TWI722244B - Electronic parts - Google Patents
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- TWI722244B TWI722244B TW106132522A TW106132522A TWI722244B TW I722244 B TWI722244 B TW I722244B TW 106132522 A TW106132522 A TW 106132522A TW 106132522 A TW106132522 A TW 106132522A TW I722244 B TWI722244 B TW I722244B
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- 239000004020 conductor Substances 0.000 claims abstract description 359
- 239000012212 insulator Substances 0.000 claims abstract description 10
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
本發明之目的在於使機械性強度提高。 本發明之電子零件具備:素體部10,其包含呈長方體形狀之絕緣體;內部導體30,其設置於素體部10之內部;及外部電極50,其至少設置於素體部10之下表面14(安裝面),且電氣連接於內部導體30;且素體部10具有:導體含有層20,其設置有成為內部導體30中發揮電氣性能之部分的線圈導體36(功能部);及高硬度層22,其沿平行於素體部10之下表面14(安裝面)之方向並列設置於導體含有層20,且具有較導體含有層20更高之硬度。The object of the present invention is to improve the mechanical strength. The electronic component of the present invention includes: an element body portion 10 including an insulator having a rectangular parallelepiped shape; an internal conductor 30 provided inside the element body portion 10; and an external electrode 50 provided on at least the lower surface of the element body portion 10 14 (mounting surface) and electrically connected to the inner conductor 30; and the element body portion 10 has: a conductor containing layer 20 provided with a coil conductor 36 (functional portion) that becomes a part of the inner conductor 30 that exerts electrical performance; and The hardness layer 22 is juxtaposed on the conductor-containing layer 20 in a direction parallel to the lower surface 14 (mounting surface) of the element body portion 10 and has a higher hardness than the conductor-containing layer 20.
Description
本發明係關於一種電子零件。 The present invention relates to an electronic component.
已知有一種將設置於呈長方體形狀之絕緣體內部之內部導體電氣連接於設置於絕緣體表面之外部電極的電子零件。對於高頻電路所使用之電子零件,謀求小型化與高頻特性之改善。例如,已知有於線圈導體設置於絕緣體之內部之電子零件中,藉由將線圈軸設為平行於絕緣體之安裝面且與形成於絕緣體之端面之一對外部電極之對向方向垂直,而降低因高頻電阻造成之損失,並獲得高Q值(例如專利文獻1)。 There is known an electronic component that electrically connects an internal conductor provided inside an insulator having a rectangular parallelepiped shape to an external electrode provided on the surface of the insulator. For electronic parts used in high-frequency circuits, miniaturization and improvement of high-frequency characteristics are sought. For example, it is known that in electronic parts in which a coil conductor is arranged inside an insulator, by setting the coil axis parallel to the mounting surface of the insulator and perpendicular to the opposing direction of one of the end faces of the insulator to the external electrode, and Reduce the loss due to high-frequency resistance, and obtain a high Q value (for example, Patent Document 1).
[專利文獻1]日本專利特開2013-98356號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2013-98356
例如,於如專利文獻1般於包含絕緣體之素體部之內部設置有線圈導體之電子零件中,為了獲得高Q值,考慮對素體部使用介電常數較低之絕緣材料。然而,於使用低介電常數之絕緣材料之情形,素體部之機械性強度降低,容易產生裂紋等。
For example, in an electronic component in which a coil conductor is provided inside an element body portion including an insulator as in
本發明係鑑於上述課題而完成者,其目的在於使機械性強度提高。 The present invention was made in view of the above-mentioned problems, and its object is to improve the mechanical strength.
本發明係一種電子零件,其具備:素體部,其包含呈長方體形狀之絕緣體;內部導體,其設置於上述素體部之內部;及外部電極,其至少設置於上述素體部之安裝面,且電氣連接於上述內部導體;且上述素體部具有:導體含有層,其設置有成為上述內部導體中發揮電氣性能之部分的功能部;及高硬度層,其沿平行於上述安裝面之方向並列設置於上述導體含有層,且具有較上述導體含有層更高之硬度。 The present invention is an electronic component comprising: an element body portion including an insulator having a rectangular parallelepiped shape; an internal conductor provided inside the element body portion; and external electrodes provided at least on the mounting surface of the element body portion , And electrically connected to the internal conductor; and the element body part has: a conductor-containing layer provided with a functional part that becomes a part of the internal conductor that exerts electrical performance; and a high-hardness layer along a line parallel to the mounting surface The direction is arranged side by side on the conductor-containing layer, and has a higher hardness than the conductor-containing layer.
於上述構成中,可構成為上述高硬度層與上述導體含有層相比,包含金屬氧化物及氧化矽中至少一者之填料之含有率更高。 In the above configuration, the high hardness layer may have a higher content of filler containing at least one of metal oxide and silicon oxide than the conductor containing layer.
於上述構成中,可構成為上述素體部具有複數個上述高硬度層,且上述複數個高硬度層夾著上述導體含有層而設置。 In the above configuration, the element body portion may have a plurality of the high hardness layers, and the plurality of high hardness layers may be provided with the conductor containing layer interposed therebetween.
於上述構成中,可構成為上述高硬度層沿平行於上述素體部之上述安裝面與鄰接於上述素體部之上述安裝面之端面之方向,並列設置於上述導體含有層。 In the above configuration, the high hardness layer may be arranged in parallel to the conductor-containing layer in a direction parallel to the mounting surface of the element body portion and the end surface of the mounting surface adjacent to the element body portion.
於上述構成中,可構成為於上述端面中上述導體含有層相對於上述高硬度層凹陷,且上述外部電極自上述素體部之上述安裝面延伸至上述端面,且於上述端面中至少設置於上述導體含有層。 In the above configuration, the conductor-containing layer in the end surface may be recessed with respect to the high hardness layer, and the external electrode may extend from the mounting surface of the element body portion to the end surface, and be provided in the end surface at least The above-mentioned conductor contains a layer.
於上述構成中,可構成為上述外部電極於上述端面中僅設置於上述導體含有層及上述高硬度層中之上述導體含有層。 In the above configuration, it may be configured that the external electrode is provided only in the conductor-containing layer and the conductor-containing layer in the high-hardness layer in the end surface.
於上述構成中,可構成為於上述導體含有層與上述高硬度層並列之方向上,上述導體含有層較上述高硬度層更厚。 In the above configuration, it may be configured that the conductor-containing layer is thicker than the high-hardness layer in the direction in which the conductor-containing layer and the high-hardness layer are juxtaposed.
於上述構成中,可構成為上述內部導體具有線圈導體作為上述功能部。 In the above configuration, the internal conductor may have a coil conductor as the functional part.
於上述構成中,可構成為上述線圈導體僅設置於上述導體含有層及 上述高硬度層中之上述導體含有層。 In the above configuration, it may be configured that the coil conductor is provided only in the conductor containing layer and The conductor-containing layer in the high-hardness layer.
於上述構成中,可構成為上述導體含有層與上述高硬度層相比,介電常數更低。 In the above configuration, the conductor-containing layer may have a lower dielectric constant than the high hardness layer.
於上述構成中,可構成為上述導體含有層及上述高硬度層以包含玻璃或樹脂之材料構成,且作為構成上述導體含有層之材料成分之矽之含有率較作為構成上述高硬度層之材料成分之矽之含有率更高。 In the above configuration, the conductor-containing layer and the high-hardness layer may be made of a material containing glass or resin, and the content of silicon as a material component of the conductor-containing layer is higher than that of the material that constitutes the high-hardness layer The silicon content of the ingredient is higher.
於上述構成中,可構成為上述線圈導體具有大致平行於上述安裝面之線圈軸。 In the above configuration, the coil conductor may have a coil axis substantially parallel to the mounting surface.
於上述構成中,可構成為上述功能部經由引出導體於上述素體部之上述安裝面或鄰接於上述安裝面之端面電氣連接於上述外部電極。 In the above configuration, the functional portion may be configured to be electrically connected to the external electrode via a lead conductor to the mounting surface of the element body portion or an end surface adjacent to the mounting surface.
於上述構成中,亦可構成為具備設置於上述素體部之標記部。 In the above configuration, it may be configured to include a marking portion provided on the element body portion.
根據本發明,可使機械性強度提高。 According to the present invention, the mechanical strength can be improved.
