TWI717868B - Image module and biometric device using the same - Google Patents

Abstract

An image module includes a photosensitive element and a light-screening structure disposed on the photosensitive element. The light-screening structure includes a light-transmitting layer, a first light-shielding layer, a second light-shielding layer and a condensing structure. The first light-shielding layer and the second light-shielding layer are disposed in the light-transmitting layer, and the second light-shielding layer is disposed between the first light-shielding layer and the photosensitive element. The first light-shielding layer has a first light passage portion and the second light-shielding layer has a second light passage portion. The condensing structure is disposed on the light-transmitting layer. The first light passage portion and the second light passage portion correspond to the photosensitive element. Light through the condensing structure produces a concentrated beam. The aperture of the first light passage portion and the aperture of the second light passage portion are respectively adjusted according to the width of the concentrated beam at the first light-shielding layer and at the second light-shielding layer.

Description

Imaging module and biometric identification device using it

The present disclosure relates to an imaging module and a biometric device using the same, and more particularly to a thin-shaped imaging module and a biometric device using the same.

The image module can be used in various applications. For example, the imaging module can be used in biometrics technology. Biometric identification technology refers to a technology that uses the physiological or behavioral characteristics of the human body to achieve identity recognition and authentication. The physiological characteristics of the human body can include fingerprints, palm prints, vein distribution, iris, retina, and facial features, for example. Nowadays, biometrics technology has been applied in digital assistants, smart phones, notebook computers, financial cards, electronic wallets, customs clearance and other fields that have high demands for information privacy and personal safety.

Devices that use biometric technology (for example, fingerprint recognition devices, face recognition devices, iris recognition devices, etc.) often require a larger volume to accommodate the imaging module in the device, which is not conducive to application in miniaturized or portable electronics In the installation. If the components in the imaging module are omitted to achieve the goal of thinning, the identification success rate of the biometric identification device may be reduced.

According to an embodiment of the present disclosure, an imaging module and a biometric identification device using it are provided, which can be applied to a miniaturized or portable electronic device. In addition, it also helps to reduce crosstalk to improve the accuracy of identifying feature points of organisms.

The disclosed embodiment includes an imaging module. The imaging module includes a photosensitive element and a light screening structure. The light screening structure is arranged on the photosensitive element, and the light screening structure includes a light-transmitting layer, a first light-shielding layer, a second light-shielding layer and a light-concentrating structure. The first light-shielding layer and the second light-shielding layer are both arranged in the light-transmitting layer, and the second light-shielding layer is located between the first light-shielding layer and the photosensitive element. The first light shielding layer has a first light passing portion, and the second light shielding layer has a second light passing portion. The light-concentrating structure is arranged on the light-transmitting layer. The first light passing portion and the second light passing portion are arranged corresponding to the photosensitive element. The light passes through the condensing structure to generate a condensed beam. The aperture of the first light-passing portion and the aperture of the second light-passing portion are respectively adjusted according to the width of the focused beam at the first light shielding layer and the second light shielding layer.

The disclosed embodiment includes an imaging module. The imaging module includes a photosensitive array and a light screening structure. The photosensitive array includes a plurality of photosensitive elements. The light screening structure is arranged on the photosensitive array, and the light screening structure includes a light-transmitting layer, a plurality of light-shielding layers and a light-concentrating array. The light-shielding layer is arranged in the light-transmitting layer, and each light-shielding layer has a plurality of light passing parts. The concentrating array is arranged on the light-transmitting layer, and the concentrating array includes a plurality of concentrating structures. The light-transmitting part is arranged corresponding to the photosensitive element. The light passes through the condensing array to generate a plurality of condensed beams, and the aperture of each light-passing part is adjusted according to the width of the corresponding condensed beam at each light shielding layer.

The disclosed embodiment includes a biometric identification device. The biometric identification device includes a substrate, a light source and the aforementioned imaging module. The light source is arranged on the substrate to emit light to the biological body. The imaging module is used for receiving light from the light source.

The following disclosure provides many different embodiments or examples to implement different features of this case. The following disclosure describes specific examples of each component and its arrangement to simplify the description. Of course, these specific examples are not meant to be limiting. For example, if the embodiment of the present disclosure describes that a first characteristic component is formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact. It may include an embodiment in which an additional characteristic part is formed between the first characteristic part and the second characteristic part, and the first characteristic part and the second characteristic part may not be in direct contact.

It should be understood that additional operation steps may be implemented before, during or after the method, and in other embodiments of the method, part of the operation steps may be replaced or omitted.

In addition, terms related to space may be used, such as "below", "below", "lower", "above", "above", "higher" and similar terms. These space-related terms are used to facilitate the description of the relationship between one element(s) or characteristic part and another element(s) or characteristic parts in the illustration. These space-related terms include the difference between devices in use or operation Position, and the position described in the diagram. When the device is turned in different directions (rotated by 90 degrees or other directions), the space-related adjectives used in it will also be interpreted according to the turned position.

In the manual, the terms "about", "approximately" and "approximately" usually mean within 20%, or within 10%, or within 5%, or within 3% of a given value or range. Or within 2%, or within 1%, or within 0.5%. The quantity given here is an approximate quantity, that is, the meaning of "about", "approximately" and "approximately" can still be implied without specifying "about", "approximately" or "approximately".

Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meanings commonly understood by the general artisans to whom the disclosures in this article belong. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meaning consistent with the relevant technology and the background or context of this disclosure, and should not be used in an idealized or overly formal way. Interpretation, unless there is a special definition in the embodiment of the present disclosure.

The different embodiments disclosed below may use the same reference symbols and/or marks repeatedly. These repetitions are for the purpose of simplification and clarity, and are not used to limit the specific relationship between the different embodiments and/or structures discussed.

FIG. 1 shows a schematic partial cross-sectional view of an imaging module 100 according to an embodiment of the disclosure. FIG. 2 shows a partially enlarged schematic diagram of the imaging module 100 of FIG. 1. FIG. 1, in some embodiments, the imaging module 100 may include a photosensitive array 10, and the photosensitive array 10 may include a plurality of photosensitive elements 11.

In some embodiments, the photosensitive array 10 may be a one-dimensional array or a two-dimensional array, but the embodiment of the disclosure is not limited thereto. In some embodiments, the photosensitive element 11 may be a pixel or a sub-pixel, or may be a part of a plurality of pixels. Therefore, the imaging module 100 shown in FIG. 2 can be regarded as an enlarged schematic diagram of a photosensitive unit U shown in FIG. 1, but the embodiment of the disclosure is not limited thereto. In some embodiments, the photosensitive element 11 may include or correspond to at least one photodiode (for example, a complementary metal-oxide-semiconductor (CMOS) photosensitive element or a charge-coupled device, CCD)) and/or other appropriate components, which can convert the received optical signal into a current signal.

Referring to FIGS. 1 and 2, the imaging module 100 may include a light-transmitting layer 20, and the light-transmitting layer 20 is disposed on the photosensitive array 10 (photosensitive element 11). In some embodiments, the material of the light-transmitting layer 20 may include transparent photoresist, polyimide, epoxy, other suitable materials, or a combination of the foregoing materials. In some embodiments, the material of the light-transmitting layer 20 may include a photocurable material, a thermal curing material, or a combination of the foregoing. For example, a spin-on coating process may be used to form the light-transmitting layer 20 on the photosensitive array 10 (photosensitive element 11), but the embodiment of the disclosure is not limited thereto.

