TWI724244B - Thermal transfer sheet - Google Patents

Thermal transfer sheet Download PDF

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TWI724244B
TWI724244B TW106133555A TW106133555A TWI724244B TW I724244 B TWI724244 B TW I724244B TW 106133555 A TW106133555 A TW 106133555A TW 106133555 A TW106133555 A TW 106133555A TW I724244 B TWI724244 B TW I724244B
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layer
thermal transfer
transfer sheet
transfer
transferred
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TW201825313A (en
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米山泰史
谷雅行
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日商大日本印刷股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B41M5/52Macromolecular coatings

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Electronic Switches (AREA)

Abstract

本發明提供即使對熱轉印薄片施加之熱能極高時,亦可於列印機內部抑制被轉印體與熱轉印薄片熱融合之熱轉印薄片。   藉由下述熱轉印薄片(100)而可解決上述課題,該熱轉印薄片(100)係於基材(1)之一面上設有轉印層(10)者,使用具有熱轉印薄片供給機構(201)、加熱機構(202)、熱轉印薄片捲取機構(203)、位於加熱機構(202)與熱轉印薄片捲取機構(203)之間之測定機構(204)、位於加熱機構(202)與測定機構(204)之間之剝離機構(205)之列印機(200),於以施加能量0.177mJ/dot、熱轉印薄片(100)之搬送速度28.2mm/sec.之條件,邊於被轉印體(300)上轉印轉印層(10),邊將轉印於被轉印體(300)上之轉印層(10)以50°之剝離角度自熱轉印薄片(100)剝離之時點,藉由測定機構(204)所測定之拉伸強度為0.29N/cm以下。The present invention provides a thermal transfer sheet that can inhibit the thermal fusion of the transfer body and the thermal transfer sheet in the printer even when the heat energy applied to the thermal transfer sheet is extremely high. The above-mentioned problems can be solved by the following thermal transfer sheet (100). The thermal transfer sheet (100) is a substrate (1) provided with a transfer layer (10) on one side of the substrate (1). Sheet feeding mechanism (201), heating mechanism (202), thermal transfer sheet winding mechanism (203), measuring mechanism (204) located between heating mechanism (202) and thermal transfer sheet winding mechanism (203), The printer (200) of the peeling mechanism (205) located between the heating mechanism (202) and the measuring mechanism (204) is applied with an applied energy of 0.177mJ/dot and a transfer speed of the thermal transfer sheet (100) 28.2mm/ Under the condition of sec., while transferring the transfer layer (10) on the transferred body (300), while transferring the transfer layer (10) on the transferred body (300) at a peeling angle of 50° The tensile strength measured by the measuring mechanism (204) at the time when the thermal transfer sheet (100) was peeled off was 0.29 N/cm or less.

Description

熱轉印薄片Thermal transfer sheet

[0001] 本發明係關於熱轉印薄片。[0001] The present invention relates to a thermal transfer sheet.

[0002] 用以將轉印層轉印於被轉印體上之熱轉印薄片已知有各種形態,例如如專利文獻1~3中所提案之(i)於基材之一面上設置作為轉印層之熱熔融墨水層之熱轉印薄片,(ii)於基材之一面上設置作為轉印層之接受層之熱轉印薄片(有時亦稱為中間轉印介質),(iii)於基材之一面上設置作為轉印層之保護層(有時亦稱為剝離層)之熱轉印薄片(有時亦稱為保護層轉印薄片),(iv)將該等構成適當組合而成之熱轉印薄片,例如已知有於基材之一面上,設置自該基材側起依序層合剝離層、接受層而成之層合構成的轉印層之熱轉印薄片,或於基材之同一面上依面順序設置熱熔融墨水層與保護層之熱轉印薄片等。且,已知有如專利文獻4中所提案之於基材上依序層合接受層、隱蔽層而成之(接受層與隱蔽層之層合體成為轉印層)之熱轉印薄片。依據專利文獻4中提案之熱轉印薄片,藉由將轉印層轉印於被轉印體上,可獲得接受層位於於其最表面之熱轉印呈像薄片。該等熱轉印薄片之轉印層係藉由將被轉印體與熱轉印薄片重疊,藉由加熱頭或加熱輥等之加熱機構加熱基材之另一面而轉印於被轉印體上。   [0003] 最近,市場上對於高速列印適性優異之列印機的要求變高,而朝向於列印機內部,將轉印層轉印於被轉印體上時對熱轉印薄片施加之能量(有時亦稱為熱能或施加能量等)增加一途。又,作為熱轉印薄片之轉印層轉印所用之列印機,已知有例如對於熱轉印薄片施加能量使轉印層熔融或軟化,於該轉印層固化之前,僅將已轉印於被轉印體上之轉印層自熱轉印薄片剝離之熱時剝離方式之列印機,及使轉印層固化後,僅將已轉印於被轉印體上之轉印層自熱轉印薄片剝離之冷時剝離方式之列印機。   [0004] 轉印層朝被轉印體上之轉印係於被轉印體與熱轉印薄片之轉印層密著的狀態,對熱轉印薄片施加能量而將轉印層轉印於被轉印體上,藉由將已轉印於被轉印體上之轉印層自熱轉印薄片剝離而進行。而且,轉印層的剝離性(有時亦稱為轉印層的轉印性)低時,熱轉印薄片之轉印層轉印於被轉印體上時,被轉印體與熱轉印薄片易熱熔著。又,被轉印體與熱轉印薄片熱熔著時,具體而言,直至轉印於被轉印體上之轉印層無法自熱轉印薄片剝離之程度,將被轉印體與熱轉印薄片貼合時,例如使用於基材上直接設置轉印層之熱轉印薄片而將轉印層轉印於被轉印體上時,於轉印層與基材產生意外之熱熔著之情況,易發生於列印機內部,熱轉印薄片斷裂,或於列印機內部,熱轉印薄片之運送異常(有時亦稱為JAM)之問題。尤其,有轉印轉印層時隨著施加於熱轉印薄片之能量變高,轉印層之剝離性變低,被轉印體與熱轉印薄片之熱熔著、或起因於熱熔著之搬送異常的發生頻度變高之傾向。   [0005] 又,轉印層之剝離性低之情況下,自熱轉印薄片剝離轉印層時,若是本來於轉印層與直接與該轉印層接觸之熱轉印薄片之構成構件之間應被剝離的轉印層會於構成轉印層之層間剝離,容易發生應轉印於被轉印體上之轉印層全部或一部分殘存於基材側之轉印不良。又,即使不發生此等轉印不良之情況,於轉印層之剝離性低的情況下,轉印時,轉印界面側之轉印層表面粗糙,換言之,位於轉印界面側之轉印層的面平滑性變低,易產生起因於此之各種問題。   [0006] 此等情況下,用以提高轉印層之剝離性已有各種研究,但針對對熱轉印薄片施加高能量時之轉印層之剝離性仍有改善餘地。 [先前技術文獻] [專利文獻]   [0007]   [專利文獻1] 日本特開平9-290576號公報   [專利文獻2] 日本特開平11-263079號公報   [專利文獻3] 日本特開2001-246845號公報   [專利文獻4] 日本特開平6-122281號公報[0002] Various forms of thermal transfer sheets for transferring a transfer layer to a body to be transferred are known. For example, as proposed in Patent Documents 1 to 3, (i) is provided on one surface of a substrate as The thermal transfer sheet of the hot melt ink layer of the transfer layer, (ii) The thermal transfer sheet (sometimes referred to as the intermediate transfer medium) as the receiving layer of the transfer layer is arranged on one surface of the substrate, (iii) ) A thermal transfer sheet (sometimes also called a protective layer transfer sheet) is provided as a protective layer (sometimes called a release layer) as a transfer layer on one surface of the substrate, (iv) the composition is appropriate The combined thermal transfer sheet, for example, is known for thermal transfer of a transfer layer formed by sequentially laminating a release layer and a receiving layer on one side of the substrate. Sheets, or thermal transfer sheets with a hot melt ink layer and a protective layer arranged on the same surface of the substrate in order. In addition, a thermal transfer sheet in which a receiving layer and a concealing layer are sequentially laminated on a substrate as proposed in Patent Document 4 (a laminate of the receiving layer and the concealing layer becomes the transfer layer) is known. According to the thermal transfer sheet proposed in Patent Document 4, by transferring the transfer layer to the transferred body, a thermal transfer imaging sheet with the receiving layer on the outermost surface can be obtained. The transfer layer of these thermal transfer sheets is transferred to the transferred body by overlapping the transferred body and the thermal transfer sheet, and the other side of the substrate is heated by a heating mechanism such as a heating head or a heating roller. on. [0003] Recently, the market for printers with excellent high-speed printability has become more demanding, and the thermal transfer sheet is applied to the thermal transfer sheet when the transfer layer is transferred to the body to be transferred toward the inside of the printer. Energy (sometimes called heat or applied energy, etc.) increases one way. In addition, as a printer used for transferring the transfer layer of a thermal transfer sheet, it is known, for example, to apply energy to the thermal transfer sheet to melt or soften the transfer layer. Before the transfer layer is solidified, only the transferred layer is transferred. A printer that uses a thermal peeling method in which the transfer layer printed on the body is peeled from the thermal transfer sheet, and after the transfer layer is cured, only the transfer layer that has been transferred on the body is transferred A printer with a cold peeling method that peels off the thermal transfer sheet. [0004] The transfer of the transfer layer to the body to be transferred is in a state where the body to be transferred and the transfer layer of the thermal transfer sheet are in close contact with each other, and energy is applied to the thermal transfer sheet to transfer the transfer layer to On the body to be transferred, it is performed by peeling the transfer layer transferred on the body to be transferred from the thermal transfer sheet. Moreover, when the releasability of the transfer layer (sometimes referred to as the transferability of the transfer layer) is low, when the transfer layer of the thermal transfer sheet is transferred to the transferred body, the transferred body and the thermal transfer The printed sheet fuses easily. In addition, when the transfer body and the thermal transfer sheet are thermally fused, specifically, until the transfer layer transferred on the transfer body cannot be peeled from the thermal transfer sheet, the transfer body and the thermal transfer sheet When the transfer sheet is attached, for example, when using a thermal transfer sheet with a transfer layer directly set on the substrate to transfer the transfer layer to the transfer object, unexpected heat fusion occurs between the transfer layer and the substrate This situation is likely to occur in the printer, the thermal transfer sheet is broken, or the thermal transfer sheet is transported abnormally (sometimes called JAM) inside the printer. In particular, when there is a transfer transfer layer, as the energy applied to the thermal transfer sheet becomes higher, the releasability of the transfer layer becomes lower, and the heat fusion between the transferred body and the thermal transfer sheet, or due to heat fusion There is a tendency to increase the frequency of abnormal transportation. [0005] In addition, when the releasability of the transfer layer is low, when the transfer layer is peeled off from the thermal transfer sheet, if it is originally between the transfer layer and the constituent members of the thermal transfer sheet directly in contact with the transfer layer The transfer layer that should be peeled off will peel off between the layers constituting the transfer layer, and the transfer layer that should be transferred on the body is likely to be transferred on the substrate, and all or part of the transfer layer will remain on the substrate side. In addition, even if such poor transfer does not occur, when the releasability of the transfer layer is low, the surface of the transfer layer on the transfer interface side is rough during transfer. In other words, the transfer layer on the transfer interface side is rough. The surface smoothness of the layer becomes low, and various problems due to this are likely to occur.  [0006] In these cases, various studies have been made to improve the releasability of the transfer layer, but there is still room for improvement in the releasability of the transfer layer when high energy is applied to the thermal transfer sheet. [Prior Art Document] [Patent Document]   [0007]   [Patent Document 1] Japanese Patent Application Publication No. 9-290576 [Patent Document 2] Japanese Patent Application Publication No. 11-263079 [Patent Document 3] Japanese Patent Application Publication No. 2001-246845 Publication [Patent Document 4] Japanese Patent Laid-Open No. 6-122281

[發明欲解決之課題]   [0008] 本發明係鑑於此等情況而完成者,主要課題在於提供將轉印層轉印於被轉印體上時,即使對熱轉印薄片施加之能量高之情況,轉印層之剝離性亦良好的熱轉印薄片。 [用以解決課題之手段]   [0009] 為解決上述課題之本發明係一種熱轉印薄片,其特徵係轉印層位於基材之一面上者,前述熱轉印薄片於將前述熱轉印薄片與被轉印體重疊,使用具有熱轉印薄片供給機構、加熱機構、熱轉印薄片捲取機構、位於前述加熱機構與前述熱轉印薄片捲取機構之間並測定沿搬送路徑搬送之熱轉印薄片之拉伸強度之測定機構、位於前述加熱機構與前述測定機構之間之剝離機構之列印機,於以施加能量0.177mJ/dot、熱轉印薄片之搬送速度28.2mm/sec.之條件,邊於前述被轉印體上轉印前述轉印層,邊將轉印於前述被轉印體上之前述轉印層以50°之剝離角度自前述熱轉印薄片剝離之時點,藉由前述測定機構所測定之拉伸強度為0.29N/cm以下。   [0010] 又亦可為,以前述條件測定之前述拉伸強度與將前述條件中之前述施加能量自0.177mJ/dot變更為0.169mJ/dot時所測定之拉伸強度之差的絕對值為0.25N/cm以下。   [0011] 又亦可為,前述轉印層呈現僅由接受層所成之單層構成或包含接受層之層合構成,前述轉印層呈現前述層合構成時,前述接受層係作為位於距離前述基材最近之層。 [發明效果]   [0012] 依據本發明之熱轉印薄片,即使對熱轉印薄片施加之能量高時,亦可成為轉印層之剝離性良好的熱轉印薄片。[Problems to be Solved by the Invention]   [0008] The present invention was completed in view of these circumstances. The main subject is to provide a method for transferring the transfer layer onto the body to be transferred, even if the energy applied to the thermal transfer sheet is high. In the case, a thermal transfer sheet with good releasability of the transfer layer. [Means to Solve the Problem]   [0009] The present invention for solving the above-mentioned problems is a thermal transfer sheet, which is characterized in that the transfer layer is located on one surface of the substrate. The thermal transfer sheet is used to transfer the thermal transfer The sheet is overlapped with the body to be transferred, and a thermal transfer sheet supply mechanism, a heating mechanism, and a thermal transfer sheet winding mechanism are used, which are located between the heating mechanism and the thermal transfer sheet winding mechanism and measure the conveyance along the conveying path. The thermal transfer sheet tensile strength measurement mechanism, the printer with the peeling mechanism located between the heating mechanism and the measurement mechanism, with an applied energy of 0.177mJ/dot, and a transfer speed of the thermal transfer sheet 28.2mm/sec . Conditions, while transferring the transfer layer on the transfer body, the transfer layer transferred on the transfer body is peeled from the thermal transfer sheet at a peeling angle of 50° , The tensile strength measured by the aforementioned measuring mechanism is 0.29N/cm or less. [0010] Alternatively, the absolute value of the difference between the tensile strength measured under the aforementioned conditions and the tensile strength measured when the aforementioned applied energy in the aforementioned conditions is changed from 0.177 mJ/dot to 0.169 mJ/dot 0.25N/cm or less. [0011] Alternatively, the transfer layer may have a single layer consisting of the receiving layer or a laminated structure including the receiving layer. When the transfer layer has the layered structure, the receiving layer may be located at a distance The nearest layer of the aforementioned substrate. [Effects of the Invention]   [0012] The thermal transfer sheet according to the present invention can be a thermal transfer sheet with good releasability of the transfer layer even when the energy applied to the thermal transfer sheet is high.