10:素體部 10: Body part
12:上表面 12: upper surface
14:下表面 14: lower surface
16:端面 16: end face
18:側面 18: side
20:導體含有層 20: Conductor contains layer
20a:導體含有層之第1層 20a: The first layer of the conductor containing layer
20b:導體含有層之第2層 20b: The second layer of the conductor containing layer
20c:導體含有層之第3層 20c: The third layer of the conductor containing layer
20d:導體含有層之第4層 20d: The fourth layer of the conductor containing layer
20e:導體含有層之第5層 20e: The fifth layer of the conductor containing layer
20f:導體含有層之第6層 20f: The 6th layer of the conductor containing layer
22:高硬度層 22: High hardness layer
22a:高硬度層之第1層 22a: The first layer of the high hardness layer
22b:高硬度層之第2層 22b: The second layer of the high hardness layer
22c:高硬度層之第3層 22c: The third layer of the high hardness layer
22d:高硬度層之第4層 22d: The fourth layer of the high hardness layer
22e:高硬度層之第5層 22e: The fifth layer of the high hardness layer
22f:高硬度層之第6層 22f: The 6th layer of the high hardness layer
30:內部導體 30: internal conductor
32:第1導體 32: The first conductor
32a:上側部分 32a: Upper part
32b:下側部分 32b: Lower part
34:第2導體 34: second conductor
36:線圈導體 36: coil conductor
38:引出導體 38: Lead out the conductor
40:導體圖案 40: Conductor pattern
42:通孔導體 42: Through-hole conductor
44C:字狀圖案 44C: word pattern
46:I字狀圖案 46: I-shaped pattern
50:外部電極 50: External electrode
60:平坦電極 60: Flat electrode
62:電容器部 62: Capacitor Department
70:焊盤 70: pad
80:標記部 80: marking department
90:支持基板 90: Support substrate
92:抗蝕劑膜 92: resist film
94:抗蝕劑膜 94: resist film
100:電子零件 100: electronic parts
110:電子零件 110: Electronic parts
120:抗蝕劑膜 120: resist film
130:電子零件 130: electronic parts
140:電子零件 140: electronic parts
200:電子零件 200: electronic parts
300:電子零件 300: electronic parts
400:電子零件 400: electronic parts
410:電子零件 410: Electronic Parts
420:電子零件 420: electronic parts
500:電子零件 500: electronic parts
600:電子零件 600: electronic parts
700:電子零件 700: electronic parts
800:電子零件 800: electronic parts
810:電子零件 810: Electronic parts
900:電子零件 900: electronic parts
910:電子零件 910: electronic parts
920:電子零件 920: electronic parts
1000:電子零件 1000: Electronic parts
G1~G16:生胚片材 G1~G16: raw embryo sheet
R:曲率半徑 R: radius of curvature
X:方向 X: direction
Y:方向 Y: direction
Z:方向 Z: direction
圖1係實施例1之電子零件之透視立體圖。 Fig. 1 is a perspective view of the electronic component of the first embodiment.
圖2(a)係實施例1之電子零件之俯視剖視圖,圖2(b)係側視剖視圖,圖2(c)係剖面剖視圖。
Fig. 2(a) is a top cross-sectional view of the electronic component of
圖3(a)至圖3(f)係顯示實施例1之電子零件之製造方法之剖視圖(其l)。 3(a) to 3(f) are cross-sectional views showing the manufacturing method of the electronic component of Embodiment 1 (Part 1).
圖4(a)至圖4(d)係顯示實施例1之電子零件之製造方法之剖視圖(其2)。 4(a) to 4(d) are cross-sectional views showing the manufacturing method of the electronic component of Embodiment 1 (No. 2).
圖5係比較例1之電子零件之透視立體圖。 FIG. 5 is a perspective perspective view of the electronic component of Comparative Example 1. FIG.
圖6係實施例1之變化例1之電子零件之透視立體圖。
FIG. 6 is a perspective perspective view of the electronic component of
圖7(a)至圖7(c)係實施例1之變化例2至變化例4之電子零件之俯視剖視圖。
7(a) to 7(c) are top cross-sectional views of the electronic components of the modification 2 to the
圖8係實施例2之電子零件之透視立體圖。 Fig. 8 is a perspective view of the electronic component of the second embodiment.
圖9係實施例3之電子零件之透視立體圖。 Fig. 9 is a perspective view of the electronic component of the third embodiment.
圖10(a)係實施例4之電子零件之透視立體圖,圖10(b)係俯視剖視圖。 Fig. 10(a) is a perspective perspective view of the electronic component of the fourth embodiment, and Fig. 10(b) is a top sectional view.
圖11係說明C字狀圖案與I字狀圖案之圖。 FIG. 11 is a diagram illustrating a C-shaped pattern and an I-shaped pattern.
圖12係顯示實施例4之電子零件之製造方法之圖。 FIG. 12 is a diagram showing the manufacturing method of the electronic component of the fourth embodiment.
圖13(a)及圖13(b)係對電子零件之安裝試驗進行說明之圖。 Fig. 13(a) and Fig. 13(b) are diagrams explaining the mounting test of electronic parts.
圖14(a)係實施例4之變化例1之電子零件之透視立體圖,圖14(b)係自素體部之上表面側觀察之圖,圖14(c)係自素體部之端面側觀察之圖。
Fig. 14(a) is a perspective perspective view of the electronic component of
圖15係實施例4之變化例2之電子零件之俯視剖視圖。
15 is a top cross-sectional view of the electronic component of Modification 2 of
圖16(a)係實施例5之電子零件之俯視剖視圖,圖16(b)係側視剖視圖,圖16(c)係剖面剖視圖。 Fig. 16(a) is a top cross-sectional view of the electronic component of the fifth embodiment, Fig. 16(b) is a side cross-sectional view, and Fig. 16(c) is a cross-sectional view.
圖17(a)係實施例6之電子零件之俯視剖視圖,圖17(b)係側視剖視圖,圖17(c)係剖面剖視圖。 Fig. 17(a) is a top cross-sectional view of the electronic component of the sixth embodiment, Fig. 17(b) is a side cross-sectional view, and Fig. 17(c) is a cross-sectional view.
圖18係顯示實施例6之電子零件之製造方法之圖(其1)。 Fig. 18 is a diagram showing the manufacturing method of the electronic component of the sixth embodiment (No. 1).
圖19(a)及圖19(b)係顯示實施例6之電子零件之製造方法(其2)。 Figures 19(a) and 19(b) show the manufacturing method of the electronic component of the sixth embodiment (No. 2).
圖20(a)係實施例7之電子零件之俯視剖視圖,圖20(b)係側視剖視圖,圖20(c)係剖面剖視圖。 Fig. 20(a) is a top cross-sectional view of the electronic component of the seventh embodiment, Fig. 20(b) is a side cross-sectional view, and Fig. 20(c) is a cross-sectional view.
圖21(a)係實施例8之電子零件之透視立體圖,圖21(b)係實施例8之變化例1之電子零件之透視立體圖。
FIG. 21(a) is a perspective perspective view of the electronic component of Embodiment 8, and FIG. 21(b) is a perspective perspective view of the electronic component of
圖22(a)至圖22(n)係顯示外部電極形狀之其他例之透視立體圖。 22(a) to 22(n) are perspective perspective views showing other examples of the shape of the external electrode.
圖23(a)係實施例9之電子零件之透視立體圖,圖23(b)係俯視剖視圖。 Fig. 23(a) is a perspective perspective view of the electronic component of Example 9, and Fig. 23(b) is a top sectional view.
