TWI728735B - Thermal reactive pressure detector - Google Patents

Thermal reactive pressure detector Download PDF

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TWI728735B
TWI728735B TW109107772A TW109107772A TWI728735B TW I728735 B TWI728735 B TW I728735B TW 109107772 A TW109107772 A TW 109107772A TW 109107772 A TW109107772 A TW 109107772A TW I728735 B TWI728735 B TW I728735B
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sensitive material
heat
pressure
substrate
detector
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TW202134613A (en
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嚴振洪
呂胤嘉
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高爾科技股份有限公司
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Abstract

A thermal reactive pressure detector includes a pressure detection module and a reference module. The pressure detection module uses a first thermal reactive sensitive material to detect a temperature which varies with a pressure, and the resistance value of the first thermal reactive sensitive material can be used to determine the pressure. The reference module uses a second thermal reactive sensitive material to sense a temperature of a surrounding environment to eliminate an influence of the temperature of the environment.

Description

熱反應式壓力偵測器Thermal response pressure detector

本發明是有關一種壓力偵測器,特別是關於一種利用溫度變化來偵測壓力的熱反應式壓力偵測器。The present invention relates to a pressure detector, in particular to a thermally reactive pressure detector that uses temperature changes to detect pressure.

目前的壓力偵測器可分為三種:利用壓力造成電容變化以偵測壓力的電容式壓力偵測器、利用壓力產生電壓變化以偵測壓力的壓電式壓力偵測器以及利用壓力產生電阻變化以偵測壓力的壓阻式壓力偵測器。現今並沒有利用壓力產生的溫度變化來偵測壓力的壓力偵測器。The current pressure detectors can be divided into three types: capacitive pressure detectors that use pressure to change capacitance to detect pressure, piezoelectric pressure detectors that use pressure to generate voltage changes to detect pressure, and use pressure to generate resistance A piezoresistive pressure detector that changes to detect pressure. Currently, there is no pressure detector that uses temperature changes caused by pressure to detect pressure.

本發明的目的,在於提出一種利用溫度變化來偵測壓力的熱反應式壓力偵測器。The purpose of the present invention is to provide a thermally reactive pressure detector that uses temperature changes to detect pressure.

根據本發明,一種熱反應式壓力偵測器包括一基板、一壓力偵測模組及一參考模組。該壓力偵測模組在該基板上,透過溫度變化來偵測一壓力值,該壓力偵測模組包括一第一熱敏材料、一第一導熱塗層及一第一外殼,該第一外殼與該基板形成一第一容置空間用以容納該第一熱敏材料及該第一導熱塗層,該第一外殼具有一開孔供空氣進入該第一容置空間,該第一容置空間內的該壓力值會影響溫度,該第一導熱塗層再將熱傳遞到該第一熱敏材料,使該第一熱敏材料的電阻值隨該溫度改變,因此可透過偵測該第一熱敏材料的電阻值來判斷該壓力值。該參考模組在該基板上,用以消除環境溫度對該壓力偵模組的影響,該參考模組包括一第二熱敏材料、一第二導熱塗層及一第二外殼,該第二熱敏材料與該第一熱敏材料具有相同的電阻溫度係數,該第二導熱塗層用以將熱傳遞到該第二熱敏材料,該第二外殼與該基板形成封閉且為真空狀態的第二容置空間以容納該第二熱敏材料及該第二導熱塗層,由於該第二容置空間為固定壓力狀態,因此該第二熱敏材料不會受到壓力影響。According to the present invention, a thermally reactive pressure detector includes a substrate, a pressure detection module, and a reference module. The pressure detection module detects a pressure value through temperature changes on the substrate. The pressure detection module includes a first thermal sensitive material, a first thermally conductive coating and a first housing. The first The housing and the substrate form a first accommodating space for accommodating the first heat-sensitive material and the first thermally conductive coating, the first housing has an opening for air to enter the first accommodating space, and the first housing The pressure value in the set space will affect the temperature. The first thermally conductive coating transfers heat to the first heat-sensitive material, so that the resistance value of the first heat-sensitive material changes with the temperature. Therefore, the first heat-sensitive material can be detected by detecting the temperature. The resistance value of the first heat-sensitive material is used to determine the pressure value. The reference module is on the substrate to eliminate the influence of ambient temperature on the pressure detection module. The reference module includes a second heat-sensitive material, a second thermally conductive coating and a second housing. The second The heat-sensitive material has the same temperature coefficient of resistance as the first heat-sensitive material, the second thermally conductive coating is used to transfer heat to the second heat-sensitive material, and the second housing and the substrate form a closed and vacuum state The second accommodating space is for accommodating the second heat-sensitive material and the second thermally conductive coating. Since the second accommodating space is in a fixed pressure state, the second heat-sensitive material will not be affected by pressure.

