TWI724487B - Current controlling device - Google Patents

Abstract

A current controlling device includes a conductive substrate and at least one current controlling structure. The at least one current controlling structure is formed on the conductive substrate. When a current is inputted into the conductive substrate, the current is blocked or split, thereby forming a uniform current intensity distribution on the conductive substrate. Therefore, the current controlling device has a uniform current intensity in a large area, and can be applied on a large area display device with uniform brightness and color distribution.

Description

Current control device

The present invention relates to a control device, in particular to a current control device that can make the current intensity distribution uniform.

Modern electronic devices often require power supply to start. Therefore, a current source or a voltage source is necessary. In addition, with the different complexity of the structure of the electronic device, the current sharing device used in it also has a different structure. For example, based on the demand of modern people for visual entertainment, the size of the display has gradually developed in the direction of large size. As the size of the display is larger, the structure of the current sharing device is more complicated, and therefore, it is more difficult to control the current distribution. Nowadays, such large displays still suffer from uneven current distribution, resulting in uneven brightness or color. Therefore, it is still necessary to develop a current control device that can uniformly control the current intensity distribution.

According to one embodiment of the present invention, a current control device is provided, which includes a conductive substrate and at least one current control structure. At least one current control structure is formed on the conductive substrate. When a current is input from the conductive substrate, the current is cut off or shunted through at least one current control structure, so that a uniform current intensity distribution is formed on the conductive substrate.

In the current control device of the above embodiment, the material of the conductive substrate may be an indium tin oxide.

In the current control device of the above embodiment, the current control structure may be a groove.

In the current control device of the above embodiment, the trench can be formed by a physical destruction method or a chemical destruction method.

In the current control device of the above embodiment, the number of current control structures is two or more. The current control structures are arranged in parallel or perpendicularly spaced apart from each other.

In the current control device of the above embodiment, one of the vertical distances between the current control structures may be the same or different.

According to another embodiment of the present invention, a current control device is provided, which includes a conductive substrate and at least one current control structure. At least one current control structure is formed on the conductive substrate. When a current is input from the conductive substrate, the current is increased or shunted through at least one current control structure, so that a uniform current intensity distribution is formed on the conductive substrate.

In the current control device of the above embodiment, the material of the conductive substrate can be an indium tin oxide, fluorine-doped tin oxide conductive glass, antimony-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, or indium Doped with zinc oxide.

In the current control device of the above embodiment, the current control structure includes a conductive material.

In the current control device of the above embodiment, the current control structure can be formed on the conductive substrate through dispensing, screen printing, evaporation, sputtering, coating, spraying, physical deposition or chemical deposition.

In the current control device of the above embodiment, the number of current control structures is two or more. Each current control structure can be formed on a central area or an edge area on the conductive substrate.

According to another embodiment of the present invention, a current control device is provided, which includes a conductive substrate and at least one current control unit. At least one current control unit is conductively connected to the outside of the conductive substrate. When a current is input from the conductive substrate, the current is shunted outside the conductive substrate through at least one current control unit, so that a uniform current intensity distribution is formed on the conductive substrate.

In the current control device of the above embodiment, the current control unit may be a conductive wire or a variable resistor.

In the current control device of the above embodiment, one end of the current control unit is connected to one end of the conductive substrate, and the other end of the current control unit is connected to the other end of the conductive substrate.

100‧‧‧Current control device

101‧‧‧Current control structure

102‧‧‧Current control structure

103‧‧‧Current control structure

104‧‧‧Slit

105‧‧‧Current control structure

106‧‧‧Current Control Unit

110‧‧‧Conductive substrate

A‧‧‧area

B‧‧‧area

I‧‧‧Current

d1‧‧‧Vertical distance

d2‧‧‧Vertical distance

Figure 1 is a schematic diagram of the current distribution of a current input to a conductive substrate; Figure 2 is a schematic diagram of the first structure of the current control device of the present invention; Figure 3 is a schematic diagram of the current control of the present invention A schematic diagram of the second structure of the device; Figure 4 is a schematic diagram of the third structure of the current control device of the present invention; Figure 5 is a schematic diagram of the fourth structure of the current control device of the present invention; and Figure 6 It is a schematic diagram showing the fifth structure of the current control device of the present invention.

