TWI717651B - Method and apparatus for manufacturing piezoelectric material film - Google Patents

Abstract

A method and an apparatus for manufacturing a piezoelectric material film are described. The apparatus for manufacturing the piezoelectric material film includes a jet device, an electric net, and a direct current power supply. The jet device is configured to jet a piezoelectric coating material toward a substrate, so as to form a piezoelectric material coating layer on the substrate. The jet device includes at least one conductive nozzle. The electric net is disposed between the jet device and the substrate and is adjacent the substrate. The electric net has at least one hole, and the piezoelectric coating material is jetted on the substrate through the hole. The direct current power supply includes a first output, a second output, and a third output. The first output is electrically coupled to the conductive nozzle, the second output is electrically coupled to the electric net, and the third output is electrically coupled to the substrate. The direct current power supply is configured to form a high electric field environment, and an electric field value of the high electric field environment is at least about 4000V/cm.

Description

Manufacturing method and equipment of piezoelectric material film

The present invention relates to a piezoelectric material technology, and particularly relates to a method and equipment for manufacturing a piezoelectric material film.

In recent years, piezoelectric materials have been widely used. These applications include electronic product touch sensors, military aircraft echolocation, and ultrasonic buzzers. Basically, piezoelectric materials can be divided into two categories: inorganic piezoelectric materials and organic piezoelectric materials. Among them, the inorganic piezoelectric material may be, for example, a piezoelectric ceramic, and the organic piezoelectric material may be, for example, a piezoelectric polymer material. These two types of piezoelectric materials have their own advantages and disadvantages, and each has its own suitable applications. In order to meet the needs of special applications, sometimes piezoelectric materials must be made into thin films. Generally speaking, piezoelectric coating preparation, piezoelectric coating coating, and polarization treatment of the piezoelectric coating film are required to obtain a film with piezoelectric properties.

In the preparation process of the polymer piezoelectric coating, the polymer piezoelectric material is dissolved together with the solvent and other additives to obtain the polymer piezoelectric solution. There are many methods for preparing ceramic piezoelectric coatings, one of which is to add ceramic piezoelectric material powder and other additives to the polymer matrix to obtain ceramic Piezoelectric paint. Next, the prepared polymer piezoelectric solution or ceramic piezoelectric paint can be directly coated on the surface of the substrate. Then, the polymer piezoelectric solution or ceramic piezoelectric paint on the substrate is baked or dried. Then, the polymer piezoelectric coating (film) or ceramic piezoelectric coating on the substrate is subjected to a polarization process to form a polymer piezoelectric material film or piezoelectric ceramic film with piezoelectric properties.

Because the molecular structure in piezoelectric materials has asymmetric characteristics, the distribution of positively and negatively charged materials is uneven, resulting in local positive and local negative electrodes in the molecular structure. Polyvinylidene fluoride (PVDF) is one of the very famous polymer piezoelectric materials. In the structure of polyvinylidene fluoride, a long carbon chain backbone is connected in a staggered manner with two hydrogen atoms or two fluorine atoms. Because the electron affinity of fluorine atoms is very strong, fluorine atoms become local negative electrodes, and hydrogen atoms are local positive electrodes. Lead zirconate titanate (PZT) is one of the most famous piezoelectric ceramic materials. Lead zirconate titanate has an orthorhombic lattice. In the orthorhombic lattice of lead zirconate titanate, the positions of titanium cations or zirconium cations are not in the middle of the lattice but above or below, making the lattice divided into local positive and local negative electrodes. . Such characteristics are the source of the polarity of piezoelectric materials, and the direction of polarity is defined as the direction from the local negative electrode to the local positive electrode. The region where the crystal lattice has the same polarity direction is called the electric domain.

The polarity directions of the electrical domains in piezoelectric materials often have no regularity and cancel each other out, which easily causes the entire piezoelectric material to have no polarity, and thus cannot exhibit the piezoelectric properties of the material itself. Therefore, it is usually necessary to perform a polarization process on the piezoelectric material to make the direction of the electric domain of the piezoelectric material consistent and exhibit piezoelectric characteristics.

One of the objectives of the present invention is to provide a method and equipment for manufacturing piezoelectric material films, which can simultaneously spray and polarize piezoelectric coatings, thus not only can effectively shorten the manufacturing process time of piezoelectric material films, but also simplify piezoelectric material films. The manufacturing process of the material film can further improve the manufacturing efficiency of the piezoelectric material film and reduce the manufacturing cost.