本發明的該第一熱敏材料及該第二熱敏材料是處在相同環境溫度下,透過第二熱敏材料的電阻值可知道環境溫度對該第一熱敏材料的影響,進而取得該第一熱敏材料中因該壓力值而產生的電阻值變化,根據該電阻值變化可判斷出該壓力值。The first heat-sensitive material and the second heat-sensitive material of the present invention are at the same ambient temperature, and the resistance value of the second heat-sensitive material can know the influence of the ambient temperature on the first heat-sensitive material, and then obtain the The resistance value change in the first thermosensitive material due to the pressure value can be judged according to the resistance value change.

圖1顯示本發明的熱反應式壓力偵測器10的第一實施例,其包括一基板12、一壓力偵測模組14、一參考模組16及一控制電路18,壓力偵測模組14是透過偵測溫度變化來偵測壓力值,參考模組16是用來消除熱反應式壓力偵測器10周遭環境溫度對壓力偵測模組14的影響,使壓力偵測模組14只偵測到因壓力變化而產生的溫度變化,例如使用者手持熱反應式壓力偵測器10時,參考模組16可消除使用者體溫對壓力偵測模組14的影響。壓力偵測模組14包括熱敏材料141、導熱塗層142及外殼143,參考模組16包括熱敏材料161、導熱塗層162及外殼163,熱敏材料141及161位於基板12上,熱敏材料141及161具有相同的電阻溫度係數,因此熱敏材料141及161的電阻值會隨溫度改變,熱敏材料141及161可以是但不限於氧化釩(VOx,x為正整數)。導熱塗層142及162分別覆蓋熱敏材料141及161,導熱塗層142及162是用來將熱傳遞至熱敏材料141及161。外殼143及163設置在基板12上,分別與基板12形成容置空間144及164,熱敏材料141及導熱塗層142是容納在容置空間144中,而熱敏材料161及導熱塗層162是容納在容置空間164中。壓力偵測模組14與參考模組16的結構幾乎相同,差別在於,壓力偵測模組14的外殼143設有一開孔145可供空氣進入容置空間144以量測壓力值,而參考模組16的容置空間161為真空狀態以避免壓力影響到熱敏材料161。控制電路18設置在基板上,施加預設電流I1或預設電壓V1至熱敏材料141及161,再透過偵測熱敏材料141及161上的電壓或電流來判斷熱敏材料141及161的電阻值,進而得到該壓力值。Figure 1 shows a first embodiment of the thermally reactive pressure detector 10 of the present invention, which includes a substrate 12, a pressure detection module 14, a reference module 16, and a control circuit 18, pressure detection module 14 is to detect the pressure value by detecting temperature changes. The reference module 16 is used to eliminate the influence of the ambient temperature of the thermally reactive pressure detector 10 on the pressure detection module 14 so that there are 14 pressure detection modules The temperature change caused by the pressure change is detected. For example, when the user holds the heat-responsive pressure detector 10 in hand, the reference module 16 can eliminate the influence of the user's body temperature on the pressure detection module 14. The pressure detection module 14 includes a heat-sensitive material 141, a thermally conductive coating 142, and a housing 143. The reference module 16 includes a heat-sensitive material 161, a thermally conductive coating 162, and a housing 163. The thermally sensitive materials 141 and 161 are located on the substrate 12. The temperature-sensitive materials 141 and 161 have the same temperature coefficient of resistance. Therefore, the resistance values of the temperature-sensitive materials 141 and 161 change with temperature. The temperature-sensitive materials 141 and 161 may be, but not limited to, vanadium oxide (VOx, x is a positive integer). The thermally conductive coatings 142 and 162 cover the thermally sensitive materials 141 and 161 respectively, and the thermally conductive coatings 142 and 162 are used to transfer heat to the thermally sensitive materials 141 and 161. The housings 143 and 163 are disposed on the substrate 12 to form accommodating spaces 144 and 164 with the substrate 12, respectively. The thermal sensitive material 141 and the thermally conductive coating 142 are accommodated in the accommodating space 144, and the thermally sensitive material 161 and the thermally conductive coating 162 are contained in the accommodating space 144. It is contained in the accommodating space 164. The structure of the pressure detection module 14 is almost the same as that of the reference module 16. The difference is that the housing 143 of the pressure detection module 14 is provided with an opening 145 for air to enter the accommodating space 144 to measure the pressure value. The accommodating space 161 of the group 16 is in a vacuum state to prevent pressure from affecting the heat-sensitive material 161. The control circuit 18 is arranged on the substrate, and applies a preset current I1 or a preset voltage V1 to the temperature-sensitive materials 141 and 161, and then detects the voltage or current on the temperature-sensitive materials 141 and 161 to determine whether the temperature-sensitive materials 141 and 161 are Resistance value, and then get the pressure value.

