TWI725190B - Viscosity lowering agent for high refractive index polymerizable compound and polymerizable composition containing the same - Google Patents
Viscosity lowering agent for high refractive index polymerizable compound and polymerizable composition containing the same Download PDFInfo
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- TWI725190B TWI725190B TW106118006A TW106118006A TWI725190B TW I725190 B TWI725190 B TW I725190B TW 106118006 A TW106118006 A TW 106118006A TW 106118006 A TW106118006 A TW 106118006A TW I725190 B TWI725190 B TW I725190B
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- compound
- polymerizable
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- refractive index
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 123
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000007787 solid Substances 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- -1 Polysiloxane Polymers 0.000 claims description 100
- 125000004432 carbon atom Chemical group C* 0.000 claims description 48
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 44
- 125000000217 alkyl group Chemical group 0.000 claims description 42
- 239000003795 chemical substances by application Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 125000003118 aryl group Chemical group 0.000 claims description 29
- 125000001424 substituent group Chemical group 0.000 claims description 26
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 23
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 22
- 229940126062 Compound A Drugs 0.000 claims description 21
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims description 21
- 239000003085 diluting agent Substances 0.000 claims description 21
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 125000001624 naphthyl group Chemical group 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 125000005561 phenanthryl group Chemical group 0.000 claims description 7
- 238000006467 substitution reaction Methods 0.000 claims description 7
- 125000006267 biphenyl group Chemical group 0.000 claims description 6
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 claims description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 229920002100 high-refractive-index polymer Polymers 0.000 abstract 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 32
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 28
- 239000000047 product Substances 0.000 description 28
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 27
- 239000000126 substance Substances 0.000 description 26
- 238000006243 chemical reaction Methods 0.000 description 24
- 150000002430 hydrocarbons Chemical group 0.000 description 22
- 230000003287 optical effect Effects 0.000 description 19
- 150000002148 esters Chemical class 0.000 description 18
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 16
- 229910052757 nitrogen Inorganic materials 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- 239000003729 cation exchange resin Substances 0.000 description 14
- 238000006068 polycondensation reaction Methods 0.000 description 14
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 14
- 239000002585 base Substances 0.000 description 13
- 239000003153 chemical reaction reagent Substances 0.000 description 13
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 11
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 8
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 8
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 229910000077 silane Inorganic materials 0.000 description 8
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 241000208340 Araliaceae Species 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 6
- 235000003140 Panax quinquefolius Nutrition 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 125000002947 alkylene group Chemical group 0.000 description 6
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 6
- 239000012043 crude product Substances 0.000 description 6
- 235000008434 ginseng Nutrition 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 5
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- VSYZNIXNUZCUOX-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-phenanthren-9-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C=C)(C=1C2=CC=CC=C2C=2C=CC=CC=2C=1)OC VSYZNIXNUZCUOX-UHFFFAOYSA-N 0.000 description 4
- IYDMICQAKLQHLA-UHFFFAOYSA-N 1-phenylnaphthalene Chemical compound C1=CC=CC=C1C1=CC=CC2=CC=CC=C12 IYDMICQAKLQHLA-UHFFFAOYSA-N 0.000 description 4
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- SLGBZMMZGDRARJ-UHFFFAOYSA-N Triphenylene Natural products C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 SLGBZMMZGDRARJ-UHFFFAOYSA-N 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000005336 allyloxy group Chemical group 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 4
- 239000012986 chain transfer agent Substances 0.000 description 4
- 239000007810 chemical reaction solvent Substances 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 125000003010 ionic group Chemical group 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 4
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 4
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- BHZKBFGLZZRETK-UHFFFAOYSA-N trimethoxy(phenanthren-9-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC3=CC=CC=C3C2=C1 BHZKBFGLZZRETK-UHFFFAOYSA-N 0.000 description 4
- 125000005580 triphenylene group Chemical group 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 3
- 229910001863 barium hydroxide Inorganic materials 0.000 description 3
- 150000007514 bases Chemical class 0.000 description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 3
- 239000000920 calcium hydroxide Substances 0.000 description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 3
- 229940023913 cation exchange resins Drugs 0.000 description 3
- 229920001429 chelating resin Polymers 0.000 description 3
- 150000004673 fluoride salts Chemical class 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- MFGWMAAZYZSWMY-UHFFFAOYSA-N (2-naphthyl)methanol Chemical compound C1=CC=CC2=CC(CO)=CC=C21 MFGWMAAZYZSWMY-UHFFFAOYSA-N 0.000 description 2
- DPEYHNFHDIXMNV-UHFFFAOYSA-N (9-amino-3-bicyclo[3.3.1]nonanyl)-(4-benzyl-5-methyl-1,4-diazepan-1-yl)methanone dihydrochloride Chemical compound Cl.Cl.CC1CCN(CCN1Cc1ccccc1)C(=O)C1CC2CCCC(C1)C2N DPEYHNFHDIXMNV-UHFFFAOYSA-N 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-Me3C6H3 Natural products CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- YSQZSPCQDXHJDJ-UHFFFAOYSA-N 1-(pentyldisulfanyl)pentane Chemical compound CCCCCSSCCCCC YSQZSPCQDXHJDJ-UHFFFAOYSA-N 0.000 description 2
- QRVQUBKLRBKFCG-UHFFFAOYSA-N 1-phenylpyrene Chemical compound C1=CC=CC=C1C1=CC=C(C=C2)C3=C4C2=CC=CC4=CC=C13 QRVQUBKLRBKFCG-UHFFFAOYSA-N 0.000 description 2
- WKAXDAMWMOBXMP-UHFFFAOYSA-N 2,3-diphenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CN=C1C1=CC=CC=C1 WKAXDAMWMOBXMP-UHFFFAOYSA-N 0.000 description 2
- JSLVASGKIAGIKH-UHFFFAOYSA-N 2,7-diphenylpyrene Chemical compound C1=CC=CC=C1C1=CC2=CC=C(C=C(C=C3C=C4)C=5C=CC=CC=5)C3=C2C4=C1 JSLVASGKIAGIKH-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 2
- RSQXKVWKJVUZDG-UHFFFAOYSA-N 9-bromophenanthrene Chemical compound C1=CC=C2C(Br)=CC3=CC=CC=C3C2=C1 RSQXKVWKJVUZDG-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XDUZWPPSSHEDFK-VVXQKDJTSA-N C(C(C)(C)C)C([C@H](O)[C@H](O)CO)O Chemical compound C(C(C)(C)C)C([C@H](O)[C@H](O)CO)O XDUZWPPSSHEDFK-VVXQKDJTSA-N 0.000 description 2
- CETBSQOFQKLHHZ-UHFFFAOYSA-N Diethyl disulfide Chemical compound CCSSCC CETBSQOFQKLHHZ-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000004386 Erythritol Substances 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- QPFYXYFORQJZEC-FOCLMDBBSA-N Phenazopyridine Chemical compound NC1=NC(N)=CC=C1\N=N\C1=CC=CC=C1 QPFYXYFORQJZEC-FOCLMDBBSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- ALVPFGSHPUPROW-UHFFFAOYSA-N dipropyl disulfide Chemical compound CCCSSCCC ALVPFGSHPUPROW-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 229940009714 erythritol Drugs 0.000 description 2
- 235000019414 erythritol Nutrition 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- JVZRCNQLWOELDU-UHFFFAOYSA-N gamma-Phenylpyridine Natural products C1=CC=CC=C1C1=CC=NC=C1 JVZRCNQLWOELDU-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229940070891 pyridium Drugs 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 125000005650 substituted phenylene group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- 125000006836 terphenylene group Chemical group 0.000 description 2
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DKZFIPFKXAGEBP-UHFFFAOYSA-N (3-hydroxy-2,2-dimethylpropyl) benzoate Chemical compound OCC(C)(C)COC(=O)C1=CC=CC=C1 DKZFIPFKXAGEBP-UHFFFAOYSA-N 0.000 description 1
- ONJSPIPCYCVZTK-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-(4-phenylphenyl)silane Chemical compound C1(=CC=C(C=C1)[Si](C1=CC=C(C=C1)C=C)(OC)OC)C1=CC=CC=C1 ONJSPIPCYCVZTK-UHFFFAOYSA-N 0.000 description 1
- ZYCRYWLQPKJDRQ-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-naphthalen-1-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C=C)(C1=CC=CC2=CC=CC=C12)OC ZYCRYWLQPKJDRQ-UHFFFAOYSA-N 0.000 description 1
- WDIAVQIZPWJESS-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-naphthalen-2-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C=C)(C1=CC2=CC=CC=C2C=C1)OC WDIAVQIZPWJESS-UHFFFAOYSA-N 0.000 description 1
- IMQULICUVKWMPN-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-phenanthren-2-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C=C)(C1=CC=2C=CC3=CC=CC=C3C=2C=C1)OC IMQULICUVKWMPN-UHFFFAOYSA-N 0.000 description 1
- DMRNLQFWPNTWIJ-UHFFFAOYSA-N (4-ethenylphenyl)-dimethoxy-phenanthren-3-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C=C)(C=1C=CC=2C=CC3=CC=CC=C3C=2C=1)OC DMRNLQFWPNTWIJ-UHFFFAOYSA-N 0.000 description 1
- DVNJGFKZFUKXBP-UHFFFAOYSA-N (4-ethenylphenyl)-phenanthren-9-yl-di(propan-2-yloxy)silane Chemical compound C(C)(C)O[Si](C1=CC=C(C=C1)C=C)(C=1C2=CC=CC=C2C=2C=CC=CC=2C=1)OC(C)C DVNJGFKZFUKXBP-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- STLNECXXOGTUDV-UHFFFAOYSA-N (4-phenylphenyl)-tri(propan-2-yloxy)silane Chemical compound C1(=CC=C(C=C1)[Si](OC(C)C)(OC(C)C)OC(C)C)C1=CC=CC=C1 STLNECXXOGTUDV-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- STLFZKZBGXSIQJ-UHFFFAOYSA-N 1,1'-biphenyl;naphthalene Chemical compound C1=CC=CC2=CC=CC=C21.C1=CC=CC=C1C1=CC=CC=C1 STLFZKZBGXSIQJ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- IDJPKRIELSFBPE-UHFFFAOYSA-N 1-(decyldisulfanyl)decane Chemical compound CCCCCCCCCCSSCCCCCCCCCC IDJPKRIELSFBPE-UHFFFAOYSA-N 0.000 description 1
- GJPDBURPGLWRPW-UHFFFAOYSA-N 1-(hexyldisulfanyl)hexane Chemical compound CCCCCCSSCCCCCC GJPDBURPGLWRPW-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N 1-butanol Substances CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- LRZPQLZONWIQOJ-UHFFFAOYSA-N 10-(2-methylprop-2-enoyloxy)decyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOC(=O)C(C)=C LRZPQLZONWIQOJ-UHFFFAOYSA-N 0.000 description 1
- KYNFOMQIXZUKRK-UHFFFAOYSA-N 2,2'-dithiodiethanol Chemical compound OCCSSCCO KYNFOMQIXZUKRK-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- MKWZLIFXFATNFR-UHFFFAOYSA-N 2,7-bis(4-ethenylphenyl)naphthalene Chemical compound C(=C)C1=CC=C(C=C1)C1=CC2=CC(=CC=C2C=C1)C1=CC=C(C=C1)C=C MKWZLIFXFATNFR-UHFFFAOYSA-N 0.000 description 1
- WKDCYKWOTYBIPG-UHFFFAOYSA-N 2-(1h-benzimidazol-2-yldisulfanyl)-1h-benzimidazole Chemical compound C1=CC=C2NC(SSC=3NC4=CC=CC=C4N=3)=NC2=C1 WKDCYKWOTYBIPG-UHFFFAOYSA-N 0.000 description 1
- XJIKEAQNTPCOLU-UHFFFAOYSA-N 2-(2,2-diethoxyethyldisulfanyl)-1,1-diethoxyethane Chemical compound CCOC(OCC)CSSCC(OCC)OCC XJIKEAQNTPCOLU-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- VAZQKPWSBFZARZ-UHFFFAOYSA-N 2-(2-phenylphenoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1C1=CC=CC=C1 VAZQKPWSBFZARZ-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- BKCNDTDWDGQHSD-UHFFFAOYSA-N 2-(tert-butyldisulfanyl)-2-methylpropane Chemical compound CC(C)(C)SSC(C)(C)C BKCNDTDWDGQHSD-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- AJPGNQYBSTXCJE-UHFFFAOYSA-N 2-methylthiolane Chemical compound CC1CCCS1 AJPGNQYBSTXCJE-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- ANCUXNXTHQXICN-UHFFFAOYSA-N 2-prop-1-en-2-ylnaphthalene Chemical compound C1=CC=CC2=CC(C(=C)C)=CC=C21 ANCUXNXTHQXICN-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- BIGOJJYDFLNSGB-UHFFFAOYSA-N 3-isocyanopropyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)CCC[N+]#[C-] BIGOJJYDFLNSGB-UHFFFAOYSA-N 0.000 description 1
- GHVQFNRPRVTBJY-UHFFFAOYSA-N 3-methoxybutyl propanoate Chemical compound CCC(=O)OCCC(C)OC GHVQFNRPRVTBJY-UHFFFAOYSA-N 0.000 description 1
- MPYGLNNTOXLWOB-UHFFFAOYSA-N 3-methyl-1-(3-methylbutyldisulfanyl)butane Chemical compound CC(C)CCSSCCC(C)C MPYGLNNTOXLWOB-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- AMKJYGFYFIGNMF-UHFFFAOYSA-N C(C(=C)C)(=O)OC.OC(C)COC=CC Chemical compound C(C(=C)C)(=O)OC.OC(C)COC=CC AMKJYGFYFIGNMF-UHFFFAOYSA-N 0.000 description 1
- RVFNWEHKRMFNNK-UHFFFAOYSA-N CC(C)(C(C(C(C)C)(C)C)(C)C)SSC(C)(C(C(C(C)C)(C)C)(C)C)C Chemical compound CC(C)(C(C(C(C)C)(C)C)(C)C)SSC(C)(C(C(C(C)C)(C)C)(C)C)C RVFNWEHKRMFNNK-UHFFFAOYSA-N 0.000 description 1
- CKBXWFBAJGDWKQ-UHFFFAOYSA-N COC1=C(C(=C(C=2C=CC3=CC=CC=C3C12)C=1C2=CC=CC=C2C=2C=CC=CC2C1)OC)C=C Chemical compound COC1=C(C(=C(C=2C=CC3=CC=CC=C3C12)C=1C2=CC=CC=C2C=2C=CC=CC2C1)OC)C=C CKBXWFBAJGDWKQ-UHFFFAOYSA-N 0.000 description 1
- ATAGQIUEZHDXDN-UHFFFAOYSA-N CO[Si](C1=CC=2C=CC3=CC=CC=C3C=2C=C1)(OC)OC Chemical compound CO[Si](C1=CC=2C=CC3=CC=CC=C3C=2C=C1)(OC)OC ATAGQIUEZHDXDN-UHFFFAOYSA-N 0.000 description 1
- VMRZPOFAOVBZNY-UHFFFAOYSA-N CO[Si](C=1C=CC=2C=CC3=CC=CC=C3C=2C=1)(OC)OC Chemical compound CO[Si](C=1C=CC=2C=CC3=CC=CC=C3C=2C=1)(OC)OC VMRZPOFAOVBZNY-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- CUDSBWGCGSUXDB-UHFFFAOYSA-N Dibutyl disulfide Chemical compound CCCCSSCCCC CUDSBWGCGSUXDB-UHFFFAOYSA-N 0.000 description 1
- ODHAQPXNQDBHSH-UHFFFAOYSA-N Dicyclohexyl disulfide Chemical compound C1CCCCC1SSC1CCCCC1 ODHAQPXNQDBHSH-UHFFFAOYSA-N 0.000 description 1
- LZAZXBXPKRULLB-UHFFFAOYSA-N Diisopropyl disulfide Chemical compound CC(C)SSC(C)C LZAZXBXPKRULLB-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 1
- 101100389975 Mus musculus Ezhip gene Proteins 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000007875 V-40 Substances 0.000 description 1
- AVTLBBWTUPQRAY-BUHFOSPRSA-N V-59 Substances CCC(C)(C#N)\N=N\C(C)(CC)C#N AVTLBBWTUPQRAY-BUHFOSPRSA-N 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- 239000007874 V-70 Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- HMSIINUKBOUHOG-UHFFFAOYSA-N [4-(4-ethenylphenyl)phenyl]-dimethoxy-phenanthren-9-ylsilane Chemical compound CO[Si](C1=CC=C(C=C1)C1=CC=C(C=C1)C=C)(C=1C2=CC=CC=C2C=2C=CC=CC=2C=1)OC HMSIINUKBOUHOG-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HAXFWIACAGNFHA-UHFFFAOYSA-N aldrithiol Chemical compound C=1C=CC=NC=1SSC1=CC=CC=N1 HAXFWIACAGNFHA-UHFFFAOYSA-N 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000004190 benzothiazol-2-yl group Chemical group [H]C1=C([H])C([H])=C2N=C(*)SC2=C1[H] 0.000 description 1
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical class C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000001891 dimethoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- HJUFTIJOISQSKQ-UHFFFAOYSA-N fenoxycarb Chemical compound C1=CC(OCCNC(=O)OCC)=CC=C1OC1=CC=CC=C1 HJUFTIJOISQSKQ-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- ISVWDXGCSXKULB-UHFFFAOYSA-N naphthalen-1-yl-tri(propan-2-yloxy)silane Chemical compound C1=CC=C2C([Si](OC(C)C)(OC(C)C)OC(C)C)=CC=CC2=C1 ISVWDXGCSXKULB-UHFFFAOYSA-N 0.000 description 1
- CXOYJPWMGYDJNW-UHFFFAOYSA-N naphthalen-2-yl 2-methylprop-2-enoate Chemical compound C1=CC=CC2=CC(OC(=O)C(=C)C)=CC=C21 CXOYJPWMGYDJNW-UHFFFAOYSA-N 0.000 description 1
- RYTXPJWZUVQRDS-UHFFFAOYSA-N naphthalen-2-yl-tri(propan-2-yloxy)silane Chemical compound C(C)(C)O[Si](C1=CC2=CC=CC=C2C=C1)(OC(C)C)OC(C)C RYTXPJWZUVQRDS-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- BMNCEQGZEGXDEB-UHFFFAOYSA-N phenanthren-9-yl-tri(propan-2-yloxy)silane Chemical compound C(C)(C)O[Si](C=1C2=CC=CC=C2C=2C=CC=CC=2C=1)(OC(C)C)OC(C)C BMNCEQGZEGXDEB-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000010898 silica gel chromatography Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- QMJBUORKPLELQD-UHFFFAOYSA-N tetramethyl-$l^{4}-sulfane Chemical compound CS(C)(C)C QMJBUORKPLELQD-UHFFFAOYSA-N 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- KTQYWNARBMKMCX-UHFFFAOYSA-N tetraphenylene Chemical group C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C3=CC=CC=C3C2=C1 KTQYWNARBMKMCX-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- ZJEYUFMTCHLQQI-UHFFFAOYSA-N triethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OCC)(OCC)OCC)=CC=CC2=C1 ZJEYUFMTCHLQQI-UHFFFAOYSA-N 0.000 description 1
- WJJDBJYEDVQKGT-UHFFFAOYSA-N triethoxy(phenanthren-9-yl)silane Chemical compound C1=CC=C2C([Si](OCC)(OCC)OCC)=CC3=CC=CC=C3C2=C1 WJJDBJYEDVQKGT-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- KMISPMRSLVRNRI-UHFFFAOYSA-N triethoxy-(4-phenylphenyl)silane Chemical compound C1=CC([Si](OCC)(OCC)OCC)=CC=C1C1=CC=CC=C1 KMISPMRSLVRNRI-UHFFFAOYSA-N 0.000 description 1
- ZSOVVFMGSCDMIF-UHFFFAOYSA-N trimethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC=CC2=C1 ZSOVVFMGSCDMIF-UHFFFAOYSA-N 0.000 description 1
- DIYLRQVVOHZHNA-UHFFFAOYSA-N trimethoxy(naphthalen-2-yl)silane Chemical compound C1=CC=CC2=CC([Si](OC)(OC)OC)=CC=C21 DIYLRQVVOHZHNA-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- XQEGZYAXBCFSBS-UHFFFAOYSA-N trimethoxy-(4-methylphenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=C(C)C=C1 XQEGZYAXBCFSBS-UHFFFAOYSA-N 0.000 description 1
- GDRDDMTUPOZHSD-UHFFFAOYSA-N trimethoxy-(4-phenylphenyl)silane Chemical compound C1=CC([Si](OC)(OC)OC)=CC=C1C1=CC=CC=C1 GDRDDMTUPOZHSD-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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-
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
本發明係提供可打破低阿貝(Abbe)化與低黏度化之互償性,經調配時折射率之損失少的高折射率之低黏度化劑、與含有其之聚合性組成物。 The present invention provides a low-viscosity agent with a high refractive index that can break the mutual compensation between low Abbe and low viscosity, and with less loss of refractive index when formulated, and a polymerizable composition containing the low-viscosity agent with high refractive index.