圖24(a)係實施例9之變化例1之電子零件之透視立體圖,圖24(b)係實施例9之變化例2之電子零件之透視立體圖。
FIG. 24(a) is a perspective perspective view of the electronic component of the
以下,參照圖式,對本發明之實施例進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
圖1係實施例1之電子零件之透視立體圖。圖2(a)係實施例1之電子零件之俯視剖視圖,圖2(b)係側視剖視圖,圖2(c)係剖面剖視圖。如圖1至圖2(c)所示,實施例1之電子零件100具備包含絕緣體之素體部10、內部導體30、及外部電極50。
Fig. 1 is a perspective view of the electronic component of the first embodiment. Fig. 2(a) is a top cross-sectional view of the electronic component of
素體部10具有第2面即上表面12、第1面即下表面14、一對端面16、及一對側面18,且呈具有以X軸方向為寬度方向、Y軸方向為長度方向、Z軸方向為高度方向之各邊之長方體形狀。下表面14為安裝面,上表面12為與下表面14對向之面。端面16為連接於上表面12及下表面14之一對邊(例如短邊)之面,側面18為連接於上表面12及下表面14之一對邊(例如長邊)之面。素體部10係例如寬度尺寸為0.05mm~0.3mm,長度尺寸為0.1mm~0.6mm,高度尺寸為0.05mm~0.5mm。即便於例如將高度尺寸設得較長度尺寸及寬度尺寸小之情形,亦可提高零件之機械性強度。另,素體部10不限於完全長方體形狀之情形,亦可為例如各頂點帶弧度時、或各稜(各面之邊界部)帶弧度時、或各面具有曲面時等之大致長方體形狀。即,長方體形狀亦包含如上述般之大致長方體形狀。另,各頂點之弧度亦可為未達素體部10之短邊長度之20%之曲率半徑R。關於下表面14與端面
16所成之稜部之弧度,亦可將高硬度層22部分之弧度設得較導體含有層20部分之弧度更小。藉此,安裝時之姿勢之穩定性提高。各面之平滑性亦可根據對安裝基板安裝時之穩定性之點,使一平面中之凹凸之大小在30μm以下。
The
內部導體30設置於素體部10之內部。素體部10具有:導體含有層20,其至少設置有內部導體30中發揮電氣性能之功能部;及高硬度層22,其未設置內部導體30中之功能部。導體含有層20與高硬度層22並列設置於X軸方向(寬度方向)。高硬度層22以自X軸方向(寬度方向)夾著導體含有層20之方式設置,構成側面18。於X軸方向上,導體含有層20較高硬度層22更厚。
The
此處,素體部10之機械性強度主要依據高硬度層22而定。因此,基於藉由使高硬度層22變高(於Z軸方向上延長)可確保機械性強度,高硬度層22之各尺寸係根據使用之材料而定。又,高硬度層22之各尺寸亦考慮電子零件之長度(Y軸方向之長度)及寬度(X軸方向之長度)。作為一例,於電子零件之長度較寬度更長,且導體含有層20與高硬度層22排列於素體部10之寬度方向(X軸方向)之情形,較佳為高硬度層22之高度較寬度更長。即,藉由將高硬度層22之寬度縮短由高度能夠確保機械性強度之量,可增大內置內部導體30之功能部之導體含有層20之比例。
Here, the mechanical strength of the
例如,X軸方向之導體含有層20之厚度為0.17mm,高硬度層22之厚度相應為0.03mm。Y軸方向及Z軸方向之高硬度層22之長度及高度係長度相對於高度之比例較小為佳。若該比例為2以下,則可設為如上述般導體含有層20與高硬度層22之厚度之比例。
For example, the thickness of the conductor-containing
Y軸方向及Z軸方向之導體含有層20之長度及高度亦可設為與高硬度
層22之長度及高度相同、或形成得略小。藉此,由高硬度層22保護導體含有層20。導體含有層20之長度及高度較高硬度層22之長度及高度,分別設為0μm~-60μm,藉此減小對安裝基板安裝時之噴嘴吸附及對安裝性之影響。
The length and height of the conductor-containing
導體含有層20及高硬度層22由例如以樹脂為主體之絕緣材料形成。作為樹脂,使用藉由熱、光、化學反應等硬化之樹脂,例如使用聚醯亞胺、環氧樹脂、或液晶聚合物等。又,導體含有層20及高硬度層22亦可由以玻璃為主成分之絕緣材料形成,或可以鐵氧體、介電質陶瓷、使用軟磁性合金粒子之磁性體、或混合磁性體粉之樹脂形成。
The conductor-containing
於以樹脂或玻璃等形成導體含有層20之情形時,亦可使高硬度層22之顏色較導體含有層20更濃、或使導體含有層20之透射度較高硬度層22更高,而產生絕緣材料之視覺性不同。藉此,可藉由根據圖像識別顏色、或根據透射度識別絕緣材料、或根據光之透射識別內部導體方向等,而識別電子零件之方向。藉此,可使生產步驟之排列作業變得容易,又,可降低對安裝基板安裝時之不良。
When the conductor-containing
高硬度層22具有較導體含有層20更高之硬度。例如,高硬度層22係於能夠以微小之面積測定硬度之維克氏硬度或努氏硬度上,較導體含有層20更高。作為一例,高硬度層22之維克氏硬度為650N/mm2,導體含有層20之維克氏硬度為400N/mm2。由於硬度與強度存在關聯,故高硬度層22具有較導體含有層20更高之硬度意指高硬度層22具有較導體含有層20更高之強度(機械性強度)。
The
導體含有層20與高硬度層22係若高硬度層22較導體含有層20硬度更高,則可以相同絕緣材料形成,亦可以不同絕緣材料形成。例如,高硬度
層22與導體含有層20相比,包含金屬氧化物及氧化矽(SiO2)之至少一者之填料之含有率(例如體積百分比)更高,藉此具有較導體含有層20更高之硬度。此處,填料意指作為粒子添加至絕緣材料中之強度構件。添加之填料作為粒子存在於玻璃或樹脂等非晶質部分之內部,可藉由SEM(Scanning Electron Microscope:掃描式電子顯微鏡)分析或TEM(Transmission Electron Microscope:穿透式電子顯微鏡)分析而觀察其之存在。藉由分別求出於以同一倍率觀察2層之畫面上,粒子狀之填料所佔之面積比例,可比較2層之填料含有量。作為有助於提高硬度之金屬氧化物,列舉例如氧化鋁(Al2O3)、氧化鋯(ZrO2)、氧化鍶(SrO)、及氧化鈦(TiO2)等。另,導體含有層20亦可具有包含金屬氧化物及SiO2之至少一者之填料,又可不具有。
If the conductor-containing
導體含有層20及高硬度層22可分別使用相同主成分之材料、或使用不同主成分之材料。於使用不同材料之情形時,導體含有層20與高硬度層22係以材料彼此互不影響之方式,以調整焙燒製程或焙燒後接著而貼合等之方法形成素體部10。又,對導體含有層20與高硬度層22使用相同主成分之材料之情形時,容易確保導體含有層20與高硬度層22之界面之密著性,又可減小各自之線膨脹係數之差。藉此,可確保作為素體部10整體之強度,又可確保熱循環試驗等之可靠性。又,於跨及導體含有層20與高硬度層22形成外部電極50之情形時,亦可藉由相同之評估進行相對於導體含有層20與高硬度層22之外部電極50評估,不僅容易選定外部電極50,亦理所當然地容易確保密著性。此係尤其於可靠性之方面上亦可獲得同樣之效果。
The conductor-containing
導體含有層20之介電常數較高硬度層22小。例如,作為構成導體含
有層20之材料成分之矽(Si)(即,並非作為填料之SiO2等中之Si)之含有率(例如重量百分比)較作為構成高硬度層22之材料成分之Si之含有率(例如重量百分比)高,藉此導體含有層20之介電常數較高硬度層22小。例如,作為構成導體含有層20之玻璃或樹脂等之成分的Si之含有率較作為構成高硬度層22之玻璃或樹脂等之成分的Si之含有率高。
The dielectric constant of the conductor-containing
內部導體30具有複數個第1導體32與複數個第2導體34,且藉由將該等複數個第1導體32與複數個第2導體34連接而形成有線圈導體36。即,線圈導體36包含複數個第1導體32與複數個第2導體34而構成且呈螺旋狀,具有特定之環繞單位且具有與環繞單位所規定之面大致正交之線圈軸。線圈導體36為內部導體30中發揮電氣性能之功能部。
The
複數個第1導體32以大致於Y軸方向相互對向之2個導體群構成。構成2個導體群各者之第1導體32沿著Z軸方向延伸,且於X軸方向空開特定間隔而排列。複數個第2導體34平行地形成於XY平面,以於Z軸方向相互對向之2個導體群構成。構成2個導體群之各者之第2導體34沿著Y軸方向延伸,且於X軸方向空開間隔而排列,並於第1導體32間各自連接。藉此,於素體部10之內部形成有於X軸方向具有線圈軸之開口為矩形形狀之線圈導體36。即,線圈導體36於大致平行於素體部10之下表面14之方向具有線圈軸,且呈縱向捲繞。另,大致平行亦包含自X軸方向略微傾斜之情形。
The plurality of
外部電極50為表面安裝用之外部端子,與Y軸方向對向而設置有2個。外部電極50自素體部10之下表面14延伸至端面16而設置,被覆下表面14之一部分及端面16之一部分。即,外部電極50呈L字型形狀。外部電極50例如僅形成於導體含有層20之表面,而未形成於高硬度層22之表
面。又,外部電極50亦可跨及例如導體含有層20之表面及高硬度層22之表面而形成。
The
