TWI718630B - Light emitting device - Google Patents
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- TWI718630B TWI718630B TW108129608A TW108129608A TWI718630B TW I718630 B TWI718630 B TW I718630B TW 108129608 A TW108129608 A TW 108129608A TW 108129608 A TW108129608 A TW 108129608A TW I718630 B TWI718630 B TW I718630B
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Description
本發明是有關於一種發光裝置,且特別是有關於一種具有較佳美觀外型,能增強使用者體驗的發光裝置。The present invention relates to a light-emitting device, and more particularly to a light-emitting device with a better appearance and an enhanced user experience.
在現有的發光裝置中,為了使發光層發光,會分別在發光層兩側的二導電塗層側邊以外接二條導線的方式電性連接至供電的電路板上。當二條導線通電時,則可使位於二導電塗層之間的發光層發光。然而,外接的二條導線會破壞發光裝置的整體外觀,而影響使用者體驗。此外,縱使可藉由增設其他的構件來隱藏二條導線,但相對地卻也會有製作成本增加的問題。In the existing light-emitting device, in order to make the light-emitting layer emit light, the sides of the two conductive coatings on both sides of the light-emitting layer are electrically connected to the power supply circuit board by means of two external wires. When the two wires are energized, the light-emitting layer located between the two conductive coatings can emit light. However, the two external wires will damage the overall appearance of the light-emitting device and affect the user experience. In addition, even if other components can be added to hide the two wires, there is a problem of relatively increased manufacturing costs.
本發明提供一種發光裝置,可具有較美觀的外型,進而增強使用者體驗。The present invention provides a light emitting device, which can have a more beautiful appearance, thereby enhancing user experience.
本發明的發光裝置包括背板、第一導電塗層、發光層、第二導電塗層、第一金屬件、第二金屬件以及供電組件。背板具有彼此相對的上表面與下表面。第一導電塗層配置於背板的上表面。發光層配置於第一導電塗層上。第二導電塗層配置於發光層上。第一金屬件埋設於背板內且具有第一端與第二端。第一端切齊下表面,第二端穿出上表面而接觸第一導電塗層。第二金屬件埋設於背板內且具有第三端與第四端。第三端切齊下表面,第四端穿出上表面且不接觸第一導電塗層而接觸第二導電塗層。供電組件配置於背板的下表面上。第一金屬件的第一端與第二金屬件的第三端接觸供電組件。The light-emitting device of the present invention includes a back plate, a first conductive coating, a light-emitting layer, a second conductive coating, a first metal piece, a second metal piece, and a power supply component. The back plate has an upper surface and a lower surface opposite to each other. The first conductive coating is disposed on the upper surface of the back plate. The light-emitting layer is configured on the first conductive coating. The second conductive coating is disposed on the light-emitting layer. The first metal piece is buried in the back plate and has a first end and a second end. The first end cuts the lower surface, and the second end penetrates the upper surface to contact the first conductive coating. The second metal piece is embedded in the back plate and has a third end and a fourth end. The third end is cut to the lower surface, and the fourth end penetrates the upper surface and does not contact the first conductive coating but contacts the second conductive coating. The power supply component is arranged on the lower surface of the backplane. The first end of the first metal piece and the third end of the second metal piece contact the power supply component.
在本發明的一實施例中,上述的第一導電塗層在背板上的正投影面積大於第二導電塗層於背板上的正投影面積。In an embodiment of the present invention, the orthographic projected area of the first conductive coating on the back plate is larger than the orthographic projected area of the second conductive coating on the back plate.
在本發明的一實施例中,上述的第一導電塗層在背板上的正投影面積小於背板。In an embodiment of the present invention, the orthographic projection area of the first conductive coating on the back plate is smaller than that of the back plate.
在本發明的一實施例中,上述的發光裝置更包括介質層。介質層配置於發光層與第一導電塗層之間。In an embodiment of the present invention, the above-mentioned light-emitting device further includes a dielectric layer. The medium layer is disposed between the light-emitting layer and the first conductive coating.