1 and 2, the imaging module 100 may include a plurality of light-shielding layers, the light-shielding layer is disposed in the light-transmitting layer 20, and each layer of the light-shielding layer has a plurality of light-passing parts, the light-passing part corresponds to the photosensitive array 10 (Photosensitive element 11) set. Specifically, the imaging module 100 includes a first light-shielding layer 31 and a second light-shielding layer 32. The first light-shielding layer 31 and the second light-shielding layer 32 are disposed in the light-transmitting layer 20, and the second light-shielding layer 32 is located in the Between a light-shielding layer 31 and the photosensitive element 11, but the embodiment of the disclosure is not limited to this. As shown in FIGS. 1 and 2, the first light shielding layer 31 may have a first light passing portion 31O, and the second light shielding layer 32 may have a second light passing portion 32O.

In some embodiments, the material of the light-shielding layer (the first light-shielding layer 31 and the second light-shielding layer 32) may include metals, such as copper (Cu), silver (Ag), etc., but the embodiments of the disclosure are not limited thereto . In some embodiments, the material of the light shielding layer may include photoresist (for example, black photoresist or other suitable non-transparent photoresist), ink (for example, black ink or other suitable non-transparent ink), molding compound ( molding compound) (for example, black molding compound or other suitable non-transparent molding compound), solder mask (for example, black solder mask or other suitable non-transparent solder mask), epoxy Resin, other suitable materials or a combination of the foregoing materials. In some embodiments, the material of the light-shielding layer may be a photocurable material, a thermal curing material, or a combination of the foregoing materials.

In some embodiments, a patterning process may be performed to pattern the aforementioned materials to form a light-shielding layer (the first light-shielding layer 31 and the second light-shielding layer 32). For example, the aforementioned patterning process may include soft baking, mask aligning, exposure, post-exposure baking, developing, and rinsing. (Rinsing), drying, other appropriate steps, or a combination of the foregoing steps, but the embodiments of the present disclosure are not limited thereto.

Referring to FIGS. 1 and 2, the imaging module 100 may include a light-concentrating array 40, and the light-concentrating array 40 is disposed on the light-transmitting layer 20. As shown in FIG. 1, the concentrating array 40 may include a plurality of concentrating structures 41. For example, the concentrating array 40 may be a one-dimensional array or a two-dimensional array, but the embodiment of the disclosure is not limited thereto.

In some embodiments, the material of the light-concentrating structure 41 may be a transparent material. For example, the material of the light-concentrating structure 41 may include glass, epoxy resin, silicone resin, polyurethane, other suitable materials or a combination of the foregoing materials, but the embodiment of the disclosure is not limited thereto. In some embodiments, a photoresist reflow method, a hot embossing method, other appropriate methods, or a combination thereof may be used to form the light-concentrating structure 41. In some embodiments, the step of forming the light-concentrating structure 41 (the light-concentrating array 40) may include a spin coating process, a photolithography process, an etching process, other appropriate processes, or a combination of the foregoing.

In this embodiment, the condensing structure 41 may be a micro-lens structure with a radius of curvature R, for example, a semi-convex lens or a convex lens, but the embodiment of the disclosure is not limited thereto. Figures 3A to 3D show schematic diagrams of different light-concentrating structures. As shown in Figs. 3A and 3B, the light-concentrating structure 41A (cone) and the light-concentrating structure 41B (tetragonal pyramid) may be micro-pyramid structures. As shown in FIGS. 3C and 3D, the light-concentrating structure 41C (flat-topped cone) and the light-collecting structure 41D (flat-topped quadrangular pyramid) may be micro-trapezoidal structures. Alternatively, the light-concentrating structure may be a gradient-index structure (not shown).

As shown in Figure 1, in this embodiment, the light-transmitting layer 20, the light-shielding layer (the first light-shielding layer 31 and the second light-shielding layer 32) and the light-concentrating array 40 (the light-concentrating structure 41) can be formed as a light screening Structure 50. That is, the light screening structure 50 can be disposed on the photosensitive array 10 (photosensitive element 11) to filter the angle of incident light. When light is incident from top to bottom, the light screening structure 50 allows nearly vertical light to enter the photosensitive array 10 and absorbs incident light at other angles.

In the disclosed embodiment, the light passing through the condensing array 40 (the condensing structure 41) can generate a plurality of condensed beams, and the aperture of each light-passing portion in the light shielding layer can be based on the width of the corresponding condensed beam at the light shielding layer. Adjustment.

)，WO₂ 與A₂ 的比值為Q₂ (

)，Q₁ 與Q₂ 的幾何平均數大於0.6且小於或等於1.8(

。進一步解釋比值關係，若比值Q₁ 大於1，代表孔徑WO₁ 大於聚光束L位於第一遮光層31之處的寬度A₁ ；若比值Q₁ 小於1，代表孔徑WO₁ 小於聚光束L位於第一遮光層31之處的寬度A₁ 。類似地，若比值Q₂ 大於1，代表孔徑WO₂ 大於聚光束L位於第二遮光層32之處的寬度A₂ ；若比值Q₂ 小於1，代表孔徑WO₂ 小於聚光束L位於第二遮光層32之處的寬度A₂ 。Specifically, as shown in Figure 2, the aperture of the first light-transmitting portion 31O is WO ₁ , the aperture of the second light-transmitting portion 32O is WO ₂ , and the aperture WO _{1 is} greater than or equal to the aperture WO ₂ (WO ₁ ≥WO ₂ ), and the center of the aperture WO ₁ is aligned with the center of the aperture WO ₂ , the arc apex 41T of the light collecting structure 41 (microlens), the center of the aperture WO ₁ , the center of the aperture WO ₂ , the center of the photosensitive element 11, the focusing beam L The focal points F are aligned with each other and are located on the same axis. The width of the focused light beam L at the first light shielding layer 31 is A ₁ , the width of the focused light beam L at the second light shielding layer 32 is A ₂ , and the ratio of WO ₁ to A ₁ is Q ₁ (

), the ratio of WO ₂ to A ₂ is Q ₂ (

), the geometric mean of Q ₁ and Q ₂ is greater than 0.6 and less than or equal to 1.8 (

. To further explain the ratio relationship, if the ratio Q _{1 is} greater than 1, it means that the aperture WO _{1 is} larger than the width A ₁ where the focused beam L is located on the first light shielding layer 31; if the ratio Q _{1 is} less than 1, it means that the aperture WO _{1 is} smaller than the focused beam L in the first light shielding layer 31. A width A _{1 of the} light shielding layer 31. Similarly, if the ratio Q _{2 is} greater than 1, it means that the aperture WO _{2 is} larger than the width A ₂ where the condensed beam L is located at the second light shielding layer 32; if the ratio Q _{2 is} less than 1, it means that the aperture WO _{2 is} smaller than the condensed beam L in the second light shielding layer 32. Width A ₂ at layer 32.