[0014] <<熱轉印薄片>>   以下,針對本發明一實施形態之熱轉印薄片(以下有時稱為一實施形態之熱轉印薄片)詳細說明。圖1~圖3係顯示一實施形態之熱轉印薄片之一例之概略剖面圖。如圖1~圖3所示,一實施形態之熱轉印薄片100具有基材1、可自該基材1剝離地設置之轉印層10。   [0015] 作為將熱轉印薄片之轉印層轉印於被轉印體上時可能產生之問題之一,舉例為被轉印體與熱轉印薄片之熱熔著。又,本說明書中所稱之被轉印體與熱轉印薄片之熱熔著,意指使被轉印體與熱轉印薄片重疊,自熱轉印薄片側藉由加熱頭等之加熱機構施加能量,將熱轉印薄片之轉印層轉印於被轉印體上,僅將轉印至被轉印體上之轉印層自熱轉印薄片剝離時,依據本來應殘存於熱轉印薄片側之熱轉印薄片之構成構件與轉印於被轉印體上之轉印層一體化,無法自熱轉印薄片僅剝離轉印於被轉印體上之轉印層之現象。意指例如,使用於基材上直接設置轉印層之熱轉印薄片時,基材與轉印層一體化至無法自基材剝離轉印至被轉印體上之轉印層的程度的現象。或者,即使可自熱轉印薄片僅剝離轉印於被轉印體上之轉印層,熱轉印薄片之構成構件與轉印至被轉印體上之轉印層一體化至該轉印層之剝離時產生異音等之程度的現象。又,被轉印體與熱轉印薄片熱熔著時,成為列印機內之搬送異常或引起轉印不良等之要因。又,為了對應於高速列印適性,於轉印層轉印於被轉印體上時,施加於熱轉印薄片之能量高的情況下,或使用熱時剝離方式之列印機之情況等,有被轉印體與熱轉印薄片易熱熔著之傾向。   [0016] 為了抑制熱轉印薄片之轉印層轉印至被轉印體上時可能產生之被轉印體與熱轉印薄片之熱熔著已進行了各種嘗試,例如提高轉印層之耐熱性的嘗試,或提高轉印層自熱轉印薄片之剝離性的嘗試等。然而目前之現狀為,藉由進行該等對策,即使可抑制特定轉印條件下之被轉印體與熱轉印薄片之熱熔著,但若提高轉印轉印層時施加於熱轉印薄片之熱能的情況下,仍無法充分抑制被轉印體與熱轉印薄片之熱熔著。   [0017] 又,被轉印體與熱轉印薄片之熱熔著,與轉印於被轉印體上之轉印層10自與構成熱轉印薄片之構成構件中與該轉印層直接接觸之構成構件剝離時的剝離力,例如直接於基材1上設置轉印層10之情況下,與自基材1剝離時之剝離力有密切關係,推測藉由減小該剝離力,可抑制該被轉印體與熱轉印薄片之熱熔著。因此,轉印於被轉印體上之轉印層10自與轉印層接觸之構成構件剝離時之剝離力於列印機內難以正確測定之情況下,有無法發現被轉印體與熱轉印薄片發生熱熔著的剝離力的臨限值之問題。針對該點進行檢討後,發現於列印機內,轉印於被轉印體上之轉印層10自與轉印層接觸之構成構件剝離時之剝離力,與該剝離時施加於熱轉印薄片之拉伸強度有相關關係,剝離時施加於熱轉印薄片之拉伸強度與被轉印體與熱轉印薄片之熱熔著亦有密切關係。以下以構成熱轉印薄片之構成構件中與轉印層直接接觸之構成構件為基材之情況為中心加以說明,但一實施形態之熱轉印薄片並非限定於基材與轉印層直接接觸之形態者,於基材與轉印層之間亦可設置任意層。該情況下,該任意層成為與轉印層直接接觸之構成構件。以下,有特別指明之情況除外,將轉印於被轉印體上之轉印層10自與轉印層接觸之熱轉印薄片100之構成構件剝離簡稱為自熱轉印薄片100剝離轉印層10。   [0018] 因此,一實施形態之熱轉印薄片100之特徵為,於將該熱轉印薄片100與被轉印體重疊,如圖7所示,使用具有熱轉印薄片供給機構201、加熱機構202、熱轉印薄片捲取機構203、位於加熱機構202與熱轉印薄片捲取機構203之間並測定沿搬送路徑搬送之熱轉印薄片之拉伸強度之測定機構204、位於加熱機構202與測定機構204之間之剝離機構205之列印機200,於以施加能量0.177mJ/dot、熱轉印薄片之搬送速度28.2mm/sec.之條件,邊於被轉印體300上轉印轉印層10,邊將轉印於被轉印體300上之轉印層10以50°之剝離角度自熱轉印薄片100剝離之時點,藉由測定機構204所測定之拉伸強度為0.29N/cm以下。   [0019] 本說明書中所謂施加能量(mJ/dot)係藉由下式(1)算出之施加能量,式(1)中之施加電力[W]可由下式(2)算出。   施加能量(mJ/dot)=W×L.S.×P.D.×能量灰階值…(1)   (式(1)中之[W]意指施加電力,[L.S.]意指線週期(msec./line),[P.D.]意指脈衝佔空比)   施加電力(W/dot)=V2 /R…(2)   (式(2)中之[V]意指施加電壓,[R]意指加熱機構之電阻值)。   [0020] 又,本說明書中所稱之熱轉印薄片之搬送速度(mm/sec.)係藉由下式(3)算出之搬送速度。   搬送速度(mm/sec.)=(25.4/(副掃描方向之印字密度(dot/inch)×線週期(msec./line)))×1000…(3)   (式(3)中之25.4係用以將吋換算為mm之數值)。   [0021] 又,本說明書中,藉由測定機構測定之拉伸強度(N/cm)係以上述條件藉由測定機構測定之應力(N)除以熱轉印薄片之加熱寬度(cm)之值。   [0022] 以下,將自基材1剝離已轉印至被轉印體300上之轉印層10時的條件,具體而言,使用具有熱轉印薄片供給機構201、加熱機構202、熱轉印薄片捲取機構203、位於加熱機構202與熱轉印薄片捲取機構203之間並測定沿搬送路徑搬送之熱轉印薄片100之拉伸強度之測定機構204、位於加熱機構202與測定機構204之間之剝離機構205之列印機200,於以施加能量0.177mJ/dot、熱轉印薄片之搬送速度28.2mm/sec.之條件,邊於被轉印體300上連續轉印轉印層10,邊將轉印於被轉印體300上之轉印層10以50°之剝離角度自熱轉印薄片100剝離之條件,總稱為「特定之測定條件」。   [0023] 依據具有上述特徵之一實施形態之熱轉印薄片,僅藉由滿足「特定之測定條件」下之熱轉印薄片之拉伸強度為0.29N/cm以下之條件,不會受到轉印轉印層10時之各種條件的影響,可使轉印層10之剝離性為良好者。藉此,可抑制熱轉印薄片100之轉印層10轉印於被轉印體300上時可能產生之被轉印體與熱轉印薄片之熱熔著。具體而言,欲對應於高速列印適性,而提高施加於熱轉印薄片之能量時,換言之,即使提高施加電力之情況,亦可抑制被轉印體與熱轉印薄片之熱熔著。   [0024] 更具體而言,欲對應於高速列印適性,而提高施加於熱轉印薄片之能量時,雖被轉印體與轉印層之密著性變高,有易使被轉印體與熱轉印薄片熱熔著之傾向,但依據「特定之測定條件」下之熱轉印薄片之拉伸強度為0.29N/cm以下之一實施形態的熱轉印薄片,可容易地自熱轉印薄片100剝離轉印層10,可抑制被轉印體與熱轉印薄片之熱熔著。   [0025] 再者,依據可成為轉印層10的剝離性良好者的一實施形態之熱轉印薄片100,轉印層10自與熱轉印薄片之轉印層10接觸之構成構件剝離時,可抑制與該構成構件接觸之側的轉印層10表面產生面粗糙。換言之,可抑制位於轉印界面側之轉印層10表面產生面粗糙。藉此,例如,構成轉印層的層中,位於轉印界面之層作為接受層時,可使接受層之染料染著性良好,且位於轉印界面之層作為保護層時,可使轉印層10之光澤度良好。   [0026] 於被轉印體300上轉印熱轉印薄片100之轉印層10時使用之列印機200若為可實現上述之「特定測定條件」,則亦可為使轉印層10熔融或軟化,於該轉印層固化前,將已轉印之轉印層10自熱轉印薄片100之基材1剝離的熱時剝離方式的列印機,亦可為於轉印層10固化後,將已轉印之轉印層10自熱轉印薄片100之基材1剝離的冷時剝離方式的列印機。   [0027] 又,一實施形態之熱轉印薄片於上述「特定測定條件」測定之拉伸強度與上述「特定測定條件」中將施加能量自0.177mJ/dot變更為0.169mJ/dot時測定之拉伸強度之差的絕對值較好為0.25N/cm以下,更好為0.1N/cm以下,又更好為0.05N/cm以下。依據該形態之熱轉印薄片,可於廣範圍能量,實現轉印層10之剝離性進一步提高。尤其較好上述「特定測定條件」測定之拉伸強度為0.2N/cm以下,且上述拉伸強度之差的絕對值為0.1N/cm以下。   [0028] (列印機)   其次,針對以上述「特定測定條件」,於被轉印體300上轉印轉印層10,將轉印於被轉印體上之轉印層10自熱轉印薄片100之基材1剝離時所用之列印機加以說明。   [0029] 如圖7所示,上述「特定測定條件」所用之列印機200具備:沿特定路徑搬送熱轉印薄片100之作為熱轉印薄片供給機構201的熱轉印薄片供給輥、及作為熱轉印薄片捲取機構203之捲取輥、加熱熱轉印薄片100之背面側而將轉印層10轉印於被轉印體300上之作為加熱機構202之加熱頭、使被轉印體300可於轉印層10所轉印之位置移動之壓輥206、位於加熱機構202與熱轉印薄片捲取機構203之間並轉印層10轉印於被轉印體300上之後,自基材1剝離轉印於該被轉印體300上之轉印層10的作為剝離機構205之剝離板、位於熱轉印薄片100的搬送路徑上且位於加熱機構202(剝離機構205)與熱轉印薄片捲取機構203之間,邊於被轉印體300上連續轉印轉印層10,邊測定自基材1剝離轉印於該被轉印體300上之轉印層10時之施加於熱轉印薄片之拉伸強度之作為測定機構204之張力計。   [0030] 上述「特定測定條件」所用之列印機200除了具備位於熱轉印薄片100的搬送路徑上且位於加熱機構202與熱轉印薄片捲取機構203之間,邊於被轉印體300上轉印轉印層10,邊測定以50°之剝離角度自熱轉印薄片100剝離轉印於該被轉印體300上之轉印層10時之熱轉印薄片之拉伸強度的測定機構204之方面以外,可適當設定使用以往習知之列印機。   [0031] 作為測定機構204,只要為可測定於搬送路徑中行進之熱轉印薄片的拉伸強度者即可,可使用張力計(ASK-1000型,大倉工業(股))。又,本說明書中所稱之拉伸強度與張力同義,拉伸強度之值表示轉印層10轉印於被轉印體300上之後,自該基材1剝離轉印於該被轉印體300上之轉印層10時之剝離力的實質值。依據測定機構204位於加熱機構202與熱轉印薄片捲取機構203之間的列印機200,藉由剝離機構205,可邊於被轉印體300上轉印轉印層10,邊測定以50°之剝離角度自熱轉印薄片100剝離轉印於該被轉印體300上之轉印層10之時點之熱轉印薄片之拉伸強度。具體而言,藉由邊於被轉印體300上連續轉印轉印層10,邊以50°之剝離角度連續自熱轉印薄片剝離轉印於該被轉印體上之轉印層10,而可測定自與熱轉印薄片100之該轉印層10接觸之構成構件剝離轉印層10時之實質剝離力。   [0032] 其次,針對上述「特定測定條件」之拉伸強度設為0.29N/cm以下之熱轉印薄片100之具體構成舉一例加以說明。又,一實施形態之熱轉印薄片100只要滿足上述「特定測定條件」之拉伸強度為0.29N/cm以下之條件即可,其以外之條件並未有限定。且,關於用以將上述「特定測定條件」之拉伸強度調整於0.29N/cm以下之具體手段亦未限定,可應用可使上述「特定測定條件」之拉伸強度為0.29N/cm以下之所有手段。以下,針對用以將上述「特定測定條件」之拉伸強度設為0.29N/cm以下之具體手段舉一例加以說明,但並非限定於該手段者。   [0033] (第1手段)   第1手段係適當選擇轉印層10所含有之成分,將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下之手段。具體而言,係將構成轉印層之層中,提高位於轉印界面之層的剝離性之手段。   [0034] 例如,如圖4所示,於基材1上設置自該基材1側依序層合接受層2、接著層5而成之層合構成的轉印層10時,藉由選擇位於轉印界面之接受層2所含有之適當樹脂材料,可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。作為一例,藉由於接受層2中含有作為樹脂材料之纖維素系樹脂,適當調整接受層中之纖維素系樹脂含量,可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。作為纖維素系樹脂可較好地使用纖維素乙酸酯丁酸酯(CAB)或纖維素乙酸酯丙酸酯(CAP)等。作為一例,藉由於接受層中含有數平均分子量(Mn)未達70000,較好55000以下,特佳40000以下之纖維素系樹脂,適當調整其含量,且與此同時適當調整接受層2之厚度、基材1之厚度等,而可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。又,數平均分子量(Mn)意指以聚苯乙烯作為標準物質,藉由凝膠滲透層析儀測定之值,意指藉由依據JIS-K-7252-1(2008)之方法測定之分子量。   [0035] 作成含有纖維素系樹脂之接受層2時之接受層厚度較好為0.3μm以上5μm以下之範圍。   [0036] 除此以外,藉由組合轉印層10中含有之樹脂材料與脫模劑,具體而言,藉由適當調整構成轉印層10之層中,位於轉印界面之層中含有之樹脂材料或脫模劑種類或該等之含量等,亦可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。作為脫模劑可舉例為例如聚乙烯蠟、聚矽氧蠟等之蠟類、聚矽氧樹脂、聚矽氧改質樹脂、氟樹脂、氟改質樹脂、聚乙烯醇、丙烯酸樹脂、熱硬化性環氧-胺基共聚物、及熱硬化性醇酸-胺基共聚物(熱硬化性胺基醇酸樹脂)等。   [0037] 又,第1手段中,考慮基材之熱收縮率,藉由作為基材使用其熱收縮率為10%以下,更好6%以下,又更好4%以下之基材,可將上述「特定測定條件」中,將施加能量自0.177mJ/dot變更為0.169mJ/dot時所測定之拉伸強度設為0.2N/cm以下。又,上述「特定測定條件」下測定之拉伸強度與上述「特定測定條件」中,將施加能量自0.177mJ/dot變更為0.169mJ/dot時所測定之拉伸強度之差的絕對值可設於上述較佳範圍內。   [0038] 本說明書中所稱之基材之熱收縮率(%)係藉由依據JIS-C-2151 (2006)之方法測定時之熱收縮率。