TWI726537B - Bending damage detection apparatus for flexible display panel - Google Patents
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本發明是有關於一種顯示裝置,且特別是有關於一種可撓顯示面板的彎折損壞偵測裝置。The present invention relates to a display device, and more particularly to a bending damage detection device of a flexible display panel.
越來越多顯示裝置採用可撓顯示面板。舉例來說,一些手機的顯示面板可以被彎折或捲曲。無論如何,頻繁地彎折可撓顯示面板一段時間後將會造成可撓顯示面板發生損壞。More and more display devices use flexible display panels. For example, the display panel of some mobile phones can be bent or curled. In any case, frequent bending of the flexible display panel will cause damage to the flexible display panel after a period of time.
本發明提供一種彎折損壞偵測裝置,以偵測可撓顯示面板的彎折損壞狀況。The invention provides a bending damage detection device to detect the bending damage condition of a flexible display panel.
在一實施例中,所述彎折損壞偵測裝置包括第一像素單元以及處理電路。第一像素單元被配置在可撓顯示面板中。第一像素單元包括第一發光元件、第一光波導層與第一光感測元件。第一發光元件位於第一光波導層的第一端,而第一光感測元件位於第一光波導層的第二端。第一光感測元件在偵測期間通過第一光波導層感測第一發光元件的光,以獲得第一光感測結果。可撓顯示面板的封裝材料被配置在第一光波導層上,且在第一發光元件與第一光感測元件之間。處理電路耦接至第一光感測元件,以接收第一光感測結果。In one embodiment, the bending damage detection device includes a first pixel unit and a processing circuit. The first pixel unit is configured in the flexible display panel. The first pixel unit includes a first light emitting element, a first optical waveguide layer and a first light sensing element. The first light emitting element is located at the first end of the first optical waveguide layer, and the first light sensing element is located at the second end of the first optical waveguide layer. The first light-sensing element senses the light of the first light-emitting element through the first optical waveguide layer during the detection period to obtain a first light-sensing result. The packaging material of the flexible display panel is arranged on the first optical waveguide layer and between the first light-emitting element and the first light-sensing element. The processing circuit is coupled to the first light sensing element to receive the first light sensing result.
在一實施例中,所述彎折損壞偵測裝置包括像素單元以及處理電路。像素單元被配置在可撓顯示面板中。像素單元包括發光元件、光波導層與光感測元件。發光元件位於光波導層的第一端,而光感測元件位於光波導層的第二端。光感測元件在偵測期間通過光波導層感測發光元件的光,以獲得光感測結果。可撓顯示面板的封裝材料被配置在發光元件與第一光感測元件之間。封裝材料包括至少一下層與至少一上層。光波導層的部份或全部被配置在所述至少一下層與所述至少一上層之間。處理電路耦接至光感測元件,以接收光感測結果。In one embodiment, the bending damage detection device includes a pixel unit and a processing circuit. The pixel unit is configured in the flexible display panel. The pixel unit includes a light emitting element, an optical waveguide layer and a light sensing element. The light emitting element is located at the first end of the optical waveguide layer, and the light sensing element is located at the second end of the optical waveguide layer. The light-sensing element senses the light of the light-emitting element through the optical waveguide layer during the detection period to obtain a light-sensing result. The packaging material of the flexible display panel is arranged between the light emitting element and the first light sensing element. The packaging material includes at least a lower layer and at least one upper layer. Part or all of the optical waveguide layer is arranged between the at least lower layer and the at least one upper layer. The processing circuit is coupled to the light sensing element to receive the light sensing result.