，k為小於或等於n的正整數。亦即，在這些實施例中，光篩選結構50可滿足以下條件（後方將稱為公式(1)），比值Q_k 的幾何平均數大於0.6且小於或等於1.8：

…(1)It should be noted that the number of light shielding layers in the light screening structure 50 is not limited to the two layers shown in FIG. 1 and FIG. 2. In some embodiments, the light screening structure 50 may include n light-shielding layers, and n is a positive integer greater than or equal to 2. Among these light-shielding layers, the aperture of each light-passing part in the k-th light-shielding layer is WO _k , the width of the focused beam L at the k-th light-shielding layer is _Ak , and the ratio of WO _k to _Ak is Q _k

, K is a positive integer less than or equal to n. That is, in these embodiments, the light screening structure 50 can satisfy the following conditions (hereinafter referred to as formula (1)), and the geometric mean of the ratio Q _k is greater than 0.6 and less than or equal to 1.8:

…(1)

Here, the aperture WO _{k of} each light-passing part is smaller than the outer diameter D of the light-concentrating structure 41 (ie, WO _k >D, the outer diameter D measures the arc surface of the self-concentrating structure 41 and the top surface of the light-transmitting layer 20 The horizontal distance from the junction to another remote junction). When the light screening structure 50 satisfies the aforementioned formula (1), better imaging quality can be obtained, which will be described later through the embodiment and the comparative example.

…(2)In addition, as shown in Fig. 2, the width _{Ak of the} spot where the focused beam L is located on the k-th light-shielding layer can be calculated according to the triangular proportional relationship. That is, the focused beam in the width L A _k at the k-th layer of the light-shielding layer may satisfy the following condition (equation (2)):

…(2)

Here, f is the focal length of the concentrating structure 41, LH is the maximum thickness of the concentrating structure 41 (measured from the arc apex 41T of the concentrating structure 41 to the top surface 20T of the light-transmitting layer 20), and H _k is the shading layer of the k The distance between the layer and the focusing position (ie, the focal point F) of the light-concentrating structure 41 (for example, the distance between the first light-shielding layer 31 and the focal point F of the light-concentrating structure 41 is H ₁ , and the second light-shielding layer 32 and the light-concentrating structure 41 The distance of the focal point F is H ₂ ), and the photosensitive element 11 is located at the focal point F.

…(3)In some embodiments, in order to achieve better imaging quality, the aperture WO _k of each light-passing part in the k-th shading layer can satisfy the following condition (formula (3)), that is, the aperture WO _{k of} each light-passing part _{k is} between 0.6 and 1.8 of the product of the width A _{k where} the focused beam L is located on the k-th shading layer:

…(3)

Although in the embodiment shown in FIG. 2, the focus position (ie, the focus F) of the focused beam L is located on the top surface of the corresponding photosensitive element 11, the embodiment of the disclosure is not limited to this. FIG. 4 shows a schematic partial cross-sectional view of an imaging module 102 according to another embodiment of the disclosure. FIG. 5 shows a schematic partial cross-sectional view of an imaging module 104 according to another embodiment of the disclosure. Figures 1 and 2 show the type of the photosensitive element 11 at the focal point F of the condensing structure 41 (ie, the focal point type); Figures 4 and 5 show the type of the photosensitive element 11 away from the focal point F of the condensing structure 41 State (ie, defocus type). In the embodiment shown in Figures 4 and 5, the aperture WO _{1 is} greater than or equal to the aperture WO ₂ (WO ₁ ≥WO ₂ ), and the center of the aperture WO ₁ is aligned with the center of the aperture WO ₂ , and the light-concentrating structure 41 (micro lens) arc point 41T, the central aperture WO _1, WO ₂ the central aperture, the center of the photosensitive member 11, the focal point of the focused beam F L mutually aligned and positioned on the same axis.

In the embodiments shown in FIGS. 4 and 5, the focal point F of each focused beam L has a distance HS from the top surface of the corresponding photosensitive element 11. In some embodiments, the distance HS between the focal point F of the condensed beam L and the top surface of the photosensitive element 11 may satisfy the following conditions (hereinafter referred to as formula (4)):

Here, WS is the minimum width of the photosensitive element. In addition, the position where the focal point F is defined is 0. When the photosensitive element 11 is below the focal point F (ie, the imaging module 102 shown in Figure 4), the distance between the focal point F and the top surface of the corresponding photosensitive element 11 HS<0 ( Defocus type, for example HS=-25μm); when the photosensitive element 11 is above the focal point F (ie the imaging module 104 shown in Figure 5), HS>0 (defocus type, for example HS=+25μm).

The specific specifications of the imaging modules of a number of embodiments of the disclosure are provided below, and the specific specifications of the imaging modules of a plurality of comparative examples are provided for comparison with the embodiments of the disclosure.

。感光元件11的最小寬度WS為30 μm。Taking Example 1 as an example (with the imaging module 100 of the focal type (HS=0) in Figures 1 and 2), the center-to-center distance P of adjacent dicondensing structures 41 is 50.0 μm (micrometers). The radius of curvature R is 40.0 μm, the outer diameter D of the concentrating structure 41 is 40.0 μm, and the maximum thickness LH of the concentrating structure 41 is 5.36 μm. The refractive index N of the light-transmitting layer 20 is 1.57, the distance H ₁ between the first light-shielding layer 31 and the focal point F of the light-concentrating structure 41 is 48.93 μm, and the distance H ₂ between the second light-shielding layer 32 and the focal point F of the light-concentrating structure 41 is 18.93μm. The width A ₁ of the focused beam L at the first light shielding layer 31 is 19.78 μm, and the width A ₂ of the focused beam L at the second light shielding layer 32 is 7.66 μm. The first light passing portion 31O WO aperture ₁ is 19.78 μm, the second portion of light through the aperture WO 32O and ₂ is 7.66 μm, i.e. WO ratio of ₁ and Q ₁ is A ₁ 1, WO ₂ and the ratio of A ₂ Q ₂ Is 1. Geometric mean of Q ₁ and Q ₂

. The minimum width WS of the photosensitive element 11 is 30 μm.

Please refer to the following Table 1 for the specific specifications of Examples 1 to 4, and all the examples satisfy the aforementioned formula (1). Specifically, the structure of the imaging module in Embodiments 1 to 4 can refer to the imaging module 100 shown in Fig. 1 and Fig. 2, and all embodiments 1 to 4 satisfy the aforementioned formula (1) .

1 0.8 1.8 1.293 WS (μm) 30 30 30 30 Table I Example 1 Example 2 Example 3 Example 4 N 1.57 1.57 1.57 1.57 P (μm) 50 50 50 50 R (μm) 40 40 40 40 D (μm) 40 40 40 40 LH (μm) 5.36 5.36 5.36 5.36 H ₁ (μm) 48.93 48.93 48.93 48.93 H ₂ (μm) 18.93 18.93 18.93 18.93 HS (um) 0 0 0 0 A ₁ (μm) 19.78 19.78 19.78 19.78 A ₂ (μm) 7.66 7.66 7.66 7.66 WO ₁ (μm) 19.78 15.82 35.6 19.78 WO ₂ (μm) 7.66 6.12 13.78 19.78 Q ₁ 1 0.8 1.8 1 Q ₂ 1 0.8 1.8 2.59

1 0.8 1.8 1.293 WS (μm) 30 30 30 30

係公式(1)的臨界值，但不符合公式(1)。For the specific specifications of Comparative Example 1 to Comparative Example 3, please refer to Table 2 below, and all the comparative examples do not satisfy the aforementioned formula (1). Specifically, the structure of the imaging module of Comparative Example 1 to Comparative Example 3 can refer to the imaging module 100 (focus type, HS=0) shown in Figure 1 and Figure 2, but Comparative Example 1 to Comparative Example 3 None of the above formula (1) is satisfied. Of comparative example 1

It is the critical value of formula (1), but does not meet formula (1).

