TWI726815B - Antenna device and manufacturing method thereof - Google Patents

Abstract

An antenna device includes a substrate, a chip, and an antenna. The substrate has a first side, a second side, and at least two through holes wherein the first side and the second side are on the opposite sides of the substrate. The chip is disposed on the first side of the substrate. The chip has at least two pads on the side of the chip facing to the substrate. The at least two pads correspond to the at least two through holes respectively. The antenna is disposed on the second side of the substrate. At least a part of the antenna is located in the at least two through holes. The antenna electrically connects to the at least two pads by the at least two through holes.

Description

Antenna device and manufacturing method thereof

The present invention relates to an antenna device and a manufacturing method thereof, and more particularly to an antenna device with a through hole and a manufacturing method thereof.

With the progress of the times, Radio Frequency Identification (RFID) devices have gradually received attention. Due to the convenience brought by the radio frequency identification device, it is widely used in various fields, such as logistics management, warehouse management, or identity recognition.

At present, in the manufacturing process of some radio frequency identification devices, after the antenna is formed on the antenna substrate, an integrated circuit (IC) chip is placed on the antenna substrate. In this way, there is a gap between the chip and the antenna substrate, which makes the overall thickness of the radio frequency identification device thicker and is prone to problems such as cracking of the IC chip and breakage of the contact between the antenna and the chip. In addition, if IC chips such as plastic integrated circuit chips are used, when the integrated circuit chips are bonded to the antenna substrate, greater pressure and longer bonding time are required than traditional integrated circuit chips. For bonding, there are problems such as excessive pressure, which makes the chip easy to break, the antenna is easily broken, and the thermocompression bonding process takes a long time. Therefore, there is an urgent need for a method that can solve the aforementioned problems.

The present invention provides an antenna device, which can ensure the electrical connection between the antenna and the chip, and can avoid problems such as chip cracking and antenna disconnection.

The present invention also provides a method for manufacturing an antenna device, which can produce an antenna device that can prevent problems such as chip cracking, antenna disconnection, etc., thereby improving the yield of the antenna device.

At least one embodiment of the present invention provides an antenna device including a substrate, a chip, and an antenna. The substrate has opposite first and second surfaces, and at least two through holes. The chip is disposed on the first surface of the substrate, and the surface of the chip facing the substrate has at least two pads respectively corresponding to at least two through holes. The antenna is disposed on the second surface of the substrate, at least a part of the antenna is located in at least two through holes, and the antenna is electrically connected to at least two pads through the at least two through holes.

At least one embodiment of the present invention provides a manufacturing method of an antenna device, which includes steps such as a substrate preparation step, a wafer placement step, and an antenna formation step. In the substrate preparation step, at least two through holes are formed in the substrate, and the substrate has opposite first and second surfaces. In the wafer placement step, the wafer is placed on the first surface on the substrate. The chip has at least two pads corresponding to at least two through holes on the surface facing the substrate. In the antenna forming step, the antenna is formed on the second surface of the substrate. At least a part of the antenna is located in at least two through holes, and the antenna is electrically connected to at least two pads through the at least two through holes.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Throughout the specification, the same reference numerals indicate the same or similar elements. In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on another element," it can be directly on the other element, or intervening elements may also be present. The "electrical connection" of two components to each other can mean that there are other components between the two components.

It should be understood that although the terms "first" and "second" etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or parts should not be affected by Limitations of these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.

The terminology used here is only for the purpose of describing specific embodiments and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a" and "an" are intended to include plural forms, including "at least one." "One of at least two" is intended to mean at least a part of the plural form, the number of which may be singular or plural, and "the other of at least two" means another part other than the aforementioned part, the number of which may be It may be singular or plural. "Or" means "and/or". It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as “lower” or “bottom surface” and “upper” or “top surface” may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper," depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "below" other elements will be oriented "above" the other elements. Thus, the exemplary terms "upper" or "lower" can include an orientation of above and below.

As used herein, "about" or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the error associated with the measurement A specific number (ie, the limit of the measurement system). For example, "about" or "substantially" can mean within one or more standard deviations of the stated value, or within ±30%, 20%, 10%, 5%. Furthermore, the "about" or "substantially" used herein can select a more acceptable deviation range or standard deviation based on optical properties, etching properties, or other properties, and not one standard deviation can be used for all properties.

Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

1A is a schematic top view of an antenna device according to the first embodiment of the present invention; FIG. 1B is a bottom schematic view of an antenna device according to the first embodiment of the present invention; FIG. 1C is along X1-X2 in FIG. 1A A schematic partial cross-sectional view of the line segment; FIG. 1D is a schematic cross-sectional view along the line Y1-Y2 of FIG. 1A. For the convenience of description, the position of the through hole 102 is indicated by a dotted line in FIGS. 1A and 1B. Another dashed line in FIG. 1B indicates the position of the wafer 110.

1A to 1D, the antenna device 10 includes a substrate 100, a chip 110, and an antenna 120. The substrate 100 has a first surface 100 a and a second surface 100 b opposite to each other, and at least two through holes 102. In the plan direction of the antenna device, the through hole 102 penetrates the entire substrate 100. The chip 110 is disposed on the first surface 100a of the substrate 100 and has opposite active surfaces 110a and back surfaces 110b. The antenna 120 is disposed on the second surface 100 b of the substrate 100 relative to the chip 110, and the antenna 120 is bonded to the pad 112 disposed on the active surface 110 a of the chip 110 through the through hole 102.

In this embodiment, the substrate 100 may be a flexible substrate. The material of the substrate 100 may include paper, polyethylene terephthalate (PET), polyvinyl chloride (PVC), plastic film, or other suitable materials, etc., according to those of ordinary skill in the art The design needs to select the material of the substrate 100, and the present invention is not limited to this. For example, when the antenna device 10 is used on a packaging box (such as a milk box, a paper bag, a biscuit bag, etc.), the substrate 100 is, for example, a substrate (such as paper, kraft paper, plastic, etc.) used to form the packaging box.

1C and 1D, the active surface 110a of the chip 110 faces the substrate 100, and the active surface 110a includes at least two pads 112. 1D, the side surface of the pad 112 is separated from the side surface of the chip 110 by a distance D1, and the lower limit of the distance D1 is preferably 0.5 mm, more preferably 1 mm. In addition, the upper limit of the distance D1 is not particularly limited, as long as it is greater than 0 mm. In one embodiment, the distance D1 is, for example, the distance between the dicing lanes when the chip 110 is diced, so as to prevent the pad 112 from being damaged when the chip 110 is diced. On the other hand, it can also avoid the conductive glue overflow when the antenna 120 fills the through hole 102. In this embodiment, the chip 110 may be an integrated circuit component based on plastic, that is, a chip type in which active components and circuits are formed on a flexible substrate such as plastic. The active surface 110a is the formation surface of the integrated circuit including the thin film transistor TFT, etc. In this embodiment, the pad 112 can be used as a contact electrically connected to the internal integrated circuit of the chip 110. The material of the pad 112 includes conductive materials, such as gold, silver, copper, aluminum, molybdenum, titanium, or other metals or alloys containing the foregoing metals.

