TWI718630B - Light emitting device - Google Patents

Light emitting device Download PDF

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TWI718630B
TWI718630B TW108129608A TW108129608A TWI718630B TW I718630 B TWI718630 B TW I718630B TW 108129608 A TW108129608 A TW 108129608A TW 108129608 A TW108129608 A TW 108129608A TW I718630 B TWI718630 B TW I718630B
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conductive coating
light
back plate
emitting device
opening
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TW108129608A
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TW202109910A (en
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黃昭霖
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和碩聯合科技股份有限公司
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Abstract

A light emitting device includes a back plate, a first conductive coating layer, a light emitting layer, a second conductive coating layer, a first metal element, a second metal element, and a power supply assembly. The back plate has an upper surface and a lower surface opposite to each other. The first conductive coating layer is disposed on the upper surface of the back plate. The light emitting layer is disposed on the first conductive coating layer. The second conductive coating layer is disposed on the light emitting layer. The first metal element is embedded in the back plate and has a first end and a second end. The first end is flush with the lower surface, and the second end passes through the upper surface to contact the first conductive coating layer. The second metal element is embedded in the back plate and has a third end and a fourth end. The third end is flush with the lower surface, and the fourth end passes through the upper surface and contacts the second conductive coating layer without contacting the first conductive coating layer. The first end of the first metal element and the third end of the second metal element contact the power supply assembly.

Description

發光裝置Light-emitting device

本發明是有關於一種發光裝置,且特別是有關於一種具有較佳美觀外型,能增強使用者體驗的發光裝置。The present invention relates to a light-emitting device, and more particularly to a light-emitting device with a better appearance and an enhanced user experience.

在現有的發光裝置中,為了使發光層發光,會分別在發光層兩側的二導電塗層側邊以外接二條導線的方式電性連接至供電的電路板上。當二條導線通電時,則可使位於二導電塗層之間的發光層發光。然而,外接的二條導線會破壞發光裝置的整體外觀,而影響使用者體驗。此外,縱使可藉由增設其他的構件來隱藏二條導線,但相對地卻也會有製作成本增加的問題。In the existing light-emitting device, in order to make the light-emitting layer emit light, the sides of the two conductive coatings on both sides of the light-emitting layer are electrically connected to the power supply circuit board by means of two external wires. When the two wires are energized, the light-emitting layer located between the two conductive coatings can emit light. However, the two external wires will damage the overall appearance of the light-emitting device and affect the user experience. In addition, even if other components can be added to hide the two wires, there is a problem of relatively increased manufacturing costs.

本發明提供一種發光裝置,可具有較美觀的外型,進而增強使用者體驗。The present invention provides a light emitting device, which can have a more beautiful appearance, thereby enhancing user experience.

本發明的發光裝置包括背板、第一導電塗層、發光層、第二導電塗層、第一金屬件、第二金屬件以及供電組件。背板具有彼此相對的上表面與下表面。第一導電塗層配置於背板的上表面。發光層配置於第一導電塗層上。第二導電塗層配置於發光層上。第一金屬件埋設於背板內且具有第一端與第二端。第一端切齊下表面,第二端穿出上表面而接觸第一導電塗層。第二金屬件埋設於背板內且具有第三端與第四端。第三端切齊下表面,第四端穿出上表面且不接觸第一導電塗層而接觸第二導電塗層。供電組件配置於背板的下表面上。第一金屬件的第一端與第二金屬件的第三端接觸供電組件。The light-emitting device of the present invention includes a back plate, a first conductive coating, a light-emitting layer, a second conductive coating, a first metal piece, a second metal piece, and a power supply component. The back plate has an upper surface and a lower surface opposite to each other. The first conductive coating is disposed on the upper surface of the back plate. The light-emitting layer is configured on the first conductive coating. The second conductive coating is disposed on the light-emitting layer. The first metal piece is buried in the back plate and has a first end and a second end. The first end cuts the lower surface, and the second end penetrates the upper surface to contact the first conductive coating. The second metal piece is embedded in the back plate and has a third end and a fourth end. The third end is cut to the lower surface, and the fourth end penetrates the upper surface and does not contact the first conductive coating but contacts the second conductive coating. The power supply component is arranged on the lower surface of the backplane. The first end of the first metal piece and the third end of the second metal piece contact the power supply component.

