TWI729511B - Calibration method, calibration device, calibration system and electronic equipment - Google Patents

Calibration method, calibration device, calibration system and electronic equipment Download PDF

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TWI729511B
TWI729511B TW108135166A TW108135166A TWI729511B TW I729511 B TWI729511 B TW I729511B TW 108135166 A TW108135166 A TW 108135166A TW 108135166 A TW108135166 A TW 108135166A TW I729511 B TWI729511 B TW I729511B
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circle
distance
calibration point
polishing head
loading
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TW202107036A (en
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劉小潔
尹影
李婷
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北京半導體專用設備研究所(中國電子科技集團公司第四十五研究所)
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques

Abstract

本發明提供一種校準方法、校準裝置、校準系統及電子設備。校準方法包括:獲取第一距離、第二距離、第三距離以及第四距離;根據第一距離、第二距離、第三距離以及第四距離校準預設拋光頭圓至目標拋光頭圓,以使第一距離與第二距離相等,以及第三距離與第四距離相等。因此,通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭圓進行校準,以使拋光頭圓對應的拋光頭與裝卸台圓對應的裝卸台同軸度一致。採用上述方法對拋光頭與裝卸台的位置進行校準,方便快捷,且誤差小、準確度高。The invention provides a calibration method, a calibration device, a calibration system and electronic equipment. The calibration method includes: obtaining a first distance, a second distance, a third distance, and a fourth distance; and calibrating a preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance. The first distance is equal to the second distance, and the third distance is equal to the fourth distance. Therefore, by making the first distance equal to the second distance, and the third distance equal to the fourth distance, the polishing head circle is calibrated so that the polishing head corresponding to the polishing head circle is consistent with the coaxiality of the loading and unloading table corresponding to the loading and unloading table circle. . The above method is adopted to calibrate the positions of the polishing head and the loading and unloading table, which is convenient and quick, with small errors and high accuracy.

Description

校準方法、校準裝置、校準系統及電子設備Calibration method, calibration device, calibration system and electronic equipment

本發明關於化學機械拋光技術領域,具體而言,關於一種校準方法、校準裝置、校準系統及電子設備。The present invention relates to the technical field of chemical mechanical polishing, in particular, to a calibration method, a calibration device, a calibration system and electronic equipment.

化學機械平坦化(Chemical Mechanical Planarization,CMP)的設備包括拋光頭(Head)以及裝卸台(Wafer Loader),當拋光頭從裝卸台取片及卸片時,拋光頭與裝卸台應該保證同軸度一致,如果不一致將會導致拋光頭取放片時間過長,且拋光頭與裝卸台對位若偏差過大時會導致產生碎片等嚴重後果。因此,在化學機械平坦化的設備使用前,首先需要對拋光頭以及裝卸台進行校準。傳統校準方法主要是拿著直尺刻度尺反復測量拋光頭以及裝卸台兩圓周之間的差值,測量後反復調整多次拋光頭的位置,以達到校準的目的。但是,採用傳統校準方法得到的結果誤差較大。Chemical Mechanical Planarization (CMP) equipment includes a polishing head (Head) and a loading and unloading table (Wafer Loader). When the polishing head takes and unloads the film from the loading and unloading table, the polishing head and the loading and unloading table should ensure the same coaxiality , If it is inconsistent, the polishing head will take too long to take and place the film, and if the alignment of the polishing head and the loading and unloading table is too large, it will cause fragmentation and other serious consequences. Therefore, before the chemical mechanical planarization equipment is used, the polishing head and the loading and unloading table need to be calibrated first. The traditional calibration method is mainly to repeatedly measure the difference between the polishing head and the two circumferences of the loading and unloading table with a ruler scale, and repeatedly adjust the position of the polishing head several times after the measurement to achieve the purpose of calibration. However, the error of the result obtained by the traditional calibration method is relatively large.

本發明提供一種校準方法、校準裝置、校準系統及電子設備,以改善校準結果誤差較大的問題。The invention provides a calibration method, a calibration device, a calibration system and electronic equipment to improve the problem of large errors in calibration results.

為了實現上述目的,本發明實施例所提供的技術方案如下所示: 第一方面,本發明實施例提供一種校準方法,包括:獲取第一距離、第二距離、第三距離以及第四距離;其中,所述第一距離為第一校準點與預設拋光頭圓的最短距離,所述第二距離為第二校準點與所述預設拋光頭圓的最短距離,所述第三距離為第三校準點與所述預設拋光頭圓的最小圓弧距離,所述第四距離為第四校準點與所述預設拋光頭圓的最小圓弧距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓;根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等;其中,所述目標拋光頭圓為所述拋光頭的目標位置對應的圓。因此,通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭圓進行校準,以使拋光頭圓對應的拋光頭與裝卸台圓對應的裝卸台同軸度一致。採用上述方法對拋光頭與裝卸台的位置進行校準,方便快捷,且誤差小、準確度高。 In order to achieve the foregoing objectives, the technical solutions provided by the embodiments of the present invention are as follows: In a first aspect, an embodiment of the present invention provides a calibration method, including: obtaining a first distance, a second distance, a third distance, and a fourth distance; wherein the first distance is the first calibration point and the preset polishing head circle The second distance is the shortest distance between the second calibration point and the preset polishing head circle, and the third distance is the minimum arc distance between the third calibration point and the preset polishing head circle, The fourth distance is the minimum arc distance between the fourth calibration point and the preset polishing head circle; the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point The punctual point is located on the loading and unloading table circle; the preset polishing head circle is the circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is the circle corresponding to the fixed position of the loading and unloading table; according to the first distance, the first distance The second distance, the third distance, and the fourth distance align the preset polishing head circle to the target polishing head circle, so that the first distance is equal to the second distance, and the third distance is equal to The fourth distances are equal; wherein the target polishing head circle is a circle corresponding to the target position of the polishing head. Therefore, by making the first distance equal to the second distance, and the third distance equal to the fourth distance, the polishing head circle is calibrated so that the polishing head corresponding to the polishing head circle is consistent with the coaxiality of the loading and unloading table corresponding to the loading and unloading table circle. . The above method is adopted to calibrate the positions of the polishing head and the loading and unloading table, which is convenient and quick, with small errors and high accuracy.

在本發明的可選實施例中,在所述獲取第一距離之前,所述方法還包括:獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊;根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。因此,首先將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台圓上,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, before the obtaining the first distance, the method further includes: obtaining first position information of the first calibration point, second position information of the second calibration point, The third position information of the third calibration point and the fourth position information of the fourth calibration point; the first calibration point is marked on the loading platform circle according to the first position information, and according to the The second position information marks the second calibration point on the loading and unloading platform circle, and the third calibration point is marked on the loading and unloading platform circle according to the third position information, and according to the fourth position information Mark the fourth calibration point on the circle of the loading and unloading platform. Therefore, first, the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are marked on the loading and unloading platform circle, so that the electronic device can be based on the above-mentioned first calibration point, second calibration point, and third calibration point. The punctuality and the fourth calibration point are used to calibrate the positions of the polishing head and the loading and unloading table with high accuracy.

在本發明的可選實施例中,所述獲取所述第一校準點的第一位置資訊以及所述第二校準點的第二位置資訊,包括:獲取拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;利用第一直線連接所述第一圓心與第二圓心,得到所述第一直線與所述裝卸台圓的第一交點以及第二交點;其中,所述第二圓心為所述裝卸台圓的圓心;確定所述第一交點的位置資訊為所述第一位置資訊以及第二交點的位置資訊為所述第二位置資訊。因此,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the acquiring the first position information of the first calibration point and the second position information of the second calibration point includes: acquiring the first center of the trajectory circle of the polishing head and the The loading and unloading table circle; wherein, the polishing head track circle is a circle corresponding to the polishing head running track; a first line is used to connect the first circle center and the second circle center to obtain the distance between the first line and the loading and unloading table circle A first intersection point and a second intersection point; wherein, the second circle center is the center of the loading dock circle; it is determined that the position information of the first intersection point is the first position information and the position information of the second intersection point is the Second location information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device can be based on the above-mentioned first calibration point. The calibration point, the second calibration point, the third calibration point, and the fourth calibration point perform high-accuracy calibration on the positions of the polishing head and the loading and unloading table.

在本發明的可選實施例中,所述獲取所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊,包括:獲取拋光頭軌跡圓的半徑、所述拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;根據所述拋光頭軌跡圓的半徑以及所述裝卸台圓的半徑確定第一角度的餘弦值,並根據所述餘弦值確定所述第一角度;其中所述第一角度為第一直線與第二直線的夾角,所述第一直線為所述第一圓心與第二圓心的連線,所述第二圓心為所述裝卸台圓的圓心,所述第二直線為所述第一圓心與所述第三校準點或者所述第四校準點的連線;根據所述第一角度、所述第一直線以及所述裝卸台圓確定所述第三位置資訊以及所述第四位置資訊。因此,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the acquiring the third position information of the third calibration point and the fourth position information of the fourth calibration point includes: acquiring the radius of the trajectory circle of the polishing head, the polishing The first center of the head trajectory circle and the loading and unloading table circle; wherein, the polishing head trajectory circle is the circle corresponding to the polishing head running trajectory; according to the radius of the polishing head trajectory circle and the loading and unloading table circle Determine the cosine value of the first angle, and determine the first angle according to the cosine value; wherein the first angle is the angle between the first straight line and the second straight line, and the first straight line is the center of the first circle and the second straight line. The line connecting the center of the circle, the second center is the center of the loading and unloading platform circle, and the second straight line is the line connecting the center of the first circle and the third calibration point or the fourth calibration point; The first angle, the first straight line, and the loading platform circle determine the third position information and the fourth position information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device can be based on the above-mentioned first calibration point. The calibration point, the second calibration point, the third calibration point, and the fourth calibration point perform high-accuracy calibration on the positions of the polishing head and the loading and unloading table.

第二方面,本發明實施例提供一種校準裝置,包括:第一獲取模組,用於獲取第一距離、第二距離、第三距離以及第四距離;其中,所述第一距離為第一校準點與預設拋光頭圓的最短距離,所述第二距離為第二校準點與所述預設拋光頭圓的最短距離,所述第三距離為第三校準點與所述預設拋光頭圓的最小圓弧距離,所述第四距離為第四校準點與所述預設拋光頭圓的最小圓弧距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓;校準模組,用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等;其中,所述目標拋光頭圓為所述拋光頭的目標位置對應的圓。因此,校準模組通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭圓進行校準,以使拋光頭圓對應的拋光頭與裝卸台圓對應的裝卸台同軸度一致。採用上述方法對拋光頭與裝卸台的位置進行校準,方便快捷,且誤差小、準確度高。In a second aspect, an embodiment of the present invention provides a calibration device, including: a first acquisition module for acquiring a first distance, a second distance, a third distance, and a fourth distance; wherein the first distance is the first distance. The shortest distance between the calibration point and the preset polishing head circle, the second distance is the shortest distance between the second calibration point and the preset polishing head circle, and the third distance is the third calibration point and the preset polishing The minimum arc distance of the head circle, the fourth distance is the minimum arc distance between the fourth calibration point and the preset polishing head circle; the first calibration point, the second calibration point, the third The calibration point and the fourth calibration point are located on the loading and unloading table circle; the preset polishing head circle is the circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is the circle corresponding to the fixed position of the loading and unloading table; Group, used to calibrate the preset polishing head circle to the target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is equal to The second distance is equal, and the third distance is equal to the fourth distance; wherein the target polishing head circle is a circle corresponding to the target position of the polishing head. Therefore, the calibration module calibrates the polishing head circle by making the first distance equal to the second distance, and the third distance equals to the fourth distance, so that the polishing head corresponding to the polishing head circle corresponds to the loading and unloading table corresponding to the loading and unloading table circle. The coaxiality is the same. The above method is adopted to calibrate the positions of the polishing head and the loading and unloading table, which is convenient and quick, with small errors and high accuracy.