在一實施例中,所述彎折損壞偵測裝置包括多個像素單元以及一個處理電路。這些像素單元被配置在可撓顯示面板中。這些像素單元的每一個包括發光元件、光波導層與光感測元件。發光元件位於光波導層的第一端,而光感測元件位於光波導層的第二端。光感測元件在偵測期間通過光波導層感測發光元件的光,以獲得光感測結果。可撓顯示面板的封裝材料被配置在發光元件與第一光感測元件之間。封裝材料包括至少一下層與至少一上層。光波導層的部份或全部被配置在所述至少一下層與所述至少一上層之間。其中,這些像素單元的所述至少一下層具有不同高度。處理電路耦接至這些像素單元的光感測元件,以接收這些像素單元的光感測結果。In one embodiment, the bending damage detection device includes a plurality of pixel units and a processing circuit. These pixel units are arranged in the flexible display panel. Each of these pixel units includes a light-emitting element, an optical waveguide layer, and a light-sensing element. The light emitting element is located at the first end of the optical waveguide layer, and the light sensing element is located at the second end of the optical waveguide layer. The light-sensing element senses the light of the light-emitting element through the optical waveguide layer during the detection period to obtain a light-sensing result. The packaging material of the flexible display panel is arranged between the light emitting element and the first light sensing element. The packaging material includes at least a lower layer and at least one upper layer. Part or all of the optical waveguide layer is arranged between the at least lower layer and the at least one upper layer. Wherein, the at least lower layers of these pixel units have different heights. The processing circuit is coupled to the light sensing elements of the pixel units to receive the light sensing results of the pixel units.
基於上述,可撓顯示面板具有至少一個像素單元,用以偵測彎折損壞狀況。像素單元的光感測元件在偵測期間可以通過光波導層感測發光元件的光,以獲得光感測結果。彎折的應力可以通過可撓顯示面板的封裝材料而施加在像素單元的光波導層。在頻繁地彎折可撓顯示面板一段時間後,彎折的應力可能會損壞封裝材料與光波導層。在光波導層損壞後,發光元件的光便難以(或無法)到達光感測元件。因此,處理電路可以依據光感測元件的光感測結果來判斷光波導層的彎折損壞狀況,進而推知可撓顯示面板的封裝材料的彎折損壞狀況。Based on the above, the flexible display panel has at least one pixel unit for detecting bending damage. The light sensing element of the pixel unit can sense the light of the light emitting element through the optical waveguide layer during the detection period to obtain a light sensing result. The bending stress can be applied to the optical waveguide layer of the pixel unit through the packaging material of the flexible display panel. After frequently bending the flexible display panel for a period of time, the bending stress may damage the packaging material and the optical waveguide layer. After the optical waveguide layer is damaged, it is difficult (or impossible) for the light of the light emitting element to reach the light sensing element. Therefore, the processing circuit can determine the bending damage condition of the optical waveguide layer according to the light sensing result of the light sensing element, and then infer the bending damage condition of the packaging material of the flexible display panel.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
在本案說明書全文(包括申請專利範圍)中所使用的「耦接(或連接)」一詞可指任何直接或間接的連接手段。舉例而言,若文中描述第一裝置耦接(或連接)於第二裝置,則應該被解釋成該第一裝置可以直接連接於該第二裝置,或者該第一裝置可以透過其他裝置或某種連接手段而間接地連接至該第二裝置。本案說明書全文(包括申請專利範圍)中提及的「第一」、「第二」等用語是用以命名元件(element)的名稱,或區別不同實施例或範圍,而並非用來限制元件數量的上限或下限,亦非用來限制元件的次序。另外,凡可能之處,在圖式及實施方式中使用相同標號的元件/構件/步驟代表相同或類似部分。不同實施例中使用相同標號或使用相同用語的元件/構件/步驟可以相互參照相關說明。The term "coupling (or connection)" used in the full text of the specification of this case (including the scope of the patent application) can refer to any direct or indirect connection means. For example, if it is described in the text that the first device is coupled (or connected) to the second device, it should be interpreted as that the first device can be directly connected to the second device, or the first device can be connected through other devices or some This kind of connection means is indirectly connected to the second device. The terms "first" and "second" mentioned in the full text of the description of this case (including the scope of the patent application) are used to name the element (element), or to distinguish different embodiments or ranges, and are not used to limit the number of elements The upper or lower limit of is not used to limit the order of components. In addition, wherever possible, elements/components/steps with the same reference numbers in the drawings and embodiments represent the same or similar parts. Elements/components/steps that use the same reference numerals or use the same terms in different embodiments may refer to related descriptions.