具體而言,測定基材之MD方向長度(試驗前之基材MD方向之長度),將該基材於熱風循環式恆溫槽內,以無荷重狀態,於190℃、20分鐘懸垂。隨後,將該基材冷卻至室溫後,測定冷卻後之基材之MD方向長度(試驗後之基材MD方向之長度)。熱收縮率(%)係將試驗前之基材MD方向之長度設為L0 ,將試驗後之基材MD方向之長度設為L時,藉由100×((L0 -L)/L)算出之值。   [0039] 且,熱收縮率(%)為上述較佳範圍之基材1亦可與以下之第2手段~第4手段組合。   [0040] (第2手段)   第2手段係適當調整構成熱轉印薄片之構成構件、或轉印層10之厚度例如基材1之厚度、轉印層10之厚度、設於基材1另一面上之任意層之厚度,例如背面層之厚度,而將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下的手段。具體而言,將基材1、構成轉印層10之層及任意層中之一層或複數層之厚度增厚的手段。依據第2手段,可抑制自基材1之另一面側施加之能量傳遞至轉印層10之能量傳遞效率,藉此,可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。又,代替調整基材1或設於基材1另一面上之任意層厚度之方法,而藉由使用能量傳遞效率低的材料作為基材1或設於基材1另一面上之任意層的材料,亦可抑制施加於基材1之另一面側之能量傳遞至轉印層10的能量傳遞效率。   [0041] (第3手段)   第3手段係於基材1與轉印層10之間設置提高轉印層10的轉印性之任意層,將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下之手段。作為任意層,可舉例為例如脫模層等。又,僅藉由第3手段,難以將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下,基於拉伸強度調整之觀點,第3手段係作為藉由上述第1手段、或第2手段調整拉伸強度之輔助手段,或較好與後述之第4手段組合。又,與脫模層之材料同時藉由增厚脫模層厚度等之對策亦可實現拉伸強度之調整。又,脫模層係不構成轉印層10之層,係於轉印層10轉印時,殘留於熱轉印薄片側之層。   [0042] (第4手段)   第4手段係考慮轉印層10本身之耐熱性,將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下之手段。作為提高轉印層之耐熱性之手段,可舉例為例如含有藉由硬化劑硬化之硬化樹脂的方法等。又,僅藉由第4手段,難以將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下,基於拉伸強度調整之觀點,第4手段係作為藉由上述第1手段、或第2手段調整拉伸強度之輔助手段,或較好與上述第3手段組合。   [0043] 且,替代提高轉印層10本身之耐熱性,或亦與此同時,可提高設於基材1之另一面上之任意層的耐熱性。   [0044] 又,適當組合上述第1手段~第4手段,亦可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。且,組合其以外之方法,亦可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下。   [0045] 以下,針對一實施形態之熱轉印薄片100之構成舉一例加以說明,但一實施形態之熱轉印薄片100係以使用上述說明之手段等,將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下為特徵者,關於其以外之條件,並未限定於以下之記載。   [0046] (基材)   基材1係一實施形態之熱轉印薄片100之必需構成,用以保持設於該基材1之一面上之轉印層10而設置。關於基材1之材料並未特別限定,但期望具有可耐受將轉印層10轉印於被轉印體上時施加之熱、於處理上無妨礙之機械特性。作為此等基材1可舉例為聚對苯二甲酸乙二酯等之聚酯、聚丙烯酸酯、聚碳酸酯、聚胺基甲酸酯、聚醯亞胺、聚醚醯亞胺、纖維素衍生物、聚乙烯、乙烯-乙酸乙烯酯共聚物、聚丙烯、聚苯乙烯、丙烯酸、聚氯乙烯、聚偏氯乙烯、聚乙烯醇、聚乙烯丁縮醛、尼龍、聚醚醚酮、聚碸、聚醚碸、四氟乙烯-全氟烷基乙烯醚共聚物、聚乙烯硫醚、四氟乙烯-乙烯共聚物、四氟乙烯-六氟丙烯共聚物、聚氯三氟乙烯、聚偏氟乙烯等之各種塑膠薄膜或薄片。   [0047] 基材1之厚度並未特別限定,較好為2.5μm以上10μm以下之範圍。   [0048] 又,為了調整基材1與轉印層10之密著性,亦可對基材1表面實施各種表面處理,例如電暈放電處理、火焰處理、臭氧處理、紫外線處理、放射線處理、粗面化處理、化學藥品處理、電漿處理、低溫電漿處理、底塗處理、接枝化處理等。   [0049] (轉印層)   如圖1~圖3所示,於基材1之一面上設置可自該基材1剝離之轉印層10。轉印層10係一實施形態之熱轉印薄片100之必需構成。   [0050] 一實施形態之熱轉印薄片100中所稱之轉印層10意指熱轉印時自基材1剝離而轉印至被轉印體之層。轉印層10若最終滿足上述「特定測定條件」之熱轉印薄片之拉伸強度為0.29N/cm以下之條件,則關於其層構成或轉印層所含有之成分並未特別限定。如圖1、圖2所示,轉印層10可呈現層合2層以上之層而成之層合構成,亦可如圖3所示,轉印層10可呈現單層構成。以下,針對構成一實施形態之熱轉印薄片100之轉印層10舉一例加以說明。   [0051] (實施形態A之轉印層)   一實施形態之熱轉印薄片之實施形態A之轉印層10(以下稱為實施形態A之轉印層)係如圖1所示,呈現自基材1側起依序層合接受層2、接著層5而成之層合構成。又,替代圖1所示之形態,亦可於接受層2與接著層5之間設有保護層(未圖示)。又,替代圖1所示之形態,亦可設為僅由接受層2而成之單層構成的轉印層10,且對該接受層2本身賦予接著性(未圖示)。具備實施形態A之轉印層10的熱轉印薄片100係用以形成熱轉印呈像薄片之熱轉印薄片。作為接著層5,可適當選擇使用熱轉印薄片領域中以往習知之接著層。又,藉由第1手段以外,將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下時,作為接受層2可適當選擇使用以往習知之材料。   [0052] 實施形態A之熱轉印薄片係用以藉由轉印轉印層10,而獲得接受層2位於最表面之熱轉印呈像薄片的熱轉印薄片。於使用實施形態A之熱轉印薄片所得之熱轉印呈像薄片的接受層2,藉由移行染料層之染料而可形成熱轉印圖像。又,移行染料層之染料而於接受層形成熱轉印圖像時之染料對於接受層之染著性與對向於染料層之接受層2表面之平滑性有關連性,接受層之表面平滑性越高,染料之染著性越良好。如上述說明,依據轉印層10之剝離性良好之一實施形態之熱轉印薄片,轉印層10自與熱轉印薄片之轉印層10接觸之構成構件剝離時,可抑制與該構成構件接觸之側的轉印層10的表面產生面粗糙。因此,實施形態A之熱轉印薄片中,可以提高接受層2之平滑性之狀態,於將轉印層轉印於被轉印體上。藉此,依據實施形態A之熱轉印薄片,使用該實施形態A之熱轉印薄片,可獲得染料之染著性良好之熱轉印呈像薄片。   [0053] (實施形態B之轉印層)   一實施形態之熱轉印薄片之實施形態B之轉印層10(以下稱為實施形態B之轉印層)係如圖2所示,呈現自基材1側起依序層合剝離層4、接受層2而成之層合構成。具備實施形態B之轉印層10的熱轉印薄片100係作為於該熱轉印薄片之接受層形成熱轉印圖像,將包含形成有熱轉印圖像之接受層的轉印層轉印於被轉印體上,用以獲得列印物之中間轉印媒體發揮作用。又,替代圖2所示之形態,亦可為於基材1之一面上,設置自基材1側起依序層合剝離層(有時亦稱為保護層)、接著層而成之層合構成,或於基材1之一面上設置僅由剝離層所成之單層構成的轉印層的熱轉印薄片。該形態之熱轉印薄片係於被轉印體上轉印轉印層,而發揮作為提高被轉印體之耐久性之保護層轉印薄片之功能。   [0054] 實施形態A、及實施形態B之轉印層10中,如上述第1手段,考慮構成轉印層10,位於轉印界面之層中含有之成分等,亦可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下,且,藉由上述第2手段,或適當組合第1手段~第4手段,亦可將拉伸強度調整為0.29N/cm以下。   [0055] (實施形態C之轉印層)   一實施形態之熱轉印薄片之實施形態A之轉印層10(以下稱為實施形態A之轉印層)係如圖3所示,呈現由熱熔融墨水層7構成之單層構成。具備實施形態C之轉印層10的熱轉印薄片100係發揮於被轉印體上每轉印一層熱熔融墨水層7即於被轉印體上形成熱轉印圖像之功能。   [0056] 實施形態C之轉印層10中,考慮構成該轉印層10之熱熔融墨水層7中含有之樹脂材料、或脫模劑等之成分或含量等,亦可將上述「特定測定條件」之拉伸強度調整為0.29N/cm以下,且藉由適當選擇上述第2手段~上述第4手段,亦可將轉印層10之拉伸強度調整為0.29N/cm以下。   [0057] 且,於基材1之同一面上,亦可與轉印層10依面順序設置其他層。例如如圖4所示,亦可為於基材1之同一面上,與轉印層10依面順序設置含不可見光吸收材料之層8之構成。圖示形態之熱轉印薄片之轉印層10雖呈現自基材1側起依序層合接受層2、接著層5而成之層合構成,但亦可為其以外之形態的轉印層10。依據圖4所示之實施形態A之熱轉印薄片,可於被轉印體之一面上,形成於可見光下無法視認或不易視認,而在紅外光下或紫外光下可辨識之含有不可見光吸收材料之圖像50A(參考圖5(a))。且,於含有不可見光吸收材料之圖像50A上(參考圖5(b))或於被轉印體之另一面上(參考圖5(c)),可轉印用以成為熱轉印呈像薄片之轉印層10。又,圖4所示形態之熱轉印薄片之轉印層10轉印於被轉印體上,形成熱轉印呈像薄片後,於該熱轉印呈像薄片之接受層2上,或於轉印有接受層2之面相反側的面上,亦可形成含有不可見光吸收材料之圖像(參考圖6(a)、(b))。又,圖5、圖6係顯示實施形態A之熱轉印薄片的使用形態之一例的概略剖面圖。   [0058] (含不可見光吸收材料之層)   含不可見光吸收材料之層8含有不可見光吸收材料。本說明書中所稱之不可見光吸收材料意指不吸收可見光或幾乎不吸收,而藉由紅外光或紫外光等激發之材料。   [0059] 作為不可見光吸收材料可舉例為例如紅外光吸收材料或紫外光吸收材料。本說明書中所稱之「紅外光」意指極大吸收波長(λmax)區域為750nm以上2000nm以下之波長區域,所謂「紫外光」意指極大吸收波長(λmax)區域為280nm以上400nm以下之區域。   [0060] 作為紅外光吸收材料可舉例為例如二亞銨系化合物、鋁系化合物、酞菁系化合物、二硫醇系有機金屬錯合物、菁系化合物、偶氮系化合物、多次甲基系化合物、醌系化合物、二苯基甲烷系化合物、三苯基甲烷系化合物、噁唑系化合物或碳黑等。含不可見光吸收材料之層8可單獨含有該等紅外光吸收材料之1種,亦可含有2種以上。   [0061] 作為紫外光吸收材料可舉例為苯并三唑系化合物、三嗪系化合物、二苯甲酮系化合物、苯甲酸酯系化合物等之有機系紫外光吸收材料,或氧化鈦、氧化鋅、氧化鈰、氧化鐵、硫酸鋇等之無機系紫外光吸收材料等。含不可見光吸收材料之層8可單獨含有該等紫外光吸收材料之1種,亦可含有2種以上。   [0062] 且,含不可見光吸收材料之層8亦可含有紅外光吸收材料與紫外光吸收材料兩者。   [0063] 且,含不可見光吸收材料之層8亦可與上述不可見光吸收材料一起含有黏合劑樹脂。作為黏合劑樹脂可舉例為例如聚酯系樹脂、聚乙烯系樹脂、氟系樹脂、聚苯乙烯系樹脂、聚丙烯酸系樹脂、纖維素系樹脂、聚碳酸酯系樹脂、聚醯胺系樹脂、聚丙烯樹脂等之聚烯烴系樹脂、聚乙烯醇系樹脂、聚醯亞胺系樹脂、酚系樹脂及聚胺基甲酸酯系樹脂等之習知樹脂。   [0064] 又,含不可見光吸收材料之層8亦可與上述不可見光吸收材料一起含有顏料或有機染料等。作為顏料可舉例為例如黃色、品紅、藍色等之有色顏料,或中空粒子等、氧化矽、氧化鈦、二氧化鈦、氧化鋅、氧化鈰、雲母鈦、白雲母、白碳、碳酸鈣、硫酸鋇、氧化鋁白、滑石等。又,亦可使用於由無機顏料所成之芯周圍被由有機顏料所成之殼被覆之芯.殼顏料等。作為有機染料,可舉例為黃色染料、品宏染料、藍色染料等。   [0065] 作為含不可見光吸收材料之層8之厚度較好為0.3μm以上5μm以下之範圍。   [0066] 又,上述含不可見光吸收材料之層8中,替代含有顏料或有機染料,含不可見光吸收材料之層8亦可設為含有不可見光吸收材料之層與含有顏料之層的層合構成(未圖示)。   [0067] 含不可見光吸收材料之層8設為層合構成時,含有不可見光吸收材料之層可位於距離基材1最近,亦可位於距離基材1最遠,含不可見光吸收材料之層8亦可設為含有不可見光吸收材料之層、含有顏料之層、及1層或2層以上之任意層的層合構成,含有不可見光吸收材料之層可位於任何層間。關於含有顏料之層亦同樣。   [0068] 作為含有顏料之層,含有上述例示之有機顏料、無機顏料之至少1種及根據需要之黏合劑等之添加材。作為黏合劑舉例為例如乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸酯共聚物、聚乙烯、聚苯乙烯、聚丙烯、聚丁烯、石油樹脂、氯乙烯樹脂、氯乙烯-乙酸乙烯酯共聚物、聚乙烯醇、偏氯乙烯樹脂、丙烯酸樹脂、甲基丙烯酸樹脂、聚醯胺、聚碳酸酯、氟樹脂、聚乙烯甲縮醛、聚乙烯丁縮醛、乙醯基纖維素、硝基纖維素、聚乙酸乙烯酯、聚異丁烯、乙基纖維素或聚乙縮醛等。又,作為黏合劑,有微晶蠟、巴西棕櫚蠟、石蠟等。再者,亦可使用費托蠟(Fischer-Tropsch wax)、各種低分子量聚乙烯、木蠟、蜂蠟、鯨蠟、蟲白蠟、羊毛蠟、蟲膠蠟、小燭樹蠟、凡士林、聚酯蠟、一部分改質蠟、脂肪酸酯、脂肪酸醯胺等之各種蠟。   [0069] 含有顏料之層厚度並未特別限定,但較好為0.1μm以上5μm以下之範圍,更好為0.5μm以上1.5μm以下之範圍。   [0070] (任意層)   又,一實施形態之熱轉印薄片100亦可具備不構成轉印層之任意層。作為任意層可舉例為設於基材1與轉印層10之間之用以提高轉印層10的轉印性之脫模層(未圖示),或設於基材1之另一面上之用以提高耐熱性或加熱頭等之加熱構件之層構成之背面層等。該等任意層可作為藉由上述第1手段或第2手段而調整拉伸強度時之複數手段而設。   [0071] (被轉印體)   關於一實施形態之熱轉印薄片100之轉印層10所轉印之被轉印體並未特別限定,可使用普通紙、上等紙、描圖紙、塑膠薄膜、以氯乙烯、氯乙烯-乙酸乙烯酯共聚物、聚碳酸酯為主體而構成之塑膠卡、熱轉印呈像薄片、於任意對象物上轉印中間轉印媒體之轉印層而成之列印物等。 [實施例]   [0072] 其次舉例實施例及比較例更具體說明本發明。以下,只要未特別限定,則份或%為質量基準。   [0073] (實施例1)   準備厚度5μm之聚對苯二甲酸乙二酯薄膜作為基材,於該基材之一面上,以使乾燥時厚度成為1μm之方式塗佈下述組成之接受層用塗佈液1並乾燥而形成接受層。其次,於該接受層上,以使乾燥時厚度成為1μm之方式塗佈下述組成之接著層用塗佈液並乾燥形成接著層。又,於基材之另一面上,以使乾燥時厚度成為1μm之方式塗佈下述組成之背面層用塗佈液1並乾燥而形成背面層,而獲得於基材之一面上設置自該基材側起依序層合接受層、接著層而成之轉印層,及於基材之另一面上設置背面層之實施例1之熱轉印薄片。又,厚度5μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為2.95%。   [0074] <接受層用塗佈液1> .氯乙烯-乙酸乙烯酯共聚物 16.7份   (SOLBIN(註冊商標) CNL 日信化學工業(股)) .纖維素乙酸酯丁酸酯 1份   (CAB-381-0.5 EASTMAN CHEMICAL(股)) .有機改質聚矽氧 1.8份   (X-22-3000T 信越化學工業(股)) .有機改質聚矽氧 0.5份   (KF-352A 信越化學工業(股)) .甲基乙基酮 40份 .甲苯 40份   [0075] <接著層用塗佈液> .丙烯酸系樹脂 8份   (DIANAL(註冊商標) BR-87,三菱縲縈(股)) .氯乙烯-乙酸乙烯酯共聚物 2份   (SOLBIN(註冊商標) CNL 日信化學工業(股)) .甲基乙基酮 30份 .甲苯 30份   [0076] <背面層用塗佈液1> .聚乙烯丁縮醛樹脂 1.8份   (SLEC(註冊商標) BX-1 積水化學工業(股)) .聚異氰酸酯硬化劑 5.5份   (BURNOCK(註冊商標) D750 DIC(股)) .磷酸酯 1.6份   (PRISURF(註冊商標) A208N 第一工業製藥(股)) .滑石 0.35份   (MICRO ACE(註冊商標)P-3 日本滑石(股)) .聚乙烯蠟 0.3份 .甲基乙基酮 18.5份 .甲苯 18.5份   [0077] (實施例2)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度4.5μm之聚對苯二甲酸乙二酯薄膜以外,全部與實施例1同樣,獲得實施例2之熱轉印薄片。又,厚度4.5μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為5.5%。   [0078] (實施例3)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度4.5μm之聚對苯二甲酸乙二酯薄膜,接受層用塗佈液1變更為下述組成之接受層用塗佈液2形成接受層以外,全部與實施例1同樣,獲得實施例3之熱轉印薄片。又,厚度4.5μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為5.5%。   [0079] <接受層用塗佈液2> .氯乙烯-乙酸乙烯酯共聚物 15.7份   (SOLBIN(註冊商標) CNL 日信化學工業(股)) .纖維素乙酸酯丁酸酯 2份   (CAB-381-0.5 EASTMAN CHEMICAL(股)) .有機改質聚矽氧 1.8份   (X-22-3000T 信越化學工業(股)) .有機改質聚矽氧 0.5份   (KF-352A 信越化學工業(股)) .甲基乙基酮 40份 .甲苯 40份   [0080] (實施例4)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度4.3μm之聚對苯二甲酸乙二酯薄膜以外,全部與實施例1同樣,獲得實施例4之熱轉印薄片。又,厚度4.3μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為3.15%。   [0081] (實施例5)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度5.7μm之聚對苯二甲酸乙二酯薄膜,接受層用塗佈液1變更為上述組成之接受層用塗佈液2形成接受層以外,全部與實施例1同樣,獲得實施例5之熱轉印薄片。又,厚度5.7μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為2.8%。   [0082] (比較例1)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度4.5μm之聚對苯二甲酸乙二酯薄膜,接受層用塗佈液1變更為下述組成之接受層用塗佈液A形成接受層以外,全部與實施例1同樣,獲得比較例1之熱轉印薄片。又,厚度4.5μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為5.5%。   [0083] <接受層用塗佈液A> .氯乙烯-乙酸乙烯酯共聚物 19份   (SOLBIN(註冊商標) CNL 日信化學工業(股)) .氯乙烯-乙酸乙烯酯共聚物 1份   (SOLBIN(註冊商標) C 日信化學工業(股)) .甲基乙基酮 40份 .甲苯 40份   [0084] (比較例2)   除了將厚度5μm之聚對苯二甲酸乙二酯薄膜變更為厚度4.5μm之聚對苯二甲酸乙二酯薄膜,接受層用塗佈液1變更為上述組成之接受層用塗佈液A形成接受層,背面層用塗佈液1變更為下述組成之背面層用塗佈液A形成背面層以外,全部與實施例1同樣,獲得比較例2之熱轉印薄片。又,厚度4.5μm之聚對苯二甲酸乙二酯薄膜之依據JIS-C-2151(2006)之方法測定時之熱收縮率為5.5%。   [0085] <背面層用塗佈液A> .聚乙烯丁縮醛樹脂 6份   (#3000-4 DENKA (股)) .聚異氰酸酯硬化劑 8份   (BURNOCK(註冊商標) D750-45 DIC(股)) .硬脂酸磷酸鋅 3份   (LBT-1830純化 堺化學工業(股)) .硬脂酸鋅 3份   (SZ-PF 堺化學工業(股)) .滑石 1.5份   (MICRO ACE(註冊商標)P-3 日本滑石(股)) .聚乙烯蠟 3份   (POLYWAX 3000 東洋ADL(股)) .甲基乙基酮 62.92份 .甲苯 12.58份   [0086] (被轉印體之作成)   使用厚度35μm之多孔質聚烯烴薄膜(SP-U 三井化學TOHCELLO (股))上,以使乾燥時之厚度成為1.5μm之方式塗佈下述組成之底塗層用塗佈液並乾燥,形成底塗層,其次,於底塗層上,藉由棒塗佈器,以使乾燥時之厚度成為4μm之方式塗佈下述組成之接受層用塗佈液(i)並乾燥形成接受層,獲得於多孔質聚烯烴薄膜上依序層合底塗層、接受層而成之層合體。其次,於厚度400μm(單位面積重量310g/m2 )之芯材紙(OKL卡,王子製紙(股))之一面上,貼合上述獲得之層合體。又,於上述芯材紙之另一面上亦同樣貼合於多孔質聚烯烴薄膜上依序層合底塗層、接受層而成之層合體。又,芯材紙與層合體之貼合係藉由下述組成之接著層用塗佈液(i)(厚度4μm)進行。藉此,獲得於芯材紙之兩面上自該芯材紙側起依序設置有多孔質聚烯烴薄膜、底塗層、接受層之被轉印體。   [0087] (底塗層用塗佈液) .聚酯樹脂 4.2份   (POLYESTAR(註冊商標) WR-905 日本合成化學工業(股)) .氧化鈦 8.4份   (TCA-888 堺化學工業(股)) .螢光增白劑 0.07份   (UVITEX(註冊商標) BAC,BASF JAPAN公司) .異丙醇 7.2份 .水 21份   [0088] (接受層用塗佈液(i)) .氯乙烯-乙酸乙烯酯共聚物 10份   (SOLBIN(註冊商標) C 日信化學工業(股)) .矽氧油 1份   (X-22-3000T 信越化學工業(股)) .甲苯 20份 .乙酸乙酯 20份   [0089] (接著層用塗佈液(i)) .多元醇樹脂 30份   (TAKELAC(註冊商標) A-969V 三井化學(股)) .異氰酸酯 10份   (TAKENATE(註冊商標) A-5 三井化學(股)) .乙酸乙酯 60份   [0090] (熱時拉伸強度之計算(熱時剝離力之計算))   將上述作成之各實施例及比較例之熱轉印薄片與上述作成之被轉印體組合,使用下述熱時剝離類型之測試列印機1,於被轉印體上邊轉印熱轉印薄片之轉印層,邊自基材剝離該轉印之轉印層,而獲得於被轉印體上設有轉印層之各實施例及比較例之列印物。獲得該列印物時,將轉印於被轉印體上之轉印層以50°之剝離角度自基材剝離之時點之熱轉印薄片之應力,藉由於列印機內於熱轉印薄片之捲取輥與加熱機構(加熱頭)之間設置之張力計(ASK-1000型,大倉工業(股))予以測定。其次,將張力計測定之應力除以熱轉印薄片之加熱寬度(能量之施加寬度)而算出拉伸強度之值。又,針對上述測試列印機1中,以施加能量自0.177mJ/dot變更為0.169mJ/dot之方式變更測試列印機1的條件(施加電壓自18.7V變更為18.3V)時之拉伸強度之值亦同樣進行計算。表1中顯示拉伸強度之計算結果。又,測試列印機1之條件中,拉伸強度為0.29N/cm以下之熱轉印薄片設為實施例的熱轉印薄片,大於0.29N/cm之熱轉印薄片設為比較例的熱轉印薄片。   [0091] (測試列印機1(熱時剝離類型)) .發熱體平均電阻值:5045(Ω) .主掃描方向印字密度:300(dpi) .副掃描方向印字密度:300(dpi) .施加電壓:18.7(V) .線週期:3(msec.) .脈衝佔空比:85(%) .列印開始溫度:29.0~36.0(℃) .自發熱點至剝離板之距離:4.5(mm) .列印壓力:3.5~4.0(kgf)(34.3~39.2(N)) .評價圖像(能量灰階):255/255灰階圖像 .由上式(1)計算之施加能量:0.177(mJ/dot) .由上式(3)計算之搬送速度:28.2(mm/sec.)   [0092] (熱熔著評價)   各實施例及比較例之熱轉印薄片與上述作成之被轉印體之組合中,基於下述評價基準,使用上述熱時剝離類型之測試列印機1,以施加能量0.177(mJ/dot)之條件進行將轉印層轉印於被轉印體上時之熱熔著評價。評價結果一併示於表1。   [0093] 「評價基準」   A:未發生熱熔著及剝離音,可良好地自基材剝離轉印層。   B:未發生熱熔著,可良好地自基材剝離轉印層,但發生剝離音。   NG:轉印層之一部分或全部發生熱熔著,無法自基材剝離轉印層之一部分或全部。   [0094] (具有染料層之熱轉印薄片之作成)   使用厚度5μm之聚對苯二甲酸乙二酯薄膜作為基材,以使乾燥時之厚度成為1μm之方式塗佈上述組成之背面層用塗佈液1並乾燥,形成背面層。其次,於基材之另一面上,以使乾燥時之厚度成為0.15μm之方式塗佈下述組成之染料底塗層用塗佈液並乾燥,形成染料底塗層。於該染料底塗層上,以使乾燥時之厚度成為0.7μm之方式依面順序塗佈下述組成之黃色、品紅、藍色染料層用塗佈液並乾燥,形成黃色染料層、品紅染料層、藍色染料層,獲得具有染料層之熱轉印薄片。   [0095] <染料底塗層用塗佈液> .膠體氧化鋁(固形分10.5%) 3.5份   (氧化鋁溶膠200 日產化學工業(股)) .乙酸乙烯酯-乙烯基吡咯啶酮共聚物 1.5份   (PVP/VA E-335,ISP JAPAN公司) .水 47.5份 .異丙醇 47.5份   [0096] <黃色染料層用塗佈液> .溶劑黃93 2.5份 .分散黃201 2.5份 .聚乙烯乙醯乙縮醛樹脂 4份   (SLEC(註冊商標) KS-5 積水化學工業(股)) .有機改質矽氧油 0.04份 .甲苯 50份 .甲基乙基酮 50份   [0097] <品紅染料層用塗佈液> .分散紅60 3份 .分散紫26 3份 .聚乙烯乙醯乙縮醛樹脂 5份   (SLEC(註冊商標) KS-5積水化學工業(股)) .有機改質矽氧油 0.05份 .甲苯 50份 .甲基乙基酮 50份   [0098] <藍色染料層用塗佈液> .溶劑藍63 3份 .分散藍354 4份 .聚乙烯乙醯乙縮醛樹脂 5份   (SLEC(註冊商標) KS-5 積水化學工業(股)) .有機改質矽氧油 0.05份 .甲苯 50份 .甲基乙基酮 50份   [0099] (染料染著性評價)   於上述熱熔著評價所得之各實施例及比較例之列印物之轉印層上(構成各實施例及比較例之熱轉印薄片的轉印層之接受層上),使用上述作成之具有染料層之熱轉印薄片之黃色染料層、品紅染料層、藍色染料層,形成黑色圖像(0/255灰階)。目視確認形成之黑色圖像,基於以下評價基準,進行染料染著性評價。評價結果一併示於表1。又,圖像未發生濃淡不均意指剝離轉印層時之剝離性良好,接受層之表面平滑性高(接受層正常轉印)。   [0100] 「評價基準」   A:黑色圖像未發生濃淡不均。   B:黑色圖像發生濃淡不均。   [0101]