本發明之方法係使用在1013.25hPa下、23℃之物質的狀態為固體,具有未達100℃之熔點的化合物,且在100℃之黏度為10mPa‧s以下,其硬化物之D線(589.3nm)的阿貝數為23以下之化合物,作為具有至少1個聚合性雙鍵,且其硬化物之D線(589.3nm)的折射率為1.60以上之高折射率聚合性化合物的低黏度化劑。 The method of the present invention uses a compound that is solid at 1013.25hPa and 23°C, has a melting point of less than 100°C, and has a viscosity of 10mPa‧s or less at 100°C. The cured product has a D line (589.3 nm) A compound with an Abbe number of 23 or less, as a high refractive index polymer compound with at least one polymerizable double bond and a cured product whose D line (589.3nm) has a refractive index of 1.60 or more Agent.
Description
本發明關於低黏度化劑,詳而言之,關於可使用來作為可實現高折射率之聚合性光學材料的低黏度化之高折射率稀釋劑的低黏度化劑。 The present invention relates to a low-viscosity agent. Specifically, the present invention relates to a low-viscosity agent that can be used as a high-refractive-index diluent that can achieve low-viscosity of a polymerizable optical material with a high refractive index.
樹脂透鏡可使用於行動電話、數位相機、車載相機等之電子機器,要求應用於其電子機器之目的的具有優異光學特性者。又,符合使用態樣,要求高的耐久性、例如耐熱性及耐候性、及可良率佳成形之高生產性。滿足如此要求之樹脂透鏡用材料可使用例如聚碳酸酯樹脂、環烯烴聚合物、甲基丙烯酸樹脂等之熱塑性透明樹脂。 Resin lenses can be used in electronic devices such as mobile phones, digital cameras, and in-vehicle cameras. Those who require excellent optical properties for the purpose of applying to their electronic devices. In addition, it conforms to the usage pattern and requires high durability, such as heat resistance and weather resistance, and high productivity that can be formed with good yield. The resin lens material that meets such requirements can use thermoplastic transparent resins such as polycarbonate resins, cycloolefin polymers, and methacrylic resins.
而且,近年,當製造樹脂透鏡時,為提升良率或生產效率、進一步抑制透鏡積層時之光軸偏移,正盛行研究從 熱塑性樹脂之射出成型,朝使用在室溫為液狀之硬化性樹脂的押擠成形所得之晶圓級成形的移動。 Moreover, in recent years, when manufacturing resin lenses, in order to improve the yield or production efficiency, and to further suppress the deviation of the optical axis when the lens is laminated, research is being carried out. The injection molding of thermoplastic resin is moving toward wafer-level molding obtained by extrusion molding using curable resin that is liquid at room temperature.
又,於高解析度相機模組係使用複數片之透鏡,其中之一片的波長修正透鏡,要求具有高波長分散性、亦即具有低阿貝數之光學材料。 In addition, a high-resolution camera module uses a plurality of lenses, and one of the wavelength correction lenses requires optical materials with high wavelength dispersion, that is, low Abbe number.
以低阿貝數為特徵之材料中,除了高折射率外,尚要求高的透明性,但若謀求此等光學特性之提升,較多為增加材料之黏度,操作性明顯惡化。一般此係有助於高折射率之成分係電子密度高,因此,起因於容易高黏度化者,操作性之惡化在低阿貝材料之開發中可謂為本質性之問題。 Among the materials characterized by low Abbe number, in addition to high refractive index, high transparency is still required. However, if the improvement of these optical properties is sought, the viscosity of the material is mostly increased, and the workability is significantly deteriorated. Generally, the component that contributes to the high refractive index has a high electron density. Therefore, due to the fact that the viscosity is easily increased, the deterioration of operability can be regarded as an essential problem in the development of low Abbe materials.
對於如此方式之問題,有提出:採用例如具有比較高之折射率的液狀(甲基)丙烯酸酯作為稀釋劑,謀求低黏度化與操作性提升之透鏡材用硬化性組成物(專利文獻1)。又,有提出:藉由在有助於高折射率之成分中導入氧伸烷基,即使不使用稀釋劑,亦可謀求低黏度化實現之硬化性組成物(專利文獻2)。 In response to the problem of such a method, there has been proposed a curable composition for lens materials that uses, for example, a liquid (meth)acrylate having a relatively high refractive index as a diluent to achieve low viscosity and improved workability (Patent Document 1 ). In addition, it has been proposed that by introducing an alkylene oxide into a component that contributes to a high refractive index, a curable composition capable of achieving low viscosity can be achieved even without using a diluent (Patent Document 2).
[專利文獻1]特開2012-255914號公報 [Patent Document 1] JP 2012-255914 A
[專利文獻2]特開2015-199952號公報 [Patent Document 2] JP 2015-199952 No.
然而,使用前述稀釋劑之硬化性組成物(專利文獻1),雖然光硬化後在589nm之折射率nD為1.61左右,但阿貝數νD成為25以上,未達可滿足例如23以下之低阿貝數的要求。又,當不使用稀釋劑之硬化性組成物(專利文獻2)時,無法實現光硬化後之折射率nD:1.60以上,此亦未能充分滿足光學特性者。 However, with the curable composition using the aforementioned diluent (Patent Document 1), although the refractive index n D at 589 nm after photocuring is about 1.61, the Abbe number ν D becomes 25 or more, which is not as good as, for example, 23 or less. Low Abbe number requirements. In addition, when the curable composition (Patent Document 2) that does not use a diluent, the refractive index n D after photocuring cannot be achieved: 1.60 or more, which also fails to sufficiently satisfy the optical characteristics.
如前述,低阿貝化與低黏度化為互償性之關係,尚無可實現例如10000mPa‧s以下之低黏度,同時實現在硬化物中如1.60以上之高折射率、23以下之低阿貝數的優異光學特性之光學材料。 As mentioned above, the relationship between low Abbeization and low viscosity is the mutual compensation. For example, it has not been possible to achieve low viscosity below 10000mPa‧s, and at the same time achieve high refractive index above 1.60 and low A below 23 in the hardened material. An optical material with excellent optical properties.
又,用以達成以往低黏度化之稀釋劑一般為低折射率,另一方面,近年朝向高解析度相機模組用透鏡等之光學材料所要求的光學特性(高折射率/低阿貝數/高透明性)因更進一步提高,故藉由調配以往之稀釋劑(低黏度化劑)反而成為可招致光學材料之高阿貝化者。 In addition, the thinner used to achieve low viscosity in the past generally has a low refractive index. On the other hand, in recent years, the optical properties required for optical materials such as lenses for high-resolution camera modules (high refractive index/low Abbe number /High transparency) is further improved, so by mixing conventional diluents (low-viscosity reducers), it becomes the one that can cause high Abbeization of optical materials.
本發明係有鑑於如此之事情而成者,課題在於提供可打破低阿貝化與低黏度化之互償性,經調配時折射率之損失少的高折射率之低黏度化劑與含有其之聚合性組成物。 The present invention was made in view of such matters, and the subject is to provide a low-viscosity agent with a high refractive index that can break the mutual compensation between low-abbeization and low-viscosity, and has less refractive index loss when blended. The polymerizable composition.
本發明人等為解決上述之課題,致力研究之結果,發現使用在常溫/常壓下為固體,且在100℃之黏度為10mPa‧s以下之低阿貝化合物作為高折射率之聚合性化合物的低黏度化劑,結果值得驚訝的是,使系統之黏度降低至10000mPa‧s以下或維持於10000mPa‧s以下,且可 在該系統之硬化物中實現優異之光學特性(低阿貝數、高折射率),終完成本發明。 In order to solve the above-mentioned problems, the inventors have worked hard as a result of research and found that a low-Abbe compound that is solid at normal temperature/normal pressure and has a viscosity of 10 mPa·s or less at 100°C is used as a polymerizable compound with high refractive index. The result is surprisingly low viscosity agent, which can reduce the viscosity of the system to below 10000mPa‧s or maintain it below 10000mPa‧s. The system achieves excellent optical properties (low Abbe number, high refractive index) in the cured product of the system, and finally completes the present invention.
亦即,本發明第1觀點為關於一種方法,其係使用在1013.25hPa下、23℃之物質的狀態為固體,具有未達100℃之熔點的化合物,且在100℃之黏度為10mPa‧s以下,其硬化物之D線(589.3nm)的阿貝數為23以下之化合物,作為具有至少1個聚合性雙鍵,且其硬化物之D線(589.3nm)的折射率為1.60以上之高折射率聚合性化合物的低黏度化劑。 That is, the first viewpoint of the present invention relates to a method that uses a compound that is solid at 1013.25hPa and 23℃, has a melting point below 100℃, and has a viscosity of 10mPa‧s at 100℃ Hereinafter, the compound with the D-line (589.3nm) of the cured product having an Abbe number of 23 or less is regarded as a compound having at least one polymerizable double bond, and the refractive index of the D-line (589.3nm) of the cured product is 1.60 or more A low-viscosity agent for high refractive index polymerizable compounds.
第2觀點係關於第1觀點記載之方法,其中,前述低黏度化劑為具有至少1個選自由可被碳原子數1至6之烷基取代之苯基或伸苯基、具有複數之苯環構造之1價或2價的縮合環烴基(可被碳原子數1至6之烷基取代);及複數之芳香環以單鍵直接鍵結之1價或2價的烴環集合基(可被碳原子數1至6之烷基取代)所構成之群中之芳香族基,且 具有至少1個選自由乙烯基、烯丙基、(甲基)烯丙基氧基及(甲基)丙烯醯基所構成之群中的具有聚合性雙鍵之基的化合物。 The second aspect relates to the method described in the first aspect, wherein the aforementioned low-viscosity agent has at least one phenyl group or phenylene group which may be substituted with an alkyl group having 1 to 6 carbon atoms, and a plural benzene group. A monovalent or divalent condensed cyclic hydrocarbon group of ring structure (which can be substituted by an alkyl group with 1 to 6 carbon atoms); and a monovalent or divalent hydrocarbon ring assembly group in which plural aromatic rings are directly bonded by a single bond ( Can be substituted by an alkyl group having 1 to 6 carbon atoms) in the group consisting of an aromatic group, and A compound having at least one group having a polymerizable double bond selected from the group consisting of a vinyl group, an allyl group, a (meth)allyloxy group, and a (meth)acryloyl group.
第3觀點係關於第2觀點記載之方法,其中,前述低黏度化劑為下述式[1]所示之化合物。 The third viewpoint is the method described in the second viewpoint, wherein the aforementioned low viscosity reducing agent is a compound represented by the following formula [1].
第4觀點係關於第2觀點記載之方法,其中,前述低黏度化劑為下述式[2]所示之化合物。 The fourth viewpoint is the method described in the second viewpoint, wherein the aforementioned low-viscosity reducing agent is a compound represented by the following formula [2].
第5觀點係關於第2觀點記載之方法,其中,前述低黏度化劑為下述式[3-1]或式[3-2]所示之化合物。 The fifth viewpoint is the method described in the second viewpoint, wherein the aforementioned low viscosity reducing agent is a compound represented by the following formula [3-1] or formula [3-2].
第6觀點係關於一種低黏度化劑,係至少具有1個之聚合性雙鍵,其硬化物之D線(589.3nm)的折射率為1.60以 上之高折射率聚合性化合物的低黏度化劑,且其由在1013.25hPa下、23℃之物質的狀態為固體,具有未達100℃之熔點的化合物,在100℃之黏度為10mPa‧s以下,在其硬化物之D線(589.3nm)的阿貝數為23以下之化合物所構成者。 The sixth point of view is about a low-viscosity agent, which has at least one polymerizable double bond, and the refractive index of the D line (589.3nm) of the cured product is 1.60 or more The above-mentioned low-viscosity agent for high-refractive-index polymerizable compounds, and it is from the state of a substance at 1013.25hPa and 23℃ to solid, and a compound with a melting point of less than 100℃, the viscosity at 100℃ is 10mPa‧s Hereinafter, the D-line (589.3nm) of the cured product is composed of a compound whose Abbe number is 23 or less.
第7觀點係關於一種聚合性組成物,其係包含:(a)至少具有1個之聚合性雙鍵,其硬化物之D線(589.3nm)的折射率為1.60以上之高折射率聚合性化合物100質量份;及 (b)由在1013.25hPa下、23℃中之物質的狀態為固體,具有未達100℃之熔點的化合物,且在100℃之黏度為10mPa‧s以下,在其硬化物之D線(589.3nm)的阿貝數為23以下之化合物所構成之低黏度化劑10~500質量份。 The seventh point of view relates to a polymerizable composition, which contains: (a) at least one polymerizable double bond, and the cured product has a high refractive index polymerizable with a refractive index of 1.60 or more at the D line (589.3nm) 100 parts by mass of the compound; and (b) From the state of the substance at 1013.25hPa and 23℃ as a solid, a compound with a melting point of less than 100℃, and a viscosity at 100℃ of 10mPa‧s or less, at the D line of the hardened product (589.3 nm) A low-viscosity agent composed of compounds with an Abbe number of 23 or less is 10 to 500 parts by mass.
第8觀點係關於第7觀點記載之聚合性組成物,其中,前述(a)高折射率聚合性化合物包含反應性聚矽氧烷,而該反應性聚矽氧烷含有:式[4]所示之烷氧基矽化合物A之聚縮合物,及式[4]所示之烷氧基矽化合物A與式[5]所示之烷氧基矽化合物B之聚縮合物的至少一者。 The eighth aspect relates to the polymerizable composition described in the seventh aspect, wherein the (a) high refractive index polymerizable compound contains a reactive polysiloxane, and the reactive polysiloxane contains: At least one of the polycondensate of the alkoxysilicon compound A and the polycondensate of the alkoxysilicon compound A represented by the formula [4] and the alkoxysilicon compound B represented by the formula [5].
[化學式5]Ar 4 -Si(OR 4 ) 3 [5](式中,Ar4表示可被碳原子數1至6之烷基取代之苯基、具有複數之苯環構造的縮合環烴基(可被碳原子數1至6之烷基取代),或複數之芳香環以單鍵直接進行鍵結之烴環集合基(可被碳原子數1至6之烷基取代);R4表示甲基、乙基或異丙基。) [Chemical formula 5] Ar 4 -Si(OR 4 ) 3 [5] (In the formula, Ar 4 represents a phenyl group which may be substituted by an alkyl group having 1 to 6 carbon atoms, a condensed cyclic hydrocarbon group having a plural benzene ring structure ( It can be substituted by an alkyl group having 1 to 6 carbon atoms), or a hydrocarbon ring group in which multiple aromatic rings are directly bonded by a single bond (which can be substituted by an alkyl group having 1 to 6 carbon atoms); R 4 represents methyl , Ethyl or isopropyl.)
第9觀點係關於第7觀點記載之聚合性組成物,其中,前述(a)高折射率聚合性化合物含有式[6]所示之茀化合物。 The ninth aspect relates to the polymerizable composition described in the seventh aspect, wherein the (a) high refractive index polymerizable compound contains the sulphur compound represented by the formula [6].
第10觀點係關於第7觀點記載之聚合性組成物,其中,前述(a)高折射率聚合性化合物為選自由下述式[7-1]所示之化合物、具有式[7-2]所示之構造單元的化合物以及具有式[7-2]所示之構造單元及式[7-3]所示之構造單元的化合物所構成之群中。 The tenth aspect is the polymerizable composition described in the seventh aspect, wherein the (a) high refractive index polymerizable compound is selected from compounds represented by the following formula [7-1], having the formula [7-2] In the group consisting of the compound of the structural unit shown in the formula [7-2] and the compound of the structural unit shown in the formula [7-3].
第11觀點係關於第7觀點至第10觀點中任一者記載之聚合性組成物,其係進一步包含(c)在1013.25hPa下、23℃之物質的狀態為液體之聚合性稀釋劑。 The eleventh viewpoint is the polymerizable composition described in any one of the seventh to the tenth viewpoints, which further contains (c) a polymerizable diluent in a liquid state at 1013.25 hPa and 23°C.
第12觀點係關於一種硬化物,其係第7觀點至第11觀點中任一者記載之聚合性組成物的硬化物。 The twelfth viewpoint relates to a cured product, which is a cured product of the polymerizable composition described in any one of the seventh to the eleventh viewpoints.
第13觀點係關於一種高折射率樹脂透鏡用材料,其係由第7觀點至第11觀點中任一者記載之聚合性組成物所構成者。 The 13th viewpoint relates to a material for a high refractive index resin lens, which is composed of the polymerizable composition described in any one of the 7th to the 11th viewpoint.
第14觀點係關於一種樹脂透鏡,其係由第7觀點至第11觀點中任一者記載之聚合性組成物所製作者。 The fourteenth viewpoint relates to a resin lens, which is produced by the polymerizable composition described in any one of the seventh to the eleventh viewpoints.
第15觀點係關於一種成形體之製造方法,其係包含:將第7觀點至第11觀點中任一者記載之聚合性組成物填充於互相接合之支持體與鑄模之間的空間;或可分割之鑄模的內部之空間的步驟;及使該被充填之組成物進行曝光而光聚合之步驟。 The fifteenth viewpoint relates to a method of manufacturing a molded body, which comprises: filling the space between the support body and the mold that are joined to each other with the polymerizable composition described in any one of the seventh to the eleventh viewpoints; or The step of dividing the inner space of the mold; and the step of exposing and photopolymerizing the filled composition.
第16觀點係關於第15觀點之製造方法,其進一步包含:從填充有所得之光聚合物之前述空間取出並脫模之步驟;以及,將該光聚合物在該脫模之前、中途或之後進行加熱之步驟。 The 16th viewpoint relates to the manufacturing method of the 15th viewpoint, which further comprises: taking out and demolding the photopolymer from the aforementioned space filled with the obtained photopolymer; and, before, during or after the demolding of the photopolymer Carry out the heating step.
第17觀點係關於第15觀點或第16觀點之製造方法,其中,前述成形體為相機模組用透鏡。 The 17th viewpoint relates to the manufacturing method of the 15th viewpoint or the 16th viewpoint, in which the said molded object is a lens for camera modules.
本發明係藉由對高折射率聚合性化合物使用在1013.25hPa下、23℃之物質的狀態為固體,具有未達 100℃之熔點的化合物,且在100℃之黏度為10mPa‧s以下,其硬化物之D線(589.3nm)的阿貝數為23以下之化合物作為低黏度化劑,可使系統之黏度降低至10000mPa‧s以下或維持於10000mPa‧s以下,且在該系統之硬化物實現優異之光學特性(低阿貝數、高折射率)。 The present invention is based on the use of high refractive index polymerizable compounds at 1013.25hPa and 23°C. The state of the substance is solid and has a low A compound with a melting point of 100°C and a viscosity at 100°C below 10mPa‧s. The compound whose hardened product has an Abbe number of less than 23 on the D line (589.3nm) can be used as a low-viscosity agent to reduce the viscosity of the system. To below 10000mPa‧s or maintain below 10000mPa‧s, and achieve excellent optical properties (low Abbe number, high refractive index) in the cured product of the system.