圖1是依照本發明的一實施例的一種彎折損壞偵測裝置100的電路方塊(circuit block)示意圖。圖1所示彎折損壞偵測裝置100具有至少一個像素單元110。像素單元110被配置在可撓顯示面板10中,用以偵測可撓顯示面板10的封裝材料的彎折損壞狀況。依照設計需求,在一些實施例中,像素單元110可以被配置在可撓顯示面板10的顯示區中。所述顯示區又稱為活動區(active area)。在另一些實施例中,像素單元110可以被配置在可撓顯示面板10的顯示區外。FIG. 1 is a schematic diagram of a circuit block of a bending
圖2是依照本發明的一實施例說明圖1所示像素單元110的電路方塊示意圖。圖3是依照本發明的一實施例說明圖1所示像素單元110的布局的俯視示意圖。圖4是依照本發明的一實施例說明圖1所示像素單元110的布局的剖面示意圖。請參照圖1至圖4。像素單元110包括發光元件111、光波導層114與光感測元件112。FIG. 2 is a schematic block diagram illustrating the circuit of the
發光元件111的第一端耦接至開關SW1。發光元件111的第二端耦接至參考電壓Vref(例如接地電壓或是其他固定電壓)。依照設計需求,發光元件111可以是任何發光元件。舉例來說,發光元件111可以是發光二極體(light emitting diode, LED)、有機發光二極體(organic light emitting diode, OLED)或是其他發光元件。發光元件111位於光波導層114的第一端。The first end of the
發光元件111的光可以進入光波導層114。依照設計需求,光波導層114的材質可以是任何導光材質。舉例來說,光波導層114可以是可撓顯示面板10的半導體層。在一些實施例中,所述半導體層可以是可撓顯示面板10的低溫多晶矽(Low Temperature Poly-Silicon, LTPS)層。The light of the
依照設計需求,光感測元件112可以是任何光感測器。舉例來說,光感測元件112可以是光敏電阻、光二極體、光電晶體或是其他光感測器。光感測元件112位於光波導層114的第二端。依照設計需求,電容113可以選擇性地配置在像素單元110中。電容113的第一端與光感測元件112的第一端耦接至開關SW2。電容113的第二端與光感測元件112的第二端耦接至節點ND。依照設計需求,節點ND可以是浮接(floating),或是耦接至參考電壓(例如接地電壓或是其他固定電壓)。According to design requirements, the
在偵測期間,光感測元件112可以通過光波導層114來感測發光元件111的光,以獲得光感測結果。依照設計需求,「偵測期間」可以是任何時段。舉例來說,在一些實施例中,「偵測期間」可以是可撓顯示面板10的正常操作期間。在另一些實施例中,「偵測期間」可以是可撓顯示面板10在開機後的初始化期間。在又一些實施例中,「偵測期間」可以是可撓顯示面板10被彎折的初期(或是末期)。在又一些實施例中,「偵測期間」可以是可撓顯示面板10被攤平的初期(或是末期)。在其他實施例中,當可撓顯示面板10被攤平時,以及當可撓顯示面板10被彎折時,彎折損壞偵測裝置100都會進入所述偵測期間。During the detection period, the
在偵測期間,閘極線G的控制訊號可以導通(turn on)開關SW1與開關SW2。當開關SW1導通時,源極線S的電壓(或電流)可以被傳輸至發光元件111,使得發光元件111發光至光波導層114。當開關SW2導通時,光感測元件112可以將光感測結果傳輸至感測線L。在非偵測期間,閘極線G的控制訊號可以截止(turn off)開關SW1與開關SW2。During the detection period, the control signal of the gate line G can turn on the switch SW1 and the switch SW2. When the switch SW1 is turned on, the voltage (or current) of the source line S may be transmitted to the
可撓顯示面板10的封裝材料11被配置在光波導層114上。在圖4所示實施例中,可撓顯示面板10的封裝材料11被配置在發光元件111與光感測元件112之間。在圖3所示實施例中,可撓顯示面板10的封裝材料11更覆蓋在光感測元件112上。在圖2所示實施例中,可撓顯示面板10的封裝材料11更覆蓋在發光元件111與光感測元件112上。The
在偵測期間,光感測元件112可以通過光波導層114來感測發光元件111的光,以獲得光感測結果。處理電路120耦接至像素單元110的光感測元件112,以接收光感測結果。處理電路120可以依據光感測元件112的光感測結果判斷可撓顯示面板10的彎折損壞狀況。During the detection period, the
