 210 provides a temperature control environment corresponding to a temperature according to the control signal (step S400). In some embodiments, the temperature control device 210 includes a processing circuit and a storage circuit. The processing circuit generates a temperature control setting according to the control signal, and according to the temperature control setting, causes the temperature control device 210 to generate a temperature control environment corresponding to the temperature control setting, such as temperature control. When the control setting is 25°C, the processing circuit controls the temperature control device 210 to provide a temperature control environment with a temperature of 25°C, but the embodiment of the present invention is not limited to this. In some examples, the temperature control setting can be a room temperature setting, a high temperature setting, or a low temperature setting. The processing circuit reads the temperature corresponding to the room temperature setting, high temperature setting or low temperature setting in the storage circuit (for example, the room temperature setting corresponds to 25°C). , The high temperature setting corresponds to 60°C and the low temperature setting corresponds to 10°C), and the temperature control device 210 provides a temperature control environment corresponding to the room temperature setting, the high temperature setting or the low temperature setting. In some embodiments, the room temperature setting, the high temperature setting, or the low temperature setting can be a temperature range, for example, the room temperature is set to 20°C to 30°C, the high temperature setting is greater than 30°C, and the low temperature setting is less than 20°C, but the embodiment of the present invention It is not limited to this. In some embodiments of step S400, the temperature control device 210 further includes a user interface. The temperature control device 210 generates a temperature control setting in response to an operation of the user interface, and provides a temperature control environment corresponding to a temperature according to the temperature control setting.

The processor 140 of the communication device 100 generates frequency setting parameters according to the frequency calibration value, and sends the frequency setting parameters to the wireless module 110 (step S402). For example, the processor 140 generates a frequency setting parameter according to the frequency at which the calibration should be operated. In some embodiments, the storage module 120 stores the frequency calibration value. The wireless module 110 of the communication device 100 operates at the operating frequency in response to the frequency setting parameter (step S404).

After step S404, the communication frequency analysis device 220 measures the operating frequency of the wireless module 110 (step S406), where the operating frequency is the operating frequency of the wireless module 110 when the adaptive model is established (that is, the operating frequency has not been performed yet). The actual operating frequency of the adaptive correction, that is, the actual frequency).

After step S406, the processor 140 of the communication device 100 receives the actual frequency measured from the communication frequency analysis device 220, and determines whether the actual frequency is substantially the same as the frequency calibration value (step S408). For example, the processor 140 determines whether the actual frequency is in the interval conforming to Equation 1. In some embodiments, the interval may be an error interval specified by a communication protocol. In an example of step S408, the processor 140 determines whether the actual frequency is the same as the frequency calibration value. In some embodiments, the processor 140 respectively uses the actual frequency obtained for the first time in a temperature-controlled environment with different temperatures as the original frequency, and stores the original frequency in the storage module 120.

…………………………（式1）

…………………………(Formula 1)

為頻率標定值，

為實際頻率。 in,

Is the frequency calibration value,

Is the actual frequency.

If the actual frequency is substantially the same as the frequency calibration value, the processor 140 collects the current frequency setting parameter, device temperature, original frequency, and frequency calibration value, and associates the current frequency setting parameter, device temperature, original frequency, and frequency calibration value together , And recorded in the storage module 120 (step S410). For example, the temperature module 130 detects the temperature of the communication device 100 to obtain a temperature signal, the processor 140 parses the temperature signal to obtain the device temperature corresponding to the temperature of the current temperature control environment, and obtains the current original frequency from the storage module 120 And the frequency calibration value, and associate the device temperature, the original frequency, the frequency calibration value and the current frequency parameter together, and then record it in the storage module 120. In some embodiments, the difference between the original frequency and the frequency calibration value is a frequency correction parameter.