又,本發明之聚合性組成物可藉由該低黏度化劑之調配實現低黏度化,其操作性會提高,以及其硬化物作為光學裝置例如高解析度相機模組用之透鏡可達成希望之光學特性(低阿貝數、高折射率)。 In addition, the polymerizable composition of the present invention can achieve low viscosity through the blending of the low viscosity agent, its operability will be improved, and its cured product can be used as an optical device such as a lens for a high-resolution camera module. The optical properties (low Abbe number, high refractive index).
因此,由上述聚合性組成物所構成之本發明的高折射率樹脂透鏡用材料可適宜使用作為高解析相機模組用之透鏡。 Therefore, the high-refractive-index resin lens material of the present invention composed of the above-mentioned polymerizable composition can be suitably used as a lens for a high-resolution camera module.
進一步,本發明之聚合性組成物藉由該低黏度化劑之調配,以無溶劑之形態具有可充分操作之黏度,故可適用金屬模具等之鑄模的壓擠加工(壓印技術)而成形,又,來自成形後之該鑄模的離型性亦優異,可適宜製造成形體。 Furthermore, the polymerizable composition of the present invention has a sufficiently manageable viscosity in a solvent-free form by the formulation of the low-viscosity agent, so it can be formed by extrusion processing (imprint technology) of molds such as metal molds In addition, the mold releasability from the mold after molding is also excellent, and the molded body can be suitably manufactured.
進一步,本發明之製造方法因所使用之上述聚合性組成物成為操作性優異者,故可有效率地製造成形體、特別是相機模組用透鏡。 Furthermore, in the manufacturing method of the present invention, since the above-mentioned polymerizable composition used is excellent in operability, it is possible to efficiently manufacture a molded body, particularly a lens for a camera module.
[圖1]圖1係表示在製造例1所得之二甲氧基(伸菲基 -9-基)(4-乙烯基苯基)矽烷的1H NMR光譜圖。 [Fig. 1] Fig. 1 shows the 1 H NMR spectrum of dimethoxy(phenanthryl-9-yl)(4-vinylphenyl)silane obtained in Production Example 1. [Fig.
[圖2]圖2係表示在製造例3所得之三甲氧基(9-菲基)矽烷的1H NMR光譜圖。 [Fig. 2] Fig. 2 shows the 1 H NMR spectrum of trimethoxy(9-phenanthryl)silane obtained in Production Example 3. [Fig.
本發明係關於一種方法,其係使用在1013.25hPa下、23℃之物質的狀態為固體,具有未達100℃之熔點的化合物,且在100℃之黏度為10mPa‧s以下,其硬化物之D線(589.3nm)的阿貝數亦即νD為23以下之化合物,作為後述之高折射率聚合性化合物的低黏度化劑,亦以該低黏度化劑作為本發明之對象。 The present invention relates to a method that uses a compound that is solid at 1013.25hPa and 23℃, has a melting point of less than 100℃, and has a viscosity of 10mPa‧s or less at 100℃. The hardened product is The Abbe number of the D line (589.3 nm), that is, the compound whose ν D is 23 or less, is used as a low-viscosity agent for the high-refractive-index polymerizable compound described later, and this low-viscosity agent is also the object of the present invention.
以下,說明本發明之詳細內容。 Hereinafter, the details of the present invention will be described.
<<低黏度化劑>> <<Low viscosity agent>>
本發明之低黏度化劑如上述,只要在1013.25hPa(亦即大氣壓)下、23℃中為固體之物質,具有未達100℃之熔點,且在100℃之黏度為10mPa‧s以下,而且其硬化物之D線(589.3nm)的阿貝數為23以下之化合物即可,無特別限定。 The low viscosity agent of the present invention is as described above, as long as it is a solid substance at 1013.25hPa (that is, atmospheric pressure) at 23°C, has a melting point of less than 100°C, and has a viscosity of 10mPa‧s or less at 100°C, and The cured product has an Abbe number of 23 or less at D line (589.3 nm), and it is not particularly limited.
前述低黏度化劑可舉例如分別至少各具有1個之芳香族基與具有聚合性雙鍵之基的化合物。在此,所謂聚合性係指藉由熱或光等之外部刺激而分子之一部分進行化學反應,藉進行開裂或分解引起聚合反應之性質。 Examples of the aforementioned low-viscosity agent include compounds each having at least one aromatic group and a group having a polymerizable double bond. Here, the so-called polymerizability refers to the property that a part of the molecule undergoes a chemical reaction by external stimuli such as heat or light, and causes a polymerization reaction by cracking or decomposition.
上述化合物具體上可舉例:至少具有1個選自由可被碳原子數1至6之烷基取代之苯基或伸苯基、具有複數苯環構造之1價或2價之縮合環烴基(可被碳原子數1至6之烷基取代),及複數之芳香環以單鍵直接進行鍵結之1價或2價的烴環集合基(可被碳原子數1至6之烷基取代)所構成之群中的芳香族基,且具有至少1個選自由乙烯基、烯丙基、(甲基)烯丙基氧基及(甲基)丙烯醯基所構成之群中的具有聚合性雙鍵之基的化合物。 The above-mentioned compounds can be specifically exemplified: having at least one monovalent or divalent condensed cyclic hydrocarbon group selected from the group consisting of a phenyl group or a phenylene group which may be substituted by an alkyl group having 1 to 6 carbon atoms, and a plural benzene ring structure (which can be A monovalent or divalent hydrocarbon ring group that is substituted by an alkyl group with 1 to 6 carbon atoms), and a monovalent or divalent hydrocarbon ring group in which multiple aromatic rings are directly bonded with a single bond (which can be substituted by an alkyl group with 1 to 6 carbon atoms) The aromatic group in the group constituted by having at least one polymerizable group selected from the group consisting of vinyl, allyl, (meth)allyloxy and (meth)acrylic groups Compounds based on double bonds.
在上述芳香族基中,具有複數之苯環構造的1價或2價的縮合環烴基,可舉例如由萘、菲、蒽、聯三苯、芘、苯并菲、稠四苯、聯伸苯、茀所衍生之1價或2價之基。 Among the above-mentioned aromatic groups, monovalent or divalent condensed cyclic hydrocarbon groups having a plurality of benzene ring structures include, for example, naphthalene, phenanthrene, anthracene, terphenyl, pyrene, triphenylene, condensed tetraphenyl, and extension A monovalent or divalent radical derived from benzene and pyridium.
又複數之芳香環以單鍵直接進行鍵結之1價或2價的烴環集合基可舉例如由聯苯、聯三苯、聯四苯、聯伸萘、苯基萘、苯基茀、二苯基茀所衍生之1價或2價的基。 In addition, the monovalent or divalent hydrocarbon ring group in which the plural aromatic rings are directly bonded by single bonds can be exemplified by biphenyl, terphenyl, bitetraphenyl, biphenylene, phenylnaphthalene, phenylpyridine, A monovalent or divalent group derived from diphenylpyridine.
又,在上述苯基或伸苯基、1價或2價之縮合環烴基及1價或2價之烴環集合基中,可具有取代基之碳原子數1至6之烷基可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二-丁基、第三-丁基、正戊基、環戊基、正己基、環己基。 In addition, in the above-mentioned phenyl group or phenylene group, monovalent or divalent condensed cyclic hydrocarbon group, and monovalent or divalent hydrocarbon ring group, the alkyl group having 1 to 6 carbon atoms which may have a substituent includes, for example Methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second-butyl, tertiary-butyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl.
此等芳香族基之中,從溶解性、黏度降低或低黏度化之維持的效果、又在調配物中可實現優異之光學特性(高透明性、高折射率、低阿貝數)之觀點而言,可舉例苯基、萘基、菲基為較佳之基。Among these aromatic groups, from the viewpoint of the effect of maintaining solubility, viscosity reduction or low viscosity, and achieving excellent optical properties (high transparency, high refractive index, and low Abbe number) in the formulation In particular, phenyl, naphthyl, and phenanthryl are preferred groups.
分別至少各具有1個之上述特定之芳香族基與具有聚合性雙鍵之基的化合物之具體例,為下述式[1]所示之化合物。 A specific example of a compound each having at least one of the above-mentioned specific aromatic group and a group having a polymerizable double bond is a compound represented by the following formula [1].
上述式[1]中,X表示:至少具有1個之具有聚合性雙鍵之基的苯基、至少具有1個之具有聚合性雙鍵之基的萘基、至少具有1個之具有聚合性雙鍵之基的聯苯基,或至少具有1個之具有聚合性雙鍵之基的菲基;Ar1表示具有複數之苯環構造的縮合環烴基(可被碳原子數1至6之烷基取代),或複數之芳香環以單鍵直接進行鍵結之烴環集合基(可被碳原子數1至6之烷基取代);R1表示甲基、乙基或異丙基。 In the above formula [1], X represents: at least one phenyl group having a polymerizable double bond, at least one naphthyl group having a polymerizable double bond, and at least one polymerizable group A biphenyl group with a double bond, or a phenanthrenyl group with at least one polymerizable double bond; Ar 1 represents a condensed cyclic hydrocarbon group with a plural benzene ring structure (can be substituted by an alkane with 1 to 6 carbon atoms Group substitution), or a hydrocarbon ring group in which multiple aromatic rings are directly bonded by a single bond (which can be substituted by an alkyl group with 1 to 6 carbon atoms); R 1 represents a methyl group, an ethyl group or an isopropyl group.
X表示之至少具有1個具有聚合性雙鍵之基的苯基可舉例如2-乙烯基苯基、3-乙烯基苯基、4-乙烯基苯基、4-乙烯基氧苯基、4-烯丙基苯基、4-烯丙基氧苯基、4-異丙烯基苯基。 The phenyl group represented by X having at least one polymerizable double bond can include, for example, 2-vinylphenyl, 3-vinylphenyl, 4-vinylphenyl, 4-vinyloxyphenyl, 4 -Allylphenyl, 4-allyloxyphenyl, 4-isopropenylphenyl.
X表示之至少具有1個具有聚合性雙鍵之基的萘基可舉例如4-乙烯基伸萘基-1-基、5-乙烯基伸萘基-1-基、6-乙烯基伸萘基-2-基、5-乙烯基氧伸萘基-1-基、5-烯丙基伸萘基-1-基、4-烯丙基氧伸萘基-1-基、5-烯丙基氧伸萘基-1-基、8-烯丙基氧伸萘基-1-基、5-異丙烯基伸萘基-1-基。 The naphthyl group represented by X having at least one polymerizable double bond group includes, for example, 4-vinylnaphthyl-1-yl, 5-vinylnaphthyl-1-yl, and 6-vinylnaphthylene-2. -Base, 5-vinyloxynaphthylene-1-yl, 5-allyloxynaphthylene-1-yl, 4-allyloxynaphthylene-1-yl, 5-allyloxynaphthylene-1-yl 1-yl, 8-allyloxynaphthylene-1-yl, 5-isopropenylnaphthylene-1-yl.
X表示之至少具有1個具有聚合性雙鍵之基的聯苯基可舉例如4’-乙烯基-[1,1’-聯苯基]-2-基、4’-乙烯基-[1,1’-聯苯基]-3-基、4’-乙烯基-[1,1’-聯苯基]-4-基、4’-乙烯基氧-[1,1’-聯苯基]-4-基、4’-烯丙基-[1,1’-聯苯基]-4-基、4’-烯丙基氧-[1,1’-聯苯基]-4-基、4’-異丙烯基-[1,1’-聯苯基]-4-基。 The biphenyl group represented by X having at least one group having a polymerizable double bond includes, for example, 4'-vinyl-[1,1'-biphenyl]-2-yl, 4'-vinyl-[1 ,1'-biphenyl]-3-yl, 4'-vinyl-[1,1'-biphenyl]-4-yl, 4'-vinyloxy-[1,1'-biphenyl ]-4-yl, 4'-allyl-[1,1'-biphenyl]-4-yl, 4'-allyloxy-[1,1'-biphenyl]-4-yl , 4'-isopropenyl-[1,1'-biphenyl]-4-yl.
X表示之至少具有1個具有聚合性雙鍵之基的菲基可舉例如3-乙烯基伸菲基-9-基、7-乙烯基伸菲基-9-基、10-乙烯基伸菲基-9-基、7-乙烯基伸菲基-2-基、6-乙烯基伸菲基-3-基、10-乙烯基伸菲基-3-基、3-乙烯基氧伸菲基-9-基、3-烯丙基伸菲基-9-基、3-烯丙基氧伸菲基-9-基、3-異丙烯基伸菲基-9-基。 The phenanthrenyl group represented by X having at least one polymerizable double bond group includes, for example, 3-vinylphenanthryl-9-yl, 7-vinylphenanthryl-9-yl, 10-vinylphenanthryl-9 -Base, 7-vinylphenanthryl-2-yl, 6-vinylphenanthryl-3-yl, 10-vinylphenanthryl-3-yl, 3-vinyloxyphenanthryl-9-yl, 3 -Allylphenanthryl-9-yl, 3-allyloxyphenanthryl-9-yl, 3-isopropenylphenanthryl-9-yl.
上述X之中,以至少具有1個之具有聚合性雙鍵之基的苯基為較佳,以乙烯基苯基為更佳。 Among the above-mentioned X, a phenyl group having at least one polymerizable double bond is preferable, and a vinyl phenyl group is more preferable.
Ar1表示之具有複數之苯環構造的縮合環烴基可舉例如由萘、菲、蒽、聯三伸苯、芘、苯并菲、稠四苯、聯伸苯、茀所衍生之1價的基。 The condensed cyclic hydrocarbon group with a plural benzene ring structure represented by Ar 1 can include, for example, monovalent monovalent derivatives derived from naphthalene, phenanthrene, anthracene, terphenylene, pyrene, triphenylene, fused tetraphenyl, biphenylene, and pyrene base.
又,複數之芳香環以單鍵直接進行鍵結之烴環集合基可舉例如由聯苯、聯三苯、聯四苯、聯伸萘、苯基萘、苯基茀、二苯基茀所衍生之1價的基。 In addition, the hydrocarbon ring group in which the plural aromatic rings are directly bonded by single bonds can be exemplified by biphenyl, terphenyl, bitetraphenyl, biphenylnaphthalene, phenylnaphthalene, phenylpyrene, and diphenylpyrene. Derived 1-valent base.
又,在上述縮合環烴基及烴環集合基中,可具有作為取代基之碳原子數1至6之烷基可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二-丁基、第三-丁基、正戊基、環戊基、正己基、環己基。 In addition, in the above-mentioned condensed cyclic hydrocarbon group and hydrocarbon ring assembly group, the alkyl group having 1 to 6 carbon atoms that may have as a substituent includes, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, Isobutyl, second-butyl, tertiary-butyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl.
上述Ar1之中,以具有複數之苯環構造的縮合環烴基(可被碳原子數1至6之烷基取代)為較佳,以菲基為更佳。 Among the above-mentioned Ar 1 , a condensed cyclic hydrocarbon group (which may be substituted with an alkyl group having 1 to 6 carbon atoms) having a plural benzene ring structure is preferable, and a phenanthryl group is more preferable.
上述式[1]所示之化合物之具體例可舉例如二甲氧基(9-菲基)(4-乙烯基苯基)矽烷、二乙氧基(9-菲基)(4-乙烯基苯基)矽烷、二異丙氧基(9-菲基)(4-乙烯基苯基)矽烷、二甲氧基(9-菲基)(4-乙烯基伸萘基-1-基)矽烷、二甲氧基(9-菲基)(4’-乙烯基-[1,1’-聯苯基]-4-基)矽烷、二甲氧基(9-菲基)(3-乙烯基伸菲基-9-基)矽烷、二甲氧基(1-萘基)(4-乙烯基苯基)矽烷、二甲氧基(2-萘基)(4-乙烯基苯基)矽烷、二甲氧基(2-菲基)(4-乙烯基苯基)矽烷、二甲氧基(3-菲基)(4-乙烯基苯基)矽烷、二甲氧基(9-菲基)(4-乙烯基苯基)矽烷、[1,1’-聯苯基]-4-基二甲氧基(4-乙烯基苯基)矽烷,但不限定於此等。 Specific examples of the compound represented by the above formula [1] include dimethoxy (9-phenanthryl) (4-vinylphenyl) silane, diethoxy (9-phenanthryl) (4-vinyl) Phenyl) silane, diisopropoxy (9-phenanthryl) (4-vinylphenyl) silane, dimethoxy (9-phenanthryl) (4-vinyl naphthyl-1-yl) silane, Dimethoxy(9-phenanthryl)(4'-vinyl-[1,1'-biphenyl]-4-yl)silane, dimethoxy(9-phenanthryl)(3-vinylphenanthrene) -9-yl) silane, dimethoxy (1-naphthyl) (4-vinylphenyl) silane, dimethoxy (2-naphthyl) (4-vinylphenyl) silane, dimethyl Oxy (2-phenanthryl) (4-vinylphenyl) silane, dimethoxy (3-phenanthryl) (4-vinylphenyl) silane, dimethoxy (9-phenanthryl) (4 -Vinylphenyl)silane, [1,1'-biphenyl]-4-yldimethoxy(4-vinylphenyl)silane, but not limited to these.
又,分別至少各具有1個之上述特定之芳香族基與具有聚合性雙鍵之基的化合物之具體例,為下述式[2]所示之化合物。 In addition, specific examples of compounds each having at least one of the above-mentioned specific aromatic group and a group having a polymerizable double bond are compounds represented by the following formula [2].
上述式[2]中,Ar2表示q價之芳香族烴殘基;q表示1或2;Y表示單鍵、-O-C(=O)-基或-O-基;R2表示氫原子或甲基。 In the above formula [2], Ar 2 represents a q-valent aromatic hydrocarbon residue; q represents 1 or 2; Y represents a single bond, -OC(=O)- group or -O- group; R 2 represents a hydrogen atom or methyl.
Ar2中之上述q價的芳香族烴殘基可舉例如從苯、具有複數之苯環構造的縮合環烴、或複數之芳香環以單鍵直接進行鍵結之烴環集合物除去q個氫原子之基,此等可被碳原子數1至6之烷基取代。 The q-valent aromatic hydrocarbon residues in Ar 2 can be, for example, removed from benzene, a condensed cyclic hydrocarbon having a plural benzene ring structure, or a hydrocarbon ring assembly in which plural aromatic rings are directly bonded with a single bond. The groups of hydrogen atoms may be substituted by alkyl groups having 1 to 6 carbon atoms.
具體而言,可被碳原子數1至6之烷基取代之苯基或伸苯基、具有複數之苯環構造的1價或2價之縮合環烴基(可被碳原子數1至6之烷基取代)、或複數之芳香環以單鍵直接進行鍵結之1價或2價的烴環集合基(可被碳原子數1至6之烷基取代)。 Specifically, a phenyl group or a phenylene group substituted by an alkyl group having 1 to 6 carbon atoms, a monovalent or divalent condensed cyclic hydrocarbon group having a plural benzene ring structure (which can be substituted by a carbon atom number of 1 to 6 Alkyl substitution), or a monovalent or divalent hydrocarbon ring group in which multiple aromatic rings are directly bonded with a single bond (which can be substituted by an alkyl group with 1 to 6 carbon atoms).
