TWI728735B - Thermal reactive pressure detector - Google Patents
Thermal reactive pressure detector Download PDFInfo
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- TWI728735B TWI728735B TW109107772A TW109107772A TWI728735B TW I728735 B TWI728735 B TW I728735B TW 109107772 A TW109107772 A TW 109107772A TW 109107772 A TW109107772 A TW 109107772A TW I728735 B TWI728735 B TW I728735B
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Abstract
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本發明是有關一種壓力偵測器,特別是關於一種利用溫度變化來偵測壓力的熱反應式壓力偵測器。The present invention relates to a pressure detector, in particular to a thermally reactive pressure detector that uses temperature changes to detect pressure.
目前的壓力偵測器可分為三種:利用壓力造成電容變化以偵測壓力的電容式壓力偵測器、利用壓力產生電壓變化以偵測壓力的壓電式壓力偵測器以及利用壓力產生電阻變化以偵測壓力的壓阻式壓力偵測器。現今並沒有利用壓力產生的溫度變化來偵測壓力的壓力偵測器。The current pressure detectors can be divided into three types: capacitive pressure detectors that use pressure to change capacitance to detect pressure, piezoelectric pressure detectors that use pressure to generate voltage changes to detect pressure, and use pressure to generate resistance A piezoresistive pressure detector that changes to detect pressure. Currently, there is no pressure detector that uses temperature changes caused by pressure to detect pressure.
本發明的目的,在於提出一種利用溫度變化來偵測壓力的熱反應式壓力偵測器。The purpose of the present invention is to provide a thermally reactive pressure detector that uses temperature changes to detect pressure.
根據本發明,一種熱反應式壓力偵測器包括一基板、一壓力偵測模組及一參考模組。該壓力偵測模組在該基板上,透過溫度變化來偵測一壓力值,該壓力偵測模組包括一第一熱敏材料、一第一導熱塗層及一第一外殼,該第一外殼與該基板形成一第一容置空間用以容納該第一熱敏材料及該第一導熱塗層,該第一外殼具有一開孔供空氣進入該第一容置空間,該第一容置空間內的該壓力值會影響溫度,該第一導熱塗層再將熱傳遞到該第一熱敏材料,使該第一熱敏材料的電阻值隨該溫度改變,因此可透過偵測該第一熱敏材料的電阻值來判斷該壓力值。該參考模組在該基板上,用以消除環境溫度對該壓力偵模組的影響,該參考模組包括一第二熱敏材料、一第二導熱塗層及一第二外殼,該第二熱敏材料與該第一熱敏材料具有相同的電阻溫度係數,該第二導熱塗層用以將熱傳遞到該第二熱敏材料,該第二外殼與該基板形成封閉且為真空狀態的第二容置空間以容納該第二熱敏材料及該第二導熱塗層,由於該第二容置空間為固定壓力狀態,因此該第二熱敏材料不會受到壓力影響。According to the present invention, a thermally reactive pressure detector includes a substrate, a pressure detection module, and a reference module. The pressure detection module detects a pressure value through temperature changes on the substrate. The pressure detection module includes a first thermal sensitive material, a first thermally conductive coating and a first housing. The first The housing and the substrate form a first accommodating space for accommodating the first heat-sensitive material and the first thermally conductive coating, the first housing has an opening for air to enter the first accommodating space, and the first housing The pressure value in the set space will affect the temperature. The first thermally conductive coating transfers heat to the first heat-sensitive material, so that the resistance value of the first heat-sensitive material changes with the temperature. Therefore, the first heat-sensitive material can be detected by detecting the temperature. The resistance value of the first heat-sensitive material is used to determine the pressure value. The reference module is on the substrate to eliminate the influence of ambient temperature on the pressure detection module. The reference module includes a second heat-sensitive material, a second thermally conductive coating and a second housing. The second The heat-sensitive material has the same temperature coefficient of resistance as the first heat-sensitive material, the second thermally conductive coating is used to transfer heat to the second heat-sensitive material, and the second housing and the substrate form a closed and vacuum state The second accommodating space is for accommodating the second heat-sensitive material and the second thermally conductive coating. Since the second accommodating space is in a fixed pressure state, the second heat-sensitive material will not be affected by pressure.