Another object of the present invention is to provide a method and equipment for manufacturing a piezoelectric material film, which can apply piezoelectric paint and/or piezoelectric material when the piezoelectric paint and/or piezoelectric material coating is not yet cured. The layer is polarized, so the polarization time can be greatly reduced and the energy consumption of the process can be reduced.

According to the above-mentioned object of the present invention, a manufacturing equipment of piezoelectric material film is provided. The manufacturing equipment of this piezoelectric material film includes an injection device, a power grid, and a DC power supply. The spray device is configured to spray piezoelectric paint toward the substrate to form a piezoelectric material coating on the substrate, wherein the spray device includes at least one conductive spray head. The power grid is arranged between the injection device and the substrate and is adjacent to the substrate. The power grid has at least one opening, and the piezoelectric paint is sprayed on the substrate through the at least one opening. The DC power supply includes a first output terminal, a second output terminal, and a third output terminal. The first output terminal is electrically coupled to the at least one conductive nozzle, the second output terminal is electrically coupled to the power grid, and the third output terminal is electrically coupled Coupled to the substrate, the DC power supply is configured to form a high electric field environment between the conductive showerhead and the substrate, and the electric field value in the high electric field environment is at least about 4000V/cm.

According to an embodiment of the present invention, the voltage of the aforementioned conductive nozzle is greater than the voltage of the power grid, and the voltage of the power grid is greater than the voltage of the substrate.

According to an embodiment of the present invention, the above-mentioned piezoelectric material film manufacturing equipment further includes an electron source, wherein the electron source is arranged above the power grid and is configured to provide electron beams to the substrate. The voltage of the electron source is greater than the voltage of the power grid.

According to an embodiment of the present invention, the aforementioned piezoelectric material film manufacturing equipment further includes an infrared lamp arranged above the power grid, wherein the infrared lamp is configured to dry the piezoelectric material coating.

According to an embodiment of the present invention, the above-mentioned piezoelectric material film manufacturing equipment further includes a heater adjacent to the substrate, wherein the heater is configured to dry the piezoelectric material coating by heat conduction.

According to an embodiment of the present invention, the above-mentioned substrate includes a transparent conductive film, the piezoelectric material coating is coated on the surface of the transparent conductive film, and the manufacturing equipment of the piezoelectric material film further includes a heating power source configured to conduct the transparent conductive film. Electricity is applied to the film to increase the temperature of the transparent conductive film, thereby drying the piezoelectric material coating.

According to the above objective of the present invention, another method for manufacturing a piezoelectric material film is proposed. In this method, the substrate is placed under the power grid and the spraying device, where the power grid is between the substrate and the spraying device and adjacent to the surface of the substrate. The DC power supply is used to apply power to the substrate, the power grid, and at least one conductive nozzle of the spray device, so that the power grid and the at least one conductive nozzle have the same or similar potential, and the substrate has a different potential from the power grid and the at least one conductive nozzle. When the DC power supply is used to apply power to at least one conductive spray head of the substrate, the power grid, and the spraying device, at least one conductive spray head of the spraying device is used to spray piezoelectric paint toward the substrate through at least one opening of the power grid to form a shape on the substrate. A piezoelectric material coating, where the grid is polarized between the grid and the substrate, and the piezoelectric paint and piezoelectric material coating.

According to an embodiment of the present invention, when at least one conductive nozzle of the spray device is used to spray piezoelectric paint toward the surface of the substrate through at least one opening of the power grid, it further includes moving the power grid and the substrate relatively.

According to an embodiment of the present invention, when the piezoelectric paint and the piezoelectric material coating are polarized between the power grid and the substrate, the piezoelectric material coating further includes using a heater to bake the piezoelectric material coating by illumination or thermal conduction. Dry treatment.

According to an embodiment of the present invention, the above-mentioned substrate includes a transparent conductive film, and the piezoelectric material coating is coated on the surface of the transparent conductive film, and the piezoelectric coating and piezoelectric material coating are polarized between the power grid and the substrate. When layering, it also includes the use of heating power to apply power to the transparent conductive film to increase the temperature of the transparent conductive film, thereby drying the piezoelectric material coating.