在本發明的可選實施例中,所述裝置還包括:第二獲取模組,用於獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊;標註模組,用於根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。因此,首先標註模組將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台圓上,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the device further includes: a second acquisition module for acquiring first position information of the first calibration point, second position information of the second calibration point, and The third position information of the third calibration point and the fourth position information of the fourth calibration point; a marking module for marking the first calibration point on the loading platform circle according to the first position information In the above, the second calibration point is marked on the loading and unloading platform circle according to the second position information, and the third calibration point is marked on the loading and unloading platform circle according to the third position information. The fourth position information marks the fourth calibration point on the loading and unloading platform circle. Therefore, the marking module first marks the first calibration point, the second calibration point, the third calibration point and the fourth calibration point on the circle of the loading and unloading platform, so that the electronic device can be based on the above-mentioned first calibration point, second calibration point, The third calibration point and the fourth calibration point calibrate the positions of the polishing head and the loading and unloading table with high accuracy.

在本發明的可選實施例中,所述第二獲取模組具體用於:獲取拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;利用第一直線連接所述第一圓心與第二圓心,得到所述第一直線與所述裝卸台圓的第一交點以及第二交點;其中,所述第二圓心為所述裝卸台圓的圓心;確定所述第一交點的位置資訊為所述第一位置資訊以及第二交點的位置資訊為所述第二位置資訊。因此,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the second acquisition module is specifically configured to: acquire the first center of the polishing head trajectory circle and the loading and unloading table circle; wherein, the polishing head trajectory circle is the polishing head The circle corresponding to the running track; connect the first center and the second center with a first straight line to obtain the first and second intersection points of the first straight line and the loading dock circle; wherein, the second center is the The center of the loading dock circle; determining that the position information of the first intersection is the first position information and the position information of the second intersection is the second position information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device can be based on the above-mentioned first calibration point. The calibration point, the second calibration point, the third calibration point, and the fourth calibration point perform high-accuracy calibration on the positions of the polishing head and the loading and unloading table.

在本發明的可選實施例中,所述第二獲取模組具體用於:獲取拋光頭軌跡圓的半徑、所述拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;根據所述拋光頭軌跡圓的半徑以及所述裝卸台圓的半徑確定第一角度的餘弦值,並根據所述餘弦值確定所述第一角度;其中所述第一角度為第一直線與第二直線的夾角,所述第一直線為所述第一圓心與第二圓心的連線,所述第二圓心為所述裝卸台圓的圓心,所述第二直線為所述第一圓心與所述第三校準點或者所述第四校準點的連線;根據所述第一角度、所述第一直線以及所述裝卸台圓確定所述第三位置資訊以及所述第四位置資訊。因此,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the second acquisition module is specifically configured to: acquire the radius of the polishing head trajectory circle, the first center of the polishing head trajectory circle, and the loading and unloading table circle; wherein, the The polishing head trajectory circle is the circle corresponding to the polishing head running trajectory; the cosine value of the first angle is determined according to the radius of the polishing head trajectory circle and the radius of the loading and unloading table circle, and the first angle is determined according to the cosine value. An angle; wherein the first angle is the angle between the first straight line and the second straight line, the first straight line is the line connecting the first circle center and the second circle center, and the second circle center is the center of the loading and unloading platform circle , The second straight line is the line connecting the first circle center and the third calibration point or the fourth calibration point; the first angle, the first straight line, and the loading platform circle are used to determine the The third location information and the fourth location information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device can be based on the above-mentioned first calibration point. The calibration point, the second calibration point, the third calibration point, and the fourth calibration point perform high-accuracy calibration on the positions of the polishing head and the loading and unloading table.

協力廠商面,本發明實施例提供一種校準系統,包括測量裝置以及第二方面中所述的校準裝置;所述測量裝置用於測量第一距離、第二距離、第三距離以及第四距離,所述校準裝置用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離對拋光頭的位置進行校準;其中,所述第一距離為第一校準點與預設拋光頭圓的圓弧距離,所述第二距離為第二校準點與所述預設拋光頭圓的圓弧距離,所述第三距離為第三校準點與所述預設拋光頭圓的最短距離,所述第四距離為第四校準點與所述預設拋光頭圓的最短距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓。因此,可以利用上述測量裝置測量第一距離、第二距離、第三距離以及第四距離,以使電子設備可以通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭與裝卸台的位置進行準確度高的校準。From a third-party perspective, an embodiment of the present invention provides a calibration system, including a measurement device and the calibration device described in the second aspect; the measurement device is used to measure the first distance, the second distance, the third distance, and the fourth distance, The calibration device is used to calibrate the position of the polishing head according to the first distance, the second distance, the third distance, and the fourth distance; wherein, the first distance is a first calibration point The arc distance from the preset polishing head circle, the second distance is the arc distance between the second calibration point and the preset polishing head circle, and the third distance is the third calibration point and the preset polishing The shortest distance of the head circle, the fourth distance is the shortest distance between the fourth calibration point and the preset polishing head circle; the first calibration point, the second calibration point, the third calibration point, and the The fourth calibration point is located on the loading and unloading table circle; the preset polishing head circle is a circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is a circle corresponding to the fixed position of the loading and unloading table. Therefore, the above-mentioned measuring device can be used to measure the first distance, the second distance, the third distance, and the fourth distance, so that the electronic device can make the first distance equal to the second distance, and the third distance equals to the fourth distance, The position of the polishing head and the loading and unloading table are calibrated with high accuracy.

在本發明的可選實施例中,所述測量裝置包括:固定件、第一測量件、第二測量件、第三測量件以及第四測量件;所述固定件的大小形狀與所述裝卸台圓的大小形狀相同;所述第一測量件設置在所述固定件上與所述裝卸台圓對應的第一位置處,所述第二測量件設置在所述固定件上與所述裝卸台圓對應的第二位置處,所述第三測量件設置在所述固定件上與所述裝卸台圓對應的第三位置處,所述第四測量件設置在所述固定件上與所述裝卸台圓對應的第四位置處;其中,所述第一位置為所述第一校準點的位置,所述第二位置為所述第二校準點的位置,所述第三位置為所述第三校準點的位置,所述第四位置為所述第四校準點的位置。因此,測量裝置上的第一測量件、第二測量件、第三測量件以及第四測量件分別設置在第一位置、第二位置、第三位置以及第四位置上,以使電子設備可以根據第一方面中的校準方法對拋光頭與裝卸台的位置進行準確度高的校準。In an optional embodiment of the present invention, the measuring device includes: a fixing piece, a first measuring piece, a second measuring piece, a third measuring piece, and a fourth measuring piece; the size and shape of the fixing piece and the mounting and dismounting The size and shape of the table circle are the same; the first measuring piece is arranged on the fixing piece at a first position corresponding to the loading and unloading table circle, and the second measuring piece is arranged on the fixing piece and the loading and unloading At the second position corresponding to the platform circle, the third measuring part is arranged on the fixing part at a third position corresponding to the loading and unloading platform circle, and the fourth measuring part is arranged on the fixing part and The fourth position corresponding to the loading and unloading platform circle; wherein, the first position is the position of the first calibration point, the second position is the position of the second calibration point, and the third position is the position of the The position of the third calibration point, the fourth position is the position of the fourth calibration point. Therefore, the first measuring piece, the second measuring piece, the third measuring piece, and the fourth measuring piece on the measuring device are respectively arranged at the first position, the second position, the third position, and the fourth position, so that the electronic device can According to the calibration method in the first aspect, the positions of the polishing head and the loading and unloading table are calibrated with high accuracy.

第四方面,本發明實施例提供一種電子設備,包括:處理器、記憶體和匯流排;所述處理器和所述記憶體通過所述匯流排完成相互間的通訊;所述記憶體儲存有可被所述處理器執行的程式指令,所述處理器調用所述程式指令能夠執行第一方面中的校準方法。In a fourth aspect, an embodiment of the present invention provides an electronic device, including: a processor, a memory, and a bus; the processor and the memory communicate with each other through the bus; the memory stores Program instructions that can be executed by the processor, and the processor invokes the program instructions to execute the calibration method in the first aspect.

第五方面,本發明實施例提供一種非暫態電腦可讀儲存媒體,所述非暫態電腦可讀儲存媒體儲存電腦指令,所述電腦指令使所述電腦執行第一方面中的校準方法。In a fifth aspect, an embodiment of the present invention provides a non-transitory computer-readable storage medium that stores computer instructions that cause the computer to execute the calibration method in the first aspect.

為使本發明的上述目的、特徵和優點能更明顯易懂,下文特舉本發明實施例,並配合所附圖式,作詳細說明如下。In order to make the above-mentioned objectives, features and advantages of the present invention more obvious and understandable, embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings, which are described in detail as follows.

下面將結合本發明實施例中圖式,對本發明實施例中的技術方案進行描述。The technical solutions in the embodiments of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention.

應注意到:相似的標號和字母在下面的圖式中表示類似項,因此,一旦某一項在一個圖式中被定義,則在隨後的圖式中不需要對其進行進一步定義和解釋。同時,在本發明的描述中,術語“第一”、“第二”等僅用於區分描述,而不能理解為指示或暗示相對重要性。It should be noted that similar numbers and letters indicate similar items in the following figures. Therefore, once a certain item is defined in a figure, there is no need to further define and explain it in the following figures. At the same time, in the description of the present invention, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

下面結合圖式,對本發明的一些實施方式作詳細說明。在不衝突的情況下,下述的實施例及實施例中的特徵可以相互組合。In the following, some embodiments of the present invention will be described in detail with reference to the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

請參照圖1,圖1為本發明實施例提供的一種校準方法的流程圖,該校準方法包括如下步驟: 步驟S101:獲取第一距離、第二距離、第三距離以及第四距離。 Please refer to FIG. 1. FIG. 1 is a flowchart of a calibration method provided by an embodiment of the present invention. The calibration method includes the following steps: Step S101: Obtain the first distance, the second distance, the third distance, and the fourth distance.

