TWI721608B - Electronic device and assembling method of electronic device - Google Patents
Electronic device and assembling method of electronic device Download PDFInfo
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Abstract
一種電子裝置及電子裝置的組接方法,所述電子裝置包含一個第一座體、一個設置有數支接腳的第二座體,及數個包括數條導線的線圈,所述電子裝置的組接方法是將所述線圈安裝於所述第二座體內並將導線往外拉平,加熱所述導線伸出所述第二座體的部位,使其漆皮熱熔去除並裸露線芯而成為導電段,再將第一座體及第二座體相對蓋合,同時讓所述接腳分別對應叉起所述導線且一併穿出所述第二側壁,使得所述導線被拉伸移動,而讓導電段對應嵌卡於接腳中,再進行熔接結合。通過事先熱熔去除漆皮,並於蓋合時使接腳叉起導線,讓導電段被對應夾置於接腳中的設計,可使所述導線與所述接腳的組裝結合便捷容易,且熔接效果優良。An electronic device and a method for assembling the electronic device. The electronic device includes a first base body, a second base body provided with a plurality of pins, and a plurality of coils including a plurality of wires. The assembly of the electronic device The connection method is to install the coil in the second seat body and straighten the wire outward, heat the part where the wire extends out of the second seat body, so that the paint skin is removed by heat and the core is exposed to become a conductive section , And then cover the first seat body and the second seat body relatively, and at the same time let the pins respectively fork the wires and pass through the second side wall together, so that the wires are stretched and moved, and The conductive segments are correspondingly embedded in the pins, and then welded and combined. The design of removing the varnish by thermal melting in advance, and making the pins fork the wires when closing, so that the conductive segments are correspondingly clamped in the pins, which makes the assembly and combination of the wires and the pins convenient and easy, and Excellent welding effect.
Description
本發明是有關於一種電子裝置,特別是指一種包含數個線圈的電子裝置及電子裝置的組接方法。The present invention relates to an electronic device, in particular to an electronic device including several coils and a method of assembling the electronic device.
一種現有電子裝置,是用於將數個線圈組裝於一個電子座內。每一個線圈具有數條導線。該電子座具有一個供所述線圈容裝的座體、數支彼此間隔地插設在該座體的左右兩側的接腳,及一個蓋設於該座體上的蓋體。每一支接腳具有一個突伸出該座體的頂面的繞線段。An existing electronic device is used to assemble several coils in an electronic socket. Each coil has several wires. The electronic seat has a seat body for the coil accommodating, several pins inserted on the left and right sides of the seat body at intervals, and a cover body arranged on the seat body. Each pin has a winding section protruding from the top surface of the seat body.
而該電子裝置的組接方法,是提供設置有所述接腳的該座體,接著將所述線圈放入該座體內,並將所述導線分別拉向所對應的接腳並纏繞於所述繞線段,而後將所述接腳的繞線段浸入高溫熔融的焊錫液中,使所述繞線段與其纏繞的導線結合在一起,藉以電連接所述接腳與所述線圈,最後再將所述蓋體蓋合於該座體上。The assembling method of the electronic device is to provide the base body provided with the pins, then put the coils into the base body, and pull the wires to the corresponding pins and wind them around the pins. The winding section, and then the winding section of the pin is immersed in the high-temperature molten solder, so that the winding section and the wire wound around are combined together, thereby electrically connecting the pin and the coil, and finally The cover body is closed on the seat body.