內部導體30除了作為包含複數個第1導體32及複數個第2導體34之功能部之線圈導體36以外,還具有非功能部即引出導體38。引出導體38配置於與位於素體部10之下表面14側之第2導體34同一XY平面上,且平行地設置於Y軸方向。線圈導體36經由引出導體38於素體部10之下表面14(安裝面)或端面16電氣連接於外部電極50。
In addition to the
內部導體30以例如銅(Cu)、鋁(Al)、鎳(Ni)、銀(Ag)、鉑(Pt)、或鈀(Pd)等金屬材料、或包含該等之合金金屬材料形成。外部電極50以例如銀(Ag)、銅(Cu)、鋁(Al)、或鎳(Ni)等金屬材料、或銀(Ag)、銅(Cu)、或鋁(Al)與鍍鎳(Ni)與鍍錫(Sn)之積層膜、或鎳(Ni)與鍍錫(Sn)之積層膜形成。
The
接著,對實施例1之電子零件100之製造方法進行說明。實施例1之電子零件100以晶圓級別同時製作複數個,並於製作後單片化為每個元件。又,實施例1之電子零件100自素體部10之上表面12側依序形成。
Next, the manufacturing method of the
圖3(a)至圖4(d)係顯示實施例1之電子零件之製造方法之剖視圖。圖3(a)至圖3(c)、圖4(a)、圖4(b)係相當於實施例1之電子零件之側視剖面之圖,圖3(d)至圖3(f)、圖4(c)、圖4(d)係相當於端面剖面之圖。如圖3(a)及圖3(d)所示,於例如矽基板、玻璃基板、或藍寶石基板等支持基板90上,印刷或塗佈例如樹脂材料、或使樹脂薄膜黏著,藉此形成導體含有層20之第1層20a、及夾著第1層20a而與第1層20a相接之高硬度層22之第1層22a。於導體含有層20之第1層20a上,藉由濺鍍法形成內部導體30之第2導體34,且形成被覆第2導體34之導體含有層20之第2層20b。於高硬度層
22之第1層22a上,形成夾著導體含有層20之第2層20b而與第2層20b相接之高硬度層22之第2層22b。導體含有層20之第2層20b及高硬度層22之第2層22b藉由印刷或塗佈樹脂材料、或使樹脂薄膜黏著而形成。隨後,藉由對導體含有層20之第2層20b及高硬度層22之第2層22b實施研磨處理,而使第2導體34之上表面露出。
3(a) to 4(d) are cross-sectional views showing the manufacturing method of the electronic component of the first embodiment. Figures 3(a) to 3(c), 4(a), and 4(b) are diagrams corresponding to the side cross-sections of the electronic components of Example 1, and Figures 3(d) to 3(f) , Figure 4 (c), Figure 4 (d) is equivalent to the end of the cross-sectional view. As shown in Figures 3(a) and 3(d), a
接著,於導體含有層20之第2層20b及高硬度層22之第2層22b上形成晶種層(未圖示)後,於晶種層上形成具有開口之抗蝕劑膜92。於抗蝕劑膜92之形成後,亦可進行去除開口內之抗蝕劑殘渣之除渣處理。隨後,藉由電鍍法而於抗蝕劑膜92之開口內形成第1導體32之上側部分32a。
Next, after forming a seed layer (not shown) on the
如圖3(b)及圖3(e)所示,於去除抗蝕劑膜92及晶種層後,形成被覆第1導體32之上側部分32a之導體含有層20之第3層20c、及夾著第3層20c而與第3層20c相接之高硬度層22之第3層22c。導體含有層20之第3層20c及高硬度層22之第3層22c藉由印刷或塗佈樹脂材料、或使樹脂薄膜黏著而形成。隨後,藉由對導體含有層20之第3層20c及高硬度層22之第3層22c實施研磨處理,而使第1導體32之上側部分32a之表面露出。
As shown in FIGS. 3(b) and 3(e), after removing the resist
如圖3(c)及圖3(f)所示,於導體含有層20之第3層20c上,形成第1導體32之下側部分32b、及被覆第1導體32之下側部分32b之導體含有層20之第4層20d。於高硬度層22之第3層22c上,形成夾著導體含有層20之第4層20d而與第4層20d相接之高硬度層22之第4層22d。第1導體32之下側部分32b以連接於第1導體32之上側部分32a之方式形成。第1導體32之下側部分32b、導體含有層20之第4層20d、及高硬度層22之第4層22d可藉由與第1導體32之上側部分32a、導體含有層20之第3層20c、及高硬度層22之第3層22c同樣之方法形成。
As shown in FIGS. 3(c) and 3(f), on the
如圖4(a)及圖4(c)所示,於導體含有層20之第4層20d及高硬度層22之第4層22d上形成晶種層(未圖示)、及具有開口之抗蝕劑膜94,且藉由電鍍法而於抗蝕劑膜94之開口內形成第2導體34及引出導體38(未圖示)。
As shown in FIGS. 4(a) and 4(c), a seed layer (not shown) is formed on the
如圖4(b)及圖4(d)所示,於去除抗蝕劑膜94及晶種層後,形成被覆第2導體34及引出導體38之導體含有層20之第5層20e、及夾著第5層20e而與第5層20e相接之高硬度層22之第5層22e。隨後,於導體含有層20之第5層20e及高硬度層22之第5層22e上,形成導體含有層20之第6層20f及高硬度層22之第6層22f。導體含有層20由第1層20a至第6層20f構成。高硬度層22由第1層22a至第6層22f構成。隨後,於素體部10之表面形成外部電極50。藉此,形成實施例1之電子零件100。
4(b) and 4(d), after removing the resist
圖5係比較例1之電子零件之透視立體圖。如圖5所示,於比較例1之電子零件1000中,素體部10不具有高硬度層22,而於實施例1中設置有高硬度層22之部分相當之部分具有導體含有層20。由於其他之構成與實施例1相同故省略說明。
FIG. 5 is a perspective perspective view of the electronic component of Comparative Example 1. FIG. As shown in FIG. 5, in the
發明者對實施例1及比較例1之電子零件進行彎曲試驗。彎曲試驗係藉由將電子零件安裝於安裝基板之上表面,並自安裝基板之下表面施加力使安裝基板彎曲,試驗此時是否於電子零件產生裂紋而進行。進行彎曲試驗之電子零件之大小係於實施例1及比較例1中相同,寬度為0.2mm,長度為0.4mm,高度為0.2mm。又,於實施例1中,於厚度為0.17mm,維克氏硬度為400N/mm2之導體含有層20之兩側設置有厚度0.015mm,維克氏硬度為650N/mm2之高硬度層22。
The inventor conducted a bending test on the electronic components of Example 1 and Comparative Example 1. The bending test is performed by mounting the electronic component on the upper surface of the mounting substrate, and applying force from the lower surface of the mounting substrate to bend the mounting substrate, and testing whether there is a crack in the electronic component at this time. The size of the electronic component subjected to the bending test is the same as in Example 1 and Comparative Example 1, with a width of 0.2 mm, a length of 0.4 mm, and a height of 0.2 mm. Furthermore, in Example 1, a high hardness layer with a thickness of 0.015 mm and a Vickers hardness of 650 N/mm 2 is provided on both sides of the conductor-containing
於表1顯示彎曲試驗之試驗結果。如表1所示,於將安裝基板之彎曲量設為2mm之情形時,於實施例1中,進行試驗之10片晶片全部未產生裂
紋,相對於此,於比較例1中,10片晶片中3片晶片產生裂紋。於將安裝基板之彎曲量設為4mm之情形時,於實施例1中,10片晶片全部未產生裂紋,相對於此,於比較例1中,10片晶片全部產生裂紋。如此,實施例1與比較例1相比,結果,可抑制裂紋之產生。此係認為於實施例1中與導體含有層20並列地設置有高硬度層22之故。
Table 1 shows the test results of the bending test. As shown in Table 1, when the bending amount of the mounting substrate is set to 2mm, in Example 1, all 10 wafers tested did not have cracks.