示例性的,在化學機械平坦化的過程中,為了保證晶圓完好無損,需要對化學機械平坦化設備中的拋光頭以及裝卸台的位置進行校準。其中,化學機械平坦化是積體電路製造中獲得全域平坦化的手段,利用化學機械平坦化能夠獲得平坦、無劃痕及雜質沾污的表面。化學機械平坦化設備包括拋光頭以及裝卸台:拋光頭是對待拋光晶圓進行拋光的工作;裝卸台是在拋光頭對晶圓進行拋光後,將拋光後的晶圓卸下的工具。化學機械平坦化設備的主要工作流程可簡述為:轉載機械手(Wafer Exchanger)將需要進行平坦化的晶圓傳遞到裝卸台上;然後拋光頭從裝卸台上取走晶圓並進行拋光流程;拋光完畢後,拋光頭將晶圓從裝卸台卸片,再由轉載機械手抓取晶圓進行清洗及甩乾流程。因此,如果拋光頭以及裝卸台的位置不符合標準,即拋光頭以及裝卸台不同軸,則會導致拋光頭取放片時間過長,且拋光頭與裝卸台中心若偏差過大,也會導致晶圓碎片的嚴重後果。Exemplarily, in the process of chemical mechanical planarization, in order to ensure that the wafer is intact, the positions of the polishing head and the loading and unloading table in the chemical mechanical planarization equipment need to be calibrated. Among them, chemical mechanical planarization is a means to achieve global planarization in integrated circuit manufacturing, and chemical mechanical planarization can be used to obtain a flat, scratch-free and contaminated surface. The chemical mechanical planarization equipment includes a polishing head and a loading and unloading table: the polishing head is the work of polishing the wafer to be polished; the loading and unloading table is a tool for unloading the polished wafer after the polishing head polishes the wafer. The main work flow of the chemical mechanical planarization equipment can be briefly described as follows: the transfer robot (Wafer Exchanger) transfers the wafer that needs to be planarized to the loading and unloading table; then the polishing head removes the wafer from the loading and unloading table and performs the polishing process ; After polishing, the polishing head unloads the wafer from the loading and unloading table, and then the transfer manipulator grabs the wafer for cleaning and spin-drying. Therefore, if the position of the polishing head and the loading and unloading table does not meet the standard, that is, the polishing head and the loading and unloading table are different axes, it will cause the polishing head to take and place the film too long, and if the center of the polishing head and the loading and unloading table are too different, it will also cause wafers. Serious consequences of fragmentation.

為了保證晶圓在平坦化的過程中不會受到損壞,需要保證拋光頭以及裝卸台同軸。作為一種實施方式,電子設備首先可以獲取第一距離、第二距離、第三距離以及第四距離。其中,第一距離為第一校準點與預設拋光頭圓的最短距離,第二距離為第二校準點與預設拋光頭圓的最短距離,第三距離為第三校準點與預設拋光頭圓的最小圓弧距離,第四距離為第四校準點與預設拋光頭圓的最小圓弧距離。In order to ensure that the wafer is not damaged during the planarization process, it is necessary to ensure that the polishing head and the loading and unloading table are coaxial. As an implementation manner, the electronic device may first obtain the first distance, the second distance, the third distance, and the fourth distance. Among them, the first distance is the shortest distance between the first calibration point and the preset polishing head circle, the second distance is the shortest distance between the second calibration point and the preset polishing head circle, and the third distance is the third calibration point and the preset polishing head. The minimum arc distance of the head circle, and the fourth distance is the minimum arc distance between the fourth calibration point and the preset polishing head circle.

請參照圖2,圖2為本發明實施例提供的拋光頭圓、裝卸台圓以及拋光頭軌跡圓的位置示意圖。預設拋光頭圓為拋光頭的起始位置對應的圓,裝卸台圓為裝卸台的固定位置對應的圓,拋光頭軌跡圓為拋光頭運動軌跡對應的圓。電子設備可以通過裝卸台圓以及預設拋光頭圓,將校準前的化學機械平坦化設備中的裝卸台以及拋光頭的位置以及大小記錄下來,以便後續根據記錄的位置以及大小對拋光頭的位置進行校準。其中,裝卸台圓以及拋光頭圓的位置固定,且裝卸台圓的圓心位置以及半徑均與實際化學機械平坦化設備中的裝卸台對應,即裝卸台圓的圓心位置以及半徑均為固定已知。拋光頭圓由於是與實際化學機械平坦化設備中的拋光頭對應,因此其半徑也是固定已知的,而拋光頭圓的位置為本發明校準方法校準的物件,校準目的為該拋光頭圓與上述裝卸台圓圓心重合。拋光頭軌跡圓是拋光頭在實際運行過程中運動軌跡對應的圓,其半徑以及圓心也是固定已知的。Please refer to FIG. 2, which is a schematic diagram of the positions of the polishing head circle, the loading and unloading table circle, and the polishing head track circle provided by an embodiment of the present invention. The preset polishing head circle is the circle corresponding to the starting position of the polishing head, the loading and unloading table circle is the circle corresponding to the fixed position of the loading and unloading table, and the polishing head trajectory circle is the circle corresponding to the movement trajectory of the polishing head. Electronic equipment can record the position and size of the loading and unloading table and polishing head in the chemical mechanical planarization equipment before calibration through the loading and unloading table circle and preset polishing head circle, so that the position and size of the polishing head can be adjusted according to the recorded position and size. Perform calibration. Among them, the positions of the loading and unloading table circle and the polishing head circle are fixed, and the center position and radius of the loading and unloading table circle correspond to the loading and unloading table in the actual chemical mechanical planarization equipment, that is, the center position and radius of the loading and unloading table circle are fixed and known. . Since the polishing head circle corresponds to the polishing head in the actual chemical mechanical planarization equipment, its radius is also fixed and known. The position of the polishing head circle is the object calibrated by the calibration method of the present invention. The centers of the circles of the above loading and unloading platforms coincide. The trajectory circle of the polishing head is the circle corresponding to the movement trajectory of the polishing head during actual operation, and its radius and center are also fixed and known.

作為一種實施方式,圖2中的ABCD四點分別為第一校準點、第二校準點、第三校準點以及第四校準點,且均位於裝卸台圓上。其中,第一校準點A、第二校準點B、第三校準點C以及第四校準點D的確定方式將在後續實施例中進行說明。在該實施方式中,第一距離為圖2中AA’線段的距離,即第一校準點A與預設拋光頭圓的最短距離;第二距離為圖2中BB’線段的距離,即第二校準點B與預設拋光頭圓的最短距離;第三距離為圖2中CC’圓弧的距離,即第三校準點C與預設拋光頭圓的最小圓弧距離;第四距離為圖2中DD’圓弧的距離,即第四校準點D與預設拋光頭圓的最小圓弧距離。As an implementation manner, the four points ABCD in FIG. 2 are respectively the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point, and they are all located on the circle of the loading and unloading platform. The methods for determining the first calibration point A, the second calibration point B, the third calibration point C, and the fourth calibration point D will be described in subsequent embodiments. In this embodiment, the first distance is the distance of the line segment AA' in FIG. 2, that is, the shortest distance between the first calibration point A and the preset polishing head circle; the second distance is the distance of the line segment BB' in FIG. The shortest distance between the second calibration point B and the preset polishing head circle; the third distance is the distance of the CC' arc in Figure 2, that is, the minimum arc distance between the third calibration point C and the preset polishing head circle; the fourth distance is The arc distance of DD' in Fig. 2 is the minimum arc distance between the fourth calibration point D and the preset polishing head circle.

需要說明的是,電子設備獲取第一距離、第二距離、第三距離以及第四距離的方式有多種,本發明實施例不作具體的限定。例如:電子設備接收操作人員輸入的資料;或者,電子設備從伺服器中讀取預先儲存的資料;或者,電子設備自身對第一距離、第二距離、第三距離以及第四距離的資料進行測量等。It should be noted that there are multiple ways for the electronic device to obtain the first distance, the second distance, the third distance, and the fourth distance, which are not specifically limited in the embodiment of the present invention. For example: the electronic device receives the data input by the operator; or, the electronic device reads the pre-stored data from the server; or, the electronic device itself performs data on the first distance, the second distance, the third distance, and the fourth distance. Measurement etc.

步驟S102:根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等。Step S102: Calibrate the preset polishing head circle to the target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is the same as the target polishing head circle. The second distance is equal, and the third distance is equal to the fourth distance.

示例性的,在步驟S102中獲取了第一距離、第二距離、第三距離以及第四距離後,電子設備可以根據第一距離、第二距離、第三距離以及第四距離對拋光頭圓進行校準,以使校準前的預設拋光頭圓變為校準後的目標拋光頭圓。然後,可以控制實際化學機械平坦化設備中的拋光頭移動至目標拋光頭圓的位置,此時,拋光頭與裝卸台圓同軸。需要說明的是,控制拋光頭移動的可以為上述電子設備,也可以為上述電子設備將校準後的目標拋光頭圓的位置發送給其他設備,由其他設備對拋光頭的移動進行控制,本領域技術人員可以根據實際情況進行選擇。Exemplarily, after the first distance, the second distance, the third distance, and the fourth distance are acquired in step S102, the electronic device can perform the rounding of the polishing head according to the first distance, the second distance, the third distance, and the fourth distance. Perform calibration so that the preset polishing head circle before calibration becomes the target polishing head circle after calibration. Then, the polishing head in the actual chemical mechanical planarization equipment can be controlled to move to the position of the target polishing head circle. At this time, the polishing head and the loading and unloading table circle are coaxial. It should be noted that the electronic device that controls the movement of the polishing head can also be the aforementioned electronic device that sends the calibrated position of the target polishing head circle to other equipment, and the other equipment controls the movement of the polishing head. Technicians can choose according to the actual situation.

作為一種實施方式,電子設備可以使第一距離與第二距離相等,以及第三距離與第四距離相等,以達到使裝卸台圓以及拋光頭圓的圓心重合的目的。As an implementation manner, the electronic device can make the first distance and the second distance equal, and the third distance and the fourth distance equal, so as to achieve the purpose of making the centers of the loading and unloading table circle and the polishing head circle coincide.

舉例來說,校準過程如下:請參照圖3a,圖3a為本發明實施例提供的拋光頭圓在CD方向上校準前的示意圖,此時,第三距離CC’與第四距離DD’不相等;請參照圖3b,圖3b為本發明實施例提供的拋光頭圓在CD方向上校準後的示意圖,此時,第三距離CC’與第四距離DD’相等。因此,可以首先在弧CD方向(Head Rotation 方向)上校準拋光頭圓的角度位置。請參照圖4a,圖4a為本發明實施例提供的拋光頭圓在AB方向上校準前的示意圖,此時,第一距離AA’與第二距離BB’不相等;請參照圖4b,圖4b為本發明實施例提供的拋光頭圓在AB方向上校準後的示意圖,此時,第一距離AA’與第二距離BB’相等。因此,可以隨後在直線AB方向(Head Sweep方向)上校準拋光頭圓的直線位置。經過CD方向以及AB方向上的校準後,校準後的裝卸台圓與拋光頭圓圓心重合。For example, the calibration process is as follows: please refer to Figure 3a, Figure 3a is a schematic diagram of the polishing head circle provided by an embodiment of the present invention before calibration in the CD direction. At this time, the third distance CC' and the fourth distance DD' are not equal ; Please refer to Figure 3b, Figure 3b is a schematic diagram of the polishing head circle provided by the embodiment of the present invention after calibration in the CD direction, at this time, the third distance CC' and the fourth distance DD' are equal. Therefore, you can first calibrate the angular position of the polishing head circle in the arc CD direction (Head Rotation direction). Please refer to Figure 4a, Figure 4a is a schematic diagram of the polishing head circle provided by an embodiment of the present invention before being calibrated in the AB direction. At this time, the first distance AA' and the second distance BB' are not equal; please refer to Figure 4b, Figure 4b This is a schematic diagram of the polishing head circle calibrated in the AB direction according to an embodiment of the present invention. At this time, the first distance AA′ is equal to the second distance BB′. Therefore, the linear position of the polishing head circle can then be calibrated in the straight line AB direction (Head Sweep direction). After calibration in the CD direction and AB direction, the center of the calibrated loading and unloading table circle coincides with the center of the polishing head circle.