然而上述組接方法為了避免所述導線松脫而發生短路或斷路現象,所以組裝時必需先通過人工將每一條導線費事地纏繞在所對應的接腳上,因此組裝上較為費工耗時且麻煩不便。此外,還需要另外利用材質不同於所述導線及所述接腳的焊錫液來熱浸焊接,如此一來將會產生大量的金屬間化合物,容易發生短路或可靠性降低等不良現象,致使成品不良率升高,因此上述電子裝置及其組接方法仍有待改進。However, in order to avoid the short circuit or open circuit caused by the loosening of the wires in the above assembly method, it is necessary to manually wind each wire on the corresponding pin during assembly, so the assembly is more labor-intensive and time-consuming. And troublesome and inconvenient. In addition, it is also necessary to use a solder solution with a different material from the wire and the pin for hot dip soldering. As a result, a large amount of intermetallic compounds will be generated, which is prone to short-circuit or reduced reliability, resulting in finished products. The defect rate is increasing, so the above-mentioned electronic devices and their assembling methods still need to be improved.
因此,本發明的目的在於提供一種能夠克服先前技術的至少一個缺點的電子裝置。Therefore, the object of the present invention is to provide an electronic device that can overcome at least one of the disadvantages of the prior art.
本發明的電子裝置,包含相蓋合且相配合界定出一個容裝空間的一個第一座體與一個第二座體、數支彼此間隔地設置於所述第一座體的接腳,及數個容裝於所述容裝空間且電連接所述接腳的線圈,所述第一座體包括一個沿著一個第一方向長向延伸的第一側壁,所述第二座體包括一個對應蓋置於所述第一側壁上方的第二側壁,所述第二側壁具有數個沿著所述第一方向間隔設置且沿著一個第二方向橫向凹設於底面的線槽,及數個分別由所述線槽直向連通至頂面的穿槽,每一支所述接腳包括一個向上突出所述第一側壁且穿伸於所述第二側壁的穿槽內的突伸段,及一個由所述突伸段伸出所述第二側壁且分叉形成有一個夾槽的叉腳段,每一個所述線圈包括一個線圈本體,及數條伸出所述線圈本體的導線,每一條所述導線穿伸於各自的線槽,並具有一個被相對應的叉腳段向上叉出所述穿槽外且嵌卡於相對應的夾槽中的導電段。The electronic device of the present invention includes a first base body and a second base body that cover and cooperate to define an accommodating space, and several pins arranged on the first base body at intervals, and A plurality of coils accommodated in the accommodating space and electrically connected to the pins, the first seat body includes a first side wall extending in a longitudinal direction along a first direction, and the second seat body includes a The corresponding cover is placed on the second side wall above the first side wall, and the second side wall has a plurality of wire grooves arranged at intervals along the first direction and recessed on the bottom surface transversely along a second direction, and a number A through groove which is directly connected to the top surface from the line groove, each of the pins includes a protruding section that protrudes upward from the first side wall and penetrates into the through groove of the second side wall , And a fork leg section extending from the second side wall from the protruding section and bifurcated to form a clamping slot, each of the coils includes a coil body, and several wires extending out of the coil body Each of the wires extends through the respective wire groove, and has a conductive section that is protruded upward from the through groove by a corresponding fork leg section and is embedded in the corresponding clamping groove.
本發明之功效在於:所述導線的導電段分別嵌設於相對應接腳的夾槽中,並和相對應的接腳熔接在一起,可以提高熔接良率。The effect of the present invention is that the conductive sections of the wires are respectively embedded in the clamping grooves of the corresponding pins, and are welded together with the corresponding pins, which can improve the welding yield.
本發明的目的在於提供一種能夠克服先前技術的至少一個缺點的電子裝置的組接方法。The purpose of the present invention is to provide a method for assembling an electronic device that can overcome at least one of the disadvantages of the prior art.