根據一氣體公式:P×V=n×R×T,其中P為壓力,V為容器體積,n為氣體分子數,R為理想氣體常數,T為溫度。該氣體公式可修改為:P×V/T = n×R = 常數,因此在容器體積V固定的情況下,該容器內的壓力P與溫度T成正比。由於本發明的壓力偵測模組14的容置空間144的體積V是固定的,因此容置空間144中的溫度T會隨壓力值P變化,導致熱敏材料141的電阻值隨壓力值P變化。參考模組16的容置空間164為固定壓力狀態,故外部壓力無法影響熱敏材料161的電阻值,熱敏材料161的電阻值只受到周遭環境溫度影響,因此能利用熱敏材料161的電阻值來消除熱敏材料141中因環境溫度而產生的變化,以得到熱敏材料141中因壓力值P所產生的電阻值變化量,並根據該電阻值變化量判斷出壓力值P。According to a gas formula: P×V=n×R×T, where P is the pressure, V is the container volume, n is the number of gas molecules, R is the ideal gas constant, and T is the temperature. The gas formula can be modified as: P×V/T = n×R = constant, so when the container volume V is fixed, the pressure P in the container is proportional to the temperature T. Since the volume V of the accommodating space 144 of the pressure detecting module 14 of the present invention is fixed, the temperature T in the accommodating space 144 varies with the pressure value P, resulting in the resistance value of the thermosensitive material 141 as the pressure value P Variety. The accommodating space 164 of the reference module 16 is in a fixed pressure state, so the external pressure cannot affect the resistance value of the thermosensitive material 161. The resistance value of the thermosensitive material 161 is only affected by the ambient temperature, so the resistance of the thermosensitive material 161 can be used The value is used to eliminate the change in the temperature-sensitive material 141 due to the environmental temperature, so as to obtain the change in resistance value of the temperature-sensitive material 141 due to the pressure value P, and determine the pressure value P based on the change in resistance value.

圖2顯示本發明的熱反應式壓力偵測器10的第二實施例,在此實施例中,基板12不包括控制電路18,控制電路18是放置在熱反應式壓力偵測器10的外部,控制電路18提供的預設電流I1或預設電壓V1可透過基板12上的導體146及165施加至熱敏材料141及161,也可透過導體146及165偵測熱敏材料141及161的電阻值以判斷壓力值。2 shows a second embodiment of the thermally reactive pressure detector 10 of the present invention. In this embodiment, the substrate 12 does not include the control circuit 18, and the control circuit 18 is placed outside the thermally reactive pressure detector 10 , The preset current I1 or the preset voltage V1 provided by the control circuit 18 can be applied to the thermal sensitive materials 141 and 161 through the conductors 146 and 165 on the substrate 12, and the thermal sensitive materials 141 and 161 can also be detected through the conductors 146 and 165. The resistance value is used to judge the pressure value.

圖3顯示控制電路18的實施例,其包括驅動器181、偵測器182及183以及處理電路184。驅動器181提供預設電流I1或預設電壓V1至熱敏材料141及161,熱敏材料141根據預設電流I1或預設壓V1產生電壓V2或電流I2,熱敏材料161根據預設電流I1或預設電壓V1產生電壓V3或電流I3,偵測器182偵測電壓V2或電流I2產生偵測信號S1,偵測器183偵測電壓V3或電流I3產生偵測信號S2,處理電路184根據偵測信號S1及S2判斷壓力值P。處理電路184判斷壓力值P的方式有很多,例如取得偵測信號S1及S2的差值,再透過預設的演算法根據該差值計算出壓力值P,或是透過查表方式根據該差值找出對應壓力值P。FIG. 3 shows an embodiment of the control circuit 18, which includes a driver 181, detectors 182 and 183, and a processing circuit 184. The driver 181 provides a preset current I1 or a preset voltage V1 to the thermal sensitive materials 141 and 161. The thermal sensitive material 141 generates a voltage V2 or a current I2 according to the preset current I1 or a preset voltage V1. The thermal sensitive material 161 generates a voltage V2 or a current I2 according to the preset current I1. Or the preset voltage V1 generates the voltage V3 or the current I3, the detector 182 detects the voltage V2 or the current I2 to generate the detection signal S1, the detector 183 detects the voltage V3 or the current I3 to generate the detection signal S2, and the processing circuit 184 according to The detection signals S1 and S2 determine the pressure value P. There are many ways for the processing circuit 184 to determine the pressure value P, such as obtaining the difference between the detection signals S1 and S2, and then calculating the pressure value P according to the difference through a preset algorithm, or according to the difference through a look-up table. Find the corresponding pressure value P.