需要說明的是,上述校準過程僅為本發明實施例提供的一種方案,還可以先校準AB方向再校準CD方向,本領域技術人員可以根據實際情況進行選擇。It should be noted that the above calibration process is only a solution provided by the embodiment of the present invention, and the AB direction can be calibrated first and then the CD direction can be calibrated, and those skilled in the art can make a selection according to the actual situation.

在本發明實施例中,通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭圓進行校準,以使拋光頭圓對應的拋光頭與裝卸台圓對應的裝卸台同軸度一致。採用上述方法對拋光頭與裝卸台的位置進行校準,方便快捷,且誤差小、準確度高。In the embodiment of the present invention, the polishing head circle is calibrated by making the first distance equal to the second distance, and the third distance equals to the fourth distance, so that the polishing head corresponding to the polishing head circle corresponds to that of the loading and unloading table circle. The coaxiality of the loading and unloading platform is consistent. The above method is adopted to calibrate the positions of the polishing head and the loading and unloading table, which is convenient and quick, with small errors and high accuracy.

進一步的,請參照圖5,圖5為本發明實施例提供的另一種校準方法的流程圖,在步驟S101之前,上述校準方法還包括如下步驟: 步驟S501:獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊。 Further, please refer to FIG. 5, which is a flowchart of another calibration method provided by an embodiment of the present invention. Before step S101, the above-mentioned calibration method further includes the following steps: Step S501: Obtain the first position information of the first calibration point, the second position information of the second calibration point, the third position information of the third calibration point, and the fourth position of the fourth calibration point News.

步驟S502:根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。Step S502: mark the first calibration point on the loading and unloading platform circle according to the first position information, mark the second calibration point on the loading and unloading platform circle according to the second position information, and The third position information marks the third calibration point on the loading and unloading platform circle, and the fourth calibration point is marked on the loading and unloading platform circle according to the fourth position information.

示例性的,在對拋光頭圓以及裝卸台圓的位置進行校準前,電子設備首先可以獲取第一校準點的第一位置資訊、第二校準點的第二位置資訊、第三校準點的第三位置資訊以及第四校準點的第四位置資訊,並根據獲取到的第一位置資訊、第二位置資訊、第三位置資訊以及第四位置資訊將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台圓上,以便後續根據第一校準點、第二校準點、第三校準點以及第四校準點的位置確定第一距離、第二距離、第三距離以及第四距離。Exemplarily, before calibrating the positions of the polishing head circle and the loading and unloading table circle, the electronic device can first obtain the first position information of the first calibration point, the second position information of the second calibration point, and the second position information of the third calibration point. The third position information and the fourth position information of the fourth calibration point, and according to the acquired first position information, second position information, third position information, and fourth position information, the first calibration point, the second calibration point, and the fourth position information The three calibration points and the fourth calibration point are marked on the circle of the loading and unloading platform, so as to determine the first distance, the second distance, and the third distance according to the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point. Distance and fourth distance.

作為一種實施方式,電子設備在獲取了第一位置資訊、第二位置資訊、第三位置資訊以及第四位置資訊之後,可以根據第一位置資訊、第二位置資訊、第三位置資訊、第四位置資訊以及裝卸台圓的位置,將第一校準點、第二校準點、第三校準點以及第四校準點標註在實際化學機械平坦化設備中的裝卸台上。即,在每台化學機械平坦化設備出廠之前,其裝卸台上都標註第一校準點、第二校準點、第三校準點以及第四校準點四點,從而方便出現偏差時對拋光頭進行快速精確的校準。As an implementation manner, after acquiring the first location information, the second location information, the third location information, and the fourth location information, the electronic device can use the first location information, the second location information, the third location information, and the fourth location information according to the Position information and the position of the loading and unloading platform circle, mark the first calibration point, the second calibration point, the third calibration point and the fourth calibration point on the loading and unloading platform in the actual chemical mechanical planarization equipment. That is, before each chemical mechanical planarization equipment leaves the factory, its loading and unloading platform is marked with four points: the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point, so as to facilitate the polishing head when there is a deviation. Fast and accurate calibration.

需要說明的是,電子設備獲取第一校準點的第一位置資訊、第二校準點的第二位置資訊、第三校準點的第三位置資訊以及第四校準點的第四位置資訊的方式有多種,本發明實施例不作具體的限定。例如:電子設備接收操作人員輸入的資料;或者,電子設備從伺服器中讀取預先儲存的資料;或者,電子設備自身根據第一校準點、第二校準點、第三校準點以及第四校準點的位置得出位置資料等。It should be noted that the electronic device obtains the first position information of the first calibration point, the second position information of the second calibration point, the third position information of the third calibration point, and the fourth position information of the fourth calibration point. There are many types, and the embodiments of the present invention do not make specific limitations. For example: the electronic device receives the data input by the operator; or the electronic device reads the pre-stored data from the server; or the electronic device itself according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point. The punctual position can be used to obtain location information and so on.

在本發明實施例中,首先將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台圓上,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, first, the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are marked on the loading and unloading platform circle, so that the electronic device can be based on the above-mentioned first calibration point and second calibration point. The punctuality, the third calibration point and the fourth calibration point perform highly accurate calibration of the positions of the polishing head and the loading and unloading table.

進一步的,請參照圖6,圖6為本發明實施例提供的另一種校準方法的流程圖,步驟S401包括如下步驟: 步驟S601:獲取拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓。 Further, please refer to FIG. 6, which is a flowchart of another calibration method provided by an embodiment of the present invention. Step S401 includes the following steps: Step S601: Obtain the first center of the polishing head trajectory circle and the loading and unloading table circle; wherein the polishing head trajectory circle is a circle corresponding to the polishing head running trajectory.

示例性的,請參照圖2,如圖2所示,拋光頭軌跡圓為拋光頭運動軌跡對應的圓,其半徑以及圓心是固定已知的。在確定第一校準點以及第二校準點的過程中,電子設備首先可以獲取拋光頭軌跡圓的第一圓心以及裝卸台圓的第二圓心及圓周,以使後續可以利用拋光頭軌跡圓的第一圓心以及裝卸台圓的第二圓心及圓周確定第一校準點以及第二校準點。Exemplarily, please refer to FIG. 2. As shown in FIG. 2, the polishing head trajectory circle is a circle corresponding to the movement trajectory of the polishing head, and its radius and center are fixed and known. In the process of determining the first calibration point and the second calibration point, the electronic device can first obtain the first center of the polishing head trajectory circle and the second center and circumference of the loading and unloading table circle, so that the second center of the polishing head trajectory circle can be used later. A center and the second center and circumference of the loading and unloading platform circle determine the first calibration point and the second calibration point.

需要說明的是,電子設備獲取拋光頭軌跡圓的第一圓心以及裝卸台圓的方式有多種,本發明實施例不作具體的限定。例如:電子設備接收操作人員輸入的資料;或者,電子設備從伺服器中讀取預先儲存的資料等。It should be noted that there are many ways for the electronic device to obtain the first center of the polishing head trajectory circle and the loading and unloading table circle, which are not specifically limited in the embodiment of the present invention. For example: the electronic device receives the data input by the operator; or the electronic device reads the pre-stored data from the server, etc.

步驟S602:利用第一直線連接所述第一圓心與第二圓心,得到所述第一直線與所述裝卸台圓的第一交點以及第二交點。Step S602: Use a first straight line to connect the first circle center and the second circle center to obtain a first intersection point and a second intersection point of the first straight line and the loading dock circle.

示例性的,請參照圖7,圖7為本發明實施例提供的確定ABCD校準點的示意圖。如圖7所示,第一校準點A以及第二校準點B分別為第一直線AB與裝卸台圓的兩個交點。其中,第一直線AB為拋光頭軌跡圓的第一圓心以及裝卸台圓的第二圓心的連線。因此,電子設備可以利用第一直線連接第一圓心與第二圓心,從而可以得到第一直線與裝卸台圓的第一交點以及第二交點。Exemplarily, please refer to FIG. 7, which is a schematic diagram of determining ABCD calibration points according to an embodiment of the present invention. As shown in Fig. 7, the first calibration point A and the second calibration point B are the two intersection points of the first straight line AB and the circle of the loading and unloading table respectively. Wherein, the first straight line AB is the line connecting the first center of the polishing head track circle and the second center of the loading and unloading table circle. Therefore, the electronic device can use the first straight line to connect the first circle center and the second circle center, so that the first intersection point and the second intersection point of the first straight line and the docking station circle can be obtained.

步驟S603:確定所述第一交點的位置資訊為所述第一位置資訊以及第二交點的位置資訊為所述第二位置資訊。Step S603: Determine that the location information of the first intersection is the first location information and the location information of the second intersection is the second location information.

示例性的,如步驟S602中所述,第一直線與裝卸台圓的第一交點以及第二交點分別為第一校準點以及第二校準點,因此,電子設備可以將第一交點的位置資訊確定為第一校準點的第一位置資訊以及將第二交點的位置資訊確定為第二校準點的第二位置資訊。Exemplarily, as described in step S602, the first intersection point and the second intersection point of the first straight line and the dock circle are the first calibration point and the second calibration point, respectively. Therefore, the electronic device can determine the position information of the first intersection point Is the first position information of the first calibration point and the position information of the second intersection is determined as the second position information of the second calibration point.

需要說明的是,在確定了一台化學機械平坦化設備上裝卸台上的第一校準點、第二校準點、第三校準點以及第四校準點四個點後,則可根據互換性,實現校正大批量的設備中拋光頭與裝卸台的同軸度一致。It should be noted that after determining the four points of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point on the loading and unloading platform of a chemical mechanical flattening equipment, according to the interchangeability, The coaxiality of the polishing head and the loading and unloading table in the large-scale equipment can be corrected.

在本發明實施例中,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device The positions of the polishing head and the loading and unloading table can be calibrated with high accuracy according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.

進一步的,請參照圖8,圖8為本發明實施例提供的另一種校準方法的流程圖,步驟S401還包括如下步驟: 步驟S801:獲取拋光頭軌跡圓的半徑、所述拋光頭軌跡圓的第一圓心以及所述裝卸台圓。 Further, please refer to FIG. 8. FIG. 8 is a flowchart of another calibration method provided by an embodiment of the present invention. Step S401 further includes the following steps: Step S801: Obtain the radius of the polishing head trajectory circle, the first center of the polishing head trajectory circle, and the loading and unloading table circle.