Ar2表示之可被碳原子數1至6之烷基取代之苯基可舉例如苯基、o-甲苯基、m-甲苯基、p-甲苯基、2,4,6-三甲基苯基、4-第三-丁基苯基,可被碳原子數1至6之烷基取代之伸苯基可舉例如伸苯基、2,4-甲基伸苯基、2,5-甲基伸苯基、2,4,5-三甲基-1,3-伸苯基、2-第三-丁基-1,4-伸苯基。 The phenyl group represented by Ar 2 which may be substituted by an alkyl group having 1 to 6 carbon atoms includes, for example, phenyl, o-tolyl, m-tolyl, p-tolyl, 2,4,6-trimethylbenzene Phenyl groups, 4-tert-butylphenyl groups, and phenylene groups that may be substituted with alkyl groups having 1 to 6 carbon atoms include, for example, phenylene groups, 2,4-methylphenylene groups, and 2,5-methyl phenylene groups. Phenylene, 2,4,5-trimethyl-1,3-phenylene, 2-tert-butyl-1,4-phenylene.
Ar2表示之具有複數之苯環構造的1價或2價之縮合環烴基可舉例如由萘、菲、蒽、聯三伸苯、芘、苯并菲、稠四苯、聯伸苯、茀所衍生之1價或2價的基。 Ar 2 represents a monovalent or divalent condensed ring hydrocarbon group with a plural benzene ring structure, for example, from naphthalene, phenanthrene, anthracene, tetraphenylene, pyrene, triphenylene, fused tetraphenyl, biphenylene, pyrene The derived monovalent or divalent base.
又,複數之芳香環以單鍵直接進行鍵結之1價或2價的烴環集合基可舉例如由聯苯、聯三苯、聯四苯、聯伸萘、苯基萘、苯基茀、二苯基茀所衍生之1價或2價的基。 In addition, the monovalent or divalent hydrocarbon ring assembly group in which plural aromatic rings are directly bonded by single bonds can be exemplified by biphenyl, terphenyl, bitetraphenyl, biphenylene, phenylnaphthalene, and phenylpyridine. , A monovalent or divalent group derived from diphenylpyridine.
又,在上述縮合環烴基及烴環集合基中,可具有作為取代基之碳原子數1至6之烷基可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二-丁基、第三-丁基、 正戊基、環戊基、正己基、環己基。 In addition, in the above-mentioned condensed cyclic hydrocarbon group and hydrocarbon ring assembly group, the alkyl group having 1 to 6 carbon atoms that may have as a substituent includes, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, Isobutyl, second-butyl, tertiary-butyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl.
上述式[2]所示之化合物的具體例可舉例如1-乙烯基萘、2-乙烯基萘、2-異丙烯基萘、2,7-雙(4-乙烯基苯基)萘、萘-1-基甲基(甲基)丙烯酸酯、萘-2-基甲基(甲基)丙烯酸酯。 Specific examples of the compound represented by the above formula [2] include, for example, 1-vinylnaphthalene, 2-vinylnaphthalene, 2-isopropenylnaphthalene, 2,7-bis(4-vinylphenyl)naphthalene, naphthalene -1-yl methyl (meth) acrylate, naphth-2-yl methyl (meth) acrylate.
本發明之低黏度化劑可舉例如下述式[3-1]至式[3-4]所示之化合物,其中,式[3-1]及式[3-2]所示之化合物從黏度之降低/維持的效果、以及實現優異之光學特性(低阿貝數)的觀點而言,為較佳,特佳係式[3-1]所示之化合物。 The low-viscosity agent of the present invention can be exemplified by the compounds represented by the following formula [3-1] to formula [3-4], wherein the compounds represented by the formula [3-1] and formula [3-2] vary from the viscosity The reduction/maintenance effect and the viewpoint of achieving excellent optical properties (low Abbe number) are preferable, and the compound represented by formula [3-1] is particularly preferable.
上述式中,R1表示甲基、乙基或異丙基。 In the above formula, R 1 represents a methyl group, an ethyl group or an isopropyl group.
本發明之低黏度化劑可適宜使用作為市售品之化合物。 The low-viscosity agent of the present invention can be suitably used as a commercially available compound.
又,例如式[3-4]所示之化合物等之含有(甲基)丙烯醯基之酯化合物可以常用之方法製造,藉由使醇及(甲基)丙烯酸鹵素化物在三乙基胺或吡啶存在下酯化反應來製造。 In addition, for example, the compound represented by the formula [3-4] and the like, the ester compound containing (meth)acryloyl group can be produced by a common method, by making alcohol and (meth)acrylic acid halide in triethylamine or It is produced by esterification in the presence of pyridine.
又,上述式[3-1]及式[3-3]所示之化合物(前述式[1]所示之化合物)係可以常用之方法來製造,例如使烷氧基矽烷化合物與格任亞(Grignard)試藥反應而獲得有機烷氧基矽烷化合物之以往的格任亞反應;或使烷氧基氫矽烷化合物與芳基鹵素化物使用過渡金屬觸媒反應而獲得有機烷氧基矽烷化合物之以往之耦合反應來製造。 In addition, the compound represented by the above formula [3-1] and formula [3-3] (the compound represented by the above formula [1]) can be produced by a commonly used method, for example, the alkoxysilane compound is combined with a glycine (Grignard) Reagent reaction to obtain the organic alkoxysilane compound in the past Grignard subreaction; or the alkoxyhydrosilane compound and the aryl halide compound are reacted with a transition metal catalyst to obtain the organic alkoxysilane compound It is manufactured by coupling reaction in the past.
詳而言之,具有Ar1基之格任亞試藥:Ar1-Mg-Hal、與具有具聚合性雙鍵之芳香環基之三烷氧基矽烷化合物:X-Si(OR1)3反應,或,具有具聚合性雙鍵之芳香環基的格任亞試藥:X-Mg-Hal、與具有Ar1基之三烷氧基矽烷化合物:Ar1-Si(OR1)3反應,可獲得式[1]所示之聚合性矽烷化合物(上述Ar1、X、R1表示與前述式[1]相同之意義,Hal表示鹵素原子)。 In detail, the sub-reagents with Ar 1 group: Ar 1 -Mg-Hal, and the trialkoxysilane compound with the aromatic ring group with polymerizable double bond: X-Si(OR 1 ) 3 Reaction, or, Gren sub-reagents with aromatic ring groups with polymerizable double bonds: X-Mg-Hal, and trialkoxysilane compounds with Ar 1 groups: Ar 1 -Si(OR 1 ) 3 , The polymerizable silane compound represented by the formula [1] can be obtained (the above Ar 1 , X, and R 1 have the same meaning as in the aforementioned formula [1], and Hal represents a halogen atom).
前述格任亞試藥可藉由鹵素化芳基:Ar1-Hal或X-Hal、與鎂之反應製得。 The aforementioned Gren sub-reagents can be prepared by halogenating aryl groups: Ar 1 -Hal or X-Hal, and reacting with magnesium.
上述格任亞試藥之製造、以及、格任亞試藥與烷氧基矽烷化合物之反應可在有機溶劑中實施。在此所使用之有機溶劑可舉例如二乙基醚、四氫呋喃、第三-丁基甲基醚等之醚系溶劑;己烷、甲苯、二甲苯等之烴系溶劑等的惰性有機溶劑。此等有機溶劑可一種單獨使用或將二種以上混合而使用。 The preparation of the above reagent and the reaction between the reagent and the alkoxysilane compound can be carried out in an organic solvent. Examples of the organic solvent used here include ether solvents such as diethyl ether, tetrahydrofuran, and tertiary butyl methyl ether; and inert organic solvents such as hydrocarbon solvents such as hexane, toluene, and xylene. These organic solvents can be used alone or in combination of two or more.
上述之製造溫度以及反應溫度以0~200℃,尤其以20~150℃之範圍為較佳。 The above-mentioned manufacturing temperature and reaction temperature are preferably in the range of 0 to 200°C, especially 20 to 150°C.
又,若在格任亞試藥之製造時,或格任亞試藥與烷氧 基矽烷化合物之反應系存在氧,在製造/反應階段格任亞試藥與氧反應,成為目的物之聚合性矽烷化合物之收率降低的原因,故此等可在氮氣、氬氣等之惰性環境下進行。 In addition, if oxygen is present during the manufacture of the reagent, or the reaction between the reagent and the alkoxysilane compound, the reagent reacts with oxygen during the production/reaction stage to form the polymerization of the target substance. Because of the decrease in the yield of the silane compound, it can be carried out in an inert environment such as nitrogen and argon.
上述低黏度化劑可一種單獨使用,或將二種以上組合而使用。 The aforementioned low-viscosity agent can be used alone or in combination of two or more kinds.
<<高折射率聚合性化合物>> <<High refractive index polymerizable compound>>
關於本發明之低黏度化劑係對於至少具有1個之聚合性雙鍵,且其硬化物之D線(589.3nm)的折射率,亦即nD為1.60以上之高折射率聚合性化合物而使用。 The low-viscosity agent of the present invention is a high-refractive-index polymerizable compound having at least one polymerizable double bond and the refractive index of the D line (589.3 nm) of the cured product, that is, n D of 1.60 or more. use.
上述高折射率聚合性化合物如上述,只要為例如具有可聚合之基,而且在其硬化物中具有1.60以上之高折射率的化合物即可,無特別限定,但可舉例如以下所示之特定之反應性聚矽氧烷,或特定之茀化合物。 The above-mentioned high refractive index polymerizable compound is as described above, and it is not particularly limited as long as it has a polymerizable group and has a high refractive index of 1.60 or more in its cured product, and it is not particularly limited, but for example, the specific ones shown below The reactive polysiloxanes, or specific sulphur compounds.
<反應性聚矽氧烷> <Reactive Polysiloxane>
上述反應性聚矽氧烷包含:式[4]所示之烷氧基矽化合物A之聚縮合物、及式[4]所示之烷氧基矽化合物A及式[5]所示之烷氧基矽化合物B之聚縮合物之至少一者。 The above-mentioned reactive polysiloxane includes: the polycondensate of the alkoxysilicon compound A represented by the formula [4], the alkoxysilicon compound A represented by the formula [4] and the alkane represented by the formula [5] At least one of polycondensates of oxysilicate compound B.
上述式[4]中,X表示:至少具有1個之具有聚合性雙鍵之取代基的苯基、至少具有1個之具有聚合性雙鍵之取代基的萘基、至少具有1個之具有聚合性雙鍵之取代基的聯苯基,或至少具有1個之具有聚合性雙鍵之取代基的菲基;Ar3表示可被碳原子數1至6之烷基取代之苯基、具有複數之苯環構造的縮合環烴基(可被碳原子數1至6之烷基取代),或複數之芳香環以單鍵直接鍵結之烴環集合基(可被碳原子數1至6之烷基取代);R3表示甲基、乙基或異丙基;上述式[4]中之X之具體例可舉出在前述式[1]所示之化合物中,舉出作為該式[1]中之基X的基,特別可舉例在式[1]中之基X中舉出作為較佳之基的基。 In the above formula [4], X represents: at least one phenyl group having a polymerizable double bond substituent, at least one naphthyl group having a polymerizable double bond substituent, and at least one A biphenyl group as a substituent of a polymerizable double bond, or a phenanthryl group having at least one substituent with a polymerizable double bond; Ar 3 represents a phenyl group that may be substituted by an alkyl group having 1 to 6 carbon atoms, and has A condensed cyclic hydrocarbon group composed of plural benzene rings (which can be substituted by an alkyl group having 1 to 6 carbon atoms), or a hydrocarbon ring group in which a plurality of aromatic rings are directly bonded by a single bond (which can be replaced by a hydrocarbon ring group of 1 to 6 carbon atoms). Alkyl substitution); R 3 represents a methyl group, an ethyl group or an isopropyl group; specific examples of X in the above formula [4] can be exemplified in the compound represented by the aforementioned formula [1], as the formula [ 1] The group of the group X in the formula [1] can be exemplified as a preferable group.
又上述式[4]中之Ar4之具體例可舉例如舉出作為前述式[1]中之基Ar1的基,特別可舉例如在式[4]中之基Ar1中舉出作為較佳之基的基。 In addition, specific examples of Ar 4 in the above formula [4] include, for example, the group as the group Ar 1 in the aforementioned formula [1], and particularly, for example, the group Ar 1 in the formula [4] can be cited as The preferred base of the base.
而且,上述式[4]所示之化合物之具體例舉出作為前述式[1]所示之化合物之具體例的化合物。 Furthermore, specific examples of the compound represented by the aforementioned formula [4] include compounds which are specific examples of the compound represented by the aforementioned formula [1].
[化學式13]Ar 4 -Si(OR 4 ) 3 [5] [Chemical formula 13] Ar 4 -Si(OR 4 ) 3 [5]
式[5]中,Ar4表示可被碳原子數1至6之烷基取代之苯基、具有複數之苯環構造的縮合環烴基(可被碳原子數1至6之烷基取代),或複數之芳香環以單鍵直接進行鍵結 之烴環集合基(可被碳原子數1至6之烷基取代);R4表示甲基、乙基或異丙基。) In formula [5], Ar 4 represents a phenyl group which may be substituted by an alkyl group having 1 to 6 carbon atoms, or a condensed cyclic hydrocarbon group having a plural benzene ring structure (which may be substituted by an alkyl group having 1 to 6 carbon atoms), Or a hydrocarbon ring group in which a plurality of aromatic rings are directly bonded by a single bond (which can be substituted by an alkyl group with 1 to 6 carbon atoms); R 4 represents a methyl group, an ethyl group or an isopropyl group. )
Ar4表示之可被碳原子數1至6之烷基取代之苯基可舉例如苯基、o-甲苯基、m-甲苯基、p-甲苯基、2,4,6-三甲基苯基、4-第三-丁基苯基。 The phenyl group represented by Ar 4 which may be substituted by an alkyl group having 1 to 6 carbon atoms includes, for example, phenyl, o-tolyl, m-tolyl, p-tolyl, 2,4,6-trimethylbenzene Group, 4-tert-butylphenyl.
Ar4表示之具有複數之苯環構造的縮合環烴基可舉例如由萘、菲、蒽、聯三伸苯、芘、苯并菲、稠四苯、聯伸苯、茀所衍生之1價的基。 The condensed cyclic hydrocarbon group with a plural benzene ring structure represented by Ar 4 can include, for example, monovalent monovalent derivatives derived from naphthalene, phenanthrene, anthracene, terphenylene, pyrene, triphenylene, fused tetraphenyl, biphenylene, and pyrene base.
又,複數之芳香環以單鍵直接進行鍵結之烴環集合基可舉例如由聯苯、聯三苯、聯四苯、聯伸萘、苯基萘、苯基茀、二苯基茀衍生之1價的基。 In addition, the hydrocarbon ring group in which the plural aromatic rings are directly bonded by single bonds may be, for example, those derived from biphenyl, terphenyl, bitetraphenyl, biphenylene, phenylnaphthalene, phenylpyrene, and diphenylpyrene. The base of the price of one.
又,在上述縮合環烴基及烴環集合基中,可具有作為取代基之碳原子數1至6之烷基可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二-丁基、第三-丁基、正戊基、環戊基、正己基、環己基。 In addition, in the above-mentioned condensed cyclic hydrocarbon group and hydrocarbon ring assembly group, the alkyl group having 1 to 6 carbon atoms that may have as a substituent includes, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, Isobutyl, second-butyl, tertiary-butyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl.
上述Ar4之中,以具有複數之苯環構造之縮合環烴基(可被碳原子數1至6之烷基取代)為較佳,以菲基為更佳。 Among the above-mentioned Ar 4 , a condensed cyclic hydrocarbon group (which may be substituted with an alkyl group having 1 to 6 carbon atoms) having a plural benzene ring structure is preferable, and a phenanthrene group is more preferable.
上述式[5]所示之化合物的具體例可舉例如三甲氧基(苯基)矽烷、三乙氧基(苯基)矽烷、三甲氧基(對-甲苯基)矽烷、三甲氧基(1-萘基)矽烷、三乙氧基(1-萘基)矽烷、三異丙氧基(1-萘基)矽烷、三甲氧基(2-萘基)矽烷、三乙氧基(2-萘基)矽烷、三異丙氧基(2-萘基)矽烷、三甲氧基(2-菲基)矽烷、三甲氧基 (3-菲基)矽烷、三甲氧基(9-菲基)矽烷、三乙氧基(9-菲基)矽烷、三異丙氧基(9-菲基)矽烷、[1,1’-聯苯基]-4-基三甲氧基矽烷、[1,1’-聯苯基]-4-基三乙氧基矽烷、[1,1’-聯苯基]-4-基三異丙氧基矽烷,不限定於此等。 Specific examples of the compound represented by the above formula [5] include, for example, trimethoxy (phenyl) silane, triethoxy (phenyl) silane, trimethoxy (p-tolyl) silane, trimethoxy (1 -Naphthyl) silane, triethoxy (1-naphthyl) silane, triisopropoxy (1-naphthyl) silane, trimethoxy (2-naphthyl) silane, triethoxy (2-naphthalene) Group) silane, triisopropoxy (2-naphthyl) silane, trimethoxy (2-phenanthryl) silane, trimethoxy (3-phenanthryl) silane, trimethoxy (9-phenanthryl) silane, Triethoxy(9-phenanthryl)silane, triisopropoxy(9-phenanthryl)silane, [1,1'-biphenyl]-4-yltrimethoxysilane, [1,1'- Biphenyl]-4-yltriethoxysilane and [1,1'-biphenyl]-4-yltriisopropoxysilane are not limited to these.
構成上述反應性聚矽氧烷之烷氧基矽化合物,除了式[4]所示之烷氧基矽化合物A以外,當含有式[5]所示之烷氧基矽化合物B時,關於此等烷氧基矽化合物之聚縮合反應的調配莫耳比無特別限定,但從使硬化物之物性安定之目的,通常,相對於烷氧基矽化合物A1莫耳,以烷氧基矽化合物B9莫耳以下之範圍為較佳。更佳為以1.5莫耳以下所調配之範圍。相對於烷氧基矽化合物A之調配莫耳數,使烷氧基矽化合物B之調配莫耳比設為9以下,可獲得充分之交聯密度,對熱之尺寸安定性更提高,且可獲得具有更高折射率、低阿貝數之硬化物。 The alkoxy silicon compound constituting the above reactive polysiloxane, in addition to the alkoxy silicon compound A represented by the formula [4], when it contains the alkoxy silicon compound B represented by the formula [5], about this The molar ratio of the polycondensation reaction of the alkoxysilicon compound is not particularly limited, but for the purpose of stabilizing the physical properties of the cured product, generally, the alkoxysilicon compound B9 is used relative to the alkoxysilicon compound A1 molar ratio. The range of less than mol is preferable. More preferably, it is a range of less than 1.5 mol. Compared with the molar ratio of the alkoxysilicon compound A, the molar ratio of the alkoxysilicon compound B is set to 9 or less to obtain a sufficient cross-linking density, and the dimensional stability to heat is improved. Obtain a hardened product with a higher refractive index and a low Abbe number.
上述之烷氧基矽化合物A及烷氧基矽化合物B可依需要而適當選擇化合物而使用,又,亦可各別併用複數種之化合物。此時之調配莫耳比,烷氧基矽化合物A之莫耳量之總計與烷氧基矽化合物B之莫耳量之總計的比亦成為上述之範圍。 The above-mentioned alkoxysilicon compound A and alkoxysilicon compound B can be used by appropriately selecting compounds according to needs, and plural kinds of compounds can also be used in combination. At this time, the molar ratio of the compounding ratio, the ratio of the total molar amount of the alkoxide silicon compound A to the total molar amount of the alkoxide silicon compound B also falls within the above-mentioned range.
上述式[4]所示之烷氧基矽化合物A之聚縮合反應、或又包含上述式[4]所示之烷氧基矽化合物A與上述式[5]所示之烷氧基矽化合物B的烷氧基矽化合物之聚縮合反應,適 宜在酸或鹼性觸媒之存在下實施。 The polycondensation reaction of the alkoxy silicon compound A represented by the above formula [4], or the alkoxy silicon compound A represented by the above formula [4] and the alkoxy silicon compound represented by the above formula [5] The polycondensation reaction of the alkoxysilicon compound of B is suitably carried out in the presence of an acid or alkaline catalyst.