Figure 02_image001
條件1:施加能量:0.169(mJ/dot),搬送速度28.2(mm/sec.) 條件2:施加能量:0.177(mJ/dot),搬送速度28.2(mm/sec.) (*1)條件1中之拉伸強度與條件2之拉伸強度之差的絕對值[0014] <<Thermal transfer sheet>> Hereinafter, the thermal transfer sheet of one embodiment of the present invention (hereinafter sometimes referred to as the thermal transfer sheet of one embodiment) will be described in detail. 1 to 3 are schematic cross-sectional views showing an example of a thermal transfer sheet according to an embodiment. As shown in FIGS. 1 to 3, a thermal transfer sheet 100 according to an embodiment has a base material 1 and a transfer layer 10 that can be peeled from the base material 1. [0015] As one of the problems that may occur when the transfer layer of the thermal transfer sheet is transferred to the transferred body, for example, the thermal fusion between the transferred body and the thermal transfer sheet. In addition, the heat fusion of the transfer body and the thermal transfer sheet referred to in this specification means that the transfer body and the thermal transfer sheet are overlapped and applied from the side of the thermal transfer sheet by a heating mechanism such as a heater. Energy, transfer the transfer layer of the thermal transfer sheet to the transfer body, only when the transfer layer transferred to the transfer body is peeled from the thermal transfer sheet, it should remain in the thermal transfer A phenomenon in which the constituent members of the thermal transfer sheet on the sheet side are integrated with the transfer layer transferred on the transfer body, and only the transfer layer transferred on the transfer body cannot be peeled from the thermal transfer sheet. For example, when used in a thermal transfer sheet with a transfer layer directly provided on a substrate, the substrate and the transfer layer are integrated to the extent that they cannot be peeled from the substrate and transferred to the transfer layer on the body to be transferred. phenomenon. Or, even if only the transfer layer transferred on the transfer body can be peeled from the thermal transfer sheet, the constituent members of the thermal transfer sheet and the transfer layer transferred to the transfer body are integrated to the transfer When the layer is peeled off, it produces a phenomenon of the degree of abnormal noise. In addition, when the to-be-transferred body and the thermal transfer sheet are thermally fused, it becomes a cause of abnormal conveyance in the printer or poor transfer. In addition, in order to correspond to high-speed printability, when the transfer layer is transferred to the body, when the energy applied to the thermal transfer sheet is high, or when a thermal peel-off printer is used, etc. , There is a tendency for the body to be transferred and the heat transfer sheet to fuse easily. [0016] Various attempts have been made to suppress the thermal fusion of the transferable body and the thermal transfer sheet that may occur when the transfer layer of the thermal transfer sheet is transferred to the transferable body, such as improving the transfer layer Attempts to heat resistance, or to improve the peelability of the transfer layer from the thermal transfer sheet, etc. However, the current status quo is that by taking these countermeasures, even if the thermal fusion between the transferred body and the thermal transfer sheet under specific transfer conditions can be suppressed, if the transfer layer is increased, it is applied to the thermal transfer In the case of the thermal energy of the sheet, the thermal fusion of the transferred body and the thermal transfer sheet cannot be sufficiently suppressed. [0017] In addition, the thermal fusion of the transferred body and the thermal transfer sheet, and the transfer layer 10 transferred on the transferred body are directly connected to the transfer layer from the constituent members constituting the thermal transfer sheet. The peeling force when the contacting constituent member is peeled, for example, when the transfer layer 10 is directly provided on the substrate 1, is closely related to the peeling force when peeling from the substrate 1. It is estimated that by reducing the peeling force, Suppresses the thermal fusion between the transferred body and the thermal transfer sheet. Therefore, when the peeling force of the transfer layer 10 transferred on the transferred body is peeled from the constituent member in contact with the transfer layer, it is difficult to accurately measure in the printer, and it is impossible to detect the transfer body and the heat. The transfer sheet has a problem with the threshold value of the peeling force of thermal fusion. After reviewing this point, it was found that in the printer, the peeling force of the transfer layer 10 transferred on the body to be transferred from the constituent member in contact with the transfer layer is different from the peeling force applied to the thermal transfer during the peeling. The tensile strength of the printed sheet is related, and the tensile strength applied to the thermal transfer sheet during peeling is also closely related to the thermal fusion of the transferred body and the thermal transfer sheet. The following description focuses on the case where the component that is in direct contact with the transfer layer among the components constituting the thermal transfer sheet is used as the base material. However, the thermal transfer sheet of one embodiment is not limited to the direct contact between the base material and the transfer layer. In the case of the form, any layer can be provided between the base material and the transfer layer. In this case, the arbitrary layer becomes a constituent member that is in direct contact with the transfer layer. Hereinafter, unless otherwise specified, the transfer layer 10 transferred on the body to be transferred is peeled off from the constituent members of the thermal transfer sheet 100 that is in contact with the transfer layer, abbreviated as the peeling transfer from the thermal transfer sheet 100 Layer 10. [0018] Therefore, the thermal transfer sheet 100 of one embodiment is characterized by overlapping the thermal transfer sheet 100 with the to-be-transferred body, as shown in FIG. The mechanism 202, the thermal transfer sheet winding mechanism 203, the measuring mechanism 204 which is located between the heating mechanism 202 and the thermal transfer sheet winding mechanism 203 and measures the tensile strength of the thermal transfer sheet conveyed along the conveying path, is located in the heating mechanism The printer 200 of the peeling mechanism 205 between 202 and the measuring mechanism 204 rotates on the transferred body 300 under the conditions of an applied energy of 0.177 mJ/dot and a transfer speed of the thermal transfer sheet of 28.2 mm/sec. When the transfer layer 10 is transferred from the thermal transfer sheet 100 at a peeling angle of 50° while the transfer layer 10 transferred on the body 300 is peeled off, the tensile strength measured by the measuring mechanism 204 is Below 0.29N/cm. [0019] The applied energy (mJ/dot) in this specification is the applied energy calculated by the following formula (1), and the applied power [W] in the formula (1) can be calculated by the following formula (2). Applied energy (mJ/dot)=W×LS×PD×energy grayscale value...(1) ([W] in formula (1) means applied power, [LS] means line period (msec./line) , [PD] means pulse duty ratio) applied power (W/dot)=V 2 /R...(2) ([V] in formula (2) means applied voltage, [R] means the heating mechanism resistance). [0020] In addition, the transport speed (mm/sec.) of the thermal transfer sheet referred to in this specification is the transport speed calculated by the following formula (3). Conveying speed (mm/sec.)=(25.4/(printing density in sub-scanning direction (dot/inch)×line period (msec./line)))×1000...(3) (25.4 series in formula (3) The value used to convert inches to mm). [0021] In addition, in this specification, the tensile strength (N/cm) measured by the measuring mechanism is the stress (N) measured by the measuring mechanism divided by the heating width (cm) of the thermal transfer sheet under the above-mentioned conditions value. [0022] Hereinafter, the conditions for peeling off the transfer layer 10 that has been transferred onto the body 300 from the base material 1 are specifically used with a thermal transfer sheet supply mechanism 201, a heating mechanism 202, and a thermal transfer Printed sheet winding mechanism 203, measuring mechanism 204 located between the heating mechanism 202 and the thermal transfer sheet winding mechanism 203 and measuring the tensile strength of the thermal transfer sheet 100 conveyed along the conveying path, located between the heating mechanism 202 and the measuring mechanism The printer 200 with the peeling mechanism between 204 and 205, under the conditions of applying energy 0.177mJ/dot and the conveying speed of the thermal transfer sheet 28.2mm/sec., while continuously transferring the transfer on the transferred body 300 For the layer 10, the conditions under which the transfer layer 10 transferred on the body 300 is peeled from the thermal transfer sheet 100 at a peeling angle of 50° are collectively referred to as "specific measurement conditions." [0023] According to the thermal transfer sheet having one of the above-mentioned features, only by satisfying the condition that the tensile strength of the thermal transfer sheet under the "specific measurement conditions" is 0.29N/cm or less, it will not be subjected to transfer. The effect of various conditions when printing the transfer layer 10 can make the releasability of the transfer layer 10 good. Thereby, it is possible to suppress the thermal fusion between the transferee and the thermal transfer sheet that may occur when the transfer layer 10 of the thermal transfer sheet 100 is transferred to the transferee 300. Specifically, when it is desired to increase the energy applied to the thermal transfer sheet in response to high-speed printability, in other words, even if the application of power is increased, the thermal fusion of the transferred body and the thermal transfer sheet can be suppressed. [0024] More specifically, when it is desired to increase the energy applied to the thermal transfer sheet in response to high-speed printing, although the adhesion between the transferred body and the transfer layer becomes higher, it is easy to be transferred The thermal transfer sheet has a tendency to heat fusion with the thermal transfer sheet. However, the thermal transfer sheet of one of the embodiments based on the tensile strength of the thermal transfer sheet under "specified measurement conditions" of 0.29 N/cm or less can be easily self-contained. The thermal transfer sheet 100 peels off the transfer layer 10, which can suppress the thermal fusion between the transferred body and the thermal transfer sheet. [0025] Furthermore, according to the thermal transfer sheet 100 of one embodiment that can be a good releasability of the transfer layer 10, when the transfer layer 10 is peeled off from the constituent member in contact with the transfer layer 10 of the thermal transfer sheet , The surface roughness of the transfer layer 10 on the side in contact with the constituent member can be suppressed. In other words, it is possible to suppress surface roughness on the surface of the transfer layer 10 located on the transfer interface side. By this, for example, when the layer located at the transfer interface of the layer constituting the transfer layer is used as the receiving layer, the dye dyeability of the receiving layer can be made good, and when the layer located at the transfer interface is used as the protective layer, the transfer The gloss of the printing layer 10 is good. [0026] If the printer 200 used to transfer the transfer layer 10 of the thermal transfer sheet 100 on the transfer body 300 can achieve the above-mentioned "specific measurement conditions", it can also be used to make the transfer layer 10 Melting or softening, before the transfer layer is solidified, the transferred transfer layer 10 is peeled off from the substrate 1 of the thermal transfer sheet 100. A thermal peeling printer can also be used on the transfer layer 10. After curing, a cold-time peel-off printer in which the transferred transfer layer 10 is peeled from the base material 1 of the thermal transfer sheet 100. [0027] In addition, the tensile strength of the thermal transfer sheet of an embodiment is measured when the applied energy is changed from 0.177 mJ/dot to 0.169 mJ/dot in the above-mentioned "specific measurement conditions" and the above-mentioned "specific measurement conditions". The absolute value of the difference in tensile strength is preferably 0.25 N/cm or less, more preferably 0.1 N/cm or less, and still more preferably 0.05 N/cm or less. According to the thermal transfer sheet of this form, the releasability of the transfer layer 10 can be further improved in a wide range of energy. It is particularly preferable that the tensile strength measured by the above-mentioned "specific measurement conditions" is 0.2 N/cm or less, and the absolute value of the difference in the above-mentioned tensile strength is 0.1 N/cm or less. [0028] (Printer) Next, for the above-mentioned "specific measurement conditions", the transfer layer 10 is transferred on the transfer body 300, and the transfer layer 10 transferred on the transfer body is spontaneously transferred. The printer used when the substrate 1 of the printed sheet 100 is peeled off will be described. [0029] As shown in FIG. 7, the printer 200 used for the above-mentioned "specific measurement conditions" includes: a thermal transfer sheet supply roller as a thermal transfer sheet supply mechanism 201 that conveys the thermal transfer sheet 100 along a specific path, and As the winding roller of the thermal transfer sheet winding mechanism 203, the back side of the thermal transfer sheet 100 is heated to transfer the transfer layer 10 to the transferred body 300, and the heating head as the heating mechanism 202 is turned After the printing body 300 can move at the position where the transfer layer 10 is transferred, the pressing roller 206 is located between the heating mechanism 202 and the thermal transfer sheet winding mechanism 203, and after the transfer layer 10 is transferred to the transferred body 300 , The peeling plate as the peeling mechanism 205 that peels off the transfer layer 10 transferred from the substrate 1 and transferred on the to-be-transferred body 300 is located on the conveying path of the thermal transfer sheet 100 and located on the heating mechanism 202 (peeling mechanism 205) With the thermal transfer sheet winding mechanism 203, while continuously transferring the transfer layer 10 on the transfer body 300, the transfer layer 10 transferred from the base material 1 to the transfer body 300 is measured. The tensile strength applied to the thermal transfer sheet at the time is used as a tensiometer of the measuring mechanism 204. [0030] The printer 200 used for the above-mentioned "specific measurement conditions" is provided with the transfer path of the thermal transfer sheet 100 and between the heating mechanism 202 and the thermal transfer sheet winding mechanism 203, as well as the body to be transferred. 300 on the transfer transfer layer 10, while measuring the tensile strength of the thermal transfer sheet when the transfer layer 10 transferred on the transfer body 300 is peeled off from the thermal transfer sheet 100 at a peeling angle of 50° Except for the aspects of the measuring mechanism 204, a conventionally known printer can be appropriately set and used. [0031] As the measuring mechanism 204, any one that can measure the tensile strength of the thermal transfer sheet traveling in the conveying path is sufficient, and a tensiometer (ASK-1000 type, Okura Kogyo Co., Ltd.) can be used. In addition, the tensile strength referred to in this specification is synonymous with tension, and the value of tensile strength indicates that after the transfer layer 10 is transferred to the transferred body 300, it is peeled from the substrate 1 and transferred to the transferred body. The actual value of the peeling force of the transfer layer 10 on 300. According to the printer 200 in which the measuring mechanism 204 is located between the heating mechanism 202 and the thermal transfer sheet winding mechanism 203, by means of the peeling mechanism 205, the transfer layer 10 can be transferred on the transfer body 300 while measuring The peeling angle of 50° is the tensile strength of the thermal transfer sheet at the point when the transfer layer 10 transferred on the transferred body 300 is peeled from the thermal transfer sheet 100. Specifically, by continuously transferring the transfer layer 10 on the transfer body 300, the transfer layer 10 transferred on the transfer body is continuously peeled from the thermal transfer sheet at a peeling angle of 50°. , And the actual peeling force when the transfer layer 10 is peeled off from the constituent member contacting the transfer layer 10 of the thermal transfer sheet 100 can be measured. [0032] Next, an example of the specific configuration of the thermal transfer sheet 100 whose tensile strength under the "specific measurement conditions" is set to 0.29 N/cm or less will be described. In addition, the thermal transfer sheet 100 of one embodiment only needs to satisfy the condition that the tensile strength of the above-mentioned "specific measurement condition" is 0.29 N/cm or less, and other conditions are not limited. Moreover, the specific means for adjusting the tensile strength of the above-mentioned "specific measurement conditions" to 0.29 N/cm or less is not limited, and it can be applied to make the tensile strength of the above-mentioned "specific measurement conditions" 0.29 N/cm or less. Of all means. Hereinafter, a specific method for setting the tensile strength of the above-mentioned "specific measurement conditions" to 0.29 N/cm or less will be described as an example, but it is not limited to this method. [0033] (First means) The first means is a means for appropriately selecting the components contained in the transfer layer 10 and adjusting the tensile strength of the above-mentioned "specific measurement conditions" to 0.29 N/cm or less. Specifically, it is a means to improve the releasability of the layer located at the transfer interface among the layers constituting the transfer layer. [0034] For example, as shown in FIG. 4, when the substrate 1 is provided with a transfer layer 10 formed by sequentially laminating the receiving layer 2 and the adhesive layer 5 from the side of the substrate 1, by selecting The appropriate resin material contained in the receiving layer 2 located at the transfer interface can adjust the tensile strength of the above-mentioned "specific measurement conditions" to 0.29 N/cm or less. As an example, since the receiving layer 2 contains cellulose resin as a resin material, the content of the cellulose resin in the receiving layer can be adjusted appropriately, and the tensile strength of the above-mentioned "specific measurement conditions" can be adjusted to 0.29N/cm or less . As the cellulose resin, cellulose acetate butyrate (CAB), cellulose acetate propionate (CAP), or the like can be preferably used. As an example, since the receiving layer contains cellulose resin with a number average molecular weight (Mn) of less than 70,000, preferably 55,000 or less, particularly preferably 40,000 or less, adjust its content appropriately, and at the same time adjust the thickness of the receiving layer 2 appropriately , The thickness of the base material 1, etc., and the tensile strength of the above-mentioned "specific measurement conditions" can be adjusted to 0.29N/cm or less. In addition, the number average molecular weight (Mn) means the value measured by gel permeation chromatography using polystyrene as a standard material, and means the molecular weight measured by the method according to JIS-K-7252-1 (2008) . [0035] The thickness of the receiving layer when the receiving layer 2 containing the cellulose resin is formed is preferably in the range of 