TWI730664B - Laser marking system and controlling method thereof - Google Patents

Laser marking system and controlling method thereof Download PDF

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TWI730664B
TWI730664B TW109108128A TW109108128A TWI730664B TW I730664 B TWI730664 B TW I730664B TW 109108128 A TW109108128 A TW 109108128A TW 109108128 A TW109108128 A TW 109108128A TW I730664 B TWI730664 B TW I730664B
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workpiece
laser marking
controller
camera
item
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TW109108128A
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TW202133983A (en
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蔡昌裕
紀鈞耀
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新代科技股份有限公司
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Abstract

A laser marking system and the controlling method is provided, which includes a display panel, a controller, a first camera, a driver, a second camera and a laser marking device, in which the display panel is provided for setting at least one marking parameter, the controller is provided for receiving the marking parameter, the first camera is provided for receiving a first instruction corresponding to the marking parameter, the first camera is provided for visually recognizing a workpiece to obtain a visual image data of the workpiece, and returning the first visual image data to the controller, the driver is provided for receiving a movement instruction generated by the controller according to the visual image data , so that the driver drives the laser marking system in order to move opposite to the workpiece and returns a command feedback value to the controller, after the controller received the command feedback value to issue a second instruction, so that the second camera is provided for visually aligning the workpiece to obtain a location information of the workpiece, and the second camera is provided for returning the location information of the workpiece to the controller, and the laser marking device is provided for receiving the location information of the workpiece transmitted by the controller, and performing a laser marking process for the workpiece according the location information.

Description

雷射打標系統及其控制方法 Laser marking system and its control method

本發明有關於一種雷射打標技術領域,特別是關於一種雷射打標系統及控制方法。 The invention relates to the technical field of laser marking, in particular to a laser marking system and control method.

雷射打標機以雷射方式在物體表面形成文字、圖案等標記具有精度高、速度快以及產生之標記具永久性等優點,因在工業上,特別是積體電路工業中,所需的高精確度及高量產的IC標記,故雷射打標技術與裝置的改良實屬重要。 The laser marking machine uses the laser method to form characters, patterns and other marks on the surface of the object. It has the advantages of high accuracy, fast speed, and permanent mark generation. It is required in the industry, especially in the integrated circuit industry. High precision and high volume production of IC tags, so the improvement of laser marking technology and equipment is really important.

一般而言,雷射打標機包括了雷射源、控制器與振鏡模組等裝置。在實際使用上,使用者必須整合上述多種裝置,所以需要花費許多時間與成本來進行多種裝置間的整線與拼裝。另一方面,雷射打標機若要進行視覺對位需額外安裝視覺相機,使用者必須調整視覺相機對應於待加工工件的打標範圍才能提升雷射打標的精準度。 Generally speaking, a laser marking machine includes devices such as a laser source, a controller, and a galvanometer module. In actual use, the user must integrate the above-mentioned multiple devices, so it takes a lot of time and cost to complete and assemble the multiple devices. On the other hand, if the laser marking machine needs to install a vision camera for visual alignment, the user must adjust the marking range of the vision camera corresponding to the workpiece to be processed in order to improve the accuracy of laser marking.

為了改善現有技術的缺點,本發明的主要目的在於提供一種雷射打標系統,其整合了顯示面板、控制器、多個相機與驅動器,其中顯示面板供使用者直接輸入打標參數,並且亦可以由顯示面板直接檢測打標的結果。 In order to improve the shortcomings of the prior art, the main purpose of the present invention is to provide a laser marking system, which integrates a display panel, a controller, multiple cameras and drivers, wherein the display panel allows the user to directly input marking parameters and also The marking result can be directly detected by the display panel.

本發明的另一目的在於提供一種雷射打標系統,其利用相機對加工工件做大範圍定位,取得目前工作範圍中,欲加工工件的位置座標與數量,再對欲加工工件進行視覺對位,以滿足在大範圍的視覺打標與流水線打標的功能。 Another object of the present invention is to provide a laser marking system, which uses a camera to position the workpiece in a wide range, obtain the position coordinates and quantity of the workpiece to be processed in the current working range, and then perform visual alignment of the workpiece to be processed , To meet the functions of large-scale visual marking and assembly line marking.

本發明的再一目的在於提供一種雷射打標系統,其顯示面板可以即時顯示加工中的各機構軸狀態與位置、雷射狀態顯示、相機狀態與顯示目前視野、工件加工狀態。 Another object of the present invention is to provide a laser marking system, the display panel of which can instantly display the state and position of each mechanism axis, laser state display, camera state, and display current field of view and workpiece processing state during processing.

本發明的又一目的在於提供一種雷射打標系統,使用者可以直接透過顯示面板對機構軸下達命令、發出命令讓雷射打標裝置進行掃碼、打標、開始加工、暫停加工或是對機構軸與雷射的控制。 Another object of the present invention is to provide a laser marking system, in which the user can directly issue commands to the axis of the mechanism through the display panel, and issue commands for the laser marking device to scan codes, mark, start processing, pause processing or Control of mechanism axis and laser.

根據上述目的,本發明提供一種雷射打標系統,其包含:顯示面板、控制器、第一相機、驅動器、第二相機及雷射打標裝置,其中顯示面板用以輸入及設定至少一個打標參數、控制器用以接收打標參數、第一相機接收由控制器傳送的相對應於打標參數的第一指令,而對工件進行視覺辨識以得到此工件的第一視覺影像資料,並將第一視覺影像資料回傳至控制器、驅動器接收由控制器根據第一視覺影像所產的移動命令,驅動該雷射打標系統相對於工件移動,並且驅動器在移動過程中會將命令回授值回傳至控制器,在控制器接收命令回授值之後對第二相機發出第二指令,使得第二相機根據此第二指令對工件進行視覺對位,以得到此工件的定位資訊,並將工件的定位資訊回傳至控制器、以及雷射打標裝置接收由控制器所傳送的工件的定位資訊,並根據定位資訊對工件進行雷射打標製程。 According to the above objective, the present invention provides a laser marking system, which includes a display panel, a controller, a first camera, a driver, a second camera, and a laser marking device, wherein the display panel is used to input and set at least one marking The marking parameters and the controller are used to receive the marking parameters. The first camera receives the first instruction corresponding to the marking parameters sent by the controller, and visually recognizes the workpiece to obtain the first visual image data of the workpiece, and The first visual image data is returned to the controller, and the driver receives the movement command generated by the controller according to the first visual image, drives the laser marking system to move relative to the workpiece, and the driver returns the command during the movement process The value is returned to the controller, and after the controller receives the command feedback value, a second command is issued to the second camera, so that the second camera performs visual alignment of the workpiece according to the second command to obtain the positioning information of the workpiece, and The positioning information of the workpiece is returned to the controller, and the laser marking device receives the positioning information of the workpiece transmitted by the controller, and performs a laser marking process on the workpiece according to the positioning information.