本發明的該第一熱敏材料及該第二熱敏材料是處在相同環境溫度下,透過第二熱敏材料的電阻值可知道環境溫度對該第一熱敏材料的影響,進而取得該第一熱敏材料中因該壓力值而產生的電阻值變化,根據該電阻值變化可判斷出該壓力值。The first heat-sensitive material and the second heat-sensitive material of the present invention are at the same ambient temperature, and the resistance value of the second heat-sensitive material can know the influence of the ambient temperature on the first heat-sensitive material, and then obtain the The resistance value change in the first thermosensitive material due to the pressure value can be judged according to the resistance value change.
圖1顯示本發明的熱反應式壓力偵測器10的第一實施例,其包括一基板12、一壓力偵測模組14、一參考模組16及一控制電路18,壓力偵測模組14是透過偵測溫度變化來偵測壓力值,參考模組16是用來消除熱反應式壓力偵測器10周遭環境溫度對壓力偵測模組14的影響,使壓力偵測模組14只偵測到因壓力變化而產生的溫度變化,例如使用者手持熱反應式壓力偵測器10時,參考模組16可消除使用者體溫對壓力偵測模組14的影響。壓力偵測模組14包括熱敏材料141、導熱塗層142及外殼143,參考模組16包括熱敏材料161、導熱塗層162及外殼163,熱敏材料141及161位於基板12上,熱敏材料141及161具有相同的電阻溫度係數,因此熱敏材料141及161的電阻值會隨溫度改變,熱敏材料141及161可以是但不限於氧化釩(VOx,x為正整數)。導熱塗層142及162分別覆蓋熱敏材料141及161,導熱塗層142及162是用來將熱傳遞至熱敏材料141及161。外殼143及163設置在基板12上,分別與基板12形成容置空間144及164,熱敏材料141及導熱塗層142是容納在容置空間144中,而熱敏材料161及導熱塗層162是容納在容置空間164中。壓力偵測模組14與參考模組16的結構幾乎相同,差別在於,壓力偵測模組14的外殼143設有一開孔145可供空氣進入容置空間144以量測壓力值,而參考模組16的容置空間161為真空狀態以避免壓力影響到熱敏材料161。控制電路18設置在基板上,施加預設電流I1或預設電壓V1至熱敏材料141及161,再透過偵測熱敏材料141及161上的電壓或電流來判斷熱敏材料141及161的電阻值,進而得到該壓力值。Figure 1 shows a first embodiment of the thermally
根據一氣體公式:P×V=n×R×T,其中P為壓力,V為容器體積,n為氣體分子數,R為理想氣體常數,T為溫度。該氣體公式可修改為:P×V/T = n×R = 常數,因此在容器體積V固定的情況下,該容器內的壓力P與溫度T成正比。由於本發明的壓力偵測模組14的容置空間144的體積V是固定的,因此容置空間144中的溫度T會隨壓力值P變化,導致熱敏材料141的電阻值隨壓力值P變化。參考模組16的容置空間164為固定壓力狀態,故外部壓力無法影響熱敏材料161的電阻值,熱敏材料161的電阻值只受到周遭環境溫度影響,因此能利用熱敏材料161的電阻值來消除熱敏材料141中因環境溫度而產生的變化,以得到熱敏材料141中因壓力值P所產生的電阻值變化量,並根據該電阻值變化量判斷出壓力值P。According to a gas formula: P×V=n×R×T, where P is the pressure, V is the container volume, n is the number of gas molecules, R is the ideal gas constant, and T is the temperature. The gas formula can be modified as: P×V/T = n×R = constant, so when the container volume V is fixed, the pressure P in the container is proportional to the temperature T. Since the volume V of the
圖2顯示本發明的熱反應式壓力偵測器10的第二實施例,在此實施例中,基板12不包括控制電路18,控制電路18是放置在熱反應式壓力偵測器10的外部,控制電路18提供的預設電流I1或預設電壓V1可透過基板12上的導體146及165施加至熱敏材料141及161,也可透過導體146及165偵測熱敏材料141及161的電阻值以判斷壓力值。2 shows a second embodiment of the thermally
圖3顯示控制電路18的實施例,其包括驅動器181、偵測器182及183以及處理電路184。驅動器181提供預設電流I1或預設電壓V1至熱敏材料141及161,熱敏材料141根據預設電流I1或預設壓V1產生電壓V2或電流I2,熱敏材料161根據預設電流I1或預設電壓V1產生電壓V3或電流I3,偵測器182偵測電壓V2或電流I2產生偵測信號S1,偵測器183偵測電壓V3或電流I3產生偵測信號S2,處理電路184根據偵測信號S1及S2判斷壓力值P。處理電路184判斷壓力值P的方式有很多,例如取得偵測信號S1及S2的差值,再透過預設的演算法根據該差值計算出壓力值P,或是透過查表方式根據該差值找出對應壓力值P。FIG. 3 shows an embodiment of the
