TWI722244B - Electronic parts - Google Patents

Abstract

The object of the present invention is to improve the mechanical strength. The electronic component of the present invention includes: an element body portion 10 including an insulator having a rectangular parallelepiped shape; an internal conductor 30 provided inside the element body portion 10; and an external electrode 50 provided on at least the lower surface of the element body portion 10 14 (mounting surface) and electrically connected to the inner conductor 30; and the element body portion 10 has: a conductor containing layer 20 provided with a coil conductor 36 (functional portion) that becomes a part of the inner conductor 30 that exerts electrical performance; and The hardness layer 22 is juxtaposed on the conductor-containing layer 20 in a direction parallel to the lower surface 14 (mounting surface) of the element body portion 10 and has a higher hardness than the conductor-containing layer 20.

Description

Electronic parts

The present invention relates to an electronic component.

There is known an electronic component that electrically connects an internal conductor provided inside an insulator having a rectangular parallelepiped shape to an external electrode provided on the surface of the insulator. For electronic parts used in high-frequency circuits, miniaturization and improvement of high-frequency characteristics are sought. For example, it is known that in electronic parts in which a coil conductor is arranged inside an insulator, by setting the coil axis parallel to the mounting surface of the insulator and perpendicular to the opposing direction of one of the end faces of the insulator to the external electrode, and Reduce the loss due to high-frequency resistance, and obtain a high Q value (for example, Patent Document 1).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2013-98356

For example, in an electronic component in which a coil conductor is provided inside an element body portion including an insulator as in Patent Document 1, in order to obtain a high Q value, it is considered to use an insulating material with a low dielectric constant for the element body portion. However, when insulating materials with low dielectric constants are used, the mechanical strength of the element body is reduced, and cracks are likely to occur.

The present invention was made in view of the above-mentioned problems, and its object is to improve the mechanical strength.

The present invention is an electronic component comprising: an element body portion including an insulator having a rectangular parallelepiped shape; an internal conductor provided inside the element body portion; and external electrodes provided at least on the mounting surface of the element body portion , And electrically connected to the internal conductor; and the element body part has: a conductor-containing layer provided with a functional part that becomes a part of the internal conductor that exerts electrical performance; and a high-hardness layer along a line parallel to the mounting surface The direction is arranged side by side on the conductor-containing layer, and has a higher hardness than the conductor-containing layer.

In the above configuration, the high hardness layer may have a higher content of filler containing at least one of metal oxide and silicon oxide than the conductor containing layer.

In the above configuration, the element body portion may have a plurality of the high hardness layers, and the plurality of high hardness layers may be provided with the conductor containing layer interposed therebetween.

In the above configuration, the high hardness layer may be arranged in parallel to the conductor-containing layer in a direction parallel to the mounting surface of the element body portion and the end surface of the mounting surface adjacent to the element body portion.

In the above configuration, the conductor-containing layer in the end surface may be recessed with respect to the high hardness layer, and the external electrode may extend from the mounting surface of the element body portion to the end surface, and be provided in the end surface at least The above-mentioned conductor contains a layer.

In the above configuration, it may be configured that the external electrode is provided only in the conductor-containing layer and the conductor-containing layer in the high-hardness layer in the end surface.

In the above configuration, it may be configured that the conductor-containing layer is thicker than the high-hardness layer in the direction in which the conductor-containing layer and the high-hardness layer are juxtaposed.

In the above configuration, the internal conductor may have a coil conductor as the functional part.

In the above configuration, it may be configured that the coil conductor is provided only in the conductor containing layer and The conductor-containing layer in the high-hardness layer.

In the above configuration, the conductor-containing layer may have a lower dielectric constant than the high hardness layer.

In the above configuration, the conductor-containing layer and the high-hardness layer may be made of a material containing glass or resin, and the content of silicon as a material component of the conductor-containing layer is higher than that of the material that constitutes the high-hardness layer The silicon content of the ingredient is higher.

In the above configuration, the coil conductor may have a coil axis substantially parallel to the mounting surface.

In the above configuration, the functional portion may be configured to be electrically connected to the external electrode via a lead conductor to the mounting surface of the element body portion or an end surface adjacent to the mounting surface.

In the above configuration, it may be configured to include a marking portion provided on the element body portion.

According to the present invention, the mechanical strength can be improved.

10: Body part

12: upper surface

14: lower surface

16: end face

18: side

20: Conductor contains layer

20a: The first layer of the conductor containing layer

20b: The second layer of the conductor containing layer

20c: The third layer of the conductor containing layer

20d: The fourth layer of the conductor containing layer

20e: The fifth layer of the conductor containing layer

20f: The 6th layer of the conductor containing layer

22: High hardness layer

22a: The first layer of the high hardness layer

22b: The second layer of the high hardness layer

22c: The third layer of the high hardness layer

22d: The fourth layer of the high hardness layer

22e: The fifth layer of the high hardness layer

22f: The 6th layer of the high hardness layer

30: internal conductor

32: The first conductor

32a: Upper part

32b: Lower part

34: second conductor

36: coil conductor

38: Lead out the conductor

40: Conductor pattern

42: Through-hole conductor

44C: word pattern

46: I-shaped pattern

50: External electrode

60: Flat electrode

62: Capacitor Department

70: pad

80: marking department

90: Support substrate

92: resist film

94: resist film

100: electronic parts

110: Electronic parts

120: resist film

130: electronic parts

140: electronic parts

200: electronic parts

300: electronic parts

400: electronic parts

410: Electronic Parts

420: electronic parts

500: electronic parts

600: electronic parts

700: electronic parts

800: electronic parts

810: Electronic parts

900: electronic parts

910: electronic parts

920: electronic parts

1000: Electronic parts

G1~G16: raw embryo sheet

R: radius of curvature

X: direction

Y: direction

Z: direction

Fig. 1 is a perspective view of the electronic component of the first embodiment.

Fig. 2(a) is a top cross-sectional view of the electronic component of embodiment 1, Fig. 2(b) is a side cross-sectional view, and Fig. 2(c) is a cross-sectional view.

3(a) to 3(f) are cross-sectional views showing the manufacturing method of the electronic component of Embodiment 1 (Part 1).

4(a) to 4(d) are cross-sectional views showing the manufacturing method of the electronic component of Embodiment 1 (No. 2).

FIG. 5 is a perspective perspective view of the electronic component of Comparative Example 1. FIG.

FIG. 6 is a perspective perspective view of the electronic component of Modification 1 of Embodiment 1. FIG.

7(a) to 7(c) are top cross-sectional views of the electronic components of the modification 2 to the modification 4 of the first embodiment.

Fig. 8 is a perspective view of the electronic component of the second embodiment.

Fig. 9 is a perspective view of the electronic component of the third embodiment.

Fig. 10(a) is a perspective perspective view of the electronic component of the fourth embodiment, and Fig. 10(b) is a top sectional view.

FIG. 11 is a diagram illustrating a C-shaped pattern and an I-shaped pattern.

FIG. 12 is a diagram showing the manufacturing method of the electronic component of the fourth embodiment.

Fig. 13(a) and Fig. 13(b) are diagrams explaining the mounting test of electronic parts.

Fig. 14(a) is a perspective perspective view of the electronic component of Modification 1 of Embodiment 4, Fig. 14(b) is a view viewed from the upper surface side of the element body, and Fig. 14(c) is from the end surface of the element body View from the side.

15 is a top cross-sectional view of the electronic component of Modification 2 of Embodiment 4.

Fig. 16(a) is a top cross-sectional view of the electronic component of the fifth embodiment, Fig. 16(b) is a side cross-sectional view, and Fig. 16(c) is a cross-sectional view.

Fig. 17(a) is a top cross-sectional view of the electronic component of the sixth embodiment, Fig. 17(b) is a side cross-sectional view, and Fig. 17(c) is a cross-sectional view.

Fig. 18 is a diagram showing the manufacturing method of the electronic component of the sixth embodiment (No. 1).

Figures 19(a) and 19(b) show the manufacturing method of the electronic component of the sixth embodiment (No. 2).

Fig. 20(a) is a top cross-sectional view of the electronic component of the seventh embodiment, Fig. 20(b) is a side cross-sectional view, and Fig. 20(c) is a cross-sectional view.

