TWI726506B - Sensing device substrate - Google Patents

Abstract

A sensing device substrate including a substrate, at least one opening and a sensing device is provided. The substrate has a first surface and a second surface opposite to each other. At least one opening is disposed on the first surface of the substrate. The sensing device is disposed on the second surface of the substrate and is overlapped with at least one opening.

Description

Sensing element substrate

The present invention relates to an optical sensing technology, and particularly relates to a sensing element substrate.

The development of optical sensing technology has opened up the possibility of diversified applications, such as smart bracelets, electronic products equipped with fingerprint recognition (such as laptops, smart phones, etc.), and even display panels with optical touch functions. Its traces can be seen. Although the light sources, sensing elements, and detection targets used in the sensing technologies of these products are different, how to improve the sensitivity of optical sensing is a common problem that related manufacturers must solve.

For example, in the existing fingerprint recognition technology, when light is irradiated on the fingerprint of the finger, the height fluctuations of the fingerprint will cause different degrees of reflected light field. Therefore, different fingerprint appearances will be distinguished by the sensing element. However, the sensing element is likely to fail to sense correctly due to insufficient reflected light or inconspicuous fingerprint dents, which causes the user to need to repeat the sensing to successfully recognize the fingerprint, which causes inconvenience in operation.

The invention provides a sensing element substrate with better sensing sensitivity.

The sensing element substrate of the present invention includes a substrate, at least one opening, and a sensing element. The substrate has a first surface and a second surface opposite to each other. At least one opening is provided on the first surface of the substrate. The sensing element is arranged on the second surface of the substrate and overlaps at least one opening.

In an embodiment of the present invention, the substrate of the above-mentioned sensing element substrate further has sidewalls defining openings. There is an included angle between the sidewall and the second surface of the substrate, and the included angle is between 30 degrees and 80 degrees.

In an embodiment of the present invention, the aforementioned sensing element substrate further includes a metal reflective layer. The substrate also has sidewalls defining the openings, and the metal reflective layer covers the sidewalls of the openings.

In an embodiment of the present invention, the above-mentioned opening of the sensing element substrate has a depth in a direction perpendicular to the first surface, the vertical projection of the area occupied by the opening on the substrate has a width, and the ratio of the depth to the width is Between 5 and 20.

In an embodiment of the present invention, the aforementioned sensing element substrate further includes a metal reflective layer. The at least one opening is a first opening and a second opening. The substrate further has a first side wall defining a first opening and a second side wall defining a second opening, and the metal reflective layer covers the first side wall, the second side wall, and a part of the first side wall between the first side wall and the second side wall. surface.

In an embodiment of the present invention, the aforementioned sensing element substrate further includes a switching element, which is disposed on the second surface of the substrate and is electrically connected to the sensing element.

In an embodiment of the present invention, the above-mentioned switching element of the sensing element substrate does not overlap at least one opening.

In an embodiment of the present invention, the sensing element of the aforementioned sensing element substrate includes a sensing layer, a first electrode layer, and a second electrode layer. The sensing layer overlaps at least one opening. The first electrode layer is disposed between the sensing layer and the substrate. The second electrode layer is electrically connected to the switching element. The sensing layer is located between the first electrode layer and the second electrode layer.

In an embodiment of the present invention, the aforementioned sensing element substrate further includes a black matrix layer disposed on the substrate, and the sensing element is located between the substrate and the black matrix layer.

In an embodiment of the present invention, the aforementioned sensing element substrate further includes a color filter layer, and the black matrix layer is located between the sensing element and the color filter layer.

In an embodiment of the present invention, the above-mentioned openings of the sensing element substrate are blind holes.

In an embodiment of the present invention, the opening of the aforementioned sensing element substrate extends from the first surface to the second surface of the substrate.

In an embodiment of the present invention, the aforementioned sensing element substrate is suitable for use in a display panel, and the display panel further includes a pixel array substrate and a display medium layer. The sensing element is located between the substrate and the pixel array substrate, and the display medium layer is disposed between the pixel array substrate and the sensing element substrate.