本發明的電子裝置的組接方法,包含一個零件備置步驟、一個線圈組裝步驟、一個熱熔去皮步驟,及一個座體蓋合步驟。所述零件備置步驟提供一個第一座體、一個設置有數支接腳的第二座體,及數個包括數條導線的線圈,所述第二座體具有數個橫向凹設於底面的線槽,及數個分別由所述線槽向上連通至頂面的穿槽,每一支所述接腳包括一個向上突出所述第一座體的突伸段,及一個形成於所述突伸段上側且具有一個夾槽的叉腳段。所述線圈組裝步驟將所述線圈安裝於所述第二座體內,將所述導線橫向往外拉平並分別嵌置於所述線槽中。所述熱熔去皮步驟加熱所述導線平拉伸出所述線槽的部位,使得所述部位的漆皮熱熔去除並裸露線芯而成為一個導電段。所述座體蓋合步驟將所述第一座體及所述第二座體相對蓋合,所述接腳的叉腳段分別叉夾所述導線且一併穿出所述第二側壁的穿槽,使得所述導線隨其被拉伸移動,而讓所述導電段對應嵌卡於所述夾槽中。The assembling method of the electronic device of the present invention includes a part preparation step, a coil assembly step, a hot melt peeling step, and a base cover step. The component preparation step provides a first base body, a second base body provided with a plurality of pins, and a plurality of coils including a plurality of wires, and the second base body has a plurality of transversely recessed wires on the bottom surface. Grooves, and a plurality of through grooves respectively connected upwards to the top surface from the line grooves, each of the pins includes a protruding section protruding upward from the first seat body, and a protruding section formed on the protruding The upper side of the section has a fork leg section with a clamping groove. In the coil assembling step, the coil is installed in the second seat body, and the wire is pulled out horizontally and embedded in the wire slot respectively. The hot-melt peeling step heats the part where the wire is stretched out of the wire slot, so that the paint at the part is hot-melt removed and the wire core is exposed to become a conductive section. In the seat body covering step, the first seat body and the second seat body are relatively covered, and the prong sections of the pins respectively fork the wires and pass through the second side wall. Through the slot, the wire is stretched and moved along with it, and the conductive section is correspondingly embedded in the clamping slot.
本發明之功效在於:通過改變所述第一座體及所述第二座體的結構,在組接時可使每一條導線便捷容易地組接於相對應的接腳上,並能確保焊接精確性。The effect of the present invention is that by changing the structure of the first base body and the second base body, each wire can be conveniently and easily connected to the corresponding pin during assembly, and welding can be ensured Accuracy.
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.
參閱圖1、圖2與圖3,本發明電子裝置的一第一實施例,在下列說明中都是以圖中所示方向來說明,當然在實施上,該電子裝置的型態及設置方向不受限於本第一實施例,例如也可以上下翻轉。Referring to Figures 1, 2 and 3, a first embodiment of the electronic device of the present invention is described in the following description in the direction shown in the figure. Of course, in implementation, the type and direction of the electronic device It is not limited to this first embodiment, for example, it can also be turned upside down.