100‧‧‧Manufacturing equipment

100a‧‧‧Manufacturing equipment

100b‧‧‧Manufacturing equipment

100c‧‧‧Manufacturing equipment

100d‧‧‧Manufacturing equipment

110‧‧‧Spraying device

112‧‧‧Conductive nozzle

114‧‧‧Containment Department

120‧‧‧Grid

122‧‧‧Opening

130‧‧‧DC power supply

132‧‧‧First output

134‧‧‧Second output

136‧‧‧Third output

140‧‧‧Substrate

140a‧‧‧Substrate

142‧‧‧surface

144‧‧‧surface

146‧‧‧Conductive substrate

148‧‧‧Transparent conductive film

148a‧‧‧surface

150‧‧‧Piezoelectric paint

152‧‧‧Piezoelectric material coating

160‧‧‧Piezoelectric material supply source

162‧‧‧Pipe

170‧‧‧Infrared light

180‧‧‧Heater

190‧‧‧Heating power supply

192‧‧‧Electron source

194‧‧‧Electron beam

196‧‧‧Mesh

200‧‧‧Step

210‧‧‧Step

220‧‧‧Step

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: [Figure 1] shows a piezoelectric material film according to one embodiment of the present invention [Figure 2] is a schematic cross-sectional view of a piezoelectric material thin film manufacturing equipment according to an embodiment of the present invention; [FIG. 3] is a schematic cross-sectional view of a manufacturing equipment of a piezoelectric material film according to another embodiment of the present invention; [FIG. 4] is a schematic view of a piezoelectric material film according to another embodiment of the present invention A schematic cross-sectional view of the manufacturing equipment; [FIG. 5] A schematic cross-sectional view of a piezoelectric material thin film manufacturing equipment according to another embodiment of the present invention; [FIG. 6] A schematic view of another embodiment of the present invention A schematic cross-sectional view of a manufacturing equipment for a piezoelectric material film; and [FIG. 7] is a flowchart showing a manufacturing method of a piezoelectric material film according to an embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2, which respectively show a schematic diagram and a cross-sectional schematic diagram of a piezoelectric material film manufacturing equipment according to an embodiment of the present invention. In some embodiments, the manufacturing equipment 100 of the piezoelectric material film mainly includes an injection device 110, a power grid 120, and a DC power supply 130. The spray device 110 includes one or more conductive spray heads 112. The spraying device 110 is configured to spray the piezoelectric paint 150 toward the surface 142 of the substrate 140 through the conductive spray heads 112 to form the piezoelectric material coating 152 on the surface 142 of the substrate 140. For example, the material of the conductive shower head 112 may be metal. In some exemplary examples, the spray device 110 may include at least one accommodating portion 114, wherein the accommodating portion 114 can be used to fill and accommodate the piezoelectric paint 150. The accommodating portion 114 communicates with the conductive spray head 112. For example, in the spray device 110, one accommodating portion 114 can be connected to and communicated with a conductive spray head 112, or one accommodating portion 114 can communicate with multiple conductive nozzles 112 at the same time. The accommodating portion 114 is a non-conductor. In some exemplary examples, the injection device 110 of the piezoelectric material thin film manufacturing equipment 100 can communicate with the piezoelectric material supply 160 through the pipeline 162. The piezoelectric material supply source 160 stores piezoelectric paint 150. The piezoelectric material supply 160 can use the pipeline 162 to transport the piezoelectric paint 150 stored therein to the accommodating portion 114 of the spraying device 110, and the accommodating portion 114 transmits the received piezoelectric paint 150 to the conductive nozzle 112. The conductive spray head 112 then sprays the piezoelectric paint 150 toward the surface 142 of the substrate 140. For example, the piezoelectric material supply 160 may use a peristaltic pump or an injection pump to deliver the piezoelectric paint 150 to the spray device 110.

Please refer to FIGS. 1 and 2 again. The power grid 120 is disposed between the conductive nozzle 112 of the spray device 110 and the surface 142 of the substrate 140, and the power grid 120 is adjacent to the surface 142 of the substrate 140. In some examples, the power grid 120 is transversely disposed above the surface 142 of the substrate 140. For example, the extension direction of the power grid 120 may be substantially parallel to the surface 142 of the substrate 140. The power grid 120 has at least one opening 122. In some exemplary examples, the shape of the opening 122 of the power grid 120 can be designed according to a desired pattern. When the spray device 110 sprays the piezoelectric paint 150 toward the substrate 140, the piezoelectric paint 150 can pass through the opening 122 of the power grid 120 and spray on the surface 142 of the substrate 140.