在本發明較佳的實施例中,第一相機設置在雷射打標裝置的側邊用以對工件在工作範圍內進行定位以取得在此工作範圍內的工件的位置座標。 In a preferred embodiment of the present invention, the first camera is arranged on the side of the laser marking device for positioning the workpiece within the working range to obtain the position coordinates of the workpiece within the working range.

在本發明較佳的實施例中,控制器根據第一視覺影像進一步計算工件的數量及/或工件的位置。 In a preferred embodiment of the present invention, the controller further calculates the number of workpieces and/or the position of the workpieces according to the first visual image.

在本發明較佳的實施例中,控制器進一步根據工件的數量及工件的位置計算最短的加工路徑。 In a preferred embodiment of the present invention, the controller further calculates the shortest processing path according to the number of workpieces and the position of the workpieces.

在本發明較佳的實施例中,控制器根據工件的定位資訊進一步的計算雷射打標裝置的振鏡的偏擺角度。 In a preferred embodiment of the present invention, the controller further calculates the deflection angle of the galvanometer of the laser marking device according to the positioning information of the workpiece.

在本發明較佳的實施例中,第二相機與雷射打標裝置設置在同一側。 In a preferred embodiment of the present invention, the second camera and the laser marking device are arranged on the same side.

在本發明較佳的實施例中,第二相機更包含擷取與判定工件的位置,並將位置的資訊傳送至遠端控制裝置。 In a preferred embodiment of the present invention, the second camera further includes capturing and determining the position of the workpiece, and transmitting the position information to the remote control device.

在本發明較佳的實施例中,第二相機更包含對工件進行掃描條碼步驟。 In a preferred embodiment of the present invention, the second camera further includes a step of scanning the barcode on the workpiece.

在本發明較佳的實施例中,打標參數至少包括圖像資訊,其中圖像資訊可以是圖像大小及/或圖像位置。 In a preferred embodiment of the present invention, the marking parameters include at least image information, where the image information may be image size and/or image position.

在本發明較佳的實施例中,驅動器耦接機構軸以驅動雷射打標系統的移動。 In a preferred embodiment of the present invention, the driver is coupled to the mechanism shaft to drive the movement of the laser marking system.

根據上述雷射打標系統,本發明還提供一種雷射打標的控制方法,其步驟包含:輸入至少一個打標參數、利用控制器接收打標參數,並根據打標參數對第一相機發出第一指令、利用第一相機根據第一指令對至少一個工件進行視覺辨識以得到工件的第一視覺影像資料,並將此第一視覺影像資料回傳至控制器,並利用控制器根據此第一視覺影像產生移動命令、利用驅動器接收由控制器根據第一視覺影像資料所產生的移動命令,驅動雷射打標系統相對於工件移動,並且驅動器在移動過程中會將命令回授值回傳至該控制器,利用第二相機根據控制器在接收到命令回授值之後所產 生的第二指令而對工件進行視覺對位,以得到工件的定位資訊、以及利用雷射打標裝置接收由控制器傳送的工件的定位資訊,並根據此定位資訊對工件進行雷射打標製程。 According to the above laser marking system, the present invention also provides a laser marking control method, the steps of which include: inputting at least one marking parameter, using a controller to receive the marking parameter, and sending the first camera to the first camera according to the marking parameter. An instruction: use the first camera to visually recognize at least one workpiece according to the first instruction to obtain first visual image data of the workpiece, and return the first visual image data to the controller, and use the controller to perform visual recognition according to the first The visual image generates a movement command, the driver receives the movement command generated by the controller according to the first visual image data, drives the laser marking system to move relative to the workpiece, and the driver returns the command feedback value to The controller uses the second camera to produce the feedback value according to the controller after receiving the command The second command is generated and the workpiece is visually aligned to obtain the positioning information of the workpiece, and the positioning information of the workpiece transmitted by the controller is received by the laser marking device, and the workpiece is laser marked according to the positioning information Process.

在本發明較佳的實施例中,打標參數至少包括圖像資訊,其中圖像資訊可以是圖像大小及/或圖像位置。 In a preferred embodiment of the present invention, the marking parameters include at least image information, where the image information may be image size and/or image position.

在本發明較佳的實施例中,打標參數是由使用者由顯示面板輸入及設定。 In a preferred embodiment of the present invention, the marking parameters are input and set by the user through the display panel.

在本發明較佳的實施例中,雷射打標的控制方法更包含對工件在工作範圍內進行定位步驟以取得在此工作範圍內的工件的位置座標。 In a preferred embodiment of the present invention, the laser marking control method further includes a step of positioning the workpiece in the working range to obtain the position coordinates of the workpiece in the working range.

在本發明較佳的實施例中,雷射打標的控制方法更包含利用控制器根據第一視覺影像計算工件的數量及/或工件的位置。 In a preferred embodiment of the present invention, the method for controlling laser marking further includes using the controller to calculate the number of workpieces and/or the position of the workpieces according to the first visual image.

在本發明較佳的實施例中,雷射打標的控制方法更包含利用控制器根據工件的定位資訊進一步的計算雷射打標裝置的振鏡的偏擺角度。 In a preferred embodiment of the present invention, the laser marking control method further includes using the controller to further calculate the deflection angle of the galvanometer of the laser marking device according to the positioning information of the workpiece.

在本發明較佳的實施例中,在雷射打標的控制方法更包含當工件的數量為多個、且在流水線上為任意擺放時,利用控制器根據每一個工件的位置計算最短的加工路徑。 In a preferred embodiment of the present invention, the control method for laser marking further includes when the number of workpieces is multiple and they are randomly placed on the assembly line, using the controller to calculate the shortest processing time according to the position of each workpiece path.

在本發明較佳的實施例中,在雷射打標的控制方法更包含利用第二相機擷取與判定工件的位置,並將此位置的資訊傳送至遠端控制裝置。 In a preferred embodiment of the present invention, the control method for laser marking further includes using a second camera to capture and determine the position of the workpiece, and transmit the position information to the remote control device.