使用於上述聚縮合反應之觸媒係只要溶解於後述之溶劑中,或均勻分散,其種類無特別限定,而可依需要而適當選擇使用。 The type of the catalyst used in the above-mentioned polycondensation reaction is not particularly limited as long as it is dissolved in the solvent described below or uniformly dispersed, and it can be appropriately selected and used according to needs.
可使用之觸媒可舉例如:酸性化合物係可舉例如鹽酸、硝酸、硫酸等之無機酸、乙酸、草酸等之有機酸;鹼性化合物係可舉例如鹼金屬氫氧化物、鹼土族金屬氫氧化物、氫氧化銨、第四級銨鹽、胺類;氟化物鹽係可舉例如NH4F、NR4F。又,在此R為由氫原子、碳原子數1至12之直鏈狀烷基、碳原子數3至12之分枝狀烷基、碳原子數3至12之環狀烷基所構成之群中之一種以上之基。 Examples of catalysts that can be used include acidic compounds such as inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, and organic acids such as acetic acid and oxalic acid; examples of basic compounds include alkali metal hydroxides and alkaline earth metal hydrogens. Oxides, ammonium hydroxide, quaternary ammonium salts, amines; fluoride salt series include, for example, NH 4 F and NR 4 F. Also, here R is composed of a hydrogen atom, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, and a cyclic alkyl group having 3 to 12 carbon atoms. The base of more than one kind in the group.
此等觸媒可一種單獨使用或亦可併用複數種。 These catalysts may be used alone or in combination of plural kinds.
上述酸性化合物係可舉例如鹽酸、硝酸、硫酸、乙酸、草酸、硼酸。 Examples of the acidic compound system include hydrochloric acid, nitric acid, sulfuric acid, acetic acid, oxalic acid, and boric acid.
上述鹼性化合物係可舉例如氫氧化鈉、氫氧化鉀、氫氧化鎂、氫氧化鈣、氫氧化鍶、氫氧化鋇、氫氧化銨、氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丁基銨、三乙基胺。 The above-mentioned basic compound system includes, for example, sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, ammonium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, Tetrabutylammonium hydroxide, triethylamine.
上述氟化物鹽係可舉例如氟化銨、氟化四甲基銨、氟化四丁基銨。 Examples of the fluoride salt system include ammonium fluoride, tetramethylammonium fluoride, and tetrabutylammonium fluoride.
此等觸媒之中,較宜使用者為選自由鹽酸、乙酸、氫氧化鉀、氫氧化鈣、氫氧化鋇及氫氧化四乙基銨所構成之群中之一種以上。 Among these catalysts, the preferred user is one or more selected from the group consisting of hydrochloric acid, acetic acid, potassium hydroxide, calcium hydroxide, barium hydroxide, and tetraethylammonium hydroxide.
觸媒之使用量相對於前述烷氧基矽化合物之總質量, 為0.01~10質量%,較佳為0.1~5質量%。使觸媒之使用量設為0.01質量%以上,反應會更良好地進行。又,若可量經濟性,以使用10質量%以下為充分。 The amount of the catalyst used is 0.01-10% by mass, preferably 0.1-5% by mass relative to the total mass of the aforementioned alkoxysilicon compound. If the amount of catalyst used is 0.01% by mass or more, the reaction will proceed more satisfactorily. In addition, if economical efficiency is possible, it is sufficient to use 10% by mass or less.
上述反應性聚矽氧烷(聚縮合物)係烷氧基矽化合物A之構造成為一個特徵,且在該烷氧基矽化合物A所含之反應性基(聚合性雙鍵)藉由自由基或陽離子而容易地聚合,聚合後(硬化後)顯示高的耐熱性。 The above-mentioned reactive polysiloxane (polycondensate) is a feature of the structure of the alkoxysilicon compound A, and the reactive group (polymerizable double bond) contained in the alkoxysilicon compound A is caused by free radicals. Or it is cationically and easily polymerized, and shows high heat resistance after polymerization (after curing).
烷氧基矽化合物A之水解聚縮合反應、或/又烷氧基矽化合物A與烷氧基矽化合物B之水解聚縮合反應亦可在無溶劑下進行,但相對於後述之四氫呋喃(THF)等之使用之烷氧基矽化合物,亦可使用惰性溶劑作為反應溶劑。使用反應溶劑時,有容易使反應系均勻,可進行更安定之聚縮合反應的優點。 The hydrolysis polycondensation reaction of the alkoxysilicon compound A, or/and the hydrolysis polycondensation reaction of the alkoxysilicon compound A and the alkoxysilicon compound B can also be carried out without a solvent, but compared to the tetrahydrofuran (THF) described later For the alkoxy silicon compound used in other applications, an inert solvent can also be used as the reaction solvent. When a reaction solvent is used, it is easy to make the reaction system uniform, and has the advantage that a more stable polycondensation reaction can be carried out.
反應性聚矽氧烷之合成反應如前述般,亦可以無溶劑進行,但為使反應更均勻化,即使使用溶劑亦無問題。只要溶劑不與使用之烷氧基矽化合物反應,而使其聚縮合物溶解者即可,無特別限定。 The synthesis reaction of the reactive polysiloxane can be carried out without a solvent as described above, but in order to make the reaction more uniform, there is no problem even if a solvent is used. It is not particularly limited as long as the solvent does not react with the alkoxysilicon compound used, but dissolves the polycondensate.
如此之反應溶劑可舉例如丙酮、甲基乙基酮(MEK)等之酮類;苯、甲苯、二甲苯等之芳香族烴類;四氫呋喃(THF)、1,4-二烷、二異丙基醚、環戊基甲基醚(CPME)等之醚類;乙二醇、丙二醇、己二醇等之二醇類;乙基溶纖劑、丁基溶纖劑、乙基卡必醇、丁基卡必 醇、二乙基溶纖劑、二乙基卡必醇等之二醇醚類;N-甲基-2-吡咯啶酮(NMP)、N,N-二甲基甲醯胺(DMF)等之醯胺類。此等溶劑可一種單獨使用、或混合二種以上使用。 Such reaction solvents include, for example, ketones such as acetone and methyl ethyl ketone (MEK); aromatic hydrocarbons such as benzene, toluene, and xylene; tetrahydrofuran (THF), 1,4-bis Ethers such as alkane, diisopropyl ether, cyclopentyl methyl ether (CPME), etc.; glycols such as ethylene glycol, propylene glycol, hexanediol, etc.; ethyl cellosolve, butyl cellosolve, ethyl card Glycol ethers such as alcohol, butyl carbitol, diethyl cellosolve, diethyl carbitol; N-methyl-2-pyrrolidone (NMP), N,N-dimethyl Dimethamides such as formamide (DMF). These solvents can be used alone or in combination of two or more.
在本發明使用之反應性聚矽氧烷,可藉由使式[4]所示之烷氧基矽化合物A、或又包含式[4]所示之烷氧基矽化合物A與式[5]所示之烷氧基矽化合物B之烷氧基矽化合物在酸或鹼性觸媒之存在下進行水解聚縮合而得。有關水解聚縮合之反應溫度為20~150℃,更佳為30~120℃。 The reactive polysiloxane used in the present invention can be obtained by using the alkoxysilicon compound A represented by the formula [4] or the alkoxysilicon compound A represented by the formula [4] and the formula [5] ] The alkoxysilicon compound of the alkoxysilicon compound B shown in the figure is obtained by hydrolysis and polycondensation in the presence of an acid or alkaline catalyst. The reaction temperature for hydrolysis polycondensation is 20 to 150°C, more preferably 30 to 120°C.
若聚縮合物之分子量增加終止,分子量分布安定所需之時間以上的話,反應時間係無特別限制,而更具體地為數小時至數日。 If the increase in the molecular weight of the polycondensate is terminated and the molecular weight distribution is stable for longer than the time required, the reaction time is not particularly limited, and more specifically it is several hours to several days.
聚縮合反應終止後,將所得之反應性聚矽氧烷以過濾、溶劑餾去等之任意方法回收,依需要而適當進行純化處理為較佳。 After the polycondensation reaction is terminated, the obtained reactive polysiloxane is recovered by any method such as filtration, solvent distillation, etc., and it is preferable to perform an appropriate purification treatment as needed.
在本發明使用之反應性聚矽氧烷之製造方法之一例,可舉例使式[4]所示之烷氧基矽化合物A、或又包含式[4]所示之烷氧基矽化合物A與式[5]所示之烷氧基矽化合物B之烷氧基矽化合物在鹼之存在下聚縮合,使用陽離子交換樹脂除去鹼而構成之方法。 As an example of the production method of the reactive polysiloxane used in the present invention, the alkoxysilicon compound A represented by the formula [4] or the alkoxysilicon compound A represented by the formula [4] can be exemplified A method consisting of polycondensation with the alkoxy silicon compound B represented by the formula [5] in the presence of an alkali, and using a cation exchange resin to remove the alkali.
上述鹼以及其使用量係可採用選自由上述之鹼性化合物及氟化物鹽所構成之群中的一種以上之化合物,又其使用量,較佳係可使用選自由氫氧化鉀、氫氧化鈣、氫氧化 鋇及氫氧化四乙基銨所構成之群中之一種以上者作為鹼。 The above-mentioned base and its usage amount can be one or more compounds selected from the group consisting of the above-mentioned basic compounds and fluoride salts, and the usage amount is preferably selected from potassium hydroxide and calcium hydroxide. One or more of the group consisting of barium hydroxide and tetraethylammonium hydroxide is used as a base.
又,使用於聚縮合反應之反應條件等或反應溶劑等可採用上述者。 In addition, the reaction conditions and the like used in the polycondensation reaction, the reaction solvent, and the like can be those described above.
而且,反應終止後,使用於鹼之除去的陽離子交換樹脂係使用具有磺基作為離子基之離子交換樹脂為較佳。 Furthermore, after the reaction is terminated, the cation exchange resin used for alkali removal is preferably an ion exchange resin having a sulfonic group as an ionic group.
上述陽離子交換樹脂可使用苯乙烯系(苯乙烯-二乙烯基苯共聚物)、丙烯酸系等一般所使用之母體構造者。又,可為具有磺基作為離子基之強酸性陽離子交換樹脂、具有羧基作為離子基之弱酸性陽離子交換樹脂的任一者。進一步,陽離子交換樹脂之形態可使用如粒狀、纖維狀、膜狀之各種者。此等陽離子交換樹脂可適宜使用市售者。 The above-mentioned cation exchange resin may use a matrix structure generally used such as styrene (styrene-divinylbenzene copolymer) and acrylic. In addition, it may be any one of a strong acid cation exchange resin having a sulfo group as an ionic group, and a weak acid cation exchange resin having a carboxyl group as an ionic group. Furthermore, various forms of the cation exchange resin can be used, such as granular, fibrous, and film-like. Commercially available cation exchange resins can be suitably used.
其中,以使用具有磺基作為離子基之強酸性陽離子交換樹脂為較佳。 Among them, it is preferable to use a strongly acidic cation exchange resin having a sulfo group as an ionic group.
市售之強酸性陽離子交換樹脂可舉例如Amberlite(註冊商標)15、Amberlite200、Amberlite200C、Amberlite200CT、Amberlite252、Amberlite1200H、AmberliteIR120B、AmberliteIR120H、AmberliteIR122Na、AmberliteIR124、AmberliteIRC50、AmberliteIRC86、AmberliteIRN77、AmberliteIRP-64、AmberliteIRP-69、AmberliteCG-50、AmberliteCG-120、Amberjet(註冊商標)1020、Amberjet1024、Amberjet1060、Amberjet1200、Amberjet1220、Amberlist(註冊商標)15、Amberlist15DRY、Amberlist15JWET、Amberlist16、 Amberlist16WET、Amberlist31WET、Amberlist35WET、Amberlist36、Dowex(註冊商標)50Wx2、Dowex50Wx4、Dowex50Wx8、DowexDR-2030、DowexDR-G8、DowexHCR-W2、Dowex650C UPW、DowexG-26、Dowex88、DowexM-31、DowexN-406、Dowex(註冊商標)Monosphere(註冊商標)650C、Dowex Monosphere88、Dowex MonosphereM-31、Dowex Monosphere99K/320、Dowex Monosphere99K/350、Dowex Monosphere99Ca/320、Dowex Marathon(註冊商標)MSC、Dowex MarathonC[以上,Dow Chemical公司製];Diaion(註冊商標)EXC04、DiaionHPK25、DiaionPK208、DiaionPK212、DiaionPK216、DiaionPK220、DiaionPK228L、DiaionRCP160M、DiaionSK1B、DiaionSK1BS、DiaionSK104、DiaionSK110、DiaionSK112、DiaionSK116、DiaionUBK510L、DiaionUBK555[以上,三菱化學(股)製];Lewatit(註冊商標)MonoPlusS100、Lewatit MonoPlusSP112[以上,Lanxess公司製]。 Commercially available strong acid cation exchange resins include, for example, Amberlite (registered trademark) 15, Amberlite200, Amberlite200C, Amberlite200CT, Amberlite252, Amberlite1200H, AmberliteIR120B, AmberliteIR120H, AmberliteIR122Na, AmberliteIR124, AmberliteIRC50, AmberliteIRC86, AmberliteIRP-64, AmberliteIRP-64, AmberliteIRP-64, AmberliteCG-50, AmberliteCG-120, Amberjet (registered trademark) 1020, Amberjet1024, Amberjet1060, Amberjet1200, Amberjet1220, Amberlist (registered trademark) 15, Amberlist15DRY, Amberlist15JWET, Amberlist16, Amberlist16WET, Amberlist31WET, Amberlist35WET, Amberlist35WET, Amberlist36WET, Amberlist36WET, Amberlist35WET, Amberlist36WET, Amberlist , Dowex50Wx4, Dowex50Wx8, DowexDR-2030, DowexDR-G8, DowexHCR-W2, Dowex650C UPW, DowexG-26, Dowex88, DowexM-31, DowexN-406, Dowex (registered trademark) Monosphere (registered trademark) 65088, Dowex Monosphere MonosphereM-31, Dowex Monosphere99K/320, Dowex Monosphere99K/350, Dowex Monosphere99Ca/320, Dowex Marathon (registered trademark) MSC, Dowex Marathon C [above, made by Dow Chemical]; Diaion (registered trademark) EXC04, DiaionHPK25, DiaionPK208, DiaionPK212 , DiaionPK216, DiaionPK220, DiaionPK228L, DiaionRCP160M, DiaionSK1B, DiaionSK1BS, DiaionSK104, DiaionSK110, DiaionSK112, DiaionSK116, DiaionUBK510L, DiaionUBK5 55 [above, manufactured by Mitsubishi Chemical Corporation]; Lewatit (registered trademark) MonoPlusS100, Lewatit MonoPlusSP112 [above, manufactured by Lanxess Corporation].
又,市售之弱酸性陽離子交換樹脂可舉例如Amberlite(註冊商標)CG-50、AmberliteFPC3500、AmberliteIRC50、AmberliteIRC76、AmberliteIRC86、AmberliteIRP-64、Dowex(註冊商標)MAC-3[以上,DowChemical公司製];Diaion(註冊商標)CWK30/S、DiaionWK10、DiaionWK11、DiaionWK40、DiaionWK100、DiaionWT01S[以上,三菱化學(股)製]。 In addition, commercially available weakly acidic cation exchange resins include, for example, Amberlite (registered trademark) CG-50, Amberlite FPC3500, AmberliteIRC50, AmberliteIRC76, AmberliteIRC86, AmberliteIRP-64, Dowex (registered trademark) MAC-3 [above, manufactured by Dow Chemical Company]; Diaion (registered trademark) CWK30/S, DiaionWK10, DiaionWK11, DiaionWK40, DiaionWK100, DiaionWT01S [above, manufactured by Mitsubishi Chemical Corporation].
藉由如此之反應所得之聚縮合化合物係以GPC進行聚苯乙烯換算所測定之重量平均分子量Mw為500~100000,較佳為500~30000,分散度:Mw(重量平均分子量)/Mn(數目平均分子量)為1.0~10。 The polycondensation compound obtained by such a reaction is converted into polystyrene by GPC. The weight average molecular weight Mw is 500-100000, preferably 500-30000, and the degree of dispersion: Mw (weight average molecular weight)/Mn (number) The average molecular weight) is 1.0-10.
又,上述反應性聚矽氧烷係至少具有[X(Ar1)SiO]所示之矽氧烷單元之化合物,例如為至少具有[X(Ar1)SiO]與[Ar2SiO3/2]所示之矽氧烷單元之具有交聯構造的化合物。 In addition, the above-mentioned reactive polysiloxane is a compound having at least a siloxane unit represented by [X(Ar 1 )SiO], for example, it has at least [X(Ar 1 )SiO] and [Ar 2 SiO 3/2 ] The siloxane unit shown is a compound with a cross-linked structure.
<茀化合物> <Fructus compound>
上述茀化合物為下述式[6]所示之化合物。 The above-mentioned stilbene compound is a compound represented by the following formula [6].
上述式[6]中,R5及R6分別獨立地表示氫原子或甲基,L1及L2分別獨立地表示可具有取代基之伸苯基、或可具有取代基之伸萘二基,L3及L4分別獨立地表示碳原子數1至6之伸烷基,更佳係碳原子數2或3之伸烷基,m及n分別獨立地表示滿足0≦m+n≦40之0或正的整數。 In the above formula [6], R 5 and R 6 each independently represent a hydrogen atom or a methyl group, and L 1 and L 2 each independently represent a substituted phenylene group or a substituted naphthalene diyl group , L 3 and L 4 each independently represent an alkylene having 1 to 6 carbon atoms, more preferably an alkylene having 2 or 3 carbon atoms, and m and n each independently represent 0≦m+n≦40的0 or a positive integer.
L1及L2表示之可具有取代基之伸苯基可舉例如鄰-伸苯基、間-伸苯基、對-伸苯基、2-甲基苯-1,4-二基、2-胺基苯-1,4-二基、2,4-二溴苯-1,3-二基、2,6-二溴苯-1,4-二基。 The phenylene groups represented by L 1 and L 2 which may have substituents include, for example, o-phenylene, m-phenylene, p-phenylene, 2-methylbenzene-1,4-diyl, 2 -Aminobenzene-1,4-diyl, 2,4-dibromobenzene-1,3-diyl, 2,6-dibromobenzene-1,4-diyl.
又,L1及L2表示之可具有取代基之伸萘二基可舉例如 1,2-伸萘二基、1,4-伸萘二基、1,5-伸萘二基、1,8-伸萘二基、2,3-伸萘二基、2,6-伸萘二基。 In addition, examples of the naphthalene diyl group represented by L 1 and L 2 that may have a substituent include 1,2-naphthalene diyl, 1,4-naphthalene diyl, 1,5-naphthalene diyl, 1, 8-naphthalene diyl, 2,3-naphthalene diyl, 2,6-naphthalene diyl.
L3及L4表示之碳原子數1至6之伸烷基可舉例如亞甲基、伸乙基、三亞甲基、1-甲基伸乙基、四亞甲基、1-甲基三亞甲基、1,1-二甲基伸乙基、五亞甲基、1-甲基四亞甲基、2-甲基四亞甲基、1,1-二甲基三亞甲基、1,2-二甲基三亞甲基、2,2-二甲基三亞甲基、1-乙基三亞甲基、六亞甲基、1-甲基五亞甲基、2-甲基五亞甲基、3-甲基五亞甲基、1,1-二甲基四亞甲基、1,2-二甲基四亞甲基、2,2-二甲基四亞甲基、1-乙基四亞甲基、1,1,2-三甲基三亞甲基、1,2,2-三甲基三亞甲基、1-乙基-1-甲基三亞甲基、1-乙基-2-甲基三亞甲基。此等之中,以相當於碳原子數2或3之伸烷基的基作為L3及L4更佳。 The alkylene groups with 1 to 6 carbon atoms represented by L 3 and L 4 include, for example, methylene, ethylene, trimethylene, 1-methylethylene, tetramethylene, 1-methyltriethylene Methyl, 1,1-dimethylethylene, pentamethylene, 1-methyltetramethylene, 2-methyltetramethylene, 1,1-dimethyltrimethylene, 1, 2-dimethyl trimethylene, 2,2-dimethyl trimethylene, 1-ethyl trimethylene, hexamethylene, 1-methyl pentamethylene, 2-methyl pentamethylene , 3-methylpentamethylene, 1,1-dimethyltetramethylene, 1,2-dimethyltetramethylene, 2,2-dimethyltetramethylene, 1-ethyl Tetramethylene, 1,1,2-trimethyltrimethylene, 1,2,2-trimethyltrimethylene, 1-ethyl-1-methyltrimethylene, 1-ethyl-2 -Methyl trimethylene. Among these, the group corresponding to the alkylene group having 2 or 3 carbon atoms is more preferable as L 3 and L 4 .