0.6 2 2.972 WS (μm) 30 30 30 Table II Comparative example 1 Comparative example 2 Comparative example 3 N 1.57 1.57 1.57 P (μm) 50 50 50 R (μm) 40 40 40 D (μm) 40 40 40 LH (μm) 5.36 5.36 5.36 H ₁ (μm) 48.93 48.93 48.93 H ₂ (μm) 18.93 18.93 18.93 HS (um) 0 0 0 A ₁ (μm) 19.78 19.78 19.78 A ₂ (μm) 7.66 7.66 7.66 WO ₁ (μm) 11.86 39.56 30 WO ₂ (μm) 4.6 15.3 30 Q ₁ 0.6 2 1.52 Q ₂ 0.6 2 3.92

0.6 2 2.972 WS (μm) 30 30 30

），符合公式(1)，可視為理想值。亦即，以實施例1的具體規格製成的成像模組可為一理想的成像模組（即可獲得最佳的成像品質）。第6圖顯示以實施例1（實施例1之成像模組的結構可參考第1圖與第2圖所示之成像模組100）的具體規格製成的成像模組的角度篩選分布曲線。第6圖的橫軸為角度，縱軸為收光效率(單位：百分比)。在0度時，收光效率達到90 %，即表示當光源以0度入射時，感光元件11所接收的光通量比上入射光源的光通量值為0.9，即為90 %。如第6圖所示，當光源以0~10度入射時的收光效率極值達到90 %，而以10~90度入射時的雜訊低於10 %。When the aperture WO ₁ of the first light-passing portion 31O is equal to the width A ₁ where the focused beam L is located on the first light shielding layer 31, the aperture WO ₂ of the second light-passing portion 32O and the focused beam L are located between the second light shielding layer 32 The width A ₂ at the position is equal (ie, Q ₁ =Q ₂ =1, and

), in accordance with formula (1), can be regarded as an ideal value. That is, the imaging module made with the specific specifications of Embodiment 1 can be an ideal imaging module (that is, the best imaging quality can be obtained). FIG. 6 shows the angular screening distribution curve of the imaging module made with the specific specifications of Embodiment 1 (for the structure of the imaging module in Embodiment 1, refer to the imaging module 100 shown in FIG. 1 and FIG. 2). In Figure 6, the horizontal axis is the angle, and the vertical axis is the light collection efficiency (unit: percentage). At 0 degrees, the light collection efficiency reaches 90%, which means that when the light source is incident at 0 degrees, the luminous flux received by the photosensitive element 11 is 0.9, that is, 90%. As shown in Figure 6, when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 90%, and the noise when incident from 10 to 90 degrees is less than 10%.

It can be judged whether the imaging module can have a good imaging quality (that is, a higher resolution) by comparing with the angle screening distribution curve of Example 1. Here, the good image quality must satisfy that the main signal strength is greater than 30% of the original signal strength (receiving efficiency is greater than 30%), and no large-angle noise interference (noise strength is less than 10% of the main signal strength) And the beam angle of the main signal (half power angle; beam angle; refers to the angle between two directions at which the light intensity is equal to 50% of the maximum light intensity on a plane perpendicular to the center line of the beam) is less than 10 degrees. Generally speaking, when the photosensitive element 11 is located under a multilayer structure (e.g., air-transmissive layer, light-shielding layer, etc.), the beam angle of the main signal needs to be less than 10 degrees to resolve the 200 μm width biometric signal (e.g., fingerprint signal). ). If the beam angle of the main signal is greater than 10 degrees, the fingerprint signals may overlap each other and the biometric signal cannot be resolved.

In short, in the range of 0~10 degrees, the signal intensity of the received light energy is greater than 30% of the original signal intensity (ie, the receiving efficiency is greater than 30%), and in the range of 10~90 degrees, the noise intensity is less than the main If the signal intensity is 10%, and the main signal beam angle is less than 10 degrees, it can be judged that the imaging module has good imaging quality.

，符合公式(1)）的角度篩選分布曲線結果，在0度時收光效率達到50 %，當光源以0~10度入射時的收光效率極值達到50 %（收光效率大於30 %），且主要訊號的波束角小於10度，而以10~90度入射時的雜訊低於10 %，因此可判斷實施例2之成像模組具有良好的成像品質。FIG. 7 shows the angular screening distribution curve of the imaging module made with the specific specifications of Embodiment 2 (the structure of the imaging module in Embodiment 2 can refer to the imaging module 100 shown in FIG. 1 and FIG. 2). Example 2 as shown in Figure 7 (

, In accordance with the results of the angle screening distribution curve of formula (1)), the light collection efficiency reaches 50% at 0 degrees, and the extreme value of light collection efficiency reaches 50% when the light source is incident from 0 to 10 degrees (the light collection efficiency is greater than 30% ), and the beam angle of the main signal is less than 10 degrees, and the noise when incident at 10 to 90 degrees is less than 10%. Therefore, it can be judged that the imaging module of Embodiment 2 has good imaging quality.

，不符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的極值不到30 %（收光效率小於30 %），即感光元件接收的光線強度不足，因此可判斷比較例1之成像模組不具有良好的成像品質。Figure 8 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 1. As shown in Figure 8 of Comparative Example 1 (

, Does not meet the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value is less than 30% (light collection efficiency is less than 30%), that is, the light intensity received by the photosensitive element is insufficient, so It can be judged that the imaging module of Comparative Example 1 does not have good imaging quality.

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %（收光效率大於30 %），且主要訊號的波束角小於10度。雖然在約30度與約55度處出現雜訊干擾，但雜訊強度小於主要訊號的10 %，因此仍可判斷成像模組具有良好的成像品質。FIG. 9 shows the angular screening distribution curve of the imaging module made with the specific specifications of Embodiment 3 (for the structure of the imaging module of Embodiment 3, refer to the imaging module 100 shown in FIG. 1 and FIG. 2). Example 3 as shown in Figure 9 (

，According to the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees . Although noise interference occurs at about 30 degrees and about 55 degrees, the noise intensity is less than 10% of the main signal, so it can still be judged that the imaging module has good imaging quality.

，不符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %。然而，在30度與52度出現雜訊干擾，且在52度出現的雜訊強度大於主要訊號的10 %（即出現串擾(cross talk)），因此可判斷比較例2之成像模組不具有良好的成像品質。Figure 10 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 2. As shown in Figure 10, Comparative Example 1 (

, The angle screening distribution curve result that does not meet the formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95%. However, noise interference occurs at 30 degrees and 52 degrees, and the noise intensity at 52 degrees is greater than 10% of the main signal (cross talk), so it can be judged that the imaging module of Comparative Example 2 does not have Good imaging quality.