In this embodiment, the pads 112 of the chip 110 correspond to the through holes 102 of the substrate 100 respectively. For example, when four pads 112 are respectively provided on the four corners of the chip 110, the four through holes 102 are provided in the substrate 100 corresponding to the four pads 112, respectively. As shown in FIG. 1C, in the short-side direction X of the chip 110, two of the pads 112 are, for example, located on a short side of the active surface 110a, and are respectively disposed adjacent to the long side of the chip 110 along the short-side direction X. At both ends, the two through holes 102 overlap the two pads 112 in the top view direction. It should be noted that although the number of pads and the number of through holes on each short side of the chip shown in FIG. 1C are two as an example, the present invention is not limited thereto. In other embodiments, the number of pads and the number of through holes on each short side of the chip can also be 1 or greater than or equal to 2, and the type of the pads can also be adjusted according to different electrical connection methods. It will be explained later. As shown in FIG. 1D, in the longitudinal direction Y of the chip 110, the other pad 112 is located at one end of the active surface 110 a along the longitudinal direction Y, for example, relative to one of the two pads 112 described above.

1B to 1D, the antenna 120 is, for example, a helical coil or other shapes, and both ends of the antenna 120 are electrically connected to the pads 112 of the chip 110 through the through holes 102, respectively. In this embodiment, the two ends of the antenna 120 are specifically described as follows: one end of the antenna 120 is located on the outermost circle of the antenna, and extends inward (in the direction of the innermost circle) from the end of the outermost circle of the coil to cover the substrate A specific line segment across the short side of the chip in the top view direction. This specific line segment will be referred to as the first bonding line segment 122 of the antenna 120; the other end is located on the innermost circle of the antenna and starts from the innermost The end of the loop extends outward (in the direction of the outermost loop), covers the through hole of the substrate, and crosses the specific line of the short side of the chip in the top view direction. This specific line is hereinafter referred to as the second bonding of the antenna 120 Line 124.

In this embodiment, the first bonding wire segment 122 and the second bonding wire segment 124 of the antenna 120 respectively completely cover the through hole 102 of the substrate 100. Furthermore, as shown in FIG. 1B, in the top view direction of the antenna device, the coverage areas of the first bonding wire segment 122 and the second bonding wire segment 124 are respectively larger than the area of the through hole 102. In other words, the through hole 102 is separated from the side surface of the first bonding line segment 122 by a distance D3, and the through hole 102 is separated from the side surface of the second bonding line segment 124 by a distance D4. In this embodiment, the lower limit of the distance D3 is preferably 0.5 mm, more preferably 1 mm. The lower limit of the distance D4 is preferably 0.5 mm, more preferably 1 mm. In addition, the upper limit of the distance D3 and the distance D4 is not particularly limited, as long as it is greater than 0 mm. In this way, the structural strength of the first bonding wire segment 122 and the second bonding wire segment 124 can be increased, and the electrical connection between the antenna 120 and the chip 110 can be ensured. Furthermore, the projected area of the through hole 102 on the substrate 100 is, for example, larger than the projected area of the pad 112 of the chip 110 on the substrate 100. In this way, when the antenna 120 completely covers the through hole 102, the contact area between the antenna 120 and the pad 112 can be ensured, so that the electrical connection between the antenna 120 and the chip 110 can be improved. In this embodiment, the material of the antenna 120 includes conductive materials, such as silver, copper, aluminum, graphene, or other conductive materials. In addition, the width of the first bonding wire segment 122 and the second bonding wire segment 124 of the antenna 120 may also be greater than the width of other parts of the antenna 120. On the second surface 100b of the substrate 100, compared with other parts of the antenna 120, the outermost circle segment as the first bonding line segment 122 and the innermost circle segment as the second bonding line segment 124 have a larger size in the projection direction of the substrate. Therefore, it can ensure that the antenna completely covers the through hole, thereby ensuring the electrical connection between the antenna and the chip, and avoiding defects such as disconnection or rupture of the antenna.

Based on the above, the first bonding wire segment 122 and the second bonding wire segment 124 can ensure that the antenna 120 completely covers the through hole 102, and the contact area between the antenna 120 and the pad 112 can be ensured, and the antenna can also be prevented from disconnecting, etc. The problem is to improve the electrical connection between the antenna 120 and the chip 110.

In this embodiment, there is an adhesive layer between the substrate 100 and the wafer 110.

1A, 1C, and 1D, on the side of the first surface 100a of the substrate 100, the chip 110 can be attached and fixed on the substrate 100 by the adhesive layer 130. The area of the adhesive layer 130 in the projection direction of the substrate is, for example, greater than or equal to or smaller than the area of the wafer 110 in the projection direction of the substrate. In this way, the wafer 110 can be prevented from falling off from the substrate 100. In this embodiment, the material of the adhesive layer 130 includes, for example, adhesive, such as hot melt adhesive or other suitable adhesive materials, but the present invention is not limited thereto.

In this embodiment, the adhesive layer 130 has, for example, a plurality of openings 132 corresponding to the plurality of through holes 102 respectively. In the top view of the antenna device, the opening 132 penetrates the entire adhesive layer 130. Accordingly, the antenna 120 can be bonded to the chip 110 through the through hole 102 and the opening 132.

In this embodiment, the through hole 102 and the opening 132 can be formed in the same manufacturing process. Therefore, the projection of the opening 132 on the substrate 100 and the projection of the through hole 102 on the substrate 100 substantially overlap. In addition, the projected area of the opening 132 on the substrate 100 is, for example, larger than the projected area of the pad 112 on the substrate 100. Thereby, when the antenna 120 is joined to the pad 112 through the through hole 102 and the opening 132, there is no step difference between the through hole 102 and the opening 132, which can ensure that the antenna 120 fills the entire through hole 102 and the opening 132, thereby improving The electrical connection between the antenna 120 and the chip 110.

In some embodiments, when the area of the adhesive layer 130 in the projection direction of the substrate is greater than the area of the wafer 110 in the projection direction of the substrate, the wafer 110 is, for example, buried in a part of the adhesive layer 130 so as to be located between the substrate 100 and the wafer 110 The thickness of the adhesive layer 130 is smaller than that of the adhesive layer 130 located at the periphery of the chip 110. For example, the adhesive layer 130 may further have a groove 134, and the chip 110 is buried in the groove 134, for example. In this way, the adhesive force between the chip 110 and the adhesive layer 130 can be enhanced, and the chip 110 can be prevented from falling off the substrate 100.

In this embodiment, compared with the conventional antenna device, the antenna device 10 has a smaller overall thickness, and the gap between the chip and the substrate during antenna printing is small. For example, compared with the conventional antenna device (thickness greater than 100 μm), the thickness of the antenna device 10 of the present invention only includes the thickness of the substrate 100, the chip 110, the antenna 120, and the adhesive layer 130, so the entire antenna device 10 The thickness can be thinned to 70 μm～80 μm. In addition, the gap between the wafer and the substrate when the antenna 120 is printed is, for example, 23 μm.

2A is a schematic top view of an antenna device according to the second embodiment of the present invention; FIG. 2B is a bottom schematic view of an antenna device according to the second embodiment of the present invention; FIG. 2C is along X1-X2 in FIG. 2A A schematic partial cross-sectional view of the line segment; FIG. 2D is a schematic cross-sectional view along the line Y1-Y2 of FIG. 2A. It must be noted here that the embodiment of FIGS. 2A to 2D uses the element numbers and part of the content of the embodiment of FIGS. 1A to 1D, wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here. For the convenience of description, FIG. 2A and FIG. 2B still show other elements located under the protective layer 210 and the protective layer 210.

2A to 2D, the difference between the antenna device 20 of this embodiment and the antenna device 10 of the first embodiment is that the first surface 100a side of the substrate 100 further has a groove 200 and a protective layer 210; There is also a protective layer 220 on the side of the two sides 100b.