在本發明的一實施例中,上述的第一導電塗層在背板上的正投影面積大於第二導電塗層於背板上的正投影面積。In an embodiment of the present invention, the orthographic projected area of the first conductive coating on the back plate is larger than the orthographic projected area of the second conductive coating on the back plate.

在本發明的一實施例中,上述的第一導電塗層在背板上的正投影面積小於背板。In an embodiment of the present invention, the orthographic projection area of the first conductive coating on the back plate is smaller than that of the back plate.

在本發明的一實施例中,上述的發光裝置更包括介質層。介質層配置於發光層與第一導電塗層之間。In an embodiment of the present invention, the above-mentioned light-emitting device further includes a dielectric layer. The medium layer is disposed between the light-emitting layer and the first conductive coating.

在本發明的一實施例中,上述的第一導電塗層具有第一開口,介質層具有第二開口,發光層具有第三開口。第一開口、第二開口及第三開口相互連通。第二金屬件的第四端穿過第一開口、第二開口及第三開口而接觸第二導電塗層。In an embodiment of the present invention, the aforementioned first conductive coating has a first opening, the dielectric layer has a second opening, and the light-emitting layer has a third opening. The first opening, the second opening, and the third opening communicate with each other. The fourth end of the second metal piece passes through the first opening, the second opening, and the third opening to contact the second conductive coating.

在本發明的一實施例中,上述的第二導電塗層於背板上的正投影面積小於發光層於背板上的正投影面積。In an embodiment of the present invention, the orthographic projection area of the second conductive coating on the backplane is smaller than the orthographic projection area of the light-emitting layer on the backplane.

在本發明的一實施例中,上述的發光裝置更包括絕緣層。絕緣層配置於背板與第一導電塗層之間。In an embodiment of the present invention, the above-mentioned light-emitting device further includes an insulating layer. The insulating layer is disposed between the back plate and the first conductive coating.

在本發明的一實施例中,上述的絕緣層在背板上的正投影面積小於或等於背板的表面積。In an embodiment of the present invention, the orthographic projection area of the aforementioned insulating layer on the backplane is less than or equal to the surface area of the backplane.

在本發明的一實施例中,上述的第一金屬件與第二金屬件的形狀包括圓柱體或矩形柱體。In an embodiment of the present invention, the shapes of the aforementioned first metal piece and the second metal piece include a cylinder or a rectangular cylinder.

在本發明的一實施例中,上述的第一導電塗層的材質與第二導電塗層的材質包括銅漿。In an embodiment of the present invention, the material of the first conductive coating and the material of the second conductive coating include copper paste.

基於上述,在本發明的發光裝置的設計中,第一金屬件與第二金屬件是埋設於背板內,且第一金屬件的兩端分別接觸供電組件與第一導電塗層,而第二金屬件的兩端分別接觸供電組件與第二導電塗層。相較於習知在二導電塗層的側邊以外接二條導線的方式電性連接至供電的電路板而言,本發明的第一導電塗層與第二導電塗層可分別透過埋設的第一金屬件與第二金屬件而電性連接至供電組件,可具有較美觀的外型,進而增強使用者體驗。Based on the above, in the design of the light-emitting device of the present invention, the first metal piece and the second metal piece are buried in the back plate, and both ends of the first metal piece contact the power supply component and the first conductive coating respectively, and the first metal piece Two ends of the two metal parts respectively contact the power supply component and the second conductive coating. Compared with the conventional electrical connection to the power supply circuit board by connecting two wires on the sides of the two conductive coatings, the first conductive coating and the second conductive coating of the present invention can respectively pass through the buried first The one metal piece and the second metal piece are electrically connected to the power supply assembly, which can have a more beautiful appearance, thereby enhancing user experience.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