Based on the foregoing, in the sensing element substrate of an embodiment of the present invention, by providing overlapping openings and sensing elements on opposite sides of the substrate, the light reflected by the target can be collimated and incident at a desired angle. The sensing element helps to improve the sensing sensitivity of the sensing element substrate.

As used herein, "approximately", "approximately", "essentially", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account all The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or, for example, within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, "about", "approximately", "essentially", or "substantially" used in this article can be based on measurement properties, cutting properties, or other properties to select a more acceptable deviation range or standard deviation. Not one standard deviation applies to all properties.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connection" can refer to physical and/or electrical connection. Furthermore, "electrical connection" can mean that there are other components between the two components.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" can be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper," depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "below" other elements will be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can include an orientation of above and below.

Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. 2 is a schematic cross-sectional view of the sensing element substrate of the first embodiment of the present invention. In particular, for the sake of clarity, the sensing element substrate 100 of FIG. 1 only depicts the substrate 101 and the sensing element 110 of FIG. 2. 1 and 2, the sensing element substrate 100 of this embodiment can be applied to a display panel 10, and the display panel 10 is suitable for being mounted on a smart mobile device, such as a smart phone, a tablet computer, or a smart watch , In order to provide the function of fingerprint recognition, but not limited to this. For example, the display panel 10 may further include a pixel array substrate 200 and a display medium layer 300, wherein the display medium layer 300 is disposed between the pixel array substrate 200 and the sensing element substrate 100.

In this embodiment, the display medium layer 300 includes, for example, a plurality of liquid crystal molecules, and at least one of the pixel array substrate 200 and the sensing element substrate 100 is provided with driving electrodes for driving these liquid crystal molecules. In other words, the display panel 10 may be a liquid crystal display panel or other suitable non-self-luminous display panels. It should be understood that this type of display panel needs to be equipped with a backlight module to achieve the effect of displaying images. However, the present invention is not limited to this. According to other embodiments, the display medium layer 300 may also include a plurality of light-emitting diode elements. The light-emitting diode element here may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), or a sub-millimeter light-emitting diode (mini light-emitting diode). -emitting diode, Mini LED). In other words, the display panel 10 may also be a self-luminous display panel. The sensing element substrate 100 will be described in detail below.

The sensing element substrate 100 includes a substrate 101, an opening OP, and a sensing element 110. The substrate 101 has a first surface 101a and a second surface 101b opposite to each other, and the opening OP and the sensing element 110 are respectively disposed on the first surface 101a and the second surface 101b. In particular, the sensing element 110 may define a sensing area SR of the sensing element substrate 100, and the opening OP is located in the sensing area SR. That is, the sensing element 110 overlaps the opening OP in the normal direction of the substrate 101 (for example, the direction Z). It should be noted that, in this embodiment, the number of openings OP corresponding to one sensing element 110 is exemplarily described with three, which does not mean that the present invention is limited by the content of the drawings. According to other embodiments, the number of openings OP corresponding to one sensing element 110 can also be adjusted according to actual specifications (for example, the size of the sensing element or the sensitivity of the sensing element).

In this embodiment, the opening OP is, for example, a blind hole recessed in the first surface 101a of the substrate 101, but the invention is not limited to this. The opening OP has a depth d in the direction perpendicular to the first surface 101a (ie direction Z), and the vertical projection of the area occupied by the opening OP on the substrate 101 has a width w, and the ratio of the depth d to the width w is between The range is between 5 and 20. In other words, the opening OP is a hole with a high aspect ratio. It is worth noting that the opening OP here can be formed on the substrate 101 by etching, mechanical drilling, laser ablation or other precise processing methods, but not Limit this.

Furthermore, the sensing element substrate 100 further includes a buffer layer 105 and a switching element T. The buffer layer 105 is disposed on the second surface 101b of the substrate 101. The switching element T is disposed on the buffer layer 105 and is electrically connected to the sensing element 110. It is worth noting that the switching element T does not overlap the opening OP in the normal direction of the substrate 101. In this embodiment, the method of forming the switching element T may include the following steps: sequentially forming a semiconductor pattern SC, a gate insulating layer 120, a gate electrode G, an interlayer insulating layer 130, a source electrode S, and a drain electrode D on the buffer layer 105 The gate electrode G overlaps the semiconductor pattern SC in the normal direction of the substrate 101, and the source electrode S and the drain electrode D penetrate the gate insulating layer 120 and the interlayer insulating layer 130 to respectively electrically connect two different regions of the semiconductor pattern SC.