In this embodiment, a groove 200 (first groove) may be further provided in the substrate 100. For example, the first surface 100a of the substrate 100 can be stamped on the first surface 100a of the substrate 100 in the predetermined region of the wafer, for example, to reduce the thickness of the substrate in the predetermined region of the wafer, and the wafer can be formed at the predetermined region of the wafer. The groove 200 for accommodating the wafer 110. In some embodiments, the punching density of the substrate 100 at the groove 200 is greater than the punching density of the substrate 100 at the periphery of the groove 200, but the present invention is not limited thereto. 2C and 2D, there is an included angle θ1 between the sidewall of the groove 200 and the second surface 100b of the substrate 100. For example, the included angle θ1 may be an acute angle, but the invention is not limited to this.

In this embodiment, the through hole 102 of the substrate 100 is, for example, provided in the substrate 100 on the bottom surface 200 b of the groove 200. 2D, for example, the through hole 102 is separated from the sidewall of the groove 200 by a distance D2, and the distance D2 is greater than or equal to 0 mm. For example, the upper limit of the distance D2 is preferably 1.5 mm, more preferably 1 mm.

The wafer 110 is disposed in the groove 200, for example. In FIG. 2D, the description is made by taking an example in which the depth of the groove 200 and the height of the wafer 110 are substantially the same. Furthermore, the depth of the groove is not greater than the thickness of the entire substrate, that is, a certain thickness of the substrate 100 is reserved on the bottom surface 200 b of the groove 200. In addition, the depth of the groove 200 is not limited to be consistent with the thickness of the wafer 110, and can be adjusted according to requirements, and the present invention is not limited thereto. In an embodiment, the depth of the groove 200 is set to be smaller than the thickness of the substrate 100 located outside the groove 200, for example. For example, the depth of the groove 200 is, for example, 16 μm to 20 μm. In this embodiment, the depth of the groove 200 can be set in such a manner that the back surface 110 b of the wafer 110 is substantially aligned with the first surface 100 a of the substrate 100. In other words, the back surface 110b of the chip 110 and the first surface 100a of the substrate 100 may be coplanar. Here, the level difference between the back surface 110b of the chip 110 and the first surface 100a of the substrate 100 is within the standard deviation range, and both can be regarded as "coplanar" as described herein, where the standard deviation range is within ±30%, for example.

In addition, in the planar direction of the antenna device, the groove 200 does not penetrate the entire substrate 100. In other words, the distance between the bottom surface 200b of the groove 200 and the second surface 100b of the substrate 100 is not 0 μm. In one embodiment, the distance between the bottom surface 200b of the groove 200 and the second surface 100b of the substrate 100 is, for example, 16 μm to 20 μm. The residual thickness of the substrate at the groove can be adjusted according to the strength of the substrate. The invention is not limited to this.

In some embodiments, when there is an adhesive layer 130 between the substrate 100 and the chip 110, the adhesive layer 130 may be located on the bottom surface 200 b of the groove 200, and the chip 110 may be attached and fixed in the groove 200. 2D, the opening 132 of the adhesive layer 130 is separated from the sidewall of the groove 200 by a distance D2, and the upper limit of the distance D2 is preferably 1.5 mm, and more preferably less than 1 mm. In addition, the lower limit of the distance D2 is not particularly limited, as long as it is greater than 0 mm.

Based on the above, by providing the above grooves on the substrate, not only the overall thickness of the antenna device 20 can be reduced, but also problems such as the wafer protruding from the substrate and easily damaged during the manufacturing process and affecting the yield rate can be avoided. For example, compared with the conventional antenna device (thickness greater than 100 μm), the thickness of the antenna device 20 of the present invention only includes the thickness of the substrate 100 and the antenna 120, so the overall thickness of the antenna device 20 can be less than 50 μm. degree. In addition, the gap between the wafer and the substrate during antenna printing is, for example, 3 μm to 9 μm, preferably 7 μm.

In this embodiment, the substrate 100 may also optionally include a protective layer.

2A to 2D, on the side of the first surface 100a of the substrate 100, the protective layer 210 covers at least the area where the wafer 110 is formed; on the side of the second surface 100b of the substrate 100, the protective layer 220 covers at least the area where the antenna 120 is formed. area. In other words, the protective layer 210 covers the chip 110 and part of the first surface 100a of the substrate 100, and the protective layer 220 covers the antenna 120 and part of the second surface 100b of the substrate 100. In addition, in the case where the substrate 100 has the groove 200, the covering area of the protective layer 210 is, for example, larger than the area of the groove 200 in the plan direction of the antenna device. Thereby, the chip and the antenna can be protected from being damaged during the manufacturing process, and the chip and the antenna can also be prevented from falling off. In this embodiment, the protective layer 210 and the protective layer 220 include, for example, a printed protective layer or a printed material. For example, when the antenna device 20 is used on a packaging box, the protective layer 210 and the protective layer 220 may be printed layers used for the outer layer of the packaging box, that is, printed materials used for printing trademarks, packaging designs, and the like. In other embodiments, only one of the protective layer 210 and the protective layer 220 may be included, and the present invention is not limited thereto. For example, when the antenna device 20 is applied to the packaging box with the chip 110 side facing the outside of the packaging box, only the protective layer 210 may be formed; when the antenna device 20 is applied to the packaging box with the antenna 120 side facing the outside of the packaging box During the application, only the protective layer 220 may be formed. In this way, the manufacturing steps can be simplified to improve the process efficiency, and the antenna device can be hidden inside the printed layer by the protective layer, thereby protecting the chip or the antenna from damage.

3A is a schematic top view of an antenna device according to the third embodiment of the present invention; FIG. 3B is a bottom schematic view of an antenna device according to the third embodiment of the present invention; FIG. 3C is along X1-X2 in FIG. 3A A schematic partial cross-sectional view of the line segment; FIG. 3D is a schematic cross-sectional view along the line Y1-Y2 of FIG. 3A. It must be noted here that the embodiments of FIGS. 3A to 3D follow the element numbers and part of the content of the embodiments of FIGS. 2A to 2D, wherein the same or similar numbers are used to denote the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.

3A to 3D, the difference between the antenna device 30 of this embodiment and the antenna device 20 of the second embodiment is: in the antenna device 30 of this embodiment, the substrate 100 further has a groove 300 in the area around the chip. This reduces the impact of chip breakage due to external force during the manufacturing process of the antenna device 30. As shown in FIG. 3A, the trench 300 is adjacent to the short side of the wafer 110 and is separated from the wafer 110 by a distance. In this embodiment, the distance between the trench 300 and the wafer 110 is, for example, 2 mm, but the invention is not limited to this. It should be noted that although the number of grooves shown in FIGS. 3A and 3B is two as an example, the present invention is not limited thereto. In other embodiments, the number of grooves may also be one or greater than or equal to two. In this embodiment, the longitudinal extension direction of the trench 300 is, for example, parallel to the short-side direction X of the wafer 110, and the length of the trench 300 is, for example, greater than or equal to the width of the wafer 110. The depth of the trench 300 is, for example, less than or equal to the thickness of the substrate 100. In this embodiment, the trench 300 penetrates the substrate 100, for example. Accordingly, in the manufacturing process, when the wafer position is deviated due to the difference in ductility between the substrate and the wafer, the groove can play a buffer function to prevent the wafer from being pulled and broken, thereby improving the yield of the antenna device. .

4A is a schematic top view of an antenna device according to the fourth embodiment of the present invention; FIG. 4B is a bottom schematic view of an antenna device according to the fourth embodiment of the present invention; FIG. 4C is along X1-X2 in FIG. 4A A schematic partial cross-sectional view of the line segment; FIG. 4D is a schematic cross-sectional view along the line Y1-Y2 of FIG. 4A. It must be noted here that the embodiment of FIGS. 4A to 4D uses the element numbers and part of the content of the embodiment of FIGS. 2A to 2D, wherein the same or similar numbers are used to denote the same or similar elements, and the same is omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here. For convenience of description, the positions of the adhesive layer 430 and the chip 110 are indicated by dotted lines in FIG. 4A.