當可撓顯示面板10被彎折時,彎折的應力會施加於可撓顯示面板10的封裝材料。因此,彎折的應力可以通過可撓顯示面板10的封裝材料11而施加在像素單元110的光波導層114。在頻繁地彎折可撓顯示面板10一段時間後,彎折的應力可能會損壞封裝材料11與光波導層114。在光波導層114損壞後,發光元件111的光便難以(或無法)到達光感測元件112。因此,處理電路120可以依據光感測元件112的光感測結果來判斷光波導層114的彎折損壞狀況,進而推知可撓顯示面板10的封裝材料的彎折損壞狀況。When the
圖5是依照本發明的一實施例說明圖1所示像素單元110的布局的俯視示意圖。圖6是依照本發明的一實施例說明圖5所示像素單元110_1~110_6的訊號時序示意圖。在圖5所示實施例中,多個像素單元110可以被配置在可撓顯示面板10的顯示區外,以便偵測可撓顯示面板10的封裝材料的彎折損壞狀況。這些像素單元110可以呈環狀而圍繞在可撓顯示面板10的顯示區的週邊。圖5左側繪示了環狀像素單元110的局部放大示意圖。在局部放大示意圖中,這些像素單元110包括像素單元110_1、110_2、110_3、110_4、110_5與110_6。這些像素單元110_1~110_6的每一個可以參照圖3所示像素單元110的相關說明,故不再贅述。FIG. 5 is a schematic top view illustrating the layout of the
閘極線G1(可以參照圖3所示閘極線G)耦接至像素單元110_1、110_2與110_3。閘極線G2(可以參照圖3所示閘極線G)耦接至像素單元110_4、110_5與110_6。源極線S1(可以參照圖3所示源極線S)耦接至像素單元110_1與110_4。源極線S2(可以參照圖3所示源極線S)耦接至像素單元110_2與110_5。源極線S3(可以參照圖3所示源極線S)耦接至像素單元110_3與110_6。感測線L1(可以參照圖3所示感測線L)耦接至像素單元110_1。感測線L2(可以參照圖3所示感測線L)耦接至像素單元110_4。感測線L3(可以參照圖3所示感測線L)耦接至像素單元110_2。感測線L4(可以參照圖3所示感測線L)耦接至像素單元110_5。感測線L5(可以參照圖3所示感測線L)耦接至像素單元110_3。感測線L6(可以參照圖3所示感測線L)耦接至像素單元110_6。The gate line G1 (refer to the gate line G shown in FIG. 3) is coupled to the pixel units 110_1, 110_2, and 110_3. The gate line G2 (refer to the gate line G shown in FIG. 3) is coupled to the pixel units 110_4, 110_5, and 110_6. The source line S1 (refer to the source line S shown in FIG. 3) is coupled to the pixel units 110_1 and 110_4. The source line S2 (refer to the source line S shown in FIG. 3) is coupled to the pixel units 110_2 and 110_5. The source line S3 (refer to the source line S shown in FIG. 3) is coupled to the pixel units 110_3 and 110_6. The sensing line L1 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_1. The sensing line L2 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_4. The sensing line L3 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_2. The sensing line L4 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_5. The sensing line L5 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_3. The sensing line L6 (refer to the sensing line L shown in FIG. 3) is coupled to the pixel unit 110_6.