FIG. 21(a) is a perspective perspective view of the electronic component of Embodiment 8, and FIG. 21(b) is a perspective perspective view of the electronic component of Modification 1 of Embodiment 8.

22(a) to 22(n) are perspective perspective views showing other examples of the shape of the external electrode.

Fig. 23(a) is a perspective perspective view of the electronic component of Example 9, and Fig. 23(b) is a top sectional view.

FIG. 24(a) is a perspective perspective view of the electronic component of the modification 1 of the embodiment 9, and FIG. 24(b) is a perspective perspective view of the electronic component of the modification 2 of the embodiment 9.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Example 1]

Fig. 1 is a perspective view of the electronic component of the first embodiment. Fig. 2(a) is a top cross-sectional view of the electronic component of embodiment 1, Fig. 2(b) is a side cross-sectional view, and Fig. 2(c) is a cross-sectional view. As shown in FIGS. 1 to 2(c), the electronic component 100 of the first embodiment includes an element body portion 10 including an insulator, an internal conductor 30, and an external electrode 50.

The element body portion 10 has a second surface that is an upper surface 12, a first surface that is a lower surface 14, a pair of end surfaces 16, and a pair of side surfaces 18, and has the X-axis direction as the width direction and the Y-axis direction as the length direction. The Z-axis direction is a rectangular parallelepiped shape on each side in the height direction. The lower surface 14 is a mounting surface, and the upper surface 12 is a surface opposite to the lower surface 14. The end surface 16 is a surface connected to an opposite side (for example, a short side) of the upper surface 12 and the lower surface 14, and the side surface 18 is a surface connected to an opposite side (for example, a long side) of the upper surface 12 and the lower surface 14. The element body portion 10 is, for example, a width dimension of 0.05 mm to 0.3 mm, a length dimension of 0.1 mm to 0.6 mm, and a height dimension of 0.05 mm to 0.5 mm. Even if the height dimension is set smaller than the length dimension and the width dimension, for example, the mechanical strength of the part can be improved. In addition, the element body portion 10 is not limited to a complete rectangular parallelepiped shape, and may have a substantially rectangular parallelepiped shape, for example, when each vertex is curved, when each edge (boundary portion of each surface) is curved, or when each surface has a curved surface. That is, the rectangular parallelepiped shape also includes the substantially rectangular parallelepiped shape as described above. In addition, the arc of each vertex may also be the radius of curvature R that does not reach 20% of the length of the short side of the element portion 10. About the bottom surface 14 and the end surface The arc of the edge formed by 16 can also be set to be smaller than the arc of the 22 part of the high-hardness layer than the arc of the 20 part of the conductor-containing layer. As a result, the stability of the posture during installation is improved. The smoothness of each surface can also be based on the stability of the mounting substrate, so that the size of the unevenness in a plane is less than 30μm.

The internal conductor 30 is provided inside the element body portion 10. The element body portion 10 has: a conductor-containing layer 20 provided with at least the functional portion of the inner conductor 30 that exerts electrical performance; and a high hardness layer 22 that is not provided with the functional portion of the inner conductor 30. The conductor-containing layer 20 and the high hardness layer 22 are arranged side by side in the X-axis direction (width direction). The high hardness layer 22 is provided so as to sandwich the conductor-containing layer 20 from the X-axis direction (width direction), and constitutes the side surface 18. In the X-axis direction, the higher hardness layer 22 of the conductor-containing layer 20 is thicker.

Here, the mechanical strength of the element body portion 10 is mainly determined by the high hardness layer 22. Therefore, since the mechanical strength can be ensured by making the high-hardness layer 22 higher (extended in the Z-axis direction), the dimensions of the high-hardness layer 22 are determined according to the material used. In addition, the dimensions of the high hardness layer 22 also consider the length (length in the Y-axis direction) and width (length in the X-axis direction) of the electronic component. As an example, when the length of the electronic component is longer than the width, and the conductor-containing layer 20 and the high-hardness layer 22 are arranged in the width direction (X-axis direction) of the element portion 10, it is preferable that the height of the high-hardness layer 22 is larger than The width is longer. That is, by shortening the width and height of the high-hardness layer 22, the amount of mechanical strength can be ensured, and the ratio of the conductor-containing layer 20 in the functional part of the built-in internal conductor 30 can be increased.

For example, the thickness of the conductor-containing layer 20 in the X-axis direction is 0.17 mm, and the thickness of the high hardness layer 22 is correspondingly 0.03 mm. The length and height of the high-hardness layer 22 in the Y-axis direction and the Z-axis direction are preferably smaller than the ratio of the length to the height. If this ratio is 2 or less, it can be set as the ratio of the thickness of the conductor containing layer 20 and the high hardness layer 22 as mentioned above.

The length and height of the conductor-containing layer 20 in the Y-axis direction and the Z-axis direction can also be set with high hardness The length and height of the layer 22 are the same or formed slightly smaller. Thereby, the conductor-containing layer 20 is protected by the high hardness layer 22. The length and height of the conductor-containing layer 20 and the length and height of the higher hardness layer 22 are set to 0 μm to -60 μm, respectively, so as to reduce the nozzle adsorption during the installation of the mounting substrate and the influence on the installability.

The conductor-containing layer 20 and the high-hardness layer 22 are formed of, for example, an insulating material mainly composed of resin. As the resin, a resin hardened by heat, light, chemical reaction or the like is used, for example, polyimide, epoxy resin, or liquid crystal polymer is used. In addition, the conductor-containing layer 20 and the high-hardness layer 22 may also be formed of an insulating material mainly composed of glass, or may be ferrite, dielectric ceramics, a magnetic body using soft magnetic alloy particles, or a resin mixed with magnetic powder form.

When the conductor-containing layer 20 is formed of resin, glass, etc., the color of the high-hardness layer 22 may be thicker than that of the conductor-containing layer 20, or the transmittance of the conductor-containing layer 20 may be higher and the hardness layer 22 may be higher. The visual properties of the resulting insulating materials are different. Thereby, the direction of the electronic component can be recognized by recognizing the color based on the image, or recognizing the insulating material based on the transmittance, or recognizing the direction of the internal conductor based on the light transmission. Thereby, the arranging operation of the production steps can be made easy, and the defects during the installation of the mounting board can be reduced.

The high hardness layer 22 has a higher hardness than the conductor containing layer 20. For example, the high-hardness layer 22 is based on Vickers hardness or Knoop hardness, which can measure the hardness with a small area, and is higher than the conductor-containing layer 20. As an example, the Vickers hardness of the high hardness layer 22 is 650 N/mm ² , and the Vickers hardness of the conductor-containing layer 20 is 400 N/mm ² . Due to the correlation between hardness and strength, the high-hardness layer 22 has a higher hardness than the conductor-containing layer 20 means that the high-hardness layer 22 has a higher strength (mechanical strength) than the conductor-containing layer 20.

If the conductor-containing layer 20 and the high-hardness layer 22 have a higher hardness than the conductor-containing layer 20, they can be formed of the same insulating material or different insulating materials. For example, compared with the conductor-containing layer 20, the high-hardness layer 22 has a higher content rate (for example, volume percentage) of the filler containing at least one of _{metal oxide and silicon oxide (SiO 2 ), thereby having a higher content than that of the conductor-containing layer 20.} Higher hardness. Here, the filler means a strength member added to the insulating material as particles. The added filler exists as particles in the amorphous part of glass or resin, and can be observed by SEM (Scanning Electron Microscope) analysis or TEM (Transmission Electron Microscope) analysis. Its existence. By obtaining the area ratio of the particle-like filler on the screen of the two layers at the same magnification, the filler content of the two layers can be compared. Examples of metal oxides that contribute to improving hardness include aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ), strontium oxide (SrO), and titanium oxide (TiO ₂ ). In addition, the conductor-containing layer 20 may also have a filler containing at least one of _{metal oxide and SiO 2, or not.}

The conductor-containing layer 20 and the high-hardness layer 22 may use materials with the same main component or materials with different main components, respectively. When different materials are used, the conductor-containing layer 20 and the high-hardness layer 22 are used to form the element body portion 10 by adjusting the firing process or bonding after firing so that the materials do not affect each other. In addition, when the conductor-containing layer 20 and the high-hardness layer 22 are made of the same main component material, it is easy to ensure the adhesion of the interface between the conductor-containing layer 20 and the high-hardness layer 22, and the coefficient of linear expansion of each can be reduced. difference. Thereby, the strength of the element body portion 10 as a whole can be ensured, and the reliability of the thermal cycle test and the like can be ensured. In addition, when the external electrode 50 is formed across the conductor-containing layer 20 and the high-hardness layer 22, the evaluation of the external electrode 50 with respect to the conductor-containing layer 20 and the high-hardness layer 22 can also be performed by the same evaluation, which is not only easy to select Of course, the external electrode 50 can easily ensure adhesion. This system can achieve the same effect especially in terms of reliability.