Please refer to the following Table 3 for the specific specifications of Embodiment 5 to Embodiment 8, and all the embodiments satisfy the aforementioned formula (1) and formula (4). Specifically, the structure of the imaging module of the embodiment 5 and the embodiment 6 can refer to the imaging module 102 (defocus type HS=-25) shown in Figure 4, and the imaging module of the embodiment 7 and embodiment 8. Refer to the imaging module 104 (defocus HS=+25) shown in Fig. 5 for the structure of, and all embodiments 5 to 8 satisfy the aforementioned formula (1) and formula (4).

1 1.8 1 0.8 WS (μm) 10 10 10 10 Table Three Example 5 Example 6 Example 7 Example 8 N 1.57 1.57 1.57 1.57 P (μm) 50 50 50 50 R (μm) 40 40 40 40 D (μm) 40 40 40 40 LH (μm) 5.36 5.36 5.36 5.36 H ₁ (μm) 28.93 28.93 78.93 78.93 H ₂ (μm) -16.1 -16.1 48.93 48.93 HS (um) -25 -25 25 25 A ₁ (μm) 11.7 11.7 31.86 31.86 A ₂ (μm) 6.5 6.5 19.78 19.78 WO ₁ (μm) 11.7 21.06 31.86 25.49 WO ₂ (μm) 6.5 11.7 19.78 15.82 Q ₁ 1 1.8 1 0.8 Q ₂ 1 1.8 1 0.8

1 1.8 1 0.8 WS (μm) 10 10 10 10

，符合公式(1)，此數值為臨界值）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到90 %（收光效率大於30 %），且主要訊號的波束角小於10度，而以10~90度入射時的雜訊低於10 %，因此可判斷實施例6之成像模組具有良好的成像品質。Fig. 11 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 6 (the structure of the imaging module of the embodiment 6 can refer to the imaging module 102 shown in Fig. 4). Example 6 shown in Figure 11 (

, In accordance with formula (1), this value is the critical value) of the angle screening distribution curve results, when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 90% (the light collection efficiency is greater than 30%), and the main signal The beam angle of is less than 10 degrees, and the noise when incident at 10 to 90 degrees is less than 10%. Therefore, it can be judged that the imaging module of Embodiment 6 has good imaging quality.

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到60 %（收光效率大於30 %），且主要訊號的波束角小於10度，而以10~90度入射時的雜訊低於10 %，因此可判斷實施例8之成像模組具有良好的成像品質。Figure 12 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 8 (the structure of the imaging module of the embodiment 8 can refer to the imaging module 104 shown in Figure 5). Example 8 as shown in Figure 12 (

，According to formula (1)) of the angle screening distribution curve results, when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 60% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees , And the noise when incident at 10 to 90 degrees is less than 10%, so it can be judged that the imaging module of Embodiment 8 has good imaging quality.

It should be noted that although in the foregoing embodiments, the number of light-shielding layers is two layers (ie, the first light-shielding layer 31 and the second light-shielding layer 32), the embodiments of the disclosure are not limited thereto.

)，WO₂ 與A₂ 的比值為Q₂ (

)，WO₃ 與A₃ 的比值為Q₃ (

)，Q₁ 、Q₂ 與Q₃ 的幾何平均數大於0.6且小於或等於1.8(

)，滿足前述之公式(1)。FIG. 13 shows a schematic partial cross-sectional view of an imaging module 106 according to another embodiment of the disclosure. The difference from the imaging module 100 shown in FIGS. 1 and 2 is that the imaging module 106 shown in FIG. 13 may further include a third light shielding layer 33. The third light shielding layer 33 is disposed in the light transmitting layer 20, and the third light shielding layer 33 is located between the second light shielding layer 32 and the photosensitive element 11. In some embodiments, the material of the third light-shielding layer 33 may be the same as or similar to the first light-shielding layer 31 or the second light-shielding layer 32, but the embodiment of the disclosure is not limited thereto. In addition, as shown in Figure 13, the third light-shielding layer 33 may have a third light-passing portion 33O, the aperture of the third light-passing portion 33O is WO ₃ , and the third light-shielding layer 33 and the focal point F of the light-concentrating structure 41 The distance is H ₃ , the aperture WO _{1 is} greater than or equal to the aperture WO ₂ , the aperture WO _{2 is} greater than or equal to the aperture WO ₃ (WO ₁ ≥WO ₂ ≥WO ₃ ), and the center of the aperture WO ₁ is aligned with the center of the aperture WO ₂ and the aperture The center of WO ₃ , the arc apex 41T of the condensing structure 41 (microlens), the center of the aperture WO ₁ , the center of the aperture WO ₂ , the center of the aperture WO ₃ , the center of the photosensitive element 11, and the focal point F of the focused beam L are mutually opposed Accurate and on the same axis. The width of the focused light beam L at the first light shielding layer 31 is A ₁ , the width of the focused light beam L at the second light shielding layer 32 is A ₂ , and the width of the focused light beam L at the third light shielding layer 33 is A ₃ , The ratio of WO ₁ to A ₁ is Q ₁ (

), the ratio of WO ₂ to A ₂ is Q ₂ (

), the ratio of WO ₃ to A ₃ is Q ₃ (

), the geometric mean of Q ₁ , Q ₂ and Q ₃ is greater than 0.6 and less than or equal to 1.8 (

), which satisfies the aforementioned formula (1).

For specific specifications of Examples 9 to 12, please refer to Table 4 below, and all examples satisfy the aforementioned formula (1). Specifically, the structure of the imaging module of Embodiment 9 to Embodiment 12 can refer to the imaging module 106 (focus type, HS=0) shown in Figure 13, and Embodiments 9 to 12 meet the aforementioned requirements Formula 1).

1 0.8 1.5 0.99 WS (μm) 30 30 30 30 Table Four Example 9 Example 10 Example 11 Example 12 N 1.57 1.57 1.57 1.57 P (μm) 50 50 50 50 R (μm) 40 40 40 40 D (μm) 40 40 40 40 LH (μm) 5.36 5.36 5.36 5.36 H ₁ (μm) 78.93 78.93 78.93 78.93 H ₂ (μm) 48.93 48.93 48.93 48.93 H ₃ (μm) 18.93 18.93 18.93 18.93 HS (um) 0 0 0 0 A ₁ (μm) 31.92 31.92 31.92 31.92 A ₂ (μm) 19.78 19.78 19.78 19.78 A ₃ (μm) 7.66 7.66 7.66 7.66 WO ₁ (μm) 31.92 25.54 47.88 19.78 WO ₂ (μm) 19.78 15.82 29.67 19.78 WO ₃ (μm) 7.66 6.12 11.49 19.78 Q ₁ 1 0.8 1.5 0.62 Q ₂ 1 0.8 1.5 1 Q ₃ 1 0.8 1.5 1.57

1 0.8 1.5 0.99 WS (μm) 30 30 30 30

For the specific specifications of Comparative Example 4 to Comparative Example 7, please refer to Table 5 below, and all the comparative examples do not satisfy the aforementioned formula (1). Specifically, the structure of the imaging module of Comparative Example 4 to Comparative Example 7 can refer to the imaging module 106 shown in FIG. 13, but none of Comparative Example 4 to Comparative Example 7 satisfies the aforementioned formula (1).