0.3 μm or more and 5 μm or less. [0036] In addition, by combining the resin material and the release agent contained in the transfer layer 10, specifically, by appropriately adjusting the layers constituting the transfer layer 10, the layer located at the transfer interface contains The type of resin material, release agent, and the content thereof can also be adjusted to 0.29 N/cm or less in the above-mentioned "specified measurement conditions". Examples of mold release agents include waxes such as polyethylene wax and silicone wax, silicone resin, silicone modified resin, fluorine resin, fluorine modified resin, polyvinyl alcohol, acrylic resin, and thermosetting resin. Epoxy-amine-based copolymers, and thermosetting alkyd-amine-based copolymers (thermosetting amino-based alkyd resins), etc. [0037] Furthermore, in the first means, considering the thermal shrinkage rate of the substrate, by using a substrate with a thermal shrinkage rate of 10% or less, more preferably 6% or less, and even more preferably 4% or less as the substrate, In the above-mentioned "specific measurement conditions", the tensile strength measured when the applied energy is changed from 0.177 mJ/dot to 0.169 mJ/dot is set to 0.2 N/cm or less. In addition, the absolute value of the difference between the tensile strength measured under the above-mentioned "specific measurement conditions" and the tensile strength measured when the applied energy is changed from 0.177mJ/dot to 0.169mJ/dot in the above-mentioned "specified measurement conditions" can be Set within the above-mentioned preferred range. [0038] The thermal shrinkage rate (%) of the substrate referred to in this specification is the thermal shrinkage rate when measured by a method based on JIS-C-2151 (2006). Specifically, the MD direction length of the substrate (the length of the substrate in the MD direction before the test) is measured, and the substrate is suspended in a hot-air circulating constant temperature bath at 190°C for 20 minutes in a non-loaded state. Subsequently, after cooling the substrate to room temperature, the MD direction length of the cooled substrate (the length of the substrate in the MD direction after the test) was measured. The heat shrinkage rate (%) is when the length of the substrate in the MD direction before the test is set to L 0 , and the length of the substrate in the MD direction after the test is set to L, by 100×((L 0 -L)/L ) Calculated value. [0039] Furthermore, the substrate 1 whose thermal shrinkage rate (%) is within the above-mentioned preferred range can also be combined with the following second to fourth means. [0040] (Second Means) The second means is to appropriately adjust the constituent members constituting the thermal transfer sheet, or the thickness of the transfer layer 10, such as the thickness of the substrate 1, the thickness of the transfer layer 10, and the thickness of the transfer layer 10. The thickness of any layer on one side, such as the thickness of the back layer, and the means to adjust the tensile strength of the above-mentioned "specific measurement conditions" to 0.29N/cm or less. Specifically, it is a means to increase the thickness of one or more of the substrate 1, the layer constituting the transfer layer 10, and any of the layers. According to the second method, the energy transfer efficiency of the energy applied from the other side of the substrate 1 to the transfer layer 10 can be suppressed, and thereby the tensile strength of the above-mentioned "specific measurement conditions" can be adjusted to 0.29 N/cm the following. In addition, instead of adjusting the thickness of the substrate 1 or any layer provided on the other side of the substrate 1, a material with low energy transfer efficiency is used as the substrate 1 or any layer provided on the other side of the substrate 1. The material can also suppress the energy transfer efficiency of the energy applied to the other side of the substrate 1 to the transfer layer 10. [0041] (The third means) The third means is to provide an optional layer between the substrate 1 and the transfer layer 10 to improve the transferability of the transfer layer 10, and adjust the tensile strength of the above-mentioned "specific measurement conditions" to Means below 0.29N/cm. As an arbitrary layer, a mold release layer etc. are mentioned, for example. In addition, it is difficult to adjust the tensile strength of the above-mentioned "specific measurement conditions" to 0.29N/cm or less by only the third method. Based on the viewpoint of the adjustment of the tensile strength, the third method is used as the first method, or The second means is an auxiliary means for adjusting the tensile strength, or preferably combined with the fourth means described later. In addition, along with the material of the release layer, the adjustment of the tensile strength can also be achieved by measures such as increasing the thickness of the release layer. In addition, the release layer is a layer that does not constitute the transfer layer 10, but is a layer that remains on the side of the thermal transfer sheet when the transfer layer 10 is transferred. [0042] (Fourth means) The fourth means considers the heat resistance of the transfer layer 10 itself, and adjusts the tensile strength of the above-mentioned "specific measurement conditions" to 0.29 N/cm or less. As a means for improving the heat resistance of the transfer layer, for example, a method containing a hardening resin hardened by a hardening agent, etc. can be exemplified. In addition, it is difficult to adjust the tensile strength of the above-mentioned "specific measurement conditions" to 0.29N/cm or less by the fourth method alone. Based on the viewpoint of the tensile strength adjustment, the fourth method is used as the first method, or The second means is an auxiliary means for adjusting the tensile strength, or preferably combined with the above-mentioned third means. [0043] Also, instead of improving the heat resistance of the transfer layer 10 itself, or at the same time, the heat resistance of any layer provided on the other side of the substrate 1 can be improved. [0044] In addition, by appropriately combining the above-mentioned first to fourth means, the tensile strength of the above-mentioned "specific measurement conditions" may be adjusted to 0.29 N/cm or less. In addition, by combining other methods, the tensile strength of the above-mentioned "specific measurement conditions" may be adjusted to 0.29 N/cm or less. [0045] Hereinafter, the configuration of the thermal transfer sheet 100 of an embodiment will be described as an example. However, the thermal transfer sheet 100 of an embodiment uses the above-described means, etc., to adjust the above-mentioned "specific measurement conditions". It is characterized by adjusting the tensile strength to 0.29 N/cm or less, and other conditions are not limited to the following description. [0046] (Substrate) The substrate 1 is an essential component of the thermal transfer sheet 100 of an embodiment, and is provided to hold the transfer layer 10 provided on one surface of the substrate 1. The material of the base material 1 is not particularly limited, but it is desired to have mechanical properties that can withstand the heat applied when the transfer layer 10 is transferred to the body to be transferred, and are not hindered in handling. Examples of these substrates 1 include polyesters such as polyethylene terephthalate, polyacrylates, polycarbonates, polyurethanes, polyimides, polyetherimides, and cellulose. Derivatives, polyethylene, ethylene-vinyl acetate copolymer, polypropylene, polystyrene, acrylic acid, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyvinyl butyral, nylon, polyether ether ketone, poly Waste, polyether, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polyvinyl sulfide, tetrafluoroethylene-ethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, polychlorotrifluoroethylene, polyvinylidene Various plastic films or sheets such as vinyl fluoride. [0047] The thickness of the substrate 1 is not particularly limited, but is preferably in the range of 2.5 μm or more and 10 μm or less. [0048] In addition, in order to adjust the adhesion between the substrate 1 and the transfer layer 10, various surface treatments may be applied to the surface of the substrate 1, such as corona discharge treatment, flame treatment, ozone treatment, ultraviolet treatment, radiation treatment, Roughening treatment, chemical treatment, plasma treatment, low temperature plasma treatment, primer treatment, grafting treatment, etc. [0049] (Transfer layer) As shown in FIGS. 1 to 3, a transfer layer 10 that can be peeled from the substrate 1 is provided on one surface of the substrate 1. The transfer layer 10 is an essential component of the thermal transfer sheet 100 of an embodiment. [0050] The transfer layer 10 referred to in the thermal transfer sheet 100 of one embodiment refers to a layer that is peeled from the substrate 1 during thermal transfer and transferred to a transfer target body. If the transfer layer 10 finally satisfies the condition that the tensile strength of the thermal transfer sheet under the above-mentioned "specific measurement conditions" is 0.29 N/cm or less, the layer composition or the components contained in the transfer layer are not particularly limited. As shown in FIGS. 1 and 2, the transfer layer 10 may have a laminated structure formed by laminating two or more layers, or as shown in FIG. 3, the transfer layer 10 may have a single-layer structure. Hereinafter, an example of the transfer layer 10 constituting the thermal transfer sheet 100 of one embodiment will be described. [0051] (Transfer layer of embodiment A) The transfer layer 10 of embodiment A of the thermal transfer sheet of one embodiment (hereinafter referred to as the transfer layer of embodiment A) is shown in FIG. The substrate 1 side has a laminate structure in which the receiving layer 2 and the adhesive layer 5 are sequentially laminated. Moreover, instead of the form shown in FIG. 1, a protective layer (not shown) may be provided between the receiving layer 2 and the adhesive layer 5. In addition, instead of the form shown in FIG. 1, it is also possible to set the transfer layer 10 composed of only a single layer of the receiving layer 2, and to impart adhesiveness to the receiving layer 2 itself (not shown). The thermal transfer sheet 100 provided with the transfer layer 10 of Embodiment A is a thermal transfer sheet for forming a thermal transfer image-forming sheet. As the adhesive layer 5, a conventionally known adhesive layer in the field of thermal transfer sheets can be appropriately selected and used. In addition, when the tensile strength of the above-mentioned "specific measurement conditions" is adjusted to 0.29 N/cm or less by other than the first means, a conventionally known material can be appropriately selected and used as the receiving layer 2. [0052] The thermal transfer sheet of Embodiment A is used to obtain a thermal transfer sheet with a thermal transfer image-forming sheet on the outermost surface of the receiving layer 2 by transferring the transfer layer 10. In the receiving layer 2 of the thermal transfer imaging sheet obtained by using the thermal transfer sheet of Embodiment A, a thermal transfer image can be formed by transferring the dye of the dye layer. In addition, when the dye of the dye layer is transferred to the receiving layer to form a thermal transfer image, the dyeability of the dye to the receiving layer is related to the smoothness of the surface of the receiving layer 2 facing the dye layer, and the surface of the receiving layer is smooth The higher the performance, the better the dyeability of the dye. As described above, according to the thermal transfer sheet according to one embodiment of the transfer layer 10 having good peelability, when the transfer layer 10 is peeled from the constituent member in contact with the transfer layer 10 of the thermal transfer sheet, it can be suppressed from the structure. The surface of the transfer layer 10 on the side where the member is in contact is roughened. Therefore, in the thermal transfer sheet of Embodiment A, the smoothness of the receiving layer 2 can be improved, and the transfer layer can be transferred to the body to be transferred. Thereby, according to the thermal transfer sheet of the embodiment A, using the thermal transfer sheet of the embodiment A, a thermal transfer imaging sheet with good dyeing properties can be obtained. [0053] (Transfer layer of embodiment B) The transfer layer 10 of embodiment B of the thermal transfer sheet of one embodiment (hereinafter referred to as the transfer layer of embodiment B) is shown in FIG. A layered structure in which the release layer 4 and the receiving layer 2 are sequentially laminated from the side of the substrate 1. The thermal transfer sheet 100 having the transfer layer 10 of the embodiment B is used as a receiving layer of the thermal transfer sheet to form a thermal transfer image, and the transfer layer including the receiving layer on which the thermal transfer image is formed is transferred Printed on the body to be transferred and used as an intermediate transfer medium to obtain the printed matter. In addition, instead of the form shown in FIG. 2, it can also be a layer formed by sequentially laminating a release layer (sometimes called a protective layer) and an adhesive layer on one surface of the substrate 1 from the side of the substrate 1 A thermal transfer sheet composed of a combined structure, or a transfer layer composed of a single layer formed by a release layer is provided on one surface of the base material 1. The thermal transfer sheet of this form transfers the transfer layer on the transfer body, and functions as a protective layer transfer sheet that improves the durability of the transfer body. [0054] In the transfer layer 10 of the embodiment A and the embodiment B, as in the above-mentioned first means, considering the components contained in the layer that constitutes the transfer layer 10 and is located at the transfer interface, the above-mentioned "specific measurement The tensile strength of "Condition" is adjusted to 0.29 N/cm or less, and the tensile strength can be adjusted to 0.29 N/cm or less by the above-mentioned second means, or an appropriate combination of the first to fourth means. [0055] (Transfer layer of embodiment C) The transfer layer 10 of embodiment A of the thermal transfer sheet of one embodiment (hereinafter referred to as the transfer layer of embodiment A) is shown in FIG. 3, which is represented by A single-layer structure composed of the hot-melt ink layer 7. The thermal transfer sheet 100 provided with the transfer layer 10 of the embodiment C functions to form a thermal transfer image on the transferred body every time a layer of hot-melt ink layer 7 is transferred on the transferred body. [0056] In the transfer layer 10 of the embodiment C, in consideration of the resin material contained in the hot-melt ink layer 7 constituting the transfer layer 10, or the component or content of the release agent, etc., the above-mentioned "specific measurement The tensile strength of "condition" is adjusted to 0.29 N/cm or less, and by appropriately selecting the above-mentioned second means to the above-mentioned fourth means, the tensile strength of the transfer layer 10 can also be adjusted to 0.29 N/cm or less. [0057] Moreover, on the same surface of the substrate 1, other layers may be arranged in sequence with the transfer layer 10. For example, as shown in FIG. 4, it may also be a structure in which a layer 8 containing an invisible light absorbing material is arranged on the same surface of the substrate 1 and the transfer layer 10 in order of the surface. Although the transfer layer 10 of the thermal transfer sheet in the form shown in the figure has a laminated structure in which the receiving layer 2 and the adhesive layer 5 are sequentially laminated from the side of the substrate 1, it can also be transferred in other forms. Layer 10. According to the thermal transfer sheet of embodiment A shown in FIG. 4, it can be formed on one surface of the transferred body, which is invisible or difficult to see under visible light, and contains invisible light that can be discerned under infrared light or ultraviolet light. Image 50A of the absorbing material (refer to Figure 5(a)). And, on the image 50A containing invisible light absorbing material (refer to Figure 5(b)) or on the other side of the transferred body (refer to Figure 5(c)), it can be transferred to become a thermal transfer image. Like the transfer layer 10 of the sheet. In addition, the transfer layer 10 of the thermal transfer sheet of the form shown in FIG. 4 is transferred on the transfer body to form a thermal transfer imaging sheet, and then on the receiving layer 2 of the thermal transfer imaging sheet, or An image containing an invisible light absorbing material can also be formed on the surface opposite to the surface on which the receiving layer 2 is transferred (refer to FIG. 6(a), (b)). 5 and 6 are schematic cross-sectional views showing an example of the use form of the thermal transfer sheet of Embodiment A. [0058] (Layer containing invisible light absorbing material) The layer 8 containing invisible light absorbing material contains an invisible light absorbing material. The invisible light absorbing material referred to in this specification means a material that does not absorb visible light or hardly absorbs but is excited by infrared light or ultraviolet light. [0059] As the invisible light absorbing material, for example, an infrared light absorbing material or an ultraviolet light absorbing material can be exemplified. The term "infrared light" in this specification means a wavelength region with a maximum absorption wavelength (λmax) of 750nm to 2000nm, and the so-called "ultraviolet light" means a region with a maximum absorption wavelength (λmax) of 280nm to 400nm. [0060] Examples of infrared light absorbing materials include diiminium-based compounds, aluminum-based compounds, phthalocyanine-based compounds, dithiol-based organometallic complexes, cyanine-based compounds, azo-based compounds, and polymethine compounds. -Based compounds, quinone-based compounds, diphenylmethane-based compounds, triphenylmethane-based compounds, oxazole-based compounds, carbon black, etc. The layer 8 containing the invisible light absorbing material may contain one kind of these infrared light absorbing materials alone, or may contain two or more kinds. [0061] Examples of ultraviolet light absorbing materials include organic ultraviolet light absorbing materials such as benzotriazole-based compounds, triazine-based compounds, benzophenone-based compounds, and benzoate-based compounds, or titanium oxide, oxide Inorganic ultraviolet light absorbing materials such as zinc, cerium oxide, iron oxide, barium sulfate, etc. The layer 8 containing the invisible light absorbing material may contain one kind of these ultraviolet light absorbing materials alone, or may contain two or more kinds. [0062] Moreover, the layer 8 containing invisible light absorbing material may also contain both infrared light absorbing material and ultraviolet light absorbing material. [0063] Furthermore, the layer 8 containing the invisible light absorbing material may also contain a binder resin together with the above invisible light absorbing material. Examples of binder resins include polyester resins, polyethylene resins, fluorine resins, polystyrene resins, polyacrylic resins, cellulose resins, polycarbonate resins, polyamide resins, Conventional resins such as polyolefin resins such as polypropylene resins, polyvinyl alcohol resins, polyimide resins, phenol resins, and polyurethane resins. [0064] In addition, the layer 8 containing the invisible light absorbing material may also contain pigments or organic dyes together with the above invisible light absorbing material. Examples of pigments include colored pigments such as yellow, magenta, and blue, or hollow particles, silicon oxide, titanium oxide, titanium dioxide, zinc oxide, cerium oxide, titanium mica, muscovite, white carbon, calcium carbonate, and