在本發明較佳的實施例中,在雷射打標的控制方法更包含利用第二相機對工件進行掃描條碼步驟。 In a preferred embodiment of the present invention, the control method of laser marking further includes the step of scanning the barcode on the workpiece with the second camera.

在本發明較佳的實施例中,在雷射打標的控制方法更包含驅動器耦接機構軸以驅動雷射打標系統的移動。 In a preferred embodiment of the present invention, the control method of laser marking further includes a driver coupling the mechanism shaft to drive the movement of the laser marking system.

1:雷射打標系統 1: Laser marking system

10:控制器 10: Controller

12:顯示面板 12: Display panel

120:打標參數 120: Marking parameters

14:第一相機 14: The first camera

16:第二相機 16: second camera

18:驅動器 18: drive

20:雷射打標裝置 20: Laser marking device

步驟S100-步驟S110:雷射打標的控制方法步驟 Step S100-Step S110: Control method steps of laser marking

步驟A100-步驟A102 Step A100-Step A102

B100:步驟 B100: steps

圖1是根據本發明所揭露的技術,表示雷射打標系統的方塊示意圖。 FIG. 1 is a block diagram of a laser marking system according to the technology disclosed in the present invention.

圖2是根據本發明所揭露的技術,表示雷射打標的控制方法的步驟流程示意圖。 FIG. 2 is a schematic flow chart showing the steps of the laser marking control method according to the technology disclosed in the present invention.

首先請參考圖1。圖1是根據本發明所揭露的技術,表示雷射打標系統的方塊示意圖。在圖1中,雷射打標系統1至少包括:控制器10、顯示面板12、第一相機14、第二相機16、驅動器18及雷射打標裝置20,其中,顯示面板12是用以讓使用者輸入及設定至少一組打標參數120,其中打標參數120可以是圖像資訊例如圖像大小及/或圖像位置。另外,使用者亦可以透過顯示面板12來得知目前雷射打標系統1的所有狀態,例如:雷射打標系統1的軸向位置、雷射打標系統1的狀態、第一相機14及第二相機16的影像擷取狀態與工件(未在圖中表示)之間的關係度、雷射源(未在圖中表示)的加工狀態與打標情況、或是打標結果。另外,使用者更可以直接由顯示面板12針對這些經過打標後的工件圖片,來判斷是否需要對目前的打標參數120進行調整,透過網路設備連線到雷射打標系統1之後,可以針對想要調整的打標參數120直接進行調整,使得雷射打標裝置20在下一次要進行打標時,會套用新的打標參數120來進行雷射打標。 Please refer to Figure 1 first. FIG. 1 is a block diagram of a laser marking system according to the technology disclosed in the present invention. In FIG. 1, the laser marking system 1 includes at least: a controller 10, a display panel 12, a first camera 14, a second camera 16, a driver 18, and a laser marking device 20, wherein the display panel 12 is used for The user is allowed to input and set at least one set of marking parameters 120, where the marking parameters 120 may be image information such as image size and/or image position. In addition, the user can also know all the current status of the laser marking system 1 through the display panel 12, such as: the axial position of the laser marking system 1, the status of the laser marking system 1, the first camera 14 and The relationship between the image capturing state of the second camera 16 and the workpiece (not shown in the figure), the processing state and marking condition of the laser source (not shown in the figure), or the marking result. In addition, the user can directly use the display panel 12 to determine whether the current marking parameters 120 need to be adjusted according to the pictures of the marked workpieces. After connecting to the laser marking system 1 through a network device, The marking parameter 120 to be adjusted can be directly adjusted, so that the laser marking device 20 will apply the new marking parameter 120 to perform laser marking when marking next time.

顯示面板12可以是雷射打標系統1上的觸控面板,也可以是桌上型電腦或筆電等,透過有線或無線網路連線的方式與雷射打標系統1中的控制器10連接。在另一實施例中,使用者可透過顯示面板12取得先行儲存於控制器10或者遠端控制裝置(未在圖中表示)的至少一組打標參數120以及與其對應的打標結果做為參考。 The display panel 12 can be a touch panel on the laser marking system 1, or it can be a desktop computer or laptop, etc., connected to the controller in the laser marking system 1 through a wired or wireless network connection. 10Connect. In another embodiment, the user can obtain at least one set of marking parameters 120 stored in the controller 10 or a remote control device (not shown in the figure) and the marking results corresponding to them through the display panel 12 as reference.

控制器10接收由使用者透過顯示面板12所輸入的至少一組打標參數120之後,控制器10會根據此組打標參數120會產生相對的第一指令並且傳送至第一相機14,使得第一相機14在接收到此第一指令之後開始對工件(未在圖中表示)進行視覺辨識,以得到工件(未在圖中表示)的第一視覺影像資料,並且再將此第一視覺影像資料回傳至控制器10。具體來說,第一相機14在雷射打標系統1中是設置在雷射打標裝置20的側邊,因此又可以將第一相機14視為側軸相機,用以針對在工作範圍內的工件(未在圖中表示)進行定位,以取得在此工作範圍內的工件(未在圖中表示)的位置座標,其中,工作範圍指的是工件(未在圖中表示)所在的區域,且為第一相機14可以擷取及定位的範圍。 After the controller 10 receives at least one set of marking parameters 120 input by the user through the display panel 12, the controller 10 generates a relative first command according to the set of marking parameters 120 and transmits it to the first camera 14, so that After receiving the first instruction, the first camera 14 starts to visually recognize the workpiece (not shown in the figure) to obtain the first visual image data of the workpiece (not shown in the figure), and then use the first vision The image data is returned to the controller 10. Specifically, the first camera 14 is arranged on the side of the laser marking device 20 in the laser marking system 1, so the first camera 14 can be regarded as a side-axis camera to target the The workpiece (not shown in the figure) is positioned to obtain the position coordinates of the workpiece (not shown in the figure) within this working range, where the working range refers to the area where the workpiece (not shown in the figure) is located , And is the range that the first camera 14 can capture and locate.