In the following description, specific embodiments of the present invention will be described with reference to the accompanying drawings. Many practical details will be explained in the following description. However, these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some conventionally used structures and elements will be drawn in a simple schematic manner in the drawings; and repeated elements may be represented by the same numbers.

Please refer to Figure 1. FIG. 1 is a schematic diagram showing the current distribution of a current I input to a conductive substrate 110. In FIG. 1, a current I is input into the conductive substrate 110 from one end of the conductive substrate 110. At this time, the current I is diffused and distributed on the conductive substrate 110. However, at the input terminal close to the current I, the current intensity is stronger, and as the distance from the input terminal of the conductive substrate 110 is, the current intensity decreases. In other words, the current intensity distributions of area A and area B in Figure 1 will not be equal. Since the area A is close to the input terminal of the current I, its current intensity distribution will be greater than that of the area B farther away from the input terminal of the current I. The conventional method to solve this uneven current intensity distribution is to inject a larger current from the input end of the conductive substrate 110. However, the injection ratio is not only difficult to control, but also often causes the device to burn out.

FIG. 2 is a schematic diagram of the first structure of the current control device 100 of the present invention. In FIG. 2, the current control device 100 includes a conductive substrate 110, a plurality of current control structures 101, a plurality of current control structures 102, and a plurality of current control structures 103. The current I is input into the conductive substrate from one end of the conductive substrate 110 110, and diffusely distributed on the conductive substrate 110. The current control structures 101, the current control structures 102, and the current control structures 103 are arranged in parallel and spaced apart from each other. In addition, a slit 104 is formed between each current control structure 101, between each current control structure 102, and between each current control structure 103. The material of the conductive substrate 110 can be an indium tin oxide (ITO), but is not limited to this, and can also be fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), or aluminum-doped zinc oxide. (AZO), gallium doped zinc oxide (GZO) or indium doped zinc oxide (IZO) and other transparent conductive films. The current control structure 101, 102, 103 may be a trench. When the current I flows through the trench, it will be cut off, so it is shunted out by the slit 104. In this way, the intensity of the current I close to the input terminal is weakened, and a uniform current intensity distribution is formed on the conductive substrate 110. The current control structures 101 and the current control structures 102 are separated by a vertical distance d1; the current control structures 102 and the current control structures 103 are separated by a vertical distance d2. The vertical distance d1 and the vertical distance d2 can be the same or different, and the shunt ratio of the current I can be adjusted according to different conditions. The current control structures 101, 102, 103 can be formed through physical or chemical destruction methods, such as laser cutting, grinding, knife cutting, ion beam (or electron beam) bombardment, chemical etching, etc., and there is no particular limitation.

Now refer to Figure 3 and Figure 4 together. FIG. 3 is a schematic diagram of the second structure of the current control device 100 of the present invention. FIG. 4 is a schematic diagram of a third structure of the current control device 100 of the present invention. In FIGS. 3 and 4, the current control device 100 includes a conductive substrate 110 and at least one current control structure 105. The current I is input into the conductive substrate 110 from one end of the conductive substrate 110, and is diffused and distributed on the conductive substrate 110. The current control structure 105 can be a conductive unit. The conductive unit can be through dispensing, screen printing, evaporation, sputtering, coating, It is formed on the conductive substrate 110 by spraying, physical deposition or chemical deposition, etc., and there is no particular limitation. In one embodiment, the current control structure 105 includes a conductive material (metal or conductive polymer, etc.). Thereby, when the current I flows through the current control structure 105, through the connection of the current control structure 105, the current in the area closer to the input terminal and with a stronger current intensity can be opposed to the area farther from the input terminal and has a higher current. The current in the area of weak current intensity is increased and shunted, so that a uniform current intensity distribution is formed on the conductive substrate 110. In Fig. 3, the current control structure 105 is formed in the edge area of the conductive substrate 110; in Fig. 4, the current control structure 105 is formed in the central area of the conductive substrate 110. Through the current control structures 105 formed at different positions on the conductive substrate 110, different current intensity gain effects can be obtained.