示例性的,請參照圖2,如圖2所示,拋光頭軌跡圓為拋光頭運動軌跡對應的圓,其半徑以及圓心是固定已知的。在確定第三校準點以及第四校準點的過程中,電子設備首先可以獲取拋光頭軌跡圓的半徑及第一圓心以及裝卸台圓的第二圓心及圓周,以使後續可以利用拋光頭軌跡圓的半徑以及裝卸台圓的第二圓心及圓周確定第三校準點以及第四校準點。Exemplarily, please refer to FIG. 2. As shown in FIG. 2, the polishing head trajectory circle is a circle corresponding to the movement trajectory of the polishing head, and its radius and center are fixed and known. In the process of determining the third calibration point and the fourth calibration point, the electronic device can first obtain the radius and first center of the polishing head trajectory circle, and the second center and circumference of the loading and unloading table circle, so that the polishing head trajectory circle can be used later. The radius of and the second center and circumference of the loading platform circle determine the third calibration point and the fourth calibration point.

需要說明的是,電子設備獲取拋光頭軌跡圓的半徑、拋光頭軌跡圓的第一圓心以及裝卸台圓的方式有多種,本發明實施例不作具體的限定。例如:電子設備接收操作人員輸入的資料;或者,電子設備從伺服器中讀取預先儲存的資料等。It should be noted that there are many ways for the electronic device to obtain the radius of the polishing head trajectory circle, the first center of the polishing head trajectory circle, and the loading and unloading table circle, which are not specifically limited in the embodiment of the present invention. For example: the electronic device receives the data input by the operator; or the electronic device reads the pre-stored data from the server, etc.

步驟S802:根據所述拋光頭軌跡圓的半徑以及所述裝卸台圓的半徑確定第一角度的餘弦值,並根據所述餘弦值確定所述第一角度。Step S802: Determine the cosine value of the first angle according to the radius of the polishing head track circle and the radius of the loading and unloading table circle, and determine the first angle according to the cosine value.

示例性的,請參照圖7,如圖7所示,拋光頭軌跡圓的半徑EO和EC以及裝卸台圓的半徑OE和OC均為已知,且第三校準點C以及第四校準點D分別為裝卸台圓與拋光頭軌跡圓的交點。但是,由於實際化學機械平坦化設備中,拋光頭軌跡圓的圓心處設置有一個圓柱體,無法確定圓心E具體的位置,因此,僅僅根據EC的長度無法確定實際化學機械平坦化設備中裝卸台上第三校準點C的具體的位置。基於上述原因,採用下述方法確定第三校準點C的具體位置:Exemplarily, please refer to FIG. 7. As shown in FIG. 7, the radii EO and EC of the polishing head track circle and the radii OE and OC of the loading and unloading table circle are known, and the third calibration point C and the fourth calibration point D They are the intersection points of the loading and unloading table circle and the polishing head trajectory circle. However, in the actual chemical mechanical planarization equipment, a cylinder is set at the center of the polishing head track circle, and the specific location of the center E cannot be determined. Therefore, the actual chemical mechanical planarization equipment cannot be determined based on the length of the EC. The specific position of the upper third calibration point C. Based on the above reasons, the following method is used to determine the specific location of the third calibration point C:

請參照圖7,圖7中的第一角度

Figure 02_image001
為第一直線OE與第二直線OC的夾角,其中,第一直線OE為拋光頭軌跡圓的第一圓心E與裝卸台圓的第二圓心O的連線,第二直線OC為拋光頭軌跡圓的第一圓心E與所述第三校準點C的連線。則,第一角度
Figure 02_image001
的餘弦值為:
Figure 02_image003
其中,
Figure 02_image005
為第一角度
Figure 02_image001
的餘弦值,
Figure 02_image007
為第一直線OE的長度,
Figure 02_image009
為第二直線OC的長度。 Please refer to Figure 7, the first angle in Figure 7
Figure 02_image001
Is the angle between the first straight line OE and the second straight line OC, where the first straight line OE is the connection line between the first center E of the polishing head track circle and the second center O of the loading and unloading table circle, and the second straight line OC is the line of the polishing head track circle The connection line between the first circle center E and the third calibration point C. Then, the first angle
Figure 02_image001
The cosine of is:
Figure 02_image003
among them,
Figure 02_image005
For the first angle
Figure 02_image001
The cosine of
Figure 02_image007
Is the length of the first straight line OE,
Figure 02_image009
Is the length of the second straight line OC.

在確定了第一角度

Figure 02_image001
的餘弦值後,可以根據第一角度
Figure 02_image001
的餘弦值確定第一角度
Figure 02_image001
為:
Figure 02_image011
其中,
Figure 02_image013
為第一角度
Figure 02_image001
的餘弦值,
Figure 02_image001
為第一角度的值。 After confirming the first angle
Figure 02_image001
After the cosine value of, can be based on the first angle
Figure 02_image001
The cosine of determines the first angle
Figure 02_image001
for:
Figure 02_image011
among them,
Figure 02_image013
For the first angle
Figure 02_image001
The cosine of
Figure 02_image001
Is the value of the first angle.

步驟S803:根據所述第一角度、所述第一直線以及所述裝卸台圓確定所述第三位置資訊以及所述第四位置資訊。Step S803: Determine the third position information and the fourth position information according to the first angle, the first straight line, and the dock circle.

示例性的,在步驟S802中確定了第一角度

Figure 02_image001
的值後,可以根據第一直線OE的位置以及第一角度
Figure 02_image001
的值確定裝卸台圓上第三校準點的第三位置資訊。需要說明的是,確定第四校準點的第四位置資訊的方式與上述確定第三校準點的第三位置資訊的方式相同,此處不再贅述。 Exemplarily, the first angle is determined in step S802
Figure 02_image001
After the value of OE, it can be based on the position of the first straight line OE and the first angle
Figure 02_image001
The value of determines the third position information of the third calibration point on the dock circle. It should be noted that the method for determining the fourth position information of the fourth calibration point is the same as the above method for determining the third position information of the third calibration point, and will not be repeated here.

因此,通過上述方式確定的第三校準點以及第四校準點,可以根據第一校準點A的位置以及第一角度

Figure 02_image001
的值,將第三校準點C以及第四校準點D標註在實際化學機械平坦化設備中裝卸台上,從而方便出現偏差時對拋光頭進行快速精確的校準。 Therefore, the third calibration point and the fourth calibration point determined by the above method can be determined according to the position of the first calibration point A and the first angle
Figure 02_image001
The third calibration point C and the fourth calibration point D are marked on the loading and unloading table in the actual chemical mechanical planarization equipment, so as to facilitate quick and accurate calibration of the polishing head when deviations occur.

在本發明實施例中,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device The positions of the polishing head and the loading and unloading table can be calibrated with high accuracy according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.

請參照圖9,圖9為本發明實施例提供的一種校準裝置的結構框圖,該校準裝置90,包括:第一獲取模組901,用於獲取第一距離、第二距離、第三距離以及第四距離;其中,所述第一距離為第一校準點與預設拋光頭圓的圓弧距離,所述第二距離為第二校準點與所述預設拋光頭圓的圓弧距離,所述第三距離為第三校準點與所述預設拋光頭圓的最短距離,所述第四距離為第四校準點與所述預設拋光頭圓的最短距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓;校準模組902,用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等;其中,所述目標拋光頭圓為所述拋光頭的目標位置對應的圓。Please refer to FIG. 9, which is a structural block diagram of a calibration device provided by an embodiment of the present invention. The calibration device 90 includes a first acquisition module 901 for acquiring a first distance, a second distance, and a third distance. And a fourth distance; wherein the first distance is the arc distance between the first calibration point and the preset polishing head circle, and the second distance is the arc distance between the second calibration point and the preset polishing head circle , The third distance is the shortest distance between the third calibration point and the preset polishing head circle, and the fourth distance is the shortest distance between the fourth calibration point and the preset polishing head circle; the first calibration The punctuality, the second calibration point, the third calibration point, and the fourth calibration point are located on the loading and unloading table circle; the preset polishing head circle is the circle corresponding to the starting position of the polishing head, and the loading and unloading table The circle is the circle corresponding to the fixed position of the loading and unloading table; the calibration module 902 is used to calibrate the preset polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance To the target polishing head circle, so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; wherein the target polishing head circle is the target of the polishing head The circle corresponding to the position.

在本發明實施例中,校準模組902通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭圓進行校準,以使拋光頭圓對應的拋光頭與裝卸台圓對應的裝卸台同軸度一致。採用上述方法對拋光頭與裝卸台的位置進行校準,方便快捷,且誤差小、準確度高。In the embodiment of the present invention, the calibration module 902 calibrates the polishing head circle by making the first distance equal to the second distance, and the third distance equals to the fourth distance, so that the polishing head corresponding to the polishing head circle can be assembled and disassembled. The coaxiality of the loading and unloading platform corresponding to the Taiwan circle is the same. The above method is adopted to calibrate the positions of the polishing head and the loading and unloading table, which is convenient and quick, with small errors and high accuracy.

進一步的,所述校準裝置90還包括:第二獲取模組,用於獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊;標註模組,用於根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。Further, the calibration device 90 further includes: a second acquisition module for acquiring the first position information of the first calibration point, the second position information of the second calibration point, and the third calibration point The third position information of the fourth calibration point and the fourth position information of the fourth calibration point; a marking module for marking the first calibration point on the loading and unloading platform circle according to the first position information, according to the The second position information marks the second calibration point on the loading and unloading platform circle, and the third calibration point is marked on the loading and unloading platform circle according to the third position information, and according to the fourth position information Mark the fourth calibration point on the circle of the loading and unloading platform.

在本發明實施例中,首先標註模組將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台圓上,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the marking module first marks the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point on the loading and unloading platform circle, so that the electronic device can be based on the above-mentioned first calibration point, The second calibration point, the third calibration point and the fourth calibration point calibrate the positions of the polishing head and the loading and unloading table with high accuracy.

進一步的,所述第二獲取模組具體用於:獲取拋光頭軌跡圓的第一圓心、所述拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;利用第一直線連接所述第一圓心與第二圓心,得到所述第一直線與所述裝卸台圓的第一交點以及第二交點;其中,所述第二圓心為所述裝卸台圓的圓心;確定所述第一交點的位置資訊為所述第一位置資訊以及第二交點的位置資訊為所述第二位置資訊。Further, the second acquisition module is specifically configured to: acquire the first center of the polishing head trajectory circle, the first center of the polishing head trajectory circle, and the loading and unloading table circle; wherein the polishing head trajectory circle is The circle corresponding to the running track of the polishing head; connect the first center and the second center by a first straight line to obtain the first and second intersection points of the first straight line and the loading and unloading table circle; wherein, the second The center of the circle is the center of the loading dock circle; it is determined that the position information of the first intersection is the first position information and the position information of the second intersection is the second position information.

在本發明實施例中,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device The positions of the polishing head and the loading and unloading table can be calibrated with high accuracy according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.