sulfuric acid. Barium, alumina white, talc, etc. In addition, it can also be used for cores made of inorganic pigments and covered with shells made of organic pigments. Shell paint, etc. Examples of organic dyes include yellow dyes, magenta dyes, blue dyes, and the like. [0065] The thickness of the layer 8 containing the invisible light absorbing material is preferably in the range of 0.3 μm or more and 5 μm or less. [0066] In addition, in the layer 8 containing the invisible light absorbing material, instead of containing pigments or organic dyes, the layer 8 containing the invisible light absorbing material can also be a laminate of a layer containing an invisible light absorbing material and a layer containing a pigment. Composition (not shown). [0067] When the layer 8 containing the invisible light absorbing material is configured as a laminate, the layer containing the invisible light absorbing material may be located closest to the substrate 1, or may be located at the farthest from the substrate 1. The layer containing the invisible light absorbing material 8 can also be a layer containing an invisible light absorbing material, a layer containing a pigment, and one or more layers of any layer. The layer containing an invisible light absorbing material can be located between any layers. The same applies to layers containing pigments. [0068] As the pigment-containing layer, at least one of the above-exemplified organic pigments and inorganic pigments, and additives such as binders as needed are contained. Examples of the binder are, for example, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, polyethylene, polystyrene, polypropylene, polybutene, petroleum resin, vinyl chloride resin, vinyl chloride-vinyl acetate copolymer , Polyvinyl alcohol, vinylidene chloride resin, acrylic resin, methacrylic resin, polyamide, polycarbonate, fluororesin, polyvinyl methyl acetal, polyvinyl butyral, acetyl cellulose, nitrocellulose Vegetarian, polyvinyl acetate, polyisobutylene, ethyl cellulose or polyacetal, etc. In addition, as the binder, there are microcrystalline wax, carnauba wax, paraffin wax, and the like. Furthermore, Fischer-Tropsch wax, various low molecular weight polyethylene, wood wax, beeswax, spermaceti, insect wax, wool wax, shellac wax, candelilla wax, petrolatum, polyester wax can also be used , Some waxes such as modified waxes, fatty acid esters, and fatty acid amides. [0069] The thickness of the layer containing the pigment is not particularly limited, but is preferably in the range of 0.1 μm or more and 5 μm or less, more preferably in the range of 0.5 μm or more and 1.5 μm or less. [0070] (Arbitrary layer) In addition, the thermal transfer sheet 100 of one embodiment may include any layer that does not constitute a transfer layer. As an arbitrary layer, for example, a release layer (not shown) provided between the substrate 1 and the transfer layer 10 to improve the transferability of the transfer layer 10, or provided on the other surface of the substrate 1 It is used to improve the heat resistance or the back layer of the heating element such as heating element. These arbitrary layers can be provided as plural means when the tensile strength is adjusted by the above-mentioned first means or second means. [0071] (Transferred body) The transferred body to be transferred by the transfer layer 10 of the thermal transfer sheet 100 of one embodiment is not particularly limited, and plain paper, fine paper, tracing paper, and plastic can be used. Film, plastic card composed of vinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate as the main body, thermal transfer imaging sheet, transfer layer of intermediate transfer medium on any object The printed matter, etc. [Examples] [0072] Next, examples and comparative examples are given to illustrate the present invention in more detail. Hereinafter, as long as it is not particularly limited, parts or% are the basis of mass. [0073] (Example 1) A polyethylene terephthalate film with a thickness of 5 μm was prepared as a substrate, and a receiving layer of the following composition was coated on one surface of the substrate so that the thickness becomes 1 μm when dried The coating liquid 1 was used and dried to form a receiving layer. Next, on this receiving layer, the coating liquid for an adhesive layer of the following composition was apply|coated so that the thickness in drying might become 1 micrometer, and it dried and formed the adhesive layer. Furthermore, on the other side of the substrate, the coating liquid 1 for the back layer of the following composition was applied so that the thickness during drying became 1 μm and dried to form the back layer, and the substrate was formed on one side of the substrate. The transfer layer formed by sequentially laminating the receiving layer and the adhesive layer on the substrate side, and the thermal transfer sheet of Example 1 where the back layer is provided on the other side of the substrate. In addition, a polyethylene terephthalate film with a thickness of 5 μm has a heat shrinkage rate of 2.95% when measured in accordance with the method of JIS-C-2151 (2006). [0074] <Coating Liquid 1 for Receptive Layer>. 16.7 parts of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) CNL Nissin Chemical Industry Co., Ltd.). 1 part of cellulose acetate butyrate (CAB-381-0.5 EASTMAN CHEMICAL (shares)). 1.8 parts of organic modified polysiloxane (X-22-3000T Shin-Etsu Chemical Industry Co., Ltd.). Organic modified polysiloxane 0.5 parts (KF-352A Shin-Etsu Chemical Industry Co., Ltd.). 40 parts of methyl ethyl ketone. 40 parts of toluene [0075] <Coating liquid for adhesive layer>. 8 parts of acrylic resin (DIANAL (registered trademark) BR-87, Mitsubishi 缧萦 (stock)). 2 copies of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) CNL Nissin Chemical Industry Co., Ltd.). 30 parts of methyl ethyl ketone. 30 parts of toluene [0076] <Coating liquid for back layer 1>. 1.8 parts of polyvinyl butyral resin (SLEC (registered trademark) BX-1 Sekisui Chemical Industry Co., Ltd.)). 5.5 parts of polyisocyanate hardener (BURNOCK (registered trademark) D750 DIC (shares)). 1.6 parts of phosphate (PRISURF (registered trademark) A208N Daiichi Industrial Pharmaceutical Co., Ltd.)). 0.35 copies of talc (MICRO ACE (registered trademark) P-3 Japanese talc (shares)). 0.3 parts of polyethylene wax. 18.5 parts of methyl ethyl ketone. 18.5 parts of toluene [0077] (Example 2) Except that a polyethylene terephthalate film with a thickness of 5 μm was changed to a polyethylene terephthalate film with a thickness of 4.5 μm, everything was obtained in the same manner as in Example 1. The thermal transfer sheet of Example 2. In addition, a polyethylene terephthalate film with a thickness of 4.5 μm has a heat shrinkage rate of 5.5% when measured in accordance with the method of JIS-C-2151 (2006). (Example 3) Except that a polyethylene terephthalate film with a thickness of 5 μm was changed to a polyethylene terephthalate film with a thickness of 4.5 μm, the coating solution 1 for the receiving layer was changed to the following composition The heat transfer sheet of Example 3 was obtained in the same manner as in Example 1, except that the coating solution 2 for receiving layer was used to form the receiving layer. In addition, a polyethylene terephthalate film with a thickness of 4.5 μm has a heat shrinkage rate of 5.5% when measured in accordance with the method of JIS-C-2151 (2006). [0079] <Coating Liquid 2 for Receptive Layer>. 15.7 parts of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) CNL Nissin Chemical Industry Co., Ltd.). 2 parts of cellulose acetate butyrate (CAB-381-0.5 EASTMAN CHEMICAL (shares)). 1.8 parts of organic modified polysiloxane (X-22-3000T Shin-Etsu Chemical Industry Co., Ltd.). Organic modified polysiloxane 0.5 parts (KF-352A Shin-Etsu Chemical Industry Co., Ltd.). 40 parts of methyl ethyl ketone. 40 parts of toluene [0080] (Example 4) Except that the polyethylene terephthalate film with a thickness of 5 μm was changed to a polyethylene terephthalate film with a thickness of 4.3 μm, everything was obtained in the same manner as in Example 1. The thermal transfer sheet of Example 4. In addition, the thickness of the polyethylene terephthalate film with a thickness of 4.3 μm has a heat shrinkage rate of 3.15% when measured in accordance with the method of JIS-C-2151 (2006). (Example 5) Except that a polyethylene terephthalate film with a thickness of 5 μm was changed to a polyethylene terephthalate film with a thickness of 5.7 μm, the coating solution 1 for the receiving layer was changed to the composition described above The heat transfer sheet of Example 5 was obtained in the same manner as in Example 1, except that the coating liquid 2 for a receiving layer was to form the receiving layer. In addition, a polyethylene terephthalate film with a thickness of 5.7 μm has a heat shrinkage rate of 2.8% when measured in accordance with the method of JIS-C-2151 (2006). [0082] (Comparative Example 1) Except that a polyethylene terephthalate film having a thickness of 5 μm was changed to a polyethylene terephthalate film having a thickness of 4.5 μm, the coating solution 1 for the receiving layer was changed to the following composition The heat transfer sheet of Comparative Example 1 was obtained in the same manner as in Example 1, except that the coating liquid A for receiving layer was used to form the receiving layer. In addition, a polyethylene terephthalate film with a thickness of 4.5 μm has a heat shrinkage rate of 5.5% when measured in accordance with the method of JIS-C-2151 (2006). [0083] <Coating Liquid A for Receptive Layer>. 19 copies of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) CNL Nissin Chemical Industry Co., Ltd.). 1 copy of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) C Nissin Chemical Industry Co., Ltd.). 40 parts of methyl ethyl ketone. 40 parts of toluene [0084] (Comparative Example 2) Except that the polyethylene terephthalate film with a thickness of 5μm was changed to a polyethylene terephthalate film with a thickness of 4.5μm, the coating solution 1 for the receiving layer was changed to The coating liquid A for the receiving layer of the above composition forms the receiving layer, and the coating liquid 1 for the back layer is changed to the coating liquid A for the back layer of the following composition to form the back layer. All are the same as Example 1 to obtain Comparative Example 2 The thermal transfer sheet. In addition, a polyethylene terephthalate film with a thickness of 4.5 μm has a heat shrinkage rate of 5.5% when measured in accordance with the method of JIS-C-2151 (2006). [0085] <Coating Liquid A for Back Layer>. 6 parts of polyvinyl butyral resin (#3000-4 DENKA (shares)). 8 parts of polyisocyanate hardener (BURNOCK (registered trademark) D750-45 DIC (shares)). 3 parts of zinc stearate phosphate (LBT-1830 purification Sakai Chemical Industry Co., Ltd.). 3 parts of zinc stearate (SZ-PF Sakai Chemical Industry Co., Ltd.). 1.5 copies of talc (MICRO ACE (registered trademark) P-3 Japanese talc (shares)). 3 parts of polyethylene wax (POLYWAX 3000 Toyo ADL (shares)). 62.92 parts of methyl ethyl ketone. 12.58 parts of toluene [0086] (Creation of the transfer material) Use a 35μm thick porous polyolefin film (SP-U Mitsui Chemicals TOHCELLO (stock)) to coat it so that the dry thickness becomes 1.5μm The coating solution for the undercoat layer of the above composition is dried to form the undercoat layer. Secondly, the undercoat layer is coated with the following composition by using a bar coater so that the thickness when dried becomes 4μm. The layer coating liquid (i) is dried to form a receiving layer, and a laminate obtained by sequentially laminating a primer layer and a receiving layer on a porous polyolefin film. Next, the laminated body obtained above was pasted on one side of a core paper (OKL card, Oji Paper (stock)) with a thickness of 400 μm (weight per unit area of 310 g/m 2 ). In addition, the other side of the core paper is similarly bonded to the porous polyolefin film, which is a laminate obtained by sequentially laminating a primer layer and a receiving layer. In addition, the bonding of the core paper and the laminate was performed with the adhesive layer coating liquid (i) (thickness 4 μm) having the following composition. Thereby, a transferred body in which a porous polyolefin film, an undercoat layer, and a receiving layer are sequentially provided on both sides of the core material paper from the core material paper side is obtained. [0087] (Coating Liquid for Undercoat Layer). 4.2 parts of polyester resin (POLYESTAR (registered trademark) WR-905 Nippon Synthetic Chemical Industry Co., Ltd.). 8.4 parts of titanium oxide (TCA-888 Sakai Chemical Industry Co., Ltd.). Fluorescent brightener 0.07 parts (UVITEX (registered trademark) BAC, BASF JAPAN company). 7.2 parts of isopropanol. 21 parts of water [0088] (coating liquid for receiving layer (i)). 10 copies of vinyl chloride-vinyl acetate copolymer (SOLBIN (registered trademark) C Nissin Chemical Industry Co., Ltd.). 1 part of silicone oil (X-22-3000T Shin-Etsu Chemical Industry Co., Ltd.). 20 parts of toluene. 20 parts of ethyl acetate [0089] (coating liquid for adhesive layer (i)). 30 parts of polyol resin (TAKELAC (registered trademark) A-969V Mitsui Chemicals Co., Ltd.). 10 parts of isocyanate (TAKENATE (registered trademark) A-5 Mitsui Chemicals Co., Ltd.). 60 parts of ethyl acetate [0090] (Calculation of tensile strength when heated (calculation of peeling force when heated)) Combine the heat transfer sheet of each of the above-mentioned Examples and Comparative Examples with the above-mentioned to-be-transferred body, Using the following thermal release type test printer 1, the transfer layer of the thermal transfer sheet was transferred on the body to be transferred, and the transferred transfer layer was peeled from the substrate to obtain the transfer layer. The printed matter of each embodiment and comparative example with a transfer layer on the body. When the printed matter is obtained, the stress of the thermal transfer sheet at the point when the transfer layer transferred on the transferred body is peeled from the substrate at a peeling angle of 50°, due to the thermal transfer in the printer A tensiometer (ASK-1000, Okura Industry Co., Ltd.) is installed between the winding roller of the sheet and the heating mechanism (heating head) to measure it. Secondly, the stress measured by the tensiometer is divided by the heating width of the thermal transfer sheet (the energy application width) to calculate the value of the tensile strength. Also, for the above-mentioned test printer 1, the applied energy is changed from 0.177mJ/dot to 0.169mJ/dot when the conditions of the test printer 1 are changed (the applied voltage is changed from 18.7V to 18.3V). The value of intensity is also calculated in the same way. Table 1 shows the calculation results of tensile strength. In addition, in the conditions of the test printer 1, a thermal transfer sheet with a tensile strength of 0.29 N/cm or less was set as the thermal transfer sheet of the example, and a thermal transfer sheet with a tensile strength greater than 0.29 N/cm was set as the comparative example. Thermal transfer sheet. [0091] (Test printer 1 (peel type when hot)). Average resistance value of heating element: 5045 (Ω). Printing density in the main scanning direction: 300 (dpi). Printing density in sub-scanning direction: 300 (dpi). Applied voltage: 18.7 (V). Line period: 3(msec.). Pulse duty cycle: 85 (%). Printing start temperature: 29.0~36.0(℃). The distance from the heating point to the peeling plate: 4.5 (mm). Printing pressure: 3.5~4.0(kgf)(34.3~39.2(N)). Evaluation image (energy grayscale): 255/255 grayscale image. The applied energy calculated from the above formula (1): 0.177 (mJ/dot). The conveying speed calculated by the above formula (3): 28.2 (mm/sec.) [0092] (Evaluation of thermal fusion) In the combination of the thermal transfer sheet of each embodiment and the comparative example and the above-mentioned to-be-transferred body, Based on the following evaluation criteria, using the test printer 1 of the above-mentioned thermal peeling type, the thermal fusion evaluation when the transfer layer was transferred to the transferred body was performed under the condition of applying an energy of 0.177 (mJ/dot). The evaluation results are shown in Table 1 together. [0093] "Evaluation Criteria" A: No heat fusion or peeling sound occurred, and the transfer layer could be peeled off the base material well. B: No heat fusion occurred, and the transfer layer could be peeled from the base material well, but peeling sound occurred. NG: Part or all of the transfer layer is thermally fused, and part or all of the transfer layer cannot be peeled from the substrate. [0094] (Preparation of a thermal transfer sheet with a dye layer) A polyethylene terephthalate film with a thickness of 5 μm is used as a substrate, and the back layer of the above composition is coated so that the thickness when dried becomes 1 μm The coating liquid 1 was dried and the back layer was formed. Next, on the other side of the substrate, a coating solution for a dye undercoating layer having the following composition is applied so that the thickness during drying becomes 0.15 μm and dried to form a dye undercoating layer. On the dye primer layer, the yellow, magenta, and blue dye layer coating liquids of the following composition are applied in the order of the surface so that the thickness when dried becomes 0.7 μm and dried to form a yellow dye layer and a product. Red dye layer and blue dye layer, to obtain a thermal transfer sheet with dye layer. [0095] <Coating Liquid for Dye Undercoat>. Colloidal alumina (solid content 10.5%) 3.5 parts (alumina sol 200 Nissan Chemical Industry Co., Ltd.). 1.5 parts of vinyl acetate-vinylpyrrolidone copolymer (PVP/VA E-335, ISP JAPAN). 47.5 parts of water. 47.5 parts of isopropyl alcohol [0096] <Coating liquid for yellow dye layer>. Solvent Yellow 93 2.5 parts. Disperse Yellow 201 2.5 parts. 4 parts of polyvinyl acetal resin (SLEC (registered trademark) KS-5 Sekisui Chemical Industry Co., Ltd.). 0.04 parts of organic modified silicone oil. 50 parts of toluene. 50 parts of methyl ethyl ketone [0097] <Coating liquid for magenta dye layer>. Disperse Red 60 3 parts. Disperse Violet 26 3 parts. 5 parts of polyvinyl acetal resin (SLEC (registered trademark) KS-5 Sekisui Chemical Industry Co., Ltd.). 0.05 parts of organic modified silicone oil. 50 parts of toluene. 50 parts of methyl ethyl ketone [0098] <Coating liquid for blue dye layer>. Solvent Blue 63 3 parts. Disperse Blue 354 4 parts. 5 parts of polyvinyl acetal resin (SLEC (registered trademark) KS-5 Sekisui Chemical Industry Co., Ltd.). 0.05 parts of organic modified silicone oil. 50 parts of toluene. 50 parts of methyl ethyl ketone [0099] (Evaluation of dyeing properties) On the transfer layer of the printed matter of each of the examples and comparative examples obtained by the above-mentioned thermal fusion evaluation (the heat of the respective examples and comparative examples) On the receiving layer of the transfer layer of the transfer sheet), use the yellow dye layer, magenta dye layer, and blue dye layer of the thermal transfer sheet with the dye layer made above to form a black image (0/255 gray scale ). The formed black image was visually confirmed, and the dye dyeability was evaluated based on the following evaluation criteria. The evaluation results are shown in Table 1 together. In addition, the absence of unevenness in the image means that the releasability when the transfer layer is peeled off is good, and the surface smoothness of the receiving layer is high (the receiving layer is normally transferred). [0100] "Evaluation Criteria" A: No unevenness of shading occurs in the black image. B: Darkness unevenness occurs in a black image. [0101]
Figure 02_image001
Condition 1: Applied energy: 0.169 (mJ/dot), conveying speed 28.2 (mm/sec.) Condition 2: Applied energy: 0.177 (mJ/dot), conveying speed 28.2 (mm/sec.) (*1) Condition 1 The absolute value of the difference between the tensile strength of the condition and the tensile strength of condition 2