當控制器10根據由第一相機14所回傳的第一視覺影像資料之後,控制器10根據此第一視覺影像產生移動命令,驅動器18接收由控制器10傳送過來的移動命令後,驅動器18可以根據此移動命令,驅動馬達(未在圖中表示)以帶動機構軸(未在圖中表示),讓雷射打標系統1相對於工件(未在圖中表示)移動,且驅動器18會將雷射打標系統1移動後所產生的命令回授值回傳至控制器10,用以告知控制器10,雷射打標系統1已經完成移動。在一實施例中,雷射打標系統1能夠移動到工件(未在圖中表示)的上方執行雷射打標。在另一實施例中,工件(未在圖中表示)可移動到雷射打標系統1的下方以完成雷射打標製程(如工件擺放在流水線時)。值得注意的是,雷射打標系統1藉由機構軸連接於床台(未在圖中表示)上方,可依照使用者需求於床台上方移動。 After the controller 10 responds to the first visual image data returned by the first camera 14, the controller 10 generates a movement command according to the first visual image. After the driver 18 receives the movement command sent by the controller 10, the driver 18 According to this movement command, the motor (not shown in the figure) can be driven to drive the mechanism shaft (not shown in the figure) to move the laser marking system 1 relative to the workpiece (not shown in the figure), and the driver 18 will The command feedback value generated after the laser marking system 1 is moved is returned to the controller 10 to inform the controller 10 that the laser marking system 1 has finished moving. In an embodiment, the laser marking system 1 can be moved above a workpiece (not shown in the figure) to perform laser marking. In another embodiment, the workpiece (not shown in the figure) can be moved under the laser marking system 1 to complete the laser marking process (for example, when the workpiece is placed on the assembly line). It is worth noting that the laser marking system 1 is connected to the top of the bed (not shown in the figure) via a mechanism shaft, and can move on the top of the bed according to the user's needs.

在控制器10接收由驅動器18回傳的命令回授值之後,控制器10根據命令回授值對第二相機16發出第二指令,使得第二相機16對工件進行視覺對位,以得到工件(未在圖中表示)的定位資訊,且第二相機16將此工件(未 在圖中表示)的定位資訊回傳至控制器10。在本發明的實施例中,在雷射打標系統1中,第二相機16是與雷射打標裝置20設置在同一側,因此可以將第二相機16視為同軸相機,由於第二相機16利用視覺對位來得到工件(未在圖中表示)的定位資訊,因此控制器10還可以根據工件(未在圖中表示)的定位資訊進一步的計算雷射打標裝置20的振鏡(未在圖中表示)的偏擺角度,據此,可以提高對工件(未在圖中表示)進行打標時的打標精確度。於另一實施例中,第二相機16還包括擷取與判定工件(未在圖中表示)的位置,並將工件(未在圖中表示)的位置的資訊傳送至遠端控制裝置(未在圖中表示)。 After the controller 10 receives the command feedback value returned by the driver 18, the controller 10 sends a second instruction to the second camera 16 according to the command feedback value, so that the second camera 16 visually aligns the workpiece to obtain the workpiece (Not shown in the figure) positioning information, and the second camera 16 this workpiece (not shown) The positioning information shown in the figure) is returned to the controller 10. In the embodiment of the present invention, in the laser marking system 1, the second camera 16 is arranged on the same side as the laser marking device 20, so the second camera 16 can be regarded as a coaxial camera. 16 Use visual alignment to obtain the positioning information of the workpiece (not shown in the figure). Therefore, the controller 10 can further calculate the galvanometer (not shown in the figure) of the laser marking device 20 based on the positioning information of the workpiece (not shown in the figure). According to the deflection angle not shown in the figure, the marking accuracy when marking the workpiece (not shown in the figure) can be improved. In another embodiment, the second camera 16 further includes capturing and determining the position of the workpiece (not shown in the figure), and sending information about the position of the workpiece (not shown in the figure) to the remote control device (not shown in the figure). Shown in the figure).

要說明的是第一相機14和第二相機16都是智慧相機,都具備有連網功能,可以將所擷取到的第一視覺影像資料及工件(未在圖中表示)的定位資訊傳送至雷射打標系統1的顯示面板12及/或同時傳送至遠端控制裝置(未在圖中表示),例如終端機或是電腦,利用外部的遠端控制裝置(未在圖中表示)來對資料進行後處理。在另一實施例中,第一相機14和第二相機16可以不具備連網功能,且不限制兩者的解析度,皆可依照使用者對雷射打標的精度要求加以調整。舉例來說,第一相機14與第二相機16可以兩個都是解析度較低的相機,於另一實施例中,第一相機14與第二相機16可以兩個都是解析度較高的相機,其中第一相機14的解析度可以大於第二相機16或者是第一相機14的解析度可以小於第二相機16。另一方面,第一相機14與第二相機16可以兩個都具備或都不具備連網功能;或者是第一相機14與第二相機16的其中一個可以具備連網功能。 It should be noted that both the first camera 14 and the second camera 16 are smart cameras, and both have a network connection function, which can transmit the captured first visual image data and the positioning information of the workpiece (not shown in the figure) To the display panel 12 of the laser marking system 1 and/or simultaneously to a remote control device (not shown in the figure), such as a terminal or a computer, using an external remote control device (not shown in the figure) To post-process the data. In another embodiment, the first camera 14 and the second camera 16 may not have a network connection function, and the resolution of the two cameras is not limited, and both can be adjusted according to the user's requirements for the accuracy of laser marking. For example, the first camera 14 and the second camera 16 may both be cameras with a lower resolution. In another embodiment, the first camera 14 and the second camera 16 may both have a higher resolution. The resolution of the first camera 14 may be greater than that of the second camera 16 or the resolution of the first camera 14 may be smaller than that of the second camera 16. On the other hand, both the first camera 14 and the second camera 16 may or may not have the network function; or one of the first camera 14 and the second camera 16 may have the network function.

當控制器10接收到由第二相機16所傳送的工件的定位資訊之後,雷射打標裝置20會根據此定位資訊及先前由顯示面板12所輸入的打標參數120例如圖像大小及/或圖像位置,對工件(未在圖中表示)進行雷射打標,以完成雷射打標製程。 After the controller 10 receives the positioning information of the workpiece transmitted by the second camera 16, the laser marking device 20 will use the positioning information and the marking parameters 120 previously input from the display panel 12, such as image size and/ Or image position, laser marking the workpiece (not shown in the figure) to complete the laser marking process.