4A to 4D, the fourth embodiment replaces the adhesive layer 130 of the second embodiment with an adhesive layer 430 (protective adhesive layer). The difference between the adhesive layer 430 of the antenna device 40 of this embodiment and the adhesive layer 130 of the antenna device 20 of the second embodiment is that the adhesive layer 430 is located on the chip 110. Specifically, on the first surface 100a side of the substrate 100, the adhesive layer 430 of the antenna device 40 is located on the chip 110, and the adhesive layer 430, for example, covers the chip 110. In other words, the adhesive layer 430 covers, for example, the back surface 110b of the chip 110 and the side surface thereof. Accordingly, the chip 110 can be fixed on the substrate 100 by the adhesive layer 430, and the chip 110 can be protected from damage. In one embodiment, when the protective layer 210 is not formed, the adhesive layer 430 can replace the protective layer 210 to protect the chip 110.

In addition, when the substrate 100 has the groove 200, the adhesive layer 430 fills the gap between the wafer 110 and the groove 200, for example, and can fix the wafer 110 in the groove 200, thereby ensuring that the wafer 110 will not be self-depressed. The groove 200 falls off.

In this embodiment, compared with the conventional antenna device (thickness greater than 100 μm), the thickness of the antenna device 40 of the present invention only includes the thickness of the substrate 100 and the antenna 120, so the overall thickness of the antenna device 40 can be less than 50 μm. The degree of μm. In addition, the gap between the wafer and the substrate during antenna printing is, for example, 3 μm to 9 μm, preferably 7 μm.

Hereinafter, a manufacturing process of an antenna device according to the fifth embodiment of the present invention will be explained.

5A to 5E are flowcharts of a manufacturing method of an antenna device according to a fifth embodiment of the present invention. It must be noted here that the embodiment of FIGS. 5A to 5E follows the element numbers and part of the content of the embodiment of FIGS. 1A to 1D, wherein the same or similar numbers are used to denote the same or similar elements, and the same is omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here. In this embodiment, the description is made by taking an example that the area of the adhesive layer 130 in the projection direction of the substrate is larger than the area of the wafer 110 in the projection direction of the substrate.

Referring to FIG. 5A, a substrate 100 is provided. Next, corresponding to the predetermined formation area of the wafer in the subsequent steps, an adhesive layer 130 is formed on the first surface 100 a of the substrate 100.

Referring to FIG. 5B, a printing layer 500 is formed on the first surface 100a of the substrate 100. In this embodiment, the printing layer 500 further has an opening 502 to expose a part of the adhesive layer 130. In other words, the printed layer 500 covers a part of the surface 130a of the adhesive layer 130. In this embodiment, the adhesive layer 130 and the opening 502 of the printing layer 500 jointly form a groove shape, that is, the surface 130a of the adhesive layer 130 exposed by the opening 502 is, for example, the bottom of the groove, and the sidewall of the opening 502 is, for example, a recess. The sidewall of the groove. In this embodiment, the material of the printing layer 500 is, for example, printing ink used for printing trademarks, packaging designs, and the like.

Referring to FIG. 5C, corresponding to the predetermined formation area of the pads on the chip, at least one of the through holes 102 of the substrate 100 and the openings 132 of the adhesive layer 130 is formed by die cutting or laser, for example. In this embodiment, the through hole 102 and the opening 132 may be formed simultaneously in the above-mentioned manufacturing process, for example, but the present invention is not limited to this.

Referring to FIG. 5D, the chip 110 is placed on the adhesive layer 130, and the pad 112 of the chip 110 is located in the opening 132 of the adhesive layer 130. In other words, the wafer 110 is disposed in the opening 502 of the printing layer 500. In this embodiment, the printed layer 500 and the adhesive layer 130 jointly form a groove, and the depth of the groove is substantially the same as the depth of the opening 502. For example, the depth of the opening 502 is set to, for example, 10 μm to 20 μm, preferably 10 μm to 15 μm. The level difference between the surface 500a of the printed layer 500 and the back surface 110b of the wafer 110 is set to, for example, 7 μm or less. In an embodiment, the depth of the opening 502 is set equal to the thickness of the wafer 110, for example. Specifically, the distance between the surface 500 a of the printing layer 500 and the surface 130 a of the adhesive layer 130 is substantially equal to the distance between the active surface 110 a of the chip 110 and the back surface 110 b of the chip 110. In other words, the surface 500a of the printing layer 500 and the back surface 110b of the wafer 110 may be coplanar. Here, the level difference between the surface 500a of the printed layer 500 and the back surface 110b of the wafer 110 is within the standard deviation range, and both can be regarded as "coplanar" as described herein, where the standard deviation range is, for example, within ±25%.

Referring to FIG. 5E, an antenna 120 is formed on the second surface 100b of the substrate 100. In this embodiment, the first bonding wire segment 122 and the second bonding wire segment 124 of the antenna 120 fill the through hole 102 and the opening 132 respectively, and are bonded to the pad 112 of the chip 110. So far, the fabrication of the antenna device 50 of this embodiment has been roughly completed.

Based on the above, by providing the above printed layer on the substrate, not only the overall thickness of the antenna device 50 can be reduced, but also the chip can be protected from damage during the manufacturing process to affect the yield, or the bonding between the antenna and the chip can be improved. It is not affected by the topography of the joint surface and avoids disconnection of the antenna.

6A is a schematic top view of an antenna device according to the sixth embodiment of the present invention; FIG. 6B is a bottom schematic view of an antenna device according to the sixth embodiment of the present invention; FIG. 6C is along X1-X2 in FIG. 6A A schematic partial cross-sectional view of the line segment; FIG. 6D is a schematic cross-sectional view along the line Y1-Y2 of FIG. 6A. It must be noted here that the embodiment of FIGS. 6A to 6D uses the element numbers and part of the content of the embodiment of FIGS. 4A to 4D, wherein the same or similar numbers are used to denote the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.

6A to 6D, the difference between the antenna device 60 of this embodiment and the antenna device 40 of the fourth embodiment is that the substrate 100 further has a groove 600 (second groove) on the second surface 100b side thereof, and The protective layer 620 replaces the protective layer 220 of the fourth embodiment.

In this embodiment, the difference between the groove 600 and the groove 200 is that the antenna 120 can be accommodated, and the antenna 120 is disposed on the bottom surface 600 b of the groove 600. 6D, in the longitudinal direction Y, there is an included angle θ2 between the sidewall of the groove 600 and the extending direction of the second surface 100b of the substrate 100. For example, the included angle θ2 may be an acute angle, but the invention is not limited to this.

In this embodiment, the through hole 102 of the substrate 100 is provided in the substrate 100 between the groove 200 and the groove 600, for example.

In FIG. 6D, the description is made by taking an example in which the depth of the groove 600 and the height of the antenna 120 are substantially the same. In other embodiments, the depth of the groove 600 is not limited to be consistent with the thickness of the antenna 120, and can be adjusted according to requirements, and the present invention is not limited thereto. For example, the depth of the groove 600 is, for example, 5 μm to 15 μm, preferably 10 μm to 12 μm. In this embodiment, the depth of the groove 600 can be set in such a way that the surface of the antenna 120 is substantially aligned with the second surface 100 b of the substrate 100. In other words, the surface of the antenna 120 and the second surface 100b of the substrate 100 may be coplanar. Here, the level difference between the surface of the antenna 120 and the second surface 100b of the substrate 100 is within the standard deviation range, which can be regarded as "coplanar" as described herein, where the standard deviation range is, for example, within ±30%.