The dielectric constant of the conductor-containing layer 20 is relatively high and the hardness layer 22 is small. For example, the content rate (for example, weight percentage) of silicon (Si) as a material component of the conductor containing layer 20 (that is, Si in SiO ₂ which is not a filler) is higher than that of Si as a material component of the high-hardness layer 22 The content rate (for example, weight percentage) is high, whereby the dielectric constant of the conductor-containing layer 20 is higher and the hardness layer 22 is smaller. For example, the content of Si, which is a component of glass or resin constituting the conductor-containing layer 20, is higher than the content of Si, which is a component of glass, resin, or the like constituting the high hardness layer 22.

The inner conductor 30 has a plurality of first conductors 32 and a plurality of second conductors 34, and the coil conductor 36 is formed by connecting the plurality of first conductors 32 and the plurality of second conductors 34. That is, the coil conductor 36 includes a plurality of first conductors 32 and a plurality of second conductors 34 and is formed in a spiral shape, has a specific winding unit, and has a coil axis substantially orthogonal to a plane defined by the winding unit. The coil conductor 36 is a functional part of the internal conductor 30 that exerts electrical performance.

The plurality of first conductors 32 are composed of two conductor groups that face each other substantially in the Y-axis direction. The first conductors 32 constituting each of the two conductor groups extend along the Z-axis direction, and are arranged at specific intervals in the X-axis direction. The plurality of second conductors 34 are formed in parallel on the XY plane, and are composed of two conductor groups facing each other in the Z-axis direction. The second conductors 34 constituting each of the two conductor groups extend along the Y-axis direction, are arranged at intervals in the X-axis direction, and are connected to the first conductors 32 respectively. Thereby, the coil conductor 36 having a rectangular opening having a coil axis in the X-axis direction is formed inside the element body portion 10. That is, the coil conductor 36 has a coil axis in a direction substantially parallel to the lower surface 14 of the element body portion 10 and is wound in a longitudinal direction. In addition, being substantially parallel also includes a case where it is slightly inclined from the X-axis direction.

The external electrodes 50 are external terminals for surface mounting, and two are provided facing the Y-axis direction. The external electrode 50 extends from the lower surface 14 of the element portion 10 to the end surface 16 and covers a part of the lower surface 14 and a part of the end surface 16. That is, the external electrode 50 has an L-shaped shape. The external electrode 50 is, for example, only formed on the surface of the conductor-containing layer 20, but not formed on the surface of the high hardness layer 22. surface. In addition, the external electrode 50 may also be formed across the surface of the conductor-containing layer 20 and the surface of the high-hardness layer 22, for example.

In addition to the coil conductor 36 which is a functional part including a plurality of first conductors 32 and a plurality of second conductors 34, the inner conductor 30 also has a non-functional part, that is, a lead conductor 38. The lead conductor 38 is arranged on the same XY plane as the second conductor 34 located on the lower surface 14 side of the element portion 10, and is arranged in parallel in the Y-axis direction. The coil conductor 36 is electrically connected to the external electrode 50 on the lower surface 14 (mounting surface) or the end surface 16 of the element body 10 via the lead conductor 38.

The inner conductor 30 is formed of a metal material such as copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), platinum (Pt), or palladium (Pd), or an alloy metal material containing these. The external electrode 50 is made of metal materials such as silver (Ag), copper (Cu), aluminum (Al), or nickel (Ni), or silver (Ag), copper (Cu), or aluminum (Al) and nickel-plated (Ni) ) And tin plating (Sn) laminated film, or nickel (Ni) and tin plating (Sn) laminated film formation.

Next, the manufacturing method of the electronic component 100 of Example 1 is demonstrated. The electronic component 100 of the first embodiment is manufactured at the same time at the wafer level, and is singulated into each component after the manufacture. In addition, the electronic component 100 of the first embodiment is formed sequentially from the upper surface 12 side of the element body portion 10.

3(a) to 4(d) are cross-sectional views showing the manufacturing method of the electronic component of the first embodiment. Figures 3(a) to 3(c), 4(a), and 4(b) are diagrams corresponding to the side cross-sections of the electronic components of Example 1, and Figures 3(d) to 3(f) , Figure 4 (c), Figure 4 (d) is equivalent to the end of the cross-sectional view. As shown in Figures 3(a) and 3(d), a support substrate 90 such as a silicon substrate, a glass substrate, or a sapphire substrate is printed or coated with a resin material, or a resin film is adhered to form a conductor The first layer 20a including the layer 20 and the first layer 22a of the high hardness layer 22 which is in contact with the first layer 20a with the first layer 20a interposed therebetween. On the first layer 20a of the conductor containing layer 20, the second conductor 34 of the inner conductor 30 is formed by a sputtering method, and the second layer 20b of the conductor containing layer 20 covering the second conductor 34 is formed. In high hardness layer On the first layer 22a of 22, there is formed a second layer 22b of the high hardness layer 22 that sandwiches the second layer 20b of the conductor-containing layer 20 and is in contact with the second layer 20b. The second layer 20b of the conductor-containing layer 20 and the second layer 22b of the high-hardness layer 22 are formed by printing or coating a resin material, or adhering a resin film. Subsequently, the second layer 20b of the conductor-containing layer 20 and the second layer 22b of the high-hardness layer 22 are subjected to a polishing process, so that the upper surface of the second conductor 34 is exposed.

Next, after forming a seed layer (not shown) on the second layer 20b of the conductor-containing layer 20 and the second layer 22b of the high hardness layer 22, a resist film 92 having openings is formed on the seed layer. After the formation of the resist film 92, a deslagging process for removing the resist residue in the opening may also be performed. Subsequently, the upper portion 32a of the first conductor 32 is formed in the opening of the resist film 92 by a plating method.

As shown in FIGS. 3(b) and 3(e), after removing the resist film 92 and the seed layer, a third layer 20c of the conductor-containing layer 20 covering the upper portion 32a of the first conductor 32 is formed, and The third layer 22c of the high hardness layer 22 which is in contact with the third layer 20c sandwiching the third layer 20c. The third layer 20c of the conductor-containing layer 20 and the third layer 22c of the high-hardness layer 22 are formed by printing or coating a resin material, or adhering a resin film. Subsequently, the third layer 20c of the conductor-containing layer 20 and the third layer 22c of the high-hardness layer 22 are subjected to polishing treatment, so that the surface of the upper portion 32a of the first conductor 32 is exposed.

As shown in FIGS. 3(c) and 3(f), on the third layer 20c of the conductor-containing layer 20, the lower portion 32b of the first conductor 32 and the lower portion 32b covering the first conductor 32 are formed The conductor contains the fourth layer 20d of the layer 20. On the third layer 22c of the high-hardness layer 22, a fourth layer 22d of the high-hardness layer 22 sandwiching the fourth layer 20d of the conductor-containing layer 20 and contacting the fourth layer 20d is formed. The lower part 32b of the first conductor 32 is formed so as to be connected to the upper part 32a of the first conductor 32. The lower portion 32b of the first conductor 32, the fourth layer 20d of the conductor containing layer 20, and the fourth layer 22d of the high hardness layer 22 can be combined with the upper portion 32a of the first conductor 32 and the third layer 22d of the conductor containing layer 20. The layer 20c and the third layer 22c of the high hardness layer 22 are formed by the same method.

As shown in FIGS. 4(a) and 4(c), a seed layer (not shown) is formed on the fourth layer 20d of the conductor-containing layer 20 and the fourth layer 22d of the high hardness layer 22, and a seed layer (not shown) and an opening The resist film 94 is formed, and the second conductor 34 and the lead conductor 38 (not shown) are formed in the opening of the resist film 94 by a plating method.