The DC power supply 130 may be a high-voltage DC power supply. In some examples, the DC power supply 130 is configured to form a high electric field environment between the conductive showerhead 112 and the substrate 140, and the electric field value in the high electric field environment is at least about 4000 V/cm. In some exemplary examples, the voltage range of the DC power supply 130 is from about 5 kV to about 40 kV. The DC power supply 130 may include a first output terminal 132, The second output terminal 134 and the third output terminal 136. For example, the third output terminal 136 may be grounded and have a ground potential (ie, potential 0), and the first output terminal 132 and the second output terminal 134 may have a negative electric potential; or, the third output terminal 136 may have a positive electric potential. An output terminal 132 and a second output terminal 134 have negative electric potentials. As shown in Figures 1 and 2, the first output terminal 132 of the DC power supply 130 is electrically coupled to the conductive nozzle 112 of the injection device 110, the second output terminal 134 is electrically coupled to the power grid 120, and the third output of the DC power supply 130 The terminal 136 is electrically coupled to the substrate 140. In some exemplary examples, through such electrical coupling, the voltage of the conductive nozzle 112 of the spray device 110 is greater than the voltage of the power grid 120, and the voltage of the power grid 120 is greater than the voltage of the substrate 140. In some specific examples, the voltages of the conductive showerhead 112 and the power grid 120 may be the same or similar to each other. The accommodating portion 114 is a non-conductor and the piezoelectric paint 150 is dripped from the pipeline 162 to the accommodating portion 114, so the first output end 132 is isolated from the pipeline 162 and the piezoelectric material supply source 160. In some exemplary examples, the first output terminal 132 and the second output terminal 134 respectively coupled to the conductive showerhead 112 and the power grid 120 are high-voltage output terminals, and the third output terminal 134 and the substrate 140 are grounded.

In some examples, the piezoelectric material film manufacturing equipment 100 uses the electrospinning principle or the electrospray principle to perform the coating process of the piezoelectric paint 150. The piezoelectric paint 150 is transmitted to the conductive spray head 112 of the spray device 110 by the supply mechanism of the piezoelectric material supply source 160. The conductive spray head 112 and the substrate 140 are electrically connected to the first output end 132 and the third output end 136 of the DC power supply 130, respectively. The coupling, therefore, can not only charge the piezoelectric paint 150 in the conductive shower head 112, but also generate a large electric field between the conductive shower head 112 and the substrate 140. Thereby, the piezoelectric paint 150 can be sprayed from the conductive spray head 112 toward the substrate 140 At the same time, the piezoelectric paint 150 becomes very fine droplets or filamentous liquid, and a uniform piezoelectric material coating 152 is formed on the surface 142 of the substrate 140.

In addition, since the potential of the power grid 120 and the potential of the conductive nozzle 112 can be the same or similar, a large voltage difference is also formed between the power grid 120 and the substrate 140, and electrons can be emitted from the power grid 120 to the surface 142 coated on the substrate 140 The piezoelectric material coating 152 is applied to the piezoelectric material coating 152 to perform a polarization process. During the polarization process, the electrons emitted by the grid 120 onto the piezoelectric material coating 152 form electrical stress on the piezoelectric material coating 152, and force the electrical domain of the piezoelectric material coating 152 to follow the direction of the electrical stress, thereby A thin film of piezoelectric material with piezoelectric properties can be formed. In some examples, the electrons emitted from the grid 120 toward the surface 142 of the substrate 140 will also polarize the piezoelectric paint 150 between the grid 120 and the surface 142 of the substrate 140. At this time, both the piezoelectric paint 150 and the piezoelectric material coating 152 are in a state of not being completely cured. Therefore, the piezoelectric paint 150 and the piezoelectric material coating 152 are more likely to be polarized than a cured piezoelectric film, so it can be greatly improved Polarization speed and efficiency of piezoelectric material film.

Please refer to FIG. 3, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material film manufacturing equipment 100a of this embodiment are substantially the same as those of the piezoelectric material film manufacturing equipment 100. The difference between the two is that the piezoelectric material film manufacturing equipment 100a is more Contains one or more infrared lamps 170. In the piezoelectric material film manufacturing equipment 100a, the infrared lamp 170 is configured to dry the piezoelectric material coating 152 coated on the surface 142 of the substrate 140 to accelerate the curing of the piezoelectric material coating 152. In some demonstration examples, the infrared light 170 is installed above the power grid 120, The piezoelectric material coating 152 under the net 120 emits infrared light to accelerate the curing of the piezoelectric material coating 152.