圖1繪示為本發明一實施例的一種發光裝置的俯視示意圖。圖2為沿圖1的線Ⅰ-Ⅰ’的剖面示意圖。請同時參照圖1與圖2,本實施例的發光裝置100包括背板110、第一導電塗層120、發光層130、第二導電塗層140、第一金屬件150、第二金屬件160以及供電組件170。背板110具有彼此相對的上表面111與下表面112,其中背板110例如是塑膠板。第一導電塗層120配置於背板110的上表面111,其中第一導電塗層120的材質例如是銅漿,但並不以此為限。發光層130配置於第一導電塗層120上,其中發光層130的材質例如是磷,但並不以此為限。第二導電塗層140配置於發光層130上,其中第二導電塗層140的材質例如是銅漿,但並不以此為限。FIG. 1 is a schematic top view of a light-emitting device according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the line I-I' of Fig. 1. 1 and 2 at the same time, the light emitting device 100 of this embodiment includes a back plate 110, a first conductive coating 120, a light emitting layer 130, a second conductive coating 140, a first metal member 150, and a second metal member 160 And power supply assembly 170. The back plate 110 has an upper surface 111 and a lower surface 112 opposite to each other, wherein the back plate 110 is, for example, a plastic plate. The first conductive coating 120 is disposed on the upper surface 111 of the back plate 110, and the material of the first conductive coating 120 is, for example, copper paste, but it is not limited thereto. The light-emitting layer 130 is disposed on the first conductive coating 120, and the material of the light-emitting layer 130 is, for example, phosphor, but it is not limited thereto. The second conductive coating 140 is disposed on the light-emitting layer 130, and the material of the second conductive coating 140 is, for example, copper paste, but it is not limited thereto.

也就是說,本實施例的第一導電塗層120、發光層130以及第二導電塗層140皆配置於背板110的上表面111上。第二導電塗層140與第一導電塗層120分別位於發光層130的相對兩側,且發光層130與背板110分別位於第一導電塗層120的相對兩側。較佳地,第一導電塗層120在背板110上的正投影面積小於背板110,且第一導電塗層120在背板110上的正投影面積大於第二導電塗層140於背板110上的正投影面積,但並不以此為限,只要第一導電塗層120與第二導電塗層140不接觸即可。第二導電塗層140於背板110上的正投影面積小於發光層130於背板110上的正投影面積,以免影響發光。In other words, the first conductive coating 120, the light-emitting layer 130, and the second conductive coating 140 of this embodiment are all disposed on the upper surface 111 of the back plate 110. The second conductive coating 140 and the first conductive coating 120 are respectively located on opposite sides of the light emitting layer 130, and the light emitting layer 130 and the back plate 110 are respectively located on opposite sides of the first conductive coating 120. Preferably, the orthographic area of the first conductive coating 120 on the backplate 110 is smaller than that of the backplate 110, and the orthographic area of the first conductive coating 120 on the backplate 110 is larger than that of the second conductive coating 140 on the backplate. The orthographic projection area on 110 is not limited to this, as long as the first conductive coating 120 and the second conductive coating 140 are not in contact with each other. The orthographic projection area of the second conductive coating 140 on the backplate 110 is smaller than the orthographic area of the light-emitting layer 130 on the backplate 110 so as not to affect the light emission.