1:基材 1: Substrate

2:接受層 2: Receiving layer

4:剝離層 4: peeling layer

5:接著層 5: Next layer

7:熱熔融墨水層 7: Hot melt ink layer

8:含不可見光吸收材料之層 8: Layer containing invisible light absorbing material

10:轉印層 10: Transfer layer

100:熱轉印薄片 100: Thermal transfer sheet

200:列印機 200: Printer

201:熱轉印薄片供給機構 201: Thermal transfer sheet supply mechanism

202:加熱機構 202: heating mechanism

203:熱轉印薄片捲取機構 203: Thermal transfer sheet winding mechanism

204:測定機構 204: Measuring Institution

205:剝離機構 205: Stripping Mechanism

300:被轉印體 300: Transferred body

50A:含有不可見光吸收材料之圖像 50A: Images containing invisible light absorbing materials

206:壓輥 206: pressure roller

[0013]   圖1係顯示一實施形態之熱轉印薄片之一例之概略剖面圖。   圖2係顯示一實施形態之熱轉印薄片之一例之概略剖面圖。   圖3係顯示一實施形態之熱轉印薄片之一例之概略剖面圖。   圖4係顯示實施形態A之熱轉印薄片之一例之概略剖面圖。   圖5係顯示實施形態A之熱轉印薄片之使用形態一例之概略剖面圖。   圖6係顯示實施形態A之熱轉印薄片之使用形態一例之概略剖面圖。   圖7係顯示轉印一實施形態之熱轉印薄片的轉印層所用之列印機之一例之概略圖。[0013]    FIG. 1 is a schematic cross-sectional view showing an example of a thermal transfer sheet according to an embodiment.   Figure 2 is a schematic cross-sectional view showing an example of a thermal transfer sheet according to an embodiment.   FIG. 3 is a schematic cross-sectional view showing an example of a thermal transfer sheet according to an embodiment.   FIG. 4 is a schematic cross-sectional view showing an example of the thermal transfer sheet of Embodiment A.   FIG. 5 is a schematic cross-sectional view showing an example of the use form of the thermal transfer sheet of Embodiment A.   FIG. 6 is a schematic cross-sectional view showing an example of the use form of the thermal transfer sheet of Embodiment A.   FIG. 7 is a schematic diagram showing an example of a printer used to transfer the transfer layer of the thermal transfer sheet of an embodiment.

10‧‧‧轉印層 10‧‧‧Transfer layer

100‧‧‧熱轉印薄片 100‧‧‧Heat Transfer Sheet

200‧‧‧列印機 200‧‧‧Printer

201‧‧‧熱轉印薄片供給機構 201‧‧‧Thermal transfer sheet supply mechanism

202‧‧‧加熱機構 202‧‧‧Heating mechanism

203‧‧‧熱轉印薄片捲取機構 203‧‧‧Heat transfer sheet winding mechanism

204‧‧‧測定機構 204‧‧‧Measuring organization

205‧‧‧剝離機構 205‧‧‧Stripping mechanism

206‧‧‧壓輥 206‧‧‧Press roller

300‧‧‧被轉印體 300‧‧‧Subject to be transferred

Claims (2)

一種熱轉印薄片,其特徵係轉印層位於基材之一面上者,前述轉印層呈現僅由接受層所成之單層構成或包含位於轉印界面之接受層之層合構成,前述接受層含有纖維素乙酸酯丁酸酯及纖維素乙酸酯丙酸酯之任一者或兩者,與氯乙烯-乙酸乙烯酯共聚物。 A thermal transfer sheet, characterized in that the transfer layer is located on one surface of the substrate, and the transfer layer is composed of a single layer composed of only the receiving layer or a laminated structure including the receiving layer at the transfer interface. The receiving layer contains either or both of cellulose acetate butyrate and cellulose acetate propionate, and a vinyl chloride-vinyl acetate copolymer. 如請求項1之熱轉印薄片,其中前述接受層進一步含有矽氧油。 The thermal transfer sheet of claim 1, wherein the receiving layer further contains silicone oil.
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