Please refer to Figure 5. FIG. 5 is a schematic diagram showing the fourth structure of the current control device 100 of the present invention. In FIG. 5, the current control device 100 includes a conductive substrate 110 and at least one current control unit 106. The current control unit 106 is conductively connected to the outside of the conductive substrate 110 in a jumper manner. In FIG. 5, the current I is input into the conductive substrate 110 from one end of the conductive substrate 110, and is diffused and distributed on the conductive substrate 110. One end of the current control unit 106 is connected to one end of the conductive substrate 110, and the other end of the current control unit 106 is connected to the other end of the conductive substrate 110. Thereby, through the current control unit 106, the current I, which is close to the input terminal and has a strong current intensity, can be shunted outside the conductive substrate 110, so that the other end of the conductive substrate 110 can also receive a current input of equivalent current intensity. A uniform current intensity distribution is formed on the conductive substrate 110. The current control unit 106 can be a conductive wire or a variable resistor. When a variable resistor is used, the ratio of current shunt can be adjusted to adapt to various conditions.

Please refer to Figure 6. FIG. 6 is a schematic diagram showing the fifth structure of the current control device 100 of the present invention. The current control device 100 in Figure 6 is a comprehensive application of the foregoing embodiments. In addition to using the current control structure 101, 102, 103 to cut or shunt the current I on the conductive substrate 110, and the current control structure 105 to perform the gain and shunt of the current I on the conductive substrate 110, the current control unit 106 is also used to automatically The current I is shunted outside the conductive substrate 110. In this way, the overall conductive substrate 110 can obtain a more uniform current intensity distribution. When the above-mentioned current control device 100 is applied to a large-area liquid crystal (LCD) or organic light emitting diode (OLED) display device, a uniform color and brightness distribution can be obtained in a simple manner, which makes the visual perception more comfortable.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the scope of the attached patent application.

100‧‧‧Current control device

101‧‧‧Current control structure

102‧‧‧Current control structure

103‧‧‧Current control structure

104‧‧‧Slit

110‧‧‧Conductive substrate

I‧‧‧Current

d1‧‧‧Vertical distance

d2‧‧‧Vertical distance

Claims (12)

A current control device, comprising: a conductive substrate; and at least one current control structure formed on the conductive substrate; wherein when a current is input from the conductive substrate, the current is made through the at least one current control structure Being cut off or shunted, a uniform current intensity distribution is formed on the conductive substrate; wherein the current control structure is a trench. As for the current control device described in item 1 of the scope of patent application, the material of the conductive substrate is an indium tin oxide, fluorine-doped tin oxide conductive glass, antimony-doped tin oxide, aluminum-doped zinc oxide, gallium-doped Hetero zinc oxide or indium doped zinc oxide. According to the current control device described in item 1 of the scope of patent application, the groove is formed by a physical destruction method or a chemical destruction method. For the current control device described in item 1 of the scope of patent application, the number of the current control structures is two or more, and the current control structures are arranged in parallel or at a vertical interval with each other. According to the current control device described in item 4 of the scope of patent application, one of the vertical distances between the current control structures is the same or different. A current control device, comprising: a conductive substrate; and at least one current control structure formed on the conductive substrate; wherein when a current is input from the conductive substrate, the current is made through the at least one current control structure By gaining or shunting, a uniform current intensity distribution is formed on the conductive substrate; wherein the current control structure includes a conductive material. According to the current control device described in item 6 of the scope of patent application, the material of the conductive substrate is an indium tin oxide. The current control device according to item 6 of the scope of patent application, wherein the current control structure is formed on the conductive substrate by dispensing, screen printing, evaporation, sputtering, coating, spraying, physical deposition or chemical deposition . According to the current control device described in item 6 of the scope of patent application, the number of the current control structures is two or more, and each current control structure is formed on a central area or an edge area of the conductive substrate. A current control device comprising: a conductive substrate; and at least one current control unit, which is conductively connected to the outside of the conductive substrate and does not contact the conductive substrate body; wherein when a current is input from the conductive substrate, it passes through The at least one current control unit allows the current to be shunted outside the conductive substrate, so that a uniform current intensity distribution is formed on the conductive substrate. According to the current control device described in item 10 of the scope of patent application, the current control unit is a conductive wire or a variable resistor. According to the current control device described in claim 10, one end of the current control unit is connected to one end of the conductive substrate, and the other end of the current control unit is connected to the other end of the conductive substrate.

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