特別是,本實施例的第一金屬件150埋設於背板110內且具有彼此相對的第一端151與第二端152。第一金屬件150的第一端151切齊背板110的下表面112,而第一金屬件150的第二端152穿出背板110的上表面111且接觸第一導電塗層120。此處,第一金屬件150的形狀例如是圓柱體,其中第一端151與第二端152的端面例如是圓形,但並不以此為限。第二金屬件160埋設於背板110內且具有彼此相對的第三端161與第四端162。第二金屬件160的第三端161切齊背板110的下表面112,而第二金屬件160的第四端162穿出背板110的上表面111且不接觸第一導電塗層120而接觸第二導電塗層140。此處,第二金屬件160的形狀例如是矩形柱體,其中第三端161與第四端162的端面例如是矩形,但並不以此為限。供電組件170例如是帶電的電路板組件(Printed Circuit Board Assembly, PCBA)或其他帶電的電子構件,配置於背板110的下表面112上,其中第一金屬件150的第一端151與第二金屬件160的第三端161接觸供電組件170。例如是使第一金屬件150的第一端151與第二金屬件160的第三端161分別電性連接至供電組件170中的線路層171,但不以此為限。In particular, the first metal member 150 of this embodiment is embedded in the back plate 110 and has a first end 151 and a second end 152 opposite to each other. The first end 151 of the first metal piece 150 is aligned with the lower surface 112 of the back plate 110, and the second end 152 of the first metal piece 150 penetrates the upper surface 111 of the back plate 110 and contacts the first conductive coating 120. Here, the shape of the first metal member 150 is, for example, a cylinder, and the end surfaces of the first end 151 and the second end 152 are, for example, circular, but not limited to this. The second metal member 160 is embedded in the back plate 110 and has a third end 161 and a fourth end 162 opposite to each other. The third end 161 of the second metal piece 160 is aligned with the lower surface 112 of the back plate 110, and the fourth end 162 of the second metal piece 160 penetrates the upper surface 111 of the back plate 110 and does not contact the first conductive coating 120. Contact the second conductive coating 140. Here, the shape of the second metal member 160 is, for example, a rectangular column, and the end surfaces of the third end 161 and the fourth end 162 are, for example, rectangular, but it is not limited thereto. The power supply assembly 170 is, for example, a printed circuit board assembly (PCBA) or other charged electronic components, and is disposed on the lower surface 112 of the back plate 110, wherein the first end 151 and the second end 151 of the first metal part 150 The third end 161 of the metal piece 160 contacts the power supply assembly 170. For example, the first end 151 of the first metal member 150 and the third end 161 of the second metal member 160 are electrically connected to the circuit layer 171 of the power supply assembly 170, but not limited to this.

再者,本實施例的發光裝置100可更包括介質層180,其中介質層180配置於發光層130與第一導電塗層120之間,以有效地隔離第一導電塗層120與第二導電塗層140,以避免短路。更詳細來說,在本實施例中,第一導電塗層120具有第一開口121,而介質層180具有第二開口181,且發光層130具有第三開口131,其中第一開口121、第二開口181及第三開口131相互連通。第二金屬件160的第四端162可穿過第一開口121、第二開口181及第三開口131以不接觸第一導電圖層120的方式而接觸第二導電塗層140。也就是說,透過第一開口121、第二開口181及第三開口131的設計,第二金屬件160不會接觸第一導電塗層120。Furthermore, the light-emitting device 100 of this embodiment may further include a dielectric layer 180, wherein the dielectric layer 180 is disposed between the light-emitting layer 130 and the first conductive coating 120 to effectively isolate the first conductive coating 120 from the second conductive coating 120. Coating 140 to avoid short circuits. In more detail, in this embodiment, the first conductive coating 120 has a first opening 121, the dielectric layer 180 has a second opening 181, and the light-emitting layer 130 has a third opening 131, wherein the first opening 121, the second opening 121 The two openings 181 and the third opening 131 communicate with each other. The fourth end 162 of the second metal member 160 can pass through the first opening 121, the second opening 181, and the third opening 131 to contact the second conductive coating 140 without contacting the first conductive layer 120. In other words, through the design of the first opening 121, the second opening 181 and the third opening 131, the second metal member 160 will not contact the first conductive coating 120.