In other embodiments, the groove 600 may also be applied to the foregoing embodiments, and the present invention is not limited thereto. For example, the antenna device 20 of the second embodiment may also have a groove 600 on the side of the second surface 100 b of the substrate 100.

In this embodiment, the difference between the protective layer 620 and the protective layer 220 of the fourth embodiment is that the covering area of the protective layer 620 in the top view direction is at least larger than the area of the groove 600. Thereby, the antenna can be protected from being damaged during the manufacturing process, and the antenna can also be prevented from falling off from the groove 600.

In this embodiment, compared with the conventional antenna device (thickness greater than 100 μm), the thickness of the antenna device 60 of the present invention only includes the thickness of the substrate 100, so the overall thickness of the antenna device 60 can be less than 30 μm. . In addition, the gap between the wafer and the substrate during antenna printing is, for example, 0 μm to 7 μm, preferably 0 μm.

Hereinafter, embodiments that can be applied to the pads in the above-mentioned embodiments and the circuit structure that can be applied to a chip will be exemplified, but the present invention is not limited to the following embodiments.

7A is a schematic top view of a wafer according to the seventh embodiment of the present invention; FIG. 7B is a schematic top view of a wafer according to the eighth embodiment of the present invention; FIG. 8 is a schematic view of a wafer according to the ninth embodiment of the present invention Schematic diagram of the circuit structure. It must be noted here that the embodiment of FIG. 7A, FIG. 7B, and FIG. 8 use the element numbers and part of the content of the embodiment of FIG. 1A to FIG. 1D, wherein the same or similar reference numbers are used to indicate the same or similar elements, and The description of the same technical content is omitted. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.

7A, the pads of the chip 110 include, for example, a plurality of pads LA1 and a plurality of pads LB1, wherein in the long side direction Y of the chip 110, the plurality of pads LA1 are located on a short side of the chip 110, and The multiple pads LB1 are located on the other short side of the chip 110. Here, the structure of the pad LA1 and the pad LB1 is similar to the pad 112 in any of the foregoing embodiments, and will not be repeated here. It should be noted that although the number of the pad LA1 and the number of the pad LB1 shown in FIG. 7A is two as an example, the present invention is not limited thereto. In other embodiments, the number of pads LA1 and LB1 can also be greater than or equal to two.

In one embodiment, corresponding to the plurality of pads LA1 and the plurality of pads LB1, the same number of through holes can be formed in the substrate, and the projected area of the through holes on the substrate is, for example, larger than that of the pad LA1 or the pad LB1 The projected area. For example, corresponding to two pads LA1 and two pads LB1, four through holes are formed and the pads LA1 and LB1 are exposed, but the invention is not limited to this. Thereby, both ends of the antenna 120 are respectively connected to the plurality of pads LA1 and the plurality of pads LB1 through the through holes, and are electrically connected to the driving circuit in the chip 110, so that one of the pads LA1 and the pads LB1 can be made One is used as the input and the other is used as the output.

Referring to FIG. 7B, the pads of the chip 110 include, for example, a pad LA2 and a pad LB2. In the long-side direction Y of the chip 110, the pad LA2 is located on a short side of the chip 110, and the pad LB2 is located on the chip 110 On the other short side. The pad LA2 and the pad LB2 are, for example, elongated pads extending along the short side direction X of the chip 110. For example, the pad LA2 and the pad LB2 may be elongated pads with a length less than the width of the chip 110. In this way, the contact area between the pad 112 of the chip 110 and the antenna 120 can be increased.

In one embodiment, corresponding to the pad LA2 and the pad LB2, through holes of the same shape can be formed in the substrate, and the projected area of the through hole on the substrate is, for example, larger than the projected area of the pad LA2 or the pad LB2. For example, corresponding to the elongated pad LA2 and the pad LB2, a elongated through hole is formed, and the pad LA2 and the pad LB2 are exposed, but the present invention is not limited thereto. Thereby, both ends of the antenna 120 are respectively connected to the pad LA2 and the pad LB2 through the through holes, and are electrically connected to the driving circuit in the chip 110, so that one of the pad LA2 and the pad LB2 can be used as an input The other is the output terminal.

Referring to FIG. 7, the pads LA on the chip 110 are, for example, the above-mentioned multiple pads LA1 or LA2, and the pads LB are, for example, the above-mentioned multiple pads LB1 or LB2, but the present invention is not limited thereto. One of the pad LA and the pad LB may be used as an input terminal, and the other may be used as an output terminal, for example. In this embodiment, the circuit structure 700 is coupled to the chip 110 via the pad LA and the pad LB, for example, and is connected in parallel with the capacitor C. The capacitor C is, for example, a tuning capacitor (Tuning Capacitor). In an embodiment, the circuit structure 700 may include a radio frequency block 710 and a digital block 720. The radio frequency block 710 includes, for example, a rectifier (Rectifier) 712 and a modulator (Modulator) 714, and the digital block 720 includes, for example, a clock generator (Clock Generator) 722, a memory array (Memory Array) 724, and a digital controller ( Digital Controller) 726, etc., but the present invention is not limited to this. In this embodiment, for example, the pad LA is used as the input terminal to receive the input signal from the circuit structure 700 and the pad LB is used as the output terminal to output the signal to the circuit structure 700. After receiving the signal through the antenna, the signal can be output to the circuit structure 700 through the pad LB, and the circuit structure 700 uses the radio frequency block 710 and the digital block 720 to rectify, modulate, write or read the signal, etc. deal with. After the signal is processed, the circuit structure 700 can output the processed signal to the pad LA.

Hereinafter, a manufacturing process of an antenna device according to an embodiment of the present invention will be described. The following content is described in a roll-to-roll process, but the present invention is not limited to this.

9A is a flowchart of a manufacturing method of an antenna device according to a tenth embodiment of the present invention; FIG. 9B is a partial perspective view of the manufacturing method of FIG. 9A.

9A and 9B, the substrate preparation steps include step S100, step S102, step S104, step S106, step S108, and so on.

In step S100, the substrate (raw material substrate) is input into the printing device by a feed roller. In this embodiment, the substrate is, for example, paper, polyethylene terephthalate, polyvinyl chloride, plastic film, or other suitable materials, and the present invention is not limited thereto. For example, when the antenna device is to be used on a packaging box (such as milk cartons, paper bags, biscuit bags, etc.), the substrate can be the same as the substrate used to form the packaging box (such as paper, kraft paper, plastic, etc.) material.

In step S102, the alignment mark 802 is printed on the substrate and the adhesive layer 810 is formed corresponding to the predetermined formation area of the wafer in the subsequent step. In this embodiment, the adhesive layer 810 is, for example, hot melt adhesive or other suitable adhesive materials. In some embodiments, the adhesive layer 810 may further have a groove (for example, the groove 134 of FIG. 1C).

In some embodiments, a groove may be formed in the substrate before the adhesion layer 810 is formed. For example, a groove 200 as shown in FIG. 2A can be formed on the subsequent side of the substrate to be loaded with the chip corresponding to the predetermined formation area of the chip; in addition, the groove 200 as shown in Figure 2A can also be further formed on the other side of the substrate to be subsequently loaded with the antenna. For the groove 600 of 6B, for the detailed description of this part, please refer to the description of the groove 200 and the groove 600, which will not be repeated here. In the case of forming a groove like the groove 200 of FIG. 2A, for example, an adhesive layer 810 is formed in the groove. The method of forming the groove is, for example, thinning the substrate thickness of the predetermined formation area of the chip or the antenna by stamping, stamping, etc., and forming a groove capable of accommodating the chip or the antenna at the predetermined formation area, but the present invention is not limited to this.