4(b) and 4(d), after removing the resist film 94 and the seed layer, the fifth layer 20e covering the conductor-containing layer 20 of the second conductor 34 and the lead conductor 38 is formed, and The fifth layer 22e of the high hardness layer 22 which is in contact with the fifth layer 20e with the fifth layer 20e interposed therebetween. Subsequently, on the fifth layer 20e of the conductor-containing layer 20 and the fifth layer 22e of the high-hardness layer 22, the sixth layer 20f of the conductor-containing layer 20 and the sixth layer 22f of the high-hardness layer 22 are formed. The conductor-containing layer 20 is composed of the first layer 20a to the sixth layer 20f. The high hardness layer 22 is composed of the first layer 22a to the sixth layer 22f. Subsequently, an external electrode 50 is formed on the surface of the element body portion 10. Thereby, the electronic component 100 of Example 1 is formed.

FIG. 5 is a perspective perspective view of the electronic component of Comparative Example 1. FIG. As shown in FIG. 5, in the electronic component 1000 of Comparative Example 1, the element body portion 10 does not have the high-hardness layer 22, while in Example 1, the portion where the high-hardness layer 22 is provided has a conductor-containing layer 20. Since the other structure is the same as that of the first embodiment, the description is omitted.

The inventor conducted a bending test on the electronic components of Example 1 and Comparative Example 1. The bending test is performed by mounting the electronic component on the upper surface of the mounting substrate, and applying force from the lower surface of the mounting substrate to bend the mounting substrate, and testing whether there is a crack in the electronic component at this time. The size of the electronic component subjected to the bending test is the same as in Example 1 and Comparative Example 1, with a width of 0.2 mm, a length of 0.4 mm, and a height of 0.2 mm. Furthermore, in Example 1, a high hardness layer ^{with a thickness of 0.015 mm and a Vickers hardness of 650 N/mm 2} is provided on both sides of the conductor-containing layer 20 with a thickness of 0.17 mm and a ^{Vickers hardness of 400 N/mm 2} twenty two.

Table 1 shows the test results of the bending test. As shown in Table 1, when the bending amount of the mounting substrate is set to 2mm, in Example 1, all 10 wafers tested did not have cracks. On the other hand, in Comparative Example 1, cracks occurred in 3 wafers out of 10 wafers. When the bending amount of the mounting substrate was 4 mm, in Example 1, all 10 wafers had no cracks. In contrast, in Comparative Example 1, all 10 wafers had cracks. In this way, Example 1 is compared with Comparative Example 1, and as a result, the occurrence of cracks can be suppressed. This is considered to be because the high-hardness layer 22 is provided in parallel with the conductor-containing layer 20 in Example 1.

As described above, according to the first embodiment, the element body portion 10 has a conductor containing layer 20 provided with a coil conductor 36 (functional portion), and is arranged side by side in a direction parallel to the lower surface 14 (mounting surface) of the element body portion 10 The conductor contains the high hardness layer 22 of the layer 20. In this way, by arranging the high-hardness layer 22 having higher hardness than the conductor-containing layer 20 on the conductor-containing layer 20 in a direction parallel to the lower surface 14 of the element body portion 10, as shown in Table 1, bending can be suppressed The occurrence of cracks in the test can also improve the mechanical strength of the element portion 10.

Furthermore, according to Example 1, the high-hardness layer 22 has a higher content rate of the filler containing at least one of _{metal oxide and SiO 2 than that of the conductor-containing layer 20.} Thereby, the hardness of the high-hardness layer 22 can be increased more easily than that of the conductor-containing layer 20, so the mechanical strength of the element body portion 10 can be easily increased.

Furthermore, according to the first embodiment, the coil conductor 36 is provided inside the conductor-containing layer 20, but is not provided inside the high hardness layer 22. Thereby, it is possible to form the conductor-containing layer 20 with a material suitable for the electrical characteristics of the coil conductor 36 to improve the electrical characteristics and increase the mechanical strength of the element body portion 10.

Furthermore, according to the first embodiment, the conductor containing layer 20 with the coil conductor 36 inside and the high hardness Compared with layer 22, the dielectric constant is lower. Thereby, the parasitic capacitance between the conductors of the coil conductor 36 can be reduced, and the natural frequency can be increased, and therefore, the Q value can be increased. For example, the conductor-containing layer 20 has a higher content rate of Si, which is a material component of the layer, than the high-hardness layer 22, so that the dielectric constant can be lower than that of the high-hardness layer 22. In addition, when the dielectric constant of the conductor-containing layer 20 is lower than that of the high-hardness layer 22, according to the point of increasing the Q value, it is preferable that the coil conductor 36 is arranged inside the conductor-containing layer 20 instead of the high-hardness layer Inside of 22.

Furthermore, according to the first embodiment, the coil conductor 36 has a coil axis in a direction substantially parallel to the lower surface 14 (mounting surface) of the element body portion 10. For example, when there is a coil axis in the direction perpendicular to the lower surface 14 (mounting surface) of the element body portion 10, the change in the magnetic flux caused by the alternating current flowing through the coil conductor is caused on the mounting substrate for mounting electronic parts. A situation where eddy currents are generated. In this case, the Q value will decrease. However, when there is a coil axis in a direction substantially parallel to the lower surface 14 (mounting surface) of the element body portion 10, the generation of eddy currents on the mounting substrate can be suppressed, and the decrease of the Q value can be suppressed.

FIG. 6 is a perspective perspective view of the electronic component of Modification 1 of Embodiment 1. FIG. As shown in FIG. 6, in the electronic component 110 of the modification 1 of the embodiment 1, the external electrodes 50 are only provided on the two ends of the lower surface 14 of the element portion 10 in the Y-axis direction, and not on the end surface 16. The coil conductor 36 is electrically connected to the external electrode 50 on the lower surface 14 of the element body 10 via the lead conductor 38. Since the other structure is the same as that of the first embodiment, the description is omitted.

In the first embodiment, as shown in FIG. 1, the coil conductor 36 is electrically connected to the external electrode 50 at the end surface 16 of the element body 10 via the lead conductor 38, but as shown in the first modification of the embodiment 1, the coil conductor 36 It is also possible to electrically connect the external electrode 50 to the lower surface 14 (mounting surface) of the element body 10 via the lead conductor 38. In addition, by disposing the external electrode 50 only on the lower surface 14 of the element body portion 10, so that the coil conductor 36 is electrically connected to the outer electrode 50 on the lower surface 14 of the element body portion 10, the external electrode 50 can be reduced. The parasitic capacitance between the partial electrode 50 and the internal conductor 30.

In addition, although illustration is omitted, the coil conductor 36 may be electrically connected to the external electrode 50 on the side surface 18 of the element portion 10 via the lead conductor 38.

7(a) to 7(c) are top cross-sectional views of the electronic components of the modification 2 to the modification 4 of the first embodiment. As shown in FIG. 7( a ), in the electronic component 120 of the modification 2 of the first embodiment, the conductor-containing layer 20 is disposed close to one of the pair of side surfaces 18 of the element portion 10. Therefore, one of the high-hardness layers 22 sandwiching the conductor-containing layer 20 has a thinner thickness in the X-axis direction than the other. Since the other structure is the same as that of the first embodiment, the description is omitted.

In Embodiment 1, the case where the conductor containing layer 20 is provided in the center between a pair of side surfaces 18 of the element body portion 10 is illustrated. However, as shown in Modification 2 of Embodiment 1, the conductor containing layer 20 may be placed close to the pair of side surfaces. One of the side 18 is provided. In this case, the direction of the electronic component can be identified based on the difference in thickness of the high hardness layer 22 sandwiching the conductor containing layer 20.

As shown in FIG. 7(b), in the electronic component 130 of the modification 3 of the embodiment 1, the conductor-containing layer 20 having the coil conductor 36 (functional part) inside is provided inside the element body part 10 and covers the conductor A high hardness layer 22 is provided around the containing layer 20. The non-functional part of the inner conductor 30, that is, the lead conductor 38 is provided on the high hardness layer 22. Since the other structure is the same as that of the first embodiment, the description is omitted.