此外,本實施例的發光裝置100可更包括絕緣層190,其中絕緣層190配置於背板110與第一導電塗層120之間,以隔離背板110與第一導電塗層120,進而確保背板110與第一導電塗層120彼此電性隔離。此處,絕緣層190在背板110上的正投影面積小於背板110的表面積,但不以此為限。在一些實施例中,絕緣層在背板上的正投影面積也可以等於背板的表面積。In addition, the light-emitting device 100 of this embodiment may further include an insulating layer 190, wherein the insulating layer 190 is disposed between the back plate 110 and the first conductive coating 120 to isolate the back plate 110 and the first conductive coating 120, thereby ensuring The back plate 110 and the first conductive coating 120 are electrically isolated from each other. Here, the orthographic projection area of the insulating layer 190 on the back plate 110 is smaller than the surface area of the back plate 110, but it is not limited to this. In some embodiments, the orthographic projection area of the insulating layer on the backplane may also be equal to the surface area of the backplane.

簡言之,在本實施例的發光裝置100中,埋設的第一金屬件150可電性連接第一導電塗層120與供電組件170,而埋設的第二金屬件160可電性連接第二導電塗層140與供電組件170。藉此,可透過第一金屬件150與第二金屬件160的設置來取代習知設置於二導電塗層外側的外接二導線。如此一來,本實施例的發光裝置100可具有較美觀的外型。In short, in the light-emitting device 100 of this embodiment, the buried first metal member 150 can be electrically connected to the first conductive coating 120 and the power supply component 170, and the buried second metal member 160 can be electrically connected to the second The conductive coating 140 and the power supply component 170. In this way, the arrangement of the first metal piece 150 and the second metal piece 160 can replace the conventional external two wires arranged on the outside of the two conductive coatings. In this way, the light emitting device 100 of this embodiment can have a more beautiful appearance.

值得一提的是,第一金屬件150的第二端152接觸第一導電塗層120,意即,第一金屬件150的第二端152可切齊第一導電塗層120的表面122或內埋於第一導電塗層120內。同樣地,第二金屬件160的第四端162接觸第二導電塗層140,意即,第二金屬件160的第四端162可切齊第二導電塗層140的表面142或內埋於第二導電塗層140內。只要第一金屬件150的第二端152有直接接觸到第一導電塗層120,及第二金屬件160的第四端162有直接接觸第二導電塗層140,皆屬於本發明所欲保護的範圍。It is worth mentioning that the second end 152 of the first metal member 150 is in contact with the first conductive coating 120, which means that the second end 152 of the first metal member 150 can be cut to the surface 122 of the first conductive coating 120 or It is buried in the first conductive coating 120. Similarly, the fourth end 162 of the second metal member 160 contacts the second conductive coating 140, which means that the fourth end 162 of the second metal member 160 can be cut to the surface 142 of the second conductive coating 140 or buried in Inside the second conductive coating 140. As long as the second end 152 of the first metal piece 150 has direct contact with the first conductive coating 120, and the fourth end 162 of the second metal piece 160 has direct contact with the second conductive coating 140, it belongs to the protection of the present invention. Range.

此外,本發明並不限制第一金屬件150與第二金屬件160的形狀。於一實施例中,第一金屬件150與第二金屬件160的形狀亦可相同,如包括圓柱體、矩形柱體或其他適當的形狀,此仍屬於本發明所欲保護的範圍。In addition, the present invention does not limit the shapes of the first metal member 150 and the second metal member 160. In one embodiment, the shape of the first metal member 150 and the second metal member 160 may also be the same, such as a cylinder, a rectangular column, or other suitable shapes, which still fall within the scope of the present invention.