0.6 1.9 1.89 0.45 WS (μm) 30 30 30 30 Table 5 Comparative example 4 Comparative example 5 Comparative example 6 Comparative example 7 N 1.57 1.57 1.57 1.57 P (μm) 50 50 50 50 R (μm) 40 40 40 40 D (μm) 40 40 40 40 LH (μm) 5.36 5.36 5.36 5.36 H ₁ (μm) 78.93 78.93 78.93 78.93 H ₂ (μm) 48.93 48.93 48.93 48.93 H ₃ (μm) 18.93 18.93 18.93 18.93 HS (um) 0 0 0 0 A ₁ (μm) 31.92 31.92 31.92 31.92 A ₂ (μm) 19.78 19.78 19.78 19.78 A ₃ (μm) 7.66 7.66 7.66 7.66 WO ₁ (μm) 19.15 60.65 31.92 7.66 WO ₂ (μm) 11.68 37.58 31.92 7.66 WO ₃ (μm) 4.6 15.55 31.92 7.66 Q ₁ 0.6 1.9 1 0.24 Q ₂ 0.6 1.9 1.61 0.39 Q ₃ 0.6 1.9 4.17 1

0.6 1.9 1.89 0.45 WS (μm) 30 30 30 30

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到50 %（收光效率大於30 %），且主要訊號的波束角小於10度，而以10~90度入射時的雜訊低於10 %，因此可判斷實施例10之成像模組具有良好的成像品質。Fig. 14 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 10 (the structure of the imaging module of the embodiment 10 can refer to the imaging module 106 shown in Fig. 13). Example 10 as shown in Figure 14 (

，According to the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 50% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees , And the noise when incident at 10 to 90 degrees is less than 10%. Therefore, it can be judged that the imaging module of Embodiment 10 has good imaging quality.

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %（收光效率大於30 %），且主要訊號的波束角小於10度，雖然在約34度與約62度處出現雜訊干擾，但雜訊強度小於主要訊號的10 %，因此仍可判斷實施例11之成像模組具有良好的成像品質。Figure 15 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 11 (the structure of the imaging module of the embodiment 11 can refer to the imaging module 106 shown in Figure 13). Example 11 shown in Figure 15 (

，According to the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees Although noise interference occurs at about 34 degrees and about 62 degrees, the noise intensity is less than 10% of the main signal. Therefore, it can be judged that the imaging module of Embodiment 11 has good imaging quality.

，此數值為臨界值，不符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的極值不到30 %（收光效率小於30 %），即感光元件接收的光線強度不足，因此可判斷比較例4之成像模組不具有良好的成像品質。Figure 16 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 4. As shown in Figure 16 in Comparative Example 4 (

, This value is a critical value and does not comply with the angle screening distribution curve result of formula (1)). When the light source is incident at 0-10 degrees, the extreme value is less than 30% (light collection efficiency is less than 30%), that is, the photosensitive element receives The light intensity is insufficient, so it can be judged that the imaging module of Comparative Example 4 does not have good imaging quality.

）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %，然而，主要訊號的波束角大於10度，在10度時，收光效率仍有80%，會造成串擾，因此可判斷比較例6之成像模組不具有良好的成像品質。Figure 17 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 6. As shown in Figure 17 in Comparative Example 6 (

) Angle screening distribution curve results, when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95%. However, the beam angle of the main signal is greater than 10 degrees, at 10 degrees, the light collection efficiency is still 80% , Will cause crosstalk, so it can be judged that the imaging module of Comparative Example 6 does not have good imaging quality.

)，WO₂ 與A₂ 的比值為Q₂ (

)，WO₃ 與A₃ 的比值為Q₃ (

)，WO₄ 與A₄ 的比值為Q₄ (

)，Q₁ 、Q₂ 、Q₃ 與Q₄ 的幾何平均數大於0.6且小於或等於1.8(

)，符合前述公式(1)。FIG. 18 shows a schematic partial cross-sectional view of an imaging module 108 according to another embodiment of the disclosure. The difference from the imaging module 106 shown in FIG. 13 is that the imaging module 108 shown in FIG. 18 may further include a fourth light shielding layer 34. The fourth light shielding layer 34 is disposed in the light transmitting layer 20, and the fourth light shielding layer 34 is located between the third light shielding layer 33 and the photosensitive element 11. In some embodiments, the material of the fourth light shielding layer 34 may be the same as or similar to the first light shielding layer 31, the second light shielding layer 32 or the third light shielding layer 33, but the embodiment of the disclosure is not limited thereto. In addition, as shown in Figure 18, the fourth light-shielding layer 34 may have a fourth light-passing portion 34O, the aperture of the fourth light-passing portion 34O is WO ₄ , and the fourth light-shielding layer 34 and the focal point F of the light-concentrating structure 41 The distance is H ₄ . The aperture WO _{1 is} greater than or equal to the aperture WO ₂ , the aperture WO _{2 is} greater than or equal to the aperture WO ₃ , and the aperture WO _{3 is} greater than or equal to the aperture WO ₄ (WO ₁ ≥WO ₂ ≥WO ₃ ≥WO ₄ ), and the center of the aperture WO ₁ The center of the quasi-aperture WO ₂ , the center of the aperture WO _{3 and} the center of the aperture WO ₄ , the arc apex 41T of the focusing structure 41 (microlens), the center of the aperture WO ₁ , the center of the aperture WO ₂ , the center of the aperture WO ₃ , The center of the aperture WO ₄ , the center of the photosensitive element 11, and the focal point F of the focused beam L are aligned with each other and are located on the same axis. The photosensitive element 11 is located on the focal point F and is a focal point (HS=0) imaging module 108. The width of the focused light beam L at the first light shielding layer 31 is A ₁ , the width of the focused light beam L at the second light shielding layer 32 is A ₂ , and the width of the focused light beam L at the third light shielding layer 33 is A ₃ , The width of the focused beam L at the fourth light-shielding layer 34 is A ₄ , and the ratio of WO ₁ to A ₁ is Q ₁ (

), the ratio of WO ₂ to A ₂ is Q ₂ (

), the ratio of WO ₃ to A ₃ is Q ₃ (

), the ratio of WO ₄ to A ₄ is Q ₄ (

), the geometric mean of Q ₁ , Q ₂ , Q ₃ and Q ₄ is greater than 0.6 and less than or equal to 1.8 (

), in line with the aforementioned formula (1).

Please refer to Table 6 below for the specific specifications of Embodiment 13 to Embodiment 16, and all the embodiments satisfy the aforementioned formula (1). Specifically, the structure of the imaging module of Embodiment 13 to Embodiment 16 can refer to the imaging module 108 (four-layer shading layer and focus type (HS=0)) shown in FIG. 18, and embodiment 13 to implementation Example 16 satisfies the aforementioned formula (1).