在式[6]所示之化合物中,m及n分別獨立地滿足0≦m+n≦30之時為較佳,滿足2≦m+n≦20之時為更佳。 In the compound represented by the formula [6], it is preferable that m and n each independently satisfy 0≦m+n≦30, and it is more preferable when it satisfies 2≦m+n≦20.
上述式[6]所示之化合物之具體例可舉例如9,9-雙(4-(2-(甲基)丙烯醯基氧乙氧基)苯基)-9H-茀、Ogsol(註冊商標)EA-0200、Ogsol EA-0300、Ogsol EA-F5003、Ogsol EA-F5503、Ogsol EA-F5510、Ogsol EA-F5710、Ogsol GA-5000[以上,大阪GAS CHEMICALS(股)製]、NK ESTER A-BPEF[新中村化學工業(股)製],但不限定於此等(又在本發明中,所謂(甲基)丙烯醯基指丙烯醯基與甲基丙烯醯基之兩者。)。 Specific examples of the compound represented by the above formula [6] include, for example, 9,9-bis(4-(2-(meth)propenyloxyethoxy)phenyl)-9H-茀, Ogsol (registered trademark) )EA-0200, Ogsol EA-0300, Ogsol EA-F5003, Ogsol EA-F5503, Ogsol EA-F5510, Ogsol EA-F5710, Ogsol GA-5000 [above, manufactured by Osaka GAS CHEMICALS], NK ESTER A- BPEF [manufactured by Shinnakamura Chemical Industry Co., Ltd.], but is not limited to these (also in the present invention, the so-called (meth)acryloyl group refers to both of the acryloyl group and the methacryloyl group.).
又,適宜作為高折射率聚合性化合物之化合物為下述式[7-1]所示之化合物、具有式[7-2]所示之構造單元的化合物、以及具有式[7-2]所示之構造單元及式[7-3]所示之構造單元的化合物。 In addition, compounds suitable as high refractive index polymerizable compounds are the compound represented by the following formula [7-1], the compound having the structural unit represented by the formula [7-2], and the compound having the formula [7-2] The structural unit shown and the compound of the structural unit shown in formula [7-3].
式[7-1]中,2個之Q分別表示相同之基,選自由乙烯基氧基、烯丙基氧基及(甲基)丙烯醯基氧基所構成之群中的基,2個之p分別相同地表示0至3之整數。 In the formula [7-1], the two Qs respectively represent the same group, which are selected from the group consisting of vinyloxy, allyloxy and (meth)acryloxy, and 2 The p represents the same integer from 0 to 3, respectively.
式[7-2]及[7-3]中,Ar5及Ar6分別獨立地表示苯基、萘基、或菲基。 In formulas [7-2] and [7-3], Ar 5 and Ar 6 each independently represent a phenyl group, a naphthyl group, or a phenanthryl group.
特別適宜作為高折射率聚合性化合物之化合物為下述式[7-1-1]所示之化合物、具有式[7-2-1]所示之構造單元的化合物、以及具有式[7-2-1]所示之構造單元及式 [7-3-1]所示之構造單元的化合物。 Compounds particularly suitable as high refractive index polymerizable compounds are the compound represented by the following formula [7-1-1], the compound having the structural unit represented by the formula [7-2-1], and the compound having the formula [7- Compound of the structural unit shown in 2-1] and the structural unit shown in formula [7-3-1].
上述高折射率聚合性化合物係可一種單獨使用,或將二種以上組合而使用。 The above-mentioned high refractive index polymerizable compound may be used alone or in combination of two or more kinds.
<<聚合性組成物>> <<Polymerizable composition>>
本發明係亦以包含前述(a)高折射率聚合性化合物100質量份、及前述(b)低黏度化劑10~500質量份之聚合性組成物作為對象。 The present invention also targets a polymerizable composition containing 100 parts by mass of the aforementioned (a) high-refractive-index polymerizable compound and 10 to 500 parts by mass of the aforementioned (b) low-viscosity agent.
在上述聚合性組成物中,(a)高折射率聚合性化合物、及(b)低黏度化劑之任一者均分別可一種單獨使用、或將二種以上組合而使用。 In the above-mentioned polymerizable composition, each of (a) a high-refractive-index polymerizable compound and (b) a low-viscosity agent can be used alone or in combination of two or more kinds.
在該聚合性組成物中,進一步亦可含有(c)在1013.25hPa下、23℃之物質之狀態為液體之聚合性稀釋劑、以及、(d)聚合起始劑。 The polymerizable composition may further contain (c) a polymerizable diluent that is a liquid at 1013.25 hPa and 23°C, and (d) a polymerization initiator.
<(c)聚合性稀釋劑> <(c) Polymerizable diluent>
可使用於本發明之聚合性組成物的聚合性稀釋劑係在1013.25hPa下、23℃之物質的狀態為液體之化合物,亦稱為液狀稀釋劑。聚合性稀釋劑可使用目的在於1)調整聚合性組成物之黏度、以及2)調整聚合性組成物硬化時之交聯密度。從聚合性稀釋劑之使用,可更提高前述低黏度化劑之黏度的低減/維持之效果。 The polymerizable diluent that can be used in the polymerizable composition of the present invention is a compound that is liquid at 1013.25 hPa and 23°C, and is also called a liquid diluent. The polymerizable diluent can be used for the purpose of 1) adjusting the viscosity of the polymerizable composition, and 2) adjusting the crosslinking density when the polymerizable composition is cured. From the use of polymerizable diluent, the effect of reducing/maintaining the viscosity of the aforementioned low-viscosity agent can be further improved.
聚合性稀釋劑係可舉例如1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、2-甲基-1,8-辛二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、三環[5.2.1.02,6]癸烷二甲醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二三羥甲基丙烷四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、2-羥基-3-丙烯醯基氧丙基甲基丙烯酸酯、甘油二(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、雙((甲基)丙烯醯基氧乙基)羥基乙基三聚異氰酸酯、聯苯甲醯基(甲基)丙烯酸酯、2-苯氧基乙基(甲基)丙烯酸酯、2-苯氧 基聯苯甲醯基(甲基)丙烯酸酯、3-苯氧基聯苯甲醯基(甲基)丙烯酸酯、4-苯氧基聯苯甲醯基(甲基)丙烯酸酯、2-(2-聯苯基氧)乙基(甲基)丙烯酸酯、2-(3-聯苯基氧)乙基(甲基)丙烯酸酯、2-(4-聯苯基氧)乙基(甲基)丙烯酸酯、乙氧基化鄰苯基酚(甲基)丙烯酸酯、二乙二醇單苯基醚(甲基)丙烯酸酯、聚乙二醇單苯基醚(甲基)丙烯酸酯、2-羥基-3-苯氧基丙基(甲基)丙烯酸酯、新戊二醇苯甲酸酯(甲基)丙烯酸酯、二乙烯基苯。 The polymerizable diluent system includes, for example, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 2-methyl-1,8-octanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, tricyclo[5.2.1.0 2,6 ]decane dimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, Ditrimethylolpropane tetra (meth) acrylate, neopentyl erythritol tetra (meth) acrylate, dineopentaerythritol hexa (meth) acrylate, 2-hydroxy-3-propenyloxypropane Methyl methacrylate, glycerol di(meth)acrylate, neopentyl erythritol tri(meth)acrylate, dineopentaerythritol penta(meth)acrylate, bis((meth)acryloyloxy) Ethyl) hydroxyethyl trimeric isocyanate, biphenylmethanyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, 2-phenoxybiphenylmethanyl (meth) Acrylate, 3-phenoxybiphenylmethanyl (meth)acrylate, 4-phenoxybiphenylmethanyl (meth)acrylate, 2-(2-biphenyloxy)ethyl ( Meth) acrylate, 2-(3-biphenyloxy)ethyl (meth)acrylate, 2-(4-biphenyloxy)ethyl (meth)acrylate, ethoxylated o-benzene Base phenol (meth)acrylate, diethylene glycol monophenyl ether (meth)acrylate, polyethylene glycol monophenyl ether (meth)acrylate, 2-hydroxy-3-phenoxypropyl (Meth)acrylate, neopentyl glycol benzoate (meth)acrylate, divinylbenzene.
上述聚合性稀釋劑可自市售品取得,其具體例為NK ESTER 701A、NK ESTERA-DCP、NK ESTERA-DON-N、NK ESTERA-HD-N、NK ESTERA-NOD-N、NK ESTERDCP、NK ESTERDOD-N、NK ESTER HD-N、NK ESTER NOD-N、NK ESTER NPG、NK ESTER A-TMM-3、NK ESTER A-TMM-3L、NK ESTER A-TMM-3LMN、NK ESTERA-TMPT、NK ESTER TMPT、NK ESTER A-TMMT、NK ESTER AD-TMP、NK ESTER A-DPH、NK ESTER A-9550、NK ESTER A-9530、NK ESTER ADP-51EH、NK ESTER ATM-31EH、UA-7100、A-LEN-10[以上,新中村化學工業(股)製]、KAYARAD(註冊商標)T-1420、KAYARAD-330、KAYARA D-320、KAYARA D-310、KAYARA DPCA-20、KAYARA DPCA-30、KAYARA DPCA-60、KAYARA DPCA-120、KAYARA TMPTA、KAYARA PET-30、KAYARA DPHA、KAYARA DPHA- 2C[以上,日本化藥(股)製]。 The above-mentioned polymeric diluents can be obtained from commercially available products, and specific examples are NK ESTER 701A, NK ESTERA-DCP, NK ESTERA-DON-N, NK ESTERA-HD-N, NK ESTERA-NOD-N, NK ESTERDCP, NK ESTERDOD-N, NK ESTER HD-N, NK ESTER NOD-N, NK ESTER NPG, NK ESTER A-TMM-3, NK ESTER A-TMM-3L, NK ESTER A-TMM-3LMN, NK ESTERA-TMPT, NK ESTER TMPT, NK ESTER A-TMMT, NK ESTER AD-TMP, NK ESTER A-DPH, NK ESTER A-9550, NK ESTER A-9530, NK ESTER ADP-51EH, NK ESTER ATM-31EH, UA-7100, A -LEN-10 [above, manufactured by Shin Nakamura Chemical Industry Co., Ltd.], KAYARAD (registered trademark) T-1420, KAYARAD-330, KAYARA D-320, KAYARA D-310, KAYARA DPCA-20, KAYARA DPCA-30, KAYARA DPCA-60, KAYARA DPCA-120, KAYARA TMPTA, KAYARA PET-30, KAYARA DPHA, KAYARA DPHA-2C [above, manufactured by Nippon Kayaku Corporation].
使用聚合性稀釋劑時,聚合性稀釋劑可一種單獨使用,或將二種以上混合使用。又,其添加量係相對於(a)成分100質量份,以10~500質量份較佳,又,使聚合性組成物之整體為100質量份時,以0.1~40質量份為較佳,以5~30質量份為更佳。若超過30質量份而添加,有時會產生折射率之降低,無法維持本發明之主要目的之高折射率。 When using a polymerizable diluent, one type of polymerizable diluent may be used alone, or two or more types may be used in combination. In addition, the addition amount is preferably 10 to 500 parts by mass relative to 100 parts by mass of the component (a), and when the entire polymerizable composition is 100 parts by mass, 0.1 to 40 parts by mass is preferred, It is more preferably 5-30 parts by mass. If it is added in excess of 30 parts by mass, the refractive index may decrease, and the high refractive index that is the main purpose of the present invention cannot be maintained.
<(d)聚合起始劑> <(d) Polymerization initiator>
本發明之聚合性組成物進一步可含有聚合起始劑。聚合起始劑亦可使用光聚合起始劑及熱聚合起始劑之任一者。 The polymerizable composition of the present invention may further contain a polymerization initiator. As the polymerization initiator, any one of a photopolymerization initiator and a thermal polymerization initiator may be used.
光聚合起始劑可舉例如烷基酚類、二苯甲酮類、米希勒酮(Michler)之酮類、醯基氧化膦類、苯甲醯基苯甲酸酯類、肟酯類、四甲基硫蘭(THIURAM)單硫醚類、硫雜蒽酮類。 The photopolymerization initiator can include, for example, alkylphenols, benzophenones, ketones such as Michler ketones, phosphine oxides, benzyl benzoates, oxime esters, tetrakis Methyl thiolan (THIURAM) monosulfide, thioxanthones.
尤其以光開裂型之光自由基聚合起始劑為較佳。 In particular, a photo-cracking type photo-radical polymerization initiator is preferred.
市售之光自由基聚合起始劑可舉例如IRGACURE(註冊商標)184、IRGACURE 369、IRGACURE 651、IRGACURE 500、IRGACURE 819、IRGACURE 907、IRGACURE 784、IRGACURE 2959、IRGACURE CGI1700、IRGACURE CGI1750、IRGACURE CGI1850、IRGACURE CG24-61、IRGACURE TPO、Darocur(註冊商 標)1116、Darocur 1173[以上,BASFJAPAN(股)製]、ESACURE KIP150、ESACURE KIP65LT、ESACURE KIP100F、ESACURE KT37、ESACURE KT55、ESACURE KTO46、ESACURE KIP75[以上,Lamberti公司製]。 Commercially available photo radical polymerization initiators include, for example, IRGACURE (registered trademark) 184, IRGACURE 369, IRGACURE 651, IRGACURE 500, IRGACURE 819, IRGACURE 907, IRGACURE 784, IRGACURE 2959, IRGACURE CGI1700, IRGACURE CGI1750, IRGACURE CGI1850, IRGACURE CG24-61, IRGACURE TPO, Darocur (registered trademark) 1116, Darocur 1173 [above, BASFJAPAN (stock) system], ESACURE KIP150, ESACURE KIP65LT, ESACURE KIP100F, ESACURE KT37, ESACURE KT55, ESACURE KTO46, ESACURE KIP75, or more Lamberti Corporation].
熱聚合起始劑可舉例如偶氮類、有機過氧化物類。 Examples of thermal polymerization initiators include azo and organic peroxides.
市售之偶氮系熱聚合起始劑可舉例如V-30、V-40、V-59、V-60、V-65、V-70[以上,和光純藥工業(股)製]。 Examples of commercially available azo-based thermal polymerization initiators include V-30, V-40, V-59, V-60, V-65, and V-70 [above, manufactured by Wako Pure Chemical Industries, Ltd.].
又市售之有機過氧化物系熱聚合起始劑可舉例如Perkadox(註冊商標)CH、Perkadox BC-FF、Perkadox 14、Perkadox 16、Trigonox(註冊商標)22、Trigonox23、Trigonox121、Kayaester(註冊商標)P、Kayaester O、Kayabutyl(註冊商標)B[以上,AKZO化藥(股)製]、PERHEXA(註冊商標)HC、PERCUMYL(註冊商標)H、PEROCTA(註冊商標)O、PERHEXYL(註冊商標)O、PERHEXYLZ、PERBUTYL(註冊商標)O、PERBUTYL Z[以上,日油(股)製],但不限定於此等。 Also commercially available organic peroxide-based thermal polymerization initiators include, for example, Perkadox (registered trademark) CH, Perkadox BC-FF, Perkadox 14, Perkadox 16, Trigonox (registered trademark) 22, Trigonox 23, Trigonox 121, Kayaester (registered trademark) ) P, Kayaester O, Kayabutyl (registered trademark) B [above, manufactured by AKZO Chemicals (Stock)], PERHEXA (registered trademark) HC, PERCUMYL (registered trademark) H, PEROCTA (registered trademark) O, PERHEXYL (registered trademark) O, PERHEXYLZ, PERBUTYL (registered trademark) O, PERBUTYL Z [above, manufactured by NOF Corporation], but not limited to these.
添加聚合起始劑時,聚合起始劑可一種單獨使用或將二種以上混合而使用。又,其添加量係相對於聚合性成分、亦即上述(a)成分及(b)成分(依所希望進一步(c)成分)之總量100質量份,為0.1~20質量份,更佳為0.3~10質量份。 When adding a polymerization initiator, a polymerization initiator can be used individually by 1 type or in mixture of 2 or more types. In addition, the added amount is 0.1-20 parts by mass relative to 100 parts by mass of the total amount of the polymerizable components, that is, the above-mentioned (a) component and (b) component (if desired, further (c) component), and more preferably It is 0.3 to 10 parts by mass.
<其他添加劑> <Other additives>
進一步,本發明之聚合性組成物只要在無損本發明之效果,可依需要而含有例如鏈轉移劑、抗氧化劑、紫外線吸收劑、光安定化劑、調平劑、流變調整劑、矽烷耦合劑等之接著補助劑、顏料、染料、消泡劑。 Furthermore, as long as the polymerizable composition of the present invention does not impair the effects of the present invention, it may contain, as necessary, chain transfer agents, antioxidants, ultraviolet absorbers, light stabilizers, leveling agents, rheology modifiers, and silane coupling agents. Adhesive additives, pigments, dyes, defoamers, etc.