綜上所述,在本發明實施例的發光裝置的設計中,第一金屬件與第二金屬件是埋設於背板內,且第一金屬件的兩端分別接觸供電組件與第一導電塗層,而第二金屬件的兩端分別接觸供電組件與第二導電塗層。相較於習知在導電塗層的外側以外接二條導線的方式電性連接至供電的電路板而言,本發明的第一導電塗層與第二導電塗層可分別透過埋設的第一金屬件與第二金屬件而電性連接供電組件,可具有較美觀的外型,進而增強使用者體驗。In summary, in the design of the light-emitting device of the embodiment of the present invention, the first metal piece and the second metal piece are embedded in the back plate, and both ends of the first metal piece contact the power supply component and the first conductive coating, respectively. The two ends of the second metal member respectively contact the power supply component and the second conductive coating. Compared with the conventional electrical connection to the power supply circuit board by externally connecting two wires on the outside of the conductive coating, the first conductive coating and the second conductive coating of the present invention can respectively penetrate the embedded first metal And the second metal piece is electrically connected to the power supply component, which can have a more beautiful appearance, thereby enhancing the user experience.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100:發光裝置100: Light-emitting device

110:背板110: Backplane

111:上表面111: upper surface

112:下表面112: lower surface

120:第一導電塗層120: The first conductive coating

121:第一開口121: The first opening

122、142:表面122, 142: Surface

130:發光層130: luminescent layer

131:第三開口131: Third Opening

140:第二導電塗層140: Second conductive coating

150:第一金屬件150: The first metal piece

151:第一端151: first end

152:第二端152: second end

160:第二金屬件160: The second metal piece

161:第三端161: third end

162:第四端162: fourth end

170:供電組件170: power supply components

171:線路層171: circuit layer

180:介質層180: dielectric layer

181:第二開口181: second opening

190:絕緣層190: Insulation layer

圖1繪示為本發明一實施例的一種發光裝置的俯視示意圖。 圖2為沿圖1的線Ⅰ-Ⅰ’的剖面示意圖。 FIG. 1 is a schematic top view of a light-emitting device according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along the line I-I' of Fig. 1.

100:發光裝置 100: Light-emitting device

110:背板 110: Backplane

111:上表面 111: upper surface

112:下表面 112: lower surface

120:第一導電塗層 120: The first conductive coating

121:第一開口 121: The first opening

122、142:表面 122, 142: Surface

130:發光層 130: luminescent layer

131:第三開口 131: Third Opening

140:第二導電塗層 140: Second conductive coating

150:第一金屬件 150: The first metal piece

151:第一端 151: first end

152:第二端 152: second end

160:第二金屬件 160: The second metal piece

161:第三端 161: third end

162:第四端 162: fourth end

170:供電組件 170: power supply components

171:線路層 171: circuit layer

180:介質層 180: dielectric layer

181:第二開口 181: second opening

190:絕緣層 190: Insulation layer

Claims (10)