進一步的,所述第二獲取模組具體用於:獲取拋光頭軌跡圓的半徑以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓;根據所述拋光頭軌跡圓的半徑以及所述裝卸台圓的半徑確定第一角度的餘弦值,並根據所述餘弦值確定所述第一角度;其中所述第一角度為第一直線與第二直線的夾角,所述第一直線為所述第一圓心與第二圓心的連線,所述第二圓心為所述裝卸台圓的圓心,所述第二直線為所述第一圓心與所述第三校準點或者所述第四校準點的連線;根據所述第一角度、所述第一直線以及所述裝卸台圓確定所述第三位置資訊以及所述第四位置資訊。Further, the second acquisition module is specifically configured to: acquire the radius of the polishing head trajectory circle and the loading and unloading table circle; wherein the polishing head trajectory circle is a circle corresponding to the polishing head running trajectory; The radius of the polishing head track circle and the radius of the loading and unloading table circle determine the cosine value of the first angle, and the first angle is determined according to the cosine value; wherein the first angle is the angle between the first straight line and the second straight line , The first straight line is the line connecting the first circle center and the second circle center, the second circle center is the center of the loading and unloading platform circle, and the second straight line is the first circle center and the third calibration line. Punctual point or the connection of the fourth calibration point; the third position information and the fourth position information are determined according to the first angle, the first straight line, and the dock circle.

在本發明實施例中,根據拋光頭軌跡圓、拋光頭圓以及裝卸台圓的位置關係確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,以使電子設備可以根據上述第一校準點、第二校準點、第三校準點以及第四校準點對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship of the polishing head trajectory circle, the polishing head circle, and the loading and unloading table circle, so that the electronic device The positions of the polishing head and the loading and unloading table can be calibrated with high accuracy according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.

本發明實施例還提供一種校準系統,包括測量裝置以及上述校準裝置90;所述測量裝置用於測量第一距離、第二距離、第三距離以及第四距離,所述校準裝置90用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離對拋光頭的位置進行校準;其中,所述第一距離為第一校準點與預設拋光頭圓的圓弧距離,所述第二距離為第二校準點與所述預設拋光頭圓的圓弧距離,所述第三距離為第三校準點與所述預設拋光頭圓的最短距離,所述第四距離為第四校準點與所述預設拋光頭圓的最短距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓。An embodiment of the present invention also provides a calibration system, including a measuring device and the above-mentioned calibration device 90; the measuring device is used for measuring the first distance, the second distance, the third distance, and the fourth distance, and the calibration device 90 is used for measuring according to The first distance, the second distance, the third distance, and the fourth distance are used to calibrate the position of the polishing head; wherein the first distance is the distance between the first calibration point and the preset polishing head circle The arc distance, the second distance is the arc distance between the second calibration point and the preset polishing head circle, and the third distance is the shortest distance between the third calibration point and the preset polishing head circle, so The fourth distance is the shortest distance between the fourth calibration point and the preset polishing head circle; the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are located in loading and unloading On the table circle; the preset polishing head circle is a circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is a circle corresponding to the fixed position of the loading and unloading table.

進一步的,請參照圖10,圖10為本發明實施例提供的一種測量裝置的結構示意圖,所述測量裝置包括:固定件、第一測量件、第二測量件、第三測量件以及第四測量件;所述固定件的大小形狀與所述裝卸台圓的大小形狀相同;所述第一測量件設置在所述固定件上與所述裝卸台圓對應的第一位置處,所述第二測量件設置在所述固定件上與所述裝卸台圓對應的第二位置處,所述第三測量件設置在所述固定件上與所述裝卸台圓對應的第三位置處,所述第四測量件設置在所述固定件上與所述裝卸台圓對應的第四位置處;其中,所述第一位置為所述第一校準點的位置,所述第二位置為所述第二校準點的位置,所述第三位置為所述第三校準點的位置,所述第四位置為所述第四校準點的位置。Further, please refer to FIG. 10, which is a schematic structural diagram of a measuring device provided by an embodiment of the present invention. The measuring device includes: a fixing piece, a first measuring piece, a second measuring piece, a third measuring piece, and a fourth measuring piece. Measuring piece; the size and shape of the fixing piece is the same as the size and shape of the loading and unloading platform circle; the first measuring piece is arranged on the fixing piece at a first position corresponding to the loading and unloading platform circle, the first Two measuring pieces are arranged on the fixing piece at a second position corresponding to the loading and unloading platform circle, and the third measuring piece is arranged on the fixing piece at a third position corresponding to the loading and unloading platform circle, so The fourth measuring part is set on the fixing part at a fourth position corresponding to the loading and unloading platform circle; wherein, the first position is the position of the first calibration point, and the second position is the The position of the second calibration point, the third position is the position of the third calibration point, and the fourth position is the position of the fourth calibration point.

示例性的,為了實現上述實施例中的校準方法,可以利用本發明實施例提供的校準系統。其中,校準系統包括測量裝置以及校準裝置90。Exemplarily, in order to implement the calibration method in the foregoing embodiment, the calibration system provided in the embodiment of the present invention may be used. Among them, the calibration system includes a measuring device and a calibration device 90.

作為一種實施方式,如圖10所示,測量裝置包括一個固定件,該固定件的形狀大小均與裝卸台圓的形狀大小相同,以使測量裝置可以固定在裝卸台圓上。請參照圖11,圖11為本發明實施例提供的測量裝置與裝卸台的安裝示意圖,測量裝置中的固定件可以卡在裝卸台上。測量裝置還包括多個測量件,如圖10所示,該測量裝置包括四個測量件,分別設置在固定件上與裝卸台圓對應的第一校準點、第二校準點、第三校準點以及第四校準點處。其中,多個測量件可以為圓柱形旋入測量尺以及弧形角度測量尺,圓柱形旋入測量尺的圓柱上刻有直線刻度,測量單位mm,弧形角度測量尺上刻有角度刻度,測量單位為°。舉例來說,位於第一位置處的第一測量件以及位於第二位置處的第二測量件可以為圓柱形旋入測量尺,位於第三位置處的第三測量件以及位於第四位置處的第四測量件可以為弧形角度測量尺。As an embodiment, as shown in FIG. 10, the measuring device includes a fixing member whose shape and size are the same as the shape and size of the loading and unloading platform circle, so that the measuring device can be fixed on the loading and unloading platform circle. Please refer to FIG. 11, which is a schematic diagram of the installation of the measuring device and the loading and unloading platform according to an embodiment of the present invention. The fixing part of the measuring device can be stuck on the loading and unloading platform. The measuring device also includes a plurality of measuring pieces. As shown in FIG. 10, the measuring device includes four measuring pieces, which are respectively arranged on the fixing piece and the first calibration point, the second calibration point, and the third calibration point corresponding to the circle of the loading and unloading platform. And at the fourth calibration point. Among them, multiple measuring pieces can be a cylindrical screw-in measuring ruler and an arc-shaped angle measuring ruler. The cylinder of the cylindrical screw-in measuring ruler is engraved with a linear scale, the unit of measurement is mm, and the arc angle measuring ruler is engraved with an angle scale. The unit of measurement is °. For example, the first measuring piece located at the first position and the second measuring piece located at the second position may be cylindrical screw-in measuring rulers, the third measuring piece located at the third position and the second measuring piece located at the fourth position The fourth measuring piece can be an arc-shaped angle measuring ruler.

作為一種實施方式,使用上述校準系統對拋光頭以及裝卸台的位置進行校準的步驟如下: 第一步,校準裝置確定第一校準點、第二校準點、第三校準點以及第四校準點的位置,並將第一校準點、第二校準點、第三校準點以及第四校準點標註在裝卸台上。 As an implementation manner, the steps for calibrating the positions of the polishing head and the loading and unloading table using the above calibration system are as follows: In the first step, the calibration device determines the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point, and sets the first calibration point, the second calibration point, the third calibration point and the fourth calibration point Marked on the loading dock.

第二步,根據校準裝置確定的第一校準點、第二校準點、第三校準點以及第四校準點的位置確定測量裝置中第一測量件、第二測量件、第三測量件以及第四測量件的位置。The second step is to determine the first, second, third, and third measurement parts in the measurement device according to the positions of the first, second, third, and fourth calibration points determined by the calibration device. 4. The position of the measuring piece.

第三步,將安裝好第一測量件、第二測量件、第三測量件以及第四測量件的測量裝置卡入裝卸台對應的位置。The third step is to snap the measuring device with the first measuring piece, the second measuring piece, the third measuring piece and the fourth measuring piece into the corresponding position of the loading and unloading platform.

第四步,移動第一測量件以及第二測量件,直到第一測量件以及第二測量件輕觸拋光台後停止移動,並讀取第一校準點以及第二校準點到拋光頭的第一距離以及第二距離。The fourth step is to move the first measurement piece and the second measurement piece until the first measurement piece and the second measurement piece touch the polishing table and stop moving, and read the first calibration point and the second calibration point to the first point of the polishing head One distance and second distance.

第五步,移動第三測量件以及第四測量件,直到第三測量件以及第四測量件輕觸拋光台後停止移動,並讀取第三校準點以及第四校準點到拋光頭的第三距離以及第四距離。The fifth step is to move the third measuring piece and the fourth measuring piece until the third and fourth measuring pieces touch the polishing table and then stop moving, and read the third calibration point and the fourth calibration point to the first position of the polishing head. Three distance and fourth distance.

第六步,校準裝置根據第一距離、第二距離、第三距離以及第四距離對拋光頭以及裝卸台的位置進行校準。In the sixth step, the calibration device calibrates the positions of the polishing head and the loading and unloading table according to the first distance, the second distance, the third distance, and the fourth distance.

在本發明實施例中,測量裝置上的第一測量件、第二測量件、第三測量件以及第四測量件分別設置在第一位置、第二位置、第三位置以及第四位置上,然後利用上述測量裝置測量第一距離、第二距離、第三距離以及第四距離,以使電子設備可以通過使第一距離與第二距離相等,以及第三距離與第四距離相等,對拋光頭與裝卸台的位置進行準確度高的校準。In the embodiment of the present invention, the first measuring piece, the second measuring piece, the third measuring piece, and the fourth measuring piece on the measuring device are respectively arranged at the first position, the second position, the third position, and the fourth position, Then use the above-mentioned measuring device to measure the first distance, the second distance, the third distance, and the fourth distance, so that the electronic device can make the first distance equal to the second distance, and the third distance equals to the fourth distance, to polish The positions of the head and the loading and unloading platform are calibrated with high accuracy.

請參照圖12,圖12為本發明實施例提供的一種電子設備的結構框圖,該電子設備包括:至少一個處理器1201,至少一個通訊介面1202,至少一個記憶體1203和至少一個通訊匯流排1204。其中,通訊匯流排1204用於實現這些組件直接的連接通訊,通訊介面1202用於與其他節點設備進行信令或資料的通訊,記憶體1203儲存有處理器1201可執行的機器可讀指令。當電子設備運行時,處理器1201與記憶體1203之間通過通訊匯流排1204通訊,機器可讀指令被處理器1201執行時執行上述校準方法。Please refer to FIG. 12, which is a structural block diagram of an electronic device according to an embodiment of the present invention. The electronic device includes: at least one processor 1201, at least one communication interface 1202, at least one memory 1203, and at least one communication bus 1204. Among them, the communication bus 1204 is used for realizing the direct connection and communication of these components, the communication interface 1202 is used for signaling or data communication with other node devices, and the memory 1203 stores machine-readable instructions executable by the processor 1201. When the electronic device is running, the processor 1201 and the memory 1203 communicate through the communication bus 1204, and the machine-readable instructions are executed when the processor 1201 executes the above-mentioned calibration method.