In Embodiment 1, the case where the conductor-containing layer 20 extends from one of the pair of end faces 16 of the element body portion 10 to the other is illustrated, but as shown in the modification 3 of the embodiment 1, the conductor may contain The layer 20 is disposed inside the element body portion 10. In this case, since the high-hardness layer 22 is provided to surround the conductor-containing layer 20, the mechanical strength can be further improved. In addition, even if the non-functional part, that is, the lead conductor 38 is provided on the high hardness layer 22, the influence on the electrical characteristics is small.

As shown in FIG. 7(c), in the electronic component 140 of Modification 4 of Embodiment 1, in the X-axis direction, the conductor-containing layer 20 has a higher hardness layer 22 that is thinner. Since the other constitutions are the same as in Example 1, The description is omitted.

In Example 1, the case where the conductor-containing layer 20 is thicker and the higher hardness layer 22 is thicker in the X-axis direction. However, as shown in Modification 4 of Example 1, the conductor-containing layer may be made in the X-axis direction. 20 The higher hardness layer 22 is thinner. When the conductor-containing layer 20 has a higher hardness and the layer 22 is thicker, since the coil conductor 36 can be enlarged, the inductance value can be increased. On the other hand, when the high hardness layer 22 is thicker than the conductor containing layer 20, the mechanical strength of the element body portion 10 can be improved.

[Example 2]

Fig. 8 is a perspective view of the electronic component of the second embodiment. As shown in FIG. 8, in the electronic component 200 of the second embodiment, the high-hardness layer 22 is provided only on one side of the conductor-containing layer 20, and the portion corresponding to the other side where the high-hardness layer 22 is provided in the first embodiment A conductor containing layer 20 is provided. Since the other structure is the same as that of the first embodiment, the description is omitted.

The inventor conducted a bending test on the electronic component of Example 2. The bending test was performed in the same manner as the method described in Example 1, and the dimensions of the electronic components were set to be the same as in Example 1. Table 2 shows the test results of the bending test. In addition, for comparison, the test results of Comparative Example 1 shown in Table 1 are also shown.

As shown in Table 2, when the bending amount of the mounting substrate was set to 2 mm, in Example 2, no cracks occurred in all 10 wafers tested. When the bending amount of the mounting substrate was 4 mm, in Example 2, 2 of the 10 wafers had cracks.

As shown in the second embodiment, if the direction parallel to the lower surface 14 (mounting surface) of the element body portion 10 and The conductor-containing layer 20 is provided with the high-hardness layer 22 in parallel, and even when the high-hardness layer 22 is provided on only one side of the conductor-containing layer 20, the mechanical strength of the element body portion 10 can be improved. In addition, from the test results in Table 1 and Table 2, it can be seen that in order to improve the mechanical strength of the element body portion 10, it is preferable to provide the high hardness layer 22 with the conductor containing layer 20 interposed therebetween.

[Example 3]

Fig. 9 is a perspective view of the electronic component of the third embodiment. In addition, in FIG. 9, since the internal conductor 30 has the same structure as in the first embodiment, the illustration is omitted in FIG. 9. As shown in FIG. 9, in the electronic component 300 of the third embodiment, the external electrode 50 extends from the lower surface 14 of the element portion 10 to the upper surface 12 through the end surface 16 and extends from the end surface 16 to the side surface 18. That is, the external electrode 50 covers the entire surface of the end surface 16, the upper surface 12, the lower surface 14, and a part of the side surface 18. Since the other structure is the same as that of the first embodiment, the description is omitted.

The inventor conducted a bending test on the electronic component of Example 3. The bending test was carried out in the same way as the method described in Example 1, so the dimensions of the electronic parts etc. were set to be the same as in Example 1. Table 3 shows the test results of the bending test. In addition, for comparison, the test results of Comparative Example 1 shown in Table 1 are also shown.

As shown in Table 3, when the bending amount of the mounting substrate was set to either 2 mm or 4 mm, in Example 3, no cracks occurred in the 10 wafers tested.

Based on the results of the bending test of Examples 1 to 3, it can be seen that if the high hardness layer 22 is provided in parallel with the conductor-containing layer 20 in the direction parallel to the lower surface 14 (mounting surface) of the element body portion 10, then Regardless of the shape of the external electrode 50, the mechanical strength of the element portion 10 can be improved.

[Example 4]

Fig. 10(a) is a perspective perspective view of the electronic component of the fourth embodiment, and Fig. 10(b) is a top sectional view. As shown in FIGS. 10(a) and 10(b), in the electronic component 400 of the fourth embodiment, the internal conductor 30 has a conductor pattern 40, a via-hole conductor 42, and a lead conductor 38. In addition, in the end surface 16, the conductor-containing layer 20, the higher hardness layer 22, is more concave. Since the other configuration is the same as that of the first embodiment, the inner conductor 30 will be described below, and other descriptions will be omitted.

In the inner conductor 30, the via-hole conductor 42 is electrically connected to the plurality of conductor patterns 40. The conductor pattern 40 includes, for example, a C-shaped pattern 44 and an I-shaped pattern 46.

FIG. 11 is a diagram illustrating a C-shaped pattern and an I-shaped pattern. As shown in FIG. 11, the C-shaped pattern 44 is a polygonal conductor pattern having three or more vertices. For example, the C-shaped pattern 44 has a substantially rectangular shape, that is, has 4 vertices and lacks a part of one side of the substantially rectangular shape. In addition, the substantially rectangular shape is not limited to the rectangular shape as shown in FIG. 11, and includes an elliptical shape that can be approximated to a rectangular shape. As shown in the case of FIG. 11, there are cases where four vertices are included, or a part that can be recognized as an apex when an approximate rectangle is included when there is no clear apex in a substantially rectangular shape. In addition, the dotted line in FIG. 11 shows the position where the through-hole conductor 42 is formed.

The I-shaped pattern 46 complements a part of a missing side of the C-shaped pattern 44 in the substantially rectangular shape. According to the actual shape of the substantially rectangular shape, the I-shaped pattern 46 may also be a straight line as shown in FIG. 11, or may be a curved shape that is a part of an elliptical shape. By using the combination of the C-shaped pattern 44 and the I-shaped pattern 46, the dimensional stability of the coil conductor can be increased, and the narrow tolerance of the inductance can be realized. It is preferable that the length of the I-shaped pattern 46 is longer than the length of the missing portion of the C-shaped pattern 44. Thereby, the electrical connection can be made more reliably.

Next, the manufacturing method of the electronic component 400 of Example 4 is demonstrated. Figure 12 series display A diagram of the manufacturing method of the electronic component of the fourth embodiment. In addition, the electronic component 400 of the fourth embodiment is formed by laminating a green sheet containing an insulating material across one of the side surfaces 18 of the element portion 10 and the other.

As shown in FIG. 12, green sheets G1 to G10, which are precursors of the insulating layer constituting the element body portion 10, are prepared. The green sheet is formed by coating an insulating material slurry mainly made of glass or the like on a film by a doctor blade forming method or the like. In addition, as an insulating material, in addition to materials mainly composed of glass, ferrite, dielectric ceramics, magnetic materials using soft magnetic alloy materials, or resins mixed with magnetic powders can also be used. The thickness of the green sheet is not particularly limited, and is, for example, 5 μm to 60 μm, and for example, it is 20 μm. Prepare a plurality of green sheets with different content of fillers containing metal oxides and silicon. The green sheets with higher content of fillers containing metal oxides are green sheets G1 and G10, and the green sheets with higher silicon content are green sheets G2~G9.

At specific positions of the green sheets G3 to G7, that is, where the through-hole conductor 42 is scheduled to be formed, through-holes are formed by laser processing or the like. In addition, a conductive material is printed on the green sheets G3 to G8 by a printing method, thereby forming a C-shaped pattern 44, an I-shaped pattern 46, and a via conductor 42. Examples of the main component of the conductive material include metals such as silver and copper.

Next, the green embryo sheets G1 to G10 are layered in a specific order, and pressure is applied to the lamination direction to press the green embryo sheets. Next, after the pressed green sheet is cut in units of wafers, it is fired at a specific temperature (for example, about 700° C. to 900° C.) to form the element body portion 10. At this time, since the green sheets G1 and G10 and the green sheets G2~G9 contain different metal oxide-containing fillers and silicon content, the shrinkage during firing is different. The result is shown in Figure 10(a) As shown in FIG. 10(b), the conductor-containing layer 20 has a concave shape with respect to the high hardness layer 22.