上述鏈轉移劑就硫醇化合物而言,可舉例如氫硫基乙酸甲酯、3-氫硫基丙酸甲酯、3-氫硫基丙酸2-乙基己酯、3-氫硫基丙酸3-甲氧基丁酯、3-氫硫基丙酸正辛酯、3-氫硫基丙酸硬脂酯、1,4-雙(3-氫硫基丙醯基氧)丁烷、1,4-雙(3-氫硫基丁醯基氧)丁烷、三羥甲基乙烷參(3-氫硫基丙酸酯)、三羥甲基乙烷參(3-氫硫基丁酸酯)、三羥甲基丙烷參(3-氫硫基丙酸酯)、三羥甲基丙烷參(3-氫硫基丁酸酯)、新戊四醇肆(3-氫硫基丙酸酯)、新戊四醇肆(3-氫硫基丁酸酯)、二新戊四醇陸(3-氫硫基丙酸酯)、二新戊四醇陸(3-氫硫基丁酸酯)、參[2-(3-氫硫基丙醯基氧)乙基]三聚異氰酸酯、參[2-(3-氫硫基丁基醯基氧)乙基]三聚異氰酸酯等之氫硫基羧酸酯類;乙烷硫醇、2-甲基丙烷-2-硫醇、正十二碳基硫醇、2,3,3,4,4,5-六甲基己烷-2-硫醇(第三-十二碳烷硫醇)、乙烷-1,2-二硫醇、丙烷-1,3-二硫醇、聯苯甲醯基硫醇等之烷基硫醇類;苯硫醇、3-甲基苯硫醇、4-甲基苯硫醇、萘-2-硫醇、吡啶-2-硫醇、苯并咪唑-2-硫醇、苯并噻唑-2-硫醇等之芳香族硫醇類;2-氫硫基乙醇、4-氫硫基-1-丁醇等之氫硫基醇類;3-(三甲氧基矽基)丙烷-1-硫醇、3-(三乙氧基矽基)丙烷-1-硫醇等之含有矽烷的硫醇 類等;就二硫醚化合物而言,可舉例如二乙基二硫醚、二丙基二硫醚、二異丙基二硫醚、二丁基二硫醚、二-第三-丁基二硫醚、二戊基二硫醚、二異戊基二硫醚、二己基二硫醚、二環己基二硫醚、二癸基二硫醚、雙(2,3,3,4,4,5-六甲基己烷-2-基)二硫醚(二-第三-十二碳基二硫醚)、雙(2,2-二乙氧基乙基)二硫醚、雙(2-羥基乙基)二硫醚、二聯苯甲醯基二硫醚等之烷基二硫醚類;二苯基二硫醚、二-對-甲苯基二硫醚、二(吡啶-2-基)吡啶基二硫醚、二(苯并咪唑-2-基)二硫醚、二(苯并噻唑-2-基)二硫醚等之芳香族二硫醚類;四甲基硫蘭二硫醚、四乙基硫蘭二硫醚、四丁基硫蘭二硫醚、雙(五亞甲基)硫蘭二硫醚等之硫蘭二硫醚類、α-甲基苯乙烯二聚體。 The above-mentioned chain transfer agent is a thiol compound, for example, methyl hydrothioacetate, methyl 3-hydrothiopropionate, 2-ethylhexyl 3-hydrothiopropionate, and 3-hydrothiopropionate. 3-methoxybutyl propionate, n-octyl 3-hydrothiopropionate, stearyl 3-hydrothiopropionate, 1,4-bis(3-hydrothiopropionyloxy)butane , 1,4-bis(3-hydrothiobutanoyloxy)butane, trimethylolethane ginseng (3-hydrothiopropionate), trimethylolethane ginseng (3-hydrothiobutane Acid ester), trimethylolpropane ginseng (3-hydrothiopropionate), trimethylolpropane ginseng (3-hydrothiobutyrate), neopentylerythritol four (3-hydrothiopropionate) Acid ester), neopentylerythritol four (3-hydrothiobutyrate), dineopentaerythritol land (3-hydrothiopropionate), dineopentaerythritol land (3-hydrothiobutyrate) Acid ester), ginseng [2-(3-hydrothiopropyloxy)ethyl] trimeric isocyanate, ginseng [2-(3-hydrothiobutyloxy) ethyl] trimeric isocyanate, etc. Hydrosulfide carboxylic acid esters; ethane mercaptan, 2-methylpropane-2-mercaptan, n-dodecyl mercaptan, 2,3,3,4,4,5-hexamethylhexane- Alkyl mercaptans such as 2-mercaptan (third-dodecane mercaptan), ethane-1,2-dimercaptan, propane-1,3-dimercaptan, biphenylmethyl mercaptan, etc. Class; Benzene mercaptan, 3-methylbenzene mercaptan, 4-methylbenzene mercaptan, naphthalene-2-mercaptan, pyridine-2-mercaptan, benzimidazole-2-mercaptan, benzothiazole-2 -Aromatic mercaptans such as mercaptans; hydrogen mercaptan alcohols such as 2-hydrothioethanol and 4-hydrosulfan-1-butanol; 3-(trimethoxysilyl)propane-1-sulfur Silane-containing mercaptans such as alcohols, 3-(triethoxysilyl)propane-1-thiol, etc.; for disulfide compounds, for example, diethyl disulfide, dipropyl disulfide Sulfide, diisopropyl disulfide, dibutyl disulfide, di-tertiary butyl disulfide, dipentyl disulfide, diisopentyl disulfide, dihexyl disulfide, Dicyclohexyl disulfide, didecyl disulfide, bis(2,3,3,4,4,5-hexamethylhexane-2-yl) disulfide (two-third-twelve carbon Alkyl disulfide), bis(2,2-diethoxyethyl) disulfide, bis(2-hydroxyethyl) disulfide, bibibenzyl disulfide, etc. Ethers; diphenyl disulfide, two-p-tolyl disulfide, two (pyridin-2-yl) pyridyl disulfide, two (benzimidazol-2-yl) disulfide, two ( Aromatic disulfide such as benzothiazol-2-yl) disulfide; tetramethyl sulfide blue disulfide, tetraethyl sulfide blue disulfide, tetrabutyl sulfide blue disulfide, bis(five Methylene) thioblue disulfide and other thioblue disulfide, α-methylstyrene dimer.
添加鏈轉移劑時,鏈轉移劑可一種單獨使用,或將二種以上混合而使用。又,其添加量相對於聚合性成分、亦即上述(a)成分及(b)成分(依所希望進一步添加之(c)成分)之總量100質量份,為0.01~20質量份,更佳為0.1~10質量份。 When adding a chain transfer agent, one kind of chain transfer agent may be used alone, or two or more kinds may be mixed and used. In addition, the addition amount is 0.01 to 20 parts by mass relative to 100 parts by mass of the total amount of the polymerizable components, that is, the above-mentioned (a) component and (b) component (the (c) component to be further added as desired), and more Preferably, it is 0.1 to 10 parts by mass.
上述抗氧化劑可舉例如酚系抗氧化劑、磷酸系抗氧化劑、硫醚系抗氧化劑等,其中,以酚系抗氧化劑為較佳。 Examples of the above-mentioned antioxidant include phenol-based antioxidants, phosphoric acid-based antioxidants, and thioether-based antioxidants. Among them, phenol-based antioxidants are preferred.
酚系抗氧化劑係可舉例如IRGANOX(註冊商標)245、IRGANOX1010、IRGANOX1035、IRGANOX1076、IRGANOX1135[以上,BASF JAPAN(股)製]、Sumilizer(註冊商標)GA-80、Sumilizer GP、Sumilizer MDP-S、 Sumilizer BBM-S、Sumilizer WX-R[以上,住友化學(股)製]、ADK STAB(註冊商標)AO-20、ADK STABAO-30、ADK STABAO-40、ADK STABAO-50、ADK STABAO-60、ADK STABAO-80、ADK STABAO-330[以上,(股)ADEKA製]。 Examples of phenolic antioxidants include IRGANOX (registered trademark) 245, IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135 [above, manufactured by BASF JAPAN (stock)], Sumilizer (registered trademark) GA-80, Sumilizer GP, Sumilizer MDP-S, Sumilizer BBM-S, Sumilizer WX-R [above, manufactured by Sumitomo Chemical Co., Ltd.], ADK STAB (registered trademark) AO-20, ADK STABAO-30, ADK STABAO-40, ADK STABAO-50, ADK STABAO-60, ADK STABAO-80, ADK STABAO-330 [above, manufactured by ADEKA].
添加抗氧化劑時,抗氧化劑可一種單獨使用,或將二種以上混合而使用。又,其添加量相對於聚合性成分,亦即上述(a)成分及(b)成分(依所希望進一步添加之(c)成分)之總量100質量份,為0.01~20質量份,更佳為0.1~10質量份。 When the antioxidant is added, one kind of antioxidant may be used alone, or two or more kinds may be mixed and used. In addition, the addition amount is 0.01 to 20 parts by mass relative to 100 parts by mass of the total amount of the above-mentioned (a) component and (b) component (additional (c) component as desired) of the polymerizable components, and more Preferably, it is 0.1 to 10 parts by mass.
<聚合性組成物之調製方法> <Preparation method of polymerizable composition>
本實施形態之聚合性組成物之調製方法無特別限定。調製法係可舉例如將(a)成分及(b)成分、及依需要之(c)成分及(d)成分以預定之比例混合,依所希望進一步添加其他添加劑而混合,形成均勻之溶液的方法;此等各成分之中,可舉例如使(a)成分及(b)成分之一部份混合而形成均勻之溶液後,加入其殘餘之各成分,依所希望進一步添加其他添加劑而混合,形成均勻之溶液的方法;或除了此等之成分以外,進一步使用常用之溶劑的方法。 The preparation method of the polymerizable composition of this embodiment is not particularly limited. The preparation method can include, for example, mixing (a) component and (b) component, and as required (c) component and (d) component in a predetermined ratio, and further adding other additives as desired to mix to form a uniform solution The method; among these components, for example, mixing a part of (a) component and (b) component to form a uniform solution, adding the remaining components, and adding other additives as desired A method of mixing to form a uniform solution; or a method of further using common solvents in addition to these ingredients.
使用溶劑時,在本聚合性組成物中之固體成分之比例係只要各成分均勻地溶解於溶劑中,無特別限定,但例如為1~50質量%,或為1~30質量%,或為1~25 質量。在此,所謂固體成分係從聚合性組成物之全部成分除去溶劑成分者。 When a solvent is used, the ratio of the solid content in the polymerizable composition is not particularly limited as long as the components are uniformly dissolved in the solvent, but for example, it is 1-50% by mass, or 1-30% by mass, or 1~25 quality. Here, the term “solid content” refers to the solvent component removed from all the components of the polymerizable composition.
又,聚合性組成物之溶液係使用孔徑為0.1~5μm之過濾器等過濾之後,再使用為較佳。 In addition, the solution of the polymerizable composition is preferably used after being filtered with a filter having a pore diameter of 0.1 to 5 μm or the like.
<<硬化物>> <<hardened material>>
可使上述聚合性組成物進行曝光(光硬化)或加熱(熱硬化),獲得硬化物,本發明亦以上述聚合性化合物之硬化物作為對象。 The polymerizable composition can be exposed (photocured) or heated (thermally cured) to obtain a cured product. The present invention also targets the cured product of the polymerizable compound.
進行曝光之光線例如紫外線、電子線、X線。使用於紫外線照射之光源可使用例如太陽光線、化學燈、低壓水銀燈、高壓水銀燈、金屬鹵素燈、氙氣燈、UV-LED。又,曝光後,為使硬化物之物性安定化,亦可施予後烘烤。後烘烤之方法係無特別限定,但通常使用加熱板、烘箱等,以50~260℃、1~120分鐘之範圍進行。 Light for exposure such as ultraviolet rays, electron rays, X-rays. The light source used for ultraviolet radiation can be, for example, sunlight, chemical lamp, low-pressure mercury lamp, high-pressure mercury lamp, metal halide lamp, xenon lamp, UV-LED. In addition, after exposure, in order to stabilize the physical properties of the hardened product, post-baking may be applied. The method of post-baking is not particularly limited, but usually a hot plate, oven, etc., are used in the range of 50 to 260°C for 1 to 120 minutes.
在熱硬化之加熱條件係無特別限定,但通常可由50~300℃、1~120分鐘之範圍適當選擇。又,加熱手段係無特別限定,但可舉例如加熱板、烘箱。 The heating conditions for thermal hardening are not particularly limited, but usually can be appropriately selected within the range of 50 to 300°C for 1 to 120 minutes. In addition, the heating means is not particularly limited, but examples include hot plates and ovens.
藉由使本發明之聚合性組成物進行硬化所得之硬化物係波長589.3nm(D線)之折射率高達1.620以上者,進一步亦可製作阿貝數成為23以下之硬化物,又,可抑制因加熱所產生之龜裂或來自支持體之剝離,期待具有尺寸安定性,故可適宜使用來作為高折射率樹脂透鏡用材料。 The cured product obtained by curing the polymerizable composition of the present invention has a wavelength of 589.3nm (D line) with a refractive index of 1.620 or more. Furthermore, a cured product with an Abbe number of 23 or less can be produced, and it can be suppressed It is expected to have dimensional stability due to cracks caused by heating or peeling from the support, so it can be suitably used as a material for high refractive index resin lenses.
<<成形體>> <<Formed body>>
本發明之聚合性組成物係藉由使用例如壓縮成形(壓印等)、澆鑄、射出成形、吹塑成形等之常用成形法,可與硬化物之形成併行而容易製造各種成形體。如此方式所得之成形體亦為本發明之對象。 The polymerizable composition of the present invention can be easily produced in parallel with the formation of hardened products by using common molding methods such as compression molding (imprinting, etc.), casting, injection molding, and blow molding. The formed body obtained in this way is also the object of the present invention.
製造成形體之方法係可舉例如包含:將本發明之聚合性組成物填充於互相接合之支持體與鑄模之間的空間、或可分割之鑄模的內部空間的步驟;使該被填充之組成物曝光而進行光聚合之步驟;從填充有所得之光聚合物之前述空間取出並脫模之步驟;以及,將該光聚合物在該脫模之前、中途或之後進行加熱之步驟。 The method of manufacturing a molded body may include, for example, a step of filling the polymerizable composition of the present invention in the space between the support body and the mold that are joined to each other, or the inner space of the mold that can be divided; making the filled composition The step of performing photopolymerization by exposing the object; the step of taking out and demolding from the aforementioned space filled with the obtained photopolymer; and the step of heating the photopolymer before, during or after the demolding.
進行上述曝光而光聚合之步驟可適用前述之<<硬化物>>所示之條件而實施。 The steps of performing the above exposure and photopolymerization can be implemented by applying the conditions shown in the above-mentioned <<hardened product>>.
上述加熱步驟之條件係無特別限定,但一般,可從50~260℃、1~120分鐘之範圍適當選擇。又,加熱手段係無特別限定,但可舉例如加熱板、烘箱等。 The conditions of the heating step are not particularly limited, but generally, it can be appropriately selected from the range of 50 to 260°C for 1 to 120 minutes. In addition, the heating means is not particularly limited, but for example, a hot plate, an oven, etc. can be mentioned.
藉由如此之方法所製造之成形體可適宜使用作為相機用模組透鏡。 The molded body manufactured by such a method can be suitably used as a camera module lens.
以下,舉出實施例,更具體地說明本發明,但本發明不限定於下述之實施例。 Hereinafter, examples are given to explain the present invention more specifically, but the present invention is not limited to the following examples.
又,在實施例中,使用於試料之調製及物性的分析之裝置及條件如以下。 In addition, in the embodiment, the equipment and conditions used for the preparation of the sample and the analysis of the physical properties are as follows.
(1)旋轉塗佈機 (1) Spin coater
裝置:Brewer Science公司製Cee(註冊商標)200X Device: Cee (registered trademark) 200X made by Brewer Science
(2)UV曝光 (2) UV exposure
裝置:Eyegraphics(股)製 批式UV照射裝置(高壓水銀燈2kW×1燈) Device: Eyegraphics (stock) system batch type UV irradiation device (high-pressure mercury lamp 2kW×1 lamp)
(3)1H NMR光譜 (3) 1 H NMR spectrum
裝置:Bruker公司製AVANCE III HD Device: AVANCE III HD manufactured by Bruker
測定頻率:500MH z Measuring frequency: 500MH z
溶劑:CDCl3 Solvent: CDCl 3
內部基準:四甲基矽烷(δ=0.00ppm) Internal benchmark: Tetramethylsilane (δ=0.00ppm)
(4)凝膠浸透色層分析(GPC) (4) Gel permeation chromatography (GPC)
裝置:(股)島津製作所製Prominence(註冊商標)GPC系統 Installation: (Stock) Prominence (registered trademark) GPC system manufactured by Shimadzu Corporation
管柱:昭和電工(股)製Shodex(註冊商標)GPC KF-804L及GPC KF-803L Column: Shodex (registered trademark) GPC KF-804L and GPC KF-803L manufactured by Showa Denko Corporation
管柱溫度:40℃ Column temperature: 40℃
溶劑:四氫呋喃 Solvent: Tetrahydrofuran
檢測器:RI Detector: RI
檢量線:標準聚苯乙烯 Calibration line: standard polystyrene
(5)阿貝數νD、折射率nD (5) Abbe number ν D , refractive index n D
裝置A(硬化膜測定時):J.A.Woollam Japan公司製多入射角分光橢圓偏振計VASE Apparatus A (when measuring cured film): Multi-incident angle spectroscopic ellipsometer VASE manufactured by J.A. Woollam Japan
裝置B(成形體測定時):Metricon公司製Prism Coupler 2010/M Apparatus B (when measuring molded body): Prism Coupler 2010/M manufactured by Metricon
測定溫度:室溫(約23℃) Measuring temperature: room temperature (about 23℃)
(6)熔點 (6) Melting point
觀察裝置:(股)Nikon製 偏光顯微鏡ECLIPSE(註冊商標)E600 POL Observation device: (Stock) Nikon Polarizing Microscope ECLIPSE (registered trademark) E600 POL
加熱裝置:(股)東海Hit製 顯微鏡用階段自動溫度控制系統ThermoPlate(註冊商標) Heating device: (Stock) Tokai Hit, stage automatic temperature control system for microscope ThermoPlate (registered trademark)
昇溫速度:0.5℃/秒 Heating rate: 0.5°C/sec
測定方法:以目視,試料之一部分開始融解之溫度作為熔點 Measurement method: visually, the temperature at which a part of the sample begins to melt is used as the melting point
(7)黏度 (7) Viscosity
裝置:京都電子工業(股)製EMS-1000 Device: EMS-1000 manufactured by Kyoto Electronics Industry Co., Ltd.
(8)穿透率 (8) Penetration rate
裝置:日本分光(股)製 紫外可見近紅外分光光度計V-670 Device: Japan Spectrophotometer (Stock) UV-Visible-Near-Infrared Spectrophotometer V-670
對照組:空氣 Control group: air
又,簡略記號表示以下之意義。 In addition, the abbreviated symbols indicate the following meanings.
NMA:萘-2-基甲基丙烯酸酯 NMA: Naphth-2-yl methacrylate
VN:2-乙烯基萘[新日鐵住金化學(股)製] VN: 2-vinyl naphthalene [manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.]
SPeDMS:二甲氧基(菲-9-基)(4-乙烯基苯基)矽烷 SPeDMS: Dimethoxy (phenanthrene-9-yl) (4-vinylphenyl) silane
BPOEA:2-([1,1’-聯苯基]-2-基氧)乙基丙烯酸酯[新中村化學工業(股)製NK ESTER A-LEN-10]BPOEA: 2-([1,1'-biphenyl]-2-yloxy)ethyl acrylate [NK ESTER A-LEN-10 manufactured by Shinnakamura Chemical Industry Co., Ltd.]
BnA:聯苯甲醯基丙烯酸酯[大阪有機化學工業(股)製Viscoat # 160,BZA] BnA: Biphenylmethyl acrylate [Viscoat #160 manufactured by Osaka Organic Chemical Industry Co., Ltd., BZA]
DVB:二乙烯基苯[新日鐵住金化學(股)製DVB-810] DVB: Divinylbenzene [DVB-810 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.]
FDA:9,9-雙(4-(2-丙烯醯基氧乙氧基)苯基)茀[新中村化學工業(股)製NK ESTER A-BPEF] FDA: 9,9-bis(4-(2-propenyloxyethoxy)phenyl) pyridium [NK ESTER A-BPEF manufactured by Shinnakamura Chemical Industry Co., Ltd.]
PheTMS:三甲氧基(9-菲基)矽烷 PheTMS: Trimethoxy (9-phenanthryl) silane
STMS:三甲氧基(4-乙烯基苯基)矽烷[信越化學工業(股)製 信越Silicone(註冊商標)KBM-1403] STMS: Trimethoxy (4-vinylphenyl) silane [manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu Silicone (registered trademark) KBM-1403]
TMOS:四甲氧基矽烷[東京化成工業(股)製] TMOS: Tetramethoxysilane [manufactured by Tokyo Chemical Industry Co., Ltd.]
TEAH:35質量%氫氧化四乙基銨水溶液[ALDRICH公司製] TEAH: 35 mass% tetraethylammonium hydroxide aqueous solution [manufactured by Aldrich]
DDT:正十二烷硫醇[花王(股)製 硫代兒茶酚20] DDT: n-dodecyl mercaptan [
I184:1-羥基環己基苯基酮[BASFJAPAN(股)製IRGACURE(註冊商標)184] I184: 1-Hydroxycyclohexyl phenyl ketone [IRGACURE (registered trademark) 184 manufactured by BASFJAPAN Co., Ltd.]