以上對於本發明之較佳實施例所作的敘述係為闡明之目的,而無意限定本發明精確地為所揭露的形式,基於以上的教導或從本發明的實施例學習而作修改或變化是可能的,實施例係為解說本發明的原理以及讓熟習該項技術者以各種實施例利用本發明在實際應用上而選擇及敘述,本發明的技術思想企圖由之後的申請專利範圍及其均等來決定。The above description of the preferred embodiments of the present invention is for the purpose of clarification, and is not intended to limit the present invention to the disclosed form accurately. Modifications or changes are possible based on the above teachings or learning from the embodiments of the present invention Yes, the embodiments are selected and described in order to explain the principles of the present invention and allow those familiar with the technology to use the present invention in various embodiments in practical applications. The technical ideas of the present invention are intended to be derived from the scope of subsequent patent applications and their equality. Decided.
10:熱反應式壓力偵測器10: Thermal reaction type pressure detector
12:基板12: substrate
14:壓力偵測模組14: Pressure detection module
141:熱敏材料141: heat sensitive material
142:導熱塗層142: Thermally conductive coating
143:外殼143: Shell
144:容置空間144: housing space
145:開孔145: Hole
146:導體146: Conductor
16:參考模組16: Reference module
161:熱敏材料161: Thermal Material
162:導熱塗層162: Thermally conductive coating
163:外殼163: Shell
164:容置空間164: accommodating space
165:導體165: Conductor
18:控制電路18: Control circuit
181:驅動器181: Drive
182:偵測器182: Detector
183:偵測器183: Detector
184:處理電路184: processing circuit
圖1顯示本發明的熱反應式壓力偵測器的第一實施例。
圖2顯示本發明的熱反應式壓力偵測器的第二實施例。
圖3顯示控制電路18的實施例。
Figure 1 shows the first embodiment of the thermally reactive pressure detector of the present invention.
Figure 2 shows a second embodiment of the thermally reactive pressure detector of the present invention.
FIG. 3 shows an embodiment of the
10:熱反應式壓力偵測器 10: Thermal reaction type pressure detector
12:基板 12: substrate
14:壓力偵測模組 14: Pressure detection module
141:熱敏材料 141: heat sensitive material
142:導熱塗層 142: Thermally conductive coating
143:外殼 143: Shell
144:容置空間 144: housing space
145:開孔 145: Hole
16:參考模組 16: Reference module
161:熱敏材料 161: Thermal Material
162:導熱塗層 162: Thermally conductive coating
163:外殼 163: Shell
164:容置空間 164: accommodating space
18:控制電路 18: Control circuit
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1497245A (en) * | 2002-10-23 | 2004-05-19 | 株式会社电装 | Pressure sensing device with temp. sensor |
TW200700708A (en) * | 2005-05-02 | 2007-01-01 | Mks Instr Inc | Heated pressure transducer |
TWI306503B (en) * | 2004-04-19 | 2009-02-21 | Celerity Inc | Pressure sensor device and method |
CN100545583C (en) * | 2005-05-27 | 2009-09-30 | 上海自动化仪表股份有限公司 | A kind of differential pressure, pressure, temperature simultaneously measuring multi-parameter sensor |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1497245A (en) * | 2002-10-23 | 2004-05-19 | 株式会社电装 | Pressure sensing device with temp. sensor |
TWI306503B (en) * | 2004-04-19 | 2009-02-21 | Celerity Inc | Pressure sensor device and method |
TW200700708A (en) * | 2005-05-02 | 2007-01-01 | Mks Instr Inc | Heated pressure transducer |
CN100545583C (en) * | 2005-05-27 | 2009-09-30 | 上海自动化仪表股份有限公司 | A kind of differential pressure, pressure, temperature simultaneously measuring multi-parameter sensor |
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