Next, in step S104, the adhesive layer 810 is dried to cure the adhesive layer 810. In this embodiment, the method of drying the adhesive layer 810 is not particularly limited, as long as it does not fall off due to subsequent manufacturing processes.

In step S106, a through hole 804 is formed in the substrate by, for example, a punching process or the like. The through hole 804 penetrates the entire substrate and the adhesive layer 810 and corresponds to the predetermined formation area of the pad on the chip. In other words, the adhesive layer 810 has openings respectively corresponding to the through holes 804, so that when the chip is subsequently placed, the adhesive layer 810 can expose the pads of the chip. It should be noted that although the number of through holes shown in FIG. 9B is 4 as an example and they are located near the four corners of the adhesive layer 810, the number and position of the through holes can be adjusted according to the type of the pad. This is limited. In an embodiment, when the substrate is formed with a groove, the lower limit of the distance between the through hole 804 and the side wall of the groove is preferably 1 mm, more preferably 1.5 mm. The upper limit of the distance between the through hole 804 and the side wall of the groove is not particularly limited, as long as it is greater than 0 mm.

In an embodiment, it is also possible to form a trench (not shown) in the substrate at the same time during the punching process, or to form the trench (not shown) by cutting the substrate, for example. Corresponding to the predetermined formation area of the wafer in the subsequent steps, the length of the groove is, for example, greater than or equal to the width of the wafer predetermined formation area, and the depth of the groove is, for example, less than or equal to the thickness of the substrate. On the short side adjacent to the predetermined formation area of the wafer, the groove is spaced apart from the predetermined formation area of the wafer. For example, the distance between the groove and the predetermined formation area of the wafer is about 2 mm. The longitudinal extension direction of the groove is, for example, parallel to the rolling direction of the take-up drum 900, in other words, the longitudinal extension direction of the groove is, for example, parallel to the moving direction of the substrate. Accordingly, in the subsequent manufacturing process, when the wafer position deviation caused by the difference in ductility between the substrate and the wafer occurs, the groove can play a buffer function to prevent the wafer from being pulled and broken, thereby improving the yield of the antenna device. .

Then, in step S108, the substrate 800 (semi-finished substrate) with the alignment mark 802, the through hole 804 and the adhesive layer 810 is taken up by the take-up roller 900, and the subsequent steps are performed in the bonding equipment.

In some embodiments, between step S104 and step S106, through the manufacturing process shown in FIGS. 5A to 5E, a printed layer with an opening is formed on the substrate, and the opening exposes, for example, part of the adhesive层810.

10A and 10B are schematic diagrams of the next step of FIGS. 9A and 9B. For ease of description, the position of the through hole 804 is indicated by a dotted line in FIG. 10B.

10A and 10B, the wafer placement step includes step S110, step S112, step S114, step S116, step S118, and so on.

In step S110, the substrate 800 to be wound up in step S108 is input into the bonding device with the surface 800a facing upwards, so that the surface 800a of the substrate 800 faces the subsequent member for placing the wafer. In one embodiment, the bonding equipment is, for example, a flip chip bonding machine (Flip Chip Bonding Machine).

In step S112, pick up the chip 820 on the wafer and turn it over 180 degrees so that the pads (not shown) of the chip 820 face down. The chip 820 may include more than two pads, wherein the pads are disposed on the active surface of the chip 820. For example, the pads may be the pads LA1 and LB1 as shown in FIG. 7A, or the pads LA2 and LB2 as shown in FIG. 7B, etc. The configuration of the pads can be adjusted according to design requirements. The present invention Not limited to this. In this embodiment, the chip 820 may be an integrated circuit component based on plastic, that is, a chip type in which active components and circuits are formed on a flexible substrate such as plastic. The active surface of the chip 820 is the formation surface of integrated circuits including thin film transistors, TFTs, etc., and the pads can be used as contacts that are electrically connected to the internal integrated circuits of the chip 820. The material of the pad includes conductive materials, such as gold, silver, copper, aluminum, molybdenum, titanium, or other metals or alloys containing the foregoing metals.

In step S114, the chip 820 is placed on the surface 800a of the substrate 800 with the active surface facing the substrate 800, and the pads of the chip 820 correspond to the through holes 804. In other words, the through holes 804 expose the pads of the chip 820 and can be electrically connected in the subsequent manufacturing process.

In one embodiment, for example, the chip 820 is placed on the adhesive layer 810 in such a way that there is an angle between the short side direction X of the chip 820 and the moving direction of the substrate. The angle between the short-side direction X of the wafer 820 and the moving direction of the substrate is less than or equal to 45 degrees, preferably 0 degrees. In other words, the short-side direction X of the wafer 820 and the moving direction of the substrate are preferably parallel to each other. Because the larger the contact area between the receiving roller and the wafer, the easier it is to cause the subsequent bending angle of the wafer during the subsequent winding of the wafer, causing the friction between the receiving roller and the wafer surface to be too large, or increasing the impact of the wafer by the receiving roller And other issues, which in turn caused damage to the chip. However, by placing the chip 820 with an angle between the short-side direction X of the chip 820 and the moving direction of the substrate, the force path of the chip in the rolling direction is shorter, and the bending angle of the chip is smaller, which can be larger. This greatly reduces the chance of chip damage, thereby improving yield. In contrast, if the short-side direction X of the wafer 820 and the moving direction of the substrate are perpendicular to each other, the measured yield rate is extremely low, for example, less than 10%.

In some embodiments, when the surface 800a of the substrate 800 further has a groove, the wafer 820 is placed in the groove, for example. According to this, not only can the thickness of the antenna device to be formed later be reduced, but also problems such as the wafer protruding from the substrate can be easily damaged in the subsequent manufacturing process, which affects the yield.

Next, in step S116, the wafer 820 is pressed and fixed. In this embodiment, the method of pressing and fixing is, for example, hot pressing. After the adhesive layer 810 is heated and melted, the wafer 820 is fixed on the substrate 800 via the adhesive layer 810.

Then, in step S118, the substrate 800 on which the wafer 820 is placed is taken up by the take-up roller 900, and the subsequent steps are performed in the printing equipment.

11A and 11B are schematic diagrams of the next step of FIGS. 10A and 10B. For the convenience of description, the position of the through hole 804 is indicated by a dotted line in FIG. 11B.

Referring to FIG. 11A and FIG. 11B, the antenna formation steps include step S120, step S122, step S124, step S126, and so on.

In step S120, the substrate 800 that will be rolled up in step S118, that is, the substrate 800 on which the wafer 820 is placed, is input into the printing device with the surface 800b facing upwards, so that the surface 800b of the substrate 800 faces the subsequent use The component that forms the antenna.

In step S122, the antenna 830 is printed. In this embodiment, the antenna 830 is formed on the surface 800b of the substrate 800 relative to the chip 820, and the antenna 830 is, for example, a helical coil or other shapes. In this embodiment, the material of the antenna 830 is, for example, conductive silver nano ink, graphene ink, or other conductive materials. Methods of printing the antenna 830 include, for example, Letterpress Printing, Gravure Printing, Screen Printing, Lithography, or Thermal Transfer. However, the present invention does not Limited to this.

Both ends of the antenna 830 are electrically connected to the pads of the chip 820 through the through holes 804, respectively. In the top view of the antenna device, where the antenna 830 is electrically connected to the chip 820 via the through hole 804, the projected area of the antenna 830 on the substrate 800 is, for example, larger than the projected area of the through hole 804 on the substrate 800. In other words, the antenna 830 fills the entire through hole 804, and covers the surface 800b of the substrate 800 located around the through hole 804, for example.