On the other hand, in Comparative Example 1, cracks occurred in 3 wafers out of 10 wafers. When the bending amount of the mounting substrate was 4 mm, in Example 1, all 10 wafers had no cracks. In contrast, in Comparative Example 1, all 10 wafers had cracks. In this way, Example 1 is compared with Comparative Example 1, and as a result, the occurrence of cracks can be suppressed. This is considered to be because the high-
如以上所示,根據實施例1,素體部10具有設置有線圈導體36(功能部)之導體含有層20、及於平行於素體部10之下表面14(安裝面)之方向並列設置於導體含有層20之高硬度層22。如此,藉由將具有較導體含有層20更高硬度之高硬度層22於平行於素體部10之下表面14之方向並列設置於導體含有層20,而如表1所說明,可抑制彎曲試驗之裂紋之產生,並可使素體部10之機械性強度提高。
As described above, according to the first embodiment, the
又,根據實施例1,高硬度層22與導體含有層20相比,包含金屬氧化物及SiO2之至少一者之填料之含有率更高。藉此,較導體含有層20,可更容易提高高硬度層22之硬度,故可容易地使素體部10之機械性強度提高。
Furthermore, according to Example 1, the high-
又,根據實施例1,線圈導體36設置於導體含有層20之內部,而未設置於高硬度層22之內部。藉此,可以適於線圈導體36之電氣特性之材料形成導體含有層20而改善電氣特性,且使素體部10之機械性強度提高。
Furthermore, according to the first embodiment, the
又,根據實施例1,於內部具有線圈導體36之導體含有層20與高硬度
層22相比,介電常數更低。藉此,可使線圈導體36之導體間之寄生電容降低,使自振頻率提高,因此,可使Q值提高。例如,導體含有層20與高硬度層22相比,作為構成層之材料成分之Si之含有率更高,藉此亦可使介電常數低於高硬度層22。又,於導體含有層20之介電常數低於高硬度層22之情形時,根據提高Q值之點,較佳為線圈導體36設置於導體含有層20之內部,而不設置於高硬度層22之內部。
Furthermore, according to the first embodiment, the
又,根據實施例1,線圈導體36於大致平行於素體部10之下表面14(安裝面)之方向具有線圈軸。例如,於垂直於素體部10之下表面14(安裝面)之方向具有線圈軸之情形時,因流通於線圈導體之交流電流引起之磁通變化,而有於安裝電子零件之安裝基板上產生渦電流之情形。於該情形時,會導致Q值降低。然而,於大致平行於素體部10之下表面14(安裝面)之方向具有線圈軸之情形時,可抑制於安裝基板上產生渦電流,而抑制Q值之降低。
Furthermore, according to the first embodiment, the
圖6係實施例1之變化例1之電子零件之透視立體圖。如圖6所示,於實施例1之變化例1之電子零件110中,外部電極50僅設置於素體部10之下表面14之Y軸方向兩端,而未設置於端面16。線圈導體36經由引出導體38而於素體部10之下表面14電氣連接於外部電極50。由於其他構成與實施例1相同故省略說明。
FIG. 6 is a perspective perspective view of the electronic component of
於實施例1中,如圖1所示,線圈導體36經由引出導體38而於素體部10之端面16電氣連接於外部電極50,但如實施例1之變化例1所示,線圈導體36亦可經由引出導體38而於素體部10之下表面14(安裝面)電氣連接於外部電極50。又,藉由將外部電極50僅設置於素體部10之下表面14,而使線圈導體36於素體部10之下表面14電氣連接於外部電極50,可減小外
部電極50與內部導體30之間之寄生電容。
In the first embodiment, as shown in FIG. 1, the
另,雖省略圖示,但線圈導體36亦可經由引出導體38而於素體部10之側面18電氣連接於外部電極50。
In addition, although illustration is omitted, the
圖7(a)至圖7(c)係實施例1之變化例2至變化例4之電子零件之俯視剖視圖。如圖7(a)所示,於實施例1之變化例2之電子零件120中,導體含有層20靠近素體部10之一對側面18中之一者而設置。因此,夾著導體含有層20之高硬度層22中之一者與另一者相比,X軸方向之厚度變薄。由於其他構成與實施例1相同故省略說明。
7(a) to 7(c) are top cross-sectional views of the electronic components of the modification 2 to the
於實施例1中,例示導體含有層20設置於素體部10之一對側面18間之中央之情形,但亦可如實施例1之變化例2所示,將導體含有層20靠近一對側面18中之一者而設置。於該情形時,可根據夾著導體含有層20之高硬度層22之厚度差異而識別電子零件之方向。
In
如圖7(b)所示,於實施例1之變化例3之電子零件130中,於內部具有線圈導體36(功能部)之導體含有層20設置於素體部10之內部,且覆蓋導體含有層20之周圍而設置有高硬度層22。內部導體30中之非功能部即引出導體38設置於高硬度層22。由於其他構成與實施例1相同故省略說明。
As shown in FIG. 7(b), in the
於實施例1中,例示導體含有層20自素體部10之一對端面16之一者延伸至另一者設置之情形,但亦可如實施例1之變化例3所示,將導體含有層20設置於素體部10之內部。於該情形時,由於包圍導體含有層20而設置高硬度層22,故可進一步提高機械性強度。又,即便將非功能部即引出導體38設置於高硬度層22,對電氣特性之影響亦較小。
In
如圖7(c)所示,於實施例1之變化例4之電子零件140中,於X軸方向上,導體含有層20較高硬度層22更薄。由於其他之構成與實施例1相同故
省略說明。
As shown in FIG. 7(c), in the
於實施例1中,例示於X軸方向上導體含有層20較高硬度層22更厚之情形,但亦可如實施例1之變化例4所示,於X軸方向上,使導體含有層20較高硬度層22更薄。於導體含有層20較高硬度層22更厚之情形時,由於可增大線圈導體36,故可增大電感值。另一方面,於高硬度層22較導體含有層20更厚之情形時,可提高素體部10之機械性強度。
In Example 1, the case where the conductor-containing
圖8係實施例2之電子零件之透視立體圖。如圖8所示,於實施例2之電子零件200中,僅於導體含有層20之單側設置高硬度層22,於與實施例1中設置有高硬度層22之另一側相當之部分設置有導體含有層20。由於其他構成與實施例1相同故省略說明。
Fig. 8 is a perspective view of the electronic component of the second embodiment. As shown in FIG. 8, in the
發明者對實施例2之電子零件進行彎曲試驗。彎曲試驗以與實施例1中說明之方法相同之方法進行,電子零件之尺寸等設為與實施例1時相同。於表2顯示彎曲試驗之試驗結果。另,為了比較,亦顯示有表1所示之比較例1之試驗結果。 The inventor conducted a bending test on the electronic component of Example 2. The bending test was performed in the same manner as the method described in Example 1, and the dimensions of the electronic components were set to be the same as in Example 1. Table 2 shows the test results of the bending test. In addition, for comparison, the test results of Comparative Example 1 shown in Table 1 are also shown.
如表2所示,於將安裝基板之彎曲量設為2mm之情形時,於實施例2中,進行試驗之10片晶片全部未產生裂紋。於將安裝基板之彎曲量設為4mm之情形時,於實施例2中,10片晶片中的2片晶片產生了裂紋。 As shown in Table 2, when the bending amount of the mounting substrate was set to 2 mm, in Example 2, no cracks occurred in all 10 wafers tested. When the bending amount of the mounting substrate was 4 mm, in Example 2, 2 of the 10 wafers had cracks.
如實施例2所示,若於平行於素體部10之下表面14(安裝面)之方向與
導體含有層20並列設置有高硬度層22,則即便於僅於導體含有層20之單側設置有高硬度層22之情形,亦可使素體部10之機械性強度提高。又,根據表1及表2之試驗結果,可知基於使素體部10之機械性強度提高之點,較佳夾著導體含有層20而設置高硬度層22。
As shown in the second embodiment, if the direction parallel to the lower surface 14 (mounting surface) of the
圖9係實施例3之電子零件之透視立體圖。另,於圖9中,由於內部導體30採用與實施例1相同之構造,故於圖9中省略圖示。如圖9所示,於實施例3之電子零件300中,外部電極50自素體部10之下表面14經由端面16延伸至上表面12且自端面16延伸至側面18而設置。即,外部電極50被覆端面16之整面、上表面12、下表面14、及側面18之一部分。由於其他構成與實施例1相同故省略說明。
Fig. 9 is a perspective view of the electronic component of the third embodiment. In addition, in FIG. 9, since the
發明者對實施例3之電子零件進行彎曲試驗。彎曲試驗以與實施例1中說明之方法相同之方法進行,故電子零件之尺寸等設為與實施例1時相同。於表3顯示彎曲試驗之試驗結果。另,為了比較,亦顯示表1所示之比較例1之試驗結果。 The inventor conducted a bending test on the electronic component of Example 3. The bending test was carried out in the same way as the method described in Example 1, so the dimensions of the electronic parts etc. were set to be the same as in Example 1. Table 3 shows the test results of the bending test. In addition, for comparison, the test results of Comparative Example 1 shown in Table 1 are also shown.