Next, the external electrode 50 is formed at a specific position of the element body portion 10. The external electrode 50 is coated It is formed by fabricating an electrode paste mainly composed of silver or copper, which is fired at a specific temperature (for example, about 600°C to 900°C), and then electroplated. As the electroplating, for example, copper, nickel, tin, or the like can be used. In this way, the electronic component 400 of the fourth embodiment is formed.

The inventor conducted a test of mounting the electronic component of Example 4 on a mounting board. Fig. 13(a) and Fig. 13(b) are diagrams explaining the mounting test of electronic parts. FIG. 13(a) shows a situation in which the electronic component 400 is joined to the pad 70 of the mounting substrate by using solder, and the electronic component 400 is mounted in an appropriate position. On the other hand, in the mounting test, as shown in FIG. 13(b), the electronic component 400 is specially mounted at a position offset by 50 μm from the pad 70, and the mounting state at this time is confirmed. In addition, the pad 70 has a rectangular shape with a length of 0.2 mm and a width of 0.15 mm. The size of the electronic component 400 is 0.2mm in width, 0.4mm in length, and 0.2mm in height.

Table 4 shows the test results of the installation test. In addition, for comparison, the test result when the electronic component 1000 of Comparative Example 1 is mounted on the mounting substrate is also shown. In addition, the size of the electronic component 1000 of Comparative Example 1 is the same as that of the electronic component 400 of Embodiment 4. As shown in Table 4, in Example 4, the mounting failure rate was 0%, while in Comparative Example 1, the mounting failure rate was 2.25%. In addition, poor mounting means a situation such as a wafer lift phenomenon (Manhattan phenomenon, tombstone phenomenon, etc.).

In this way, in Example 4, as compared with Comparative Example 1, installation failures were reduced. It is believed to be based on the following reasons. That is, when the electronic component is mounted on the mounting substrate by bonding the external electrode 50 of the electronic component to the pad 70 of the mounting substrate with solder, the solder is melted during mounting. The tension of the material becomes the driving force, so the self-alignment effect of moving the electronic component to the center of the mounting position in order to balance the tension generated by the external electrodes 50 provided on each surface of the element body portion 10 is generated. With this self-alignment effect, the horizontal rotation of the electronic component relative to the mounting surface during mounting and the component tilting (such as the electronic component falling off from one side of the pad and standing on the other side of the pad) can be suppressed. phenomenon).

The self-alignment effect (self-alignment force) is that the larger the amount of solder, the larger, and since the solder spreads on the external electrode 50, the larger the area of the external electrode 50, the larger. In Comparative Example 1, the end surface 16 of the conductor-containing layer 20 is a flat surface. In contrast, in Example 4, the end surface 16 of the conductor-containing layer 20 has a recessed shape with respect to the high hardness layer 22. Therefore, in Example 4, compared with Comparative Example 1, since the amount of solder supplied to the pad 70 can be increased and the area of the external electrode 50 to which the solder is joined is larger, the self-alignment effect is increased. In addition, in Embodiment 4, the conductor-containing layer 20 in the end surface 16 of the element portion 10 has a curved shape that is recessed with respect to the high hardness layer 22, so the external electrode 50 provided on the conductor-containing layer 20 has a curved shape. Therefore, it is easy to move the electronic component to an appropriate position by the self-aligning force acting toward the center of the installation position. Based on these, it is considered that Example 4 has reduced installation defects compared with Comparative Example 1.

According to the fourth embodiment, in the end surface 16 of the element body portion 10, the conductor-containing layer 20 is recessed with respect to the high hardness layer 22. The external electrode 50 extends from the lower surface 14 of the element portion 10 to the end surface 16, and is provided on the conductor-containing layer 20 in the end surface 16 at least. Thereby, the self-alignment when mounting electronic components on the mounting substrate can be improved. In addition, as shown in the fourth embodiment, it is preferable that the external electrode 50 is only provided in the conductor-containing layer 20 in the end surface 16 and not provided in the high hardness layer 22. In addition, since the conductor-containing layer 20 is recessed with respect to the high-hardness layer 22, when the conductor-containing layer 20 forms the external electrode 50, the external electrode 50 can be prevented from being diffused and formed to the high-hardness layer 22. That is, it is possible to easily form the external electrode 50 on the surface of the conductor containing layer 20 instead of forming the external electrode 50 on the high hardness layer 22.

Fig. 14(a) is a perspective perspective view of the electronic component of Modification 1 of Embodiment 4, Fig. 14(b) is a view viewed from the upper surface side, and Fig. 14(c) is a view viewed from the end surface side. As shown in FIGS. 14(a) to 14(c), in the electronic component 410 of Modification 1 of Embodiment 4, the external electrode 50 is provided in the conductor-containing layer on the lower surface 14 and the end surface 16 of the element body portion 10 20 and the high hardness layer 22. In the end surface 16, the external electrode 50 has a curved shape in the conductor-containing layer 20, and has a shape in which the height in the Z-axis direction is curved so that the high-hardness layer 22 becomes higher than the conductor-containing layer 20. Also, on the lower surface 14 as well, the external electrode 50 has a curved shape. In addition, the external electrode 50 may extend beyond the side surface 18 of the element body portion 10. The other configuration is the same as that of the fourth embodiment, so the description is omitted. In the case of the modification 1 of the embodiment 4, as in the embodiment 4, the self-alignment can be improved.

15 is a top cross-sectional view of the electronic component of Modification 2 of Embodiment 4. As shown in FIG. 15, in the electronic component 420 of the modification 2 of the embodiment 4, the high hardness layer 22 is provided only on one side of the conductor-containing layer 20. The other configuration is the same as that of the fourth embodiment, so the description is omitted.

The inventor conducted a test of mounting the electronic component of the modification 2 of the embodiment 4 on the mounting board. The mounting test was carried out in the same way as the method described in Example 4, so the dimensions of the electronic parts etc. were set to be the same as in Example 4. Table 5 shows the test results of the installation test. In addition, for comparison, the test results of Comparative Example 1 shown in Table 4 are also shown.

As shown in Table 5, the installation failure rate in the modification 2 of the embodiment 4 is 0.75%.

As shown in the modification 2 of the embodiment 4, even if the high hardness layer 22 is provided on only one side of the conductor-containing layer 20, the self-alignment can be improved. According to the test results in Table 4 and Table 5, it can be seen from the point of improving self-alignment that it is preferable to provide the high hardness layer 22 sandwiching the conductor containing layer 20.

[Example 5]

Fig. 16(a) is a top cross-sectional view of the electronic component of the fifth embodiment, Fig. 16(b) is a side cross-sectional view, and Fig. 16(c) is a cross-sectional view. As shown in FIGS. 16(a) to 16(c), in the electronic component 500 of the fifth embodiment, the coil conductor 36 has a coil axis in the Y-axis direction (longitudinal direction) and the opening has a rectangular shape. Since the other configuration is the same as that of the first embodiment, the description will be omitted.

In Examples 1 to 4, the case where the coil axis of the coil conductor 36 is wound longitudinally along the X-axis direction is illustrated. As shown in Example 5, the coil axis of the coil conductor 36 is longitudinally wound along the Y-axis direction. Around the situation.

[Example 6]

Fig. 17(a) is a top cross-sectional view of the electronic component of the sixth embodiment, Fig. 17(b) is a side cross-sectional view, and Fig. 17(c) is a cross-sectional view. As shown in FIGS. 17(a) to 17(c), the electronic component 600 of the sixth embodiment is provided with a coil conductor 36 having a coil axis in the Z-axis direction (height direction) and having a rectangular opening shape. That is, the coil conductor 36 is wound horizontally. The coil conductor 36 is provided close to the upper surface 12 side from the center of the element body part 10 in the Z-axis direction. Since the other structure is the same as that of the first embodiment, the description is omitted.

18 to 19(b) are diagrams showing the manufacturing method of the electronic component of the sixth embodiment. 19(a) and 19(b) are diagrams corresponding to the top cross-section of the electronic component of the sixth embodiment. As shown in FIG. 18, a plurality of insulating green sheets G11 to G16, which are precursors of the conductor-containing layer 20, are prepared. Regarding the green sheet, since it is described in Example 4, the description is omitted here.