On the other hand, the projected area of the through hole 804 on the substrate 800 is, for example, larger than the projected area of the pad of the chip 820 on the substrate 800. Therefore, when the antenna 830 fills the entire through hole 804, the contact area between the antenna 830 and the pad can be ensured, and the electrical connection between the antenna 830 and the chip 820 can be improved.

In an embodiment, the antenna 830 may include a first bonding wire segment 122 and a second bonding wire segment 124 like the antenna 120 of FIG. 1A. For related description, please refer to the above-mentioned embodiment, and will not be repeated here.

Next, in step S124, the antenna 830 is dried, and the antenna 830 is cured. In this embodiment, the method for drying the antenna 830 includes, for example, thermal curing, light curing, or air-drying curing, etc., but the present invention is not limited thereto. In one embodiment, after curing the antenna 830, a protective layer (such as the protective layer 220 in FIG. 2B or the protective layer 620 in FIG. 6B) may be formed thereon. So far, the fabrication of the antenna device 60 of this embodiment has been roughly completed. Finally, in step S126, the antenna device 60 is wound up.

In this embodiment, since the thickness of the antenna device 60 only includes the thickness of the substrate 800, the adhesive layer 810, the chip 820, and the antenna 830, the overall thickness of the fixed antenna device 60 can be reduced to 70 μm-80 μm. In some embodiments, when the wafer 820 is placed in the groove, the overall thickness of the antenna device 60 can be less than 50 μm. In other embodiments, when grooves are formed on both sides of the substrate, the overall thickness of the antenna device 60 can be less than 30 μm. Accordingly, compared with the traditional antenna device (thickness greater than 100 μm), not only the overall thickness of the antenna device is greatly reduced, but also problems such as the chip or the antenna protruding from the substrate and easily damaged in the subsequent manufacturing process and affecting the yield rate can be avoided. . In addition, compared with the traditional antenna device manufacturing method, in the manufacturing method of the antenna device 60 of the present invention, for example, a thermal compression bonding process using anisotropic conductive paste (Anisotropic Conductive Paste, ACP), etc., is not required, so there are fewer steps. , And can improve the process efficiency.

FIG. 12 is a flowchart of a manufacturing method of an antenna device according to an eleventh embodiment of the present invention.

12, the difference between the manufacturing method of the eleventh embodiment and the manufacturing method of the tenth embodiment is: the manufacturing method of the eleventh embodiment is the manufacturing process of the antenna device in the same roll-to-roll machine station. In other words, for example, steps S108, S118, and S120 of the tenth embodiment can be omitted. In this way, the process efficiency can be improved. For the part of the technical description omitted from step S200 to step S220, please refer to the related content of FIG. 9A, FIG. 10A, and FIG. 11A, which will not be repeated here.

FIG. 13 is a flowchart of a manufacturing method of an antenna device according to a twelfth embodiment of the present invention. It must be noted here that the embodiment of FIG. 13 uses the reference numerals and part of the content of the embodiment of FIG. 12, wherein the same or similar reference numerals are used to indicate the same or similar processes, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.

Please refer to FIG. 13, the difference between the manufacturing method of the twelfth embodiment and the manufacturing method of the eleventh embodiment is that step S213 is further included after step S212 and before step S214. Specifically, in step S202', corresponding to the predetermined formation area of the wafer in the subsequent steps, an alignment mark is printed or a groove is formed on the substrate without forming an adhesive layer here, so the steps of the eleventh embodiment are also omitted. S204. Next, after placing the wafer on the substrate (step S212), an adhesive layer is formed on the wafer (step S213), and the wafer is pressed and fixed (step S214).

In this embodiment, the adhesive layer, for example, covers the chip. In other words, the adhesive layer, for example, covers the surface of the wafer and its side surfaces. Accordingly, the chip can be fixed on the substrate by the adhesive layer, and the chip can be protected from damage.

In one embodiment, when the chip is placed in the groove, the adhesive layer, for example, fills the gap between the chip and the groove, and the chip can be fixed in the groove to ensure that the chip does not come from the groove. Fall off.

14 is a perspective schematic view of a manufacturing method of an antenna device according to a thirteenth embodiment of the present invention, in which the same component symbols as in FIG. 9B, FIG. 10B, and FIG. 11B are used to represent the same or similar components, and omitted Part of the technical description, such as the size, material, function, etc. of each layer or area, can refer to the related content of FIG. 9B, FIG. 10B, and FIG.

Please refer to FIG. 14, for example, the manufacturing method of the above-mentioned embodiment can be repeated to form a plurality of antenna devices 60 on the substrate. For example, in one embodiment, step S102 or step S202 can be repeated during the substrate preparation step to form multiple adhesive layers on the substrate, and then step S112 and step S114 or step S210 can be repeated during the wafer placement step. Same as step S212, to place a plurality of chips on the adhesive layer, and then repeat step S122 or step S216 during the antenna forming step to form a plurality of antennas on the side of the substrate opposite to the chip. In another embodiment, step S213 in FIG. 13 can be used instead of step S102 or step S202 to form a plurality of adhesive layers on the wafer, but the invention is not limited to this.

In summary, the antenna device of the present invention has a plurality of through holes in the substrate, and the antenna is electrically connected to the chip through the through holes, so that the electrical connection between the antenna and the chip can be ensured, and the antenna can be prevented from disconnecting, etc. Problems, and further improve the yield of the antenna device. Moreover, in the manufacturing method of the antenna device of the present invention, by forming a plurality of through holes in the substrate, and the antenna is electrically connected to the chip through the through holes, the electrical connection between the antenna and the chip can be ensured, and the antenna can be avoided. Problems such as disconnection occur, thereby improving the yield of the antenna device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

10, 20, 30, 40, 50, 60, 70: antenna device 100, 800: substrate 100a: First side 100b: second side 102, 804: through hole 110, 820: chip 110a: active side 110b: back 112: pad 120, 830: antenna 122: first joint line segment 124: Second joint line segment 130, 430, 810: Adhesive layer 130a, 500a, 800a, 800b: surface 132: Opening 134, 200, 600: groove 200b, 600b: bottom surface 210, 220, 620: protective layer 300: groove 500: printing layer 502: open 700: circuit structure 710: RF block 712: Rectifier 714: Modulator 720: digital block 722: Clock Generator 724: Memory Array 726: Digital Controller 802: Counterpoint 900: Receiving drum C: Capacitance D1, D2, D3, D4: distance LA, LA1, LA2, LB, LB1, LB2: pad S100～S126, S200～S220: steps X: Short-side direction Y: Long side direction θ1, θ2: included angle