If the actual frequency is not substantially the same as the frequency calibration value, the processor 140 determines whether the actual frequency is greater than the frequency calibration value (step S414). If the actual frequency is less than the frequency calibration value, the processor 140 reduces the frequency setting parameter (step S416), and The frequency setting parameter is transmitted to the wireless module 110, so that the wireless module 110 operates at the operating frequency in response to the frequency setting parameter (step S404), and repeats the subsequent steps; if the actual frequency is greater than the frequency calibration value (for example, the actual frequency conforms to the formula 2 Condition), the processor 140 adds the frequency setting parameter (step S418), and transmits the frequency setting parameter to the wireless module 110, so that the wireless module 110 operates at the operating frequency in response to the frequency setting parameter (step S404), and repeats the following step.

…………………………（式2）

…………………………(Formula 2)

為頻率標定值，

為實際頻率。 in,

Is the frequency calibration value,

Is the actual frequency.

In an exemplary example, the smaller the frequency setting parameter, the greater the operating frequency of the wireless module 110 operating in response to the frequency setting parameter. At this time, if the actual frequency is less than the frequency calibration value, the processor 140 reduces the frequency setting parameter (step S416). If the actual frequency is greater than the frequency calibration value, the processor 140 increases the frequency setting parameter (step S418). In another example, the larger the frequency setting parameter is, the higher the operating frequency the wireless module 110 operates in response to the frequency setting parameter. At this time, if the actual frequency is less than the frequency calibration value, the processor 140 increases the frequency setting parameter ( Step S418), if the actual frequency is greater than the frequency calibration value, the processor 140 reduces the frequency setting parameter (step S416).

In some embodiments, in step S416, if the actual frequency is less than the frequency calibration value, the processor 140 uses the current actual frequency as the first actual frequency, reduces the frequency setting parameter (for example, reduces the value of the frequency setting parameter by one), and The reduced frequency setting parameter is used as the first frequency setting parameter, so that the wireless module 110 operates at the corresponding operating frequency in response to the first frequency setting parameter. The communication frequency analysis device 220 measures the actual frequency of the wireless module 110 (in response to the operating frequency of the first frequency setting parameter), and the processor 140 of the communication device 100 receives the actual frequency measured by the communication frequency analysis device 220 (in response to the first frequency). The operating frequency of a frequency setting parameter) and the actual frequency as the second actual frequency, and the frequency calibration value is obtained from the storage module 120. The processor 140 obtains the second frequency setting parameter (as shown in Equation 3) according to the frequency calibration value, the first actual frequency, and the second actual frequency. The processor 140 further reduces the first frequency setting parameter, for example, subtracts the second frequency setting parameter from the first frequency setting parameter to obtain the third frequency setting parameter, and transmits the third frequency setting parameter to the wireless module 110 to make the wireless mode The group 110 operates at the operating frequency in response to the third frequency setting parameter (step S404), and continues the subsequent steps (steps 406 to S418), until the actual frequency is substantially the same as the frequency calibration value, the processor 140 collects the current frequency setting parameter , The device temperature, the original frequency, and the frequency calibration value are associated with each other to be recorded in the storage module 120 (step S410).

……………………（式3）

…………………… (Equation 3)

為第二頻率設定參數，

為頻率標定值，

為第二實際頻率，

為第一實際頻率。

Set parameters for the second frequency,

Is the frequency calibration value,

Is the second actual frequency,

Is the first actual frequency.

In some embodiments, in step S418, if the actual frequency is less than the frequency calibration value, the processor 140 uses the current actual frequency as the first actual frequency, increases the frequency setting parameter (for example, adds one to the value of the frequency setting parameter), and The increased frequency setting parameter is used as the first frequency setting parameter, so that the wireless module 110 operates at the operating frequency in response to the first frequency setting parameter. The communication frequency analysis device 220 measures the actual frequency of the wireless module 110 (in response to the operating frequency of the first frequency setting parameter), and the processor 140 of the communication device 100 receives the actual frequency measured by the communication frequency analysis device 220 (in response to the first frequency). The operating frequency of a frequency setting parameter) and the actual frequency as the second actual frequency, and the frequency calibration value is obtained from the storage module 120. The processor 140 obtains the second frequency setting parameter (as shown in Equation 4) according to the frequency calibration value, the first actual frequency, and the second actual frequency. The processor 140 further adds the first frequency setting parameter, for example, according to the first frequency setting parameter plus the second frequency setting parameter to obtain the third frequency setting parameter, and transmits the third frequency setting parameter to the wireless module 110 to enable the wireless mode The group 110 operates at the operating frequency in response to the third frequency setting parameter (step S404), and continues the subsequent steps (steps 406 to S418), until the actual frequency is substantially the same as the frequency calibration value, the processor 140 collects the current frequency setting parameter , The device temperature, the original frequency, and the frequency calibration value are associated with each other to be recorded in the storage module 120 (step S410).