處理器1201可以是一種積體電路晶片,具有訊號處理能力。上述處理器1201可以是通用處理器,包括中央處理器(Central Processing Unit,CPU)、網路處理器(Network Processor,NP)等;還可以是數位訊號處理器(DSP)、專用積體電路(ASIC)、現成可程式設計閘陣列(FPGA)或者其他可程式設計邏輯器件、分立門或者電晶體邏輯器件、分立硬體組件。其可以實現或者執行本發明實施例中公開的各種方法、步驟及邏輯框圖。通用處理器可以是微處理器或者該處理器也可以是任何常規的處理器等。The processor 1201 may be an integrated circuit chip with signal processing capability. The aforementioned processor 1201 may be a general-purpose processor, including a central processing unit (CPU), a network processor (Network Processor, NP), etc.; it may also be a digital signal processor (DSP), a dedicated integrated circuit ( ASIC), ready-made programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. It can implement or execute various methods, steps, and logical block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor or the like.

記憶體1203可以包括但不限於隨機存取記憶體(Random Access Memory,RAM),唯讀記憶體(Read Only Memory,ROM),可程式設計唯讀記憶體(Programmable Read-Only Memory,PROM),可擦除唯讀記憶體(Erasable Programmable Read-Only Memory,EPROM),電可擦除唯讀記憶體(Electric Erasable Programmable Read-Only Memory,EEPROM)等。The memory 1203 may include but is not limited to Random Access Memory (RAM), Read Only Memory (Read Only Memory, ROM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), Electric Erasable Programmable Read-Only Memory (EEPROM), etc.

本發明實施例還提供一種電腦程式產品,包括儲存在非暫態電腦可讀儲存媒體上的電腦程式,電腦程式包括程式指令,當程式指令被電腦執行時,電腦能夠執行上述實施例中校準方法的步驟,例如包括:獲取第一距離、第二距離、第三距離以及第四距離;根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等。An embodiment of the present invention also provides a computer program product, including a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer can execute the calibration method in the above-mentioned embodiment The steps of, for example, include: obtaining a first distance, a second distance, a third distance, and a fourth distance; and calibrating the first distance, the second distance, the third distance, and the fourth distance according to the first distance, the second distance, the third distance, and the fourth distance. The polishing head circle is preset to the target polishing head circle, so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance.

以上所述僅為本發明的優選實施例而已,並不用於限制本發明,對於本領域的技術人員來說,本發明可以有各種更改和變化。凡在本發明的精神和原則之內,所作的任何修改、等同替換、改進等,均應包含在本發明的保護範圍之內。The above are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

以上所述,僅為本發明的具體實施方式,但本發明的保護範圍並不局限於此,任何熟悉本技術領域的技術人員在本發明揭露的技術範圍內,可輕易想到變化或替換,都應涵蓋在本發明的保護範圍之內。因此,本發明的保護範圍應所述以申請專利範圍的保護範圍為準。The above are only specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. It should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the patent application.

需要說明的是,在本文中,諸如第一和第二等之類的關係術語僅僅用來將一個實體或者操作與另一個實體或操作區分開來,而不一定要求或者暗示這些實體或操作之間存在任何這種實際的關係或者順序。而且,術語“包括”、“包含”或者其任何其他變體意在涵蓋非排他性的包含,從而使得包括一系列要素的過程、方法、物品或者設備不僅包括那些要素,而且還包括沒有明確列出的其他要素,或者是還包括為這種過程、方法、物品或者設備所固有的要素。在沒有更多限制的情況下,由語句“包括一個……”限定的要素,並不排除在包括所述要素的過程、方法、物品或者設備中還存在另外的相同要素。It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply one of these entities or operations. There is any such actual relationship or order between. Moreover, the terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes those that are not explicitly listed Other elements of, or also include elements inherent to this process, method, article or equipment. If there are no more restrictions, the element defined by the sentence "including a..." does not exclude the existence of other identical elements in the process, method, article, or equipment that includes the element.

90            校準裝置 901          第一獲取模組 902          校準模組 1201        處理器 1202        通訊介面 1203        記憶體 1204        通訊匯流排 S101        步驟 S102        步驟 S501        步驟 S502        步驟 S601        步驟 S602        步驟 S603        步驟 S801        步驟 S802        步驟 S803        步驟 90 Calibration device 901 First acquisition module 902 Calibration module 1201 Processor 1202 Communication interface 1203 Memory 1204 Communication bus S101 Step S102 Step S501 Step S502 Step S601 Step S602 Step S603 Step S801 Step S802 Steps S803 Steps

為了更清楚地說明本發明實施例的技術方案,下面將對實施例中所需要使用的圖式作簡單地介紹。應當理解,以下圖式僅示出了本發明的某些實施例,因此不應被看作是對範圍的限定,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據這些圖式獲得其他相關的圖式。In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, they can also Obtain other related schemas based on these schemas.

圖1為本發明實施例提供的一種校準方法的流程圖。Fig. 1 is a flowchart of a calibration method provided by an embodiment of the present invention.

圖2為本發明實施例提供的拋光頭圓、裝卸台圓以及拋光頭軌跡圓的位置示意圖。Fig. 2 is a schematic diagram of the positions of the polishing head circle, the loading and unloading table circle, and the polishing head track circle provided by the embodiment of the present invention.

圖3a為本發明實施例提供的拋光頭圓在CD方向上校準前的示意圖。Fig. 3a is a schematic diagram of a polishing head circle provided by an embodiment of the present invention before being calibrated in the CD direction.

圖3b為本發明實施例提供的拋光頭圓在CD方向上校準後的示意圖。Fig. 3b is a schematic diagram of the polishing head circle provided by the embodiment of the present invention after being calibrated in the CD direction.

圖4a為本發明實施例提供的拋光頭圓在AB方向上校準前的示意圖。Fig. 4a is a schematic diagram of a polishing head circle provided by an embodiment of the present invention before being calibrated in the AB direction.

圖4b為本發明實施例提供的拋光頭圓在AB方向上校準後的示意圖。Fig. 4b is a schematic diagram of the polishing head circle provided by the embodiment of the present invention after being calibrated in the AB direction.

圖5為本發明實施例提供的另一種校準方法的流程圖。Fig. 5 is a flowchart of another calibration method provided by an embodiment of the present invention.

圖6為本發明實施例提供的另一種校準方法的流程圖。Fig. 6 is a flowchart of another calibration method provided by an embodiment of the present invention.

圖7為本發明實施例提供的確定ABCD校準點的示意圖。FIG. 7 is a schematic diagram of determining ABCD calibration points according to an embodiment of the present invention.

圖8為本發明實施例提供的另一種校準方法的流程圖。FIG. 8 is a flowchart of another calibration method provided by an embodiment of the present invention.

圖9為本發明實施例提供的一種校準裝置的結構框圖。FIG. 9 is a structural block diagram of a calibration device provided by an embodiment of the present invention.

圖10為本發明實施例提供的一種測量裝置的結構示意圖。FIG. 10 is a schematic structural diagram of a measuring device provided by an embodiment of the present invention.

圖11為本發明實施例提供的測量裝置與裝卸台的安裝示意圖。FIG. 11 is a schematic diagram of the installation of the measuring device and the loading and unloading platform provided by the embodiment of the present invention.

圖12為本發明實施例提供的一種電子設備的結構框圖。FIG. 12 is a structural block diagram of an electronic device according to an embodiment of the present invention.

S101        步驟 S102         步驟 S101 Step S102 Step

Claims (10)