FIG. 1A is a schematic top view of an antenna device according to the first embodiment of the present invention. Fig. 1B is a schematic bottom view of an antenna device according to the first embodiment of the present invention. Fig. 1C is a schematic partial cross-sectional view of the line X1-X2 in Fig. 1A. Fig. 1D is a schematic cross-sectional view of the line Y1-Y2 in Fig. 1A. 2A is a schematic top view of an antenna device according to a second embodiment of the invention. 2B is a schematic bottom view of an antenna device according to the second embodiment of the present invention. Fig. 2C is a schematic partial cross-sectional view of the line X1-X2 in Fig. 2A. Fig. 2D is a schematic cross-sectional view of the line Y1-Y2 in Fig. 2A. 3A is a schematic top view of an antenna device according to a third embodiment of the present invention. 3B is a schematic bottom view of an antenna device according to the third embodiment of the present invention. Fig. 3C is a schematic partial cross-sectional view of the line X1-X2 in Fig. 3A. Fig. 3D is a schematic cross-sectional view of the line Y1-Y2 in Fig. 3A. 4A is a schematic top view of an antenna device according to a fourth embodiment of the present invention. 4B is a schematic bottom view of an antenna device according to the fourth embodiment of the present invention. Fig. 4C is a schematic partial cross-sectional view of the line X1-X2 in Fig. 4A. Fig. 4D is a schematic cross-sectional view of the line Y1-Y2 in Fig. 4A. 5A to 5E are flowcharts of a manufacturing method of an antenna device according to a fifth embodiment of the present invention. FIG. 6A is a schematic top view of an antenna device according to a sixth embodiment of the present invention. Fig. 6B is a schematic bottom view of an antenna device according to a sixth embodiment of the present invention. Fig. 6C is a schematic partial cross-sectional view of the line X1-X2 in Fig. 6A. Fig. 6D is a schematic cross-sectional view of the line Y1-Y2 in Fig. 6A. Fig. 7A is a schematic top view of a wafer according to a seventh embodiment of the present invention. Fig. 7B is a schematic top view of a wafer according to an eighth embodiment of the present invention. FIG. 8 is a schematic diagram of a circuit structure of a chip according to a ninth embodiment of the present invention. 9A, 10A, and 11A are flowcharts of a manufacturing method of an antenna device according to a tenth embodiment of the present invention. 9B, 10B, and 11B are partial three-dimensional schematic diagrams of a manufacturing method of an antenna device according to a tenth embodiment of the present invention. FIG. 12 is a flowchart of a manufacturing method of an antenna device according to an eleventh embodiment of the present invention. FIG. 13 is a flowchart of a manufacturing method of an antenna device according to a twelfth embodiment of the present invention. FIG. 14 is a schematic perspective view of a manufacturing method of an antenna device according to a thirteenth embodiment of the present invention.

100: substrate

100a: First side

100b: second side

102: Through hole

110: chip

110a: active side

110b: back

112: pad

120: Antenna

122: first joint line segment

124: Second joint line segment

130: Adhesive layer

132: Opening

134: Groove

D1, D3, D4: distance

Y: Long side direction

Claims (20)

An antenna device, including: The substrate has a first surface and a second surface opposite to each other, and at least two through holes; A chip disposed on the first surface of the substrate, and the chip has at least two pads corresponding to the at least two through holes on the surface facing the substrate; and An antenna disposed on the second surface of the substrate, at least a part of the antenna is located in the at least two through holes, and the antenna is connected to the at least two pads through the at least two through holes Electrical connection. The antenna device according to claim 1, wherein the antenna has a first bonding wire segment and a second bonding wire segment electrically connected to the at least two pads, and the first bonding wire segment is located at the outermost portion of the antenna And completely cover one of the at least two through holes, and the second bonding wire segment is located at the innermost circle of the antenna and completely covers the other of the at least two through holes. The antenna device according to claim 1, further comprising: The adhesive layer is located between the substrate and the chip. The antenna device according to claim 3, wherein the area of the adhesive layer is larger than the area of the chip, The chip is buried in a part of the adhesion layer, so that the thickness of the adhesion layer between the substrate and the chip is smaller than the thickness of the adhesion layer on the periphery of the chip, The adhesive layer has at least two openings respectively corresponding to the at least two through holes. The antenna device according to claim 1, which further includes: The protective adhesive layer is disposed on the chip, and the protective adhesive layer covers the chip, The area of the protective adhesive layer is larger than the area of the chip. The antenna device according to claim 1, wherein the substrate further has a first groove for accommodating the chip on the first surface, There is an included angle between the side wall of the first groove and the second surface of the substrate, and the included angle is an acute angle, The at least two through holes are arranged in the substrate on the bottom surface of the first groove. The antenna device according to claim 6, wherein the substrate further has a second groove for accommodating the antenna on the second surface, The at least two through holes are arranged in the substrate between the first groove and the second groove. The antenna device according to claim 1, which further includes: A protective layer is disposed on at least one of the chip and the antenna, and the projected area of the protective layer on the substrate is larger than that of at least one of the chip and the antenna on the substrate shadow area. The antenna device according to claim 1, which further includes: A printing layer located on the first surface of the substrate, The printed layer has an opening, the wafer is located in the opening, and the level difference between the surface of the printed layer and the back surface of the wafer is 7 μm or less. The antenna device according to any one of claim 1 to claim 9, wherein the substrate further includes a groove, The groove is adjacent to the short side of the wafer and is separated from the wafer by a distance, The length of the groove is greater than or equal to the width of the wafer. A manufacturing method of an antenna device includes: In the substrate preparation step, at least two through holes are formed in the substrate, the substrate having opposite first and second surfaces; In the wafer placing step, the substrate is moved in a roll-to-roll manner, and the wafer is placed on the first surface of the substrate, and the surface of the wafer facing the substrate has a surface corresponding to the at least two channels respectively. At least two pads of the hole; and In the antenna forming step, an antenna is formed on the second surface of the substrate, at least a part of the antenna is located in the at least two through holes, and the antenna is connected to the at least two through holes through the at least two through holes. The pads are electrically connected. The method for manufacturing an antenna device according to claim 11, wherein an included angle is formed between the short side direction of the wafer and the moving direction of the substrate, and the included angle is less than or equal to 45 degrees. The method for manufacturing an antenna device according to claim 11, wherein the antenna has a first bonding wire segment and a second bonding wire segment that are electrically connected to the at least two pads, respectively, The first bonding wire segment is located at the outermost circle of the antenna and traverses the short side direction of the chip in a manner of completely covering one of the at least two through holes, and the second bonding wire segment is located at the antenna The innermost ring, and spans the short side direction of the chip in a manner of completely covering the other of the at least two through holes. The method for manufacturing an antenna device according to claim 11, wherein the substrate preparation step further includes: An adhesive layer is formed on the predetermined formation area of the wafer of the substrate. The method of manufacturing an antenna device according to claim 14, wherein the area of the adhesive layer is larger than the area of the chip, In the wafer placement step, the wafer is buried in a part of the adhesive layer, so that the thickness of the adhesive layer between the substrate and the wafer is smaller than that of the adhesive layer at the periphery of the wafer thickness of, The adhesive layer has at least two openings respectively corresponding to the at least two through holes, so that the adhesive layer exposes the at least two pads of the chip. The method for manufacturing an antenna device according to claim 11, wherein after the chip placing step and before the antenna forming step, the method further includes: Forming a protective adhesive layer on the chip, the protective adhesive layer covering the chip, The area of the protective adhesive layer is larger than the area of the chip. The method for manufacturing an antenna device according to claim 11, wherein the substrate preparation step further includes: The first groove forming step is to form a first groove in the first surface of the substrate corresponding to a predetermined formation area of the wafer, There is an included angle between the side wall of the first groove and the second surface of the substrate, and the included angle is an acute angle, The at least two through holes are arranged in the substrate on the bottom surface of the first groove. The method for manufacturing an antenna device according to claim 17, wherein the substrate preparation step further includes: The second groove forming step is to form a second groove in the second surface of the substrate corresponding to a predetermined formation area of the antenna, The at least two through holes are provided in the substrate between the first groove and the second groove. The method for manufacturing an antenna device according to claim 11, wherein the substrate preparation step further includes: In the groove forming step, a groove is formed in the substrate adjacent to the short side of the predetermined formation area of the wafer, and the groove is separated from the predetermined formation area by a distance. The method of manufacturing an antenna device according to claim 11, wherein in the antenna forming step, a first bonding wire segment and a second bonding wire segment electrically connected to the at least two pads are formed, and the first bonding The line segment is located at the outermost circle of the antenna and completely covers one of the at least two through holes. The second bonding line segment is located at the innermost circle of the antenna and completely covers the other of the at least two through holes. By.

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