以上對於本發明之較佳實施例所作的敘述係為闡明之目的,而無意限定本發明精確地為所揭露的形式,基於以上的教導或從本發明的實施例學習而作修改或變化是可能的,實施例係為解說本發明的原理以及讓熟習該項技術者以各種實施例利用本發明在實際應用上而選擇及敘述,本發明的技術思想企圖由之後的申請專利範圍及其均等來決定。The above description of the preferred embodiments of the present invention is for the purpose of clarification, and is not intended to limit the present invention to the disclosed form accurately. Modifications or changes are possible based on the above teachings or learning from the embodiments of the present invention Yes, the embodiments are selected and described in order to explain the principles of the present invention and allow those familiar with the technology to use the present invention in various embodiments in practical applications. The technical ideas of the present invention are intended to be derived from the scope of subsequent patent applications and their equality. Decided.

10:熱反應式壓力偵測器10: Thermal reaction type pressure detector

12:基板12: substrate

14:壓力偵測模組14: Pressure detection module

141:熱敏材料141: heat sensitive material

142:導熱塗層142: Thermally conductive coating

143:外殼143: Shell

144:容置空間144: housing space

145:開孔145: Hole

146:導體146: Conductor

16:參考模組16: Reference module

161:熱敏材料161: Thermal Material

162:導熱塗層162: Thermally conductive coating

163:外殼163: Shell

164:容置空間164: accommodating space

165:導體165: Conductor

18:控制電路18: Control circuit

181:驅動器181: Drive

182:偵測器182: Detector

183:偵測器183: Detector

184:處理電路184: processing circuit

圖1顯示本發明的熱反應式壓力偵測器的第一實施例。 圖2顯示本發明的熱反應式壓力偵測器的第二實施例。 圖3顯示控制電路18的實施例。 Figure 1 shows the first embodiment of the thermally reactive pressure detector of the present invention. Figure 2 shows a second embodiment of the thermally reactive pressure detector of the present invention. FIG. 3 shows an embodiment of the control circuit 18.

10:熱反應式壓力偵測器 10: Thermal reaction type pressure detector

12:基板 12: substrate

14:壓力偵測模組 14: Pressure detection module

141:熱敏材料 141: heat sensitive material

142:導熱塗層 142: Thermally conductive coating

143:外殼 143: Shell

144:容置空間 144: housing space

145:開孔 145: Hole

16:參考模組 16: Reference module

161:熱敏材料 161: Thermal Material

162:導熱塗層 162: Thermally conductive coating

163:外殼 163: Shell

164:容置空間 164: accommodating space

18:控制電路 18: Control circuit

Claims (4)