對於平板承受彎矩而產生彎折變形,平板上部分(彎折外側面)承受拉伸,平板的下部分(彎折內側面)承受壓縮。在平板的上面與下面之間有一個平面,其縱向長度不變(沒有拉伸也沒有壓縮),此平面稱為平板的中立面。此中立面跟任何斷面平面所交的線稱為斷面的中性軸(neutral axis)。為了將可撓顯示面板10的電性元件(例如像素電路)遭受彎折損壞的可能性降到最低,可撓顯示面板10的電性元件可以盡可能地被配置在可撓顯示面板10的中性軸(中立面)。在圖4所示實施例中,光波導層114可以盡可能地被配置在可撓顯示面板10的中性軸(中立面)附近。For the flat plate to be bent and deformed due to the bending moment, the upper part of the flat plate (the bent outer side) is subjected to tension, and the lower part of the plate (the bent inner side) is subjected to compression. There is a plane between the upper and lower sides of the slab, the longitudinal length of which is constant (no stretch or compression). This plane is called the neutral plane of the slab. The line intersecting this neutral plane with any section plane is called the neutral axis of the section. In order to minimize the possibility of the electrical components (such as pixel circuits) of the
光波導層114與中性軸(中立面)之間的距離可以稱為中性軸距離。中性軸距離越遠,光波導層114越容易遭受彎折損壞。基於這樣的特性,在多個像素單元110中,不同像素單元110的中性軸距離可以互不相同。以圖5所示像素單元110_1~110_6為例,像素單元110_1~110_3的中性軸距離可以互不相同。舉例來說,像素單元110_1的布局的剖面可以參照圖4所示,像素單元110_2的布局的剖面可以參照圖7所示,而像素單元110_3的布局的剖面可以參照圖8所示。The distance between the
圖7所示開關SW3可以參照圖4所示開關SW1的相關說明來類推。圖7所示發光元件711可以參照圖4所示發光元件111的相關說明來類推。圖7所示光感測元件712可以參照圖4所示光感測元件112的相關說明來類推。圖7所示光波導層714可以參照圖4所示光波導層114的相關說明來類推。在圖7所示實施例中,封裝材料11包括至少一下層與至少一上層,光波導層714的部份或全部被配置在所述至少一下層與所述至少一上層之間,如圖7所示。圖4所示布局具有較小的中性軸距離(光波導層114與中性軸之間的距離),而圖7所示布局具有較大的中性軸距離(所述至少一下層的高度)。The switch SW3 shown in FIG. 7 can be analogized with reference to the related description of the switch SW1 shown in FIG. 4. The light-emitting
圖8所示開關SW4可以參照圖4所示開關SW1的相關說明來類推。圖8所示發光元件811可以參照圖4所示發光元件111的相關說明來類推。圖8所示光感測元件812可以參照圖4所示光感測元件112的相關說明來類推。圖7所示光波導層814可以參照圖4所示光波導層114的相關說明來類推。在圖8所示實施例中,封裝材料11包括至少一下層與至少一上層,光波導層814的部份或全部被配置在所述至少一下層與所述至少一上層之間,如圖8所示。圖7所示布局具有較小的中性軸距離(所述至少一下層的高度),而圖8所示布局具有較大的中性軸距離(所述至少一下層的高度)。The switch SW4 shown in FIG. 8 can be analogized with reference to the related description of the switch SW1 shown in FIG. 4. The light-emitting
這些像素單元110_1~110_3具有不同的中性軸距離。中性軸距離越大,光波導層所遭受的彎折的應力(拉伸力或壓縮力)越大,致使光波導層越容易損壞。因此,這些像素單元110_1~110_3可以針對對可撓顯示面板10的封裝材料11的彎折損壞狀況提供預警機制。處理電路120可以依據像素單元110_1~110_3的光感測結果(這些像素單元110_1~110_3中已經損壞的像素單元數量)來判斷可撓顯示面板10的彎折損壞狀況。處理電路120可以依據這些像素單元110_1~110_3中已經損壞的像素單元數量來判斷可撓顯示面板10的彎折損壞狀況。These pixel units 110_1 to 110_3 have different neutral axis distances. The greater the distance of the neutral axis, the greater the bending stress (tensile or compressive force) that the optical waveguide layer is subjected to, and the more easily the optical waveguide layer is damaged. Therefore, these pixel units 110_1 to 110_3 can provide an early warning mechanism for the bending damage of the