在本發明的一實施例中,上述的第一導電塗層具有第一開口,介質層具有第二開口,發光層具有第三開口。第一開口、第二開口及第三開口相互連通。第二金屬件的第四端穿過第一開口、第二開口及第三開口而接觸第二導電塗層。In an embodiment of the present invention, the aforementioned first conductive coating has a first opening, the dielectric layer has a second opening, and the light-emitting layer has a third opening. The first opening, the second opening, and the third opening communicate with each other. The fourth end of the second metal piece passes through the first opening, the second opening, and the third opening to contact the second conductive coating.
在本發明的一實施例中,上述的第二導電塗層於背板上的正投影面積小於發光層於背板上的正投影面積。In an embodiment of the present invention, the orthographic projection area of the second conductive coating on the backplane is smaller than the orthographic projection area of the light-emitting layer on the backplane.
在本發明的一實施例中,上述的發光裝置更包括絕緣層。絕緣層配置於背板與第一導電塗層之間。In an embodiment of the present invention, the above-mentioned light-emitting device further includes an insulating layer. The insulating layer is disposed between the back plate and the first conductive coating.
在本發明的一實施例中,上述的絕緣層在背板上的正投影面積小於或等於背板的表面積。In an embodiment of the present invention, the orthographic projection area of the aforementioned insulating layer on the backplane is less than or equal to the surface area of the backplane.
在本發明的一實施例中,上述的第一金屬件與第二金屬件的形狀包括圓柱體或矩形柱體。In an embodiment of the present invention, the shapes of the aforementioned first metal piece and the second metal piece include a cylinder or a rectangular cylinder.
在本發明的一實施例中,上述的第一導電塗層的材質與第二導電塗層的材質包括銅漿。In an embodiment of the present invention, the material of the first conductive coating and the material of the second conductive coating include copper paste.
基於上述,在本發明的發光裝置的設計中,第一金屬件與第二金屬件是埋設於背板內,且第一金屬件的兩端分別接觸供電組件與第一導電塗層,而第二金屬件的兩端分別接觸供電組件與第二導電塗層。相較於習知在二導電塗層的側邊以外接二條導線的方式電性連接至供電的電路板而言,本發明的第一導電塗層與第二導電塗層可分別透過埋設的第一金屬件與第二金屬件而電性連接至供電組件,可具有較美觀的外型,進而增強使用者體驗。Based on the above, in the design of the light-emitting device of the present invention, the first metal piece and the second metal piece are buried in the back plate, and both ends of the first metal piece contact the power supply component and the first conductive coating respectively, and the first metal piece Two ends of the two metal parts respectively contact the power supply component and the second conductive coating. Compared with the conventional electrical connection to the power supply circuit board by connecting two wires on the sides of the two conductive coatings, the first conductive coating and the second conductive coating of the present invention can respectively pass through the buried first The one metal piece and the second metal piece are electrically connected to the power supply assembly, which can have a more beautiful appearance, thereby enhancing user experience.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