For the specific specifications of Comparative Example 8 to Comparative Example 11, please refer to Table 7 below, and all the comparative examples do not satisfy the aforementioned formula (1). Specifically, the structure of the imaging module of Comparative Example 8 to Comparative Example 11 can refer to the imaging module 108 shown in FIG. 18, but none of Comparative Example 8 to Comparative Example 11 satisfies the aforementioned formula (1). The geometric mean (0.6, 1.83) of the Q _n values of Comparative Examples 8 and 10 are respectively close to the upper and lower critical values of the formula (1).

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %（收光效率大於30 %），且主要訊號的波束角小於10度，雖然在約33度與約62度處出現雜訊干擾，但雜訊強度小於主要訊號的10 %，因此仍可判斷實施例15之成像模組具有良好的成像品質。Figure 19 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 15 (the structure of the imaging module of the embodiment 15 can refer to the imaging module 108 shown in Figure 18). Example 15 shown in Figure 19 (

，According to the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees Although noise interference occurs at about 33 degrees and about 62 degrees, the noise intensity is less than 10% of the main signal. Therefore, it can be judged that the imaging module of Embodiment 15 has good imaging quality.

，符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到55 %（收光效率大於30 %），且主要訊號的波束角小於10度，而以10~90度入射時的雜訊低於10 %，因此可判斷實施例16之成像模組具有良好的成像品質。Figure 20 shows the angular screening distribution curve of the imaging module made with the specific specifications of the embodiment 16 (the structure of the imaging module of the embodiment 16 can refer to the imaging module 108 shown in Figure 18). As shown in Figure 20 in the embodiment 16 (

，According to the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 55% (the light collection efficiency is greater than 30%), and the beam angle of the main signal is less than 10 degrees , And the noise when incident at 10 to 90 degrees is less than 10%, so it can be judged that the imaging module of Embodiment 16 has good imaging quality.

，不符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的收光效率極值達到95 %，然而，主要訊號的波束角大於10度，在10度時，收光效率仍有80%，會造成串擾，因此可判斷比較例10之成像模組不具有良好的成像品質。Figure 21 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 10. As shown in Figure 21, Comparative Example 10 (

, The result of the angle screening distribution curve that does not meet the formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value of the light collection efficiency reaches 95%. However, the beam angle of the main signal is greater than 10 degrees. At 10 degrees, The light collection efficiency is still 80%, which will cause crosstalk. Therefore, it can be judged that the imaging module of Comparative Example 10 does not have good imaging quality.

，不符合公式(1)）的角度篩選分布曲線結果，當光源以0~10度入射時的極值不到10 %（收光效率小於30 %），即感光元件接收的光線強度不足，因此可判斷比較例11之成像模組不具有良好的成像品質。Figure 22 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 11. As shown in Figure 22, Comparative Example 11 (

, Does not meet the results of the angle screening distribution curve of formula (1)), when the light source is incident from 0 to 10 degrees, the extreme value is less than 10% (light collection efficiency is less than 30%), that is, the light intensity received by the photosensitive element is insufficient, so It can be judged that the imaging module of Comparative Example 11 does not have good imaging quality.

FIG. 23 shows a schematic diagram of the biometric identification device 1 according to an embodiment of the disclosure. The biometric identification device 1 can be used to identify biometric features of a part of a living body, such as fingerprints, veins, or iris. As shown in FIG. 23, the biometric device 1 may include a substrate 60, a light source 70, and the imaging module 100 shown in FIG. The light source 70 is disposed on the substrate 60 to emit light to a living body (such as a finger as shown in FIG. 23), and the imaging module 100 can be used to receive light from the light source 70. For example, the light source 70 may be a light-emitting diode, which can emit light to be projected to a characteristic point of a biological body (for example, a fingerprint), and the characteristic point may reflect light (or other mechanisms such as light coupling, light scattering, etc.) Into the imaging module 100, the imaging module 100 can obtain the image of the characteristic point.

In some embodiments, the light source 70 may be disposed on at least one side of the imaging module 100. For example, the light source 70 can surround the imaging module 100, but the embodiment of the disclosure is not limited to this. It should be noted that the imaging module 100 shown in Figure 23 can also be replaced with the imaging module 102 shown in Figure 4, the imaging module 104 shown in Figure 5, and the imaging module shown in Figure 13 106 or the imaging module 108 shown in FIG. 18 will not be repeated here.

In addition, although the embodiment shown in FIG. 23 uses a reflective biometric device for description, the embodiment of the disclosure is not limited to this. In other embodiments, depending on the position of the light source 70, the biometric identification device 1 may also be of the transmissive type (lighting from above the biological body) or scattering type (lighting from the side of the biological body).

In some embodiments, the biometric identification device 1 may further include a cover 80, and the cover 80 is disposed on the light source 70 and the imaging module 100. For example, the cover 80 may be a glass cover, but the embodiment of the disclosure is not limited thereto.

To sum up, by satisfying the formula (1) for the light screening structure of the embodiment of the disclosure, and making the distance between the focal point of the condensing beam and the top surface of the photosensitive element satisfy the formula (4), it can help the imaging module and Thinning of the biometric device using it. In addition, it also helps to reduce crosstalk to improve the accuracy of identifying feature points of organisms.

The components of the several embodiments are summarized above so that those with ordinary knowledge in the technical field of the present disclosure can better understand the viewpoints of the embodiments of the present disclosure. Those with ordinary knowledge in the technical field of the present disclosure should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purpose and/or advantages as the embodiments described herein. Those with ordinary knowledge in the technical field to which this disclosure belongs should also understand that such equivalent structures do not depart from the spirit and scope of this disclosure, and they can do everything without departing from the spirit and scope of this disclosure. Various changes, substitutions and replacements. Therefore, the scope of protection of this disclosure shall be subject to the scope of the attached patent application. In addition, although the present disclosure has been disclosed in several preferred embodiments as described above, it is not intended to limit the present disclosure.

Reference to features, advantages, or similar language throughout this specification does not mean that all the features and advantages that can be achieved with the present disclosure should be or be in any single embodiment of the present disclosure. In contrast, language related to features and advantages is understood as meaning that a particular feature, advantage, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present disclosure. Thus, the discussion of features and advantages and similar language throughout the specification may but does not necessarily represent the same embodiment.

Furthermore, in one or more embodiments, the described features, advantages, and characteristics of the present disclosure may be combined in any suitable manner. Based on the description herein, those skilled in the relevant art will realize that the present disclosure can be implemented without one or more specific features or advantages of a specific embodiment. In other cases, additional features and advantages can be recognized in certain embodiments, and these features and advantages may not exist in all embodiments of the present disclosure.