舉例來說,當這些像素單元110_1~110_3的光波導層都良好時,處理電路120可以判斷可撓顯示面板10的封裝材料11的彎折損壞狀況為「良好」。當這些像素單元110_1~110_2的光波導層都良好但是像素單元110_3的光波導層為損壞時,處理電路120可以判斷可撓顯示面板10的封裝材料11的彎折損壞狀況為「將要損壞」。當像素單元110_1的光波導層為良好但是這些像素單元110_2~110_3的光波導層都損壞時,處理電路120可以判斷可撓顯示面板10的封裝材料11的彎折損壞狀況為「可能損壞」。當像素單元110_1~110_3的光波導層都損壞時,處理電路120可以判斷可撓顯示面板10的封裝材料11的彎折損壞狀況為「已經損壞」。For example, when the optical waveguide layers of the pixel units 110_1 to 110_3 are all good, the
圖9是依照本發明的另一實施例說明圖5所示可撓顯示面板10的環狀像素單元110的局部放大示意圖。圖9所示實施例包括像素單元110_91、110_92、110_93、110_94、110_95與110_96。圖9所示像素單元110_91、110_92、110_93、110_94、110_95與110_96可以參照圖5所示像素單元110_1、110_2、110_3、110_4、110_5與110_6的相關說明,圖9所示閘極線G1、閘極線G2、源極線S1、源極線S2、源極線S3、感測線L1、感測線L2、感測線L3、感測線L4、感測線L5與感測線L6可以參照圖5的相關說明,故不再贅述。FIG. 9 is a partial enlarged schematic diagram illustrating the ring-shaped
圖10是依照本發明的又一實施例說明圖5所示可撓顯示面板10的環狀像素單元110的局部放大示意圖。圖11是依照本發明的一實施例說明圖10所示像素單元110_1~110_6的訊號時序示意圖。圖10所示像素單元110_1、110_2、110_3、110_4、110_5與110_6可以參照圖5的相關說明,圖10所示閘極線G1、閘極線G2、源極線S1、源極線S2與源極線S3可以參照圖5的相關說明,故不再贅述。在圖10所示實施例中,感測線L11(可以參照圖3所示感測線L)耦接至像素單元110_1與110_4。感測線L22(可以參照圖3所示感測線L)耦接至像素單元110_2與110_5。感測線L33(可以參照圖3所示感測線L)耦接至像素單元110_3與110_6。FIG. 10 is a partially enlarged schematic diagram illustrating the ring-shaped
圖12是依照本發明的另一實施例說明一種彎折損壞偵測裝置的電路方塊示意圖。圖12所示彎折損壞偵測裝置具有呈環狀排列的多個像素單元110。圖12所示像素單元110可以參照圖5至圖11的相關說明來類推,故不再贅述。圖12所示彎折損壞偵測裝置還具有處理電路1220、彎折感測器1230與驅動電路1240。圖12所示處理電路1220可以參照圖1所示處理電路120的相關說明來類推,故不再贅述。FIG. 12 is a circuit block diagram illustrating a bending damage detection device according to another embodiment of the present invention. The bending damage detection device shown in FIG. 12 has a plurality of
請參照圖12,驅動電路1240可以驅動可撓顯示面板10,以顯示影像於顯示區。所述顯示區又稱為活動區(active area)。基於處理電路1220控制,驅動電路1240可以提供掃描訊號給像素單元110的閘極線(可以參照圖2、圖3所示閘極線G,也可以參照圖5、圖9、圖10所示閘極線G1~G2)。驅動電路1240還可以提供驅動電壓(電流)給像素單元110的源極線(可以參照圖2、圖3所示源極線S,也可以參照圖5、圖9、圖10所示源極線S1~S3)。基於驅動電路1240對像素單元110的掃描時序,處理電路1220可以從像素單元110的感測線(可以參照圖2、圖3所示感測線L,也可以參照圖5、圖9、圖10所示感測線L1~L6)獲得光感測元件的光感測結果。Referring to FIG. 12, the
請參照圖12,彎折感測器1230被配置在可撓顯示面板10中。彎折感測器1230可以偵測可撓顯示面板10有無被彎折,以獲得感測結果。處理電路1220耦接至彎折感測器1230,以接收所述感測結果。依照設計需求,彎折感測器1230可以包括光感測器、微動開關或是其他感測器。Please refer to FIG. 12, the bending