In this embodiment, the gate G of the switching element T can be selectively arranged above the semiconductor pattern SC (that is, the gate G, the source S, and the drain D are located on the same side of the semiconductor pattern SC) to form Top-gate TFT (top-gate TFT), but the present invention is not limited to this. In other embodiments, the gate G of the switching element T can be selectively disposed under the semiconductor pattern SC (that is, the gate G is located between the semiconductor pattern SC and the substrate 101) to form a bottom gate type thin film electrical Crystal (bottom-gate TFT).

It should be noted that the gate electrode G, the source electrode S, the drain electrode D, the semiconductor pattern SC, the buffer layer 105, the gate insulating layer 120, and the interlayer insulating layer 130 can be used by any person having ordinary knowledge in the art. Any gate, any source, any drain, any semiconductor pattern, any buffer layer, any gate insulating layer, and any interlayer insulating layer of the sensing element substrate are implemented, and the gate G, the source The electrode S, the drain electrode D, the semiconductor pattern SC, the buffer layer 105, the gate insulating layer 120, and the interlayer insulating layer 130 can be respectively formed by any method known to those having ordinary knowledge in the art, so they are not here. Go into details. In this embodiment, the sensing element substrate 100 may also optionally include a light shielding pattern SM. The light-shielding pattern SM is disposed between the buffer layer 105 and the substrate 101 and overlaps the switching element T to prevent the semiconductor pattern SC from deteriorating under long-term exposure of external ambient light or sensing light.

Furthermore, the sensing device substrate 100 further includes a signal line SL, a conductive pattern CP, and a flat layer 140. In this embodiment, the signal line SL and the gate G of the switching element T can selectively belong to the same film layer, the conductive pattern CP, the source S, and the drain D can selectively belong to the same film layer, and the conductive pattern CP The signal line SL penetrates through the interlayer insulating layer 130 to be electrically connected. The flat layer 140 covers the conductive pattern CP and the source S and the drain D of the switching element T. The sensing element 110 is disposed on the flat layer 140 and is electrically connected between the drain D of the switching element T and the signal line SL. In detail, the sensing element 110 includes a first electrode layer 111, a sensing layer 112 and a second electrode layer 113. The first electrode layer 111 and the second electrode layer 113 are respectively electrically connected to the conductive pattern CP and the drain D of the switching element T, and the sensing layer 112 is located between the first electrode layer 111 and the second electrode layer 113. In particular, the vertical projection of the sensing layer 112 on the substrate 101 here can define the sensing area SR of the sensing element substrate 100.

In this embodiment, the material of the sensing layer 112 is, for example, silicon-rich oxide (SRO) or other suitable materials. The first electrode layer 111 is, for example, a light-transmitting electrode, and the material of the light-transmitting electrode includes metal oxide, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or other suitable materials. , Or a stacked layer of at least two of the above. The second electrode layer 113 is, for example, a reflective electrode. The material of the reflective electrode includes metals, alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or other suitable materials, or metallic materials. Stacked layers with other conductive materials. However, the present invention is not limited to this. According to other embodiments, the second electrode layer 113 may also be a light-transmitting electrode.

When the user's finger FG hits the first surface 101a of the substrate 101, the light beam from the backlight module passes through the pixel array substrate 200, the display medium layer 300 and the sensing element substrate 100 in sequence and then is transmitted to the finger FG. On the pad of the finger, it is transmitted in the direction of the sensing element 110 after the (diffuse) reflection on the surface of the fingerprint FP. For example, the light LB1 transmitted on the XZ plane (or the light LB2 transmitted on the YZ plane) enters the opening OP after being (diffuse) reflected by the surface of the fingerprint FP, and passes through the substrate 101 The reflection of the surface of the sidewall 101s defining the opening OP transmits the light LB1 (or the light LB2) to the portion where the sensing layer 112 substantially overlaps the opening OP.