該電子裝置包含相蓋合且相配合界定出一個容裝空間5的一個第一座體1與一個第二座體2、數支彼此間隔地設置於所述第一座體1的接腳3,及數個容裝於所述容裝空間5且電連接所述接腳3的線圈4。The electronic device includes a
所述第一座體1由絕緣塑膠材料製成,並包括兩個沿著一個第二方向7間隔設置且沿著一個第一方向6長向延伸的第一側壁11,及一個左右兩側分別連接所述第一側壁11的底壁12。每一個所述第一側壁11具有突設於頂面且沿著所述第一方向6長向延伸的一個突台111與一個側牆112,所述側牆112間隔位在所述突台111遠離所述容裝空間5的一側。The
所述第二座體2由絕緣塑膠材料製成,並包括一個頂壁21、一個由所述頂壁21的周緣向下突伸的周壁22,及兩個沿著所述第二方向7間隔設置且分別連接於所述周壁22底緣的左右兩側的第二側壁23。所述第二側壁23對應蓋置於所述第一側壁11上方,並具有數個沿著所述第一方向6間隔設置且沿著所述第二方向7橫向凹設於底面的線槽231、數個分別由所述線槽231直向連通至頂面的穿槽232,及一個凹設於底面且沿著所述第一方向6長向延伸的嵌槽233。所述嵌槽233供所述突台111對應嵌入定位並間隔位在所述側牆112內側。The
所述接腳3彼此間隔地插設於所述第一座體1的所述第一側壁11中,每一支接腳3皆由導電金屬材料製成,並包括一個向上突出所述第一側壁11且穿伸於所述第二側壁23的穿槽232內的突伸段31、一個由所述突伸段31伸出所述第二側壁23且分叉形成有夾槽321的叉腳段32、一個埋設於所述第一側壁11內且連接所述突伸段31的嵌埋段33,及一個由所述嵌埋段33側向往外伸出所述第一側壁11的外側面並向下再往外彎折延伸的凸腳段34。所述突伸段31及所述叉腳段32向上突伸出所述第二側壁23的突台111。The
每一個線圈4包括一個線圈本體41,及數條伸出所述線圈本體41的導線42。每一條導線42穿伸於各自的線槽231,並具有一個被相對應的叉腳段32向上叉出所述穿槽232外且嵌卡於相對應的夾槽321中的導電段421、一個由所述線圈本體41連接至所述導電段421的內接段422,及一個由所述導電段421延伸至所述第二側壁23外側的外伸段423。所述內接段422由所述線圈本體41拉出且水平穿過所述線槽231,再向上彎折伸入所述穿槽232並轉向連接所述導電段421,所述外伸段423由所述導電段421轉向往下伸出所述穿槽232,再彎折往外沿著所述線槽231水平穿出。需說明的是,每一條導線42都是在一條具有導電功能的線芯週邊包覆一層具有絕緣效果的漆皮。Each
參閱圖2、圖3及圖4,進一步說明本第一實施例的電子裝置的組接方法,包含一個零件備置步驟、一個線圈組裝步驟、一個熱熔去皮步驟、一個座體蓋合步驟、一個熱熔結合步驟,及一個線端切除步驟。Referring to Figure 2, Figure 3 and Figure 4, the assembly method of the electronic device of the first embodiment is further described, including a part preparation step, a coil assembly step, a hot melt peeling step, a base cover step, A hot-melt bonding step, and a wire end cutting step.
所述零件備置步驟提供所述第一座體1、所述設置有接腳3的第二座體2,及所述包括導線42的線圈4。其中設置有接腳3的第二座體2,是將所述接腳3擺放在一個模具(圖未示)的左右兩側,再於該模具中注入熔融的絕緣塑膠材料以成形出該第二座體2,待冷卻脫膜後即完成製造,由於其為一般現有制程,所以在此不再詳細說明。The component preparation step provides the
所述線圈組裝步驟將所述線圈4安裝於所述第二座體2內,將所述導線42橫向往外拉平並分別嵌置於所述線槽231中,另外可在所述第二座體2內填灌絕緣膠(圖未示)以定位所述線圈4的線圈本體41。In the coil assembly step, the
所述熱熔去皮步驟是通過一台雷射設備發出雷射光束照射所述導線42平拉伸出所述線槽231的部位,使得所述部位的漆皮熱熔去除並裸露線芯而成為導電段421。The hot-melt peeling step is to use a laser device to emit a laser beam to irradiate the
所述座體蓋合步驟將所述第一座體1及所述第二座體2相對蓋合,所述接腳3的叉腳段32分別叉夾所述導線42且一併穿過所述穿槽232,使得所述導線42隨其被拉伸移動,直到所述叉腳段32完全伸出所述穿槽232,所述導電段421也會恰好嵌卡於所述夾槽321中,同時所述第一座體1和所述第二座體2也蓋合完成。In the step of covering the seat body, the
所述熱熔結合步驟是通過所述雷射設備發出雷射光束照射所述叉腳段32與所述導電段421叉夾在一起的部位,使得該處部位被加熱熔融而結合在一起。In the hot-melt bonding step, the laser beam emits a laser beam to irradiate the part where the
所述線端切除步驟是通過加工機(圖未示)將所述導線42伸出所述第二座體2的部位切除,以完成所述電子裝置的製造。The wire end cutting step is to cut the part where the
參閱圖5,本發明電子裝置的一第二實施例的構造大致相同於該第一實施例,其差別在於:本第二實施例每一支接腳3的凸腳段34的構造不同,所述凸腳段34是由所述嵌埋段33直向往下伸出所述第一側壁11的底面。Referring to FIG. 5, the structure of a second embodiment of the electronic device of the present invention is substantially the same as that of the first embodiment. The difference is that the structure of the protruding