圖13是依照本發明的一實施例說明圖12所示可撓顯示面板10被攤平(但還沒完全攤平)的側視示意圖。當可撓顯示面板10從捲曲(彎折)狀態被打開(攤平)時,彎折感測器1230感測到環境光而輸出感測結果給處理電路1220。當彎折感測器1230的感測結果表示可撓顯示面板10被打開(攤平)時,處理電路1220可以對像素單元110進行一次光感測(亦即,通過光感測元件偵測光波導層以獲得光感測結果)。FIG. 13 is a schematic side view illustrating that the
圖14是依照本發明的一實施例說明圖12所示可撓顯示面板10被捲曲(彎折)的側視示意圖。當可撓顯示面板10從打開(攤平)狀態被捲曲(彎折)時,彎折感測器1230感測不到環境光而輸出感測結果給處理電路1220。當彎折感測器1230的感測結果表示可撓顯示面板10被捲曲(彎折)時,處理電路1220可以對像素單元110進行另一次光感測(亦即,通過光感測元件偵測光波導層以獲得光感測結果)。FIG. 14 is a schematic side view illustrating that the
依照不同的設計需求,上述處理電路與(或)驅動電路的方塊的實現方式可以是硬體(hardware)、韌體(firmware)、軟體(software,即程式)或是前述三者中的多者的組合形式。According to different design requirements, the blocks of the processing circuit and/or the driving circuit can be implemented in hardware, firmware, software, or more of the three. The combination form.
綜上所述,可撓顯示面板10具有至少一個像素單元110,用以偵測可撓顯示面板10的封裝材料的彎折損壞狀況。像素單元110的光感測元件在偵測期間可以通過光波導層感測發光元件的光,以獲得光感測結果。彎折的應力可以通過可撓顯示面板10的封裝材料11而施加在像素單元110的光波導層。在頻繁地彎折可撓顯示面板10一段時間後,彎折的應力可能會損壞封裝材料11與光波導層。在光波導層損壞後,發光元件的光便難以(或無法)到達光感測元件。因此,處理電路可以依據光感測元件的光感測結果來判斷光波導層的彎折損壞狀況,進而推知可撓顯示面板10的封裝材料的彎折損壞狀況。In summary, the
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
10:可撓顯示面板10: Flexible display panel
11:封裝材料11: Packaging materials
100:彎折損壞偵測裝置100: bending damage detection device
110、110_1、110_2、110_3、110_4、110_5、110_6、110_91、110_92、110_93、110_94、110_95、110_96:像素單元110, 110_1, 110_2, 110_3, 110_4, 110_5, 110_6, 110_91, 110_92, 110_93, 110_94, 110_95, 110_96: pixel unit
111、711、811:發光元件111, 711, 811: light-emitting element
112、712、812:光感測元件112, 712, 812: light sensing element
113:電容113: Capacitance
114、714、814:光波導層114, 714, 814: optical waveguide layer
120、1220:處理電路120, 1220: processing circuit
1230:彎折感測器1230: Bend sensor
1240:驅動電路1240: drive circuit
G、G1、G2:閘極線G, G1, G2: gate line
L、L1、L2、L3、L4、L5、L6、L11、L22、L33:感測線L, L1, L2, L3, L4, L5, L6, L11, L22, L33: sensing line
ND:節點ND: Node
S、S1、S2、S3:源極線S, S1, S2, S3: source line
SW1、SW2、SW3、SW4:開關SW1, SW2, SW3, SW4: switch
Vref:參考電壓Vref: reference voltage
圖1是依照本發明的一實施例的一種彎折損壞偵測裝置的電路方塊(circuit block)示意圖。 圖2是依照本發明的一實施例說明圖1所示像素單元的電路方塊示意圖。 圖3是依照本發明的一實施例說明圖1所示像素單元的布局的俯視示意圖。 圖4是依照本發明的一實施例說明圖1所示像素單元的布局的剖面示意圖。 圖5是依照本發明的一實施例說明圖1所示像素單元的布局的俯視示意圖。 圖6是依照本發明的一實施例說明圖5所示像素單元的訊號時序示意圖。 圖7是依照本發明的另一實施例說明圖5所示像素單元的布局的剖面示意圖。 圖8是依照本發明的又一實施例說明圖5所示像素單元的布局的剖面示意圖。 圖9是依照本發明的另一實施例說明圖5所示可撓顯示面板的環狀像素單元的局部放大示意圖。 圖10是依照本發明的又一實施例說明圖5所示可撓顯示面板的環狀像素單元的局部放大示意圖。 圖11是依照本發明的一實施例說明圖10所示像素單元的訊號時序示意圖。 圖12是依照本發明的另一實施例說明一種彎折損壞偵測裝置的電路方塊示意圖。 圖13是依照本發明的一實施例說明圖12所示可撓顯示面板被攤平(但還沒完全攤平)的側視示意圖。 圖14是依照本發明的一實施例說明圖12所示可撓顯示面板被捲曲(彎折)的側視示意圖。 