一種發光裝置,包括:一背板,具有彼此相對的一上表面與一下表面;一第一導電塗層,配置於該背板的該上表面;一發光層,配置於該第一導電塗層上;一第二導電塗層,配置於該發光層上;一第一金屬件,埋設於該背板內,且具有一第一端與一第二端,其中該第一端切齊該下表面,該第二端穿出該上表面而接觸該第一導電塗層;一第二金屬件,埋設於該背板內,且具有一第三端與一第四端,其中該第三端切齊該下表面,該第四端穿出該上表面且不接觸該第一導電塗層而接觸該第二導電塗層;以及一供電組件,配置於該背板的該下表面上,且該第一金屬件的該第一端與該第二金屬件的該第三端接觸該供電組件,其中該第二金屬件電性連接至該第二導電塗層與該供電組件,且該第二金屬件不接觸該第一導電塗層。 A light-emitting device includes: a back plate having an upper surface and a lower surface opposite to each other; a first conductive coating layer disposed on the upper surface of the back plate; a light-emitting layer disposed on the first conductive coating layer On; a second conductive coating, configured on the light-emitting layer; a first metal piece, buried in the back plate, and has a first end and a second end, wherein the first end is aligned with the bottom Surface, the second end penetrates the upper surface to contact the first conductive coating; a second metal piece is embedded in the back plate and has a third end and a fourth end, wherein the third end Cutting the lower surface, the fourth end passes through the upper surface and does not contact the first conductive coating but contacts the second conductive coating; and a power supply component is disposed on the lower surface of the backplane, and The first end of the first metal piece and the third end of the second metal piece contact the power supply component, wherein the second metal piece is electrically connected to the second conductive coating and the power supply component, and the first The two metal parts do not touch the first conductive coating. 如申請專利範圍第1項所述的發光裝置,其中該第一導電塗層在該背板上的正投影面積大於該第二導電塗層於該背板上的正投影面積。 According to the light-emitting device described in claim 1, wherein the orthographic projection area of the first conductive coating on the backplane is larger than the orthographic projection area of the second conductive coating on the backplane. 如申請專利範圍第1項所述的發光裝置,其中該第一導電塗層在該背板上的正投影面積小於該背板。 The light-emitting device according to the first item of the scope of patent application, wherein the orthographic projection area of the first conductive coating on the back plate is smaller than that of the back plate. 如申請專利範圍第1項所述的發光裝置,更包括: 一介質層,配置於該發光層與該第一導電塗層之間。 The light-emitting device described in item 1 of the scope of patent application further includes: A dielectric layer is arranged between the light-emitting layer and the first conductive coating. 如申請專利範圍第4項所述的發光裝置,其中該第一導電塗層具有一第一開口,該介質層具有一第二開口,該發光層具有一第三開口,該第一開口、該第二開口及該第三開口相互連通,且該第二金屬件的該第四端穿過該第一開口、該第二開口及該第三開口而接觸該第二導電塗層。 The light-emitting device according to claim 4, wherein the first conductive coating has a first opening, the dielectric layer has a second opening, the light-emitting layer has a third opening, the first opening, the The second opening and the third opening are communicated with each other, and the fourth end of the second metal piece passes through the first opening, the second opening and the third opening to contact the second conductive coating. 如申請專利範圍第1項所述的發光裝置,其中該第二導電塗層於該背板上的正投影面積小於該發光層於該背板上的正投影面積。 The light-emitting device according to claim 1, wherein the orthographic projection area of the second conductive coating on the backplane is smaller than the orthographic projection area of the light-emitting layer on the backplane. 如申請專利範圍第1項所述的發光裝置,更包括:一絕緣層,配置於該背板與該第一導電塗層之間。 The light-emitting device described in item 1 of the scope of patent application further includes: an insulating layer disposed between the back plate and the first conductive coating. 如申請專利範圍第7項所述的發光裝置,其中該絕緣層在該背板上的正投影面積小於或等於該背板的表面積。 The light-emitting device according to item 7 of the scope of patent application, wherein the orthographic projection area of the insulating layer on the back plate is less than or equal to the surface area of the back plate. 如申請專利範圍第1項所述的發光裝置,其中該第一金屬件與該第二金屬件的形狀包括圓柱體或矩形柱體。 According to the light-emitting device described in claim 1, wherein the shape of the first metal piece and the second metal piece includes a cylinder or a rectangular column. 如申請專利範圍第1項所述的發光裝置,其中該第一導電塗層的材質與該第二導電塗層的材質包括銅漿。According to the light-emitting device described in claim 1, wherein the material of the first conductive coating and the material of the second conductive coating include copper paste.
TW108129608A 2019-08-20 2019-08-20 Light emitting device TWI718630B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200403603A (en) * 2002-08-30 2004-03-01 Tomy Co Ltd Electroluminescence light emitting display system
TW200602376A (en) * 2004-05-21 2006-01-16 Showa Denko Kk Electroconductive composition and application thereof
CN104094431A (en) * 2012-02-03 2014-10-08 皇家飞利浦有限公司 Oled device and manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200403603A (en) * 2002-08-30 2004-03-01 Tomy Co Ltd Electroluminescence light emitting display system
TW200602376A (en) * 2004-05-21 2006-01-16 Showa Denko Kk Electroconductive composition and application thereof
CN104094431A (en) * 2012-02-03 2014-10-08 皇家飞利浦有限公司 Oled device and manufacture thereof

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