On the other hand, the light LB3 transmitted substantially on the YZ plane enters the part of the substrate 101 located between the two adjacent openings OP after being (diffusely) reflected by the surface of the fingerprint FP, and passes through the entire portion between the two sidewalls 101s. By reflection, the light LB3 is transmitted to the portion of the sensing layer 112 that substantially overlaps the portion of the substrate 101. In other words, through the opening OP and the sensing element 110 overlapping each other on two opposite sides of the substrate 101 (ie, the first surface 101a and the second surface 101b), they are reflected by the target (ie the surface of the fingerprint FP). The light beam can be collimated and incident on the sensing element 110 at a desired angle, which helps to improve the sensing sensitivity of the sensing element substrate 100.

Furthermore, the sensing element substrate 100 further includes an insulating layer 145 and a black matrix layer BM, which are disposed on the second surface 101b of the substrate 101. For example, the black matrix layer BM here can define a plurality of pixel areas or open areas (not shown) of the display panel 10, and overlap the signal lines (not shown) and active areas of the pixel array substrate 200. Components (not shown). It is worth noting that the black matrix layer BM covers the sensing element 110, and the sensing element 110 is located between the black matrix layer BM and the substrate 101, and the insulating layer 145 is located between the black matrix layer BM and the third electrode layer of the sensing element 110 113 between. In other words, through the overlapping relationship between the sensing element 110 and the black matrix layer BM, the sensing element 110 can avoid occupying too much layout space and affecting the aperture ratio of the pixel. In this embodiment, the material of the black matrix layer BM may include black resin, metal with low reflectivity (for example: chromium, nickel, etc.) or other suitable materials.

On the other hand, the sensing element substrate 100 can also optionally include a color filter layer CF and a coating layer 150. The color filter layer CF covers the black matrix layer BM and is located between the black matrix layer BM and the covering layer 150. For example, the color filter layer CF includes, for example, a red filter pattern, a red filter pattern, and a blue filter pattern. In some embodiments, the color filter layer CF may also include filter patterns of other colors. The color filter layer CF is provided corresponding to the opening area of the display panel 10.

Other embodiments will be listed below to describe the disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and will not be repeated hereafter. In particular, the sensing element substrates of the following embodiments can all be used to replace the sensing element substrate 100 in the above-mentioned display panel 10.

3 is a schematic cross-sectional view of a sensing element substrate according to a second embodiment of the present invention. Referring to FIG. 3, the difference between the sensing element substrate 100A of this embodiment and the sensing element substrate 100 of FIG. 2 is that the arrangement of the openings on the substrate is different. Specifically, the opening OPa of the sensing element substrate 100A can selectively extend from the first surface 101a of the substrate 101A to the second surface 101b (that is, the opening OPa can penetrate the substrate 101A).

In particular, in order to consider the process requirements (such as surface flatness) of the subsequent sensing element 110, the color filter layer CF and the black matrix layer BM, the step of forming the opening OPa may include: first forming a non-penetrating hole on the substrate 101A After forming the color filter layer CF, the holes are penetrated through the substrate 101A by etching, mechanical drilling or laser drilling to form the opening OPa of this embodiment. For example, the substrate 101A here is, for example, a glass with a thickness of 0.15 cm, and in the pre-process of forming the opening OPa, the depth of the pre-dug hole can be between 0.1 cm and 0.13 cm.

4 is a schematic top view of a sensing element substrate according to a third embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the sensing element substrate of FIG. 4. Fig. 6 is a schematic top view of a sensing element substrate according to a fourth embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a sensing element substrate according to a fifth embodiment of the present invention. 4 and 5, the main difference between the sensing element substrate 100B of this embodiment and the sensing element substrate 100A of FIG. 3 is that the sensing element substrate 100B further includes a metal reflective layer 160, which is provided on the substrate 101A to define openings On the side walls.

For example, the substrate 101A has a first sidewall 101s1 defining a first opening OPa1 and a second sidewall 101s2 defining a second opening OPa2, and the metal reflective layer 160 covers the first sidewall 101s1, the second sidewall 101s2, and is located in the first sidewall 101s1. Part of the first surface 101a between the side wall 101s1 and the second side wall 101s2. In other words, the metal reflective layer 160 may extend between the first sidewall 101s1 of the first opening OPa1 and the second sidewall 101s2 of the second opening OPa2.