Please refer to FIG. 4, which is a schematic cross-sectional view of a manufacturing equipment of a piezoelectric material film according to another embodiment of the present invention. The components and structure of the piezoelectric material film manufacturing equipment 100b of this embodiment are substantially the same as those of the piezoelectric material film manufacturing equipment 100. The difference between the two is that the piezoelectric material film manufacturing equipment 100b is more Includes heater 180. In the piezoelectric material thin film manufacturing equipment 100b, the heater 180 is configured to dry the piezoelectric material coating 152 coated on the surface 142 of the substrate 140 to accelerate the curing speed of the piezoelectric material coating 152. In this embodiment, the heater 180 is provided adjacent to the substrate 140. In some exemplary examples, the heater 180 is bonded to the other surface 144 of the substrate 140, and the surfaces 144 and 142 of the substrate 140 are respectively located on two opposite sides of the substrate 140. The heater 180 can dry the piezoelectric material coating 152 on the other side surface 142 from the surface 144 of the substrate 140 via the substrate 140 by thermal conduction, so as to shorten the curing time of the piezoelectric material coating 152.

Please refer to FIG. 5, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material film manufacturing equipment 100c of this embodiment are substantially the same as those of the aforementioned piezoelectric material film manufacturing equipment 100. The difference between the two is that the piezoelectric material film manufacturing equipment 100c is more Contains heating power supply 190. In this embodiment, the substrate 140 a includes a transparent conductive film 148, wherein the piezoelectric material coating 152 is coated on the surface 148 a of the transparent conductive film 148. For example, the transparent conductive film 148 may be indium tin oxide (ITO) Film, indium zinc oxide (IZO), or aluminum oxide zinc (AZO), etc. In some examples, the substrate 140 a further includes a conductive base 146, and the transparent conductive film 148 covers the conductive base 146.

In the piezoelectric material film manufacturing equipment 100c, the first output end 132 of the direct current power supply 130 is electrically coupled to the conductive nozzle 112 of the spray device 110, the second output end 134 of the direct current power supply 130 is electrically coupled to the power grid 120, and the direct current The third output terminal 134 of the power supply 130 is electrically coupled to the conductive base 146 of the substrate 140. The heating power source 190 is electrically coupled to the transparent conductive film 148, so the heating power source 190 can apply power to the transparent conductive film 148, thereby increasing the temperature of the transparent conductive film 148, and further, the transparent conductive film 148 can be used for the surface 148a. The piezoelectric material coating 152 is dried to accelerate the curing of the piezoelectric material coating 152.

Please refer to FIG. 6, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material film manufacturing equipment 100d of this embodiment are substantially the same as those of the piezoelectric material film manufacturing equipment 100. The difference between the two is that the piezoelectric material film manufacturing equipment 100d is more Contains electron source 192. This embodiment is applicable to the situation where the grid 120 cannot provide sufficient amount of electrons.

In the manufacturing equipment 100d of piezoelectric material film, the electron source 192 is installed above the power grid 120. The electron source 192 and the conductive showerhead 112 can both be connected to the first output terminal 132, so that the electron source 192, the conductive showerhead 112 and the first output terminal 132 have the same potential. The electron source 192 can also be independently connected to other power sources to generate high voltage. The electron source 192 can use the tip discharge method Or corona discharge provides electron beam 194. The electron source 192 adopting the tip discharge method may include, for example, a needle electrode, a pin electrode, or a wire electrode. The voltage of the electron source 192 is greater than the voltage of the power grid 120, and the voltage of the power grid 120 is greater than the voltage of the substrate 140, thus generating electric fields between the electron source 192 and the power grid 120 and between the power grid 120 and the substrate 140. The electron beam 192 provided by the electron source 192 is ejected to the power grid 120 along the direction of the electric field, and then the electron beam 194 is continuously emitted to the substrate 140 through the mesh 196 of the grid structure of the power grid 120.

In addition to the piezoelectric material film manufacturing equipment 100, the electron source 192 can also be installed in the piezoelectric material film manufacturing equipment 100a, 100b, and 100c shown in FIGS. 3 to 5. When the electron source 192 is installed in the manufacturing equipment 100 a of FIG. 3, the electron source 192 is located above the infrared lamp 170.