1: Biometric identification device 100, 102, 104, 106, 108: imaging module 10: photosensitive array 11: photosensitive element 20: light transmitting layer 20T: top surface 31: first light shielding layer 31O: first light passing part 32: Second light-shielding layer 32O: second light-passing part 33: third light-shielding layer 33O: third light-passing part 34: fourth light-shielding layer 34O: fourth light-passing part 40: light-condensing array 41: light-concentrating structure 41T: arc Vertex 50: light screening structure 60: substrate 70: light source 80: cover plate A ₁ : the width of the spot where the focused beam is located at the first shading layer A ₂ : the width of the spot where the spot beam is located at the second shading layer A ₃ : the spot where the beam is located at the third light shielding layers width a _4: the width D of the focused beam is located at the fourth light blocking layers: an outer diameter F of the condenser structure: focus f: focal length of the condensing structure H _1: a first light-shielding layer and the condenser the configuration of the focus distance H _2: focal distance of the second light-shielding layer and the condenser structure H _{3: 4} and the focal point of the third light-shielding layer concentrator structures distance H: focal distance of the fourth light-shielding layer and the condenser structure HS: the distance between the focal point of the focused beam and the top surface of the photosensitive element L: the focused beam LH: the maximum thickness of the focused structure N: the refractive index of the light-transmitting layer P: the center distance R: the radius of curvature U: the photosensitive unit WO ₁ : the first The aperture of a light-passing part WO ₂ : the aperture of the second light-passing part WO ₃ : the aperture of the third light-passing part WO ₄ : the aperture of the fourth light-passing part WS: the minimum width of the photosensitive element

The embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be noted that the various characteristic components are not drawn to scale and are only used for illustrative purposes. In fact, the size of the element may be enlarged or reduced to clearly show the technical features of the embodiment of the disclosure. FIG. 1 shows a schematic partial cross-sectional view of an imaging module according to an embodiment of the disclosure. Figure 2 shows a partially enlarged schematic diagram of the imaging module of Figure 1. Figures 3A to 3D show schematic diagrams of different light-concentrating structures. FIG. 4 shows a schematic partial cross-sectional view of an imaging module according to another embodiment of the disclosure. FIG. 5 shows a schematic partial cross-sectional view of an imaging module according to another embodiment of the disclosure. Figure 6 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 1. Figure 7 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 2. Figure 8 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 1. Figure 9 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 3. Figure 10 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 2. Figure 11 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 6. Figure 12 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 8. FIG. 13 shows a schematic partial cross-sectional view of an imaging module according to another embodiment of the disclosure. Figure 14 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 10. Figure 15 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 11. Figure 16 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 4. Figure 17 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 6. FIG. 18 shows a schematic partial cross-sectional view of an imaging module according to another embodiment of the disclosure. Figure 19 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 15. Figure 20 shows the angular screening distribution curve of the imaging module made with the specific specifications of Example 16. Figure 21 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 10. Figure 22 shows the angular screening distribution curve of the imaging module made with the specific specifications of Comparative Example 11. FIG. 23 shows a schematic diagram of a biometric identification device according to an embodiment of the disclosure.

100: imaging module

10: photosensitive array

11: photosensitive element

20: light transmitting layer

31: The first shading layer

31O: the first light part

32: second shading layer

32O: the second light part

40: Condenser array

41: Concentrating structure

50: Light screening structure

P: Center spacing

U: photosensitive unit

Claims (13)

An imaging module includes: a photosensitive element; and a light screening structure arranged on the photosensitive element, the light screening structure comprising: a light transmitting layer; a first light shielding layer arranged in the light transmitting layer, and The first light-shielding layer has a first light-passing portion; a second light-shielding layer is disposed in the light-transmitting layer and is located between the first light-shielding layer and the photosensitive element, and the second light-shielding layer has a second And a light-condensing structure disposed on the light-transmitting layer; wherein the first light-passing part and the second light-passing part are arranged corresponding to the photosensitive element, and the light passes through the light-concentrating structure to generate a condensed beam, The aperture of the first light-passing part is WO ₁ , the aperture of the second light-passing part is WO ₂ , the width of the condensed light beam at the first light-shielding layer is A ₁ , and the condensed light beam is located on the second light-shielding layer The width of the place is A ₂ , the ratio of WO ₁ to A ₁ is Q ₁ , the ratio of WO ₂ to A ₂ is Q ₂ , and the geometric mean of Q ₁ and Q ₂ is greater than 0.6 and less than or equal to 1.8. According to the imaging module described in claim 1, wherein the focal point of the condensed beam is located on the top surface of the photosensitive element. According to the imaging module described in claim 1, wherein the focal point of the condensing beam is at a distance from the top surface of the photosensitive element. The imaging module described in item 3 of the scope of patent application, wherein the minimum width of the photosensitive element is WS, the focal length of the concentrating structure is f, the outer diameter of the concentrating structure is D, and the maximum thickness of the concentrating structure Is LH, and the distance HS between the focal point of the focused beam and the top surface of the photosensitive element satisfies the following conditions:

According to the imaging module described in item 1 of the scope of patent application, the focal length of the concentrating structure is f, the outer diameter of the concentrating structure is D, the maximum thickness of the concentrating structure is LH, and the first light shielding layer and The focal point distance of the light-concentrating structure is H ₁ , the distance between the second light-shielding layer and the focal point of the light-concentrating structure is H ₂ , and the aperture WO ₁ of the first light-passing part and the aperture of the second light-passing part WO ₂ meets the following conditions:

According to the imaging module described in item 1 of the scope of patent application, the light-concentrating structure is a microlens structure, a micro-cone structure, a micro-trapezoid structure or a refractive index gradient structure. An imaging module includes: a photosensitive array, including a plurality of photosensitive elements; and a light screening structure, arranged on the photosensitive array, the light screening structure includes: a light-transmitting layer; In the light layer, each light-shielding layer has a plurality of light-passing parts; and a light-concentrating array is arranged on the light-transmitting layer, and the light-concentrating array includes a plurality of light-concentrating structures; wherein the light-passing parts correspond to the The light-sensitive elements are arranged, and the light passes through the light-condensing array to generate multiple condensed beams. The light screening structure includes n layers of light-shielding layers, where n is a positive integer greater than or equal to 2. In the n-layer light-shielding layers, the k-th light-shielding layer The aperture of each light-passing part is WO _k , the width of each focused beam at the k-th light-shielding layer is _Ak , the ratio of WO _k to _Ak is Q _k , and k is a positive integer less than or equal to n , And the light screening structure meets the following conditions:

The imaging module as described in item 7 of the scope of patent application, wherein the light screening structure includes n layers of light-shielding layers, and n is a positive integer greater than or equal to 2. In the n-layers of light-shielding layers, each of the k-th light-shielding layers The aperture of the light-passing part is WO _k , the focal length of each light-concentrating structure is f, the outer diameter of each light-concentrating structure is D, the maximum thickness of each light-concentrating structure is LH, and the k-th light-shielding layer is connected to each The focal distance of the light-concentrating structure is H _k , and the aperture WO _{k of} each light-passing part satisfies the following conditions:

In the imaging module described in item 8 of the scope of patent application, the minimum width of each photosensitive element is WS, and the distance HS between the focal point of each condensed beam and the top surface of the corresponding photosensitive element satisfies the following conditions:

Such as the imaging module described in item 7 of the scope of patent application, which The photosensitive array is a one-dimensional array or a two-dimensional array, and the concentrating array is a one-dimensional array or a two-dimensional array. A biometric identification device includes: a substrate; a light source arranged on the substrate to emit light to a living object; and the imaging module as described in any one of items 1 to 10 in the scope of patent application for Receive the light from the light source. The biometric identification device described in item 11 of the scope of patent application, wherein the light source is arranged on at least one side of the imaging module. As described in item 11 of the scope of patent application, the biometric identification device further includes: a cover plate disposed on the light source and the imaging module.

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