At specific positions of the green sheet G12~G15, through holes are formed by laser processing. Next, a conductive material is printed on the green sheets G12 to G16 by a printing method, thereby forming the internal conductor 30.

Next, layer the green sheets G11~G16 in a specific order, and apply pressure in the direction of the layering Press the green sheet with force. Next, after the pressed green sheet is cut in units of wafers, it is fired at a specific temperature (for example, about 700°C to 900°C). Thereby, as shown in FIG. 19(a), the conductor containing layer 20 which has the internal conductor 30 inside is formed.

Next, as shown in FIG. 19(b), by printing, or dipping, for example, paste, paste, ink, etc., on both sides of the conductor-containing layer 20, or then processing into a sheet, the high hardness is formed Layer 22. Thereby, the element body portion 10 in which the high hardness layer 22 is provided with the conductor containing layer 20 interposed therebetween is formed. Subsequently, an external electrode 50 is formed at a specific position of the element body portion 10. In this way, the electronic component 600 of the sixth embodiment is formed.

The conductor-containing layer 20 can be formed by forming a through hole in the green sheet as described above, and then forming the inner conductor part, and then laminating and crimping the green sheet in a specific order to form a coil. Method: A method in which a resin or the like is used for the insulating layer to produce an internal conductor by a thin film method without firing, and a method in which a conductor that becomes an internal conductor is wound into a coil shape and then fixed with resin or the like without firing. In addition, the winding direction of the coil includes two types of vertical winding, which is perpendicular to the mounting surface and has a coil axis, and parallel to the mounting surface, and has a coil axis, and the length or width direction of the coil axis and the mounting surface are approximately the same. Winding, any of the 3 winding methods can also be applied.

Regarding the formation of the high-hardness layer 22, printing, dipping, or sheet bonding can be performed, but depending on the slurry or paste, ink or adhesive, adhesive, etc. used, there may be cases where it can be fired. The situation cannot be roasted. When the firing is possible, and when firing is performed during the production of the conductor-containing layer 20, the sequence of steps for simultaneous firing may be used, or the sequence of steps for separate firing may be used. When the firing cannot be performed, whether or not firing is performed during the production of the conductor-containing layer 20, the high-hardness layer 22 is formed after the conductor-containing layer 20 is completed.

When the high-hardness layer 22 is added and formed on the conductor-containing layer 20, by arranging a plurality of conductor-containing layers 20 on an adhesive sheet, etc., compared with the separate addition and formation of the high-hardness layer 22 when singulated, it can be Effectively attach and form.

In Embodiments 1 to 5, the coil conductor 36 is longitudinally wound. As shown in Embodiment 6, the coil conductor 36 may be horizontally wound. Furthermore, according to the sixth embodiment, the coil conductor 36 is provided close to the upper surface 12 side of the element body portion 10. As a result, since the coil conductor 36 is separated from the mounting surface, that is, the lower surface 14, the influence of the parasitic capacitance of the coil conductor 36 from the mounting substrate after the electronic component is mounted on the mounting substrate can be reduced, and the change in characteristics can be suppressed.

[Example 7]

Fig. 20(a) is a top cross-sectional view of the electronic component of the seventh embodiment, Fig. 20(b) is a side cross-sectional view, and Fig. 20(c) is a cross-sectional view. As shown in FIGS. 20(a) to 20(c), in the electronic component 700 of the seventh embodiment, the inner conductor 30 includes a plurality of flat electrodes 60. The area where the plurality of flat electrodes 60 overlap each other becomes the capacitor portion 62 of the functional portion that exerts electrical performance in the internal conductor 30. The area where the plurality of flat electrodes 60 do not overlap each other corresponds to the lead-out portion that electrically connects the capacitor portion 62 to the external electrode 50. That is, the internal conductor 30 has a capacitor portion 62 as a functional portion including a region where a plurality of flat electrodes 60 overlap each other, and a non-functional portion which is a region where the plurality of flat electrodes 60 do not overlap each other. Since the other structure is the same as that of the first embodiment, the description is omitted.

In Embodiment 1 to Embodiment 6, the case where the inner conductor 30 includes the coil conductor 36 as a functional part, that is, the case where the electronic component is an inductance element, is exemplified, but it is not limited to this. It may also be the case where the internal conductor 30 includes the capacitor part 62 as a functional part as shown in the seventh embodiment, that is, the case where the electronic component is a capacitor element. Moreover, even when the capacitor portion 62 is included as a functional portion, the capacitor portion 62 can be attached to the lower surface 14 of the element body portion 10 by drawing a conductor, as in FIG. It is electrically connected to the external electrode 50 and may also be electrically connected to the external electrode 50 on the side surface 18 of the element portion 10.

[Example 8]

FIG. 21(a) is a perspective perspective view of the electronic component of Embodiment 8, and FIG. 21(b) is a perspective perspective view of the electronic component of Modification 1 of Embodiment 8. As shown in FIG. 21(a), in the electronic component 800 of Example 8, the high-hardness layer 22 is juxtaposed on the conductor-containing layer 20 in the Y-axis direction (longitudinal direction). The high hardness layer 22 is provided on both sides of the conductor-containing layer 20 with the conductor-containing layer 20 sandwiched from the Y-axis direction (longitudinal direction), and constitutes the end surface 16 of the element body portion 10. In the Y-axis direction, the thickness of the conductor-containing layer 20 is higher and the hardness layer 22 is thicker. The coil conductor 36 (functional part) in the inner conductor 30 is provided inside the conductor-containing layer 20. Since the other structure is the same as that of the first embodiment, the description is omitted. As shown in FIG. 21(b), in the electronic component 810 of Modification 1 of Embodiment 8, the width (length in the X-axis direction) of the element body portion 10 is longer than the length (length in the Y-axis direction). Since the other structure is the same as that of the eighth embodiment, the description is omitted.

In Examples 1 to 7, the case where the high-hardness layer 22 is arranged on the conductor-containing layer 20 in the X-axis direction is exemplified, but if the high-hardness layer 22 is parallel to the lower surface 14 (mounting surface) of the element body portion 10 If the direction is arranged in the conductor-containing layer 20, the high-hardness layer 22 may be arranged in the conductor-containing layer 20 in the Y-axis direction as shown in Embodiment 8 and Modification 1 of Embodiment 8.

When the electronic component is mounted on the mounting substrate, stress is likely to be concentrated on the end portion of the external electrode 50 and the end portion of the internal conductor 30, so cracks are likely to occur between them. Therefore, by positioning the high-hardness layer 22 in this portion, the occurrence of cracks can be suppressed. In addition, in the modification 1 of the embodiment 8, the mechanical strength of the element body portion 10 is not only the height of the high hardness layer 22 but also the length and the width. For example, as shown in Modification 1 of Embodiment 8, when the width of the electronic component is longer than the length, the arrangement of the conductor containing layer 20 and high hardness due to the length direction of the element portion 10 The degree layer 22 can ensure the strength in the width direction of the element body portion 10.

In Embodiments 1 to 8, the external electrode 50 is illustrated in an L-shaped shape extending from the lower surface 14 of the element body portion 10 to the end surface 16 and is larger than the width of the element body portion 10 (the width in the X-axis direction). Narrow situation, but not limited to this situation. 22(a) to 22(n) are perspective perspective views showing other examples of the shape of the external electrode. The external electrode 50 can also be provided only on the lower surface as shown in Figure 22(a), can be provided only on the underside of the end surface as shown in Figure 22(b), or can be provided on the end surface as shown in Figure 22(c) Whole face. It can also extend from the lower surface to the upper surface through the end surface as shown in Figure 22(d), and can also extend to the side as shown in Figure 22(e), and can also extend to the side as shown in Figure 22(f) and Figure 22(g). As shown, the length in the upper surface is shorter than the length in the lower surface. It can also extend from the lower surface to a part of the end surface as shown in Fig. 22(h), and can also extend from the lower surface to the entire end surface as shown in Fig. 22(i). It can also be arranged in a triangular column shape at the end of the lower surface as shown in Figure 22(j) and Figure 22(k), and it can also cover a part of the lower surface, a part of the side surface, and a part of the end surface as shown in Figure 22(l). The arrangement can also cover a part of the lower surface, a part of the side surface, and the entire end surface as shown in Fig. 22(m) and Fig. 22(n). In addition, in FIG. 22(a) to FIG. 22(n), the external electrode 50 may be narrower than the width of the element portion 10.