FIG. 1 is a schematic diagram of a circuit block of a bending damage detection device according to an embodiment of the present invention. FIG. 2 is a schematic block diagram illustrating the circuit of the pixel unit shown in FIG. 1 according to an embodiment of the present invention. FIG. 3 is a schematic top view illustrating the layout of the pixel unit shown in FIG. 1 according to an embodiment of the present invention. 4 is a schematic cross-sectional view illustrating the layout of the pixel unit shown in FIG. 1 according to an embodiment of the present invention. FIG. 5 is a schematic top view illustrating the layout of the pixel unit shown in FIG. 1 according to an embodiment of the present invention. 6 is a schematic diagram illustrating the signal timing of the pixel unit shown in FIG. 5 according to an embodiment of the present invention. FIG. 7 is a cross-sectional schematic diagram illustrating the layout of the pixel unit shown in FIG. 5 according to another embodiment of the present invention. FIG. 8 is a cross-sectional schematic diagram illustrating the layout of the pixel unit shown in FIG. 5 according to another embodiment of the present invention. FIG. 9 is a partial enlarged schematic diagram illustrating the ring-shaped pixel unit of the flexible display panel shown in FIG. 5 according to another embodiment of the present invention. FIG. 10 is a partial enlarged schematic diagram illustrating the ring-shaped pixel unit of the flexible display panel shown in FIG. 5 according to another embodiment of the present invention. FIG. 11 is a schematic diagram illustrating the signal timing of the pixel unit shown in FIG. 10 according to an embodiment of the present invention. FIG. 12 is a circuit block diagram illustrating a bending damage detection device according to another embodiment of the present invention. FIG. 13 is a schematic side view illustrating that the flexible display panel shown in FIG. 12 is flattened (but not completely flattened) according to an embodiment of the present invention. FIG. 14 is a schematic side view illustrating that the flexible display panel shown in FIG. 12 is rolled (bent) according to an embodiment of the present invention.
11:封裝材料 11: Packaging materials
111:發光元件 111: light-emitting element
112:光感測元件 112: light sensing element
114:光波導層 114: optical waveguide layer
SW1:開關 SW1: switch
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