在上述的實施例中,若欲進行打標的工件是以整齊的方式擺放,則使用第一相機14對工件(未在圖中表示)進行視覺辨識及使用第二相機16對工件(未在圖中表示)進行位置定位時,控制器10不需要去計算雷射打標系統1相對於工件(未在圖中表示)的移動距離。但是當欲進行打標的工件是以亂料的方式擺放在流水線時,為了有效率的進行打標製程,控制器10除了根據第一相機14所得到的工件(未在圖中表示)的第一視覺影像資料產生移動命令之外,還根據第一視覺影像資料來計算在流水線上,工件(未在圖中表示)的總數量及/或每一個工件(未在圖中表示)的位置,最後得到最短的加工路徑,使得在後續雷射打標裝置20進行打標時,除了依據打標參數之外,還同時依據最短的加工路徑來對於在流水線上的工件(未在圖中表示)一一進行打標。 In the above-mentioned embodiment, if the workpiece to be marked is placed neatly, the first camera 14 is used to visually recognize the workpiece (not shown in the figure) and the second camera 16 is used to visually recognize the workpiece (not shown in the figure). When the position is located, the controller 10 does not need to calculate the moving distance of the laser marking system 1 relative to the workpiece (not shown in the figure). However, when the workpiece to be marked is placed on the assembly line in a random manner, in order to perform the marking process efficiently, the controller 10 except for the first camera 14 obtained by the first camera (not shown in the figure) In addition to generating a movement command from a visual image data, it also calculates the total number of workpieces (not shown in the figure) and/or the position of each workpiece (not shown in the figure) on the assembly line based on the first visual image data, Finally, the shortest processing path is obtained, so that when the subsequent laser marking device 20 performs marking, in addition to the marking parameters, it is also based on the shortest processing path for the workpiece on the assembly line (not shown in the figure) Mark one by one.

在另一實施例中,驅動器18可以具備多軸驅動功能並與第一相機14和第二相機16連接。如此一來,驅動器18可依照使用者需求控制第一相機14和第二相機16的移動。舉例來說,若需進行雷射打標的工件(未在圖中表示)的擺放位置超出第一相機14和第二相機16原本設定的影像擷取範圍時,使用者可以調整第一相機14或第二相機16的影像擷取角度直到需進行雷射打標的工件(未在圖中表示)位於其第一相機14或第二相機16的影像擷取範圍內。 In another embodiment, the driver 18 may have a multi-axis driving function and be connected to the first camera 14 and the second camera 16. In this way, the driver 18 can control the movement of the first camera 14 and the second camera 16 according to user requirements. For example, if the position of the workpiece (not shown in the figure) to be laser-marked exceeds the image capturing range originally set by the first camera 14 and the second camera 16, the user can adjust the first camera 14 Or the image capturing angle of the second camera 16 until the workpiece (not shown in the figure) to be laser marked is within the image capturing range of the first camera 14 or the second camera 16.

另外,於本發明的另一實施例中,第二相機16可以在工件完成雷射打標製程之後,更進一步的可以對工件(未在圖中表示)進行掃描條碼步驟,進一步的確認工件(未在圖中表示)的打標結果以及讀取已打標的工件的資訊。 In addition, in another embodiment of the present invention, the second camera 16 can further scan the barcode of the workpiece (not shown in the figure) after the workpiece has completed the laser marking process to further confirm the workpiece ( Not shown in the figure) marking results and reading the information of the marked workpiece.

接著,本發明還揭露一種應用於雷射打標系統1的雷射打標的控制方法,如圖2所示,並同時配合圖1來進一步說明。在圖2中,步驟S100:輸 入打標參數。於此步驟中,使用者透過雷射打標系統1中的顯示面板12將欲進行打標的工件(未在圖中表示)的至少一組打標參數120輸入至雷射打標系統1,其中打標參數可以是圖像資訊,例如圖像大小及/或是圖像位置。接著,步驟S102:利用控制器接收打標參數,並根據打標參數對第一相機發出第一指令。於此步驟中,控制器10接收由使用者透過顯示面板12所輸入的打標參數120之後,對雷射打標系統1中的第一相機14發出第一指令。接著步驟S104:利用第一相機根據第一指令對工件進行視覺辨識以得到工件的第一視覺影像資料,並將第一視覺影像資料回傳至控制器,並利用控制器根據第一視覺影像資料產生移動命令。於此步驟中,第一相機14接收到由控制器10傳來的第一指令之後,對於在工作範圍內的工件(未在圖中表示)進行視覺辨識,以進行大範圍定位,取得在目前的工作範圍中,欲進行打標的工件(未在圖中表示)的位置座標。當第一相機14擷取到工作範圍內的工件(未在圖中表示)的第一視覺影像資料之後,將此第一視覺影像資料回傳至控制器10,此時控制器10會根據此第一視覺影像資料產生相對應的移動命令。 Next, the present invention also discloses a laser marking control method applied to the laser marking system 1, as shown in FIG. 2, and is further described in conjunction with FIG. 1 at the same time. In Figure 2, step S100: input Enter the marking parameters. In this step, the user inputs at least one set of marking parameters 120 of the workpiece (not shown in the figure) to be marked into the laser marking system 1 through the display panel 12 in the laser marking system 1, where The marking parameters can be image information, such as image size and/or image location. Next, step S102: Utilize the controller to receive the marking parameter, and issue a first instruction to the first camera according to the marking parameter. In this step, after the controller 10 receives the marking parameters 120 input by the user through the display panel 12, it sends a first command to the first camera 14 in the laser marking system 1. Then step S104: Use the first camera to visually recognize the workpiece according to the first command to obtain the first visual image data of the workpiece, and return the first visual image data to the controller, and use the controller according to the first visual image data Generate a move command. In this step, after the first camera 14 receives the first instruction from the controller 10, it visually recognizes the workpiece (not shown in the figure) within the working range for large-scale positioning, and obtains the current The position coordinates of the workpiece (not shown in the figure) to be marked in the working range. After the first camera 14 captures the first visual image data of the workpiece (not shown in the figure) within the working range, the first visual image data is returned to the controller 10, and the controller 10 will respond according to this The first visual image data generates a corresponding movement command.

接著,步驟S106:利用驅動器接收由控制器根據第一視覺影像資料產生的移動命令,驅動雷射打標系統根據此移動命令相對於工件(未在圖中表示)移動,並且驅動器將命令回授值回傳至控制器。於此步驟中,驅動器18接收由控制器10根據第一視覺影像資料所產生的移動命令之後,驅動器18會依據此移動命令,驅動雷射打標系統1相對於工件(未在圖中表示)移動,並且驅動器18會將雷射打標系統1移動時所產生的命令回授值回傳至控制器10。 Next, step S106: Use the driver to receive the movement command generated by the controller according to the first visual image data, drive the laser marking system to move relative to the workpiece (not shown in the figure) according to the movement command, and the driver feedback the command The value is passed back to the controller. In this step, after the driver 18 receives the movement command generated by the controller 10 according to the first visual image data, the driver 18 will drive the laser marking system 1 relative to the workpiece according to the movement command (not shown in the figure) And the driver 18 will return the command feedback value generated when the laser marking system 1 moves to the controller 10.