如表3所示,於將安裝基板之彎曲量設為2mm、4mm之任一情形時,於實施例3中,進行試驗之10片晶片均未產生裂紋。 As shown in Table 3, when the bending amount of the mounting substrate was set to either 2 mm or 4 mm, in Example 3, no cracks occurred in the 10 wafers tested.
基於實施例1至實施例3之彎曲試驗之結果,可知若於平行於素體部10之下表面14(安裝面)之方向與導體含有層20並列設置有高硬度層22,則
無論將外部電極50設為何種形狀,均可提高素體部10之機械性強度。
Based on the results of the bending test of Examples 1 to 3, it can be seen that if the
圖10(a)係實施例4之電子零件之透視立體圖,圖10(b)係俯視剖視圖。如圖10(a)及圖10(b)所示,於實施例4之電子零件400中,內部導體30具有導體圖案40、通孔導體42、及引出導體38。又,於端面16中,導體含有層20較高硬度層22更為凹陷。因其他構成與實施例1相同,故於以下對內部導體30進行說明,且省略其他說明。
Fig. 10(a) is a perspective perspective view of the electronic component of the fourth embodiment, and Fig. 10(b) is a top sectional view. As shown in FIGS. 10(a) and 10(b), in the
於內部導體30中,通孔導體42電氣連接於複數個導體圖案40。導體圖案40包含例如C字狀圖案44與I字狀圖案46。
In the
圖11係說明C字狀圖案與I字狀圖案之圖。如圖11所示,C字狀圖案44為具有3個以上頂點之多角形導體圖案。例如,C字狀圖案44為大致矩形形狀即具有4個頂點且缺少該大致矩形形狀之一邊之一部分者。另,大致矩形形狀不限於如圖11般之矩形形狀,亦包含橢圓形狀者等可近似矩形之形狀。如圖11之情形所示,具有包含4個頂點的情形、或包含大致矩形形狀無明確之頂點時之近似矩形時可辨識為頂點之部位的情形。另,圖11之虛線顯示有形成通孔導體42之位置。
FIG. 11 is a diagram illustrating a C-shaped pattern and an I-shaped pattern. As shown in FIG. 11, the C-shaped
I字狀圖案46補足大致矩形狀中之C字狀圖案44所缺少之一邊之一部分。根據大致矩形形狀之實際形狀,I字狀圖案46亦可為如圖11所示之直線,或可為呈橢圓形狀之一部分之曲線形狀。藉由使用C字狀圖案44與I字狀圖案46之組合,可增加線圈導體之尺寸穩定化,實現電感之窄公差化。較佳為I字狀圖案46之長度較C字狀圖案44所缺少之部分之長度更長。藉此,可更確實地進行電氣連接。
The I-shaped
接著,對實施例4之電子零件400之製造方法進行說明。圖12係顯示
實施例4之電子零件之製造方法之圖。另,實施例4之電子零件400藉由自素體部10之一對側面18之一者跨及另一者積層有包含絕緣性材料之生胚片材而形成。
Next, the manufacturing method of the
如圖12所示,準備構成素體部10之絕緣體層之前驅體即生胚片材G1至G10。生胚片材藉由將例如以玻璃等為主原料之絕緣性材料漿料利用刮刀成形法等塗佈於薄膜上而形成。另,作為絕緣性材料,除了以玻璃為主成分之材料以外,亦可使用鐵氧體、介電質陶瓷、使用軟磁性合金材料之磁性體、或混合磁性體粉之樹脂等。生胚片材之厚度無特別限定,例如為5μm~60μm,作為一例為20μm。準備複數種使包含金屬氧化物之填料及矽之含有率不同之生胚片材。包含金屬氧化物之填料之含有率較高之生胚片材為生胚片材G1、G10,矽含有率較高之生胚片材為生胚片材G2~G9。
As shown in FIG. 12, green sheets G1 to G10, which are precursors of the insulating layer constituting the
於生胚片材G3~G7之特定位置,即於預定形成通孔導體42之位置,藉由雷射加工等形成通孔。且,於生胚片材G3~G8使用印刷法印刷導電性材料,藉此形成C字狀圖案44、I字狀圖案46、及通孔導體42。作為導電性材料之主成分列舉銀、銅等金屬。
At specific positions of the green sheets G3 to G7, that is, where the through-
接著,以特定之順序積層生胚片材G1~G10,並朝積層方向施加壓力而壓接生胚片材。接著,於將壓接之生胚片材以晶片單位切斷後,以特定溫度(例如700℃~900℃左右)進行焙燒,而形成素體部10。此時,由於生胚片材G1、G10與生胚片材G2~G9之包含金屬氧化物之填料及矽之含有率不同,故焙燒時之收縮率不同,其結果,如圖10(a)及圖10(b)所示,成為導體含有層20相對於高硬度層22凹陷之形狀。
Next, the green embryo sheets G1 to G10 are layered in a specific order, and pressure is applied to the lamination direction to press the green embryo sheets. Next, after the pressed green sheet is cut in units of wafers, it is fired at a specific temperature (for example, about 700° C. to 900° C.) to form the
接著,於素體部10之特定位置形成外部電極50。外部電極50藉由塗
佈以銀或銅等為主成分之電極糊料,並以特定溫度(例如600℃~900℃左右)進行焙燒,進而實施電鍍等而形成。作為該電鍍,可使用例如銅、鎳、或錫等。藉此,形成實施例4之電子零件400。
Next, the
發明者對實施例4之電子零件進行向安裝基板上安裝之試驗。圖13(a)及圖13(b)係對電子零件之安裝試驗進行說明之圖。圖13(a)係顯示有藉由使用焊料使電子零件400接合於安裝基板之焊盤70,而將電子零件400安裝於適當之位置的情形。相對於此,於安裝試驗中,如圖13(b)所示,藉由特地將電子零件400安裝於相對於焊盤70偏移50μm之位置,並確認此時之安裝狀態而進行。另,焊盤70呈縱向為0.2mm,橫向為0.15mm之長方形形狀。電子零件400之大小係寬度為0.2mm,長度為0.4mm,高度為0.2mm。
The inventor conducted a test of mounting the electronic component of Example 4 on a mounting board. Fig. 13(a) and Fig. 13(b) are diagrams explaining the mounting test of electronic parts. FIG. 13(a) shows a situation in which the
於表4顯示安裝試驗之試驗結果。另,為了比較,亦顯示有將比較例1之電子零件1000安裝於安裝基板上時之試驗結果。另,比較例1之電子零件1000之大小與實施例4之電子零件400相同。如表4所示,於實施例4中安裝不良產生率為0%,相對於此,於比較例1中安裝不良產生率為2.25%。另,安裝不良意指如晶片翹起現象(曼哈頓現象或豎碑現象等)般之情形。
Table 4 shows the test results of the installation test. In addition, for comparison, the test result when the
如此,實施例4與比較例1相比減少了安裝不良。其係認為基於以下之理由所致。即,於藉由利用焊料將電子零件之外部電極50接合於安裝基板之焊盤70而將電子零件安裝於安裝基板之情形時,來自安裝時熔融之焊
料之張力成為驅動力,故產生為了使設置於素體部10之各面之外部電極50所產生之張力平衡而使電子零件移動至安裝位置中央之自對準效應。藉由該自對準效應,可抑制安裝時之電子零件相對於安裝面之水平方向之旋轉、及零件翹起(如電子零件自單側之焊盤脫落而於另一焊盤側立起之現象)。
In this way, in Example 4, as compared with Comparative Example 1, installation failures were reduced. It is believed to be based on the following reasons. That is, when the electronic component is mounted on the mounting substrate by bonding the
自對準效應(自對準力)係焊料之量越多則越大,又,由於焊料係於外部電極50蔓延故外部電極50之面積越大則越大。於比較例1中,導體含有層20之端面16為平坦面,相對於此,於實施例4中,導體含有層20之端面16呈相對於高硬度層22凹陷之形狀。因此,於實施例4中,與比較例1相比,由於可使供給至焊盤70之焊料量增多且焊料所接合之外部電極50之面積較大,故自對準效應增大。又,於實施例4中,於素體部10之端面16中導體含有層20呈相對於高硬度層22凹陷之曲面形狀,因此設置於導體含有層20之外部電極50為曲面形狀。因此,藉由自對準力朝向安裝位置中央作用而容易將電子零件移動至適當之位置。基於該等,認為實施例4與比較例1相比減少了安裝不良。
The self-alignment effect (self-alignment force) is that the larger the amount of solder, the larger, and since the solder spreads on the
根據實施例4,於素體部10之端面16中,導體含有層20相對於高硬度層22凹陷。外部電極50自素體部10之下表面14延伸至端面16,且於端面16中至少設置於導體含有層20。藉此,可使將電子零件安裝於安裝基板時之自對準性提高。另,如實施例4所示,較佳為外部電極50僅於端面16中設置於導體含有層20而不設置於高硬度層22之情形。又,由於導體含有層20相對於高硬度層22凹陷,故於導體含有層20形成外部電極50時,可抑制外部電極50擴散形成至高硬度層22。即,可容易實現於導體含有層20之表面形成外部電極50,而不於高硬度層22形成外部電極50。