綜上所述,本發明電子裝置及電子裝置的組接方法,通過事先將所述線圈4的導線42熱熔去除漆皮425而成為導電段421,並於蓋合時使所述叉腳段32叉起導線42,一併讓所述導電段421被夾置於夾槽321中的設計,無需利用人工費事地纏繞,可使所述導線42與所述接腳3的組裝結合便捷容易,並具有較佳的夾持卡定效果,再者其是通過熱熔方式直接熔融連接在一起,由於並未另外添加焊錫液,不會產生金屬間化合物,所以電熱傳導性良好,可減少短路機會以提升可靠性,確能有效提升產品良率並降低成本,因此,本發明不僅是前所未有的創新,更可供產業上利用,所以確實能達成本發明的目的。In summary, the electronic device and the method of assembling the electronic device of the present invention are formed by thermally melting the
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.
1:第一座體 11:第一側壁 111:突台 112:側牆 12:底壁 2:第二座體 21:頂壁 22:周壁 23:第二側壁 231:線槽 232:穿槽 233:嵌槽 3:接腳 31:突伸段 32:叉腳段 321:夾槽 33:嵌埋段 34:凸腳段 4:線圈 41:線圈本體 42:導線 421:導電段 422:內接段 423:外伸段 5:容裝空間 6:第一方向 7:第二方向1: The first block 11: The first side wall 111: Protruding platform 112: side wall 12: bottom wall 2: The second block 21: top wall 22: Zhou wall 23: second side wall 231: Trunking 232: piercing 233: Socket 3: pin 31: Overhang 32: Fork leg section 321: Clip Groove 33: Embedded section 34: protruding foot section 4: coil 41: Coil body 42: Wire 421: Conductive section 422: Inscribed section 423: Outreach 5: Storage space 6: First direction 7: Second direction
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一個局部立體分解圖,說明本發明電子裝置的一第一實施例; 圖2是一個剖視前視圖,說明該第一實施例; 圖3是一個不完整的立體放大圖,說明該第一實施例; 圖4是一個製造流程圖,說明該第一實施例的組接方法;及 圖5是一個剖視前視圖,說明本發明電子裝置的一第二實施例。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a partial three-dimensional exploded view illustrating a first embodiment of the electronic device of the present invention; Figure 2 is a sectional front view illustrating the first embodiment; Figure 3 is an incomplete three-dimensional enlarged view illustrating the first embodiment; Figure 4 is a manufacturing flow chart illustrating the assembling method of the first embodiment; and Fig. 5 is a sectional front view illustrating a second embodiment of the electronic device of the present invention.
1:第一座體 1: The first block
11:第一側壁 11: The first side wall
111:突台 111: Protruding platform
112:側牆 112: side wall
12:底壁 12: bottom wall
2:第二座體 2: The second block
21:頂壁 21: top wall
22:周壁 22: Zhou wall
23:第二側壁 23: second side wall
231:線槽 231: Trunking
232:穿槽 232: piercing
233:嵌槽 233: Socket
3:接腳 3: pin
31:突伸段 31: Overhang
32:叉腳段 32: Fork leg section
321:夾槽 321: Clip Groove
33:嵌埋段 33: Embedded section
34:凸腳段 34: protruding foot section
4:線圈 4: coil
41:線圈本體 41: Coil body
42:導線 42: Wire
421:導電段 421: Conductive section
422:內接段 422: Inscribed section
423:外伸段 423: Outreach
5:容裝空間 5: Storage space
7:第二方向 7: Second direction
Claims (8)
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