步驟S108:利用第二相機根據控制器在接收到命令回授值之後所產生的第二指令對工件進行視覺對位,以得到工件的定位資訊。在此步驟 中,控制器10在接收到由驅動器18回傳的命令回授值之後,會產生第二指令,並且將此第二指令傳送至第二相機16,讓第二相機16依據此第二指令對在目前工作範圍內的工件(未在圖中表示)進行視覺對位,以得到工件(未在圖中表示)的定位資訊。 Step S108: Use the second camera to visually align the workpiece according to the second command generated by the controller after receiving the command feedback value, so as to obtain the positioning information of the workpiece. At this step In the controller 10, after receiving the command feedback value returned by the driver 18, it generates a second command, and transmits the second command to the second camera 16, so that the second camera 16 responds to the second command according to the second command. Visual alignment is performed on the workpiece (not shown in the figure) in the current working range to obtain the positioning information of the workpiece (not shown in the figure).

接著,步驟S110:利用雷射打標裝置接收由控制器傳送的工件的定位資訊,並且根據定位資訊及打標參數對工件進行雷射打標製程。在前述步驟S108中,第二相機16得到工件(未在圖中表示)的定位資訊之後會將此定位資訊回傳至控制器10,控制器10即根據此定位資訊及先前所輸入的打標參數120來驅動雷射打標裝置20對工件(未在圖中表示)進行打標,以完成雷射打標製程。 Next, step S110: Use the laser marking device to receive the positioning information of the workpiece transmitted by the controller, and perform a laser marking process on the workpiece according to the positioning information and marking parameters. In the aforementioned step S108, after the second camera 16 obtains the positioning information of the workpiece (not shown in the figure), the positioning information will be returned to the controller 10, and the controller 10 will then use the positioning information and the previously entered marking The parameter 120 drives the laser marking device 20 to mark the workpiece (not shown in the figure) to complete the laser marking process.

要說明的是,在上述步驟中,若工件(未在圖中表示)是亂料的方式,也就是說以多個、且以任意擺放的方式擺放在流水線時,於步驟A100,利用控制器10根據第一視覺影像資料計算在流水線上的工件數量及/或工件的位置。在此步驟中,控制器10除了根據第一視覺影像資料產生移動命令(步驟S104)之外,同時還根據此第一視覺影像資料計算在流水線上的工件數量及/或是工件的位置。接著,步驟A102,利用控制器依據工件數量及/或工件的位置並利用演算法來計算出振鏡的偏擺角度及工件的最短的加工路徑。於此步驟中,控制器10依據工件數量及/或工件的位置利用演算法來計算出振鏡(未在圖中表示)的偏擺角度及最短的加工路徑,此步驟的目的在於,由於工件(未在圖中表示)在流水線是以亂料的方式擺放,因此,在進行雷射打標製程時,為了要節省打標時間,必需要根據工件(未在圖中表示)的數量及位置來計算出最短的加工路徑,使得雷射打標裝置20可以在最短的加工路徑來進行打標製程。要說明的是,如果工件(未在圖中表示)在流水線上不是以亂料的方式擺放,則控制器10可以不需要依據工件數量及/或工 件(未在圖中表示)的位置來計算最短的加工路徑,也不需要計算振鏡(未在圖中表示)的偏擺角度。因此,控制器10可以根據第一相機14所得到的第一視覺影像資料來判斷工件(未在圖中表示)是不是以亂料的方式擺放於流水線上,若是,則控制器10依據第一視覺影像計算工件數量及/或工件(未在圖中表示)的位置,並進一步的計算出最短的加工路徑;若不是,則控制器10就不需要計算對工件(未在圖中表示)進行打標時的最短的加工路徑。 It should be noted that in the above steps, if the workpiece (not shown in the figure) is a random material, that is to say, when multiple and arbitrarily placed on the assembly line, in step A100, use The controller 10 calculates the number of workpieces and/or the positions of the workpieces on the assembly line according to the first visual image data. In this step, in addition to generating a movement command based on the first visual image data (step S104), the controller 10 also calculates the number of workpieces and/or the positions of the workpieces on the assembly line based on the first visual image data. Next, in step A102, the controller is used to calculate the deflection angle of the galvanometer and the shortest processing path of the workpiece according to the number of workpieces and/or the position of the workpiece and the algorithm. In this step, the controller 10 uses an algorithm to calculate the deflection angle and the shortest processing path of the galvanometer (not shown in the figure) according to the number of workpieces and/or the position of the workpiece. The purpose of this step is that the workpiece (Not shown in the figure) The assembly line is placed in a random manner. Therefore, in order to save marking time during the laser marking process, it must be based on the number of workpieces (not shown in the figure) and The position is used to calculate the shortest processing path, so that the laser marking device 20 can perform the marking process on the shortest processing path. It should be noted that if the workpieces (not shown in the figure) are not placed in a random manner on the assembly line, the controller 10 may not need to depend on the number of workpieces and/or the work. The position of the workpiece (not shown in the figure) is used to calculate the shortest processing path, and there is no need to calculate the deflection angle of the galvanometer (not shown in the figure). Therefore, the controller 10 can determine whether the workpiece (not shown in the figure) is placed on the assembly line in a random manner according to the first visual image data obtained by the first camera 14. A visual image calculates the number of workpieces and/or the position of the workpiece (not shown in the figure), and further calculates the shortest processing path; if not, the controller 10 does not need to calculate the workpiece (not shown in the figure) The shortest processing path when marking.