When the user's finger FG hits the first surface 101a of the substrate 101A, the light beam from the backlight module is transmitted to the pad of the finger FG, and then passes through the (diffuse) reflection on the surface of the fingerprint FP toward the sensor element 110. Direction pass. For example, since the metal reflective layer 160 is provided on the sidewall of the opening, the light (such as the light LB4, the light LB5, or the light LB6) transmitted into the opening is substantially transmitted on the YZ plane. After passing through the (diffuse) reflection on the surface of the fingerprint FP, it enters the opening, and by the surface reflection of the metal reflective layer 160, the light is transmitted to the portion where the sensing layer 112 substantially overlaps the opening. In other words, by providing mutually overlapping openings (for example, the first opening OPa1 or the second opening OPa2) and the sensing hole on the opposite sides of the substrate 101A (that is, the first surface 101a and the second surface 101b). In the element 110, the light reflected by the target (ie, the surface of the fingerprint FP) can collimately enter the sensing element 110 at a desired angle, which helps to improve the sensing sensitivity of the sensing element substrate 100B.

In particular, the vertical projection contour of the opening (for example, the first opening OPa1 or the second opening OPa2) on the substrate 101A of this embodiment is a rectangle, and a plurality of openings are arranged on the substrate 101A along the direction X. And extend in the direction Y. However, the present invention is not limited to this. According to other embodiments, the vertical projection profile of the opening OPb on the substrate 101B may also be circular, and a plurality of openings OPb are arrayed on the substrate 101B (as shown in FIG. 6). On the other hand, in this embodiment, the opening of the sensing element substrate 100B is a through hole penetrating the substrate 101A, but the present invention is not limited to this. In other embodiments, the opening OP of the sensing element substrate 100D may also be a blind hole (as shown in FIG. 7).

FIG. 8 is a schematic cross-sectional view of a sensing element substrate according to a sixth embodiment of the present invention. Please refer to FIG. 8, the main difference between the sensing element substrate 100E of this embodiment and the sensing element substrate 100A of FIG. 3 is that the configurations of the openings are different. In this embodiment, there is an included angle θ between the sidewall 101s of the substrate 101C defining the opening OPc and the second surface 101b of the substrate 101C, and the included angle θ is between 30 degrees and 80 degrees. In a preferred embodiment, the included angle θ can be between 60 degrees and 80 degrees. Accordingly, the reflectivity of the sidewall 101s of the substrate 101C to the light entering the opening OPc can be increased, which helps to further improve the sensing sensitivity of the sensing element substrate 100E.

FIG. 9 is a schematic cross-sectional view of a sensing element substrate according to a seventh embodiment of the present invention. 10 is a schematic cross-sectional view of a sensing element substrate according to an eighth embodiment of the present invention. Referring to FIG. 9, the difference between the sensing element substrate 100F of this embodiment and the sensing element substrate 100E of FIG. 8 is: the sensing element substrate 100F further includes a metal reflective layer 160, which is disposed on the sidewall 101s of the substrate 101C defining the opening OPc on. In this embodiment, the configuration of the metal reflective layer 160 is similar to that of the sensing element substrate 100B (as shown in FIG. 5) of the foregoing embodiment, and will not be repeated here. On the other hand, in this embodiment, the opening OPc of the sensing element substrate 100F is a through hole penetrating the substrate 101C, but the present invention is not limited to this. In other embodiments, the opening OPd of the sensing element substrate 100G may also be a blind hole (as shown in FIG. 10).

To sum up, in the sensing element substrate of an embodiment of the present invention, by arranging mutually overlapping openings and sensing elements on opposite sides of the substrate, the light reflected by the target can be collimated as expected. The angle of incidence of the sensing element helps to improve the sensing sensitivity of the sensing element substrate.