……………………（式4）

…………………… (Equation 4)

為第二頻率設定參數，

為頻率標定值，

為第二實際頻率，

為第一實際頻率。

Set parameters for the second frequency,

Is the frequency calibration value,

Is the second actual frequency,

Is the first actual frequency.

After step S410, the communication device 100 sends another control signal to the temperature control device 210. The temperature control device 210 provides a temperature control environment corresponding to the new temperature (that is, a temperature different from the previous temperature control environment) according to another control signal (step S412). For example, the previous temperature control setting is 25°C, and the temperature control device 210 provides a temperature control environment with a temperature of 25°C. At this time, the temperature control device 210 generates a new temperature control setting (such as a temperature of 35°C) according to another control signal. Control setting) so that the temperature control device 210 provides a temperature control environment with a temperature of 35°C. Or the previous temperature control setting is the room temperature setting, at this time the temperature control device 210 generates the temperature control setting of the high temperature setting according to another control signal. After the temperature control device 210 provides a temperature control environment corresponding to the new temperature (step S412), the communication device 100 continues to generate frequency setting parameters according to the frequency calibration value (step S402) and repeats the subsequent steps, that is, the communication frequency analysis device 220 operates on the temperature When the control environment is at different temperatures, the actual frequency operated by the wireless module 110 is measured, and the communication device 100 repeatedly obtains the device temperature, the actual frequency, and the frequency calibration value under different temperature control environments to establish the temperature frequency relation.

When the storage module 120 has multiple sets of device temperature, original frequency and frequency calibration values obtained in a temperature-controlled environment corresponding to different temperatures, the processor 140 obtains the device temperature and corresponding values according to these values (corresponding to the temperature-controlled environment of different temperatures). The actual frequency and the frequency calibration value) establish a temperature-frequency relationship, and store the temperature-frequency relationship in the storage module 120. For example, the processor 140 creates the device based on the device temperature, the original frequency, and the frequency calibration value (or the difference between the device temperature and the original frequency and the frequency calibration value) obtained by multiple sets of temperature-controlled environments corresponding to different temperatures. Correspondence between temperature, original frequency and frequency calibration value or establish the corresponding relation between device temperature and frequency offset value (the difference between the original actual temperature and the frequency calibration value). Therefore, the temperature-frequency relationship has a corresponding relationship between the actual frequency and the frequency calibration value at a variety of different device temperatures. In some embodiments, the processor determines whether there is a linear relationship between different sets of values based on the device temperature, the original frequency, and the frequency calibration values obtained by multiple sets of temperature control environments corresponding to different temperatures. If there is a linear relationship, a linear relationship is established. In the calculation formula, if there is no relationship, a compensation comparison table is established.

Referring to FIG. 5, it is a flow diagram of the device error correction value and the frequency setting parameter corresponding to the device error correction value for establishing an adaptive model for correcting the communication frequency according to an embodiment of the present invention. First, the communication device 100 sends a control signal to the temperature control device 210, so that the temperature control device 210 provides a temperature control environment corresponding to a temperature according to the control signal (step S500), and continues with step S502, as described above, to further measure the actual temperature. Frequency and adjust the frequency setting parameters so that the actual frequency is substantially the same as the frequency calibration value. Steps S500 to S510 and steps S514 to S518 are the same as the aforementioned steps S400 to S410 and steps S414 to S418, and the description will not be repeated. Compared with Figure 4, the establishment of the device error correction value and its corresponding frequency setting parameters is to correct the frequency distortion caused by individual components, and to obtain device error correction by means of a fixed temperature (under a fixed temperature control environment) Value (for example, the difference between the original frequency and the frequency calibration value), without repeating steps S500 to S518 in a temperature-controlled environment with different temperatures. In some embodiments, in step S510, because the device error correction value (for example, the difference between the original frequency and the frequency calibration value) is obtained at a fixed temperature (under a fixed temperature control environment), The processor 140 does not need to record the device temperature corresponding to the device error correction value in the storage module 120.