一種校準方法,包括以下步驟: 獲取第一距離、第二距離、第三距離以及第四距離;其中,所述第一距離為第一校準點與預設拋光頭圓的最短距離,所述第二距離為第二校準點與所述預設拋光頭圓的最短距離,所述第三距離為第三校準點與所述預設拋光頭圓的最小圓弧距離,所述第四距離為第四校準點與所述預設拋光頭圓的最小圓弧距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓;及 根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等;其中,所述目標拋光頭圓為所述拋光頭的目標位置對應的圓。 A calibration method includes the following steps: Obtain a first distance, a second distance, a third distance, and a fourth distance; wherein the first distance is the shortest distance between the first calibration point and the preset polishing head circle, and the second distance is the second calibration point and the The shortest distance of the preset polishing head circle, the third distance is the minimum arc distance between the third calibration point and the preset polishing head circle, and the fourth distance is the fourth calibration point and the preset The minimum arc distance of the polishing head circle; the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are located on the loading and unloading table circle; the preset polishing head circle is The circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is the circle corresponding to the fixed position of the loading and unloading table; and Calibrate the preset polishing head circle to the target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is the same as the second distance. The distance is equal, and the third distance is equal to the fourth distance; wherein the target polishing head circle is a circle corresponding to the target position of the polishing head. 如請求項1所述之校準方法,其中,在所述獲取第一距離之前,所述校準方法還包括: 獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊; 根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。 The calibration method according to claim 1, wherein, before the obtaining the first distance, the calibration method further includes: Acquiring first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point; The first calibration point is marked on the loading and unloading platform circle according to the first position information, the second calibration point is marked on the loading and unloading platform circle according to the second position information, and according to the first position information Three-position information marks the third calibration point on the loading and unloading platform circle, and marking the fourth calibration point on the loading and unloading platform circle according to the fourth position information. 如請求項2所述之校準方法,其中,所述獲取所述第一校準點的第一位置資訊以及所述第二校準點的第二位置資訊包括: 獲取拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓; 利用第一直線連接所述第一圓心與第二圓心,得到所述第一直線與所述裝卸台圓的第一交點以及第二交點;其中,所述第二圓心為所述裝卸台圓的圓心; 確定所述第一交點的位置資訊為所述第一位置資訊以及第二交點的位置資訊為所述第二位置資訊。 The calibration method according to claim 2, wherein said obtaining the first position information of the first calibration point and the second position information of the second calibration point comprises: Obtaining the first center of the polishing head trajectory circle and the loading and unloading table circle; wherein the polishing head trajectory circle is a circle corresponding to the polishing head running trajectory; Use a first straight line to connect the first circle center and the second circle center to obtain a first intersection point and a second intersection point of the first straight line and the loading dock circle; wherein the second circle center is the center of the loading dock circle; It is determined that the position information of the first intersection is the first position information and the position information of the second intersection is the second position information. 如請求項2所述之校準方法,其中,所述獲取所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊包括: 獲取拋光頭軌跡圓的半徑、所述拋光頭軌跡圓的第一圓心以及所述裝卸台圓;其中,所述拋光頭軌跡圓為所述拋光頭運行軌跡對應的圓; 根據所述拋光頭軌跡圓的半徑以及所述裝卸台圓的半徑確定第一角度的餘弦值,並根據所述餘弦值確定所述第一角度;其中所述第一角度為第一直線與第二直線的夾角,所述第一直線為所述第一圓心與第二圓心的連線,所述第二圓心為所述裝卸台圓的圓心,所述第二直線為所述第一圓心與所述第三校準點或者所述第四校準點的連線; 根據所述第一角度、所述第一直線以及所述裝卸台圓確定所述第三位置資訊以及所述第四位置資訊。 The calibration method according to claim 2, wherein said obtaining the third position information of the third calibration point and the fourth position information of the fourth calibration point includes: Obtaining the radius of the polishing head trajectory circle, the first center of the polishing head trajectory circle, and the loading and unloading table circle; wherein the polishing head trajectory circle is a circle corresponding to the polishing head running trajectory; The cosine value of the first angle is determined according to the radius of the polishing head track circle and the radius of the loading and unloading platform circle, and the first angle is determined according to the cosine value; wherein the first angle is the first straight line and the second The included angle of a straight line, the first straight line is the line connecting the first circle center and the second circle center, the second circle center is the center of the loading and unloading platform circle, and the second straight line is the first circle center and the The connection line of the third calibration point or the fourth calibration point; The third position information and the fourth position information are determined according to the first angle, the first straight line, and the dock circle. 一種校準裝置,包括: 第一獲取模組,用於獲取第一距離、第二距離、第三距離以及第四距離;其中,所述第一距離為第一校準點與預設拋光頭圓的最短距離,所述第二距離為第二校準點與所述預設拋光頭圓的最短距離,所述第三距離為第三校準點與所述預設拋光頭圓的最小圓弧距離,所述第四距離為第四校準點與所述預設拋光頭圓的最小圓弧距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓;及 校準模組,用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離校準所述預設拋光頭圓至目標拋光頭圓,以使所述第一距離與所述第二距離相等,以及所述第三距離與所述第四距離相等;其中,所述目標拋光頭圓為所述拋光頭的目標位置對應的圓。 A calibration device, including: The first acquisition module is used to acquire the first distance, the second distance, the third distance and the fourth distance; wherein the first distance is the shortest distance between the first calibration point and the preset polishing head circle, and the first distance is the shortest distance between the first calibration point and the preset polishing head circle. The second distance is the shortest distance between the second calibration point and the preset polishing head circle, the third distance is the minimum arc distance between the third calibration point and the preset polishing head circle, and the fourth distance is the first The minimum arc distance between the four calibration points and the preset polishing head circle; the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are located on the loading and unloading platform circle; The preset polishing head circle is a circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is a circle corresponding to the fixed position of the loading and unloading table; and The calibration module is used to calibrate the preset polishing head circle to the target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first The distance is equal to the second distance, and the third distance is equal to the fourth distance; wherein the target polishing head circle is a circle corresponding to the target position of the polishing head. 如請求項5所述之校準裝置,其中,所述校準裝置還包括: 第二獲取模組,用於獲取所述第一校準點的第一位置資訊、所述第二校準點的第二位置資訊、所述第三校準點的第三位置資訊以及所述第四校準點的第四位置資訊; 標註模組,用於根據所述第一位置資訊將所述第一校準點標註在所述裝卸台圓上,根據所述第二位置資訊將所述第二校準點標註在所述裝卸台圓上,根據所述第三位置資訊將所述第三校準點標註在所述裝卸台圓上,根據所述第四位置資訊將所述第四校準點標註在所述裝卸台圓上。 The calibration device according to claim 5, wherein the calibration device further includes: The second acquisition module is used to acquire the first position information of the first calibration point, the second position information of the second calibration point, the third position information of the third calibration point, and the fourth calibration point. On-time fourth location information; The marking module is configured to mark the first calibration point on the loading and unloading platform circle according to the first position information, and mark the second calibration point on the loading and unloading platform circle according to the second position information In the above, the third calibration point is marked on the loading and unloading platform circle according to the third position information, and the fourth calibration point is marked on the loading and unloading platform circle according to the fourth position information. 一種校準系統,包括測量裝置以及請求項5中所述之校準裝置; 所述測量裝置用於測量第一距離、第二距離、第三距離以及第四距離,所述校準裝置用於根據所述第一距離、所述第二距離、所述第三距離以及所述第四距離對拋光頭的位置進行校準; 其中,所述第一距離為第一校準點與預設拋光頭圓的圓弧距離,所述第二距離為第二校準點與所述預設拋光頭圓的圓弧距離,所述第三距離為第三校準點與所述預設拋光頭圓的最短距離,所述第四距離為第四校準點與所述預設拋光頭圓的最短距離;所述第一校準點、所述第二校準點、所述第三校準點以及所述第四校準點位於裝卸台圓上;所述預設拋光頭圓為拋光頭的起始位置對應的圓,所述裝卸台圓為裝卸台的固定位置對應的圓。 A calibration system, including a measuring device and the calibration device described in claim 5; The measuring device is used to measure a first distance, a second distance, a third distance, and a fourth distance, and the calibration device is used to measure the first distance, the second distance, the third distance, and the The fourth distance is to calibrate the position of the polishing head; Wherein, the first distance is the arc distance between the first calibration point and the preset polishing head circle, the second distance is the arc distance between the second calibration point and the preset polishing head circle, and the third The distance is the shortest distance between the third calibration point and the preset polishing head circle, the fourth distance is the shortest distance between the fourth calibration point and the preset polishing head circle; the first calibration point, the second The second calibration point, the third calibration point, and the fourth calibration point are located on the loading and unloading table circle; the preset polishing head circle is the circle corresponding to the starting position of the polishing head, and the loading and unloading table circle is the circle of the loading and unloading table. The circle corresponding to the fixed position. 如請求項7所述之校準系統,其中,所述測量裝置包括:固定件、第一測量件、第二測量件、第三測量件以及第四測量件; 所述固定件的大小形狀與所述裝卸台圓的大小形狀相同; 所述第一測量件設置在所述固定件上與所述裝卸台圓對應的第一位置處,所述第二測量件設置在所述固定件上與所述裝卸台圓對應的第二位置處,所述第三測量件設置在所述固定件上與所述裝卸台圓對應的第三位置處,所述第四測量件設置在所述固定件上與所述裝卸台圓對應的第四位置處; 其中,所述第一位置為所述第一校準點的位置,所述第二位置為所述第二校準點的位置,所述第三位置為所述第三校準點的位置,所述第四位置為所述第四校準點的位置。 The calibration system according to claim 7, wherein the measuring device includes: a fixing part, a first measuring part, a second measuring part, a third measuring part, and a fourth measuring part; The size and shape of the fixing member are the same as the size and shape of the loading and unloading platform circle; The first measuring piece is arranged on the fixing piece at a first position corresponding to the loading and unloading platform circle, and the second measuring piece is arranged on the fixing piece at a second position corresponding to the loading and unloading platform circle Where, the third measuring piece is set on the fixing piece at a third position corresponding to the loading and unloading platform circle, and the fourth measuring piece is set on the fixing piece at the first position corresponding to the loading and unloading platform circle. Four positions Wherein, the first position is the position of the first calibration point, the second position is the position of the second calibration point, the third position is the position of the third calibration point, and the second position is the position of the third calibration point. The fourth position is the position of the fourth calibration point. 一種電子設備,包括:處理器、記憶體和匯流排; 所述處理器和所述記憶體通過所述匯流排完成相互間的通訊; 所述記憶體儲存有可被所述處理器執行的程式指令,所述處理器調用所述程式指令能夠執行如請求項1至4中任一項所述之校準方法。 An electronic device, including: a processor, a memory, and a bus; The processor and the memory communicate with each other through the bus; The memory stores program instructions that can be executed by the processor, and the processor invokes the program instructions to execute the calibration method as described in any one of request items 1 to 4. 一種非暫態電腦可讀儲存媒體,其特徵在於,所述非暫態電腦可讀儲存媒體儲存電腦指令,所述電腦指令使所述電腦執行如請求項1至4中任一項所述之校準方法。A non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions cause the computer to execute any one of claims 1 to 4 Calibration method.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113161268A (en) 2021-05-11 2021-07-23 杭州众硅电子科技有限公司 Device for calibrating positions of polishing head and loading and unloading platform, polishing equipment and calibration method

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW544366B (en) * 2001-03-20 2003-08-01 Samsung Electronics Co Ltd Calibration apparatus for pad conditioner head
TW556296B (en) * 2000-12-27 2003-10-01 Koninkl Philips Electronics Nv Method of measuring alignment of a substrate with respect to a reference alignment mark
WO2004024394A1 (en) * 2002-09-16 2004-03-25 Applied Materials, Inc. Control of removal profile in electrochemically assisted cmp
CN1500029A (en) * 2001-03-29 2004-05-26 ��ķ�о����޹�˾ Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing
TW200538704A (en) * 2004-05-21 2005-12-01 Zetetic Inst Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry
US20060154574A1 (en) * 2005-01-13 2006-07-13 Elmufdi Carolina L CMP pad having a radially alternating groove segment configuration
US7311586B2 (en) * 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
TW201502461A (en) * 2013-05-16 2015-01-16 Kla Tencor Corp Metrology system calibration refinement
TW201527040A (en) * 2011-05-05 2015-07-16 Nexplanar Corp Polishing pad with alignment feature
US20180358243A1 (en) * 2013-12-13 2018-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2611251B2 (en) * 1987-08-28 1997-05-21 株式会社ニコン Substrate transfer device
JP2804547B2 (en) * 1989-10-28 1998-09-30 株式会社日立製作所 Wafer alignment apparatus and alignment method
WO2007099646A1 (en) * 2006-02-28 2007-09-07 Canon Kabushiki Kaisha Circular shape measurement method, cylindrical shape measurement method, and cylindrical shape measurement apparatus
CN103811387B (en) * 2012-11-08 2016-12-21 沈阳新松机器人自动化股份有限公司 Wafer pre-alignment method and device
CN110634786A (en) * 2013-09-22 2019-12-31 盛美半导体设备(上海)有限公司 Alignment device and alignment method
CN104197830B (en) * 2014-08-06 2017-04-19 青岛歌尔声学科技有限公司 Method and system for correcting optical test fixture
KR101616464B1 (en) * 2014-11-18 2016-04-29 주식회사 엘지실트론 Apparatus for Loading Wafer of Polishing Wafer Equipment and Method of Calibrating Loading Position of Wafer
CN108088388B (en) * 2018-01-15 2020-10-23 中国工程物理研究院机械制造工艺研究所 Workpiece polishing detection device
CN109886889B (en) * 2019-02-12 2023-05-05 哈尔滨工程大学 Precise positioning method for aerial oil-adding taper sleeve based on center deviation compensation method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7311586B2 (en) * 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
TW556296B (en) * 2000-12-27 2003-10-01 Koninkl Philips Electronics Nv Method of measuring alignment of a substrate with respect to a reference alignment mark
TW544366B (en) * 2001-03-20 2003-08-01 Samsung Electronics Co Ltd Calibration apparatus for pad conditioner head
CN1500029A (en) * 2001-03-29 2004-05-26 ��ķ�о����޹�˾ Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing
WO2004024394A1 (en) * 2002-09-16 2004-03-25 Applied Materials, Inc. Control of removal profile in electrochemically assisted cmp
TW200538704A (en) * 2004-05-21 2005-12-01 Zetetic Inst Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry
US20060154574A1 (en) * 2005-01-13 2006-07-13 Elmufdi Carolina L CMP pad having a radially alternating groove segment configuration
TW201527040A (en) * 2011-05-05 2015-07-16 Nexplanar Corp Polishing pad with alignment feature
TW201502461A (en) * 2013-05-16 2015-01-16 Kla Tencor Corp Metrology system calibration refinement
US20180358243A1 (en) * 2013-12-13 2018-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method

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