The piezoelectric material film manufacturing equipment 100, 100a, 100b, 100c, and 100d of the above embodiment can be used to manufacture piezoelectric material film. The following uses the manufacturing device 100 of a piezoelectric material film as an example to describe an embodiment of manufacturing a piezoelectric material film.

Please refer to FIG. 7 and FIG. 1 and FIG. 2 at the same time. FIG. 7 is a flowchart of a method for manufacturing a piezoelectric material film according to an embodiment of the present invention. In some embodiments, when the piezoelectric material film is manufactured, step 200 may be performed to install the substrate 140 under the power grid 120 and the spray device 110. As shown in FIGS. 1 and 2, the power grid 120 is provided between the substrate 140 and the conductive spray head 112 of the spray device 110, and the power grid 120 may be adjacent to the surface 142 of the substrate 140.

Next, step 210 can be performed to electrically couple the first output end 132 of the DC power supply 130 to the conductive spray head of the spray device 110 112. Electrically couple the second output terminal 134 of the DC power source 130 to the power grid 120, and electrically couple the third output terminal 136 of the DC power source 130 to the substrate 140. Next, the DC power supply 130 can be used to apply power to the substrate 140, the power grid 120, and the conductive spray head 112 of the spray device 110, so that the power grid 120 and the conductive spray head 112 of the spray device 110 have the same or similar potential, and the substrate 140 has a different The electrical potential of the power grid 120 and the conductive nozzle 112. In some exemplary examples, the first output terminal 132 and the second output terminal 134 respectively coupled to the conductive showerhead 112 and the power grid 120 are high-voltage output terminals, and the second output terminal 136 and the substrate 140 are grounded.

While the DC power supply 130 is used to apply power to the substrate 140, the power grid 120, and the conductive spray head 112 of the spray device 110, step 220 can be performed to use the piezoelectric material supply 160 to deliver the piezoelectric paint 150 to the spray through the pipeline 162. The accommodating portion 114 of the device 110 is then supplied to the conductive spray head 112, and the conductive spray head 112 is used to spray the piezoelectric paint 150 toward the surface 142 of the substrate 140 through the opening 122 of the power grid 120. In some examples, when the piezoelectric paint 150 is sprayed, the DC power supply 130 can form a high electric field environment between the conductive spray head 112 and the substrate 140, and the electric field value in this high electric field environment is at least about 4000 V/cm. In some exemplary examples, when spraying the piezoelectric paint 150, the voltage of the DC power supply 130 can be controlled from about 5kV to about 40kV.

Since the conductive spray head 112 and the substrate 140 are electrically coupled to the first output terminal 132 and the third output terminal 136 of the DC power supply 130, respectively, the piezoelectric paint 150 sprayed through the conductive spray head 112 will be charged, and the conductive spray head 112 and the substrate 140 A huge electric field is generated between. The piezoelectric paint 150 sprayed by the conductive spray head 112 can be attracted to the surface 142 of the substrate 140, and on the substrate 140 A piezoelectric material coating 152 is formed on the surface 142 thereof. When the piezoelectric paint 150 is sprayed, since the electric potential of the electric grid 120 can be equal to or close to the electric potential of the conductive nozzle 112, the charged electric paint 150 sprayed by the electrically conductive nozzle 112 repels the electric grid 120, and the spray range of the piezoelectric paint 150 is concentrated in The opening 122 of the power grid 120. Therefore, the pattern of the opening 122 of the power grid 120 can affect the pattern of the piezoelectric material coating 152. In some exemplary examples, the shape of the opening 122 of the power grid 120 can be designed according to the desired pattern of the piezoelectric material coating 152. In some alternative embodiments, when the conductive spray head 112 of the spray device 110 is used to spray the piezoelectric paint 150 on the surface 142 of the substrate 140 through the opening 122 of the power grid 120, the power grid 120 and the substrate 140 can be moved relatively to form a Patterned piezoelectric material coating 152. For example, when the power grid 120 is not moving, the substrate 140 can be moved laterally forward and backward; or, when the substrate 140 is not moving, the power grid 120 can be moved laterally; or, the substrate 140 and the power grid 120 can be moved laterally. . In some examples, the substrate 140 can be a continuous strip structure, and the strip substrate 140 can be rolled into a roll. When the piezoelectric paint 150 is sprayed on the surface 142 of the substrate 140, the power grid 120 can not move, and the substrate 140 is continuous. The conductive spray nozzle 112 of the spraying device 110 successively sprays the piezoelectric paint 150 through the underside of the power grid 120. In some exemplary examples, in conjunction with the movement of the power grid 120, the spraying device 110 can be moved so that the piezoelectric paint 150 sprayed by the conductive nozzle 112 of the spraying device 110 can be smoothly applied to the surface of the substrate 140 through the opening 122 of the power grid 120 142 on.