According to the fourth embodiment, in the
圖14(a)係實施例4之變化例1之電子零件之透視立體圖,圖14(b)係自上表面側觀察之圖,圖14(c)係自端面側觀察之圖。如圖14(a)至圖14(c)所示,於實施例4之變化例1之電子零件410中,外部電極50於素體部10之下表面14及端面16中設置於導體含有層20與高硬度層22兩者。於端面16中,外部電極50除了於導體含有層20呈曲面形狀以外,成為Z軸方向之高度以高硬度層22較導體含有層20變得更高之方式彎曲之形狀。又,於下表面14亦同樣,外部電極50呈彎曲之形狀。另,外部電極50亦可於素體部10之側面18超出。其他之構成因與實施例4相同,故省略說明。於實施例4之變化例1之情形,亦與實施例4同樣,可使自對準性提高。
Fig. 14(a) is a perspective perspective view of the electronic component of
圖15係實施例4之變化例2之電子零件之俯視剖視圖。如圖15所示,於實施例4之變化例2之電子零件420中,僅於導體含有層20之單側設置有高硬度層22。其他之構成因與實施例4相同,故省略說明。
15 is a top cross-sectional view of the electronic component of Modification 2 of
發明者對實施例4之變化例2之電子零件進行向安裝基板上安裝之試驗。安裝試驗以與實施例4中說明之方法相同之方法進行,故電子零件之尺寸等設為與實施例4時相同。於表5顯示安裝試驗之試驗結果。另,為了比較,亦顯示有表4所示之比較例1之試驗結果。
The inventor conducted a test of mounting the electronic component of the modification 2 of the
如表5所示,於實施例4之變化例2中安裝不良產生率為0.75%。
As shown in Table 5, the installation failure rate in the modification 2 of the
如實施例4之變化例2所示,即便僅於導體含有層20之單側設置有高硬度層22之情形,亦可使自對準性提高。根據表4及表5之試驗結果,可由提高自對準性之點得知較佳為夾著導體含有層20設置高硬度層22。
As shown in the modification 2 of the
圖16(a)係實施例5之電子零件之俯視剖視圖,圖16(b)係側視剖視圖,圖16(c)係剖面剖視圖。如圖16(a)至圖16(c)所示,於實施例5之電子零件500中,線圈導體36於Y軸方向(長度方向)具有線圈軸且開口呈矩形形狀。其他構成因與實施例1相同故省略說明。
Fig. 16(a) is a top cross-sectional view of the electronic component of the fifth embodiment, Fig. 16(b) is a side cross-sectional view, and Fig. 16(c) is a cross-sectional view. As shown in FIGS. 16(a) to 16(c), in the
於實施例1至實施例4中,例示有線圈導體36之線圈軸沿X軸方向縱向捲繞之情形,亦可如實施例5所示,為線圈導體36之線圈軸沿Y軸方向縱向捲繞之情形。
In Examples 1 to 4, the case where the coil axis of the
圖17(a)係實施例6之電子零件之俯視剖視圖,圖17(b)係側視剖視圖,圖17(c)係剖面剖視圖。如圖17(a)至圖17(c)所示,於實施例6之電子零件600中,設置有於Z軸方向(高度方向)具有線圈軸,且開口形狀為矩形形狀之線圈導體36。即,線圈導體36呈水平捲繞。線圈導體36自Z軸方向之素體部10之中央靠近上表面12側而設置。其他構成因與實施例1相同,故省略說明。
Fig. 17(a) is a top cross-sectional view of the electronic component of the sixth embodiment, Fig. 17(b) is a side cross-sectional view, and Fig. 17(c) is a cross-sectional view. As shown in FIGS. 17(a) to 17(c), the
圖18至圖19(b)係顯示實施例6之電子零件之製造方法之圖。圖19(a)及圖19(b)係相當於實施例6之電子零件之俯視剖面之圖。如圖18所示,準備導體含有層20之前驅體即複數片絕緣性之生胚片材G11~G16。關於生胚片材,因於實施例4說明故此處省略說明。
18 to 19(b) are diagrams showing the manufacturing method of the electronic component of the sixth embodiment. 19(a) and 19(b) are diagrams corresponding to the top cross-section of the electronic component of the sixth embodiment. As shown in FIG. 18, a plurality of insulating green sheets G11 to G16, which are precursors of the conductor-containing
於生胚片材G12~G15之特定位置,藉由雷射加工等形成通孔。接著,於生胚片材G12~G16,使用印刷法印刷導電性材料,藉此形成內部導體30。
At specific positions of the green sheet G12~G15, through holes are formed by laser processing. Next, a conductive material is printed on the green sheets G12 to G16 by a printing method, thereby forming the
接著,以特定之順序積層生胚片材G11~G16,並朝積層方向施加壓
力而壓接生胚片材。接著,於將壓接之生胚片材以晶片單位切斷後,以特定溫度(例如700℃~900℃左右)進行焙燒。藉此,如圖19(a)所示,形成於內部具有內部導體30之導體含有層20。
Next, layer the green sheets G11~G16 in a specific order, and apply pressure in the direction of the layering
Press the green sheet with force. Next, after the pressed green sheet is cut in units of wafers, it is fired at a specific temperature (for example, about 700°C to 900°C). Thereby, as shown in FIG. 19(a), the
接著,如圖19(b)所示,藉由於導體含有層20之兩側,印刷、或浸塗例如漿料或糊料、油墨等、或接著加工成片材狀者等,而形成高硬度層22。藉此,形成夾著導體含有層20而設置有高硬度層22之素體部10。隨後,於素體部10之特定位置形成外部電極50。藉此,形成實施例6之電子零件600。
Next, as shown in FIG. 19(b), by printing, or dipping, for example, paste, paste, ink, etc., on both sides of the conductor-containing
對於導體含有層20之形成係可採用如上所述於生胚片材形成通孔,進而形成內部導體部後,將以形成線圈之方式以特定順序積層、壓接生胚片材者焙燒而製作的方法、於絕緣層使用樹脂等利用薄膜法製作內部導體等而不進行焙燒的方法、於將成為內部導體之導體捲繞成線圈狀後,以樹脂等固定而不進行焙燒的方法。又,線圈之捲繞方向有垂直於安裝面而具有線圈軸之水平捲繞、及平行於安裝面而具有線圈軸,且線圈軸與安裝面之長度方向或寬度方向大致一致之2種縱向捲繞,亦可應用該3種捲繞方法中之任一種。
The conductor-containing
關於高硬度層22之形成,可以印刷、浸塗、或片材接著等進行,但根據該等所使用之漿料或糊料、油墨或接著劑、膠合劑等,有可進行焙燒之情形與無法進行焙燒之情形。於可進行焙燒之情形時,於導體含有層20之製作中進行焙燒之情形時,可採用同時進行焙燒之步驟順序,亦可採用分開進行各自之焙燒之步驟順序。於無法進行焙燒之情形時,不論是否於導體含有層20之製作中進行焙燒,均等到完成導體含有層20後,進行高硬度層22之形成。
Regarding the formation of the high-
於將高硬度層22附加、形成於導體含有層20時,藉由將複數個導體含有層20排列配置於黏著片材等,與單片化時分開附加、形成高硬度層22相比,可有效地進行附加、形成。
When the high-
於實施例1至實施例5中,線圈導體36為縱向捲繞,亦可如實施例6所示,線圈導體36為水平捲繞。又,根據實施例6,線圈導體36靠近素體部10之上表面12側而設置。藉此,由於線圈導體36與安裝面即下表面14分開配置,故可降低將電子零件搭載於安裝基板後,線圈導體36自安裝基板受到之寄生電容之影響,可抑制特性之變化。
In
圖20(a)係實施例7之電子零件之俯視剖視圖,圖20(b)係側視剖視圖,圖20(c)係剖面剖視圖。如圖20(a)至圖20(c)所示,於實施例7之電子零件700中,內部導體30包含複數個平坦電極60。複數個平坦電極60相互重疊之區域係成為內部導體30中發揮電氣性能之功能部之電容器部62。複數個平坦電極60中不相互重疊之區域相當於將電容器部62電氣連接於外部電極50之引出部。即,內部導體30具有:電容器部62,其作為包含複數個平坦電極60相互重疊之區域之功能部;及非功能部,其係複數個平坦電極60中未相互重疊之區域。因其他構成與實施例1相同,故省略說明。