一種熱反應式壓力偵測器,包括:一基板;一壓力偵測模組,在該基板上,透過溫度變化來偵測一壓力值,該壓力偵模組包含:一第一熱敏材料,具有一電阻溫度係數且設置在該基板上,其中該第一熱敏材料的電阻值被用來判斷該壓力值;一第一導熱塗層,覆蓋該第一熱敏材料,用以將熱傳遞到該第一熱敏材料;以及一第一外殼,在該基板上,與該基板形成第一容置空間用以容納該第一熱敏材料及該第一導熱塗層,該第一外殼具有一開孔供空氣進入該第一容置空間;一參考模組,在該基板上,用以消除環境溫度對該壓力偵測模組的影響,該參考模組包含:一第二熱敏材料,具有該電阻溫度係數且設置在該基板上;一第二導熱塗層,覆蓋該第二熱敏材料,用以將熱傳遞到該第二熱敏材料;以及一第二外殼,在該基板上,與該基板形成封閉的第二容置空間用以容納該第二熱敏材料及該第二導熱塗層,其中該第二容置空間為真空狀態;以及一控制電路,耦接該第一熱敏材料及該第二熱敏材料以偵測該第一熱敏材料及該第二熱敏材料的電阻值,並據以判斷該壓力值。 A thermally responsive pressure detector includes: a substrate; a pressure detection module on the substrate to detect a pressure value through temperature changes, the pressure detection module includes: a first heat-sensitive material, It has a temperature coefficient of resistance and is set on the substrate, wherein the resistance value of the first thermal sensitive material is used to determine the pressure value; a first thermally conductive coating covering the first thermal sensitive material is used to transfer heat To the first heat-sensitive material; and a first housing, on the substrate, and the substrate to form a first accommodating space for accommodating the first heat-sensitive material and the first thermally conductive coating, the first housing has An opening for air to enter the first accommodating space; a reference module on the substrate to eliminate the influence of ambient temperature on the pressure detection module, the reference module including: a second heat-sensitive material , Having the temperature coefficient of resistance and arranged on the substrate; a second thermally conductive coating covering the second heat-sensitive material for transferring heat to the second heat-sensitive material; and a second housing on the substrate Above, a closed second accommodating space is formed with the substrate for accommodating the second heat-sensitive material and the second thermally conductive coating, wherein the second accommodating space is in a vacuum state; and a control circuit coupled to the first A heat-sensitive material and the second heat-sensitive material are used to detect the resistance values of the first heat-sensitive material and the second heat-sensitive material, and determine the pressure value accordingly. 如請求項1的熱反應式壓力偵測器,其中該控制電路包括:一驅動器,耦接該第一熱敏材料及該第二熱敏材料,用以提供一預 設電流或一預設電壓至該第一熱敏材料以產生一第一電壓或一第一電流,以及提供該預設電流或該預設電壓至該第二熱敏材料以產生一第二電壓或一第二電流;一第一偵測器,耦接該第一熱敏材料,偵測該第一電壓或該第一電流產生一第一偵測信號供判斷該第一熱敏材料的電阻值;一第二偵測器,耦接該第二熱敏材料,偵測該第二電壓或該第二電流產生一第二偵測信號供判斷該第二熱敏材料的電阻值;以及一處理電路,連接該第一偵測器及該第二偵測器,根據該第一偵測信號及該第二偵測信號判斷該壓力值。 For example, the thermally reactive pressure detector of claim 1, wherein the control circuit includes: a driver, coupled to the first heat-sensitive material and the second heat-sensitive material, for providing a preset Set a current or a predetermined voltage to the first thermal sensitive material to generate a first voltage or a first current, and provide the predetermined current or the predetermined voltage to the second thermal sensitive material to generate a second voltage Or a second current; a first detector, coupled to the first heat-sensitive material, detects the first voltage or the first current to generate a first detection signal for determining the resistance of the first heat-sensitive material A second detector, coupled to the second heat-sensitive material, detects the second voltage or the second current to generate a second detection signal for determining the resistance value of the second heat-sensitive material; and a A processing circuit is connected to the first detector and the second detector, and determines the pressure value according to the first detection signal and the second detection signal. 如請求項1的熱反應式壓力偵測器,其中該控制電路是設置在該基板上。 Such as the thermal reaction type pressure detector of claim 1, wherein the control circuit is provided on the substrate. 如請求項1的熱反應式壓力偵測器,其中該第一熱敏材料及該第二熱敏材料包括氧化釩。According to the thermal reaction type pressure detector of claim 1, wherein the first thermal sensitive material and the second thermal sensitive material include vanadium oxide.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1497245A (en) * 2002-10-23 2004-05-19 株式会社电装 Pressure sensing device with temp. sensor
TW200700708A (en) * 2005-05-02 2007-01-01 Mks Instr Inc Heated pressure transducer
TWI306503B (en) * 2004-04-19 2009-02-21 Celerity Inc Pressure sensor device and method
CN100545583C (en) * 2005-05-27 2009-09-30 上海自动化仪表股份有限公司 A kind of differential pressure, pressure, temperature simultaneously measuring multi-parameter sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1497245A (en) * 2002-10-23 2004-05-19 株式会社电装 Pressure sensing device with temp. sensor
TWI306503B (en) * 2004-04-19 2009-02-21 Celerity Inc Pressure sensor device and method
TW200700708A (en) * 2005-05-02 2007-01-01 Mks Instr Inc Heated pressure transducer
CN100545583C (en) * 2005-05-27 2009-09-30 上海自动化仪表股份有限公司 A kind of differential pressure, pressure, temperature simultaneously measuring multi-parameter sensor

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