In addition, in Example 1, the use of electroplating to manufacture electronic parts is shown. In Examples 4 and 5, there are shown cases in which electronic parts are manufactured by laminating sheets. In Examples 1 to 8, the electronic Parts can also be made of either electroplating or laminated sheets. Moreover, as long as it is a method for obtaining the structure of the present invention, the manufacturing method is not limited to the above-mentioned method, and a manufacturing method combining several methods may be used.

[Example 9]

Fig. 23(a) is a perspective perspective view of the electronic component of Example 9, and Fig. 23(b) is a top sectional view. In addition, in FIG. 23(a), the illustration of the coil conductor 36 and the like is omitted for clarity of the drawing (after The same applies to Figure 24(a) and Figure 24(b) described above). As shown in FIG. 23(a) and FIG. 23(b), in the electronic component 900 of the ninth embodiment, a marking portion 80 is provided inside the element portion 10. For example, the marking portion 80 is disposed inside the high-hardness layer 22, and compared with the high-hardness layer 22, at least one of the three attributes (hue, chroma, and brightness) of the color is different. That is, the marking portion 80 can recognize its position. The marking portion 80 may be formed of a different material from the high-hardness layer 22, or may be formed of the same material as the high-hardness layer 22 and contain a pigment that becomes a different color from the high-hardness layer 22. In addition, the marking portion 80 may have a higher hardness than the conductor-containing layer 20 in the same way as the high-hardness layer 22. Since the other structure is the same as that of the first embodiment, the description is omitted.

According to the ninth embodiment, the marking part 80 is provided on the element body part 10. In this way, the direction of the electronic component 900 can be recognized. Therefore, the arranging operation in the production step can be easily performed, and defects during mounting on the mounting substrate can be reduced.

FIG. 24(a) is a perspective perspective view of the electronic component of the modification 1 of the embodiment 9, and FIG. 24(b) is a perspective perspective view of the electronic component of the modification 2 of the embodiment 9. As shown in the electronic component 910 of the modification 1 of the embodiment 9 in FIG. 24(a), the marking portion 80 may also be provided on the side surface 18 of the element portion 10 (that is, the surface of the high hardness layer 22). As shown in the electronic component 920 of the modification 2 of the embodiment 9 in FIG. 24(b), the marking portion 80 may also be provided on the surface of the element body portion 10 across the conductor-containing layer 20 and the high hardness layer 22. When the marking portion 80 is provided across the conductor-containing layer 20 and the high-hardness layer 22, it is preferable to compare the marking portion 80 with the conductor-containing layer 20 and the high-hardness layer 22, at least one of the three attributes of the color different. In addition, in FIG. 24( b ), a case where the marking portion 80 is provided on the upper surface 12 of the element body portion 10 is illustrated, and it may also be provided on the lower surface 14 or the end surface 16. The marking portion 80 on the surface of the element body portion 10 may also be formed by, for example, printing.

The embodiments of the present invention are described in detail above, but the present invention is not limited to specific embodiments, and various implementations can be made within the scope of the gist of the present invention described in the scope of the patent application. Deformation, change.

10‧‧‧Body Department

12‧‧‧Upper surface

16‧‧‧end face

18‧‧‧ side

20‧‧‧Conductor containing layer

22‧‧‧High hardness layer

30‧‧‧Internal conductor

32‧‧‧The first conductor

34‧‧‧Second conductor

36‧‧‧Coil conductor

38‧‧‧Lead conductor

50‧‧‧External electrode

100‧‧‧Electronic parts

X‧‧‧direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (24)

An electronic component comprising: an element body including an insulator in the shape of a rectangular parallelepiped, and having an end surface that is a lower surface of a mounting surface, an end surface facing the upper surface of the mounting surface, and an end surface connected to the short side of the mounting surface, and The side surface connected to the long side of the mounting surface; the internal conductor, which is provided inside the element body portion; and the external electrode, which is provided at least at the end of the mounting surface in the direction of the end surface, and is electrically connected to the inside Conductor; The element body portion has: a conductor-containing layer that extends from the mounting surface to the upper surface and is provided with a functional portion that becomes a part of the internal conductor that exerts electrical performance; and a high-hardness layer that extends from the mounting surface The conductor-containing layer is arranged side by side on the above-mentioned upper surface and has a higher hardness than the above-mentioned conductor-containing layer; and the dielectric constant of the above-mentioned conductor-containing layer is lower than that of the high-hardness layer, and between the mounting surface and the upper surface The height is smaller than the above-mentioned high hardness layer. The electronic component of claim 1, wherein the high-hardness layer has a higher content rate of filler containing at least one of metal oxide and silicon oxide than that of the conductor-containing layer. The electronic component of claim 1, wherein the element body portion has a plurality of the high hardness layers; and the plurality of high hardness layers are provided with the conductor containing layer sandwiched therebetween. The electronic component of claim 1, wherein the high-hardness layer is parallel to the upper part of the element body The direction of the mounting surface and the end surface are arranged side by side on the conductor-containing layer. The electronic component of claim 4, wherein the conductor-containing layer in the end surface is recessed with respect to the high hardness layer; and the external electrode extends from the mounting surface of the element portion to the end surface, and is provided at least in the end surface The above conductor contains a layer. The electronic component of claim 5, wherein the external electrode is provided only in the conductor-containing layer and the conductor-containing layer in the high-hardness layer in the end face. The electronic component of claim 1, wherein in the direction in which the conductor-containing layer and the high-hardness layer are juxtaposed, the conductor-containing layer is thicker than the high-hardness layer. The electronic component of claim 1, wherein the internal conductor has a coil conductor as the functional part. The electronic component of claim 8, wherein the coil conductor is provided only in the conductor-containing layer and the conductor-containing layer in the high-hardness layer. The electronic component of claim 9, wherein the conductor-containing layer and the high-hardness layer are made of a material containing glass or resin; and the content of silicon as a material component of the conductor-containing layer is higher than that of the high-hardness layer The silicon content of the material component is higher. The electronic component of claim 10, wherein the coil conductor has a coil axis substantially parallel to the mounting surface. The electronic component of claim 8, wherein the coil conductor has a coil axis substantially parallel to the mounting surface. The electronic component according to claim 2, wherein the element body portion has a plurality of the high hardness layers; and the plurality of high hardness layers are provided with the conductor containing layer sandwiched therebetween. The electronic component of claim 2, wherein the high-hardness layer is arranged in parallel on the conductor-containing layer along a direction parallel to the mounting surface and the end surface of the element body portion. The electronic component of claim 14, wherein the conductor-containing layer in the end surface is recessed with respect to the high hardness layer; and the external electrode extends from the mounting surface of the element portion to the end surface, and is provided at least in the end surface The above conductor contains a layer. The electronic component of claim 15, wherein the external electrode is provided only in the conductor-containing layer in the end surface and the conductor-containing layer in the high-hardness layer. The electronic component of claim 2, wherein the conductor-containing layer is thicker than the high-hardness layer in the direction in which the conductor-containing layer and the high-hardness layer are juxtaposed. An electronic component according to claim 2, wherein the internal conductor has a coil conductor as the functional part. The electronic component of claim 18, wherein the coil conductor is provided only in the conductor-containing layer and the conductor-containing layer in the high-hardness layer. The electronic component of claim 19, wherein the conductor-containing layer and the high-hardness layer are made of a material containing glass or resin; and the content of silicon as a material component of the conductor-containing layer is higher than that of the high-hardness layer The silicon content of the material component is higher. The electronic component of claim 18, wherein the coil conductor has a coil axis substantially parallel to the mounting surface. The electronic component of claim 20, wherein the coil conductor has a coil axis substantially parallel to the mounting surface. The electronic component according to any one of claims 1 to 22, wherein the functional portion is electrically connected to the external electrode on the mounting surface or the end surface of the element body via a lead conductor. Such as the electronic component of claim 23, which is provided with a marking part provided on the above-mentioned element body part.

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