Fig. 20(a) is a top cross-sectional view of the electronic component of the seventh embodiment, Fig. 20(b) is a side cross-sectional view, and Fig. 20(c) is a cross-sectional view. As shown in FIGS. 20(a) to 20(c), in the
於實施例1至實施例6中,例示有於內部導體30包含作為功能部之線圈導體36之情形,即電子零件為電感元件之情形,但並不限於此。亦可如實施例7所示,為內部導體30包含電容器部62作為功能部之情形,即電子零件為電容元件之情形。又,即便於包含電容器部62作為功能部之情形時,亦與圖6同樣,電容器部62可藉由引出導體而於素體部10之下表面14
電氣連接於外部電極50,亦可於素體部10之側面18電氣連接於外部電極50。
In
圖21(a)係實施例8之電子零件之透視立體圖,圖21(b)係實施例8之變化例1之電子零件之透視立體圖。如圖21(a)所示,於實施例8之電子零件800中,高硬度層22於Y軸方向(長度方向)上並列設置於導體含有層20。高硬度層22自Y軸方向(長度方向)夾著導體含有層20而設置於導體含有層20之兩側,並構成素體部10之端面16。於Y軸方向上,導體含有層20之厚度較高硬度層22更厚。內部導體30中之線圈導體36(功能部)設置於導體含有層20之內部。因其他構成與實施例1相同,故省略說明。如圖21(b)所示,於實施例8之變化例1之電子零件810中,素體部10之寬度(X軸方向之長度)較長度(Y軸方向之長度)更長。因其他構成與實施例8相同,故省略說明。
FIG. 21(a) is a perspective perspective view of the electronic component of Embodiment 8, and FIG. 21(b) is a perspective perspective view of the electronic component of
於實施例1至實施例7中,例示有高硬度層22於X軸方向排列於導體含有層20之情形,但若高硬度層22於平行於素體部10之下表面14(安裝面)之方向排列於導體含有層20,則亦可如實施例8及實施例8之變化例1所示,為高硬度層22於Y軸方向排列於導體含有層20之情形。
In Examples 1 to 7, the case where the high-
於將電子零件安裝於安裝基板之情形時,易使應力集中於外部電極50之端部分與內部導體30之端部分,故容易於該等之間產生裂紋。因此,藉由使高硬度層22位於該部分,可抑制裂紋之產生。又,於實施例8之變化例1中,素體部10之機械性強度除高硬度層22之高度外,亦與長度及寬度有較大關聯。例如實施例8之變化例1所示,於電子零件之寬度較長度更長之情形時,藉由於素體部10之長度方向排列導體含有層20與高硬
度層22,可確保素體部10之寬度方向之強度。
When the electronic component is mounted on the mounting substrate, stress is likely to be concentrated on the end portion of the
於實施例1至實施例8中,例示有外部電極50呈自素體部10之下表面14延伸至端面16之L字型形狀且較素體部10之寬度(X軸方向之寬度)更窄之情形,但並不限於該情形。圖22(a)至圖22(n)係顯示外部電極形狀之其他例之透視立體圖。外部電極50亦可如圖22(a)所示僅設置於下表面,又可如圖22(b)所示僅設置於端面之下側,還可如圖22(c)所示設置於端面整面。亦可如圖22(d)所示自下表面經過端面延伸至上表面而設置,又可如圖22(e)所示進而延伸至側面,還可如圖22(f)、圖22(g)所示使上表面中之長度較下表面中之長度更短。亦可如圖22(h)所示自下表面延伸至端面之一部分而設置,又可如圖22(i)所示自下表面延伸至端面整面而設置。亦可如圖22(j)、圖22(k)所示於下表面之端呈三角柱形狀設置,又可如圖22(l)所示覆蓋下表面之一部分、側面之一部分、及端面之一部分而設置,還可如圖22(m)、圖22(n)所示覆蓋下表面之一部分、側面之一部分、及端面之整面而設置。另,於圖22(a)至圖22(n)中,亦可為外部電極50較素體部10之寬度更窄之情形。
In
另,於實施例1中,顯示使用電鍍製造電子零件之情形,於實施例4、5中,顯示有藉由積層片材而製造電子零件之情形,於實施例1至實施例8中,電子零件亦可以電鍍或積層片材之任一者製造。又,只要為可獲得本發明之構造之方法,則其製造方法並非限定於上述方法者,又可為組合若干方法之製造方法。 In addition, in Example 1, the use of electroplating to manufacture electronic parts is shown. In Examples 4 and 5, there are shown cases in which electronic parts are manufactured by laminating sheets. In Examples 1 to 8, the electronic Parts can also be made of either electroplating or laminated sheets. Moreover, as long as it is a method for obtaining the structure of the present invention, the manufacturing method is not limited to the above-mentioned method, and a manufacturing method combining several methods may be used.
圖23(a)係實施例9之電子零件之透視立體圖,圖23(b)係俯視剖視圖。另,於圖23(a)中,為了圖式之明瞭化而省略線圈導體36等之圖示(後
述之圖24(a)及圖24(b)亦同樣)。如圖23(a)及圖23(b)所示,於實施例9之電子零件900中,於素體部10之內部設置有標記部80。例如,標記部80設置於高硬度層22之內部,且與高硬度層22相比顏色之三屬性(色相、彩度、及亮度)之至少一者不同。即,標記部80係可識別其位置。標記部80亦可以與高硬度層22不同之材料形成,又可以與高硬度層22相同之材料形成且含有如成為與高硬度層22不同之顏色般之色素。又,標記部80亦可與高硬度層22同樣,具有較導體含有層20更高之硬度。因其他構成與實施例1相同故省略說明。
Fig. 23(a) is a perspective perspective view of the electronic component of Example 9, and Fig. 23(b) is a top sectional view. In addition, in FIG. 23(a), the illustration of the
根據實施例9,於素體部10設置有標記部80。藉此,可識別電子零件900之方向。因此,可使產生步驟中之排列作業容易進行,又可降低向安裝基板安裝時之不良。
According to the ninth embodiment, the marking
圖24(a)係實施例9之變化例1之電子零件之透視立體圖,圖24(b)係實施例9之變化例2之電子零件之透視立體圖。如圖24(a)之實施例9之變化例1之電子零件910所示,標記部80亦可設置於素體部10之側面18(即,高硬度層22之表面)。如圖24(b)之實施例9之變化例2之電子零件920所示,標記部80亦可跨及導體含有層20與高硬度層22而設置於素體部10之表面。於跨及導體含有層20與高硬度層22設置標記部80之情形時,較佳使標記部80與導體含有層20及高硬度層22之兩者相比,顏色之三屬性中至少一者不同。另,於圖24(b)中,例示有標記部80設置於素體部10之上表面12之情形,亦可設置於下表面14或端面16。素體部10之表面之標記部80亦可藉由例如印刷而形成。
FIG. 24(a) is a perspective perspective view of the electronic component of the
以上對本發明之實施例進行詳細敘述,但本發明並非限定於特定之實施例者,於專利申請範圍所記載之本發明之主旨之範圍內,可進行各種 變形、變更。 The embodiments of the present invention are described in detail above, but the present invention is not limited to specific embodiments, and various implementations can be made within the scope of the gist of the present invention described in the scope of the patent application. Deformation, change.
10‧‧‧素體部 10‧‧‧Body Department
12‧‧‧上表面 12‧‧‧Upper surface
16‧‧‧端面 16‧‧‧end face
18‧‧‧側面 18‧‧‧ side
20‧‧‧導體含有層 20‧‧‧Conductor containing layer
22‧‧‧高硬度層 22‧‧‧High hardness layer
30‧‧‧內部導體 30‧‧‧Internal conductor
32‧‧‧第1導體 32‧‧‧The first conductor
34‧‧‧第2導體 34‧‧‧Second conductor
36‧‧‧線圈導體 36‧‧‧Coil conductor
38‧‧‧引出導體 38‧‧‧Lead conductor
50‧‧‧外部電極 50‧‧‧External electrode
100‧‧‧電子零件 100‧‧‧Electronic parts
X‧‧‧方向 X‧‧‧direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
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JP7247818B2 (en) * | 2019-08-29 | 2023-03-29 | 株式会社村田製作所 | multilayer inductor |
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