圖1繪示為本發明一實施例的一種發光裝置的俯視示意圖。圖2為沿圖1的線Ⅰ-Ⅰ’的剖面示意圖。請同時參照圖1與圖2,本實施例的發光裝置100包括背板110、第一導電塗層120、發光層130、第二導電塗層140、第一金屬件150、第二金屬件160以及供電組件170。背板110具有彼此相對的上表面111與下表面112,其中背板110例如是塑膠板。第一導電塗層120配置於背板110的上表面111,其中第一導電塗層120的材質例如是銅漿,但並不以此為限。發光層130配置於第一導電塗層120上,其中發光層130的材質例如是磷,但並不以此為限。第二導電塗層140配置於發光層130上,其中第二導電塗層140的材質例如是銅漿,但並不以此為限。FIG. 1 is a schematic top view of a light-emitting device according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the line I-I' of Fig. 1. 1 and 2 at the same time, the
也就是說,本實施例的第一導電塗層120、發光層130以及第二導電塗層140皆配置於背板110的上表面111上。第二導電塗層140與第一導電塗層120分別位於發光層130的相對兩側,且發光層130與背板110分別位於第一導電塗層120的相對兩側。較佳地,第一導電塗層120在背板110上的正投影面積小於背板110,且第一導電塗層120在背板110上的正投影面積大於第二導電塗層140於背板110上的正投影面積,但並不以此為限,只要第一導電塗層120與第二導電塗層140不接觸即可。第二導電塗層140於背板110上的正投影面積小於發光層130於背板110上的正投影面積,以免影響發光。In other words, the first
特別是,本實施例的第一金屬件150埋設於背板110內且具有彼此相對的第一端151與第二端152。第一金屬件150的第一端151切齊背板110的下表面112,而第一金屬件150的第二端152穿出背板110的上表面111且接觸第一導電塗層120。此處,第一金屬件150的形狀例如是圓柱體,其中第一端151與第二端152的端面例如是圓形,但並不以此為限。第二金屬件160埋設於背板110內且具有彼此相對的第三端161與第四端162。第二金屬件160的第三端161切齊背板110的下表面112,而第二金屬件160的第四端162穿出背板110的上表面111且不接觸第一導電塗層120而接觸第二導電塗層140。此處,第二金屬件160的形狀例如是矩形柱體,其中第三端161與第四端162的端面例如是矩形,但並不以此為限。供電組件170例如是帶電的電路板組件(Printed Circuit Board Assembly, PCBA)或其他帶電的電子構件,配置於背板110的下表面112上,其中第一金屬件150的第一端151與第二金屬件160的第三端161接觸供電組件170。例如是使第一金屬件150的第一端151與第二金屬件160的第三端161分別電性連接至供電組件170中的線路層171,但不以此為限。In particular, the
再者,本實施例的發光裝置100可更包括介質層180,其中介質層180配置於發光層130與第一導電塗層120之間,以有效地隔離第一導電塗層120與第二導電塗層140,以避免短路。更詳細來說,在本實施例中,第一導電塗層120具有第一開口121,而介質層180具有第二開口181,且發光層130具有第三開口131,其中第一開口121、第二開口181及第三開口131相互連通。第二金屬件160的第四端162可穿過第一開口121、第二開口181及第三開口131以不接觸第一導電圖層120的方式而接觸第二導電塗層140。也就是說,透過第一開口121、第二開口181及第三開口131的設計,第二金屬件160不會接觸第一導電塗層120。Furthermore, the light-
此外,本實施例的發光裝置100可更包括絕緣層190,其中絕緣層190配置於背板110與第一導電塗層120之間,以隔離背板110與第一導電塗層120,進而確保背板110與第一導電塗層120彼此電性隔離。此處,絕緣層190在背板110上的正投影面積小於背板110的表面積,但不以此為限。在一些實施例中,絕緣層在背板上的正投影面積也可以等於背板的表面積。In addition, the light-
簡言之,在本實施例的發光裝置100中,埋設的第一金屬件150可電性連接第一導電塗層120與供電組件170,而埋設的第二金屬件160可電性連接第二導電塗層140與供電組件170。藉此,可透過第一金屬件150與第二金屬件160的設置來取代習知設置於二導電塗層外側的外接二導線。如此一來,本實施例的發光裝置100可具有較美觀的外型。In short, in the light-
值得一提的是,第一金屬件150的第二端152接觸第一導電塗層120,意即,第一金屬件150的第二端152可切齊第一導電塗層120的表面122或內埋於第一導電塗層120內。同樣地,第二金屬件160的第四端162接觸第二導電塗層140,意即,第二金屬件160的第四端162可切齊第二導電塗層140的表面142或內埋於第二導電塗層140內。只要第一金屬件150的第二端152有直接接觸到第一導電塗層120,及第二金屬件160的第四端162有直接接觸第二導電塗層140,皆屬於本發明所欲保護的範圍。It is worth mentioning that the
此外,本發明並不限制第一金屬件150與第二金屬件160的形狀。於一實施例中,第一金屬件150與第二金屬件160的形狀亦可相同,如包括圓柱體、矩形柱體或其他適當的形狀,此仍屬於本發明所欲保護的範圍。In addition, the present invention does not limit the shapes of the
綜上所述,在本發明實施例的發光裝置的設計中,第一金屬件與第二金屬件是埋設於背板內,且第一金屬件的兩端分別接觸供電組件與第一導電塗層,而第二金屬件的兩端分別接觸供電組件與第二導電塗層。相較於習知在導電塗層的外側以外接二條導線的方式電性連接至供電的電路板而言,本發明的第一導電塗層與第二導電塗層可分別透過埋設的第一金屬件與第二金屬件而電性連接供電組件,可具有較美觀的外型,進而增強使用者體驗。