另外,在完成打標製程之後,即完成步驟S110之後,可以進一步的進行步驟B100:利用第二相機對已完成打標的工件進行掃碼步驟以判斷是否需要修改打標參數。在此步驟中,利用第二相機16對已完成打標的工件進行掃碼,其目的是為了讓使用者可以處理已經進行打標的工件圖片,可以直接透過雷射打標系統1的顯示面板12或是遠端控制裝置(未在圖中表示),來判斷是否需要對目前的打標參數120進行調整,使用者可以直接透過顯示面板12來修改,或者是透過與雷射打標系統1連接的遠端控制裝置(未在圖中表示)來針對想要修改的打標的圖像資訊中的圖像尺寸及/或圖像位置進行調整,使得在進行下一次打標前可以套用新的打標參數。 In addition, after the marking process is completed, that is, after step S110 is completed, step B100 may be further performed: use the second camera to scan the code of the workpiece that has been marked to determine whether the marking parameters need to be modified. In this step, the second camera 16 is used to scan the code of the workpiece that has been marked. The purpose is to allow the user to process the image of the workpiece that has been marked. It can directly pass through the display panel 12 or the laser marking system 1 It is a remote control device (not shown in the figure) to determine whether the current marking parameter 120 needs to be adjusted. The user can modify it directly through the display panel 12, or connect to the laser marking system 1 The remote control device (not shown in the figure) adjusts the image size and/or image position in the image information of the marking to be modified, so that the new marking can be applied before the next marking parameter.

1:雷射打標系統 1: Laser marking system

10:控制器 10: Controller

12:顯示面板 12: Display panel

120:打標參數 120: Marking parameters

14:第一相機 14: The first camera

16:第二相機 16: second camera

18:驅動器 18: drive

20:雷射打標裝置 20: Laser marking device

Claims (22)