In some embodiments, the processor 140 establishes a temperature correction relationship according to the temperature control environment of different temperatures and a measurement value of the corresponding temperature signal, and stores the temperature correction relationship in the storage module 120, wherein the device temperature corresponds to Different temperature of the temperature control environment. In some embodiments, the processor 140 uses the temperature of the temperature-controlled environment as the device temperature, and associates the measurement values measured by the temperature module 130 in the temperature-controlled environment of different temperatures with the corresponding device temperature to establish a temperature correction. The post-processor 140 stores the temperature correction relationship in the storage module 120. In some embodiments, the processing circuit generates a temperature control environment corresponding to the temperature control setting according to the temperature control setting, and stores the temperature control setting in a storage circuit or the processing circuit detects and records the temperature of the currently provided temperature control environment. In the storage circuit, the processor 140 reads the storage circuit, and uses the temperature control setting or the temperature of the temperature control environment stored in the storage circuit as the device temperature.

In some embodiments, the communication device 100 is coupled to the temperature control device 210 and the communication frequency analysis device 220 via a serial data communication interface (such as RS232) or a universal serial bus (USB).

Therefore, according to any embodiment, the communication device detects its own temperature to determine the frequency setting parameters that should be given to the wireless module at this time, so that the operating frequency of the wireless module will not be distorted. Therefore, it is ensured that the operating frequency of the wireless module of the communication device can meet the target frequency without being affected by temperature changes. In some embodiments, the frequency setting parameters are obtained by combining the device error correction value (the influence of the device component on the operating frequency of the wireless module), which greatly reduces the possibility of frequency distortion and avoids the device component’s influence on the frequency. Interference. In some embodiments, the temperature correction relationship is used to improve the accuracy of the communication device to detect the temperature, thereby reducing the chance of frequency distortion.

100: Communication device 110: wireless module 120: storage module 130: Temperature module 140: processor 200: model building system 210: Temperature control device 220: Communication frequency analysis device S400~S418: Step S500~S518: steps

[Figure 1] is a block diagram of a communication device for adaptively correcting a communication frequency according to an embodiment of the invention. [Figure 2] is a schematic diagram of the architecture of a model building system for adaptively correcting communication frequencies according to an embodiment of the present invention. [Fig. 3] is a block diagram of a model building system for adaptively correcting communication frequency according to an embodiment of the present invention. [Fig. 4] is a schematic diagram of the flow of establishing the temperature-frequency relationship of the adaptive model for correcting the communication frequency and the frequency setting parameters corresponding to the frequency correction parameters according to an embodiment of the present invention. [Fig. 5] is a schematic diagram of the flow of establishing the device error correction value and the frequency setting parameter corresponding to the device error correction value of the adaptive model for correcting the communication frequency according to an embodiment of the present invention.

100: Communication device

110: wireless module

120: storage module

130: Temperature module

140: processor

Claims (10)