While spraying the piezoelectric material 150, since the electric grid 120 has the same or similar electric potential as the conductive nozzle 112, there is also a large voltage difference between the electric grid 120 and the substrate 140, so that electrons can flow from the electric grid 120 to the base. The surface 142 of the plate 140 emits in the direction, and the piezoelectric paint 150 between the grid 120 and the surface 142 of the substrate 140 and the piezoelectric material coating 152 on the surface 142 of the substrate 140 can be polarized. During the polarization process, the electrons emitted by the grid 120 onto the piezoelectric paint 150 and the piezoelectric material coating 152 form electrical stress on the piezoelectric paint 150 and the piezoelectric material coating 152, and force the piezoelectric paint 150 and the piezoelectric material The electrical domain of the coating 152 is turned to follow the direction of the electrical stress, thereby forming a piezoelectric material film with piezoelectric properties. At this time, both the piezoelectric paint 150 and the piezoelectric material coating 152 are in a state of not being completely cured. Therefore, the piezoelectric paint 150 and the piezoelectric material coating 152 can be polarized more easily than the cured piezoelectric film, so the pressure can be greatly increased. Polarization speed and efficiency of electrical material films. In this embodiment, the polarization process performed by the power grid 120 must be maintained until the piezoelectric material coating 152 is completely cured into a piezoelectric material film. Therefore, the process of changing the piezoelectric paint 150 from a liquid state to a solid state is in a high electric field environment.

In some examples, when the power grid 120 performs a polarization process on the piezoelectric paint 150 between the power grid 120 and the surface 142 of the substrate 140 and the piezoelectric material coating 152 on the surface 142 of the substrate 140, a thin film of piezoelectric material is produced. The method can also use a heater to dry the piezoelectric material coating 152 in a light or heat conduction manner. For example, the infrared lamp 170 as shown in FIG. 3 is used to illuminate the piezoelectric material coating 152 to dry and solidify the piezoelectric material coating 152; or the heater 180 as shown in FIG. 4 is used to conduct heat To dry and cure the piezoelectric material coating 152. In some alternative examples, as shown in FIG. 5, when the power grid 120 performs a polarization process on the piezoelectric coating 150 between the power grid 120 and the substrate 140a and the piezoelectric material coating 152 on the substrate 140a, the heating power source 190 can be used. Power is applied to the transparent conductive film 148 of the substrate 140a, by This increases the temperature of the transparent conductive film 148, and further passes through the transparent conductive film 148 to dry and cure the piezoelectric material coating 152.

It can be seen from the above-mentioned embodiments that one of the advantages of the present invention is that the piezoelectric material film manufacturing method and equipment according to the embodiment of the present invention can simultaneously spray and polarize the piezoelectric paint, so it can not only effectively shorten the piezoelectric material film The manufacturing process time can further simplify the manufacturing process of the piezoelectric material film, thereby improving the manufacturing efficiency of the piezoelectric material film and reducing the manufacturing cost.

As can be seen from the above-mentioned embodiments, another advantage of the present invention is that the piezoelectric material film manufacturing method and equipment according to the embodiments of the present invention can be applied to the piezoelectric material when the piezoelectric paint and/or piezoelectric material coating is not yet cured. The paint and/or piezoelectric material coating is polarized, so the polarizing time can be greatly reduced and the energy consumption of the process can be reduced.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

100‧‧‧Manufacturing equipment

110‧‧‧Spraying device

112‧‧‧Conductive nozzle

114‧‧‧Containment Department

120‧‧‧Grid

122‧‧‧Opening

130‧‧‧DC power supply

132‧‧‧First output

134‧‧‧Second output

136‧‧‧Third output

140‧‧‧Substrate

142‧‧‧surface

150‧‧‧Piezoelectric paint

152‧‧‧Piezoelectric material coating

160‧‧‧Piezoelectric material supply source

162‧‧‧Pipe

Claims (10)