一種雷射打標系統,包含:一顯示面板,用以輸入及設定至少一打標參數;一控制器,接收該打標參數;一第一相機,接收由該控制器傳送的相對於該打標參數的一第一指令對至少一工件進行一視覺辨識以得到該工件的一第一視覺影像資料,並將該第一視覺影像資料回傳至該控制器,該控制器根據該第一相機所得到的該第一視覺影像資料判斷該工件是不是以亂料的方式擺放於一流水線上,若是,則該控制器依據該第一視覺影像資料計算在該流水線上的工件數量及/或工件的位置,並計算出該些工件的最短的一加工路徑,若不是則該控制器不需要計算對該工件進行打標時的最短的一加工路徑;一驅動器,接收由該控制器根據該第一視覺影像所產生的一移動命令驅動該雷射打標系統相對於該工件移動並且將一命令回授值回傳至該控制器;一第二相機,該控制器接收該命令回授值後對該第二相機發出一第二指令,使得該第二相機根據該第二指令對該工件進行一視覺對位以得到該工件的一定位資訊,並將該工件的該定位資訊回傳至該控制器;以及一雷射打標裝置,接收由該控制器傳送的該工件的該定位資訊,並根據該定位資訊及該組打標參數對該工件進行一雷射打標製程。 A laser marking system includes: a display panel for inputting and setting at least one marking parameter; a controller for receiving the marking parameter; and a first camera for receiving the signal transmitted by the controller relative to the marking parameter; A first command with a standard parameter performs a visual recognition on at least one workpiece to obtain a first visual image data of the workpiece, and returns the first visual image data to the controller, which according to the first camera The obtained first visual image data determines whether the workpiece is placed on the first-rate waterline in a random manner, and if so, the controller calculates the number of workpieces and/or on the pipeline according to the first visual image data The position of the workpiece, and calculate the shortest processing path of the workpieces. If it is not, the controller does not need to calculate the shortest processing path when marking the workpiece; a driver receives the controller according to the A movement command generated by the first visual image drives the laser marking system to move relative to the workpiece and returns a command feedback value to the controller; a second camera, the controller receives the command feedback value Then a second command is issued to the second camera, so that the second camera performs a visual alignment on the workpiece according to the second command to obtain a positioning information of the workpiece, and returns the positioning information of the workpiece to The controller; and a laser marking device that receives the positioning information of the workpiece transmitted by the controller, and performs a laser marking process on the workpiece according to the positioning information and the set of marking parameters. 如申請專利範圍第1項所述的雷射打標系統,其中該第一相機設置在該雷射打標裝置的一側邊,用以對該工件於一工作範圍內進行定位以取得在該工作範圍內的該工件的一位置座標。 For the laser marking system described in item 1 of the scope of patent application, the first camera is arranged on one side of the laser marking device for positioning the workpiece in a working range to obtain the A position coordinate of the workpiece within the working range. 如申請專利範圍第1項所述的雷射打標系統,其中該控制器根據該第一視覺影像進一步計算該工件的一數量及/或該工件的一位置。 According to the laser marking system described in claim 1, wherein the controller further calculates a quantity of the workpiece and/or a position of the workpiece according to the first visual image. 如申請專利範圍第3項所述的雷射打標系統,其中該控制器進一步根據該工件的該數量及該工件的該位置以計算一最短的一加工路徑。 According to the laser marking system described in item 3 of the scope of patent application, the controller further calculates a shortest processing path according to the number of the workpieces and the position of the workpieces. 如申請專利範圍第1項所述的雷射打標系統,其中該控制器根據該工件的該定位資訊進一步的計算該雷射打標裝置的一振鏡的一偏擺角度。 According to the laser marking system described in item 1 of the scope of patent application, the controller further calculates a deflection angle of a galvanometer of the laser marking device according to the positioning information of the workpiece. 如申請專利範圍第1項所述的雷射打標系統,其中該第二相機與該雷射打標裝置設置在同一側。 The laser marking system as described in item 1 of the scope of patent application, wherein the second camera and the laser marking device are arranged on the same side. 如申請專利範圍第1項或第6項所述的雷射打標系統,其中該第二相機更包含擷取與判定該工件的該位置,並將該位置的一資訊傳送至一遠端控制裝置。 Such as the laser marking system described in item 1 or item 6 of the scope of patent application, wherein the second camera further includes capturing and determining the position of the workpiece, and sending a piece of information of the position to a remote control Device. 如申請專利範圍第1項或第6項所述的雷射打標系統,其中該第二相機更包含對該工件進行一掃描條碼步驟。 For the laser marking system described in item 1 or item 6 of the scope of patent application, the second camera further includes a step of scanning a barcode on the workpiece. 如申請專利範圍第1項所述的雷射打標系統,其中該打標參數至少包括一圖像資訊。 In the laser marking system described in item 1 of the scope of patent application, the marking parameter includes at least one image information. 如申請專利範圍第9項所述的雷射打標系統,其中該圖像資訊可以是圖像大小及/或圖像位置。 For the laser marking system described in item 9 of the scope of patent application, the image information can be the image size and/or the image position. 如申請專利範圍第1項所述的雷射打標系統,其中該驅動器耦接一機構軸以驅動該雷射打標系統的移動。 According to the laser marking system described in item 1 of the scope of patent application, the driver is coupled to a mechanism shaft to drive the movement of the laser marking system. 一種雷射打標的控制方法,其步驟包含:輸入至少一打標參數; 利用一控制器接收該打標參數,並根據該打標參數對一第一相機發出一第一指令;利用該第一相機根據該第一指令對至少一工件進行一視覺辨識以得到該工件的一第一視覺影像資料並將該第一視覺影像資料回傳至該控制器,且該控制器用以判斷該工件為任意擺放於一流水線上,若是則依據該第一視覺影像資料計算在該流水線上的工件數量及/或該工件的一位置,並計算出該些工件的最短的一加工路徑;若不是,則不需要對該工件計算最短的該加工路徑,並利用該控制器根據該第一視覺影像資料產生一移動命令;利用一驅動器接收由該控制器根據該第一視覺影像資料產生的該移動命令,驅動一雷射打標系統根據該移動命令相對於該工件移動,並且該驅動器將一命令回授值回傳至該控制器;利用一第二相機根據該控制器在接收到該命令回授值之後所產生的一第二指令對該工件進行一視覺對位,以得到該工件的一定位資訊;以及利用一雷射打標裝置接收由該控制器傳送的該工件的該定位資訊,並根據該定位資訊對該工件進行一雷射打標製程。 A method for controlling laser marking, the steps of which include: inputting at least one marking parameter; Use a controller to receive the marking parameter, and send a first command to a first camera according to the marking parameter; use the first camera to perform a visual recognition on at least one workpiece according to the first command to obtain the workpiece A first visual image data and the first visual image data are returned to the controller, and the controller is used to determine that the workpiece is arbitrarily placed on the first-rate waterline, and if so, it is calculated on the first visual image data according to the first visual image data. The number of workpieces on the assembly line and/or a position of the workpiece, and calculate the shortest processing path of the workpieces; if not, there is no need to calculate the shortest processing path for the workpiece, and use the controller according to the The first visual image data generates a movement command; a driver receives the movement command generated by the controller according to the first visual image data, drives a laser marking system to move relative to the workpiece according to the movement command, and the The driver returns a command feedback value to the controller; a second camera is used to perform a visual alignment of the workpiece according to a second instruction generated by the controller after receiving the command feedback value to obtain A positioning information of the workpiece; and using a laser marking device to receive the positioning information of the workpiece transmitted by the controller, and perform a laser marking process on the workpiece according to the positioning information. 如申請專利範圍第12項所述的雷射打標的控制方法,其中該打標參數至少包括一圖像資訊。 The laser marking control method as described in item 12 of the scope of patent application, wherein the marking parameter includes at least one image information. 如申請專利範圍第12項所述的雷射打標的控制方法,其中該圖像資訊可以是圖像大小及/或圖像位置。 In the laser marking control method described in item 12 of the scope of patent application, the image information can be the image size and/or the image position. 如申請專利範圍第12項或第13項所述的雷射打標的控制方法,其中該打標參數是由一使用者由一顯示面板輸入及設定。 For example, the laser marking control method described in item 12 or 13 of the scope of patent application, wherein the marking parameter is input and set by a user through a display panel. 如申請專利範圍第12項所述的雷射打標的控制方法,更包含對該工件在一工作範圍內進行一定位步驟以取得在該工作範圍內的該工件的一位置座標。 As described in item 12 of the scope of patent application, the laser marking control method further includes performing a positioning step on the workpiece in a working range to obtain a position coordinate of the workpiece in the working range. 如申請專利範圍第12項所述的雷射打標的控制方法,更包含利用該控制器根據該第一視覺影像計算該工件的一數量及/或該工件的一位置。 The laser marking control method as described in item 12 of the scope of the patent application further includes using the controller to calculate a quantity of the workpiece and/or a position of the workpiece according to the first visual image. 如申請專利範圍第12項所述的雷射打標的控制方法,更包含利用該控制器根據該工件的該定位資訊進一步的計算該雷射打標裝置的一振鏡的一偏擺角度。 As described in item 12 of the scope of patent application, the laser marking control method further includes using the controller to further calculate a deflection angle of a galvanometer of the laser marking device according to the positioning information of the workpiece. 如申請專利範圍第12項所述的雷射打標的控制方法,其中當該工件的該數量為多個、且在一流水線上為任意擺放時,利用該控制器根據各該工件的該位置計算一最短的一加工路徑。 The laser marking control method as described in item 12 of the scope of patent application, wherein when the number of the workpieces is multiple and they are randomly placed on the water line, the controller is used according to the position of each workpiece Calculate a shortest processing path. 如申請專利範圍第12項所述的雷射打標的控制方法,其中利用該第二相機擷取與判定該工件的該位置,並將該位置的一資訊傳送至一遠端控制裝置。 The laser marking control method as described in item 12 of the scope of patent application, wherein the second camera is used to capture and determine the position of the workpiece, and transmit a piece of information of the position to a remote control device. 如申請專利範圍第12項所述的雷射打標的控制方法,更包含利用該第二相機對該工件進行一掃描條碼步驟。 As described in item 12 of the scope of patent application, the laser marking control method further includes a step of scanning a barcode on the workpiece by using the second camera. 如申請專利範圍第12項所述的雷射打標的控制方法,其中該驅動器耦接一機構軸以驅動該雷射打標系統的移動。 The laser marking control method as described in item 12 of the scope of patent application, wherein the driver is coupled to a mechanism shaft to drive the movement of the laser marking system.
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TW201714695A (en) * 2015-10-28 2017-05-01 新代科技股份有限公司 Flying laser marking system with real-time 3D modeling and method thereof
CN107931848A (en) * 2017-11-16 2018-04-20 惠州市契贝科技有限公司 Continuously beat calibration method and marking device
TW201927453A (en) * 2017-12-15 2019-07-16 新代科技股份有限公司 Boundary-Joint Laser-mark machine and the method thereof
TWM600667U (en) * 2020-03-12 2020-09-01 新代科技股份有限公司 Laser marking system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201714695A (en) * 2015-10-28 2017-05-01 新代科技股份有限公司 Flying laser marking system with real-time 3D modeling and method thereof
CN107931848A (en) * 2017-11-16 2018-04-20 惠州市契贝科技有限公司 Continuously beat calibration method and marking device
TW201927453A (en) * 2017-12-15 2019-07-16 新代科技股份有限公司 Boundary-Joint Laser-mark machine and the method thereof
TWM600667U (en) * 2020-03-12 2020-09-01 新代科技股份有限公司 Laser marking system

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