A communication device for adaptively correcting the communication frequency includes: a wireless module, which operates at a working frequency in response to a frequency setting parameter; and a storage module, which stores a temperature-frequency relationship, the temperature-frequency relationship being the wireless at different temperatures The corresponding relationship between an actual frequency of the module and a frequency calibration value; a temperature module that detects the temperature of the communication device to obtain a temperature signal; and a processor coupled to the wireless module and the storage The module and the temperature module obtain a device temperature according to the temperature signal, obtain a frequency correction parameter corresponding to a target frequency at the device temperature according to the temperature-frequency relationship, and generate the frequency according to the frequency correction parameter Set parameters, and send the frequency setting parameters to the wireless module so that the working frequency of the wireless module meets the target frequency; wherein, when the temperature-frequency relationship has not been established, the processor stores a communication frequency analysis The actual frequency initially measured by the device in a temperature-controlled environment of different temperatures is used as an original frequency; wherein, in a temperature environment corresponding to a temperature, the communication frequency analysis device continuously measures the actual frequency, when the When the actual frequency measured is substantially the same as the frequency calibration value, the processor associates the device temperature obtained by the temperature-controlled environment corresponding to the temperature, the original frequency, the corresponding frequency setting parameter, and the frequency calibration value together, To establish the temperature-frequency relationship; when the actual frequency of the measurement is different from the frequency calibration value, the processor reduces or increases the previous frequency setting parameter until the actual frequency of the measurement is substantially the same as the frequency calibration value . The communication device according to claim 1, wherein the storage module further stores a device error correction value, and the processor further combines the frequency correction parameter and the device error correction value to obtain the frequency setting parameter. The communication device according to claim 1, wherein the processor performs temperature calibration on a measurement value corresponding to the temperature signal to obtain the device temperature. The communication device according to claim 3, wherein the storage module further stores a temperature correction relationship for the processor to correct the measurement value to the device temperature according to the temperature correction relationship, and the temperature correction relationship is the quantity Correspondence between the measured value and the temperature of the device. The communication device according to claim 1, wherein the temperature-frequency relationship is a linear calculation formula, and the linear calculation formula presents a linear relationship between the device temperature and the frequency correction parameter. The communication device according to claim 1, wherein the temperature-frequency relationship is a compensation comparison table, and the compensation comparison table presents a non-linear relationship between the device temperature and the frequency correction parameter. The communication device according to claim 1, wherein within a temperature interval, the temperature-frequency relationship is a linear calculation formula; outside the temperature interval, the temperature-frequency relationship is a compensation comparison table. A model building system for adaptively correcting communication frequencies includes: a temperature control device that provides a temperature control environment; a communication device located in the temperature control environment; the communication device includes: a storage module; a wireless module, Operate at a working frequency in response to a frequency setting parameter; a temperature module to detect the temperature of the communication device to obtain a temperature signal; and A processor, coupled to the wireless module, the storage module, and the temperature module, obtains a device temperature according to the temperature signal, generates the frequency setting parameter according to a frequency calibration value, and sends the frequency setting parameter to The wireless module; and a communication frequency analysis device, which measure an actual frequency operated by the wireless module when the temperature control environment is at different temperatures, wherein the communication device is coupled to the temperature control device and the temperature control device The communication frequency analysis device enables the processor of the communication device to store the actual frequency initially measured by the communication frequency analysis device in the temperature-controlled environment of different temperatures as an original frequency, and in the temperature environment corresponding to a temperature Next, when the measured actual frequency is substantially the same as the frequency calibration value, the processor will obtain the device temperature, the original frequency, the corresponding frequency setting parameter, and the frequency obtained by the temperature-controlled environment corresponding to the temperature. The calibration values are linked together to establish a temperature-frequency relationship, and store the temperature-frequency relationship in the storage module; when the measured actual frequency is not the same as the frequency calibration value, the processor reduces or increases the previous The frequency parameter is set until the actual frequency measured is substantially the same as the frequency calibration value. The model building system according to claim 8, wherein the communication frequency analysis device measures the actual frequency operated by the wireless module when the temperature-controlled environment is at a fixed temperature, and the processor of the communication device is based on The actual frequency and the frequency calibration value obtained by the temperature control environment corresponding to the fixed temperature are generated to generate a device error correction value, and the device error correction value is stored in the storage module. The model creation system according to claim 8, wherein the processor establishes a temperature correction relationship according to the temperature control environment of different temperatures and a corresponding measurement value of the temperature signal, and stores the temperature correction relationship in the The storage module, wherein the temperature of the device corresponds to different temperatures of the temperature control environment.

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