A manufacturing equipment of a piezoelectric material film, comprising: a spraying device configured to spray a piezoelectric paint toward a substrate to form a piezoelectric material coating on the substrate, wherein the spraying device includes at least one conductive spray head; a power grid, Is arranged between the spraying device and the substrate and is adjacent to the substrate, wherein the power grid has at least one opening, the piezoelectric paint is sprayed on the substrate through the at least one opening, and the power grid is configured to intervene The piezoelectric paint and the piezoelectric material coating between the grid and the substrate emit electrons, and the piezoelectric paint and the piezoelectric material coating between the grid and the substrate are polarized; and A DC power supply includes a first output terminal, a second output terminal, and a third output terminal, wherein the first output terminal is electrically coupled to the at least one conductive nozzle, and the second output terminal is electrically coupled to the The third output terminal is electrically coupled to the substrate, and the DC power supply is configured so that the power grid and the at least one conductive nozzle have the same potential, and a high electric field environment is formed between the conductive nozzle and the substrate, the The electric field value in a high electric field environment is at least 4000V/cm. For example, the piezoelectric material film manufacturing equipment in the first item of the scope of patent application, wherein the voltage of the grid is greater than the voltage of the substrate. For example, the piezoelectric material film manufacturing equipment in the first item of the scope of the patent application further includes an electron source, wherein the electron source is set on the power grid And configured to provide an electron beam to the substrate, and the voltage of the electron source is greater than the voltage of the power grid. For example, the piezoelectric material film manufacturing equipment of the first item of the patent application further includes an infrared lamp arranged above the power grid, wherein the infrared lamp is configured to perform a drying process on the piezoelectric material coating. For example, the piezoelectric material thin film manufacturing equipment in the first item of the patent application further includes a heater adjacent to the substrate, wherein the heater is configured to perform a drying process on the piezoelectric material coating by a thermal conduction method. For example, the piezoelectric material film manufacturing equipment of the first item of the patent application, wherein the substrate includes a transparent conductive film, the piezoelectric material coating is coated on a surface of the transparent conductive film, the piezoelectric material film manufacturing equipment It further includes a heating power supply configured to apply a power to the transparent conductive film to increase the temperature of the transparent conductive film, so as to perform a drying process on the piezoelectric material coating. A method for manufacturing a thin film of piezoelectric material includes: arranging a substrate under a power grid and an injection device, wherein the power grid is between the substrate and the injection device and is adjacent to a surface of the substrate; The power supply applies an electric power to the substrate, the power grid, and at least one conductive nozzle of the spray device, so that the power grid and the at least one conductive nozzle The spray heads have the same potential, and the substrate has a potential different from that of the power grid and the at least one conductive spray head; and when the power is applied to the substrate, the power grid, and the at least one conductive spray head of the spray device using the DC power supply Using the at least one conductive spray head of the spraying device to spray a piezoelectric paint toward the substrate through at least one opening of the power grid to form a piezoelectric material coating on the substrate; and using the at least one spraying device of the spraying device When the conductive spray head sprays the piezoelectric paint towards the substrate through the at least one opening of the grid, the grid is used to emit electrons to the piezoelectric paint and the piezoelectric material coating between the grid and the substrate, The piezoelectric paint and the piezoelectric material coating polarized between the grid and the substrate. For example, the manufacturing method of piezoelectric material film of the seventh item of the scope of patent application, wherein the at least one conductive nozzle of the spraying device is used to spray the piezoelectric paint toward the surface of the substrate through the at least one opening of the power grid. It includes moving the grid and the substrate relative to each other. For example, the manufacturing method of the piezoelectric material film of the seventh item of the scope of patent application, wherein when the electric grid is polarized between the electric grid and the substrate, the piezoelectric paint and the piezoelectric material coating further include using a heater A drying process is performed on the piezoelectric material coating by an illumination method or a heat conduction method. For example, the manufacturing method of piezoelectric material thin film in the scope of patent application, wherein the substrate includes a transparent conductive film, and the piezoelectric material The material coating is coated on a surface of the transparent conductive film. When the grid is polarized between the grid and the substrate, the piezoelectric paint and the piezoelectric material coating further include using a heating power source to An electric power is applied to the conductive film to increase the temperature of the transparent conductive film, thereby performing a drying process on the piezoelectric material coating.

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