In summary, in the design of the light-emitting device of the embodiment of the present invention, the first metal piece and the second metal piece are embedded in the back plate, and both ends of the first metal piece contact the power supply component and the first conductive coating, respectively. The two ends of the second metal member respectively contact the power supply component and the second conductive coating. Compared with the conventional electrical connection to the power supply circuit board by externally connecting two wires on the outside of the conductive coating, the first conductive coating and the second conductive coating of the present invention can respectively penetrate the embedded first metal And the second metal piece is electrically connected to the power supply component, which can have a more beautiful appearance, thereby enhancing the user experience.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
100:發光裝置100: Light-emitting device
110:背板110: Backplane
111:上表面111: upper surface
112:下表面112: lower surface
120:第一導電塗層120: The first conductive coating
121:第一開口121: The first opening
122、142:表面122, 142: Surface
130:發光層130: luminescent layer
131:第三開口131: Third Opening
140:第二導電塗層140: Second conductive coating
150:第一金屬件150: The first metal piece
151:第一端151: first end
152:第二端152: second end
160:第二金屬件160: The second metal piece
161:第三端161: third end
162:第四端162: fourth end
170:供電組件170: power supply components
171:線路層171: circuit layer
180:介質層180: dielectric layer
181:第二開口181: second opening
190:絕緣層190: Insulation layer
圖1繪示為本發明一實施例的一種發光裝置的俯視示意圖。 圖2為沿圖1的線Ⅰ-Ⅰ’的剖面示意圖。 FIG. 1 is a schematic top view of a light-emitting device according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the line I-I' of Fig. 1.
100:發光裝置 100: Light-emitting device
110:背板 110: Backplane
111:上表面 111: upper surface
112:下表面 112: lower surface
120:第一導電塗層 120: The first conductive coating
121:第一開口 121: The first opening
122、142:表面 122, 142: Surface
130:發光層 130: luminescent layer
131:第三開口 131: Third Opening
140:第二導電塗層 140: Second conductive coating
150:第一金屬件 150: The first metal piece
151:第一端 151: first end
152:第二端 152: second end
160:第二金屬件 160: The second metal piece
161:第三端 161: third end
162:第四端 162: fourth end
170:供電組件 170: power supply components
171:線路層 171: circuit layer
180:介質層 180: dielectric layer
181:第二開口 181: second opening
190:絕緣層 190: Insulation layer
Claims (10)
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TW108129608A TWI718630B (en) | 2019-08-20 | 2019-08-20 | Light emitting device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200403603A (en) * | 2002-08-30 | 2004-03-01 | Tomy Co Ltd | Electroluminescence light emitting display system |
TW200602376A (en) * | 2004-05-21 | 2006-01-16 | Showa Denko Kk | Electroconductive composition and application thereof |
CN104094431A (en) * | 2012-02-03 | 2014-10-08 | 皇家飞利浦有限公司 | Oled device and manufacture thereof |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200403603A (en) * | 2002-08-30 | 2004-03-01 | Tomy Co Ltd | Electroluminescence light emitting display system |
TW200602376A (en) * | 2004-05-21 | 2006-01-16 | Showa Denko Kk | Electroconductive composition and application thereof |
CN104094431A (en) * | 2012-02-03 | 2014-10-08 | 皇家飞利浦有限公司 | Oled device and manufacture thereof |
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