10: Display panel 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G: sensing element substrate 101, 101A, 101B, 101C, 101D: substrate 101a: first surface 101b: second surface 101s, 101s1, 101s2: side wall 105: buffer layer 110: sensing element 111: first electrode layer 112: Sensing layer 113: second electrode layer 120: gate insulation 130: Interlayer insulation 140: flat layer 145: Insulation layer 150: cladding layer 160: metal reflective layer 200: pixel array substrate 300: display medium layer BM: Black matrix layer CF: Color filter layer CP: conductive pattern d: depth D: Dip pole FG: Finger FP: Fingerprint G: Gate LB1, LB2, LB3, LB4, LB5, LB6: light OP, OPa, OPa1, OPa2, OPb, OPc, OPd: opening S: source SC: Semiconductor pattern SL: signal line SM: shading pattern SR: Sensing area T: switching element w: width X, Y, Z: direction θ: included angle

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. 2 is a schematic cross-sectional view of the sensing element substrate of the first embodiment of the present invention. 3 is a schematic cross-sectional view of a sensing element substrate according to a second embodiment of the present invention. 4 is a schematic top view of a sensing element substrate according to a third embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the sensing element substrate of FIG. 4. Fig. 6 is a schematic top view of a sensing element substrate according to a fourth embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a sensing element substrate according to a fifth embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a sensing element substrate according to a sixth embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of a sensing element substrate according to a seventh embodiment of the present invention. 10 is a schematic cross-sectional view of a sensing element substrate according to an eighth embodiment of the present invention.

100: Sensing component substrate

101: substrate

101a: first surface

101b: second surface

101s: sidewall

105: buffer layer

110: sensing element

111: first electrode layer

112: Sensing layer

113: second electrode layer

120: gate insulation

130: Interlayer insulation

140: flat layer

145: Insulation layer

150: cladding layer

BM: Black matrix layer

CF: Color filter layer

CP: conductive pattern

d: depth

D: Dip pole

FG: Finger

FP: Fingerprint

G: Gate

LB1, LB2, LB3: light

OP: Opening

S: source

SC: Semiconductor pattern

SL: signal line

SM: shading pattern

SR: Sensing area

T: switching element

w: width

X, Y, Z: direction

Claims (9)

A sensing element substrate includes: a substrate having a first surface and a second surface opposite to each other; at least one opening provided on the first surface of the substrate; and a sensing element provided on the first surface of the substrate On the second surface and overlap the at least one opening; a pixel array substrate, wherein the sensing element is located between the substrate and the pixel array substrate; a display medium layer is disposed on the pixel array substrate and the pixel array substrate Between the sensing element substrates; and a switching element disposed on the second surface of the substrate and electrically connected to the sensing element, the switching element does not overlap the at least one opening, wherein the sensing element includes : A sensing layer overlapping the at least one opening; a first electrode layer disposed between the sensing layer and the substrate; and a second electrode layer electrically connected to the switching element, the sensing The layer is located between the first electrode layer and the second electrode layer. The second electrode layer is a reflective electrode and covers opposite sides of the sensing layer. The sensing element substrate according to claim 1, wherein the substrate further has a side wall defining the opening, an included angle is formed between the side wall and the second surface of the substrate, and the included angle is between 30 Between degrees and 80 degrees. The sensing element substrate as described in item 1 of the scope of patent application further includes: A metal reflective layer, wherein the substrate further has a side wall defining the opening, and the metal reflective layer covers the side wall of the opening. The sensing element substrate according to claim 1, wherein the opening has a depth in a direction perpendicular to the first surface, and the vertical projection of the area occupied by the opening on the substrate has a width, And the ratio of the depth to the width is between 5 and 20. The sensing element substrate described in the first item of the scope of patent application further includes: a metal reflective layer, wherein the at least one opening is a first opening and a second opening, and the substrate further defines the first opening. A first side wall of the opening and a second side wall defining the second opening, and the metal reflective layer covers the first side wall, the second side wall, and a portion between the first side wall and the second side wall The first surface. The sensing element substrate described in the first item of the scope of patent application further includes: a black matrix layer disposed on the substrate, and the sensing element is located between the substrate and the black matrix layer. The sensing element substrate described in item 6 of the scope of patent application further includes: a color filter layer, wherein the black matrix layer is located between the sensing element and the color filter layer. According to the first item of the scope of patent application, the sensing element substrate, wherein the opening is a blind hole. The sensing element substrate according to claim 1, wherein the opening extends from the first surface to the second surface of the substrate.

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