TPO:二苯基(2,4,6-三甲基苯甲醯基)氧化膦[BASFJAPAN(股)製IRGACURE(註冊商標)TPO] TPO: Diphenyl (2,4,6-trimethylbenzyl) phosphine oxide [BASFJAPAN (Stock) IRGACURE (registered trademark) TPO]
PGMEA:丙二醇單甲基醚乙酸酯 PGMEA: Propylene glycol monomethyl ether acetate
THF:四氫呋喃 THF: Tetrahydrofuran
在具備凝縮器之1L反應燒瓶中裝填鎂切削片[關東化學(股)製]15.7g(0.65mol),使用氮氣氣球將燒瓶中之 空氣以氮氣取代。對此,將9-溴菲[東京化成工業(股)製]151.2g(0.58mol)、及THF518g之混合物在室溫(約23℃)下以1小時滴入,進一步,進行攪拌1小時,調製格任亞試藥。 A 1L reaction flask equipped with a condenser was filled with 15.7 g (0.65 mol) of magnesium chips [manufactured by Kanto Chemical Co., Ltd.], and the air in the flask was replaced with nitrogen using a nitrogen balloon. In response, a mixture of 151.2 g (0.58 mol) of 9-bromophenanthrene [manufactured by Tokyo Chemical Industry Co., Ltd.] and 518 g of THF was dropped at room temperature (about 23° C.) for 1 hour, and further stirred for 1 hour. Prepare Gerenya reagent.
在2L之反應燒瓶中裝填STMS131.9g(0.58mol)、及THF259g,使用氮氣氣球將燒瓶中之空氣以氮氣取代。對此,將上述格任亞試藥在回流下(約66℃)、以30分鐘滴入,進一步使其回流24小時。從此反應混合物使用蒸發器使THF減壓餾去。於所得之殘渣中加入己烷1000g,使其回流1小時而溶解可溶物之後,過濾不溶物。在此不溶物再度加入己烷750g,同樣地溶解可溶物之後,過濾不溶物。混合各別之濾液,使用蒸發器將己烷減壓餾去,獲得粗生成物。將粗生成物以己烷150g進行再結晶,獲得目的之SPeDMS 102.4g(收率47%)。 A 2L reaction flask was filled with STMS131.9g (0.58mol) and THF259g, and a nitrogen balloon was used to replace the air in the flask with nitrogen. In this regard, the above-mentioned Grenya reagent was dropped under reflux (approximately 66°C) for 30 minutes, and further refluxed for 24 hours. From this reaction mixture, THF was distilled off under reduced pressure using an evaporator. After adding 1000 g of hexane to the obtained residue and refluxing for 1 hour to dissolve the soluble matter, the insoluble matter was filtered. To this insoluble matter, 750 g of hexane was added again, and after dissolving the soluble matter in the same manner, the insoluble matter was filtered. The respective filtrates were mixed, and hexane was distilled off under reduced pressure using an evaporator to obtain a crude product. The crude product was recrystallized with 150 g of hexane to obtain 102.4 g of the intended SPeDMS (yield 47%).
將所得之化合物之1H NMR光譜表示於圖1中。 The 1 H NMR spectrum of the obtained compound is shown in FIG. 1.
在200mL反應燒瓶中裝填2-萘甲醇[東京化成工業(股)製]25.0g(0.158mol)、及THF158g,使用氮氣氣球將燒瓶中之空氣以氮氣取代後,冷卻至0℃。對此,加入三乙基胺[東京化成工業(股)製]17.58g(0.174mol)、及丙烯醯基氯[東京化成工業(股)製]15.73g(0.174mol),在室溫(約23℃)攪拌1小時。對此反應混合物加入水158g,以乙酸乙酯158g萃取生成 物。從有機層使用蒸發器將溶劑減壓餾去,獲得粗生成物。將粗生成物以氧化矽凝膠色層分析(己烷/乙酸乙酯=9/1(質量比))純化,獲得目的物之萘-2-基甲基丙烯酸酯21.5g(收率64%)。 A 200 mL reaction flask was charged with 25.0 g (0.158 mol) of 2-naphthalenemethanol [manufactured by Tokyo Chemical Industry Co., Ltd.] and 158 g of THF, and after replacing the air in the flask with nitrogen using a nitrogen balloon, it was cooled to 0°C. To this, 17.58 g (0.174 mol) of triethylamine [manufactured by Tokyo Chemical Industry Co., Ltd.] and 15.73 g (0.174 mol) of acryloyl chloride [manufactured by Tokyo Chemical Industry Co., Ltd.] were added and kept at room temperature (about 23°C) Stir for 1 hour. 158 g of water was added to the reaction mixture, and the product was extracted with 158 g of ethyl acetate. The solvent was distilled off under reduced pressure from the organic layer using an evaporator to obtain a crude product. The crude product was purified by silica gel chromatography (hexane/ethyl acetate=9/1 (mass ratio)) to obtain 21.5 g of the target naphthalene-2-yl methacrylate (yield 64%) ).
從所得之化合物之1H NMR光譜確認目的之構造。 The target structure was confirmed from the 1 H NMR spectrum of the obtained compound.
在具備凝縮器之500mL反應燒瓶中裝填鎂切削片[關東化學(股)製]10.4g(0.43mol),使用氮氣氣球將燒瓶中之空氣以氮氣取代。對此,將9-溴菲[東京化成工業(股)製]100.3g(0.39mol)、及THF346g之混合物在室溫(約23℃)下以1小時滴入,進一步,進行攪拌30分鐘,調製格任亞試藥。 A 500 mL reaction flask equipped with a condenser was filled with 10.4 g (0.43 mol) of magnesium chips [manufactured by Kanto Chemical Co., Ltd.], and the air in the flask was replaced with nitrogen using a nitrogen balloon. In this regard, a mixture of 100.3 g (0.39 mol) of 9-bromophenanthrene [manufactured by Tokyo Chemical Industry Co., Ltd.] and 346 g of THF was dropped at room temperature (about 23°C) for 1 hour, and further stirred for 30 minutes. Prepare Gerenya reagent.
在1L之反應燒瓶中裝填TMOS178.0g(1.17mol)、及THF346g,使用氮氣氣球將燒瓶中之空氣以氮氣取代。對此,將上述格任亞試藥在室溫(約23℃)下,以30分鐘滴入,進一步攪拌2小時。從此反應混合物使用蒸發器使THF減壓餾去。於所得之殘渣中加入己烷1000g,溶解可溶物之後,過濾不溶物。在此不溶物中再度加入己烷500g,同樣地過濾可溶物。混合各別之濾液,使用蒸發器將己烷減壓餾去,獲得粗生成物。將粗生成物減壓蒸留(1mmHg、120~150℃)之後,以甲醇389g進行再結晶,獲得目的之PheTMS74.6g(收率64%)。 A 1L reaction flask was filled with 178.0g (1.17mol) of TMOS and 346g of THF, and a nitrogen balloon was used to replace the air in the flask with nitrogen. In this regard, the above-mentioned Grenya reagent was dropped at room temperature (approximately 23° C.) for 30 minutes, and further stirred for 2 hours. From this reaction mixture, THF was distilled off under reduced pressure using an evaporator. After adding 1000 g of hexane to the obtained residue to dissolve the soluble matter, the insoluble matter was filtered. 500 g of hexane was added to this insoluble matter again, and the soluble matter was filtered in the same manner. The respective filtrates were mixed, and hexane was distilled off under reduced pressure using an evaporator to obtain a crude product. After the crude product was evaporated under reduced pressure (1 mmHg, 120 to 150°C), it was recrystallized with 389 g of methanol to obtain 74.6 g of the desired PheTMS (yield 64%).
將所得之化合物之1H NMR光譜表示於圖2中。 The 1 H NMR spectrum of the obtained compound is shown in FIG. 2.
在具備凝縮器之50mL反應燒瓶中裝填TEAH1.36g(3.23mmol)、及THF12g,使用氮氣氣球將燒瓶中之空氣以氮氣取代。對此,將依據製造例1所製造之SPeDMS29.9g(80.7mmol)、及THF24g之混合物在室溫(約23℃)下以10分鐘滴入,以40℃攪拌16小時。再將此冷卻至室溫(約23℃)。然後,於此反應混合物中加入預先以THF洗淨過之陽離子交換樹脂[Dow Chemical公司製Amberlist(註冊商標)15JWET]6.0g、及過濾助劑[日本製紙(股)製KCFlock W-100GK]1.2g,攪拌1小時而停止反應。其後,以孔徑0.5μm之過濾膜過濾陽離子交換樹脂及過濾助劑,進一步以乙酸乙酯30g沖洗。合併此濾液及洗淨液,添加於甲醇897g中使聚合物沈澱。將此沈澱物過濾、乾燥,獲得目的之高折射率聚合性化合物1(以下,亦有時簡稱為PSPeDMS)18.9g。 A 50 mL reaction flask equipped with a condenser was charged with 1.36 g (3.23 mmol) of TEAH and 12 g of THF, and a nitrogen balloon was used to replace the air in the flask with nitrogen. In this regard, a mixture of 29.9 g (80.7 mmol) of SPeDMS manufactured according to Manufacturing Example 1 and 24 g of THF was dropped at room temperature (about 23° C.) for 10 minutes, and stirred at 40° C. for 16 hours. Cool this to room temperature (about 23°C). Then, 6.0 g of a cation exchange resin [Amberlist (registered trademark) 15JWET manufactured by Dow Chemical Co., Ltd.] and a filter aid [KCFlock W-100GK manufactured by Nippon Paper Co., Ltd.] 1.2 were added to this reaction mixture. g, stir for 1 hour to stop the reaction. After that, the cation exchange resin and the filter aid were filtered with a filter membrane with a pore diameter of 0.5 μm, and further rinsed with 30 g of ethyl acetate. This filtrate and washing liquid were combined, and they were added to 897 g of methanol to precipitate the polymer. This precipitate was filtered and dried to obtain 18.9 g of the intended high refractive index polymerizable compound 1 (hereinafter, also abbreviated as PSPeDMS).
以GPC進行之聚苯乙烯換算所測定之獲得的化合物之重量平均分子量Mw為610,分散度:Mw(重量平均分子量)/Mn(數目平均分子量)為1.2。 The weight average molecular weight Mw of the obtained compound measured in terms of polystyrene by GPC was 610, and the degree of dispersion: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.2.
在具備凝縮器之50mL反應燒瓶中裝填TEAH0.90g(2.14mmol)、離子交換水0.86g(47.7mmol)、及THF7g,使用氮氣氣球將燒瓶中之空氣以氮氣取代。對 此,將依據製造例1所製造之SPeDMS9.9g(26.8mmol)、依據製造例3所製造之PheTMS8.0g(26.8mmol)、及THF14g之混合物在室溫(約23℃)下以10分鐘滴入,以40℃攪拌16小時。再將此冷卻至室溫(約23℃)。然後,於此反應混合物中加入預先以THF洗淨過之陽離子交換樹脂[Dow Chemical公司製Amberlist(註冊商標)15JWET]3.6g、及過濾助劑[日本製紙(股)製KCFlock W-100GK]0.72g,攪拌1小時而停止反應。其後,以孔徑0.5μm之過濾膜過濾陽離子交換樹脂及過濾助劑,進一步以乙酸乙酯18g沖洗。合併此濾液及洗淨液,添加於甲醇538g中使聚合物沈澱。將此沈澱物過濾、乾燥,獲得目的之高折射率聚合性化合物2(以下,亦有時簡稱為XPe55)14.8g。 A 50 mL reaction flask equipped with a condenser was filled with 0.90 g (2.14 mmol) of TEAH, 0.86 g (47.7 mmol) of ion-exchanged water, and 7 g of THF, and a nitrogen balloon was used to replace the air in the flask with nitrogen. In this regard, a mixture of 9.9 g (26.8 mmol) of SPeDMS manufactured according to Manufacturing Example 1, PheTMS 8.0 g (26.8 mmol) manufactured according to Manufacturing Example 3, and 14 g of THF was used for 10 minutes at room temperature (about 23°C) Dropped and stirred at 40°C for 16 hours. Cool this to room temperature (about 23°C). Then, 3.6 g of a cation exchange resin [Amberlist (registered trademark) 15JWET manufactured by Dow Chemical Co., Ltd.] and a filter aid [KCFlock W-100GK manufactured by Nippon Paper Co., Ltd.] 0.72 were added to this reaction mixture. g, stir for 1 hour to stop the reaction. After that, the cation exchange resin and the filter aid were filtered with a filter membrane with a pore size of 0.5 μm, and further washed with 18 g of ethyl acetate. The filtrate and the washing liquid were combined, and added to 538 g of methanol to precipitate the polymer. This precipitate was filtered and dried to obtain 14.8 g of the intended high refractive index polymerizable compound 2 (hereinafter, also sometimes referred to as XPe55).
以GPC進行之聚苯乙烯換算所測定之獲得的化合物之重量平均分子量Mw為1000,分散度:Mw/Mn為1.0。 The weight average molecular weight Mw of the obtained compound measured in terms of polystyrene by GPC was 1000, and the degree of dispersion: Mw/Mn was 1.0.
有關依據製造例1,2而製造出之SPeDMS及NMA、以及VN、BPOEA,測定在大氣壓下、23℃及100℃中之物質的狀態及黏度。將結果表示於表1中。 Regarding the SPeDMS, NMA, VN, and BPOEA produced according to Production Examples 1 and 2, the state and viscosity of the substance at 23°C and 100°C under atmospheric pressure were measured. The results are shown in Table 1.
將上述SPeDMS、NMA、VN、或BPOEA100質量份、I184 1質量份、及PGMEA233質量份混合。將此溶液以孔徑0.2μm之PTFE唧筒過濾器過濾,獲得固體成分濃度30質量%之清漆。 100 parts by mass of SPeDMS, NMA, VN, or BPOEA, 1 part by mass of I184, and 233 parts by mass of PGMEA were mixed. This solution was filtered with a PTFE pump filter with a pore size of 0.2 μm to obtain a varnish with a solid content of 30% by mass.
將各清漆進行旋轉塗佈在矽晶圓上(1500rpm×30秒鐘),以80℃之加熱板加熱乾燥1分鐘。將此塗膜在氮氣 環境下以20mW/cm2進行UV曝光250秒鐘,進一步,以150℃之加熱板加熱20分鐘,製作膜厚1.0μm之硬化膜。測定所得之硬化膜的波長589nm(D線)之阿貝數νD。將結果一併表示於表1中。 Each varnish was spin-coated on a silicon wafer (1500 rpm×30 seconds), and heated and dried on a hot plate at 80°C for 1 minute. This coating film was subjected to UV exposure at 20 mW/cm 2 in a nitrogen atmosphere for 250 seconds, and further heated on a hot plate at 150° C. for 20 minutes to produce a cured film with a film thickness of 1.0 μm. The Abbe number ν D of the obtained cured film at a wavelength of 589 nm (line D) was measured. The results are shown in Table 1 together.
調配作為(b)成分之低黏度化劑的VN2質量份、作為(a)成分之高折射率聚合性化合物的FDA6質量份、及作為(c)成分之聚合性稀釋劑的BnA2質量份,在40℃攪拌2小時。對此,加入作為(d)成分之聚合起始劑的I184 0.1質量份及TPO0.07質量份,在40℃攪拌1小時。進一步,對此,加入作為鏈轉移劑(反應促進劑)之DDT0.3質量份,在室溫(約23℃)攪拌2小時,製得均勻透明清漆之聚合性組成物1。
除將各調配如表2記載之方式變更以外,其餘係與實施例1同樣地操作,分別調製聚合性組成物2~16。又,表 2中,「部」表示「質量份」。 Except that each formulation was changed as described in Table 2, the rest was performed in the same manner as in Example 1, and
將各聚合性組成物之25℃的黏度表示於表3中。 Table 3 shows the viscosity of each polymerizable composition at 25°C.
將各聚合性組成物與1mm厚之聚矽氧橡膠製間隔物一起以經離型處理之玻璃基板2片挾持。經此挾持之聚合性組成物以20mW/cm2UV曝光250秒鐘。將硬化物從玻璃基板剝離之後,以150℃之加熱板加熱20分鐘,製作直徑30mm、厚度1mm之成形體。 Each polymerizable composition and a 1mm thick silicone rubber spacer were sandwiched by two glass substrates with a release process. The polymerizable composition held by this was exposed to 20mW/cm 2 UV for 250 seconds. After peeling the cured product from the glass substrate, it was heated on a hot plate at 150°C for 20 minutes to produce a molded body with a diameter of 30 mm and a thickness of 1 mm.
測定所得之成形體之波長589nm(D線)的阿貝數νD、及折射率nD、波長400~800nm之平均透過率。將結果一併表示於表3。 Measure the Abbe's number ν D at the wavelength of 589 nm (D line) of the obtained molded body, the refractive index n D , and the average transmittance at the wavelength of 400 to 800 nm. The results are shown in Table 3 together.
如表2及表3所示,藉由本發明之低黏度劑的調配,與無調配低黏度化劑之例相比較,可獲得實現低黏 度化、低阿貝數νD,又,有關折射率nD及透過率亦同等或可提升至更高之值的結果(參照實施例1及3與比較例1、實施例4及比較例2、實施例5及比較例3)。又,在實施例2,雖藉由低黏度劑之調配可實現低黏度化及高折射率及高透過率,但於聚合性組成物佔有之高折射率聚合性化合物之比例減少,故可看到阿貝數之上昇。 As shown in Tables 2 and 3, the low-viscosity agent of the present invention can be formulated to achieve low viscosity and low Abbe number ν D as compared with the case where the low-viscosity agent is not formulated. In addition, it is related to the refractive index. n D and transmittance are also the same or can be increased to higher values (refer to Examples 1 and 3 and Comparative Example 1, Example 4 and Comparative Example 2, Example 5 and Comparative Example 3). In addition, in Example 2, although low viscosity, high refractive index and high transmittance can be achieved by the formulation of a low viscosity agent, the proportion of high refractive index polymerizable compounds in the polymerizable composition is reduced, so it can be seen To the rise of Abbe number.
又,屬於以往之液狀稀釋劑的BPOEA雖然與本發明之低黏度化劑同樣地黏度降低或維持10000mPa‧s以下之黏度,但阿貝數會上昇(參照實施例5與比較例5、實施例7與比較例6、實施例9與比較例7)。又,若與無調配低黏度化劑之例比較,BPOEA係藉由調配,反而成為可看到阿貝數上昇之結果(參照比較例3與5、比較例4與7)。 In addition, although BPOEA, which is a conventional liquid diluent, has a lower viscosity or maintains a viscosity of 10000 mPa•s or less like the low-viscosity agent of the present invention, the Abbe number increases (refer to Example 5 and Comparative Example 5, implementation Example 7 and Comparative Example 6, Example 9 and Comparative Example 7). In addition, when compared with the example in which the low viscosity agent is not formulated, BPOEA is compounded, but the result is that the Abbe number can be increased (refer to Comparative Examples 3 and 5, and Comparative Examples 4 and 7).
將上述FDA、PSPeDMS、XPe55或BPOEA 100質量份、I184 1質量份、及PGMEA 233質量份混合。將此溶液以孔徑0.2μm之PTFE唧筒過濾器過濾,獲得固體成分濃度30質量%之清漆。 100 parts by mass of the aforementioned FDA, PSPeDMS, XPe55 or BPOEA, 1 part by mass of I184, and 233 parts by mass of PGMEA were mixed. This solution was filtered with a PTFE pump filter with a pore size of 0.2 μm to obtain a varnish with a solid content of 30% by mass.
將各清漆進行旋轉塗佈在矽晶圓上(1500rpm×30秒鐘),以80℃之加熱板加熱乾燥1分鐘。將此塗膜在氮氣環境下以20mW/cm2進行UV曝光250秒鐘,進一步,以150℃之加熱板加熱20分鐘,製作膜厚1.0μm之硬化膜。測定所得之硬化膜的波長589nm(D線)之折射率及阿貝數νD。將結果一併表示於表4中。 Each varnish was spin-coated on a silicon wafer (1500 rpm×30 seconds), and heated and dried on a hot plate at 80°C for 1 minute. This coating film was subjected to UV exposure at 20 mW/cm 2 in a nitrogen atmosphere for 250 seconds, and further heated on a hot plate at 150° C. for 20 minutes to produce a cured film with a film thickness of 1.0 μm. The refractive index and Abbe number ν D of the obtained cured film at a wavelength of 589 nm (D line) were measured. The results are shown in Table 4 together.
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